Overview of CEV Thermal Protection System Seal Development

NASA Technical Reports Server (NTRS)

DeMange, Jeff; Taylor, Shawn; Dunlap, Patrick; Steinetz, Bruce; Delgado, Irebert; Finkbeiner, Josh; Mayer, John

2009-01-01

NASA GRC supporting design, development, and implementation of numerous seal systems for the Orion CEV: a) HS-to-BS interface. b) Compression pad. HS-to-BS Interface Seal System: a) design has evolved as a result of changes with the CEV TPS. b) Seal system is currently under development/evaluation. Coupon level tests, Arc jet tests, and Validation test development. Compression Pad: a) Finalizing design options. b) Evaluating material candidates.

Effect of thermal interface on heat flow in carbon nanofiber composites.

PubMed

Gardea, F; Naraghi, M; Lagoudas, D

2014-01-22

The thermal transport process in carbon nanofiber (CNF)/epoxy composites is addressed through combined micromechanics and finite element modeling, guided by experiments. The heat exchange between CNF constituents and matrix is studied by explicitly accounting for interface thermal resistance between the CNFs and the epoxy matrix. The effects of nanofiber orientation and discontinuity on heat flow and thermal conductivity of nanocomposites are investigated through simulation of the laser flash experiment technique and Fourier's model of heat conduction. Our results indicate that when continuous CNFs are misoriented with respect to the average temperature gradient, the presence of interfacial resistance does not affect the thermal conductivity of the nanocomposites, as most of the heat flow will be through CNFs; however, interface thermal resistance can significantly alter the patterns of heat flow within the nanocomposite. It was found that very high interface resistance leads to heat entrapment at the interface near to the heat source, which can promote interface thermal degradation. The magnitude of heat entrapment, quantified via the peak transient temperature rise at the interface, in the case of high thermal resistance interfaces becomes an order of magnitude more intense as compared to the case of low thermal resistance interfaces. Moreover, high interface thermal resistance in the case of discontinuous fibers leads to a nearly complete thermal isolation of the fibers from the matrix, which will marginalize the contribution of the CNF thermal conductivity to the heat transfer in the composite.

TIA Software User's Manual

NASA Technical Reports Server (NTRS)

Cramer, K. Elliott; Syed, Hazari I.

1995-01-01

This user's manual describes the installation and operation of TIA, the Thermal-Imaging acquisition and processing Application, developed by the Nondestructive Evaluation Sciences Branch at NASA Langley Research Center, Hampton, Virginia. TIA is a user friendly graphical interface application for the Macintosh 2 and higher series computers. The software has been developed to interface with the Perceptics/Westinghouse Pixelpipe(TM) and PixelStore(TM) NuBus cards and the GW Instruments MacADIOS(TM) input-output (I/O) card for the Macintosh for imaging thermal data. The software is also capable of performing generic image-processing functions.

Evaluation of Oxidation Damage in Thermal Barrier Coating Systems

NASA Technical Reports Server (NTRS)

Zhu, Dongming; Miller, Robert A.

1996-01-01

A method based on the technique of dilatometry has been established to quantitatively evaluate the interfacial damage due to the oxidation in a thermal barrier coating system. Strain isolation and adhesion coefficients have been proposed to characterize the thermal barrier coating (TBC) performance based on its thermal expansion behavior. It has been found that, for a thermal barrier coating system consisting of ZrO2-8%Y2O3/FeCrAlY/4140 steel substrate, the oxidation of the bond coat and substrate significantly reduced the ceramic coating adherence, as inferred from the dilatometry measurements. The in-situ thermal expansion measurements under 30 deg C to 700 deg C thermal cycling in air showed that the adhesion coefficient, A(sub i) decreased by 25% during the first 35 oxidation cycles. Metallography showed that delamination occurred at both the ceramic/bond coat and bond coat/substrate interfaces. In addition, the strain isolation effect has been improved by increasing the FeCrAlY bond coat thickness. The strain isolation coefficient, Si, increased from about 0.04 to 0.25, as the bond coat thickness changed from 0.1 mm to 1.0 mm. It may be possible to design optimum values of strain isolation and interface adhesion coefficients to achieve the best TBC performance.

Effect of fiber treatments on tensile and thermal properties of starch/ethylene vinyl alcohol copolymers/coir biocomposites

USDA-ARS?s Scientific Manuscript database

The effects of different fiber treatments, namely washing with water, alkali treatment (mercerization) and bleaching, on mechanical and thermal properties of starch/EVA/coir biocomposites were evaluated by tensile tests and thermogravimetry (TG), respectively. Additionally, the fiber/matrix interfac...

Deconstructing Temperature Gradients across Fluid Interfaces: The Structural Origin of the Thermal Resistance of Liquid-Vapor Interfaces

NASA Astrophysics Data System (ADS)

Muscatello, Jordan; Chacón, Enrique; Tarazona, Pedro; Bresme, Fernando

2017-07-01

The interfacial thermal resistance determines condensation-evaporation processes and thermal transport across material-fluid interfaces. Despite its importance in transport processes, the interfacial structure responsible for the thermal resistance is still unknown. By combining nonequilibrium molecular dynamics simulations and interfacial analyses that remove the interfacial thermal fluctuations we show that the thermal resistance of liquid-vapor interfaces is connected to a low density fluid layer that is adsorbed at the liquid surface. This thermal resistance layer (TRL) defines the boundary where the thermal transport mechanism changes from that of gases (ballistic) to that characteristic of dense liquids, dominated by frequent particle collisions involving very short mean free paths. We show that the thermal conductance is proportional to the number of atoms adsorbed in the TRL, and hence we explain the structural origin of the thermal resistance in liquid-vapor interfaces.

High temperature solar thermal receiver

NASA Technical Reports Server (NTRS)

1979-01-01

A design concept for a high temperature solar thermal receiver to operate at 3 atmospheres pressure and 2500 F outlet was developed. The performance and complexity of windowed matrix, tube-header, and extended surface receivers were evaluated. The windowed matrix receiver proved to offer substantial cost and performance benefits. An efficient and cost effective hardware design was evaluated for a receiver which can be readily interfaced to fuel and chemical processes or to heat engines for power generation.

Temperature evaluation during PMMA screw augmentation in osteoporotic bone--an in vitro study about the risk of thermal necrosis in human femoral heads.

PubMed

Boner, Vanessa; Kuhn, Philipp; Mendel, Thomas; Gisep, Armando

2009-08-01

The use of polymethylmethacrylate (PMMA) bone cement to augment hip screws reduces cut-out risk but is associated with an exothermic reaction. This in vitro investigation evaluated the risk of thermal necrosis when augmenting the implant purchase with PMMA. A pilot study analyzed the effects of different PMMA layer thicknesses on temperatures around an implant. The main study used either 3.0 or 6.0 cc PMMA for hip screw augmentation in human femoral heads. The risk of thermal necrosis was estimated according to critical values reported in literature. Highest temperatures were measured inside the PMMA with a significant drop of average maximum temperatures from the center of the PMMA to the PMMA/bone interface. Risk of thermal necrosis exists with PMMA layer thicknesses greater than 5.0 mm. In the main study, we found no risk of thermal necrosis at the PMMA/bone interface or in the surrounding bone, neither with 3.0 nor 6.0 cc PMMA. The results of the two studies were consistent regarding average peak temperatures related to associated cement layer thicknesses. The results of this in vitro study reduce objections concerning the risk of thermal necrosis when augmenting cancellous bone around hip screws with up to 6.0 cc PMMA.

Thermal characteristics of carbon fiber reinforced epoxy containing multi-walled carbon nanotubes

NASA Astrophysics Data System (ADS)

Lee, Jin-woo; Park, Soo-Jeong; Kim, Yun-hae; Riichi-Murakami

2018-06-01

The material with irregular atomic structures such as polymer material exhibits low thermal conductivity because of the complex structural properties. Even materials with same atomic configurations, thermal conductivity may be different based on their structural properties. It is expected that nanoparticles with conductivity will change non-conductive polymer base materials to electrical conductors, and improve the thermal conductivity even with extremely small filling amount. Nano-composite materials contain nanoparticles with a higher surface ratio which makes the higher interface percentage to the total surface of nanoparticles. Therefore, thermal resistance of the interface becomes a dominating factor determines the effective thermal conductivity in nano-composite materials. Carbon fiber has characteristic of resistance or magnetic induction and Also, Carbon nanotube (CNT) has electronic and thermal property. It can be applied for heating system. These characteristic are used as heating composite. In this research, the exothermic characteristics of Carbon fiber reinforced composite added CNT were evaluated depend on CNT length and particle size. It was found that the CNT dispersed in the resin reduces the resistance between the interfaces due to the decrease in the total resistance of the heating element due to the addition of CNTs. It is expected to improve the life and performance of the carbon fiber composite material as a result of the heating element resulting from this paper.

Interface-based two-way tuning of the in-plane thermal transport in nanofilms

NASA Astrophysics Data System (ADS)

Hua, Yu-Chao; Cao, Bing-Yang

2018-03-01

Here, the two-way tuning of in-plane thermal transport is obtained in the bi-layer nanofilms with an interfacial effect by using the Boltzmann transport equation (BTE) and the phonon Monte Carlo (MC) technique. A thermal conductivity model was derived from the BTE and verified by the MC simulations. Both the model and the MC simulations indicate that the tuning of the thermal transport can be bidirectional (reduced or enhanced), depending on the interface conditions (i.e., roughness and adhesion energy) and the phonon property dissimilarity at the interface. For the identical-material interface, the emergence of thermal conductivity variation requires two conditions: (a) the interface is not completely specular and (b) the transmission specularity parameter differs from the reflection specularity parameter at the interface. When the transmission specularity parameter is larger than the reflection specularity parameter at the interface, the thermal conductivity improvement effect emerges, whereas the thermal conductivity reduction effect occurs. For the disparate-material interface, the phonon property perturbation near the interface causes the thermal conductivity variation, even when neither the above two conditions are satisfied. The mean free path ratio (γ) between the disparate materials was defined to characterize the phonon property dissimilarity. γ > 1 can lead to the thermal conductivity improvement effect, while γ < 1 corresponds to the thermal conductivity reduction effect. Our work provides a more in-depth understanding of the interfacial effect on the nanoscale thermal transport, with an applicable predictive model, which can be helpful for predicting and manipulating phonon transport in nanofilms.

CNT-based Thermal Interface Materials for Load-Bearing Aerospace Applications

DTIC Science & Technology

2012-08-01

CNT -based Thermal Interface Materials for Load-Bearing Aerospace Applications Michael Bifano, Pankaj Kaul and Vikas Prakash (PI) Department...4. TITLE AND SUBTITLE CNT -based Thermal Interface Materials for Load-Bearing Aerospace Applications 5a. CONTRACT NUMBER 5b. GRANT NUMBER 5c...Z39-18 Objective Develop multifunctional CNT -epoxy Thermal Interface Materials (TIMs) for load bearing aerospace applications. Emphasis - To

Performance evaluation of an automotive thermoelectric generator

NASA Astrophysics Data System (ADS)

Dubitsky, Andrei O.

Around 40% of the total fuel energy in typical internal combustion engines (ICEs) is rejected to the environment in the form of exhaust gas waste heat. Efficient recovery of this waste heat in automobiles can promise a fuel economy improvement of 5%. The thermal energy can be harvested through thermoelectric generators (TEGs) utilizing the Seebeck effect. In the present work, a versatile test bench has been designed and built in order to simulate conditions found on test vehicles. This allows experimental performance evaluation and model validation of automotive thermoelectric generators. An electrically heated exhaust gas circuit and a circulator based coolant loop enable integrated system testing of hot and cold side heat exchangers, thermoelectric modules (TEMs), and thermal interface materials at various scales. A transient thermal model of the coolant loop was created in order to design a system which can maintain constant coolant temperature under variable heat input. Additionally, as electrical heaters cannot match the transient response of an ICE, modelling was completed in order to design a relaxed exhaust flow and temperature history utilizing the system thermal lag. This profile reduced required heating power and gas flow rates by over 50%. The test bench was used to evaluate a DOE/GM initial prototype automotive TEG and validate analytical performance models. The maximum electrical power generation was found to be 54 W with a thermal conversion efficiency of 1.8%. It has been found that thermal interface management is critical for achieving maximum system performance, with novel designs being considered for further improvement.

Thermal force induced by the presence of a particle near a solidifying interface.

PubMed

Hadji, L

2001-11-01

The presence of a foreign particle in the melt, ahead of a solid-liquid interface, leads to the onset of interfacial deformations if the thermal conductivity of the particle, k(p), differs from that of the melt, k(l). In this paper, the influence of the thermal conductivity contrast on the interaction between the solidifying interface and the particle is quantified. We show that the interface distortion gives rise to a thermal force whose expression is given by F(th)=2piLGa3(1-alpha)/(2+alpha)T(m), where L is the latent heat of fusion per unit volume, T(m) is the melting point, a is the particle's radius, G the thermal gradient in the liquid phase and alpha=k(p)/k(l). The derivation makes use of the following assumptions: (i) the particle is small compared to the horizontal extent of the interface, (ii) the particle is placed in the near proximity of the deformable solid-liquid interface, and (iii) the interface is practically immobile in the calculation of the thermal field, i.e., V

Engineering Interface Structures and Thermal Stabilities via SPD Processing in Bulk Nanostructured Metals

DOE PAGES

Zheng, Shijian; Carpenter, John S.; McCabe, Rodney J.; ...

2014-02-27

Nanostructured metals achieve extraordinary strength but suffer from low thermal stability, both a consequence of a high fraction of interfaces. Overcoming this tradeoff relies on making the interfaces themselves thermally stable. In this paper, we show that the atomic structures of bi-metal interfaces in macroscale nanomaterials suitable for engineering structures can be significantly altered via changing the severe plastic deformation (SPD) processing pathway. Two types of interfaces are formed, both exhibiting a regular atomic structure and providing for excellent thermal stability, up to more than half the melting temperature of one of the constituents. Most importantly, the thermal stability ofmore » one is found to be significantly better than the other, indicating the exciting potential to control and optimize macroscale robustness via atomic-scale bimetal interface tuning. As a result, we demonstrate an innovative way to engineer pristine bimetal interfaces for a new class of simultaneously strong and thermally stable materials.« less

Thermal Interface Comparisons Under Flight Like Conditions

NASA Technical Reports Server (NTRS)

Rodriquez-Ruiz, Juan

2008-01-01

Thermal interface materials are used in bolted interfaces to promote good thermal conduction between the two. The mounting surface can include panels, heat pipes, electronics boxes, etc.. . On Lunar Reconnaissance Orbiter (LRO) project the results are directly applicable: a) Several high power avionics boxes b) Several interfaces from RWA to radiator through heat pipe network

High thermal conductivity liquid metal pad for heat dissipation in electronic devices

NASA Astrophysics Data System (ADS)

Lin, Zuoye; Liu, Huiqiang; Li, Qiuguo; Liu, Han; Chu, Sheng; Yang, Yuhua; Chu, Guang

2018-05-01

Novel thermal interface materials using Ag-doped Ga-based liquid metal were proposed for heat dissipation of electronic packaging and precision equipment. On one hand, the viscosity and fluidity of liquid metal was controlled to prevent leakage; on the other hand, the thermal conductivity of the Ga-based liquid metal was increased up to 46 W/mK by incorporating Ag nanoparticles. A series of experiments were performed to evaluate the heat dissipation performance on a CPU of smart-phone. The results demonstrated that the Ag-doped Ga-based liquid metal pad can effectively decrease the CPU temperature and change the heat flow path inside the smart-phone. To understand the heat flow path from CPU to screen through the interface material, heat dissipation mechanism was simulated and discussed.

Surface Cracking and Interface Reaction Associated Delamination Failure of Thermal and Environmental Barrier Coatings

NASA Technical Reports Server (NTRS)

Zhu, Dong-Ming; Choi, Sung R.; Eldridge, Jeffrey I.; Lee, Kang N.; Miller, Robert A.

2003-01-01

In this paper, surface cracking and interface reactions of a BSAS coating and a multi-layer ZrO2-8wt%Y2O3 and mullite/BSAS/Si thermal and environmental barrier coating system on SiC/SiC ceramic matrix composites were characterized after long-term combined laser thermal gradient and furnace cyclic tests in a water vapor containing environment. The surface cracking was analyzed based on the coating thermal gradient sintering behavior and thermal expansion mismatch stress characteristics under the thermal cyclic conditions. The interface reactions, which were largely enhanced by the coating surface cracking in the water vapor environment, were investigated in detail, and the reaction phases were identified for the coating system after the long-term exposure. The accelerated coating delamination failure was attributed to the increased delamination driving force under the thermal gradient cyclic loading and the reduced interface adhesion due to the detrimental interface reactions.

Surface Cracking and Interface Reaction Associated Delamination Failure of Thermal and Environmental Barrier Coatings

NASA Technical Reports Server (NTRS)

Zhu, Dongming; Choi, Sung R.; Eldridge, Jeffrey I.; Lee, Kang N.; Miller, Robert A.

2003-01-01

In this paper, surface cracking and interface reactions of a BSAS coating and a multi-layer ZTO2-8wt%Y2O3 and mullite/BSAS/Si thermal and environmental barrier coating system on SiC/SiC ceramic matrix composites were characterized after long-term combined laser thermal gradient and furnace cyclic tests in a water vapor containing environment. The surface cracking was analyzed based on the coating thermal gradient sintering behavior and thermal expansion mismatch stress characteristics under the thermal cyclic conditions. The interface reactions, which were largely enhanced by the coating surface cracking in the water vapor environment, were investigated in detail, and the reaction phases were identified for the coating system after the long- term exposure. The accelerated coating delamination failure was attributed to the increased delamination driving force under the thermal gradient cyclic loading and the reduced interface adhesion due to the detrimental interface reactions.

Thermal conductance at atomically clean and disordered silicon/aluminum interfaces: A molecular dynamics simulation study

NASA Astrophysics Data System (ADS)

Ih Choi, Woon; Kim, Kwiseon; Narumanchi, Sreekant

2012-09-01

Thermal resistance between layers impedes effective heat dissipation in electronics packaging applications. Thermal conductance for clean and disordered interfaces between silicon (Si) and aluminum (Al) was computed using realistic Si/Al interfaces and classical molecular dynamics with the modified embedded atom method potential. These realistic interfaces, which include atomically clean as well as disordered interfaces, were obtained using density functional theory. At 300 K, the magnitude of interfacial conductance due to phonon-phonon scattering obtained from the classical molecular dynamics simulations was approximately five times higher than the conductance obtained using analytical elastic diffuse mismatch models. Interfacial disorder reduced the thermal conductance due to increased phonon scattering with respect to the atomically clean interface. Also, the interfacial conductance, due to electron-phonon scattering at the interface, was greater than the conductance due to phonon-phonon scattering. This indicates that phonon-phonon scattering is the bottleneck for interfacial transport at the semiconductor/metal interfaces. The molecular dynamics modeling predictions for interfacial thermal conductance for a 5-nm disordered interface between Si/Al were in-line with recent experimental data in the literature.

Interface Shape Control Using Localized Heating during Bridgman Growth

NASA Technical Reports Server (NTRS)

Volz, M. P.; Mazuruk, K.; Aggarwal, M. D.; Croll, A.

2008-01-01

Numerical calculations were performed to assess the effect of localized radial heating on the melt-crystal interface shape during vertical Bridgman growth. System parameters examined include the ampoule, melt and crystal thermal conductivities, the magnitude and width of localized heating, and the latent heat of crystallization. Concave interface shapes, typical of semiconductor systems, could be flattened or made convex with localized heating. Although localized heating caused shallower thermal gradients ahead of the interface, the magnitude of the localized heating required for convexity was less than that which resulted in a thermal inversion ahead of the interface. A convex interface shape was most readily achieved with ampoules of lower thermal conductivity. Increasing melt convection tended to flatten the interface, but the amount of radial heating required to achieve a convex interface was essentially independent of the convection intensity.

Power-Generation Characteristics After Vibration and Thermal Stresses of Thermoelectric Unicouples with CoSb3/Ti/Mo(Cu) Interfaces

NASA Astrophysics Data System (ADS)

Bae, Kwang Ho; Choi, Soon-Mok; Kim, Kyung-Hun; Choi, Hyoung-Seuk; Seo, Won-Seon; Kim, Il-Ho; Lee, Soonil; Hwang, Hae Jin

2015-06-01

Reliability tests for thermoelectric unicouples were carried out to investigate the adhesion properties of CoSb3/Ti/Mo(Cu) interfaces. The n-type In0.25 Co3.95Ni0.05Sb12 and p-type In0.25Co3FeSb12 bulks were prepared for fabricating a thermoelectric unicouple (one p- n couple) by an induction melting and a spark plasma sintering process. Mo-Cu alloy was selected as an electrode for the unicouples due to its high melting temperature and proper work function value. Many thermoelectric unicouples with the CoSb3/Ti/Mo(Cu) interfaces were fabricated with the proper brazing materials by means of a repeated firing process. Reliability of the unicouples with the interfaces was evaluated by a vibration test and a thermal cycling test. After the thermal cycling and vibration tests, the power-generation characteristics of the unicouples were compared with the unicouples before the tests. Even after the vibration test, electrical power with a power density of 0.5 W/cm2 was generated. The Ti-interlayer is considered as a possible candidate for making a reliable unicouple with high adhesion strength. With the thermal cycling test, the resistance of the unicouple increased and the electrical power from the unicouple decreased. A failure mode by the thermal cycling test was ascribed to a complex effect of micro-cracks originated from the thermal stress and oxidation problem of the thermoelectric materials; that is, a thick oxide layer more than 300 μm was detected after a high-temperature durability test of n-type In0.25Co3.95Ni0.05Sb12 material at 773 K in air for 7 days.

Thermal conductivity of hydrate-bearing sediments

USGS Publications Warehouse

Cortes, Douglas D.; Martin, Ana I.; Yun, Tae Sup; Francisca, Franco M.; Santamarina, J. Carlos; Ruppel, Carolyn D.

2009-01-01

A thorough understanding of the thermal conductivity of hydrate-bearing sediments is necessary for evaluating phase transformation processes that would accompany energy production from gas hydrate deposits and for estimating regional heat flow based on the observed depth to the base of the gas hydrate stability zone. The coexistence of multiple phases (gas hydrate, liquid and gas pore fill, and solid sediment grains) and their complex spatial arrangement hinder the a priori prediction of the thermal conductivity of hydrate-bearing sediments. Previous studies have been unable to capture the full parameter space covered by variations in grain size, specific surface, degree of saturation, nature of pore filling material, and effective stress for hydrate-bearing samples. Here we report on systematic measurements of the thermal conductivity of air dry, water- and tetrohydrofuran (THF)-saturated, and THF hydrate–saturated sand and clay samples at vertical effective stress of 0.05 to 1 MPa (corresponding to depths as great as 100 m below seafloor). Results reveal that the bulk thermal conductivity of the samples in every case reflects a complex interplay among particle size, effective stress, porosity, and fluid-versus-hydrate filled pore spaces. The thermal conductivity of THF hydrate–bearing soils increases upon hydrate formation although the thermal conductivities of THF solution and THF hydrate are almost the same. Several mechanisms can contribute to this effect including cryogenic suction during hydrate crystal growth and the ensuing porosity reduction in the surrounding sediment, increased mean effective stress due to hydrate formation under zero lateral strain conditions, and decreased interface thermal impedance as grain-liquid interfaces are transformed into grain-hydrate interfaces.

Reduction of thermal stresses in continuous fiber reinforced metal matrix composites with interface layers

NASA Technical Reports Server (NTRS)

Jansson, S.; Leckie, F. A.

1990-01-01

The potential of using an interface layer to reduce thermal stresses in the matrix of composites with a mismatch in coefficients of thermal expansion of fiber and matrix was investigated. It was found that compliant layers, with properties of readily available materials, do not have the potential to reduce thermal stresses significantly. However, interface layers with high coefficient of thermal expansion can compensate for the mismatch and reduce thermal stresses in the matrix significantly.

3D hierarchical interface-enriched finite element method: Implementation and applications

NASA Astrophysics Data System (ADS)

Soghrati, Soheil; Ahmadian, Hossein

2015-10-01

A hierarchical interface-enriched finite element method (HIFEM) is proposed for the mesh-independent treatment of 3D problems with intricate morphologies. The HIFEM implements a recursive algorithm for creating enrichment functions that capture gradient discontinuities in nonconforming finite elements cut by arbitrary number and configuration of materials interfaces. The method enables the mesh-independent simulation of multiphase problems with materials interfaces that are in close proximity or contact while providing a straightforward general approach for evaluating the enrichments. In this manuscript, we present a detailed discussion on the implementation issues and required computational geometry considerations associated with the HIFEM approximation of thermal and mechanical responses of 3D problems. A convergence study is provided to investigate the accuracy and convergence rate of the HIFEM and compare them with standard FEM benchmark solutions. We will also demonstrate the application of this mesh-independent method for simulating the thermal and mechanical responses of two composite materials systems with complex microstructures.

Thermal flux limited electron Kapitza conductance in copper-niobium multilayers

DOE PAGES

Cheaito, Ramez; Hattar, Khalid Mikhiel; Gaskins, John T.; ...

2015-03-05

The interplay between the contributions of electron thermal flux and interface scattering to the Kapitza conductance across metal-metal interfaces through measurements of thermal conductivity of copper-niobium multilayers was studied. Thermal conductivities of copper-niobium multilayer films of period thicknesses ranging from 5.4 to 96.2 nm and sample thicknesses ranging from 962 to 2677 nm are measured by time-domain thermoreflectance over a range of temperatures from 78 to 500 K. The Kapitza conductances between the Cu and Nb interfaces in multilayer films are determined from the thermal conductivities using a series resistor model and are in good agreement with the electron diffusemore » mismatch model. The results for the thermal boundary conductance between Cu and Nb are compared to literature values for the thermal boundary conductance across Al-Cu and Pd-Ir interfaces, and demonstrate that the interface conductance in metallic systems is dictated by the temperature derivative of the electron energy flux in the metallic layers, rather than electron mean free path or scattering processes at the interface.« less

Reliability of emerging bonded interface materials for large-area attachments

DOE PAGES

Paret, Paul P.; DeVoto, Douglas J.; Narumanchi, Sreekant

2015-12-30

In this study, conventional thermal interface materials (TIMs), such as greases, gels, and phase change materials, pose bottlenecks to heat removal and have long caused reliability issues in automotive power electronics packages. Bonded interface materials (BIMs) with superior thermal performance have the potential to be a replacement to the conventional TIMs. However, due to coefficient of thermal expansion mismatches between different components in a package and resultant thermomechanical stresses, fractures or delamination could occur, causing serious reliability concerns. These defects manifest themselves in increased thermal resistance in the package. In this paper, the results of reliability evaluation of emerging BIMsmore » for large-area attachments in power electronics packaging are reported. Thermoplastic (polyamide) adhesive with embedded near-vertical-aligned carbon fibers, sintered silver, and conventional lead solder (Sn 63Pb 37) materials were bonded between 50.8 mm x 50.8 mm cross-sectional footprint silicon nitride substrates and copper base plate samples, and were subjected to accelerated thermal cycling until failure or 2500 cycles. Damage in the BIMs was monitored every 100 cycles by scanning acoustic microscopy. Thermoplastic with embedded carbon fibers performed the best with no defects, whereas sintered silver and lead solder failed at 2300 and 1400 thermal cycles, respectively. Besides thermal cycling, additional lead solder samples were subjected to thermal shock and thermal cycling with extended dwell periods. A finite element method (FEM)-based model was developed to simulate the behavior of lead solder under thermomechanical loading. Strain energy density per cycle results were calculated from the FEM simulations. A predictive lifetime model was formulated for lead solder by correlating strain energy density results extracted from modeling with cycles-to-failure obtained from experimental accelerated tests. A power-law-based approach was used to formulate the - redictive lifetime model.« less

Scaled-Up Production and Transport Applications of Graphitic Carbon Nanomaterials

NASA Astrophysics Data System (ADS)

Saviers, Kimberly R.

Graphitic carbon nanomaterials enhance the performance of engineered systems for energy harvesting and storage. However, commercial availability remains largely cost-prohibitive due to technical barriers to mass production. This thesis examines both the scaled-up production and energy transport applications of graphitic materials. Cost driven-production of graphitic petals is developed, carbon nanotube array thermal interface materials enhance waste heat energy harvesting, and microsupercapacitors are visually examined using a new electroreflectance measurement method. Graphitic materials have previously been synthesized using batch-style processing methods with small sample sizes, limiting their commercial viability. In order to increase production throughput, a roll-to-roll radio-frequency plasma chemical vapor deposition method is employed to continuously deposit graphitic petals on carbon fiber tow. In consideration of a full production framework, efficient and informative characterization methods in the form of electrical resistance and electrochemical capacitance are highlighted. To co-optimize the functional characteristics of the material, the processing conditions are comprehensively varied using a data-driven predictive design of experiments method. Repeatable and reliable production of graphitic materials will enable a host of creative graphene-based devices to emerge into the marketplace. Two such applications are discussed in the remaining chapters. Waste heat is most efficiently harvested at high temperatures, such as vehicle exhaust systems near 600°C. However, the resistance to heat flux at the interfaces between the harvesting device and its surroundings is detrimental to the system-level performance. To study the performance of thermal interface materials up to 700°C, a reference bar measurement method was designed. Design considerations are discussed and compared to past implementations, particularly regarding radiation heat flux and thermal expansion at these elevated temperatures. The microscale roughness of the contacting measurement surface is fully characterized, as it fundamentally affects the resulting thermal interface resistance. This comprehensive method for determining thermal interface resistance at high temperatures includes the physical equipment, data acquisition system, and data analysis method. Thermomechanical evaluation of carbon nanotube arrays up to 700°C has shown that the arrays provide mechanical flexibility to accommodate thermal expansion in a thermomechanically mismatched interface. To demonstrate the application of the arrays for improving energy generation, they were evaluated in conjunction with a thermoelectric module. The system-level efficiency increases significantly when a carbon nanotube array is applied to the hot side of the thermoelectric module. Additional materials characterization suggests the presence of a strong thermal connection between the carbon nanotubes and their catalyst layers, due to covalent bonding between them. In another application of harvesting waste heat, the carbon nanotube arrays increase the performance of a thermo-magnetically actuated shuttle device for solar photovoltaic cells due to decreased thermal interface resistance. Vertically-oriented graphitic petals have previously enhanced supercapacitor power density. Here, a spatiotemporal characterization method is developed and utilized to study ageing phenomena in microsupercapacitor electrodes. The electroreflectance method captures images of charge accumulation in the electrodes at varying states during each charge-discharge cycle. The method was exploited by imaging each an ideal device and a device with defects over an extended period of over four million cycles. The charge accumulation patterns over the ageing period relate to the physical transport behavior. During a single discharge cycle, one may visually observe the electrons drifting out of the electrode. Overall, the investigations herein determine the following. Continuous production of graphitic petals is possible and is optimized by considering the effect of plasma conditions on the resulting functional performance of the material. Thermal interface resistance may be measured at high temperatures in order to understand the viability of interface materials for energy harvesting applications. Carbon nanotube array thermal interface materials lead to increased energy generation from thermoelectric modules. Spatial electroreflectance measurements of microsupercapacitors lead to observation of decreased physical wetting between the electrode and electrolyte, impacting device performance. Looking forward, creative application of graphitic carbon nanomaterials, coupled with cost-driven production capability, will launch them into the commercial marketplace.

Influence of engineered interfaces on residual stresses and mechanical response in metal matrix composites

NASA Technical Reports Server (NTRS)

Arnold, Steven M.; Wilt, Thomas E.

1992-01-01

Because of the inherent coefficient of thermal expansion (CTE) mismatch between fiber and matrix within metal and intermetallic matrix composite systems, high residual stresses can develop under various thermal loading conditions. These conditions include cooling from processing temperature to room temperature as well as subsequent thermal cycling. As a result of these stresses, within certain composite systems, radial, circumferential, and/or longitudinal cracks have been observed to form at the fiber matrix interface region. A number of potential solutions for reducing this thermally induced residual stress field have been proposed recently. Examples of some potential solutions are high CTE fibers, fiber preheating, thermal anneal treatments, and an engineered interface. Here the focus is on designing an interface (by using a compensating/compliant layer concept) to reduce or eliminate the thermal residual stress field and, therefore, the initiation and propagation of cracks developed during thermal loading. Furthermore, the impact of the engineered interface on the composite's mechanical response when subjected to isothermal mechanical load histories is examined.

Creation of a sharp compositional interface in the Pu`u `O`o shallow magma reservoir, Kilauea volcano, Hawai`i

NASA Astrophysics Data System (ADS)

Mittelstaedt, E.; Garcia, M. O.

2006-12-01

Lavas from the early episodes of the Pu`u `O`O eruption (1983-85) of Kilauea Volcano on the island of Hawai'i display rapid compositional variation over short periods for some episodes, especially from the well sampled episode 30 with ~2 wt% MgO variation in <4 hours. Little chemical variation is observed within the episode 30 lavas before or after this abrupt change suggesting a sharp compositional interface within the Pu`u `O`o dike-like shallow reservoir. The change in lava composition throughout the eruption is due to changes in cooling within the dike-like shallow reservoir of Pu`u `O`o. Potential explanations for a sharp interface, such as a reservoir of changing width and changing country rock thermal properties, are evaluated using a simple thermal model of a dike-like body with spatially variable thermal conductivity. The model that best reproduces the compositional data involves a change in thermal conductivity from 2.7 to 11 W m-1 C-1. which is consistent with deep drill hole data in the east rift zone. The change in thermal conductivity may indicate that fluid flow in the east rift zone is restricted at depth possibly by increasing numbers of dikes acting as acuacludes or decreasing pore space due to formation of secondary minerals. Results suggest that country rock thermal gradients can strongly influence magma chemistry in shallow reservoirs.

Modeling the sharp compositional interface in the Pùu ̀Ṑō magma reservoir, Kīlauea volcano, Hawaìi

NASA Astrophysics Data System (ADS)

Mittelstaedt, Eric; Garcia, Michael O.

2007-05-01

Lavas from the early episodes of the Pu`u `Ō`ō eruption (1983-1985) of Kīlauea Volcano on the island of Hawai`i display rapid compositional variation over short periods for some episodes, especially the well-sampled episode 30 with ˜2 wt% MgO variation in <4 hours. Little chemical variation is observed within the episode 30 lavas before or after this abrupt change, suggesting a sharp compositional interface within the Pu`u `Ō`ō dike-like shallow reservoir. Cooling-induced crystal fractionation in this reservoir is thought to be the main control on intraepisode compositional variation. Potential explanations for a sharp interface, such as changing reservoir width and wall rock thermal properties, are evaluated using a simple thermal model of a dike-like body surrounded by wall rock with spatially variable thermal conductivity. The model that best reproduces the compositional data involves a change in wall rock thermal conductivity from 2.7 to 9 W m-1 C-1, which is consistent with deep drill hole data in the east rift zone. The change in thermal conductivity may indicate that fluid flow in the east rift zone is restricted to shallow depths possibly by increasing numbers of dikes acting as aquicludes and/or decreasing pore space due to formation of secondary minerals. Results suggest that wall rock thermal gradients can strongly influence magma chemistry in shallow reservoirs.

Fracture mechanics analyses of ceramic/veneer interface under mixed-mode loading.

PubMed

Wang, Gaoqi; Zhang, Song; Bian, Cuirong; Kong, Hui

2014-11-01

Few studies have focused on the interface fracture performance of zirconia/veneer bilayered structure, which plays an important role in dental all-ceramic restorations. The purpose of this study was to evaluate the fracture mechanics performance of zirconia/veneer interface in a wide range of mode-mixities (at phase angles ranging from 0° to 90°), and to examine the effect of mechanical properties of the materials and the interface on the fracture initiation and crack path of an interfacial crack. A modified sandwich test configuration with an oblique interfacial crack was proposed and calibrated to choose the appropriate geometry dimensions by means of finite element analysis. The specimens with different interface inclination angles were tested to failure under three-point bending configuration. Interface fracture parameters were obtained with finite element analyses. Based on the interfacial fracture mechanics, three fracture criteria for crack kinking were used to predict crack initiation and propagation. In addition, the effects of residual stresses due to coefficient of thermal expansion mismatch between zirconia and veneer on the crack behavior were evaluated. The crack initiation and propagation were well predicted by the three fracture criteria. For specimens at phase angle of 0, the cracks propagated in the interface; whereas for all the other specimens the cracks kinked into the veneer. Compressive residual stresses in the veneer can improve the toughness of the interface structure. The results suggest that, in zirconia/veneer bilayered structure the veneer is weaker than the interface, which can be used to explain the clinical phenomenon that veneer chipping rate is larger than interface delamination rate. Consequently, a veneer material with larger fracture toughness is needed to decrease the failure rate of all-ceramic restorations. And the coefficient of thermal expansion mismatch of the substrates can be larger to produce larger compressive stresses in the veneer. Copyright © 2014 Elsevier Ltd. All rights reserved.

A flux-limited treatment for the conductive evaporation of spherical interstellar gas clouds

NASA Technical Reports Server (NTRS)

Dalton, William W.; Balbus, Steven A.

1993-01-01

In this work, we present and analyze a new analytic solution for the saturated (flux-limited) thermal evaporation of a spherical cloud. This work is distinguished from earlier analytic studies by allowing the thermal conductivity to change continuously from a diffusive to a saturated form, in a manner usually employed only in numerical calculations. This closed form solution will be of interest as a computational benchmark. Using our calculated temperature profiles and mass-loss rates, we model the thermal evaporation of such a cloud under typical interstellar medium (ISM) conditions, with some restrictions. We examine the ionization structure of the cloud-ISM interface and evaluate column densities of carbon, nitrogen, oxygen, neon, and silicon ions toward the cloud. In accord with other investigations, we find that ionization equilibrium is far from satisfied under the assumed conditions. Since the inclusion of saturation effects in the heat flux narrows the thermal interface relative to its classical structure, we also find that saturation effects tend to lower predicted column densities.

Investigation of Thermal Interface Materials Using Phase-Sensitive Transient Thermoreflectance Technique: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

Feng, X.; King, C.; DeVoto, D.

2014-08-01

With increasing power density in electronics packages/modules, thermal resistances at multiple interfaces are a bottleneck to efficient heat removal from the package. In this work, the performance of thermal interface materials such as grease, thermoplastic adhesives and diffusion-bonded interfaces are characterized using the phase-sensitive transient thermoreflectance technique. A multi-layer heat conduction model was constructed and theoretical solutions were derived to obtain the relation between phase lag and the thermal/physical properties. This technique enables simultaneous extraction of the contact resistance and bulk thermal conductivity of the TIMs. With the measurements, the bulk thermal conductivity of Dow TC-5022 thermal grease (70 tomore » 75 um bondline thickness) was 3 to 5 W/(m-K) and the contact resistance was 5 to 10 mm2-K/W. For the Btech thermoplastic material (45 to 80 μm bondline thickness), the bulk thermal conductivity was 20 to 50 W/(m-K) and the contact resistance was 2 to 5 mm2-K/W. Measurements were also conducted to quantify the thermal performance of diffusion-bonded interface for power electronics applications. Results with the diffusion-bonded sample showed that the interfacial thermal resistance is more than one order of magnitude lower than those of traditional TIMs, suggesting potential pathways to efficient thermal management.« less

Energy Storage Requirements & Challenges for Ground Vehicles

DTIC Science & Technology

2010-03-18

Titinate Evaluation Cell Evaluation Battery Aging Phenomenon Battery SOC/SOH Determination Modeling ARM 100 LiIon APU Lion Cell Evaluation Cell...Advanced Batteries Fuels Th er m al Ma na ge m en t Radiators Heat Recovery Thermal Interface Materials Phase Change Cooling Advanced Electronics...in all energy storage Energy Storage Team Mission Battery Technology Evaluation Lab Module Test & Eval Cell Test & Eval 6UNCLASSIFIED Pacing Vehicle

Thermal conductance of two interface materials and their applications in space systems

NASA Technical Reports Server (NTRS)

Scialdone, J. J.; Clatterbuck, C. H.; Wall, J. L.

1992-01-01

The temperature control of spacecraft and instrument systems and subsystems requires heat transfer interface materials that possess good thermal and structural characteristics, among other properties, to respond to the vacuum environment of space. These materials must be easy to apply to, and remove from, the surfaces where they are applied, and must be able to withstand power dissipation extremes, and be used for different clamping configurations and pressures. Silicone based greases, used in the past, tend to migrate and to contaminate nearby surfaces. Bare metal to metal contact offers low thermal conductance and difficulties in estimating the actual heat transfer. Several polymeric materials containing different thermal conductive compounds and structural reinforcements were prepared to overcome grease and metal problems. Two polymeric materials were evaluated: Cho-Therm 1671 elastomer; and the CV-2946, a conductive RTV silicone. Tests were done to learn more about these products. Results indicate that the tightly bolted, torqued fixtures did not buckle or distort, and provided optimum thermal conductance. Fixtures simulating actual spacecraft configuration suffered bowing and separating.

Nanoscale characterization of the thermal interface resistance of a heat-sink composite material by in situ TEM.

PubMed

Kawamoto, Naoyuki; Kakefuda, Yohei; Mori, Takao; Hirose, Kenji; Mitome, Masanori; Bando, Yoshio; Golberg, Dmitri

2015-11-20

We developed an original method of in situ nanoscale characterization of thermal resistance utilizing a high-resolution transmission electron microscope (HRTEM). The focused electron beam of the HRTEM was used as a contact-free heat source and a piezo-movable nanothermocouple was developed as a thermal detector. This method has a high flexibility of supplying thermal-flux directions for nano/microscale thermal conductivity analysis, and is a powerful way to probe the thermal properties of complex or composite materials. Using this method we performed reproducible measurements of electron beam-induced temperature changes in pre-selected sections of a heat-sink α-Al(2)O(3)/epoxy-based resin composite. Observed linear behavior of the temperature change in a filler reveals that Fourier's law holds even at such a mesoscopic scale. In addition, we successfully determined the thermal resistance of the nanoscale interfaces between neighboring α-Al(2)O(3) fillers to be 1.16 × 10(-8) m(2)K W(-1), which is 35 times larger than that of the fillers themselves. This method that we have discovered enables evaluation of thermal resistivity of composites on the nanoscale, combined with the ultimate spatial localization and resolution sample analysis capabilities that TEM entails.

Thermogravimetric and microscopic analysis of SiC/SiC materials with advanced interfaces

DOE Office of Scientific and Technical Information (OSTI.GOV)

Windisch, C.F. Jr.; Jones, R.H.; Snead, L.L.

1997-04-01

The chemical stability of SiC/SiC composites with fiber/matrix interfaces consisting of multilayers of SiC/SiC and porous SiC have been evaluated using a thermal gravimetric analyzer (TGA). Previous evaluations of SiC/SiC composites with carbon interfacial layers demonstrated the layers are not chemically stable at goal use temperatures of 800-1100{degrees}C and O{sub 2} concentrations greater than about 1 ppm. No measureable mass change was observed for multilayer and porous SiC interfaces at 800-1100{degrees}C and O{sub 2} concentrations of 100 ppm to air; however, the total amount of oxidizable carbon is on the order of the sensitivity of the TGA. Further studies aremore » in progress to evaluate the stability of these materials.« less

A numerical study on optimising the cryosurgical process for effective tumour necrosis

NASA Astrophysics Data System (ADS)

Ramajayam, K. K.; Kumar, A.; Sarangi, S. K.; Thirugnanam, A.

2017-05-01

This study presents the concept of improving the efficacy of cryosurgery using a low thermal conductivity liquid around the interface of a tumour. In the same context, perfluorohexane, a low thermal conductivity liquid has been used for the insulation of tumour. In the presence of a perfluorohexane layer, results demonstrate that the lethal front and the freezing front do not cross the tumour boundary. The results of numerical modelling indicate that there is an optimal thickness of the perfluorohexane layer which enables a perfect insulation to the tumour. Further, the contour plot presents that the optimal thickness of the perfluorohexane layer is 1 mm. The results also suggest that the lethal front reaches the tumour boundary at 100 s when perfluorohexane is used as an insulation at the tumour boundary. It is seen that a change in the thermal conductivity of the insulation at the tumour interface affects the lethal front propagation drastically. Among perfluorohexane, octafluoropropane and water, this study reveals perfluorohexane as the best substitute for the formation of the insulating layer at the tumour interface. The lower thermal conductivity of perfluorohexane provides a good barrier to the healthy tissue surrounding the tumour (as seen from the comparison of gap, i.e. the distance between the lethal front and the tumour interface). Furthermore, the calculation of gap indicates the most optimal configuration for cooling the tumour (termed as the optimal offset). In conclusion, the results presented in the study help in optimising the layer thickness at the tumour interface, the identification of an appropriate substance for making the layer and the use of gap to evaluate the most optimal configuration for freezing the tumours effectively.

Thermal transport across metal–insulator interface via electron–phonon interaction.

PubMed

Zhang, Lifa; Lü, Jing-Tao; Wang, Jian-Sheng; Li, Baowen

2013-11-06

The thermal transport across a metal–insulator interface can be characterized by electron–phonon interaction through which an electron lead is coupled to a phonon lead if phonon–phonon coupling at the interface is very weak. We investigate the thermal conductance and rectification between the electron part and the phonon part using the nonequilibrium Green's function method. It is found that the thermal conductance has a nonmonotonic behavior as a function of average temperature or the coupling strength between the phonon leads in the metal part and the insulator part. The metal–insulator interface shows a clear thermal rectification effect, which can be reversed by a change in average temperature or the electron–phonon coupling.

Thermal conductivity of III-V semiconductor superlattices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mei, S., E-mail: song.mei@wisc.edu; Knezevic, I., E-mail: irena.knezevic@wisc.edu

2015-11-07

This paper presents a semiclassical model for the anisotropic thermal transport in III-V semiconductor superlattices (SLs). An effective interface rms roughness is the only adjustable parameter. Thermal transport inside a layer is described by the Boltzmann transport equation in the relaxation time approximation and is affected by the relevant scattering mechanisms (three-phonon, mass-difference, and dopant and electron scattering of phonons), as well as by diffuse scattering from the interfaces captured via an effective interface scattering rate. The in-plane thermal conductivity is obtained from the layer conductivities connected in parallel. The cross-plane thermal conductivity is calculated from the layer thermal conductivitiesmore » in series with one another and with thermal boundary resistances (TBRs) associated with each interface; the TBRs dominate cross-plane transport. The TBR of each interface is calculated from the transmission coefficient obtained by interpolating between the acoustic mismatch model (AMM) and the diffuse mismatch model (DMM), where the weight of the AMM transmission coefficient is the same wavelength-dependent specularity parameter related to the effective interface rms roughness that is commonly used to describe diffuse interface scattering. The model is applied to multiple III-arsenide superlattices, and the results are in very good agreement with experimental findings. The method is both simple and accurate, easy to implement, and applicable to complicated SL systems, such as the active regions of quantum cascade lasers. It is also valid for other SL material systems with high-quality interfaces and predominantly incoherent phonon transport.« less

Mechanical and thermal disturbances of the PSR Moderate Focus-Mission Structure

NASA Technical Reports Server (NTRS)

Shih, Choon-Foo; Lou, Michael C.

1991-01-01

The primary objective of this paper is to evaluate the optical pointing performance of the PSR Moderate Focus-Mission Structure when subjected to both mechanical and thermal disturbances. The mechanical disturbances are based on secondary mirror chopping. Results indicate that dynamic responses of the primary reflector and the secondary reflector subjected to chopping disturbances of the secondary reflector about its center of mass are within the figure maintenance control capabilities. The effects of modal damping, truss-type secondary support, interface boundary constraints, and alternate configurations, are also evaluated in the analysis. Thermal distortions of the structure were also evaluated based on the on-orbit temperature profiles derived from the submillimeter telescope missions. Results from thermal deformation analysis indicate that figure initialization control is needed for the PSR Moderate Focus-Mission. However, a figure maintenance system may not be required if adequate thermal isolation is incorporated into the support truss design for the PSR Moderate Focus-Mission Structure.

Superior Thermal Interface via Vertically Aligned Carbon Nanotubes Grown on Graphite Foils

DTIC Science & Technology

2012-01-01

accepted 12 November 2012) In an attempt to study the thermal transport at the interface between nanotubes and graphene, vertically aligned multiwalled...tually increases the thermal barrier in a significant manner. On the other hand, thermal transport properties of thermal tapes and thermally conductive...aforementioned study achieved superior thermal transport properties, the processing and scale-up of the developed process would be prohibitively

Interfacial Thermal Conductance Limit and Thermal Rectification Across Vertical Carbon Nanotube/Graphene Nanoribbon-Silicon Interfaces

DTIC Science & Technology

2013-01-01

Interfacial thermal conductance limit and thermal rectification across vertical carbon nanotube/graphene nanoribbon-silicon interfaces Ajit K...054308 (2013) Investigation on interfacial thermal resistance and phonon scattering at twist boundary of silicon J. Appl. Phys. 113, 053513 (2013...2013 to 00-00-2013 4. TITLE AND SUBTITLE Interfacial thermal conductance limit and thermal rectification across vertical carbon nanotube/graphene

Acoustic wave generation by microwaves and applications to nondestructive evaluation.

PubMed

Hosten, Bernard; Bacon, Christophe; Guilliorit, Emmanuel

2002-05-01

Although acoustic wave generation by electromagnetic waves has been widely studied in the case of laser-generated ultrasounds, the literature on acoustic wave generation by thermal effects due to electromagnetic microwaves is very sparse. Several mechanisms have been suggested to explain the phenomenon of microwave generation, i.e. radiation pressure, electrostriction or thermal expansion. Now it is known that the main cause is the thermal expansion due to the microwave absorption. This paper will review the recent advances in the theory and experiments that introduce a new way to generate ultrasonic waves without contact for the purpose of nondestructive evaluation and control. The unidirectional theory based on Maxwell's equations, heat equation and thermoviscoelasticity predicts the generation of acoustic waves at interfaces and inside stratified materials. Acoustic waves are generated by a pulsed electromagnetic wave or a burst at a chosen frequency such that materials can be excited with a broad or narrow frequency range. Experiments show the generation of acoustic waves in water, viscoelastic polymers and composite materials shaped as rod and plates. From the computed and measured accelerations at interfaces, the viscoelastic and electromagnetic properties of materials such as polymers and composites can be evaluated (NDE). Preliminary examples of non-destructive testing applications are presented.

Current development in selected stress and thermal analysis software interfaces with PRO-ENGINEER

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schulze, J.

1993-06-01

Ever since PRO-ENGINEER has become a dominating CAD package available to the public, some of us have been saying, ``Gee, if only I could export my geometry to a stress analysis program without having to recreate any of the details already created, wouldn`t that be spectacular?`` Well, much to the credit of the major stress and thermal analysis software vendors, some of them have been listening to design engineers like me badger them to furnish a seamless interface between PRO and their stress analysis programs. The down side of this problem is the fact that a lot of problems stillmore » exist with most of the vendors and their interfaces. I want to discuss the interfaces that I feel are currently ``State of the Art``, and how they are developing and the future for finally arriving at a transparent procedure that an engineer at a workstation can utilize in his or her design process. In years past, engineers would develop a design and changes would evolve based on intuition, or somebody else`s critical evaluation. Then the design would be forwarded to the production group, or the stress analysis group for further evaluation and analysis. Maybe data from a preliminary prototype would be collected and an evaluation report made. All of this took time and increased the cost of the item to be manufactured. Today, the engineer must assume responsibility for design and functional capability early on in the design process, if for no other reason than costs associated with diverse channels of critiquing. For that reason, one place to enhance the design process is to have the ability to do preliminary stress and thermal analysis during the initial design phase. This is both cost and time effective. But, as I am sure you are aware, this has been easier said than done.« less

Translational and rotational diffusion of Janus nanoparticles at liquid interfaces

NASA Astrophysics Data System (ADS)

Rezvantalab, Hossein; Shojaei-Zadeh, Shahab

2014-11-01

We use molecular dynamics simulations to understand the thermal motion of nanometer-sized Janus particles at the interface between two immiscible fluids. We consider spherical nanoparticles composed of two sides with different affinity to fluid phases, and evaluate their dynamics and changes in fluid structure as a function of particle size and surface chemistry. We show that as the amphiphilicity increases upon enhancing the wetting of each side with its favored fluid, the in-plane diffusivity at the interface becomes slower. Detail analysis of the fluid structure reveals that this is mainly due to formation of a denser adsorption layer around more amphiphilic particles, which leads to increased drag acting against nanoparticle motion. Similarly, the rotational thermal motion of Janus particles is reduced compared to their homogeneous counterparts as a result of the higher resistance of neighboring fluid species against rotation. We also incorporate the influence of fluid density and surface tension on the interfacial dynamics of such Janus nanoparticles. Our findings may have implications in understanding the adsorption mechanism of drugs and protein molecules with anisotropic surface properties to biological interfaces including cell membranes.

Transfer of control system interface solutions from other domains to the thermal power industry.

PubMed

Bligård, L-O; Andersson, J; Osvalder, A-L

2012-01-01

In a thermal power plant the operators' roles are to control and monitor the process to achieve efficient and safe production. To achieve this, the human-machine interfaces have a central part. The interfaces need to be updated and upgraded together with the technical functionality to maintain optimal operation. One way of achieving relevant updates is to study other domains and see how they have solved similar issues in their design solutions. The purpose of this paper is to present how interface design solution ideas can be transferred from domains with operator control to thermal power plants. In the study 15 domains were compared using a model for categorisation of human-machine systems. The result from the domain comparison showed that nuclear power, refinery and ship engine control were most similar to thermal power control. From the findings a basic interface structure and three specific display solutions were proposed for thermal power control: process parameter overview, plant overview, and feed water view. The systematic comparison of the properties of a human-machine system allowed interface designers to find suitable objects, structures and navigation logics in a range of domains that could be transferred to the thermal power domain.

Thermal management and prototype testing of Compton scattering X-ray beam position monitor for the Advanced Photon Source Upgrade

NASA Astrophysics Data System (ADS)

Lee, S. H.; Yang, B. X.; Collins, J. T.; Ramanathan, M.

2017-02-01

Accurate and stable x-ray beam position monitors (XBPMs) are key elements in obtaining the desired user beam stability in the Advanced Photon Source Upgrade. In the next-generation XBPMs for the canted-undulator front ends, where two undulator beams are separated by 1.0 mrad, the lower beam power (<10 kW) per undulator allows us to explore lower-cost solutions based on Compton scattering from a diamond placed edge-on to the x-ray beam. Because of the high peak power density of the x-ray beams, this diamond experiences high temperatures and has to be clamped to a water-cooled heat spreader using thermal interface materials (TIMs), which play a key role in reducing the temperature of the diamond. To evaluate temperature changes through the interface via thermal simulations, the thermal contact resistance (TCR) of TIMs at an interface between two solid materials under even contact pressure must be known. This paper addresses the TCR measurements of several TIMs, including gold, silver, pyrolytic graphite sheet, and 3D graphene foam. In addition, a prototype of a Compton-scattering XBPM with diamond blades was installed at APS Beamline 24-ID-A in May 2015 and has been tested. This paper presents the design of the Compton-scattering XBPM, and compares thermal simulation results obtained for the diamond blade of this XBPM by the finite element method with in situ empirical measurements obtained by using reliable infrared technology.

Thermal management and prototype testing of Compton scattering X-ray beam position monitor for the Advanced Photon Source Upgrade.

PubMed

Lee, S H; Yang, B X; Collins, J T; Ramanathan, M

2017-02-01

Accurate and stable x-ray beam position monitors (XBPMs) are key elements in obtaining the desired user beam stability in the Advanced Photon Source Upgrade. In the next-generation XBPMs for the canted-undulator front ends, where two undulator beams are separated by 1.0 mrad, the lower beam power (<10 kW) per undulator allows us to explore lower-cost solutions based on Compton scattering from a diamond placed edge-on to the x-ray beam. Because of the high peak power density of the x-ray beams, this diamond experiences high temperatures and has to be clamped to a water-cooled heat spreader using thermal interface materials (TIMs), which play a key role in reducing the temperature of the diamond. To evaluate temperature changes through the interface via thermal simulations, the thermal contact resistance (TCR) of TIMs at an interface between two solid materials under even contact pressure must be known. This paper addresses the TCR measurements of several TIMs, including gold, silver, pyrolytic graphite sheet, and 3D graphene foam. In addition, a prototype of a Compton-scattering XBPM with diamond blades was installed at APS Beamline 24-ID-A in May 2015 and has been tested. This paper presents the design of the Compton-scattering XBPM, and compares thermal simulation results obtained for the diamond blade of this XBPM by the finite element method with in situ empirical measurements obtained by using reliable infrared technology.

Impacts and Awards | Transportation Research | NREL

Science.gov Websites

for Si-based materials and the electrochemical lithiation and delithiation of the coated materials -cooling lab equipment New Thermal Interface Materials Deliver Ultralow Thermal Resistance for Compact Electronics Graphic of data chart showing thermal contact resistances at various interfaces. Optical Thermal

Nondestructive Evaluation of Adhesive Bonds via Ultrasonic Phase Measurements

NASA Technical Reports Server (NTRS)

Haldren, Harold A.; Perey, Daniel F.; Yost, William T.; Cramer, K. Elliott; Gupta, Mool C.

2016-01-01

The use of advanced composites utilizing adhesively bonded structures offers advantages in weight and cost for both the aerospace and automotive industries. Conventional nondestructive evaluation (NDE) has proved unable to reliably detect weak bonds or bond deterioration during service life conditions. A new nondestructive technique for quantitatively measuring adhesive bond strength is demonstrated. In this paper, an ultrasonic technique employing constant frequency pulsed phased-locked loop (CFPPLL) circuitry to monitor the phase response of a bonded structure from change in thermal stress is discussed. Theoretical research suggests that the thermal response of a bonded interface relates well with the quality of the adhesive bond. In particular, the effective stiffness of the adhesive-adherent interface may be extracted from the thermal phase response of the structure. The sensitivity of the CFPPLL instrument allows detection of bond pathologies that have been previously difficult-to-detect. Theoretical results with this ultrasonic technique on single epoxy lap joint (SLJ) specimens are presented and discussed. This technique has the potential to advance the use of adhesive bonds - and by association, advanced composite structures - by providing a reliable method to measure adhesive bond strength, thus permitting more complex, lightweight, and safe designs.

Effects of interfaces on the thermal conductivity in Si/Si0.75Ge0.25 multilayer with varying Au layers

NASA Astrophysics Data System (ADS)

Hu, Yangsen; Wu, Zhenghua; Ye, Fengjie; Hu, Zhiyu

2018-02-01

The manoeuvre of thermal transport property across multilayer films with inserted metal layers through controlling the metal-nonmetal interfaces is of fundamental interest. In this work, amorphous Si/Si0.75Ge0.25 multilayer films inserted with varying Au layers were fabricated by magnetron sputtering. The structure and sharp interface of multilayers films were characterized by low angle x-ray diffraction (LAXRD), grazing incidence small angle x-ray scattering (GISAXS) and scanning electron microscopy (SEM). A differential 3ω method was applied to measure the effective thermal conductivity. The measurements show that thermal conductivity has changed as varying Au layers. Thermal conductivity increased from 0.94 to 1.31 Wm-1K-1 while Si0.75Ge0.25 layer was replaced by different Au layers, which was attributed to the strong electron-phonon coupling and interface thermal resistance in a metal-nonmetal multilayered system. Theoretical calculation combined with experimental results indicate that the thermal conductivity of the multilayer film could be facilely controlled by introducing different number of nanoconstructed metal-nonmetal interfaces, which provide a more insightful understanding of the thermal transport manipulation mechanism of the thin film system with inserting metal layers.

Phonon-interface scattering in multilayer graphene on an amorphous support

PubMed Central

Sadeghi, Mir Mohammad; Jo, Insun; Shi, Li

2013-01-01

The recent studies of thermal transport in suspended, supported, and encased graphene just began to uncover the richness of two-dimensional phonon physics, which is relevant to the performance and reliability of graphene-based functional materials and devices. Among the outstanding questions are the exact causes of the suppressed basal-plane thermal conductivity measured in graphene in contact with an amorphous material, and the layer thickness needed for supported or embedded multilayer graphene (MLG) to recover the high thermal conductivity of graphite. Here we use sensitive in-plane thermal transport measurements of graphene samples on amorphous silicon dioxide to show that full recovery to the thermal conductivity of the natural graphite source has yet to occur even after the MLG thickness is increased to 34 layers, considerably thicker than previously thought. This seemingly surprising finding is explained by long intrinsic scattering mean free paths of phonons in graphite along both basal-plane and cross-plane directions, as well as partially diffuse scattering of MLG phonons by the MLG-amorphous support interface, which is treated by an interface scattering model developed for highly anisotropic materials. Based on the phonon transmission coefficient calculated from reported experimental thermal interface conductance results, phonons emerging from the interface consist of a large component that is scattered across the interface, making rational choice of the support materials a potential approach to increasing the thermal conductivity of supported MLG. PMID:24067656

Thermal Protection Supplement for Reducing Interface Thermal Mismatch

NASA Technical Reports Server (NTRS)

Stewart, David A. (Inventor); Leiser, Daniel B. (Inventor)

2017-01-01

A thermal protection system that reduces a mismatch of thermal expansion coefficients CTE between a first material layer (CTE1) and a second material layer (CTE2) at a first layer-second layer interface. A portion of aluminum borosilicate (abs) or another suitable additive (add), whose CTE value, CTE(add), satisfies (CTE(add)-CTE1)(CTE(add)-CTE2)<0, is distributed with variable additive density,.rho.(z;add), in the first material layer and/or in the second material layer, with.rho.(z;add) near the materials interface being relatively high (alternatively, relatively low) and.rho.(z;add) in a region spaced apart from the interface being relatively low (alternatively, relatively high).

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lee, S. H.; Yang, B. X.; Collins, J. T.

Accurate and stable x-ray beam position monitors (XBPMs) are key elements in obtaining the desired user beam stability in the Advanced Photon Source Upgrade. In the next-generation XBPMs for the canted-undulator front ends, where two undulator beams are separated by 1.0 mrad, the lower beam power (<10 kW) per undulator allows us to explore lower-cost solutions based on Compton scattering from a diamond placed edge-on to the x-ray beam. Because of the high peak power density of the x-ray beams, this diamond experiences high temperatures and has to be clamped to a water-cooled heat spreader using thermal interface materials (TIMs),more » which play a key role in reducing the temperature of the diamond. To evaluate temperature changes through the interface via thermal simulations, the thermal contact resistance (TCR) of TIMs at an interface between two solid materials under even contact pressure must be known. This paper addresses the TCR measurements of several TIMs, including gold, silver, pyrolytic graphite sheet, and 3D graphene foam. In addition, a prototype of a Compton-scattering XBPM with diamond blades was installed at APS Beamline 24-ID-A in May 2015 and has been tested. This study presents the design of the Compton-scattering XBPM, and compares thermal simulation results obtained for the diamond blade of this XBPM by the finite element method with in situ empirical measurements obtained by using reliable infrared technology.« less

Arc Jet Testing of the TIRS Cover Thermal Protection System for Mars Exploration Rover

NASA Technical Reports Server (NTRS)

Szalai, Christine E.; Chen, Y.-K.; Loomis, Mark; Hui, Frank; Scrivens, Larry

2002-01-01

This paper summarizes the arc jet test results of the Mars Exploration Rover (MER) Silicone Impregnated Reusable Ceramic Ablator (SIRCA) Transverse Impulse Rocket System (TIRS) Cover test series in the Panel Test Facility (PTF) at NASA Ames Research Center (ARC). NASA ARC performed aerothermal environment analyses, TPS sizing and thermal response analyses, and arc jet testing to evaluate the MER SIRCA TIRS Cover design and interface to the aeroshell structure. The primary objective of this arc jet test series was to evaluate specific design details of the SIRCA TIRS Cover interface to the MER aeroshell under simulated atmospheric entry heating conditions. Four test articles were tested in an arc jet environment with various sea] configurations. The test condition was designed to match the predicted peak flight heat load at the gap region between the SIRCA and the backshell TPS material, SLA-561S, and resulted in an over-test (with respect to heat flux and heat load) for the apex region of the SIRCA TIRS Cover. The resulting pressure differential was as much as twenty times that predicted for the flight case, depending on the location, and there was no post-test visual evidence of over-heating or damage to the seal, bracket, or backshell structure. The exposed titanium bolts were in good condition at post-test and showed only a small amount of oxidation at the leading edge locations. Repeatable thermocouple data were obtained and SIRCA thermal response analyses were compared to applicable thermocouple data. For the apex region of the SIRCA TIRS Cover, a one-dimensional thermal response prediction proved overly conservative, as there were strong multi-dimensional conduction effects evident from the thermocouple data. The one-dimensional thermal response prediction compared well with the thermocouple data for the leading edge "lip" region at the bolt location. In general, the test results yield confidence in the baseline seal design to prevent hot gas ingestion at the bracket and composite aeroshell structure interface.

Solid-Liquid Interface Thermal Resistance Affects the Evaporation Rate of Droplets from a Surface: A Study of Perfluorohexane on Chromium Using Molecular Dynamics and Continuum Theory.

PubMed

Han, Haoxue; Schlawitschek, Christiane; Katyal, Naman; Stephan, Peter; Gambaryan-Roisman, Tatiana; Leroy, Frédéric; Müller-Plathe, Florian

2017-05-30

We study the role of solid-liquid interface thermal resistance (Kapitza resistance) on the evaporation rate of droplets on a heated surface by using a multiscale combination of molecular dynamics (MD) simulations and analytical continuum theory. We parametrize the nonbonded interaction potential between perfluorohexane (C 6 F 14 ) and a face-centered-cubic solid surface to reproduce the experimental wetting behavior of C 6 F 14 on black chromium through the solid-liquid work of adhesion (quantity directly related to the wetting angle). The thermal conductances between C 6 F 14 and (100) and (111) solid substrates are evaluated by a nonequilibrium molecular dynamics approach for a liquid pressure lower than 2 MPa. Finally, we examine the influence of the Kapitza resistance on evaporation of droplets in the vicinity of a three-phase contact line with continuum theory, where the thermal resistance of liquid layer is comparable with the Kapitza resistance. We determine the thermodynamic conditions under which the Kapitza resistance plays an important role in correctly predicting the evaporation heat flux.

Ion irradiation of the native oxide/silicon surface increases the thermal boundary conductance across aluminum/silicon interfaces

NASA Astrophysics Data System (ADS)

Gorham, Caroline S.; Hattar, Khalid; Cheaito, Ramez; Duda, John C.; Gaskins, John T.; Beechem, Thomas E.; Ihlefeld, Jon F.; Biedermann, Laura B.; Piekos, Edward S.; Medlin, Douglas L.; Hopkins, Patrick E.

2014-07-01

The thermal boundary conductance across solid-solid interfaces can be affected by the physical properties of the solid boundary. Atomic composition, disorder, and bonding between materials can result in large deviations in the phonon scattering mechanisms contributing to thermal boundary conductance. Theoretical and computational studies have suggested that the mixing of atoms around an interface can lead to an increase in thermal boundary conductance by creating a region with an average vibrational spectra of the two materials forming the interface. In this paper, we experimentally demonstrate that ion irradiation and subsequent modification of atoms at solid surfaces can increase the thermal boundary conductance across solid interfaces due to a change in the acoustic impedance of the surface. We measure the thermal boundary conductance between thin aluminum films and silicon substrates with native silicon dioxide layers that have been subjected to proton irradiation and post-irradiation surface cleaning procedures. The thermal boundary conductance across the Al/native oxide/Si interfacial region increases with an increase in proton dose. Supported with statistical simulations, we hypothesize that ion beam mixing of the native oxide and silicon substrate within ˜2.2nm of the silicon surface results in the observed increase in thermal boundary conductance. This ion mixing leads to the spatial gradation of the silicon native oxide into the silicon substrate, which alters the acoustic impedance and vibrational characteristics at the interface of the aluminum film and native oxide/silicon substrate. We confirm this assertion with picosecond acoustic analyses. Our results demonstrate that under specific conditions, a "more disordered and defected" interfacial region can have a lower resistance than a more "perfect" interface.

Effect of graphene nanofillers on the enhanced thermoelectric properties of Bi2Te3 nanosheets: elucidating the role of interface in de-coupling the electrical and thermal characteristics

NASA Astrophysics Data System (ADS)

Kumar, Sunil; Singh, Simrjit; Dhawan, Punit Kumar; Yadav, R. R.; Khare, Neeraj

2018-04-01

In this report, we investigate the effect of graphene nanofillers on the thermoelectric properties of Bi2Te3 nanosheets and demonstrate the role of interface for enhancing the overall figure of merit (ZT) ∼ 53%. The enhancement in the ZT is obtained due to an increase in the electrical conductivity (∼111%) and decrease in the thermal conductivity (∼12%) resulting from increased conducting channels and phonon scattering, respectively at the interfaces between graphene and Bi2Te3 nanosheets. A detailed analysis of the thermal conductivity reveals ∼4 times decrease in the lattice thermal conductivity in contrast to ∼2 times increase in the electronic thermal conductivity after the addition of graphene. Kelvin probe measurements have also been carried which reveals presence of low potential barrier at the interface between graphene and Bi2Te3 nanosheets which assist the flow of charge carriers thereby, increasing the mobility of the carriers. Thus, our results reveals a significant decrease in the lattice thermal conductivity (due to the formation of interfaces) and increase in the electron mobility (due to conducting paths at the interfaces) strongly participate in deciding observed enhancement in the thermoelectric figure of merit.

Effect of graphene nanofillers on the enhanced thermoelectric properties of Bi2Te3 nanosheets: elucidating the role of interface in de-coupling the electrical and thermal characteristics.

PubMed

Kumar, Sunil; Singh, Simrjit; Dhawan, Punit Kumar; Yadav, R R; Khare, Neeraj

2018-04-03

In this report, we investigate the effect of graphene nanofillers on the thermoelectric properties of Bi 2 Te 3 nanosheets and demonstrate the role of interface for enhancing the overall figure of merit (ZT) ∼ 53%. The enhancement in the ZT is obtained due to an increase in the electrical conductivity (∼111%) and decrease in the thermal conductivity (∼12%) resulting from increased conducting channels and phonon scattering, respectively at the interfaces between graphene and Bi 2 Te 3 nanosheets. A detailed analysis of the thermal conductivity reveals ∼4 times decrease in the lattice thermal conductivity in contrast to ∼2 times increase in the electronic thermal conductivity after the addition of graphene. Kelvin probe measurements have also been carried which reveals presence of low potential barrier at the interface between graphene and Bi 2 Te 3 nanosheets which assist the flow of charge carriers thereby, increasing the mobility of the carriers. Thus, our results reveals a significant decrease in the lattice thermal conductivity (due to the formation of interfaces) and increase in the electron mobility (due to conducting paths at the interfaces) strongly participate in deciding observed enhancement in the thermoelectric figure of merit.

General theories and features of interfacial thermal transport

NASA Astrophysics Data System (ADS)

Zhou, Hangbo; Zhang, Gang

2018-03-01

A clear understanding and proper control of interfacial thermal transport is important in nanoscale device. In this review, we first discuss the theoretical methods to handle the interfacial thermal transport problem, such as the macroscopic model, molecular dynamics, lattice dynamics and modern quantum transport theories. Then we discuss various effects that can significantly affect the interfacial thermal transport, such as the formation of chemical bonds at interface, defects and interface roughness, strain and substrates, atomic species and mass ratios, structural orientations. Then importantly, we analyze the role of inelastic scatterings at the interface, and discuss its application in thermal rectifications. Finally, the challenges and promising directions are discussed.

Space transportation system payload interface verification

NASA Technical Reports Server (NTRS)

Everline, R. T.

1977-01-01

The paper considers STS payload-interface verification requirements and the capability provided by STS to support verification. The intent is to standardize as many interfaces as possible, not only through the design, development, test and evaluation (DDT and E) phase of the major payload carriers but also into the operational phase. The verification process is discussed in terms of its various elements, such as the Space Shuttle DDT and E (including the orbital flight test program) and the major payload carriers DDT and E (including the first flights). Five tools derived from the Space Shuttle DDT and E are available to support the verification process: mathematical (structural and thermal) models, the Shuttle Avionics Integration Laboratory, the Shuttle Manipulator Development Facility, and interface-verification equipment (cargo-integration test equipment).

Thermal conductance of metal–diamond interfaces at high pressure

DOE PAGES

Hohensee, Gregory T.; Wilson, R. B.; Cahill, David G.

2015-03-06

The thermal conductance of interfaces between metals and diamond, which has a comparatively high Debye temperature, is often greater than can be accounted for by two phonon-processes. The high pressures achievable in a diamond anvil cell can significantly extend the metal phonon density of states to higher frequencies, and can also suppress extrinsic effects by greatly stiffening interface bonding. Here we report time-domain thermoreflectance measurements of metal-diamond interface thermal conductance up to 50 GPa in the DAC for Pb, Au 0.95Pd 0.05, Pt, and Al films deposited on Type 1A natural [100] and Type 2A synthetic [110] diamond anvils. Inmore » all cases, the thermal conductances increase weakly or saturate to similar values at high pressure. Lastly, our results suggest that anharmonic conductance at metal-diamond interfaces is controlled by partial transmission processes, where a diamond phonon that inelastically scatters at the interface absorbs or emits a metal phonon.« less

An Investigation into the Effects of Interface Stress and Interfacial Arrangement on Temperature Dependent Thermal Properties of a Biological and a Biomimetic Material

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tomar, Vikas

2015-01-12

A significant effort in the biomimetic materials research is on developing materials that can mimic and function in the same way as biological tissues, on bio-inspired electronic circuits, on bio-inspired flight structures, on bio-mimetic materials processing, and on structural biomimetic materials, etc. Most structural biological and biomimetic material properties are affected by two primary factors: (1) interfacial interactions between an organic and an inorganic phase usually in the form of interactions between an inorganic mineral phase and organic protein network; and (2) structural arrangement of the constituents. Examples are exoskeleton structures such as spicule, nacre, and crustacean exoskeletons. A significantmore » effort is being directed towards making synthetic biomimetic materials based on a manipulation of the above two primary factors. The proposed research is based on a hypothesis that in synthetic materials with biomimetic morphology thermal conductivity, k, (how fast heat is carried away) and thermal diffusivity, D, (how fast a material’s temperature rises: proportional to the ratio of k and heat capacity) can be engineered to be either significantly low or significantly high based on a combination of chosen interface orientation and interfacial arrangement in comparison to conventional material microstructures with the same phases and phase volume fractions. METHOD DEVELOPMENT 1. We have established a combined Raman spectroscopy and nanomechanical loading based experimental framework to perform environment (liquid vs. air vs. vacuum) dependent and temperature dependent (~1000 degree-C) in-situ thermal diffusivity measurements in biomaterials at nanoscale to micron scale along with the corresponding analytical theoretic calculations. (Zhang and Tomar, 2013) 2. We have also established a new classical molecular simulation based framework to measure thermal diffusivity in biomolecular interfaces. We are writing a publication currently (Qu and Tomar, 2013) to report the framework and findings in tropocollagen-hydroxyapatite based idealized biomaterial interfaces. PHYSICAL FINDINGS 1. Analyses using experiments have revealed that in the case of bone thermal conductivity and thermal diffusivity at micron scale shows significant dependence on compressive stress and temperature. Overall, there is a decrease with respect to increase in temperature and increase with respect to increase in compressive stress. Bio-molecular simulations on idealized tropocollagen-hydroxyapatite interfaces confirm such findings. However, simulations also reveal that thermal diffusivity and thermal conductivity can be significantly tailored by interfacial orientation. More importantly, in inorganic materials, interfaces contribute to reduce thermal conductivity and diffusivity. However, analyses here reveal that both can be increased despite presence of a lot of interfaces. 2. Based on significant role played by interfaces in affecting bone thermal properties, a crustacean-exoskeleton system is examined for thermal diffusivity using the newly developed setup. Special emphasis here is on this system since such arrangement is found to be common in fresh water shrimp as well as in some deep water organisms surviving in environment extremes. Experiments reveal that in such system thermal diffusivity is highly tailorable. 3. Overall, experiments and models have established that in biomaterial interfaces a counterintuitive role of interfaces in mediating thermal conduction as a function of stress and temperature is possible in contrast to inorganic materials where interfaces almost always lead to reduction of thermal conductivity as a function of such factors. More investigations are underway to reveal physical origins of such counter-physical characteristics. Such principles can be significantly useful in developing new and innovative bioenergy and inorganic energy systems where heat dissipation significantly affects system performance.« less

Electrochemical determination of the glass transition temperature of thin polyelectrolyte brushes at solid-liquid interfaces by impedance spectroscopy.

PubMed

Alonso-García, Teodoro; Rodríguez-Presa, María José; Gervasi, Claudio; Moya, Sergio; Azzaroni, Omar

2013-07-16

Devising strategies to assess the glass transition temperature (Tg) of polyelectrolyte assemblies at solid-electrolyte interfaces is very important to understand and rationalize the temperature-dependent behavior of polyelectrolyte films in a wide range of settings. Despite the evolving perception of the importance of measuring Tg under aqueous conditions in thin film configurations, its straightforward measurement poses a challenging situation that still remains elusive in polymer and materials science. Here, we describe a new method based on electrochemical impedance spectroscopy (EIS) to estimate the glass transition temperature of planar polyelectrolyte brushes at solid-liquid interfaces. To measure Tg, the charge transfer resistance (Rct) of a redox probe diffusing through the polyelectrolyte brush was measured, and the temperature corresponding to the discontinuous change in Rct was identified as Tg. Furthermore, we demonstrate that impedance measurements not only facilitate the estimation of Tg but also enable a reliable evaluation of the transport properties of the polymeric interface, i.e., determination of diffusion coefficients, close to the thermal transition. We consider that this approach bridges the gap between electrochemistry and the traditional tools used in polymer science and offers new opportunities to characterize the thermal behavior of complex polymeric interfaces and macromolecular assemblies.

Enhanced energy transport owing to nonlinear interface interaction

PubMed Central

Su, Ruixia; Yuan, Zongqiang; Wang, Jun; Zheng, Zhigang

2016-01-01

It is generally expected that the interface coupling leads to the suppression of thermal transport through coupled nanostructures due to the additional interface phonon-phonon scattering. However, recent experiments demonstrated that the interface van der Waals interactions can significantly enhance the thermal transfer of bonding boron nanoribbons compared to a single freestanding nanoribbon. To obtain a more in-depth understanding on the important role of the nonlinear interface coupling in the heat transports, in the present paper, we explore the effect of nonlinearity in the interface interaction on the phonon transport by studying the coupled one-dimensional (1D) Frenkel-Kontorova lattices. It is found that the thermal conductivity increases with increasing interface nonlinear intensity for weak inter-chain nonlinearity. By developing the effective phonon theory of coupled systems, we calculate the dependence of heat conductivity on interfacial nonlinearity in weak inter-chain couplings regime which is qualitatively in good agreement with the result obtained from molecular dynamics simulations. Moreover, we demonstrate that, with increasing interface nonlinear intensity, the system dimensionless nonlinearity strength is reduced, which in turn gives rise to the enhancement of thermal conductivity. Our results pave the way for manipulating the energy transport through coupled nanostructures for future emerging applications. PMID:26787363

Burner liner thermal-structural load modeling

NASA Technical Reports Server (NTRS)

Maffeo, R.

1986-01-01

The software package Transfer Analysis Code to Interface Thermal/Structural Problems (TRANCITS) was developed. The TRANCITS code is used to interface temperature data between thermal and structural analytical models. The use of this transfer module allows the heat transfer analyst to select the thermal mesh density and thermal analysis code best suited to solve the thermal problem and gives the same freedoms to the stress analyst, without the efficiency penalties associated with common meshes and the accuracy penalties associated with the manual transfer of thermal data.

Parallel Fin ORU Thermal Interface for space applications. [Orbital Replaceable Unit

NASA Technical Reports Server (NTRS)

Stobb, C. A.; Limardo, Jose G.

1992-01-01

The Parallel Fin Thermal Interface has been developed as an Orbital Replaceable Unit (ORU) interface. The interface transfers heat from an ORU baseplate to a Heat Acquisition Plate (HAP) through pairs of fins sandwiched between insert plates that press against the fins with uniform pressure. The insert plates are spread apart for ORU baseplate separation and replacement. Two prototype interfaces with different fin dimensions were built (Model 140 and 380). Interfacing surface samples were found to have roughnesses of 56 to 89 nm. Conductance values of 267 to 420 W/sq m C were obtained for the 140 model in vacuum with interface pressures of 131 to 262 kPa (19 to 38 psi). Vacuum conductances ranging from 176 to 267 W/sq m F were obtained for the 380 model at interface pressures of 97 to 152 kPa (14 and 22 psi). Correlations from several sources were found to agree with test data within 20 percent using thermal math models of the interfaces.

Interface characterization of Cu-Mo coating deposited on Ti-Al alloys by arc spraying

NASA Astrophysics Data System (ADS)

Bai, Shengqiang; Li, Fei; Wu, Ting; Yin, Xianglin; Shi, Xun; Chen, Lidong

2015-03-01

Cu-Mo pseudobinary alloys are promising candidates as electrode materials in CoSb3-based skutterudite thermoelectric (TE) devices for TE power generation. In this study, Cu-Mo coatings were deposited onto Ti-Al substrates by applying a dual-wire electric arc spraying coating technique. The microstructure of the surfaces, cross sections and coating interfaces were analyzed by scanning electron microscopy (SEM) and energy dispersion spectrometry (EDS). Cu-Mo coatings showed a typical banded splat with compact microstructures, and have no coarse pores nor micro-cracks. The thermal shock resistance of the Cu-Mo coating was also investigated to show good combinations with Ti-Al substrates. After 50 thermal shock cycles, there were no cracks observed at the interface. In contrast, the test of the thermal shock resistance of the Cu coating on the Ti-Al substrate was also investigated. Due to a large difference in the thermal expansion coefficients between Cu and Ti-Al alloys, the Cu coating flaked from the Ti-Al substrate completely after 10 thermal shock cycles. The contact resistivity of the Ti-Al/Cu-Mo interface was about 1.6 μΩṡcm2 and this value was unchanged after 50 thermal shock cycles, indicating the low electric resistance and high thermal stability of the Cu-Mo/Ti-Al interface.

Ultrasensitive molecular detection using thermal conductance of a hydrophobic gold-water interface.

PubMed

Green, Andrew J; Alaulamie, Arwa A; Baral, Susil; Richardson, Hugh H

2013-09-11

The thermal conductance from a hydrophobic gold aqueous interface is measured with increasing solute concentration. A small amount of aqueous solute molecules (1 solute molecule in 550 water molecules) dramatically increases the heat dissipation into the surrounding liquid. This result is consistent with a thermal conductance that is limited by an interface interaction where minority aqueous components significantly alter the surface properties and heat transport through the interface. The increase in heat dissipation can be used to make an extremely sensitive molecular detector that can be scaled to give single molecule detection without amplification or utilizing fluorescence labels.

Thermal transport across metal silicide-silicon interfaces: An experimental comparison between epitaxial and nonepitaxial interfaces

NASA Astrophysics Data System (ADS)

Ye, Ning; Feser, Joseph P.; Sadasivam, Sridhar; Fisher, Timothy S.; Wang, Tianshi; Ni, Chaoying; Janotti, Anderson

2017-02-01

Silicides are used extensively in nano- and microdevices due to their low electrical resistivity, low contact resistance to silicon, and their process compatibility. In this work, the thermal interface conductance of TiSi2, CoSi2, NiSi, and PtSi are studied using time-domain thermoreflectance. Exploiting the fact that most silicides formed on Si(111) substrates grow epitaxially, while most silicides on Si(100) do not, we study the effect of epitaxy, and show that for a wide variety of interfaces there is no dependence of interface conductance on the detailed structure of the interface. In particular, there is no difference in the thermal interface conductance between epitaxial and nonepitaxial silicide/silicon interfaces, nor between epitaxial interfaces with different interface orientations. While these silicide-based interfaces yield the highest reported interface conductances of any known interface with silicon, none of the interfaces studied are found to operate close to the phonon radiation limit, indicating that phonon transmission coefficients are nonunity in all cases and yet remain insensitive to interfacial structure. In the case of CoSi2, a comparison is made with detailed computational models using (1) full-dispersion diffuse mismatch modeling (DMM) including the effect of near-interfacial strain, and (2) an atomistic Green' function (AGF) approach that integrates near-interface changes in the interatomic force constants obtained through density functional perturbation theory. Above 100 K, the AGF approach significantly underpredicts interface conductance suggesting that energy transport does not occur purely by coherent transmission of phonons, even for epitaxial interfaces. The full-dispersion DMM closely predicts the experimentally observed interface conductances for CoSi2, NiSi, and TiSi2 interfaces, while it remains an open question whether inelastic scattering, cross-interfacial electron-phonon coupling, or other mechanisms could also account for the high-temperature behavior. The effect of degenerate semiconductor dopant concentration on metal-semiconductor thermal interface conductance was also investigated with the result that we have found no dependencies of the thermal interface conductances up to (n or p type) ≈1 ×1019 cm-3, indicating that there is no significant direct electronic transport and no transport effects that depend on long-range metal-semiconductor band alignment.

Stress Intensity of Delamination in a Sintered-Silver Interconnection: Preprint

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, D. J.; Paret, P. P.; Wereszczak, A. A.

2014-08-01

In automotive power electronics packages, conventional thermal interface materials such as greases, gels, and phase-change materials pose bottlenecks to heat removal and are also associated with reliability concerns. The industry trend is toward high thermal performance bonded interfaces for large-area attachments. However, because of coefficient of thermal expansion mismatches between materials/layers and resultant thermomechanical stresses, adhesive and cohesive fractures could occur, posing a reliability problem. These defects manifest themselves in increased thermal resistance. This research aims to investigate and improve the thermal performance and reliability of sintered-silver for power electronics packaging applications. This has been experimentally accomplished by the synthesismore » of large-area bonded interfaces between metalized substrates and copper base plates that have subsequently been subjected to thermal cycles. A finite element model of crack initiation and propagation in these bonded interfaces will allow for the interpretation of degradation rates by a crack-velocity (V)-stress intensity factor (K) analysis. A description of the experiment and the modeling approach are discussed.« less

Graphene-Enhanced Thermal Interface Materials for Thermal Management of Solar Cells

NASA Astrophysics Data System (ADS)

Saadah, Mohammed Ahmed

The interest to photovoltaic solar cells as a source of energy for a variety of applications has been rapidly increasing in recent years. Solar cells panels that employ optical concentrators can convert more than 30% of absorbed light into electricity. Most of the remaining 70% of absorbed energy is turned into heat inside the solar cell. The increase in the photovoltaic cell temperature negatively affects its power conversion efficiency and lifetime. In this dissertation research I investigated a feasibility of using graphene fillers in thermal interface materials for improving thermal management of multi-junction concentrator solar cells. Graphene and few-layer graphene fillers, produced by a scalable environmentally-friendly liquid-phase exfoliation technique, were incorporated into conventional thermal interface materials. Characteristics of the composites have been examined with Raman spectroscopy, optical microscopy and thermal conductivity measurements. Graphene-enhanced thermal interface materials have been applied between a solar cell and heat sink to improve heat dissipation. The performance of the single and multi-junction solar cells has been tested using an industry-standard solar simulator under the light concentration of up to 2000 suns. It was found that the application of graphene-enhanced thermal interface materials allows one to reduce the solar cell temperature and increase the open-circuit voltage. We demonstrated that the use of graphene helps in recovering significant amount of the power loss due to solar cell overheating. The obtained results are important for the development of new technologies for thermal management of concentrated and multi-junction photovoltaic solar cells.

Thermal management and prototype testing of Compton scattering X-ray beam position monitor for the Advanced Photon Source Upgrade

DOE PAGES

Lee, S. H.; Yang, B. X.; Collins, J. T.; ...

2017-02-07

Accurate and stable x-ray beam position monitors (XBPMs) are key elements in obtaining the desired user beam stability in the Advanced Photon Source Upgrade. In the next-generation XBPMs for the canted-undulator front ends, where two undulator beams are separated by 1.0 mrad, the lower beam power (<10 kW) per undulator allows us to explore lower-cost solutions based on Compton scattering from a diamond placed edge-on to the x-ray beam. Because of the high peak power density of the x-ray beams, this diamond experiences high temperatures and has to be clamped to a water-cooled heat spreader using thermal interface materials (TIMs),more » which play a key role in reducing the temperature of the diamond. To evaluate temperature changes through the interface via thermal simulations, the thermal contact resistance (TCR) of TIMs at an interface between two solid materials under even contact pressure must be known. This paper addresses the TCR measurements of several TIMs, including gold, silver, pyrolytic graphite sheet, and 3D graphene foam. In addition, a prototype of a Compton-scattering XBPM with diamond blades was installed at APS Beamline 24-ID-A in May 2015 and has been tested. This study presents the design of the Compton-scattering XBPM, and compares thermal simulation results obtained for the diamond blade of this XBPM by the finite element method with in situ empirical measurements obtained by using reliable infrared technology.« less

Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces

NASA Astrophysics Data System (ADS)

Hua, Chengyun; Chen, Xiangwen; Ravichandran, Navaneetha K.; Minnich, Austin J.

2017-05-01

Interfaces play an essential role in phonon-mediated heat conduction in solids, impacting applications ranging from thermoelectric waste heat recovery to heat dissipation in electronics. From the microscopic perspective, interfacial phonon transport is described by transmission coefficients that link vibrational modes in the materials composing the interface. However, direct experimental determination of these coefficients is challenging because most experiments provide a mode-averaged interface conductance that obscures the microscopic detail. Here, we report a metrology to extract thermal phonon transmission coefficients at solid interfaces using ab initio phonon transport modeling and a thermal characterization technique, time-domain thermoreflectance. In combination with transmission electron microscopy characterization of the interface, our approach allows us to link the atomic structure of an interface to the spectral content of the heat crossing it. Our work provides a useful perspective on the microscopic processes governing interfacial heat conduction.

Experimental metrology to obtain thermal phonon transmission coefficients at solid interfaces

DOE PAGES

Hua, Chengyun; Chen, Xiangwen; Ravichandran, Navaneetha K.; ...

2017-05-17

Interfaces play an essential role in phonon-mediated heat conduction in solids, impacting applications ranging from thermoelectric waste heat recovery to heat dissipation in electronics. From the microscopic perspective, interfacial phonon transport is described by transmission coefficients that link vibrational modes in the materials composing the interface. But, direct experimental determination of these coefficients is challenging because most experiments provide a mode-averaged interface conductance that obscures the microscopic detail. Here, we report a metrology to extract thermal phonon transmission coefficients at solid interfaces using ab initio phonon transport modeling and a thermal characterization technique, time-domain thermoreflectance. In combination with transmission electronmore » microscopy characterization of the interface, our approach allows us to link the atomic structure of an interface to the spectral content of the heat crossing it. This work provides a useful perspective on the microscopic processes governing interfacial heat conduction.« less

Performance Testing of Thermal Interface Filler Materials in a Bolted Aluminum Interface Under Thermal/Vacuum Conditions

NASA Technical Reports Server (NTRS)

Glasgow, S. D.; Kittredge, K. B.

2003-01-01

A thermal interface material is one of the many tools often used as part of the thermal control scheme for space-based applications. Historically, at Marshall Space Flight Center, CHO-THERM 1671 has primarily been used for applications where an interface material was deemed necessary. However, numerous alternatives have come on the market in recent years. It was decided that a number of these materials should be tested against each other to see if there were better performing alternatives. The tests were done strictly to compare the thermal performance of the materials relative to each other under repeatable conditions and do not take into consideration other design issues, such as off-gassing, electrical conduction, isolation, etc. The purpose of this Technical Memorandum is to detail the materials tested, test apparatus, procedures, and results of these tests. The results show that there are a number of better performing alternatives now available.

Development of Advanced Thermal and Environmental Barrier Coatings Using a High-Heat-Flux Testing Approach

NASA Technical Reports Server (NTRS)

Zhu, Dongming; Miller, Robert A.

2003-01-01

The development of low conductivity, robust thermal and environmental barrier coatings requires advanced testing techniques that can accurately and effectively evaluate coating thermal conductivity and cyclic resistance at very high surface temperatures (up to 1700 C) under large thermal gradients. In this study, a laser high-heat-flux test approach is established for evaluating advanced low conductivity, high temperature capability thermal and environmental barrier coatings under the NASA Ultra Efficient Engine Technology (UEET) program. The test approach emphasizes the real-time monitoring and assessment of the coating thermal conductivity, which initially rises under the steady-state high temperature thermal gradient test due to coating sintering, and later drops under the cyclic thermal gradient test due to coating cracking/delamination. The coating system is then evaluated based on damage accumulation and failure after the combined steady-state and cyclic thermal gradient tests. The lattice and radiation thermal conductivity of advanced ceramic coatings can also be evaluated using laser heat-flux techniques. The external radiation resistance of the coating is assessed based on the measured specimen temperature response under a laser- heated intense radiation-flux source. The coating internal radiation contribution is investigated based on the measured apparent coating conductivity increases with the coating surface test temperature under large thermal gradient test conditions. Since an increased radiation contribution is observed at these very high surface test temperatures, by varying the laser heat-flux and coating average test temperature, the complex relation between the lattice and radiation conductivity as a function of surface and interface test temperature may be derived.

A thermal scale modeling study for Apollo and Apollo applications, volume 1

NASA Technical Reports Server (NTRS)

Shannon, R. L.

1972-01-01

The program is reported for developing and demonstrating the capabilities of thermal scale modeling as a thermal design and verification tool for Apollo and Apollo Applications Projects. The work performed for thermal scale modeling of STB; cabin atmosphere/spacecraft cabin wall thermal interface; closed loop heat rejection radiator; and docked module/spacecraft thermal interface are discussed along with the test facility requirements for thermal scale model testing of AAP spacecraft. It is concluded that thermal scale modeling can be used as an effective thermal design and verification tool to provide data early in a spacecraft development program.

Nanoscale thermal transport. II. 2003-2012

NASA Astrophysics Data System (ADS)

Cahill, David G.; Braun, Paul V.; Chen, Gang; Clarke, David R.; Fan, Shanhui; Goodson, Kenneth E.; Keblinski, Pawel; King, William P.; Mahan, Gerald D.; Majumdar, Arun; Maris, Humphrey J.; Phillpot, Simon R.; Pop, Eric; Shi, Li

2014-03-01

A diverse spectrum of technology drivers such as improved thermal barriers, higher efficiency thermoelectric energy conversion, phase-change memory, heat-assisted magnetic recording, thermal management of nanoscale electronics, and nanoparticles for thermal medical therapies are motivating studies of the applied physics of thermal transport at the nanoscale. This review emphasizes developments in experiment, theory, and computation in the past ten years and summarizes the present status of the field. Interfaces become increasingly important on small length scales. Research during the past decade has extended studies of interfaces between simple metals and inorganic crystals to interfaces with molecular materials and liquids with systematic control of interface chemistry and physics. At separations on the order of ˜ 1 nm , the science of radiative transport through nanoscale gaps overlaps with thermal conduction by the coupling of electronic and vibrational excitations across weakly bonded or rough interfaces between materials. Major advances in the physics of phonons include first principles calculation of the phonon lifetimes of simple crystals and application of the predicted scattering rates in parameter-free calculations of the thermal conductivity. Progress in the control of thermal transport at the nanoscale is critical to continued advances in the density of information that can be stored in phase change memory devices and new generations of magnetic storage that will use highly localized heat sources to reduce the coercivity of magnetic media. Ultralow thermal conductivity—thermal conductivity below the conventionally predicted minimum thermal conductivity—has been observed in nanolaminates and disordered crystals with strong anisotropy. Advances in metrology by time-domain thermoreflectance have made measurements of the thermal conductivity of a thin layer with micron-scale spatial resolution relatively routine. Scanning thermal microscopy and thermal analysis using proximal probes has achieved spatial resolution of 10 nm, temperature precision of 50 mK, sensitivity to heat flows of 10 pW, and the capability for thermal analysis of sub-femtogram samples.

Some Aspects of Thermal Transport across the Interface between Graphene and Epoxy in Nanocomposites.

PubMed

Wang, Yu; Yang, Chunhui; Pei, Qing-Xiang; Zhang, Yingyan

2016-03-01

Owing to the superior thermal properties of graphene, graphene-reinforced polymer nanocomposites hold great potential as the thermal interface materials (TIMs) dissipating heat for electronic packages. However, this application is greatly hindered by the high thermal resistance at the interface between graphene and polymer. In this paper, some important aspects of the improvement of the thermal transport across the interface between graphene and epoxy in graphene-epoxy nanocomposites, including the effectiveness of covalent and noncovalent functionalization, isotope doping, and acetylenic linkage in graphene are systematically investigated using molecular dynamics (MD) simulations. The simulation results show that the covalent and noncovalent functionalization techniques could considerably reduce the graphene-epoxy interfacial thermal resistance in the nanocomposites. Among different covalent functional groups, butyl is more effective than carboxyl and hydroxyl in reducing the interfacial thermal resistance. Different noncovalent functional molecules, including 1-pyrenebutyl, 1-pyrenebutyric acid, and 1-pyrenebutylamine, yield a similar amount of reductions. Moreover, it is found that the graphene-epoxy interfacial thermal resistance is insensitive to the carbon isotope doping in graphene, while it can be reduced moderately by replacing the sp(2) bonds in graphene with acetylenic linkages.

Anomalous Epitaxial Growth in Thermally Sprayed YSZ and LZ Splats

NASA Astrophysics Data System (ADS)

Chen, Lin; Yang, Guan-Jun

2017-08-01

Thermally sprayed coatings are essentially layered materials, and lamellar interfaces are of great importance to coatings' performances. In the present study, to investigate the microstructures and defect features at thermally sprayed coating interfaces, homoepitaxial 8 mol.% yttria-stabilized zirconia (YSZ) and heteroepitaxial lanthanum zirconia (LZ) films were fabricated. The epitaxial interfaces were examined by high-resolution transmission electron microscope (HR-TEM) in detail. As a result, we report, for the first time, an anomalous incommensurate homoepitaxial growth with mismatch-induced dislocations in thermally sprayed YSZ splats to create a homointerface. We also find the anomalous heteroepitaxial growth in thermally sprayed LZ splats. The mechanism of the anomalous incommensurate growth was analyzed in detail. Essentially, it is a pseudo-heteroepitaxy because of the lattice mismatch between the film and the locally heated substrate, as the locally heated substrate is significantly strained by its cold surroundings. Moreover, the super-high-density dislocations were found in the interfacial region, which resulted from sufficient thermal fluctuations and extremely rapid cooling rates. Both the anomalous lattice mismatch and super-high-density dislocations lead to weak interfaces and violent cracking in thermally sprayed coatings. These were also the essential differences between the conventional and the present epitaxy by thermal spray technique.

Study of thermal management for space platform applications

NASA Technical Reports Server (NTRS)

Oren, J. A.

1980-01-01

Techniques for the management of the thermal energy of large space platforms using many hundreds of kilowatts over a 10 year life span were evaluated. Concepts for heat rejection, heat transport within the vehicle, and interfacing were analyzed and compared. The heat rejection systems were parametrically weight optimized over conditions for heat pipe and pumped fluid approaches. Two approaches to achieve reliability were compared for: performance, weight, volume, projected area, reliability, cost, and operational characteristics. Technology needs are assessed and technology advancement recommendations are made.

Effects of interface morphology and TGO thickness on residual stress of EB-PVD thermal barrier coatings

NASA Astrophysics Data System (ADS)

Chen, Jianwei; Zhao, Yang; Ma, Jian

2015-04-01

The residual stress of electron beam-physical vapor deposition (EB-PVD) thermal barrier coatings (TBC) is complex and difficult to be obtained. In this paper, the interface morphology of TBCs subjected to cyclic heating and cooling was observed by SEM. Based on the thermal elastic-plastic finite method, corresponding interface model of TBCs was established. The residual stress of EB-PVD TBCs with different interface morphologies and TGO thicknesses was calculated using the FE method without regard to the presence of cracks and defects. The result shows that the distribution of residual stress is significantly affected by the interface morphology, and the growth of TGO also has influence on the residual stress of TC and TGO.

An investigation of heat transfer to the implant-bone interface when drilling through a zirconia crown attached to a titanium or zirconia abutment.

PubMed

Mason, Amy G; Sutton, Alan; Turkyilmaz, Ilser

2014-11-01

Thermal injury to the implant-bone interface may lead to bone necrosis and loss of osseointegration. This is a concern during manipulation of the implant throughout the restorative phase of treatment. The risk of heat transfer to the implant-bone interface during abutment preparation or prosthesis removal should be considered. The purpose of the study was to examine the amount of heat transferred to the implant-bone interface when a zirconia crown is drilled to access the screw channel or section a crown with a high-speed dental handpiece. Of the 64 ceramic-veneered zirconia crowns fabricated, 32 had a coping thickness of 0.5 mm and 32 had a coping thickness of 1.0 mm. The crowns were cemented on either titanium stock abutments or zirconia stock abutments. Each group was further subdivided to evaluate heat transfer when the screw channel was accessed or the crown was sectioned with a high-speed handpiece with or without irrigation. Temperature change was recorded for each specimen at the cervical and apical aspect of the implant with thermocouples and a logging thermometer. ANOVA was used to assess the statistical significance in temperature change between the test combinations, and nonparametric Mann-Whitney U tests were used to evaluate the findings. The use of irrigation during both crown removal processes yielded an average temperature increase of 3.59 ±0.35°C. Crown removal in the absence of irrigation yielded an average temperature increase of 18.76 ±3.09°C. When all parameter combinations in the presence of irrigation were evaluated, the maximum temperature change was below the threshold of thermal injury to bone. The maximum temperature change was above the threshold for thermal injury at the coronal aspect of the implant and below the threshold at the apical aspect in the absence of irrigation. Within the limitations of this investigation, the use of irrigation with a high-speed dental handpiece to remove a ceramic-veneered zirconia crown results in a temperature increase at the implant-bone interface insufficient to cause irreversible damage. Conversely, a lack of irrigation may yield a temperature increase capable of producing irreversible damage at the coronal aspect of the implant. Copyright © 2014 Editorial Council for the Journal of Prosthetic Dentistry. Published by Elsevier Inc. All rights reserved.

An axial temperature profile curvature criterion for the engineering of convex crystal growth interfaces in Bridgman systems

NASA Astrophysics Data System (ADS)

Peterson, Jeffrey H.; Derby, Jeffrey J.

2017-06-01

A unifying idea is presented for the engineering of convex melt-solid interface shapes in Bridgman crystal growth systems. Previous approaches to interface control are discussed with particular attention paid to the idea of a "booster" heater. Proceeding from the idea that a booster heater promotes a converging heat flux geometry and from the energy conservation equation, we show that a convex interface shape will naturally result when the interface is located in regions of the furnace where the axial thermal profile exhibits negative curvature, i.e., where d2 T / dz2 < 0 . This criterion is effective in explaining prior literature results on interface control and promising for the evaluation of new furnace designs. We posit that the negative curvature criterion may be applicable to the characterization of growth systems via temperature measurements in an empty furnace, providing insight about the potential for achieving a convex interface shape, without growing a crystal or conducting simulations.

LANDSAT-1 and LANDSAT-2 flight evaluation report, 23 January - 23 April 1977

NASA Technical Reports Server (NTRS)

1977-01-01

The LANDSAT operations from launch through orbital instrument observations are reviewed. Orbital parameters, power subsystem, attitude control subsystem, and command/clock subsystem are discussed. Other subsystems are also considered, such as telemetry, orbit adjust, electrical interface, thermal, wideband telemetry, multispectral scanner, and data collection.

The effect of human-mattress interface's temperature on perceived thermal comfort.

PubMed

Califano, R; Naddeo, A; Vink, P

2017-01-01

In recent years, methods that allow for an objective evaluation of perceived comfort, in terms of postural, physiological, cognitive and environmental comfort, have received a great deal of attention from researchers. This paper focuses on one of the factors that influences physiological comfort perception: the temperature difference between users and the objects with which they interact. The first aim is to create a measuring system that does not affect the perceived comfort during the temperatures' acquisition. The main aim is to evaluate how the temperature at the human-mattress interface can affect the level of perceived comfort. A foam mattress has been used for testing in order to take into account the entire back part of the human body. The temperature at the interface was registered by fourteen 100 Ohm Platinum RTDs (Resistance Temperature Detectors) placed on the mattress under the trunk, the shoulders, the buttocks, the legs, the thighs, the arms and the forearms of the test subject. 29 subjects participated in a comfort test in a humidity controlled environment. The test protocol involved: dress-code, anthropometric-based positioning on mattress, environment temperature measuring and an acclimatization time before the test. At the end of each test, each of the test subject's thermal sensations and the level of comfort perception were evaluated using the ASHRAE (American Society of Heating, Refrigerating and Air-Conditioning Engineers) scale. The data analyses concerned, in the first instance, correlations between the temperature at the interface and comfort levels of the different parts of the body. Then the same analyses were performed independently of the body parts being considered. The results demonstrated that there was no strong correlation among the studied variables and that the total increase of temperature at interface is associated with a reduction in comfort. Copyright © 2016 Elsevier Ltd. All rights reserved.

Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces

NASA Astrophysics Data System (ADS)

Qi, Lihua; Huang, Jihua; Zhang, Hua; Zhao, Xingke; Wang, Haitao; Cheng, Donghai

2010-02-01

The growth behavior of reaction-formed intermetallic compounds (IMCs) at Sn3.5Ag0.5Cu/Ni and Cu interfaces under thermal-shear cycling conditions was investigated. The results show that the morphology of (Cu x Ni1- x )6Sn5 and Cu6Sn5 IMCs formed both at Sn3.5Ag0.5Cu/Ni and Cu interfaces gradually changed from scallop-like to chunk-like, and different IMC thicknesses developed with increasing thermal-shear cycling time. Furthermore, Cu6Sn5 IMC growth rate at the Sn3.5Ag0.5Cu/Cu interface was higher than that of (Cu x Ni1- x )6Sn5 IMC under thermal-shear cycling. Compared to isothermal aging, thermal-shear cycling led to only one Cu6Sn5 layer at the interface between SnAgCu solder and Cu substrate after 720 cycles. Moreover, Ag3Sn IMC was dispersed uniformly in the solder after reflow. The planar Ag3Sn formed near the interface changed remarkably and merged together to large platelets with increasing cycles. The mechanism of formation of Cu6Sn5, (Cu x Ni1- x )6Sn5 and Ag3Sn IMCs during thermal-shear cycling process was investigated.

Microstructural Analysis and Transport Properties of Thermally Sprayed Multiple-Layer Ceramic Coatings

NASA Astrophysics Data System (ADS)

Wang, Hsin; Muralidharan, Govindarajan; Leonard, Donovan N.; Haynes, J. Allen; Porter, Wallace D.; England, Roger D.; Hays, Michael; Dwivedi, Gopal; Sampath, Sanjay

2018-02-01

Multilayer, graded ceramic/metal coatings were prepared by an air plasma spray method on Ti-6Al-4V, 4140 steel and graphite substrates. The coatings were designed to provide thermal barriers for diesel engine pistons to operate at higher temperatures with improved thermal efficiency and cleaner emissions. A systematic, progressive variation in the mixture of yttria-stabilized zirconia and bondcoat alloys (NiCoCrAlYHfSi) was designed to provide better thermal expansion match with the substrate and to improve thermal shock resistance and cycle life. Heat transfer through the layers was evaluated by a flash diffusivity technique based on a model of one-dimensional heat flow. The aging effect of the as-sprayed coatings was captured during diffusivity measurements, which included one heating and cooling cycle. The hysteresis of thermal diffusivity due to aging was not observed after 100-h annealing at 800 °C. The measurements of coatings on substrate and freestanding coatings allowed the influence of interface resistance to be evaluated. The microstructure of the multilayer coating was examined using scanning electron microscope and electron probe microanalysis.

Evaluation of GeO desorption behavior in the metalGeO(2)Ge structure and its improvement of the electrical characteristics.

PubMed

Oniki, Yusuke; Koumo, Hideo; Iwazaki, Yoshitaka; Ueno, Tomo

2010-06-15

The relation between germanium monoxide (GeO) desorption and either improvement or deterioration in electrical characteristics of metalGeO(2)Ge capacitors fabricated by thermal oxidation has been investigated. In the metalGeO(2)Ge stack, two processes of GeO desorption at different sites and at different temperatures were observed by thermal desorption spectroscopy measurements. The electrical characteristics of as-oxidized metalGeO(2)Ge capacitors shows a large flat-band voltage shift and minority carrier generation due to the GeO desorption from the GeO(2)Ge interface during oxidation of Ge substrates. On the other hand, the electrical properties were drastically improved by a postmetallization annealing at low temperature resulting in a metal catalyzed GeO desorption from the top interface.

Evaluation of using ferrofluid as an interface material for a field-reversible thermal connector

NASA Astrophysics Data System (ADS)

Yousif, Ahmed S.

The electrical functionality of an avionics chassis is limited due to heat dissipation limits. The limits arise due to the fact that components in an avionic computer boxes are packed very compactly, with the components mounted onto plug-in cards, and the harsh environment experienced by the chassis limits how heat can be dissipated from the cards. Convective and radiative heat transfer to the ambient are generally not possible. Therefore it is necessary to have heat transferred from the components conducted to the edge of the plug-in cards. The heat then needs to conduct from the card edge to a cold block that not only holds the card in place, but also removes the generated heat by some heat transfer fluid that is circulated through the cold block. The interface between the plug-in card and the cold block typically has a high thermal resistance since it is necessary for the card to have the capability to be re-workable, meaning that the card can be removed and then returned to the chassis. Reducing the thermal resistance of the interface is the objective of the current study and the topic of this thesis. The current design uses a pressure interface between the card and cold block. The contact pressure is increased through the addition of a wedgelock, which is a field-reversible mechanical connector. To use a wedgelock, the cold block has channels milled on the surface with widths that are larger than the thickness of the plug-in card and the un-expanded wedgelock. The card edge is placed in the channel and placed against one of the channel walls. A wedgelock is then placed between the card and the other channel wall. The wedgelock is then expanded by using either a screw or a lever. As the wedgelock expands it fills in the remaining channel gap and bears against the other face of the plug-in card. The majority of heat generated by the components on the plug-in card is forced to conduct from the card into the wall of the cold block, effectively a single sided, dry conduction heat transfer path. Having started as a student design competition named RevCon Challenge, work was performed to evaluate the use of new field-reversible thermal connectors. The new design proposed by the University of Missouri utilized oil based iron nanoparticles, commonly known as a ferrofluid, as a thermal interface material. By using a liquid type of interface material the channel gap can be reduced to a few micrometers, within machining tolerances, and heat can be dissipated off both sides of the card. The addition of nanoparticles improves the effective thermal conductivity of base fluid. The use of iron nanoparticles allows magnets to be used to hold the fluid in place, so the electronic cards may be easily inserted and removed while keeping the ferrofluid in the cold block channel. The ferrofluid-based design which was investigated has shown lower thermal resistance than the current wedgelock design. These results open the door for further development of electronic cards by using higher heat emitting components without compromising the simplicity of attaching/detaching cards from cooling plates.

Interface magnetic anisotropy for monatomic layer-controlled Co/Ni epitaxial multilayers

NASA Astrophysics Data System (ADS)

Shioda, A.; Seki, T.; Shimada, J.; Takanashi, K.

2015-05-01

The magnetic properties for monatomic layer (ML)-controlled Co/Ni epitaxial multilayers were investigated in order to evaluate the interface magnetic anisotropy energy (Ks) between Ni and Co layers. The Co/Ni epitaxial multilayers were prepared on an Al2O3 (11-20) substrate with V/Au buffer layers. The value of Ks was definitely larger than that for the textured Co/Ni grown on a thermally oxidized Si substrate. We consider that the sharp interface for the epitaxial Co/Ni played a role to increase the value of Ks, which also enabled us to obtain perpendicular magnetization even for the 1 ML-Co/1 ML-Ni multilayer.

The Effect of Core Configuration on Thermal Barrier Thermal Performance

NASA Technical Reports Server (NTRS)

DeMange, Jeffrey J.; Bott, Robert H.; Druesedow, Anne S.

2015-01-01

Thermal barriers and seals are integral components in the thermal protection systems (TPS) of nearly all aerospace vehicles. They are used to minimize heat transfer through interfaces and gaps and protect underlying temperature-sensitive components. The core insulation has a significant impact on both the thermal and mechanical properties of compliant thermal barriers. Proper selection of an appropriate core configuration to mitigate conductive, convective and radiative heat transfer through the thermal barrier is challenging. Additionally, optimization of the thermal barrier for thermal performance may have counteracting effects on mechanical performance. Experimental evaluations have been conducted to better understand the effect of insulation density on permeability and leakage performance, which can significantly impact the resistance to convective heat transfer. The effect of core density on mechanical performance was also previously investigated and will be reviewed. Simple thermal models were also developed to determine the impact of various core parameters on downstream temperatures. An extended understanding of these factors can improve the ability to design and implement these critical TPS components.

A miniature low-cost LWIR camera with a 160×120 microbolometer FPA

NASA Astrophysics Data System (ADS)

Tepegoz, Murat; Kucukkomurler, Alper; Tankut, Firat; Eminoglu, Selim; Akin, Tayfun

2014-06-01

This paper presents the development of a miniature LWIR thermal camera, MSE070D, which targets value performance infrared imaging applications, where a 160x120 CMOS-based microbolometer FPA is utilized. MSE070D features a universal USB interface that can communicate with computers and some particular mobile devices in the market. In addition, it offers high flexibility and mobility with the help of its USB powered nature, eliminating the need for any external power source, thanks to its low-power requirement option. MSE070D provides thermal imaging with its 1.65 inch3 volume with the use of a vacuum packaged CMOS-based microbolometer type thermal sensor MS1670A-VP, achieving moderate performance with a very low production cost. MSE070D allows 30 fps thermal video imaging with the 160x120 FPA size while resulting in an NETD lower than 350 mK with f/1 optics. It is possible to obtain test electronics and software, miniature camera cores, complete Application Programming Interfaces (APIs) and relevant documentation with MSE070D, as MikroSens want to help its customers to evaluate its products and to ensure quick time-to-market for systems manufacturers.

Thermal transport study across interface “nanostructured solid surface / fluid” by photoacoustic technique

NASA Astrophysics Data System (ADS)

Voitenko, K.; Isaiev, M.; Pastushenko, A.; Andrusenko, D.; Kuzmich, A.; Lysenko, V.; Burbelo, R.

2017-01-01

In the paper the experimental study of heat transport across the interface “porous silicon/liquid” by photoacoustic technique is reported. Two cases with and without liquid covering of porous silicon surface were considered. Thermal perturbations were excited at the surface of porous silicon as a result of absorption of the light with modulated intensity. The resulting thermal-elastic stresses arising in the system were registered with piezoelectric transducer. The amplitude-frequency dependencies of the voltage on the piezoelectric electrodes were measured. The presence of the liquid film leads to decreasing of the amplitude of photoacoustic signal as a result of the thermal energy evacuation from the porous silicon into the liquid. The experimental dependencies were fitted with the results of simulation that takes into account heat fluxes separation at the porous silicon/liquid interface. With the presented method one can precisely measure heat fluxes transferred from the solid into contacting fluid. Moreover, the presented approach can be easily adopted for the thermal conductivity study of the different nanofluids as well as thermal resistance at the interface nanostructured solid/fluid.

ANALOG I/O MODULE TEST SYSTEM BASED ON EPICS CA PROTOCOL AND ACTIVEX CA INTERFACE

DOE Office of Scientific and Technical Information (OSTI.GOV)

YENG,YHOFF,L.

2003-10-13

Analog input (ADC) and output (DAC) modules play a substantial role in device level control of accelerator and large experiment physics control system. In order to get the best performance some features of analog modules including linearity, accuracy, crosstalk, thermal drift and so on have to be evaluated during the preliminary design phase. Gain and offset error calibration and thermal drift compensation (if needed) may have to be done in the implementation phase as well. A natural technique for performing these tasks is to interface the analog VO modules and GPIB interface programmable test instruments with a computer, which canmore » complete measurements or calibration automatically. A difficulty is that drivers of analog modules and test instruments usually work on totally different platforms (vxworks VS Windows). Developing new test routines and drivers for testing instruments under VxWorks (or any other RTOS) platform is not a good solution because such systems have relatively poor user interface and developing such software requires substantial effort. EPICS CA protocol and ActiveX CA interface provide another choice, a PC and LabVIEW based test system. Analog 110 module can be interfaced from LabVIEW test routines via ActiveX CA interface. Test instruments can be controlled via LabVIEW drivers, most of which are provided by instrument vendors or by National Instruments. Labview also provides extensive data analysis and process functions. Using these functions, users can generate powerful test routines very easily. Several applications built for Spallation Neutron Source (SNS) Beam Loss Monitor (BLM) system are described in this paper.« less

Modeling of Thermal Barrier Coatings

NASA Technical Reports Server (NTRS)

Ferguson, B. L.; Petrus, G. J.; Krauss, T. M.

1992-01-01

The project examined the effectiveness of studying the creep behavior of thermal barrier coating system through the use of a general purpose, large strain finite element program, NIKE2D. Constitutive models implemented in this code were applied to simulate thermal-elastic and creep behavior. Four separate ceramic-bond coat interface geometries were examined in combination with a variety of constitutive models and material properties. The reason for focusing attention on the ceramic-bond coat interface is that prior studies have shown that cracking occurs in the ceramic near interface features which act as stress concentration points. The model conditions examined include: (1) two bond coat coefficient of thermal expansion curves; (2) the creep coefficient and creep exponent of the bond coat for steady state creep; (3) the interface geometry; and (4) the material model employed to represent the bond coat, ceramic, and superalloy base.

Evaluation of used fuel disposition in clay-bearing rock

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jove-Colon, Carlos F.; Hammond, Glenn Edward; Kuhlman, Kristopher L.

The R&D program from the DOE Used Fuel Disposition Campaign (UFDC) has documented key advances in coupled Thermal-Hydrological-Mechanical-Chemical (THMC) modeling of clay to simulate its complex dynamic behavior in response to thermal and hydrochemical feedbacks. These efforts have been harnessed to assess the isolation performance of heat-generating nuclear waste in a deep geological repository in clay/shale/argillaceous rock formations. This report describes the ongoing disposal R&D efforts on the advancement and refinement of coupled THMC process models, hydrothermal experiments on barrier clay interactions, used fuel and canister material degradation, thermodynamic database development, and reactive transport modeling of the near-field under non-isothermalmore » conditions. These play an important role to the evaluation of sacrificial zones as part of the EBS exposure to thermally-driven chemical and transport processes. Thermal inducement of chemical interactions at EBS domains enhances mineral dissolution/precipitation but also generates mineralogical changes that result in mineral H2O uptake/removal (hydration/dehydration reactions). These processes can result in volume changes that can affect the interface / bulk phase porosities and the mechanical (stress) state of the bentonite barrier. Characterization studies on bentonite barrier samples from the FEBEX-DP international activity have provided important insight on clay barrier microstructures (e.g., microcracks) and interactions at EBS interfaces. Enhancements to the used fuel degradation model outlines the need to include the effects of canister corrosion due the strong influence of H2 generation on the source term.« less

General MACOS Interface for Modeling and Analysis for Controlled Optical Systems

NASA Technical Reports Server (NTRS)

Sigrist, Norbert; Basinger, Scott A.; Redding, David C.

2012-01-01

The General MACOS Interface (GMI) for Modeling and Analysis for Controlled Optical Systems (MACOS) enables the use of MATLAB as a front-end for JPL s critical optical modeling package, MACOS. MACOS is JPL s in-house optical modeling software, which has proven to be a superb tool for advanced systems engineering of optical systems. GMI, coupled with MACOS, allows for seamless interfacing with modeling tools from other disciplines to make possible integration of dynamics, structures, and thermal models with the addition of control systems for deformable optics and other actuated optics. This software package is designed as a tool for analysts to quickly and easily use MACOS without needing to be an expert at programming MACOS. The strength of MACOS is its ability to interface with various modeling/development platforms, allowing evaluation of system performance with thermal, mechanical, and optical modeling parameter variations. GMI provides an improved means for accessing selected key MACOS functionalities. The main objective of GMI is to marry the vast mathematical and graphical capabilities of MATLAB with the powerful optical analysis engine of MACOS, thereby providing a useful tool to anyone who can program in MATLAB. GMI also improves modeling efficiency by eliminating the need to write an interface function for each task/project, reducing error sources, speeding up user/modeling tasks, and making MACOS well suited for fast prototyping.

Numerical simulation of high-temperature thermal contact resistance and its reduction mechanism.

PubMed

Liu, Donghuan; Zhang, Jing

2018-01-01

High-temperature thermal contact resistance (TCR) plays an important role in heat-pipe-cooled thermal protection structures due to the existence of contact interface between the embedded heat pipe and the heat resistive structure, and the reduction mechanism of thermal contact resistance is of special interests in the design of such structures. The present paper proposed a finite element model of the high-temperature thermal contact resistance based on the multi-point contact model with the consideration of temperature-dependent material properties, heat radiation through the cavities at the interface and the effect of thermal interface material (TIM), and the geometry parameters of the finite element model are determined by simple surface roughness test and experimental data fitting. The experimental results of high-temperature thermal contact resistance between superalloy GH600 and C/C composite material are employed to validate the present finite element model. The effect of the crucial parameters on the thermal contact resistance with and without TIM are also investigated with the proposed finite element model.

Numerical simulation of high-temperature thermal contact resistance and its reduction mechanism

PubMed Central

Zhang, Jing

2018-01-01

High-temperature thermal contact resistance (TCR) plays an important role in heat-pipe-cooled thermal protection structures due to the existence of contact interface between the embedded heat pipe and the heat resistive structure, and the reduction mechanism of thermal contact resistance is of special interests in the design of such structures. The present paper proposed a finite element model of the high-temperature thermal contact resistance based on the multi-point contact model with the consideration of temperature-dependent material properties, heat radiation through the cavities at the interface and the effect of thermal interface material (TIM), and the geometry parameters of the finite element model are determined by simple surface roughness test and experimental data fitting. The experimental results of high-temperature thermal contact resistance between superalloy GH600 and C/C composite material are employed to validate the present finite element model. The effect of the crucial parameters on the thermal contact resistance with and without TIM are also investigated with the proposed finite element model. PMID:29547651

Tutorial: Determination of thermal boundary resistance by molecular dynamics simulations

NASA Astrophysics Data System (ADS)

Liang, Zhi; Hu, Ming

2018-05-01

Due to the high surface-to-volume ratio of nanostructured components in microelectronics and other advanced devices, the thermal resistance at material interfaces can strongly affect the overall thermal behavior in these devices. Therefore, the thermal boundary resistance, R, must be taken into account in the thermal analysis of nanoscale structures and devices. This article is a tutorial on the determination of R and the analysis of interfacial thermal transport via molecular dynamics (MD) simulations. In addition to reviewing the commonly used equilibrium and non-equilibrium MD models for the determination of R, we also discuss several MD simulation methods which can be used to understand interfacial thermal transport behavior. To illustrate how these MD models work for various interfaces, we will show several examples of MD simulation results on thermal transport across solid-solid, solid-liquid, and solid-gas interfaces. The advantages and drawbacks of a few other MD models such as approach-to-equilibrium MD and first-principles MD are also discussed.

Performance Testing of Thermal Interface Filler Materials in a Bolted Aluminum Interface Under Thermal/Vacuum Conditions

NASA Technical Reports Server (NTRS)

Glasgow, Shaun; Kittredge, Ken

2003-01-01

A thermal interface material is one of the many tools that are often used as part of the thermal control scheme for space-based applications. These materials are placed between, for example, an avionics box and a cold plate, in order to improve the conduction heat transfer so that proper temperatures can be maintained. Historically at Marshall Space Flight Center, CHO-THERM@ 1671 has primarily been used for applications where an interface material was deemed necessary. However, there have been numerous alternatives come on the market in recent years. It was decided that a number of these materials should be tested against each other to see if there were better performing alternatives. The tests were done strictly to compare the thermal performance of the materials relative to each other under repeatable conditions and they do not take into consideration other design issues such as off-gassing, electrical conduction or isolation, etc. This paper details the materials tested, test apparatus, procedures, and results of these tests.

Thermal transport in lithium ion batteries: An experimental investigation of interfaces and granular materials

NASA Astrophysics Data System (ADS)

Gaitonde, Aalok Jaisheela Uday

Increasing usage and recent accidents due to lithium-ion (Li-ion) batteries exploding or catching on fire has inspired research on the characterization and thermal management of these batteries. In cylindrical 18650 cells, heat generated during the battery's charge/discharge cycle is poorly dissipated to the surrounding through its metallic case due to the poor thermal conductivity of the jelly roll, which is spirally wound with many interfaces between electrodes and the polymeric separator. This work presents a technique to measure the thermal conduction across the metallic case-plastic separator interface, which ultimately limits heat transfer out of the jelly roll. The polymeric separator and metallic case are harvested from discharged commercial 18650 battery cells for thermal testing. A miniaturized version of the reference bar method enables measurements of the interface resistance between the case and the separator by establishing a temperature gradient across a multilayer stack consisting of two reference layers of known thermal conductivity and the case-separator sample. The case-separator interfacial conductance is reported for a range of case temperatures and interface pressures. The mean thermal conductance across the case-separator interface is 670 +/- 275 W/(m2K) and no significant temperature or pressure dependence is observed. The effective thermal conductivity of the battery stack is measured to be 0.27 W/m/K and 0.32 W/m/K in linear and radial configurations, respectively. Many techniques for fabricating battery electrodes involve coating particles of the active materials on metallic current collectors. The impact of mechanical shearing on the resultant thermal properties of these packed particle beds during the fabrication process has not yet been studied. Thus, the final portion of this thesis designs and validates a measurement system to measure the effects of mechanical shearing on the thermal conductivity of packed granular beds. This system simultaneously shears the sample while applying a temperature gradient across the particle bed, enabling thermal conductivity measurements using a radial equivalent of the conventional reference bar method. Results of this research, which includes characterization of thermal conductance across the rate limiting separator-case interface, will help improve the design and reliability of lithium ion batteries. Cells of larger dimension and capacity could also be achieved by the improved understanding of thermal transport across the microscopic electrode stack. Better analytic models of the thermal response of the batteries could be constructed, by taking into account the interfacial conductance and thermal conductivity of the electrodes measured in this work. This is of particular importance in the current circumstances, where accidents and safety issues related to lithium ion batteries are on the increase.

Velocity of the high-spin low-spin interface inside the thermal hysteresis loop of a spin-crossover crystal, via photothermal control of the interface motion.

PubMed

Slimani, Ahmed; Varret, François; Boukheddaden, Kamel; Garrot, Damien; Oubouchou, Hassane; Kaizaki, Sumio

2013-02-22

We investigated by optical microscopy the thermal transition of the spin-crossover dinuclear iron(II) compound [(Fe(NCSe)(py)(2))(2)(m-bpypz)]. In a high-quality crystal the high-spin (HS) low-spin (LS) thermal transition took place with a sizable hysteresis, at ~108 K and ~116 K on cooling and heating, respectively, through the growth of a single macroscopic domain with a straight LS and HS interface. The interface orientation was almost constant and its propagation velocity was close to ~6 and 26 μ m s(-1) for the on-cooling and on-heating processes, respectively. We found that the motion of the interface was sensitive to the intensity of the irradiation beam of the microscope, through a photothermal effect. By fine-tuning the intensity we could stop and even reverse the interface motion. This way we stabilized a biphasic state of the crystal, and we followed the spontaneous motion of the interface at different temperatures inside the thermal hysteresis loop. This experiment gives access for the first time to an accurate determination of the equilibrium temperature in the case of thermal hysteresis--which was not accessible by the usual quasistatic investigations. The temperature dependence of the propagation velocity inside the hysteretic interval was revealed to be highly nonlinear, and it was quantitatively reproduced by a dynamical mean-field theory, which made possible an estimate of the macroscopic energy barrier.

Modeling Coupled Movement of Water, Vapor, and Energy in Soils and at the Soil-Atmosphere Interface Using HYDRUS

NASA Astrophysics Data System (ADS)

Simunek, Jiri; Brunetti, Giuseppe; Saito, Hirotaka; Bristow, Keith

2017-04-01

Mass and energy fluxes in the subsurface are closely coupled and cannot be evaluated without considering their mutual interactions. However, only a few numerical models consider coupled water, vapor and energy transport in both the subsurface and at the soil-atmosphere interface. While hydrological and thermal processes in the subsurface are commonly implemented in existing models, which often consider both isothermally and thermally induced water and vapor flow, the interactions at the soil-atmosphere interface are often simplified, and the effects of slope inclination, slope azimuth, variable surface albedo and plant shading on incoming radiation and spatially variable surface mass and energy balance, and consequently on soil moisture and temperature distributions, are rarely considered. In this presentation we discuss these missing elements and our attempts to implement them into the HYDRUS model. We demonstrate implications of some of these interactions and their impact on the spatial distributions of soil temperature and water content, and their effect on soil evaporation. Additionally, we will demonstrate the use of the HYDRUS model to simulate processes relevant to the ground source heat pump systems.

Thermal Integration of a Liquid Acquisition Device into a Cryogenic Feed System

NASA Technical Reports Server (NTRS)

Hastings, L. J.; Bolshinskiy, L. G.; Schunk, R. G.; Martin, A. K.; Eskridge, R. H.; Frenkel, A.; Grayson, G.; Pendleton, M. L.

2011-01-01

Primary objectives of this effort were to define the following: (1) Approaches for quantification of the accumulation of thermal energy within a capillary screen liquid acquisition device (LAD) for a lunar lander upper stage during periods of up to 210 days on the lunar surface, (2) techniques for mitigating heat entrapment, and (3) perform initial testing, data evaluation. The technical effort was divided into the following categories: (1) Detailed thermal modeling of the LAD/feed system interactions using both COMSOL computational fluid device and standard codes, (2) FLOW-3D modeling of bulk liquid to provide interfacing conditions for the LAD thermal modeling, (3) condensation conditioning of capillary screens to stabilize surface tension retention capability, and (4) subscale testing of an integrated LAD/feed system. Substantial progress was achieved in the following technical areas: (1) Thermal modeling and experimental approaches for evaluating integrated cryogen LAD/feed systems, at both the system and component levels, (2) reduced gravity pressure control analyses, (3) analytical modeling and testing for capillary screen conditioning using condensation and wicking, and (4) development of rapid turnaround testing techniques for evaluating LAD/feed system thermal and fluid integration. A comprehensive effort, participants included a diverse cross section of representatives from academia, contractors, and multiple Marshall Space Flight Center organizations.

Burner liner thermal/structural load modeling: TRANCITS program user's manual

NASA Technical Reports Server (NTRS)

Maffeo, R.

1985-01-01

Transfer Analysis Code to Interface Thermal/Structural Problems (TRANCITS) is discussed. The TRANCITS code satisfies all the objectives for transferring thermal data between heat transfer and structural models of combustor liners and it can be used as a generic thermal translator between heat transfer and stress models of any component, regardless of the geometry. The TRANCITS can accurately and efficiently convert the temperature distributions predicted by the heat transfer programs to those required by the stress codes. It can be used for both linear and nonlinear structural codes and can produce nodal temperatures, elemental centroid temperatures, or elemental Gauss point temperatures. The thermal output of both the MARC and SINDA heat transfer codes can be interfaced directly with TRANCITS, and it will automatically produce stress model codes formatted for NASTRAN and MARC. Any thermal program and structural program can be interfaced by using the neutral input and output forms supported by TRANCITS.

Probing Nanoscale Thermal Transport in Surfactant Solutions

PubMed Central

Cao, Fangyu; Liu, Ying; Xu, Jiajun; He, Yadong; Hammouda, B.; Qiao, Rui; Yang, Bao

2015-01-01

Surfactant solutions typically feature tunable nanoscale, internal structures. Although rarely utilized, they can be a powerful platform for probing thermal transport in nanoscale domains and across interfaces with nanometer-size radius. Here, we examine the structure and thermal transport in solution of AOT (Dioctyl sodium sulfosuccinate) in n-octane liquids using small-angle neutron scattering, thermal conductivity measurements, and molecular dynamics simulations. We report the first experimental observation of a minimum thermal conductivity occurring at the critical micelle concentration (CMC): the thermal conductivity of the surfactant solution decreases as AOT is added till the onset of micellization but increases as more AOT is added. The decrease of thermal conductivity with AOT loading in solutions in which AOT molecules are dispersed as monomers suggests that even the interfaces between individual oleophobic headgroup of AOT molecules and their surrounding non-polar octane molecules can hinder heat transfer. The increase of thermal conductivity with AOT loading after the onset of micellization indicates that the thermal transport in the core of AOT micelles and across the surfactant-oil interfaces, both of which span only a few nanometers, are efficient. PMID:26534840

The Thermal and Microstructural Effect of Plasticizing HMX-Nitrocellulose Composites

DOE PAGES

Yeager, John David; Watkins, Erik Benjamin; Duque, Amanda Lynn; ...

2017-03-15

Thermal ignition via self-heating (cook-off) of cyclotetramethylene-tetranitramine (HMX)-containing plastic-bonded explosives (PBXs) is driven by the β → δ phase transition in the HMX, which is affected if not dominated by microstructure. Here, we studied the HMX-binder interface and phase transition for several variations of PBX 9404 (HMX with plasticized nitrocellulose [NC] binder). Neutron reflectometry was used to examine the interface under several conditions—pristine, after aging, and after thermal treatment. The initial interfacial structure depended on the plasticizer, but the interface homogenized over time. Thermal and optical analyses showed that all formulated materials had higher transition temperatures than neat HMX. Thismore » effect increased with NC content.« less

The Thermal and Microstructural Effect of Plasticizing HMX-Nitrocellulose Composites

NASA Astrophysics Data System (ADS)

Yeager, John D.; Watkins, Erik B.; Higginbotham Duque, Amanda L.; Majewski, Jaroslaw

2018-01-01

Thermal ignition via self-heating (cook-off) of cyclotetramethylene-tetranitramine (HMX)-containing plastic-bonded explosives (PBXs) is driven by the β → δ phase transition in the HMX, which is affected if not dominated by microstructure. Here, the HMX-binder interface and phase transition were studied for several variations of PBX 9404 (HMX with plasticized nitrocellulose [NC] binder). Neutron reflectometry was used to examine the interface under several conditions-pristine, after aging, and after thermal treatment. The initial interfacial structure depended on the plasticizer, but the interface homogenized over time. Thermal and optical analyses showed that all formulated materials had higher transition temperatures than neat HMX. This effect increased with NC content.

Development of a Nondestructive Evaluation Technique for Degraded Thermal Barrier Coatings Using Microwave

NASA Astrophysics Data System (ADS)

Sayar, M.; Ogawa, K.; Shoji, T.

2008-02-01

Thermal barrier coatings have been widely used in gas turbine engines in order to protect substrate metal alloy against high temperature and to enhance turbine efficiency. Currently, there are no reliable nondestructive techniques available to monitor TBC integrity over lifetime of the coating. Hence, to detect top coating (TC) and TGO thicknesses, a microwave nondestructive technique that utilizes a rectangular waveguide was developed. The phase of the reflection coefficient at the interface of TC and waveguide varies for different TGO and TC thicknesses. Therefore, measuring the phase of the reflection coefficient enables us to accurately calculate these thicknesses. Finally, a theoretical analysis was used to evaluate the reliability of the experimental results.

Interface Shape and Convection During Solidification and Melting of Succinonitrile

NASA Technical Reports Server (NTRS)

Degroh, Henry C., III; Lindstrom, Tiffany

1994-01-01

An experimental study was conducted of the crystal growth of succinonitrile during solidification, melting, and no-growth conditions using a horizontal Bridgman furnace and square glass ampoule. For use as input boundary conditions to numerical codes, thermal profiles on the outside of the ampoule at five locations around its periphery were measured along the ampoule's length. Temperatures inside the ampoule were also measured. The shapes of the s/l interface in various two dimensional planes were quantitatively determined. Though interfaces were nondendritic and noncellular, they were not flat, but were highly curved and symmetric in only one unique longitudinal y-z plane (at x=O). The shapes of the interface were dominated by the primary longitudinal flow cell characteristic of shallow cavity flow in horizontal Bridgman; this flow cell was driven by the imposed furnace temperature gradient and caused a 'radical' thermal gradient such that the upper half of the ampoule was hotter than the bottom half. We believe that due to the strong convection, the release of latent heat does not significantly influence the thermal conditions near the interface. We hope that the interface shape and thermal data presented in this paper can be used to optimize crystal growth processes and validate numerical models.

Thermal transport across metal silicide-silicon interfaces: First-principles calculations and Green's function transport simulations

NASA Astrophysics Data System (ADS)

Sadasivam, Sridhar; Ye, Ning; Feser, Joseph P.; Charles, James; Miao, Kai; Kubis, Tillmann; Fisher, Timothy S.

2017-02-01

Heat transfer across metal-semiconductor interfaces involves multiple fundamental transport mechanisms such as elastic and inelastic phonon scattering, and electron-phonon coupling within the metal and across the interface. The relative contributions of these different transport mechanisms to the interface conductance remains unclear in the current literature. In this work, we use a combination of first-principles calculations under the density functional theory framework and heat transport simulations using the atomistic Green's function (AGF) method to quantitatively predict the contribution of the different scattering mechanisms to the thermal interface conductance of epitaxial CoSi2-Si interfaces. An important development in the present work is the direct computation of interfacial bonding from density functional perturbation theory (DFPT) and hence the avoidance of commonly used "mixing rules" to obtain the cross-interface force constants from bulk material force constants. Another important algorithmic development is the integration of the recursive Green's function (RGF) method with Büttiker probe scattering that enables computationally efficient simulations of inelastic phonon scattering and its contribution to the thermal interface conductance. First-principles calculations of electron-phonon coupling reveal that cross-interface energy transfer between metal electrons and atomic vibrations in the semiconductor is mediated by delocalized acoustic phonon modes that extend on both sides of the interface, and phonon modes that are localized inside the semiconductor region of the interface exhibit negligible coupling with electrons in the metal. We also provide a direct comparison between simulation predictions and experimental measurements of thermal interface conductance of epitaxial CoSi2-Si interfaces using the time-domain thermoreflectance technique. Importantly, the experimental results, performed across a wide temperature range, only agree well with predictions that include all transport processes: elastic and inelastic phonon scattering, electron-phonon coupling in the metal, and electron-phonon coupling across the interface.

Modeling and experimental investigation of thermal-mechanical-electric coupling dynamics in a standing wave ultrasonic motor

NASA Astrophysics Data System (ADS)

Li, Xiang; Yao, Zhiyuan; He, Yigang; Dai, Shichao

2017-09-01

Ultrasonic motor operation relies on high-frequency vibration of a piezoelectric vibrator and interface friction between the stator and rotor/slider, which can cause temperature rise of the motor under continuous operation, and can affect motor parameters and performance in turn. In this paper, an integral model is developed to study the thermal-mechanical-electric coupling dynamics in a typical standing wave ultrasonic motor. Stick-slip motion at the contact interface and the temperature dependence of material parameters of the stator are taken into account in this model. The elastic, piezoelectric and dielectric material coefficients of the piezoelectric ceramic, as a function of temperature, are determined experimentally using a resonance method. The critical parameters in the model are identified via measured results. The resulting model can be used to evaluate the variation in output characteristics of the motor caused by the thermal-mechanical-electric coupling effects. Furthermore, the dynamic temperature rise of the motor can be accurately predicted under different input parameters using the developed model, which will contribute to improving the reliable life of a motor for long-term running.

Oxidation- and Creep-Enhanced Fatigue of Haynes 188 Alloy-Oxide Scale System Under Simulated Pulse Detonation Engine Conditions

NASA Technical Reports Server (NTRS)

Zhu, Dongming; Fox, Dennis S.; Miller, Robert A.

2002-01-01

The development of the pulse detonation engine (PDE) requires robust design of the engine components that are capable of enduring harsh detonation environments. In this study, a high cycle thermal fatigue test rig was developed for evaluating candidate PDE combustor materials using a CO2 laser. The high cycle thermal fatigue behavior of Haynes 188 alloy was investigated under an enhanced pulsed laser test condition of 30 Hz cycle frequency (33 ms pulse period, and 10 ms pulse width including 0.2 ms pulse spike). The temperature swings generated by the laser pulses near the specimen surface were characterized by using one-dimensional finite difference modeling combined with experimental measurements. The temperature swings resulted in significant thermal cyclic stresses in the oxide scale/alloy system, and induced extensive surface cracking. Striations of various sizes were observed at the cracked surfaces and oxide/alloy interfaces under the cyclic stresses. The test results indicated that oxidation and creep-enhanced fatigue at the oxide scale/alloy interface was an important mechanism for the surface crack initiation and propagation under the simulated PDE condition.

Mixed convection of magnetohydrodynamic nanofluids inside microtubes at constant wall temperature

NASA Astrophysics Data System (ADS)

Moshizi, S. A.; Zamani, M.; Hosseini, S. J.; Malvandi, A.

2017-05-01

Laminar fully developed mixed convection of magnetohydrodynamic nanofluids inside microtubes at a constant wall temperature (CWT) under the effects of a variable directional magnetic field is investigated numerically. Nanoparticles are assumed to have slip velocities relative to the base fluid owing to thermophoretic diffusion (temperature gradient driven force) and Brownian diffusion (concentration gradient driven force). The no-slip boundary condition is avoided at the fluid-solid mixture to assess the non-equilibrium region at the fluid-solid interface. A scale analysis is performed to estimate the relative significance of the pertaining parameters that should be included in the governing equations. After the effects of pertinent parameters on the pressure loss and heat transfer enhancement were considered, the figure of merit (FoM) is employed to evaluate and optimize the thermal performance of heat exchange equipment. The results indicate the optimum thermal performance is obtained when the thermophoresis overwhelms the Brownian diffusion, which is for larger nanoparticles. This enhancement boosts when the buoyancy force increases. In addition, increasing the magnetic field strength and slippage at the fluid-solid interface enhances the thermal performance.

A TBA approach to thermal transport in the XXZ Heisenberg model

NASA Astrophysics Data System (ADS)

Zotos, X.

2017-10-01

We show that the thermal Drude weight and magnetothermal coefficient of the 1D easy-plane Heisenberg model can be evaluated by an extension of the Bethe ansatz thermodynamics formulation by Takahashi and Suzuki (1972 Prog. Theor. Phys. 48 2187). They have earlier been obtained by the quantum transfer matrix method (Klümper 1999 Z. Phys. B 91 507). Furthermore, this approach can be applied to the study of the far-out of equilibrium energy current generated at the interface between two semi-infinite chains held at different temperatures.

Evapotranspiration from combined reflected solar and emitted terrestrial radiation - Preliminary FIFE results from AVHRR data

NASA Technical Reports Server (NTRS)

Goward, S. N.; Hope, A. S.

1989-01-01

The relation between remotely sensed spectral vegetation indices and thermal IR measurements is studied. Land surface evapotranspiration is evaluated based on this relationship. Analysis of the AVHRR data, obtained in Kansas in 1987, reveal a strong correlation between the spectral vegetation indices and surface temperature and this relation covaries with surface moisture conditions. It is noted that the relation between remotely sensed measurements of canopy green foliage and surface temperature is useful for examining variations in the interface thermal inertia and energy balance Bowen ratio.

Optimized Characterization of Thermoelectric Generators for Automotive Application

NASA Astrophysics Data System (ADS)

Tatarinov, Dimitri; Wallig, Daniel; Bastian, Georg

2012-06-01

New developments in the field of thermoelectric materials bring the prospect of consumer devices for recovery of some of the waste heat from internal combustion engines closer to reality. Efficiency improvements are expected due to the development of high-temperature thermoelectric generators (TEG). In contrast to already established radioisotope thermoelectric generators, the temperature difference in automotive systems is not constant, and this imposes a set of specific requirements on the TEG system components. In particular, the behavior of the TEGs and interface materials used to link the heat flow from the heat source through the TEG to the heat sink must be examined. Due to the usage patterns of automobiles, the TEG will be subject to cyclic thermal loads, which leads to module degradation. Additionally, the automotive TEG will be exposed to an inhomogeneous temperature distribution, leading to inhomogeneous mechanical loads and reduced system efficiency. Therefore, a characterization rig is required to allow determination of the electrical, thermal, and mechanical properties of such high-temperature TEG systems. This paper describes a measurement setup using controlled adjustment of cold-side and warm-side temperatures as well as controlled feed-in of electrical power for evaluation of TEGs for application in vehicles with combustion engines. The temperature profile in the setup can be varied to simulate any vehicle usage pattern, such as the European standard driving cycle, allowing the power yield of the TEGs to be evaluated for the chosen cycle. The spatially resolved temperature distribution of a TEG system can be examined by thermal imaging. Hotspots or cracks on thermocouples of the TEGs and the thermal resistance of thermal interface materials can also be examined using this technology. The construction of the setup is briefly explained, followed by detailed discussion of the experimental results.

Evaluation of GeO desorption behavior in the metal∕GeO2∕Ge structure and its improvement of the electrical characteristics

PubMed Central

Oniki, Yusuke; Koumo, Hideo; Iwazaki, Yoshitaka; Ueno, Tomo

2010-01-01

The relation between germanium monoxide (GeO) desorption and either improvement or deterioration in electrical characteristics of metal∕GeO2∕Ge capacitors fabricated by thermal oxidation has been investigated. In the metal∕GeO2∕Ge stack, two processes of GeO desorption at different sites and at different temperatures were observed by thermal desorption spectroscopy measurements. The electrical characteristics of as-oxidized metal∕GeO2∕Ge capacitors shows a large flat-band voltage shift and minority carrier generation due to the GeO desorption from the GeO2∕Ge interface during oxidation of Ge substrates. On the other hand, the electrical properties were drastically improved by a postmetallization annealing at low temperature resulting in a metal catalyzed GeO desorption from the top interface. PMID:20644659

Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat Conduction

NASA Technical Reports Server (NTRS)

Ngo, Quoc; Cruden, Brett A.; Cassell, Alan M.; Sims, Gerard; Li, Jun; Meyyappa, M.; Yang, Cary Y.

2005-01-01

Efforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.

Modifying Surface Energy of Graphene via Plasma-Based Chemical Functionalization to Tune Thermal and Electrical Transport at Metal Interfaces.

PubMed

Foley, Brian M; Hernández, Sandra C; Duda, John C; Robinson, Jeremy T; Walton, Scott G; Hopkins, Patrick E

2015-08-12

The high mobility exhibited by both supported and suspended graphene, as well as its large in-plane thermal conductivity, has generated much excitement across a variety of applications. As exciting as these properties are, one of the principal issues inhibiting the development of graphene technologies pertains to difficulties in engineering high-quality metal contacts on graphene. As device dimensions decrease, the thermal and electrical resistance at the metal/graphene interface plays a dominant role in degrading overall performance. Here we demonstrate the use of a low energy, electron-beam plasma to functionalize graphene with oxygen, fluorine, and nitrogen groups, as a method to tune the thermal and electrical transport properties across gold-single layer graphene (Au/SLG) interfaces. We find that while oxygen and nitrogen groups improve the thermal boundary conductance (hK) at the interface, their presence impairs electrical transport leading to increased contact resistance (ρC). Conversely, functionalization with fluorine has no impact on hK, yet ρC decreases with increasing coverage densities. These findings indicate exciting possibilities using plasma-based chemical functionalization to tailor the thermal and electrical transport properties of metal/2D material contacts.

Thermal conductivity of SrVO3-SrTiO3 thin films: Evidence of intrinsic thermal resistance at the interface between oxide layers

NASA Astrophysics Data System (ADS)

Katsufuji, T.; Saiki, T.; Okubo, S.; Katayama, Y.; Ueno, K.

2018-05-01

By using a technique of thermoreflectance that can precisely measure the thermal conductivity of thin films, we found that the thermal conductivity of SrVO3-SrTiO3 multilayer thin films normal to the surface was substantially reduced by decreasing the thickness of each layer. This indicates that a large intrinsic thermal resistance exists at the interface between SrVO3 and SrTiO3 in spite of the similar phononic properties for these two compounds.

Thermoelectric and morphological effects of Peltier pulsing on directional solidification of eutectic Bi-Mn

NASA Technical Reports Server (NTRS)

Silberstein, R. P.; Larson, D. J., Jr.; Dressler, B.

1984-01-01

Extensive in situ thermal measurements using Peltier Interface Demarcation (PID) during directional solidification of eutectic Bi/MnBi were carried out. Observations indicate that significant thermal transients occur throughout the sample as a result of the Peltier pulsing. The contributions of the Peltier, Thomson, and Joule heats were separated and studied as a function of pulse intensity and polarity. The Joule and the combined Peltier and Thomson thermal contributions were determined as a function of time during and after the current pulses, close to the solid/liquid interface. Variations of the Bi/MnBi particle morphology clearly reveal the interface shape, changes in interface velocity, meltback, and temporary loss of cooperative growth, as a result of the pulsing.

Self-pressurization of a spherical liquid hydrogen storage tank in a microgravity environment

NASA Technical Reports Server (NTRS)

Lin, C. S.; Hasan, M. M.

1992-01-01

Thermal stratification and self-pressurization of partially filled liquid hydrogen (LH2) storage tanks under microgravity condition is studied theoretically. A spherical tank is subjected to a uniform and constant wall heat flux. It is assumed that a vapor bubble is located in the tank center such that the liquid-vapor interface and tank wall form two concentric spheres. This vapor bubble represents an idealized configuration of a wetting fluid in microgravity conditions. Dimensionless mass and energy conservation equations for both vapor and liquid regions are numerically solved. Coordinate transformation is used to capture the interface location which changes due to liquid thermal expansion, vapor compression, and mass transfer at liquid-vapor interface. The effects of tank size, liquid fill level, and wall heat flux on the pressure rise and thermal stratification are studied. Liquid thermal expansion tends to cause vapor condensation and wall heat flux tends to cause liquid evaporation at the interface. The combined effects determine the direction of mass transfer at the interface. Liquid superheat increases with increasing wall heat flux and liquid fill level and approaches an asymptotic value.

Integrated thermal disturbance analysis of optical system of astronomical telescope

NASA Astrophysics Data System (ADS)

Yang, Dehua; Jiang, Zibo; Li, Xinnan

2008-07-01

During operation, astronomical telescope will undergo thermal disturbance, especially more serious in solar telescope, which may cause degradation of image quality. As drives careful thermal load investigation and measure applied to assess its effect on final image quality during design phase. Integrated modeling analysis is boosting the process to find comprehensive optimum design scheme by software simulation. In this paper, we focus on the Finite Element Analysis (FEA) software-ANSYS-for thermal disturbance analysis and the optical design software-ZEMAX-for optical system design. The integrated model based on ANSYS and ZEMAX is briefed in the first from an overview of point. Afterwards, we discuss the establishment of thermal model. Complete power series polynomial with spatial coordinates is introduced to present temperature field analytically. We also borrow linear interpolation technique derived from shape function in finite element theory to interface the thermal model and structural model and further to apply the temperatures onto structural model nodes. Thereby, the thermal loads are transferred with as high fidelity as possible. Data interface and communication between the two softwares are discussed mainly on mirror surfaces and hence on the optical figure representation and transformation. We compare and comment the two different methods, Zernike polynomials and power series expansion, for representing and transforming deformed optical surface to ZEMAX. Additionally, these methods applied to surface with non-circular aperture are discussed. At the end, an optical telescope with parabolic primary mirror of 900 mm in diameter is analyzed to illustrate the above discussion. Finite Element Model with most interested parts of the telescope is generated in ANSYS with necessary structural simplification and equivalence. Thermal analysis is performed and the resulted positions and figures of the optics are to be retrieved and transferred to ZEMAX, and thus final image quality is evaluated with thermal disturbance.

Carbon nanotube thermal interfaces and related applications

NASA Astrophysics Data System (ADS)

Hodson, Stephen L.

The development of thermal interface materials (TIMs) is necessitated by the temperature drop across interfacing materials arising from macro and microscopic irregularities of their surfaces that constricts heat through small contact regions as well as mismatches in their thermal properties. Similar to other types of TIMs, CNT TIMs alleviate the thermal resistance across the interface by thermally bridging two materials together with cylindrical, high-aspect ratio, and nominally vertical conducting elements. Within the community of TIM engineers, the vision driving the development of CNT TIMs was born from measurements that revealed impressively high thermal conductivities of individual CNTs. This vision was then projected to efforts focused on packing many individual CNTs on a single substrate that efficiently conduct heat in parallel and ultimately through many contact regions at CNT-to-substrate contacts. This thesis encompasses a comprehensive investigation of the viability of carbon nanotube based thermal interface materials (CNT TIMs) to efficiently conduct heat across two contacting materials. The efforts in this work were initially devoted to engaging CNT TIMs with an opposing substrate using two bonding techniques. Using palladium hexadecanethiolate, Pd(SC16H35)2 the CNT ends were bonded to an opposing substrate (one-sided interface) or opposing CNT array (two-sided interface) to enhance contact conductance while maintaining a compliant joint. The palladium weld is particularly attractive for its mechanical stability at high temperatures. The engagement of CNT TIMs with an opposing substrate was also achieved by inserting a solder foil between the CNT TIM and opposing substrate and subsequently raising the temperature of the interface above the eutectic point of the solder foil. This bonding technique creates a strong weld that not only reduces the thermal resistance significantly but also minimizes the change in thermal resistance with an applied compressive load. The thermal performance was further improved by infiltrating the CNT TIM with paraffin wax, which serves as an alternate pathway for heat conduction across the interface that ultimately reduces the bulk thermal resistance of the CNT TIM. For CNT TIMs synthesized at the Birck Nanotechnology Center at Purdue University, the thermal resistance was shown to scale linearly with their aggregate, as-grown height. Thus, the bulk thermal resistance can alternatively be tuned by adjusting the as-grown height. The linear relationship between thermal resistance and CNT TIM height provides a simple and efficient methodology to estimate the contact resistance and effective thermal conductivity of CNT TIMs. In this work, the contact resistance and effective thermal conductivity were estimated using two measurement techniques: (i) one-dimensional, steady-state reference bar and (ii) photoacoustic technique. A discrepancy in the estimated contact resistance exists between the two measurement techniques, which is due to the difficulty in measuring the true contact area. In contrast, the effective thermal conductivities estimated from both measurement techniques moderately agreed and were estimated to be on the order of O(1 W/mK). The final chapter is in collaboration with Sandia National Laboratories and focuses on the development of an apparatus to measure the thermal conductivity of insulation materials critical for the operation of molten salt batteries. Molten salt batteries are particularly useful power sources for radar and guidance systems in military applications such as guided missiles, ordinance, and other weapons. Molten salt batteries are activated by raising the temperature of the electrolyte above its melting temperature using pyrotechnic heat pellets. The battery will remain active as long as the electrolyte is molten. As a result, the thermal processes within the components and interactions between them are critical to the overall performance of molten salt batteries. A molten salt battery is typically thermally insulated using wrappable and board-like insulation materials such as Fiberfrax wrap, Fiberfrax board, and Min-K insulation. The Fiberfrax board and Min-K insulation are composites of alumino-silicate and fumed silica-titania, respectively. In Chapter 9, the thermal conductivities of the Fiberfrax board and Min-K insulation were measured under different uniaxial compressive states and ambient environments. The thermal conductivity of the mixed separator pellets (LiCl/MgO/KCl) was also measured along with its contact resistances with interfacing members. To measure the thermal quantities, a steady-state reference bar with thermocouples was employed. The resulting values serve as inputs to a thermal model that aims to predict lifetimes of the batteries. (Abstract shortened by ProQuest.).

Pressurized-Flat-Interface Heat Exchanger

NASA Technical Reports Server (NTRS)

Voss, F. E.; Howell, H. R.; Winkler, R. V.

1990-01-01

High thermal conductance obtained without leakage between loops. Heat-exchanger interface enables efficient transfer of heat between two working fluids without allowing fluids to intermingle. Interface thin, flat, and easy to integrate into thermal system. Possible application in chemical or pharmaceutical manufacturing when even trace contamination of process stream with water or other coolant ruins product. Reduces costs when highly corrosive fluids must be cooled or heated.

Characterization of the heat transfer properties of thermal interface materials

NASA Astrophysics Data System (ADS)

Fullem, Travis Z.

Physicists have studied the thermal conductivity of solids for decades. As a result of these efforts, thermal conduction in crystalline solids is well understood; there are detailed theories describing thermal conduction due to electrons and phonons. Phonon scattering and transmission at solid/solid interfaces, particularly above cryogenic temperatures, is not well understood and more work is needed in this area. The desire to solve engineering problems which require good thermal contact between mating surfaces has provided enhanced motivation for furthering the state of the art on this topic. Effective thermal management is an important design consideration in microelectronic systems. A common technique for removing excess heat from an electronic device is to attach a heatsink to the device; it is desirable to minimize the thermal resistance between the device and the heatsink. This can be accomplished by placing a thermal interface material (TIM) between the two surfaces. Due to the ever-increasing power densities found in electronic components, there is a desire to design better TIMs, which necessitates the ability to characterize TIM bondlines and to better understand the physics of heat conduction through TIM bondlines. A micro Fourier apparatus which employs Pt thin film thermometers of our design has been built and is capable of precisely quantifying the thermal resistance of thermal interface materials. In the present work several types of commercially available TIMs have been studied using this apparatus, including: greases, filled epoxies, and thermally conductive pads. In the case of filled epoxies, bondlines of various thicknesses, ranging from thirty microns to several hundred microns, have been measured. The microstructure of these bondlines has been investigated using optical microscopy and acoustic microscopy. Measured values of thermal conductivity are considered in terms of microstructural features such as percolation networks and filler particle depleted regions at the interface between the TIM and the substrate. The extent to which depleted regions contribute to the interfacial resistance is examined. The relationship between electrical and thermal resistance of the TIM bondline is considered in the context of comparing the relative contribution of electron and phonon heat conduction and how this correlates to microstructural features.

Understanding the liquid-liquid (water-hexane) interface

NASA Astrophysics Data System (ADS)

Murad, Sohail; Puri, Ishwar K.

2017-10-01

Nonequilibrium molecular dynamics simulations are employed to investigate the interfacial thermal resistance of nanoscale hexane-water interfaces subject to an applied heat flux. Our studies show that these liquid-liquid interfaces exhibit behavior significantly dissimilar to that of solid-liquid and solid-vapor interfaces. Notably, the thermal resistance of a hexane-water interface is contingent on the interfacial temperature gradient alone with negligible dependence on the mean interfacial temperature, while the solid-liquid dependent strongly on the interfacial temperature. Application of a heat flux also increases the interface thickness significantly as compared to an equilibrium isothermal interface. Since liquid-liquid interfaces have been proposed for diverse applications, e.g., sensors for wastewater treatment and for extraction of toxic ions from water, they can be designed to be wider by applying a heat flux. This may allow the interface to be used for other applications not possible currently because of the very limited thickness of the interface in isothermal systems.

Thermal-structural design study of an airframe-integrated Scramjet

NASA Technical Reports Server (NTRS)

Killackey, J. J.; Katinsky, E. A.; Tepper, S.; Vuigner, A. A.

1978-01-01

Design concepts are developed and evaluated for a cooled structures assembly for the Scramjet engine, for engine subsystems mass, volume, and operating requirements, and for the aircraft/engine interface. A thermal protection system was defined that makes it possible to attain a life of 100 hours and 1000 cycles. The coolant equivalence ratio at the Mach 10 maximum thermal loading condition is 0.6, indicating a capacity for airframe cooling. The mechanical design is feasible for manufacture using conventional materials. For the cooled structures in a six-module engine, the mass per unit capture area is 12.4 KN/sq m. The total weight of a six-module engine assembly including the fuel system is 14.73 KN.

Optical processing for semiconductor device fabrication

NASA Technical Reports Server (NTRS)

Sopori, Bhushan L.

1994-01-01

A new technique for semiconductor device processing is described that uses optical energy to produce local heating/melting in the vicinity of a preselected interface of the device. This process, called optical processing, invokes assistance of photons to enhance interface reactions such as diffusion and melting, as compared to the use of thermal heating alone. Optical processing is performed in a 'cold wall' furnace, and requires considerably lower energies than furnace or rapid thermal annealing. This technique can produce some device structures with unique properties that cannot be produced by conventional thermal processing. Some applications of optical processing involving semiconductor-metal interfaces are described.

Thermal interface material characterization for cryogenic electronic packaging solutions

NASA Astrophysics Data System (ADS)

Dillon, A.; McCusker, K.; Van Dyke, J.; Isler, B.; Christiansen, M.

2017-12-01

As applications of superconducting logic technologies continue to grow, the need for efficient and reliable cryogenic packaging becomes crucial to development and testing. A trade study of materials was done to develop a practical understanding of the properties of interface materials around 4 K. While literature exists for varying interface tests, discrepancies are found in the reported performance of different materials and in the ranges of applied force in which they are optimal. In considering applications extending from top cooling a silicon chip to clamping a heat sink, a range of forces from approximately 44 N to approximately 445 N was chosen for testing different interface materials. For each range of forces a single material was identified to optimize the thermal conductance of the joint. Of the tested interfaces, indium foil clamped at approximately 445 N showed the highest thermal conductance. Results are presented from these characterizations and useful methodologies for efficient testing are defined.

Electrical characteristics and thermal stability of HfO{sub 2} metal-oxide-semiconductor capacitors fabricated on clean reconstructed GaSb surfaces

DOE Office of Scientific and Technical Information (OSTI.GOV)

Miyata, Noriyuki, E-mail: nori.miyata@aist.go.jp; Mori, Takahiro; Yasuda, Tetsuji

2014-06-09

HfO{sub 2}/GaSb interfaces fabricated by high-vacuum HfO{sub 2} deposition on clean reconstructed GaSb surfaces were examined to explore a thermally stable GaSb metal-oxide-semiconductor structure with low interface-state density (D{sub it}). Interface Sb-O bonds were electrically and thermally unstable, and post-metallization annealing at temperatures higher than 200 °C was required to stabilize the HfO{sub 2}/GaSb interfaces. However, the annealing led to large D{sub it} in the upper-half band gap. We propose that the decomposition products that are associated with elemental Sb atoms act as interface states, since a clear correlation between the D{sub it} and the Sb coverage on the initial GaSbmore » surfaces was observed.« less

Effects of isothermal and cyclic exposures on interface structure and mechanical properties of FPalpha-Al2O3/aluminum composites. [polycrystaline alumina fibers

NASA Technical Reports Server (NTRS)

Kim, W. M.; Koczak, M. J.; Lawley, A.

1979-01-01

The microstructural and interface stability of FPalpha-Al203/Al-Li composites are investigated as a function of isothermal exposure at 500 C or thermal cycling between 140 and 500 C with hold time at Tmax. Interfacial morphology, growth kinetics, crystal structure, and composition of interfacial reaction products are characterized. Strength is monitored in the transverse orientation, and fracture mechanics is analyzed in terms of interface reaction products. The interfacial reaction product in FP/Al is Li2O.5Al2O3. Significant fiber-matrix reaction occurs during fabrication. The number of thermal cycles rather than total time at Tmax is the determining factor in strength degradation, thermal cycling giving rise to voids at the fiber-matrix interface. Extensive interface failures occur at composite fracture stresses below about 128 MPa; above this stress level failure is attributed to ductile matrix fracture.

Enhanced thermal stability of RuO2/polyimide interface for flexible device applications

NASA Astrophysics Data System (ADS)

Music, Denis; Schmidt, Paul; Chang, Keke

2017-09-01

We have studied the thermal stability of RuO2/polyimide (Kapton) interface using experimental and theoretical methods. Based on calorimetric and spectroscopic analyses, this inorganic-organic system does not exhibit any enthalpic peaks as well as all bonds in RuO2 and Kapton are preserved up to 500 °C. In addition, large-scale density functional theory based molecular dynamics, carried out in the same temperature range, validates the electronic structure and points out that numerous Ru-C and a few Ru-O covalent/ionic bonds form across the RuO2/Kapton interface. This indicates strong adhesion, but there is no evidence of Kapton degradation upon thermal excitation. Furthermore, RuO2 does not exhibit any interfacial bonds with N and H in Kapton, providing additional evidence for the thermal stability notion. It is suggested that the RuO2/Kapton interface is stable due to aromatic architecture of Kapton. This enhanced thermal stability renders Kapton an appropriate polymeric substrate for RuO2 containing systems in various applications, especially for flexible microelectronic and energy devices.

Reverse Non-Equilibrium Molecular Dynamics Demonstrate That Surface Passivation Controls Thermal Transport at Semiconductor-Solvent Interfaces.

PubMed

Hannah, Daniel C; Gezelter, J Daniel; Schaller, Richard D; Schatz, George C

2015-06-23

We examine the role played by surface structure and passivation in thermal transport at semiconductor/organic interfaces. Such interfaces dominate thermal transport in semiconductor nanomaterials owing to material dimensions much smaller than the bulk phonon mean free path. Utilizing reverse nonequilibrium molecular dynamics simulations, we calculate the interfacial thermal conductance (G) between a hexane solvent and chemically passivated wurtzite CdSe surfaces. In particular, we examine the dependence of G on the CdSe slab thickness, the particular exposed crystal facet, and the extent of surface passivation. Our results indicate a nonmonotonic dependence of G on ligand-grafting density, with interfaces generally exhibiting higher thermal conductance for increasing surface coverage up to ∼0.08 ligands/Å(2) (75-100% of a monolayer, depending on the particular exposed facet) and decreasing for still higher coverages. By analyzing orientational ordering and solvent penetration into the ligand layer, we show that a balance of competing effects is responsible for this nonmonotonic dependence. Although the various unpassivated CdSe surfaces exhibit similar G values, the crystal structure of an exposed facet nevertheless plays an important role in determining the interfacial thermal conductance of passivated surfaces, as the density of binding sites on a surface determines the ligand-grafting densities that may ultimately be achieved. We demonstrate that surface passivation can increase G relative to a bare surface by roughly 1 order of magnitude and that, for a given extent of passivation, thermal conductance can vary by up to a factor of ∼2 between different surfaces, suggesting that appropriately tailored nanostructures may direct heat flow in an anisotropic fashion for interface-limited thermal transport.

Interfacial phonon scattering and transmission loss in >1 μm thick silicon-on-insulator thin films

NASA Astrophysics Data System (ADS)

Jiang, Puqing; Lindsay, Lucas; Huang, Xi; Koh, Yee Kan

2018-05-01

Scattering of phonons at boundaries of a crystal (grains, surfaces, or solid/solid interfaces) is characterized by the phonon wavelength, the angle of incidence, and the interface roughness, as historically evaluated using a specularity parameter p formulated by Ziman [Electrons and Phonons (Clarendon Press, Oxford, 1960)]. This parameter was initially defined to determine the probability of a phonon specularly reflecting or diffusely scattering from the rough surface of a material. The validity of Ziman's theory as extended to solid/solid interfaces has not been previously validated. To better understand the interfacial scattering of phonons and to test the validity of Ziman's theory, we precisely measured the in-plane thermal conductivity of a series of Si films in silicon-on-insulator (SOI) wafers by time-domain thermoreflectance (TDTR) for a Si film thickness range of 1-10 μm and a temperature range of 100-300 K. The Si /SiO2 interface roughness was determined to be 0.11 ±0.04 nm using transmission electron microscopy (TEM). Furthermore, we compared our in-plane thermal conductivity measurements to theoretical calculations that combine first-principles phonon transport with Ziman's theory. Calculations using Ziman's specularity parameter significantly overestimate values from the TDTR measurements. We attribute this discrepancy to phonon transmission through the solid/solid interface into the substrate, which is not accounted for by Ziman's theory for surfaces. The phonons that are specularly transmitted into an amorphous layer will be sufficiently randomized by the time they come back to the crystalline Si layer, the effect of which is practically equivalent to a diffuse reflection at the interface. We derive a simple expression for the specularity parameter at solid/amorphous interfaces and achieve good agreement between calculations and measurement values.

Thermal Shock Resistance of Si3N4/h -BN Composites Prepared via Catalytic Reaction-Bonding Route

NASA Astrophysics Data System (ADS)

Yang, Wanli; Peng, Zhigang; Dai, Lina; Shi, Zhongqi; Jin, Zhihao

2017-09-01

Si3N4/h-BN ceramic matrix composites were prepared via a catalytic reaction-bonding route by using ZrO2 as nitridation catalyst, and the water quenching (fast cooling) and molten aluminum quenching tests (fast heating) were carried out to evaluate the thermal shock resistance of the composites. The results showed that the thermal shock resistance was improved obviously with the increase in h-BN content, and the critical thermal shock temperature difference (Δ T c) reaches as high as 780 °C when the h-BN content was 30 wt.%. The improvement of thermal shock resistance of the composites was mainly due to the crack tending to quasi static propagating at weak bonding interface between Si3N4 and h-BN with the increase in h-BN content. For the molten aluminum quenching test, the residual strength showed no obvious decrease compared with water quenching test, which could be caused by the mild stress condition on the surface. In addition, a calculated parameter, volumetric crack density ( N f), was presented to quantitative evaluating the thermal shock resistance of the composites in contrast to the conventional R parameter.

Microstructural Analysis and Transport Properties of Thermally Sprayed Multiple-Layer Ceramic Coatings

DOE PAGES

Wang, Hsin; Muralidharan, Govindarajan; Leonard, Donovan N.; ...

2018-01-04

In this paper, multilayer, graded ceramic/metal coatings were prepared by an air plasma spray method on Ti-6Al-4V, 4140 steel and graphite substrates. The coatings were designed to provide thermal barriers for diesel engine pistons to operate at higher temperatures with improved thermal efficiency and cleaner emissions. A systematic, progressive variation in the mixture of yttria-stabilized zirconia and bondcoat alloys (NiCoCrAlYHfSi) was designed to provide better thermal expansion match with the substrate and to improve thermal shock resistance and cycle life. Heat transfer through the layers was evaluated by a flash diffusivity technique based on a model of one-dimensional heat flow.more » The aging effect of the as-sprayed coatings was captured during diffusivity measurements, which included one heating and cooling cycle. The hysteresis of thermal diffusivity due to aging was not observed after 100-h annealing at 800 °C. The measurements of coatings on substrate and freestanding coatings allowed the influence of interface resistance to be evaluated. Finally, the microstructure of the multilayer coating was examined using scanning electron microscope and electron probe microanalysis.« less

Microstructural Analysis and Transport Properties of Thermally Sprayed Multiple-Layer Ceramic Coatings

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wang, Hsin; Muralidharan, Govindarajan; Leonard, Donovan N.

In this paper, multilayer, graded ceramic/metal coatings were prepared by an air plasma spray method on Ti-6Al-4V, 4140 steel and graphite substrates. The coatings were designed to provide thermal barriers for diesel engine pistons to operate at higher temperatures with improved thermal efficiency and cleaner emissions. A systematic, progressive variation in the mixture of yttria-stabilized zirconia and bondcoat alloys (NiCoCrAlYHfSi) was designed to provide better thermal expansion match with the substrate and to improve thermal shock resistance and cycle life. Heat transfer through the layers was evaluated by a flash diffusivity technique based on a model of one-dimensional heat flow.more » The aging effect of the as-sprayed coatings was captured during diffusivity measurements, which included one heating and cooling cycle. The hysteresis of thermal diffusivity due to aging was not observed after 100-h annealing at 800 °C. The measurements of coatings on substrate and freestanding coatings allowed the influence of interface resistance to be evaluated. Finally, the microstructure of the multilayer coating was examined using scanning electron microscope and electron probe microanalysis.« less

Carbon-Fiber Brush Heat Exchangers

NASA Technical Reports Server (NTRS)

Knowles, Timothy R.

2004-01-01

Velvetlike and brushlike pads of carbon fibers have been proposed for use as mechanically compliant, highly thermally conductive interfaces for transferring heat. A pad of this type would be formed by attaching short carbon fibers to either or both of two objects that one desires to place in thermal contact with each other. The purpose of using a thermal-contact pad of this or any other type is to reduce the thermal resistance of an interface between a heat source and a heat sink.

Thermal conductance at the interface between crystals using equilibrium and nonequilibrium molecular dynamics

NASA Astrophysics Data System (ADS)

Merabia, Samy; Termentzidis, Konstantinos

2012-09-01

In this article, we compare the results of nonequilibrium (NEMD) and equilibrium (EMD) molecular dynamics methods to compute the thermal conductance at the interface between solids. We propose to probe the thermal conductance using equilibrium simulations measuring the decay of the thermally induced energy fluctuations of each solid. We also show that NEMD and EMD give generally speaking inconsistent results for the thermal conductance: Green-Kubo simulations probe the Landauer conductance between two solids which assumes phonons on both sides of the interface to be at equilibrium. On the other hand, we show that NEMD give access to the out-of-equilibrium interfacial conductance consistent with the interfacial flux describing phonon transport in each solid. The difference may be large and reaches typically a factor 5 for interfaces between usual semiconductors. We analyze finite size effects for the two determinations of the interfacial thermal conductance, and show that the equilibrium simulations suffer from severe size effects as compared to NEMD. We also compare the predictions of the two above-mentioned methods—EMD and NEMD—regarding the interfacial conductance of a series of mass mismatched Lennard-Jones solids. We show that the Kapitza conductance obtained with EMD can be well described using the classical diffuse mismatch model (DMM). On the other hand, NEMD simulation results are consistent with an out-of-equilibrium generalization of the acoustic mismatch model (AMM). These considerations are important in rationalizing previous results obtained using molecular dynamics, and help in pinpointing the physical scattering mechanisms taking place at atomically perfect interfaces between solids, which is a prerequisite to understand interfacial heat transfer across real interfaces.

Interface Energy Coupling between β-tungsten Nanofilm and Few-layered Graphene

DOE PAGES

Han, Meng; Yuan, Pengyu; Liu, Jing; ...

2017-09-22

We report the thermal conductance induced by few-layered graphene (G) sandwiched between β-phase tungsten (β-W) films of 15, 30 and 40 nm thickness. Our differential characterization is able to distinguish the thermal conductance of β-W film and β-W/G interface. The cross-plane thermal conductivity (k) of β-W films is determined at 1.69~2.41 Wm -1K -1 which is much smaller than that of α-phase tungsten (174 Wm -1K -1). This small value is consistent with the large electrical resistivity reported for β-W in literatures and in this work. The β-W/β-W and β-W/G interface thermal conductance (GW/W and GW/G) are characterized and comparedmore » using multilayered β-W films with and without sandwiched graphene layers. The average GW/W is found to be at 280 MW m -2K -1. GW/G features strong variation from sample to sample, and has a lower-limit of 84 MW m -2K -1, taking into consideration of the uncertainties. This is attributed to possible graphene structure damage and variation during graphene transfer and W sputtering. The difference between G2W/G and GW/W uncovers the finite thermal resistance induced by the graphene layer. Compared with up-to-date reported graphene interface thermal conductance, the β-W/G interface is at the high end in terms of local energy coupling.« less

Interface Energy Coupling between β-tungsten Nanofilm and Few-layered Graphene

DOE Office of Scientific and Technical Information (OSTI.GOV)

Han, Meng; Yuan, Pengyu; Liu, Jing

We report the thermal conductance induced by few-layered graphene (G) sandwiched between β-phase tungsten (β-W) films of 15, 30 and 40 nm thickness. Our differential characterization is able to distinguish the thermal conductance of β-W film and β-W/G interface. The cross-plane thermal conductivity (k) of β-W films is determined at 1.69~2.41 Wm -1K -1 which is much smaller than that of α-phase tungsten (174 Wm -1K -1). This small value is consistent with the large electrical resistivity reported for β-W in literatures and in this work. The β-W/β-W and β-W/G interface thermal conductance (GW/W and GW/G) are characterized and comparedmore » using multilayered β-W films with and without sandwiched graphene layers. The average GW/W is found to be at 280 MW m -2K -1. GW/G features strong variation from sample to sample, and has a lower-limit of 84 MW m -2K -1, taking into consideration of the uncertainties. This is attributed to possible graphene structure damage and variation during graphene transfer and W sputtering. The difference between G2W/G and GW/W uncovers the finite thermal resistance induced by the graphene layer. Compared with up-to-date reported graphene interface thermal conductance, the β-W/G interface is at the high end in terms of local energy coupling.« less

Observation of interface defects in thermally oxidized SiC using positron annihilation

NASA Astrophysics Data System (ADS)

Dekker, James; Saarinen, Kimmo; Ólafsson, Halldór; Sveinbjörnsson, Einar Ö.

2003-03-01

Positron annihilation has been applied to study thermally oxidized 4H- and 6H-SiC. The SiC/SiO2 interface is found to contain a high density of open-volume defects. The positron trapping at the interface defects correlates with the charge of the interface determined by capacitance-voltage experiments. For oxides grown on n-SiC substrates, the positron annihilation characteristics at these defects are nearly indistinguishable from those of a silicon/oxide interface, with no discernable contribution from C-related bonds or carbon clusters. These results indicate that those defects at the SiC/oxide interface, which are visible to positrons, are similar to those at the Si/oxide interface. The positron annihilation characteristics suggest that these defects are vacancies surrounded by oxygen atoms.

Kapitza thermal resistance studied by high-frequency photothermal radiometry

DOE Office of Scientific and Technical Information (OSTI.GOV)

Horny, Nicolas; Chirtoc, Mihai; Hamaoui, Georges

2016-07-18

Kapitza thermal resistance is determined using high-frequency photothermal radiometry (PTR) extended for modulation up to 10 MHz. Interfaces between 50 nm thick titanium coatings and silicon or stainless steel substrates are studied. In the used configuration, the PTR signal is not sensitive to the thermal conductivity of the film nor to its optical absorption coefficient, thus the Kapitza resistance is directly determined from single thermal parameter fits. Results of thermal resistances show the significant influence of the nature of the substrate, as well as of the presence of free electrons at the interface.

Metallized compliant 3D microstructures for dry contact thermal conductance enhancement

NASA Astrophysics Data System (ADS)

Cui, Jin; Wang, Jicheng; Zhong, Yang; Pan, Liang; Weibel, Justin A.

2018-05-01

Microstructured three-dimensional (3D) materials can be engineered to enable new capabilities for various engineering applications; however, microfabrication of large 3D structures is typically expensive due to the conventional top-down fabrication scheme. Herein we demonstrated the use of projection micro-stereolithography and electrodeposition as cost-effective and high-throughput methods to fabricate compliant 3D microstructures as a thermal interface material (TIM). This novel TIM structure consists of an array of metallized micro-springs designed to enhance the dry contact thermal conductance between nonflat surfaces under low interface pressures (10s-100s kPa). Mechanical compliance and thermal resistance measurements confirm that this dry contact TIM can achieve conformal contact between mating surfaces with a nonflatness of approximately 5 µm under low interface pressures.

Remarkably enhanced thermal transport based on a flexible horizontally-aligned carbon nanotube array film

PubMed Central

Qiu, Lin; Wang, Xiaotian; Su, Guoping; Tang, Dawei; Zheng, Xinghua; Zhu, Jie; Wang, Zhiguo; Norris, Pamela M.; Bradford, Philip D.; Zhu, Yuntian

2016-01-01

It has been more than a decade since the thermal conductivity of vertically aligned carbon nanotube (VACNT) arrays was reported possible to exceed that of the best thermal greases or phase change materials by an order of magnitude. Despite tremendous prospects as a thermal interface material (TIM), results were discouraging for practical applications. The primary reason is the large thermal contact resistance between the CNT tips and the heat sink. Here we report a simultaneous sevenfold increase in in-plane thermal conductivity and a fourfold reduction in the thermal contact resistance at the flexible CNT-SiO2 coated heat sink interface by coupling the CNTs with orderly physical overlapping along the horizontal direction through an engineering approach (shear pressing). The removal of empty space rapidly increases the density of transport channels, and the replacement of the fine CNT tips with their cylindrical surface insures intimate contact at CNT-SiO2 interface. Our results suggest horizontally aligned CNT arrays exhibit remarkably enhanced in-plane thermal conductivity and reduced out-of-plane thermal conductivity and thermal contact resistance. This novel structure makes CNT film promising for applications in chip-level heat dissipation. Besides TIM, it also provides for a solution to anisotropic heat spreader which is significant for eliminating hot spots. PMID:26880221

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yeager, John David; Watkins, Erik Benjamin; Duque, Amanda Lynn

Thermal ignition via self-heating (cook-off) of cyclotetramethylene-tetranitramine (HMX)-containing plastic-bonded explosives (PBXs) is driven by the β → δ phase transition in the HMX, which is affected if not dominated by microstructure. Here, we studied the HMX-binder interface and phase transition for several variations of PBX 9404 (HMX with plasticized nitrocellulose [NC] binder). Neutron reflectometry was used to examine the interface under several conditions—pristine, after aging, and after thermal treatment. The initial interfacial structure depended on the plasticizer, but the interface homogenized over time. Thermal and optical analyses showed that all formulated materials had higher transition temperatures than neat HMX. Thismore » effect increased with NC content.« less

Joining Dental Ceramic Layers With Glass

PubMed Central

Saied, MA; Lloyd, IK; Haller, WK; Lawn, BR

2011-01-01

Objective Test the hypothesis that glass-bonding of free-form veneer and core ceramic layers can produce robust interfaces, chemically durable and aesthetic in appearance and, above all, resistant to delamination. Methods Layers of independently produced porcelains (NobelRondo™ Press porcelain, Nobel BioCare AB and Sagkura Interaction porcelain, Elephant Dental) and matching alumina or zirconia core ceramics (Procera alumina, Nobel BioCare AB, BioZyram yttria stabilized tetragonal zirconia polycrystal, Cyrtina Dental) were joined with designed glasses, tailored to match thermal expansion coefficients of the components and free of toxic elements. Scanning electron microprobe analysis was used to characterize the chemistry of the joined interfaces, specifically to confirm interdiffusion of ions. Vickers indentations were used to drive controlled corner cracks into the glass interlayers to evaluate the toughness of the interfaces. Results The glass-bonded interfaces were found to have robust integrity relative to interfaces fused without glass, or those fused with a resin-based adhesive. Significance The structural integrity of the interfaces between porcelain veneers and alumina or zirconia cores is a critical factor in the longevity of all-ceramic dental crowns and fixed dental prostheses. PMID:21802131

Coupling device with improved thermal interface

NASA Astrophysics Data System (ADS)

Milam, Malcolm Bruce

1992-04-01

The primary object of the present invention is to provide a simple, reliable, and lightweight coupling that will also have an efficient thermal interface. A further object of the invention is to provide a coupling that is capable of blind mating with little or no insertion forces. Another object of the invention is to provide a coupling that acts as a thermal regulator to maintain a constant temperature on one side of the coupling. Another object of the invention is to increase the available surface area of a coupling thus providing a larger area for the conduction of heat across the thermal interface. Another object of the invention is to provide a fluidic coupling that has no fluid passing across the interface, thus reducing the likelihood of leaks and contamination. The foregoing objects are achieved by utilizing, as in the prior art, a hot area (at an elevated temperature as compared to a cold area) with a need to remove excess heat from the hot area to a cold area. In this device, the thermal interface will occur not on a planar horizontal surface, but along a non-planar vertical surface, which will reduce the reaction forces and increase the thermal conductivity of the device. One non-planar surface is a surface on a cold pin extending from the cold area and the other non-planar surface is a surface on a hot pin extending from the hot area. The cold pin is fixed and does not move while the hot pin is a flexible member and its movement towards the cold pin will bring the two non-planar surfaces together forming the thermal interface. The actuating member for the device is a shape-memory actuation wire which is attached through an aperture to the hot pin and through another aperture to an actuation wire retainer. By properly programming the actuation wire, heat from the hot area will cause the actuation wire to bend the hot wire. Heat from the hot area will cause the actuation wire to bend the hot pin towards the cold pin forming the coupling and the desired thermal interface. The shape-memory actuation wire is made of a shape-memory-effect alloy such as Nitinol.

Role of direct electron-phonon coupling across metal-semiconductor interfaces in thermal transport via molecular dynamics.

PubMed

Lin, Keng-Hua; Strachan, Alejandro

2015-07-21

Motivated by significant interest in metal-semiconductor and metal-insulator interfaces and superlattices for energy conversion applications, we developed a molecular dynamics-based model that captures the thermal transport role of conduction electrons in metals and heat transport across these types of interface. Key features of our model, denoted eleDID (electronic version of dynamics with implicit degrees of freedom), are the natural description of interfaces and free surfaces and the ability to control the spatial extent of electron-phonon (e-ph) coupling. Non-local e-ph coupling enables the energy of conduction electrons to be transferred directly to the semiconductor/insulator phonons (as opposed to having to first couple to the phonons in the metal). We characterize the effect of the spatial e-ph coupling range on interface resistance by simulating heat transport through a metal-semiconductor interface to mimic the conditions of ultrafast laser heating experiments. Direct energy transfer from the conduction electrons to the semiconductor phonons not only decreases interfacial resistance but also increases the ballistic transport behavior in the semiconductor layer. These results provide new insight for experiments designed to characterize e-ph coupling and thermal transport at the metal-semiconductor/insulator interfaces.

Cross-plane thermal conductivity of (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices

NASA Astrophysics Data System (ADS)

Saha, Bivas; Koh, Yee Rui; Comparan, Jonathan; Sadasivam, Sridhar; Schroeder, Jeremy L.; Garbrecht, Magnus; Mohammed, Amr; Birch, Jens; Fisher, Timothy; Shakouri, Ali; Sands, Timothy D.

2016-01-01

Reduction of cross-plane thermal conductivity and understanding of the mechanisms of heat transport in nanostructured metal/semiconductor superlattices are crucial for their potential applications in thermoelectric and thermionic energy conversion devices, thermal management systems, and thermal barrier coatings. We have developed epitaxial (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices with periodicity ranging from 1 nm to 240 nm that show significantly lower thermal conductivity compared to the parent TiN/(Al,Sc)N superlattice system. The (Ti,W)N/(Al,Sc)N superlattices grow with [001] orientation on the MgO(001) substrates with well-defined coherent layers and are nominally single crystalline with low densities of extended defects. Cross-plane thermal conductivity (measured by time-domain thermoreflectance) decreases with an increase in the superlattice interface density in a manner that is consistent with incoherent phonon boundary scattering. Thermal conductivity values saturate at 1.7 W m-1K-1 for short superlattice periods possibly due to a delicate balance between long-wavelength coherent phonon modes and incoherent phonon scattering from heavy tungsten atomic sites and superlattice interfaces. First-principles density functional perturbation theory based calculations are performed to model the vibrational spectrum of the individual component materials, and transport models are used to explain the interface thermal conductance across the (Ti,W)N/(Al,Sc)N interfaces as a function of periodicity. The long-wavelength coherent phonon modes are expected to play a dominant role in the thermal transport properties of the short-period superlattices. Our analysis of the thermal transport properties of (Ti,W)N/(Al,Sc)N metal/semiconductor superlattices addresses fundamental questions about heat transport in multilayer materials.

Constructing a High-Sensitivity, Computer-Interfaced, Differential Thermal Analysis Device for Teaching and Research

ERIC Educational Resources Information Center

Martinez, L. M.; Videa, M.; Mederos, F.; Mesquita, J.

2007-01-01

The construction of a new highly-sensitive, computer-interfaced, differential thermal analysis (DTA) device, used for gathering different information about the chemical reactions, is described. The instrument provides a better understanding about the phase transitions, phase diagrams and many more concepts to the students.

The Effect of Prosthetic Socket Interface Design on Socket Comfort, Residual Limb Health, and Function for the Transfemoral Amputee

DTIC Science & Technology

2016-10-01

laminated rigid frame to reduce thermal layers, increase flexibility and comfort while retaining ischial containment. In contrast, a Sub-I design has...design is comprised of a flexible interface and minimal laminated rigid frame to reduce thermal layers, increase flexibility and comfort while...AWARD NUMBER: W81XWH-15-1-0410 TITLE: The Effect of Prosthetic Socket Interface Design on Socket Comfort , Residual Limb Health, and Function

Ceramic blade with tip seal

DOEpatents

Glezer, B.; Bhardwaj, N.K.; Jones, R.B.

1997-08-05

The present gas turbine engine includes a disc assembly defining a disc having a plurality of blades attached thereto. The disc has a preestablished rate of thermal expansion and the plurality of blades have a preestablished rate of thermal expansion being less than the preestablished rate of thermal expansion of the disc. A shroud assembly is attached to the gas turbine engine and is spaced from the plurality of blades a preestablished distance forming an interface there between. Positioned in the interface is a seal having a preestablished rate of thermal expansion being generally equal to the rate of thermal expansion of the plurality of blades. 4 figs.

Combining Thermal And Structural Analyses

NASA Technical Reports Server (NTRS)

Winegar, Steven R.

1990-01-01

Computer code makes programs compatible so stresses and deformations calculated. Paper describes computer code combining thermal analysis with structural analysis. Called SNIP (for SINDA-NASTRAN Interfacing Program), code provides interface between finite-difference thermal model of system and finite-element structural model when no node-to-element correlation between models. Eliminates much manual work in converting temperature results of SINDA (Systems Improved Numerical Differencing Analyzer) program into thermal loads for NASTRAN (NASA Structural Analysis) program. Used to analyze concentrating reflectors for solar generation of electric power. Large thermal and structural models needed to predict distortion of surface shapes, and SNIP saves considerable time and effort in combining models.

New methods for evaluating physical and thermal comfort properties of orthotic materials used in insoles for patients with diabetes.

PubMed

Lo, Wai Ting; Yick, Kit Lun; Ng, Sun Pui; Yip, Joanne

2014-01-01

Orthotic insoles are commonly used in the treatment of the diabetic foot to prevent ulcerations. Choosing suitable insole material is vital for effective foot orthotic treatment. We examined seven types of orthotic materials. In consideration of the key requirements and end uses of orthotic insoles for the diabetic foot, including accommodation, cushioning, and control, we developed test methods for examining important physical properties, such as force reduction and compression properties, insole-skin friction, and shear properties, as well as thermal comfort properties of fabrication materials. A novel performance index that combines various material test results together was also proposed to quantify the overall performance of the insole materials. The investigation confirms that the insole-sock interface has a lower coefficient of friction and shearing stress than those of the insole-skin interface. It is also revealed that material brand and the corresponding density and cell volume, as well as thickness, are closely associated with the performance of moisture absorption and thermal comfort. On the basis of the proposed performance index, practitioners can better understand the properties and performance of various insole materials, thus prescribing suitable orthotic insoles for patients with diabetic foot.

Heat transport by phonons in crystalline materials and nanostructures

NASA Astrophysics Data System (ADS)

Koh, Yee Kan

This dissertation presents experimental studies of heat transport by phonons in crystalline materials and nanostructures, and across solid-solid interfaces. Particularly, this dissertation emphasizes advancing understanding of the mean-free-paths (i.e., the distance phonons propagate without being scattered) of acoustic phonons, which are the dominant heat carriers in most crystalline semiconductor nanostructures. Two primary tools for the studies presented in this dissertation are time-domain thermoreflectance (TDTR) for measurements of thermal conductivity of nanostructures and thermal conductance of interfaces; and frequency-domain thermoreflectance (FDTR), which I developed as a direct probe of the mean-free-paths of dominant heat-carrying phonons in crystalline solids. The foundation of FDTR is the dependence of the apparent thermal conductivity on the frequency of periodic heat sources. I find that the thermal conductivity of semiconductor alloys (InGaP, InGaAs, and SiGe) measured by TDTR depends on the modulation frequency, 0.1 ≤ f ≤ 10 MHz, used in TDTR measurements. Reduction in the thermal conductivity of the semiconductor alloys at high f compares well to the reduction in the thermal conductivity of epitaxial thin films, indicating that frequency dependence and thickness dependence of thermal conductivity are fundamentally equivalent. I developed the frequency dependence of thermal conductivity into a convenient probe of phonon mean-free-paths, a technique which I call frequency-domain thermoreflectance (FDTR). In FDTR, I monitor the changes in the intensity of the reflected probe beam as a function of the modulation frequency. To facilitate the analysis of FDTR measurements, I developed a nonlocal theory for heat conduction by phonons at high heating frequencies. Calculations of the nonlocal theory confirm my experimental findings that phonons with mean-free-paths longer than two times the penetration depth do not contribute to the apparent thermal conductivity. I employed FDTR to study the mean-free-paths of acoustic phonons in Si1-xGex. I experimentally demonstrate that 40% of heat is carried in Si1-xGe x alloys by phonons with mean-free-path 0.5 ≤ ℓ ≤ 5 mum, and phonons with > 2 mum do not contribute to the thermal conductivity of Si. I employed TDTR and frequency-dependent TDTR to study scattering of long- and medium-wavelength phonons in two important thermoelectric materials embedded with nanoscale precipitates. I find that the through-thickness lattice thermal conductivity of (PbTe)1-x/(PbSe)x nanodot superlattices (NDSLs) approaches the thermal conductivity of bulk homogenous PbTe1-x Sex alloys with the same average composition. On the other hand, I find that 3% of ErAs nanoparticles embedded in InGaAs is sufficient to scatter most of the phonons in InGaAs that have intermediate mean-free-paths, and thus reduces the thermal conductivity of InGaAs below the alloy limit. I find that scattering by nanoparticles approach the geometrical limit and can be readily accounted for by an additional boundary scattering which depends on the concentration of nanoparticles. Finally, I studied the thermal conductance of Au/Ti/Graphene/SiO 2 interfaces by TDTR. I find that heat transport across the interface is dominated by phonons. Even though graphene is only one atomic layer thick, graphene interfaces should be treated as two discrete interfaces instead of one diffuse interface in thermal analysis, suggesting that direct transmission of phonons from Au to SiO2 is negligible. My study is important for thermal management of graphene devices.

New Laboratory Observations of Thermal Pressurization Weakening

NASA Astrophysics Data System (ADS)

Badt, N.; Tullis, T. E.; Hirth, G.

2017-12-01

Dynamic frictional weakening due to pore fluid thermal pressurization has been studied under elevated confining pressure in the laboratory, using a rotary-shear apparatus having a sample with independent pore pressure and confining pressure systems. Thermal pressurization is directly controlled by the permeability of the rocks, not only for the initiation of high-speed frictional weakening but also for a subsequent sequence of high-speed sliding events. First, the permeability is evaluated at different effective pressures using a method where the pore pressure drop and the flow-through rate are compared using Darcy's Law as well as a pore fluid oscillation method, the latter method also permitting measurement of the storage capacity. Then, the samples undergo a series of high-speed frictional sliding segments at a velocity of 2.5 mm/s, under an applied confining pressure and normal stress of 45 MPa and 50 MPa, respectively, and an initial pore pressure of 25 MPa. Finally the rock permeability and storage capacity are measured again to assess the evolution of the rock's pore fluid properties. For samples with a permeability of 10-20 m2 thermal pressurization promotes a 40% decrease in strength. However, after a sequence of three high-speed sliding events, the magnitude of weakening diminishes progressively from 40% to 15%. The weakening events coincide with dilation of the sliding interface. Moreover, the decrease in the weakening degree with progressive fast-slip events suggest that the hydraulic diffusivity may increase locally near the sliding interface during thermal pressurization-enhanced slip. This could result from stress- or thermally-induced damage to the host rock, which would perhaps increase both permeability and storage capacity, and so possibly decrease the susceptibility of dynamic weakening due to thermal pressurization in subsequent high-speed sliding events.

Thermal conductivity investigation of adhesive-free bond laser components

NASA Astrophysics Data System (ADS)

Li, Da; Hong, Pengda; Vedula, MahaLakshmi; Meissner, Helmuth E.

2017-02-01

An interferometric method has been developed and employed at Onyx Optics, Inc. to accurately measure the thermal conductivity of laser-active crystals as function of dopant concentration or inactive materials such as single crystals, optical ceramics and glasses relative to a standard of assumed to be known thermal conductivity [1]. This technique can also provide information on heat transfer resistance at the interface between two materials in close thermal contact. While the technique appears generally applicable to composites between optically homogeneous materials, we report on thermal conductivities and heat transfer coefficients of selected adhesive-free bond (AFB®) laser composites. Single crystal bars and AFB bonded crystal doublets with the combinations of various rare-earth (Nd3+, Yb3+, Er3+, and Tm3+ trivalent ion doped YAG, and un-doped YAG have been fabricated with the AFB technique. By loading the test sample in a vacuum cryostat, with a precisely controlled heat load at one end of the doublets, the temperature distribution inside the single crystal or the composite samples can been precisely mapped by measuring the optical path difference interferometrically, given the material's thermal-optical properties. No measurable heat transfer resistance can be identified for the AFB interfaces between low-concentration doped YAG and un-doped YAG. For the heavily doped RE3+:YAG, for example, 10% Yb:YAG, the thermal conductivity measured in our experiment is 8.3 W/m•K, using the thermal conductivity of undoped YAG reported in [1] as basis. The thermal transfer resistance of the AFB interface with un-doped YAG, if there is any at the AFB interface, could be less than 1.29×10-6 m2•K/W.

Ultrasonic infrared thermal wave nondestructive evaluation for crack detection of several aerospace materials

NASA Astrophysics Data System (ADS)

Xu, Weichao; Shen, Jingling; Zhang, Cunlin; Tao, Ning; Feng, Lichun

2008-03-01

The applications of ultrasonic infrared thermal wave nondestructive evaluation for crack detection of several materials, which often used in aviation alloy. For instance, steel and carbon fiber. It is difficult to test cracks interfacial or vertical with structure's surface by the traditional nondestructive testing methods. Ultrasonic infrared thermal wave nondestructive testing technology uses high-power and low-frequency ultrasonic as heat source to excite the sample and an infrared video camera as a detector to detect the surface temperature. The ultrasonic emitter launch pulses of ultrasonic into the skin of the sample, which causes the crack interfaces to rub and dissipate energy as heat, and then caused local increase in temperature at one of the specimen surfaces. The infrared camera images the returning thermal wave reflections from subsurface cracks. A computer collects and processes the thermal images according to different properties of samples to get the satisfied effect. In this paper, a steel plate with fatigue crack we designed and a juncture of carbon fiber composite that has been used in a space probe were tested and get satisfying results. The ultrasonic infrared thermal wave nondestructive detection is fast, sensitive for cracks, especially cracks that vertical with structure's surface. It is significative for nondestructive testing in manufacture produce and application of aviation, cosmography and optoelectronics.

Dynamics of melt crystal interface and thermal stresses in rotational Bridgman crystal growth process

NASA Astrophysics Data System (ADS)

Ma, Ronghui; Zhang, Hui; Larson, David J.; Mandal, Krishna C.

2004-05-01

The growth process of potassium bromide (KBr) single crystals in a vertical Bridgman furnace has been studied numerically using an integrated model that combines formulation of global heat transfer and thermal elastic stresses. The global heat transfer sub-model accounts for conduction, convection and interface movement in the multiphase system. Using the elastic stress sub-model, thermal stresses in the growing crystal caused by the non-uniform temperature distribution is predicted. Special attention is directed to the interaction between the crystal and the ampoule. The global temperature distribution in the furnace, the flow pattern in the melt and the interface shapes are presented. We also investigate the effects of the natural convection and rotational forced convection on the shape of the growth fronts. Furthermore, the state of the thermal stresses in the crystal is studied to understand the plastic deformation mechanisms during the cooling process. The influence of the wall contact on thermal stresses is also addressed.

Hydro-Thermal Fatigue Resistance Measurements on Polymer Interfaces

NASA Astrophysics Data System (ADS)

Gurumurthy, Charan K.; Kramer, Edward J.; Hui, Chung-Yuen

1998-03-01

We have developed a new technique based on a fiber optic displacement sensor for rapid determination of hydro-thermal fatigue crack growth rate per cycle (da/dN) of an epoxy/polyimide interface used in flip chip attach microelectronic assembly. The sample is prepared as a trilayered cantilever beam by capillary flow of the epoxy underfill over a polyimide coated metallic beam. During hydro-thermal cycling the crack growth along the interface (from the free end) changes the displacement of this end of the beam and we measure the free end displacement at the lowest temperature in each hydro-thermal cycle. The change in beam displacement is then converted into crack growth rate (da/dN). da/dN depends on the maximum change in the strain energy release rate of the crack and the phase angle in each cycle. The relation between da/dN and maximum strain energy release rate characterizes the fatigue crack growth resistance of the interface. We have developed and used a simple model anhydride cured and a commercially available PMDA/ODA passivation for this study.

The role of process history, phase morphology and interface strength upon the mechanical properties of dispersion strengthened alloys

NASA Technical Reports Server (NTRS)

Ansell, G. S.

1972-01-01

An analytical rationale for the sensitivity-insensitivity of dispersion-strengthened systems to process history is provided. In particular, the research was focussed upon the influence of the particle-matrix interface bond in TD-Nickel and TD-Nichrome, and the manner in which the differences in both elastic constants and thermal expansion coefficients between these phases stress this interface when these alloys are subjected to mechanical and thermal loads upon the mechanical properties of these alloys.

Epitaxial CdSe-Au nanocrystal heterostructures by thermal annealing.

PubMed

Figuerola, Albert; van Huis, Marijn; Zanella, Marco; Genovese, Alessandro; Marras, Sergio; Falqui, Andrea; Zandbergen, Henny W; Cingolani, Roberto; Manna, Liberato

2010-08-11

The thermal evolution of a collection of heterogeneous CdSe-Au nanosystems (Au-decorated CdSe nanorods, networks, vertical assemblies) prepared by wet-chemical approaches was monitored in situ in the transmission electron microscope. In contrast to interfaces that are formed during kinetically controlled wet chemical synthesis, heating under vacuum conditions results in distinct and well-defined CdSe/Au interfaces, located at the CdSe polar surfaces. The high quality of these interfaces should make the heterostructures more suitable for use in nanoscale electronic devices.

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment.

PubMed

Jeong, Seung Hee; Chen, Si; Huo, Jinxing; Gamstedt, Erik Kristofer; Liu, Johan; Zhang, Shi-Li; Zhang, Zhi-Bin; Hjort, Klas; Wu, Zhigang

2015-12-16

Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor.

An analytical approach to thermal modeling of Bridgman-type crystal growth. I - One-dimensional analysis

NASA Technical Reports Server (NTRS)

Naumann, R. J.

1982-01-01

A relatively simple one-dimensional thermal model of the Bridgman growth process has been developed which is applicable to the growth of small diameter samples with conductivities similar to those of metallic alloys. The heat flow in a translating rod is analyzed in a way that is applicable to Biot numbers less than unity. The model accommodates an adiabatic zone, different heat transfer coefficients in the hot and cold zones, and changes in sample material properties associated with phase change. The analysis is applied to several simplified cases. The effect of the rod's motion is studied in a three-zone furnace for a rod sufficiently long that end effects can be neglected; end effects are then investigated for a motionless rod. Finally, the addition of a fourth zone, an independently controlled booster heater between the main heater and the adiabatic zone, is evaluated for its ability to increase the gradient in the sample at the melt interface and to control the position of the interface.

Numerical analysis of melt-solid interface shapes and growth rates of gallium antimonide in a single-zone vertical Bridgman furnace

NASA Astrophysics Data System (ADS)

Dutta, P. S.; Bhat, H. L.; Kumar, Vikram

1995-09-01

Numerical analysis has been carried out to determine the deviation of the growth rate from the ampoule lowering rate and the shape of the isotherms during the growth of gallium antimonide using the vertical Bridgman technique in a single-zone furnace. Electrical analogues have been used to model the thermal behaviour of the growth system. The standard circuit analysis technique has been used to calculate the temperature distribution in the growing crystal under various growth conditions. The effects of furnace temperature gradient near the melt-solid interface, the ampoule lowering rate, the ampoule geometry, the thermal conductivity of the melt, the mode of heat extraction from the tip of the ampoule and the extent of lateral heat loss from the side walls of the ampoule on the shape of isotherms in the crystal have been evaluated. The theoretical results presented here agree well with our previously obtained experimental results.

Nonlocal thermal transport across embedded few-layer graphene sheets

DOE PAGES

Liu, Ying; Huxtable, Scott T.; Yang, Bao; ...

2014-11-13

Thermal transport across the interfaces between few-layer graphene sheets and soft materials exhibits intriguing anomalies when interpreted using the classical Kapitza model, e.g., the conductance of the same interface differs greatly for different modes of interfacial thermal transport. Using atomistic simulations, we show that such thermal transport follows a nonlocal flux-temperature drop constitutive law and is characterized jointly by a quasi-local conductance and a nonlocal conductance instead of the classical Kapitza conductance. Lastly, the nonlocal model enables rationalization of many anomalies of the thermal transport across embedded few-layer graphene sheets and should be used in studies of interfacial thermal transportmore » involving few-layer graphene sheets or other ultra-thin layered materials.« less

Interfacial Effects on the Thermal and Mechanical Properties of Graphite/Copper Composites. Final Contractor Report Ph.D. Thesis

NASA Technical Reports Server (NTRS)

Devincent, Sandra Marie

1995-01-01

Graphite surfaces are not wet by pure copper. This lack of wetting has been responsible for a debonding phenomenon that has been found in continuous graphite fiber reinforced copper matrix composites subjected to elevated temperatures. By suitably alloying copper, its ability to wet graphite surfaces can be enhanced. Information obtained during sessile drop testing has led to the development of a copper-chromium alloy that suitably wets graphite. Unidirectionally reinforced graphite/copper composites have been fabricated using a pressure infiltration casting procedure. P100 pitch-based fibers have been used to reinforce copper and copper-chromium alloys. X-ray radiography and optical microscopy have been used to assess the fiber distribution in the cast composites. Scanning electron microscopy and Auger electron spectroscopy analyses were conducted to study the distribution and continuity of the chromium carbide reaction phase that forms at the fiber/matrix interface in the alloyed matrix composites. The effects of the chromium in the copper matrix on the mechanical and thermal properties of P100Gr/Cu composites have been evaluated through tensile testing, three-point bend testing, thermal cycling and thermal conductivity calculations. The addition of chromium has resulted in an increased shear modulus and essentially zero thermal expansion in the P100Gr/Cu-xCr composites through enhanced fiber/matrix bonding. The composites have longitudinal tensile strengths in excess of 700 MPa with elastic moduli of 393 GPa. After 100 hr at 760 deg C 84 percent of the as-cast strength is retained in the alloyed matrix composites. The elastic moduli are unchanged by the thermal exposure. It has been found that problems with spreading of the fiber tows strongly affect the long transverse tensile properties and the short transverse thermal conductivity of the P100Gr/Cu-xCr composites. The long transverse tensile strength is limited by rows of touching fibers which are paths of easy crack propagation under low tensile loads. The short transverse thermal conductivity is dictated by the fiber/matrix interface. Conduction across this interface has been estimated to be two orders of magnitude lower than that across the composite. This is due to the mechanical, and not chemical, nature of Gr/Cu bond.

Evaluation of the effects of implant materials and designs on thermal necrosis of bone in cemented hip arthroplasty.

PubMed

Li, Chaodi; Kotha, Shiva; Mason, James

2003-01-01

The exothermic polymerization of bone cement may induce thermal necrosis of bone in cemented hip arthroplasty. A finite element formulation was developed to predict the evolution of the temperature with time in the cemented hip replacement system. The developed method is capable of taking into account both the chemical reaction that generates heat during bone cement polymerization (through a kinetic model) and the physical process of heat conduction (with an energy balance equation). The possibility of thermal necrosis of bone was then evaluated based on the temperature history in the bone and an appropriate damage criterion. Specifically, we evaluate the role of implant materials and designs on the thermal response of the system. Results indicated that the peak temperature at the bone/cement interface with a metal prosthesis was lower than that with a polymer or a composite prosthesis in hip replacement systems. Necrosis of bone was predicted to occur with a polymer or a composite prosthesis while no necrosis was predicted with a metal prosthesis in the simulated conditions. When reinforcing osteoporotic hips with injected bone cement in the cancellous core of the femur, the volume of bone cement implanted is increased which may increase the risk of thermal necrosis of bone. We evaluate whether this risk can be decreased through the use of an insulator to contain the bone cement. No thermal necrosis of bone was predicted with a 3 mm thick polyurethane insulator while more damage is predicted for the use of bone cement without the insulator. This method provides a numerical tool for the quantitative simulation of the thermal behavior of bone-cement-prosthesis designs and for examining and refining new designs computationally.

Interface structure and properties of CNTs/Cu composites fabricated by electroless deposition and spark plasma sintering

NASA Astrophysics Data System (ADS)

Wang, Hu; Zhang, Zhao-Hui; Hu, Zheng-Yang; Song, Qi; Yin, Shi-Pan

2018-01-01

In this paper, we fabricated a novel copper matrix composites reinforced by carbon nanotubes (CNTs) using electroless deposition (ED) and spark plasma sintering technique. Microstructure, mechanical, electric conductivity, and thermal properties of the CNTs/Cu composites were investigated. The results show that a favorable interface containing C-O and O-Cu bond was formed between CNTs and matrix when the CNTs were coated with nano-Cu by ED method. Thus, we accomplished the uniformly dispersed CNTs in the CNTs/Cu powders and compacted composites, which eventually leads to the enhancement of the mechanical properties of the CNTs/Cu composites in the macro-scale environment. However, the interface structure can hinder the movement of carriers and free electrons and increase the interface thermal resistance, which leads to modest decrease of electrical and thermal conductivity of the CNTs/Cu composites.

Steady-state low thermal resistance characterization apparatus: The bulk thermal tester

DOE Office of Scientific and Technical Information (OSTI.GOV)

Burg, Brian R.; Kolly, Manuel; Blasakis, Nicolas

The reliability of microelectronic devices is largely dependent on electronic packaging, which includes heat removal. The appropriate packaging design therefore necessitates precise knowledge of the relevant material properties, including thermal resistance and thermal conductivity. Thin materials and high conductivity layers make their thermal characterization challenging. A steady state measurement technique is presented and evaluated with the purpose to characterize samples with a thermal resistance below 100 mm{sup 2} K/W. It is based on the heat flow meter bar approach made up by two copper blocks and relies exclusively on temperature measurements from thermocouples. The importance of thermocouple calibration is emphasizedmore » in order to obtain accurate temperature readings. An in depth error analysis, based on Gaussian error propagation, is carried out. An error sensitivity analysis highlights the importance of the precise knowledge of the thermal interface materials required for the measurements. Reference measurements on Mo samples reveal a measurement uncertainty in the range of 5% and most accurate measurements are obtained at high heat fluxes. Measurement techniques for homogeneous bulk samples, layered materials, and protruding cavity samples are discussed. Ultimately, a comprehensive overview of a steady state thermal characterization technique is provided, evaluating the accuracy of sample measurements with thermal resistances well below state of the art setups. Accurate characterization of materials used in heat removal applications, such as electronic packaging, will enable more efficient designs and ultimately contribute to energy savings.« less

Fracture mechanics analysis for various fiber/matrix interface loadings

NASA Technical Reports Server (NTRS)

Naik, R. A.; Crews, J. H., Jr.

1991-01-01

Fiber/matrix (F/M) cracking was analyzed to provide better understanding and guidance in developing F/M interface fracture toughness tests. Two configurations, corresponding to F/M cracking at a broken fiber and at the free edge, were investigated. The effects of mechanical loading, thermal cooldown, and friction were investigated. Each configuration was analyzed for two loadings: longitudinal and normal to the fiber. A nonlinear finite element analysis was performed to model friction and slip at the F/M interface. A new procedure for fitting a square-root singularity to calculated stresses was developed to determine stress intensity factors (K sub I and K sub II) for a bimaterial interface crack. For the case of F/M cracking at a broken fiber with longitudinal loading, crack tip conditions were strongly influenced by interface friction. As a result, an F/M interface toughness test based on this case was not recommended because nonlinear data analysis methods would be required. For the free edge crack configuration, both mechanical and thermal loading caused crack opening, thereby avoiding frictional effects. A F/M interface toughness test based on this configuration would provide data for K(sub I)/K(sub II) ratios of about 0.7 and 1.6 for fiber and radial normal loading, respectively. However, thermal effects must be accounted for in the data analysis.

Fracture mechanics analysis for various fiber/matrix interface loadings

NASA Technical Reports Server (NTRS)

Naik, Rajiv A.; Crews, John H., Jr.

1992-01-01

Fiber/matrix (F/M) cracking was analyzed to provide better understanding and guidance in developing F/M interface fracture toughness tests. Two configurations, corresponding to F/M cracking at a broken fiber and at the free edge, were investigated. The effects of mechanical loading, thermal cooldown, and friction were investigated. Each configuration was analyzed for two loadings: longitudinal and normal to the fiber. A nonlinear finite element analysis was performed to model friction and slip at the F/M interface. A new procedure for fitting a square-root singularity to calculated stresses was developed to determine stress intensity factors (K sub I and K sub II) for a bimaterial interface crack. For the case of F/M cracking at a broken fiber with longitudinal loading, crack tip conditions were strongly influenced by interface friction. As a result, an F/M interface toughness test based on this case was not recommended because nonlinear data analysis methods would be required. For the free edge crack configuration, both mechanical and thermal loading caused crack opening, theory avoiding fractional effects. A F/M interface toughness test based on this configuration would provide data for K(sub I/K(sub II) ratios of about 0.7 and 1.6 for fiber and radial normal loading, respectively. However, thermal effects must be accounted for in the data analysis.

Fracture mechanics analysis for various fiber/matrix interface loadings

NASA Technical Reports Server (NTRS)

Naik, R. A.; Crews, J. H., Jr.

1991-01-01

Fiber/matrix (F/M) cracking was analyzed to provide better understanding and guidance in developing F/M interface fracture toughness tests. Two configurations, corresponding to F/M cracking at a broken fiber and at the free edge, were investigated. The effects of mechanical loading, thermal cooldown, and friction were investigated. Each configuration was analyzed for two loadings: longitudinal and normal to the fiber. A nonlinear finite element analysis was performed to model friction and slip at the F/M interface. A new procedure for fitting a square-root singularity to calculated stresses was developed to determine stress intensity factors (K sub I and K sub II) for a bimaterial interface crack. For the case of F/M cracking at a broken fiber with longitudinal loading, crack tip conditions were strongly influenced by interface friction. As a result, an F/M interface toughness test based on this case was not recommended because nonlinear data analysis methods would be required. For the free edge crack configuration, both mechanical and thermal loading caused crack opening, thereby avoiding frictional effects. An F/M interface toughness test based on this configuration would provide data for K(sub I)/K(sub II) ratios of about 0.7 and 1.6 for fiber and radial normal loading, respectively. However, thermal effects must be accounted for in the data analysis.

Role of fluttering dislocations in the thermal interface resistance between a silicon crystal and plastic solid 4He

NASA Astrophysics Data System (ADS)

Amrit, Jay; Ramiere, Aymeric; Volz, Sebastian

2018-01-01

A quantum solid (solid 4He) in contact with a classical solid defines a new class of interfaces. In addition to its quantum nature, solid 4He is indeed a very plastic medium. We examine the thermal interface resistance upon solidification of superfluid 4He in contact with a silicon crystal surface (111) and show that dislocations play a crucial role in the thermal interface transport. The growth of solid 4He and the measurements are conducted at the minimum of the melting curve of helium (0.778 K and ˜25 bar ). The results display a first-order transition in the Kapitza resistance from a value of RK ,L=(80 ±8 ) c m2K /W at a pressure of 24.5 bar to a value of RK ,S=(41.7 ±8 ) c m2K /W after the formation of solid helium at ˜25.2 bar . The drop in RK ,S is only of a factor of ˜2 , although transverse phonon modes in solid 4He now participate in heat transmission at the interface. We provide an explanation for the measured RK ,S by considering the interaction of thermal phonons with vibrating dislocations in solid 4He. We demonstrate that this mechanism, also called fluttering, induces a thermal resistance RF l∝NdT-6 , where T is the temperature and Nd is the density of dislocations. We estimate that for dislocation densities on the order of ˜107c m-2 , RF l predominates over the boundary resistance RK ,S. These fundamental findings shed light on the role of dislocations and provide a quantitative explanation for previous experiments which showed no measurable change in the Kapitza resistance between Cu and superfluid 4He upon solidification of the latter. This demonstrates the possibility of using dislocations as an additional means to tailor thermal resistances at interfaces, formed especially with a plastic material.

Bilayer Suspension Plasma-Sprayed Thermal Barrier Coatings with Enhanced Thermal Cyclic Lifetime: Experiments and Modeling

NASA Astrophysics Data System (ADS)

Gupta, Mohit; Kumara, Chamara; Nylén, Per

2017-08-01

Suspension plasma spraying (SPS) has been shown as a promising process to produce porous columnar strain tolerant coatings for thermal barrier coatings (TBCs) in gas turbine engines. However, the highly porous structure is vulnerable to crack propagation, especially near the topcoat-bondcoat interface where high stresses are generated due to thermal cycling. A topcoat layer with high toughness near the topcoat-bondcoat interface could be beneficial to enhance thermal cyclic lifetime of SPS TBCs. In this work, a bilayer coating system consisting of first a dense layer near the topcoat-bondcoat interface followed by a porous columnar layer was fabricated by SPS using Yttria-stabilised zirconia suspension. The objective of this work was to investigate if the bilayer topcoat architecture could enhance the thermal cyclic lifetime of SPS TBCs through experiments and to understand the effect of the column gaps/vertical cracks and the dense layer on the generated stresses in the TBC during thermal cyclic loading through finite element modeling. The experimental results show that the bilayer TBC had significantly higher lifetime than the single-layer TBC. The modeling results show that the dense layer and vertical cracks are beneficial as they reduce the thermally induced stresses which thus increase the lifetime.

Thermal Improvement and Stability of Si3N4/GeNx/p- and n-Ge Structures Prepared by Electron-Cyclotron-Resonance Plasma Nitridation and Sputtering at Room Temperature

NASA Astrophysics Data System (ADS)

Fukuda, Yukio; Okamoto, Hiroshi; Iwasaki, Takuro; Izumi, Kohei; Otani, Yohei; Ishizaki, Hiroki; Ono, Toshiro

2012-09-01

This paper reports on the thermal improvement of Si3N4/GeNx/Ge structures. After the Si3N4 (5 nm)/GeNx (2 nm) stacks were prepared on Ge substrates by electron-cyclotron-resonance plasma nitridation and sputtering at room temperature, they were thermally annealed in atmospheric N2 + 10% H2 ambient at temperatures from 400 to 600 °C. It was demonstrated that the electronic properties of the GeNx/Ge interfaces were thermally improved at temperatures of up to 500 °C with a minimum interface trap density (Dit) of ˜1×1011 cm-2 eV-1 near the Ge midgap, whereas the interface properties were slightly degraded after annealing at 600 °C with a minimum Dit value of ˜4×1011 cm-2 eV-1.

A gigantically increased ratio of electrical to thermal conductivity and synergistically enhanced thermoelectric properties in interface-controlled TiO2-RGO nanocomposites.

PubMed

Nam, Woo Hyun; Lim, Young Soo; Kim, Woochul; Seo, Hyeon Kook; Dae, Kyun Seong; Lee, Soonil; Seo, Won-Seon; Lee, Jeong Yong

2017-06-14

We report synergistically enhanced thermoelectric properties through the independently controlled charge and thermal transport properties in a TiO 2 -reduced graphene oxide (RGO) nanocomposite. By the consolidation of TiO 2 -RGO hybrid powder using spark plasma sintering, we prepared an interface-controlled TiO 2 -RGO nanocomposite where its grain boundaries are covered with the RGO network. Both the enhancement in electrical conductivity and the reduction in thermal conductivity were simultaneously achieved thanks to the beneficial effects of the RGO network, and detailed mechanisms are discussed. This led to the gigantic increase in the ratio of electrical to thermal conductivity by six orders of magnitude and also the synergistic enhancement in the thermoelectric figure of merit by two orders. Our results present a strategy for the realization of 'phonon-glass electron-crystals' through interface control using graphene in graphene hybrid thermoelectric materials.

Ceramic blade with tip seal

DOEpatents

Glezer, Boris; Bhardwaj, Narender K.; Jones, Russell B.

1997-01-01

The present gas turbine engine (10) includes a disc assembly (64) defining a disc (66) having a plurality of blades (70) attached thereto. The disc (66) has a preestablished rate of thermal expansion and the plurality of blades have a preestablished rate of thermal expansion being less than the preestablished rate of thermal expansion of the disc (66). A shroud assembly (100) is attached to the gas turbine engine (10) and is spaced from the plurality of blades (70) a preestablished distance forming an interface (108) therebetween. Positioned in the interface is a seal (110) having a preestablished rate of thermal expansion being generally equal to the rate of thermal expansion of the plurality of blades (70).

Interfacing superhydrophobic silica nanoparticle films with graphene and thermoplastic polyurethane for wear/abrasion resistance.

PubMed

Naderizadeh, Sara; Athanassiou, Athanassia; Bayer, Ilker S

2018-06-01

Nanoparticle films are one of the most suitable platforms for obtaining sub-micrometer and nanometer dual-scale surface texture required for liquid repellency. The assembly of superhydrophobic nanoparticles into conformal and strongly adherent films having abrasion-induced wear resistance still poses a significant challenge. Various techniques have been developed over the years to render nanoparticle films with good liquid repellent properties and transparency. However, forming abrasion resistant superhydrophobic nanoparticle films on hard surfaces is challenging. One possibility is to partially embed or weld nanoparticles in thin thermoplastic primers applied over metals. Hexamethyldisilazane-functionalized fumed silica nanoparticle films spray deposited on aluminum surfaces were rendered abrasion resistant by thermally welding them into thermoplastic polyurethane (TPU) primer applied a priori over aluminum. Different solvents, nanoparticle concentrations and annealing temperatures were studied to optimize nanoparticle film morphology and hydrophobicity. Thermal annealing at 150 °C enhanced stability and wear resistance of nanoparticle films. A thin thermal interface layer of graphene nanoplatelets (GnPs) between the primer and the nanoparticle film significantly improved superhydrophobic wear resistance after annealing. As such, superhydrophobic nanocomposite films with the GnPs thermal interface layer displayed superior abrasion-induced wear resistance under 20 kPa compared to films having no GnPs-based thermal interface. Copyright © 2018 Elsevier Inc. All rights reserved.

Diamond-based heat spreaders for power electronic packaging applications

NASA Astrophysics Data System (ADS)

Guillemet, Thomas

As any semiconductor-based devices, power electronic packages are driven by the constant increase of operating speed (higher frequency), integration level (higher power), and decrease in feature size (higher packing density). Although research and innovation efforts have kept these trends continuous for now more than fifty years, the electronic packaging technology is currently facing a challenge that must be addressed in order to move toward any further improvements in terms of performances or miniaturization: thermal management. Thermal issues in high-power packages strongly affect their reliability and lifetime and have now become one of the major limiting factors of power modules development. Thus, there is a strong need for materials that can sustain higher heat flux levels while safely integrating into the electronic package architecture. In such context, diamond is an attractive candidate because of its outstanding thermal conductivity, low thermal expansion, and high electrical resistivity. Its low heat capacity relative to metals such as aluminum or copper makes it however preferable for heat spreading applications (as a heat-spreader) rather than for dissipating the heat flux itself (as a heat sink). In this study, a dual diamond-based heat-spreading solution is proposed. Polycrystalline diamond films were grown through laser-assisted combustion synthesis on electronic substrates (in the U.S) while, in parallel, diamond-reinforced copper-matrix composite films were fabricated through tape casting and hot pressing (in France). These two types of diamond-based heat-spreading films were characterized and their microstructure and chemical composition were related to their thermal performances. Particular emphasize was put on the influence of interfaces on the thermal properties of the materials, either inside a single material (grain boundaries) or between dissimilar materials (film/substrate interface, matrix/reinforcement interface). Finally, the packaging potential of the two heat-spreading solutions invoked was evaluated. This study was carried out within the framework of a French-American collaboration between the Electrical Engineering department of the University of Nebraska-Lincoln (United States, U.S.) and the Institute of Condensed Matter Chemistry of the University of Bordeaux (France). This study was financed by the Office of Naval Research in the U.S., and by the Region Aquitaine in France.

Rapid screening of pharmaceutical drugs using thermal desorption - SALDI mass spectrometry

NASA Astrophysics Data System (ADS)

Grechnikov, A. A.; Kubasov, A. E.; Georgieva, V. B.; Borodkov, A. S.; Nikiforov, S. M.; Simanovsky, Ya O.; Alimpiev, S. S.

2012-12-01

A novel approach to the rapid screening of pharmaceutical drugs by surface assisted laser desorption-ionization (SALDI) mass spectrometry with the rotating ball interface coupled with temperature programmed thermal desorption has been developed. Analytes were thermally desorbed and deposited onto the surface of amorphous silicon substrate attached to the rotating ball. The ball was rotated and the deposited analytes were analyzed using SALDI. The effectiveness of coupling SALDI mass spectrometry with thermal desorption was evaluated by the direct and rapid analysis of tablets containing lidocaine, diphenhydramine and propranolol without any sample pretreatment. The overall duration of the screening procedure was 30÷40 sec. Real urine samples were studied for drug analysis. It is shown that with simple preparation steps, urine samples can be quantitatively analyzed using the proposed technique with the detection limits in the range of 0.2÷0.5 ng/ml.

Phonon cross-plane transport and thermal boundary resistance: effect of heat source size and thermal boundary resistance on phonon characteristics

NASA Astrophysics Data System (ADS)

Ali, H.; Yilbas, B. S.

2016-09-01

Phonon cross-plane transport across silicon and diamond thin films pair is considered, and thermal boundary resistance across the films pair interface is examined incorporating the cut-off mismatch and diffusive mismatch models. In the cut-off mismatch model, phonon frequency mismatch for each acoustic branch is incorporated across the interface of the silicon and diamond films pair in line with the dispersion relations of both films. The frequency-dependent and transient solution of the Boltzmann transport equation is presented, and the equilibrium phonon intensity ratios at the silicon and diamond film edges are predicted across the interface for each phonon acoustic branch. Temperature disturbance across the edges of the films pair is incorporated to assess the phonon transport characteristics due to cut-off and diffusive mismatch models across the interface. The effect of heat source size, which is allocated at high-temperature (301 K) edge of the silicon film, on the phonon transport characteristics at the films pair interface is also investigated. It is found that cut-off mismatch model predicts higher values of the thermal boundary resistance across the films pair interface as compared to that of the diffusive mismatch model. The ratio of equilibrium phonon intensity due to the cut-off mismatch over the diffusive mismatch models remains >1 at the silicon edge, while it becomes <1 at the diamond edge for all acoustic branches.

Heat-transport mechanisms in molecular building blocks of inorganic/organic hybrid superlattices

NASA Astrophysics Data System (ADS)

Giri, Ashutosh; Niemelä, Janne-Petteri; Tynell, Tommi; Gaskins, John T.; Donovan, Brian F.; Karppinen, Maarit; Hopkins, Patrick E.

2016-03-01

Nanomaterial interfaces and concomitant thermal resistances are generally considered as atomic-scale planes that scatter the fundamental energy carriers. Given that the nanoscale structural and chemical properties of solid interfaces can strongly influence this thermal boundary conductance, the ballistic and diffusive nature of phonon transport along with the corresponding phonon wavelengths can affect how energy is scattered and transmitted across an interfacial region between two materials. In hybrid composites composed of atomic layer building blocks of inorganic and organic constituents, the varying interaction between the phononic spectrum in the inorganic crystals and vibronic modes in the molecular films can provide a new avenue to manipulate the energy exchange between the fundamental vibrational energy carriers across interfaces. Here, we systematically study the heat transfer mechanisms in hybrid superlattices of atomic- and molecular-layer-grown zinc oxide and hydroquinone with varying thicknesses of the inorganic and organic layers in the superlattices. We demonstrate ballistic energy transfer of phonons in the zinc oxide that is limited by scattering at the zinc oxide/hydroquinone interface for superlattices with a single monolayer of hydroquinone separating the thicker inorganic layers. The concomitant thermal boundary conductance across the zinc oxide interfacial region approaches the maximal thermal boundary conductance of a zinc oxide phonon flux, indicative of the contribution of long wavelength vibrations across the aromatic molecular monolayers in transmitting energy across the interface. This transmission of energy across the molecular interface decreases considerably as the thickness of the organic layers are increased.

Thermal analysis of Bridgman-Stockbarger growth. [mercury cadmium telluride single crystals

NASA Technical Reports Server (NTRS)

Knopf, F. W.

1979-01-01

A thermal analysis of a cylindrical HgCdTe sample in a Bridgman-Stockbarger crystal growth configuration was conducted with emphasis on the thermal profile, interface shape and position, and the thermal gradients at the liquid-solid interface. Alloys of HgTe and CdTe with compositions approximating 20 percent CdTe, 80 percent HgTe were used. This composition results in a bandgap suited for the detection of 10.6 micron CO2 radiation. The sensitivity of the sample thermal characteristics to important growth parameters, such as thermal diffusivities, thermal conductivities, furnace temperature profile, ampoule dimensions, and growth velocity was assessed. Numerical techniques and associated computational models necessary to analyze the heat transfer process within the sample and the Bridgman-Stockbarger boundary conditions were developed. This thermal analysis mode was programmed in FORTRAN V, and is currently operational on the MSFC Univac 1100 system.

Interface thermal resistance of nanostructured FeCoCu film and Si substrate

NASA Astrophysics Data System (ADS)

Nikolaenko, Yuri M.; Medvedev, Yuri V.; Genenko, Yuri A.; Ghafari, Mohammad; Hahn, Horst

2006-05-01

Results of measurement of thermal resistance (RFS ) of film substrate interface of 10 nm (Fe1-x Cox )1-y Cuy film on Si substrate with 50 nm SiO2 sublayer are presented. The estimated magnitude is two orders greater then RFS of epitaxial manganite films on StTiO3 substrate with and without sublayer. The significant increase of RFS is explained by granular structure of film with average size of grain about 10 nm. In this case the additional thermal barier in the film-substrate interface is appeared. It provides the change of regime of phonons propagation from ballistic to diffusion one. The principle possibility of variation of RFS in wide range as a task of nanotechnology is discussed.

Interfacial phonon scattering and transmission loss in > 1 µm thick silicon-on-insulator thin films

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jiang, Puqing; Lindsay, Lucas R.; Huang, Xi

Scattering of phonons at boundaries of a crystal (grains, surfaces, or solid/solid interfaces) is characterized by the phonon wavelength, the angle of incidence, and the interface roughness, as historically evaluated using a specularity parameter p formulated by Ziman [Electrons and Phonons (Clarendon Press, Oxford, 1960)]. This parameter was initially defined to determine the probability of a phonon specularly reflecting or diffusely scattering from the rough surface of a material. The validity of Ziman's theory as extended to solid/solid interfaces has not been previously validated. Here, to better understand the interfacial scattering of phonons and to test the validity of Ziman'smore » theory, we precisely measured the in-plane thermal conductivity of a series of Si films in silicon-on-insulator (SOI) wafers by time-domain thermoreflectance (TDTR) for a Si film thickness range of 1–10 μm and a temperature range of 100–300 K. The Si/SiO 2 interface roughness was determined to be 0.11±0.04nm using transmission electron microscopy (TEM). Furthermore, we compared our in-plane thermal conductivity measurements to theoretical calculations that combine first-principles phonon transport with Ziman's theory. Calculations using Ziman's specularity parameter significantly overestimate values from the TDTR measurements. We attribute this discrepancy to phonon transmission through the solid/solid interface into the substrate, which is not accounted for by Ziman's theory for surfaces. The phonons that are specularly transmitted into an amorphous layer will be sufficiently randomized by the time they come back to the crystalline Si layer, the effect of which is practically equivalent to a diffuse reflection at the interface. Finally, we derive a simple expression for the specularity parameter at solid/amorphous interfaces and achieve good agreement between calculations and measurement values.« less

Interfacial phonon scattering and transmission loss in > 1 µm thick silicon-on-insulator thin films

DOE PAGES

Jiang, Puqing; Lindsay, Lucas R.; Huang, Xi; ...

2018-05-17

Scattering of phonons at boundaries of a crystal (grains, surfaces, or solid/solid interfaces) is characterized by the phonon wavelength, the angle of incidence, and the interface roughness, as historically evaluated using a specularity parameter p formulated by Ziman [Electrons and Phonons (Clarendon Press, Oxford, 1960)]. This parameter was initially defined to determine the probability of a phonon specularly reflecting or diffusely scattering from the rough surface of a material. The validity of Ziman's theory as extended to solid/solid interfaces has not been previously validated. Here, to better understand the interfacial scattering of phonons and to test the validity of Ziman'smore » theory, we precisely measured the in-plane thermal conductivity of a series of Si films in silicon-on-insulator (SOI) wafers by time-domain thermoreflectance (TDTR) for a Si film thickness range of 1–10 μm and a temperature range of 100–300 K. The Si/SiO 2 interface roughness was determined to be 0.11±0.04nm using transmission electron microscopy (TEM). Furthermore, we compared our in-plane thermal conductivity measurements to theoretical calculations that combine first-principles phonon transport with Ziman's theory. Calculations using Ziman's specularity parameter significantly overestimate values from the TDTR measurements. We attribute this discrepancy to phonon transmission through the solid/solid interface into the substrate, which is not accounted for by Ziman's theory for surfaces. The phonons that are specularly transmitted into an amorphous layer will be sufficiently randomized by the time they come back to the crystalline Si layer, the effect of which is practically equivalent to a diffuse reflection at the interface. Finally, we derive a simple expression for the specularity parameter at solid/amorphous interfaces and achieve good agreement between calculations and measurement values.« less

Reaction of amorphous/crystalline SiOC/Fe interfaces by thermal annealing

DOE PAGES

Su, Qing; Zhernenkov, Mikhail; Ding, Hepeng; ...

2017-06-12

The development of revolutionary new alloys and composites is crucial to meeting materials requirements for next generation nuclear reactors. The newly developed amorphous silicon oxycarbide (SiOC) and crystalline Fe composite system has shown radiation tolerance over a wide range of temperatures. To advance understanding of this new composite, we investigate the structure and thermal stability of the interface between amorphous SiOC and crystalline Fe by combining various experimental techniques and simulation methods. We show that the SiOC/Fe interface is thermally stable up to at least 400 °C. When the annealing temperature reaches 600 °C, an intermixed region forms at thismore » interface. This region appears to be a crystalline phase that forms an incoherent interface with the Fe layer. Density functional theory (DFT) Molecular dynamics (MD) is performed on the homogeneous SiFeOC phase to study the early stages of 2 formation of the intermixed layer. Both experimental and simulation results suggest this phase has the fayalite crystal structure. As a result, the physical processes involved in the formation of the intermixed region are discussed.« less

Reconstruction of phonon relaxation times from systems featuring interfaces with unknown properties

NASA Astrophysics Data System (ADS)

Forghani, Mojtaba; Hadjiconstantinou, Nicolas G.

2018-05-01

We present a method for reconstructing the phonon relaxation-time function τω=τ (ω ) (including polarization) and associated phonon free-path distribution from thermal spectroscopy data for systems featuring interfaces with unknown properties. Our method does not rely on the effective thermal-conductivity approximation or a particular physical model of the interface behavior. The reconstruction is formulated as an optimization problem in which the relaxation times are determined as functions of frequency by minimizing the discrepancy between the experimentally measured temperature profiles and solutions of the Boltzmann transport equation for the same system. Interface properties such as transmissivities are included as unknowns in the optimization; however, because for the thermal spectroscopy problems considered here the reconstruction is not very sensitive to the interface properties, the transmissivities are only approximately reconstructed and can be considered as byproducts of the calculation whose primary objective is the accurate determination of the relaxation times. The proposed method is validated using synthetic experimental data obtained from Monte Carlo solutions of the Boltzmann transport equation. The method is shown to remain robust in the presence of uncertainty (noise) in the measurement.

[Interface compatibility between tooth-like yttria-stabilized tetragonal zirconia polycrystal by adding rare-earth oxide and Vita VM9 veneering porcelain].

PubMed

Gao, Yan; Zhang, Fu-qiang; He, Fan

2011-10-01

To evaluate the interface compatibility between tooth-like yttria-stabilized tetragonal zirconia polycrystal(Y-TZP) by adding rare-earth oxide and Vita VM9 veneering porcelain. Six kinds(S1,S2,S3,S4,S5,S6) of tooth-like yttria stabilized tetragonal zirconia polycrystal were made by introducing internal colorating technology to detect the thermal shock resistance and interface bonding strength with Vita VM9 Bsaedentin. Statistical analysis was performed using SAS6.12 software package. There was no gap between the layers via hot shocking test.The shear bonding strength between Y-TZP and VitaVM9 was higher and the value was (36.03±3.82) to (37.98±4.89) MPa. By adding rare-earth oxide to yttria-stabilized tetragonal zirconia polycrystal ,better compatibility between the layer (TZP and Vita VM9) can be formed which is of better interface integrate and available for clinical applications.

Effect of Nb2O5 doping on improving the thermo-mechanical stability of sealing interfaces for solid oxide fuel cells.

PubMed

Zhang, Qi; Du, Xinhang; Tan, Shengwei; Tang, Dian; Chen, Kongfa; Zhang, Teng

2017-07-13

Nb 2 O 5 is added to a borosilicate sealing system to improve the thermo-mechanical stability of the sealing interface between the glass and Fe-Cr metallic interconnect (Crofer 22APU) in solid oxide fuel cells (SOFCs). The thermo-mechanical stability of the glass/metal interface is evaluated experimentally as well as by using a finite element analysis (FEA) method. The sealing glass doped with 4 mol.% Nb 2 O 5 shows the best thermo-mechanical stability, and the sealing couple of Crofer 22APU/glass/GDC (Gd 0.2 Ce 0.8 O 1.9 ) remains intact after 50 thermal cycles. In addition, all sealing couples show good joining after being held at 750 °C for 1000 h. Moreover, the possible mechanism on the thermo-mechanical stability of sealing interface is investigated in terms of stress-based and energy-based perspectives.

Synthesis and metrology of conducting carbon nanotube assemblies

NASA Astrophysics Data System (ADS)

Longson, Timothy Jay

Since its discovery, the carbon nanotube (CNT) has been proposed as one of the ultimate materials for its electrical, thermal and mechanical properties due to its incredibly strong sp2 bonds, low defect density, and large aspect ratio. Many experimental results on individual CNTs have confirmed these outstanding theoretically predicted properties. However, scaling these properties to the macroscopic regime has proved to be challenging. This work focused on the synthesis and measurement of highly conducting, macroscopic, CNT assemblies. Scaling up the synthesis of vertically aligned multiwalled CNT (MWNT) forests was investigated through the development of a large, 100mm, wafer scale, cold wall chemical vapor deposition chamber. In addition to the synthesis, two distinct CNT assemblies have been investigated. A linear morphology where CNTs are strung in series for electrical transport (CNT wires) and a massively parallel 2D array of vertically aligned CNTs for Thermal Interface Material (TIM) applications. Poymer-CNT wire composites have been fabricated by developing a coaxial CNT core-polymer shell electrospinning technique. The core-shell interactions in this system have been studied by way of Hansen's solubility parameters. The most well defined CNT core was achieved using a core solvent that is semi-immiscible with the shell solution, yet still a solvent of the shell polymer. Electrical characterization of the resulting CNT core has shown a two orders of magnitude increase in conductivity over traditional, homogeneously mixed, electrospun CNT wires. A number of vertically aligned MWNT assemblies were studied for their thermal interface properties. Double-sided Silicon substrate (MWNT-Si-MWNT) TIM assemblies were characterized using a DC, 1D reference bar, thermal measurement technique. While attempts to control MWNT density via a micelle template technique produced only 'spaghetti like' CNTs, sputter deposited catalyst provided stark variations in array density. Relevant array morphologies such as density, height, and crystallinity were studied in conjunction with their thermal performance. A Euler buckling model was used to identify the transition between increasing and decreasing resistance with density over array height, these two regimes are explained by way of contact analysis. Self catalyzing Fecralloy substrate MWNT TIMs were studied in a similar vein to the Silicon based assemblies. This substrate was investigated because of its malleability, ease of CNT synthesis and increased CNT adhesion. The growth behavior was studied with respect to the array morphologies, i.e. array height, density, crystallinity, and diameter, while the contact resistance was evaluated using a DC, 1D reference bar technique. The best performing samples were found to have a factor of two increase over their Si counterparts. Temperature dependent thermal measurements offer insight into the interfacial phonon conduction physics and are found to agree with other temperature dependent studies, suggesting inelastic scattering at the MWNT-Cu interface. Due to the challenges associated with deliberately controlling a single array morphology, a statistical approach was used for identifying the influences of the multivariate array morphology on contact resistance. Showing the strongest correlation with array height, following a R ~ L-0.5. Several models were investigated to help explain this behavior, although little insight is gained over the empirical relations. To better characterize these MWNT TIM assemblies two experimental techniques were developed. A transient 3o thermal measurement technique was adapted to characterize the thermal performance of CNT TIMs, offering insight into the limiting resistance in a mulilayer material stack. The MWNT-growth substrate interface was found to dominate in the Si samples while the MWNT-opposing substrate interface dominated in the Fecralloy samples. These measurements strongly supported the DC thermal measurements and the qualitative observations of substrate adhesion. Additionally, a new technique for observing nano sized contacts was established by viewing contact loading through an electron transparent membrane, imaged under an SEM. The contrast mechanism is explained by a voltage contrast phenomenon developed by trapped charges at the interface. The resolution limits have been studied by way of electron beam interactions and the use of Monte Carlo simulations, showing nanometer resolution with appropriate experimental conditions. The real MWNT contact area was found to be less than 1/100th the apparent contact area even at moderate pressures and the number of contacting CNTs is approximately 1/10th the total number of CNTs. These results confirm experimental measurement values for van der Waals adhesion strengths and thermal interface resistance.

Development and evaluation of thermal model reduction algorithms for spacecraft

NASA Astrophysics Data System (ADS)

Deiml, Michael; Suderland, Martin; Reiss, Philipp; Czupalla, Markus

2015-05-01

This paper is concerned with the topic of the reduction of thermal models of spacecraft. The work presented here has been conducted in cooperation with the company OHB AG, formerly Kayser-Threde GmbH, and the Institute of Astronautics at Technische Universität München with the goal to shorten and automatize the time-consuming and manual process of thermal model reduction. The reduction of thermal models can be divided into the simplification of the geometry model for calculation of external heat flows and radiative couplings and into the reduction of the underlying mathematical model. For simplification a method has been developed which approximates the reduced geometry model with the help of an optimization algorithm. Different linear and nonlinear model reduction techniques have been evaluated for their applicability in reduction of the mathematical model. Thereby the compatibility with the thermal analysis tool ESATAN-TMS is of major concern, which restricts the useful application of these methods. Additional model reduction methods have been developed, which account to these constraints. The Matrix Reduction method allows the approximation of the differential equation to reference values exactly expect for numerical errors. The summation method enables a useful, applicable reduction of thermal models that can be used in industry. In this work a framework for model reduction of thermal models has been created, which can be used together with a newly developed graphical user interface for the reduction of thermal models in industry.

Suppression of thermally excited capillary waves by shear flow.

PubMed

Derks, Didi; Aarts, Dirk G A L; Bonn, Daniel; Lekkerkerker, Henk N W; Imhof, Arnout

2006-07-21

We investigate the thermal fluctuations of the colloidal gas-liquid interface subjected to a shear flow parallel to the interface. Strikingly, we find that the shear strongly suppresses capillary waves, making the interface smoother. This phenomenon can be described by introducing an effective interfacial tension that increases with the shear rate. The increase of sigma(eff) is a direct consequence of the loss of interfacial entropy caused by the flow, which affects especially the slow fluctuations. This demonstrates that the interfacial tension of fluids results from an intrinsic as well as a fluctuation contribution.

Dynamic Stability of the Rate, State, Temperature, and Pore Pressure Friction Model at a Rock Interface

NASA Astrophysics Data System (ADS)

Sinha, Nitish; Singh, Arun K.; Singh, Trilok N.

2018-05-01

In this article, we study numerically the dynamic stability of the rate, state, temperature, and pore pressure friction (RSTPF) model at a rock interface using standard spring-mass sliding system. This particular friction model is a basically modified form of the previously studied friction model namely the rate, state, and temperature friction (RSTF). The RSTPF takes into account the role of thermal pressurization including dilatancy and permeability of the pore fluid due to shear heating at the slip interface. The linear stability analysis shows that the critical stiffness, at which the sliding becomes stable to unstable or vice versa, increases with the coefficient of thermal pressurization. Critical stiffness, on the other hand, remains constant for small values of either dilatancy factor or hydraulic diffusivity, but the same decreases as their values are increased further from dilatancy factor (˜ 10^{ - 4} ) and hydraulic diffusivity (˜ 10^{ - 9} {m}2 {s}^{ - 1} ) . Moreover, steady-state friction is independent of the coefficient of thermal pressurization, hydraulic diffusivity, and dilatancy factor. The proposed model is also used for predicting time of failure of a creeping interface of a rock slope under the constant gravitational force. It is observed that time of failure decreases with increase in coefficient of thermal pressurization and hydraulic diffusivity, but the dilatancy factor delays the failure of the rock fault under the condition of heat accumulation at the creeping interface. Moreover, stiffness of the rock-mass also stabilizes the failure process of the interface as the strain energy due to the gravitational force accumulates in the rock-mass before it transfers to the sliding interface. Practical implications of the present study are also discussed.

Polarized neutron reflectivity study of a thermally treated MnIr/CoFe exchange bias system.

PubMed

Awaji, Naoki; Miyajima, Toyoo; Doi, Shuuichi; Nomura, Kenji

2010-12-01

It has recently been found that the exchange bias of a MnIr/CoFe system can be increased significantly by adding a thermal treatment to the bilayer. To reveal the origin of the higher exchange bias, we performed polarized neutron reflectivity measurements at the JRR-3 neutron source. The magnetization vector near the MnIr/CoFe interface for thermally treated samples differed from that for samples without the treatment. We propose a model in which the pinned spin area at the interface is extended due to the increased roughness and atomic interdiffusion that result from the thermal treatment.

Power Electronics and Thermal Management | Transportation Research | NREL

Science.gov Websites

Power Electronics and Thermal Management Power Electronics and Thermal Management This is the March Gearhart's testimony. Optical Thermal Characterization Enables High-Performance Electronics Applications New transient thermoreflectance measures the thermal performance of materials and their interfaces that cannot

Toward Improved Lifetimes of Organic Solar Cells under Thermal Stress: Substrate-Dependent Morphological Stability of PCDTBT:PCBM Films and Devices.

PubMed

Li, Zhe; Ho Chiu, Kar; Shahid Ashraf, Raja; Fearn, Sarah; Dattani, Rajeev; Cheng Wong, Him; Tan, Ching-Hong; Wu, Jiaying; Cabral, João T; Durrant, James R

2015-10-15

Morphological stability is a key requirement for outdoor operation of organic solar cells. We demonstrate that morphological stability and lifetime of polymer/fullerene based solar cells under thermal stress depend strongly on the substrate interface on which the active layer is deposited. In particular, we find that the stability of benchmark PCDTBT/PCBM solar cells under modest thermal stress is substantially increased in inverted solar cells employing a ZnO substrate compared to conventional devices employing a PSS substrate. This improved stability is observed to correlate with PCBM nucleation at the 50 nm scale, which is shown to be strongly influenced by different substrate interfaces. Employing this approach, we demonstrate remarkable thermal stability for inverted PCDTBT:PC70BM devices on ZnO substrates, with negligible (<2%) loss of power conversion efficiency over 160 h under 85 °C thermal stress and minimal thermally induced "burn-in" effect. We thus conclude that inverted organic solar cells, in addition to showing improved environmental stability against ambient humidity exposure as widely reported previously, can also demonstrate enhanced morphological stability. As such we show that the choice of suitable substrate interfaces may be a key factor in achieving prolonged lifetimes for organic solar cells under thermal stress conditions.

Influence of Thermal Cycles Number on Bond Strength of Metallic Brackets to Ceramic.

PubMed

Jurubeba, José Eliú Pereira; Costa, Ana Rosa; Correr-Sobrinho, Lourenço; Tubel, Carlos Alberto Malanconi; Correr, Américo Bortolazzo; Vedovello, Silvia Amélia; Crepaldi, Marcus Vinicius; Vedovello, Mário

2017-01-01

The aim of this study was to evaluate the effect of different number of thermal cycles on the shear bond strength (SBS) of metallic orthodontic brackets bonded to feldspathic ceramic by a composite resin. Twenty-five ceramic cylinders were etched with 10% hydrofluoric acid for 60 s and received two layers of silane. Brackets were bonded to the cylinders using Transbond XT and assigned to 5 groups (n=5): Group 1 - Control group (without thermal cycling); Group 2 - 500 thermal cycles; Group 3 - 5,000 thermal cycles; Group 4 - 7,000 thermal cycles and Group 5 - 10,000 thermal cycles. Light-activation was carried out by Radii Plus LED. SBS testing was carried out after 24 h of storage in deionized water and thermal cycling (5/55 oC and 30 s dwell time). Five brackets were bonded to each cylinder, totalizing 25 brackets for each group. Data were submitted to one-way ANOVA and Tukey's test (α=0.05). The Adhesive Remnant Index (ARI) was evaluated at 8× magnification. The SBS (MPa) of control group (9.3±0.8), 500 (9.0±0.7) and 5,000 (8.4±0.9) thermal cycles were significantly higher than those after 7,000 (6.8±0.6) and 10,000 (4.9±1.0) thermal cycles (p<0.05). The ARI showed a predominance of Scores 0 (adhesive failure) prevailed in all groups, as shown by the ARI, with increased scores 1 and 2 (mixed failures) for control group and 500 thermal cycles. In conclusion, thermal fatigue may compromise the bonding integration between metallic brackets and ceramic restorations. For in vitro testing, use of at least 7,000 cycles is advised to result in significant fatigue on the bonding interface.

Residual thermal stresses in composites for dimensionally stable spacecraft applications

NASA Technical Reports Server (NTRS)

Bowles, David E.; Tompkins, Stephen S.; Funk, Joan G.

1992-01-01

An overview of NASA LaRC's research on thermal residual stresses and their effect on the dimensional stability of carbon fiber reinforced polymer-matrix composites is presented. The data show that thermal residual stresses can induce damage in polymer matrix composites and significantly affect the dimensional stability of these composites by causing permanent residual strains and changes in CTE. The magnitude of these stresses is primarily controlled by the laminate configuration and the applied temperature change. The damage caused by thermal residual stresses initiates at the fiber/matrix interface and micromechanics level analyses are needed to accurately predict it. An increased understanding of fiber/matrix interface interactions appears to be the best approach for improving a composite's resistance to thermally induced damage.

Effect of temperature gradient on the optical quality of mercurous chloride crystals

NASA Technical Reports Server (NTRS)

Singh, N. B.; Davies, D. K.; Gottlieb, M.; Henningsen, T.; Mazelsky, R.

1989-01-01

Single crystals of mercurous chloride were grown at temperature gradients of 8, 11 and 17 K/cm by the physical vapor transport method. The optical quality of these crystals was evaluated by measuring bulk scattering and inhomogeneity of refractive index by birefringence interferometry. It was observed that a high temperature gradient at the solid-vapor interface induced thermal stresses and crystals showed higher scattering and irregular fringes.

Elasto-plastic analysis of interface layers for fiber reinforced metal matrix composites

NASA Technical Reports Server (NTRS)

Doghri, I.; Leckie, F. A.

1991-01-01

The mismatch in coefficients of thermal expansion (CTE) of fiber and matrix in metal matrix composites reinforced with ceramic fibers induces high thermal stresses in the matrix. Elasto-plastic analyses - with different degrees of simplification and modelization - show that an interface layer with a sufficiently high CTE can reduce the tensile hoop stress in the matrix substantially.

Focused ultrasound thermal therapy system with ultrasound image guidance and temperature measurement feedback.

PubMed

Lin, Kao-Han; Young, Sun-Yi; Hsu, Ming-Chuan; Chan, Hsu; Chen, Yung-Yaw; Lin, Win-Li

2008-01-01

In this study, we developed a focused ultrasound (FUS) thermal therapy system with ultrasound image guidance and thermocouple temperature measurement feedback. Hydraulic position devices and computer-controlled servo motors were used to move the FUS transducer to the desired location with the measurement of actual movement by linear scale. The entire system integrated automatic position devices, FUS transducer, power amplifier, ultrasound image system, and thermocouple temperature measurement into a graphical user interface. For the treatment procedure, a thermocouple was implanted into a targeted treatment region in a tissue-mimicking phantom under ultrasound image guidance, and then the acoustic interference pattern formed by image ultrasound beam and low-power FUS beam was employed as image guidance to move the FUS transducer to have its focal zone coincident with the thermocouple tip. The thermocouple temperature rise was used to determine the sonication duration for a suitable thermal lesion as a high power was turned on and ultrasound image was used to capture the thermal lesion formation. For a multiple lesion formation, the FUS transducer was moved under the acoustic interference guidance to a new location and then it sonicated with the same power level and duration. This system was evaluated and the results showed that it could perform two-dimensional motion control to do a two-dimensional thermal therapy with a small localization error 0.5 mm. Through the user interface, the FUS transducer could be moved to heat the target region with the guidance of ultrasound image and acoustic interference pattern. The preliminary phantom experimental results demonstrated that the system could achieve the desired treatment plan satisfactorily.

Effect of power history on the shape and the thermal stress of a large sapphire crystal during the Kyropoulos process

NASA Astrophysics Data System (ADS)

Nguyen, Tran Phu; Chuang, Hsiao-Tsun; Chen, Jyh-Chen; Hu, Chieh

2018-02-01

In this study, the effect of the power history on the shape of a sapphire crystal and the thermal stress during the Kyropoulos process are numerically investigated. The simulation results show that the thermal stress is strongly dependent on the power history. The thermal stress distributions in the crystal for all growth stages produced with different power histories are also studied. The results show that high von Mises stress regions are found close to the seed of the crystal, the highly curved crystal surface and the crystal-melt interface. The maximum thermal stress, which occurs at the crystal-melt interface, increases significantly in value as the crystal expands at the crown. After this, there is reduction in the maximum thermal stress as the crystal lengthens. There is a remarkable enhancement in the maximum von Mises stress when the crystal-melt interface is close to the bottom of the crucible. There are two obvious peaks in the maximum Von Mises stress, at the end of the crown stage and in the final stage, when cracking defects can form. To alleviate this problem, different power histories are considered in order to optimize the process to produce the lowest thermal stress in the crystal. The optimal power history is found to produce a significant reduction in the thermal stress in the crown stage.

Thermal analysis of the vertical bridgman semiconductor crystal growth technique. Ph.D. Thesis

NASA Technical Reports Server (NTRS)

Jasinski, T. J.

1982-01-01

The quality of semiconductor crystals grown by the vertical Bridgman technique is strongly influenced by the axial and radial variations of temperature within the charge. The relationship between the thermal parameters of the vertical Bridgman system and the thermal behavior of the charge are examined. Thermal models are developed which are capable of producing results expressable in analytical form and which can be used without recourse to extensive computer work for the preliminary thermal design of vertical Bridgman crystal growth systems. These models include the effects of thermal coupling between the furnace and the charge, charge translation rate, charge diameter, thickness and thermal conductivity of the confining crucible, thermal conductivity change and liberation of latent heat at the growth interface, and infinite charge length. The hot and cold zone regions, considered to be at spatially uniform temperatures, are separated by a gradient control region which provides added thermal design flexibility for controlling the temperature variations near the growth interface.

Mechanically Stretchable and Electrically Insulating Thermal Elastomer Composite by Liquid Alloy Droplet Embedment

PubMed Central

Jeong, Seung Hee; Chen, Si; Huo, Jinxing; Gamstedt, Erik Kristofer; Liu, Johan; Zhang, Shi-Li; Zhang, Zhi-Bin; Hjort, Klas; Wu, Zhigang

2015-01-01

Stretchable electronics and soft robotics have shown unsurpassed features, inheriting remarkable functions from stretchable and soft materials. Electrically conductive and mechanically stretchable materials based on composites have been widely studied for stretchable electronics as electrical conductors using various combinations of materials. However, thermally tunable and stretchable materials, which have high potential in soft and stretchable thermal devices as interface or packaging materials, have not been sufficiently studied. Here, a mechanically stretchable and electrically insulating thermal elastomer composite is demonstrated, which can be easily processed for device fabrication. A liquid alloy is embedded as liquid droplet fillers in an elastomer matrix to achieve softness and stretchability. This new elastomer composite is expected useful to enhance thermal response or efficiency of soft and stretchable thermal devices or systems. The thermal elastomer composites demonstrate advantages such as thermal interface and packaging layers with thermal shrink films in transient and steady-state cases and a stretchable temperature sensor. PMID:26671673

Experimental Characterization and Modeling of Thermal Contact Resistance of Electric Machine Stator-to-Cooling Jacket Interface Under Interference Fit Loading

DOE PAGES

Cousineau, Justine Emily; Bennion, Kevin S.; Chieduko, Victor; ...

2018-05-08

Cooling of electric machines is a key to increasing power density and improving reliability. This paper focuses on the design of a machine using a cooling jacket wrapped around the stator. The thermal contact resistance (TCR) between the electric machine stator and cooling jacket is a significant factor in overall performance and is not well characterized. This interface is typically an interference fit subject to compressive pressure exceeding 5 MPa. An experimental investigation of this interface was carried out using a thermal transmittance setup using pressures between 5 and 10 MPa. Furthermore, the results were compared to currently available modelsmore » for contact resistance, and one model was adapted for prediction of TCR in future motor designs.« less

Experimental Characterization and Modeling of Thermal Contact Resistance of Electric Machine Stator-to-Cooling Jacket Interface Under Interference Fit Loading

DOE Office of Scientific and Technical Information (OSTI.GOV)

Cousineau, Justine Emily; Bennion, Kevin S.; Chieduko, Victor

Cooling of electric machines is a key to increasing power density and improving reliability. This paper focuses on the design of a machine using a cooling jacket wrapped around the stator. The thermal contact resistance (TCR) between the electric machine stator and cooling jacket is a significant factor in overall performance and is not well characterized. This interface is typically an interference fit subject to compressive pressure exceeding 5 MPa. An experimental investigation of this interface was carried out using a thermal transmittance setup using pressures between 5 and 10 MPa. Furthermore, the results were compared to currently available modelsmore » for contact resistance, and one model was adapted for prediction of TCR in future motor designs.« less

Au-assisted fabrication of nano-holes on c-plane sapphire via thermal treatment guided by Au nanoparticles as catalysts

NASA Astrophysics Data System (ADS)

Sui, Mao; Pandey, Puran; Li, Ming-Yu; Zhang, Quanzhen; Kunwar, Sundar; Lee, Jihoon

2017-01-01

Nanoscale patterning of sapphires is a challenging task due to the high mechanical strength, chemical stability as well as thermal durability. In this paper, we demonstrate a gold droplet assisted approach of nano-hole fabrication on c-plane sapphire via a thermal treatment. Uniformly distributed nano-holes are fabricated on the sapphire surface guided by dome shaped Au nanoparticles (NPs) as catalysts and the patterning process is discussed based on the disequilibrium of vapor, liquid, solid interface energies at the Au NP/sapphire interface induced by the Au evaporation at high temperature. Followed by the re-equilibration of interface energy, transport of alumina from the beneath of NPs to the sapphire surface can occur along the NP/sapphire interface resulting in the formation of nano-holes. The fabrication of nano-holes using Au NPs as catalysts is a flexible, economical and convenient approach and can find applications in various optoelectronics.

Interplay between total thickness and period thickness in the phonon thermal conductivity of superlattices from the nanoscale to the microscale: Coherent versus incoherent phonon transport

NASA Astrophysics Data System (ADS)

Cheaito, Ramez; Polanco, Carlos A.; Addamane, Sadhvikas; Zhang, Jingjie; Ghosh, Avik W.; Balakrishnan, Ganesh; Hopkins, Patrick E.

2018-02-01

We report on the room temperature thermal conductivity of AlAs-GaAs superlattices (SLs), in which we systematically vary the period thickness and total thickness between 2 -24 nm and 20.1 -2 ,160 nm , respectively. The thermal conductivity increases with the SL thickness and plateaus at a thickness around 200 nm, showing a clear transition from a quasiballistic to a diffusive phonon transport regime. These results demonstrate the existence of classical size effects in SLs, even at the highest interface density samples. We use harmonic atomistic Green's function calculations to capture incoherence in phonon transport by averaging the calculated transmission over several purely coherent simulations of independent SL with different random mixing at the AlAs-GaAs interfaces. These simulations demonstrate the significant contribution of incoherent phonon transport through the decrease in the transmission and conductance in the SLs as the number of interfaces increases. In spite of this conductance decrease, our simulations show a quasilinear increase in thermal conductivity with the superlattice thickness. This suggests that the observation of a quasilinear increase in thermal conductivity can have important contributions from incoherent phonon transport. Furthermore, this seemingly linear slope in thermal conductivity versus SL thickness data may actually be nonlinear when extended to a larger number of periods, which is a signature of incoherent effects. Indeed, this trend for superlattices with interatomic mixing at the interfaces could easily be interpreted as linear when the number of periods is small. Our results reveal that the change in thermal conductivity with period thickness is dominated by incoherent (particlelike) phonons, whose properties are not dictated by changes in the AlAs or GaAs phonon dispersion relations. This work demonstrates the importance of studying both period and sample thickness dependencies of thermal conductivity to understand the relative contributions of coherent and incoherent phonon transport in the thermal conductivity in SLs.

Effect of interfacial interactions on the thermal conductivity and interfacial thermal conductance in tungsten–graphene layered structure

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jagannadham, K., E-mail: jag-kasichainula@ncsu.edu

2014-09-01

Graphene film was deposited by microwave plasma assisted deposition on polished oxygen free high conductivity copper foils. Tungsten–graphene layered film was formed by deposition of tungsten film by magnetron sputtering on the graphene covered copper foils. Tungsten film was also deposited directly on copper foil without graphene as the intermediate film. The tungsten–graphene–copper samples were heated at different temperatures up to 900 °C in argon atmosphere to form an interfacial tungsten carbide film. Tungsten film deposited on thicker graphene platelets dispersed on silicon wafer was also heated at 900 °C to identify the formation of tungsten carbide film by reaction of tungstenmore » with graphene platelets. The films were characterized by scanning electron microscopy, Raman spectroscopy, and x-ray diffraction. It was found that tungsten carbide film formed at the interface upon heating only above 650 °C. Transient thermoreflectance signal from the tungsten film surface on the samples was collected and modeled using one-dimensional heat equation. The experimental and modeled results showed that the presence of graphene at the interface reduced the cross-plane effective thermal conductivity and the interfacial thermal conductance of the layer structure. Heating at 650 and 900 °C in argon further reduced the cross-plane thermal conductivity and interface thermal conductance as a result of formation nanocrystalline tungsten carbide at the interface leading to separation and formation of voids. The present results emphasize that interfacial interactions between graphene and carbide forming bcc and hcp elements will reduce the cross-plane effective thermal conductivity in composites.« less

A Thermal Management Systems Model for the NASA GTX RBCC Concept

NASA Technical Reports Server (NTRS)

Traci, Richard M.; Farr, John L., Jr.; Laganelli, Tony; Walker, James (Technical Monitor)

2002-01-01

The Vehicle Integrated Thermal Management Analysis Code (VITMAC) was further developed to aid the analysis, design, and optimization of propellant and thermal management concepts for advanced propulsion systems. The computational tool is based on engineering level principles and models. A graphical user interface (GUI) provides a simple and straightforward method to assess and evaluate multiple concepts before undertaking more rigorous analysis of candidate systems. The tool incorporates the Chemical Equilibrium and Applications (CEA) program and the RJPA code to permit heat transfer analysis of both rocket and air breathing propulsion systems. Key parts of the code have been validated with experimental data. The tool was specifically tailored to analyze rocket-based combined-cycle (RBCC) propulsion systems being considered for space transportation applications. This report describes the computational tool and its development and verification for NASA GTX RBCC propulsion system applications.

Thermal Shock Damage and Microstructure Evolution of Thermal Barrier Coatings on Mar-M247 Superalloy in a Combustion Gas Environment

NASA Astrophysics Data System (ADS)

Mei, Hui

2012-06-01

The effect of preoxidation on the thermal shock of air plasma sprayed thermal barrier coatings (TBCs) was completely investigated in a combustion gas environment by burning jet fuel with high speed air. Results show that with increasing cycles, the as-oxidized TBCs lost more weight and enlarged larger spallation area than the as-sprayed ones. Thermally grown oxide (TGO) growth and thermal mismatch stress were proven to play critical roles on the as-oxidized TBC failure. Two types of significant cracks were identified: the type I crack was vertical to the TGO interface and the type II crack was parallel to the TGO interface. The former accelerated the TGO growth to develop the latter as long as the oxidizing gas continuously diffused inward and then oxidized the more bond coat (BC). The preoxidation treatment directly increased the TGO thickness, formed the parallel cracks earlier in the TGO during the thermal shocks, and eventually resulted in the worse thermal shock resistance.

Effect of ambient temperature and relative humidity on interfacial temperature during early stages of drop evaporation.

PubMed

Fukatani, Yuki; Orejon, Daniel; Kita, Yutaku; Takata, Yasuyuki; Kim, Jungho; Sefiane, Khellil

2016-04-01

Understanding drop evaporation mechanisms is important for many industrial, biological, and other applications. Drops of organic solvents undergoing evaporation have been found to display distinct thermal patterns, which in turn depend on the physical properties of the liquid, the substrate, and ambient conditions. These patterns have been reported previously to be bulk patterns from the solid-liquid to the liquid-gas drop interface. In the present work the effect of ambient temperature and humidity during the first stage of evaporation, i.e., pinned contact line, is studied paying special attention to the thermal information retrieved at the liquid-gas interface through IR thermography. This is coupled with drop profile monitoring to experimentally investigate the effect of ambient temperature and relative humidity on the drop interfacial thermal patterns and the evaporation rate. Results indicate that self-generated thermal patterns are enhanced by an increase in ambient temperature and/or a decrease in humidity. The more active thermal patterns observed at high ambient temperatures are explained in light of a greater temperature difference generated between the apex and the edge of the drop due to greater evaporative cooling. On the other hand, the presence of water humidity in the atmosphere is found to decrease the temperature difference along the drop interface due to the heat of adsorption, absorption and/or that of condensation of water onto the ethanol drops. The control, i.e., enhancement or suppression, of these thermal patterns at the drop interface by means of ambient temperature and relative humidity is quantified and reported.

Active Control of Interface Shape During the Crystal Growth of Lead Bromide

NASA Technical Reports Server (NTRS)

Duval, W. M. B.; Batur, C.; Singh, N. B.

2003-01-01

A thermal model for predicting and designing the furnace temperature profile was developed and used for the crystal growth of lead bromide. The model gives the ampoule temperature as a function of the furnace temperature, thermal conductivity, heat transfer coefficients, and ampoule dimensions as variable parameters. Crystal interface curvature was derived from the model and it was compared with the predicted curvature for a particular furnace temperature and growth parameters. Large crystals of lead bromide were grown and it was observed that interface shape was in agreement with the shape predicted by this model.

A Steady State and Quasi-Steady Interface Between the Generalized Fluid System Simulation Program and the SINDA/G Thermal Analysis Program

NASA Technical Reports Server (NTRS)

Schallhorn, Paul; Majumdar, Alok; Tiller, Bruce

2001-01-01

A general purpose, one dimensional fluid flow code is currently being interfaced with the thermal analysis program SINDA/G. The flow code, GFSSP, is capable of analyzing steady state and transient flow in a complex network. The flow code is capable of modeling several physical phenomena including compressibility effects, phase changes, body forces (such as gravity and centrifugal) and mixture thermodynamics for multiple species. The addition of GFSSP to SINDA/G provides a significant improvement in convective heat transfer modeling for SINDA/G. The interface development is conducted in multiple phases. This paper describes the first phase of the interface which allows for steady and quasisteady (unsteady solid, steady fluid) conjugate heat transfer modeling.

Thermal cycling fatigue of organic thermal interface materials using a thermal-displacement measurement technique

NASA Astrophysics Data System (ADS)

Steill, Jason Scott

The long term reliability of polymer-based thermal interface materials (TIM) is essential for modern electronic packages which require robust thermal management. The challenge for today's materials scientists and engineers is to maximize the heat flow from integrated circuits through a TIM and out the heat sink. Thermal cycling of the electronic package and non-uniformity in the heat flux with respect to the plan area can lead to void formation and delamination which re-introduces inefficient heat transfer. Measurement and understanding at the nano-scale is essential for TIM development. Finding and documenting the evolution of the defects is dependent upon a full understanding of the thermal probes response to changing environmental conditions and the effects of probe usage. The response of the thermal-displacement measurement technique was dominated by changes to the environment. Accurate measurement of the thermal performance was hindered by the inability to create a model system and control the operating conditions. This research highlights the need for continued study into the probe's thermal and mechanical response using tightly controlled test conditions.

Landsat-1 and Landsat-2 flight evaluation

NASA Technical Reports Server (NTRS)

1975-01-01

The flight performance of Landsat 1 and Landsat 2 is analyzed. Flight operations of the satellites are briefly summarized. Other topics discussed include: orbital parameters; power subsystem; attitude control subsystem; command/clock subsystem; telemetry subsystem; orbit adjust subsystem; magnetic moment compensating assembly; unified s-band/premodulation processor; electrical interface subsystem; thermal subsystem; narrowband tape recorders; wideband telemetry subsystem; attitude measurement sensor; wideband video tape recorders; return beam vidicon; multispectral scanner subsystem; and data collection subsystem.

Thermal barrier coating life prediction model development

NASA Technical Reports Server (NTRS)

Demasi, J. T.

1986-01-01

A methodology is established to predict thermal barrier coating life in a environment similar to that experienced by gas turbine airfoils. Experiments were conducted to determine failure modes of the thermal barrier coating. Analytical studies were employed to derive a life prediction model. A review of experimental and flight service components as well as laboratory post evaluations indicates that the predominant mode of TBC failure involves thermomechanical spallation of the ceramic coating layer. This ceramic spallation involves the formation of a dominant crack in the ceramic coating parallel to and closely adjacent to the topologically complex metal ceramic interface. This mechanical failure mode clearly is influenced by thermal exposure effects as shown in experiments conducted to study thermal pre-exposure and thermal cycle-rate effects. The preliminary life prediction model developed focuses on the two major damage modes identified in the critical experiments tasks. The first of these involves a mechanical driving force, resulting from cyclic strains and stresses caused by thermally induced and externally imposed mechanical loads. The second is an environmental driving force based on experimental results, and is believed to be related to bond coat oxidation. It is also believed that the growth of this oxide scale influences the intensity of the mechanical driving force.

Equilibrium Limit of Boundary Scattering in Carbon Nanostructures: Molecular Dynamics Calculations of Thermal Transport

NASA Technical Reports Server (NTRS)

Haskins, Justin; Kinaci, Alper; Sevik, Cem; Cagin, Tahir

2012-01-01

It is widely known that graphene and many of its derivative nanostructures have exceedingly high reported thermal conductivities (up to 4000 W/mK at 300 K). Such attractive thermal properties beg the use of these structures in practical devices; however, to implement these materials while preserving transport quality, the influence of structure on thermal conductivity should be thoroughly understood. For graphene nanostructures, having average phonon mean free paths on the order of one micron, a primary concern is how size influences the potential for heat conduction. To investigate this, we employ a novel technique to evaluate the lattice thermal conductivity from the Green-Kubo relations and equilibrium molecular dynamics in systems where phonon-boundary scattering dominates heat flow. Specifically, the thermal conductivities of graphene nanoribbons and carbon nanotubes are calculated in sizes up to 3 microns, and the relative influence of boundary scattering on thermal transport is determined to be dominant at sizes less than 1 micron, after which the thermal transport largely depends on the quality of the nanostructure interface. The method is also extended to carbon nanostructures (fullerenes) where phonon confinement, as opposed to boundary scattering, dominates, and general trends related to the influence of curvature on thermal transport in these materials are discussed.

Space station common module thermal management: Design and construction of a test bed

NASA Technical Reports Server (NTRS)

Barile, R. G.

1986-01-01

In this project, a thermal test bed was designed, simulated, and planned for construction. The thermal system features interior and exterior thermal loads and interfacing with the central-radiator thermal bus. Components of the test bed include body mounted radiator loop with interface heat exchangers (600 Btu/hr); an internal loop with cabin air-conditioning and cold plates (3400 Btu/hr); interface heat exchangers to the central bus (13,000 Btu/hr); and provisions for new technology including advanced radiators, thermal storage, and refrigeration. The apparatus will be mounted in a chamber, heated with lamps, and tested in a vacuum chamber with LN2-cooled walls. Simulation of the test bed was accomplished using a DEC PRO 350 computer and the software package TK! olver. Key input variables were absorbed solar radiation and cold plate loads. The results indicate temperatures on the two loops will be nominal when the radiation and cold plate loads are in the range of 25% to 75% of peak loads. If all loads fall to zero, except the cabin air system which was fixed, the radiator fluid will drop below -100 F and may cause excessive pressure drop. If all loads reach 100%, the cabin air temperature could rise to 96 F.

Thermal Conductivity Changes Due to Degradation of Cathode Film Subjected to Charge-Discharge Cycles in a Li Ion Battery

NASA Astrophysics Data System (ADS)

Jagannadham, K.

2018-05-01

A battery device with graphene platelets as anode, lithium nickel manganese oxide as cathode, and solid-state electrolyte consisting of layers of lithium phosphorous oxynitride and lithium lanthanum titanate is assembled on the stainless steel substrate. The battery in a polymer enclosure is subjected to several electrical tests consisting of charge and discharge cycles at different current and voltage levels. Thermal conductivity of the cathode layer is determined at the end of charge-discharge cycles using transient thermoreflectance. The microstructure and composition of the cathode layer and the interface between the cathode, the anode, and the electrolyte are characterized using scanning electron microscopy and elemental mapping. The decrease in the thermal conductivity of the same cathode observed after each set of electrical test cycles is correlated with the volume changes and formation of low ionic and thermal conductivity lithium oxide and lithium oxychloride at the interface and along porous regions. The interface between the metal current collector and the cathode is also found to be responsible for the increase in thermal resistance. The results indicate that changes in the thermal conductivity of the electrodes provide a measure of the resistance to heat transfer and degradation of ionic transport in the cathode accompanying the charge-discharge cycles in the batteries.

Reduction of thermal conductivity in MnSi{sub 1.7} multi-layered thin films with artificially inserted Si interfaces

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kurosaki, Y., E-mail: yosuke.kurosaki.uy@hitachi.com; Yabuuchi, S.; Nishide, A.

We report a lowered lattice thermal conductivity in nm-scale MnSi{sub 1.7}/Si multilayers which were fabricated by controlling thermal diffusions of Mn and Si atoms. The thickness of the constituent layers is 1.5–5.0 nm, which is comparable to the phonon mean free path of both MnSi{sub 1.7} and Si. By applying the above nanostructures, we reduced the lattice thermal conductivity down to half that of bulk MnSi{sub 1.7}/Si composite materials. The obtained value of 1.0 W/K m is the experimentally observed minimum in MnSi{sub 1.7}-based materials without any heavy element doping and close to the minimum thermal conductivity. We attribute the reduced latticemore » thermal conductivity to phonon scattering at the MnSi{sub 1.7}/Si interfaces in the multilayers.« less

Tuning the Seebeck effect in C60-based hybrid thermoelectric devices through temperature-dependent surface polarization and thermally-modulated interface dipoles.

PubMed

Liu, Yuchun; Xu, Ling; Zhao, Chen; Shao, Ming; Hu, Bin

2017-06-07

Fullerene (C 60 ) is an important n-type organic semiconductor with high electron mobility and low thermal conductivity. In this work, we report the experimental results on the tunable Seebeck effect of C 60 hybrid thin-film devices by adopting different oxide layers. After inserting n-type high-dielectric constant titanium oxide (TiO x ) and zinc oxide (ZnO) layers, we observed a significantly enhanced n-type Seebeck effect in oxide/C 60 hybrid devices with Seebeck coefficients of -5.8 mV K -1 for TiO x /C 60 and -2.08 mV K -1 for ZnO/C 60 devices at 100 °C, compared with the value of -400 μV K -1 for the pristine C 60 device. However, when a p-type nickel oxide (NiO) layer is inserted, the C 60 hybrid devices show a p-type to n-type Seebeck effect transition when the temperature increases. The remarkable Seebeck effect and change in Seebeck coefficient in different oxide/C 60 hybrid devices can be attributed to two reasons: the temperature-dependent surface polarization difference and thermally-dependent interface dipoles. Firstly, the surface polarization difference due to temperature-dependent electron-phonon coupling can be enhanced by inserting an oxide layer and functions as an additional driving force for the Seebeck effect development. Secondly, thermally-dependent interface dipoles formed at the electrode/oxide interface play an important role in modifying the density of interface states and affecting the charge diffusion in hybrid devices. The surface polarization difference and interface dipoles function in the same direction in hybrid devices with TiO x and ZnO dielectric layers, leading to enhanced n-type Seebeck effect, while the surface polarization difference and interface dipoles generate the opposite impact on electron diffusion in ITO/NiO/C 60 /Al, leading to a p-type to n-type transition in the Seebeck effect. Therefore, inserting different oxide layers could effectively modulate the Seebeck effect of C 60 -based hybrid devices through the surface polarization difference and thermally-dependent interface dipoles, which represents an effective approach to tune the vertical Seebeck effect in organic functional devices.

Using high pressure to study thermal transport and phonon scattering mechanisms

NASA Astrophysics Data System (ADS)

Hohensee, Gregory Thomas

The aerospace industry studies nanocomposites for heat dissipation and moderation of thermal expansion, and the semiconductor industry faces a Joule heating barrier in devices with high power density. My primary experimental tools are the diamond anvil cell (DAC) coupled with time-domain thermoreflectance (TDTR). TDTR is a precise optical method well-suited to measuring thermal conductivities and conductances at the nanoscale and across interfaces. The DAC-TDTR method yields thermal property data as a function of pressure, rather than temperature. This relatively unexplored independent variable can separate the components of thermal conductance and serve as an independent test for phonon-defect scattering models. I studied the effect of non-equilibrium thermal transport at the aluminum-coated surface of an exotic cuprate material Ca9La5Cu 24O41, which boasts a tenfold enhanced thermal conductivity along one crystalline axis where two-leg copper-oxygen spin-ladder structures carry heat in the form of thermalized magnetic excitations. Highly anisotropic materials are of interest for controlled thermal management applications, and the spin-ladder magnetic heat carriers ("magnons") are not well understood. I found that below room temperature, the apparent thermal conductivity of Ca9La5Cu24O41 depends on the frequency of the applied surface heating in TDTR. This occurs because the thermal penetration depth in the TDTR experiment is comparable to the length-scale for the equilibration of the magnons that are the dominant channel for heat conduction and the phonons that dominate the heat capacity. I applied a two-temperature model to analyze the TDTR data and extracted an effective volumetric magnon-phonon coupling parameter g for Ca9La5Cu24O 41 at temperatures from 75 K to 300 K; g varies by approximately two orders of magnitude over this range of temperature and has the value g = 1015 W m-3 K-1 near the peak of the thermal conductivity at T ≈ 180 K. To examine intrinsic phonon-mediated interface conductance between dissimilar materials, I applied DAC-TDTR to measure the thermal conductance of a series of metal-diamond interfaces as a function of pressure up to 50 GPa. The thermal conductance of interfaces between metals and diamond, which has a comparatively high Debye temperature, is often greater than can be accounted for by two phonon-processes, and the nature of heat transport between such dissimilar materials is central to the thermal design of composite materials. The high pressures achievable in a diamond anvil cell can significantly extend the metal phonon density of states to higher frequencies, and can also suppress extrinsic effects by greatly stiffening interface bonding. I measured the interface thermal conductances of Pb, Au0.95Pd0.05, Pt, and Al films deposited on Type 1A natural [100] and Type 2A synthetic [110] diamond anvils, from ambient pressure to 50 GPa. In all cases, the thermal conductances increase weakly or saturate to similar values at high pressure. My results suggest that anharmonic conductance at metal-diamond interfaces is controlled by partial transmission processes, where a diamond phonon that inelastically scatters at the interface absorbs or emits a metal phonon. The thermal conductivity and absolute electrical resistivity of metallic silicon have not been measured previously. I performed regular and beam-offset TDTR to establish the thermal conductivities of Si and Si0.991Ge 0.009 across the semiconductor-metal phase transition and up to 45 GPa. The thermal conductivities of metallic Si and Si(Ge) are comparable to aluminum and indicative of predominantly electronic heat carriers. Metallic Si and Si(Ge) have a transport anisotropy of approximately 1.4, similar to that of beryllium, due to the primitive hexagonal crystal structure. I used the Wiedemann-Franz law to derive the associated electrical resistivity, and found it consistent with the Bloch-Gruneisen model. Not all crystalline point defects are alike in how they scatter phonons and reduce the thermal conductivity of mixed crystals. Heat-carrying phonons in iron (Fe) doped MgO, or [Mg,Fe]O ferropericlase, are known to be resonantly scattered by interaction with a 3.3 THz electronic transition in the high-spin state of the Fe impurities. At sufficiently high pressures, the Fe atoms transition from a high-spin to a low-spin state, which eliminates the resonant interaction and reduces the Fe atoms to simpler point defect phonon scatterers. To study the behavior of phonon-defect scattering with and without this resonant scattering process, I measured the thermal conductivity of Mg0.92Fe0.08 O ferropericlase up to and above the 40--60 GPa spin transition. Fe-doped MgO (ferropericlase) is also a model system relevant to geophysical modeling of the Earth's core-mantle boundary, so data on its thermal transport under pressure is valuable in itself. (Abstract shortened by UMI.).

Hall Thruster Thermal Modeling and Test Data Correlation

NASA Technical Reports Server (NTRS)

Myers, James

2016-01-01

HERMeS - Hall Effect Rocket with Magnetic Shielding. Developed through a joint effort by NASA/GRC and the Jet Propulsion Laboratory (JPL). Design goals: High power (12.5 kW) high Isp (3000 sec), high efficiency (> 60%), high throughput (10,000 kg), reduced plasma erosion and increased life (5 yrs) to support Asteroid Redirect Robotic Mission (ARRM). Further details see "Performance, Facility Pressure Effects and Stability Characterization Tests of NASAs HERMeS Thruster" by H. Kamhawi and team. Hall Thrusters (HT) inherently operate at elevated temperatures approx. 600 C (or more). Due to electric magnetic (E x B) fields used to ionize and accelerate propellant gas particles (i.e., plasma). Cooling is largely limited to radiation in vacuum environment.Thus the hardware components must withstand large start-up delta-T's. HT's are constructed of multiple materials; assorted metals, non-metals and ceramics for their required electrical and magnetic properties. To mitigate thermal stresses HT design must accommodate the differential thermal growth from a wide range of material Coef. of Thermal Expansion (CTEs). Prohibiting the use of some bolted/torqued interfaces.Commonly use spring loaded interfaces, particularly at the metal-to-ceramic interfaces to allow for slippage.However most component interfaces must also effectively conduct heat to the external surfaces for dissipation by radiation.Thus contact pressure and area are important.

Comparing the Richtmyer-Meshkov instability of thermal and ion-species interfaces in two-fluid plasmas

NASA Astrophysics Data System (ADS)

Wheatley, Vincent; Bond, Daryl; Li, Yuan; Samtaney, Ravi; Pullin, Dale

2017-11-01

The Richtmyer-Meshkov instability (RMI) of a shock accelerated perturbed density interface is important in both inertial confinement fusion and astrophysics, where the materials involved are typically in the plasma state. Initial density interfaces can be due to either temperature or ion-species discontinuities. If the Atwood number of the interfaces and specific heat ratios of the fluids are matched, these two cases behave similarly when modeled using the equations of either hydrodynamics or magnetohydrodynamics. In the two-fluid ion-electron plasma model, however, there is a significant difference between them: In the thermal interface case, there is a discontinuity in electron density that is also subject to the RMI, while for the ion-species interface case there is not. It will be shown via ideal two-fluid plasma simulations that this causes substantial differences in the dynamics of the flow between the two cases. This work was partially supported by the KAUST Office of Sponsored Research under Award URF/1/2162-01.

Instrument interface description for NOAA 2000 instruments with European morning spacecraft and/or NOAA-OPQ spacecraft

NASA Technical Reports Server (NTRS)

1993-01-01

The purpose is to describe at a high level the common interface provisions and constraints placed on the NOAA-2000 instruments and the interfacing spacecraft elements in the following areas: electrical interface, mechanical interface, thermal interface, magnetic interface, electromagnetic compatibility, structural/mechanical environmental interface, contamination control, and the ionizing radiation environment. The requirements reflect the fact that these instruments must be compatible with a number of different polar orbiting satellite vehicles including the NOAA-OPQ satellites and the EUMETSAT METOP satellites.

International interface design for Space Station Freedom - Challenges and solutions

NASA Technical Reports Server (NTRS)

Mayo, Richard E.; Bolton, Gordon R.; Laurini, Daniele

1988-01-01

The definition of interfaces for the International Space Station is discussed, with a focus on negotiations between NASA and ESA. The program organization and division of responsibilities for the Space Station are outlined; the basic features of physical and functional interfaces are described; and particular attention is given to the interface management and documentation procedures, architectural control elements, interface implementation and verification, and examples of Columbus interface solutions (including mechanical, ECLSS, thermal-control, electrical, data-management, standardized user, and software interfaces). Diagrams, drawings, graphs, and tables listing interface types are provided.

Abundance and Temperature Dependency of Protein-Protein Interaction Revealed by Interface Structure Analysis and Stability Evolution

PubMed Central

He, Yi-Ming; Ma, Bin-Guang

2016-01-01

Protein complexes are major forms of protein-protein interactions and implement essential biological functions. The subunit interface in a protein complex is related to its thermostability. Though the roles of interface properties in thermal adaptation have been investigated for protein complexes, the relationship between the interface size and the expression level of the subunits remains unknown. In the present work, we studied this relationship and found a positive correlation in thermophiles rather than mesophiles. Moreover, we found that the protein interaction strength in complexes is not only temperature-dependent but also abundance-dependent. The underlying mechanism for the observed correlation was explored by simulating the evolution of protein interface stability, which highlights the avoidance of misinteraction. Our findings make more complete the picture of the mechanisms for protein complex thermal adaptation and provide new insights into the principles of protein-protein interactions. PMID:27220911

Abundance and Temperature Dependency of Protein-Protein Interaction Revealed by Interface Structure Analysis and Stability Evolution

NASA Astrophysics Data System (ADS)

He, Yi-Ming; Ma, Bin-Guang

2016-05-01

Protein complexes are major forms of protein-protein interactions and implement essential biological functions. The subunit interface in a protein complex is related to its thermostability. Though the roles of interface properties in thermal adaptation have been investigated for protein complexes, the relationship between the interface size and the expression level of the subunits remains unknown. In the present work, we studied this relationship and found a positive correlation in thermophiles rather than mesophiles. Moreover, we found that the protein interaction strength in complexes is not only temperature-dependent but also abundance-dependent. The underlying mechanism for the observed correlation was explored by simulating the evolution of protein interface stability, which highlights the avoidance of misinteraction. Our findings make more complete the picture of the mechanisms for protein complex thermal adaptation and provide new insights into the principles of protein-protein interactions.

SAGE III on ISS Lessons Learned on Thermal Interface Design

NASA Technical Reports Server (NTRS)

Davis, Warren

2015-01-01

The Stratospheric Aerosol and Gas Experiment III (SAGE III) instrument - the fifth in a series of instruments developed for monitoring vertical distribution of aerosols, ozone, and other trace gases in the Earth's stratosphere and troposphere - is currently scheduled for delivery to the International Space Station (ISS) via the SpaceX Dragon vehicle in 2016. The Instrument Adapter Module (IAM), one of many SAGE III subsystems, continuously dissipates a considerable amount of thermal energy during mission operations. Although a portion of this energy is transferred via its large radiator surface area, the majority must be conductively transferred to the ExPRESS Payload Adapter (ExPA) to satisfy thermal mitigation requirements. The baseline IAM-ExPA mechanical interface did not afford the thermal conductance necessary to prevent the IAM from overheating in hot on-orbit cases, and high interfacial conductance was difficult to achieve given the large span between mechanical fasteners, less than stringent flatness specifications, and material usage constraints due to strict contamination requirements. This paper will examine the evolution of the IAM-ExPA thermal interface over the course of three design iterations and will include discussion on design challenges, material selection, testing successes and failures, and lessons learned.

Analyses of layer-thickness effects in bilayered dental ceramics subjected to thermal stresses and ring-on-ring tests

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hsueh, Chun-Hway; Thompson, G. A.; Jadaan, Osama M.

Objectives. The purpose of this study was to analyze the stress distribution through the thickness of bilayered dental ceramics subjected to both thermal stresses and ring-on-ring tests and to systematically examine how the individual layer thickness influences this stress distribution and the failure origin. Methods. Ring-on-ring tests were performed on In-Ceram Alumina/Vitadur Alpha porcelain bilayered disks with porcelain in the tensile side, and In-Ceram Alumina to porcelain layer thickness ratios of 1:2, 1:1, and 2:1 were used to characterize the failure origins as either surface or interface. Based on the thermomechanical properties and thickness of each layer, the cooling temperaturemore » from glass transition temperature, and the ring-on-ring loading configuration, the stress distribution through the thickness of the bilayer was calculated using closed-form solutions. Finite element analyses were also performed to verify the analytical results. Results. The calculated stress distributions showed that the location of maximum tension during testing shifted from the porcelain surface to the In-Ceram Alumina/porcelain interface when the relative layer thickness ratio changed from 1:2 to 1:1 and to 2:1. This trend is in agreement with the experimental observations of the failure origins. Significance. For bilayered dental ceramics subjected to ring-on-ring tests, the location of maximum tension can shift from the surface to the interface depending upon the layer thickness ratio. The closed-form solutions for bilayers subjected to both thermal stresses and ring-on-ring tests are explicitly formulated which allow the biaxial strength of the bilayer to be evaluated.« less

Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayers

PubMed Central

Schäfer, D.; Eisenmenger-Sittner, C.; Chirtoc, Mihai; Kijamnajsuk, P.; Kornfeind, N.; Hutter, H.; Neubauer, E.; Kitzmantel, M.

2011-01-01

The manipulation of mechanical and thermal interfaces is essential for the design of modern composites. Amongst these are copper carbon composites which can exhibit excellent heat conductivities if the Cu/C interface is affected by a suitable interlayer to minimize the Thermal Contact Resistance (TCR) and to maximize the adhesion strength between Cu and C. In this paper we report on the effect of boron based interlayers on wetting, mechanical adhesion and on the TCR of Cu coatings deposited on glassy carbon substrates by magnetron sputtering. The interlayers were 5 nm thick and consisted of pure B and B with additions of the carbide forming metals Mo, Ti and Cr in the range of 5 at.% relative to B. The interlayers were deposited by RF magnetron sputtering from either a pure B target or from a composite target. The interlayer composition was checked by Auger Electron Spectroscopy and found to be homogenous within the whole film. The system C-substrate/interlayer/Cu coating was characterized in as deposited samples and samples heat treated for 30 min at 800 °C under High Vacuum (HV), which mimics typical hot pressing parameters during composite formation. Material transport during heat treatment was investigated by Secondary Ion Mass Spectroscopy (SIMS). The de-wetting and hole formation in the Cu coating upon heat treatment were studied by Scanning Electron Microscopy (SEM) and Atomic Force Microscopy (AFM). The adhesion of the Cu coating was evaluated by mechanical pull-off testing. The TCR was assessed by infrared photothermal radiometry (PTR). A correlation between the adhesion strength and the value of the TCR which was measured by PTR was determined for as deposited as well as for heat treated samples. PMID:22241938

Fracture Toughness Evaluation of Space Shuttle External Tank Thermal Protection System Polyurethane Foam Insulation Materials

NASA Technical Reports Server (NTRS)

McGill, Preston; Wells, Doug; Morgan, Kristin

2006-01-01

Experimental evaluation of the basic fracture properties of Thermal Protection System (TPS) polyurethane foam insulation materials was conducted to validate the methodology used in estimating critical defect sizes in TPS applications on the Space Shuttle External Fuel Tank. The polyurethane foam found on the External Tank (ET) is manufactured by mixing liquid constituents and allowing them to react and expand upwards - a process which creates component cells that are generally elongated in the foam rise direction and gives rise to mechanical anisotropy. Similarly, the application of successive foam layers to the ET produces cohesive foam interfaces (knitlines) which may lead to local variations in mechanical properties. This study reports the fracture toughness of BX-265, NCFI 24-124, and PDL-1034 closed-cell polyurethane foam as a function of ambient and cryogenic temperatures and knitline/cellular orientation at ambient pressure.

Deep Boreholes Seals Subjected to High P,T conditions - Proposed Experimental Studies

NASA Astrophysics Data System (ADS)

Caporuscio, F.

2015-12-01

Deep borehole experimental work will constrain the P,T conditions which "seal" material will experience in deep borehole crystalline rock repositories. The rocks of interest to this study include mafic (amphibolites) and silicic (granitic gneiss) end members. The experiments will systematically add components to capture discrete changes in both water and EBS component chemistries. Experiments in the system wall rock-clay-concrete-groundwater will evaluate interactions among components, including: mineral phase stability, metal corrosion rates and thermal limits. Based on engineered barrier studies, experimental investigations will move forward with three focusses. First, evaluation of interaction between "seal" materials and repository wall rock (crystalline) under fluid-saturated conditions over long-term (i.e., six-month) experiments; which reproduces the thermal pulse event of a repository. Second, perform experiments to determine the stability of zeolite minerals (analcime-wairakitess) under repository conditions. Both sets of experiments are critically important for understanding mineral paragenesis (zeolites and/or clay transformations) associated with "seals" in contact with wall rock at elevated temperatures. Third, mineral growth at the metal interface is a principal control on the survivability (i.e. corrosion) of waste canisters in a repository. The objective of this planned experimental work is to evaluate physio-chemical processes for 'seal' components and materials relevant to deep borehole disposal. These evaluations will encompass multi-laboratory efforts for the development of seals concepts and application of Thermal-Mechanical-Chemical (TMC) modeling work to assess barrier material interactions with subsurface fluids and other barrier materials, their stability at high temperatures, and the implications of these processes to the evaluation of thermal limits.

Hyperthermia in bone generated with MR imaging-controlled focused ultrasound: control strategies and drug delivery.

PubMed

Staruch, Robert; Chopra, Rajiv; Hynynen, Kullervo

2012-04-01

To evaluate the feasibility of achieving image-guided drug delivery in bone by using magnetic resonance (MR) imaging-controlled focused ultrasound hyperthermia and temperature-sensitive liposomes. Experiments were approved by the institutional animal care committee. Hyperthermia (43°C, 20 minutes) was generated in 10-mm-diameter regions at a muscle-bone interface in nine rabbit thighs by using focused ultrasound under closed-loop temperature control with MR thermometry. Thermosensitive liposomal doxorubicin was administered systemically during heating. Heating uniformity and drug delivery were evaluated for control strategies with the temperature control image centered 10 mm (four rabbits) or 0 mm (five rabbits) from the bone. Simulations estimated temperature elevations in bone. Drug delivery was quantified by using the fluorescence of doxorubicin extracted from bone marrow and muscle and was compared between treated and untreated thighs by using the one-sided Wilcoxon signed rank test. With ultrasound focus and MR temperature control plane 0 mm and 10 mm from the bone interface, average target region temperatures were 43.1°C and 43.3°C, respectively; numerically estimated bone temperatures were 46.8°C and 78.1°C. The 10-mm offset resulted in thermal ablation; numerically estimated muscle temperature was 66.1°C at the bone interface. Significant increases in doxorubicin concentration occurred in heated versus unheated marrow (8.2-fold, P = .002) and muscle (16.8-fold, P = .002). Enhancement occurred for 0- and 10-mm offsets, which suggests localized drug delivery in bone is possible with both hyperthermia and thermal ablation. MR imaging-controlled focused ultrasound can achieve localized hyperthermia in bone for image-guided drug delivery in bone with temperature-sensitive drug carriers. © RSNA, 2012.

Thermal Gradient Cyclic Behavior of a Thermal/Environmental Barrier Coating System on SiC/SiC Ceramic Matrix Composites

NASA Technical Reports Server (NTRS)

Zhu, Dongming; Lee, Kang N.; Miller, Robert A.

2002-01-01

Thermal barrier and environmental barrier coatings (TBCs and EBCs) will play a crucial role in future advanced gas turbine engines because of their ability to significantly extend the temperature capability of the ceramic matrix composite (CMC) engine components in harsh combustion environments. In order to develop high performance, robust coating systems for effective thermal and environmental protection of the engine components, appropriate test approaches for evaluating the critical coating properties must be established. In this paper, a laser high-heat-flux, thermal gradient approach for testing the coatings will be described. Thermal cyclic behavior of plasma-sprayed coating systems, consisting of ZrO2-8wt%Y2O3 thermal barrier and NASA Enabling Propulsion Materials (EPM) Program developed mullite+BSAS/Si type environmental barrier coatings on SiC/SiC ceramic matrix composites, was investigated under thermal gradients using the laser heat-flux rig in conjunction with the furnace thermal cyclic tests in water-vapor environments. The coating sintering and interface damage were assessed by monitoring the real-time thermal conductivity changes during the laser heat-flux tests and by examining the microstructural changes after the tests. The coating failure mechanisms are discussed based on the cyclic test results and are correlated to the sintering, creep, and thermal stress behavior under simulated engine temperature and heat flux conditions.

Study of Thermal Control Systems for orbiting power systems

NASA Technical Reports Server (NTRS)

Howell, H. R.

1981-01-01

Thermal control system designs were evaluated for the 25 kW power system. Factors considered include long operating life, high reliability, and meteoroid hazards to the space radiator. Based on a cost advantage, the bumpered pumped fluid radiator is recommended for the initial 25 kW power system and intermediate versions up to 50 kW. For advanced power systems with heat rejection rates above 50 kW the lower weight of the advanced heat pipe radiator offsets the higher cost and this design is recommended. The power system payloads heat rejection allocations studies show that a centralized heat rejection system is the most weight and cost effective approach. The thermal interface between the power system and the payloads was addressed and a concept for a contact heat exchanger that eliminates fluid transfer between the power system and the payloads was developed. Finally, a preliminary design of the thermal control system, with emphasis on the radiator and radiator deployment mechanism, is presented.

Ultracompliant Heterogeneous Copper-Tin Nanowire Arrays Making a Supersolder.

PubMed

Gong, Wei; Li, Pengfei; Zhang, Yunheng; Feng, Xuhui; Major, Joshua; DeVoto, Douglas; Paret, Paul; King, Charles; Narumanchi, Sreekant; Shen, Sheng

2018-06-13

Due to the substantial increase in power density, thermal interface resistance that can constitute more than 50% of the total thermal resistance has generally become a bottleneck for thermal management in electronics. However, conventional thermal interface materials (TIMs) such as solder, epoxy, gel, and grease cannot fulfill the requirements of electronics for high-power and long-term operation. Here, we demonstrate a high-performance TIM consisting of a heterogeneous copper-tin nanowire array, which we term "supersolder" to emulate the role of conventional solders in bonding various surfaces. The supersolder is ultracompliant with a shear modulus 2-3 orders of magnitude lower than traditional solders and can reduce the thermal resistance by two times as compared with the state-of-the-art TIMs. This supersolder also exhibits excellent long-term reliability with >1200 thermal cycles over a wide temperature range. By resolving this critical thermal bottleneck, the supersolder enables electronic systems, ranging from microelectronics and portable electronics to massive data centers, to operate at lower temperatures with higher power density and reliability.

The effect of filler parameters on the healing of thermal conductivity and mechanical properties of a thermal interface material based on a self-healable organic-inorganic polymer matrix

NASA Astrophysics Data System (ADS)

Zhong, Nan; Garcia, Santiago J.; van der Zwaag, Sybrand

2016-08-01

Thermal interface materials (TIMs) are widely used in all kinds of electronic devices to handle the heat dissipation and the mechanical anchoring of the heat producing component. The aging of TIMs may lead to delamination and internal crack formation causing a loss of heat transfer and mechanical integrity both leading to premature device failure. In the present work, a novel TIM system based on a self-healing organic-inorganic polymer matrix filled with spherical glass beads is presented which is capable of healing both the thermal conductivity and the mechanical properties upon thermal activation. The effect of particle volume concentration (PVC) and particle size on tensile strength and thermal conductivity healing behavior is investigated. The results show that a higher PVC increases the mechanical property but decreases mechanical healing. For the same PVC, bigger particles lead to lower mechanical properties but higher thermal conductivities and higher mechanical healing efficiencies.

Reduction in thermal conductivity and tunable heat capacity of inorganic/organic hybrid superlattices

NASA Astrophysics Data System (ADS)

Giri, Ashutosh; Niemelä, Janne-Petteri; Szwejkowski, Chester J.; Karppinen, Maarit; Hopkins, Patrick E.

2016-01-01

We study the influence of molecular monolayers on the thermal conductivities and heat capacities of hybrid inorganic/organic superlattice thin films fabricated via atomic/molecular layer deposition. We measure the cross plane thermal conductivities and volumetric heat capacities of TiO2- and ZnO-based superlattices with periodic inclusion of hydroquinone layers via time domain thermoreflectance. In comparison to their homogeneous counterparts, the thermal conductivities in these superlattice films are considerably reduced. We attribute this reduction in the thermal conductivity mainly due to incoherent phonon boundary scattering at the inorganic/organic interface. Increasing the inorganic/organic interface density reduces the thermal conductivity and heat capacity of these films. High-temperature annealing treatment of the superlattices results in a change in the orientation of the hydroquinone molecules to a 2D graphitic layer along with a change in the overall density of the hybrid superlattice. The thermal conductivity of the hybrid superlattice increases after annealing, which we attribute to an increase in crystallinity.

Thermal Fatigue and Fracture Behavior of Ceramic Thermal Barrier Coatings

NASA Technical Reports Server (NTRS)

Zhu, Dong-Ming; Choi, Sung R.; Miller, Robert A.

2001-01-01

Thermal fatigue and fracture behavior of plasma-sprayed ceramic thermal barrier coatings has been investigated under high heat flux and thermal cyclic conditions. The coating crack propagation is studied under laser heat flux cyclic thermal loading, and is correlated with dynamic fatigue and strength test results. The coating stress response and inelasticity, fatigue and creep interactions, and interface damage mechanisms during dynamic thermal fatigue processes are emphasized.

Shuttle antenna radome technology test program. Volume 2: Development of S-band antenna interface design

NASA Technical Reports Server (NTRS)

Kuhlman, E. A.; Baranowski, L. C.

1977-01-01

The effects of the Thermal Protection Subsystem (TPS) contamination on the space shuttle orbiter S band quad antenna due to multiple mission buildup are discussed. A test fixture was designed, fabricated and exposed to ten cycles of simulated ground and flight environments. Radiation pattern and impedance tests were performed to measure the effects of the contaminates. The degradation in antenna performance was attributed to the silicone waterproofing in the TPS tiles rather than exposure to the contaminating sources used in the test program. Validation of the accuracy of an analytical thermal model is discussed. Thermal vacuum tests with a test fixture and a representative S band quad antenna were conducted to evaluate the predictions of the analytical thermal model for two orbital heating conditions and entry from each orbit. The results show that the accuracy of predicting the test fixture thermal responses is largely dependent on the ability to define the boundary and ambient conditions. When the test conditions were accurately included in the analytical model, the predictions were in excellent agreement with measurements.

Thermal System Upgrade of the Space Environment Simulation Test Chamber

NASA Technical Reports Server (NTRS)

Desai, Ashok B.

1997-01-01

The paper deals with the refurbishing and upgrade of the thermal system for the existing thermal vacuum test facility, the Space Environment Simulator, at NASA's Goddard Space Flight Center. The chamber is the largest such facility at the center. This upgrade is the third phase of the long range upgrade of the chamber that has been underway for last few years. The first phase dealt with its vacuum system, the second phase involved the GHe subsystem. The paper describes the considerations of design philosophy options for the thermal system; approaches taken and methodology applied, in the evaluation of the remaining "life" in the chamber shrouds and related equipment by conducting special tests and studies; feasibility and extent of automation, using computer interfaces and Programmable Logic Controllers in the control system and finally, matching the old components to the new ones into an integrated, highly reliable and cost effective thermal system for the facility. This is a multi-year project just started and the paper deals mainly with the plans and approaches to implement the project successfully within schedule and costs.

Photovoltaic Performance and Interface Behaviors of Cu(In,Ga)Se2 Solar Cells with a Sputtered-Zn(O,S) Buffer Layer by High-Temperature Annealing.

PubMed

Wi, Jae-Hyung; Kim, Tae Gun; Kim, Jeong Won; Lee, Woo-Jung; Cho, Dae-Hyung; Han, Won Seok; Chung, Yong-Duck

2015-08-12

We selected a sputtered-Zn(O,S) film as a buffer material and fabricated a Cu(In,Ga)Se2 (CIGS) solar cell for use in monolithic tandem solar cells. A thermally stable buffer layer was required because it should withstand heat treatment during processing of top cell. Postannealing treatment was performed on a CIGS solar cell in vacuum at temperatures from 300-500 °C to examine its thermal stability. Serious device degradation particularly in VOC was observed, which was due to the diffusion of thermally activated constituent elements. The elements In and Ga tend to out-diffuse to the top surface of the CIGS, while Zn diffuses into the interface of Zn(O,S)/CIGS. Such rearrangement of atomic fractions modifies the local energy band gap and band alignment at the interface. The notch-shape induced at the interface after postannealing could function as an electrical trap during electron transport, which would result in the reduction of solar cell efficiency.

The impact of the Fermi-Dirac distribution on charge injection at metal/organic interfaces.

PubMed

Wang, Z B; Helander, M G; Greiner, M T; Lu, Z H

2010-05-07

The Fermi level has historically been assumed to be the only energy-level from which carriers are injected at metal/semiconductor interfaces. In traditional semiconductor device physics, this approximation is reasonable as the thermal distribution of delocalized states in the semiconductor tends to dominate device characteristics. However, in the case of organic semiconductors the weak intermolecular interactions results in highly localized electronic states, such that the thermal distribution of carriers in the metal may also influence device characteristics. In this work we demonstrate that the Fermi-Dirac distribution of carriers in the metal has a much more significant impact on charge injection at metal/organic interfaces than has previously been assumed. An injection model which includes the effect of the Fermi-Dirac electron distribution was proposed. This model has been tested against experimental data and was found to provide a better physical description of charge injection. This finding indicates that the thermal distribution of electronic states in the metal should, in general, be considered in the study of metal/organic interfaces.

Silicon Cations Intermixed Indium Zinc Oxide Interface for High-Performance Thin-Film Transistors Using a Solution Process.

PubMed

Na, Jae Won; Rim, You Seung; Kim, Hee Jun; Lee, Jin Hyeok; Hong, Seonghwan; Kim, Hyun Jae

2017-09-06

Solution-processed amorphous metal-oxide thin-film transistors (TFTs) utilizing an intermixed interface between a metal-oxide semiconductor and a dielectric layer are proposed. In-depth physical characterizations are carried out to verify the existence of the intermixed interface that is inevitably formed by interdiffusion of cations originated from a thermal process. In particular, when indium zinc oxide (IZO) semiconductor and silicon dioxide (SiO 2 ) dielectric layer are in contact and thermally processed, a Si 4+ intermixed IZO (Si/IZO) interface is created. On the basis of this concept, a high-performance Si/IZO TFT having both a field-effect mobility exceeding 10 cm 2 V -1 s -1 and a on/off current ratio over 10 7 is successfully demonstrated.

Interfacing a General Purpose Fluid Network Flow Program with the SINDA/G Thermal Analysis Program

NASA Technical Reports Server (NTRS)

Schallhorn, Paul; Popok, Daniel

1999-01-01

A general purpose, one dimensional fluid flow code is currently being interfaced with the thermal analysis program Systems Improved Numerical Differencing Analyzer/Gaski (SINDA/G). The flow code, Generalized Fluid System Simulation Program (GFSSP), is capable of analyzing steady state and transient flow in a complex network. The flow code is capable of modeling several physical phenomena including compressibility effects, phase changes, body forces (such as gravity and centrifugal) and mixture thermodynamics for multiple species. The addition of GFSSP to SINDA/G provides a significant improvement in convective heat transfer modeling for SINDA/G. The interface development is conducted in multiple phases. This paper describes the first phase of the interface which allows for steady and quasi-steady (unsteady solid, steady fluid) conjugate heat transfer modeling.

Ultrasonic Studies of Composites Undergoing Thermal and Fatigue Loading

NASA Technical Reports Server (NTRS)

Madaras, Eric I.; Winfree, William P.; Johnston, Patrick H.

1997-01-01

New composite materials possess attractive properties for use in advanced aircraft. A necessary requirement for their introduction into aeronautic use is an accurate understanding of their long term aging processes so that proper design criteria can be established. In order to understand those properties, these composites must be exposed to thermal and load cycles that are characteristic of flight conditions. Additionally, airline companies will require nondestructive evaluation (NDE) methods that can be used in the field to assess the condition of these new materials as they age. As part of an effort to obtain the required information about new composites for aviation use, we are performing ultrasonic measurements both in the NDE laboratory and in the materials testing laboratory at NASA. The materials testing laboratory is equipped with environmental chambers mounted on load frames so that composite samples can be exposed to thermal and loading cycles representative of flight protocols. Applying both temperature and load simultaneously will help to highlight temperature and load interactions during the aging of these composite materials. This study reports on our initial ultrasonic attenuation results from thermoset and thermoplastic composite samples. Ultrasonic attenuation measurements have been used reliably to assess the effects of material degradation. For example, recently, researchers have shown that by using frequencies of ultrasound on the order of 24 MHz, they could obtain adequate contrast in the evaluation of thermal degradation in these composites. This paper will present data that shows results at a lower frequency range. In addition, we report results on the frequency dependence of attenuation as the slope of attenuation with respect to frequency, beta = delta alpha (f) / delta f. The slope of attenuation is an attractive parameter since it is quantitative, yet does not require interface corrections like conventional quantitative attenuation measurements. This is a consequence of the assumption that interface correction terms are frequently independent. Uncertainty in those corrections terms compromises the value of conventional quantitative attenuation data.

Aerothermo-Structural Analysis of Low Cost Composite Nozzle/Inlet Components

NASA Technical Reports Server (NTRS)

Shivakumar, Kuwigai; Challa, Preeli; Sree, Dave; Reddy, D.

1999-01-01

This research is a cooperative effort among the Turbomachinery and Propulsion Division of NASA Glenn, CCMR of NC A&T State University, and the Tuskegee University. The NC A&T is the lead center and Tuskegee University is the participating institution. Objectives of the research were to develop an integrated aerodynamic, thermal and structural analysis code for design of aircraft engine components, such as, nozzles and inlets made of textile composites; conduct design studies on typical inlets for hypersonic transportation vehicles and setup standards test examples and finally manufacture a scaled down composite inlet. These objectives are accomplished through the following seven tasks: (1) identify the relevant public domain codes for all three types of analysis; (2) evaluate the codes for the accuracy of results and computational efficiency; (3) develop aero-thermal and thermal structural mapping algorithms; (4) integrate all the codes into one single code; (5) write a graphical user interface to improve the user friendliness of the code; (6) conduct test studies for rocket based combined-cycle engine inlet; and finally (7) fabricate a demonstration inlet model using textile preform composites. Tasks one, two and six are being pursued. Selected and evaluated NPARC for flow field analysis, CSTEM for in-depth thermal analysis of inlets and nozzles and FRAC3D for stress analysis. These codes have been independently verified for accuracy and performance. In addition, graphical user interface based on micromechanics analysis for laminated as well as textile composites was developed. Demonstration of this code will be made at the conference. A rocket based combined cycle engine was selected for test studies. Flow field analysis of various inlet geometries were studied. Integration of codes is being continued. The codes developed are being applied to a candidate example of trailblazer engine proposed for space transportation. A successful development of the code will provide a simpler, faster and user-friendly tool for conducting design studies of aircraft and spacecraft engines, applicable in high speed civil transport and space missions.

Nano Enabled Thermo-Mechanical Materials in Adhesive Joints: A New Paradigm to Materials Functionality (Preprint)

DTIC Science & Technology

2006-12-01

interface as well as to minimize the interface contact resistance. There is an on- going effort by numerous researchers of dispersing conductive nano...constituents (single wall carbon nanotube (SWCNT), multi wall carbon nano tube ( MWCNT )) in polymers (adhesive) to enhance its thermal conductivity [1...propose to use vertically aligned MWCNT in joints to enhance through-thickness conductivity [10] because of its known high thermal conductivity

Microcomputer spacecraft thermal analysis routines (MSTAR) Phase I: The user interface

DOE Office of Scientific and Technical Information (OSTI.GOV)

Teti, N.M.

1993-12-31

The Microcomputer Spacecraft Thermal Analysis Routines (MSTAR) software package is being developed for NASA/Goddard Space Flight Center by Swales and Associates, Inc. (S&AI). In December 1992, S&AI was awarded a phase I Small Business Inovative Research contract fronm NASA to develop a microcomputer based thermal analysis program to replace the current SSPTA and TRASYS programs. Phase I consists of a six month effort which will focus on developing geometric model generation and visualization capabilities using a graphical user interface (GUI). The information contained in this paper encompasses the work performed during the Phase I development cycle; with emphasis on themore » development of the graphical user interface (GUI). This includes both the theory behind and specific examples of how the MSTAR GUI was implemented. Furthermore, this report discusses new applications and enhancements which will improve the capabilities and commercialization of the MSTAR program.« less

Microcomputer spacecraft thermal analysis routines (MSTAR) Phase I: The user interface

NASA Technical Reports Server (NTRS)

Teti, Nicholas M.

1993-01-01

The Microcomputer Spacecraft Thermal Analysis Routines (MSTAR) software package is being developed for NASA/Goddard Space Flight Center by Swales and Associates, Inc. (S&AI). In December 1992, S&AI was awarded a phase I Small Business Inovative Research contract fronm NASA to develop a microcomputer based thermal analysis program to replace the current SSPTA and TRASYS programs. Phase I consists of a six month effort which will focus on developing geometric model generation and visualization capabilities using a graphical user interface (GUI). The information contained in this paper encompasses the work performed during the Phase I development cycle; with emphasis on the development of the graphical user interface (GUI). This includes both the theory behind and specific examples of how the MSTAR GUI was implemented. Furthermore, this report discusses new applications and enhancements which will improve the capabilities and commercialization of the MSTAR program.

77 FR 48514 - Certain New Chemicals; Receipt and Status Information

Federal Register 2010, 2011, 2012, 2013, 2014

2012-08-14

... emission; Use as an additive for electromagnetic interface (EMI) shielding; Use as a pigment; use as a... additive for heat transfer and thermal emission; Use as an additive for electromagnetic interface (EMI... electromagnetic interface (EMI) shielding; Use as a pigment; Use as a functional additive in composites and paints...

Assessment of thermal loads in the CERN SPS crab cavities cryomodule1

NASA Astrophysics Data System (ADS)

Carra, F.; Apeland, J.; Calaga, R.; Capatina, O.; Capelli, T.; Verdú-Andrés, S.; Zanoni, C.

2017-07-01

As a part of the HL-LHC upgrade, a cryomodule is designed to host two crab cavities for a first test with protons in the SPS machine. The evaluation of the cryomodule heat loads is essential to dimension the cryogenic infrastructure of the system. The current design features two cryogenic circuits. The first circuit adopts superfluid helium at 2 K to maintain the cavities in the superconducting state. The second circuit, based on helium gas at a temperature between 50 K and 70 K, is connected to the thermal screen, also serving as heat intercept for all the interfaces between the cold mass and the external environment. An overview of the heat loads to both circuits, and the combined numerical and analytical estimations, is presented. The heat load of each element is detailed for the static and dynamic scenarios, with considerations on the design choices for the thermal optimization of the most critical components.

Thermal conductance of two interface materials and their applications in space systems

NASA Technical Reports Server (NTRS)

Scialdone, J. J.; Clatterbuck, C. H.; Wall, J. L.

1992-01-01

Two polymeric materials, the Cho-Therm 1671 elastomer and the CV-2946 conductive RTV silicone, have been evaluated. Tests were conducted in vacuum and in air, for many clamping pressures, power densities, and as a function of time. Results obtained show that the CV-2946 thermal conductance after 24 hour in vacuum is 0.62 W/sq cm C(4W/sq in C) when clamped with an average pressure of about 350 psi. The maximum conductance of Cho-Therm 1671 is 4.3 W/sq in C at the clamping pressure about 200 psi. After 72 h in vacuum, the conductance reaches a steady 3.4 W/sq in C, independent of clamping pressure. It is concluded that the tightly bolted, torqued fixtures do not buckle or distort and provide an optimum thermal conductance. The fixtures simulating an actual spacecraft configuration suffered severe bowing and separating, which caused considerable degradation of conductance values.

Strain isolated ceramic coatings

NASA Technical Reports Server (NTRS)

Tolokan, R. P.; Brady, J. B.; Jarrabet, G. P.

1985-01-01

Plasma sprayed ceramic coatings are used in gas turbine engines to improve component temperature capability and cooling air efficiency. A compliant metal fiber strain isolator between a plasma sprayed ceramic coating and a metal substrate improves ceramic durability while allowing thicker coatings for better insulation. Development of strain isolated coatings has concentrated on design and fabrication of coatings and coating evaluation via thermal shock testing. In thermal shock testing, five types of failure are possible: buckling failure im compression on heat up, bimetal type failure, isothermal expansion mismatch failure, mudflat cracking during cool down, and long term fatigue. A primary failure mode for thermally cycled coatings is designated bimetal type failure. Bimetal failure is tensile failure in the ceramic near the ceramic-metal interface. One of the significant benefits of the strain isolator is an insulating layer protecting the metal substrate from heat deformation and thereby preventing bimetal type failure.

Thermal boundary conductance of hydrophilic and hydrophobic ionic liquids

NASA Astrophysics Data System (ADS)

Oyake, Takafumi; Sakata, Masanori; Yada, Susumu; Shiomi, Junichiro

2015-03-01

A solid/liquid interface plays a critical role for understanding mechanisms of biological and physical science. Moreover, carrier density of the surface is dramatically enhanced by electric double layer with ionic liquid, salt in the liquid state. Here, we have measured the thermal boundary conductance (TBC) across an interface of gold thin film and ionic liquid by using time-domain thermoreflectance technique. Following the prior researches, we have identified the TBC of two interfaces. One is gold and hydrophilic ionic liquid, N,N-Diethyl-N-methyl-N-(2-methoxyethyl) ammonium tetrafluoroborate (DEME-BF4), which is a hydrophilic ionic liquid, and the other is N,N-Diethyl-N-methyl-N-(2-methoxyethyl) ammonium bis (trifluoromethanesulfonyl) imide (DEME-TFSI), which is a hydrophobic ionic liquid. We found that the TBC between gold and DEME-TFIS (19 MWm-2K-1) is surprisingly lower than the interface between gold and DEME-BF4 (45 MWm-2K-1). With these data, the importance of the wetting angle and ion concentration for the thermal transport at the solid/ionic liquid interface is discussed. Part of this work is financially supported by Japan Society for the Promotion of Science (JSPS) and Japan Science and Technology Agency. The author is financially supported by JSPS Fellowship.

Development of an integrated thermal-hydraulics capability incorporating RELAP5 and PANTHER neutronics code

DOE Office of Scientific and Technical Information (OSTI.GOV)

Page, R.; Jones, J.R.

1997-07-01

Ensuring that safety analysis needs are met in the future is likely to lead to the development of new codes and the further development of existing codes. It is therefore advantageous to define standards for data interfaces and to develop software interfacing techniques which can readily accommodate changes when they are made. Defining interface standards is beneficial but is necessarily restricted in application if future requirements are not known in detail. Code interfacing methods are of particular relevance with the move towards automatic grid frequency response operation where the integration of plant dynamic, core follow and fault study calculation toolsmore » is considered advantageous. This paper describes the background and features of a new code TALINK (Transient Analysis code LINKage program) used to provide a flexible interface to link the RELAP5 thermal hydraulics code with the PANTHER neutron kinetics and the SIBDYM whole plant dynamic modelling codes used by Nuclear Electric. The complete package enables the codes to be executed in parallel and provides an integrated whole plant thermal-hydraulics and neutron kinetics model. In addition the paper discusses the capabilities and pedigree of the component codes used to form the integrated transient analysis package and the details of the calculation of a postulated Sizewell `B` Loss of offsite power fault transient.« less

Effect of asymmetric concentration profile on thermal conductivity in Ge/SiGe superlattices

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hahn, Konstanze R., E-mail: konstanze.hahn@dsf.unica.it; Cecchi, Stefano; Colombo, Luciano

2016-05-16

The effect of the chemical composition in Si/Ge-based superlattices on their thermal conductivity has been investigated using molecular dynamics simulations. Simulation cells of Ge/SiGe superlattices have been generated with different concentration profiles such that the Si concentration follows a step-like, a tooth-saw, a Gaussian, and a gamma-type function in direction of the heat flux. The step-like and tooth-saw profiles mimic ideally sharp interfaces, whereas Gaussian and gamma-type profiles are smooth functions imitating atomic diffusion at the interface as obtained experimentally. Symmetry effects have been investigated comparing the symmetric profiles of the step-like and the Gaussian function to the asymmetric profilesmore » of the tooth-saw and the gamma-type function. At longer sample length and similar degree of interdiffusion, the thermal conductivity is found to be lower in asymmetric profiles. Furthermore, it is found that with smooth concentration profiles where atomic diffusion at the interface takes place the thermal conductivity is higher compared to systems with atomically sharp concentration profiles.« less

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhang, Jingchao, E-mail: zhang@unl.edu, E-mail: yyue@whu.edu.cn; Hong, Yang; Yue, Yanan, E-mail: zhang@unl.edu, E-mail: yyue@whu.edu.cn

As the dimensions of nanocircuits and nanoelectronics shrink, thermal energies are being generated in more confined spaces, making it extremely important and urgent to explore for efficient heat dissipation pathways. In this work, the phonon energy transport across graphene and hexagonal boron-nitride (h-BN) interface is studied using classic molecular dynamics simulations. Effects of temperature, interatomic bond strength, heat flux direction, and functionalization on interfacial thermal transport are investigated. It is found out that by hydrogenating graphene in the hybrid structure, the interfacial thermal resistance (R) between graphene and h-BN can be reduced by 76.3%, indicating an effective approach to manipulatemore » the interfacial thermal transport. Improved in-plane/out-of-plane phonon couplings and broadened phonon channels are observed in the hydrogenated graphene system by analyzing its phonon power spectra. The reported R results monotonically decrease with temperature and interatomic bond strengths. No thermal rectification phenomenon is observed in this interfacial thermal transport. Results reported in this work give the fundamental knowledge on graphene and h-BN thermal transport and provide rational guidelines for next generation thermal interface material designs.« less

Investigation of thermal energy transport interface of hybrid graphene-carbon nanotube/polyethylene nanocomposites.

PubMed

Liu, Feng; Liu, Xuyang; Hu, Ning; Ning, Huiming; Atobe, Satoshi; Yan, Cheng; Mo, Fuhao; Fu, Shaoyun; Zhang, Jianyu; Wang, Yu; Mu, Xiaojing

2017-10-31

It is well known the thermal properties of three-dimensional (3-D) hybrid graphene (GR)-carbon nanotube (CNT) structures are not superior to that of the individual GR and CNT, however, the 3-D hybrid GR-CNT structures can effectively improve the thermal properties of polymer matrix. Therefore, understanding the thermal energy transport in the interface between polymer matrix and 3-D hybrid GR-CNT structure is essential. Here, the enhancement mechanism of interfacial thermal transport of hybrid GR-CNT structure was explored by applying non-equilibrium molecular dynamics (NEMD) simulations. Three different types of hybrid GR-CNT structures were built. The influences of CNT radius and CNT type for the hybrid GR-CNT on the interfacial thermal properties were also analyzed. Computational results show that among the three different types of hybrid GR-CNT structures, the Model-I, i.e., the covalent bond hybrid GR-CNT structures are of the best interfacial thermal properties. Meanwhile, the CNT radius of hybrid GR-CNT structure has a great influence on the interfacial thermal properties.

Development of Passive Fuel Cell Thermal Management Heat Exchanger

NASA Technical Reports Server (NTRS)

Burke, Kenneth A.; Jakupca, Ian J.; Colozza, Anthony J.

2010-01-01

The NASA Glenn Research Center is developing advanced passive thermal management technology to reduce the mass and improve the reliability of space fuel cell systems for the NASA Exploration program. The passive thermal management system relies on heat conduction within highly thermally conductive cooling plates to move the heat from the central portion of the cell stack out to the edges of the fuel cell stack. Using the passive approach eliminates the need for a coolant pump and other cooling loop components within the fuel cell system which reduces mass and improves overall system reliability. Previous development demonstrated the performance of suitable highly thermally conductive cooling plates that could conduct the heat, provide a sufficiently uniform temperature heat sink for each cell of the fuel cell stack, and be substantially lighter than the conventional thermal management approach. Tests were run with different materials to evaluate the design approach to a heat exchanger that could interface with the edges of the passive cooling plates. Measurements were made during fuel cell operation to determine the temperature of individual cooling plates and also to determine the temperature uniformity from one cooling plate to another.

Estimation of Thermoelectric Generator Performance by Finite Element Modeling

NASA Astrophysics Data System (ADS)

Ziolkowski, P.; Poinas, P.; Leszczynski, J.; Karpinski, G.; Müller, E.

2010-09-01

Prediction of thermoelectric performance parameters by numerical methods is an inherent part of thermoelectric generator (TEG) development and allows for time- and cost-saving assessment of material combinations and variations of crucial design parameters (e.g., shape, pellet length, and thermal coupling). Considering the complexity of a TEG system and its numerous affecting factors, the clarity and the flexibility of a mathematical treatment comes to the fore. Comfortable tools are provided by commercial finite element modeling (FEM) software offering powerful geometry interfaces, mesh generators, solvers, and postprocessing options. We describe the level of development and the simulation results of a three dimensional (3D) TEG FEM. Using ANSYS 11.0, we implemented and simulated a TEG module geometry under various conditions. Comparative analytical one dimensional (1D) results and a direct comparison with inhouse-developed TEG simulation software show the consistency of results. Several pellet aspect ratios and contact property configurations (thermal/electrical interface resistance) were evaluated for their impact on the TEG performance as well as parasitic effects such as convection, radiation, and conductive heat bypass. The scenarios considered revealed the highest efficiency decay for convectionally loaded setups (up to 4.8%pts), followed by the impacts of contact resistances (up to 4.8%pts), by radiation (up to 0.56%pts), and by thermal conduction of a solid filling material within the voids of the module construction (up to 0.14%pts).

Investigation of phonon transport and thermal boundary conductance at the interface of functionalized SWCNT and poly (ether-ketone)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Huang, Haoxiang; Kumar, Satish, E-mail: satish.kumar@me.gatech.edu; Chen, Liang

2016-09-07

Carbon nanostructures such as carbon nanotube (CNT), graphene, and carbon fibers can be used as fillers in amorphous polymers to improve their thermal properties. In this study, the effect of covalent bonding of CNT with poly(ether ketone) (PEK) on interfacial thermal interactions is investigated using non-equilibrium molecular dynamics simulations. The number of covalent bonds between (20, 20) CNT and PEK is varied in the range of 0–80 (0%–6.25%), and the thermal boundary conductance is computed. The analysis reveals that covalent functionalization of CNT atoms can enhance the thermal boundary conductance by an order of magnitude compared to the non-functionalized CNT-PEKmore » interface at a high degree of CNT functionalization. Besides strengthening the thermal coupling, covalent functionalization is also shown to modify the phonon spectra of CNT. The transient spectral energy analysis shows that the crosslinks cause faster energy exchange from CNT to PEK in different frequency bands. The oxygen atom of hydroxyl group of PEK contributes energy transfer in the low frequency band, while aromatic and carbonyl carbon atoms play a more significant role in high frequency bands. In addition, by analyzing the relaxation time of the spectral temperature of different frequency bands of CNT, it is revealed that with increasing number of bonds, both lower frequency vibrational modes and higher frequency modes efficiently couple across the CNT-PEK interface and contribute in thermal energy transfer from CNT to the matrix.« less

Study of the thermal properties of low k dielectric thin films

NASA Astrophysics Data System (ADS)

Hu, Chuan

The integration of low k material is of great importance for the performance of an electronic device as the result of shrink in the device size. The thermal conductivity of low k materials is usually much lower than that of the traditionally used SiO2 and thus a tradeoff has to be properly evaluated. The thermal conduction in amorphous thin films is not only industrially important but also scientifically interesting. Many efforts have been done to understand the "phonon" propagation in an amorphous medium. Two experimental tools to study thermal properties are developed. The photothermal technique is an optical far field method and the 3o technique is an electrical near field method. The free standing and on-wafer photothermal techniques measure the out-of-plane thermal diffusivity directly and the 3o technique measures the out-of-plane thermal conductivity under our typical experimental configurations. The thermal diffusivities of a rigid rod like polyimide PI2611 and a flexible PI2545 are measured using the photothermal technique. The thermal anisotropy is studied by comparing our measurements with the result from in-plane measurements. The porosity dependence of thermal conductivity of Xerogel is studied by 3o technique. The fast drop in thermal conductivity is explained as the result of porosity and thermal contact in solid phase. A scaling rule of thermal conductivity as a function of porosity is proposed to the show the tradeoff between the thermal and the electrical properties. The possible impact of integrating low k materials in an interconnect structure is evaluated. The effective thermal conductivity of polymeric thin films as thin as 70 A is measured by 3o technique. The interfacial thermal resistances of Al/polymer/Si sandwich structure are found to be about 2 to 10 times larger than that of Al/SiO2/Si and the bulk thermal conductivities of polymers are found to be about 5 to 10 times smaller than that of SiO 2. The thermal conductivity of amorphous material is explained using the minimum thermal length model. The interfacial thermal resistance is explained using the acoustic and diffuse mismatch models as well as roughness and inelastic scattering at the interface.

Nonequilibrium kinetic boundary condition at the vapor-liquid interface of argon

NASA Astrophysics Data System (ADS)

Ishiyama, Tatsuya; Fujikawa, Shigeo; Kurz, Thomas; Lauterborn, Werner

2013-10-01

A boundary condition for the Boltzmann equation (kinetic boundary condition, KBC) at the vapor-liquid interface of argon is constructed with the help of molecular dynamics (MD) simulations. The KBC is examined at a constant liquid temperature of 85 K in a wide range of nonequilibrium states of vapor. The present investigation is an extension of a previous one by Ishiyama, Yano, and Fujikawa [Phys. Rev. Lett.PRLTAO0031-900710.1103/PhysRevLett.95.084504 95, 084504 (2005)] and provides a more complete form of the KBC. The present KBC includes a thermal accommodation coefficient in addition to evaporation and condensation coefficients, and these coefficients are determined in MD simulations uniquely. The thermal accommodation coefficient shows an anisotropic behavior at the interface for molecular velocities normal versus tangential to the interface. It is also found that the evaporation and condensation coefficients are almost constant in a fairly wide range of nonequilibrium states. The thermal accommodation coefficient of the normal velocity component is almost unity, while that of the tangential component shows a decreasing function of the density of vapor incident on the interface, indicating that the tangential velocity distribution of molecules leaving the interface into the vapor phase may deviate from the tangential parts of the Maxwell velocity distribution at the liquid temperature. A mechanism for the deviation of the KBC from the isotropic Maxwell KBC at the liquid temperature is discussed in terms of anisotropic energy relaxation at the interface. The liquid-temperature dependence of the present KBC is also discussed.

Microstructure, Tensile Adhesion Strength and Thermal Shock Resistance of TBCs with Different Flame-Sprayed Bond Coat Materials Onto BMI Polyimide Matrix Composite

NASA Astrophysics Data System (ADS)

Abedi, H. R.; Salehi, M.; Shafyei, A.

2017-10-01

In this study, thermal barrier coatings (TBCs) composed of different bond coats (Zn, Al, Cu-8Al and Cu-6Sn) with mullite top coats were flame-sprayed and air-plasma-sprayed, respectively, onto bismaleimide matrix composites. These polyimide matrix composites are of interest to replace PMR-15, due to concerns about the toxicity of the MDA monomer from which PMR-15 is made. The results showed that pores and cracks appeared at the bond coat/substrate interface for the Al-bonded TBC because of its high thermal conductivity and diffusivity resulting in transferring of high heat flux and temperature to the polymeric substrate during top coat deposition. The other TBC systems due to the lower conductivity and diffusivity of bonding layers could decrease the adverse thermal effect on the polymer substrate during top coat deposition and exhibited adhesive bond coat/substrate interfaces. The tensile adhesion test showed that the adhesion strength of the coatings to the substrate is inversely proportional to the level of residual stress in the coatings. However, the adhesion strength of Al bond-coated sample decreased strongly after mullite top coat deposition due to thermal damage at the bond coat/substrate interface. TBC system with the Cu-6Sn bond coat exhibited the best thermal shock resistance, while Al-bonded TBC showed the lowest. It was inferred that thermal mismatch stresses and oxidation of the bond coats were the main factors causing failure in the thermal shock test.

Effect of artificial aging on the bond durability of fissure sealants.

PubMed

Yun, Xiaofei; Li, Wei; Ling, Chen; Fok, Alex

2013-06-01

To evaluate the effect of artificial aging on the bond durability of fissure sealants in vitro. Twenty bovine incisors received 4 different sealant treatments and were divided into four groups: 1. Ultraseal XT plus (UX); 2. Enamel Loc (EL); 3. 35% phosphoric acid plus Enamel Loc (PEL); 4. Adper Prompt L-Pop plus Clinpro (PPC). Beam-shaped specimens were prepared and randomly divided into three subgroups. One subgroup underwent the microtensile bond strength (µTBS) test after 24-h storage in 37°C water. The other two subgroups were also subjected to the microtensile bond strength test after 5000 and 10,000 thermal cycles, respectively. Another twelve intact human third molars were sealed using 1 of 3 methods and were divided into 3 groups of 4 each: 1. Ultraseal XT plus; 2. Adper Prompt L-Pop plus Clinpro; and 3. Enamel Loc. Two specimens from each group were immersed in a 50% silver nitrate solution for 24 h, followed by exposure to fluorescent light for 8 h, before being scanned in a micro-CT (microcomputer tomography) machine. The other two were handled in the same way after undergoing 10,000 thermal cycles. The CT images obtained were evaluated. All samples from the EL group were broken during preparation, so no µTBS results were available. After 5000 thermal cycles, the bond strengths of the three other groups (UX, PEL, PPC) decreased significantly (p < 0.05). Longer thermocycling (10,000 cycles) resulted in more decreases in µTBS for group PEL and PPC, while the strength of the UX group remained relatively unchanged. After thermocycling, considerable silver penetration could be seen at the sealant/enamel interface of the EL group in micro-CT images. The etch-and-rinse procedure for sealant application promotes higher bond strength under artificial aging. Micro-CT, a nondestructive analytical tool, may be used to evaluate the sealant/enamel interface effectively.

Universal Controller for Spacecraft Mechanisms

NASA Technical Reports Server (NTRS)

Levanas, Greg; McCarthy, Thomas; Hunter, Don; Buchanan, Christine; Johnson, Michael; Cozy, Raymond; Morgan, Albert; Tran, Hung

2006-01-01

An electronic control unit has been fabricated and tested that can be replicated as a universal interface between the electronic infrastructure of a spacecraft and a brushless-motor (or other electromechanical actuator) driven mechanism that performs a specific mechanical function within the overall spacecraft system. The unit includes interfaces to a variety of spacecraft sensors, power outputs, and has selectable actuator control parameters making the assembly a mechanism controller. Several control topologies are selectable and reconfigurable at any time. This allows the same actuator to perform different functions during the mission life of the spacecraft. The unit includes complementary metal oxide/semiconductor electronic components on a circuit board of a type called rigid flex (signifying flexible printed wiring along with a rigid substrate). The rigid flex board is folded to make the unit fit into a housing on the back of a motor. The assembly has redundant critical interfaces, allowing the controller to perform time-critical operations when no human interface with the hardware is possible. The controller is designed to function over a wide temperature range without the need for thermal control, including withstanding significant thermal cycling, making it usable in nearly all environments that spacecraft or landers will endure. A prototype has withstood 1,500 thermal cycles between 120 and +85 C without significant deterioration of its packaging or electronic function. Because there is no need for thermal control and the unit is addressed through a serial bus interface, the cabling and other system hardware are substantially reduced in quantity and complexity, with corresponding reductions in overall spacecraft mass and cost.

Materials and Manufacturing Technology Directorate Thermal Sciences and Materials Branch (Overview)

DTIC Science & Technology

2010-09-01

Molecular Mechanics for thermo-mechanical response Materials Characterization • CNT modified durable thermal interface ( DTI ) • MEMS-based RTD micro...stabilization. Surface Characterization by Atomic Force Microscopy: Probing Thermal, Electrical, and Mechanical Properties Heater Current Path Anchor Leg 50 µm

Heat transfer enhancement in a lithium-ion cell through improved material-level thermal transport

NASA Astrophysics Data System (ADS)

Vishwakarma, Vivek; Waghela, Chirag; Wei, Zi; Prasher, Ravi; Nagpure, Shrikant C.; Li, Jianlin; Liu, Fuqiang; Daniel, Claus; Jain, Ankur

2015-12-01

While Li-ion cells offer excellent electrochemical performance for several applications including electric vehicles, they also exhibit poor thermal transport characteristics, resulting in reduced performance, overheating and thermal runaway. Inadequate heat removal from Li-ion cells originates from poor thermal conductivity within the cell. This paper identifies the rate-limiting material-level process that dominates overall thermal conduction in a Li-ion cell. Results indicate that thermal characteristics of a Li-ion cell are largely dominated by heat transfer across the cathode-separator interface rather than heat transfer through the materials themselves. This interfacial thermal resistance contributes around 88% of total thermal resistance in the cell. Measured value of interfacial resistance is close to that obtained from theoretical models that account for weak adhesion and large acoustic mismatch between cathode and separator. Further, to address this problem, an amine-based chemical bridging of the interface is carried out. This is shown to result in in four-times lower interfacial thermal resistance without deterioration in electrochemical performance, thereby increasing effective thermal conductivity by three-fold. This improvement is expected to reduce peak temperature rise during operation by 60%. By identifying and addressing the material-level root cause of poor thermal transport in Li-ion cells, this work may contributes towards improved thermal performance of Li-ion cells.

Brownian thermal noise in functional optical surfaces

NASA Astrophysics Data System (ADS)

Kroker, S.; Dickmann, J.; Rojas Hurtado, C. B.; Heinert, D.; Nawrodt, R.; Levin, Y.; Vyatchanin, S. P.

2017-07-01

We present a formalism to compute Brownian thermal noise in functional optical surfaces such as grating reflectors, photonic crystal slabs, or complex metamaterials. Such computations are based on a specific readout variable, typically a surface integral of a dielectric interface displacement weighed by a form factor. This paper shows how to relate this form factor to Maxwell's stress tensor computed on all interfaces of the moving surface. As an example, we examine Brownian thermal noise in monolithic T-shaped grating reflectors. The previous computations by Heinert et al. [Phys. Rev. D 88, 042001 (2013), 10.1103/PhysRevD.88.042001] utilizing a simplified readout form factor produced estimates of thermal noise that are tens of percent higher than those of the exact analysis in the present paper. The relation between the form factor and Maxwell's stress tensor implies a close correlation between the optical properties of functional optical surfaces and thermal noise.

Fundamentals and applications of solar energy. Part 2

NASA Astrophysics Data System (ADS)

Faraq, I. H.; Melsheimer, S. S.

Applications of techniques of chemical engineering to the development of materials, production methods, and performance optimization and evaluation of solar energy systems are discussed. Solar thermal storage systems using phase change materials, liquid phase Diels-Alder reactions, aquifers, and hydrocarbon oil were examined. Solar electric systems were explored in terms of a chlorophyll solar cell, the nonequilibrium electric field effects developed at photoelectrode/electrolyte interfaces, and designs for commercial scale processing of solar cells using continuous thin-film coating production methods. Solar coal gasification processes were considered, along with multilayer absorber coatings for solar concentrator receivers, solar thermal industrial applications, the kinetics of anaerobic digestion of crop residues to produce methane, and a procedure for developing a computer simulation of a solar cooling system.

Evaluation of the increase in threading dislocation during the initial stage of physical vapor transport growth of 4H-SiC

NASA Astrophysics Data System (ADS)

Suo, Hiromasa; Tsukimoto, Susumu; Eto, Kazuma; Osawa, Hiroshi; Kato, Tomohisa; Okumura, Hajime

2018-06-01

The increase in threading dislocation during the initial stage of physical vapor transport growth of n-type 4H-SiC crystals was evaluated by cross-sectional X-ray topography. Crystals were grown under two different temperature conditions. A significant increase in threading dislocation was observed in crystals grown at a high, not low, temperature. The local strain distribution in the vicinity of the grown/seed crystal interface was evaluated using the electron backscatter diffraction technique. The local nitrogen concentration distribution was also evaluated by time-of-flight secondary ion mass spectrometry. We discuss the relationship between the increase in threading dislocation and the local strain due to thermal stress and nitrogen concentration.

Growth rates and interface shapes in germanium and lead tin telluride observed in-situ, real-time in vertical Bridgman furnaces

NASA Technical Reports Server (NTRS)

Barber, P. G.; Berry, R. F.; Debnam, W. J.; Fripp, A. L.; Woodell, G.; Simchick, R. T.

1995-01-01

Using the advanced technology developed to visualize the melt-solid interface in low Prandtl number materials, crystal growth rates and interface shapes have been measured in germanium and lead tin telluride semiconductors grown in vertical Bridgman furnaces. The experimental importance of using in-situ, real time observations to determine interface shapes, to measure crystal growth rates, and to improve furnace and ampoule designs is demonstrated. The interface shapes observed in-situ, in real-time were verified by quenching and mechanically induced interface demarcation, and they were also confirmed using machined models to ascertain the absence of geometric distortions. Interface shapes depended upon the interface position in the furnace insulation zone, varied with the nature of the crystal being grown, and were dependent on the extent of transition zones at the ends of the ampoule. Actual growth rates varied significantly from the constant translation rate in response to the thermophysical properties of the crystal and its melt and the thermal conditions existing in the furnace at the interface. In the elemental semiconductor germanium the observed rates of crystal growth exceeded the imposed translation rate, but in the compound semiconductor lead tin telluride the observed rates of growth were less than the translation rate. Finally, the extent of ampoule thermal loading influenced the interface positions, the shapes, and the growth rates.

Simulation of the Thermal Response of Externally Cooled Ordnance Engulfed in Large Aviation Fuel Fires

DTIC Science & Technology

1990-09-01

400j.GE T (Io 1Q0 .(MELT ViH N- T ?A( 11 3 7( 2,( 1 TBEFORE AVG TEMP(OF) L] SIDE INTERFACE TE.M1P CALCULATE THERMAL CONDUCTIVITY CALCULATION | L... ISTE a AVG TEMP EXPLOSIVE SIDE OF INTERFACE AE-0 SLIU INT 00726 ENERGY GENERATED IS. (INT).LT. T •ELT(EXPL) T 0 EI"E’rNG I CALCULATE NEWl TEMP WIlTH

Carbon nanotubes for thermal interface materials in microelectronic packaging

NASA Astrophysics Data System (ADS)

Lin, Wei

As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nanotubes, given their high intrinsic thermal and mechanical properties, and their high thermal and chemical stabilities, have received extensive attention from both academia and industry as a candidate for high-performance thermal interface materials. The thesis is devoted to addressing some challenges related to the potential application of carbon nanotubes as thermal interface materials in microelectronics. These challenges include: 1) controlled synthesis of vertically aligned carbon nanotubes on various bulk substrates via chemical vapor deposition and the fundamental understanding involved; 2) development of a scalable annealing process to improve the intrinsic properties of synthesized carbon nanotubes; 3) development of a state-of-art assembling process to effectively implement high-quality vertically aligned carbon nanotubes into a flip-chip assembly; 4) a reliable thermal measurement of intrinsic thermal transport property of vertically aligned carbon nanotube films; 5) improvement of interfacial thermal transport between carbon nanotubes and other materials. The major achievements are summarized. 1. Based on the fundamental understanding of catalytic chemical vapor deposition processes and the growth mechanism of carbon nanotube, fast synthesis of high-quality vertically aligned carbon nanotubes on various bulk substrates (e.g., copper, quartz, silicon, aluminum oxide, etc.) has been successfully achieved. The synthesis of vertically aligned carbon nanotubes on the bulk copper substrate by the thermal chemical vapor deposition process has set a world record. In order to functionalize the synthesized carbon nanotubes while maintaining their good vertical alignment, an in situ functionalization process has for the first time been demonstrated. The in situ functionalization renders the vertically aligned carbon nanotubes a proper chemical reactivity for forming chemical bonding with other substrate materials such as gold and silicon. 2. An ultrafast microwave annealing process has been developed to reduce the defect density in vertically aligned carbon nanotubes. Raman and thermogravimetric analyses have shown a distinct defect reduction in the CNTs annealed in microwave for 3 min. Fibers spun from the as-annealed CNTs, in comparison with those from the pristine CNTs, show increases of ˜35% and ˜65%, respectively, in tensile strength (˜0.8 GPa) and modulus (˜90 GPa) during tensile testing; an ˜20% improvement in electrical conductivity (˜80000 S m-1) was also reported. The mechanism of the microwave response of CNTs was discussed. Such a microwave annealing process has been extended to the preparation of reduced graphene oxide. 3. Based on the fundamental understanding of interfacial thermal transport and surface chemistry of metals and carbon nanotubes, two major transfer/assembling processes have been developed: molecular bonding and metal bonding. Effective improvement of the interfacial thermal transport has been achieved by the interfacial bonding. 4. The thermal diffusivity of vertically aligned carbon nanotube (VACNT, multi-walled) films was measured by a laser flash technique, and shown to be ˜30 mm2 s-1 along the tube-alignment direction. The calculated thermal conductivities of the VACNT film and the individual CNTs are ˜27 and ˜540 W m-1 K-1, respectively. The technique was verified to be reliable although a proper sampling procedure is critical. A systematic parametric study of the effects of defects, buckling, tip-to-tip contacts, packing density, and tube-tube interaction on the thermal diffusivity was carried out. Defects and buckling decreased the thermal diffusivity dramatically. An increased packing density was beneficial in increasing the collective thermal conductivity of the VACNT film; however, the increased tube-tube interaction in dense VACNT films decreased the thermal conductivity of the individual CNTs. The tip-to-tip contact resistance was shown to be ˜1x10-7 m2 K W -1. The study will shed light on the potential application of VACNTs as thermal interface materials in microelectronic packaging. 5. A combined process of in situ functionalization and microwave curing has been developed to effective enhance the interface between carbon nanotubes and the epoxy matrix. Effective medium theory has been used to analyze the interfacial thermal resistance between carbon nanotubes and polymer matrix, and that between graphite nanoplatlets and polymer matrix.

Vertically aligned carbon nanotube arrays as thermal interface material for vibrational structure of piezoelectric transformer

NASA Astrophysics Data System (ADS)

Chen, Lie; Ju, Bin; Feng, Zhihua; Zhao, Yang

2018-07-01

The application and characterization of thermal interface material (TIM) for vibrational structures is investigated in this paper. The vibrating feature during the operation requires unique solution for its thermal management, since the connection between the device and heat dissipater should be able to conduct heat efficiently and impose minimum constraint onto the vibration simultaneously. As a typical vibrational device, piezoelectric transformers (PTs) are discussed in this paper. The PTs have urgent demands for thermal dissipation since their power conversion efficiency decrease rapidly with the rising temperature. A novel method by applying vertically aligned carbon nanotube (VACNT) arrays to the interface between PT and heat dissipater is presented to enhance the performance of piezoelectric transformers. VACNT arrays are one of the excellent TIMs. It can directly establish thermal contact between two surfaces by van der Waals’ forces. In addition, the unique anisotropic character of CNT arrays provides enough flexibility to accommodate the vibration during the operation. Different configurations of TIMs are compared with each other in this work, including CNT arrays, tape of polypropylene (PP) membrane and without heat transfer structure (HTS). The results indicate that the temperature rise is lowest and the efficiency is highest at the same power density while CNT arrays served as the TIM. Almost no significant fretting and wearing damage occurred on PT electrode surface with CNT arrays TIM even after working continuously for 120 days. Meanwhile, the thermo-physical properties of CNT arrays at contact interface are measured by optical transient thermo-reflectance technique.

Experimental investigation on IXV TPS interface effects in Plasmatron

NASA Astrophysics Data System (ADS)

Ceglia, Giuseppe; Trifoni, Eduardo; Gouriet, Jean-Baptiste; Chazot, Olivier; Mareschi, Vincenzo; Rufolo, Giuseppe; Tumino, Giorgio

2016-06-01

An experimental investigation related to the thermal protection system (TPS) interfaces of the intermediate experimental vehicle has been carried out in the Plasmatron facility at the von Karman Institute for fluid dynamics. The objective of this test campaign is to qualify the thermal behaviours of two different TPS interfaces under flight representative conditions in terms of heat flux and integral heat load ( 180 kW/m2 for 700 s). Three test samples are tested in off-stagnation configuration installed on an available flat plate holder under the same test conditions. The first junction is composed of an upstream ceramic matrix composite (CMC) plate and an ablative P50 cork composite block separated by a gap of 2 mm. The second one is made of an upstream P50 block and a downstream ablative SV2A silicon elastomer block with silicon-based filler in between. A sample composed of P50 material is tested in order to obtain reference results without TPS interface effect. The overheating at the CMC-P50 interface due to the jump of the catalytic properties of the materials, and the recession/swelling behaviour of the P50-SV2A interface are under investigation. All the test samples withstand relatively well the imposed heat flux for the test duration. As expected, both the ablative materials undergo a thermal degradation. The P50 exhibits the formation of a porous char layer and its recession; on the other hand, the SV2A swells and forms a fragile char layer.

Phase evolution and thermal properties of yttria-stabilized hafnia nano-coatings deposited on alumina

NASA Astrophysics Data System (ADS)

Rubio, Ernesto Javier

High-temperature coatings are critical to the future power-generation systems and industries. Thermal barrier coatings (TBCs), which are usually the ceramic materials applied as thin coatings, protect engine components and allow further increase in engine temperatures for higher efficiency. Thus, the durability and reliability of the coating systems have to be more robust compared to current natural gas based engines. While a near and mid-term target is to develop TBC architecture with a 1300 °C surface temperature tolerance, a deeper understanding of the structure evolution and thermal behavior of the TBC-bond coat interface, specifically the thermally grown oxide (TGO), is of primary importance. In the present work, attention is directed towards yttria-stabilized hafnia (YSH) coatings on alumina (α-Al2O 3) to simulate the TBC-TGO interface and understand the phase evolution, microstructure and thermal oxidation of the coatings. YSH coatings were grown on α-Al2O3 substrates by sputter deposition by varying coating thickness in a wide range ˜30-1000 nm. The effect of coating thickness on the structure, morphology and the residual stress has been investigated using X-ray diffraction (XRD) and high resolution scanning electron microscopy (SEM). Thermal oxidation behavior of the coatings has been evaluated using the isothermal oxidation measurements under static conditions. X-ray diffraction analyses revealed the existence of monoclinic hafnia phase for relatively thin coatings indicating that the interfacial phenomena are dominant in phase stabilization. The evolution towards pure stabilized cubic phase of hafnia with the increasing coating thickness is observed. The SEM results indicate the changes in morphology of the coatings; the average grain size increases from 15 to 500 nm with increasing thickness. Residual stress was calculated employing XRD using the variable ψ-angle. Relation between residual stress and structural change is also studied. The results obtained on the thermal oxidation behavior indicate that the YSH coatings exhibit initial mass gain in the first 6 hours and sustained structure for extended hours of thermal treatment.

Thermal conductance of Teflon and Polyethylene: Insight from an atomistic, single-molecule level

PubMed Central

Buerkle, Marius; Asai, Yoshihiro

2017-01-01

The thermal transport properties of teflon (polytetrafluoroethylene) and its polyethylene counterparts are, while highly desirable and widely used, only superficially understood. Here, we aim therefore to provide rigorous insight from an atomistic point of view in context of single-molecule devices. We show that for vinyl polymers adsorbed on metal-surfaces the thermal transport strongly depends on the properties of the metal-molecule interface and that the reduced thermal conductance observed for teflon derivatives originates in a reduced phonon injection life time. In asymmetric molecules phonon blocking on the intra molecular interface leads to a further reduction of thermal conductance. For hetrojunctions with different electrode materials we find that thermal conductance is suppressed due to a reduced overlap of the available phonon modes in the different electrodes. A detailed atomistic picture is thereby provided by studying the transport through perfluorooctane and octane on a single-molecule level using first principles transport calculations and nonequilibrium molecular dynamic simulations. PMID:28150738

A 3D graphene interface (Si-doped) of Ag matrix with excellent electronic transmission and thermal conductivity via nano-assembly modification

NASA Astrophysics Data System (ADS)

Ye, Xianzhu; Li, Ming; Zhang, Yafei

2018-04-01

The wide development of electronic materials requires higher load capacity and high temperature resistance. In this study, a novel architecture was fabricated consisting of a 3D reduced graphene oxide (rGO)-Si interface using a simple nano-assembly sintering to achieve high current capacity and excellent thermal features. Via the analysis of catalytic oxidation for methanol, the loading catalytic activity of nano-Ag still remained to a certain extent for the composite with 0.8 vol.% rGO. The final Ag-rGO composite apparently possesses a higher initial oxidation temperature and lower rate of oxidation for internal passing and shielding, and the thermal conductivity is significantly enhanced from 344 to 407 W m‑1 K‑1. Importantly, with a 3D synergistic transportation network, the resistivity of the Ag-rGO composite is much lower than pure Ag, and with a longer conductive time under a stress condition of current density of 6.0  ×  104 A cm‑2. Thermal-electronic features demonstrate that the dispersed graphene interface can efficiently suppress the primary failure pathways (high temperature) in Ag matrix and make it uniquely efficient for the advancement of microscale and thermal-management electronics.

The Effect of Interface Roughness and Oxide Film Thickness on the Inelastic Response of Thermal Barrier Coatings to Thermal Cycling

NASA Technical Reports Server (NTRS)

Pindera, Marek-Jerzy; Aboudi, Jacob; Arnold, Steven M.

1999-01-01

The effects of interfacial roughness and oxide film thickness on thermally-induced stresses in plasma-sprayed thermal barrier coatings subjected to thermal cycling are investigated using the recently developed higher-order theory for functionally graded materials. The higher-order theory is shown to be a viable alternative to the finite-element approach, capable of modeling different interfacial roughness architectures in the presence of an aluminum oxide layer and capturing the high stress gradients that occur at the top coat/bond coat interface. The oxide layer thickness is demonstrated to have a substantially greater effect on the evolution of residual stresses than local variations in interfacial roughness. Further, the location of delamination initiation in the top coat is predicted to change with increasing oxide layer thickness. This result can be used to optimize the thickness of a pre-oxidized layer introduced at the top coat/bond coat interface in order to enhance TBC durability as suggested by some researchers. The results of our investigation also support a recently proposed hypothesis regarding delamination initiation and propagation in the presence of an evolving bond coat oxidation, while pointing to the importance of interfacial roughness details and specimen geometry in modeling this phenomenon.

Thermal time constant: optimising the skin temperature predictive modelling in lower limb prostheses using Gaussian processes

PubMed Central

Buis, Arjan

2016-01-01

Elevated skin temperature at the body/device interface of lower-limb prostheses is one of the major factors that affect tissue health. The heat dissipation in prosthetic sockets is greatly influenced by the thermal conductive properties of the hard socket and liner material employed. However, monitoring of the interface temperature at skin level in lower-limb prosthesis is notoriously complicated. This is due to the flexible nature of the interface liners used which requires consistent positioning of sensors during donning and doffing. Predicting the residual limb temperature by monitoring the temperature between socket and liner rather than skin and liner could be an important step in alleviating complaints on increased temperature and perspiration in prosthetic sockets. To predict the residual limb temperature, a machine learning algorithm – Gaussian processes is employed, which utilizes the thermal time constant values of commonly used socket and liner materials. This Letter highlights the relevance of thermal time constant of prosthetic materials in Gaussian processes technique which would be useful in addressing the challenge of non-invasively monitoring the residual limb skin temperature. With the introduction of thermal time constant, the model can be optimised and generalised for a given prosthetic setup, thereby making the predictions more reliable. PMID:27695626

Thermal time constant: optimising the skin temperature predictive modelling in lower limb prostheses using Gaussian processes.

PubMed

Mathur, Neha; Glesk, Ivan; Buis, Arjan

2016-06-01

Elevated skin temperature at the body/device interface of lower-limb prostheses is one of the major factors that affect tissue health. The heat dissipation in prosthetic sockets is greatly influenced by the thermal conductive properties of the hard socket and liner material employed. However, monitoring of the interface temperature at skin level in lower-limb prosthesis is notoriously complicated. This is due to the flexible nature of the interface liners used which requires consistent positioning of sensors during donning and doffing. Predicting the residual limb temperature by monitoring the temperature between socket and liner rather than skin and liner could be an important step in alleviating complaints on increased temperature and perspiration in prosthetic sockets. To predict the residual limb temperature, a machine learning algorithm - Gaussian processes is employed, which utilizes the thermal time constant values of commonly used socket and liner materials. This Letter highlights the relevance of thermal time constant of prosthetic materials in Gaussian processes technique which would be useful in addressing the challenge of non-invasively monitoring the residual limb skin temperature. With the introduction of thermal time constant, the model can be optimised and generalised for a given prosthetic setup, thereby making the predictions more reliable.

Mechanism of electromigration failure in Damascene processed copper interconnects

NASA Astrophysics Data System (ADS)

Michael, Nancy Lyn

2002-11-01

A major unresolved issue in Cu interconnect reliability is the interface role in the failure mechanism of real structures. The present study investigates failure in single-level damascene Cu interconnects with variations in interface condition, passivation and barrier, and linewidth. In the first phase, accelerated electromigration testing of 0.25mum Cu interconnects capped with SiN or SiCN, shows that lifetime and failure mode vary with capping layer. The first mode, seen primarily in SiN samples, is characterized by gradual resistance increase and extensive interface damage, believed to result from failure led by interface electromigration. The competing failure mode, found in SiCN capped samples, is characterized by abrupt resistance increase and localized voiding. The second phase fixes SiCN as the capping material and varies barrier material and line width. The three barrier materials, Ta, TaN, and Ta/TaN, produce similar lifetime statistics and failure is abrupt. Line width, however, does have a strong influence on failure time. The line width/grain size ratio ranged from 0.53 to 2.2 but does not correlate with mean time to failure (MTF). The strong dependence on interface fraction, combined with the conclusion from phase one that interface electromigration is not rate controlling, suggests another mechanism related to the interface is a controlling factor. The possibility that contamination and defects at the interface are key to this failure mode was investigated using electro-thermal fatigue (ETF). In ETF, where lines are simultaneously subjected to thermal cycling and constant current, damage caused by thermal stress is accelerated. Tests reveal that in 80 nm lines, transient failure occurs at times far below MTF in electromigration tests at higher temperatures. Failure found in ETF is clearly a result of damage growth due to thermal/mechanical stress rather than electromigration. At the stress levels created by the moderate ETF test conditions, the only place voids are likely to nucleate and grow is at pre-existing defects and impurities. In narrower lines, where smaller voids can cause catastrophic damage, defects have a greater effect on MTF. Results from this investigation suggest that impurities and defects in the Cu and at the interface, must be carefully controlled to make reliable narrow Cu interconnects.

High thermal stability of abrupt SiO2/GaN interface with low interface state density

NASA Astrophysics Data System (ADS)

Truyen, Nguyen Xuan; Taoka, Noriyuki; Ohta, Akio; Makihara, Katsunori; Yamada, Hisashi; Takahashi, Tokio; Ikeda, Mitsuhisa; Shimizu, Mitsuaki; Miyazaki, Seiichi

2018-04-01

The effects of postdeposition annealing (PDA) on the interface properties of a SiO2/GaN structure formed by remote oxygen plasma-enhanced chemical vapor deposition (RP-CVD) were systematically investigated. X-ray photoelectron spectroscopy clarified that PDA in the temperature range from 600 to 800 °C has almost no effects on the chemical bonding features at the SiO2/GaN interface, and that positive charges exist at the interface, the density of which can be reduced by PDA at 800 °C. The capacitance-voltage (C-V) and current density-SiO2 electric field characteristics of the GaN MOS capacitors also confirmed the reduction in interface state density (D it) and the improvement in the breakdown property of the SiO2 film after PDA at 800 °C. Consequently, a high thermal stability of the SiO2/GaN structure with a low fixed charge density and a low D it formed by RP-CVD was demonstrated. This is quite informative for realizing highly robust GaN power devices.

Adsorption and solvation of ethanol at the water liquid-vapor interface: a molecular dynamics study

NASA Technical Reports Server (NTRS)

Wilson, M. A.; Pohorille, A.

1997-01-01

The free energy profiles of methanol and ethanol at the water liquid-vapor interface at 310K were calculated using molecular dynamics computer simulations. Both alcohols exhibit a pronounced free energy minimum at the interface and, therefore, have positive adsorption at this interface. The surface excess was computed from the Gibbs adsorption isotherm and was found to be in good agreement with experimental results. Neither compound exhibits a free energy barrier between the bulk and the surface adsorbed state. Scattering calculations of ethanol molecules from a gas phase thermal distribution indicate that the mass accommodation coefficient is 0.98, and the molecules become thermalized within 10 ps of striking the interface. It was determined that the formation of the solvation structure around the ethanol molecule at the interface is not the rate-determining step in its uptake into water droplets. The motion of an ethanol molecule in a water lamella was followed for 30 ns. The time evolution of the probability distribution of finding an ethanol molecule that was initially located at the interface is very well described by the diffusion equation on the free energy surface.

Probing the low thermal conductivity of single-crystalline porous Si nanowires

NASA Astrophysics Data System (ADS)

Zhao, Yunshan; Lina Yang Collaboration; Lingyu Kong Collaboration; Baowen Li Collaboration; John T L Thong Collaboration; Kedar Hippalgaonkar Collaboration

Pore-like structures provide a novel way to reduce the thermal conductivity of silicon nanowires, compared to both smooth-surface VLS nanowires and rough EE nanowires. Because of enhanced phonon scattering with interface and decrease in phonon transport path, the porous nanostructures show reduction in thermal conductance by few orders of magnitude. It proves to be extremely challenging to evaluate porosity accurately in an experimental manner and further understand its effect on thermal transport. In this study, we use the newly developed electron-beam based micro-electrothermal device technique to study the porosity dependent thermal conductivity of mesoporous silicon nanowires that have single-crystalline scaffolding. Based on the Casino simulation, the power absorbed by the nanowire, coming from the loss of travelling electron energy, has a linear relationship with it cross section. The relationship has been verified experimentally as well. Monte Carlo simulation is carried out to theoretically predict the thermal conductivity of silicon nanowires with a specific value of porosity. These single-crystalline porous silicon nanowires show extremely low thermal conductivity, even below the amorphous limit. These structures together with our experimental techniques provide a particularly intriguing platform to understand the phonon transport in nanoscale and aid the performance improvement in future nanowires-based devices.

Shuttle infrared telescope facility (SIRTF) preliminary design study

NASA Technical Reports Server (NTRS)

1976-01-01

An overall picture of the SIRTF system is first presented, including the telescope, focal plane instruments, cryogen supply, shuttle and spacelab support subsystems, mechanical and data interfaces with the vehicles, ground support equipment, and system requirements. The optical, mechanical, and thermal characteristics of the telescope are then evaluated, followed by a description of the SIRTF internal stabilization subsystem and its interface with the IPS. Expected performance in the shuttle environment is considered. Tradeoff studies are described, including the Gregorian versus the Cassegrain telescope, aperture diameter tradeoff, a CCD versus an image dissector for the star tracker, the large ambient telescope versus the SIRTF, and a dedicated gimbal versus the IPS. Operations from integration through launch and recovery are also discussed and cost estimates for the program are presented.

The Response of the Ocean Thermal Skin Layer to Air-Sea Surface Heat Fluxes

NASA Astrophysics Data System (ADS)

Wong, Elizabeth Wing-See

There is much evidence that the ocean is heating as a result of an increase in concentrations of greenhouse gases (GHGs) in the atmosphere from human activities. GHGs absorb infrared radiation and re-emit infrared radiation back to the ocean's surface which is subsequently absorbed. However, the incoming infrared radiation is absorbed within the top micrometers of the ocean's surface which is where the thermal skin layer exists. Thus the incident infrared radiation does not directly heat the upper few meters of the ocean. We are therefore motivated to investigate the physical mechanism between the absorption of infrared radiation and its effect on heat transfer at the air-sea boundary. The hypothesis is that since heat lost through the air-sea interface is controlled by the thermal skin layer, which is directly influenced by the absorption and emission of infrared radiation, the heat flow through the thermal skin layer adjusts to maintain the surface heat loss, assuming the surface heat loss does not vary, and thus modulates the upper ocean heat content. This hypothesis is investigated through utilizing clouds to represent an increase in incoming longwave radiation and analyzing retrieved thermal skin layer vertical temperature profiles from a shipboard infrared spectrometer from two research cruises. The data are limited to night-time, no precipitation and low winds of less than 2 m/s to remove effects of solar radiation, wind-driven shear and possibilities of thermal skin layer disruption. The results show independence of the turbulent fluxes and emitted radiation on the incident radiative fluxes which rules out the immediate release of heat from the absorption of the cloud infrared irradiance back into the atmosphere through processes such as evaporation and increase infrared emission. Furthermore, independence was confirmed between the incoming and outgoing radiative flux which implies the heat sink for upward flowing heat at the air-sea interface is more-or-less fixed. The surplus energy, from absorbing increasing levels of infrared radiation, is found to adjust the curvature of the thermal skin layer such that there is a smaller gradient at the interface between the thermal skin layer and the mixed layer beneath. The vertical conduction of heat from the mixed layer to the surface is therefore hindered while the additional energy within the thermal skin layer is supporting the gradient changes of the skin layer's temperature profile. This results in heat beneath the thermal skin layer, which is a product of the absorption of solar radiation during the day, to be retained and cause an increase in upper ocean heat content. The accuracy of four published skin layer models were evaluated by comparison with the field results. The results show a need to include radiative effects, which are currently absent, in such models as they do not replicate the findings from the field data and do not elucidate the effects of the absorption of infrared radiation.

Process dependent morphology of the Si/SiO2 interface measured with scanning tunneling microscopy

NASA Technical Reports Server (NTRS)

Hecht, Michael H.; Bell, L. D.; Grunthaner, F. J.; Kaiser, W. J.

1988-01-01

A new experimental technique to determine Si/SiO2 interface morphology is described. Thermal oxides of silicon are chemically removed, and the resulting surface topography is measured with scanning tunneling microscopy. Interfaces prepared by oxidation of Si (100) and (111) surfaces, followed by postoxidation anneal (POA) at different temperatures, have been characterized. Correlations between interface structure, chemistry, and electrical characteristics are described.

LANDSAT-2 and LANDSAT-3 Flight evaluation report

NASA Technical Reports Server (NTRS)

Winchester, T. W.

1978-01-01

Flight performance analysis of LANDSAT 2 and LANDSAT 3 are presented for the period July 1978 to October 1978. Spacecraft operations and orbital parameters are summarized for each spacecraft. Data are provided on the performance and operation of the following subsystems onboard the spacecraft: power; attitude control; command/clock; telemetry; orbit adjust; magnetic moment compensating assembly; unified S band/premodulation processor; electrical interface; thermal narrowband tape recorders; wideband telemetry; attitude measurement sensor; wideband video tape recorders; return beam vidicon; multispectral scanner subsystem; and data collections.

Ultracompliant Heterogeneous Copper-Tin Nanowire Arrays Making a Supersolder

DOE Office of Scientific and Technical Information (OSTI.GOV)

Narumanchi, Sreekant V; Feng, Xuhui; Major, Joshua

Due to the substantial increase in power density, thermal interface resistance that can constitute more than 50% of the total thermal resistance has generally become a bottleneck for thermal management in electronics. However, conventional thermal interface materials (TIMs) such as solder, epoxy, gel, and grease cannot fulfill the requirements of electronics for high-power and long-term operation. Here, we demonstrate a high-performance TIM consisting of a heterogeneous copper-tin nanowire array, which we term 'supersolder' to emulate the role of conventional solders in bonding various surfaces. The supersolder is ultracompliant with a shear modulus 2-3 orders of magnitude lower than traditional soldersmore » and can reduce the thermal resistance by two times as compared with the state-of-the-art TIMs. This supersolder also exhibits excellent long-term reliability with >1200 thermal cycles over a wide temperature range. By resolving this critical thermal bottleneck, the supersolder enables electronic systems, ranging from microelectronics and portable electronics to massive data centers, to operate at lower temperatures with higher power density and reliability.« less

Thermal diffusivity measurement of GaAs/AlGaAs thin-film structures

NASA Astrophysics Data System (ADS)

Chen, G.; Tien, C. L.; Wu, X.; Smith, J. S.

1994-05-01

This work develops a new measurement technique that determines the thermal diffusivity of thin films in both parallel and perpendicular directions, and presents experimental results on the thermal diffusivity of GaAs/AlGaAs-based thin-film structures. In the experiment, a modulated laser source heats up the sample and a fast-response temperature sensor patterned directly on the sample picks up the thermal response. From the phase delay between the heating source and the temperature sensor, the thermal diffusivity in either the parallel or perpendicular direction is obtained depending on the experimental configuration. The experiment is performed on a molecular-beam-epitaxy grown vertical-cavity surface-emitting laser (VCSEL) structure. The substrates of the samples are etched away to eliminate the effects of the interface between the film and the substrate. The results show that the thermal diffusivity of the VCSEL structure is 5-7 times smaller than that of its corresponding bulk media. The experiments also provide evidence on the anisotropy of thermal diffusivity caused solely by the effects of interfaces and boundaries of thin films.

Thermal Stir Welder

NASA Technical Reports Server (NTRS)

Ding, R. Jeffrey (Inventor)

2012-01-01

A welding apparatus is provided for forming a weld joint between first and second elements of a workpiece. The apparatus heats the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding mixer, to remove any dendritic-type weld microstructures introduced into the interface material during heating.

Flexural resonance mechanism of thermal transport across graphene-SiO2 interfaces

NASA Astrophysics Data System (ADS)

Ong, Zhun-Yong; Qiu, Bo; Xu, Shanglong; Ruan, Xiulin; Pop, Eric

2018-03-01

Understanding the microscopic mechanism of heat dissipation at the dimensionally mismatched interface between a two-dimensional (2D) crystal and its substrate is crucial for the thermal management of devices based on 2D materials. Here, we study the lattice contribution to thermal (Kapitza) transport at graphene-SiO2 interfaces using molecular dynamics (MD) simulations and non-equilibrium Green's functions (NEGF). We find that 78 percent of the Kapitza conductance is due to sub-20 THz flexural acoustic modes, and that a resonance mechanism dominates the interfacial phonon transport. MD and NEGF estimate the classical Kapitza conductance to be hK ≈ 10 to 16 MW K-1 m-2 at 300 K, respectively, consistent with existing experimental observations. Taking into account quantum mechanical corrections, this value is approximately 28% lower at 300 K. Our calculations also suggest that hK scales as T2 at low temperatures (T < 100 K) due to the linear frequency dependence of phonon transmission across the graphene-SiO2 interface at low frequencies. Our study sheds light on the role of flexural acoustic phonons in heat dissipation from graphene to its substrate.

Structural and thermal interface characteristics of Stirling cycle cryocoolers for space applications

NASA Technical Reports Server (NTRS)

Boyle, R.; James, E.; Miller, P.; Arillo, V.; Sparr, L.; Castles, S.

1991-01-01

Integration of a Stirling cycle cryocooler into a flight system will require careful attention to the thermal, structural, and electrical interfaces between the cryocooler, the instrument and the spacecraft. These issues are currently under investigation by National Aeronautics and Space Administration/Goddard Space Flight Center personnel in laboratory tests of representative longlife cryocoolers. An 80 K cryocooler has been instrumented as a testbed for vibration control systems characterization. Initial vibration data using a new six-DOF force dynamometer is presented in this report.

Interface conductance modal analysis of lattice matched InGaAs/InP

NASA Astrophysics Data System (ADS)

Gordiz, Kiarash; Henry, Asegun

2016-05-01

We studied the heat conduction at InGaAs/InP interfaces and found that the total value of interface conductance was quite high ˜830 MW m-2 K-1. The modal contributions to the thermal interface conductance (TIC) were then investigated to determine the mode responsible. Using the recently developed interface conductance modal analysis method, we showed that more than 70% of the TIC arises from extended modes in the system. The lattice dynamics calculations across the interface revealed that, unlike any other interfaces previously studied, the different classes of vibration around the interface of InGaAs/InP naturally segregate into distinct regions with respect to frequency. In addition, interestingly, the entire region of frequency overlap between the sides of the interface is occupied by extended modes, whereby the two materials vibrate together with a single frequency. We also mapped the correlations between modes, which showed that the contribution by extended modes to the TIC primarily arises from coupling to the modes that have the same frequencies of vibration (i.e., autocorrelations). Moreover, interfacial modes despite their low population still contribute more than 6% to interfacial thermal transport. The analysis sheds light on the nature of heat conduction by different classes of vibration that exist in interfacial systems, which has technological relevance to applications such as thermophotovoltaics and optoelectronics.

Thermal Design, Analysis, and Testing of the Quench Module Insert Bread Board

NASA Technical Reports Server (NTRS)

Breeding, Shawn; Khodabandeh, Julia

2002-01-01

Contents include the following: Quench Module Insert (QMI) science requirements. QMI interfaces. QMI design layout. QMI thermal analysis and design methodology. QMI bread board testing and instrumentation approach. QMI thermal probe design parameters. Design features for gradient measurement. Design features for heated zone measurements. Thermal gradient analysis results. Heated zone analysis results. Bread board thermal probe layout. QMI bread board correlation and performance. Summary and conclusions.

The energetics of adhesion in composite materials

NASA Astrophysics Data System (ADS)

Harding, Philip Hiram

Composite materials are used throughout modern society, and often the most important parameter in determining their properties is the adhesion at material interfaces within the composite. A broad investigation is completed, the global objective of which is to develop understanding of the role of adhesion in composite materials. The scope of this study ranges from macroscopic effects of adhesion on filled polymer composites to microscopic adhesion measurements with engineered interfaces. The surface of a filler material is systematically modified and surface characterization techniques are used to quantify the influence of the surface treatments on surface energetics and wetting properties. Filled polymer composites are prepared and composite mechanical properties determined with beam deflection tests. Filler surface treatments significantly alter the composite yield stress for composites which fail interfacially and are observed to increase or decrease mechanical strength, depending on the chemical nature of the modification. Thermodynamic adhesion mechanisms active at the filler-matrix interfaces are then explored by making direct interfacial strength measurements whereby a single spherical particle is introduced into the polymeric matrix. Interfacial strength is determined by submitting the single-particle composite (SPC) to uni-axial tension and relating the macroscopic stress at interfacial failure to that experienced at the interface. The technique provides a measurement of interfacial strength between two elastic materials, one unaffected by frictional forces, viscoelasticity, and thermal stresses. The SPC measurements are used to verify proposed adhesion mechanisms at the various filler-polymer interfaces and establish the role of adhesion in the filled polymer composites. The SPC technique is then used to investigate the adhesion promotion mechanism of organofunctional silanes, which are shown to be controlled by the compatibility and penetration of the silane organofunctional group. The effects of thermal residual stresses on interfacial strength are also investigated using the SPC technique. Processing conditions, i.e., time-temperature profiles, are used to systematically vary the thermal residual stresses within the polymeric matrix. The interfaces studied are deleteriously affected by increases in thermal residual stresses.

Relationship between negative differential thermal resistance and asymmetry segment size

NASA Astrophysics Data System (ADS)

Kong, Peng; Hu, Tao; Hu, Ke; Jiang, Zhenhua; Tang, Yi

2018-03-01

Negative differential thermal resistance (NDTR) was investigated in a system consisting of two dissimilar anharmonic lattices exemplified by Frenkel-Kontorova (FK) lattices and Fremi-Pasta-Ulam (FPU) lattices (FK-FPU). The previous theoretical and numerical simulations show the dependence of NDTR are the coupling constant, interface and system size, but we find the segment size also to be an important element. It’s interesting that NDTR region depends on FK segment size rather than FPU segment size in this coupling FK-FPU model. Remarkably, we could observe that NDTR appears in the strong interface coupling strength case which is not NDTR in previous studies. The results are conducive to further developments in designing and fabricating thermal devices.

Transient Mass and Thermal Transport during Methane Adsorption into the Metal-Organic Framework HKUST-1.

PubMed

Babaei, Hasan; McGaughey, Alan J H; Wilmer, Christopher E

2018-01-24

Methane adsorption into the metal-organic framework (MOF) HKUST-1 and the resulting heat generation and dissipation are investigated using molecular dynamics simulations. Transient simulations reveal that thermal transport in the MOF occurs two orders of magnitude faster than gas diffusion. A large thermal resistance at the MOF-gas interface (equivalent to 127 nm of bulk HKUST-1), however, prevents fast release of the generated heat. The mass transport resistance at the MOF-gas interface is equivalent to 1 nm of bulk HKUST-1 and does not present a bottleneck in the adsorption process. These results provide important insights into the application of MOFs for gas storage applications.

Orion Passive Thermal Control Overview

NASA Technical Reports Server (NTRS)

Miller, Stephen W.

2007-01-01

An viewgraph presentation of Orion's passive thermal control system is shown. The topics include: 1) Orion in CxP Hierarchy; 2) General Orion Description/Orientation; 3) Module Descriptions and Images; 4) Orion PTCS Overview; 5) Requirements/Interfaces; 6) Design Reference Missions; 7) Natural Environments; 8) Thermal Models; 9) Challenges/Issues; and 10) Testing

Dominant phonon polarization conversion across dimensionally mismatched interfaces: Carbon-nanotube-graphene junction

NASA Astrophysics Data System (ADS)

Shi, Jingjing; Lee, Jonghoon; Dong, Yalin; Roy, Ajit; Fisher, Timothy S.; Ruan, Xiulin

2018-04-01

Dimensionally mismatched interfaces are emerging for thermal management applications, but thermal transport physics remains poorly understood. Here we consider the carbon-nanotube-graphene junction, which is a dimensionally mismatched interface between one- and two-dimensional materials and is the building block for carbon-nanotube (CNT)-graphene three-dimensional networks. We predict the transmission function of individual phonon modes using the wave packet method; surprisingly, most incident phonon modes show predominantly polarization conversion behavior. For instance, longitudinal acoustic (LA) polarizations incident from CNTs transmit mainly into flexural transverse (ZA) polarizations in graphene. The frequency stays the same as the incident mode, indicating elastic transmission. Polarization conversion is more significant as the phonon wavelength increases. We attribute such unique phonon polarization conversion behavior to the dimensional mismatch across the interface, and it opens significantly new phonon transport channels as compared to existing theories where polarization conversion is neglected.

Study of SiO{sub 2}/4H-SiC interface nitridation by post-oxidation annealing in pure nitrogen gas

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chanthaphan, Atthawut, E-mail: chanthaphan@asf.mls.eng.osaka-u.ac.jp; Hosoi, Takuji, E-mail: hosoi@mls.eng.osaka-u.ac.jp; Shimura, Takayoshi

An alternative and effective method to perform interface nitridation for 4H-SiC metal-oxide-semiconductor (MOS) devices was developed. We found that the high-temperature post-oxidation annealing (POA) in N{sub 2} ambient was beneficial to incorporate a sufficient amount of nitrogen atoms directly into thermal SiO{sub 2}/SiC interfaces. Although N{sub 2}-POA was ineffective for samples with thick thermal oxide layers, interface nitridation using N{sub 2}-POA was achieved under certain conditions, i.e., thin SiO{sub 2} layers (< 15 nm) and high annealing temperatures (>1350°C). Electrical characterizations of SiC-MOS capacitors treated with high-temperature N{sub 2}-POA revealed the same evidence of slow trap passivation and fast trapmore » generation that occurred in NO-treated devices fabricated with the optimized nitridation conditions.« less

Cyclic Failure Mechanisms of Thermal and Environmental Barrier Coating Systems Under Thermal Gradient Test Conditions

NASA Technical Reports Server (NTRS)

Zhu, Dongming; Lee, Kang N.; Miller, Robert A.

2002-01-01

Plasma-sprayed ZrO2-8wt%Y2O3 and mullite+BSAS/Si multilayer thermal and environmental barrier coating (TBC-EBC) systems on SiC/SiC ceramic matrix composite (CMC) substrates were thermally cyclic tested under high thermal gradients using a laser high-heat-flux rig in conjunction with furnace exposure in water-vapor environments. Coating sintering and interface damage were assessed by monitoring the real-time thermal conductivity changes during the laser heat-flux tests and by examining the microstructural changes after exposure. Sintering kinetics of the coating systems were also independently characterized using a dilatometer. It was found that the coating failure involved both the time-temperature dependent sintering and the cycle frequency dependent cyclic fatigue processes. The water vapor environments not only facilitated the initial coating conductivity increases due to enhanced sintering and interface reaction, but also promoted later conductivity reductions due to the accelerated coating cracking and delamination. The failure mechanisms of the coating systems are also discussed based on the cyclic test results and are correlated to the sintering and thermal stress behavior under the thermal gradient test conditions.

The Neural-fuzzy Thermal Error Compensation Controller on CNC Machining Center

NASA Astrophysics Data System (ADS)

Tseng, Pai-Chung; Chen, Shen-Len

The geometric errors and structural thermal deformation are factors that influence the machining accuracy of Computer Numerical Control (CNC) machining center. Therefore, researchers pay attention to thermal error compensation technologies on CNC machine tools. Some real-time error compensation techniques have been successfully demonstrated in both laboratories and industrial sites. The compensation results still need to be enhanced. In this research, the neural-fuzzy theory has been conducted to derive a thermal prediction model. An IC-type thermometer has been used to detect the heat sources temperature variation. The thermal drifts are online measured by a touch-triggered probe with a standard bar. A thermal prediction model is then derived by neural-fuzzy theory based on the temperature variation and the thermal drifts. A Graphic User Interface (GUI) system is also built to conduct the user friendly operation interface with Insprise C++ Builder. The experimental results show that the thermal prediction model developed by neural-fuzzy theory methodology can improve machining accuracy from 80µm to 3µm. Comparison with the multi-variable linear regression analysis the compensation accuracy is increased from ±10µm to ±3µm.

Molecular dynamics study of interfacial thermal transport between silicene and substrates.

PubMed

Zhang, Jingchao; Hong, Yang; Tong, Zhen; Xiao, Zhihuai; Bao, Hua; Yue, Yanan

2015-10-07

In this work, the interfacial thermal transport across silicene and various substrates, i.e., crystalline silicon (c-Si), amorphous silicon (a-Si), crystalline silica (c-SiO2) and amorphous silica (a-SiO2) are explored by classical molecular dynamics (MD) simulations. A transient pulsed heating technique is applied in this work to characterize the interfacial thermal resistance in all hybrid systems. It is reported that the interfacial thermal resistances between silicene and all substrates decrease nearly 40% with temperature from 100 K to 400 K, which is due to the enhanced phonon couplings from the anharmonicity effect. Analysis of phonon power spectra of all systems is performed to interpret simulation results. Contradictory to the traditional thought that amorphous structures tend to have poor thermal transport capabilities due to the disordered atomic configurations, it is calculated that amorphous silicon and silica substrates facilitate the interfacial thermal transport compared with their crystalline structures. Besides, the coupling effect from substrates can improve the interface thermal transport up to 43.5% for coupling strengths χ from 1.0 to 2.0. Our results provide fundamental knowledge and rational guidelines for the design and development of the next-generation silicene-based nanoelectronics and thermal interface materials.

Heat transfer enhancement in a lithium-ion cell through improved material-level thermal transport

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vishwakarma, Vivek; Waghela, Chirag; Wei, Zi

2016-09-25

We report that while Li-ion cells offer excellent electrochemical performance for several applications including electric vehicles, they also exhibit poor thermal transport characteristics, resulting in reduced performance, overheating and thermal runaway. Inadequate heat removal from Li-ion cells originates from poor thermal conductivity within the cell. This paper identifies the rate-limiting material-level process that dominates overall thermal conduction in a Li-ion cell. Results indicate that thermal characteristics of a Li-ion cell are largely dominated by heat transfer across the cathode-separator interface rather than heat transfer through the materials themselves. This interfacial thermal resistance contributes around 88% of total thermal resistance inmore » the cell. Measured value of interfacial resistance is close to that obtained from theoretical models that account for weak adhesion and large acoustic mismatch between cathode and separator. Further, to address this problem, an amine-based chemical bridging of the interface is carried out. This is shown to result in in four-times lower interfacial thermal resistance without deterioration in electrochemical performance, thereby increasing effective thermal conductivity by three-fold. This improvement is expected to reduce peak temperature rise during operation by 60%. Finally, by identifying and addressing the material-level root cause of poor thermal transport in Li-ion cells, this work may contribute towards improved thermal performance of Li-ion cells.« less

Measurement of interfacial thermal conductance in Lithium ion batteries

NASA Astrophysics Data System (ADS)

Gaitonde, Aalok; Nimmagadda, Amulya; Marconnet, Amy

2017-03-01

Increasing usage and recent accidents due to Lithium ion (Li-ion) batteries exploding or catching on fire has inspired research on the thermal management of these batteries. In cylindrical 18650 cells, heat generated during the charge/discharge cycle must dissipate to the surrounding through its metallic case due to the poor thermal conductivity of the jelly roll, which is spirally wound with many interfaces between electrodes and the polymeric separator. This work develops a technique to measure the thermal resistance across the case-separator interface, which ultimately limits heat transfer out of the jelly roll. Commercial 18650 batteries are discharged and opened using a battery disassembly tool, and the 25 μm thick separator and the 200 μm thick metallic case are harvested to make samples. A miniaturized version of the conventional reference bar method (ASTM astm:D5470)

Thermal analysis of a growing crystal in an aqueous solution

NASA Astrophysics Data System (ADS)

Shiomi, Yuji; Kuroda, Toshio; Ogawa, Tomoya

1980-10-01

The temperature profiles around growing crystals in aqueous solutions of Rochelle salt were measured with accuracy of 0.005°C in a two-dimensional cell which was used for elimination of thermal convection current in the cell. The temperature distribution became stationary after 2 h from injection of the mother liquid, but the concentration distribution did not become stationary because the diffusion constant of solute in the solution was much smaller than the thermal diffusivity of the solution. The growth rate was linearly proportional to the temperature gradient at every growing interface. Since crystal growth is a typical interaction process between thermal and material flow, the experimental results were analysed by such an interaction model. The analysis confirms that the material flow is limited by diffusion within a layer width of about a few hundreds micrometers on the growing interface.

Interfacial characteristics of diamond/aluminum composites with high thermal conductivity fabricated by squeeze-casting method

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jiang, Longtao, E-mail: longtaojiang@163.com; Wang, Pingping; Xiu, Ziyang

2015-08-15

In this work, aluminum matrix composites reinforced with diamond particles (diamond/aluminum composites) were fabricated by squeeze casting method. The material exhibited a thermal conductivity as high as 613 W / (m · K). The obtained composites were investigated by scanning electron microscope and transmission electron microscope in terms of the (100) and (111) facets of diamond particles. The diamond particles were observed to be homogeneously distributed in the aluminum matrix. The diamond{sub (111)}/Al interface was found to be devoid of reaction products. While at the diamond{sub (100)}/Al interface, large-sized aluminum carbides (Al{sub 4}C{sub 3}) with twin-crystal structure were identified. Themore » interfacial characteristics were believed to be responsible for the excellent thermal conductivity of the material. - Graphical abstract: Display Omitted - Highlights: • Squeeze casting method was introduced to fabricate diamond/Al composite. • Sound interfacial bonding with excellent thermal conductivity was produced. • Diamond{sub (111)}/ aluminum interface was firstly characterized by TEM/HRTEM. • Physical combination was the controlling bonding for diamond{sub (111)}/aluminum. • The growth mechanism of Al{sub 4}C{sub 3} was analyzed by crystallography theory.« less

Systems evaluation of thermal bus concepts

NASA Technical Reports Server (NTRS)

Stalmach, D. D.

1982-01-01

Thermal bus concepts, to provide a centralized thermal utility for large, multihundred kilowatt space platforms, were studied and the results are summarized. Concepts were generated, defined, and screened for inclusion in system level thermal bus trades. Parametric trade studies were conducted in order to define the operational envelope, performance, and physical characteristics of each. Two concepts were selected as offering the most promise for thermal bus development. All of four concepts involved two phase flow in order to meet the required isothermal nature of the thermal bus. Two of the concepts employ a mechanical means to circulate the working fluid, a liquid pump in one case and a vapor compressor in another. Another concept utilizes direct osmosis as the driving force of the thermal bus. The fourth concept was a high capacity monogroove heat pipe. After preliminary sizing and screening, three of these concepts were selected to carry into the trade studies. The monogroove heat pipe concept was deemed unsuitable for further consideration because of its heat transport limitations. One additional concept utilizing capillary forces to drive the working fluid was added. Parametric system level trade studies were performed. Sizing and weight calculations were performed for thermal bus sizes ranging from 5 to 350 kW and operating temperatures in the range of 4 to 120 C. System level considerations such as heat rejection and electrical power penalties and interface temperature losses were included in the weight calculations.

Directional Solidification of Pure Succinonitrile and a Succinonitrile-Acetone Alloy

NASA Technical Reports Server (NTRS)

Simpson, James E.; deGroh, Henry C., III; Garimella, Suresh V.

1999-01-01

An experimental study of the horizontal Bridgman growth of pure succinonitrile (SCN) and of a succinonitrile-1.0 mol.% acetone alloy (SCN-1.0 mol.% ACE) has been performed. Experiments involving both a stationary thermal field (no-growth case) and a translating thermal field (growth case) were conducted. Growth rates of 2 and 40 micrometers/s were investigated. For the pure SCN experiments, the velocity field in the melt was estimated using video images of seed particles in the melt. Observations of the seed particles indicate that a primary longitudinal convective cell is formed. The maximum velocity of two different particles which traveled along similar paths was the same and equal to 1.49 +/- 0.01 mm/s. The general accuracy of velocity measurements is estimated to be +/- 0.08 mm/s, though the data shows consistency to within +/- 0.02 mm/s. The shape of the solid/liquid interface was also quantitatively determined. The solid/liquid interface was stable (non-dendritic and non-cellular) but not flat; rather it was significantly distorted by the influence of convection in (he melt and, for the growth case, by the moving temperature boundary conditions along the ampoule. It was found that the interface shape and position were highly dependent on the alignment of the ampoule in the apparatus. Consequently, the ampoule was carefully aligned for all experiments. The values for front location agree with those determined in previous experiments. For the alloy experiments, the solid/liquid interface was determined to be unstable at growth rates greater than 2.8 micrometers/s, but stable for the cases of no-growth and growth at 2 micrometers/s. When compared to the shape of the pure SCN interface, the alloy interface forms closer to the cold zone, indicating that the melting temperature decreased due to the alloying element. Extensive temperature measurements were performed on the outside of the ampoule containing pure SCN. The resulting thermal profiles are presented in detail in the results section. It is intended that the interface shape, thermal boundary condition and velocity data presented in this paper be used to test numerical simulations.

Directional Solidification of Pure Succinonitrile and a Succinonitrile-Acetone Alloy

NASA Technical Reports Server (NTRS)

Simpson, James E.; deGroh, Henry C., III; Garimella, Suresh V.

2000-01-01

An experimental study of the horizontal Bridgman growth of pure succinonitrile (SCN) and of a succinonitrile-1.0 mol% acetone alloy (SCN-1.0 mol.% ACE) has been performed. Experiments involving both a stationary thermal field (no-growth case) and a translating thermal field (growth case) were conducted. Growth rates of 2 and 40 micrometers/sec were investigated. For the pure SCN experiments, the velocity field in the melt was estimated using video images of seed particles in the melt. Observations of the seed particles indicate that a primary longitudinal convective cell is formed. The maximum velocity of two different particles which traveled along similar paths was the same and equal to 1.49 +/- 0.01 mm/s. The general accuracy of velocity measurements is estimated to be +/-0.08 mm/s, though the data shows consistency to within +/- 0.02 mm/s. The shape of the solid/liquid interface was also quantitatively determined. The solid/liquid interface was stable (non-dendritic and non-cellular) but not flat: rather it was significantly distorted by the influence of connection in the melt and, for the growth case, by the moving temperature boundary conditions along the ampoule. It was found that the interface shape and position were highly dependent on the alignment of the ampoule in the apparatus. Consequently, the ampoule was carefully aligned for all experiments. The values for front location agree with those determined in previous experiments. For the alloy experiments, the solid/liquid interface was determined to be unstable at growth rates greater than 2.8 micrometers/sec, but stable for the cases of no-growth and growth at 2 micrometers/sec. When compared to the shape of the pure SCN interface, the alloy interface forms closer to the cold zone, indicating that the melting temperature decreased due to the alloying element. Extensive temperature measurements were performed on the outside of the ampoule containing pure SCN. The resulting thermal profiles are presented in detail in the results section. It is intended that the interface shape, thermal boundary condition, and velocity data presented in this paper be used to test numerical simulations.

Measurements of the effects of thermal contact resistance on steady state heat transfer in phosphoric-acid fuel cell stack

NASA Technical Reports Server (NTRS)

Abdul-Aziz, Ali; Alkasab, Kalil A.

1991-01-01

The influence of the thermal contact resistance on the heat transfer between the electrode plates, and the cooling system plate in a phosphoric-acid fuel-cell stack was experimentally investigated. The investigation was conducted using a set-up that simulates the operating conditions prevailing in a phosphoric acid fuel-cell stack. The fuel-cell cooling system utilized three types of coolants, water, engine oil, and air, to remove excess heat generated in the cell electrode and to maintain a reasonably uniform temperature distribution in the electrode plate. The thermal contact resistance was measured as a function of pressure at the interface between the electrode plate and the cooling system plate. The interface pressure range was from 0 kPa to 3448 kPa, while the Reynolds number for the cooling limits varied from 15 to 79 for oil, 1165 to 6165 for water, and 700 to 6864 for air. Results showed that increasing the interface pressure resulted in a higher heat transfer coefficient.

Specificity Switching Pathways in Thermal and Mass Evaporation of Multicomponent Hydrocarbon Droplets: A Mesoscopic Observation.

PubMed

Nasiri, Rasoul; Luo, Kai H

2017-07-10

For well over one century, the Hertz-Knudsen equation has established the relationship between thermal - mass transfer coefficients through a liquid - vapour interface and evaporation rate. These coefficients, however, have been often separately estimated for one-component equilibrium systems and their simultaneous influences on evaporation rate of fuel droplets in multicomponent systems have yet to be investigated at the atomic level. Here we first apply atomistic simulation techniques and quantum/statistical mechanics methods to understand how thermal and mass evaporation effects are controlled kinetically/thermodynamically. We then present a new development of a hybrid method of quantum transition state theory/improved kinetic gas theory, for multicomponent hydrocarbon systems to investigate how concerted-distinct conformational changes of hydrocarbons at the interface affect the evaporation rate. The results of this work provide an important physical concept in fundamental understanding of atomistic pathways in topological interface transitions of chain molecules, resolving an open problem in kinetics of fuel droplets evaporation.

Effect of the interface on the mechanical properties and thermal conductivity of bismuth telluride films

NASA Astrophysics Data System (ADS)

Lai, Tang-Yu; Wang, Kuan-Yu; Fang, Te-Hua; Huang, Chao-Chun

2018-02-01

Bismuth telluride (Bi2Te3) is a type of thermoelectric material used for energy generation that does not cause pollution. Increasing the thermoelectric conversion efficiency (ZT) is one of the most important steps in the development of thermoelectric components. In this study, we use molecular dynamics to investigate the mechanical properties and thermal conductivity of quintuple layers of Bi2Te3 nanofilms with different atomic arrangements at the interface and study the effects of varying layers, angles, and grain boundaries. The results indicate that the Bi2Te3 nanofilm perfect substrate has the ideal Young’s modulus and thermal conductivity, and the maximum yield stress is observed for a thickness of ∼90 Å. As the interface changed, the structural disorder of atomic arrangement affected the mechanical properties; moreover, the phonons encounter lattice disordered atomic region will produce scattering reduce heat conduction. The results of this investigation are helpful for the application of Bi2Te3 nanofilms as thermoelectric materials.

Enhancing the ballistic thermal transport of silicene through smooth interface coupling

NASA Astrophysics Data System (ADS)

Chen, Chao-Yu; She, Yanchao; Xiao, Huaping; Ding, Jianwen; Cao, Juexian; Guo, Zhi-Xin

2016-04-01

We have performed nonequilibrium molecular dynamics calculations on the length (L ) dependence of thermal conductivity (K ) of silicene both supported on and sandwiched between the smooth surfaces, i.e. h-BN, at room temperature. We find that K of silicene follows a power law K\\propto {{L}β} , with β increasing from about 0.3-0.4 under the effect of interface coupling, showing an enhancement of the ballistic thermal transport of silicene. We also find that β can be further increased to about 0.6 by increasing the interface coupling strength for the silicene sandwiched between h-BN. The increase of β for the supported case is found to come from the variation of the flexural acoustic (ZA) phonon mode and the first optical phonon mode induced by the substrate, whereas the unusual increase of β for the sandwiched case is attributed to the increment of velocities of all three acoustic phonon modes. These findings provide an interesting route for manipulating the ballistic energy flow in nanomaterials.

Interface and properties of inorganic fullerene tungsten sulphide nanoparticle reinforced poly (ether ether ketone) nanocomposites

NASA Astrophysics Data System (ADS)

Wang, Nannan; Yang, Zhuxian; Wang, Yuan; Thummavichai, Kunyapat; Xia, Yongde; Ghita, Oana; Zhu, Yanqiu

We report a simple and effective method to fabricate PEEK (poly ether ether ketone)/IF-WS2 (Inorganic Fullerene Tungsten Sulphide) nanocomposites with IF-WS2 content up to 8 wt%. We have used electron microscopies to characterise the morphology and structural features of the nancomposites, and FTIR and XPS to show that some chemical interface bondings were formed between the PEEK and IF-WS2. We demonstrate that the resulting PEEK/IF-WS2 nanocomposites showed an extraordinary 190% increase in thermal conductivity, 50 °C higher in degradation temperature, and mild improvements in strength and hardness. The increased degradation activation energy from 64 to 76 kJ/mol for neat PEEK and PEEK/IF-WS2 nanocomposites, respectively, is attributed to the synergistic interface between the PEEK matrix and IF-WS2 nanoparticles. The enhancements in both the mechanical and thermal properties will significantly expand the capacities of PEEK-based nanocomposites towards applications where thermal conductivity and stability are important.

Electron beam induced strong organic/inorganic grafting for thermally stable lithium-ion battery separators

NASA Astrophysics Data System (ADS)

Choi, Yunah; Kim, Jin Il; Moon, Jungjin; Jeong, Jongyeob; Park, Jong Hyeok

2018-06-01

A tailored interface between organic and inorganic materials is of great importance to maximize the synergistic effects from hybridization. Polyethylene separators over-coated with inorganic thin films are the state-of-the art technology for preparing various secondary batteries with high safety. Unfortunately, the organic/inorganic hybrid separators have the drawback of a non-ideal interface, thus causing poor thermal/dimensional stability. Here, we report a straightforward method to resolve the drawback of the non-ideal interface between vapor deposited SiO2 and polyethylene separators, to produce a highly stable lithium-ion battery separator through strong chemical linking generated by direct electron beam irradiation. The simple treatment with an electron beam with an optimized dose generates thermally stable polymer separators, which may enhance battery safety under high-temperature conditions. Additionally, the newly formed Si-O-C or Si-CH3 chemical bonding enhances electrolyte-separator compatibility and thus may provide a better environment for ionic transport between the cathode and anode, thereby leading to better charge/discharge behaviors.

On the Interplay Between Adhesion Strength and Tensile Properties of Thermal Spray Coated Laminates—Part II: Low-Velocity Thermal Spray Coatings

NASA Astrophysics Data System (ADS)

Luo, Xiaotao; Smith, Gregory M.; Sampath, Sanjay

2018-02-01

In this two-part study, uniaxial tensile testing was used to evaluate coating/substrate bonding and compared with traditional ASTM C633 bond pull test results for thermal spray (TS) coated steel laminates. In Part I, the rationale, methodology, and applicability of the test to high-velocity TS coatings were demonstrated. In this Part II, the method was investigated for low-velocity TS processes (air plasma spray and arc spray) on equivalent materials. Ni and Ni-5wt.%Al coatings were deposited on steel substrates with three different roughness levels and tested using both uniaxial tensile and ASTM C633 methods. The results indicate the uniaxial tensile approach provides useful information about the nature of the coating/substrate bonding and goes beyond the traditional bond pull test in providing insightful information on the load sharing processes across the interface. Additionally, this proposed methodology alleviates some of the longstanding shortcomings and potentially reduces error associated with the traditional ASTM C633 test. The mechanisms governing the load transfer between the substrate and the coating were investigated, and the influence of Al in the coating material evaluated.

Nondestructive Handheld Fourier Transform Infrared (FT-IR) Analysis of Spectroscopic Changes and Multivariate Modeling of Thermally Degraded Plain Portland Cement Concrete and its Slag and Fly Ash-Based Analogs.

PubMed

Leung Tang, Pik; Alqassim, Mohammad; Nic Daéid, Niamh; Berlouis, Leonard; Seelenbinder, John

2016-05-01

Concrete is by far the world's most common construction material. Modern concrete is a mixture of industrial pozzolanic cement formulations and aggregate fillers. The former acts as the glue or binder in the final inorganic composite; however, when exposed to a fire the degree of concrete damage is often difficult to evaluate nondestructively. Fourier transform infrared (FT-IR) spectroscopy through techniques such as transmission, attenuated total reflectance, and diffuse reflectance have been rarely used to evaluate thermally damaged concrete. In this paper, we report on a study assessing the thermal damage of concrete via the use of a nondestructive handheld FT-IR with a diffuse reflectance sample interface. In situ measurements can be made on actual damaged areas, without the need for sample preparation. Separate multivariate models were developed to determine the equivalent maximal temperature endured for three common industrial concrete formulations. The concrete mixtures were successfully modeled displaying high predictive power as well as good specificity. This has potential uses in forensic investigation and remediation services particularly for fires in buildings. © The Author(s) 2016.

Designing for adaptation to novelty and change: functional information, emergent feature graphics, and higher-level control.

PubMed

Hajdukiewicz, John R; Vicente, Kim J

2002-01-01

Ecological interface design (EID) is a theoretical framework that aims to support worker adaptation to change and novelty in complex systems. Previous evaluations of EID have emphasized representativeness to enhance generalizability of results to operational settings. The research presented here is complementary, emphasizing experimental control to enhance theory building. Two experiments were conducted to test the impact of functional information and emergent feature graphics on adaptation to novelty and change in a thermal-hydraulic process control microworld. Presenting functional information in an interface using emergent features encouraged experienced participants to become perceptually coupled to the interface and thereby to exhibit higher-level control and more successful adaptation to unanticipated events. The absence of functional information or of emergent features generally led to lower-level control and less success at adaptation, the exception being a minority of participants who compensated by relying on analytical reasoning. These findings may have practical implications for shaping coordination in complex systems and fundamental implications for the development of a general unified theory of coordination for the technical, human, and social sciences. Actual or potential applications of this research include the design of human-computer interfaces that improve safety in complex sociotechnical systems.

Thermal stress in flexible interdigital transducers with anisotropic electroactive cellulose substrates

NASA Astrophysics Data System (ADS)

Yoon, Sean J.; Kim, Jung Woong; Kim, Hyun Chan; Kang, Jinmo; Kim, Jaehwan

2017-12-01

Thermal stress in flexible interdigital transducers a reliability concern in the development of flexible devices, which may lead to interface delamination, stress voiding and plastic deformation. In this paper, a mathematical model is presented to investigate the effect of material selections on the thermal stress in interdigital transducers. We modified the linear relationships in the composite materials theory with the effect of high curvature, anisotropic substrate and small substrate thickness. We evaluated the thermal stresses of interdigital transducers, fabricated with various electrodes, insulators and substrate materials for the comparison. The results show that, among various insulators, organic polymer developed the highest stress level while oxide showed the lowest stress level. Aluminium shows a higher stress level and curvature as an electrode than gold. As substrate materials, polyimide and electroactive cellulose show similar stress levels except the opposite sign convention to each other. Polyimide shows positive curvatures while electroactive cellulose shows negative curvatures, which is attributed to the stress and thermal expansion state of the metal/insulator composite. The results show that the insulator is found to be responsible for the confinement across the metal lines while the substrate is responsible for the confinement along the metal lines.

Silicide/Silicon Hetero-Junction Structure for Thermoelectric Applications.

PubMed

Jun, Dongsuk; Kim, Soojung; Choi, Wonchul; Kim, Junsoo; Zyung, Taehyoung; Jang, Moongyu

2015-10-01

We fabricated silicide/silicon hetero-junction structured thermoelectric device by CMOS process for the reduction of thermal conductivity with the scatterings of phonons at silicide/silicon interfaces. Electrical conductivities, Seebeck coefficients, power factors, and temperature differences are evaluated using the steady state analysis method. Platinum silicide/silicon multilayered structure showed an enhanced Seebeck coefficient and power factor characteristics, which was considered for p-leg element. Also, erbium silicide/silicon structure showed an enhanced Seebeck coefficient, which was considered for an n-leg element. Silicide/silicon multilayered structure is promising for thermoelectric applications by reducing thermal conductivity with an enhanced Seebeck coefficient. However, because of the high thermal conductivity of the silicon packing during thermal gradient is not a problem any temperature difference. Therefore, requires more testing and analysis in order to overcome this problem. Thermoelectric generators are devices that based on the Seebeck effect, convert temperature differences into electrical energy. Although thermoelectric phenomena have been used for heating and cooling applications quite extensively, it is only in recent years that interest has increased in energy generation.

Effect of various intermediate ceramic layers on the interfacial stability of zirconia core and veneering ceramics.

PubMed

Yoon, Hyung-In; Yeo, In-Sung; Yi, Yang-Jin; Kim, Sung-Hun; Lee, Jai-Bong; Han, Jung-Suk

2015-01-01

The purposes of this study were to evaluate the effects of intermediate ceramics on the adhesion between the zirconia core and veneer ceramics. The polished surfaces of fully sintered Y-TZP blocks received three different treatments: (1) connector (C), (2) liner (L) or (3) wash layer (W). All the treated zirconia blocks were veneered with either (a) fluorapatite glass-ceramic (E) or (b) feldspathic porcelain (V) and divided into four groups (CE, CV, LE and WV). For the control group, the testing surfaces of metal blocks were veneered with feldspathic porcelain (VM). A half of the samples in each group (n = 21) were exposed to thermocycling, while the other half of the specimens were stored at room temperature under dry conditions. All specimens were subjected to the shear test and the failed surfaces were microscopically examined. The elemental distribution at the zirconia core/veneer interface was analyzed. The specimens in Groups CE and CV exhibited significantly greater mean bond strength values than those in Groups LE and WV, respectively (p < 0.05). However, the mean bond strengths significantly decreased in the connector groups (CE and CV) after thermal cycling (p < 0.05). The elemental analysis suggested diffusion of ceramic substances into the zirconia surface. A glass-ceramic based connector is significantly more favorable to core/veneer adhesion than the other intermediate ceramics evaluated in the study. However, thermal cycling affected the bond strength at the core/veneer interface differently according to the intermediate ceramics.

Thermal Fatigue Behavior of Air-Plasma Sprayed Thermal Barrier Coating with Bond Coat Species in Cyclic Thermal Exposure

PubMed Central

Lu, Zhe; Myoung, Sang-Won; Jung, Yeon-Gil; Balakrishnan, Govindasamy; Lee, Jeongseung; Paik, Ungyu

2013-01-01

The effects of the bond coat species on the delamination or fracture behavior in thermal barrier coatings (TBCs) was investigated using the yclic thermal fatigue and thermal-shock tests. The interface microstructures of each TBC showed a good condition without cracking or delamination after flame thermal fatigue (FTF) for 1429 cycles. The TBC with the bond coat prepared by the air-plasma spray (APS) method showed a good condition at the interface between the top and bond coats after cyclic furnace thermal fatigue (CFTF) for 1429 cycles, whereas the TBCs with the bond coats prepared by the high-velocity oxygen fuel (HVOF) and low-pressure plasma spray (LPPS) methods showed a partial cracking (and/or delamination) and a delamination after 780 cycles, respectively. The TBCs with the bond coats prepared by the APS, HVOF and LPPS methods were fully delaminated (>50%) after 159, 36, and 46 cycles, respectively, during the thermal-shock tests. The TGO thickness in the TBCs was strongly dependent on the both exposure time and temperature difference tested. The hardness values were found to be increased only after the CFTF, and the TBC with the bond coat prepared by the APS showed the highest adhesive strength before and after the FTF. PMID:28811441

Metal-Organic-Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances.

PubMed

Yegin, Cengiz; Nagabandi, Nirup; Feng, Xuhui; King, Charles; Catalano, Massimo; Oh, Jun Kyun; Talib, Ansam J; Scholar, Ethan A; Verkhoturov, Stanislav V; Cagin, Tahir; Sokolov, Alexei V; Kim, Moon J; Matin, Kaiser; Narumanchi, Sreekant; Akbulut, Mustafa

2017-03-22

As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Herein, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix-which are prepared by the chemisorption-coupled electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m K), which are very high considering their relatively low elastic modulus values on the order of 21.2-28.5 GPa. The synergistic combination of these properties led to the ultralow total thermal resistivity values in the range of 0.38-0.56 mm 2 K/W for a typical bond-line thickness of 30-50 μm, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.

Interaction of Porosity with a Planar Solid/Liquid Interface

NASA Technical Reports Server (NTRS)

Catalina, Adrian V.; Stefanescu, Doru M.; Sen, Subhayu; Kaukler, William F.

2004-01-01

In this article, an investigation of the interaction between gas porosity and a planar solid/liquid (SL) interface is reported. A two-dimensional numerical model able to accurately track sharp SL interfaces during solidification of pure metals and alloys is proposed. The finite-difference method and a rectangular undeformed grid are used for computation. The SL interface is described through the points of intersection with the grid lines. Its motion is determined by the thermal and solute gradients at each particular point. Changes of the interface temperature because of capillarity or solute redistribution as well as any perturbation of the thermal and solute field produced by the presence of non-metallic inclusions can be computed. To validate the model, the dynamics of the interaction between a gas pore and a solidification front in metal alloys was observed using a state of the art X-ray transmission microscope (XTM). The experiments included observation of the distortion of the SL interface near a pore, real-time measurements of the growth rate, and the change in shape of the porosity during interaction with the SL interface in pure Al and Al-0.25 wt pct Au alloy. In addition, porosity-induced solute segregation patterns surrounding a pore were also quantified.

Vertically Aligned and Interconnected Boron Nitride Nanosheets for Advanced Flexible Nanocomposite Thermal Interface Materials.

PubMed

Chen, Jin; Huang, Xingyi; Sun, Bin; Wang, Yuxin; Zhu, Yingke; Jiang, Pingkai

2017-09-13

The continuous evolution toward semiconductor technology in the "more-than-Moore" era and rapidly increasing power density of modern electronic devices call for advanced thermal interface materials (TIMs). Here, we report a novel strategy to construct flexible polymer nanocomposite TIMs for advanced thermal management applications. First, aligned polyvinyl alcohol (PVA) supported and interconnected 2D boron nitride nanosheets (BNNSs) composite fiber membranes were fabricated by electrospinning. Then, the nanocomposite TIMs were constructed by rolling the PVA/BNNS composite fiber membranes to form cylinders and subsequently vacuum-assisted impregnation of polydimethylsiloxane (PDMS) into the porous cylinders. The nanocomposite TIMs not only exhibit a superhigh through-plane thermal conductivity enhancement of about 10 times at a low BNNS loading of 15.6 vol % in comparison with the pristine PDMS but also show excellent electrical insulating property (i.e., high volume electrical resistivity). The outstanding thermal management capability of the nanocomposite TIMs was practically confirmed by capturing the surface temperature variations of a working LED chip integrated with the nanocomposite TIMs.

Smoothed dissipative particle dynamics model for mesoscopic multiphase flows in the presence of thermal fluctuations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Lei, Huan; Baker, Nathan A.; Wu, Lei

2016-08-05

Thermal fluctuations cause perturbations of fluid-fluid interfaces and highly nonlinear hydrodynamics in multiphase flows. In this work, we develop a novel multiphase smoothed dissipative particle dynamics model. This model accounts for both bulk hydrodynamics and interfacial fluctuations. Interfacial surface tension is modeled by imposing a pairwise force between SDPD particles. We show that the relationship between the model parameters and surface tension, previously derived under the assumption of zero thermal fluctuation, is accurate for fluid systems at low temperature but overestimates the surface tension for intermediate and large thermal fluctuations. To analyze the effect of thermal fluctuations on surface tension,more » we construct a coarse-grained Euler lattice model based on the mean field theory and derive a semi-analytical formula to directly relate the surface tension to model parameters for a wide range of temperatures and model resolutions. We demonstrate that the present method correctly models the dynamic processes, such as bubble coalescence and capillary spectra across the interface.« less

Exploring Novel Spintronic Responses from Advanced Functional Organic Materials

DTIC Science & Technology

2015-11-12

March 20-22, 2014 (8) Interface enhanced photovoltaic and Seebeck effects in organic solar cells and thermoelectric devices DISTRIBUTION A...on thermoelectric effects by using polymer/metal interface-controllable thermal and electric conductions. The project explored a new strategy by using...following major breakthroughs on molecular metamaterials by using spin radicals and on thermoelectric effects by using polymer/metal interface

Design and Construction of a Thermal Contact Resistance and Thermal Conductivity Measurement System

DTIC Science & Technology

2015-09-01

plate interface resistance control. Numerical heat transfer and uncertainty analyses with applied engineering judgement were extensively used to come... heat transfer issues facing the Department of Defense. 14. SUBJECT TERMS Thermal contact resistance, thermal conductivity, measurement system 15... heat transfer and uncertainty analyses with applied engineering judgement were extensively used to come up with an optimized design and construction

Development of interface-dominant bulk Cu/V nanolamellar composites by cross accumulative roll bonding

PubMed Central

Zeng, L. F.; Gao, R.; Xie, Z. M.; Miao, S.; Fang, Q. F.; Wang, X. P.; Zhang, T.; Liu, C. S.

2017-01-01

Traditional nanostructured metals are inherently comprised of a high density of high-energy interfaces that make this class of materials not stable in extreme conditions. Therefore, high performance bulk nanostructured metals containing stable interfaces are highly desirable for extreme environments applications. Here, we reported an attractive bulk Cu/V nanolamellar composite that was successfully developed by integrating interface engineering and severe plastic deformation techniques. The layered morphology and ordered Cu/V interfaces remained stable with respect to continued rolling (total strain exceeding 12). Most importantly, for layer thickness of 25 nm, this bulk Cu/V nanocomposite simultaneously achieves high strength (hardness of 3.68 GPa) and outstanding thermal stability (up to 700 °C), which are quite difficult to realize simultaneously in traditional nanostructured materials. Such extraordinary property in our Cu/V nanocomposite is achieved via an extreme rolling process that creates extremely high density of stable Cu/V heterophase interfaces and low density of unstable grain boundaries. In addition, high temperature annealing result illustrates that Rayleigh instability is the dominant mechanism driving the onset of thermal instability after exposure to 800 °C. PMID:28094346

Simultaneous measurement of the dynamic emissivity and the radiance of the shocked Al/LiF interface in the near-infrared wavelength

NASA Astrophysics Data System (ADS)

Liu, Shenggang; Li, Jiabo; Li, Jun; Xue, Tao; Tao, Tianjiong; Ma, Heli; Wang, Xiang; Weng, Jidong; Li, Zeren

2018-04-01

A novel method based on signal superimposing has been presented to simultaneously measure the dynamic emissivity and the radiance of a shocked sample/window interface in the near-infrared wavelength. In this method, we have used three rectangle laser pulses to illuminate the sample/window interface via an integrating sphere and expect that the reflected laser pulses from the sample/window interface can be superimposed on its thermal radiation at the shocked steady state by time precision synchronization. In the two proving trials, the second laser pulse reflected from the Al/LiF interface has been successfully superimposed on its thermal radiation despite large flyer velocity uncertainty. The dynamic emissivity and the radiance at 1064 nm have been obtained simultaneously from the superimposing signals. The obtained interface temperatures are 1842 ± 82 K and 1666 ± 154 K, respectively, the corresponding release pressures are 65.7 GPa and 62.6 GPa, and the deduced Hugonoit temperatures are consistent with the theoretical calculations. In comparison, the fitting temperatures from the gray body model are 300-500 K higher than our experimental measurement results and the theoretical calculations.

New Class of Thermal Interface Materials Delivers Ultralow Thermal

Science.gov Websites

chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix functionalized with soft organic linkers and a copper matrix. Researchers selected BNNS as a filler due to its metal/organic/inorganic hybrid nanocomposites provide a promising start to a thermal management solution

Ceramic joints

DOEpatents

Miller, Bradley J.; Patten, Jr., Donald O.

1991-01-01

Butt joints between materials having different coefficients of thermal expansion are prepared having a reduced probability of failure of stress facture. This is accomplished by narrowing/tapering the material having the lower coefficient of thermal expansion in a direction away from the joint interface and not joining the narrow-tapered surface to the material having the higher coefficient of thermal expansion.

Microstructure and thermal properties of copper–diamond composites with tungsten carbide coating on diamond particles

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kang, Qiping; He, Xinbo, E-mail: xb_he@163.com; Ren, Shubin

2015-07-15

An effective method for preparing tungsten carbide coating on diamond surfaces was proposed to improve the interface bonding between diamond and copper. The WC coating was formed on the diamond surfaces with a reaction medium of WO{sub 3} in mixed molten NaCl–KCl salts and the copper–diamond composites were obtained by vacuum pressure infiltration of WC-coated diamond particles with pure copper. The microstructure of interface bonding between diamond and copper was discussed. Thermal conductivity and thermal expansion behavior of the obtained copper–diamond composites were investigated. Results indicated that the thermal conductivity of as-fabricated composite reached 658 W m{sup −} {sup 1}more » K{sup −} {sup 1}. Significant reduction in coefficient of thermal expansion of the composite compared with that of pure copper was obtained. - Highlights: • WC coating was successfully synthesized on diamond particles in molten salts. • WC coating obviously promoted the wettability of diamond and copper matrix. • WC coating greatly enhanced the thermal conductivity of Cu–diamond composite. • The composites are suitable candidates for heat sink applications.« less

A thermal control approach for a solar electric propulsion thrust subsystem

NASA Technical Reports Server (NTRS)

Maloy, J. E.; Oglebay, J. C.

1979-01-01

A thrust subsystem thermal control design is defined for a Solar Electric Propulsion System (SEPS) proposed for the comet Halley Flyby/comet Tempel 2 rendezvous mission. A 114 node analytic model, developed and coded on the systems improved numerical differencing analyzer program, was employed. A description of the resulting thrust subsystem thermal design is presented as well as a description of the analytic model and comparisons of the predicted temperature profiles for various SEPS thermal configurations that were generated using this model. It was concluded that: (1) a BIMOD engine system thermal design can be autonomous; (2) an independent thrust subsystem thermal design is feasible; (3) the interface module electronics temperatures can be controlled by a passive radiator and supplementary heaters; (4) maintaining heat pipes above the freezing point would require an additional 322 watts of supplementary heating power for the situation where no thrusters are operating; (5) insulation is required around the power processors, and between the interface module and the avionics module, as well as in those areas which may be subjected to solar heating; and (6) insulation behind the heat pipe radiators is not necessary.

Thermal stir welding process

NASA Technical Reports Server (NTRS)

Ding, R. Jeffrey (Inventor)

2012-01-01

A welding method is provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.

Thermal stir welding apparatus

NASA Technical Reports Server (NTRS)

Ding, R. Jeffrey (Inventor)

2011-01-01

A welding method and apparatus are provided for forming a weld joint between first and second elements of a workpiece. The method includes heating the first and second elements to form an interface of material in a plasticized or melted state interface between the elements. The interface material is then allowed to cool to a plasticized state if previously in a melted state. The interface material, while in the plasticized state, is then mixed, for example, using a grinding/extruding process, to remove any dendritic-type weld microstructures introduced into the interface material during the heating process.

Investigating Morphological Stability of Faceted Interfaces with Axial Heat Processing (AHP) Technique

NASA Technical Reports Server (NTRS)

Abbaschian, Reza; Balikci, Ercan; Deal, Andrew; Gonik, Michael; Golyshev, Viladimir D.; Leonardi, Eddie; deVahlDavis, G.; Chen, P. Y. P.; Timchenko, V.

2003-01-01

Successful processing of homogeneous semiconductor single crystals from their melts depends strongly on precise control of thermal and fluid flow conditions near the solid/liquid interface. In this project, we utilize a novel crystal growth technique called Axial Heat Processing (AHP) that uses a baffle, positioned inside the melt near the interface, to supply and/or conduct heat axially to the interface. The baffle, which may or may not have a heater encased in it, can promote more stable and planar growth as well as reduce buoyancy driven convection. The latter is because the baffle reduces the aspect ratio of the melt as it separates the melt into three sections, above the baffle, in the feed gap between the baffle and the crucible wall, and below the baffle between the baffle base and the interface. AHP also enables a close monitoring and/or control of thermal boundaries near the solid/liquid interface during crystal growth by means of thermocouples placed in the baffle. The interface is kept planar when a heating element in the baffle is used. However, a proper choice of melt height is necessary to keep the interface planar when using the baffle without a heater. This study addresses the influence of melt height and growth velocity on the segregation profile of AHP-grown Sb doped Ge single crystals.

In situ SEM thermal fatigue of Al/graphite metal matrix composites

NASA Technical Reports Server (NTRS)

Zong, G. S.; Rabenberg, L.; Marcus, H. L.

1990-01-01

Several thermal fatigue-induced failure mechanisms are deduced for unidirectional graphite-reinforced 6061 Al-alloy MMCs subjected to in situ thermal cycling. These thermal cycling conditions are representative of MMC service cycles in aerospace environments, where thermal fatigue is primarily associated with changes in the stress states near the interfaces due to coefficient of thermal expansion mismatch between fiber and matrix. This in situ SEM thermal-cycling study clarified such factors affecting MMCs' thermal fatigue as local fiber content and distribution, void volume, fiber stiffness, thermal excursion magnitude, and number of thermal cycles. MMC microfailure modes in thermal fatigue have been deduced.

A review of passive thermal management of LED module

NASA Astrophysics Data System (ADS)

Huaiyu, Ye; Koh, Sau; van Zeijl, Henk; Gielen, A. W. J.; Guoqi, Zhang

2011-01-01

Recently, the high-brightness LEDs have begun to be designed for illumination application. The increased electrical currents used to drive LEDs lead to thermal issues. Thermal management for LED module is a key design parameter as high operation temperature directly affects their maximum light output, quality, reliability and life time. In this review, only passive thermal solutions used on LED module will be studied. Moreover, new thermal interface materials and passive thermal solutions applied on electronic equipments are discussed which have high potential to enhance the thermal performance of LED Module.

Dielectric, electric and thermal properties of carboxylic functionalized multiwalled carbon nanotubes impregnated polydimethylsiloxane nanocomposite

NASA Astrophysics Data System (ADS)

Sagar, Sadia; Iqbal, Nadeem; Maqsood, Asghari

2013-06-01

The dielectric, electric and thermal properties of carboxylic functionalized multiwalled carbon nanotubes (F-MWCNT) incorporated into the polydimethylsiloxane (PDMS) were evaluated to determine their potential in the field of electronic materials. Carboxylic functionalization of the pristine multi walled carbon tubes (Ps-MWCNT) was confirmed through Fourier transform infrared spectroscopy, X-ray diffraction patterns for both Ps-MWCNTs and F-MWCNTs elaborated that crystalline behavior did not change with carboxylic moieties. Thermogravimetric and differential thermal analyses were performed to elucidate the thermal stability with increasing weight % addition of F-MWCNTs in the polymer matrix. Crystallization/glass transition / melting temperatures were evaluated using differential scanning calorimeter and it was observed that glass transition and crystallization temperatures were diminished while temperatures of first and second melting transitions were progressed with increasing F-MWCNT concentration in the PDMS matrix. Scanning electron microscopy and energy dispersive x-ray spectroscopy were carried out to confirm the morphology, functionalization, and uniform dispersion of F-MWCNTs in the polymer matrix. Electrical resistivity at temperature range (100-300°C), dielectric loss (tanδ) and dielectric parameters (epsilon/ epsilon//) were measured in the frequency range (1MHz-3GHz). The measured data simulate that the aforementioned properties were influenced by increasing filler contents in the polymer matrix because of the high polarization of conductive F-MWCNTs at the reinforcement/polymer interface.

Thermal energy harvesting and solar energy conversion utilizing carbon-based nanomaterials

NASA Astrophysics Data System (ADS)

McCarthy, Patrick T.

This dissertation provides details of carbon-based nanomaterial fabrication for applications in energy harvesting and generation. As energy demands increase, and concerns about mankind's environmental impact increase, alternative methods of generating energy will be widely researched. Carbon-based nanomaterials may be effective in such applications as their fabrication is often inexpensive and they have highly desirable electrical, mechanical, and thermal properties. Synthesis and characterization of carbon nanotube thermal interfaces on gadolinium foils is described herein. Total thermal interface resistances of carbon nanotube coated gadolinium were measured using a one-dimensional reference calorimeter technique, and the effect of hydrogen embrittlement on the magnetic properties of gadolinium foils is discussed. The samples generated in this study were consistently measured with reduced total thermal interface resistances of 55-70% compared to bare gadolinium. Characterization of gadolinium foils in a cooling device called a magneto thermoelectric generator was also performed. A gadolinium shuttle drives the device as it transitions between ferromagnetic and paramagnetic states. Reduced interface resistances from the carbon nanotube arrays led to increased shuttle frequency and effective heat transfer coefficients. Detailed theoretical derivations for electron emission during thermal and photo-excitation are provided for both three-dimensional and two-dimensional materials. The derived theories were fitted to experimental data from variable temperature photoemission studies of potassium-intercalated graphitic nanopetals. A work function reduction from approximately 4.5 eV to 2 -- 3 eV resulted from potassium intercalation and adsorption. While changes in the electron energy distribution shape and intensity were significant within 310 -- 680 K, potassium-intercalated graphitic petals demonstrate very high thermal stability after heating to nearly 1000 K. Boron nitride modification of the nanopetals was performed in an effort to minimize deintercalation of potassium from the nanopetal lattice and while multiple work functions were present within the electron energy distribution, massive reductions in emission intensity took place above 580 K. Finally, a device for measuring the current density during photoemission was also developed and photoemission induced by a solar simulator at room temperature produced currents on the order of 1 nA/cm 2 resulting in a quantum efficiency of approximately 8.0x10 --8 electrons emitted per photon of illumination.

Organophophorous Ester Degradation by Chromium(III) Terephthalate Metal-Organic Framework (MIL-101) Chelated to N,N-Dimethylaminopyridine and Related Aminopyridines

DTIC Science & Technology

2013-01-22

hydrofluoric acid in the hydro- thermal synthesis of MIL-101 MOF, and employed an optimized TMAOH/Cr(NO3)3/TPA/H2O (0.25/1/1/280) alkaline medium.41 MOF...identical to those of as-synthesized, parent MIL-101. This demonstrates that the framework integrity of MIL-101 was retained after both thermal water...Materials & Interfaces Research Article dx.doi.org/10.1021/am302359b | ACS Appl. Mater. Interfaces 2013, 5, 1269−12781272 of most zeolites or silicas

Time-Dependent Thermally-Driven Interfacial Flows in Multilayered Fluid Structures

NASA Technical Reports Server (NTRS)

Haj-Hariri, Hossein; Borhan, A.

1996-01-01

A computational study of thermally-driven convection in multilayered fluid structures will be performed to examine the effect of interactions among deformable fluid-fluid interfaces on the structure of time-dependent flow in these systems. Multilayered fluid structures in two models configurations will be considered: the differentially heated rectangular cavity with a free surface, and the encapsulated cylindrical liquid bridge. An extension of a numerical method developed as part of our recent NASA Fluid Physics grant will be used to account for finite deformations of fluid-fluid interfaces.

Vibrational energy flow through the green fluorescent protein-water interface: communication maps and thermal boundary conductance.

PubMed

Xu, Yao; Leitner, David M

2014-07-17

We calculate communication maps for green fluorescent protein (GFP) to elucidate energy transfer pathways between the chromophore and other parts of the protein in the ground and excited state. The approach locates energy transport channels from the chromophore to remote regions of the protein via residues and water molecules that hydrogen bond to the chromophore. We calculate the thermal boundary conductance between GFP and water over a wide range of temperature and find that the interface between the protein and the cluster of water molecules in the β-barrel poses negligible resistance to thermal flow, consistent with facile vibrational energy transfer from the chromophore to the β-barrel waters observed in the communication maps.

Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures

DOE PAGES

Dhuley, R. C.; Geelhoed, M. I.; Thangaraj, J. C. T.

2018-06-15

Here, we examine the resistance to heat flow across contacts of mechanically pressed aluminum and niobium near liquid helium temperatures for designing a thermally conducting joint of aluminum and superconducting niobium. Measurements in the temperature range of 3.5 K to 5.5 K show the thermal contact resistance to grow as a near-cubic function of decreasing temperature, indicating phonons to be the primary heat carriers across the interface. In the 4 kN to 14 kN range of pressing force the contact resistance shows linear drop with the increasing force, in agreement with the model of micro-asperity plastic deformation at pressed contacts.more » Several thermal contact resistance models as well as the phonon diffuse mismatch model of interface thermal resistance are compared with the experimental data. The diffuse mismatch model shows closest agreement. The joints are further augmented with thin foil of indium, which lowers the joint resistance by an order of magnitude. The developed joint has nearly 1 K*cm2/W of thermal resistance at 4.2 K, is demountable, and free of the thermally resistive interfacial alloy layer that typically exists at welded, casted, or soldered joints of dissimilar metals.« less

Graphene-enhanced thermal interface materials for heat removal from photovoltaic solar cells

NASA Astrophysics Data System (ADS)

Saadah, M.; Gamalath, D.; Hernandez, E.; Balandin, A. A.

2016-09-01

The increase in the temperature of photovoltaic (PV) solar cells affects negatively their power conversion efficiency and decreases their lifetime. The negative effects are particularly pronounced in concentrator solar cells. Therefore, it is crucial to limit the PV cell temperature by effectively removing the excess heat. Conventional thermal phase change materials (PCMs) and thermal interface materials (TIMs) do not possess the thermal conductivity values sufficient for thermal management of the next generation of PV cells. In this paper, we report the results of investigation of the increased efficiency of PV cells with the use of graphene-enhanced TIMs. Graphene reveals the highest values of the intrinsic thermal conductivity. It was also shown that the thermal conductivity of composites can be increased via utilization of graphene fillers. We prepared TIMs with up to 6% of graphene designed specifically for PV cell application. The solar cells were tested using the solar simulation module. It was found that the drop in the output voltage of the solar panel under two-sun concentrated illumination can be reduced from 19% to 6% when grapheneenhanced TIMs are used. The proposed method can recover up to 75% of the power loss in solar cells.

Thermal resistance of pressed contacts of aluminum and niobium at liquid helium temperatures

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dhuley, R. C.; Geelhoed, M. I.; Thangaraj, J. C. T.

Here, we examine the resistance to heat flow across contacts of mechanically pressed aluminum and niobium near liquid helium temperatures for designing a thermally conducting joint of aluminum and superconducting niobium. Measurements in the temperature range of 3.5 K to 5.5 K show the thermal contact resistance to grow as a near-cubic function of decreasing temperature, indicating phonons to be the primary heat carriers across the interface. In the 4 kN to 14 kN range of pressing force the contact resistance shows linear drop with the increasing force, in agreement with the model of micro-asperity plastic deformation at pressed contacts.more » Several thermal contact resistance models as well as the phonon diffuse mismatch model of interface thermal resistance are compared with the experimental data. The diffuse mismatch model shows closest agreement. The joints are further augmented with thin foil of indium, which lowers the joint resistance by an order of magnitude. The developed joint has nearly 1 K*cm2/W of thermal resistance at 4.2 K, is demountable, and free of the thermally resistive interfacial alloy layer that typically exists at welded, casted, or soldered joints of dissimilar metals.« less

Disturbance Impacts on Thermal Hot Spots and Hot Moments at the Peatland-Atmosphere Interface

NASA Astrophysics Data System (ADS)

Leonard, R. M.; Kettridge, N.; Devito, K. J.; Petrone, R. M.; Mendoza, C. A.; Waddington, J. M.; Krause, S.

2018-01-01

Soil-surface temperature acts as a master variable driving nonlinear terrestrial ecohydrological, biogeochemical, and micrometeorological processes, inducing short-lived or spatially isolated extremes across heterogeneous landscape surfaces. However, subcanopy soil-surface temperatures have been, to date, characterized through isolated, spatially discrete measurements. Using spatially complex forested northern peatlands as an exemplar ecosystem, we explore the high-resolution spatiotemporal thermal behavior of this critical interface and its response to disturbances by using Fiber-Optic Distributed Temperature Sensing. Soil-surface thermal patterning was identified from 1.9 million temperature measurements under undisturbed, trees removed and vascular subcanopy removed conditions. Removing layers of the structurally diverse vegetation canopy not only increased mean temperatures but it shifted the spatial and temporal distribution, range, and longevity of thermal hot spots and hot moments. We argue that linking hot spots and/or hot moments with spatially variable ecosystem processes and feedbacks is key for predicting ecosystem function and resilience.

Investigation of failure mechanism of thermal barrier coatings (TBCs) deposited by EB-PVD technique

NASA Astrophysics Data System (ADS)

Shahid, M. R.; Abbas, Musharaf

2013-06-01

Failure mechanism of thermal barrier coatings (TBCs) prepared by electron beam physical vapor deposition (EB-PVD) technique owing to formation of micro cracks was investigated. The TBCs were deposited on the Ni-based super alloy IN-100 and the micro cracks were observed within the top ceramic coat of thermally cycled TBCs at 1050°C. It was observed that these cracks propagate in the ceramic coat in the direction normal to interface while no cracks were observed in the bond coat. SEM/EDS studies revealed that some non-uniform oxides were formed on the interface between ceramic top and metallic bond coat just below the cracks. Study proposed that the cracks were initiated due to stress owing to big difference in Pilling-Bed worth ratio of non-uniform oxides as well as thermal stress, which caused the formation of cracks in top ceramic coat leading to failure of TBCs

Morphological instability of a thermophoretically growing deposit

NASA Technical Reports Server (NTRS)

Castillo, Jose L.; Garcia-Ybarra, Pedro L.; Rosner, Daniel E.

1992-01-01

The stability of the planar interface of a structureless solid growing from a depositing component dilute in a carrier fluid is studied when the main solute transport mechanism is thermal (Soret) diffusion. A linear stability analysis, carried out in the limit of low growth Peclet number, leads to a dispersion relation which shows that the planar front is unstable either when the thermal diffusion factor of the condensing component is positive and the latent heat release is small or when the thermal diffusion factor is negative and the solid grows over a thermally-insulating substrate. Furthermore, the influence of interfacial energy effects and constitutional supersaturation in the vicinity of the moving interface is analyzed in the limit of very small Schmidt numbers (small solute Fickian diffusion). The analysis is relevant to physical vapor deposition of very massive species on cold surfaces, as in recent experiments of organic solid film growth under microgravity conditions.

Interfacing the Generalized Fluid System Simulation Program with the SINDA/G Thermal Program

NASA Technical Reports Server (NTRS)

Schallhorn, Paul; Palmiter, Christopher; Farmer, Jeffery; Lycans, Randall; Tiller, Bruce

2000-01-01

A general purpose, one dimensional fluid flow code has been interfaced with the thermal analysis program SINDA/G. The flow code, GFSSP, is capable of analyzing steady state and transient flow in a complex network. The flow code is capable of modeling several physical phenomena including compressibility effects, phase changes, body forces (such as gravity and centrifugal) and mixture thermodynamics for multiple species. The addition of GFSSP to SINDA/G provides a significant improvement in convective heat transfer modeling for SINDA/G. The interface development was conducted in two phases. This paper describes the first (which allows for steady and quasi-steady - unsteady solid, steady fluid - conjugate heat transfer modeling). The second (full transient conjugate heat transfer modeling) phase of the interface development will be addressed in a later paper. Phase 1 development has been benchmarked to an analytical solution with excellent agreement. Additional test cases for each development phase demonstrate desired features of the interface. The results of the benchmark case, three additional test cases and a practical application are presented herein.

Closed-form analysis of fiber-matrix interface stresses under thermo-mechanical loadings

NASA Technical Reports Server (NTRS)

Naik, Rajiv A.; Crews, John H., Jr.

1992-01-01

Closed form techniques for calculating fiber matrix (FM) interface stresses, using repeating square and diamond regular arrays, were presented for a unidirectional composite under thermo-mechanical loadings. An Airy's stress function micromechanics approach from the literature, developed for calculating overall composite moduli, was extended in the present study to compute FM interface stresses for a unidirectional graphite/epoxy (AS4/3501-6) composite under thermal, longitudinal, transverse, transverse shear, and longitudinal shear loadings. Comparison with finite element results indicate excellent agreement of the FM interface stresses for the square array. Under thermal and longitudinal loading, the square array has the same FM peak stresses as the diamond array. The square array predicted higher stress concentrations under transverse normal and longitudinal shear loadings than the diamond array. Under transverse shear loading, the square array had a higher stress concentration while the diamond array had a higher radial stress concentration. Stress concentration factors under transverse shear and longitudinal shear loadings were very sensitive to fiber volume fraction. The present analysis provides a simple way to calculate accurate FM interface stresses for both the square and diamond array configurations.

Assessment of thermal loads in the CERN SPS crab cavities cryomodule 1

DOE PAGES

Carra, F.; Apeland, J.; Calaga, R.; ...

2017-07-20

As a part of the HL-LHC upgrade, we designed a cryomodule to host two crab cavities for a first test with protons in the SPS machine. The evaluation of the cryomodule heat loads is essential to dimension the cryogenic infrastructure of the system. The current design features two cryogenic circuits. The first circuit adopts superfluid helium at 2 K to maintain the cavities in the superconducting state. The second circuit, based on helium gas at a temperature between 50 K and 70 K, is connected to the thermal screen, also serving as heat intercept for all the interfaces between themore » cold mass and the external environment. We present an overview of the heat loads to both circuits, and the combined numerical and analytical estimations. The heat load of each element is detailed for the static and dynamic scenarios, with considerations on the design choices for the thermal optimization of the most critical components.« less

Advanced integrated life support system update

NASA Technical Reports Server (NTRS)

Whitley, Phillip E.

1994-01-01

The Advanced Integrated Life Support System Program (AILSS) is an advanced development effort to integrate the life support and protection requirements using the U.S. Navy's fighter/attack mission as a starting point. The goal of AILSS is to optimally mate protection from altitude, acceleration, chemical/biological agent, thermal environment (hot, cold, and cold water immersion) stress as well as mission enhancement through improved restraint, night vision, and head-mounted reticules and displays to ensure mission capability. The primary emphasis to date has been to establish garment design requirements and tradeoffs for protection. Here the garment and the human interface are treated as a system. Twelve state-off-the-art concepts from government and industry were evaluated for design versus performance. On the basis of a combination of centrifuge, thermal manikin data, thermal modeling, and mobility studies, some key design parameters have been determined. Future efforts will concentrate on the integration of protection through garment design and the use of a single layer, multiple function concept to streamline the garment system.

Development of the TACOM (Tank Automotive Command) Thermal Imaging Model (TTIM). Volume 1. Technical Guide and User’s Manual.

DTIC Science & Technology

1984-12-01

BLOCK DATA Default values for variables input by menus. LIBR Interface with frame I/O routines. SNSR Interface with sensor routines. ATMOS Interface with...Routines Included in Frame I/O Interface Routine Description LIBR Selects options for input or output to a data library. FRREAD Reads frame from file and/or...Layer", Journal of Applied Meteorology 20, pp. 242-249, March 1981. 15 L.J. Harding, Numerical Analysis and Applications Software Abstracts, Computing

Pressurization of a Flightweight, Liquid Hydrogen Tank: Evaporation and Condensation at a Liquid Vapor Interface

NASA Technical Reports Server (NTRS)

Stewart, Mark E.

2017-01-01

Evaporation and condensation at a liquidvapor interface is important for long-term, in-space cryogenic propellant storage. Yet the current understanding of interfacial physics does not predict behavior or evaporation condensation rates. The proposed paper will present a physical model, based on the 1-D Heat equation and Schrages equation which demonstrates thin thermal layers at the fluidvapor interface.

Interfacing with an EVA Suit

NASA Technical Reports Server (NTRS)

Ross, Amy

2011-01-01

A NASA spacesuit under the EVA Technology Domain consists of a suit system; a PLSS; and a Power, Avionics, and Software (PAS) system. Ross described the basic functions, components, and interfaces of the PLSS, which consists of oxygen, ventilation, and thermal control subsystems; electronics; and interfaces. Design challenges were reviewed from a packaging perspective. Ross also discussed the development of the PLSS over the last two decades.

Landsat-1 and Landsat-2 evaluation report, 23 January 1975 to 23 April 1975

NASA Technical Reports Server (NTRS)

1975-01-01

A description of the work accomplished with the Landsat-1 and Landsat-2 satellites during the period 23 Jan. - 23 Apr. 1975 was presented. The following information was given for each satellite: operational summary, orbital parameters, power subsystem, attitude control subsystem, command/clock subsystem, telemetry subsystem, orbit adjust subsystem, magnetic moment compensating assembly, unified S-band/premodulation processor, electrical interface subsystem, thermal subsystem, narrowband tape recorders, wideband telemetry subsystem, attitude measurement sensor, wideband video tape recorders, return beam vidicon, multispectral scanner subsystem, and data collection subsystem.

Interfacial free energy and stiffness of aluminum during rapid solidification

DOE Office of Scientific and Technical Information (OSTI.GOV)

Brown, Nicholas T.; Martinez, Enrique; Qu, Jianmin

Using molecular dynamics simulations and the capillary fluctuation method, we have calculated the anisotropic crystal-melt interfacial free energy and stiffness of aluminum in a rapid solidification system where a temperature gradient is applied to enforce thermal non-equilibrium. To calculate these material properties, the standard capillary fluctuation method typically used for systems in equilibrium has been modified to incorporate a second-order Taylor expansion of the interfacial free energy term. The result is a robust method for calculating interfacial energy, stiffness and anisotropy as a function of temperature gradient using the fluctuations in the defined interface height. This work includes the calculationmore » of interface characteristics for temperature gradients ranging from 11 to 34 K/nm. The captured results are compared to a thermal equilibrium case using the same model and simulation technique with a zero gradient definition. We define the temperature gradient as the change in temperature over height perpendicular to the crystal-melt interface. The gradients are applied in MD simulations using defined thermostat regions on a stable solid-liquid interface initially in thermal equilibrium. The results of this work show that the interfacial stiffness and free energy for aluminum are dependent on the magnitude of the temperature gradient, however the anisotropic parameters remain independent of the non-equilibrium conditions applied in this analysis. As a result, the relationships of the interfacial free energy/stiffness are determined to be linearly related to the thermal gradient, and can be interpolated to find material characteristics at additional temperature gradients.« less

Interfacial free energy and stiffness of aluminum during rapid solidification

DOE PAGES

Brown, Nicholas T.; Martinez, Enrique; Qu, Jianmin

2017-05-01

Using molecular dynamics simulations and the capillary fluctuation method, we have calculated the anisotropic crystal-melt interfacial free energy and stiffness of aluminum in a rapid solidification system where a temperature gradient is applied to enforce thermal non-equilibrium. To calculate these material properties, the standard capillary fluctuation method typically used for systems in equilibrium has been modified to incorporate a second-order Taylor expansion of the interfacial free energy term. The result is a robust method for calculating interfacial energy, stiffness and anisotropy as a function of temperature gradient using the fluctuations in the defined interface height. This work includes the calculationmore » of interface characteristics for temperature gradients ranging from 11 to 34 K/nm. The captured results are compared to a thermal equilibrium case using the same model and simulation technique with a zero gradient definition. We define the temperature gradient as the change in temperature over height perpendicular to the crystal-melt interface. The gradients are applied in MD simulations using defined thermostat regions on a stable solid-liquid interface initially in thermal equilibrium. The results of this work show that the interfacial stiffness and free energy for aluminum are dependent on the magnitude of the temperature gradient, however the anisotropic parameters remain independent of the non-equilibrium conditions applied in this analysis. As a result, the relationships of the interfacial free energy/stiffness are determined to be linearly related to the thermal gradient, and can be interpolated to find material characteristics at additional temperature gradients.« less

Transverse flexural tests as a tool for assessing damage to PMR-15 composites from isothermal aging in air at elevated temperatures

NASA Technical Reports Server (NTRS)

Bowles, Kenneth J.

1992-01-01

To date, the effect of thermo-oxidative aging on unidirectional composite mechanical properties has been monitored by the measurement of interlaminar shear strength (ILSS) and either three or four point longitudinal flexural strength (LFS) of the composites being tested. Both results are affected by the fiber-to-matrix bonding, the former being dependent on the shear resistance of the interface and the latter on the degree of load sharing by the fibers through the fiber/matrix interface. Recently, fiber/matrix interfacial bond strengths have been monitored using a transverse flexural strength (TFS) test method. This test method was used to evaluate the effect of fiber surface treatment on the fiber/matrix bond. The interface bonding was varied in these tests using Hercules A-fibers with three-types of surfaces that produce bonds of poor, better, and good quality. The TFS was found not only to be sensitive to the bonding, but also to the aging time of unidirectional A-fiber/PMR-15 composites. This relationship reflects the mechanism by which the PMR-15 degrades during thermal aging.

Space processing applications payload equipment study. Volume 2B: Payload interface analysis (power/thermal/electromagnetic compatibility)

NASA Technical Reports Server (NTRS)

Hammel, R. L. (Editor); Smith, A. G. (Editor)

1974-01-01

As a part of the task of performing preliminary engineering analysis of modular payload subelement/host vehicle interfaces, a subsystem interface analysis was performed to establish the integrity of the modular approach to the equipment design and integration. Salient areas that were selected for analysis were power and power conditioning, heat rejection and electromagnetic capability (EMC). The equipment and load profiles for twelve representative experiments were identified. Two of the twelve experiments were chosen as being representative of the group and have been described in greater detail to illustrate the evaluations used in the analysis. The shuttle orbiter will provide electrical power from its three fuel cells in support of the orbiter and the Spacelab operations. One of the three shuttle orbiter fuel cells will be dedicated to the Spacelab electrical power requirements during normal shuttle operation. This power supplies the Spacelab subsystems and the excess will be available to the payload. The current Spacelab sybsystem requirements result in a payload allocation of 4.0 to 4.8 kW average (24 hour/day) and 9.0 kW peak for 15 minutes.

Tuning Interfacial Thermal Conductance of Graphene Embedded in Soft Materials by Vacancy Defects

DOE PAGES

Liu, Ying; Hu, Chongze; Huang, Jingsong; ...

2015-06-23

Nanocomposites based on graphene dispersed in matrices of soft materials are promising thermal management materials. Their effective thermal conductivity depends on both the thermal conductivity of graphene and the conductance of the thermal transport across graphene-matrix interfaces. Here we report on molecular dynamics simulations of the thermal transport across the interfaces between defected graphene and soft materials in two different modes: in the across mode, heat enters graphene from one side of its basal plane and leaves through the other side; in the non-across mode, heat enters or leaves a graphene simultaneously from both sides of its basal plane. Wemore » show that, as the density of vacancy defects in graphene increases from 0 to 8%, the conductance of the interfacial thermal transport in the across mode increases from 160.4 16 to 207.8 11 MW/m2K, while that in the non-across mode increases from 7.2 0.1 to 17.8 0.6 MW/m2K. The molecular mechanisms for these variations of thermal conductance are clarified by using the phonon density of states and structural characteristics of defected graphenes. On the basis of these results and effective medium theory, we show that it is possible to enhance the effective thermal conductivity of thermal nanocomposites by tuning the density of vacancy defects in graphene despite the fact that graphene s thermal conductivity always decreases as vacancy defects are introduced.« less

Voltage tunability of thermal conductivity in ferroelectric materials

DOEpatents

Ihlefeld, Jon; Hopkins, Patrick Edward

2016-02-09

A method to control thermal energy transport uses mobile coherent interfaces in nanoscale ferroelectric films to scatter phonons. The thermal conductivity can be actively tuned, simply by applying an electrical potential across the ferroelectric material and thereby altering the density of these coherent boundaries to directly impact thermal transport at room temperature and above. The invention eliminates the necessity of using moving components or poor efficiency methods to control heat transfer, enabling a means of thermal energy control at the micro- and nano-scales.

Thermal Transport at Solid-Liquid Interfaces: High Pressure Facilitates Heat Flow through Nonlocal Liquid Structuring.

PubMed

Han, Haoxue; Mérabia, Samy; Müller-Plathe, Florian

2017-05-04

The integration of three-dimensional microelectronics is hampered by overheating issues inherent to state-of-the-art integrated circuits. Fundamental understanding of heat transfer across soft-solid interfaces is important for developing efficient heat dissipation capabilities. At the microscopic scale, the formation of a dense liquid layer at the solid-liquid interface decreases the interfacial heat resistance. We show through molecular dynamics simulations of n-perfluorohexane on a generic wettable surface that enhancement of the liquid structure beyond a single adsorbed layer drastically enhances interfacial heat conductance. Pressure is used to control the extent of the liquid layer structure. The interfacial thermal conductance increases with pressure values up to 16.2 MPa at room temperature. Furthermore, it is shown that liquid structuring enhances the heat-transfer rate of high-energy lattice waves by broadening the transmission peaks in the heat flux spectrum. Our results show that pressure is an important external parameter that may be used to control interfacial heat conductance at solid-soft interfaces.

Numerical investigation of electromagnetic pulse welded interfaces between dissimilar metals

DOE Office of Scientific and Technical Information (OSTI.GOV)

Xu, Wei; Sun, Xin

Electromagnetic pulse welding (EMPW), an innovative high-speed joining technique, is a potential method for the automotive industry in joining and assembly of dissimilar lightweight metals with drastically different melting temperatures and other thermal physical properties, such as thermal conductivity and thermal expansion coefficients. The weld quality of EMPW is significantly affected by a variety of interacting physical phenomena including large plastic deformation, materials mixing, localized heating and rapid cooling, possible localized melting and subsequent diffusion and solidification, micro-cracking and void, etc. In the present study, a thermo-mechanically coupled dynamic model has been developed to quantitatively resolve the high-speed impact joiningmore » interface characteristics as well as the process-induced interface temperature evolution, defect formation and possible microstructural composition variation. Reasonably good agreement has been obtained between the predicted results and experimental measurements in terms of interfacial morphology characteristics. The modeling framework is expected to provide further understanding of the hierarchical interfacial features of the non-equilibrium material joining process and weld formation mechanisms involved in the EMPW operation, thus accelerating future development and deployment of this advanced joining technology.« less

Ion-beam mixed ultra-thin cobalt suicide (CoSi2) films by cobalt sputtering and rapid thermal annealing

NASA Astrophysics Data System (ADS)

Kal, S.; Kasko, I.; Ryssel, H.

1995-10-01

The influence of ion-beam mixing on ultra-thin cobalt silicide (CoSi2) formation was investigated by characterizing the ion-beam mixed and unmixed CoSi2 films. A Ge+ ion-implantation through the Co film prior to silicidation causes an interface mixing of the cobalt film with the silicon substrate and results in improved silicide-to-silicon interface roughness. Rapid thermal annealing was used to form Ge+ ion mixed and unmixed thin CoSi2 layer from 10 nm sputter deposited Co film. The silicide films were characterized by secondary neutral mass spectroscopy, x-ray diffraction, tunneling electron microscopy (TEM), Rutherford backscattering, and sheet resistance measurements. The experi-mental results indicate that the final rapid thermal annealing temperature should not exceed 800°C for thin (<50 nm) CoSi2 preparation. A comparison of the plan-view and cross-section TEM micrographs of the ion-beam mixed and unmixed CoSi2 films reveals that Ge+ ion mixing (45 keV, 1 × 1015 cm-2) produces homogeneous silicide with smooth silicide-to-silicon interface.

Metal–Organic–Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances

DOE PAGES

Yegin, Cengiz; Nagabandi, Nirup; Feng, Xuhui; ...

2017-02-27

As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Here in this paper, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix -- which are prepared by chemisorption-coupledmore » electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m.K), which are very high considering their relatively low elastic modulus values on the order of 21.2 to 28.5 GPa. The synergistic combination of these properties lead to the ultra-low total thermal resistivity values in the range of 0.38 to 0.56 mm 2.K/W for a typical bondline thickness of 30-50 um, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally-induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.« less

Metal–Organic–Inorganic Nanocomposite Thermal Interface Materials with Ultralow Thermal Resistances

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yegin, Cengiz; Nagabandi, Nirup; Feng, Xuhui

As electronic devices get smaller and more powerful, energy density of energy storage devices increases continuously, and moving components of machinery operate at higher speeds, the need for better thermal management strategies is becoming increasingly important. The removal of heat dissipated during the operation of electronic, electrochemical, and mechanical devices is facilitated by high-performance thermal interface materials (TIMs) which are utilized to couple devices to heat sinks. Here in this paper, we report a new class of TIMs involving the chemical integration of boron nitride nanosheets (BNNS), soft organic linkers, and a copper matrix -- which are prepared by chemisorption-coupledmore » electrodeposition approach. These hybrid nanocomposites demonstrate bulk thermal conductivities ranging from 211 to 277 W/(m.K), which are very high considering their relatively low elastic modulus values on the order of 21.2 to 28.5 GPa. The synergistic combination of these properties lead to the ultra-low total thermal resistivity values in the range of 0.38 to 0.56 mm 2.K/W for a typical bondline thickness of 30-50 um, advancing the current state-of-art transformatively. Moreover, its coefficient of thermal expansion (CTE) is 11 ppm/K, forming a mediation zone with a low thermally-induced axial stress due to its close proximity to the CTE of most coupling surfaces needing thermal management.« less

The electrical behavior of GaAs-insulator interfaces - A discrete energy interface state model

NASA Technical Reports Server (NTRS)

Kazior, T. E.; Lagowski, J.; Gatos, H. C.

1983-01-01

The relationship between the electrical behavior of GaAs Metal Insulator Semiconductor (MIS) structures and the high density discrete energy interface states (0.7 and 0.9 eV below the conduction band) was investigated utilizing photo- and thermal emission from the interface states in conjunction with capacitance measurements. It was found that all essential features of the anomalous behavior of GaAs MIS structures, such as the frequency dispersion and the C-V hysteresis, can be explained on the basis of nonequilibrium charging and discharging of the high density discrete energy interface states.

Effects of optical design modifications on thermal performance of a highly reflective HfO2/SiO2/TiO2 three material coating

NASA Astrophysics Data System (ADS)

Ocak, M.; Sert, C.; Okutucu-Özyurt, T.

2018-02-01

Effects of layer thickness modifications on laser induced temperature distribution inside three material, highly reflective thin film coatings are studied with numerical simulations. As a base design, a 21 layer coating composed of HfO2, SiO2 and TiO2 layers of quarter wave thickness is considered. First, the laser induced temperature distribution in this base design is obtained. Then the layer thicknesses of the base design are modified and the corresponding temperature distributions in four alternative non-quarter wave coatings are evaluated. The modified thicknesses are determined using an in-house code developed to shift the electric field intensity (EFI) peak from the first high/low layer interface towards the adjacent low index layer that has a higher thermal conductivity, hence, higher laser damage resistance. Meanwhile, the induced increase in the EFI peak is kept at a user defined upper limit. The laser endurance of the base and alternative designs are compared in terms of their estimated temperature distributions. The results indicated that both the peak temperature and the highest interface temperature are decreased by at least 32%, in non-dimensional form, when alternative designs are used instead of the base design. The total reflection of the base design is only decreased from 99.8% to at most 99.4% when alternative designs are used. The study is proved to be successful in improving the laser endurance of three material thin film coatings by lowering the peak and interface temperatures.

Evaluation of mechanically alloyed Cu-based powders as filler alloy for brazing tungsten to a reduced activation ferritic-martensitic steel

NASA Astrophysics Data System (ADS)

de Prado, J.; Sánchez, M.; Ureña, A.

2017-07-01

80Cu-20Ti powders were evaluated for their use as filler alloy for high temperature brazing of tungsten to a reduced activation ferritic/martensitic steel (Eurofer), and its application for the first wall of the DEMO fusion reactor. The use of alloyed powders has not been widely considered for brazing purposes and could improve the operational brazeability of the studied system due to its narrower melting range, determined by DTA analysis, which enhances the spreading capabilities of the filler. Ti contained in the filler composition acts as an activator element, reacting and forming several interfacial layers at the Eurofer-braze, which enhances the wettability properties and chemical interaction at the brazing interface. Brazing thermal cycle also activated the diffusion phenomena, which mainly affected to the Eurofer alloying elements causing in it a softening band of approximately 400 μm of thickness. However, this softening effect did not degrade the shear strength of the brazed joints (94 ± 23 MPa), because failure during testing was always located at the tungsten-braze interface.

Modelling of directional solidification of BSO

NASA Astrophysics Data System (ADS)

Lin, Chenting; Motakef, Shahryar

1993-03-01

A thermo-fluid model for vertical Bridgman growth of bismuth silicon oxide (BSO) as model material for semi-transparent, low thermal conductivity oxides is developed. Internal radiative heat transfer, together with convective and conductive heat transfer are considered in this model. Due to the strong internal thermal radiation within the grown crystal, the growth interface is highly convex into the melt, instead of being concave as is the case for opaque materials with the thermal conductivity of the melt larger than that of the solid. Reduction of the growth interface non-planarity through variations in the growth configuration is investigated. A furnace temperature profile consisting of a steep gradient on the melt side and shallow gradient on the solid side of the charge is found to be the most effective approach.

Thermal and mechanical behavior of metal matrix and ceramic matrix composites

NASA Technical Reports Server (NTRS)

Kennedy, John M. (Editor); Moeller, Helen H. (Editor); Johnson, W. S. (Editor)

1990-01-01

The present conference discusses local stresses in metal-matrix composites (MMCs) subjected to thermal and mechanical loads, the computational simulation of high-temperature MMCs' cyclic behavior, an analysis of a ceramic-matrix composite (CMC) flexure specimen, and a plasticity analysis of fibrous composite laminates under thermomechanical loads. Also discussed are a comparison of methods for determining the fiber-matrix interface frictional stresses of CMCs, the monotonic and cyclic behavior of an SiC/calcium aluminosilicate CMC, the mechanical and thermal properties of an SiC particle-reinforced Al alloy MMC, the temperature-dependent tensile and shear response of a graphite-reinforced 6061 Al-alloy MMC, the fiber/matrix interface bonding strength of MMCs, and fatigue crack growth in an Al2O3 short fiber-reinforced Al-2Mg matrix MMC.

Optical study on thermal radiation energy of diesel spray combustion in a shock tube

NASA Astrophysics Data System (ADS)

Tsuboi, T.; Nagaya, K.; Ishii, K.

. A ``tailored'' interface shock tube was used to measure the thermal energy radiated from diesel-spray combustion. Experiments were performed in a steel shock tube with a seven m long low-pressure section filled with air and a six m long high-pressure section. Pre-compressed fuel was injected through a throttling nozzle into air behind a reflected shock wave. Monochromatic emissive powers and emissive powers of the whole IR-wavelengths were followed with IR-detectors set along the central axis of the tube. Time-dependent-radii, where soot particles radiate, were also determined. Results were : (1) the tailored interface shock tube could be applied to a study of diesel-spray combustion. (2) thermal radiation energy could be described well from the ignition delay of the fuel spray.

GaN on Diamond with Ultra-Low Thermal Barrier Resistance

DTIC Science & Technology

2016-03-31

GaN-on-Diamond with Ultra-Low Thermal Barrier Resistance Xing Gu1, Cathy Lee1, Jinqiao Xie1, Edward Beam1, Michael Becker2, Timothy A. Grotjohn2...Bristol BS8 1TL, UK Abstract: We investigated the effective thermal boundary resistance (TBReff) of GaN-on-Diamond interfaces for diamond growth... thermal boundary resistance; TBReff , interfacial layers; high density dielectric Introduction While GaN-based RF transistors, typically on SiC

Energy-Efficient Phase-Change Memory with Graphene as a Thermal Barrier

DTIC Science & Technology

2015-09-02

Joule heating should be restricted inside a small volume of the phase-change material and heat loss by thermal conduction to the surroundings needs to...technique (see Figure 1a). TDTR is a well-established pump− probe technique, capable of measuring the cross-plane thermal conductivity of nanometer-thin...films and thermal conductance per unit area across interfaces of particular interest27 (see Supporting Information, Section 1 and Figure S1

Size effects in the thermal conductivity of gallium oxide (β-Ga{sub 2}O{sub 3}) films grown via open-atmosphere annealing of gallium nitride

DOE Office of Scientific and Technical Information (OSTI.GOV)

Szwejkowski, Chester J.; Giri, Ashutosh; Donovan, Brian F.

2015-02-28

Gallium nitride (GaN) is a widely used semiconductor for high frequency and high power devices due to of its unique electrical properties: a wide band gap, high breakdown field, and high electron mobility. However, thermal management has become a limiting factor regarding efficiency, lifetime, and advancement of GaN devices and GaN-based applications. In this work, we study the thermal conductivity of beta-phase gallium oxide (β-Ga{sub 2}O{sub 3}) thin films, a component of typical gate oxides used in such devices. We use time domain thermoreflectance to measure the thermal conductivity of a variety of polycrystalline β-Ga{sub 2}O{sub 3} films of differentmore » thicknesses grown via open atmosphere annealing of the surfaces of GaN films on sapphire substrates. We show that the measured effective thermal conductivity of these β-Ga{sub 2}O{sub 3} films can span 1.5 orders of magnitude, increasing with an increased film thickness, which is indicative of the relatively large intrinsic thermal conductivity of the β-Ga{sub 2}O{sub 3} grown via this technique (8.8 ± 3.4 W m{sup −1} K{sup −1}) and large mean free paths compared to typical gate dielectrics commonly used in GaN device contacts. By conducting time domain thermoreflectance (TDTR) measurements with different metal transducers (Al, Au, and Au with a Ti wetting layer), we attribute this variation in effective thermal conductivity to a combination of size effects in the β-Ga{sub 2}O{sub 3} film resulting from phonon scattering at the β-Ga{sub 2}O{sub 3}/GaN interface and thermal transport across the β-Ga{sub 2}O{sub 3}/GaN interface. The measured thermal properties of open atmosphere-grown β-Ga{sub 2}O{sub 3} and its interface with GaN set the stage for thermal engineering of gate contacts in high frequency GaN-based devices.« less

Pressurization of a Flightweight, Liquid Hydrogen Tank: Evaporation and Condensation at a Liquid Vapor Interface

NASA Technical Reports Server (NTRS)

Stewart, Mark

2017-01-01

Evaporation and condensation at a liquid-vapor interface is important for long-term, in-space cryogenic propellant storage. Yet the current understanding of inter-facial physics does not consistently predict behavior of evaporation or condensation rates. The proposed paper will present a physical model, based on the 1-D Heat equation and Schrage's equation, which demonstrates thin thermal layers at the fluid vapor interface.

NASA Tech Briefs, December 2003

NASA Technical Reports Server (NTRS)

2003-01-01

Topics covered include: Organic/Inorganic Hybrid Polymer/Clay Nanocomposites; Less-Toxic Coatings for Inhibiting Corrosion of Aluminum; Liquid Coatings for Reducing Corrosion of Steel in Concrete; Processable Polyimides Containing APB and Reactive End Caps; Rod/Coil Block Copolyimides for Ion-Conducting Membranes; Techniques for Characterizing Microwave Printed Antennas; Cylindrical Antenna With Partly Adaptive Phased-Array Feed; Command Interface ASIC - Analog Interface ASIC Chip Set; Predicting Accumulations of Ice on Aerodynamic Surfaces; Analyzing Aeroelasticity in Turbomachines; Software for Allocating Resources in the Deep Space Network; Expert Seeker; High-Speed Recording of Test Data on Hard Disks; Functionally Graded Nanophase Beryllium/Carbon Composites; Thin Thermal-Insulation Blankets for Very High Temperatures; Aerostructures Test Wing; Flight-Test Evaluation of Flutter-Prediction Methods; Piezoelectrically Actuated Microvalve for Liquid Effluents; Larger-Stroke Piezoelectrically Actuated Microvalve; Innovative, High-Pressure, Cryogenic Control Valve: Short Face-to-Face, Reduced Cost; Safer Roadside Crash Walls Would Limit Deceleration; Improved Interactive Medical-Imaging System; Scanning Microscopes Using X Rays and Microchannels; Slotting Fins of Heat Exchangers to Provide Thermal Breaks; Methane Clathrate Hydrate Prospecting; Automated Monitoring with a BSP Fault-Detection Test; Automated Monitoring with a BCP Fault-Decision Test; Vector-Ordering Filter Procedure for Data Reduction; Remote Sensing and Information Technology for Large Farms; Developments at the Advanced Design Technologies Testbed; Spore-Forming Bacteria that Resist Sterilization; and Acoustical Applications of the HHT Method.

Observations on the oxidation of Mn-modified Ni-base Haynes 230 alloy under SOFC exposure conditions

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yang, Z Gary; Xia, Gordon; Stevenson, Jeffry W.

2005-07-01

The commercial Ni-base Haynes 230 alloy (Ni-Cr-Mo-W-Mn) was modified with two increased levels of Mn (1 and 2 wt per cent) and evaluated for its oxidation resistance under simulated SOFC interconnect exposure conditions. Oxidation rate, oxide morphology, oxide conductivity and thermal expansion were measured and compared with commercial Haynes 230. It was observed that additions of higher levels of Mn to the bulk alloy facilitated the formation of a bi-layered oxide scale that was comprised of an outer M3O4 (M=Mn, Cr, Ni) spinel-rich layer at the oxide – gas interface over a Cr2O3-rich sub-layer at the metal – oxide interface.more » The modified alloys showed higher oxidation rates and the formation of thicker oxide scales compared to the base alloy. The formation of a spinel-rich top layer improved the scale conductivity, especially during the early stages of the oxidation, but the higher scale growth rate resulted in an increase in the area-specific electrical resistance over time. Due to their face-centered cubic crystal structure, both commercial and modified alloys demonstrated a coefficient of thermal expansion that was higher than that of typical anode-supported and electrolyte-supported SOFCs.« less

Infrared Thermography as a Non-destructive Testing Solution for Thermal Spray Metal Coatings

NASA Astrophysics Data System (ADS)

Santangelo, Paolo E.; Allesina, Giulio; Bolelli, Giovanni; Lusvarghi, Luca; Matikainen, Ville; Vuoristo, Petri

2017-12-01

In this work, an infrared (IR) thermographic procedure was evaluated as a non-destructive testing tool to detect damage in thermal spray metallic coatings. As model systems, polished HVOF- and HVAF-sprayed Fe-based layers deposited onto steel plates were employed. Damage by external-object impingement was simulated through a cyclic impact-test apparatus, which induced circumferential and radial cracks across all model systems, and interface cracks of different sizes in distinct samples. Damaged and undamaged plates were bulk-heated to above 100 °C using an IR lamp; their free-convection cooling was then recorded by an IR thermocamera. The intentionally induced defects were hardly detectable in IR thermograms, due to IR reflection and artificial "hot" spots induced by residuals of transfer material from the impacting counterbody. As a micrometer-thin layer of black paint was applied, surface emissivity got homogenized and any artifacts were effectively suppressed, so that failed coating areas clearly showed up as "cold spots." This effect was more apparent when large interface cracks occurred. Finite-element modeling proved the physical significance of the IR-thermography approach, showing that failed coating areas are cooled by surrounding air faster than they are heated by conduction from the hot substrate, which is due to the insulating effect of cracks.

Atomic density effects on temperature characteristics and thermal transport at grain boundaries through a proper bin size selection

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vo, Truong Quoc; Kim, BoHung, E-mail: muratbarisik@iyte.edu.tr, E-mail: bohungk@ulsan.ac.kr; Barisik, Murat, E-mail: muratbarisik@iyte.edu.tr, E-mail: bohungk@ulsan.ac.kr

2016-05-21

This study focuses on the proper characterization of temperature profiles across grain boundaries (GBs) in order to calculate the correct interfacial thermal resistance (ITR) and reveal the influence of GB geometries onto thermal transport. The solid-solid interfaces resulting from the orientation difference between the (001), (011), and (111) copper surfaces were investigated. Temperature discontinuities were observed at the boundary of grains due to the phonon mismatch, phonon backscattering, and atomic forces between dissimilar structures at the GBs. We observed that the temperature decreases gradually in the GB area rather than a sharp drop at the interface. As a result, threemore » distinct temperature gradients developed at the GB which were different than the one observed in the bulk solid. This behavior extends a couple molecular diameters into both sides of the interface where we defined a thickness at GB based on the measured temperature profiles for characterization. Results showed dependence on the selection of the bin size used to average the temperature data from the molecular dynamics system. The bin size on the order of the crystal layer spacing was found to present an accurate temperature profile through the GB. We further calculated the GB thickness of various cases by using potential energy (PE) distributions which showed agreement with direct measurements from the temperature profile and validated the proper binning. The variation of grain crystal orientation developed different molecular densities which were characterized by the average atomic surface density (ASD) definition. Our results revealed that the ASD is the primary factor affecting the structural disorders and heat transfer at the solid-solid interfaces. Using a system in which the planes are highly close-packed can enhance the probability of interactions and the degree of overlap between vibrational density of states (VDOS) of atoms forming at interfaces, leading to a reduced ITR. Thus, an accurate understanding of thermal characteristics at the GB can be formulated by selecting a proper bin size.« less

Atomic density effects on temperature characteristics and thermal transport at grain boundaries through a proper bin size selection

NASA Astrophysics Data System (ADS)

Vo, Truong Quoc; Barisik, Murat; Kim, BoHung

2016-05-01

This study focuses on the proper characterization of temperature profiles across grain boundaries (GBs) in order to calculate the correct interfacial thermal resistance (ITR) and reveal the influence of GB geometries onto thermal transport. The solid-solid interfaces resulting from the orientation difference between the (001), (011), and (111) copper surfaces were investigated. Temperature discontinuities were observed at the boundary of grains due to the phonon mismatch, phonon backscattering, and atomic forces between dissimilar structures at the GBs. We observed that the temperature decreases gradually in the GB area rather than a sharp drop at the interface. As a result, three distinct temperature gradients developed at the GB which were different than the one observed in the bulk solid. This behavior extends a couple molecular diameters into both sides of the interface where we defined a thickness at GB based on the measured temperature profiles for characterization. Results showed dependence on the selection of the bin size used to average the temperature data from the molecular dynamics system. The bin size on the order of the crystal layer spacing was found to present an accurate temperature profile through the GB. We further calculated the GB thickness of various cases by using potential energy (PE) distributions which showed agreement with direct measurements from the temperature profile and validated the proper binning. The variation of grain crystal orientation developed different molecular densities which were characterized by the average atomic surface density (ASD) definition. Our results revealed that the ASD is the primary factor affecting the structural disorders and heat transfer at the solid-solid interfaces. Using a system in which the planes are highly close-packed can enhance the probability of interactions and the degree of overlap between vibrational density of states (VDOS) of atoms forming at interfaces, leading to a reduced ITR. Thus, an accurate understanding of thermal characteristics at the GB can be formulated by selecting a proper bin size.

Modeling Interfacial Thermal Boundary Conductance of Engineered Interfaces

DTIC Science & Technology

2014-08-31

melting / recrystallization of the subsurface Ag/Cu interface. Observed the formation of a novel, lattice-mismatched interfacial microstruc- ture...calculations were converged within 1 × 10−4 Ryd with respect to wave function cutoff energy, energy density cutoff, and k- point sampling. The A-EAM

Role of entrapped vapor bubbles during microdroplet evaporation

NASA Astrophysics Data System (ADS)

Putnam, Shawn A.; Byrd, Larry W.; Briones, Alejandro M.; Hanchak, Michael S.; Ervin, Jamie S.; Jones, John G.

2012-08-01

On superheated surfaces, the air bubble trapped during impingement grows into a larger vapor bubble and oscillates at the frequency predicted for thermally induced capillary waves. In some cases, the entrapped vapor bubble penetrates the droplet interface, leaving a micron-sized coffee-ring pattern of pure fluid. Vapor bubble entrapment, however, does not influence the evaporation rate. This is also true on laser heated surfaces, where a laser can thermally excite capillary waves and induce bubble oscillations over a broad range of frequencies, suggesting that exciting perturbations in a pinned droplets interface is not an effective avenue for enhancing evaporative heat transfer.

Spatial profile of thermoelectric effects during Peltier pulsing in Bi and Bi/MnBi eutectic

NASA Technical Reports Server (NTRS)

Silberstein, R. P.; Larson, D. J., Jr.

1987-01-01

The spatial profile of the thermal transients that occur during and following the current pulsing associated with Peltier Interface Demarcation during directional solidification is studied. Results for pure Bi are presented in detail and compared with corresponding results for the Bi/MnBi eutectic. Significant thermal transients occur throughout the sample that can be accounted for by the Peltier effect, the Thomson effect, and Joule heating. These effects are separated and their behavior is studied as a function of time, current density, and position with respect to the solid/liquid interface.

Multiscale Modeling of Novel Carbon Nanotube/Copper-Composite Material Used in Microelectronics

NASA Astrophysics Data System (ADS)

Awad, Ibrahim; Ladani, Leila

2016-06-01

Current carrying capacity is one of the elements that hinders further miniaturization of Copper (Cu) interconnects. Therefore, there is a need to propose new materials with higher ampacity (current carrying capacity) that have the potential to replace Cu. Experimental observations have shown that Carbon Nanotube (CNT)/Cu-composite material has a hundredfold ampacity of Cu, which makes it a good candidate to replace Cu. However, sufficient information about the mechanical behavior of the novel CNT/Cu-composite is not available. In the current paper, the CNT/Cu-composite is utilized to construct Through Silicon Via (TSV). The mechanical behavior, specifically the fatigue life, of the CNT/Cu-TSV is evaluated by applying a multiscale modeling approach. Molecular Dynamics (MD) simulations are conducted to evaluate the tensile strength and the coefficient of thermal expansion of CNTs. MD simulation is also used to determine the interface behavior between CNTs and Cu. MD simulation results are integrated into Finite Element analysis at the micro-level to estimate the fatigue life of the CNT/Cu-TSV. A comparison is made with base material; Cu. CNTs addition has redistributed the plastic deformation in Cu to occur at two different locations (Si/Cu interface and Cu/CNT interface) instead of only one location (Si/Cu interface) in the case of Cu-only-TSV. Thus, the maximum equivalent plastic strain has been alleviated in the CNT/Cu-TSV. Accordingly, CNT/Cu-TSV has shown a threefold increase in the fatigue life. This is a solid indication of the improvement in the fatigue life that is attributed to the addition of CNTs.

Thermal contact conductance as a method of rectification in bulk materials

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sayer, Robert A.

2016-08-01

A thermal rectifier that utilizes thermal expansion to directionally control interfacial conductance between two contacting surfaces is presented. The device consists of two thermal reservoirs contacting a beam with one rough and one smooth end. When the temperature of reservoir in contact with the smooth surface is raised, a similar temperature rise will occur in the beam, causing it to expand, thus increasing the contact pressure at the rough interface and reducing the interfacial contact resistance. However, if the temperature of the reservoir in contact with the rough interface is raised, the large contact resistance will prevent a similar temperaturemore » rise in the beam. As a result, the contact pressure will be marginally affected and the contact resistance will not change appreciably. Owing to the decreased contact resistance of the first scenario compared to the second, thermal rectification occurs. A parametric analysis is used to determine optimal device parameters including surface roughness, contact pressure, and device length. Modeling predicts that rectification factors greater than 2 are possible at thermal biases as small as 3 K. Lastly, thin surface coatings are discussed as a method to control the temperature bias at which maximum rectification occurs.« less

Thermal management systems and methods

DOEpatents

Gering, Kevin L.; Haefner, Daryl R.

2006-12-12

A thermal management system for a vehicle includes a heat exchanger having a thermal energy storage material provided therein, a first coolant loop thermally coupled to an electrochemical storage device located within the first coolant loop and to the heat exchanger, and a second coolant loop thermally coupled to the heat exchanger. The first and second coolant loops are configured to carry distinct thermal energy transfer media. The thermal management system also includes an interface configured to facilitate transfer of heat generated by an internal combustion engine to the heat exchanger via the second coolant loop in order to selectively deliver the heat to the electrochemical storage device. Thermal management methods are also provided.

IAC - INTEGRATED ANALYSIS CAPABILITY

NASA Technical Reports Server (NTRS)

Frisch, H. P.

1994-01-01

The objective of the Integrated Analysis Capability (IAC) system is to provide a highly effective, interactive analysis tool for the integrated design of large structures. With the goal of supporting the unique needs of engineering analysis groups concerned with interdisciplinary problems, IAC was developed to interface programs from the fields of structures, thermodynamics, controls, and system dynamics with an executive system and database to yield a highly efficient multi-disciplinary system. Special attention is given to user requirements such as data handling and on-line assistance with operational features, and the ability to add new modules of the user's choice at a future date. IAC contains an executive system, a data base, general utilities, interfaces to various engineering programs, and a framework for building interfaces to other programs. IAC has shown itself to be effective in automatic data transfer among analysis programs. IAC 2.5, designed to be compatible as far as possible with Level 1.5, contains a major upgrade in executive and database management system capabilities, and includes interfaces to enable thermal, structures, optics, and control interaction dynamics analysis. The IAC system architecture is modular in design. 1) The executive module contains an input command processor, an extensive data management system, and driver code to execute the application modules. 2) Technical modules provide standalone computational capability as well as support for various solution paths or coupled analyses. 3) Graphics and model generation interfaces are supplied for building and viewing models. Advanced graphics capabilities are provided within particular analysis modules such as INCA and NASTRAN. 4) Interface modules provide for the required data flow between IAC and other modules. 5) User modules can be arbitrary executable programs or JCL procedures with no pre-defined relationship to IAC. 6) Special purpose modules are included, such as MIMIC (Model Integration via Mesh Interpolation Coefficients), which transforms field values from one model to another; LINK, which simplifies incorporation of user specific modules into IAC modules; and DATAPAC, the National Bureau of Standards statistical analysis package. The IAC database contains structured files which provide a common basis for communication between modules and the executive system, and can contain unstructured files such as NASTRAN checkpoint files, DISCOS plot files, object code, etc. The user can define groups of data and relations between them. A full data manipulation and query system operates with the database. The current interface modules comprise five groups: 1) Structural analysis - IAC contains a NASTRAN interface for standalone analysis or certain structural/control/thermal combinations. IAC provides enhanced structural capabilities for normal modes and static deformation analysis via special DMAP sequences. IAC 2.5 contains several specialized interfaces from NASTRAN in support of multidisciplinary analysis. 2) Thermal analysis - IAC supports finite element and finite difference techniques for steady state or transient analysis. There are interfaces for the NASTRAN thermal analyzer, SINDA/SINFLO, and TRASYS II. FEMNET, which converts finite element structural analysis models to finite difference thermal analysis models, is also interfaced with the IAC database. 3) System dynamics - The DISCOS simulation program which allows for either nonlinear time domain analysis or linear frequency domain analysis, is fully interfaced to the IAC database management capability. 4) Control analysis - Interfaces for the ORACLS, SAMSAN, NBOD2, and INCA programs allow a wide range of control system analyses and synthesis techniques. Level 2.5 includes EIGEN, which provides tools for large order system eigenanalysis, and BOPACE, which allows for geometric capabilities and finite element analysis with nonlinear material. Also included in IAC level 2.5 is SAMSAN 3.1, an engineering analysis program which contains a general purpose library of over 600 subroutin

Centaur Standard Shroud (CSS) static ultimate load structural tests

NASA Technical Reports Server (NTRS)

1975-01-01

A series of tests were conducted on the jettisonable metallic shroud used on the Titan/Centaur launch vehicle to verify its structural capabilities and to evaluate its structural interaction with the Centaur stage. A flight configured shroud and the interfacing Titan/Centaur structural assemblies were subjected to tests consisting of combinations of applied axial and shear loads to design ultimate values, including a set of tests on thermal conditions and two dynamic response tests to verify the analytical stiffness model. The strength capabilities were demonstrated at ultimate (125 percent of design limit) loads. It was also verified that the spring rate of the flight configured shroud-to-Centaur forward structural deflections of the specimen became nonlinear, as expected, above limit load values. This test series qualification program verified that the Titan/Centaur shroud and the Centaur and Titan interface components are qualified structurally at design ultimate loads.

Portable Solid Phase Micro-Extraction Coupled with Ion Mobility Spectrometry System for On-Site Analysis of Chemical Warfare Agents and Simulants in Water Samples

PubMed Central

Yang, Liu; Han, Qiang; Cao, Shuya; Yang, Jie; Yang, Junchao; Ding, Mingyu

2014-01-01

On-site analysis is an efficient approach to facilitate analysis at the location of the system under investigation as it can result in more accurate, more precise and quickly available analytical data. In our work, a novel self-made thermal desorption based interface was fabricated to couple solid-phase microextraction with ion mobility spectrometry for on-site water analysis. The portable interface can be connected with the front-end of an ion mobility spectrometer directly without other modifications. The analytical performance was evaluated via the extraction of chemical warfare agents and simulants in water samples. Several parameters including ionic strength and extraction time have been investigated in detail. The application of the developed method afforded satisfactory recoveries ranging from 72.9% to 114.4% when applied to the analysis of real water samples. PMID:25384006

Simulation of thermal stress in Er2O3 and Al2O3 tritium penetration barriers by finite-element analysis

NASA Astrophysics Data System (ADS)

Ze, LIU; Guogang, YU; Anping, HE; Ling, WANG

2017-09-01

The physical vapor deposition method is an effective way to deposit Al2O3 and Er2O3 on 316L stainless steel substrates acting as tritium permeation barriers in a fusion reactor. The distribution of residual thermal stress is calculated both in Al2O3 and Er2O3 coating systems with planar and rough substrates using finite element analysis. The parameters influencing the thermal stress in the sputter process are analyzed, such as coating and substrate properties, temperature and Young’s modulus. This work shows that the thermal stress in Al2O3 and Er2O3 coating systems exhibit a linear relationship with substrate thickness, temperature and Young’s modulus. However, this relationship is inversed with coating thickness. In addition, the rough substrate surface can increase the thermal stress in the process of coating deposition. The adhesive strength between the coating and the substrate is evaluated by the shear stress. Due to the higher compressive shear stress, the Al2O3 coating has a better adhesive strength with a 316L stainless steel substrate than the Er2O3 coating. Furthermore, the analysis shows that it is a useful way to improve adhesive strength with increasing interface roughness.

Design Through Manufacturing: The Solid Model - Finite Element Analysis Interface

NASA Technical Reports Server (NTRS)

Rubin, Carol

2003-01-01

State-of-the-art computer aided design (CAD) presently affords engineers the opportunity to create solid models of machine parts which reflect every detail of the finished product. Ideally, these models should fulfill two very important functions: (1) they must provide numerical control information for automated manufacturing of precision parts, and (2) they must enable analysts to easily evaluate the stress levels (using finite element analysis - FEA) for all structurally significant parts used in space missions. Today's state-of-the-art CAD programs perform function (1) very well, providing an excellent model for precision manufacturing. But they do not provide a straightforward and simple means of automating the translation from CAD to FEA models, especially for aircraft-type structures. The research performed during the fellowship period investigated the transition process from the solid CAD model to the FEA stress analysis model with the final goal of creating an automatic interface between the two. During the period of the fellowship a detailed multi-year program for the development of such an interface was created. The ultimate goal of this program will be the development of a fully parameterized automatic ProE/FEA translator for parts and assemblies, with the incorporation of data base management into the solution, and ultimately including computational fluid dynamics and thermal modeling in the interface.

Measurements of interfacial thermal contact conductance between pressed alloys at low temperatures

NASA Astrophysics Data System (ADS)

Zheng, Jiang; Li, Yanzhong; Chen, Pengwei; Yin, Geyuan; Luo, Huaihua

2016-12-01

Interfacial thermal contact conductance is the primary factor limiting the heat transfer in many cryogenic engineering applications. This paper presents an experimental apparatus to measure interfacial thermal contact conductance between pressed alloys in a vacuum environment at low temperatures. The measurements of thermal contact conductance between pressed alloys are conducted by using the developed apparatus. The results show that the contact conductance increases with the decrease of surface roughness, the increase of interface temperature and contact pressure. The temperature dependence of thermal conductivity and mechanical properties is analyzed to explain the results. Thermal contact conductance of a pair of stainless steel specimens is obtained in the interface temperature range of 135-245 K and in the contact pressure range of 1-9 MPa. The results are regressed as a power function of temperature and load. Thermal conductance is also obtained between aluminums as well as between stainless steel and aluminum. The load exponents of the regressed relations for different contacts are compared. Existing theoretical models (the Cooper-Mikic-Yovanovich plastic model, the Mikic elastic model and the improved Kimura model) are reviewed and compared with the experimental results. The Cooper-Mikic-Yovanovich model predictions are found to be in good agreement with experimental results, especially with measurements between aluminums.

Surface-restrained growth of vertically aligned carbon nanotube arrays with excellent thermal transport performance.

PubMed

Ping, Linquan; Hou, Peng-Xiang; Liu, Chang; Li, Jincheng; Zhao, Yang; Zhang, Feng; Ma, Chaoqun; Tai, Kaiping; Cong, Hongtao; Cheng, Hui-Ming

2017-06-22

A vertically aligned carbon nanotube (VACNT) array is a promising candidate for a high-performance thermal interface material in high-power microprocessors due to its excellent thermal transport property. However, its rough and entangled free tips always cause poor interfacial contact, which results in serious contact resistance dominating the total thermal resistance. Here, we employed a thin carbon cover to restrain the disorderly growth of the free tips of a VACNT array. As a result, all the free tips are seamlessly connected by this thin carbon cover and the top surface of the array is smoothed. This unique structure guarantees the participation of all the carbon nanotubes in the array in the heat transport. Consequently the VACNT array grown on a Cu substrate shows a record low thermal resistance of 0.8 mm 2 K W -1 including the two-sided contact resistances, which is 4 times lower than the best result previously reported. Remarkably, the VACNT array can be easily peeled away from the Cu substrate and act as a thermal pad with excellent flexibility, adhesive ability and heat transport capability. As a result the CNT array with a thin carbon cover shows great potential for use as a high-performance flexible thermal interface material.

The Texas Thermal Interface: A real-time computer interface for an Inframetrics infrared camera

DOE Office of Scientific and Technical Information (OSTI.GOV)

Storek, D.J.; Gentle, K.W.

1996-03-01

The Texas Thermal Interface (TTI) offers an advantageous alternative to the conventional video path for computer analysis of infrared images from Inframetrics cameras. The TTI provides real-time computer data acquisition of 48 consecutive fields (version described here) with 8-bit pixels. The alternative requires time-consuming individual frame grabs from video tape with frequent loss of resolution in the D/A/D conversion. Within seconds after the event, the TTI temperature files may be viewed and processed to infer heat fluxes or other quantities as needed. The system cost is far less than commercial units which offer less capability. The system was developed formore » and is being used to measure heat fluxes to the plasma-facing components in a tokamak. {copyright} {ital 1996 American Institute of Physics.}« less

Low-temperature electron cyclotron resonance plasma-enhanced chemical-vapor deposition silicon dioxide as gate insulator for polycrystalline silicon thin-film transistors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Maiolo, L.; Pecora, A.; Fortunato, G.

2006-03-15

Silicon dioxide films have been deposited at temperatures below 270 deg. C in an electron cyclotron resonance (ECR) plasma reactor from O{sub 2}, SiH{sub 4}, and He gas mixture. Pinhole density analysis as a function of substrate temperature for different microwave powers was carried out. Films deposited at higher microwave power and at room temperature show defect densities (<7 pinhole/mm{sup 2}), ensuring low-temperature process integration on large area. From Fourier transform infrared analysis and thermal desorption spectrometry we also evaluated very low hydrogen content if compared to conventional rf-plasma-enhanced chemical-vapor-deposited (PECVD) SiO{sub 2} deposited at 350 deg. C. Electrical propertiesmore » have been measured in metal-oxide-semiconductor (MOS) capacitors, depositing SiO{sub 2} at RT as gate dielectric; breakdown electric fields >10 MV/cm and charge trapping at fields >6 MV/cm have been evaluated. From the study of interface quality in MOS capacitors, we found that even for low annealing temperature (200 deg. C), it is possible to considerably reduce the interface state density down to 5x10{sup 11} cm{sup -2} eV{sup -1}. To fully validate the ECR-PECVD silicon dioxide we fabricated polycrystalline silicon thin-film transistors using RT-deposited SiO{sub 2} as gate insulator. Different postdeposition thermal treatments have been studied and good device characteristics were obtained even for annealing temperature as low as 200 deg. C.« less

Microorganism Nutrition Processes as a General Route for the Preparation of Bionic Nanocomposites Based on Intractable Polymers.

PubMed

Valentini, L; Bon, S Bittolo; Pugno, N M

2016-08-31

In this paper the fermentation process activated by living microorganisms of the baker's yeast is proposed as a facile assembly method of hybrid nanoparticles at liquid interface. Water dispersion of commercial baker's yeast extract used for bread production, graphene nanoplatelets (GNPs), and carbon nanotubes (CNTs) were added to oil/water interface; when the yeast is activated by adding sugar, the byproduct carbon dioxide bubbles migrate from the water phase to the oil/water interface generating a floating nanostructured film at liquid interface where it is trapped. Starting from this simple method, we propose a general approach for the stabilization of intractable poly(etheretherketone) polymeric particles with GNPs and CNTs at immiscible liquid interface. This process allowed the formation of sintered porous composites with improved mechanical properties. The porous structure of the composites gave rise to a low thermal conductivity making them good candidates for thermal insulating applications. Liquid absorption by these porous composites has been also reported. We believe that this new approach may have applications in the large scale fabrication of nanomaterials and is particularly suited for the preparation of nanocomposites starting from polymers that are intractable by solvent casting.

Across-plane thermal characterization of films based on amplitude-frequency profile in photothermal technique

DOE Office of Scientific and Technical Information (OSTI.GOV)

Xu, Shen; Wang, Xinwei, E-mail: xwang3@iastate.edu

2014-10-15

This work develops an amplitude method for the photothermal (PT) technique to analyze the amplitude of the thermal radiation signal from the surface of a multilayered film sample. The thermal conductivity of any individual layer in the sample can be thereby determined. Chemical vapor deposited SiC film samples (sample 1 to 3: 2.5 to 3.5 μm thickness) with different ratios of Si to C and thermally oxidized SiO{sub 2} film (500 nm thickness) on silicon substrates are studied using the amplitude method. The determined thermal conductivity based on the amplitude method is 3.58, 3.59, and 2.59 W/m⋅K for sample 1more » to 3 with ±10% uncertainty. These results are verified by the phase shift method, and sound agreement is obtained. The measured thermal conductivity (k) of SiC is much lower than the value of bulk SiC. The large k reduction is caused by the structure difference revealed by Raman spectroscopy. For the SiO{sub 2} film, the thermal conductivity is measured to be 1.68 ± 0.17 W/m⋅K, a little higher than that obtained by the phase shift method: 1.31 ± 0.06 W/m⋅K. Sensitivity analysis of thermal conductivity and interfacial resistance is conducted for the amplitude method. Its weak-sensitivity to the thermal contact resistance, enables the amplitude method to determine the thermal conductivity of a film sample with little effect from the interface thermal resistance between the film and substrate. The normalized amplitude ratio at a high frequency to that at a low frequency provides a reliable way to evaluate the effusivity ratio of the film to that of the substrate.« less

Thermal conductivity measurements of impregnated Nb3Sn coil samples in the temperature range of 3.5 K to 100 K

NASA Astrophysics Data System (ADS)

Koettig, T.; Maciocha, W.; Bermudez, S.; Rysti, J.; Tavares, S.; Cacherat, F.; Bremer, J.

2017-02-01

In the framework of the luminosity upgrade of the LHC, high-field magnets are under development. Magnetic flux densities of up to 13 T require the use of Nb3Sn superconducting coils. Quench protection becomes challenging due to the high stored energy density and the low stabilizer fraction. The thermal conductivity and diffusivity of the combination of insulating layers and Nb3Sn based cables are an important thermodynamic input parameter for quench protection systems and superfluid helium cooling studies. A two-stage cryocooler based test stand is used to measure the thermal conductance of the coil sample in two different heat flow directions with respect to the coil package geometry. Variable base temperatures of the experimental platform at the cryocooler allow for a steady-state heat flux method up to 100 K. The heat is applied at wedges style copper interfaces of the Rutherford cables. The respective temperature difference represents the absolute value of thermal conductance of the sample arrangement. We report about the measurement methodology applied to this kind of non-uniform sample composition and the evaluation of the used resin composite materials.

Thermal modulation voltammetry with laser heating at an aqueous|nitrobenzene solution microinterface: determination of the standard entropy changes of transfer for tetraalkylammonium ions.

PubMed

Hinoue, Teruo; Ikeda, Eiji; Watariguchi, Shigeru; Kibune, Yasuyuki

2007-01-01

Thermal modulation voltammetry (TMV) with laser heating was successfully performed at an aqueous|nitrobenzene (NB) solution microinterface, by taking advantage of the fact that laser light with a wavelength of 325.0 nm is optically transparent to the aqueous solution but opaque to the NB solution. When the laser beam impinges upon the interface from the aqueous solution side, a temperature is raised around the interface through the thermal diffusion subsequent to the light-to-heat conversion following the optical absorption by the NB solution near the interface. Based on such a principle, we achieved a fluctuating temperature perturbation around the interface for TMV by periodically irradiating the interface with the laser beam. On the other hand, the fluctuating temperature perturbation has influence on currents for transfer of an ion across the interface to produce fluctuating currents synchronized with the perturbation through temperature coefficients of several variables concerning the transfer, such as the standard transfer potential and the diffusion coefficient of the ion. Consequently, TMV has the possibility of providing information about the standard entropy change of transfer corresponding to a temperature coefficient of the standard transfer potential and a temperature coefficient of the diffusion coefficient. In this work, the aqueous|NB solution interface of 30 microm in diameter was irradiated with the laser beam at 10 Hz, and the currents synchronized with the periodical irradiation were recorded as a function of the potential difference across the interface in order to construct a TM voltammogram. TM voltammograms were measured for transfer of tetramethylammonium, tetraethylammonium, tetrapropylammonium, and tetra-n-butylammonium ions from the aqueous solution to the NB solution, and the standard entropy change of transfer was determined for each ion, according to an analytical procedure based on a mathematical expression of the TM voltammogram. Comparison of the values obtained in this work with the literature values has proved that TMV with laser heating is available for the determination of the standard entropy change of transfer for an ion.

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, Douglas

2016-06-08

This is a technical review of the DOE VTO EDT project EDT063, Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. A procedure for analyzing the reliability of sintered-silver through experimental thermal cycling and crack propagation modeling has been outlined and results have been presented.

Shear bond strength comparison between conventional porcelain fused to metal and new functionally graded dental restorations after thermal-mechanical cycling.

PubMed

Henriques, B; Gonçalves, S; Soares, D; Silva, F S

2012-09-01

The aim of this study was to evaluate the effect of thermo-mechanical cycling on the metal-ceramic bond strength of conventional porcelain fused to metal restorations (PFM) and new functionally graded metal-ceramic dental restorations (FGMR). Two types of specimens were produced: PFM and FGMR specimens. PFM specimens were produced by conventional PFM technique. FGMR specimens were hot pressed and prepared with a metal/ceramic composite interlayer (50 M, vol%) at the metal-ceramic interface. They were manufactured and standardized in cylindrical format and then submitted to thermal (3000, 6000 and 12,000 cycles; between 5 °C and 60 °C; dwell time: 30s) and mechanical (25,000, 50,000 and 100,000 cycles under a load of 50 N; 1.6 Hz) cycling. The shear bond strength tests were performed in a universal testing machine (crosshead speed: 0.5mm/min), using a special device to concentrate the tension at the metal-ceramic interface and the load was applied until fracture. The metal-ceramic interfaces were examined with SEM/EDS prior to and after shear tests. The Young's modulus and hardness were measured across the interfaces of both types of specimens using nanoindentation tests. Data was analyzed with Shapiro-Wilk test to test the assumption of normality. The 2-way ANOVA was used to compare shear bond strength results (p<0.05). FGMR specimens showed significantly (p<0.001) higher shear bond strength results than PFM specimens, irrespective of fatigue conditions. Fatigue conditions significantly (p<0.05) affected the shear bond strength results. The analysis of surface fracture revealed adhesive fracture type for PFM specimens and mixed fracture type for FGMR specimens. Nanoindentation tests showed differences in mechanical properties measured across the metal-ceramic interface for the two types of specimens, namely Young's Modulus and hardness. This study showed significantly better performance of the new functionally graded restorations relative to conventional PFM restorations, under fatigue testing conditions and for the materials tested. Copyright © 2012 Elsevier Ltd. All rights reserved.

Methods of forming thermal management systems and thermal management methods

DOEpatents

Gering, Kevin L.; Haefner, Daryl R.

2012-06-05

A thermal management system for a vehicle includes a heat exchanger having a thermal energy storage material provided therein, a first coolant loop thermally coupled to an electrochemical storage device located within the first coolant loop and to the heat exchanger, and a second coolant loop thermally coupled to the heat exchanger. The first and second coolant loops are configured to carry distinct thermal energy transfer media. The thermal management system also includes an interface configured to facilitate transfer of heat generated by an internal combustion engine to the heat exchanger via the second coolant loop in order to selectively deliver the heat to the electrochemical storage device. Thermal management methods are also provided.

A thermal scale modeling study for Apollo and Apollo applications, volume 2

NASA Technical Reports Server (NTRS)

Shannon, R. L.

1972-01-01

The development and demonstration of practical thermal scale modeling techniques applicable to systems involving radiation, conduction, and convection with emphasis on cabin atmosphere/cabin wall thermal interface are discussed. The Apollo spacecraft environment is used as the model. Four possible scaling techniques were considered: (1) modified material preservation, (2) temperature preservation, (3) scaling compromises, and Nusselt number preservation. A thermal mathematical model was developed for use with the Nusselt number preservation technique.

Effect of Length, Diameter, Chirality, Deformation, and Strain on Contact Thermal Conductance between Single Wall Carbon Nanotubes

NASA Astrophysics Data System (ADS)

Varshney, Vikas; Lee, Jonghoon; Brown, Joshua S.; Farmer, Barry L.; Voevodin, Andrey A.; Roy, Ajit K.

2018-04-01

Thermal energy transfer across physically interacting single-wall carbon nanotube (SWCNT) interconnects has been investigated using non-equilibrium molecular dynamics simulations. The role of various geometrical and structural (length, diameter, chirality) as well as external (deformation and strain) carbon nanotube (CNT) parameters has been explored to estimate total as well as area-normalized thermal conductance across cross-contact interconnects. It is shown that the CNT aspect ratio and degree of lateral as well as tensile deformation play a significant role in determining the extent of thermal energy exchange across CNT contacts, while CNT chirality has a negligible influence on thermal transport. Depending on the CNT diameter, aspect ratio, and degree of deformation at the contact interface, the thermal conductance values can vary significantly –by more than an order of magnitude for total conductance and a factor of 3 to 4 for area-normalized conductance. The observed trends are discussed from the perspective of modulation in number of low frequency out-of-plane (transverse, flexural, and radial) phonons that transmit thermal energy across the contact and govern the conductance across the interface. The established general dependencies for phonon governed thermal transport at CNT contacts are anticipated to help design and performance prediction of CNT-based flexible nanoelectronic devices, where CNT-CNT contact deformation and strain are routinely encountered during device operations.

Thermal structure and geodynamics of subduction zones

NASA Astrophysics Data System (ADS)

Wada, Ikuko

The thermal structure of subduction zones depends on the age-controlled thermal state of the subducting slab and mantle wedge flow. Observations indicate that the shallow part of the forearc mantle wedge is stagnant and the slab-mantle interface is weakened. In this dissertation, the role of the interface strength in controlling mantle wedge flow, thermal structure, and a wide range of subduction zone processes is investigated through two-dimensional finite-element modelling and a global synthesis of geological and geophysical observations. The model reveals that the strong temperature-dependence of the mantle strength always results in full slab-mantle decoupling along the weakened part of the interface and hence complete stagnation of the overlying mantle. The interface immediately downdip of the zone of decoupling is fully coupled, and the overlying mantle is driven to flow at a rate compatible with the subduction rate. The sharpness of the transition from decoupling to coupling depends on the rheology assumed and increases with the nonlinearity of the flow system. This bimodal behaviour of the wedge flow gives rise to a strong thermal contrast between the cold stagnant and hot flowing parts of the mantle wedge. The maximum depth of decoupling (MDD) thus dictates the thermal regime of the forearc. Observed surface heat flow patterns and petrologically and geochemically estimated mantle wedge temperatures beneath the volcanic arc require an MDD of 70--80 km in most, if not all, subduction zones regardless of their thermal regime of the slab. The common MDD of 70--80 km explains the observed systematic variations of the petrologic, seismological, and volcanic processes with the thermal state of the slab and thus explains the rich diversity of subduction zones in a unified fashion. Models for warm-slab subduction zones such as Cascadia and Nankai predict shallow dehydration of the slab beneath the cold stagnant part of the mantle wedge, which provides ample fluid for mantle wedge serpentinization in the forearc but little fluid for melt generation beneath the arc. In contrast, models for colder-slab subduction zones such as NE Japan and Kamchatka predict deeper dehydration, which provides greater fluid supply for melt generation beneath the arc and allows deeper occurrence of intraslab earthquakes but less fluid for forearc mantle wedge serpentinization. The common MDD also explains the intriguing uniform configuration of subduction zones, that is, the volcanic arc always tends to be situated where the slab is at about 100 km depth. The sudden onset of mantle wedge flow downdip of the common MDD overshadows the thermal effect of the slab, and the resultant thermal field and slab dehydration control the location of the volcanic arc. The recognition of the fundamental importance of the MDD has important implications to the study of geodynamics and earthquake hazard in subduction zones.

Mountain-Scale Coupled Processes (TH/THC/THM)

DOE Office of Scientific and Technical Information (OSTI.GOV)

P. Dixon

The purpose of this Model Report is to document the development of the Mountain-Scale Thermal-Hydrological (TH), Thermal-Hydrological-Chemical (THC), and Thermal-Hydrological-Mechanical (THM) Models and evaluate the effects of coupled TH/THC/THM processes on mountain-scale UZ flow at Yucca Mountain, Nevada. This Model Report was planned in ''Technical Work Plan (TWP) for: Performance Assessment Unsaturated Zone'' (BSC 2002 [160819], Section 1.12.7), and was developed in accordance with AP-SIII.10Q, Models. In this Model Report, any reference to ''repository'' means the nuclear waste repository at Yucca Mountain, and any reference to ''drifts'' means the emplacement drifts at the repository horizon. This Model Report provides themore » necessary framework to test conceptual hypotheses for analyzing mountain-scale hydrological/chemical/mechanical changes and predict flow behavior in response to heat release by radioactive decay from the nuclear waste repository at the Yucca Mountain site. The mountain-scale coupled TH/THC/THM processes models numerically simulate the impact of nuclear waste heat release on the natural hydrogeological system, including a representation of heat-driven processes occurring in the far field. The TH simulations provide predictions for thermally affected liquid saturation, gas- and liquid-phase fluxes, and water and rock temperature (together called the flow fields). The main focus of the TH Model is to predict the changes in water flux driven by evaporation/condensation processes, and drainage between drifts. The TH Model captures mountain-scale three dimensional (3-D) flow effects, including lateral diversion at the PTn/TSw interface and mountain-scale flow patterns. The Mountain-Scale THC Model evaluates TH effects on water and gas chemistry, mineral dissolution/precipitation, and the resulting impact to UZ hydrological properties, flow and transport. The THM Model addresses changes in permeability due to mechanical and thermal disturbances in stratigraphic units above and below the repository host rock. The Mountain-Scale THM Model focuses on evaluating the changes in 3-D UZ flow fields arising out of thermal stress and rock deformation during and after the thermal periods.« less

Graphene nanocomposites as thermal interface materials for cooling energy devices

NASA Astrophysics Data System (ADS)

Dmitriev, A. S.; Valeev, A. R.

2017-11-01

The paper describes the technology of creating samples of graphene nanocomposites based on graphene flakes obtained by splitting graphite with ultrasound of high power. Graphene nanocomposites in the form of samples are made by the technology of weak sintering at high pressure (200-300 bar) and temperature up to 150 0 C, and also in the form of compositions with polymer matrices. The reflection spectra in the visible range and the near infrared range for the surface of nanocomposite samples are studied, the data of optical and electronic spectroscopy of such samples are givenIn addition, data on the electrophysical and thermal properties of the nanocomposites obtained are presented. Some analytical models of wetting and spreading over graphene nanocomposite surfaces have been constructed and calculated, and their effective thermal conductivity has been calculated and compared with the available experimental data. Possible applications of graphene nanocomposites for use as thermal interface materials for heat removal and cooling for power equipment, as well as microelectronics and optoelectronics devices are described.

Atmosphere, Magnetosphere and Plasmas in Space (AMPS). Spacelab payload definition study. Volume 3, book 2: AMPS equipment to Spacelab ICD

NASA Technical Reports Server (NTRS)

1976-01-01

The interfaces between AMPS Payload No.(TBD) and Spacelab are described. The interfaces specified cover the AMPS physical, electrical, and thermal interfaces that are established to prescribe the standard Spacelab configuration required to perform the mission. If the configuration definition changes due to change of Spacelab equipment model, or serial numbers, then reidentification of the Labcraft payload may be required.

Detection of thermally grown oxides in thermal barrier coatings by nondestructive evaluation

NASA Astrophysics Data System (ADS)

Fahr, A.; Rogé, B.; Thornton, J.

2006-03-01

The thermal-barrier coatings (TBC) sprayed on hot-section components of aircraft turbine engines commonly consist of a partially stabilized zirconia top-coat and an intermediate bond-coat applied on the metallic substrate. The bond-coat is made of an aluminide alloy that at high engine temperatures forms thermally grown oxides (TGO). Although formation of a thin layer of aluminum oxide at the interface between the ceramic top-coat and the bond-coat has the beneficial effect of protecting the metallic substrate from hot gases, oxide formation at splat boundaries or pores within the bond-coat is a source of weakness. In this study, plasma-sprayed TBC specimens are manufactured from two types of bond-coat powders and exposed to elevated temperatures to form oxides at the ceramic-bond-coat boundary and within the bond-coat. The specimens are then tested using nondestructive evaluation (NDE) and destructive metallography and compared with the as-manufactured samples. The objective is to determine if NDE can identify the oxidation within the bond-coat and give indication of its severity. While ultrasonic testing can provide some indication of the degree of bond-coat oxidation, the eddy current (EC) technique clearly identifies severe oxide formation within the bond-coat. Imaging of the EC signals as the function of probe location provides information on the spatial variations in the degree of oxidation, and thereby identifies which components or areas are prone to premature damage.

Effective thermal and mechanical properties of polycrystalline diamond films

NASA Astrophysics Data System (ADS)

Cheng, Hao-Yu; Yang, Chi-Yuan; Yang, Li-Chueh; Peng, Kun-Cheng; Chia, Chih-Ta; Liu, Shiu-Jen; Lin, I.-Nan; Lin, Kung-Hsuan

2018-04-01

Polycrystalline diamond films were demonstrated as good candidates for electron field emitters, and their mechanical/thermal properties should thus be considered for real devices. We utilized ultrafast optical techniques to investigate the phonon dynamics of several polycrystalline diamond films, prepared by microwave plasma enhanced chemical vapor deposition. The mechanical properties (longitudinal acoustic velocity) and thermal conductivities of diamond films were evaluated from the coherent and incoherent phonon dynamics, respectively. Ultrananocrystalline diamond films were grown using a CH4 (2%)/Ar plasma, while microcrystalline diamond films were grown using a CH4 (2%)/H2 plasma. The ultrananocrystalline diamond film (with a grain size of several nanometers) possesses low acoustic velocity (14.5 nm/ps) and low thermal conductivity (3.17 W/m K) compared with other kinds of diamond films. The acoustic velocity of diamond films increased abruptly to nearly the same as that of natural diamond and remained there when the rod-shaped diamond grains were induced due to the incorporation of H2 in the growth plasma (CH4/Ar). The thermal conductivities of the materials increased monotonously with increasing incorporation of H2 in the growth plasma (CH4/Ar). The thermal conductivity of 25.6 W/m K was attained for nanocrystalline diamond films containing spherical diamond grains (with a size of several tens of nanometers). Compared with single crystalline diamond, the low thermal conductivity of polycrystalline films results from phonon scattering at the interfaces of grains and amorphous carbon in the boundary phases.

Room-temperature voltage tunable phonon thermal conductivity via reconfigurable interfaces in ferroelectric thin films.

PubMed

Ihlefeld, Jon F; Foley, Brian M; Scrymgeour, David A; Michael, Joseph R; McKenzie, Bonnie B; Medlin, Douglas L; Wallace, Margeaux; Trolier-McKinstry, Susan; Hopkins, Patrick E

2015-03-11

Dynamic control of thermal transport in solid-state systems is a transformative capability with the promise to propel technologies including phononic logic, thermal management, and energy harvesting. A solid-state solution to rapidly manipulate phonons has escaped the scientific community. We demonstrate active and reversible tuning of thermal conductivity by manipulating the nanoscale ferroelastic domain structure of a Pb(Zr0.3Ti0.7)O3 film with applied electric fields. With subsecond response times, the room-temperature thermal conductivity was modulated by 11%.

Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications

NASA Astrophysics Data System (ADS)

Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook

2009-01-01

A thick Cu column based double-bump flip chip structure is one of the promising alternatives for fine pitch flip chip applications. In this study, the thermal cycling (T/C) reliability of Cu/SnAg double-bump flip chip assemblies was investigated, and the failure mechanism was analyzed through the correlation of T/C test and the finite element analysis (FEA) results. After 1000 thermal cycles, T/C failures occurred at some Cu/SnAg bumps located at the edge and corner of chips. Scanning acoustic microscope analysis and scanning electron microscope observations indicated that the failure site was the Cu column/Si chip interface. It was identified by a FEA where the maximum stress concentration was located during T/C. During T/C, the Al pad between the Si chip and a Cu column bump was displaced due to thermomechanical stress. Based on the low cycle fatigue model, the accumulation of equivalent plastic strain resulted in thermal fatigue deformation of the Cu column bumps and ultimately reduced the thermal cycling lifetime. The maximum equivalent plastic strains of some bumps at the chip edge increased with an increased number of thermal cycles. However, equivalent plastic strains of the inner bumps did not increase regardless of the number of thermal cycles. In addition, the z-directional normal plastic strain ɛ22 was determined to be compressive and was a dominant component causing the plastic deformation of Cu/SnAg double bumps. As the number of thermal cycles increased, normal plastic strains in the perpendicular direction to the Si chip and shear strains were accumulated on the Cu column bumps at the chip edge at low temperature region. Thus it was found that the Al pad at the Si chip/Cu column interface underwent thermal fatigue deformation by compressive normal strain and the contact loss by displacement failure of the Al pad, the main T/C failure mode of the Cu/SnAg flip chip assembly, then occurred at the Si chip/Cu column interface shear strain deformation during T/C.

Heat Transfer Behavior across the Dentino-Enamel Junction in the Human Tooth

PubMed Central

Niu, Lin; Dong, Shao-Jie; Kong, Ting-Ting; Wang, Rong; Zou, Rui; Liu, Qi-Da

2016-01-01

During eating, the teeth usually endure the sharply temperature changes because of different foods. It is of importance to investigate the heat transfer and heat dissipation behavior of the dentino–enamel junction (DEJ) of human tooth since dentine and enamel have different thermophysical properties. The spatial and temporal temperature distributions on the enamel, dentine, and pulpal chamber of both the human tooth and its discontinuous boundaries, were measured using infrared thermography using a stepped temperature increase on the outer boundary of enamel crowns. The thermal diffusivities for enamel and dentine were deduced from the time dependent temperature change at the enamel and dentine layers. The thermal conductivities for enamel and dentine were calculated to be 0.81 Wm-1K-1 and 0.48 Wm-1K-1 respectively. The observed temperature discontinuities across the interfaces between enamel, dentine and pulp-chamber layers were due to the difference of thermal conductivities at interfaces rather than to the phase transformation. The temperature gradient distributes continuously across the enamel and dentine layers and their junction below a temperature of 42°C, whilst a negative thermal resistance is observed at interfaces above 42°C. These results suggest that the microstructure of the dentin-enamel junction (DEJ) junction play an important role in tooth heat transfer and protects the pulp from heat damage. PMID:27662186

Heat Transfer Behavior across the Dentino-Enamel Junction in the Human Tooth.

PubMed

Niu, Lin; Dong, Shao-Jie; Kong, Ting-Ting; Wang, Rong; Zou, Rui; Liu, Qi-Da

During eating, the teeth usually endure the sharply temperature changes because of different foods. It is of importance to investigate the heat transfer and heat dissipation behavior of the dentino-enamel junction (DEJ) of human tooth since dentine and enamel have different thermophysical properties. The spatial and temporal temperature distributions on the enamel, dentine, and pulpal chamber of both the human tooth and its discontinuous boundaries, were measured using infrared thermography using a stepped temperature increase on the outer boundary of enamel crowns. The thermal diffusivities for enamel and dentine were deduced from the time dependent temperature change at the enamel and dentine layers. The thermal conductivities for enamel and dentine were calculated to be 0.81 Wm-1K-1 and 0.48 Wm-1K-1 respectively. The observed temperature discontinuities across the interfaces between enamel, dentine and pulp-chamber layers were due to the difference of thermal conductivities at interfaces rather than to the phase transformation. The temperature gradient distributes continuously across the enamel and dentine layers and their junction below a temperature of 42°C, whilst a negative thermal resistance is observed at interfaces above 42°C. These results suggest that the microstructure of the dentin-enamel junction (DEJ) junction play an important role in tooth heat transfer and protects the pulp from heat damage.

Role of interfacial thermal barrier in the transverse thermal conductivity of uniaxial SiC fiber-reinforced reaction bonded silicon nitride

NASA Technical Reports Server (NTRS)

Bhatt, H.; Donaldson, K. Y.; Hasselman, D. P. H.; Bhatt, R. T.

1992-01-01

The transverse thermal conductivity of reaction-bonded Si3N4 is significantly affected by an interfacial barrier at the interface formed with SiC reinforcing fibers. A comparative study of composites with and without reinforcing-fiber carbon coatings found the coating to reduce effective thermal conductivity by a factor of about 2; this, however, is partially due to a thermal expansion-mismatch gap between fiber and matrix. HIPing of composites with coated fibers led to an enhancement of thermal conductivity via improved interfacial thermal contact and greater grain size and crystallinity of the fibers.

Heat transfer analysis of the Bridgman-Stockbarger configuration for crystal growth. Part 1: Analytical treatment of the axial temperature distribution

NASA Technical Reports Server (NTRS)

Jasinski, T. J.; Rohsenow, W. M.; Witt, A. F.

1982-01-01

All first order effects on the axial temperature distribution in a solidifying charge in a Bridgman-Stockbarger configuration for crystal growth are analyzed on the basis of a one dimensional model whose validity can be verified through comparison with published finite difference ana;uses of two dimensional models. The model presented includes an insulated region between axially aligned heat pipes and considers the effects of charge diameter, charge motion, thickness, and thermal conductivity of a confining crucible, thermal conductivity change at the crystal-melt interface, generation of latent heat at the interface, and finite charge length. Results are primarily given in analytical form and can be used without recourse to computer work for both improve furnace design and optimization of growth conditions in a given thermal configuration.

Crack prediction in EB-PVD thermal barrier coatings based on the simulation of residual stresses

NASA Astrophysics Data System (ADS)

Chen, J. W.; Zhao, Y.; Liu, S.; Zhang, Z. Z.; Ma, J.

2016-07-01

Thermal barrier coatings systems (TBCs) are widely used in the field of aerospace. The durability and insulating ability of TBCs are highly dependent on the residual stresses of top coatings, thus the investigation of the residual stresses is helpful to understand the failure mechanisms of TBCs. The simulation of residual stresses evolution in electron beam physical vapor deposition (EB-PVD) TBCs is described in this work. The interface morphology of TBCs subjected to cyclic heating and cooling is observed using scanning electron microscope (SEM). An interface model of TBCs is established based on thermal elastic-plastic finite method. Residual stress distributions in TBCs are obtained to reflect the influence of interfacial roughness. Both experimental and simulation results show that it is feasible to predict the crack location by stress analysis, which is crucial to failure prediction.

Analyzing the thermionic reactor critical experiments. [thermal spectrum of uranium 235 core

NASA Technical Reports Server (NTRS)

Niederauer, G. F.

1973-01-01

The Thermionic Reactor Critical Experiments (TRCE) consisted of fast spectrum highly enriched U-235 cores reflected by different thicknesses of beryllium or beryllium oxide with a transition zone of stainless steel between the core and reflector. The mixed fast-thermal spectrum at the core reflector interface region poses a difficult neutron transport calculation. Calculations of TRCE using ENDF/B fast spectrum data and GATHER library thermal spectrum data agreed within about 1 percent for the multiplication factor and within 6 to 8 percent for the power peaks. Use of GAM library fast spectrum data yielded larger deviations. The results were obtained from DOT R Theta calculations with leakage cross sections, by region and by group, extracted from DOT RZ calculations. Delineation of the power peaks required extraordinarily fine mesh size at the core reflector interface.

New nanocomposite surfaces and thermal interface materials based on mesoscopic microspheres, polymers and graphene flakes

NASA Astrophysics Data System (ADS)

Dmitriev, Alex A.; Dmitriev, Alex S.; Makarov, Petr; Mikhailova, Inna

2018-04-01

In recent years, there has been a great interest in the development and creation of new functional energy mate-rials, including for improving the energy efficiency of power equipment and for effectively removing heat from energy devices, microelectronics and optoelectronics (power micro electronics, supercapacitors, cooling of processors, servers and data centers). In this paper, the technology of obtaining new nanocomposites based on mesoscopic microspheres, polymers and graphene flakes is considered. The methods of sequential production of functional materials from graphene flakes of different volumetric concentration using epoxy polymers, as well as the addition of monodisperse microspheres are described. Data are given on the measurement of the contact angle and thermal conductivity of these nanocomposites with respect to the creation of thermal interface materials for cooling devices of electronics, optoelectronics and power engineering.

Correlation of interface states/border traps and threshold voltage shift on AlGaN/GaN metal-insulator-semiconductor high-electron-mobility transistors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wu, Tian-Li, E-mail: Tian-Li.Wu@imec.be; Groeseneken, Guido; Department of Electrical Engineering, KU Leuven, Leuven

2015-08-31

In this paper, three electrical techniques (frequency dependent conductance analysis, AC transconductance (AC-g{sub m}), and positive gate bias stress) were used to evaluate three different gate dielectrics (Plasma-Enhanced Atomic Layer Deposition Si{sub 3}N{sub 4}, Rapid Thermal Chemical Vapor Deposition Si{sub 3}N{sub 4}, and Atomic Layer Deposition (ALD) Al{sub 2}O{sub 3}) for AlGaN/GaN Metal-Insulator-Semiconductor High-Electron-Mobility Transistors. From these measurements, the interface state density (D{sub it}), the amount of border traps, and the threshold voltage (V{sub TH}) shift during a positive gate bias stress can be obtained. The results show that the V{sub TH} shift during a positive gate bias stress ismore » highly correlated to not only interface states but also border traps in the dielectric. A physical model is proposed describing that electrons can be trapped by both interface states and border traps. Therefore, in order to minimize the V{sub TH} shift during a positive gate bias stress, the gate dielectric needs to have a lower interface state density and less border traps. However, the results also show that the commonly used frequency dependent conductance analysis technique to extract D{sub it} needs to be cautiously used since the resulting value might be influenced by the border traps and, vice versa, i.e., the g{sub m} dispersion commonly attributed to border traps might be influenced by interface states.« less

Techniques for Reducing Thermal Contact Resistance in Steady-State Thermal Conductivity Measurements on Polymer Composites

NASA Astrophysics Data System (ADS)

Stacey, C.; Simpkin, A. J.; Jarrett, R. N.

2016-11-01

The National Physical Laboratory (NPL) has developed a new variation on the established guarded hot plate technique for steady-state measurements of thermal conductivity. This new guarded hot plate has been specifically designed for making measurements on specimens with a thickness that is practical for advanced industrial composite materials and applications. During the development of this new guarded hot plate, NPL carried out an experimental investigation into methods for minimising the thermal contact resistance between the test specimen and the plates of the apparatus. This experimental investigation included tests on different thermal interface materials for use in another NPL facility based on a commercial guarded heat flow meter apparatus conforming to standard ASTM E1530-11. The results show the effect of applying different quantities of the type of heat transfer compound suggested in ASTM E1530-11 (clause 10.7.3) and also the effect on thermal resistance of alternative types of thermal interface products. The optimum quantities of two silicone greases were determined, and a silicone grease filled with copper was found to offer the best combination of repeatability, small hysteresis effect and a low thermal contact resistance. However, two products based on a textured indium foil and pyrolytic graphite sheet were found to offer similar or better reductions in thermal contact resistance, but with quicker, easier application and the advantages of protecting the apparatus plates from damage and being useable with specimen materials that would otherwise absorb silicone grease.

Development of Methodologies for the Estimation of Thermal Properties Associated with Aerospace Vehicles

NASA Technical Reports Server (NTRS)

Scott, Elaine P.

1996-01-01

A thermal stress analysis is an important aspect in the design of aerospace structures and vehicles such as the High Speed Civil Transport (HSCT) at the National Aeronautics and Space Administration Langley Research Center (NASA-LaRC). These structures are complex and are often composed of numerous components fabricated from a variety of different materials. The thermal loads on these structures induce temperature variations within the structure, which in turn result in the development of thermal stresses. Therefore, a thermal stress analysis requires knowledge of the temperature distributions within the structures which consequently necessitates the need for accurate knowledge of the thermal properties, boundary conditions and thermal interface conditions associated with the structural materials. The goal of this proposed multi-year research effort was to develop estimation methodologies for the determination of the thermal properties and interface conditions associated with aerospace vehicles. Specific objectives focused on the development and implementation of optimal experimental design strategies and methodologies for the estimation of thermal properties associated with simple composite and honeycomb structures. The strategy used in this multi-year research effort was to first develop methodologies for relatively simple systems and then systematically modify these methodologies to analyze complex structures. This can be thought of as a building block approach. This strategy was intended to promote maximum usability of the resulting estimation procedure by NASA-LARC researchers through the design of in-house experimentation procedures and through the use of an existing general purpose finite element software.

Thermal stress analysis of ceramic gas-path seal components for aircraft turbines

NASA Technical Reports Server (NTRS)

Kennedy, F. E.; Bill, R. C.

1979-01-01

Stress and temperature distributions were evaluated numerically for a blade-tip seal system proposed for gas turbine applications. The seal consists of an abradable ceramic layer on metallic backing with intermediate layers between the ceramic layer and metal substrate. The most severe stresses in the seal, as far as failure is concerned, are tensile stresses at the top of the ceramic layer and shear and normal stresses at the layer interfaces. All these stresses reach their maximum values during the deceleration phase of a test engine cycle. A parametric study was carried out to evaluate the influence of various design parameters on these critical stress values. The influences of material properties and geometric parameters of the ceramic, intermediate, and backing layers were investigated. After the parametric study was completed, a seal system was designed which incorporated materials with beneficial elastic and thermal properties in each layer of the seal. An analysis of the proposed seal design shows an appreciable decrease in the magnitude of the maximum critical stresses over those obtained with earlier configurations.

G-189A analytical simulation of the integrated waste management-water system using radioisotopes for thermal energy

NASA Technical Reports Server (NTRS)

Coggi, J. V.; Loscutoff, A. V.; Barker, R. S.

1973-01-01

An analytical simulation of the RITE-Integrated Waste Management and Water Recovery System using radioisotopes for thermal energy was prepared for the NASA-Manned Space Flight Center (MSFC). The RITE system is the most advanced concept water-waste management system currently under development and has undergone extended duration testing. It has the capability of disposing of nearly all spacecraft wastes including feces and trash and of recovering water from usual waste water sources: urine, condensate, wash water, etc. All of the process heat normally used in the system is produced from low penalty radioisotope heat sources. The analytical simulation was developed with the G189A computer program. The objective of the simulation was to obtain an analytical simulation which can be used to (1) evaluate the current RITE system steady state and transient performance during normal operating conditions, and also during off normal operating conditions including failure modes; and (2) evaluate the effects of variations in component design parameters and vehicle interface parameters on system performance.

Silicon switching transistor with high power and low saturation voltage

NASA Technical Reports Server (NTRS)

Stonebraker, E.; Stoneburner, D.; Ferree, H.

1973-01-01

Assembly of two individually encapsulated silicon-chip transistors produces silicon power-transistor that has low electrical resistance and low thermal impedance. Electrical resistance and thermal impedance are low because of short lead lengths, and external contact surfaces are plated to reduce resistance at interfaces.

Interface-facilitated energy transport in coupled Frenkel-Kontorova chains

NASA Astrophysics Data System (ADS)

Su, Rui-Xia; Yuan, Zong-Qiang; Wang, Jun; Zheng, Zhi-Gang

2016-04-01

The role of interface couplings on the energy transport of two coupled Frenkel-Kontorova (FK) chains is explored through numerical simulations. In general, it is expected that the interface couplings result in the suppression of heat conduction through the coupled system due to the additional interface phonon-phonon scattering. In the present paper, it is found that the thermal conductivity increases with increasing intensity of interface interactions for weak inter-chain couplings, whereas the heat conduction is suppressed by the interface interaction in the case of strong inter-chain couplings. Based on the phonon spectral energy density method, we demonstrate that the enhancement of energy transport results from the excited phonon modes (in addition to the intrinsic phonon modes), while the strong interface phonon-phonon scattering results in the suppressed energy transport.

Test Method Designed to Evaluate Cylinder Liner-Piston Ring Coatings for Advanced Heat Engines

NASA Technical Reports Server (NTRS)

Radil, Kevin C.

1997-01-01

Research on advanced heat engine concepts, such as the low-heat-rejection engine, have shown the potential for increased thermal efficiency, reduced emissions, lighter weight, simpler design, and longer life in comparison to current diesel engine designs. A major obstacle in the development of a functional advanced heat engine is overcoming the problems caused by the high combustion temperatures at the piston ring/cylinder liner interface, specifically at top ring reversal (TRR). Therefore, advanced cylinder liner and piston ring materials are needed that can survive under these extreme conditions. To address this need, researchers at the NASA Lewis Research Center have designed a tribological test method to help evaluate candidate piston ring and cylinder liner materials for advanced diesel engines.

Turbojet engine blade damping

NASA Technical Reports Server (NTRS)

Srinivasan, A. V.; Cutts, D. G.; Sridhar, S.

1981-01-01

The potentials of various sources of nonaerodynamic damping in engine blading are evaluated through a combination of advanced analysis and testing. The sources studied include material hysteresis, dry friction at shroud and root disk interfaces as well as at platform type external dampers. A limited seris of tests was conducted to evaluate damping capacities of composite materials (B/AL, B/AL/Ti) and thermal barrier coatings. Further, basic experiments were performed on titanium specimens to establish the characteristics of sliding friction and to determine material damping constants J and n. All the tests were conducted on single blades. Mathematical models were develthe several mechanisms of damping. Procedures to apply this data to predict damping levels in an assembly of blades are developed and discussed.

On the collaborative design and simulation of space camera: stop structural/thermal/optical) analysis

NASA Astrophysics Data System (ADS)

Duan, Pengfei; Lei, Wenping

2017-11-01

A number of disciplines (mechanics, structures, thermal, and optics) are needed to design and build Space Camera. Separate design models are normally constructed by each discipline CAD/CAE tools. Design and analysis is conducted largely in parallel subject to requirements that have been levied on each discipline, and technical interaction between the different disciplines is limited and infrequent. As a result a unified view of the Space Camera design across discipline boundaries is not directly possible in the approach above, and generating one would require a large manual, and error-prone process. A collaborative environment that is built on abstract model and performance template allows engineering data and CAD/CAE results to be shared across above discipline boundaries within a common interface, so that it can help to attain speedy multivariate design and directly evaluate optical performance under environment loadings. A small interdisciplinary engineering team from Beijing Institute of Space Mechanics and Electricity has recently conducted a Structural/Thermal/Optical (STOP) analysis of a space camera with this collaborative environment. STOP analysis evaluates the changes in image quality that arise from the structural deformations when the thermal environment of the camera changes throughout its orbit. STOP analyses were conducted for four different test conditions applied during final thermal vacuum (TVAC) testing of the payload on the ground. The STOP Simulation Process begins with importing an integrated CAD model of the camera geometry into the collaborative environment, within which 1. Independent thermal and structural meshes are generated. 2. The thermal mesh and relevant engineering data for material properties and thermal boundary conditions are then used to compute temperature distributions at nodal points in both the thermal and structures mesh through Thermal Desktop, a COTS thermal design and analysis code. 3. Thermally induced structural deformations of the camera are then evaluated in Nastran, an industry standard code for structural design and analysis. 4. Thermal and structural results are next imported into SigFit, another COTS tool that computes deformation and best fit rigid body displacements for the optical surfaces. 5. SigFit creates a modified optical prescription that is imported into CODE V for evaluation of optical performance impacts. The integrated STOP analysis was validated using TVAC test data. For the four different TVAC tests, the relative errors between simulation and test data of measuring points temperatures were almost around 5%, while in some test conditions, they were even much lower to 1%. As to image quality MTF, relative error between simulation and test was 8.3% in the worst condition, others were all below 5%. Through the validation, it has been approved that the collaborative design and simulation environment can achieved the integrated STOP analysis of Space Camera efficiently. And further, the collaborative environment allows an interdisciplinary analysis that formerly might take several months to perform to be completed in two or three weeks, which is very adaptive to scheme demonstration of projects in earlier stages.

Modular, thermal bus-to-radiator integral heat exchanger design for Space Station Freedom

NASA Technical Reports Server (NTRS)

Chambliss, Joe; Ewert, Michael

1990-01-01

The baseline concept is introduced for the 'integral heat exchanger' (IHX) which is the interface of the two-phase thermal bus with the heat-rejecting radiator panels. A direct bus-to-radiator heat-pipe integral connection replaces the present interface hardware to reduce the weight and complexity of the heat-exchange mechanism. The IHX is presented in detail and compared to the baseline system assuming certain values for heat rejection, mass per unit width, condenser capacity, contact conductance, and assembly mass. The spreadsheet comparison can be used to examine a variety of parameters such as radiator length and configuration. The IHX is shown to permit the reduction of panel size and system mass in response to better conductance and packaging efficiency. The IHX is found to be a suitable heat-rejection system for the Space Station Freedom because it uses present technology and eliminates the interface mechanisms.

Study of the kinetics and mechanism of the thermal nitridation of SiO2

NASA Technical Reports Server (NTRS)

Vasquez, R. P.; Madhukar, A.; Grunthaner, F. J.; Naiman, M. L.

1985-01-01

X-ray photoelectron spectroscopy (XPS) has been used to study the nitridation time and temperature dependence of the nitrogen distribution in thermally nitrided SiO2 films. The XPS data show that the maximum nitrogen concentration near the (SiO(x)N(y)/Si interface is initially at the interface, but moves 20-25 A away from the interface with increasing nitridation time. Computer modeling of the kinetic processes involved is carried out and reveals a mechanism in which diffusing species, initially consisting primarily of nitrogen, react with the substrate, followed by formation of the oxygen-rich oxynitride due to reaction of the diffusing oxygen displaced by the slower nitridation of the SiO2. The data are consistent with this mechanism provided the influence of the interfacial strain on the nitridation and oxidation kinetics is explicitly accounted for.

Optical Radiation from Shock-Compressed Materials. Ph.D. Thesis

NASA Technical Reports Server (NTRS)

Svendsen, Robert F., Jr.

1987-01-01

Recent observations of shock-induced radiation from oxides, silicates, and metals of geophysical interest constrain the shock-compressed temperature of these materials. The relationships between the temperature inferred from the observed radiation and the temperature of the shock-compressed film or foil and/or window were investigated. Changes of the temperature field in each target component away from that of their respective shock-compressed states occur because of: shock-impedance mismatch between target components; thermal mismatch between target components; surface roughness at target interfaces; and conduction within and between target components. In particular, conduction may affect the temperature of the film/foil window interface on the time scale of the experiments, and so control the intensity and history of the dominant thermal radiation sources in the target. This type of model was used to interpret the radiation emitted by a variety of shock-compressed materials and interfaces.

First-principles study on the effect of SiO{sub 2} layers during oxidation of 4H-SiC

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ono, Tomoya, E-mail: ono@ccs.tsukuba.ac.jp; JST-PRESTO, Kawaguchi, Saitama 332-0012; Saito, Shoichiro

The effect of SiO{sub 2} layers during the thermal oxidation of a 4H-SiC(0001) substrate is examined by performing the first-principles total-energy calculations. Although it is expected that a CO molecule is the most preferable product during the oxidation, CO{sub 2} molecules are mainly emitted from the SiC surface at the initial stage of the oxidation. As the oxidation proceeds, CO{sub 2} emission becomes less favorable and CO molecules are emitted from the interface. We conclude that the interface stress due to the lattice constant mismatch between 4H-SiC(0001) and SiO{sub 2} is responsible for the removal of C during the oxidation,more » resulting in the characteristic electronic property of the interface fabricated by the thermal oxidation.« less

Geometrical effects on the concentrated behavior of heat flux in metamaterials thermal harvesting devices

NASA Astrophysics Data System (ADS)

Xu, Guoqiang; Zhang, Haochun; Xie, Ming; Jin, Yan

2017-10-01

Thermal harvesting devices based on transformation optics, which can manipulate the heat flux concentration significantly through rational arrangements of the conductivities, have attracted considerable interest owing to several great potential applications of the technique for high-efficiency thermal conversion and collection. However, quantitative studies on the geometrical effects, particularly wedge angles, on the harvesting behaviors are rare. In this paper, we adopt wedge structure-based thermal harvesting schemes, and focus on the effects of the geometrical parameters including the radii ratios and wedge angles on the harvesting performance. The temperature deformations at the boundaries of the compressional region and temperature gradients for the different schemes with varying design parameters are investigated. Moreover, a concept for temperature stabilization was derived to evaluate the fluctuation in the energy distributions. In addition, the effects of interface thermal resistances have been investigated. Considering the changes in the radii ratios and wedge angles, we proposed a modification of the harvesting efficiency to quantitatively assess the concentration performance, which was verified through random tests and previously fabricated devices. In general, this study indicates that a smaller radii ratio contributes to a better harvesting behavior, but causes larger perturbations in the thermal profiles owing to a larger heat loss. We also find that a smaller wedge angle is beneficial to ensuring a higher concentration efficiency with less energy perturbations. These findings can be used to guide the improvement of a thermal concentrator with a high efficiency in reference to its potential applications as novel heat storage, thermal sensors, solar cells, and thermoelectric devices.

Influence of temperature oscillations on the interface velocity during Bridgman crystal growth

NASA Astrophysics Data System (ADS)

Stelian, Carmen; Duffar, Thierry; Santailler, Jean-Louis; Nicoara, Irina

2002-04-01

The objective of this work is the study of the effect of thermal oscillations on the interface velocity in the vertical Bridgman configuration. In order to study this effect, a transient numerical simulation of the heat transfer and melt convection is performed in a simplified geometrical model. The relation between the thermal signal amplitude and the amplitude of the velocity oscillations is investigated. When the oscillation period is varied, an asymptotic evolution of the velocity oscillation amplitude, with a cut-off period, is observed. It is shown that latent heat of solidification has a huge effect on the velocity amplitude, but not on the cut-off frequency.

Effects of compressibility on the temperature jump at the interface of layered, spherical-shell convection

NASA Technical Reports Server (NTRS)

Yen, David A.; Zhang, Shuxia; Langenberger, Sherri E.

1988-01-01

Large temperature jumps at the interface of layered convection are important to the argument used against the likelihood of separate circulations in the upper and lower mantles. This problem was studied within the framework of a compressible, constant viscosity spherical-shell model. Both mechanical and thermal coupling configurations are considered. Although the temperature jumps are reduced by compressibility, their magnitudes remain quite large, in the case of mechanical coupling. For thermal coupling, the temperature jumps become smaller but still are substantial, between 500 to 1000 C. In layered spherical-shell convection, flows in the lower mantle are several times greater than the surface velocities.

Thermally tunable grating using thermo-responsive magnetic fluid

NASA Astrophysics Data System (ADS)

Zaibudeen, A. W.; Philip, John

2017-04-01

We report a thermally tunable grating prepared using poly(N-isopropylacrylamide) and super paramagnetic iron oxide nanoparticles. The array spacing is reversibly tuned by varying the temperature between 5 and 38 °C. Here, the ability of thermo-responsive polymer brushes to alter their conformation at an interface is exploited to control the grating spacing in nanoscale. The underlying mechanism for the temperature dependent conformational changes are studied by measuring the subtle intermolecular forces between the polymer covered interfaces. It is observed that the interparticle forces are repulsive and exponentially decaying with distance. The thermo-responsive grating is simple to use and offers a wide range of applications.

Mixing and transient interface condensation of a liquid hydrogen tank

NASA Technical Reports Server (NTRS)

Lin, C. S.; Hasan, M. M.; Nyland, T. W.

1993-01-01

Experiments were conducted to investigate the effect of axial jet-induced mixing on the pressure reduction of a thermally stratified liquid hydrogen tank. The tank was nearly cylindrical, having a volume of about 0.144 cu m with 0.559 m in diameter and 0.711 m length. A mixer/pump unit, which had a jet nozzle outlet of 0.0221 m in diameter was located 0.178 m from the tank bottom and was installed inside the tank to generate the axial jet mixing and tank fluid circulation. Mixing tests began with the tank pressures at which the thermal stratification results in 4.9-6.2 K liquid subcooling. The mixing time and transient vapor condensation rate at the liquid-vapor interface are determined. Two mixing time correlations, based on the thermal equilibrium and pressure equilibrium, are developed and expressed as functions of system and buoyancy parameters. The limited liquid hydrogen data of the present study shows that the modified steady state condensation rate correlation may be used to predict the transient condensation rate in a mixing process if the instantaneous values of jet sub cooling and turbulence intensity at the interface are employed.

A low thermal impact annealing process for SiO2-embedded Si nanocrystals with optimized interface quality

NASA Astrophysics Data System (ADS)

Hiller, Daniel; Gutsch, Sebastian; Hartel, Andreas M.; Löper, Philipp; Gebel, Thoralf; Zacharias, Margit

2014-04-01

Silicon nanocrystals (Si NCs) for 3rd generation photovoltaics or optoelectronic applications can be produced by several industrially compatible physical or chemical vapor deposition technologies. A major obstacle for the integration into a fabrication process is the typical annealing to form and crystallize these Si quantum dots (QDs) which involves temperatures ≥1100 °C for 1 h. This standard annealing procedure allows for interface qualities that correspond to more than 95% dangling bond defect free Si NCs. We study the possibilities to use rapid thermal annealing (RTA) and flash lamp annealing to crystallize the Si QDs within seconds or milliseconds at high temperatures. The Si NC interface of such samples exhibits huge dangling bond defect densities which makes them inapplicable for photovoltaics or optoelectronics. However, if the RTA high temperature annealing is combined with a medium temperature inert gas post-annealing and a H2 passivation, luminescent Si NC fractions of up to 90% can be achieved with a significantly reduced thermal load. A new figure or merit, the relative dopant diffusion length, is introduced as a measure for the impact of a Si NC annealing procedure on doping profiles of device structures.

Performance and Reliability of Bonded Interfaces for High-Temperature Packaging; NREL (National Renewable Energy Laboratory)

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeVoto, Douglas

2015-06-10

This is a technical review of the DOE VTO EDT project EDT063, Performance and Reliability of Bonded Interfaces for High-Temperature Packaging. A procedure for analyzing the reliability of sintered-silver through experimental thermal cycling and crack propagation modeling has been outlined and results have been presented.

Dynamics explorer: Interface definition study, volume 1

NASA Technical Reports Server (NTRS)

1978-01-01

Work done in response to the work statement wherein a specific deliverable was not identified but where design and analysis tasks were identified is reported. The summary and baseline change list is included along with design notes for the spacecraft system, thermal subsystem, power subsystem, communications subsystem, plasma wave instrument interface definition, and the structure.

Ceramic Technology Project semiannual progress report, October 1992--March 1993

DOE Office of Scientific and Technical Information (OSTI.GOV)

Johnson, D.R.

1993-09-01

This project was developed to meet the ceramic technology requirements of the OTS`s automotive technology programs. Although progress has been made in developing reliable structural ceramics, further work is needed to reduce cost. The work described in this report is organized according to the following work breakdown structure project elements: Materials and processing (monolithics [Si nitride, carbide], ceramic composites, thermal and wear coatings, joining, cost effective ceramic machining), materials design methodology (contact interfaces, new concepts), data base and life prediction (structural qualification, time-dependent behavior, environmental effects, fracture mechanics, nondestructive evaluation development), and technology transfer.

The response of Galileo aft cover components to laser radiation

NASA Technical Reports Server (NTRS)

Metzger, J. W.

1982-01-01

The aft region of the Galileo probe will be subjected to severe heat transfer rates dominated by the radiation contributions. To assess the response of several vehicle aft region components to thermal radiation, tests employing a 10 KW CO2 laser were conducted. The experiments evaluated the annulus/aft cover interface, the umbilical feedthrough assembly and the mortar cover seal assembly. Experimental evidence of the response of the phenolic nylon heatshield and quantitative measures of its effect on gap geometries of several vehicle components were acquired. In addition, qualitative measures of the survivability of the irradiated components were obtained.

A Fundamental Study of the Bonding of Thermal Barrier Coatings.

DTIC Science & Technology

1986-06-01

information, as there is a ubiquitous glassy phase which can, at times, obscure the interface bound- ary. Computer simulation is being used to interpret...interpret the interface structure and determine whether or not an amorphous phase is actually present. It is tempting, however, to stggest that the...discussed, we have been unable so far to specify the ZrO2 orientation that leads to this low-energy interface . It is common in HREM to determine the crystal

Method and apparatus for operating an improved thermocline storage unit

DOEpatents

Copeland, R.J.

1982-09-30

A method and apparatus for operating a thermocline storage unit in which an insulated barrier member is provided substantially at the interface region between the hot and cold liquids in the storage tank. The barrier member physically and thermally separates the hot and cold liquids substantially preventing any diffusing or mixing between them and substantially preventing any heat transfer there between. The barrier member follows the rise and fall of the interface region between the liquids as the tank is charged and discharged. Two methods of maintaining it in the interface region are disclosed. With the structure and operation of the present invention and in particular the significant reduction in diffusing or mixing between the hot and cold liquids as well as the significant reduction in the thermal heat transfer between them, the performance of the storage tank is improved. More specifically, the stability of the interface region or thermocline is enhanced and the thickness of the thermocline is reduced producing a corresponding increase in the steepness of the temperature gradient across the thermocline and a more efficiently operating thermocline storage unit.

Time-dependent deformation of titanium metal matrix composites

NASA Technical Reports Server (NTRS)

Bigelow, C. A.; Bahei-El-din, Y. A.; Mirdamadi, M.

1995-01-01

A three-dimensional finite element program called VISCOPAC was developed and used to conduct a micromechanics analysis of titanium metal matrix composites. The VISCOPAC program uses a modified Eisenberg-Yen thermo-viscoplastic constitutive model to predict matrix behavior under thermomechanical fatigue loading. The analysis incorporated temperature-dependent elastic properties in the fiber and temperature-dependent viscoplastic properties in the matrix. The material model was described and the necessary material constants were determined experimentally. Fiber-matrix interfacial behavior was analyzed using a discrete fiber-matrix model. The thermal residual stresses due to the fabrication cycle were predicted with a failed interface, The failed interface resulted in lower thermal residual stresses in the matrix and fiber. Stresses due to a uniform transverse load were calculated at two temperatures, room temperature and an elevated temperature of 650 C. At both temperatures, a large stress concentration was calculated when the interface had failed. The results indicate the importance of accuracy accounting for fiber-matrix interface failure and the need for a micromechanics-based analytical technique to understand and predict the behavior of titanium metal matrix composites.

Method and apparatus for operating an improved thermocline storage unit

DOEpatents

Copeland, Robert J.

1985-01-01

A method and apparatus for operating a thermocline storage unit in which an insulated barrier member is provided substantially at the interface region between the hot and cold liquids in the storage tank. The barrier member physically and thermally separates the hot and cold liquids substantially preventing any diffusing or mixing between them and substantially preventing any heat transfer therebetween. The barrier member follows the rise and fall of the interface region between the liquids as the tank is charged and discharged. Two methods of maintaining it in the interface region are disclosed. With the structure and operation of the present invention and in particular the significant reduction in diffusing or mixing between the hot and cold liquids as well as the significant reduction in the thermal heat transfer between them, the performance of the storage tank is improved. More specifically, the stability of the interface region or thermocline is enhanced and the thickness of the thermocline is reduced producing a corresponding increase in the steepness of the temperature gradient across the thermocline and a more efficiently operating thermocline storage unit.

Interface interactions in benzophenone doped by multiwalled carbon nanotubes

NASA Astrophysics Data System (ADS)

Lebovka, N. I.; Goncharuk, A.; Melnyk, V. I.; Puchkovska, G. A.

2009-08-01

The interface interactions were studied by methods of conductometry, low-temperature phosphorescence and differential scanning calorimetry (DSC) in multiwalled carbon nanotubes (MWCNT) and benzophenone (BP) composite. The concentration of MWCNTs was varied within 0-1 wt%. A percolative threshold was found at MWCNT concentrations exceeding 0.1 wt%. The integration of MWCNTs caused melting temperature increase (≈3 K for 1 wt% of MWCNTs). The effect of positive thermal resistively coefficient, as well as substantial hysteretic behaviour of electrical conductivity σ in a heating-cooling cycle, was observed near the melting point of BP ( T m=321.5 K). The activation-type temperature behaviour of electrical conductivity was observed in the temperature range of supercooled BP. The activation energy was decreasing with increase of MWCNT concentration. The observed nonlinear dependencies of electrical conductivity σ vs. applied voltage U reflect the transport mechanism of the charge carriers through amorphous interface films formed near the surface of the MWCNTs. The thermal shifts of phosphorescence spectra measured within the temperature range 5-200 K evidence existence of such interface films of amorphous BP with width of the order of 0.1 μm.

Features of electronic and lattice mechanisms of transboundary heat transfer in multilayer nanolaminate TiAlN/Ag coatings.

PubMed

Kovalev, A I; Wainstein, D L; Vakhrushev, V O; Gago, R; Soldera, F; Endrino, J L; Fox-Rabinovich, G S; Veldhuis, S

2017-12-06

Plasmon resonance heterogeneities were identified and studied along Ag and TiAlN layers within a multilayer stack in nanolaminate TiAlN/Ag coatings. For this purpose, a high-resolution plasmon microscopy was used. The plasmons intensity, energy, and depth of interface plasmon-polariton penetration were studied by scanning reflected electron energy loss spectroscopy. The heat conductivity of such metal-insulator-metal (MIM) nanolaminate coatings was measured by laser reflectometry. Dependencies of thermal conductivity coefficient of coatings, MIM interfaces, and resistivity of Ag layers as a function of the Ag-TiAlN bilayer thickness were calculated on the basis of experimental data. The contribution of plasmon resonance confinement to the abnormal lower thermal conductivity in the MIM metamaterial with Ag layer thickness below 25 nm is discussed. In particular, the results highlight the relevant role of different heat transfer mechanisms between MI and IM interfaces: asymmetry of plasmon-polariton interactions on upper and lower boundaries of Ag layer and asymmetry of LA and TA phonons propagation through interfaces.

Positron annihilation studies of the AlOx/SiO2/Si interface in solar cell structures

NASA Astrophysics Data System (ADS)

Edwardson, C. J.; Coleman, P. G.; Li, T.-T. A.; Cuevas, A.; Ruffell, S.

2012-03-01

Film and film/substrate interface characteristics of 30 and 60 nm-thick AlOx films grown on Si substrates by thermal atomic layer deposition (ALD), and 30 nm-thick AlOx films by sputtering, have been probed using variable-energy positron annihilation spectroscopy (VEPAS) and Doppler-broadened spectra ratio curves. All samples were found to have an interface which traps positrons, with annealing increasing this trapping response, regardless of growth method. Thermal ALD creates an AlOx/SiOx/Si interface with positron trapping and annihilation occurring in the Si side of the SiOx/Si boundary. An induced positive charge in the Si next to the interface reduces diffusion into the oxides and increases annihilation in the Si. In this region there is a divacancy-type response (20 ± 2%) before annealing which is increased to 47 ± 2% after annealing. Sputtering seems to not produce samples with this same electrostatic shielding; instead, positron trapping occurs directly in the SiOx interface in the as-deposited sample, and the positron response to it increases after annealing as an SiO2 layer is formed. Annealing the film has the effect of lowering the film oxygen response in all film types. Compared to other structural characterization techniques, VEPAS shows larger sensitivity to differences in film preparation method and between as-deposited and annealed samples.

High-heat-load monochromator options for the RIXS beamline at the APS with the MBA lattice

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liu, Zunping, E-mail: zpliu@anl.gov; Gog, Thomas, E-mail: gog@aps.anl.gov; Stoupin, Stanislav A.

2016-07-27

With the MBA lattice for APS-Upgrade, tuning curves of 2.6 cm period undulators meet the source requirements for the RIXS beamline. The high-heat-load monochromator (HHLM) is the first optical white beam component. There are four options for the HHLM such as diamond monochromators with refrigerant of either water or liquid nitrogen (LN{sub 2}), and silicon monochromators of either direct or indirect cooling system. Their performances are evaluated at energy 11.215 keV (Ir L-III edge). The cryo-cooled diamond monochromator has similar performance as the water-cooled diamond monochromator because GaIn of the Cu-GaIn-diamond interface becomes solid. The cryo-cooled silicon monochromators perform better,more » not only in terms of surface slope error due to thermal deformation, but also in terms of thermal capacity.« less

Development of Detonation Flame Sprayed Cu-Base Coatings Containing Large Ceramic Particles

NASA Astrophysics Data System (ADS)

Tillmann, Wolfgang; Vogli, Evelina; Nebel, Jan

2007-12-01

Metal-matrix composites (MMCs) containing large ceramic particles as superabrasives are typically used for grinding stone, minerals, and concrete. Sintering and brazing are the key manufacturing technologies for grinding tool production. However, restricted geometry flexibility and the absence of repair possibilities for damaged tool surfaces, as well as difficulties of controlling material interfaces, are the main weaknesses of these production processes. Thermal spraying offers the possibility to avoid these restrictions. The research for this paper investigated a fabrication method based on the use of detonation flame spraying technology to bond large superabrasive particles (150-600 μm, needed for grinding minerals and stones) in a metallic matrix. Layer morphology and bonding quality are evaluated with respect to superabrasive material, geometry, spraying, and powder-injection parameters. The influence of process temperature and the possibilities of thermal treatment of MMC layers are analyzed.

NASA Systems Autonomy Demonstration Project - Development of Space Station automation technology

NASA Technical Reports Server (NTRS)

Bull, John S.; Brown, Richard; Friedland, Peter; Wong, Carla M.; Bates, William

1987-01-01

A 1984 Congressional expansion of the 1958 National Aeronautics and Space Act mandated that NASA conduct programs, as part of the Space Station program, which will yield the U.S. material benefits, particularly in the areas of advanced automation and robotics systems. Demonstration programs are scheduled for automated systems such as the thermal control, expert system coordination of Station subsystems, and automation of multiple subsystems. The programs focus the R&D efforts and provide a gateway for transfer of technology to industry. The NASA Office of Aeronautics and Space Technology is responsible for directing, funding and evaluating the Systems Autonomy Demonstration Project, which will include simulated interactions between novice personnel and astronauts and several automated, expert subsystems to explore the effectiveness of the man-machine interface being developed. Features and progress on the TEXSYS prototype thermal control system expert system are outlined.

Thermal properties and chemical reactivity. Quarterly report, October 1971--December 1971

DOE Office of Scientific and Technical Information (OSTI.GOV)

Myers, L.C.

1998-12-31

A very high boiling impurity was concentrated from a sample of FEFO with a hexane wash. Additional washing of this sample has increased the concentration of this impurity. A mass spectrum was obtained but an identification has not been made. The results of the analysis of the products from the thermal decomposition of FEFO at 120, 135, 150 C are discussed. A chromatogram of FEFO heated for 22 hours at 150 C shows a definite increase in low and high boiling impurities. The evaluation of the condition of the two coupon test assemblies aged at 80 C for 21 andmore » 27 months are discussed. Thermal analysis of the LX-09 from these two coupon tests, a PASS A mechanical test specimen and a control sample are reported. A PDP-12/30 was interfaced with a Perkin Elmer DSC-1 to measure the heat of fusion of PETN. Some of the problems associated with getting reproducible data are discussed. The heat of fusion for six lots of LX-13 grade PETN are given.« less

Thermal energy management process experiment

NASA Technical Reports Server (NTRS)

Ollendorf, S.

1984-01-01

The thermal energy management processes experiment (TEMP) will demonstrate that through the use of two-phase flow technology, thermal systems can be significantly enhanced by increasing heat transport capabilities at reduced power consumption while operating within narrow temperature limits. It has been noted that such phenomena as excess fluid puddling, priming, stratification, and surface tension effects all tend to mask the performance of two-phase flow systems in a 1-g field. The flight experiment approach would be to attack the experiment to an appropriate mounting surface with a 15 to 20 meter effective length and provide a heat input and output station in the form of heaters and a radiator. Using environmental data, the size, location, and orientation of the experiment can be optimized. The approach would be to provide a self-contained panel and mount it to the STEP through a frame. A small electronics package would be developed to interface with the STEP avionics for command and data handling. During the flight, heaters on the evaporator will be exercised to determine performance. Flight data will be evaluated against the ground tests to determine any anomalous behavior.

Thermal barrier coating life prediction model development, phase 1

NASA Technical Reports Server (NTRS)

Demasi, Jeanine T.; Ortiz, Milton

1989-01-01

The objective of this program was to establish a methodology to predict thermal barrier coating (TBC) life on gas turbine engine components. The approach involved experimental life measurement coupled with analytical modeling of relevant degradation modes. Evaluation of experimental and flight service components indicate the predominant failure mode to be thermomechanical spallation of the ceramic coating layer resulting from propagation of a dominant near interface crack. Examination of fractionally exposed specimens indicated that dominant crack formation results from progressive structural damage in the form of subcritical microcrack link-up. Tests conducted to isolate important life drivers have shown MCrAlY oxidation to significantly affect the rate of damage accumulation. Mechanical property testing has shown the plasma deposited ceramic to exhibit a non-linear stress-strain response, creep and fatigue. The fatigue based life prediction model developed accounts for the unusual ceramic behavior and also incorporates an experimentally determined oxide rate model. The model predicts the growth of this oxide scale to influence the intensity of the mechanic driving force, resulting from cyclic strains and stresses caused by thermally induced and externally imposed mechanical loads.

Residual Stresses in Thermal Barrier Coatings for a Cu-8Cr-4Nb Substrate System

NASA Technical Reports Server (NTRS)

Ghosn, Louis J.; Raj, Sai V.

2002-01-01

Analytical calculations were conducted to determine the thermal stresses developed in a coated copper-based alloy, Cu-8%(at.%)Cr-4%Nb (designated as GRCop-84), after plasma spraying and during heat-up in a simulated rocket engine environment. Finite element analyses were conducted for two coating systems consisting of a metallic top coat, a pure copper bond coat and the GRCop-84. The through thickness temperature variations were determined as a function of coating thickness for two metallic coatings, a Ni-17%(wt%)Cr-6%Al-0.5%Y alloy and a Ni-50%(at.%)Al alloy. The residual stresses after low-pressure plasma spraying of the NiCrAlY and NiAl coatings on GRCop-84 substrate were also evaluated. These analyses took into consideration a 50.8 mm copper bond coat and the effects of an interface coating roughness. The through the thickness thermal stresses developed in coated liners were also calculated after 15 minutes of exposure in a rocket environment with and without an interfacial roughness.

Characterization of an ultra-stable optical cavity developed in the industry for space applications

NASA Astrophysics Data System (ADS)

Argence, Berengere; Bize, S.; Lemonde, P.; Santarelli, G.; Prevost, E.; Le Goff, R.; Lévèque, T.

2017-11-01

We report the main characteristics and performances of the first - to our knowledge - prototype of an ultra-stable cavity designed and produced by industry with the aim of space missions. The cavity is a 100 mm long cylinder rigidly held at its midplane by an engineered mechanical interface providing an efficient decoupling from thermal and vibration perturbations. The spacer is made from Ultra-Low Expansion (ULE) glass and mirrors substrate from fused silica to reduce the thermal noise limit to 4x10-16. Finite element modeling was performed in order to minimize thermal and vibration sensitivities while getting a high fundamental resonance frequency. The system was designed to be transportable, acceleration tolerant (up to several g) and temperature range compliant [-33°C +73°C]. The axial vibration sensitivity was evaluated at 4x10-11 /(ms-2), while the transverse one is < 1x10-11 /(ms-2). The fractional frequency instability is < 1x10-15 from 0.1 to few seconds and reaches 5-6x10-16 at 1s.

First principles calculation of thermo-mechanical properties of thoria using Quantum ESPRESSO

NASA Astrophysics Data System (ADS)

Malakkal, Linu; Szpunar, Barbara; Zuniga, Juan Carlos; Siripurapu, Ravi Kiran; Szpunar, Jerzy A.

2016-05-01

In this work, we have used Quantum ESPRESSO (QE), an open source first principles code, based on density-functional theory, plane waves, and pseudopotentials, along with quasi-harmonic approximation (QHA) to calculate the thermo-mechanical properties of thorium dioxide (ThO2). Using Python programming language, our group developed qe-nipy-advanced, an interface to QE, which can evaluate the structural and thermo-mechanical properties of materials. We predicted the phonon contribution to thermal conductivity (kL) using the Slack model. We performed the calculations within local density approximation (LDA) and generalized gradient approximation (GGA) with the recently proposed version for solids (PBEsol). We employed a Monkhorst-Pack 5 × 5 × 5 k-points mesh in reciprocal space with a plane wave cut-off energy of 150 Ry to obtain the convergence of the structure. We calculated the dynamical matrices of the lattice on a 4 × 4 × 4 mesh. We have predicted the heat capacity, thermal expansion and the phonon contribution to thermal conductivity, as a function of temperature up to 1400K, and compared them with the previous work and known experimental results.

In-situ fabrication of diketopyrrolopyrrole-carbazole-based conjugated polymer/TiO2 heterojunction for enhanced visible light photocatalysis

NASA Astrophysics Data System (ADS)

Yang, Long; Yu, Yuyan; Zhang, Jianling; Chen, Fu; Meng, Xiao; Qiu, Yong; Dan, Yi; Jiang, Long

2018-03-01

Aiming at developing highly efficient photocatalysts by broadening the light-harvesting region and suppressing photo-generated electron-hole recombination simultaneously, this work reports rational design and fabrication of donor-acceptor (D-A) conjugated polymer/TiO2 heterojunction catalyst with strong interfacial interactions by a facile in-situ thermal treatment. To expand the light-harvesting window, soluable conjugated copolymers with D-A architecture are prepared by Pd-mediated polycondensation of diketopyrrolopyrrole (DPP) and t-butoxycarbonyl (t-Boc) modified carbazole (Car), and used as visible-light-harvesting antenna to couple with TiO2 nanocrystals. The DPP-Car/TiO2 composites show wide range absorption in 300-1000 nm. To improve the interfacial binding at the interface, a facile in-situ thermal treatment is carried out to cleave the pendant t-Boc groups in carbazole units and liberate the polar amino groups (-NH-) which strongly bind to the surface of TiO2 through dipole-dipole interactions, forming a heterojunction interface. This in-situ thermal treatment changes the surface elemental distribution of TiO2, reinforces the interface bonding at the boundary of conjugated polymers/TiO2 and finally improves the photocatalytic efficiency of DPP-Car/TiO2 under visible-light irradiation. The interface changes are characterized and verified through Fourier-transform infrared spectroscopy (FT-IR), photo images, UV/Vis (solution state and powder diffuse reflection spectroscopy), X-ray powder diffraction (XRD), X-ray photoelectron spectroscopy (XPS), fluorescence, scanning electron microscopy(SEM) and transmission electron microscopy (TEM) techniques. This study provides a new strategy to avoid the low solubility of D-A conjugated polymers and construct highly-efficient conjugated polymer/TiO2 heterojunction by enforcing the interface contact and facilitating charge or energy transfer for the applications in photocatalysis.