Printability Optimization For Fine Pitch Solder Bonding

DOE Office of Scientific and Technical Information (OSTI.GOV)

Kwon, Sang-Hyun; Lee, Chang-Woo; Yoo, Sehoon

2011-01-17

Effect of metal mask and pad design on solder printability was evaluated by DOE in this study. The process parameters were stencil thickness, squeegee angle, squeegee speed, mask separating speed, and pad angle of PCB. The main process parameters for printability were stencil thickness and squeegee angle. The response surface showed that maximum printability of 1005 chip was achieved at the stencil thickness of 0.12 mm while the maximum printability of 0603 and 0402 chip was obtained at the stencil thickness of 0.05 mm. The bonding strength of the MLCC chips was also directly related with the printability.

Chip, Chip, Hooray!

ERIC Educational Resources Information Center

Kelly, Susan

2001-01-01

Presents a science laboratory using different brands of potato chips in which students test their oiliness, size, thickness, saltiness, quality, and cost, then analyze the results to determine the best chip. Gives a brief history of potato chips. (YDS)

Storage stability of banana chips in polypropylene based nanocomposite packaging films.

PubMed

Manikantan, M R; Sharma, Rajiv; Kasturi, R; Varadharaju, N

2014-11-01

In this study, polypropylene (PP) based nanocomposite films of 15 different compositions of nanoclay, compatibilizer and thickness were developed and used for packaging and storage of banana chips. The effect of nanocomposite films on the quality characteristics viz. moisture content (MC), water activity (WA), total color difference(TCD), breaking force (BF), free fatty acid (FFA), peroxide value(PV), total plate count (TPC) and overall acceptability score of banana chips under ambient condition at every 15 days interval were studied for 120 days. All quality parameters of stored banana chips increased whereas overall acceptability scores decreased during storage. The elevation in FFA, BF and TCD of stored banana chips increased with elapse of storage period as well as with increased proportion of both nanoclay and compatibilizer but decreased by reducing the thickness of film. Among all the packaging materials, the WA of banana chips remained lower than 0.60 i.e. critical limit for microbial growth up to 90 days of storage. The PV of banana chips packaged also remained within the safe limit of 25 meq oxygen kg(-1) throughout the storage period. Among all the nanocomposite films, packaging material having 5 % compatibilizer, 2 % nanoclay & 100 μm thickness (treatment E) and 10 % compatibilizer, 4 % nanoclay & 120 μm thickness (treatment N) showed better stability of measured quality characteristics of banana chips than any other treatment.

Structural architecture and petrophysical properties of the Rocca di Neto extensional fault zone developed in the shallow marine sediments of the Crotone Basin (Southern Apennines, Italy).

NASA Astrophysics Data System (ADS)

Pizzati, Mattia; Balsamo, Fabrizio; Iacumin, Paola; Swennen, Rudy; Storti, Fabrizio

2017-04-01

In this contribution we describe the architecture and petrophysical properties of the Rocca di Neto extensional fault zone in loose and poorly lithified sediments, located in the Crotone forearc basin (south Italy). To this end, we combined fieldwork with microstructural observations, grain size analysis, and in situ permeability measurements. The studied fault zone has an estimated maximum displacement of 80-90 m and separates early Pleistocene age (Gelasian) sands in the footwall from middle Pleistocene (Calabrian) silty clay in the hangingwall. The analysed outcrop consists of about 70 m section through the fault zone mostly developed in the footwall block. Fault zone consists of four different structural domains characterized by distinctive features: (1) <1 m-thick fault core (where the majority of the displacement is accommodated) in which bedding is transposed into foliation imparted by grain preferential orientation and some black gouges decorate the main slip surfaces; (2) zone of tectonic mixing characterized by a set of closely spaced and anastomosed deformation bands parallel to the main slip surface; (3) about 8 m-thick footwall damage zone characterized by synthetic and antithetic sets of deformation bands; (4) zone of background deformation with a few, widely-spaced conjugate minor faults and deformation bands. The boundary between the relatively undeformed sediments and the damage zone is not sharp and it is characterized by a progressive decrease in deformation intensity. The silty clay in the hangingwall damage zone is characterized by minor faults. Grain size and microstructural data indicate that particulate flow with little amount of cataclasis is the dominant deformation mechanism in both fault core rocks and deformation bands. Permeability of undeformed sediments is about 70000 mD, whereas the permeability in deformation bands ranges from 1000 to 18000 mD; within the fault core rocks permeability is reduced up to 3-4 orders of magnitude respect to the undeformed domains. Structural and petrophysical data suggest that the Rocca di Neto fault zone may compartmentalize the footwall block due to both juxtaposition of clay-rich lithology in the hangingwall and the development of low permeability fault core rocks.

Fundamentals of cutting.

PubMed

Williams, J G; Patel, Y

2016-06-06

The process of cutting is analysed in fracture mechanics terms with a view to quantifying the various parameters involved. The model used is that of orthogonal cutting with a wedge removing a layer of material or chip. The behaviour of the chip is governed by its thickness and for large radii of curvature the chip is elastic and smooth cutting occurs. For smaller thicknesses, there is a transition, first to plastic bending and then to plastic shear for small thicknesses and smooth chips are formed. The governing parameters are tool geometry, which is principally the wedge angle, and the material properties of elastic modulus, yield stress and fracture toughness. Friction can also be important. It is demonstrated that the cutting process may be quantified via these parameters, which could be useful in the study of cutting in biology.

Silicon sample holder for molecular beam epitaxy on pre-fabricated integrated circuits

NASA Technical Reports Server (NTRS)

Hoenk, Michael E. (Inventor); Grunthaner, Paula J. (Inventor); Grunthaner, Frank J. (Inventor)

1994-01-01

The sample holder of the invention is formed of the same semiconductor crystal as the integrated circuit on which the molecular beam expitaxial process is to be performed. In the preferred embodiment, the sample holder comprises three stacked micro-machined silicon wafers: a silicon base wafer having a square micro-machined center opening corresponding in size and shape to the active area of a CCD imager chip, a silicon center wafer micro-machined as an annulus having radially inwardly pointing fingers whose ends abut the edges of and center the CCD imager chip within the annulus, and a silicon top wafer micro-machined as an annulus having cantilevered membranes which extend over the top of the CCD imager chip. The micro-machined silicon wafers are stacked in the order given above with the CCD imager chip centered in the center wafer and sandwiched between the base and top wafers. The thickness of the center wafer is about 20% less than the thickness of the CCD imager chip. Preferably, four titanium wires, each grasping the edges of the top and base wafers, compress all three wafers together, flexing the cantilever fingers of the top wafer to accommodate the thickness of the CCD imager chip, acting as a spring holding the CCD imager chip in place.

A Study of Chip Formation Feedrates of Various Steels in Low-Speed Milling Process

NASA Astrophysics Data System (ADS)

Prasetyo, L.; Tauviqirrahman, M.; Rusnaldy

2017-05-01

Milling is a process of metal removal by feeding the workpiece a rotating multitoothed cutter. The objective of the study was to investigate the chip characteristics (chip length, width, and thickness) during the milling process by varying the feedrates and the types of materials used based on an experimental approach. The chosen materials were AISI 1020, AISI 1045, AISI 1090, AISI D2, and AISI 4340 with a high-speed steel (HSS) as a cutter. In this work, the feedrates were varied of 5, 10, and 15 mm/minutes with the depth of cut of 0.5 mm and a low spindle speed of 70 rpm. The results show that, in general, increasing the feedrate will lead to the growth of chip length, width, and thickness for all types of materials used. Also, related to the chip shape, AISI 1020 produces the discontinuous chip which can be related to its hardness value.

C-Band Backscatter Measurements of Winter Sea-Ice in the Weddell Sea, Antarctica

NASA Technical Reports Server (NTRS)

Drinkwater, M. R.; Hosseinmostafa, R.; Gogineni, P.

1995-01-01

During the 1992 Winter Weddell Gyre Study, a C-band scatterometer was used from the German ice-breaker R/V Polarstern to obtain detailed shipborne measurement scans of Antarctic sea-ice. The frequency-modulated continuous-wave (FM-CW) radar operated at 4-3 GHz and acquired like- (VV) and cross polarization (HV) data at a variety of incidence angles (10-75 deg). Calibrated backscatter data were recorded for several ice types as the icebreaker crossed the Weddell Sea and detailed measurements were made of corresponding snow and sea-ice characteristics at each measurement site, together with meteorological information, radiation budget and oceanographic data. The primary scattering contributions under cold winter conditions arise from the air/snow and snow/ice interfaces. Observations indicate so e similarities with Arctic sea-ice scattering signatures, although the main difference is generally lower mean backscattering coefficients in the Weddell Sea. This is due to the younger mean ice age and thickness, and correspondingly higher mean salinities. In particular, smooth white ice found in 1992 in divergent areas within the Weddell Gyre ice pack was generally extremely smooth and undeformed. Comparisons of field scatterometer data with calibrated 20-26 deg incidence ERS-1 radar image data show close correspondence, and indicate that rough Antarctic first-year and older second-year ice forms do not produce as distinctively different scattering signatures as observed in the Arctic. Thick deformed first-year and second-year ice on the other hand are clearly discriminated from younger undeformed ice. thereby allowing successful separation of thick and thin ice. Time-series data also indicate that C-band is sensitive to changes in snow and ice conditions resulting from atmospheric and oceanographic forcing and the local heat flux environment. Variations of several dB in 45 deg incidence backscatter occur in response to a combination of thermally-regulated parameters including sea-ice brine volume, snow and ice complex dielectric properties, and snow physical properties.

Latest Cretaceous and Paleocene extension in SE California

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tosdal, R.M.; Conrad, J.E.; Murphy, G.P.

1993-04-01

Two ductile deformations formed the 3.5-km-thick, south dipping American Girl shear zone in the Cargo Muchancho Mountains, SE California. The older event (D1) imprints crystalloblastic fabrics that record contractional strains at midcrustal depths in the Middle( ) and Late Jurassic. The second event (D2) is marked by superposed mylonitic fabrics that are coplanar and colinear with fabrics of D1. Small mylonitic shear zones of D2 cut undeformed rocks in the hanging wall of the American Girl shear zone. Folded sheets of Jurassic granite geneiss and kinematic indicators in mylonites indicative southward directed transport down the present dip of the foliationmore » during D2. [sup 40]Ar/[sup 39]Ar release spectrum on hornblende from undeformed upper-plate monzo-diorite (173 Ma, U-Pb zircon), about 2 km above the top of shear zone has a plateau age of 96.7[+-]0.9 Ma. In contrast, hornblende release spectra from granite gneiss about 200 m below the top of the shear zone and from hornblende gneiss about 3 km below the top of the shear zone are flat and have identical ages. Hornblende from monzodiorite at the base of the upper plate has a more complicated spectrum that is interpreted to indicate a cooling age of 60.4[+-]1.3 Ma.« less

Evaluation of a conventional chip seal under an overlay to mitigate reflective cracking (informal).

DOT National Transportation Integrated Search

2015-03-01

The Billings District initiated an experimental project in placing a conventional : chip seal (as an interlayer) on an existing pavement prior to an overlay : (composed of a 0.25 PMS thickness). The intent of the chip seal (CS) was to : seal exist...

Predicting segregation of wood and bark chips by differences in terminal velocities.

Treesearch

John A. Sturos

1973-01-01

Presents data on length, width, thickness, moisture content, specific gravity, and terminal velocities of wood and bark chips for eight important pulpwood species. Gives differences in terminal velocities of the wood and bark chips used to predict the degree of segregation possible by air flotation.

Recent advances in the hydrostratigraphy of paleozoic bedrock in the midwestern united states

USGS Publications Warehouse

Bradbury, K.R.; Runkel, Anthony C.

2011-01-01

Recent hydrostratigraphic researches have made it possible to acquire knowledge about the relatively undeformed Paleozoic bedrock that forms the most widely used aquifers in Minnesota and Wisconsin. Ongoing evaluation of the Cambrian Eau Claire Formation in southern Wisconsin has caused the formation to be considered a major regional aquitard. Subsurface logs indicate that its thickness ranges from absent to <75 m, and parts of the formation yield significant amounts of water to wells. A key part of modern aquitard hydrogeology is the integration of multi-level hydraulic head measurements into hydrostratigraphic analysis. In south-central Wisconsin, regional groundwater withdrawals from the confined Mount Simon aquifer have created a regional cone of depression. Regional groundwater modeling has demonstrated that this relatively thin unit exerts a major control on regional groundwater flow in the ??300-m-thick bedrock aquifer system and that it is critical in protecting deep wells from contamination.

Study on Crystallographic Orientation Effect on Surface Generation of Aluminum in Nano-cutting

NASA Astrophysics Data System (ADS)

Xu, Feifei; Fang, Fengzhou; Zhu, Yuanqing; Zhang, Xiaodong

2017-04-01

The material characteristics such as size effect are one of the most important factors that could not be neglected in cutting the material at nanoscale. The effects of anisotropic nature of single crystal materials in nano-cutting are investigated employing the molecular dynamics simulation. Results show that the size effect of the plastic deformation is based on different plastic carriers, such as the twin, stacking faults, and dislocations. The minimum uncut chip thickness is dependent on cutting direction, where even a negative value is obtained when the cutting direction is {110}<001>. It also determines the material deformation and removal mechanism (e.g., shearing, extruding, and rubbing mechanism) with a decrease in uncut chip thickness. When material is deformed by shearing, the primary shearing zone expands from the stagnation point or the tip of stagnation zone. When a material is deformed by extruding and rubbing, the primary deformation zone almost parallels to the cutting direction and expands from the bottom of the cutting edge merging with the tertiary deformation zone. The generated surface quality relates to the crystallographic orientation and the minimum uncut chip thickness. The cutting directions of {110}<001>, {110}<1-10>, and {111}<1-10>, whose minimum uncut chip thickness is relatively small, have better surface qualities compared to the other cutting direction.

Study on Crystallographic Orientation Effect on Surface Generation of Aluminum in Nano-cutting.

PubMed

Xu, Feifei; Fang, Fengzhou; Zhu, Yuanqing; Zhang, Xiaodong

2017-12-01

The material characteristics such as size effect are one of the most important factors that could not be neglected in cutting the material at nanoscale. The effects of anisotropic nature of single crystal materials in nano-cutting are investigated employing the molecular dynamics simulation. Results show that the size effect of the plastic deformation is based on different plastic carriers, such as the twin, stacking faults, and dislocations. The minimum uncut chip thickness is dependent on cutting direction, where even a negative value is obtained when the cutting direction is {110}<001>. It also determines the material deformation and removal mechanism (e.g., shearing, extruding, and rubbing mechanism) with a decrease in uncut chip thickness. When material is deformed by shearing, the primary shearing zone expands from the stagnation point or the tip of stagnation zone. When a material is deformed by extruding and rubbing, the primary deformation zone almost parallels to the cutting direction and expands from the bottom of the cutting edge merging with the tertiary deformation zone. The generated surface quality relates to the crystallographic orientation and the minimum uncut chip thickness. The cutting directions of {110}<001>, {110}<1-10>, and {111}<1-10>, whose minimum uncut chip thickness is relatively small, have better surface qualities compared to the other cutting direction.

Ductile-regime turning of germanium and silicon

NASA Technical Reports Server (NTRS)

Blake, Peter N.; Scattergood, Ronald O.

1989-01-01

Single-point diamond turning of silicon and germanium was investigated in order to clarify the role of cutting depth in coaxing a ductile chip formation in normally brittle substances. Experiments based on the rapid withdrawal of the tool from the workpiece have shown that microfracture damage is a function of the effective depth of cut (as opposed to the nominal cutting depth). In essence, damage created by the leading edge of the tool is removed several revolutions later by lower sections of the tool edge, where the effective cutting depth is less. It appears that a truly ductile cutting response can be achieved only when the effective cutting depth, or critical chip thickness, is less than about 20 nm. Factors such as tool rake angle are significant in that they will affect the actual value of the critical chip thickness for transition from brittle to ductile response. It is concluded that the critical chip thickness is an excellent parameter for measuring the effects of machining conditions on the ductility of the cut and for designing tool-workpiece geometry in both turning and grinding.

Physical properties and estimated glycemic index of protein-enriched sorghum based chips.

PubMed

Jiang, Hongrui; Hettiararchchy, Navam S; Horax, Ronny

2018-03-01

Sorghum is a gluten-free grain and more attention has been given to the nutritional properties and recently its usage as a wheat replacement in food products. In the present work, protein-enriched sorghum based snack chips, prepared from sorghum meal with soy protein isolates and soy flour to meet the final protein content of 35.7%, were produced. The effect of varying baking powder (1.5-2.5%), dough sheet thickness (0.7-1.7 mm), and baking time (6-12 min) on the physical properties of the snack chips was investigated using a central composite design of response surface methodology. Under baking temperature of 160 °C, with baking powder added, the water activity and puffiness of chips significantly increased. Baking time was the most significant factor for all the parameters detected except for puffiness. The optimized conditions of preparing protein-enriched sorghum chips were baking powder 2.5%, dough sheet thickness 0.7 mm, and baking time 7.66 min. The estimated glycemic index (eGI) of the protein-enriched sorghum chips (eGI = 59.8) was significantly lower than soybean-free sorghum chips. The gluten-free protein-enriched sorghum chips developed could be considered as protein rich with lower intermediate-glycemic index classified healthy snacks and potential commercialization.

Prevention of Stripping under Chip Seals

DOT National Transportation Integrated Search

2017-10-01

Eighteen chip-sealed roadways in eight cities and counties in Minnesota were evaluated both in the field (for condition surveys and density tests) and in the laboratory (for permeability, stripping, tensile-strength ratio, asphalt film thickness, and...

Sea-ice evaluation of NEMO-Nordic 1.0: a NEMO-LIM3.6-based ocean-sea-ice model setup for the North Sea and Baltic Sea

NASA Astrophysics Data System (ADS)

Pemberton, Per; Löptien, Ulrike; Hordoir, Robinson; Höglund, Anders; Schimanke, Semjon; Axell, Lars; Haapala, Jari

2017-08-01

The Baltic Sea is a seasonally ice-covered marginal sea in northern Europe with intense wintertime ship traffic and a sensitive ecosystem. Understanding and modeling the evolution of the sea-ice pack is important for climate effect studies and forecasting purposes. Here we present and evaluate the sea-ice component of a new NEMO-LIM3.6-based ocean-sea-ice setup for the North Sea and Baltic Sea region (NEMO-Nordic). The setup includes a new depth-based fast-ice parametrization for the Baltic Sea. The evaluation focuses on long-term statistics, from a 45-year long hindcast, although short-term daily performance is also briefly evaluated. We show that NEMO-Nordic is well suited for simulating the mean sea-ice extent, concentration, and thickness as compared to the best available observational data set. The variability of the annual maximum Baltic Sea ice extent is well in line with the observations, but the 1961-2006 trend is underestimated. Capturing the correct ice thickness distribution is more challenging. Based on the simulated ice thickness distribution we estimate the undeformed and deformed ice thickness and concentration in the Baltic Sea, which compares reasonably well with observations.

Discrete component bonding and thick film materials study. [of capacitor chips bonded with solders and conductive epoxies

NASA Technical Reports Server (NTRS)

Kinser, D. L.

1976-01-01

The bonding reliability of discrete capacitor chips bonded with solders and conductive epoxies was examined along with the thick film resistor materials consisting of iron oxide phosphate and vanadium oxide phosphates. It was concluded from the bonding reliability studies that none of the wide range of types of solders examined is capable of resisting failure during thermal cycling while the conductive epoxy gives substantially lower failure rates. The thick film resistor studies proved the feasibility of iron oxide phosphate resistor systems although some environmental sensitivity problems remain. One of these resistor compositions has inadvertently proven to be a candidate for thermistor applications because of the excellent control achieved upon the temperature coefficient of resistance. One new and potentially damaging phenomenon observed was the degradation of thick film conductors during the course of thermal cycling.

Differential alternating current chip calorimeter for in situ investigation of vapor-deposited thin films

NASA Astrophysics Data System (ADS)

Ahrenberg, M.; Shoifet, E.; Whitaker, K. R.; Huth, H.; Ediger, M. D.; Schick, C.

2012-03-01

Physical vapor deposition can be used to produce thin films with interesting material properties including extraordinarily stable organic glasses. We describe an ac chip calorimeter for in situ heat capacity measurements of as-deposited nanometer thin films of organic glass formers. The calorimetric system is based on a differential ac chip calorimeter which is placed in the vacuum chamber for physical vapor deposition. The sample is directly deposited onto one calorimetric chip sensor while the other sensor is protected against deposition. The device and the temperature calibration procedure are described. The latter makes use of the phase transitions of cyclopentane and the frequency dependence of the dynamic glass transition of toluene and ethylbenzene. Sample thickness determination is based on a finite element modeling of the sensor sample arrangement. In the modeling, a layer of toluene was added to the sample sensor and its thickness was varied in an iterative way until the model fit the experimental data.

Differential AC chip calorimeter for in situ investigation of vapor deposited thin films

NASA Astrophysics Data System (ADS)

Ahrenberg, Mathias; Schick, Christoph; Huth, Heiko; Schoifet, Evgeni; Ediger, Mark; Whitaker, Katie

2012-02-01

Physical vapor deposition (PVD) can be used to produce thin films with particular material properties like extraordinarily stable glasses of organic molecules. We describe an AC chip calorimeter for in-situ heat capacity measurements of as-deposited nanometer thin films of organic glass formers. The calorimetric system is based on a differential AC chip calorimeter which is placed in the vacuum chamber for physical vapor deposition. The sample is directly deposited onto one calorimetric chip sensor while the other sensor is protected against deposition. The device and the temperature calibration procedure are described. The latter makes use of the phase transitions of cyclopentane and the frequency dependence of the dynamic glass transition of toluene and ethylbenzene. Sample thickness determination is based on a finite element modeling (FEM) of the sensor sample arrangement. A layer of toluene was added to the sample sensor and its thickness was varied in an iterative way until the model fits the experimental data.

Large-area sheet task advanced dendritic web growth development

NASA Technical Reports Server (NTRS)

Duncan, C. S.; Seidensticker, R. G.; Mchugh, J. P.

1984-01-01

The thermal models used for analyzing dendritic web growth and calculating the thermal stress were reexamined to establish the validity limits imposed by the assumptions of the models. Also, the effects of thermal conduction through the gas phase were evaluated and found to be small. New growth designs, both static and dynamic, were generated using the modeling results. Residual stress effects in dendritic web were examined. In the laboratory, new techniques for the control of temperature distributions in three dimensions were developed. A new maximum undeformed web width of 5.8 cm was achieved. A 58% increase in growth velocity of 150 micrometers thickness was achieved with dynamic hardware. The area throughput goals for transient growth of 30 and 35 sq cm/min were exceeded.

Modified dry limestone process for control of sulfur dioxide emissions

DOEpatents

Shale, Correll C.; Cross, William G.

1976-08-24

A method and apparatus for removing sulfur oxides from flue gas comprise cooling and conditioning the hot flue gas to increase the degree of water vapor saturation prior to passage through a bed of substantially dry carbonate chips or lumps, e.g., crushed limestone. The reaction products form as a thick layer of sulfites and sulfates on the surface of the chips which is easily removed by agitation to restore the reactive surface of the chips.

RuO2 Thermometer for Ultra-Low Temperatures

NASA Technical Reports Server (NTRS)

Hait, Thomas; Shirron, Peter J.; DiPirro, Michael

2009-01-01

A small, high-resolution, low-power thermometer has been developed for use in ultra-low temperatures that uses multiple RuO2 chip resistors. The use of commercially available thick-film RuO2 chip resistors for measuring cryogenic temperatures is well known due to their low cost, long-term stability, and large resistance change.

Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology.

PubMed

Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng

2018-08-01

In this study, through silicon via (TSV)-less interconnection using the fan-out wafer-level-packaging (FO-WLP) technology and a novel redistribution layer (RDL)-first wafer level packaging are investigated. Since warpage of molded wafer is a critical issue and needs to be optimized for process integration, the evaluation of the warpage issue on a 12-inch wafer using finite element analysis (FEA) at various parameters is presented. Related parameters include geometric dimension (such as chip size, chip number, chip thickness, and mold thickness), materials' selection and structure optimization. The effect of glass carriers with various coefficients of thermal expansion (CTE) is also discussed. Chips are bonded onto a 12-inch reconstituted wafer, which includes 2 RDL layers, 3 passivation layers, and micro bumps, followed by using epoxy molding compound process. Furthermore, an optical surface inspector is adopted to measure the surface profile and the results are compared with the results from simulation. In order to examine the quality of the TSV-less interconnection structure, electrical measurement is conducted and the respective results are presented.

CMOS chip planarization by chemical mechanical polishing for a vertically stacked metal MEMS integration

NASA Astrophysics Data System (ADS)

Lee, Hocheol; Miller, Michele H.; Bifano, Thomas G.

2004-01-01

In this paper we present the planarization process of a CMOS chip for the integration of a microelectromechanical systems (MEMS) metal mirror array. The CMOS chip, which comes from a commercial foundry, has a bumpy passivation layer due to an underlying aluminum interconnect pattern (1.8 µm high), which is used for addressing individual micromirror array elements. To overcome the tendency for tilt error in the CMOS chip planarization, the approach is to sputter a thick layer of silicon nitride at low temperature and to surround the CMOS chip with dummy silicon pieces that define a polishing plane. The dummy pieces are first lapped down to the height of the CMOS chip, and then all pieces are polished. This process produced a chip surface with a root-mean-square flatness error of less than 100 nm, including tilt and curvature errors.

Multilayer on-chip stacked Fresnel zone plates: Hard x-ray fabrication and soft x-ray simulations

DOE Office of Scientific and Technical Information (OSTI.GOV)

Li, Kenan; Wojcik, Michael J.; Ocola, Leonidas E.

2015-11-01

Fresnel zone plates are widely used as x-ray nanofocusing optics. To achieve high spatial resolution combined with good focusing efficiency, high aspect ratio nanolithography is required, and one way to achieve that is through multiple e-beam lithography writing steps to achieve on-chip stacking. A two-step writing process producing 50 nm finest zone width at a zone thickness of 1.14 µm for possible hard x-ray applications is shown here. The authors also consider in simulations the case of soft x-ray focusing where the zone thickness might exceed the depth of focus. In this case, the authors compare on-chip stacking with, andmore » without, adjustment of zone positions and show that the offset zones lead to improved focusing efficiency. The simulations were carried out using a multislice propagation method employing Hankel transforms.« less

Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si

NASA Astrophysics Data System (ADS)

Duan, P.; Raz, O.; Smalbrugge, B. E.; Duis, J.; Dorren, H. J. S.

2012-01-01

We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking the opto-electrical dies directly on the CMOS driver. The suggested implementation is aiming to provide a wafer scale process which will make the use of wire bonding redundant and will allow for impedance matched metallic wiring between the electronic driving circuit and its opto-electronic counter part. We suggest the use of a thick photoresist ramp between CMOS driver and opto-electrical dies surface as the bridge for supporting co-plannar waveguides (CPW) electrically plated with lithographic accuracy. In this way all three dimensions of the interconnecting metal layer, width, length and thickness can be completely controlled. In this 1st demonstration all processing is done on commercially available devices and products, and is compatible with CMOS processing technology. To test the applicability of CPW instead of wire bonds for interconnecting the CMOS circuit and opto-electronic chips, we have made test samples and tested their performance at speeds up to 10 Gbps. In this demonstration, a silicon substrate was used on which we evaporated gold co-planar waveguides (CPW) to mimic a wire on the driver. An optical link consisting of a VCSEL chip and a photodiode chip has been assembled and fully characterized using optical coupling into and out of a multimode fiber (MMF). A 10 Gb/s 27-1 NRZ PRBS signal transmitted from one chip to another chip was detected error free. A 4 dB receiver sensitivity penalty is measured for the integrated device compared to a commercial link.

Terahertz microfluidic chips for detection of amino acids in aqueous solutions

NASA Astrophysics Data System (ADS)

Su, Bo; Zhang, Cong; Fan, Ning; Zhang, Cunlin

2016-11-01

Microfluidic technology can control the fluidic thickness accurately in less than 100 micrometers. So the combination of terahertz (THz) and microfluidic technology becomes one of the most interesting directions towards biological detection. We designed microfluidic chips for terahertz spectroscopy of biological samples in aqueous solutions. Using the terahertz time-domain spectroscopy (THz-TDS) system, we experimentally measured the transmittance of the chips and the THz absorption spectra of L-threonine and L-arginine, respectively. The results indicated the feasibility of performing high sensitivity THz spectroscopy of amino acids solutions. Therefore, the microfluidic chips can realize real-time and label-free measurement for biochemistry samples in THz-TDS system.

Tool Forces and Chip Formation In Orthogonal Cutting Of Loblolly Pine

Treesearch

George E. Woodson; Peter Koch

1970-01-01

Specimens of earlywood and latewood of Pinus taeda L. were excised so that length along the grain was 3 inches and thickness was 0.1 inch. These specimens were cut orthogonally-as with a carpenter's plane-in the three major directions. Cutting velocity was 2 inches per minute. When cutting was in the planing (90-O) direction, thin chips,...

Effects of chipping, grinding, and heat on survival of emerald ash borer, Agrilus planipennis (Coleoptera: Buprestidae), in chips

Treesearch

Deborah G. McCullough; Therese M. Poland; David Cappaert; Erin L. Clark; Ivich Fraser; Victor Mastro; Sarah Smith; Christopher Pell

2007-01-01

The emerald ash borer, Agrilus planipennis Fairmaire (Coleoptera: Buprestidae), a phloem-feeding insect from Asia, was identi?ed in 2002 as the cause of widespread ash (Fraxinus sp.) mortality in southeastern Michigan and Essex County, Ontario. Most larvae overwinter as nonfeeding prepupae in the outer sapwood or thick bark of...

A Single Chip Automotive Control LSI Using SOI Bipolar Complimentary MOS Double-Diffused MOS

NASA Astrophysics Data System (ADS)

Kawamoto, Kazunori; Mizuno, Shoji; Abe, Hirofumi; Higuchi, Yasushi; Ishihara, Hideaki; Fukumoto, Harutsugu; Watanabe, Takamoto; Fujino, Seiji; Shirakawa, Isao

2001-04-01

Using the example of an air bag controller, a single chip solution for automotive sub-control systems is investigated, by using a technological combination of improved circuits, bipolar complimentary metal oxide silicon double-diffused metal oxide silicon (BiCDMOS) and thick silicon on insulator (SOI). For circuits, an automotive specific reduced instruction set computer (RISC) center processing unit (CPU), and a novel, all integrated system clock generator, dividing digital phase-locked loop (DDPLL) are proposed. For the device technologies, the authors use SOI-BiCDMOS with trench dielectric-isolation (TD) which enables integration of various devices in an integrated circuit (IC) while avoiding parasitic miss operations by ideal isolation. The structures of the SOI layer and TD, are optimized for obtaining desired device characteristics and high electromagnetic interference (EMI) immunity. While performing all the air bag system functions over a wide range of supply voltage, and ambient temperature, the resulting single chip reduces the electronic parts to about a half of those in the conventional air bags. The combination of single chip oriented circuits and thick SOI-BiCDMOS technologies offered in this work is valuable for size reduction and improved reliability of automotive electronic control units (ECUs).

Development of Equivalent Material Properties of Microbump for Simulating Chip Stacking Packaging

PubMed Central

Lee, Chang-Chun; Tzeng, Tzai-Liang; Huang, Pei-Chen

2015-01-01

A three-dimensional integrated circuit (3D-IC) structure with a significant scale mismatch causes difficulty in analytic model construction. This paper proposes a simulation technique to introduce an equivalent material composed of microbumps and their surrounding wafer level underfill (WLUF). The mechanical properties of this equivalent material, including Young’s modulus (E), Poisson’s ratio, shear modulus, and coefficient of thermal expansion (CTE), are directly obtained by applying either a tensile load or a constant displacement, and by increasing the temperature during simulations, respectively. Analytic results indicate that at least eight microbumps at the outermost region of the chip stacking structure need to be considered as an accurate stress/strain contour in the concerned region. In addition, a factorial experimental design with analysis of variance is proposed to optimize chip stacking structure reliability with four factors: chip thickness, substrate thickness, CTE, and E-value. Analytic results show that the most significant factor is CTE of WLUF. This factor affects microbump reliability and structural warpage under a temperature cycling load and high-temperature bonding process. WLUF with low CTE and high E-value are recommended to enhance the assembly reliability of the 3D-IC architecture. PMID:28793495

On-Chip Waveguide Coupling of a Layered Semiconductor Single-Photon Source.

PubMed

Tonndorf, Philipp; Del Pozo-Zamudio, Osvaldo; Gruhler, Nico; Kern, Johannes; Schmidt, Robert; Dmitriev, Alexander I; Bakhtinov, Anatoly P; Tartakovskii, Alexander I; Pernice, Wolfram; Michaelis de Vasconcellos, Steffen; Bratschitsch, Rudolf

2017-09-13

Fully integrated quantum technology based on photons is in the focus of current research, because of its immense potential concerning performance and scalability. Ideally, the single-photon sources, the processing units, and the photon detectors are all combined on a single chip. Impressive progress has been made for on-chip quantum circuits and on-chip single-photon detection. In contrast, nonclassical light is commonly coupled onto the photonic chip from the outside, because presently only few integrated single-photon sources exist. Here, we present waveguide-coupled single-photon emitters in the layered semiconductor gallium selenide as promising on-chip sources. GaSe crystals with a thickness below 100 nm are placed on Si 3 N 4 rib or slot waveguides, resulting in a modified mode structure efficient for light coupling. Using optical excitation from within the Si 3 N 4 waveguide, we find nonclassicality of generated photons routed on the photonic chip. Thus, our work provides an easy-to-implement and robust light source for integrated quantum technology.

Tool wear mechanisms in turning titanium-aluminum-vanadium using tungsten carbide and polycrystalline diamond inserts

NASA Astrophysics Data System (ADS)

Schrock, David James

The objective of this work is to identify some of the tool wear mechanisms at the material level for the machining of titanium and to provide some understanding of these mechanisms for use in physics based tool wear models. Turning experiments were conducted at cutting speeds of 61m/min, 91m/min, and 122m/min on Ti-6Al-4V, an alloy of titanium, using two different grades of tungsten carbide cutting inserts and one grade of polycrystalline diamond inserts. Three-dimensional wear data and two-dimensional wear profiles of the rake face were generated using Confocal Laser Scanning Microscopy to quantify the tool wear mechanisms. Additionally, the microstructure of the deformed work material (chip) and un-deformed parent material (work piece) were studied using Orientation Imaging Microscopy (OIM). Observations from tool wear studies on the PCD inserts revealed the presence of two fundamentally different wear mechanisms operating at the different cutting speeds. Microstructural analyses of the chip and the work material showed phase dependent tool wear mechanisms for machining titanium. There is a high likelihood of phase change occurring in the work material during machining, with a transformation from the alpha phase to the beta phase. The observed dramatic increase in wear is attributed to a combination of increased diffusivity in the beta phase of the titanium alloy in conjunction with a higher degree of recrystallization of the prior beta phase upon cooling. Results of other observations such as the influence of carbide grain size on tool wear are also discussed.

High-directionality fiber-chip grating coupler with interleaved trenches and subwavelength index-matching structure.

PubMed

Benedikovic, Daniel; Alonso-Ramos, Carlos; Cheben, Pavel; Schmid, Jens H; Wang, Shurui; Xu, Dan-Xia; Lapointe, Jean; Janz, Siegfried; Halir, Robert; Ortega-Moñux, Alejandro; Wangüemert-Pérez, J Gonzalo; Molina-Fernández, Iñigo; Fédéli, Jean-Marc; Vivien, Laurent; Dado, Milan

2015-09-15

We present the first experimental demonstration of a new fiber-chip grating coupler concept that exploits the blazing effect by interleaving the standard full (220 nm) and shallow etch (70 nm) trenches in a 220 nm thick silicon layer. The high directionality is obtained by controlling the separation between the deep and shallow trenches to achieve constructive interference in the upward direction and destructive interference toward the silicon substrate. Utilizing this concept, the grating directionality can be maximized independent of the bottom oxide thickness. The coupler also includes a subwavelength-engineered index-matching region, designed to reduce the reflectivity at the interface between the injection waveguide and the grating. We report a measured fiber-chip coupling efficiency of -1.3  dB, the highest coupling efficiency achieved to date for a surface grating coupler in a 220 nm silicon-on-insulator platform fabricated in a conventional dual-etch process without high-index overlays or bottom mirrors.

From Cylindrical to Stretching Ridges and Wrinkles in Twisted Ribbons

NASA Astrophysics Data System (ADS)

Pham Dinh, Huy; Démery, Vincent; Davidovitch, Benny; Brau, Fabian; Damman, Pascal

2016-09-01

Twisted ribbons under tension exhibit a remarkably rich morphology, from smooth and wrinkled helicoids, to cylindrical or faceted patterns. This complexity emanates from the instability of the natural, helicoidal symmetry of the system, which generates both longitudinal and transverse stresses, thereby leading to buckling of the ribbon. Here, we focus on the tessellation patterns made of triangular facets. Our experimental observations are described within an "asymptotic isometry" approach that brings together geometry and elasticity. The geometry consists of parametrized families of surfaces, isometric to the undeformed ribbon in the singular limit of vanishing thickness and tensile load. The energy, whose minimization selects the favored structure among those families, is governed by the tensile work and bending cost of the pattern. This framework describes the coexistence lines in a morphological phase diagram, and determines the domain of existence of faceted structures.

Pulsatile release of biomolecules from polydimethylsiloxane (PDMS) chips with hydrolytically degradable seals.

PubMed

Intra, Janjira; Glasgow, Justin M; Mai, Hoang Q; Salem, Aliasger K

2008-05-08

We demonstrate, for the first time, a robust novel polydimethylsiloxane (PDMS) chip that can provide controlled pulsatile release of DNA based molecules, proteins and oligonucleotides without external stimuli or triggers. The PDMS chip with arrays of wells was constructed by replica molding. Poly(lactic acid-co-glycolic acid) (PLGA) polymer films of varying composition and thickness were used as seals to the wells. The composition, molecular weight and thickness of the PLGA films were all parameters used to control the degradation rate of the seals and therefore the release profiles. Degradation of the films followed the PLGA composition order of 50:50 PLGA>75:25 PLGA>85:15 PLGA at all time-points beyond week 1. Scanning electron microscopy images showed that films were initially smooth, became porous and ruptured as the osmotic pressure pushed the degrading PLGA film outwards. Pulsatile release of DNA was controlled by the composition and thickness of the PLGA used to seal the well. Transfection experiments in a model Human Embryonic Kidney 293 (HEK293) cell line showed that plasmid DNA loaded in the wells was functional after pulsatile release in comparison to control plasmid DNA at all time-points. Thicker films degraded faster than thinner films and could be used to fine-tune the release of DNA over day length periods. Finally the PDMS chip was shown to provide repeated sequential release of CpG oligonucleotides and a model antigen, Ovalbumin (OVA), indicating significant potential for this device for vaccinations or applications that require defined complex release patterns of a variety of chemicals, drugs and biomolecules.

276 nm Substrate-Free Flip-Chip AlGaN Light-Emitting Diodes

NASA Astrophysics Data System (ADS)

Hwang, Seongmo; Morgan, Daniel; Kesler, Amanda; Lachab, Mohamed; Zhang, Bin; Heidari, Ahmad; Nazir, Haseeb; Ahmad, Iftikhar; Dion, Joe; Fareed, Qhalid; Adivarahan, Vinod; Islam, Monirul; Khan, Asif

2011-03-01

Lateral-conduction, substrate-free flip-chip (SFFC) light-emitting diodes (LEDs) with peak emission at 276 nm are demonstrated for the first time. The AlGaN multiple quantum well LED structures were grown by metal-organic chemical vapor deposition (MOCVD) on thick-AlN laterally overgrown on sapphire substrates. To fabricate the SFFC LEDs, a newly-developed laser-assisted ablation process was employed to separate the substrate from the LED chips. The chips had physical dimensions of 1100×900 µm2, and were comprised of four devices each with a 100×100 µm2 junction area. Electrical and optical characterization of the devices revealed no noticeable degradation to their performance due to the laser-lift-off process.

An interactive NASTRAN preprocessor. [graphic display of undeformed structure using CDC 6000 series computer

NASA Technical Reports Server (NTRS)

Smith, W. W.

1973-01-01

A Langley Research Center version of NASTRAN Level 15.1.0 designed to provide the analyst with an added tool for debugging massive NASTRAN input data is described. The program checks all NASTRAN input data cards and displays on a CRT the graphic representation of the undeformed structure. In addition, the program permits the display and alteration of input data and allows reexecution without physically resubmitting the job. Core requirements on the CDC 6000 computer are approximately 77,000 octal words of central memory.

Ignition propagation and heat effects of propellant chips embedded in castable inhibitor using a laser flux test bomb

NASA Technical Reports Server (NTRS)

Bolton, Douglas E., Jr.

1993-01-01

A castable inhibitor is applied to the aft face of the Space Shuttle Redesigned Solid Rocket Motor (RSRM) forward segment propellant grain to control propellant surface burn area. During fabrication, the propellant surface is trimmed prior to the inhibitor application. This produces a potential for small propellant chips to remain undetected on the propellant surface and contaminate the inhibitor during application. The concern was that undetected propellant chips in the inhibitor might provide a fuse path for premature propellant ignition underneath the inhibitor. To evaluate the fuse path potential, testing was performed on inhibitor samples with embedded propellant. The internal motor environment was simulated with a calibrated CO2 laser beam directed onto a sample which was placed in a 4100 kPa (600 psi) nitrogen pressurized bomb (laser bomb). The testing showed definitive results pertaining to fuse path formation. Embedded propellant chips did not autoignite until the receding heat affected inhibitor surface reached, or passed, the propellant chip. Samples with embedded propellant chips in alignment did not propagate ignition from one chip to another with separation distances as small as 0.010 cm(0.004 inc) and some as little as 0.0051 cm (0.002 in). Propellant chips with volumes approximately less than 0.025 cu cm (0.0015 cu in) (which did not propagate ignition) did not increase the inhibitor material decomposition depth more than the resulting void cavity of the burned out propellant chip. In addition, the depth of this void cavity did not increase until it was overtaken by the surrounding material decomposition depth. This was due, in part, to the retention of the protective inhibitor char layer. Samples with embedded propellant strings, whose thicknesses were below 0.023 cm (0.009 in), did not propagate ignition. Propellant string thicknesses above 0.038 cm (0.015 in) did propagate ignition. Test sample char and heat affected layer measurements and observations compared well with those from the Space Shuttle Solid Rocket Motor (SRM) Technical Evaluation Motor no. 9(TEM-9).

Stress analysis of ultra-thin silicon chip-on-foil electronic assembly under bending

NASA Astrophysics Data System (ADS)

Wacker, Nicoleta; Richter, Harald; Hoang, Tu; Gazdzicki, Pawel; Schulze, Mathias; Angelopoulos, Evangelos A.; Hassan, Mahadi-Ul; Burghartz, Joachim N.

2014-09-01

In this paper we investigate the bending-induced uniaxial stress at the top of ultra-thin (thickness \\leqslant 20 μm) single-crystal silicon (Si) chips adhesively attached with the aid of an epoxy glue to soft polymeric substrate through combined theoretical and experimental methods. Stress is first determined analytically and numerically using dedicated models. The theoretical results are validated experimentally through piezoresistive measurements performed on complementary metal-oxide-semiconductor (CMOS) transistors built on specially designed chips, and through micro-Raman spectroscopy investigation. Stress analysis of strained ultra-thin chips with CMOS circuitry is crucial, not only for the accurate evaluation of the piezoresistive behavior of the built-in devices and circuits, but also for reliability and deformability analysis. The results reveal an uneven bending-induced stress distribution at the top of the Si-chip that decreases from the central area towards the chip's edges along the bending direction, and increases towards the other edges. Near these edges, stress can reach very high values, facilitating the emergence of cracks causing ultimate chip failure.

Effect of core thickness differences on post-fatigue indentation fracture resistance of veneered zirconia crowns.

PubMed

Alhasanyah, Abdulrahman; Vaidyanathan, Tritala K; Flinton, Robert J

2013-07-01

Despite the excellent esthetics of veneered zirconia crowns, the incidence of chipping and fracture of veneer porcelain on zirconia crowns has been recognized to be higher than in metal ceramic crowns. The objective of this investigation was to study the effect of selected variations in core thickness on the post-fatigue fracture resistance of veneer porcelain on zirconia crowns. Zirconia crowns for veneering were prepared with three thickness designs of (a) uniform 0.6-mm thick core (group A), (b) extra-thick 1.7 mm occlusal core support (group B), and (c) uniform 1.2-mm thick core (group C). The copings were virtually designed and milled by the CAD/CAM technique. Metal ceramic copings (group D) with the same design as in group C were used as controls. A sample size of N = 20 was used for each group. The copings were veneered with compatible porcelain and fatigue tested under a sinusoidal loading regimen. Loading was done with a 200 N maximum force amplitude under Hertzian axial loading conditions at the center of the crowns using a spherical tungsten carbide indenter. After 100,000 fatigue cycles, the crowns were axially loaded to fracture and maximum load levels before fracture was recorded. One-way ANOVA (P < 0.05) and post hoc Tukey tests (α = 0.05) were used to determine significant differences between means. The mean fracture failure load of group B was not significantly different from that of control group D. In contrast, the mean failure loads of groups A and C were significantly lower than that of control group D. Failure patterns also indicated distinct differences in failure mode distributions. The results suggest that proper occlusal core support improves veneer chipping fracture resistance in zirconia crowns. Extra-thick occlusal core support for porcelain veneer may significantly reduce the veneer chipping and fracture of zirconia crowns. This is suggested as an important consideration in the design of copings for zirconia crowns. © 2013 by the American College of Prosthodontists.

Investigation of electromigration behavior in lead-free flip chip solder bumps

NASA Astrophysics Data System (ADS)

Kalkundri, Kaustubh Jayant

Packaging technology has also evolved over time in an effort to keep pace with the demanding requirements. Wirebond and flip chip packaging technologies have become extremely versatile and ubiquitous in catering to myriad applications due to their inherent potential. This research is restricted strictly to flip chip technology. This technology incorporates a process in which the bare chip is turned upside down, i.e., active face down, and is bonded through the I/O to the substrate, hence called flip chip. A solder interconnect that provides electrical connection between the chip and substrate is bumped on a processed silicon wafer prior to dicing for die-attach. The assembly is then reflow-soldered followed by the underfill process to provide the required encapsulation. The demand for smaller and lighter products has increased the number of I/Os without increasing the package sizes, thereby drastically reducing the size of the flip chip solder bumps and their pitch. Reliability assessment and verification of these devices has gained tremendous importance due to their shrinking size. To add to the complexity, changing material sets that are results of recently enacted lead-free solder legislations have raised some compatibility issues that are already being researched. In addition to materials and process related flip chip challenges such as solder-flux compatibility, Coefficient of Thermal Expansion (CTE) mismatch, underfill-flux compatibility and thermal management, flip chip packages are vulnerable to a comparatively newer challenge, namely electromigration observed in solder bumps. It is interesting to note that electromigration has come to the forefront of challenges only recently. It has been exacerbated by the reduction in bump cross-section due to the seemingly continuous shrinking in package size over time. The focus of this research was to understand the overall electromigration behavior in lead-free (SnAg) flip chip solder bumps. The objectives of the research were to comprehend the physics of failure mechanism in electromigration for lead-free solder bumps assembled in a flip chip ceramic package having thick copper under bump metallization and to estimate the unknown critical material parameters from Black's equation that describe failure due to electromigration. In addition, the intent was to verify the 'use condition reliability' by extrapolation from experimental conditions. The methodology adopted for this research was comprised of accelerated electromigration tests on SnAg flip chip solder bumps assembled on ceramic substrate with a thick copper under bump metallization. The experimental approach was comprised of elaborate measurement of the temperature of each sample by separate metallization resistance exhibiting positive resistance characteristics to overcome the variation in Joule heating. After conducting the constant current experiments and analyzing the failed samples, it was found that the primary electromigration failure mode observed was the dissolution of the thick copper under bump metallization in the solder, leading to a change in resistance. The lifetime data obtained from different experiments was solved simultaneously using a multiple regression approach to yield the unknown Black's equation parameters of current density exponent and activation energy. In addition to the implementation of a systematic failure analysis and data analysis procedure, it was also deduced that thermomigration due to the temperature gradient across the chip does impact the overall electromigration behavior. This research and the obtained results were significant in bridging the gap for an overall understanding of this critical failure mode observed in flip chip solder bumps. The measurement of each individual sample temperature instead of an average temperature enabled an accurate analysis for predicting the 'use condition reliability' of a comparable product. The obtained results and the conclusions can be used as potential inputs in future designs and newer generations of flip chip devices that might undergo aggressive scaling. This will enable these devices to retain their functionality during their intended useful life with minimal threat of failure due to the potent issue of electromigration. (Abstract shortened by UMI.)

Microfluidic devices with thick-film electrochemical detection

DOEpatents

Wang, Joseph; Tian, Baomin; Sahlin, Eskil

2005-04-12

An apparatus for conducting a microfluidic process and analysis, including at least one elongated microfluidic channel, fluidic transport means for transport of fluids through the microfluidic channel, and at least one thick-film electrode in fluidic connection with the outlet end of the microfluidic channel. The present invention includes an integrated on-chip combination reaction, separation and thick-film electrochemical detection microsystem, for use in detection of a wide range of analytes, and methods for the use thereof.

High reliability bond program using small diameter aluminum wire

NASA Technical Reports Server (NTRS)

Macha, M.; Thiel, R. A.

1975-01-01

The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.

Designing an Electronics Data Package for Printed Circuit Boards (PCBs)

DTIC Science & Technology

2013-08-01

finished PCB flatness deviation should be less than 0.010 inches per inch. 4  The minimum copper wall thickness of plated-thru holes should be...Memory Card International Association)  IPC-6015 MCM-L (Multi-Chip Module – Laminated )  IPC-6016 HDI (High Density Interconnect)  IPC-6018...Interconnect ICT In Circuit Tester IPC Association Connecting Electronics Industries MCM-L Multi-Chip Module – Laminated MIL Military NEMA National

Moisture content of southern pine as related to thrust, torque, and chip formation in boring

Treesearch

Charles W. McMillin; George E. Woodson

1972-01-01

Holes 3-1/2 inches deep were bored with a 1-inch spur machine bit in southern pine having specific gravity of 0.53 (ovendry weight and volume at 10.4 percent moisture). The bit was rotated at 2,4000 rpm and removed chips 0.020 inch thick. For wood mositure contents ranging from ovendry to saturation, thrust was lower when boring along the grain (Average 98 pounds)...

Turbulent heat transfer as a control of platelet ice growth in supercooled under-ice ocean boundary layers

NASA Astrophysics Data System (ADS)

McPhee, Miles G.; Stevens, Craig L.; Smith, Inga J.; Robinson, Natalie J.

2016-04-01

Late winter measurements of turbulent quantities in tidally modulated flow under land-fast sea ice near the Erebus Glacier Tongue, McMurdo Sound, Antarctica, identified processes that influence growth at the interface of an ice surface in contact with supercooled seawater. The data show that turbulent heat exchange at the ocean-ice boundary is characterized by the product of friction velocity and (negative) water temperature departure from freezing, analogous to similar results for moderate melting rates in seawater above freezing. Platelet ice growth appears to increase the hydraulic roughness (drag) of fast ice compared with undeformed fast ice without platelets. Platelet growth in supercooled water under thick ice appears to be rate-limited by turbulent heat transfer and that this is a significant factor to be considered in mass transfer at the underside of ice shelves and sea ice in the vicinity of ice shelves.

Correlation studies of passive and active microwave data in the marginal ice zone

NASA Technical Reports Server (NTRS)

Comiso, J. C.

1991-01-01

The microwave radiative and backscatter characteristics of sea ice in an Arctic marginal ice zone have been studied using near-simultaneous passive and active synthetic aperture radar microwave data. Intermediate-resolution multichannel passive microwave data were registered and analyzed. Passive and active microwave data generally complement each other as the two sensors are especially sensitive to different physical properties of the sea ice. In the inner pack, undeformed first-year ice is observed to have low backscatter values but high brightness temperatures while multiyear ice has generally high backscatter values and low brightness temperatures. However, in the marginal ice zone, the signature and backscatter for multiyear ice are considerably different and closer to those of first-year ice. Some floes identified by photography as snow-covered thick ice have backscatter similar to that of new ice or open water while brash ice has backscatter similar to or higher than that of ridged ice.

Graphene-based microfluidics for serial crystallography.

PubMed

Sui, Shuo; Wang, Yuxi; Kolewe, Kristopher W; Srajer, Vukica; Henning, Robert; Schiffman, Jessica D; Dimitrakopoulos, Christos; Perry, Sarah L

2016-08-02

Microfluidic strategies to enable the growth and subsequent serial crystallographic analysis of micro-crystals have the potential to facilitate both structural characterization and dynamic structural studies of protein targets that have been resistant to single-crystal strategies. However, adapting microfluidic crystallization platforms for micro-crystallography requires a dramatic decrease in the overall device thickness. We report a robust strategy for the straightforward incorporation of single-layer graphene into ultra-thin microfluidic devices. This architecture allows for a total material thickness of only ∼1 μm, facilitating on-chip X-ray diffraction analysis while creating a sample environment that is stable against significant water loss over several weeks. We demonstrate excellent signal-to-noise in our X-ray diffraction measurements using a 1.5 μs polychromatic X-ray exposure, and validate our approach via on-chip structure determination using hen egg white lysozyme (HEWL) as a model system. Although this work is focused on the use of graphene for protein crystallography, we anticipate that this technology should find utility in a wide range of both X-ray and other lab on a chip applications.

Suitability of shredded tyres as a substitute for a landfill leachate collection medium.

PubMed

Park, Jae K; Edil, Tuncer B; Kim, Jae Y; Huh, Mock; Lee, Sung Ho; Lee, Jung Jun

2003-06-01

A series of tests were conducted to investigate the fate of heavy metals and gasoline components in a simulated landfill, consisting of a 30 cm thick clay liner and a leachate collection layer containing tyres as well as in two test cells installed in a landfill. Arsenic, selenium, mercury, barium, and lead concentrations were lower while zinc concentration was higher in the tank containing tyre-chips than the tank without tyre-chips. When samples were filtered, however, concentrations of zinc as well as other inorganics were lower in the tank containing tyre-chips, indicating that metals in the leachate exposed to tyre-chips travel more slowly in a subsurface environment due to filtering effect. In a test cell study, arsenic, cobalt, lead and nickel concentrations were lower in the cell containing tyre-chips than in the cell without tyre-chips, except iron and zinc. Both tests indicate that some inorganic contaminants are sorbed to tyre-chips. Gasoline components were also significantly sorbed by tyre-chips in field cell tests. Although tyre-chips are known to leach organic and inorganic contaminants, concentrations in field conditions will be lower than the reported experimental results since the tests were performed under worst-case scenarios. If tyre-chips are used in areas where contamination levels are high, then they can be used as a sorbent for environmental clean-up.

How chip size impacts steam pretreatment effectiveness for biological conversion of poplar wood into fermentable sugars

DOE Office of Scientific and Technical Information (OSTI.GOV)

DeMartini, Jaclyn D.; Foston, Marcus; Meng, Xianzhi

We report that woody biomass is highly recalcitrant to enzymatic sugar release and often requires significant size reduction and severe pretreatments to achieve economically viable sugar yields in biological production of sustainable fuels and chemicals. However, because mechanical size reduction of woody biomass can consume significant amounts of energy, it is desirable to minimize size reduction and instead pretreat larger wood chips prior to biological conversion. To date, however, most laboratory research has been performed on materials that are significantly smaller than applicable in a commercial setting. As a result, there is a limited understanding of the effects that largermore » biomass particle size has on the effectiveness of steam explosion pretreatment and subsequent enzymatic hydrolysis of wood chips. To address these concerns, novel downscaled analysis and high throughput pretreatment and hydrolysis (HTPH) were applied to examine whether differences exist in the composition and digestibility within a single pretreated wood chip due to heterogeneous pretreatment across its thickness. Heat transfer modeling, Simons’ stain testing, magnetic resonance imaging (MRI), and scanning electron microscopy (SEM) were applied to probe the effects of pretreatment within and between pretreated wood samples to shed light on potential causes of variation, pointing to enzyme accessibility (i.e., pore size) distribution being a key factor dictating enzyme digestibility in these samples. Application of these techniques demonstrated that the effectiveness of pretreatment of Populus tremuloides can vary substantially over the chip thickness at short pretreatment times, resulting in spatial digestibility effects and overall lower sugar yields in subsequent enzymatic hydrolysis. Finally, these results indicate that rapid decompression pretreatments (e.g., steam explosion) that specifically alter accessibility at lower temperature conditions are well suited for larger wood chips due to the non-uniformity in temperature and digestibility profiles that can result from high temperature and short pretreatment times. Furthermore, this study also demonstrated that wood chips were hydrated primarily through the natural pore structure during pretreatment, suggesting that preserving the natural grain and transport systems in wood during storage and chipping processes could likely promote pretreatment efficacy and uniformity.« less

How chip size impacts steam pretreatment effectiveness for biological conversion of poplar wood into fermentable sugars

DOE PAGES

DeMartini, Jaclyn D.; Foston, Marcus; Meng, Xianzhi; ...

2015-12-09

We report that woody biomass is highly recalcitrant to enzymatic sugar release and often requires significant size reduction and severe pretreatments to achieve economically viable sugar yields in biological production of sustainable fuels and chemicals. However, because mechanical size reduction of woody biomass can consume significant amounts of energy, it is desirable to minimize size reduction and instead pretreat larger wood chips prior to biological conversion. To date, however, most laboratory research has been performed on materials that are significantly smaller than applicable in a commercial setting. As a result, there is a limited understanding of the effects that largermore » biomass particle size has on the effectiveness of steam explosion pretreatment and subsequent enzymatic hydrolysis of wood chips. To address these concerns, novel downscaled analysis and high throughput pretreatment and hydrolysis (HTPH) were applied to examine whether differences exist in the composition and digestibility within a single pretreated wood chip due to heterogeneous pretreatment across its thickness. Heat transfer modeling, Simons’ stain testing, magnetic resonance imaging (MRI), and scanning electron microscopy (SEM) were applied to probe the effects of pretreatment within and between pretreated wood samples to shed light on potential causes of variation, pointing to enzyme accessibility (i.e., pore size) distribution being a key factor dictating enzyme digestibility in these samples. Application of these techniques demonstrated that the effectiveness of pretreatment of Populus tremuloides can vary substantially over the chip thickness at short pretreatment times, resulting in spatial digestibility effects and overall lower sugar yields in subsequent enzymatic hydrolysis. Finally, these results indicate that rapid decompression pretreatments (e.g., steam explosion) that specifically alter accessibility at lower temperature conditions are well suited for larger wood chips due to the non-uniformity in temperature and digestibility profiles that can result from high temperature and short pretreatment times. Furthermore, this study also demonstrated that wood chips were hydrated primarily through the natural pore structure during pretreatment, suggesting that preserving the natural grain and transport systems in wood during storage and chipping processes could likely promote pretreatment efficacy and uniformity.« less

Thermal modeling and analysis of thin-walled structures in micro milling

NASA Astrophysics Data System (ADS)

Zhang, J. F.; Ma, Y. H.; Feng, C.; Tang, W.; Wang, S.

2017-11-01

The numerical analytical model has been developed to predict the thermal effect with respect to thin walled structures by micro-milling. In order to investigate the temperature distribution around micro-edge of cutter, it is necessary to considering the friction power, the shearing power, the shear area between the tool micro-edge and materials. Due to the micro-cutting area is more difficult to be measured accurately, the minimum chip thickness as one of critical factors is also introduced. Finite element-based simulation was employed by the Advantedge, which was determined from the machining of Ti-6Al-4V over a range of the uncut chip thicknesses. Results from the proposed model have been successfully accounted for the effects of thermal softening for material.

Handling Heavenly Jewels - 35 Years of Antarctic Meteorite Processing at Johnson Space Center

NASA Technical Reports Server (NTRS)

Satterwhite, C. E.; McBridge, K. M.; Harrington, R.; Schwarz, C. M.

2011-01-01

The ANSMET program began in 1976, and since that time more than 18,000 meteorites have been processed in the Meteorite Processing Lab at Johnson Space Center in Houston, TX[1]. The meteorites are collected and returned to JSC on a freezer truck and remain frozen until they are initially processed. Initial Processing of Meteorites: Initial processing involves drying the meteorites in a nitrogen glove box for 24 to 48 hours, photographing, measuring, weighing and writing a description of the interior and exterior. The meteorite is broken and a representative sample is sent to the Smithsonian Institution for classification. Newsletter & Requests: Once initial processing has been complete and the meteorites have been classified, the information is published in the Antarctic Meteorite Newsletter[2,3]. The newsletter is published twice yearly and is sent electronically to researchers around the world and is also available on line. Researchers are asked to fill out a request form and submit it to the Meteorite Working Group secretary. All sample requests will be reviewed by either the meteorite curator or the Meteorite Working Group de-pending on the type of meteorite and the research being conducted. Processing for Sample Requests: In the meteorite processing lab, meteorite samples are prepared several different ways. Most samples are prepared as chips obtained by use of stainless steel chisels in a chipping bowl or rock splitter. In special situations where a researcher needs a slab the meteorite samples can be bandsawed in a dry nitrogen glove box with a diamond blade, no liquids are ever introduced into the cabinet. The last type of sample preparation is thin/thick sections. The meteorite thin section lab at JSC can prepare standard 30-micron thin sections, thick sections of variable thickness (100 to 200 microns), or demountable sections using superglue. Information for researchers: It is important that re-searchers fill the sample request form completely, in order to make sure the meteorite is processed correctly[4]. Re-searchers should list any special requirements on the form, i.e. packaging of samples (poly vs. stainless), thick sections and thickness needed, superglue needed, interior chips, exterior chips, fusion crust, contamination issues, all concerns should be listed so processing can be done accurately and any concerns the researcher has can be addressed be-fore the meteorites are broken.

Optical interconnection for a polymeric PLC device using simple positional alignment.

PubMed

Ryu, Jin Hwa; Kim, Po Jin; Cho, Cheon Soo; Lee, El-Hang; Kim, Chang-Seok; Jeong, Myung Yung

2011-04-25

This study proposes a simple cost-effective method of optical interconnection between a planar lightwave circuit (PLC) device chip and an optical fiber. It was conducted to minimize and overcome the coupling loss caused by lateral offset which is due to the process tolerance and the dimensional limitation existing between PLC device chips and fiber array blocks with groove structures. A PLC device chip and a fiber array block were simultaneously fabricated in a series of polymer replication processes using the original master. The dimensions (i.e., width and thickness) of the under-clad of the PLC device chip were identical to those of the fiber array block. The PLC device chip and optical fiber were aligned by simple positional control for the vertical direction of the PLC device chip under a particular condition. The insertion loss of the proposed 1 x 2 multimode optical splitter device interconnection was 4.0 dB at 850 nm and the coupling loss was below 0.1 dB compared with single-fiber based active alignment.

Moisture content of southern pine as related to thrust, torque, and chip formation in boring

Treesearch

C. W. McMillin; G. E. Woodson

1972-01-01

Holes 3-1/2 inches deep were bored with a 1-inch spur machine bit in southern pine having specific gravity of 0.53 (ovendry weight and volume at 10.4 percent moisture). The bit was rotated at 2,400 rpm and removed chips 0.020 inch thick. For wood moisture contents ranging from ovendry to saturation, thrust was lower when boring along the grain (average 98 pounds) than...

Statistical metrology—measurement and modeling of variation for advanced process development and design rule generation

NASA Astrophysics Data System (ADS)

Boning, Duane S.; Chung, James E.

1998-11-01

Advanced process technology will require more detailed understanding and tighter control of variation in devices and interconnects. The purpose of statistical metrology is to provide methods to measure and characterize variation, to model systematic and random components of that variation, and to understand the impact of variation on both yield and performance of advanced circuits. Of particular concern are spatial or pattern-dependencies within individual chips; such systematic variation within the chip can have a much larger impact on performance than wafer-level random variation. Statistical metrology methods will play an important role in the creation of design rules for advanced technologies. For example, a key issue in multilayer interconnect is the uniformity of interlevel dielectric (ILD) thickness within the chip. For the case of ILD thickness, we describe phases of statistical metrology development and application to understanding and modeling thickness variation arising from chemical-mechanical polishing (CMP). These phases include screening experiments including design of test structures and test masks to gather electrical or optical data, techniques for statistical decomposition and analysis of the data, and approaches to calibrating empirical and physical variation models. These models can be integrated with circuit CAD tools to evaluate different process integration or design rule strategies. One focus for the generation of interconnect design rules are guidelines for the use of "dummy fill" or "metal fill" to improve the uniformity of underlying metal density and thus improve the uniformity of oxide thickness within the die. Trade-offs that can be evaluated via statistical metrology include the improvements to uniformity possible versus the effect of increased capacitance due to additional metal.

Anti-cancer activity of ZnO chips by sustained zinc ion release.

PubMed

Moon, Seong-Hee; Choi, Won Jin; Choi, Sik-Won; Kim, Eun Hye; Kim, Jiyeon; Lee, Jeong-O; Kim, Seong Hwan

2016-01-01

We report anti-cancer activity of ZnO thin-film-coated chips by sustained release of zinc ions. ZnO chips were fabricated by precisely tuning ZnO thickness using atomic layer deposition, and their potential to release zinc ions relative to the number of deposition cycles was evaluated. ZnO chips exhibited selective cytotoxicity in human B lymphocyte Raji cells while having no effect on human peripheral blood mononuclear cells. Of importance, the half-maximal inhibitory concentration of the ZnO chip on the viability of Raji cells was 121.5 cycles, which was comparable to 65.7 nM of daunorubicin, an anti-cancer drug for leukemia. Molecular analysis of cells treated with ZnO chips revealed that zinc ions released from the chips increased cellular levels of reactive oxygen species, including hydrogen peroxide, which led to the down-regulation of anti-apoptotic molecules (such as HIF-1α, survivin, cIAP-2, claspin, p-53, and XIAP) and caspase-dependent apoptosis. Because the anti-cancer activity of ZnO chips and the mode of action were comparable to those of daunorubicin, the development and optimization of ZnO chips that gradually release zinc ions might have clinical anti-cancer potential. A further understanding of the biological action of ZnO-related products is crucial for designing safe biomaterials with applications in disease treatment.

Biodegradable scaffold with built-in vasculature for organ-on-a-chip engineering and direct surgical anastomosis.

PubMed

Zhang, Boyang; Montgomery, Miles; Chamberlain, M Dean; Ogawa, Shinichiro; Korolj, Anastasia; Pahnke, Aric; Wells, Laura A; Massé, Stéphane; Kim, Jihye; Reis, Lewis; Momen, Abdul; Nunes, Sara S; Wheeler, Aaron R; Nanthakumar, Kumaraswamy; Keller, Gordon; Sefton, Michael V; Radisic, Milica

2016-06-01

We report the fabrication of a scaffold (hereafter referred to as AngioChip) that supports the assembly of parenchymal cells on a mechanically tunable matrix surrounding a perfusable, branched, three-dimensional microchannel network coated with endothelial cells. The design of AngioChip decouples the material choices for the engineered vessel network and for cell seeding in the parenchyma, enabling extensive remodelling while maintaining an open-vessel lumen. The incorporation of nanopores and micro-holes in the vessel walls enhances permeability, and permits intercellular crosstalk and extravasation of monocytes and endothelial cells on biomolecular stimulation. We also show that vascularized hepatic tissues and cardiac tissues engineered by using AngioChips process clinically relevant drugs delivered through the vasculature, and that millimetre-thick cardiac tissues can be engineered in a scalable manner. Moreover, we demonstrate that AngioChip cardiac tissues implanted with direct surgical anastomosis to the femoral vessels of rat hindlimbs establish immediate blood perfusion.

Comminution process to produce precision wood particles of uniform size and shape with disrupted grain structure from wood chips

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dooley, James H; Lanning, David N

A process of comminution of wood chips (C) having a grain direction to produce a mixture of wood particles (P), wherein the wood chips are characterized by an average length dimension (L.sub.C) as measured substantially parallel to the grain, an average width dimension (W.sub.C) as measured normal to L.sub.C and aligned cross grain, and an average height dimension (H.sub.C) as measured normal to W.sub.C and L.sub.C, and wherein the comminution process comprises the step of feeding the wood chips in a direction of travel substantially randomly to the grain direction through a counter rotating pair of intermeshing arrays of cuttingmore » discs (D) arrayed axially perpendicular to the direction of wood chip travel, wherein the cutting discs have a uniform thickness (T.sub.D), and wherein at least one of L.sub.C, W.sub.C, and H.sub.C is greater than T.sub.D.« less

Biodegradable scaffold with built-in vasculature for organ-on-a-chip engineering and direct surgical anastomosis

NASA Astrophysics Data System (ADS)

Zhang, Boyang; Montgomery, Miles; Chamberlain, M. Dean; Ogawa, Shinichiro; Korolj, Anastasia; Pahnke, Aric; Wells, Laura A.; Massé, Stéphane; Kim, Jihye; Reis, Lewis; Momen, Abdul; Nunes, Sara S.; Wheeler, Aaron R.; Nanthakumar, Kumaraswamy; Keller, Gordon; Sefton, Michael V.; Radisic, Milica

2016-06-01

We report the fabrication of a scaffold (hereafter referred to as AngioChip) that supports the assembly of parenchymal cells on a mechanically tunable matrix surrounding a perfusable, branched, three-dimensional microchannel network coated with endothelial cells. The design of AngioChip decouples the material choices for the engineered vessel network and for cell seeding in the parenchyma, enabling extensive remodelling while maintaining an open-vessel lumen. The incorporation of nanopores and micro-holes in the vessel walls enhances permeability, and permits intercellular crosstalk and extravasation of monocytes and endothelial cells on biomolecular stimulation. We also show that vascularized hepatic tissues and cardiac tissues engineered by using AngioChips process clinically relevant drugs delivered through the vasculature, and that millimetre-thick cardiac tissues can be engineered in a scalable manner. Moreover, we demonstrate that AngioChip cardiac tissues implanted with direct surgical anastomosis to the femoral vessels of rat hindlimbs establish immediate blood perfusion.

Numerical modelling of the formation of fibrous bedding-parallel veins

NASA Astrophysics Data System (ADS)

Torremans, Koen; Muchez, Philippe; Sintubin, Manuel

2014-05-01

Bedding-parallel veins with a fibrous infill oriented orthogonal to the vein wall, are often observed in fine-grained metasedimentary sequences. Several mechanisms have been proposed for their formation, mostly with respect to effects of fluid overpressures and anisotropy of the host-rock fabric in order to explain the inferred extensional failure with sub-vertical opening. Abundant pre-folding, bedding-parallel fibrous dolomite veins are found associated with the Nkana-Mindola stratiform Cu-Co deposit in Zambia. The goal of this study is to better understand the formation mechanisms of these veins and to explain their particular spatial and thickness distribution, with respect to failure of transversely isotropic rocks. The spatial distribution and thickness variation of these veins was quantified during a field campaign in thirteen line transects perpendicular to undeformed veins in underground crosscuts. The fibrous dolomite veins studied are not related to lithological contrasts, but to a strong bedding-parallel shaly fabric, typical for the black shale facies of the Copperbelt Orebody Member. The host rock can hence be considered as transversely isotropic. Growth morphologies vary from antitaxial with a pronounced median surface to asymmetric syntaxial, always with small but quantifiable growth competition. A microstructural fabric study reveals that the undeformed dolomite veins show low-tortuosity vein walls and quantifiable growth competition. Here, we use a Discrete Element Method numerical modelling approach with ESyS-Particle (http://launchpad.net/esys-particle) to simulate the observed properties of the veins. Calibrated numerical specimens with a transversely isotropic matrix are repeatedly brought to failure under constant strain rates by changing the effective strain rates at model boundaries. After each fracture event, fractures in the numerical model are filled with cohesive vein material and the experiment is repeated. By systematically varying stress states, fluid pressures and mechanical properties of materials (host rock, vein infill and interface), we attempt to reproduce the characteristics of spatial distribution and thickness variation of the veins. Four parameter sets of mechanical micro-properties are defined in the models, essentially yielding (1) a competent and (2) incompetent matrix, (3) a vein material and (4) a vein-matrix interface. Each combination of parameters and particle packings is calibrated to fit a predetermined Mohr-Coulomb type failure envelope, via an automated calibration procedure. Preliminary tests already show that by varying these parameters, we are able to simulate realistically distributed cracking through crack-seal processes. Different types of veins and vein generations can be modelled, ranging from single veins, over crack-seal veins to anastomosing veins, by varying the mechanical strength of competent and incompetent matrix, vein and interface material. Further results of this approach will be presented. We will discuss our results with respect to mechanisms proposed in the literature for bedding-parallel, fibrous veins in metasedimentary rock sequences.

The Effects of Channel Curvature and Protrusion Height on Nucleate Boiling and the Critical Heat Flux of a Simulated Electronic Chip

DTIC Science & Technology

1994-05-01

parameters and geometry factor. 57 3.2 Laminar sublayer and buffer layer thicknesses for geometry of Mudawar and Maddox.ŝ 68 3.3 Correlation constants...transfer from simulated electronic chip heat sources that are flush with the flow channel wall. Mudawar and Maddox2" have studied enhanced surfaces...bias error was not estimated; however, the percentage of heat loss measured compares with that previously reported by Mudawar and Maddox19 for a

Chip-scale pattern modification method for equalizing residual layer thickness in nanoimprint lithography

NASA Astrophysics Data System (ADS)

Youn, Sung-Won; Suzuki, Kenta; Hiroshima, Hiroshi

2018-06-01

A software program for modifying a mold design to obtain a uniform residual layer thickness (RLT) distribution has been developed and its validity was verified by UV-nanoimprint lithography (UV-NIL) simulation. First, the effects of granularity (G) on both residual layer uniformity and filling characteristics were characterized. For a constant complementary pattern depth and a granularity that was sufficiently larger than the minimum pattern width, filling time decreased with the decrease in granularity. For a pattern design with a wide density range and an irregular distribution, the choice of a small granularity was not always a good strategy since the etching depth required for a complementary pattern occasionally exceptionally increased with the decrease in granularity. On basis of the results obtained, the automated method was applied to a chip-scale pattern modification. Simulation results showed a marked improvement in residual layer thickness uniformity for a capacity-equalized (CE) mold. For the given conditions, the standard deviation of RLT decreased in the range from 1/3 to 1/5 in accordance with pattern designs.

Wet-preserved hemp fibreboard properties improvement with veneering

NASA Astrophysics Data System (ADS)

Kirilovs, E.; Kukle, S.; Gusovius, H.-J.

2015-03-01

The initial research describes a new type of fiber boards for the furniture interior design, developed in cooperation with ATB (Leibniz-Institute for Agricultural Engineering) by using a new method of raw materials preparation and specific production technologies of ATB. The main raw materials are aerobically aged hemp stalks. The samples are made of hemp chips with a long preservation time and fastened together with the UF glue. Specimens are 8 mm thick and correspond to a medium-density fiberboard, fitting standard EN622. Due to the fact that non-veneered material can be used only in non-load-bearing constructions, material improving technologies were studied, such as increase of board density, increase of glue percentage, partially substitution of wet-preserved hemp chips with a dry hemp and/or wooden chips to equalize moisture content of obtained mixture. The particular article describes how the new material is veneered with the oak veneer obtaining three-ply composite board with the improved mechanical properties that allows to use these boards in a load-bearing constructions. Tests are performed with the veneered material to determine such parameters as static bending strength (MOR), modulus of elasticity in static bending (MOE), swelling in thickness and hardness.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Economy, David Ross; Mara, Nathan A.; Schoeppner, R.

In complex loading conditions (e.g. sliding contact), mechanical properties, such as strain hardening and initial hardness, will dictate the long-term performance of materials systems. With this in mind, the strain hardening behaviors of Cu/Nb nanoscale metallic multilayer systems were examined by performing nanoindentation tests within nanoscratch wear boxes and undeformed, as-deposited regions. Both the architecture and substrate influence were examined by utilizing three different individual layer thicknesses (2, 20, and 100 nm) and two total film thicknesses (1 and 10 μm). After nano-wear deformation, multilayer systems with thinner layers showed less volume loss as measured by laser scanning microscopy. Additionally,more » the hardness of the deformed regions significantly rose with respect to the as-deposited measurements, which further increased with greater wear loads. Strain hardening exponents for multilayers with thinner layers (2 and 20 nm, n ≈ 0.018 and n ≈ 0.022 respectively) were less than was determined for 100 nm systems (n ≈ 0.041). These results suggest that singledislocation based deformation mechanisms observed for the thinner systems limit the extent of achievable strain hardening. This conclusion indicates that impacts of both architecture strengthening and strain hardening must be considered to accurately predict multilayer performance during sliding contact across varying length scales.« less

Identifying Deformation and Strain Hardening Behaviors of Nanoscale Metallic Multilayers Through Nano-wear Testing

DOE PAGES

Economy, David Ross; Mara, Nathan A.; Schoeppner, R.; ...

2016-01-13

In complex loading conditions (e.g. sliding contact), mechanical properties, such as strain hardening and initial hardness, will dictate the long-term performance of materials systems. With this in mind, the strain hardening behaviors of Cu/Nb nanoscale metallic multilayer systems were examined by performing nanoindentation tests within nanoscratch wear boxes and undeformed, as-deposited regions. Both the architecture and substrate influence were examined by utilizing three different individual layer thicknesses (2, 20, and 100 nm) and two total film thicknesses (1 and 10 μm). After nano-wear deformation, multilayer systems with thinner layers showed less volume loss as measured by laser scanning microscopy. Additionally,more » the hardness of the deformed regions significantly rose with respect to the as-deposited measurements, which further increased with greater wear loads. Strain hardening exponents for multilayers with thinner layers (2 and 20 nm, n ≈ 0.018 and n ≈ 0.022 respectively) were less than was determined for 100 nm systems (n ≈ 0.041). These results suggest that singledislocation based deformation mechanisms observed for the thinner systems limit the extent of achievable strain hardening. This conclusion indicates that impacts of both architecture strengthening and strain hardening must be considered to accurately predict multilayer performance during sliding contact across varying length scales.« less

Progress on TSV technology for Medipix3RX chip

NASA Astrophysics Data System (ADS)

Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.

2017-12-01

The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together with Si based sensors for X-ray detection. The 3D integration technology, including TSV, Re-distribution layer deposition, bump bonding to the Si sensor and bump bonding to the carrier PCB, was done by Fraunhofer Institute IZM in Berlin. After assembly, the module was successfully tested by recording background radiation and making X-ray images of small objects. The active area of the Medipix3RX chip is 14.1 mm×14.1 mm or 256×256 pixels. During TSV processing, the Medipix3RX chip was thinned from 775 μm original thickness, to 130 μm. The diameter of the vias is 40 μm, and the pitch between the vias is 120 μm. A liner filling approach was used to contact the TSV with the RDL on the backside of the Medipix3RX readout chip.

Stratigraphic and structural data for the Conasauga Group and the Rome Formation on the Copper Creek fault block near Oak Ridge, Tennessee: preliminary results from test borehole ORNL-JOY No. 2

DOE Office of Scientific and Technical Information (OSTI.GOV)

Haase, C.S.; Walls, E.C.; Farmer, C.D.

1985-06-01

To resolve long-standing problems with the stratigraphy of the Conasauga Group and the Rome Formation on the Copper Creek fault block near Oak Ridge National Laboratory (ORNL), an 828.5-m-deep test borehole was drilled. Continuous rock core was recovered from the 17.7- to 828.5-m-deep interval; temperature, caliper, neutron, gamma-ray, and acoustic (velocity and televiewer) logs were obtained. The Conasauga Group at the study site is 572.4 m thick and comprises six formations that are - in descending stratigraphic order - Maynardville Limestone (98.8 m), Nolichucky Shale (167.9 m), Maryville Limestone (141.1 m), Rogersville Shale (39.6 m), Rutledge Limestone (30.8 m), andmore » Pumpkin Valley Shale (94.2 m). The formations are lithologically complex, ranging from clastics that consist of shales, mudstones, and siltstones to carbonates that consist of micrites, wackestones, packstones, and conglomerates. The Rome Formation is 188.1 m thick and consists of variably bedded mudstones, siltstones, and sandstones. The Rome Formation thickness represents 88.1 m of relatively undeformed section and 100.0 m of highly deformed, jumbled, and partially repeated section. The bottom of the Rome Formation is marked by a tectonic disconformity that occurs within a 46-m-thick, intensely deformed interval caused by motion along the Copper Creek fault. Results from this study establish the stratigraphy and the lithology of the Conasauga Group and the Rome Formation near ORNL and, for the first time, allow for the unambiguous correlation of cores and geophysical logs from boreholes elsewhere in the ORNL vicinity. 45 refs., 26 figs., 2 tabs.« less

Contamination control in hybrid microelectronic modules. Part 2: Selection and evaluation of coating materials

NASA Technical Reports Server (NTRS)

Himmel, R. P.

1975-01-01

The selection, test, and evaluation of organic coating materials for contamination control in hybrid circuits is reported. The coatings were evaluated to determine their suitability for use as a conformal coating over the hybrid microcircuit (including chips and wire bonds) inside a hermetically sealed package. Evaluations included ease of coating application and repair and effect on thin film and thick film resistors, beam leads, wire bonds, transistor chips, and capacitor chips. The coatings were also tested for such properties as insulation resistance, voltage breakdown strength, and capability of immobilizing loose particles inside the packages. The selected coatings were found to be electrically, mechanically, and chemically compatible with all components and materials normally used in hybrid microcircuits.

Comparison of edge chipping resistance of PFM and veneered zirconia specimens

PubMed Central

Quinn, Janet B.; Sundar, Veeraraghavan; Parry, Edward E.; Quinn, George D.

2011-01-01

Objectives To investigate the chipping resistance of veneered zirconia specimens and compare it to the chipping resistance of porcelain fused to metal (PFM) specimens. Methods Veneered zirconia and PFM bar specimens were prepared in clinically relevant thicknesses. The specimen edges were chipped with different magnitude forces, producing chips of various sizes. The range of sizes included small chips that did not penetrate all the way through the veneers to the substrates, and also chips that were very large and reached the zirconia or metal substrates. The relationship between force magnitude and chip size (edge distance) was graphed. The resulting curves were compared for the veneered zirconia and PFM specimens. Knoop hardness vs. force graphs for the veneers and substrates were also obtained. Results The zirconia and PFM veneer chipping data followed a power law (coefficient of determination, R2 > 0.93) as expected from the literature. The curves overlapped within the combined data scatter, indicating similar resistance to chipping. The chips made in both types of specimens detached and did not penetrate into the substrate when they reached the veneer/substrate intersections. The hardness–load curves for the veneers and substrates all exhibited an indentation size effect (ISE) at low loads. The Knoop hardness values with uncertainties of ±one standard deviation at 4 N loads for the metal, zirconia, and the metal and zirconia veneers are: (2.02 ± 0.08, 12.01 ± 0.39, 4.24 ± 0.16 and 4.36 ± 0.02 GPa), respectively, with no statistically significant difference between the veneers (Tukey pairwise comparison at 0.95 family confidence). Significance This work indicates that a similar resistance to chipping might be expected for veneered zirconia and PFM restorations, in spite of the large difference in substrate hardness. Differences in susceptibility to chip spalling were not detected, but the chips in both specimen types detached off the sides in a similar manner instead of extending into the substrates. PMID:19748115

Analytical study of a microfludic DNA amplification chip using water cooling effect.

PubMed

Chen, Jyh Jian; Shen, Chia Ming; Ko, Yu Wei

2013-04-01

A novel continuous-flow polymerase chain reaction (PCR) chip has been analyzed in our work. Two temperature zones are controlled by two external controllers and the other temperature zone at the chip center is controlled by the flow rate of the fluid inside a channel under the glass chip. By employing a water cooling channel at the chip center, the sequence of denaturation, annealing, and extension can be created due to the forced convection effect. The required annealing temperature of PCR less than 313 K can also be demonstrated in this chip. The Poly(methyl methacrylate) (PMMA) cooling channel with the thin aluminum cover is utilized to enhance the temperature uniformity. The size of this chip is 76 mm × 26 mm × 3 mm. This device represents the first demonstration of water cooling thermocycling within continuous-flow PCR microfluidics. The commercial software CFD-ACE+(TM) is utilized to determine the distances between the heating assemblies within the chip. We investigate the influences of various chip materials, operational parameters of the cooling channel and geometric parameters of the chip on the temperature uniformity on the chip surface. Concerning the temperature uniformity of the working zones and the lowest temperature at the annealing zone, the air gap spacing of 1 mm and the cooling channel thicknesses of 1 mm of the PMMA channel with an aluminum cover are recommended in our design. The hydrophobic surface of the PDMS channel was modified by filling it with 20 % Tween 20 solution and then adding bovine serum albumin (BSA) solution to the PCR mixture. DNA fragments with different lengths (372 bp and 478 bp) are successfully amplified with the device.

Telecom meets terahertz

NASA Astrophysics Data System (ADS)

Nikitin, Alexey Y.

2018-01-01

Excitation and gate tuning of terahertz plasmons in dual-layer graphene integrated into on-chip telecom photonic waveguides using infrared lasers has now been demonstrated. This may open the door to atomically thick optoelectronic devices for security, tomography or data processing.

Application of Numerical Simulation for the Analysis of the Processes of Rotary Ultrasonic Drilling

NASA Astrophysics Data System (ADS)

Naď, Milan; Čičmancová, Lenka; Hajdu, Štefan

2016-12-01

Rotary ultrasonic machining (RUM) is a hybrid process that combines diamond grinding with ultrasonic machining. It is most suitable to machine hard brittle materials such as ceramics and composites. Due to its excellent machining performance, RUM is very often applied for drilling of hard machinable materials. In the final phase of drilling, the edge deterioration of the drilled hole can occur, which results in a phenomenon called edge chipping. During hole drilling, a change in the thickness of the bottom of the drilled hole occurs. Consequently, the bottom of the hole as a plate structure is exposed to the transfer through the resonance state. This resonance state can be considered as one of the important aspects leading to edge chipping. Effects of changes in the bottom thickness and as well as the fillet radius between the wall and bottom of the borehole on the stress-strain states during RUM are analyzed.

Microstructural characterization of Ti-6Al-4V metal chips by focused ion beam (FIB) and transmission electron microscopy (TEM)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schneider, Judy; Dong, Lei; Howe, Jane Y

2011-01-01

The microstructure of the secondary deformation zone (SDZ) near the cutting surface in metal chips of Ti-6Al-4V formed during machining was investigated using focused ion beam (FIB) specimen preparation and transmission electron microscopy (TEM) imaging. Use of the FIB allowed precise extraction of the specimen across this region to reveal its inhomogeneous microstructure resulting from the non-uniform distribution of strain, strain rate, and temperature generated during the cutting process. Initial imaging from conventional TEM foil preparation revealed microstructures ranging from heavily textured to regions of fine grains. Using FIB preparation, the transverse microstructure could be interpreted as fine grains nearmore » the cutting surface which transitioned to coarse grains toward the free surface. At the cutting surface a 10 nm thick recrystallized layer was observed capping a 20 nm thick amorphous layer.« less

Comminution process to produce precision wood particles of uniform size and shape with disrupted grain structure from wood chips

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dooley, James H.; Lanning, David N.

A process of comminution of wood chips (C) having a grain direction to produce a mixture of wood particles (P), wherein the wood chips are characterized by an average length dimension (L.sub.C) as measured substantially parallel to the grain, an average width dimension (W.sub.C) as measured normal to L.sub.C and aligned cross grain, and an average height dimension (H.sub.C) as measured normal to W.sub.C and L.sub.C, wherein W.sub.C>L.sub.C, and wherein the comminution process comprises the step of feeding the wood chips in a direction of travel substantially randomly to the grain direction through a counter rotating pair of intermeshing arraysmore » of cutting discs (D) arrayed axially perpendicular to the direction of wood chip travel, wherein the cutting discs have a uniform thickness (T.sub.D), and wherein at least one of L.sub.C, W.sub.C, and H.sub.C is less than T.sub.D.« less

Development of a Biosensor Nanofluidic Platform for Integration with Terahertz Spectroscopic System

DTIC Science & Technology

2014-06-27

space. The instrumentation for fabrication of micro/nano-fluidic chips including a Laser-Cutting System, a Sputtering system, a Spin Coating ...polyester (PET) substrate, as PET is more chemically and thermally resistant, and can be readily obtained in a variety of thicknesses down to 12.5 um...to create the array pattern on the silver coated PET substrate. Copper was then electrodeposited to a thickness of 5 um around the photoresist

Heterogeneously integrated microsystem-on-a-chip

DOEpatents

Chanchani, Rajen [Albuquerque, NM

2008-02-26

A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.

Chip-scale fluorescence microscope based on a silo-filter complementary metal-oxide semiconductor image sensor.

PubMed

Ah Lee, Seung; Ou, Xiaoze; Lee, J Eugene; Yang, Changhuei

2013-06-01

We demonstrate a silo-filter (SF) complementary metal-oxide semiconductor (CMOS) image sensor for a chip-scale fluorescence microscope. The extruded pixel design with metal walls between neighboring pixels guides fluorescence emission through the thick absorptive filter to the photodiode of a pixel. Our prototype device achieves 13 μm resolution over a wide field of view (4.8 mm × 4.4 mm). We demonstrate bright-field and fluorescence longitudinal imaging of living cells in a compact, low-cost configuration.

Listwaenite in the Sartohay ophiolitic mélange (Xinjiang, China): A genetic model based on petrology, U-Pb chronology and trace element geochemistry

NASA Astrophysics Data System (ADS)

Qiu, Tian; Zhu, Yongfeng

2018-03-01

Listwaenite lenses in the Sartohay ophiolitic mélange (Xinjiang, China) were formed via reactions between serpentinite and metasomatic fluids. First, serpentinite changed into talc schist via the reaction of serpentine + CO2 → talc + magnesite + H2O. Second, talc schist changed into listwaenite via the reaction of talc + CO2 → magnesite + quartz + H2O. Magnetite was progressively destroyed during transformation from serpentinite to talc schist, and completely consumed in listwaenite. Zircon crystals 30-100 μm long, disseminating in talc schist, undeformed listwaenite and mylonitized listwaenite, coexist with talc, quartz and magnesite, while micron-sized zircon grains (<5 μm in length) occur along the shearing foliation in the weakly deformed listwaenite and mylonitized listwaenite. We postulate that these micron-sized zircon crystals may have grown in-situ from medium-temperature hydrothermal fluids. Concentrations of most trace elements including high field strength elements (HFSE) increase from the undeformed, through the weakly deformed, to the mylonitized listwaenite, showing a positive correlation with the degrees of deformation and proportions of micron-size zircon, apatite, rutile and monazite. The large zircon crystals recovered from talc schist, undeformed listwaenite and mylonitized listwaenite yield similar weighted mean U-Pb ages (302.9 ± 6.8 Ma, 299.7 ± 5.5 Ma and 296.5 ± 3.5 Ma), and are thought to represent the age of formation of the talc schist and listwaenite. These ages are indistinguishable within errors and suggest a rapid transformation from talc schist to listwaenite. Some zircon rims in samples of the undeformed listwaenite and mylonitized listwaenite give much younger apparent U-Pb ages (280-277 Ma), which could be interpreted as a recrystallization age reflecting late-stage shearing in the Sartohay ophiolitic mélange.

Evidence for stable grain boundary melt films in experimentally deformed olivine-orthopyroxene rocks

NASA Astrophysics Data System (ADS)

de Kloe, R.; Drury, M. R.; van Roermund, H. L. M.

The microstructure of olivine-olivine grain boundaries has been studied in experimentally deformed (1200-1227°C, 300MPa) partially molten olivine and olivine-orthopyroxene rocks. In-situ melting produced 1vol% melt in all samples studied. Grain boundary analyses were carried out using a number of transmission electron microscopy techniques. The grain boundary chemistry in undeformed olivine-orthopyroxene starting material showed evidence for the presence of an intergranular phase along some, but not all, of the olivine-olivine boundaries. In the deformed samples, ultrathin Si-rich, Al- and Ca-bearing amorphous films have been observed along all investigated olivine-olivine grain boundaries. The chemistry of the grain boundaries, which is considered to be indicative for the presence of a thin film, was measured with energy-dispersive X-ray spectroscopy (EDX) and energy-filtering imaging. The amorphous nature of the films was confirmed with diffuse dark field imaging, Fresnel fringe imaging, and high-resolution electron microscopy. The films range in thickness from 0.6 to 3.0nm, and EDX analyses show that the presence of Al and Ca is restricted to this ultrathin film along the grain boundaries. Because thin melt films have been observed in all the samples, they are thought to be stable features of the melt microstructure in deformed partially molten rocks. The transition from the occasional presence of films in the undeformed starting material to the general occurrence of the films in deformed materials suggests that deformation promotes the formation and distribution of the films. Alternatively, hot-pressing may be too short for films to develop along all grain boundaries. A difference in creep strength between the studied samples could not be attributed to grain boundary melt films, as these have been found in all deformed samples. However, a weakening effect of grain boundary melt films on olivine rheology could not be ruled out due to the lack of confirmed melt-film free experiments.

Sheet on a deformable sphere: Wrinkle patterns suppress curvature-induced delamination

NASA Astrophysics Data System (ADS)

Hohlfeld, Evan; Davidovitch, Benny

2015-01-01

The adhesion of a stiff film onto a curved substrate often generates elastic stresses in the film that eventually give rise to its delamination. Here we predict that delamination of very thin films can be dramatically suppressed through tiny, smooth deformations of the substrate, dubbed here "wrinklogami," that barely affect the macro-scale topography. This "prolamination" effect reflects a surprising capability of smooth wrinkles to suppress compression in elastic films even when spherical or other doubly curved topography is imposed, in a similar fashion to origami folds that enable construction of curved structures from an unstretchable paper. We show that the emergence of a wrinklogami pattern signals a nontrivial isometry of the sheet to its planar, undeformed state, in the doubly asymptotic limit of small thickness and weak tensile load exerted by the adhesive substrate. We explain how such an "asymptotic isometry" concept broadens the standard usage of isometries for describing the response of elastic sheets to geometric constraints and mechanical loads.

Nonlinear equations of motion for the elastic bending and torsion of twisted nonuniform rotor blades

NASA Technical Reports Server (NTRS)

Hodges, D. H.; Dowell, E. H.

1974-01-01

The equations of motion are developed by two complementary methods, Hamilton's principle and the Newtonian method. The resulting equations are valid to second order for long, straight, slender, homogeneous, isotropic beams undergoing moderate displacements. The ordering scheme is based on the restriction that squares of the bending slopes, the torsion deformation, and the chord/radius and thickness/radius ratios are negligible with respect to unity. All remaining nonlinear terms are retained. The equations are valid for beams with mass centroid axis and area centroid (tension) axis offsets from the elastic axis, nonuniform mass and stiffness section properties, variable pretwist, and a small precone angle. The strain-displacement relations are developed from an exact transformation between the deformed and undeformed coordinate systems. These nonlinear relations form an important contribution to the final equations. Several nonlinear structural and inertial terms in the final equations are identified that can substantially influence the aeroelastic stability and response of hingeless helicopter rotor blades.

Breakdown of Shape Memory Effect in Bent Cu-Al-Ni Nanopillars: When Twin Boundaries Become Stacking Faults.

PubMed

Liu, Lifeng; Ding, Xiangdong; Sun, Jun; Li, Suzhi; Salje, Ekhard K H

2016-01-13

Bent Cu-Al-Ni nanopillars (diameters 90-750 nm) show a shape memory effect, SME, for diameters D > 300 nm. The SME and the associated twinning are located in a small deformed section of the nanopillar. Thick nanopillars (D > 300 nm) transform to austenite under heating, including the deformed region. Thin nanopillars (D < 130 nm) do not twin but generate highly disordered sequences of stacking faults in the deformed region. No SME occurs and heating converts only the undeformed regions into austenite. The defect-rich, deformed region remains in the martensite phase even after prolonged heating in the stability field of austenite. A complex mixture of twins and stacking faults was found for diameters 130 nm < D < 300 nm. The size effect of the SME in Cu-Al-Ni nanopillars consists of an approximately linear reduction of the SME between 300 and 130 nm when the SME completely vanishes for smaller diameters.

A novel bone scraper for intraoral harvesting: a device for filling small bone defects.

PubMed

Zaffe, Davide; D'Avenia, Ferdinando

2007-08-01

To evaluate histologically the morphology and characteristics of bone chips harvested intraorally by Safescraper, a specially designed cortical bone collector. Bone chips harvested near a bone defect or in other intraoral sites were grafted into a post-extractive socket or applied in procedures for maxillary sinus floor augmentation or guided bone regeneration. Core biopsies were performed at implant insertion. Undecalcified specimens embedded in PMMA were studied by histology, histochemistry and SEM. Intraoral harvesting by Safescraper provided a simple, clinically effective regenerative procedure with low morbidity for collecting cortical bone chips (0.9-1.7 mm in length, roughly 100 microm thick). Chips had an oblong or quadrangular shape and contained live osteocytes (mean viability: 45-72%). Bone chip grafting produced newly formed bone tissue suitable for implant insertion. Trabecular bone volume measured on biopsies decreased with time (from 45-55% to 23%). Grafted chips made up 50% or less of the calcified tissue in biopsies. Biopsies presented remodeling activities, new bone formation by apposition and live osteocytes (35% or higher). In conclusion, Safescraper is capable of collecting adequate amounts of cortical bone chips from different intraoral sites. The procedure is effective for treating alveolar defects for endosseous implant insertion and provides good healing of small bone defects after grafting with bone chips. The study indicates that Safescraper is a very useful device for in-office bone harvesting procedures in routine peri-implant bone regeneration.

High-voltage solar-cell chip

NASA Technical Reports Server (NTRS)

Kapoor, V. J.; Valco, G. J.; Skebe, G. G.; Evans, J. C., Jr.

1985-01-01

Integrated circuit technology has been successfully applied to the design and fabrication of 0.5 x 0.5-cm planar multijunction solar-cell chips. Each of these solar cells consisted of six voltage-generating unit cells monolithically connected in series and fabricated on a 75-micron-thick, p-type, single crystal, silicon substrate. A contact photolithic process employing five photomask levels together with a standard microelectronics batch-processing technique were used to construct the solar-cell chip. The open-circuit voltage increased rapidly with increasing illumination up to 5 AM1 suns where it began to saturate at the sum of the individual unit-cell voltages at a maximum of 3.0 V. A short-circuit current density per unit cell of 240 mA/sq cm was observed at 10 AM1 suns.

Tests of UFXC32k chip with CdTe pixel detector

NASA Astrophysics Data System (ADS)

Maj, P.; Taguchi, T.; Nakaye, Y.

2018-02-01

The paper presents the performance of the UFXC32K—a hybrid pixel detector readout chip working with CdTe detectors. The UFXC32K has a pixel pitch of 75 μm and can cope with both input signal polarities. This functionality allows operating with widely used silicon sensors collecting holes and CdTe sensors collecting electrons. This article describes the chip focusing on solving the issues connected to high-Z sensor material, namely high leakage currents, slow charge collection time and thick material resulting in increased charge-sharring effects. The measurements were conducted with higher X-ray energies including 17.4 keV from molybdenum. Conclusions drawn inside the paper show the UFXC32K's usability for CdTe sensors in high X-ray energy applications.

Improved light extraction efficiency of InGaN-based multi-quantum well light emitting diodes by using a single die growth.

PubMed

Park, Min Joo; Kwon, K W; Kim, Y H; Park, S H; Kwak, Joon Seop

2011-05-01

We have demonstrated that the light extraction efficiency of the InGaN based multi-quantum well light-emitting diodes (LEDs) can be improved by using a single die growth (SDG) method. The SDG was performed by patterning the n-GaN and sapphire substrate with a size of single chip (600 x 250 microm2) by using a laser scriber, followed by the regrowth of the n-GaN and LED structures on the laser patterned n-GaN. We fabricated lateral LED chips having the SDG structures (SDG-LEDs), in which the thickness of the regrown n-GaN was varied from 2 to 6 microm. For comparison, we also fabricated conventional LED chips without the SDG structures. The SDG-LEDs showed lower operating voltage when compared to the conventional LEDs. In addition, the output power of the SDG-LEDs was significantly higher than that of the conventional LEDs. From optical ray tracing simulations, the increase in the thickness and sidewall angle of the regrown n-GaN and LED structures may enhance photon escapes from the tilted facets of the regrown n-GaN, followed by the increase in light output power and extraction efficiency of the SDG-LEDs.

Surface plasmon resonance sensor for antibiotics detection based on photo-initiated polymerization molecularly imprinted array.

PubMed

Luo, Qiaohui; Yu, Neng; Shi, Chunfei; Wang, Xiaoping; Wu, Jianmin

2016-12-01

A surface plasmon resonance (SPR) sensor combined with nanoscale molecularly imprinted polymer (MIP) film as recognition element was developed for selective detection of the antibiotic ciprofloxacin (CIP). The MIP film on SPR sensor chip was prepared by in situ photo-initiated polymerization method which has the advantages of short polymerization time, controllable thickness and good uniformity. The surface wettability and thickness of MIP film on SPR sensor chip were characterized by static contact angle measurement and stylus profiler. The MIP-SPR sensor exhibited high selectivity, sensitivity and good stability for ciprofloxacin. The imprinting factors of the MIP-SPR sensor to ciprofloxacin and its structural analogue ofloxacin were 2.63 and 3.80, which is much higher than those to azithromycin, dopamine and penicillin. The SPR response had good linear relation with CIP concentration over the range 10 -11 -10 -7 molL -1 . The MIP-SPR sensor also showed good repeatability and stability during cyclic detections. On the basis of the photo-initiated polymerization method, a surface plasmon resonance imaging (SPRi) chip modified with three types of MIP sensing spots was fabricated. The MIPs-SPRi sensor shows different response patterns to ciprofloxacin and azithromycin, revealing the ability to recognize different antibiotic molecules. Copyright © 2016 Elsevier B.V. All rights reserved.

On-chip free beam optics on a polymer-based photonic integration platform.

PubMed

Happach, M; de Felipe, D; Conradi, H; Friedhoff, V N; Schwartz, E; Kleinert, M; Brinker, W; Zawadzki, C; Keil, N; Hofmann, W; Schell, M

2017-10-30

This paper presents on-chip free beam optics on polymer-based photonic components. Due to the circumstance that waveguide-based optics allows no direct beam access we use Gradient index (GRIN) lenses assembled into the chip to collimate the beam from the waveguides. This enables low loss power transmission over a length of 1432 µm. Even though the beam propagates through air it is possible to create a resonator with a wavelength shift of 0.002 nm/°C, hence the allowed deviations from the ITU-T grid (100 GHz) are met for ± 20 °C. In order to guarantee reliable laser stability, it is necessary to implement optical isolators at the output of the laser. This requires the insertion of bulk material into the chip and is realized by a 1050 µm thick coated glass. Due to the large gap of the free-space section, it is possible to combine different resonators together. This demonstrates the feasibility of an integrated wavelength-meter.

The optical design of 3D ICs for smartphone and optro-electronics sensing module

NASA Astrophysics Data System (ADS)

Huang, Jiun-Woei

2018-03-01

Smartphone require limit space for image system, current lens, used in smartphones are refractive type, the effective focal length is limited the thickness of phone physical size. Other, such as optro-electronics sensing chips, proximity optical sensors, and UV indexer chips are integrated into smart phone with limit space. Due to the requirement of multiple lens in smartphone, proximity optical sensors, UV indexer and other optro-electronics sensing chips in a limited space of CPU board in future smart phone, optro-electronics 3D IC's integrated with optical lens or components may be a key technology for 3 C products. A design for reflective lens is fitted to CMOS, proximity optical sensors, UV indexer and other optro-electronics sensing chips based on 3-D IC. The reflective lens can be threes times of effective focal lens, and be able to resolve small object. The system will be assembled and integrated in one 3-D IC more easily.

Effect of cooking method (baking compared with frying) on acrylamide level of potato chips.

PubMed

Palazoğlu, T Koray; Savran, Derya; Gökmen, Vural

2010-01-01

The effect of cooking method (baking compared with frying) on acrylamide level of potato chips was investigated in this study. Baking and frying experiments were conducted at 170, 180, and 190 degrees C using potato slices with a thickness of 1.4 mm. Raw potatoes were analyzed for reducing sugars and asparagine. Surface and internal temperatures of potato slices were monitored during the experiments to better explain the results. Fried and baked chips were analyzed for acrylamide content using an LC-MS method. The results showed that acrylamide level of potato chips prepared by frying increased with frying temperature (19.6 ng/g at 170 degrees C, 39 ng/g at 180 degrees C, and 95 ng/g at 190 degrees C). In baking, however, the highest acrylamide level was observed in potato chips prepared at 170 degrees C (47.8 ng/g at 170 degrees C, 19.3 ng/g at 180 degrees C, and 29.7 ng/g at 190 degrees C). The results showed that baking at 170 degrees C more than doubled the acrylamide amount that formed upon frying at the same temperature, whereas at 180 and 190 degrees C, the acrylamide levels of chips prepared by baking were lower than their fried counterparts.

Packaging Technologies for 500 C SiC Electronics and Sensors: Challenges in Material Science and Technology

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Behelm, Glenn M.; Spry, David J.; Meredith, Roger D.; Hunter, Gary W.

2015-01-01

This paper presents ceramic substrates and thick-film metallization based packaging technologies in development for 500C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550C. The 96 alumina packaging system composed of chip-level packages and PCBs has been successfully tested with high temperature SiC discrete transistor devices at 500C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC junction field-effect-transistor (JFET) with a packaging system composed of a 96 alumina chip-level package and an alumina printed circuit board was tested on low earth orbit for eighteen months via a NASA International Space Station experiment. In addition to packaging systems for electronics, a spark-plug type sensor package based on this high temperature interconnection system for high temperature SiC capacitive pressure sensors was also developed and tested. In order to further significantly improve the performance of packaging system for higher packaging density, higher operation frequency, power rating, and even higher temperatures, some fundamental material challenges must be addressed. This presentation will discuss previous development and some of the challenges in material science (technology) to improve high temperature dielectrics for packaging applications.

Integrating Magnetics for On-Chip Power: A Perspective

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sullivan, CR; Harburg, DV; Qiu, JZ

Integration of efficient power converters requires technology for efficient, high-power on-chip inductors and transformers. Increases in switching frequency, facilitated by advances in circuit designs and silicon or wide-bandgap semiconductors, can enable miniaturization, but only if the magnetics technology works well at the higher frequencies. Technologies, geometries, and scaling of air-core and magnetic-core inductors and transformers are examined, and their potential for integration is discussed. Air-core inductors can use simpler fabrication, and increasing frequency can always be used to decrease their size, but magnetic cores can decrease the required thickness without requiring as high a frequency.

The use of hybrid integrated circuit techniques in biotelemetry applications

NASA Technical Reports Server (NTRS)

Fryer, T. B.

1977-01-01

A review is presented of some features of hybrid integrated circuits that make their use advantageous in miniature biotelemetry applications. The various techniques for fabricating resistors, capacitors and interconnections by both thin film and thick film technology are discussed. The use of chip capacitors, resistors, and especially standard IC chips on substrates with fired-on interconnection patterns is emphasized. The review is designed primarily to acquaint biotelemetry users and designers with an overview of this fabrication technique so that they can better communicate their needs with an understanding of its limitations and advantages to facilities specializing in hybrid construction.

Direct immunosensing by spectral correlation interferometry: assay characteristics versus antibody immobilization chemistry.

PubMed

Burenin, Alexandr G; Urusov, Alexandr E; Betin, Alexei V; Orlov, Alexey V; Nikitin, Maxim P; Ksenevich, Tatiana I; Gorshkov, Boris G; Zherdev, Anatoly V; Dzantiev, Boris B; Nikitin, Petr I

2015-05-01

A 3-channel biosensor based on spectral correlation interferometry (SCI) has been adapted for direct optical detection of antigens by measuring changes in thickness of a biolayer on functionalized glass slips employed as affordable single-use sensor chips. The instrument is insensitive to the bulk refractive index of a solution under test and provides signals in metrological units (pm or nm). Using real-time monitoring with the SCI, protocols for fabrication of sensor chips with different functional (epoxylated, carboxylated, and biotinylated) surfaces for antibody immobilization have been developed and optimized to minimize chip-to-chip variations and achieve better limit of detection (LOD), shorter assay time, and longer shelf life. The optimized coupling surfaces have been compared for detection of human serum albumin (HSA) used as a model agent of medical significance. The dynamic ranges for measuring the HSA concentration were 0.07-20, 0.12-30, and 0.25-10 μg/ml, and the assay durations were less than 20, 15, and 30 min for the epoxylated, carboxylated, and biotinylated chips, respectively. The advantages of each type of sensor chip have been shown, namely, the carboxylated chips feature the shortest assay time, the epoxylated ones demonstrate the best LOD, and the biotinylated chips exhibit the longest shelf life in an unprotected environment. The developed protocols of antibody immobilization can be used in different biosensors and assay techniques including those based on fluorescent, magnetic or plasmonic labels, etc. The SCI is well compatible with various partially transparent layers used in biosensing and with microarrays for multi-analyte detection.

MEMS Incandescent Light Source

NASA Technical Reports Server (NTRS)

Tuma, Margaret; King, Kevin; Kim, Lynn; Hansler, Richard; Jones, Eric; George, Thomas

2001-01-01

A MEMS-based, low-power, incandescent light source is being developed. This light source is fabricated using three bonded chips. The bottom chip consists of a reflector on Silicon, the middle chip contains a Tungsten filament bonded to silicon and the top layer is a transparent window. A 25-micrometer-thick spiral filament is fabricated in Tungsten using lithography and wet-etching. A proof-of-concept device has been fabricated and tested in a vacuum chamber. Results indicate that the filament is electrically heated to approximately 2650 K. The power required to drive the proof-of-concept spiral filament to incandescence is 1.25 W. The emitted optical power is expected to be approximately 1.0 W with the spectral peak at 1.1 microns. The micromachining techniques used to fabricate this light source can be applied to other MEMS devices.

Evaluation of advanced microelectronic fluxless solder-bump contacts for hybrid microcircuits

NASA Technical Reports Server (NTRS)

Mandal, R. P.

1976-01-01

Technology for interconnecting monolithic integrated circuit chips with other components is investigated. The advantages and disadvantages of the current flip-chip approach as compared to other interconnection methods are outlined. A fluxless solder-bump contact technology is evaluated. Multiple solder-bump contacts were formed on silicon integrated circuit chips. The solder-bumps, comprised of a rigid nickel under layer and a compliant solder overlayer, were electroformed onto gold device pads with the aid of thick dry film photomasks. Different solder alloys and the use of conductive epoxy for bonding were explored. Fluxless solder-bump bond quality and reliability were evaluated by measuring the effects of centrifuge, thermal cycling, and high temperature storage on bond visual characteristics, bond electrical continuity, and bond shear tests. The applicability and suitability of this technology for hybrid microelectronic packaging is discussed.

Manufacturing Methods and Technology Engineering (MM&TE) Program for the Establishment of Production Techniques for High Density Thick Film Circuits Used in Crystal Oscillators. Volume I.

DTIC Science & Technology

1980-04-01

incorporate the high reliability ceramic-packaged quartz crystal resonator developed at ERADCOM, and utilize beam -leaded devices wherever possible...the form of a truncated cylinder. The rather complex module outline is best accomplished through the use of a precast potting shell filled with a low...crossover connections are achieved by means of thick-film dielectric material. Chip components attached to the metallized substrate complete the circuits

Growth of High-Quality Carbon Nanotudes on Free-Standing Diamond Substrates (Postprint)

DTIC Science & Technology

2010-03-01

thickness and consisting of 20 nm diameter tubes were observed to grow in a thermal CVD system using C2H2 as precursor, Transmission electron microscopy...multi walled CNTs forming a mat of 5 lm thickness and consisting of 20 nm diameter tubes were observed to grow in a thermal CVD system using C2H2...desired devices. For example, chip cooling with CNT microfin architectures have been recently proposed by Kordas et al. [5]. CNT films as thermal

Morphological Expressions of Crater Infill Collapse: Model Simulations of Chaotic Terrains on Mars

NASA Astrophysics Data System (ADS)

Roda, Manuel; Marketos, George; Westerweel, Jan; Govers, Rob

2017-10-01

Martian chaotic terrains are characterized by deeply depressed intensively fractured areas that contain a large number of low-strain tilted blocks. Stronger deformation (e.g., higher number of fractures) is generally observed in the rims when compared to the middle regions of the terrains. The distribution and number of fractures and tilted blocks are correlated with the size of the chaotic terrains. Smaller chaotic terrains are characterized by few fractures between undeformed blocks. Larger terrains show an elevated number of fractures uniformly distributed with single blocks. We investigate whether this surface morphology may be a consequence of the collapse of the infill of a crater. We perform numerical simulations with the Discrete Element Method and we evaluate the distribution of fractures within the crater and the influence of the crater size, infill thickness, and collapsing depth on the final morphology. The comparison between model predictions and the morphology of the Martian chaotic terrains shows strong statistical similarities in terms of both number of fractures and correlation between fractures and crater diameters. No or very weak correlation is observed between fractures and the infill thickness or collapsing depth. The strong correspondence between model results and observations suggests that the collapse of an infill layer within a crater is a viable mechanism for the peculiar morphology of the Martian chaotic terrains.

Biostability of an implantable glucose sensor chip

NASA Astrophysics Data System (ADS)

Fröhlich, M.; Birkholz, M.; Ehwald, K. E.; Kulse, P.; Fursenko, O.; Katzer, J.

2012-12-01

Surface materials of an implantable microelectronic chip intended for medical applications were evaluated with respect to their long-term stability in bio-environments. The sensor chip shall apply in a glucose monitor by operating as a microviscosimeter according to the principle of affinity viscosimetry. A monolithic integration of a microelectromechanical system (MEMS) into the sensor chip was successfully performed in a combined 0.25 μm CMOS/BiCMOS technology. In order to study material durability and biostability of the surfaces, sensor chips were exposed to various in vitro and in vivo tests. Corrosional damage of SiON, SiO2 and TiN surfaces was investigated by optical microscopy, ellipsometry and AFM. The results served for optimizing the Back-end-of-Line (BEoL) stack, from which the MEMS was prepared. Corrosion of metal lines could significantly be reduced by improving the topmost passivation layer. The experiments revealed no visible damage of the actuator or other functionally important MEMS elements. Sensor chips were also exposed to human body fluid for three month by implantation into the abdomen of a volunteer. Only small effects were observed for layer thickness and Ra roughness after explantation. In particular, TiN as used for the actuator beam showed no degradation by biocorrosion. The highest degradation rate of about 50 nm per month was revealed for the SiON passivation layer. These results suggest that the sensor chip may safely operate in subcutaneous tissue for a period of several months.

Modelling Sawing of Metal Tubes Through FEM Simulation

NASA Astrophysics Data System (ADS)

Bort, C. M. Giorgio; Bosetti, P.; Bruschi, S.

2011-05-01

The paper presents the development of a numerical model of the sawing process of AISI 304 thin tubes, which is cut through a circular blade with alternating roughing and finishing teeth. The numerical simulation environment is the three-dimensional FEM software Deform™ v.10.1. The teeth actual trajectories were determined by a blade kinematics analysis developed in Matlab™. Due to the manufacturing rolling steps and subsequent welding stage, the tube material is characterized by a gradient of properties along its thickness. Consequently, a simplified cutting test was set up and carried out in order to identify the values of relevant material parameters to be used in the numerical model. The dedicated test was the Orthogonal Tube Cutting test (OTC), which was performed on an instrumented lathe. The proposed numerical model was validated by comparing numerical results and experimental data obtained from sawing tests carried out on an industrial machine. The following outputs were compared: the cutting force, the chip thickness, and the chip contact area.

Thermal cycling reliability of Cu/SnAg double-bump flip chip assemblies for 100 μm pitch applications

NASA Astrophysics Data System (ADS)

Son, Ho-Young; Kim, Ilho; Lee, Soon-Bok; Jung, Gi-Jo; Park, Byung-Jin; Paik, Kyung-Wook

2009-01-01

A thick Cu column based double-bump flip chip structure is one of the promising alternatives for fine pitch flip chip applications. In this study, the thermal cycling (T/C) reliability of Cu/SnAg double-bump flip chip assemblies was investigated, and the failure mechanism was analyzed through the correlation of T/C test and the finite element analysis (FEA) results. After 1000 thermal cycles, T/C failures occurred at some Cu/SnAg bumps located at the edge and corner of chips. Scanning acoustic microscope analysis and scanning electron microscope observations indicated that the failure site was the Cu column/Si chip interface. It was identified by a FEA where the maximum stress concentration was located during T/C. During T/C, the Al pad between the Si chip and a Cu column bump was displaced due to thermomechanical stress. Based on the low cycle fatigue model, the accumulation of equivalent plastic strain resulted in thermal fatigue deformation of the Cu column bumps and ultimately reduced the thermal cycling lifetime. The maximum equivalent plastic strains of some bumps at the chip edge increased with an increased number of thermal cycles. However, equivalent plastic strains of the inner bumps did not increase regardless of the number of thermal cycles. In addition, the z-directional normal plastic strain ɛ22 was determined to be compressive and was a dominant component causing the plastic deformation of Cu/SnAg double bumps. As the number of thermal cycles increased, normal plastic strains in the perpendicular direction to the Si chip and shear strains were accumulated on the Cu column bumps at the chip edge at low temperature region. Thus it was found that the Al pad at the Si chip/Cu column interface underwent thermal fatigue deformation by compressive normal strain and the contact loss by displacement failure of the Al pad, the main T/C failure mode of the Cu/SnAg flip chip assembly, then occurred at the Si chip/Cu column interface shear strain deformation during T/C.

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500 C silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chip-level packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550 C. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500 C for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500 C are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding

NASA Astrophysics Data System (ADS)

Wang, Wei-Shan; Wiemer, Maik; Froemel, Joerg; Enderlein, Tom; Gessner, Thomas; Lullin, Justine; Bargiel, Sylwester; Passilly, Nicolas; Albero, Jorge; Gorecki, Christophe

2016-04-01

In this work, vertical integration of miniaturized array-type Mirau interferometers at wafer level by using multi-stack anodic bonding is presented. Mirau interferometer is suitable for MEMS metrology and for medical imaging according to its vertical-, lateral- resolutions and working distances. Miniaturized Mirau interferometer can be a promising candidate as a key component of an optical coherence tomography (OCT) system. The miniaturized array-type interferometer consists of a microlens doublet, a Si-based MEMS Z scanner, a spacer for focus-adjustment and a beam splitter. Therefore, bonding technologies which are suitable for heterogeneous substrates are of high interest and necessary for the integration of MEMS/MOEMS devices. Multi-stack anodic bonding, which meets the optical and mechanical requirements of the MOEMS device, is adopted to integrate the array-type interferometers. First, the spacer and the beam splitter are bonded, followed by bonding of the MEMS Z scanner. In the meanwhile, two microlenses, which are composed of Si and glass wafers, are anodically bonded to form a microlens doublet. Then, the microlens doublet is aligned and bonded with the scanner/spacer/beam splitter stack. The bonded array-type interferometer is a 7- wafer stack and the thickness is approximately 5mm. To separate such a thick wafer stack with various substrates, 2-step laser cutting is used to dice the bonded stack into Mirau chips. To simplify fabrication process of each component, electrical connections are created at the last step by mounting a Mirau chip onto a flip chip PCB instead of through wafer vias. Stability of Au/Ti films on the MEMS Z scanner after anodic bonding, laser cutting and flip chip bonding are discussed as well.

NEPP Evaluation of Automotive Grade Tantalum Chip Capacitors

NASA Technical Reports Server (NTRS)

Sampson, Mike; Brusse, Jay

2018-01-01

Automotive grade tantalum (Ta) chip capacitors are available at lower cost with smaller physical size and higher volumetric efficiency compared to military/space grade capacitors. Designers of high reliability aerospace and military systems would like to take advantage of these attributes while maintaining the high standards for long-term reliable operation they are accustomed to when selecting military-qualified established reliability tantalum chip capacitors (e.g., MIL-PRF-55365). The objective for this evaluation was to assess the long-term performance of off-the-shelf automotive grade Ta chip capacitors (i.e., manufacturer self-qualified per AEC Q-200). Two (2) lots of case size D manganese dioxide (MnO2) cathode Ta chip capacitors from 1 manufacturer were evaluated. The evaluation consisted of construction analysis, basic electrical parameter characterization, extended long-term (2000 hours) life testing and some accelerated stress testing. Tests and acceptance criteria were based upon manufacturer datasheets and the Automotive Electronics Council's AEC Q-200 qualification specification for passive electronic components. As-received a few capacitors were marginally above the specified tolerance for capacitance and ESR. X-ray inspection found that the anodes for some devices may not be properly aligned within the molded encapsulation leaving less than 1 mil thickness of the encapsulation. This evaluation found that the long-term life performance of automotive grade Ta chip capacitors is generally within specification limits suggesting these capacitors may be suitable for some space applications.

Electrochemical behavior of high performance on-chip porous carbon films for micro-supercapacitors applications in organic electrolytes

NASA Astrophysics Data System (ADS)

Brousse, K.; Huang, P.; Pinaud, S.; Respaud, M.; Daffos, B.; Chaudret, B.; Lethien, C.; Taberna, P. L.; Simon, P.

2016-10-01

Carbide derived carbons (CDCs) are promising materials for preparing integrated micro-supercapacitors, as on-chip CDC films are prepared via a process fully compatible with current silicon-based device technology. These films show good adherence on the substrate and high capacitance thanks to their unique nanoporous structure which can be fine-tuned by adjusting the synthesis parameters during chlorination of the metallic carbide precursor. The carbon porosity is mostly related to the synthesis temperature whereas the thickness of the films depends on the chlorination duration. Increasing the pore size allows the adsorption of large solvated ions from organic electrolytes and leads to higher energy densities. Here, we investigated the electrochemical behavior and performance of on-chip TiC-CDC in ionic liquid solvent mixtures of 1-ethyl-3-methylimidazolium tetrafluoroborate (EMIBF4) diluted in either acetonitrile or propylene carbonate via cyclic voltammetry and electrochemical impedance spectroscopy. Thin CDC films exhibited typical capacitive signature and achieved 169 F cm-3 in both electrolytes; 65% of the capacitance was still delivered at 1 V s-1. While increasing the thickness of the films, EMI+ transport limitation was observed in more viscous PC-based electrolyte. Nevertheless, the energy density reached 90 μW h cm-2 in 2M EMIBF4/ACN, confirming the interest of these CDC films for micro-supercapacitors applications.

Design and fabricate multi channel microfluidic mold on top of glass slide using SU-8

NASA Astrophysics Data System (ADS)

Azman, N. A. N.; Rajapaksha, R. D. A. A.; Uda, M. N. A.; Hashim, U.

2017-09-01

Microfluidic is the study of fluid in microscale. Microfluidics provides miniaturized fluidic networks for processing and analyzing liquids in the nanoliter to milliliter range. Microfluidic device comprises of some essential segments or structure that are micromixer, microchannel and microchamber. The SU-8 mold is known as the most used technique in microfluidic fabrication due to the characteristic of very gooey polymer that can be spread over a thickness. In this study, in order to reduce the fabrication cost, the development and fabrication of SU-8 mold is replace by using a glass plate instead of silicon wafer which is used in the previous research. We designed a microfluidic chip for use with an IDE sensors to conduct multiplex detection of multiple channels. The microfluidic chip was designed to include multiplex detection for pathogen that consists of multiple channels of simultaneous results. The multi-channel microfluidic chip was designed, including the fluid outlet and inlet. A multi-channel microfluidic chip was used for pathogen detection. This paper sum up the fabrication of lab SU-8 mold using glass slide.

Numerical Simulation and Performance Optimization of a Magnetophoretic Bio-separation chip

NASA Astrophysics Data System (ADS)

Golozar, Matin; Darabi, Jeff; Molki, Majid

Separation of micro/nanoparticles is important in biomedicine and biotechnology. This research presents the modeling and optimization of a magnetophoretic bio-separation chip for the isolation of biomaterials, such as circulating tumor cells (CTCs) from the peripheral blood. The chip consists of a continuous flow through microfluidic channels that contains locally engineered magnetic field gradients. The high gradient magnetic field produced by the magnets is spatially non-uniform and gives rise to an attractive force on magnetic particles that move through the flow channel. The computational model takes into account the magnetic and fluidic forces as well as the effect of the volume fraction of particles on the continuous phase. The model is used to investigate the effect of two-way particle-fluid coupling on both the capture efficiency and the flow pattern in the separation chip. The results show that the microfluidic device has the capability of separating CTCs from their native environment. Additionally, a parametric study is performed to investigate the effects of the channel height, substrate thickness, magnetic bead size, bioparticle size, and the number of beads per cell on the cell separation performance.

Integrated on-chip solid state capacitor based on vertically aligned carbon nanofibers, grown using a CMOS temperature compatible process

NASA Astrophysics Data System (ADS)

Saleem, Amin M.; Andersson, Rickard; Desmaris, Vincent; Enoksson, Peter

2018-01-01

Complete miniaturized on-chip integrated solid-state capacitors have been fabricated based on conformal coating of vertically aligned carbon nanofibers (VACNFs), using a CMOS temperature compatible microfabrication processes. The 5 μm long VACNFs, operating as electrode, are grown on a silicon substrate and conformally coated by aluminum oxide dielectric using atomic layer deposition (ALD) technique. The areal (footprint) capacitance density value of 11-15 nF/mm2 is realized with high reproducibility. The CMOS temperature compatible microfabrication, ultra-low profile (less than 7 μm thickness) and high capacitance density would enables direct integration of micro energy storage devices on the active CMOS chip, multi-chip package and passives on silicon or glass interposer. A model is developed to calculate the surface area of VACNFs and the effective capacitance from the devices. It is thereby shown that 71% of surface area of the VACNFs has contributed to the measured capacitance, and by using the entire area the capacitance can potentially be increased.

Fabrication and physical evaluation of a polymer-encapsulated paramagnetic probe for biomedical oximetry

PubMed Central

Meenakshisundaram, Guruguhan; Eteshola, Edward; Pandian, Ramasamy P.; Bratasz, Anna; Kuppusamy, Periannan

2009-01-01

Lithium octa-n-butoxynaphthalocyanine (LiNc-BuO) is a promising probe for biological electron paramagnetic resonance (EPR) oximetry and is being developed for clinical use. However, clinical applicability of LiNc-BuO may be hindered by potential limitations associated with biocompatibility, biodegradation, and migration of individual crystals in tissue. To overcome these limitations, we have encapsulated LiNc-BuO crystals in polydimethyl siloxane (PDMS), an oxygen-permeable and bioinert polymer, to fabricate conveniently implantable and retrievable oxygen-sensing chips. Encapsulation was performed by a simple cast-molding process, giving appreciable control over size, shape, thickness and spin density of chips. The in vitro oxygen response of the chip was linear, reproducible, and not significantly different from that of unencapsulated crystals. Cast-molding of the structurally-flexible PDMS enabled the fabrication of chips with tailored spin densities, and ensured non-exposure of embedded LiNc-BuO, mitigating potential biocompatibility/toxicological concerns. Our results establish PDMS-encapsulated LiNc-BuO as a promising candidate for further biological evaluation and potential clinical application. PMID:19291409

Formulation of Saudi Propolis into Biodegradable Chitosan Chips for Vital Pulpotomy.

PubMed

Balata, Gihan F; Abdelhady, Mohamed I S; Mahmoud, Ghada M; Matar, Moustafa A; Abd El-Latif, Amani N

2018-01-01

Propolis has been widely used to treat oral cavity disorders, such as endodontal and periodontal diseases and microbial infections. The study aimed at the formulation of commercial Saudi propolis into biodegradable chitosan chips and evaluation of its effectiveness as a pulpotomy agent. The standardization of 80% ethanolic propolis extract was performed regarding its total phenolic content, total flavonoid content, quantitative estimation of main polyphenolic constituents and antioxidant activity. Chitosan chips containing propolis extract were prepared by the solvent/ casting method. The investigated variables were % of chitosan polymer (2, 2.5 and 3%), % of plasticizer (1, 5 and 10%) and incorporation of different concentrations of hydroxypropyl methylcellulose (5, 10 and 20% of polymer weight). The chips were characterized for weight and thickness uniformity, content uniformity, pH, percentage moisture loss, swelling index, tensile strength and in vitro propolis release. The optimal propolis chip formulation was further investigated in dogs regarding the short term response of primary dental pulp to propolis chips compared with the most commonly used formocresol preparation. The prepared films were flexible and demonstrated satisfactory physicochemical characteristics. The optimal formulation showed an initial release of about 41.7% of the loaded propolis followed by a sustained release extended up to 7 days. The kinetics study demonstrated that propolis release was controlled by Fick´s diffusion. The optimal propolis chip formulation resulted in less pulpal inflammation compared to formocresol, and produced hard tissue formation in all specimens. Formulation of commercial Saudi propolis as a biodegradable chitosan chip is an effective alternative to the commercially available chemical agents for the treatment of vital pulpotomy. Copyright© Bentham Science Publishers; For any queries, please email at epub@benthamscience.org.

Design of a CMOS readout circuit on ultra-thin flexible silicon chip for printed strain gauges

NASA Astrophysics Data System (ADS)

Elsobky, Mourad; Mahsereci, Yigit; Keck, Jürgen; Richter, Harald; Burghartz, Joachim N.

2017-09-01

Flexible electronics represents an emerging technology with features enabling several new applications such as wearable electronics and bendable displays. Precise and high-performance sensors readout chips are crucial for high quality flexible electronic products. In this work, the design of a CMOS readout circuit for an array of printed strain gauges is presented. The ultra-thin readout chip and the printed sensors are combined on a thin Benzocyclobutene/Polyimide (BCB/PI) substrate to form a Hybrid System-in-Foil (HySiF), which is used as an electronic skin for robotic applications. Each strain gauge utilizes a Wheatstone bridge circuit, where four Aerosol Jet® printed meander-shaped resistors form a full-bridge topology. The readout chip amplifies the output voltage difference (about 5 mV full-scale swing) of the strain gauge. One challenge during the sensor interface circuit design is to compensate for the relatively large dc offset (about 30 mV at 1 mA) in the bridge output voltage so that the amplified signal span matches the input range of an analog-to-digital converter (ADC). The circuit design uses the 0. 5 µm mixed-signal GATEFORESTTM technology. In order to achieve the mechanical flexibility, the chip fabrication is based on either back thinned wafers or the ChipFilmTM technology, which enables the manufacturing of silicon chips with a thickness of about 20 µm. The implemented readout chip uses a supply of 5 V and includes a 5-bit digital-to-analog converter (DAC), a differential difference amplifier (DDA), and a 10-bit successive approximation register (SAR) ADC. The circuit is simulated across process, supply and temperature corners and the simulation results indicate excellent performance in terms of circuit stability and linearity.

Ultra Small Integrated Optical Fiber Sensing System

PubMed Central

Van Hoe, Bram; Lee, Graham; Bosman, Erwin; Missinne, Jeroen; Kalathimekkad, Sandeep; Maskery, Oliver; Webb, David J.; Sugden, Kate; Van Daele, Peter; Van Steenberge, Geert

2012-01-01

This paper introduces a revolutionary way to interrogate optical fiber sensors based on fiber Bragg gratings (FBGs) and to integrate the necessary driving optoelectronic components with the sensor elements. Low-cost optoelectronic chips are used to interrogate the optical fibers, creating a portable dynamic sensing system as an alternative for the traditionally bulky and expensive fiber sensor interrogation units. The possibility to embed these laser and detector chips is demonstrated resulting in an ultra thin flexible optoelectronic package of only 40 μm, provided with an integrated planar fiber pigtail. The result is a fully embedded flexible sensing system with a thickness of only 1 mm, based on a single Vertical-Cavity Surface-Emitting Laser (VCSEL), fiber sensor and photodetector chip. Temperature, strain and electrodynamic shaking tests have been performed on our system, not limited to static read-out measurements but dynamically reconstructing full spectral information datasets.

Trapping ultracold gases near cryogenic materials with rapid reconfigurability

DOE Office of Scientific and Technical Information (OSTI.GOV)

Naides, Matthew A.; Turner, Richard W.; Lai, Ruby A.

We demonstrate an atom chip trapping system that allows the placement and high-resolution imaging of ultracold atoms within microns from any ≲100 μm-thin, UHV-compatible material, while also allowing sample exchange with minimal experimental downtime. The sample is not connected to the atom chip, allowing rapid exchange without perturbing the atom chip or laser cooling apparatus. Exchange of the sample and retrapping of atoms has been performed within a week turnaround, limited only by chamber baking. Moreover, the decoupling of sample and atom chip provides the ability to independently tune the sample temperature and its position with respect to the trapped ultracoldmore » gas, which itself may remain in the focus of a high-resolution imaging system. As a first demonstration of this system, we have confined a 700-nK cloud of 8 × 10{sup 4} {sup 87}Rb atoms within 100 μm of a gold-mirrored 100-μm-thick silicon substrate. The substrate was cooled to 35 K without use of a heat shield, while the atom chip, 120 μm away, remained at room temperature. Atoms may be imaged and retrapped every 16 s, allowing rapid data collection.« less

Crustal structure of the Gulf of Aden southern margin: Evidence from receiver functions on Socotra Island (Yemen)

NASA Astrophysics Data System (ADS)

Ahmed, Abdulhakim; Leroy, Sylvie; Keir, Derek; Korostelev, Félicie; Khanbari, Khaled; Rolandone, Frédérique; Stuart, Graham; Obrebski, Mathias

2014-12-01

Breakup of continents in magma-poor setting occurs primarily by faulting and plate thinning. Spatial and temporal variations in these processes can be influenced by the pre-rift basement structure as well as by early syn-rift segmentation of the rift. In order to better understand crustal deformation and influence of pre-rift architecture on breakup we use receiver functions from teleseismic recordings from Socotra which is part of the subaerial Oligo-Miocene age southern margin of the Gulf of Aden. We determine variations in crustal thickness and elastic properties, from which we interpret the degree of extension related thinning and crustal composition. Our computed receiver functions show an average crustal thickness of ~ 28 km for central Socotra, which decreases westward along the margin to an average of ~ 21 km. In addition, the crust thins with proximity to the continent-ocean transition to ~ 16 km in the northwest. Assuming an initial pre-rift crustal thickness of 35 km (undeformed Arabian plate), we estimate a stretching factor in the range of ~ 2.1-2.4 beneath Socotra. Our results show considerable differences between the crustal structure of Socotra's eastern and western sides on either side of the Hadibo transfer zone; the east displays a clear intracrustal conversion phase and thick crust when compared with the western part. The majority of measurements across Socotra show Vp/Vs ratios of between 1.70 and 1.77 and are broadly consistent with the Vp/Vs values expected from the granitic and carbonate rock type exposed at the surface. Our results strongly suggest that intrusion of mafic rock is absent or minimal, providing evidence that mechanical thinning accommodated the majority of crustal extension. From our observations we interpret that the western part of Socotra corresponds to the necking zone of a classic magma-poor continental margin, while the eastern part corresponds to the proximal domain.

Finite element analysis of high aspect ratio wind tunnel wing model: A parametric study

NASA Astrophysics Data System (ADS)

Rosly, N. A.; Harmin, M. Y.

2017-12-01

Procedure for designing the wind tunnel model of a high aspect ratio (HAR) wing containing geometric nonlinearities is described in this paper. The design process begins with identification of basic features of the HAR wing as well as its design constraints. This enables the design space to be narrowed down and consequently, brings ease of convergence towards the design solution. Parametric studies in terms of the spar thickness, the span length and the store diameter are performed using finite element analysis for both undeformed and deformed cases, which respectively demonstrate the linear and nonlinear conditions. Two main criteria are accounted for in the selection of the wing design: the static deflections due to gravitational loading should be within the allowable margin of the size of the wind tunnel test section and the flutter speed of the wing should be much below the maximum speed of the wind tunnel. The findings show that the wing experiences a stiffness hardening effect under the nonlinear static solution and the presence of the store enables significant reduction in linear flutter speed.

MMIC Amplifier Produces Gain of 10 dB at 235 GHz

NASA Technical Reports Server (NTRS)

Dawson, Douglas; Fung, King Man; Lee, Karen; Samoska, Lorene; Wells, Mary; Gaier, Todd; Kangaslahti, Pekka; Grundbacher, Ronald; Lai, Richard; Raja, Rohit;

Micro-architecture embedding ultra-thin interlayer to bond diamond and silicon via direct fusion

NASA Astrophysics Data System (ADS)

Kim, Jong Cheol; Kim, Jongsik; Xin, Yan; Lee, Jinhyung; Kim, Young-Gyun; Subhash, Ghatu; Singh, Rajiv K.; Arjunan, Arul C.; Lee, Haigun

2018-05-01

The continuous demand on miniaturized electronic circuits bearing high power density illuminates the need to modify the silicon-on-insulator-based chip architecture. This is because of the low thermal conductivity of the few hundred nanometer-thick insulator present between the silicon substrate and active layers. The thick insulator is notorious for releasing the heat generated from the active layers during the operation of devices, leading to degradation in their performance and thus reducing their lifetime. To avoid the heat accumulation, we propose a method to fabricate the silicon-on-diamond (SOD) microstructure featured by an exceptionally thin silicon oxycarbide interlayer (˜3 nm). While exploiting the diamond as an insulator, we employ spark plasma sintering to render the silicon directly fused to the diamond. Notably, this process can manufacture the SOD microarchitecture via a simple/rapid way and incorporates the ultra-thin interlayer for minute thermal resistance. The method invented herein expects to minimize the thermal interfacial resistance of the devices and is thus deemed as a breakthrough appealing to the current chip industry.

Tg and Structural Recovery of Single Ultrathin Films

NASA Astrophysics Data System (ADS)

Simon, Sindee

The behavior of materials confined at the nanoscale has been of considerable interest over the past two decades. Here, the focus is on recent results for single polystyrene ultrathin films studied with ultrafast scanning chip calorimetry. The Tg depression of a 20 nm-thick high-molecular-weight polystyrene film is found to be a function of cooling rate, decreasing with increasing cooling rate; whereas, at high enough cooling rates (e.g., 1000 K/s), Tg is the same as the bulk within the error of the measurements. Structural recovery is also performed with chip calorimetry as a function of aging time and temperature, and the evolution of the fictive temperature is followed. The advantages of the Flash DSC include sufficient sensitivity to measure enthalpy recovery for a single 20 nm-thick film, as well as extension of the measurements to aging temperatures as high as 15 K above nominal Tg and to aging times as short as 0.01 s. The aging behavior and relaxation time-temperature map for single ultrathin films are compared to those for bulk material. Comparison to behavior in other geometries will also be discussed.

Dynamics and materials physics of fault rupture and glacial processes

NASA Astrophysics Data System (ADS)

Platt, John Daniel

This thesis focuses on two main topics, the physics governing how faults rapidly weaken during an earthquake and the thermal and mechanical structure of ice stream shear margins. The common theme linking these two projects is the desire to understand how the complicated interactions between stress and temperature control deformation and failure. All of the problems in this thesis are attacked using a combination of analytic and numerical methods, and the interplay between these two approaches provides a powerful way to understand the different physical balances that dominate in different regimes. We also use aspects of materials science to understand how the often complicated rheologies are controlled by underlying physical phenomena such as melting, phase transitions, diffusion, and dislocation motion. With regards to fault mechanics, we begin by showing how co-seismic weakening mechanisms driven by elevated pore fluid pressures lead to micron-scale strain localization during an earthquake. We solve for the localized zone thickness for a range of fault temperatures, test these predictions using numerical simulations, and show how the onset of localization accelerates fault weakening. Next we present the first solutions to account for thermal decomposition reactions during a dynamic rupture, showing that the activation of thermal decomposition may lead to a larger slip duration and total slip. Finally we present a new set of experiments studying flash heating of serpentinite, highlighting the dependence of friction on normal stress and the presence of gouge, and producing the first model to explain the hysteresis commonly observed in flash heating experiments. With regards to ice stream shear margins, we begin by extending the work of Perol and Rice [2011] to study the formation of temperate ice in shear margins, and quantify the total melt that may be generated within the shear margins. We conclude by investigating how the presence of such a channel alters the stress on and strength of the undeforming bed in the shear margin, showing that the transition from a deforming to an undeforming bed across a channel is stable when the water flux in the channel exceeds a critical value.

Retrodeformable cross sections and Oak Ridge fault, Ventura basin, California

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yeats, R.S.; Huftile, G.F.

1988-03-01

A retrodeformable (balanced) cross section is constructed such that stratified rocks are restored to their undeformed state without loss or gain of bed length or bed thickness. Ductile strata may be area-balanced if original thickness is known. Near Ventura, folds in Pliocene-Pleistocene turbidites and Miocene-early Pliocene shales (Rincon, Monterey, Sisquoc) overlie an unfolded competent Paleogene sequence. The basal decollement of the foldbelt is in the ductile Rincon Formation (lower Miocene). The overlying Sulphur Mountain, Ventura Avenue, San Miguelito, and Rincon anticlines are fault-propagation folds developing from south-dipping, largely late Quaternary frontal ramp thrusts (Sisar-Big Canyon-Lion fault set, Barnard fault set,more » padre Juan fault, and C-3 fault, respectively) that rise from the decollement. Cross-section balancing shows that the overlying fold-thrust belt has shortened 2.5-6 km more than subjacent Paleogene competent strata. This excess bed length is taken up in the Paleogene sequence on the Oak Ridge fault as a ramp from the brittle-plastic transition zone through the upper crust. This implies that the basal decollement is the frontal active thrust of the Oak Ridge fault. The decollement dies out southeast of a line between Timber Canyon oil field and the west end of Oak Ridge, possibly because of decreased ductility in the Miocene decollement sequence due to appearance of sandstone interbeds. Farther southeast, late Quaternary displacement concentrated on the Oak Ridge fault itself at rates greater than 10 mm/year.« less

Monte Carlo-based diode design for correction-less small field dosimetry.

PubMed

Charles, P H; Crowe, S B; Kairn, T; Knight, R T; Hill, B; Kenny, J; Langton, C M; Trapp, J V

2013-07-07

Due to their small collecting volume, diodes are commonly used in small field dosimetry. However, the relative sensitivity of a diode increases with decreasing small field size. Conversely, small air gaps have been shown to cause a significant decrease in the sensitivity of a detector as the field size is decreased. Therefore, this study uses Monte Carlo simulations to look at introducing air upstream to diodes such that they measure with a constant sensitivity across all field sizes in small field dosimetry. Varying thicknesses of air were introduced onto the upstream end of two commercial diodes (PTW 60016 photon diode and PTW 60017 electron diode), as well as a theoretical unenclosed silicon chip using field sizes as small as 5 mm × 5 mm. The metric D(w,Q)/D(Det,Q) used in this study represents the ratio of the dose to a point of water to the dose to the diode active volume, for a particular field size and location. The optimal thickness of air required to provide a constant sensitivity across all small field sizes was found by plotting D(w,Q)/D(Det,Q) as a function of introduced air gap size for various field sizes, and finding the intersection point of these plots. That is, the point at which D(w,Q)/D(Det,Q) was constant for all field sizes was found. The optimal thickness of air was calculated to be 3.3, 1.15 and 0.10 mm for the photon diode, electron diode and unenclosed silicon chip, respectively. The variation in these results was due to the different design of each detector. When calculated with the new diode design incorporating the upstream air gap, k(f(clin),f(msr))(Q(clin),Q(msr)) was equal to unity to within statistical uncertainty (0.5%) for all three diodes. Cross-axis profile measurements were also improved with the new detector design. The upstream air gap could be implanted on the commercial diodes via a cap consisting of the air cavity surrounded by water equivalent material. The results for the unclosed silicon chip show that an ideal small field dosimetry diode could be created by using a silicon chip with a small amount of air above it.

"Peak tracking chip" for label-free optical detection of bio-molecular interaction and bulk sensing.

PubMed

Bougot-Robin, Kristelle; Li, Shunbo; Zhang, Yinghua; Hsing, I-Ming; Benisty, Henri; Wen, Weijia

2012-10-21

A novel imaging method for bulk refractive index sensing or label-free bio-molecular interaction sensing is presented. This method is based on specially designed "Peak tracking chip" (PTC) involving "tracks" of adjacent resonant waveguide gratings (RWG) "micropads" with slowly evolving resonance position. Using a simple camera the spatial information robustly retrieves the diffraction efficiency, which in turn transduces either the refractive index of the liquids on the tracks or the effective thickness of an immobilized biological layer. Our intrinsically multiplex chip combines tunability and versatility advantages of dielectric guided wave biochips without the need of costly hyperspectral instrumentation. The current success of surface plasmon imaging techniques suggests that our chip proposal could leverage an untapped potential to routinely extend such techniques in a convenient and sturdy optical configuration toward, for instance for large analytes detection. PTC design and fabrication are discussed with challenging process to control micropads properties by varying their period (step of 2 nm) or their duty cycle through the groove width (steps of 4 nm). Through monochromatic imaging of our PTC, we present experimental demonstration of bulk index sensing on the range [1.33-1.47] and of surface biomolecule detection of molecular weight 30 kDa in aqueous solution using different surface densities. A sensitivity of the order of 10(-5) RIU for bulk detection and a sensitivity of the order of ∼10 pg mm(-2) for label-free surface detection are expected, therefore opening a large range of application of our chip based imaging technique. Exploiting and chip design, we expect as well our chip to open new direction for multispectral studies through imaging.

Studies on spectroscopy of glycerol in THz range using microfluidic chip-integrated micropump

NASA Astrophysics Data System (ADS)

Su, Bo; Han, Xue; Wu, Ying; Zhang, Cunlin

2014-11-01

Terahertz time-domain spectroscopy (THz-TDS) is a detection method of biological molecules with label-free, non-ionizing, non-intrusive, no pollution and real-time monitoring. But owing to the strong THz absorption by water, it is mainly used in the solid state detection of biological molecules. In this paper, we present a microfluidic chip technique for detecting biological liquid samples using the transmission type of THz-TDS system. The microfluidic channel of the microfluidic chip is fabricated in the quartz glass using Micro-Electro-Mechanical System (MEMS) technology and sealed with polydimethylsiloxane (PDMS) diaphragm. The length, width and depth of the microfluidic channel are 25mm, 100μm and 50μm, respectively. The diameter of THz detection zone in the microfluidic channel is 4mm. The thicknesses of quartz glass and PDMS diaphragm are 1mm and 250μm, individually. Another one of the same quartz glass is used to bond with the PDMS for the rigidity and air tightness of the microfluidic chip. In order to realize the automation of sampling and improve the control precise of fluid, a micropump, which comprises PDMS diaphragm, pump chamber, diffuser and nozzle and flat vibration motor, is integrated on the microfluidic chip. The diffuser and nozzle are fabricated on both sides of the pump chamber, which is covered with PDMS diaphragm. The flat vibration motor is stuck on the PDMS diaphragm as the actuator. We study the terahertz absorption spectroscopy characteristics of glycerol with the concentration of 98% in the microfluidic chip by the aid of the THz-TDS system, and the feasibility of the microfluidic chip for the detection of liquid samples is proved.

‘Chip-olate’ and dry-film resists for efficient fabrication, singulation and sealing of microfluidic chips

NASA Astrophysics Data System (ADS)

Temiz, Yuksel; Delamarche, Emmanuel

2014-09-01

This paper describes a technique for high-throughput fabrication and efficient singulation of chips having closed microfluidic structures and takes advantage of dry-film resists (DFRs) for efficient sealing of capillary systems. The technique is illustrated using 4-inch Si/SiO2 wafers. Wafers carrying open microfluidic structures are partially diced to about half of their thickness. Treatments such as surface cleaning are done at wafer-level, then the structures are sealed using low-temperature (45 °C) lamination of a DFR that is pre-patterned using a craft cutter, and ready-to-use chips are finally separated manually like a chocolate bar by applying a small force (≤ 4 N). We further show that some DFRs have low auto-fluorescence at wavelengths typically used for common fluorescent dyes and that mechanical properties of some DFRs allow for the lamination of 200 μm wide microfluidic structures with negligible sagging (~1 μm). The hydrophilicity (advancing contact angle of ~60°) of the DFR supports autonomous capillary-driven flow without the need for additional surface treatment of the microfluidic chips. Flow rates from 1 to 5 µL min-1 are generated using different geometries of channels and capillary pumps. In addition, the ‘chip-olate’ technique is compatible with the patterning of capture antibodies on DFR for use in immunoassays. We believe this technique to be applicable to the fabrication of a wide range of microfluidic and lab-on-a-chip devices and to offer a viable alternative to many labor-intensive processes that are currently based on wafer bonding techniques or on the molding of poly(dimethylsiloxane) (PDMS) layers.

Thinning and mounting a Texas Instruments 3-phase CCD

NASA Technical Reports Server (NTRS)

Lesser, M. P.; Leach, R. W.; Angel, J. R. P.

1986-01-01

Thin CCDs with precise control of thickness and surface quality allow astronomers to optimize chips for specific applications. A means of mechanically thinning a TI 800 x 800 CCD with an abrasive slurry of aluminum oxide is presented. Using the same techniques, the abrasives can be replaced with a chemical solution to eliminate subsurface damage. A technique of mounting the CCD which retains the high quality surface generated during thinning is also demonstrated. This requires the backside of the chip to be bonded to a glass window which closely matches silicon's thermal expansion properties. Thinned CCDs require backside treatment to enhance blue and UV quantum efficiency. Two methods are discussed which may be effective with this mounting system.

MBE growth of VCSELs for high volume applications

NASA Astrophysics Data System (ADS)

Jäger, Roland; Riedl, Michael C.

2011-05-01

Mass market applications like laser computer mouse or optical data transmission based on vertical-cavity surface-emitting laser (VCSEL) chips need a high over all yield including epitaxy, processing, dicing, mounting and testing. One yield limitation for VCSEL structures is the emission wavelength variation of the substrate surface area leading to the fraction on laser chips which are below or above the specification limits. For most 850 nm VCSEL products a resonator wavelength variation of ±2 nm is common. This represents an average resonator thickness variation of much less than 1% which is quite challenging to be fulfilled on the entire processed wafer surface area. A high over all yield is demonstrated on MBE grown VCSEL structures.

Dual-scan technique for the customization of zirconia computer-aided design/computer-aided manufacturing frameworks.

PubMed

Andreiuolo, Rafael Ferrone; Sabrosa, Carlos Eduardo; Dias, Katia Regina H Cervantes

2013-09-01

The use of bi-layered all-ceramic crowns has continuously grown since the introduction of computer-aided design/computer-aided manufacturing (CAD/CAM) zirconia cores. Unfortunately, despite the outstanding mechanical properties of zirconia, problems related to porcelain cracking or chipping remain. One of the reasons for this is that ceramic copings are usually milled to uniform thicknesses of 0.3-0.6 mm around the whole tooth preparation. This may not provide uniform thickness or appropriate support for the veneering porcelain. To prevent these problems, the dual-scan technique demonstrates an alternative that allows the restorative team to customize zirconia CAD/CAM frameworks with adequate porcelain thickness and support in a simple manner.

On-chip micropatterning of plastic (cylic olefin copolymer, COC) microfluidic channels for the fabrication of biomolecule microarrays using photografting methods.

PubMed

Pu, Qiaosheng; Oyesanya, Olufemi; Thompson, Bowlin; Liu, Shantang; Alvarez, Julio C

2007-01-30

This paper reports on the surface modification of plastic microfluidic channels to prepare different biomolecule micropatterns using ultraviolet (UV) photografting methods. The linkage chemistry is based upon UV photopolymerization of acryl monomers to generate thin films (0.01-6 microm) chemically linked to the organic backbone of the plastic surface. The commodity thermoplastic, cyclic olefin copolymer (COC) was selected to build microfluidic chips because of its significant UV transparency and easiness for microfabrication by molding techniques. Once the polyacrylic films were grafted on the COC surface using photomasks, micropatterns of proteins, DNA, and biotinlated conjugates were readily obtained by surface chemical reactions in one or two subsequent steps. The thickness of the photografted films can be tuned from several nanometers up to several micrometers, depending on the reaction conditions. The micropatterned films can be prepared inside the microfluidic channel (on-chip) or on open COC surfaces (off-chip) with densities of functional groups about 10(-7) mol/cm2. Characterization of these films was performed by attenuated-total-reflectance IR spectroscopy, fluorescence microscopy, profilometry, atomic force microscopy, and electrokinetic methods.

Mechanical design optimization of a single-axis MOEMS accelerometer based on a grating interferometry cavity for ultrahigh sensitivity

NASA Astrophysics Data System (ADS)

Lu, Qianbo; Bai, Jian; Wang, Kaiwei; Lou, Shuqi; Jiao, Xufen; Han, Dandan; Yang, Guoguang

2016-08-01

The ultrahigh static displacement-acceleration sensitivity of a mechanical sensing chip is essential primarily for an ultrasensitive accelerometer. In this paper, an optimal design to implement to a single-axis MOEMS accelerometer consisting of a grating interferometry cavity and a micromachined sensing chip is presented. The micromachined sensing chip is composed of a proof mass along with its mechanical cantilever suspension and substrate. The dimensional parameters of the sensing chip, including the length, width, thickness and position of the cantilevers are evaluated and optimized both analytically and by finite-element-method (FEM) simulation to yield an unprecedented acceleration-displacement sensitivity. Compared with one of the most sensitive single-axis MOEMS accelerometers reported in the literature, the optimal mechanical design can yield a profound sensitivity improvement with an equal footprint area, specifically, 200% improvement in displacement-acceleration sensitivity with moderate resonant frequency and dynamic range. The modified design was microfabricated, packaged with the grating interferometry cavity and tested. The experimental results demonstrate that the MOEMS accelerometer with modified design can achieve the acceleration-displacement sensitivity of about 150μm/g and acceleration sensitivity of greater than 1500V/g, which validates the effectiveness of the optimal design.

Microrectenna: A Terahertz Antenna and Rectifier on a Chip

NASA Technical Reports Server (NTRS)

Siegel, Peter

2007-01-01

A microrectenna that would operate at a frequency of 2.5 THz has been designed and partially fabricated. The circuit is intended to be a prototype of an extremely compact device that could be used to convert radio-beamed power to DC to drive microdevices (see Figure 1). The microrectenna (see Figure 2) circuit consists of an antenna, a diode rectifier and a DC output port. The antenna consists of a twin slot array in a conducting ground plane (denoted the antenna ground plane) over an enclosed quarter-wavelength-thick resonant cavity (denoted the reflecting ground plane). The circuit also contains a planar high-frequency low-parasitic Schottky-barrier diode, a low-impedance microstrip transmission line, capacitors, and contact beam leads. The entire 3-D circuit is fabricated monolithically from a single GaAs wafer. The resonant cavity renders the slot radiation pattern unidirectional with a half-power beam width of about 65. A unique metal mesh on the rear of the wafer forms the backplate for the cavity but allows the GaAs to be wet etched from the rear surface of the twin slot antennas and ground plane. The beam leads protrude past the edge of the chip and are used both to mount the microrectenna and to make the DC electrical connection with external circuitry. The antenna ground plane and the components on top of it are formed on a 2- m thick GaAs membrane that is grown in the initial wafer MBE (molecular beam epitaxy) process. The side walls of the antenna cavity are not metal coated and, hence, would cause some loss of power; however, the relatively high permittivity (epsilon=13) of the GaAs keeps the cavity modes well confined, without the usual surface-wave losses associated with thick dielectric substrates. The Schottky-barrier diode has the usual submicron dimensions associated with THz operation and is formed in a mesa process above the antenna ground plane. The diode is connected at the midpoint of a microstrip transmission line, which is formed on 1- m-thick SiO (permittivity of 5) laid down on top of the GaAs membrane. The twin slots are fed in phase by this structure. To prevent radio-frequency (RF) leakage past the slot antennas, low-loss capacitors are integrated into the microstrip transmission line at the edges of the slots. The DC current- carrying lines extend from the outer edges of the capacitors, widen approaching the edges of the chip, and continue past the edges of the chip to become the beam leads used in tacking down the devices. The structure provides a self-contained RF to DC converter that works in the THz range.

Vacuum enhanced cutaneous biopsy instrument

DOEpatents

Collins, Joseph

2000-01-01

A syringe-like disposable cutaneous biopsy instrument equipped with a tubular blade at its lower end, and designed so that a vacuum is created during use, said vacuum serving to retain undeformed a plug of tissue cut from a patient's skin.

Design automation for complex CMOS/SOS LSI hybrid substrates

NASA Technical Reports Server (NTRS)

Ramondetta, P. W.; Smiley, J. W.

1976-01-01

A design automated approach used to develop thick-film hybrid packages is described. The hybrid packages produced combine thick-film and silicon on sapphire (SOS) laser surface interaction technologies to bring the on-chip performance level of SOS to the subsystem level. Packing densities are improved by a factor of eight over ceramic dual in-line packing; interchip wiring capacitance is low. Due to significant time savings, the design automated approach presented can be expected to yield a 3:1 reduction in cost over the use of manual methods for the initial design of a hybrid.

Space Radar Image of Weddell Sea Ice

NASA Image and Video Library

1999-04-15

This is the first calibrated, multi-frequency, multi-polarization spaceborne radar image of the seasonal sea-ice cover in the Weddell Sea, Antarctica. The multi-channel data provide scientists with details about the ice pack they cannot see any other way and indicates that the large expanse of sea-ice is, in fact, comprised of many smaller rounded ice floes, shown in blue-gray. These data are particularly useful in helping scientists estimate the thickness of the ice cover which is often extremely difficult to measure with other remote sensing systems. The extent, and especially thickness, of the polar ocean's sea-ice cover together have important implications for global climate by regulating the loss of heat from the ocean to the cold polar atmosphere. The image was acquired on October 3, 1994, by the Spaceborne Imaging Radar-C/X-Band Synthetic Aperture Radar (SIR-C/X-SAR) onboard the space shuttle Endeavour. This image is produced by overlaying three channels of radar data in the following colors: red (C-band, HH-polarization), green (L-band HV-polarization), and blue (L-band, HH-polarization). The image is oriented almost east-west with a center location of 58.2 degrees South and 21.6 degrees East. Image dimensions are 45 kilometers by 18 kilometers (28 miles by 11 miles). Most of the ice cover is composed of rounded, undeformed blue-gray floes, about 0.7 meters (2 feet) thick, which are surrounded by a jumble of red-tinged deformed ice pieces which are up to 2 meters (7 feet) thick. The winter cycle of ice growth and deformation often causes this ice cover to split apart, exposing open water or "leads." Ice growth within these openings is rapid due to the cold, brisk Antarctic atmosphere. Different stages of new-ice growth can be seen within the linear leads, resulting from continuous opening and closing. The blue lines within the leads are open water areas in new fractures which are roughened by wind. The bright red lines are an intermediate stage of new-ice growth perhaps 5 to 10 centimeters (2 to 4 inches) thick. The more extensive dark zones are covered by a slightly thicker layer of smooth, level ice up to 70 centimeters (28 inches) thick. http://photojournal.jpl.nasa.gov/catalog/PIA01786

Mass-manufacturable polymer microfluidic device for dual fiber optical trapping.

PubMed

De Coster, Diane; Ottevaere, Heidi; Vervaeke, Michael; Van Erps, Jürgen; Callewaert, Manly; Wuytens, Pieter; Simpson, Stephen H; Hanna, Simon; De Malsche, Wim; Thienpont, Hugo

2015-11-30

We present a microfluidic chip in Polymethyl methacrylate (PMMA) for optical trapping of particles in an 80µm wide microchannel using two counterpropagating single-mode beams. The trapping fibers are separated from the sample fluid by 70µm thick polymer walls. We calculate the optical forces that act on particles flowing in the microchannel using wave optics in combination with non-sequential ray-tracing and further mathematical processing. Our results are compared with a theoretical model and the Mie theory. We use a novel fabrication process that consists of a premilling step and ultraprecision diamond tooling for the manufacturing of the molds and double-sided hot embossing for replication, resulting in a robust microfluidic chip for optical trapping. In a proof-of-concept demonstration, we show the trapping capabilities of the hot embossed chip by trapping spherical beads with a diameter of 6µm, 8µm and 10µm and use the power spectrum analysis of the trapped particle displacements to characterize the trap strength.

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

NASA Technical Reports Server (NTRS)

Miller, TImothy M.; Jhabvala, Christine A.; Leong, Edward; Costen, Nicholas P.; Sharp, Elmer; Adachi, Tomoko; Benford, Dominic

2012-01-01

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit paths by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

Enabling Large Focal Plane Arrays through Mosaic Hybridization

NASA Technical Reports Server (NTRS)

Miller, Timothy M.; Jhabvala, Christine A.; Costen, Nick; Benford, Dominic J.

2012-01-01

We have demonstrated the hybridization of large mosaics of far-infrared detectors, joining separately fabricated sub-units into a single unit on a single, large substrate. We produced a single detector mockup on a 100mm diameter wafer and four mockup readout quadrant chips from a separate 100mm wafer. The individually fabricated parts were hybridized using a Suss FC150 flip chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion (CTE) match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the mockup mosaic-hybridized detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently demonstrated.

Optimized sensitivity of Silicon-on-Insulator (SOI) strip waveguide resonator sensor

PubMed Central

TalebiFard, Sahba; Schmidt, Shon; Shi, Wei; Wu, WenXuan; Jaeger, Nicolas A. F.; Kwok, Ezra; Ratner, Daniel M.; Chrostowski, Lukas

2017-01-01

Evanescent field sensors have shown promise for biological sensing applications. In particular, Silicon-on-Insulator (SOI)-nano-photonic based resonator sensors have many advantages for lab-on-chip diagnostics, including high sensitivity for molecular detection and compatibility with CMOS foundries for high volume manufacturing. We have investigated the optimum design parameters within the fabrication constraints of Multi-Project Wafer (MPW) foundries that result in the highest sensitivity for a resonator sensor. We have demonstrated the optimum waveguide thickness needed to achieve the maximum bulk sensitivity with SOI-based resonator sensors to be 165 nm using the quasi-TM guided mode. The closest thickness offered by MPW foundry services is 150 nm. Therefore, resonators with 150 nm thick silicon waveguides were fabricated resulting in sensitivities as high as 270 nm/RIU, whereas a similar resonator sensor with a 220 nm thick waveguide demonstrated sensitivities of approximately 200 nm/RIU. PMID:28270963

Fabrication of a Cryogenic Bias Filter for Ultrasensitive Focal Plane

NASA Technical Reports Server (NTRS)

Chervenak, James; Wollack, Edward

2012-01-01

A fabrication process has been developed for cryogenic in-line filtering for the bias and readout of ultrasensitive cryogenic bolometers for millimeter and submillimeter wavelengths. The design is a microstripline filter that cuts out, or strongly attenuates, frequencies (10 50 GHz) that can be carried by wiring staged at cryogenic temperatures. The filter must have 100-percent transmission at DC and low frequencies where the bias and readout lines will carry signal. The fabrication requires the encapsulation of superconducting wiring in a dielectric-metal envelope with precise electrical characteristics. Sufficiently thick insulation layers with high-conductivity metal layers fully surrounding a patterned superconducting wire in arrayable formats have been demonstrated. A degenerately doped silicon wafer has been chosen to provide a metallic ground plane. A metallic seed layer is patterned to enable attachment to the ground plane. Thick silicon dioxide films are deposited at low temperatures to provide tunable dielectric isolation without degrading the metallic seed layer. Superconducting wiring is deposited and patterned using microstripline filtering techniques to cut out the relevant frequencies. A low Tc superconductor is used so that it will attenuate power strongly above the gap frequency. Thick dielectric is deposited on top of the circuit, and then vias are patterned through both dielectric layers. A thick conductive film is deposited conformally over the entire circuit, except for the contact pads for the signal and bias attachments to complete the encapsulating ground plane. Filters are high-aspect- ratio rectangles, allowing close packing in one direction, while enabling the chip to feed through the wall of a copper enclosure. The chip is secured in the copper wall using a soft metal seal to make good thermal and electrical contact to the outer shield.

Major Element Analysis of the Target Rocks at Meteor Crater, Arizona

NASA Technical Reports Server (NTRS)

See, Thomas H.; Hoerz, Friedrich; Mittlefehldt, David W.; Varley, Laura; Mertzman, Stan; Roddy, David

2002-01-01

We collected approximately 400 rock chips in continuous vertical profile at Meteor Crater, Arizona, representing, from bottom to top, the Coconino, Toroweap, Kaibab, and Moenkopi Formations to support ongoing compositional analyses of the impact melts and their stratigraphic source depth(s) and other studies at Meteor Crater that depend on the composition of the target rocks. These rock chips were subsequently pooled into 23 samples for compositional analysis by XRF (x ray fluorescence) methods, each sample reflecting a specific stratigraphic "subsection" approximately 5-10 in thick. We determined the modal abundance of quartz, dolomite, and calcite for the entire Kaibab Formation at vertical resolutions of 1-2 meters. The Coconino Formation composes the lower half of the crater cavity. It is an exceptionally pure sandstone. The Toroweap is only two inches thick and compositionally similar to Coconino, therefore, it is not a good compositional marker horizon. The Kaibab Formation is approximately 80 in thick. XRD (x ray diffraction) studies show that the Kaibab Formation is dominated by dolomite and quartz, albeit in highly variable proportions; calcite is a minor phase at best. The Kaibab at Meteor Crater is therefore a sandy dolomite rather than a limestone, consistent with pronounced facies changes in the Permian of SE Arizona over short vertical and horizontal distances. The Moenkopi forms the 12 in thick cap rock and has the highest Al2O3 and FeO concentrations of all target rocks. With several examples, we illustrate how this systematic compositional and modal characterization of the target ideologies may contribute to an understanding of Meteor Crater, such as the depth of its melt zone, and to impact cratering in general, such as the liberation of CO2 from shocked carbonates.

Fabrication of multijunction high voltage concentrator solar cells by integrated circuit technology

NASA Technical Reports Server (NTRS)

Valco, G. J.; Kapoor, V. J.; Evans, J. C., Jr.; Chai, A.-T.

1981-01-01

Standard integrated circuit technology has been developed for the design and fabrication of planar multijunction (PMJ) solar cell chips. Each 1 cm x 1 cm solar chip consisted of six n(+)/p, back contacted, internally series interconnected unit cells. These high open circuit voltage solar cells were fabricated on 2 ohm-cm, p-type 75 microns thick, silicon substrates. A five photomask level process employing contact photolithography was used to pattern for boron diffusions, phorphorus diffusions, and contact metallization. Fabricated devices demonstrated an open circuit voltage of 3.6 volts and a short circuit current of 90 mA at 80 AMl suns. An equivalent circuit model of the planar multi-junction solar cell was developed.

On-chip broadband spectral filtering using planar double high-contrast grating reflectors

NASA Astrophysics Data System (ADS)

Horie, Yu; Arbabi, Amir; Faraon, Andrei

2015-02-01

We propose a broadband free-space on-chip spectrometer based on an array of integrated narrowband filters consisting of Fabry-Perot resonators formed by two high-contrast grating (HCG) based reflectors separated by a low-index thin layer with a fixed cavity thickness. Using numerical simulations, broadband tunability of resonance wavelengths was achieved only by changing the in-plane grating parameters such as period or duty cycle of HCGs while the substrate geometry was kept fixed. Experimentally, the HCG reflectors were fabricated on silicon on insulator (SOI) substrates and high reflectivity was measured, fabrication process for the proposed double HCG-based narrowband filter array was developed. The filtering function that can be spanned over a wide range of wavelengths was measured.

Submillimeter-Wave Amplifier Module with Integrated Waveguide Transitions

NASA Technical Reports Server (NTRS)

Samoska, Lorene; Chattopadhyay, Goutam; Pukala, David; Gaier, Todd; Soria, Mary; ManFung, King; Deal, William; Mei, Gerry; Radisic, Vesna; Lai, Richard

2009-01-01

To increase the usefulness of monolithic millimeter-wave integrated circuit (MMIC) components at submillimeter-wave frequencies, a chip has been designed that incorporates two integrated, radial E-plane probes with an MMIC amplifier in between, thus creating a fully integrated waveguide module. The integrated amplifier chip has been fabricated in 35-nm gate length InP high-electron-mobility-transistor (HEMT) technology. The radial probes were mated to grounded coplanar waveguide input and output lines in the internal amplifier. The total length of the internal HEMT amplifier is 550 m, while the total integrated chip length is 1,085 m. The chip thickness is 50 m with the chip width being 320 m. The internal MMIC amplifier is biased through wire-bond connections to the gates and drains of the chip. The chip has 3 stages, employing 35-nm gate length transistors in each stage. Wire bonds from the DC drain and gate pads are connected to off-chip shunt 51-pF capacitors, and additional off-chip capacitors and resistors are added to the gate and drain bias lines for low-frequency stability of the amplifier. Additionally, bond wires to the grounded coplanar waveguide pads at the RF input and output of the internal amplifier are added to ensure good ground connections to the waveguide package. The S-parameters of the module, not corrected for input or output waveguide loss, are measured at the waveguide flange edges. The amplifier module has over 10 dB of gain from 290 to 330 GHz, with a peak gain of over 14 dB at 307 GHz. The WR2.2 waveguide cutoff is again observed at 268 GHz. The module is biased at a drain current of 27 mA, a drain voltage of 1.24 V, and a gate voltage of +0.21 V. Return loss of the module is very good between 5 to 25 dB. This result illustrates the usefulness of the integrated radial probe transition, and the wide (over 10-percent) bandwidth that one can expect for amplifier modules with integrated radial probes in the submillimeter-regime (>300 GHz).

Transparent Conducting Oxides for Infrared Plasmonic Waveguides: ZnO (Preprint)

DTIC Science & Technology

2014-01-15

dependence of mobility (µ) on thickness (d). 15. SUBJECT TERMS microcavity; polariton ; strong coupling; ZnO 16. SECURITY CLASSIFICATION OF: 17...dimensions below the diffraction limit. Keywords: microcavity; polariton ; strong coupling; ZnO INTRODUCTION The field of plasmonics has received...optical computing and chips, enhanced signal detectors, etc3. Surface plasmon polaritons (SPPs) are quasi-particles or excitations that result from

Using dual-polarization interferometry to study surface-initiated DNA hybridization chain reactions in real time.

PubMed

Huang, Fujian; Xu, Pingping; Liang, Haojun

2014-01-15

In this study we used dual-polarization interferometry to investigate DNA hybridization chain reactions (HCRs) at solid-liquid interfaces. We monitored the effects of variations in mass, thickness, and density of the immobilized initiator on the subsequent HCRs at various salt concentrations. At low salt concentrations, the single-stranded DNA (ssDNA) initiator was attached uniformly to the chip surface. At high salt concentrations, it lay on the surface at the onset of the immobilization process, but the approaching ssDNA forced the pre-immobilized ssDNA strands to extend into solution as a result of increased electrostatic repulsion between the pre-adsorbed and approaching ssDNA chains. Injection of a mixture of H1 and H2 increased the mass and thickness of the films initially, but thereafter the thickness decreased. These changes indicate that the long double-stranded DNA that formed lay on the surface, rather than extended into the solution, thereby suppressing the subsequent initiation activity of the released single-strand parts of H1 and H2. Increasing the salt concentration increased the HCR efficiency and reaction rate. The HCR efficiency of the initiator ssDNA immobilized on its 5' end was higher than that immobilized on its 3' end, suggesting that the released single-strand parts of H1 and H2 close to the chip surface decreased the initiation activity relative to those of the ones extending into solution. © 2013 Elsevier B.V. All rights reserved.

Tapered Optical Fiber Sensor for Label-Free Detection of Biomolecules

PubMed Central

Tian, Ye; Wang, Wenhui; Wu, Nan; Zou, Xiaotian; Wang, Xingwei

2011-01-01

This paper presents a fast, highly sensitive and low-cost tapered optical fiber biosensor that enables the label-free detection of biomolecules. The sensor takes advantage of the interference effect between the fiber’s first two propagation modes along the taper waist region. The biomolecules bonded on the taper surface were determined by demodulating the transmission spectrum phase shift. Because of the sharp spectrum fringe signals, as well as a relatively long biomolecule testing region, the sensor displayed a fast response and was highly sensitive. To better understand the influence of various biomolecules on the sensor, a numerical simulation that varied biolayer parameters such as thickness and refractive index was performed. The results showed that the spectrum fringe shift was obvious to be measured even when the biolayer was only nanometers thick. A microchannel chip was designed and fabricated for the protection of the sensor and biotesting. Microelectromechanical systems (MEMS) fabrication techniques were used to precisely control the profile and depth of the microchannel on the silicon chip with an accuracy of 2 μm. A tapered optical fiber biosensor was fabricated and evaluated with an Immune globulin G (IgG) antibody-antigen pair. PMID:22163821

Tapered optical fiber sensor for label-free detection of biomolecules.

PubMed

Tian, Ye; Wang, Wenhui; Wu, Nan; Zou, Xiaotian; Wang, Xingwei

2011-01-01

This paper presents a fast, highly sensitive and low-cost tapered optical fiber biosensor that enables the label-free detection of biomolecules. The sensor takes advantage of the interference effect between the fiber's first two propagation modes along the taper waist region. The biomolecules bonded on the taper surface were determined by demodulating the transmission spectrum phase shift. Because of the sharp spectrum fringe signals, as well as a relatively long biomolecule testing region, the sensor displayed a fast response and was highly sensitive. To better understand the influence of various biomolecules on the sensor, a numerical simulation that varied biolayer parameters such as thickness and refractive index was performed. The results showed that the spectrum fringe shift was obvious to be measured even when the biolayer was only nanometers thick. A microchannel chip was designed and fabricated for the protection of the sensor and biotesting. Microelectromechanical systems (MEMS) fabrication techniques were used to precisely control the profile and depth of the microchannel on the silicon chip with an accuracy of 2 μm. A tapered optical fiber biosensor was fabricated and evaluated with an Immune globulin G (IgG) antibody-antigen pair.

Integrated Flexible Electronic Devices Based on Passive Alignment for Physiological Measurement

PubMed Central

Ryu, Jin Hwa; Byun, Sangwon; Baek, In-Bok; Lee, Bong Kuk; Jang, Won Ick; Jang, Eun-Hye; Kim, Ah-Yung; Yu, Han Yung

2017-01-01

This study proposes a simple method of fabricating flexible electronic devices using a metal template for passive alignment between chip components and an interconnect layer, which enabled efficient alignment with high accuracy. An electrocardiogram (ECG) sensor was fabricated using 20 µm thick polyimide (PI) film as a flexible substrate to demonstrate the feasibility of the proposed method. The interconnect layer was fabricated by a two-step photolithography process and evaporation. After applying solder paste, the metal template was placed on top of the interconnect layer. The metal template had rectangular holes at the same position as the chip components on the interconnect layer. Rectangular hole sizes were designed to account for alignment tolerance of the chips. Passive alignment was performed by simply inserting the components in the holes of the template, which resulted in accurate alignment with positional tolerance of less than 10 µm based on the structural design, suggesting that our method can efficiently perform chip mounting with precision. Furthermore, a fabricated flexible ECG sensor was easily attachable to the curved skin surface and able to measure ECG signals from a human subject. These results suggest that the proposed method can be used to fabricate epidermal sensors, which are mounted on the skin to measure various physiological signals. PMID:28420219

Novel wafer stepper with violet LED light source

NASA Astrophysics Data System (ADS)

Ting, Yung-Chiang; Shy, Shyi-Long

2014-03-01

Novel wafer stepper by using contact or proximity printing will be developed, using violet LED light source to replace Hg Arc. lamp or laser. Mirror, filter and condenser lens for Hg Arc. Lamp or laser and reduction lens for projection printing can be discarded. Reliability and manufacturing cost of wafer stepper can be improved. Exposure result by using IP3600 resist and wafer stepper with violet LED light source (wave-length 360nm to 410 nm) will be obtained. This novel wafer stepper can be used for 3DIC, MEMS and bio-chip lithography application by using thin and thick resist with sub-micron to 100 micron thickness.

Choosing a therapy electron accelerator target.

PubMed

Hutcheon, R M; Schriber, S O; Funk, L W; Sherman, N K

1979-01-01

Angular distributions of photon depth dose produced by 25-MeV electrons incident on several fully stopping single-element targets (C, Al, Cu, Mo, Ta, Pb) and two composite layered targets (Ni-Al, W-Al) were studied. Depth-dose curves measured using TLD-700 (thermoluminescent dosimeter) chips embedded in lucite phantoms. Several useful therapy electron accelerator design curves were determined, including relative flattener thickness as a function of target atomic number, "effective" bremsstrahlung endpoint energy or beam "hardness" as a function of target atomic number and photon emission angle, and estimates of shielding thickness as a function of angle required to reduce the radiation outside the treatment cone to required levels.

A High-Voltage SOI CMOS Exciter Chip for a Programmable Fluidic Processor System.

PubMed

Current, K W; Yuk, K; McConaghy, C; Gascoyne, P R C; Schwartz, J A; Vykoukal, J V; Andrews, C

2007-06-01

A high-voltage (HV) integrated circuit has been demonstrated to transport fluidic droplet samples on programmable paths across the array of driving electrodes on its hydrophobically coated surface. This exciter chip is the engine for dielectrophoresis (DEP)-based micro-fluidic lab-on-a-chip systems, creating field excitations that inject and move fluidic droplets onto and about the manipulation surface. The architecture of this chip is expandable to arrays of N X N identical HV electrode driver circuits and electrodes. The exciter chip is programmable in several senses. The routes of multiple droplets may be set arbitrarily within the bounds of the electrode array. The electrode excitation waveform voltage amplitude, phase, and frequency may be adjusted based on the system configuration and the signal required to manipulate a particular fluid droplet composition. The voltage amplitude of the electrode excitation waveform can be set from the minimum logic level up to the maximum limit of the breakdown voltage of the fabrication technology. The frequency of the electrode excitation waveform can also be set independently of its voltage, up to a maximum depending upon the type of droplets that must be driven. The exciter chip can be coated and its oxide surface used as the droplet manipulation surface or it can be used with a top-mounted, enclosed fluidic chamber consisting of a variety of materials. The HV capability of the exciter chip allows the generated DEP forces to penetrate into the enclosed chamber region and an adjustable voltage amplitude can accommodate a variety of chamber floor thicknesses. This demonstration exciter chip has a 32 x 32 array of nominally 100 V electrode drivers that are individually programmable at each time point in the procedure to either of two phases: 0deg and 180deg with respect to the reference clock. For this demonstration chip, while operating the electrodes with a 100-V peak-to-peak periodic waveform, the maximum HV electrode waveform frequency is about 200 Hz; and standard 5-V CMOS logic data communication rate is variable up to 250 kHz. This HV demonstration chip is fabricated in a 130-V 1.0-mum SOI CMOS fabrication technology, dissipates a maximum of 1.87 W, and is about 10.4 mm x 8.2 mm.

Nonlocal postbuckling analysis of graphene sheets with initial imperfection based on first order shear deformation theory

NASA Astrophysics Data System (ADS)

Soleimani, Ahmad; Naei, Mohammad Hasan; Mashhadi, Mahmoud Mosavi

In this paper, the first order shear deformation theory (FSDT) is used to investigate the postbuckling behavior of orthotropic single-layered graphene sheet (SLGS) under in-plane loadings. Nonlocal elasticity theory and von-Karman nonlinear model in combination with the isogeometric analysis (IGA) have been applied to study the postbuckling characteristics of SLGSs. In contrast to the classical model, the nonlocal continuum model developed in this work considers the size-effects on the postbuckling characteristics of SLGSs. FSDT takes into account effects of shear deformations through-the-thickness of plate. Geometric imperfection which is defined as a very small transverse displacement of the mid-plane is applied on undeformed nanoplate to create initial deviation in graphene sheet from being perfectly flat. Nonlinear governing equations of motion for SLGS are derived from the principle of virtual work and a variational formulation. At the end, the results are presented as the postbuckling equilibrium paths of SLGS. The influence of various parameters such as edge length, nonlocal parameter, compression ratio, boundary conditions and aspect ratio on the postbuckling path is investigated. The results of this work show the high accuracy of nonlocal FSDT-based analysis for postbuckling behavior of graphene sheets.

Tectonic triggering of slump sheets in the Upper Cretaceous carbonate succession of the Porto Selvaggio area (Salento peninsula, southern Italy): Synsedimentary tectonics in the Apulian Carbonate Platform

NASA Astrophysics Data System (ADS)

Mastrogiacomo, G.; Moretti, M.; Owen, G.; Spalluto, L.

2012-08-01

Soft-sediment deformation structures crop out in the Upper Cretaceous carbonate succession in Porto Selvaggio cove in the western Salento peninsula, Apulian foreland, southern Italy. The deformed interval is about 13 m thick and occurs between shallow-water limestones and dolostones formed in peritidal and shallow subtidal environments. It comprises well-bedded grey mudstones interlayered with dark grey laminated microbioclastic wackestones characterized by couplets of closely spaced dark and bright laminae marked by the parallel orientation of calcareous microbioclasts and thin-shelled bivalves. The low biological diversity, scarcity of burrowing biota, and presence of a well preserved fish fauna provide evidence of anoxic conditions occurring in morphological depressions within the platform, and a stagnant, stratified water body affected by weak bottom currents, indicating the sudden development of a localised and short-lived intraplatform basin. Two soft-sediment deformation horizons (slump sheets) separated by undeformed limestones with similar facies occur in this part of the succession. The lower, thicker slump sheet (1.0-1.3 m thick) contains asymmetric and box folds. Well-developed décollement surfaces (locally containing thick brecciated zones) cut the folds, forming small-scale thrust-sheets and indicating mixed plastic to brittle behaviour. The upper, thinner slump sheet (0.25-0.35 m thick) contains only asymmetric folds, indicating plastic behaviour only. The differences in deformation style are attributed to differences in facies. Measurements of fold-axis orientations in the slump sheets show that they moved in similar directions, recording the development of a local, gently dipping palaeoslope. Autogenic (internal) trigger mechanisms are ruled out by a detailed consideration of facies. The slump sheets were triggered by allogenic, tectonic effects, either the weakening of sediment by seismic activity or the tectonically induced steepening of slopes, or a combination of both. Tectonically induced steepening is consistent with localised and sudden vertical facies changes related to the creation of an intraplatform basin. The occurrence of slump sheets in carbonate platform successions is unusual since carbonate platforms are normally associated with shelves or low-angle ramps.

Preparation of a YAG:Ce phosphor glass by screen-printing technology and its application in LED packaging.

PubMed

Yang, Liang; Chen, Mingxiang; Lv, Zhicheng; Wang, Simin; Liu, Xiaogang; Liu, Sheng

2013-07-01

A simple and practical method for preparing phosphor glass is proposed. Phosphor distribution and element analysis are investigated by optical microscope and field emission scanning electron microscope (FE-SEM). The phosphor particles dispersed in the matrix are vividly observed, and their distributions are uniform. Spectrum distribution and color coordinates dependent on the thickness of the screen-printed phosphor layer coupled with a blue light emitting diode (LED) chip are studied. The luminous efficacy of the 75 μm printed phosphor-layer phosphor glass packaged white LED is 81.24 lm/W at 350 mA. This study opens up many possibilities for applications using the phosphor glass on a selected chip in which emission is well absorbed by all phosphors. The screen-printing technique also offers possibilities for the design and engineering of complex phosphor layers on glass substrates. Phosphor screen-printing technology allows the realization of high stability and thermal conductivity for the phosphor layer. This phosphor glass method provides many possibilities for LED packing, including thin-film flip chip and remote phosphor technology.

Light-extraction enhancement of GaN-based 395  nm flip-chip light-emitting diodes by an Al-doped ITO transparent conductive electrode.

PubMed

Xu, Jin; Zhang, Wei; Peng, Meng; Dai, Jiangnan; Chen, Changqing

2018-06-01

The distinct ultraviolet (UV) light absorption of indium tin oxide (ITO) limits the performance of GaN-based near-UV light-emitting diodes (LEDs). Herein, we report an Al-doped ITO with enhanced UV transmittance and low sheet resistance as the transparent conductive electrode for GaN-based 395 nm flip-chip near-UV LEDs. The thickness dependence of optical and electrical properties of Al-doped ITO films is investigated. The optimal Al-doped ITO film exhibited a transmittance of 93.2% at 395 nm and an average sheet resistance of 30.1  Ω/sq. Meanwhile, at an injection current of 300 mA, the forward voltage decreased from 3.14 to 3.11 V, and the light output power increased by 13% for the 395 nm near-UV flip-chip LEDs with the optimal Al-doped ITO over those with pure ITO. This Letter provides a simple and repeatable approach to further improve the light extraction efficiency of GaN-based near-UV LEDs.

Enabling Large Focal Plane Arrays Through Mosaic Hybridization

NASA Technical Reports Server (NTRS)

Miller, Timothy M.; Jhabvala, Christine A.; Leong, Edward; Costen, Nick P.; Sharp, Elmer; Adachi, Tomoko; Benford, Dominic J.

2012-01-01

We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit patbs by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabric.ted parts were hybridized using a Suss FCI50 flip chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.

GOSSIP: A vertex detector combining a thin gas layer as signal generator with a CMOS readout pixel array

NASA Astrophysics Data System (ADS)

Campbell, M.; Heijne, E. H. M.; Llopart, X.; Colas, P.; Giganon, A.; Giomataris, Y.; Chefdeville, M.; Colijn, A. P.; Fornaini, A.; van der Graaf, H.; Kluit, P.; Timmermans, J.; Visschers, J. L.; Schmitz, J.

2006-05-01

A small TPC has been read out by means of a Medipix2 chip as direct anode. A Micromegas foil was placed 50 μm above the chip, and electron multiplication occurred in the gap. With a He/isobutane 80/20 mixture, gas multiplication factors up to tens of thousands were achieved, resulting in an efficiency for detecting single electrons of better than 90%. With this new readout technology for gas-filled detectors we recorded many image frames containing 2D images with tracks from cosmic muons. Along these tracks, electron clusters were observed, as well as δ-rays. With a gas layer thickness of only 1 mm, the device could be applied as vertex detector, outperforming all Si-based detectors.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Beck, M. A., E-mail: mabeck2@wisc.edu; Isaacs, J. A.; Booth, D.

We describe the design and characterization of superconducting coplanar waveguide cavities tailored to facilitate strong coupling between superconducting quantum circuits and single trapped Rydberg atoms. For initial superconductor–atom experiments at 4.2 K, we show that resonator quality factors above 10{sup 4} can be readily achieved. Furthermore, we demonstrate that the incorporation of thick-film copper electrodes at a voltage antinode of the resonator provides a route to enhance the zero-point electric fields of the resonator in a trapping region that is 40 μm above the chip surface, thereby minimizing chip heating from scattered trap light. The combination of high resonator quality factor andmore » strong electric dipole coupling between the resonator and the atom should make it possible to achieve the strong coupling limit of cavity quantum electrodynamics with this system.« less

Mechanical and physical properties of wood fiber-reinforced, sulfur-based wood composites

Treesearch

Chung-Yun Hse; Ben S. Bryant

1993-01-01

Sulfur-based composite was made from sulfur impregnated, oven dried, wet-formed fiber mats. The fiber mats consisted of a 50/50 mixture of recycled newsprint pulp and mechanical hardwood pulp from several species made from chips in a laboratory refiner. The thickness of the composites was 0.125 inch and the specific gravity of the unimpregnated fiber mat was 0.2. The...

Advanced Sensors for TBI

DTIC Science & Technology

2016-12-01

SMD-VAC- GP, Virtual Industries) with plastic tip. Then the chip was covered with silicone open-cell foam (0.062” thick, HT -870, Stockwell...the build. 26 We discussed with a sub- contractor in Livermore who might be able to perform the packaging assembly work. Dr. Kotovsky...worked with the sub- contractor on practice assemblies anticipating the new upcoming build. Working through an outside contractor represents an enormous

Thin hybrid pixel assembly with backside compensation layer on ROIC

NASA Astrophysics Data System (ADS)

Bates, R.; Buttar, C.; McMullen, T.; Cunningham, L.; Ashby, J.; Doherty, F.; Gray, C.; Pares, G.; Vignoud, L.; Kholti, B.; Vahanen, S.

2017-01-01

The entire ATLAS inner tracking system will be replaced for operation at the HL-LHC . This will include a significantly larger pixel detector of approximately 15 m2. For this project, it is critical to reduce the mass of the hybrid pixel modules and this requires thinning both the sensor and readout chips to about 150 micrometres each. The thinning of the silicon chips leads to low bump yield for SnAg bumps due to bad co-planarity of the two chips at the solder reflow stage creating dead zones within the pixel array. In the case of the ATLAS FEI4 pixel readout chip thinned to 100 micrometres, the chip is concave, with the front side in compression, with a bow of +100 micrometres at room temperature which varies to a bow of -175 micrometres at the SnAg solder reflow temperature, caused by the CTE mismatch between the materials in the CMOS stack and the silicon substrate. A new wafer level process to address the issue of low bump yield be controlling the chip bow has been developed. A back-side dielectric and metal stack of SiN and Al:Si has been deposited on the readout chip wafer to dynamically compensate the stress of the front side stack. In keeping with a 3D process the materials used are compatible with Through Silicon Via (TSV) technology with a TSV last approach which is under development for this chip. It is demonstrated that the amplitude of the correction can be manipulated by the deposition conditions and thickness of the SiN/Al:Si stack. The bow magnitude over the temperature range for the best sample to date is reduced by almost a factor of 4 and the sign of the bow (shape of the die) remains constant. Further development of the backside deposition conditions is on-going with the target of close to zero bow at the solder reflow temperature and a minimal bow magnitude throughout the temperature range. Assemblies produced from FEI4 readout wafers thinned to 100 micrometres with the backside compensation layer have been made for the first time and demonstrate bond yields close to 100%.

Three-dimensional bioprinting of thick vascularized tissues

NASA Astrophysics Data System (ADS)

Kolesky, David B.; Homan, Kimberly A.; Skylar-Scott, Mark A.; Lewis, Jennifer A.

2016-03-01

The advancement of tissue and, ultimately, organ engineering requires the ability to pattern human tissues composed of cells, extracellular matrix, and vasculature with controlled microenvironments that can be sustained over prolonged time periods. To date, bioprinting methods have yielded thin tissues that only survive for short durations. To improve their physiological relevance, we report a method for bioprinting 3D cell-laden, vascularized tissues that exceed 1 cm in thickness and can be perfused on chip for long time periods (>6 wk). Specifically, we integrate parenchyma, stroma, and endothelium into a single thick tissue by coprinting multiple inks composed of human mesenchymal stem cells (hMSCs) and human neonatal dermal fibroblasts (hNDFs) within a customized extracellular matrix alongside embedded vasculature, which is subsequently lined with human umbilical vein endothelial cells (HUVECs). These thick vascularized tissues are actively perfused with growth factors to differentiate hMSCs toward an osteogenic lineage in situ. This longitudinal study of emergent biological phenomena in complex microenvironments represents a foundational step in human tissue generation.

Packaging Technologies for High Temperature Electronics and Sensors

NASA Technical Reports Server (NTRS)

Chen, Liangyu; Hunter, Gary W.; Neudeck, Philip G.; Beheim, Glenn M.; Spry, David J.; Meredith, Roger D.

2013-01-01

This paper reviews ceramic substrates and thick-film metallization based packaging technologies in development for 500degC silicon carbide (SiC) electronics and sensors. Prototype high temperature ceramic chip-level packages and printed circuit boards (PCBs) based on ceramic substrates of aluminum oxide (Al2O3) and aluminum nitride (AlN) have been designed and fabricated. These ceramic substrate-based chiplevel packages with gold (Au) thick-film metallization have been electrically characterized at temperatures up to 550degC. A 96% alumina based edge connector for a PCB level subsystem interconnection has also been demonstrated recently. The 96% alumina packaging system composed of chip-level packages and PCBs has been tested with high temperature SiC devices at 500degC for over 10,000 hours. In addition to tests in a laboratory environment, a SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE-7 suite to the International Space Station via a Shuttle mission. This packaged SiC transistor was successfully tested in orbit for eighteen months. A spark-plug type sensor package designed for high temperature SiC capacitive pressure sensors was developed. This sensor package combines the high temperature interconnection system with a commercial high temperature high pressure stainless steel seal gland (electrical feed-through). Test results of a packaged high temperature capacitive pressure sensor at 500degC are also discussed. In addition to the pressure sensor package, efforts for packaging high temperature SiC diode-based gas chemical sensors are in process.

The development of lab-on-a-chip fabricated from two molds

NASA Astrophysics Data System (ADS)

Pramuanjaroenkij, A.; Bunta, J.; Thiangpadung, J.; Sansaradee, S.; Kamsopa, P.; Sodsai, S.; Vichainsan, S.; Wongpanit, K.; Maturos, T.; Lomas, T.; Tuantranont, A.; Cetin, B.; Phankhoksoong, S.; Tongkratoke, A.

2018-01-01

Development of diagnostic technique of microfluidic or lab-on-a-chip (LOCs) is currently of great interest for researchers and inventors for their many advantages. It can be used as a real laboratory was many ways to help to the diagnosis faster. This research aims to develop Polydimethylsiloxane (PDMS) lab-on-a-chip (LOCs) which were produced from different molds; the silicon wafer mold and the stainless mold to investigate the flow of the biological sample as the flow in nanochannels. In addition, this research proposes a means to leakage and the blockage of the channel flow. The experimental results were found that the LOCs casted from the silicon wafer mold sandwiched by both the plasma cleaner machine and H shaped acrylic sheets showed leakages around the electrode areas because the first new electrodes were too thick, the proper thickness of the nickel electrode was at 0.05 millimeters. The LOCs casted from the stainless mold were inserted by the nickel electrodes produced by the from the prototype shaped electroplating process; this LOCs using nickel plated electrodes 2 times to make a groove on the nickel electrode backsides when pouring the PDMS into the LOCs casted from the stainless mold. It was found that PDMS was able to flow under the nickel electrode and the PDMS sheet could stick with the glass slide smoothly. In conclusion, it was possible to develop these LOC designs and new electrode fabrications continually under helps from Micro-Electro-Mechanical system, Thailand National Electronics and Computer Technology Center, since causes of the LOC problems were found, and demonstrated the feasibility of developing the LOCs for chemical detection and disease diagnostics.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Nabeel A. Riza

The goals of the second six months of the Phase 2 of this project were to conduct first time experimental studies using optical designs and some initial hardware developed in the first 6 months of Phase 2. One focus is to modify the SiC chip optical properties to enable gas species sensing with a specific gas species under high temperature and pressure. The goal was to acquire sensing test data using two example inert and safe gases and show gas discrimination abilities. A high pressure gas mixing chamber was to be designed and assembled to achieve the mentioned gas sensingmore » needs. Another goal was to initiate high temperature probe design by developing and testing a probe design that leads to accurately measuring the thickness of the deployed SiC sensor chip to enable accurate overall sensor system design. The third goal of this phase of the project was to test the SiC chip under high pressure conditions using the earlier designed calibration cell to enable it to act as a pressure sensor when doing gas detection. In this case, experiments using a controlled pressure system were to deliver repeatable pressure measurement data. All these goals have been achieved and are described in detail in the report. Both design process and diagrams for the mechanical elements as well as the optical systems are provided. Photographs or schematics of the fabricated hardware are provided. Experimental data from the three optical sensor systems (i.e., Thickness, pressure, and gas species) is provided. The design and experimentation results are summarized to give positive conclusions on the proposed novel high temperature high pressure gas species detection optical sensor technology.« less

Effects of short-term repeated exposure to different flooring surfaces on the behavior and physiology of dairy cattle.

PubMed

Schütz, K E; Cox, N R

2014-05-01

Dairy cattle managed in some pasture-based systems such as in New Zealand are predominantly kept outdoors all year around, but are often taken off pasture for periods of time in wet weather to avoid soil damage. It is common to keep cattle on concrete surfaces during such "stand-off" practices and we investigated whether the addition of rubber matting onto concrete areas improves the welfare of dairy cattle. Sixteen groups of 5 cows (4 groups/treatment, 5 cows/group) were allocated to 1 of 4 treatments (concrete, 12-mm-thick rubber mat, 24-mm-thick rubber mat, or deep-bedded wood chips) and kept on these surfaces for 18 h/24h for 4 consecutive days (6h on pasture/24h). Each 4-d stand-off period was repeated 4 times (with 7 d of recovery between periods) to study the accumulated effects of repeated stand-off. Lying behavior was recorded continuously during the experiment. Gait score, stride length, hygiene score, live weight, and blood samples for cortisol analysis were recorded immediately before and after each stand-off period. Cows on wood chips spent the most time lying, and cows on concrete spent the least time lying compared with those on other surfaces [wood chips: 10.8h, 24-mm rubber mat: 7.3h, 12-mm rubber mat: 6.0 h, and concrete: 2.8h/18 h, standard error of the difference (SED): 0.71 h]. Cows on concrete spent more time lying during the 6h on pasture, likely compensating for the reduced lying during the stand-off period. Similarly, cows on concrete spent more time lying on pasture between stand-off periods (concrete: 12.1h, 12-mm rubber mat: 11.1h, 24-mm rubber mat: 11.2h, and wood chips: 10.7h/24h, SED: 0.28 h). Cows on concrete had higher gait score and shorter stride length after the 4-d stand-off period compared with cows on the other surface types, suggesting a change in gait pattern caused by discomfort. Cows on rubber mats were almost 3 times dirtier than cows on concrete or wood chips. Cortisol and live weight decreased for all treatment groups during the stand-off period. We observed no major effect of the repeated stand-off exposure. In summary, adding rubber matting onto concrete surfaces for stand-off purposes is beneficial for animal welfare. A well-managed wood chip surface offered the best welfare for dairy cows removed from pasture, and the findings of this study confirm that a concrete surface decreases the welfare of cows removed from pasture. Copyright © 2014 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

Nondestructive web thickness measurement of micro-drills with an integrated laser inspection system

NASA Astrophysics Data System (ADS)

Chuang, Shui-Fa; Chen, Yen-Chung; Chang, Wen-Tung; Lin, Ching-Chih; Tarng, Yeong-Shin

2010-09-01

Nowadays, the electric and semiconductor industries use numerous micro-drills to machine micro-holes in printed circuit boards. The measurement of web thickness of micro-drills, a key parameter of micro-drill geometry influencing drill rigidity and chip-removal ability, is quite important to ensure quality control. Traditionally, inefficiently destructive measuring method is adopted by inspectors. To improve quality and efficiency of the web thickness measuring tasks, a nondestructive measuring method is required. In this paper, based on the laser micro-gauge (LMG) and laser confocal displacement meter (LCDM) techniques, a nondestructive measuring principle of web thickness of micro-drills is introduced. An integrated laser inspection system, mainly consisting of a LMG, a LCDM and a two-axis-driven micro-drill fixture device, was developed. Experiments meant to inspect web thickness of micro-drill samples with a nominal diameter of 0.25 mm were conducted to test the feasibility of the developed laser inspection system. The experimental results showed that the web thickness measurement could achieve an estimated repeatability of ± 1.6 μm and a worst repeatability of ± 7.5 μm. The developed laser inspection system, combined with the nondestructive measuring principle, was able to undertake the web thickness measuring tasks for certain micro-drills.

Continuously tunable solution-processed organic semiconductor DFB lasers pumped by laser diode.

PubMed

Klinkhammer, Sönke; Liu, Xin; Huska, Klaus; Shen, Yuxin; Vanderheiden, Sylvia; Valouch, Sebastian; Vannahme, Christoph; Bräse, Stefan; Mappes, Timo; Lemmer, Uli

2012-03-12

The fabrication and characterization of continuously tunable, solution-processed distributed feedback (DFB) lasers in the visible regime is reported. Continuous thin film thickness gradients were achieved by means of horizontal dipping of several conjugated polymer and blended small molecule solutions on cm-scale surface gratings of different periods. We report optically pumped continuously tunable laser emission of 13 nm in the blue, 16 nm in the green and 19 nm in the red spectral region on a single chip respectively. Tuning behavior can be described with the Bragg-equation and the measured thickness profile. The laser threshold is low enough that inexpensive laser diodes can be used as pump sources.

Multi-angle lensless digital holography for depth resolved imaging on a chip.

PubMed

Su, Ting-Wei; Isikman, Serhan O; Bishara, Waheb; Tseng, Derek; Erlinger, Anthony; Ozcan, Aydogan

2010-04-26

A multi-angle lensfree holographic imaging platform that can accurately characterize both the axial and lateral positions of cells located within multi-layered micro-channels is introduced. In this platform, lensfree digital holograms of the micro-objects on the chip are recorded at different illumination angles using partially coherent illumination. These digital holograms start to shift laterally on the sensor plane as the illumination angle of the source is tilted. Since the exact amount of this lateral shift of each object hologram can be calculated with an accuracy that beats the diffraction limit of light, the height of each cell from the substrate can be determined over a large field of view without the use of any lenses. We demonstrate the proof of concept of this multi-angle lensless imaging platform by using light emitting diodes to characterize various sized microparticles located on a chip with sub-micron axial and lateral localization over approximately 60 mm(2) field of view. Furthermore, we successfully apply this lensless imaging approach to simultaneously characterize blood samples located at multi-layered micro-channels in terms of the counts, individual thicknesses and the volumes of the cells at each layer. Because this platform does not require any lenses, lasers or other bulky optical/mechanical components, it provides a compact and high-throughput alternative to conventional approaches for cytometry and diagnostics applications involving lab on a chip systems.

Finite Element Simulations of Micro Turning of Ti-6Al-4V using PCD and Coated Carbide tools

NASA Astrophysics Data System (ADS)

Jagadesh, Thangavel; Samuel, G. L.

2017-02-01

The demand for manufacturing axi-symmetric Ti-6Al-4V implants is increasing in biomedical applications and it involves micro turning process. To understand the micro turning process, in this work, a 3D finite element model has been developed for predicting the tool chip interface temperature, cutting, thrust and axial forces. Strain gradient effect has been included in the Johnson-Cook material model to represent the flow stress of the work material. To verify the simulation results, experiments have been conducted at four different feed rates and at three different cutting speeds. Since titanium alloy has low Young's modulus, spring back effect is predominant for higher edge radius coated carbide tool which leads to the increase in the forces. Whereas, polycrystalline diamond (PCD) tool has smaller edge radius that leads to lesser forces and decrease in tool chip interface temperature due to high thermal conductivity. Tool chip interface temperature increases by increasing the cutting speed, however the increase is less for PCD tool as compared to the coated carbide tool. When uncut chip thickness decreases, there is an increase in specific cutting energy due to material strengthening effects. Surface roughness is higher for coated carbide tool due to ploughing effect when compared with PCD tool. The average prediction error of finite element model for cutting and thrust forces are 11.45 and 14.87 % respectively.

Superior Sensitivity of Copper-Based Plasmonic Biosensors.

PubMed

Stebunov, Yury V; Yakubovsky, Dmitry I; Fedyanin, Dmitry Yu; Arsenin, Aleksey V; Volkov, Valentyn S

2018-04-17

Plasmonic biosensing has been demonstrated to be a powerful technique for quantitative determination of molecular analytes and kinetic analysis of biochemical reactions. However, interfaces of most plasmonic biosensors are made of noble metals, such as gold and silver, which are not compatible with industrial production technologies. This greatly limits biosensing applications beyond biochemical and pharmaceutical research. Here, we propose and investigate copper-based biosensor chips fully fabricated with a standard complementary metal-oxide-semiconductor (CMOS) process. The protection of thin copper films from oxidation is achieved with SiO 2 and Al 2 O 3 dielectric films deposited onto the metal surface. In addition, the deposition of dielectric films with thicknesses of only several tens of nanometers significantly improves the biosensing sensitivity, owing to better localization of electromagnetic field above the biosensing surface. According to surface plasmon resonance (SPR) measurements, the copper biosensor chips coated with thin films of SiO 2 (25 nm) and Al 2 O 3 (15 nm) show 55% and 75% higher sensitivity to refractive index changes, respectively, in comparison to pure gold sensor chips. To test biomolecule immobilization, the copper-dielectric biosensor chips are coated with graphene oxide linking layers and used for the selective analysis of oligonucleotide hybridization. The proposed plasmonic biosensors make SPR technology more affordable for various applications and provide the basis for compact biosensors integrated with modern electronic devices.

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

NASA Astrophysics Data System (ADS)

Choi, W. J.; Yeh, E. C. C.; Tu, K. N.

2003-11-01

Electromigration of eutectic SnPb flip chip solder joints and their mean-time-to-failure (MTTF) have been studied in the temperature range of 100 to 140 °C with current densities of 1.9 to 2.75×104 A/cm2. In these joints, the under-bump-metallization (UBM) on the chip side is a multilayer thin film of Al/Ni(V)/Cu, and the metallic bond-pad on the substrate side is a very thick, electroless Ni layer covered with 30 nm of Au. When stressed at the higher current densities, the MTTF was found to decrease much faster than what is expected from the published Black's equation. The failure occurred by interfacial void propagation at the cathode side, and it is due to current crowding near the contact interface between the solder bump and the thin-film UBM. The current crowding is confirmed by a simulation of current distribution in the solder joint. Besides the interfacial void formation, the intermetallic compounds formed on the UBM as well as the Ni(V) film in the UBM have been found to dissolve completely into the solder bump during electromigration. Therefore, the electromigation failure is a combination of the interfacial void formation and the loss of UBM. Similar findings in eutectic SnAgCu flip chip solder joints have also been obtained and compared.

High Temperature Pt/Alumina Co-Fired System for 500 C Electronic Packaging Applications

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu; Neudeck, Philip G.; Spry, David J.; Beheim, Glenn M.; Hunter, Gary W.

2015-01-01

Gold thick-film metallization and 96 alumina substrate based prototype packaging system developed for 500C SiC electronics and sensors is briefly reviewed, the needs of improvement are discussed. A high temperature co-fired alumina material system based packaging system composed of 32-pin chip-level package and printed circuit board is discussed for packaging 500C SiC electronics and sensors.

Tool Forces and Chip Types In Orthogonal Cutting Of Southern Hardwoods

Treesearch

G.E. Woodson

1979-01-01

Specimens (l/8 to l/4 inch thick) from 5 trees of each of 22 hardwood species were cut orthogonally at 5 inches per minute. Average parallel and normal cutting forces for various rake angles (50, 60, and 70 degrees for veneer; 10, 20, and 30 degrees for planing; 20, 30, and 40 degrees for crosscutting) were measured at three moisture contents (10 percent, 20 percent,...

Analysis of light extraction efficiency enhancement for thin-film-flip-chip InGaN quantum wells light-emitting diodes with GaN micro-domes.

PubMed

Zhao, Peng; Zhao, Hongping

2012-09-10

The enhancement of light extraction efficiency for thin-film flip-chip (TFFC) InGaN quantum wells (QWs) light-emitting diodes (LEDs) with GaN micro-domes on n-GaN layer was studied. The light extraction efficiency of TFFC InGaN QWs LEDs with GaN micro-domes were calculated and compared to that of the conventional TFFC InGaN QWs LEDs with flat surface. The three dimensional finite difference time domain (3D-FDTD) method was used to calculate the light extraction efficiency for the InGaN QWs LEDs emitting at 460nm and 550 nm, respectively. The effects of the GaN micro-dome feature size and the p-GaN layer thickness on the light extraction efficiency were studied systematically. Studies indicate that the p-GaN layer thickness is critical for optimizing the TFFC LED light extraction efficiency. Significant enhancement of the light extraction efficiency (2.5-2.7 times for λ(peak) = 460nm and 2.7-2.8 times for λ(peak) = 550nm) is achievable from TFFC InGaN QWs LEDs with optimized GaN micro-dome diameter and height.

Sub-100 μm scale on-chip inductors with CoZrTa for GHz applications

NASA Astrophysics Data System (ADS)

Xu, Wei; Wu, Hao; Gardner, Donald S.; Sinha, Saurabh; Dastagir, Tawab; Bakkaloglu, Bertan; Cao, Yu; Yu, Hongbin

2011-04-01

On-chip inductors with magnetic material are fabricated with complementary metal-oxide semiconductor processes. The inductors use copper metallization and amorphous CoZrTa thinfilms. Enhancements of 3.5X in inductance and 3X for the quality factor at frequencies as highas 3 GHz have been successfully demonstrated by using a continuous CoZrTa-ring structure in spiral inductors at the 100 μm scale. Further improvement of the frequency response of inductance up to 6 GHz was achieved by micro-patterning the magnetic film. The effect ofincreasing the film thickness on the performance of strip line inductors was measured and modeled. This work demonstrates significantly larger increases in inductance and quality factor atabove 1 GHz as compared to prior efforts, thereby making the added processing cost worthwhile.

Tritium autoradiography with thinned and back-side illuminated monolithic active pixel sensor device

NASA Astrophysics Data System (ADS)

Deptuch, G.

2005-05-01

The first autoradiographic results of the tritium ( 3H) marked source obtained with monolithic active pixel sensors are presented. The detector is a high-resolution, back-side illuminated imager, developed within the SUCIMA collaboration for low-energy (<30 keV) electrons detection. The sensitivity to these energies is obtained by thinning the detector, originally fabricated in the form of a standard VLSI chip, down to the thickness of the epitaxial layer. The detector used is the 1×10 6 pixel, thinned MIMOSA V chip. The low noise performance and thin (˜160 nm) entrance window provide the sensitivity of the device to energies as low as ˜4 keV. A polymer tritium source was parked directly atop the detector in open-air conditions. A real-time image of the source was obtained.

Capillary-Driven Microfluidic Chips for Miniaturized Immunoassays: Patterning Capture Antibodies Using Microcontact Printing and Dry-Film Resists.

PubMed

Temiz, Yuksel; Lovchik, Robert D; Delamarche, Emmanuel

2017-01-01

The miniaturization of immunoassays using microfluidic devices is attractive for many applications, but an important challenge remains the patterning of capture antibodies (cAbs) on the surface of microfluidic structures. Here, we describe how to pattern cAbs on planar poly(dimethylsiloxane) (PDMS) stamps and how to microcontact print the cAbs on a dry-film resist (DFR). DFRs are new types of photoresists having excellent chemical resistance and good mechanical, adhesive, and optical properties. Instead of being liquid photoresists, DFRs are thin layers that are easy to handle, cut, photo-pattern, and laminate over surfaces. We show how to perform a simple fluorescence immunoassay using anti-biotin cAbs patterned on a 50-μm-thick DF-1050 DFR, Atto 647N-biotin analytes, and capillary-driven chips fabricated in silicon.

Direct Prototyping of Patterned Nanoporous Carbon: A Route from Materials to On-chip Devices

PubMed Central

Shen, Caiwei; Wang, Xiaohong; Zhang, Wenfeng; Kang, Feiyu

2013-01-01

Prototyping of nanoporous carbon membranes with three-dimensional microscale patterns is significant for integration of such multifunctional materials into various miniaturized systems. Incorporating nano material synthesis into microelectronics technology, we present a novel approach to direct prototyping of carbon membranes with highly nanoporous structures inside. Membranes with significant thicknesses (1 ~ 40 μm) are rapidly prototyped at wafer level by combining nano templating method with readily available microfabrication techniques, which include photolithography, high-temperature annealing and etching. In particular, the high-surface-area membranes are specified as three-dimensional electrodes for micro supercapacitors and show high performance compared to reported ones. Improvements in scalability, compatibility and cost make the general strategy promising for batch fabrication of operational on-chip devices or full integration of three-dimensional nanoporous membranes with existing micro systems. PMID:23887486

Polyplanar optical display

NASA Astrophysics Data System (ADS)

Veligdan, James T.; Beiser, Leo; Biscardi, Cyrus; Brewster, Calvin; DeSanto, Leonard

1997-07-01

The polyplanar optical display (POD) is a unique display screen which can be use with any projection source. This display screen is 2 inches thick and has a matte black face which allows for high contrast images. The prototype being developed is a form, fit and functional replacement display for the B-52 aircraft which uses a monochrome ten-inch display. The new display uses a 100 milliwatt green solid state laser as its optical source. In order to produce real- time video, the laser light is being modulated by a digital light processing (DLP) chip manufactured by Texas Instruments, Inc. A variable astigmatic focusing system is used to produce a stigmatic image on the viewing face of the POD. In addition to the optical design, we discuss the electronic interfacing to the DLP chip, the opto-mechanical design and viewing angle characteristics.

Laser-driven polyplanar optic display

DOE Office of Scientific and Technical Information (OSTI.GOV)

Veligdan, J.T.; Biscardi, C.; Brewster, C.

1998-01-01

The Polyplanar Optical Display (POD) is a unique display screen which can be used with any projection source. This display screen is 2 inches thick and has a matte-black face which allows for high contrast images. The prototype being developed is a form, fit and functional replacement display for the B-52 aircraft which uses a monochrome ten-inch display. The new display uses a 200 milliwatt green solid-state laser (532 nm) as its optical source. In order to produce real-time video, the laser light is being modulated by a Digital Light Processing (DLP) chip manufactured by Texas Instruments, Inc. A variablemore » astigmatic focusing system is used to produce a stigmatic image on the viewing face of the POD. In addition to the optical design, the authors discuss the DLP chip, the optomechanical design and viewing angle characteristics.« less

Laser-driven polyplanar optic display

NASA Astrophysics Data System (ADS)

Veligdan, James T.; Beiser, Leo; Biscardi, Cyrus; Brewster, Calvin; DeSanto, Leonard

1998-05-01

The Polyplanar Optical Display (POD) is a unique display screen which can be used with any projection source. This display screen is 2 inches thick and has a matte-black face which allows for high contrast images. The prototype being developed is a form, fit and functional replacement display for the B-52 aircraft which uses a monochrome ten-inch display. The new display uses a 200 milliwatt green solid- state laser (532 nm) as its optical source. In order to produce real-time video, the laser light is being modulated by a Digital Light Processing (DLPTM) chip manufactured by Texas Instruments, Inc. A variable astigmatic focusing system is used to produce a stigmatic image on the viewing face of the POD. In addition to the optical design, we discuss the DLPTM chip, the opto-mechanical design and viewing angle characteristics.

On-chip and freestanding elastic carbon films for micro-supercapacitors

DOE PAGES

Huang, Peihua; Lethien, C.; Pinaud, S.; ...

2016-02-11

Integration of electrochemical capacitors with silicon-based electronics is a major challenge, limiting energy storage on a chip. We describe a wafer-scale process for manufacturing strongly adhering carbide-derived carbon films and interdigitated micro-supercapacitors with embedded titanium carbide current collectors, fully compatible with current microfabrication and silicon-based device technology. Capacitance of those films reaches 410 farads per cubic centimeter/200 millifarads per square centimeter in aqueous electrolyte and 170 farads per cubic centimeter/85 millifarads per square centimeter in organic electrolyte. We also demonstrate preparation of self-supported, mechanically stable, micrometer-thick porous carbon films with a Young’s modulus of 14.5 gigapascals, with the possibility ofmore » further transfer onto flexible substrates. Lastly, these materials are interesting for applications in structural energy storage, tribology, and gas separation.« less

Method of fabricating a microelectronic device package with an integral window

DOEpatents

Peterson, Kenneth A.; Watson, Robert D.

2003-01-01

A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating material, e.g., a low-temperature cofired ceramic (LTCC) or high-temperature cofired ceramic (HTCC). The window is inserted in-between personalized layers of ceramic green tape during stackup and registration. Then, during baking and firing, the integral window is simultaneously bonded to the sintered ceramic layers of the densified package. Next, the microelectronic device is flip-chip bonded to cofired thick-film metallized traces on the package, where the light-sensitive side is optically accessible through the window. Finally, a cover lid is attached to the opposite side of the package. The result is a compact, low-profile package, flip-chip bonded, hermetically-sealed package having an integral window.

Novel chip coating approaches to improve white LED technology

NASA Astrophysics Data System (ADS)

Hartmann, Paul; Schweighart, Marko; Sommer, Christian; Wenzl, Franz-P.; Zinterl, Ernst; Hoschopf, Hans; Pachler, Peter; Tasch, Stefan

2008-02-01

Key market requirements for white LEDs, especially in the general lighting and automotive headlamp segments call for improved concepts and performance of white LEDs based on phosphor conversion. Major challenges are small emission areas, highest possible intensities, long-term color stability, and spatial homogeneity of color coordinates. On the other hand, the increasingly high radiation power of the blue LEDs poses problems for all involved materials. Various thick film coating technologies are widely used for applying the color conversion layer to the semiconductor chip. We present novel concepts based on Silicate phosphors with high performance in terms of spatial homogeneity of the emission and variability of the color temperature. Numerical calculation of the optical properties with the help of state-of-the-art simulation tools was used as a basis for the practical optimization of the layer geometries.

On-chip and freestanding elastic carbon films for micro-supercapacitors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Huang, Peihua; Lethien, C.; Pinaud, S.

Integration of electrochemical capacitors with silicon-based electronics is a major challenge, limiting energy storage on a chip. We describe a wafer-scale process for manufacturing strongly adhering carbide-derived carbon films and interdigitated micro-supercapacitors with embedded titanium carbide current collectors, fully compatible with current microfabrication and silicon-based device technology. Capacitance of those films reaches 410 farads per cubic centimeter/200 millifarads per square centimeter in aqueous electrolyte and 170 farads per cubic centimeter/85 millifarads per square centimeter in organic electrolyte. We also demonstrate preparation of self-supported, mechanically stable, micrometer-thick porous carbon films with a Young’s modulus of 14.5 gigapascals, with the possibility ofmore » further transfer onto flexible substrates. Lastly, these materials are interesting for applications in structural energy storage, tribology, and gas separation.« less

Nanoscale patterning controls inorganic-membrane interface structure

NASA Astrophysics Data System (ADS)

Almquist, Benjamin D.; Verma, Piyush; Cai, Wei; Melosh, Nicholas A.

2011-02-01

The ability to non-destructively integrate inorganic structures into or through biological membranes is essential to realizing full bio-inorganic integration, including arrayed on-chip patch-clamps, drug delivery, and biosensors. Here we explore the role of nanoscale patterning on the strength of biomembrane-inorganic interfaces. AFM measurements show that inorganic probes functionalized with hydrophobic bands with thicknesses complimentary to the hydrophobic lipid bilayer core exhibit strong attachment in the bilayer. As hydrophobic band thickness increases to 2-3 times the bilayer core the interfacial strength decreases, comparable to homogeneously hydrophobic probes. Analytical calculations and molecular dynamics simulations predict a transition between a `fused' interface and a `T-junction' that matches the experimental results, showing lipid disorder and defect formation for thicker bands. These results show that matching biological length scales leads to more intimate bio-inorganic junctions, enabling rational design of non-destructive membrane interfaces.The ability to non-destructively integrate inorganic structures into or through biological membranes is essential to realizing full bio-inorganic integration, including arrayed on-chip patch-clamps, drug delivery, and biosensors. Here we explore the role of nanoscale patterning on the strength of biomembrane-inorganic interfaces. AFM measurements show that inorganic probes functionalized with hydrophobic bands with thicknesses complimentary to the hydrophobic lipid bilayer core exhibit strong attachment in the bilayer. As hydrophobic band thickness increases to 2-3 times the bilayer core the interfacial strength decreases, comparable to homogeneously hydrophobic probes. Analytical calculations and molecular dynamics simulations predict a transition between a `fused' interface and a `T-junction' that matches the experimental results, showing lipid disorder and defect formation for thicker bands. These results show that matching biological length scales leads to more intimate bio-inorganic junctions, enabling rational design of non-destructive membrane interfaces. Electronic supplementary information (ESI) available: Breakthrough rate as a function of force plots for 5 nm, 10 nm and ∞-probes.. See DOI: 10.1039/c0nr00486c

Geologic appraisal of Paradox basin salt deposits for water emplacement

USGS Publications Warehouse

Hite, Robert J.; Lohman, Stanley William

1973-01-01

Thick salt deposits of Middle Pennsylvanian age are present in an area of 12,000 square miles in the Paradox basin of southeast Utah and southwest Colorado. The deposits are in the Paradox Member of the Hermosa Formation. The greatest thickness of this evaporite sequence is in a troughlike depression adjacent to the Uncompahgre uplift on the northeast side of the basin.The salt deposits consist of a cyclical sequence of thick halite units separated by thin units of black shale, dolomite, and anhydrite. Many halite units are several hundred feet thick and locally contain economically valuable potash deposits.Over much of the Paradox basin the salt deposits occur at depths of more than 5,000 feet. Only in a series of salt anticlines located along the northeastern side of the basin do the salt deposits rise to relatively shallow depths. The salt anticlines can be divided geographically and structurally into five major systems. Each system consists of a long undulating welt of thickened salt over which younger rocks are arched in anticlinal form. Locally there are areas along the axes of the anticlines where the Paradox Member was never covered by younger sediments. This allowed large-scale migration of Paradox strata toward and up through these holes in the sediment cover forming diapiric anticlines.The central or salt-bearing cores of the anticlines range in thickness from about 2,500 to 14,000 feet. Structure in the central core of the salt anticlines is the result of both regional-compression and flowage of the Paradox Member into the anticlines from adjacent synclines. Structure in the central cores of the salt anticlines ranges from relatively undeformed beds to complexly folded and faulted masses, in which stratigraphic continuity is undemonstrable.The presence of thick cap rock .over many of the salt anticlines is evidence of removal of large volumes of halite by groundwater. Available geologic and hydrologic information suggests that this is a relatively slow process and that any waste-storage or disposal sites in these structures should remain dry for hundreds of thousands of years.Trace to commercial quantities of oil and gas are found in all of the black shale-dolomite-anhydrite interbeds of the Paradox Member. These hydrocarbons constitute a definite hazard in the construction and operation of underground waste-storage or disposal facilities. However, many individual halite beds are of. sufficient thickness that a protective seal of halite can be left between the openings and the gassy beds.A total of 12 different localities were considered to be potential waste-storage or disposal sites in the Paradox basin. Two Sharer dome and Salt Valley anticline, were considered to have the most favorable characteristics.

Reworked crustal of early Paleozoic WuYi Orogen revealed by receiver function data

NASA Astrophysics Data System (ADS)

Wei, Y.; Duan, Y.; Tian, X.; Zhao, Y.

2017-12-01

Intraplate orogenic belt, which occurs at the rigid and undeformable plate interiors, is a distinct new type of orogen rather than an interplate or plate marginal orogenic belt, whose deformation occurs exclusively at plate margins. Therefore, intraplate orogenic belts are the most obvious exception to the plate-tectonic paradigm, they are uncommon in Earth's history. The early Paleozoic Wuyi orogen in South China is one of the few examples of intraplate orogen, and is a key to understanding the process of intraplate orogenesis and global early Paleozoic geodynamics. In this study, we select teleseismic records from 45 mobile linear seismic stations deployed in Wuyi Mountain and 58 permanent stations setting in Jiangxi and Fujian provinces, from January 2011 to December 2012, and calculate the crustal thickness and average crustal Vp/Vs ratio using the H-κ stacking method. The main results include the following: 1) the crustal average Poission's ratio shows an increase tendency from land to sea, the interior of Wuyi orogen belt with an low ration less than 0.23, and the coastline with high ration which is up to 0.28, which indicate a very heterogeneous crustal structure and composition in Wuyi orogen and coast belt. 2) the crustal thickness ranges 28-34 km and shows a tendency of thinning from inland to coast in the region of SE China margin, which maight mean the eastern Eurasia lithospheric is extension and thinning induced by the subducted paleo-Pacific slab. To conclusion, we assume that Wuyi orogen experienced upper crustal thickening, lower crust and lithosphere delamination during the early Paleozoic orogeny, and lithosphere extension in Mesozoic. This research is founded by the Natural Science Foundation of China (41174052 and 41604048).

Late Cretaceous-recent tectonic assembly of diverse crustal blocks in Central America, the Nicaraguan Rise, the Colombian Basin and northern South America as seen on a 1600-km-long, geologic and structural transect

NASA Astrophysics Data System (ADS)

Sanchez, J.; Mann, P.

2015-12-01

We have constructed a 1600-km-long transect from northern Honduras to northern Colombia that crosses northeastward-striking crustal blocks using a combination of offshore seismic data, gravity and magnetic data, well subsidence information, nearby outcrop information, and results from previous thermochronological, geochronological, geochemical and paleostress studies. The transect defines three major crustal and structural provinces: 1) Precambrian-Paleozoic, Chortis continental block whose northern edge is defined by the North America-Caribbean plate boundary. Events in this ~20-25-km-thick province include two major unconformities at the top of the Cretaceous and Eocene, associated southeast-dipping thrust faults related to collision of the Great Arc of the Caribbean (GAC) and Caribbean Large Igneous Province (CLIP) with the Chortis continental block. A third event is Eocene to recent subsidence and transtensional basins formed during the opening of the Cayman trough; 2) Late Cretaceous GAC and CLIP of oceanic arc and plateau origin, whose northern, deformed edge corresponds to the mapped Siuna belt of northern Nicaragua. This crustal province has a ~15-20-km-thick crust and is largely undeformed and extends across the Lower Nicaraguan Rise, Hess fault, to the southern limit of the Colombian basin where about 300 km of this province has been subducted beneath the accretionary wedge of the South Caribbean deformed belt of northwestern South America; and 3) Eocene to recent accretionary prism and intramontane basins on continental crust of northern South America, where Miocene accelerated exhumation and erosion of Paleogene and Cretaceous rocks reflect either shallow subduction of the CLIP or the Panama collisional event to the southwest.

Core evidence of paleoseismic events in Paleogene deposits of the Shulu Sag in the Bohai Bay Basin, east China, and their petroleum geologic significance

NASA Astrophysics Data System (ADS)

Zheng, Lijing; Jiang, Zaixing; Liu, Hui; Kong, Xiangxin; Li, Haipeng; Jiang, Xiaolong

2015-10-01

The Shulu Sag, located in the southwestern corner of the Jizhong Depression, Bohai Bay Basin of east China, is a NE-SW trending, elongate Cenozoic half-graben basin. The lowermost part of the third member of the Shahejie Formation in this basin is characterized by continental rudstone and calcilutite to calcisiltite facies. Based on core observation and regional geologic analysis, seismites are recognized in these lacustrine deposits, which include soft-sediment deformation structures (sedimentary dikes, hydraulic shattering, diapir structures, convolute lamination, load-flame structures, ball-and-pillow structures, loop bedding, and subsidence structures), synsedimentary faults, and seismoturbidites. In addition, mixed-source rudstones, consisting of the Paleozoic carbonate clasts and in situ calcilutite clasts in the lowermost submember of Shahejie 3, appear in the seismites, suggesting an earthquake origin. A complete representative vertical sequence in the lowermost part of the third member found in well ST1H located in the central part of the Shulu Sag shows, from the base to the top: underlying undeformed layers, synsedimentary faults, liquefied carbonate rocks, allogenetic seismoturbidites, and overlying undeformed layers. Seismites are widely distributed around this well and there are multiple sets of stacked seismites separated by undeformed sediment. The nearby NW-trending Taijiazhuang fault whose fault growth index is from 1.1 to 1.8 and the NNE-trending Xinhe fault with a fault growth index of 1.3-1.9 may be the source of the instability to create the seismites. These deformed sedimentary layers are favorable for the accumulation of oil and gas; for example, sedimentary dikes can cut through many layers and serve as conduits for fluid migration. Sedimentary faults and fractures induced by earthquakes can act as oil and gas migration channels or store petroleum products as well. Seismoturbidites and mixed-source rudstones are excellent reservoirs due to their abundant primary or dissolved pores.

An X-ray transparent microfluidic platform for screening of the phase behavior of lipidic mesophases

PubMed Central

Khvostichenko, Daria S.; Kondrashkina, Elena; Perry, Sarah L.; Pawate, Ashtamurthy S.; Brister, Keith

2013-01-01

Lipidic mesophases are a class of highly ordered soft materials that form when certain lipids are mixed with water. Understanding the relationship between the composition and the microstructure of mesophases is necessary for fundamental studies of self-assembly in amphiphilic systems and for applications, such as crystallization of membrane proteins. However, the laborious formulation protocol for highly viscous mesophases and the large amounts of material required for sample formulation are significant obstacles in such studies. Here we report a microfluidic platform that facilitates investigations of the phase behavior of mesophases by reducing sample consumption, and automating and parallelizing sample formulation. The mesophases were formulated on-chip using less than 40 nL of material per sample and their microstructure was analyzed in situ using small-angle X-ray scattering (SAXS). The 220 μm-thick X-ray compatible platform was comprised of thin polydimethylsiloxane (PDMS) layers sandwiched between cyclic olefin copolymer (COC) sheets. Uniform mesophases were prepared using an active on-chip mixing strategy coupled with periodic cooling of the sample to reduce the viscosity. We validated the platform by preparing and analyzing mesophases of lipid monoolein (MO) mixed with aqueous solutions of different concentrations of β-octylglucoside (βOG), a detergent frequently used in membrane protein crystallization. Four samples were prepared in parallel on chip, by first metering and automatically diluting βOG to obtain detergent solutions of different concentration, then metering MO, and finally mixing by actuation of pneumatic valves. Integration of detergent dilution and subsequent mixing significantly reduced the number of manual steps needed for sample preparation. Three different types of mesophases typical for monoolein were successfully identified in SAXS data from on-chip samples. Microstructural parameters of identical samples formulated in different chips showed excellent agreement. Phase behavior observed on-chip corresponded well with that of samples prepared via the traditional coupled-syringe method (“off-chip”) using 300-fold larger amount of material, further validating the utility of the microfluidic platform for on-chip characterization of mesophase behavior. PMID:23882463

Adiabatic shear banding and scaling laws in chip formation with application to cutting of Ti-6Al-4V

NASA Astrophysics Data System (ADS)

Molinari, A.; Soldani, X.; Miguélez, M. H.

2013-11-01

The phenomenon of adiabatic shear banding is analyzed theoretically in the context of metal cutting. The mechanisms of material weakening that are accounted for are (i) thermal softening and (ii) material failure related to a critical value of the accumulated plastic strain. Orthogonal cutting is viewed as a unique configuration where adiabatic shear bands can be experimentally produced under well controlled loading conditions by individually tuning the cutting speed, the feed (uncut chip thickness) and the tool geometry. The role of cutting conditions on adiabatic shear banding and chip serration is investigated by combining finite element calculations and analytical modeling. This leads to the characterization and classification of different regimes of shear banding and the determination of scaling laws which involve dimensionless parameters representative of thermal and inertia effects. The analysis gives new insights into the physical aspects of plastic flow instability in chip formation. The originality with respect to classical works on adiabatic shear banding stems from the various facets of cutting conditions that influence shear banding and from the specific role exercised by convective flow on the evolution of shear bands. Shear bands are generated at the tool tip and propagate towards the chip free surface. They grow within the chip formation region while being convected away by chip flow. It is shown that important changes in the mechanism of shear banding take place when the characteristic time of shear band propagation becomes equal to a characteristic convection time. Application to Ti-6Al-4V titanium are considered and theoretical predictions are compared to available experimental data in a wide range of cutting speeds and feeds. The fundamental knowledge developed in this work is thought to be useful not only for the understanding of metal cutting processes but also, by analogy, to similar problems where convective flow is also interfering with adiabatic shear banding as in impact mechanics and perforation processes. In that perspective, cutting speeds higher than those usually encountered in machining operations have been also explored.

Pressure-Sensor Assembly Technique

NASA Technical Reports Server (NTRS)

Pruzan, Daniel A.

2003-01-01

Nielsen Engineering & Research (NEAR) recently developed an ultrathin data acquisition system for use in turbomachinery testing at NASA Glenn Research Center. This system integrates a microelectromechanical- systems- (MEMS-) based absolute pressure sensor [0 to 50 psia (0 to 345 kPa)], temperature sensor, signal-conditioning application-specific integrated circuit (ASIC), microprocessor, and digital memory into a package which is roughly 2.8 in. (7.1 cm) long by 0.75 in. (1.9 cm) wide. Each of these components is flip-chip attached to a thin, flexible circuit board and subsequently ground and polished to achieve a total system thickness of 0.006 in. (0.15 mm). Because this instrument is so thin, it can be quickly adhered to any surface of interest where data can be collected without disrupting the flow being investigated. One issue in the development of the ultrathin data acquisition system was how to attach the MEMS pressure sensor to the circuit board in a manner which allowed the sensor s diaphragm to communicate with the ambient fluid while providing enough support for the chip to survive the grinding and polishing operations. The technique, developed by NEAR and Jabil Technology Services Group (San Jose, CA), is described below. In the approach developed, the sensor is attached to the specially designed circuit board, see Figure 1, using a modified flip-chip technique. The circular diaphragm on the left side of the sensor is used to actively measure the ambient pressure, while the diaphragm on the right is used to compensate for changes in output due to temperature variations. The circuit board is fabricated with an access hole through it so that when the completed system is installed onto a wind tunnel model (chip side down), the active diaphragm is exposed to the environment. After the sensor is flip-chip attached to the circuit board, the die is underfilled to support the chip during the subsequent grinding and polishing operations. To prevent this underfill material from getting onto the sensor s diaphragms, the circuit board is fabricated with two 25- micrometer-tall polymer rings, sized so that the diaphragms fit inside the rings once the chip is attached.

Ultrashort pulse laser dicing of thin Si wafers: the influence of laser-induced periodic surface structures on the backside breaking strength

NASA Astrophysics Data System (ADS)

Domke, Matthias; Egle, Bernadette; Piredda, Giovanni; Stroj, Sandra; Fasching, Gernot; Bodea, Marius; Schwarz, Elisabeth

2016-11-01

High power electronic chips are usually fabricated on about 50 µm thin Si wafers to improve heat dissipation. At these chip thicknesses mechanical dicing becomes challenging. Chippings may occur at the cutting edges, which reduce the mechanical stability of the die. Thermal load changes could then lead to sudden chip failure. Ultrashort pulsed lasers are a promising tool to improve the cutting quality, because thermal side effects can be reduced to a minimum. However, laser-induced periodic surface structures occur at the sidewalls and at the trench bottom during scribing. The goal of this study was to investigate the influence of these periodic structures on the backside breaking strength of the die. An ultrafast laser with a pulse duration of 380 fs and a wavelength of 1040 nm was used to cut a wafer into single chips. The pulse energy and the number of scans was varied. The cuts in the wafer were investigated using transmitted light microscopy, the sidewalls of the cut chips were investigated using scanning electron and confocal microscopy, and the breaking strength was evaluated using the 3-point bending test. The results indicated that periodic holes with a distance of about 20-30 µm were formed at the bottom of the trench, if the number of scans was set too low to completely cut the wafer; the wafer was only perforated. Mechanical breaking of the bridges caused 5 µm deep kerfs in the sidewall. These kerfs reduced the breaking strength at the backside of the chip to about 300 MPa. As the number of scans was increased, the bridges were ablated and the wafer was cut completely. Periodic structures were observed on the sidewall; the roughness was below 1 µm. The surface roughness remained on a constant level even when the number of scans was doubled. However, the periodic structures on the sidewall seemed to vanish and the probability to remove local flaws increases with the number of scans. As a consequence, the breaking strength was increased to about 700 MPa.

Single-bead arrays for fluorescence-based immunoassays on capillary-driven microfluidic chips

NASA Astrophysics Data System (ADS)

Temiz, Yuksel; Lim, Michel; Delamarche, Emmanuel

2016-03-01

We report a concept for the simple fabrication of easy-to-use chips for immunoassays in the context of point-of-care diagnostics. The chip concept comprises mainly three features: (1) the efficient integration of reagents using beads functionalized with receptors, (2) the generation of capillary-driven liquid flows without using external pumps, and (3) a high-sensitivity detection of analytes using fluorescence microscopy. We fabricated prototype chips using dry etching of Si wafers. 4.5-μm-diameter beads were integrated into hexagonal arrays by sedimentation and removing the excess using a stream of water. We studied the effect of different parameters and showed that array occupancies from 30% to 50% can be achieved by pipetting a 250 nL droplet of 1% bead solution and allowing the beads sediment for 3 min. Chips with integrated beads were sealed using a 50-μm-thick dry-film resist laminated at 45 °C. Liquids pipetted to loading pads were autonomously pulled by capillary pumps at a rate of 0.35 nL s-1 for about 30 min. We studied ligand-receptor interactions and binding kinetics using time-lapse fluorescence microscopy and demonstrated a 5 pM limit of detection (LOD) for an anti-biotin immunoassay. As a clinically-relevant example, we implemented an immunoassay to detect prostate specific antigen (PSA) and showed an LOD of 108 fM (i.e. 3.6 pg mL-1). While a specific implementation is provided here for the detection of PSA, we believe that combining capillary-driven microfluidics with arrays of single beads and fluorescence readout to be very flexible and sufficiently sensitive for the detection of other clinically-relevant analytes.

Systematic analysis of CMOS-micromachined inductors with application to mixer matching circuits

NASA Astrophysics Data System (ADS)

Wu, Jerry Chun-Li

The growing demand for consumer voice and data communication systems and military communication applications has created a need for low-power, low-cost, high-performance radio-frequency (RF) front-end. To achieve this goal, bringing passive components, especially inductors, to silicon is imperative. On-chip passive components such as inductors and capacitors generally enhance the reliability and efficiency of silicon-integrated RF cells. They can provide circuit solutions with superior performance and contribute to a higher level of integration. With passive components on chip, there is a great opportunity to have transformers, filters, and matching networks on chip. However, inductors on silicon have a low quality factor (Q) due to both substrate and metal loss. This dissertation demonstrates the systematic analysis of inductors fabricated using standard complementary metal-oxide-semiconductor (CMOS) and micro-electro-mechanical (MEMS) system technologies. We report system-on-chip inductor modeling, simulation, and measurements of effective inductance and quality factors. In this analysis methodology, a number of systematic simulations are performed on regular and micromachined inductors with different parameters such as spiral topology, number of turns, outer diameter, thickness, and percentage of substrate removed by using micromachining technologies. Three different novel support structures of the micromachined spiral inductor are proposed, analyzed, and implemented for larger size suspended inductors. The sensitivity of the structure support and different degree of substrate etching by post-processing is illustrated. The results provide guidelines for the selection of inductor parameters, post-processing methodologies, and its spiral supports to meet the RF design specifications and the stability requirements for mobile communication. The proposed CMOS-micromachined inductor is used in a low cost-effective double-balanced Gilbert mixer with on-chip matching network. The integrated mixer inductor was implemented and tested to prove the concept.

Design and performance evaluation of a microfluidic ion-suppression module for anion-exchange chromatography.

PubMed

Wouters, Sam; Wouters, Bert; Jespers, Sander; Desmet, Gert; Eghbali, Hamed; Bruggink, Cees; Eeltink, Sebastiaan

2014-08-15

A microfluidic membrane suppressor has been constructed to suppress ions of alkaline mobile-phases via an acid-base reaction across a sulfonated poly(tetrafluoroethylene)-based membrane and was evaluated for anion-exchange separations using conductivity detection. The membrane was clamped between two chip substrates, accommodating rectangular microchannels for the eluent and regenerant flow, respectively. Additionally, a clamp-on chip holder has been constructed which allows the alignment and stacking of different chip modules. The response and efficacy of the microfluidic chip suppressor was assessed for a wide range of eluent (KOH) concentrations, using 127 and 183μm thick membranes, while optimizing the flow rate and concentration of the regenerant solution (H2SO4). The optimal operating eluent flow rate was determined at 5μL/min, corresponding to the optimal van-Deemter flow velocity of commercially-available column technology, i.e. a 0.4mm i.d.×250mm long column packed with 7.5μm anion-exchange particles. When equilibrated at 10mM KOH, a 99% decrease in conductivity signal could be obtained within 5min when applying 10mM H2SO4 regenerant at 75μL/min. A background signal as low as 1.2μS/cm was obtained, which equals the performance of a commercially-available electrolytic hollow-fiber suppressor. When increasing the temperature of the membrane suppressor from 15 to 20°C, ion suppression was significantly improved allowing the application of 75mM KOH. The applicability of the chip suppressor has been demonstrated with an isocratic baseline separation of a mixture of seven inorganic ions, yielding plate numbers between 5300 and 10,600 and with a gradient separation of a complex ion mixture. Copyright © 2014 Elsevier B.V. All rights reserved.

Terahertz NDE for Under Paint Corrosion Detection and Evaluation

NASA Technical Reports Server (NTRS)

Anastasi, Robert F.; Madaras, Eric I.

2005-01-01

Corrosion under paint is not visible until it has caused paint to blister, crack, or chip. If corrosion is allowed to continue then structural problems may develop. Identifying corrosion before it becomes visible would minimize repairs and costs and potential structural problems. Terahertz NDE imaging under paint for corrosion is being examined as a method to inspect for corrosion by examining the terahertz response to paint thickness and to surface roughness.

Growth And Characterization Studies Of Advanced Infrared Heterostructures

DTIC Science & Technology

2015-06-30

controlled within 50 arc-seconds for all the samples. The three samples were then processed into deep-etched mesa -type photodiodes, by using standard...contact ultraviolet lithography and wet-chemical etching. The circular mesa -size ranged from 25 to 400 µm in diameter. A 200-nm-thick SiNx film...coating was applied on top of the mesa . Devices were mounted on ceramic leadless chip carriers, and then mounted in the cryostat to characterize their

Sinuous flow in metals

PubMed Central

Yeung, Ho; Viswanathan, Koushik; Compton, Walter Dale; Chandrasekar, Srinivasan

2015-01-01

Annealed metals are surprisingly difficult to cut, involving high forces and an unusually thick “chip.” This anomaly has long been explained, based on ex situ observations, using a model of smooth plastic flow with uniform shear to describe material removal by chip formation. Here we show that this phenomenon is actually the result of a fundamentally different collective deformation mode—sinuous flow. Using in situ imaging, we find that chip formation occurs via large-amplitude folding, triggered by surface undulations of a characteristic size. The resulting fold patterns resemble those observed in geophysics and complex fluids. Our observations establish sinuous flow as another mesoscopic deformation mode, alongside mechanisms such as kinking and shear banding. Additionally, by suppressing the triggering surface undulations, sinuous flow can be eliminated, resulting in a drastic reduction of cutting forces. We demonstrate this suppression quite simply by the application of common marking ink on the free surface of the workpiece material before the cutting. Alternatively, prehardening a thin surface layer of the workpiece material shows similar results. Besides obvious implications to industrial machining and surface generation processes, our results also help unify a number of disparate observations in the cutting of metals, including the so-called Rehbinder effect. PMID:26216980

Sinuous flow in metals.

PubMed

Yeung, Ho; Viswanathan, Koushik; Compton, Walter Dale; Chandrasekar, Srinivasan

2015-08-11

Annealed metals are surprisingly difficult to cut, involving high forces and an unusually thick "chip." This anomaly has long been explained, based on ex situ observations, using a model of smooth plastic flow with uniform shear to describe material removal by chip formation. Here we show that this phenomenon is actually the result of a fundamentally different collective deformation mode--sinuous flow. Using in situ imaging, we find that chip formation occurs via large-amplitude folding, triggered by surface undulations of a characteristic size. The resulting fold patterns resemble those observed in geophysics and complex fluids. Our observations establish sinuous flow as another mesoscopic deformation mode, alongside mechanisms such as kinking and shear banding. Additionally, by suppressing the triggering surface undulations, sinuous flow can be eliminated, resulting in a drastic reduction of cutting forces. We demonstrate this suppression quite simply by the application of common marking ink on the free surface of the workpiece material before the cutting. Alternatively, prehardening a thin surface layer of the workpiece material shows similar results. Besides obvious implications to industrial machining and surface generation processes, our results also help unify a number of disparate observations in the cutting of metals, including the so-called Rehbinder effect.

Characterization and Modeling of Fine-Pitch Copper Ball Bonding on a Cu/Low- k Chip

NASA Astrophysics Data System (ADS)

Che, F. X.; Wai, L. C.; Zhang, Xiaowu; Chai, T. C.

2015-02-01

Cu ball bonding faces more challenges than Au ball bonding, for example, excessive deformation of the bond pad and damage of Cu/low- k structures, because of the much greater hardness of Cu free air balls. In this study, dynamic finite-element analysis (FEA) modeling with displacement control was developed to simulate the ball-bonding process. The three-dimensional (3D) FEA simulation results were confirmed by use of stress-measurement data, obtained by use of stress sensors built into the test chip. Stress comparison between two-dimensional (2D) and 3D FEA models showed the 2D plain strain model to be a reasonable and effective model for simulation of the ball-bonding process without loss of accuracy; it also saves computing resources. The 2D FEA model developed was then used in studies of a Cu/low- k chip to find ways of reducing Al bond pad deformation and stresses of low- k structures. The variables studied included Al pad properties, capillary geometry, bond pad design (Al pad thickness, Al pad coated with Ni layer), and the effect of ultrasonic bonding power.

Micro-particle manipulation by single beam acoustic tweezers based on hydrothermal PZT thick film.

PubMed

Zhu, Benpeng; Xu, Jiong; Li, Ying; Wang, Tian; Xiong, Ke; Lee, Changyang; Yang, Xiaofei; Shiiba, Michihisa; Takeuchi, Shinichi; Zhou, Qifa; Shung, K Kirk

2016-03-01

Single-beam acoustic tweezers (SBAT), used in laboratory-on-a-chip (LOC) device has promising implications for an individual micro-particle contactless manipulation. In this study, a freestanding hydrothermal PZT thick film with excellent piezoelectric property (d 33 = 270pC/N and k t = 0.51) was employed for SBAT applications and a press-focusing technology was introduced. The obtained SBAT, acting at an operational frequency of 50MHz, a low f-number (∼0.9), demonstrated the capability to trap and manipulate a micro-particle sized 10μm in the distilled water. These results suggest that such a device has great potential as a manipulator for a wide range of biomedical and chemical science applications.

Limits on silicon nanoelectronics for terascale integration.

PubMed

Meindl, J D; Chen, Q; Davis, J A

2001-09-14

Throughout the past four decades, silicon semiconductor technology has advanced at exponential rates in both performance and productivity. Concerns have been raised, however, that the limits of silicon technology may soon be reached. Analysis of fundamental, material, device, circuit, and system limits reveals that silicon technology has an enormous remaining potential to achieve terascale integration (TSI) of more than 1 trillion transistors per chip. Such massive-scale integration is feasible assuming the development and economical mass production of double-gate metal-oxide-semiconductor field effect transistors with gate oxide thickness of about 1 nanometer, silicon channel thickness of about 3 nanometers, and channel length of about 10 nanometers. The development of interconnecting wires for these transistors presents a major challenge to the achievement of nanoelectronics for TSI.

3D imaging of optically cleared tissue using a simplified CLARITY method and on-chip microscopy

PubMed Central

Zhang, Yibo; Shin, Yoonjung; Sung, Kevin; Yang, Sam; Chen, Harrison; Wang, Hongda; Teng, Da; Rivenson, Yair; Kulkarni, Rajan P.; Ozcan, Aydogan

2017-01-01

High-throughput sectioning and optical imaging of tissue samples using traditional immunohistochemical techniques can be costly and inaccessible in resource-limited areas. We demonstrate three-dimensional (3D) imaging and phenotyping in optically transparent tissue using lens-free holographic on-chip microscopy as a low-cost, simple, and high-throughput alternative to conventional approaches. The tissue sample is passively cleared using a simplified CLARITY method and stained using 3,3′-diaminobenzidine to target cells of interest, enabling bright-field optical imaging and 3D sectioning of thick samples. The lens-free computational microscope uses pixel super-resolution and multi-height phase recovery algorithms to digitally refocus throughout the cleared tissue and obtain a 3D stack of complex-valued images of the sample, containing both phase and amplitude information. We optimized the tissue-clearing and imaging system by finding the optimal illumination wavelength, tissue thickness, sample preparation parameters, and the number of heights of the lens-free image acquisition and implemented a sparsity-based denoising algorithm to maximize the imaging volume and minimize the amount of the acquired data while also preserving the contrast-to-noise ratio of the reconstructed images. As a proof of concept, we achieved 3D imaging of neurons in a 200-μm-thick cleared mouse brain tissue over a wide field of view of 20.5 mm2. The lens-free microscope also achieved more than an order-of-magnitude reduction in raw data compared to a conventional scanning optical microscope imaging the same sample volume. Being low cost, simple, high-throughput, and data-efficient, we believe that this CLARITY-enabled computational tissue imaging technique could find numerous applications in biomedical diagnosis and research in low-resource settings. PMID:28819645

Manufacturing and characterization of a ceramic single-use microvalve

NASA Astrophysics Data System (ADS)

Khaji, Z.; Klintberg, L.; Thornell, G.

2016-09-01

We present the manufacturing and characterization of a ceramic single-use microvalve with the potential to be integrated in lab-on-a-chip devices, and forsee its utilization in space and other demanding applications. A 3 mm diameter membrane was used as the flow barrier, and the opening mechanism was based on cracking the membrane by inducing thermal stresses on it with fast and localized resistive heating. Four manufacturing schemes based on high-temperature co-fired ceramic technology were studied. Three designs for the integrated heaters and two thicknesses of 40 and 120 μm for the membranes were considered, and the heat distribution over their membranes, the required heating energies, their opening mode, and the flows admitted through were compared. Furthermore, the effect of applying  +1 and  -1 bar pressure difference on the membrane during cracking was investigated. Thick membranes demonstrated unpromising results for low-pressure applications since the heating either resulted in microcracks or cracking of the whole chip. Because of the higher pressure tolerance of the thick membranes, the design with microcracks can be considered for high-pressure applications where flow is facilitated anyway. Thin membranes, on the other hand, showed different opening sizes depending on heater design and, consequently, heat distribution over the membranes, from microcracks to holes with sizes of 3-100% of the membrane area. For all the designs, applying  +1 bar over pressure contributed to bigger openings, whereas  -1 bar pressure difference only did so for one of the designs, resulting in smaller openings for the other two. The energy required for breaking these membranes was a few hundred mJ with no significant dependence on design and applied pressure. The maximum sustainable pressure of the valve for the current design and thin membranes was 7 bar.

Insights into the lithospheric architecture of Iberia and Morocco from teleseismic body-wave attenuation

NASA Astrophysics Data System (ADS)

Bezada, Maximiliano J.

2017-11-01

The long and often complicated tectonic history of continental lithosphere results in lateral strength heterogeneities which in turn affect the style and localization of deformation. In this study, we produce a model for the attenuation structure of Iberia and northern Morocco using a waveform-matching approach on P-wave data from teleseismic deep-focus earthquakes. We find that attenuation is correlated with zones of intraplate deformation and seismicity, but do not find a consistent relationship between attenuation and recent volcanism. The main features of our model are low to moderate Δt* in the undeformed Tertiary basins of Spain and high Δt* in areas deformed by the Alpine orogeny. Additionally, low Δt* is found in areas where the Alboran slab is thought to be attached to the Iberian and African lithosphere, and high Δt* where it has detached. These features are robust with respect to inversion parameters, and are consistent with independent data. Very mild backazimuthal dependence of the measurements and comparison with previous results suggest that the source of the attenuation is sub-crustal. In line with other recent studies, the range of Δt* we observe is much larger than can be expected from lithospheric thickness or temperature variations.

Geology and undiscovered resource assessment of the potash-bearing Central Asia Salt Basin, Turkmenistan, Uzbekistan, Tajikistan, and Afghanistan: Chapter AA in Global mineral resource assessment

USGS Publications Warehouse

Wynn, Jeff; Orris, Greta J.; Dunlap, Pamela; Cocker, Mark D.; Bliss, James D.

2016-03-23

Chapter 1 of this report provides an overview of the history of the CASB and summarizes evaporite potash deposition, halokinesis, and dissolution processes that have affected the current distribution of potash-bearing salt in the CASB. Chapter 2 describes the Gissar tract, an uplifted region that contains a mix of stratabound and halokinetic potash deposits and all of the discovered and exploited potash deposits of the CASB. Chapter 3 describes the Amu Darya tract, where evaporite deposits remain flat-lying and undeformed since their original deposition. Chapter 4 describes the highly deformed and compressed Afghan-Tajik tract and what is known of the deeply-buried Jurassic salt. Chapter 5 describes the spatial databases included with this report, which contain a collection of CASB potash information. Appendixes A and B summarize descriptive models for stratabound and halokinetic potash-bearing salt deposits, respectively. Appendix C summarizes the AGE method used to evaluate the Gissar and Amu Darya tracts. Appendixes D and E contain grade and thickness data for the Gissar and Amu Darya tracts. Appendix F provides the SYSTAT script used to estimate undiscovered K2 O in a CASB tract. Appendix G provides a potash glossary, and appendix H provides biographies of assessment participants.

Spreading of the ocean floor: Undeformed sediments in the peru-chile trench

USGS Publications Warehouse

Scholl, D. W.; von Huene, Roland E.; Ridlon, J.B.

1968-01-01

None of the expected stratigraphic and structural effects of a spreading sea floor have been imposed on the sedimentary fill of the Peru-Chile Trench. During at least the last several million years, and perhaps during much of the Cenozoic, the trench has not been affected by an oceanic crust thrusting under the continent.

76 FR 65101 - Special Conditions: Embraer S.A.; Model EMB 500; Single-Place Side Facing Seat Dynamic Test...

Federal Register 2010, 2011, 2012, 2013, 2014

2011-10-20

... anthropomorphic test dummy (ATD) or its equivalent, undeformed floor, no yaw, and with all lateral structural... Side Facing Seat Dynamic Test Requirements AGENCY: Federal Aviation Administration (FAA), DOT. ACTION... installation of a single-place side facing seat on Embraer S.A. EMB 500 aircraft. Side- facing seats are...

Polyplanar optic display for cockpit application

DOE Office of Scientific and Technical Information (OSTI.GOV)

Veligdan, J.; Biscardi, C.; Brewster, C.

1998-04-01

The Polyplanar Optical Display (POD) is a high contrast display screen being developed for cockpit applications. This display screen is 2 inches thick and has a matte black face which allows for high contrast images. The prototype being developed is a form, fit and functional replacement display for the B-52 aircraft which uses a monochrome ten-inch display. The new display uses a long lifetime, (10,000 hour), 200 mW green solid-state laser (532 nm) as its optical source. In order to produce real-time video, the laser light is being modulated by a Digital Light Processing (DLP{trademark}) chip manufactured by Texas Instruments,more » Inc. A variable astigmatic focusing system is used to produce a stigmatic image on the viewing face of the POD. In addition to the optical design and speckle reduction, the authors discuss the electronic interfacing to the DLP{trademark} chip, the opto-mechanical design and viewing angle characteristics.« less

Polyplanar optic display

DOE Office of Scientific and Technical Information (OSTI.GOV)

Veligdan, J.; Biscardi, C.; Brewster, C.

1997-07-01

The Polyplanar Optical Display (POD) is a unique display screen which can be used with any projection source. This display screen is 2 inches thick and has a matte black face which allows for high contrast images. The prototype being developed is a form, fit and functional replacement display for the B-52 aircraft which uses a monochrome ten-inch display. The new display uses a 100 milliwatt green solid state laser (532 nm) as its optical source. In order to produce real-time video, the laser light is being modulated by a Digital Light Processing (DLP{trademark}) chip manufactured by Texas Instruments, Inc.more » A variable astigmatic focusing system is used to produce a stigmatic image on the viewing face of the POD. In addition to the optical design, the authors discuss the electronic interfacing to the DLP{trademark} chip, the opto-mechanical design and viewing angle characteristics.« less

Polyplanar optic display for cockpit application

NASA Astrophysics Data System (ADS)

Veligdan, James T.; Biscardi, Cyrus; Brewster, Calvin; DeSanto, Leonard; Freibott, William C.

1998-09-01

The Polyplanar Optical Display (POD) is a high contrast display screen being developed for cockpit applications. This display screen is 2 inches thick and has a matte black face which allows for high contrast images. The prototype being developed is a form, fit and functional replacement display for the B-52 aircraft which uses a monochrome ten-inch display. The new display uses a long lifetime, (10,000 hour), 200 mW green solid-state laser (532 nm) as its optical source. In order to produce real-time video, the laser light is being modulated by a Digital Light Processing (DLPTM) chip manufactured by Texas Instruments, Inc. A variable astigmatic focusing system is used to produce a stigmatic image on the viewing face of the POD. In addition to the optical design and speckle reduction, we discuss the electronic interfacing to the DLPTM chip, the opto-mechanical design and viewing angle characteristics.

On the closed form mechanistic modeling of milling: Specific cutting energy, torque, and power

NASA Astrophysics Data System (ADS)

Bayoumi, A. E.; Yücesan, G.; Hutton, D. V.

1994-02-01

Specific energy in metal cutting, defined as the energy expended in removing a unit volume of workpiece material, is formulated and determined using a previously developed closed form mechanistic force model for milling operations. Cutting power is computed from the cutting torque, cutting force, kinematics of the cutter, and the volumetric material removal rate. Closed form expressions for specific cutting energy were formulated and found to be functions of the process parameters: pressure and friction for both rake and flank surfaces and chip flow angle at the rake face of the tool. Friction is found to play a very important role in cutting torque and power. Experiments were carried out to determine the effects of feedrate, cutting speed, workpiece material, and flank wear land width on specific cutting energy. It was found that the specific cutting energy increases with a decrease in the chip thickness and with an increase in flank wear land.

Monolithic short wave infrared (SWIR) detector array

NASA Technical Reports Server (NTRS)

1983-01-01

A monolithic self-scanned linear detector array was developed for remote sensing in the 1.1- 2.4-micron spectral region. A high-density IRCCD test chip was fabricated to verify new design approaches required for the detector array. The driving factors in the Schottky barrier IRCCD (Pdsub2Si) process development are the attainment of detector yield, uniformity, adequate quantum efficiency, and lowest possible dark current consistent with radiometric accuracy. A dual-band module was designed that consists of two linear detector arrays. The sensor architecture places the floating diffusion output structure in the middle of the chip, away from the butt edges. A focal plane package was conceptualized and includes a polycrystalline silicon substrate carrying a two-layer, thick-film interconnecting conductor pattern and five epoxy-mounted modules. A polycrystalline silicon cover encloses the modules and bond wires, and serves as a radiation and EMI shield, thermal conductor, and contamination seal.

Morphology and capacity of a cadmium electrode - Studies on a simulated pore.

NASA Technical Reports Server (NTRS)

Will, F. G.; Hess, H. J.

1973-01-01

Conditions in a single pore of a battery plate were simulated by using a cadmium chip of millimeter dimensions covered with an electrolyte film of micron thickness. In situ microscopy was applied to study changes in the electrode morphology during charge and discharge. Passivation and increases in particle sizes due to precipitation and electrodeposition of dissolved cadmium species were found to cause profound loss in electrode capacity on repeated charge and discharge.

The Investigation of 6mu Biaxially Oriented Polyethylene 2, 6, -Naphthalate As a Possible Dielectric For Pulse Power Capacitors

NASA Technical Reports Server (NTRS)

Yen, S. P. S.; Lowry, L.; Cygan, P. J.; Jow, T. R.

1993-01-01

The introduction of polythylene -2, 6-Naphthalate (PEN) semicrystalline film with thicknesses of 0.9mu, 1.5mu, 4.0Mu and community. Its unique chemical and high temparterure stability, as well as superior thermo-mechanical properties allow ultra thin ( 2mu) PEN film to be processed into miniature multilayer chip capacitors for surface mount technology (SMT) application that can be used with standard soldering techniques.

Improving the Cell Viability and Isolating Precision of Laser-induced Forward Transfer Process by Maintaining a Proper Environment with a Microchip.

PubMed

Deng, Yu; Huang, Zhigang; Wang, Wenbing; Chen, Yinghuai; Guo, Zhongning; Chen, Ying

2017-01-01

Aiming to improve the laser-induced forward transfer (LIFT) cell isolation process, a polydimethylsiloxane (PDMS) layer with micro-hole arrays was employed to improve the cell separation precision, and a microchip with heater was developed to maintain the working area at 100% humidity and 37°C with the purpose to preserve the viability of the isolated cells. A series of experiments were conducted to verify the contributions of the optimization to LIFT cell isolation process as well as to study the effect of laser pulse energy, laser spot size and the titanium thickness on cell isolation. With 40µm laser spot size and 40nm thick of titanium, laser energy threshold for 100% single cell isolating succeed ratio is 7µJ. According to the staining images and proliferation ratios, the chip did help to improve the cell availability and the cells can recover from the juries at least a day earlier comparing to the samples processed without the chip. With a Lattice Boltzmann model, the cell isolation process is numerically studied and it turns out that the micro-hole makes the isolation process shift to a micro-syringe injection model leading to the lower laser energy threshold for cell separation and fewer injuries. Copyright© Bentham Science Publishers; For any queries, please email at epub@benthamscience.org.

Characterisation of a novel reverse-biased PPD CMOS image sensor

NASA Astrophysics Data System (ADS)

Stefanov, K. D.; Clarke, A. S.; Ivory, J.; Holland, A. D.

2017-11-01

A new pinned photodiode (PPD) CMOS image sensor (CIS) has been developed and characterised. The sensor can be fully depleted by means of reverse bias applied to the substrate, and the principle of operation is applicable to very thick sensitive volumes. Additional n-type implants under the pixel p-wells, called Deep Depletion Extension (DDE), have been added in order to eliminate the large parasitic substrate current that would otherwise be present in a normal device. The first prototype has been manufactured on a 18 μm thick, 1000 Ω .cm epitaxial silicon wafers using 180 nm PPD image sensor process at TowerJazz Semiconductor. The chip contains arrays of 10 μm and 5.4 μm pixels, with variations of the shape, size and the depth of the DDE implant. Back-side illuminated (BSI) devices were manufactured in collaboration with Teledyne e2v, and characterised together with the front-side illuminated (FSI) variants. The presented results show that the devices could be reverse-biased without parasitic leakage currents, in good agreement with simulations. The new 10 μm pixels in both BSI and FSI variants exhibit nearly identical photo response to the reference non-modified pixels, as characterised with the photon transfer curve. Different techniques were used to measure the depletion depth in FSI and BSI chips, and the results are consistent with the expected full depletion.

Thick Bi2Sr2CaCu2O8+δ films grown by liquid-phase epitaxy for Josephson THz applications

NASA Astrophysics Data System (ADS)

Simsek, Y.; Vlasko-Vlasov, V.; Koshelev, A. E.; Benseman, T.; Hao, Y.; Kesgin, I.; Claus, H.; Pearson, J.; Kwok, W.-K.; Welp, U.

2018-01-01

Theoretical and experimental studies of intrinsic Josephson junctions (IJJs) that naturally occur in high-T c superconducting Bi2Sr2CaCu2O8+δ (Bi-2212) have demonstrated their potential for novel types of compact devices for the generation and sensing of electromagnetic radiation in the THz range. Here, we show that the THz-on-a-chip concept may be realized in liquid-phase epitaxial-grown (LPE) thick Bi-2212 films. We have grown μm thick Bi-2212 LPE films on MgO substrates. These films display excellent c-axis alignment and single crystal grains of about 650 × 150 μm2 in size. A branched current-voltage characteristic was clearly observed in c-axis transport, which is a clear signature of underdamped IJJs, and a prerequisite for THz-generation. We discuss LPE growth conditions allowing improvement of the structural quality and superconducting properties of Bi-2212 films for THz applications.

Ultra-Thin Monocrystalline Silicon Solar Cell with 12.2% Efficiency Using Silicon-On-Insulator Substrate.

PubMed

Bian, Jian-Tao; Yu, Jian; Duan, Wei-Yuan; Qiu, Yu

2015-04-01

Single side heterojunction silicon solar cells were designed and fabricated using Silicon-On-Insulator (SOI) substrate. The TCAD software was used to simulate the effect of silicon layer thickness, doping concentration and the series resistance. A 10.5 µm thick monocrystalline silicon layer was epitaxially grown on the SOI with boron doping concentration of 2 x 10(16) cm(-3) by thermal CVD. Very high Voc of 678 mV was achieved by applying amorphous silicon heterojunction emitter on the front surface. The single cell efficiency of 12.2% was achieved without any light trapping structures. The rear surface recombination and the series resistance are the main limiting factors for the cell efficiency in addition to the c-Si thickness. By integrating an efficient light trapping scheme and further optimizing fabrication process, higher efficiency of 14.0% is expected for this type of cells. It can be applied to integrated circuits on a monolithic chip to meet the requirements of energy autonomous systems.

Phase Transformation Study in Nb-Mo Microalloyed Steels Using Dilatometry and EBSD Quantification

NASA Astrophysics Data System (ADS)

Isasti, Nerea; Jorge-Badiola, Denis; Taheri, Mitra L.; Uranga, Pello

2013-08-01

A complete microstructural characterization and phase transformation analysis has been performed for several Nb and Nb-Mo microalloyed low-carbon steels using electron backscattered diffraction (EBSD) and dilatometry tests. Compression thermomechanical schedules were designed resulting in the undeformed and deformed austenite structures before final transformation. The effects of microalloying additions and accumulated deformation were analyzed after CCT diagram development and microstructural quantification. The resulting microstructures ranged from polygonal ferrite and pearlite at slow cooling ranges, to a combination of quasipolygonal ferrite and granular ferrite for intermediate cooling rates, and finally, to bainitic ferrite with martensite for fast cooling rates. The addition of Mo promotes a shift in the CCT diagrams to lower transformation start temperatures. When the amount of Nb is increased, CCT diagrams show little variations for transformations from the undeformed austenite and higher initial transformation temperatures in the transformations from the deformed austenite. This different behavior is due to the effect of niobium on strain accumulation in austenite and its subsequent acceleration of transformation kinetics. This article shows the complex interactions between chemical composition, deformation, and the phases formed, as well as their effect on microstructural unit sizes and homogeneity.

Noncommutative spherically symmetric spacetimes at semiclassical order

NASA Astrophysics Data System (ADS)

Fritz, Christopher; Majid, Shahn

2017-07-01

Working within the recent formalism of Poisson-Riemannian geometry, we completely solve the case of generic spherically symmetric metric and spherically symmetric Poisson-bracket to find a unique answer for the quantum differential calculus, quantum metric and quantum Levi-Civita connection at semiclassical order O(λ) . Here λ is the deformation parameter, plausibly the Planck scale. We find that r, t, d r, d t are all forced to be central, i.e. undeformed at order λ, while for each value of r, t we are forced to have a fuzzy sphere of radius r with a unique differential calculus which is necessarily nonassociative at order λ2 . We give the spherically symmetric quantisation of the FLRW cosmology in detail and also recover a previous analysis for the Schwarzschild black hole, now showing that the quantum Ricci tensor for the latter vanishes at order λ. The quantum Laplace-Beltrami operator for spherically symmetric models turns out to be undeformed at order λ while more generally in Poisson-Riemannian geometry we show that it deforms to □f+λ2ωαβ(Ricγα-Sγα)(∇^βdf)γ+O(λ2) in terms of the classical Levi-Civita connection \\widehat\

Geologic and structural controls on rupture zone fabric: A field-based study of the 2010 Mw 7.2 El Mayor–Cucapah earthquake surface rupture

USGS Publications Warehouse

Teran, Orlando; Fletcher, John L.; Oskin, Michael; Rockwell, Thomas; Hudnut, Kenneth W.; Spelz, Ronald; Akciz, Sinan; Hernandez-Flores, Ana Paula; Morelan, Alexander

2015-01-01

We systematically mapped (scales >1:500) the surface rupture of the 4 April 2010 Mw (moment magnitude) 7.2 El Mayor-Cucapah earthquake through the Sierra Cucapah (Baja California, northwestern Mexico) to understand how faults with similar structural and lithologic characteristics control rupture zone fabric, which is here defined by the thickness, distribution, and internal configuration of shearing in a rupture zone. Fault zone thickness and master fault dip are strongly correlated with many parameters of rupture zone fabric. Wider fault zones produce progressively wider rupture zones and both of these parameters increase systematically with decreasing dip of master faults, which varies from 20° to 90° in our dataset. Principal scarps that accommodate more than 90% of the total coseismic slip in a given transect are only observed in fault sections with narrow rupture zones (<25 m). As rupture zone thickness increases, the number of scarps in a given transect increases, and the scarp with the greatest relative amount of coseismic slip decreases. Rupture zones in previously undeformed alluvium become wider and have more complex arrangements of secondary fractures with oblique slip compared to those with pure normal dip-slip or pure strike-slip. Field relations and lidar (light detection and ranging) difference models show that as magnitude of coseismic slip increases from 0 to 60 cm, the links between kinematically distinct fracture sets increase systematically to the point of forming a throughgoing principal scarp. Our data indicate that secondary faults and penetrative off-fault strain continue to accommodate the oblique kinematics of coseismic slip after the formation of a thoroughgoing principal scarp. Among the widest rupture zones in the Sierra Cucapah are those developed above buried low angle faults due to the transfer of slip to widely distributed steeper faults, which are mechanically more favorably oriented. The results from this study show that the measureable parameters that define rupture zone fabric allow for testing hypotheses concerning the mechanics and propagation of earthquake ruptures, as well as for siting and designing facilities to be constructed in regions near active faults.

Electrostatically Actuated Resonant Microcantilever Beam in CMOS Technology for the Detection of Chemical Weapons

DTIC Science & Technology

2005-01-01

sorption . In this regard, the length ( ) and 1530-437X/$20.00 © 2005 IEEE Report Documentation Page Form ApprovedOMB No. 0704-0188 Public reporting...temperature. The beam’s resonant frequency shift re- sponse resulting from analyte sorption increases with increasing thickness of the polymer layer. At...pneumatic tubing used for all gas wetted parts was PFA . The chip mounted in the Kyocera package was sealed by positioning a Combo Lid (Chelsea Technology

Investigation of discrete component chip mounting technology for hybrid microelectronic circuits

NASA Technical Reports Server (NTRS)

Caruso, S. V.; Honeycutt, J. O.

1975-01-01

The use of polymer adhesives for high reliability microcircuit applications is a radical deviation from past practices in electronic packaging. Bonding studies were performed using two gold-filled conductive adhesives, 10/90 tin/lead solder and Indalloy no. 7 solder. Various types of discrete components were mounted on ceramic substrates using both thick-film and thin-film metallization. Electrical and mechanical testing were performed on the samples before and after environmental exposure to MIL-STD-883 screening tests.

Quantitative fabrication, performance optimization and comparison of PEG and zwitterionic polymer antifouling coatings.

PubMed

Xing, Cheng-Mei; Meng, Fan-Ning; Quan, Miao; Ding, Kai; Dang, Yuan; Gong, Yong-Kuan

2017-09-01

A versatile fabrication and performance optimization strategy of PEG and zwitterionic polymer coatings is developed on the sensor chip of surface plasma resonance (SPR) instrument. A random copolymer bearing phosphorylcholine zwitterion and active ester side chains (PMEN) and carboxylic PEG coatings with comparable thicknesses were deposited on SPR sensor chips via amidation coupling on the precoated polydopamine (PDA) intermediate layer. The PMEN coating showed much stronger resistance to bovine serum albumin (BSA) adsorption than PEG coating at very thin thickness (∼1nm). However, the BSA resistant efficacy of PEG coating could exceed that of PMEN due to stronger steric repelling effect when the thickness increased to 1.5∼3.3nm. Interestingly, both the PEG and PMEN thick coatings (≈3.6nm) showed ultralow fouling by BSA and bovine plasma fibrinogen (Fg). Moreover, changes in the PEG end group from -OH to -COOH, protein adsorption amount could increase by 10-fold. Importantly, the optimized PMEN and PEG-OH coatings were easily duplicated on other substrates due to universal adhesion of the PDA layer, showed excellent resistance to platelet, bacteria and proteins, and no significant difference in the antifouling performances was observed. These detailed results can explain the reported discrepancy in performances between PEG and zwitterionic polymer coatings by thickness. This facile and substrate-independent coating strategy may benefit the design and manufacture of advanced antifouling biomedical devices and long circulating nanocarriers. Prevention of biofouling is one of the biggest challenges for all biomedical applications. However, it is very difficult to fabricate a highly hydrophilic antifouling coating on inert materials or large devices. In this study, PEG and zwitterion polymers, the most widely investigated polymers with best antifouling performance, are conveniently immobilized on different kinds of substrates from their aqueous solutions by precoating a polydopamine intermediate layer as the universal adhesive and readily re-modifiable surface. Importantly, the coating fabrication and antifouling performance can be monitored and optimized quantitatively by a surface plasma resonance (SPR) system. More significantly, the SPR on-line optimized coatings were successfully duplicated off-line on other substrates, and supported by their excellent antifouling properties. Copyright © 2017 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

The radiation dose from a proposed measurement of arsenic and selenium in human skin

NASA Astrophysics Data System (ADS)

Gherase, Mihai R.; Mader, Joanna E.; Fleming, David E. B.

2010-09-01

Dose measurements following 10 min irradiations with a portable x-ray fluorescence spectrometer composed of a miniature x-ray tube and a silicon PiN diode detector were performed using thermoluminescent dosimeters consisting of LiF:Mg,Ti chips of 3 mm diameter and 0.4 mm thickness. The table-top setup of the spectrometer was used for all measurements. The setup included a stainless steel lid which served as a radiation shield. Two rectangular polyethylene skin/soft tissue phantoms with two cylindrical plaster of Paris bone phantoms were used to study the effect of x-ray beam attenuation and backscatter on the measured dose. Eight different irradiation experiments were performed. The average dose rate values measured with TLD chips within a 1 × 1 cm2 area were between 4.8 and 12.8 mGy min-1. The equivalent dose for a 1 × 1 cm2 skin area was estimated to be 13.2 mSv. The maximum measured dose rate values with a single TLD chip were between 7.5 and 25.1 mGy min-1. The effective dose corresponding to a proposed arsenic/selenium skin measurement was estimated to be 0.13 µSv for a 2 min irradiation.

Advances in OLED/OPD-based sensors and spectrometer-on-a-chip (Conference Presentation)

NASA Astrophysics Data System (ADS)

Shinar, Joseph; Kaudal, Rajiv; Manna, Eeshita; Fungura, Fadzai; Shinar, Ruth

2016-09-01

We describe ongoing advances toward achieving all-organic optical sensors and a spectrometer on a chip. Two-dimensional combinatorial arrays of microcavity OLEDs (μcOLEDs) with systematically varying optical cavity lengths are fabricated on a single chip by changing the thickness of different organic and/or spacer layers sandwiched between two metal electrodes (one very thin) that form the cavity. The broad spectral range is achieved by utilizing materials that result in white OLEDs (WOLEDs) when fabricated on a standard ITO substrate. The tunable and narrower emissions from the μcOLEDs serve as excitation sources in luminescent sensors and in monitoring light absorption. For each wavelength, the light from the μcOLED is partially absorbed by a sample under study and the light emitted by an electronically excited sample, or the transmitted light is detected by a photodetector (PD). To obtain a compact monitor, an organic PD (OPD) or a perovskite-based PD is integrated with the μcOLED array. We show the potential of encompassing a broader wavelength range by using WOLED materials to fabricate the μcOLEDs. The utility of the all-organic analytical devices is demonstrated by monitoring oxygen, and bioanalytes based on oxygen detection, as well as the absorption spectra of dyes.

Use of shredded tire chips and tire crumbs as packing media in trickling filter systems for landfill leachate treatment.

PubMed

Mondal, B; Warith, M A

2008-08-01

Scrap tire stockpiles are breeding grounds for pests, mosquitoes and west Nile viruses and, thereby, become a potential health risk. This experimental study was carried out in six stages to determine the suitability of shredded tire materials in a trickling filter system to treat landfill leachate. Biochemical oxygen demand (BOD5), chemical oxygen demand (COD) and NH3-N removals were obtained in the range of 81 to 96%, 76 to 90% and 15 to 68%, respectively. The removal of organics appears to be largely related to total dissolved solids reduction in leachate. A sudden increase, from time to time, in organic content of effluent could be attributed to biomass sloughing and clogging in the trickling filters. However, tire crumbs exhibited more consistent organics removal throughout the experimental program. Due to the high surface area of shredded tire chips and crumbs, a layer of biomass, 1-2 mm thick, was attached to them and was sloughed off at an interval of 21 days. Apart from that, as shredded tires are comparatively cheaper than any other usable packing material, tire chips and tire crumbs appeared to be quite promising as packing media in trickling filters for landfill leachate treatment.

Surface transport and stable trapping of particles and cells by an optical waveguide loop.

PubMed

Hellesø, Olav Gaute; Løvhaugen, Pål; Subramanian, Ananth Z; Wilkinson, James S; Ahluwalia, Balpreet Singh

2012-09-21

Waveguide trapping has emerged as a useful technique for parallel and planar transport of particles and biological cells and can be integrated with lab-on-a-chip applications. However, particles trapped on waveguides are continuously propelled forward along the surface of the waveguide. This limits the practical usability of the waveguide trapping technique with other functions (e.g. analysis, imaging) that require particles to be stationary during diagnosis. In this paper, an optical waveguide loop with an intentional gap at the centre is proposed to hold propelled particles and cells. The waveguide acts as a conveyor belt to transport and deliver the particles/cells towards the gap. At the gap, the diverging light fields hold the particles at a fixed position. The proposed waveguide design is numerically studied and experimentally implemented. The optical forces on the particle at the gap are calculated using the finite element method. Experimentally, the method is used to transport and trap micro-particles and red blood cells at the gap with varying separations. The waveguides are only 180 nm thick and thus could be integrated with other functions on the chip, e.g. microfluidics or optical detection, to make an on-chip system for single cell analysis and to study the interaction between cells.

Automated imaging of cellular spheroids with selective plane illumination microscopy on a chip (Conference Presentation)

NASA Astrophysics Data System (ADS)

Paiè, Petra; Bassi, Andrea; Bragheri, Francesca; Osellame, Roberto

2017-02-01

Selective plane illumination microscopy (SPIM) is an optical sectioning technique that allows imaging of biological samples at high spatio-temporal resolution. Standard SPIM devices require dedicated set-ups, complex sample preparation and accurate system alignment, thus limiting the automation of the technique, its accessibility and throughput. We present a millimeter-scaled optofluidic device that incorporates selective plane illumination and fully automatic sample delivery and scanning. To this end an integrated cylindrical lens and a three-dimensional fluidic network were fabricated by femtosecond laser micromachining into a single glass chip. This device can upgrade any standard fluorescence microscope to a SPIM system. We used SPIM on a CHIP to automatically scan biological samples under a conventional microscope, without the need of any motorized stage: tissue spheroids expressing fluorescent proteins were flowed in the microchannel at constant speed and their sections were acquired while passing through the light sheet. We demonstrate high-throughput imaging of the entire sample volume (with a rate of 30 samples/min), segmentation and quantification in thick (100-300 μm diameter) cellular spheroids. This optofluidic device gives access to SPIM analyses to non-expert end-users, opening the way to automatic and fast screening of a high number of samples at subcellular resolution.

A battery-free multichannel digital neural/EMG telemetry system for flying insects.

PubMed

Thomas, Stewart J; Harrison, Reid R; Leonardo, Anthony; Reynolds, Matthew S

2012-10-01

This paper presents a digital neural/EMG telemetry system small enough and lightweight enough to permit recording from insects in flight. It has a measured flight package mass of only 38 mg. This system includes a single-chip telemetry integrated circuit (IC) employing RF power harvesting for battery-free operation, with communication via modulated backscatter in the UHF (902-928 MHz) band. An on-chip 11-bit ADC digitizes 10 neural channels with a sampling rate of 26.1 kSps and 4 EMG channels at 1.63 kSps, and telemeters this data wirelessly to a base station. The companion base station transceiver includes an RF transmitter of +36 dBm (4 W) output power to wirelessly power the telemetry IC, and a digital receiver with a sensitivity of -70 dBm for 10⁻⁵ BER at 5.0 Mbps to receive the data stream from the telemetry IC. The telemetry chip was fabricated in a commercial 0.35 μ m 4M1P (4 metal, 1 poly) CMOS process. The die measures 2.36 × 1.88 mm, is 250 μm thick, and is wire bonded into a flex circuit assembly measuring 4.6 × 6.8 mm.

Microstructural observations of reconsolidated granular salt to 250°C

NASA Astrophysics Data System (ADS)

Mills, M. M.; Hansen, F.; Bauer, S. J.; Stormont, J.

2014-12-01

Very low permeability is a principal reason salt formations are considered viable hosts for disposal of nuclear waste and spent nuclear fuel. Granular salt is likely to be used as back-fill material and as a seal system component. Granular salt is expected to reconsolidate to a low permeability condition because of external pressure from the surrounding salt formation. Understanding the consolidation processes--known to depend on the stress state, moisture availability and temperature--is important for predicting achievement of sealing functions and long-term repository performance. As granular salt consolidates, initial void reduction is accomplished by brittle processes of grain rearrangement and cataclastic flow. At porosities of less than 10%, grain boundary processes and crystal-plastic mechanisms govern further porosity reduction. We investigate the micro-mechanisms operative in granular salt that has been consolidated under high temperatures to relatively low porosity. These conditions would occur proximal to heat-generating canisters. Mine-run salt from the Waste Isolation Pilot Plant was used to create cylindrical samples which were consolidated at 250°C and stresses to 20 MPa. From samples consolidated to fractional densities of 86% and 97% polished thin sections, etched cleavage chips, and fragments were fabricated. Microstructural techniques included scanning electron and optical microscopy. Microstructure of undeformed mine-run salt was compared to the deformed granular salt. Observed deformation mechanisms include glide, cross slip, climb, fluid-assisted creep, pressure-solution redeposition, and annealing. Documentation of operative deformation mechanisms within the consolidating granular salt, particularly at grain boundaries, is essential to establish effects of moisture, stress, and temperature. Future work will include characterization of pore structures. Information gleaned in these studies supports evaluation of a constitutive model for reconsolidating granular salt, which will be used to predict the thermal-mechanical-hydrologic response of salt repository seal structures and backfilled rooms.

An analysis of the pull strength behaviors of fine-pitch, flip chip solder interconnections using a Au-Pt-Pd thick film conductor on Low-Temperature, Co-fired Ceramic (LTCC) substrates.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Uribe, Fernando R.; Kilgo, Alice C.; Grazier, John Mark

2008-09-01

The assembly of the BDYE detector requires the attachment of sixteen silicon (Si) processor dice (eight on the top side; eight on the bottom side) onto a low-temperature, co-fired ceramic (LTCC) substrate using 63Sn-37Pb (wt.%, Sn-Pb) in a double-reflow soldering process (nitrogen). There are 132 solder joints per die. The bond pads were gold-platinum-palladium (71Au-26Pt-3Pd, wt.%) thick film layers fired onto the LTCC in a post-process sequence. The pull strength and failure modes provided the quality metrics for the Sn-Pb solder joints. Pull strengths were measured in both the as-fabricated condition and after exposure to thermal cycling (-55/125 C; 15more » min hold times; 20 cycles). Extremely low pull strengths--referred to as the low pull strength phenomenon--were observed intermittently throughout the product build, resulting in added program costs, schedule delays, and a long-term reliability concern for the detector. There was no statistically significant correlation between the low pull strength phenomenon and (1) the LTCC 'sub-floor' lot; (2) grit blasting the LTCC surfaces prior to the post-process steps; (3) the post-process parameters; (4) the conductor pad height (thickness); (5) the dice soldering assembly sequence; or (5) the dice pull test sequence. Formation of an intermetallic compound (IMC)/LTCC interface caused by thick film consumption during either the soldering process or by solid-state IMC formation was not directly responsible for the low-strength phenomenon. Metallographic cross sections of solder joints from dice that exhibited the low pull strength behavior, revealed the presence of a reaction layer resulting from an interaction between Sn from the molten Sn-Pb and the glassy phase at the TKN/LTCC interface. The thick film porosity did not contribute, explicitly, to the occurrence of reaction layer. Rather, the process of printing the very thin conductor pads was too sensitive to minor thixotropic changes to ink, which resulted in inconsistent proportions of metal and glassy phase particles present during the subsequent firing process. The consequences were subtle, intermittent changes to the thick film microstructure that gave rise to the reaction layer and, thus, the low pull strength phenomenon. A mitigation strategy would be the use of physical vapor deposition (PVD) techniques to create thin film bond pads; this is multi-chip module, deposited (MCM-D) technology.« less

Design and characterization of novel monolithic pixel sensors for the ALICE ITS upgrade

NASA Astrophysics Data System (ADS)

Cavicchioli, C.; Chalmet, P. L.; Giubilato, P.; Hillemanns, H.; Junique, A.; Kugathasan, T.; Mager, M.; Marin Tobon, C. A.; Martinengo, P.; Mattiazzo, S.; Mugnier, H.; Musa, L.; Pantano, D.; Rousset, J.; Reidt, F.; Riedler, P.; Snoeys, W.; Van Hoorne, J. W.; Yang, P.

2014-11-01

Within the R&D activities for the upgrade of the ALICE Inner Tracking System (ITS), Monolithic Active Pixel Sensors (MAPS) are being developed and studied, due to their lower material budget ( 0.3 %X0 in total for each inner layer) and higher granularity ( 20 μm × 20 μm pixels) with respect to the present pixel detector. This paper presents the design and characterization results of the Explorer0 chip, manufactured in the TowerJazz 180 nm CMOS Imaging Sensor process, based on a wafer with high-resistivity (ρ > 1 kΩ cm) and 18 μm thick epitaxial layer. The chip is organized in two sub-matrices with different pixel pitches (20 μm and 30 μm), each of them containing several pixel designs. The collection electrode size and shape, as well as the distance between the electrode and the surrounding electronics, are varied; the chip also offers the possibility to decouple the charge integration time from the readout time, and to change the sensor bias. The charge collection properties of the different pixel variants implemented in Explorer0 have been studied using a 55Fe X-ray source and 1-5 GeV/c electrons and positrons. The sensor capacitance has been estimated, and the effect of the sensor bias has also been examined in detail. A second version of the Explorer0 chip (called Explorer1) has been submitted for production in March 2013, together with a novel circuit with in-pixel discrimination and a sparsified readout. Results from these submissions are also presented.

Drilling a ';super-volcano': volcanology of the proximal rhyolitic volcanic succession in the HOTSPOT deep drill hole, Idaho, Yellowstone hot-spot track

NASA Astrophysics Data System (ADS)

Knott, T.; Branney, M. J.; Christiansen, E. H.; Reichow, M. K.; McCurry, M. O.; Shervais, J. W.

2013-12-01

Project HOTSPOT seeks to understand the bimodal volcanism in the Yellowstone-Snake River large igneous province, including the magma generation and eruption history. The 1.9 km-deep Kimberly well in southern Idaho, USA, reveals a proximal mid-Miocene rhyolitic and basaltic volcanic succession marginal to the postulated Twin Falls eruptive centre. Three rhyolitic eruption-units (each we interpret to record a single eruption, based on core descriptions) are separated by basaltic lavas, palaeosols and volcaniclastic sediments, and are being dated by 40Ar-39Ar on plagioclases. Whole-rock and mineral chemical data, from each unit, has been compiled to facilitate correlation with well-studied eruption-units at more distal outcrops, where we have detailed chemical, palaeomagnetic and radiometric characterisation. Results will contribute to frequency and volume calculations for some of the most catastrophic super-eruptions in Earth history. As the volcanism is of Snake River (SR)-type and lacks typical pumice fall deposits and low-moderate grade ignimbrites, interpreting the physical origin of the units can be difficult; many SR-type rheomorphic ignimbrites are flow-banded and resemble lavas, and the distinction between these and true lavas involves interpretation of critical evidence from lower contacts (e.g., distinguishing basal lava autobreccias from peperitic contacts, which can occur at the bases of SR-type lavas and ignimbrites). The lower most eruption-unit, ';Kimberly Rhyolite 1,' is >1323 m thick (base not seen) and suggests ponding in the margin of a caldera. Few vitroclastic textures are preserved, but a rheomorphic ignimbrite origin is inferred by folded fabrics and scattered obsidian chips (2-5 mm in size) within a thick lithoidal zone, which passes sharply upwards into a 39.6 m thick vitrophyre with an autobrecciated top and it is overlain by 18 m (caldera?) lake sediments. However, lithic mesobreccia, that characterise caldera fills elsewhere, are not seen. ';Kimberly Rhyolite 2' is 168.2 m-thick with a non-brecciated base, lithoidal centre and an autobrecciated upper vitrophyre (45 m thick). It also contains 2-5 mm obsidian chips and may represent a proximal outflow correlative of more distal ignimbrites in southern Idaho. It is overlain by laminated sediments (64 m-thick), basalt lavas (67 m thick), 23 m-thick laminated sediments, and a 30 m basalt lava with an upper palaeosol. Overlying this palaeosol is the uppermost unit,' Kimberly Rhyolite 3' (127 m thick) with a 4.5 m vitrophyric basal autobreccia, well-developed flow banding and no visible pyroclasts. The nature of the basal contact, and the lack of any pyroclastic features, suggest its origin is likely a rhyolitic lava and whole rock and mineral chemistries indicate it may be a correlative of the 6.53 Ma, ≤200 m-thick, Shoshone rhyolite lava. The Kimberly well is the only window into potential caldera fills in the SR-Plain, southern Idaho. Any correlations made with this proximal succession would greatly increase the volume of SR-outflow facies by demonstrating caldera fills, that to date, have only been inferred.

Surficial geology, structure, and thickness of selected geohydrologic units in the Columbia Plateau, Washington

USGS Publications Warehouse

Drost, B.W.; Whiteman, K.J.

1986-01-01

A 2-1/2 year study of the Columbia Plateau in Washington was begun in March 1982 to define spatial and temporal variations in dissolved sodium in the Columbia River Basalt Group aquifers and to relate these variations to the groundwater system and its geologic framework. This report describes the geologic framework , including the vertical and areal extent of the major basalt units, interbeds, and overlying materials. Thickness and structure of the Grande Ronde, Wanapum, and Saddle Mountains Basalts, thickness of the interbeds between the Grande Ronde and Wanapum, and Wanapum and Saddle Mountains Basalts, and thickness of the overburden were mapped at a scale of 1:500,000. Information was compiled from 2,500 well records using chemical analyses of core or drill chips, geophysical logs, and driller 's logs, in decreasing order of reliability. Surficial geology and surficial expression of structural features were simplified from published maps to provide maps with this information at the 1:500,000 scale. This report is intended to serve as a base for evaluating the distribution of dissolved sodium in basalt aquifers and as a base for future water resource studies. (USGS)

Functionalized Thick Film Impedance Sensors for Use in In Vitro Cell Culture.

PubMed

Bartsch, Heike; Baca, Martin; Fernekorn, Uta; Müller, Jens; Schober, Andreas; Witte, Hartmut

2018-04-05

Multi-electrode arrays find application in electrophysiological recordings. The quality of the captured signals depends on the interfacial contact between electrogenic cells and the electronic system. Therefore, it requires reliable low-impedance electrodes. Low-temperature cofired ceramic technology offers a suitable platform for rapid prototyping of biological reactors and can provide both stable fluid supply and integrated bio-hardware interfaces for recordings in electrogenic cell cultures. The 3D assembly of thick film gold electrodes in in vitro bio-reactors has been demonstrated for neuronal recordings. However, especially when dimensions become small, their performance varies strongly. This work investigates the influence of different coatings on thick film gold electrodes with regard to their influence on impedance behavior. PSS layer, titanium oxynitride and laminin coatings are deposited on LTCC gold electrodes using different 2D and 3D MEA chip designs. Their impedance characteristics are compared and discussed. Titanium oxynitride layers emerged as suitable functionalization. Small 86-µm-electrodes have a serial resistance R s of 32 kOhm and serial capacitance C s of 4.1 pF at 1 kHz. Thick film gold electrodes with such coatings are thus qualified for signal recording in 3-dimensional in vitro cell cultures.

Evaluation of oxide-coated iridium-rhenium chambers

NASA Astrophysics Data System (ADS)

Reed, Brian D.

1994-03-01

Iridium-coated rhenium (Ir-Re) provides long life operation of radiation-cooled rockets at temperatures up to 2200 C. Ceramic oxide coatings could be used to increase Ir-Re rocket lifetimes and allow operation in highly oxidizing environments. Ceramic oxide coatings promise to serve as both thermal and diffusion barriers for the iridium layer. Seven ceramic oxide-coated Ir-Re, 22-N rocket chambers were tested with gaseous hydrogen/gaseous oxygen (GHz/G02) propellants. Five chambers had thick (over 10 mils), monolithic coatings of either hafnia (HfO2) or zirconia (ZrO2). Two chambers had coatings with thicknesses less than 5 mils. One of these chambers had a thin-walled coating of ZrO2 infiltrated with sol gel HfO2. The other chamber had a coating composed of an Ir-oxide composite. The purpose of this test program was to assess the ability of the oxide coatings to withstand the thermal shock of combustion initiation, adhere under repeated thermal cycling, and operate in aggressively oxidizing environments. All of the coatings survived the thermal shock of combustion and demonstrated operation at mixture ratios up to 11. Testing the Ir-oxide composite-coated chamber included over 29 min at mixture ratio 16. The thicker walled coatings provided the larger temperature drops across the oxide layer (up to 570 C), but were susceptible to macrocracking and eventual chipping at a stress concentrator. The cracks apparently resealed during firing, under compression of the oxide layer. The thinner walled coatings did not experience the macrocracking and chipping of the chambers that was seen with the thick, monolithic coatings. However, burn-throughs in the throat region did occur in both of the thin-walled chambers at mixture ratios well above stoichiometric. The burn-throughs were probably the result of oxygen diffusion through the oxide coating that allowed the underlying Ir and Re layers to be oxidized. The results of this test program indicated that the thin-walled oxide coatings are better suited for repeated thermal cycling than the thick-walled coating, while thicker coatings may be required for operation in aggressively oxidizing environments.

Evaluation of oxide-coated iridium-rhenium chambers

NASA Technical Reports Server (NTRS)

Reed, Brian D.

1994-01-01

Iridium-coated rhenium (Ir-Re) provides long life operation of radiation-cooled rockets at temperatures up to 2200 C. Ceramic oxide coatings could be used to increase Ir-Re rocket lifetimes and allow operation in highly oxidizing environments. Ceramic oxide coatings promise to serve as both thermal and diffusion barriers for the iridium layer. Seven ceramic oxide-coated Ir-Re, 22-N rocket chambers were tested with gaseous hydrogen/gaseous oxygen (GHz/G02) propellants. Five chambers had thick (over 10 mils), monolithic coatings of either hafnia (HfO2) or zirconia (ZrO2). Two chambers had coatings with thicknesses less than 5 mils. One of these chambers had a thin-walled coating of ZrO2 infiltrated with sol gel HfO2. The other chamber had a coating composed of an Ir-oxide composite. The purpose of this test program was to assess the ability of the oxide coatings to withstand the thermal shock of combustion initiation, adhere under repeated thermal cycling, and operate in aggressively oxidizing environments. All of the coatings survived the thermal shock of combustion and demonstrated operation at mixture ratios up to 11. Testing the Ir-oxide composite-coated chamber included over 29 min at mixture ratio 16. The thicker walled coatings provided the larger temperature drops across the oxide layer (up to 570 C), but were susceptible to macrocracking and eventual chipping at a stress concentrator. The cracks apparently resealed during firing, under compression of the oxide layer. The thinner walled coatings did not experience the macrocracking and chipping of the chambers that was seen with the thick, monolithic coatings. However, burn-throughs in the throat region did occur in both of the thin-walled chambers at mixture ratios well above stoichiometric. The burn-throughs were probably the result of oxygen diffusion through the oxide coating that allowed the underlying Ir and Re layers to be oxidized. The results of this test program indicated that the thin-walled oxide coatings are better suited for repeated thermal cycling than the thick-walled coating, while thicker coatings may be required for operation in aggressively oxidizing environments.

Testing and evaluation of oxide-coated iridium/rhenium chambers

NASA Technical Reports Server (NTRS)

Reed, Brian D.

1993-01-01

Iridium-coated rhenium provides long life operation of radiation-cooled rockets at temperatures up to 2200 C. Ceramic oxide coatings could be used to increase iridium/rhenium rocket lifetimes and allow operation in highly oxidizing environments. Ceramic oxide coatings promise to serve as both thermal and diffusion barriers for the iridium layer. Seven ceramic oxide-coated iridium/rhenium, 22 N rocket chambers were tested on gaseous hydrogen/gaseous oxygen propellants. Five chambers had thick (over 10 mils), monolithic coatings of either hafnia or zirconia. Two chambers had coatings with thicknesses less than 5 mils. One of these chambers had a thin-walled coating of zirconia infiltrated with sol gel hafnia. The other chamber had a coating composed of an iridium/oxide composite. The purpose of this test program was to assess the ability of the oxide coatings to withstand the thermal shock of combustion initiation, adhere under repeated thermal cycling, and operate in aggressively oxidizing environments. All of the coatings survived the thermal shock of combustion and demonstrated operation at mixture ratios up to 11. The iridium/oxide composite coated chamber included testing for over 29 minutes at mixture ratio 16. The thicker-walled coatings provided the larger temperature drops across the oxide layer (up to 570 C), but were susceptible to macrocracking and eventual chipping at a stress concentrator. The cracks apparently resealed during firing, under compression of the oxide layer. The thinner-walled coatings did not experience the macrocracking and chipping of the chambers seen with the thick, monolithic coatings. However, burnthroughs in the throat region did occur in both of the thin-walled chambers at mixture ratios well above stochiometric. The burn-throughs were probably the result of oxygen-diffusion through the oxide coating that allowed the underlying iridium and rhenium layers to be oxidized. The results of this test program indicated that the thin-walled oxide coatings are better suited for repeated thermal cycling than the thick-walled coating, while thicker coatings may be required for operation in aggressively oxidizing environments.

Experimental Study of Subcooled Flow Boiling Heat Transfer on a Smooth Surface in Short-Term Microgravity

NASA Astrophysics Data System (ADS)

Zhang, Yonghai; Liu, Bin; Zhao, Jianfu; Deng, Yueping; Wei, Jinjia

2018-06-01

The flow boiling heat transfer characteristics of subcooled air-dissolved FC-72 on a smooth surface (chip S) were studied in microgravity by utilizing the drop tower facility in Beijing. The heater, with dimensions of 40 × 10 × 0.5 mm3 (length × width × thickness), was combined with two silicon chips with the dimensions of 20 × 10 × 0.5 mm3. High-speed visualization was used to supplement observation in the heat transfer and vapor-liquid two-phase flow characteristics. In the low and moderate heat fluxes region, the flow boiling of chip S at inlet velocity V = 0.5 m/s shows almost the same regulations as that in pool boiling. All the wall temperatures at different positions along the heater in microgravity are slightly lower than that in normal gravity, which indicates slight heat transfer enhancement. However, in the high heat flux region, the pool boiling of chip S shows much evident deterioration of heat transfer compared with that of flow boiling in microgravity. Moreover, the bubbles of flow boiling in microgravity become larger than that in normal gravity due to the lack of buoyancy Although the difference of the void fraction in x-y plain becomes larger with increasing heat flux under different gravity levels, it shows nearly no effect on heat transfer performance except for critical heat flux (CHF). Once the void fraction in y-z plain at the end of the heater equals 1, the vapor blanket will be formed quickly and transmit from downstream to upstream along the heater, and CHF occurs. Thus, the height of channel is an important parameter to determine CHF in microgravity at a fixed velocity. The flow boiling of chip S at inlet velocity V = 0.5 m/s shows higher CHF than that of pool boiling because of the inertia force, and the CHF under microgravity is about 78-92% of that in normal gravity.

Improved force prediction model for grinding Zerodur based on the comprehensive material removal mechanism.

PubMed

Sun, Guoyan; Zhao, Lingling; Zhao, Qingliang; Gao, Limin

2018-05-10

There have been few investigations dealing with the force model on grinding brittle materials. However, the dynamic material removal mechanisms have not yet been sufficiently explicated through the grain-workpiece interaction statuses while considering the brittle material characteristics. This paper proposes an improved grinding force model for Zerodur, which contains ductile removal force, brittle removal force, and frictional force, corresponding to the ductile and brittle material removal phases, as well as the friction process, respectively. The critical uncut chip thickness a gc of brittle-ductile transition and the maximum uncut chip thickness a gmax of a single abrasive grain are calculated to identify the specified material removal mode, while the comparative result between a gmax and a gc can be applied to determine the selection of effective grinding force components. Subsequently, indentation fracture tests are carried out to acquire accurate material mechanical properties of Zerodur in establishing the brittle removal force model. Then, the experiments were conducted to derive the coefficients in the grinding force prediction model. Simulated through this model, correlations between the grinding force and grinding parameters can be predicted. Finally, three groups of grinding experiments are carried out to validate the mathematical grinding force model. The experimental results indicate that the improved model is capable of predicting the realistic grinding force accurately with the relative mean errors of 6.04% to the normal grinding force and 7.22% to the tangential grinding force, respectively.

Hybrid intracerebral probe with integrated bare LED chips for optogenetic studies.

PubMed

Ayub, Suleman; Gentet, Luc J; Fiáth, Richárd; Schwaerzle, Michael; Borel, Mélodie; David, François; Barthó, Péter; Ulbert, István; Paul, Oliver; Ruther, Patrick

2017-09-01

This article reports on the development, i.e., the design, fabrication, and validation of an implantable optical neural probes designed for in vivo experiments relying on optogenetics. The probes comprise an array of ten bare light-emitting diode (LED) chips emitting at a wavelength of 460 nm and integrated along a flexible polyimide-based substrate stiffened using a micromachined ladder-like silicon structure. The resulting mechanical stiffness of the slender, 250-μm-wide, 65-μm-thick, and 5- and 8-mm-long probe shank facilitates its implantation into neural tissue. The LEDs are encapsulated by a fluropolymer coating protecting the implant against the physiological conditions in the brain. The electrical interface to the external control unit is provided by 10-μm-thick, highly flexible polyimide cables making the probes suitable for both acute and chronic in vivo experiments. Optical and electrical properties of the probes are reported, as well as their in vivo validation in acute optogenetic studies in transgenic mice. The depth-dependent optical stimulation of both excitatory and inhibitory neurons is demonstrated by altering the brain activity in the cortex and the thalamus. Local network responses elicited by 20-ms-long light pulses of different optical power (20 μW and 1 mW), as well as local modulation of single unit neuronal activity to 1-s-long light pulses with low optical intensity (17 μW) are presented. The ability to modulate neural activity makes these devices suitable for a broad variety of optogenetic experiments.

Design and fabrication of AlGaInP-based micro-light-emitting-diode array devices

NASA Astrophysics Data System (ADS)

Bao, Xingzhen; Liang, Jingqiu; Liang, Zhongzhu; Wang, Weibiao; Tian, Chao; Qin, Yuxin; Lü, Jinguang

2016-04-01

An integrated high-resolution (individual pixel size 80 μm×80 μm) solid-state self-emissive active matrix programmed with 320×240 micro-light-emitting-diode arrays structure was designed and fabricated on an AlGaInP semiconductor chip using micro electro-mechanical systems, microstructure and semiconductor fabricating techniques. Row pixels share a p-electrode and line pixels share an n-electrode. We experimentally investigated GaAs substrate thickness affects the electrical and optical characteristics of the pixels. For a 150-μm-thick GaAs substrate, the single pixel output power was 167.4 μW at 5 mA, and increased to 326.4 μW when current increase to 10 mA. The device investigated potentially plays an important role in many fields.

Germanium ``hexa'' detector: production and testing

NASA Astrophysics Data System (ADS)

Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Hirsemann, H.; Struth, B.; Fritzsch, T.; Rothermund, M.; Zuvic, M.; Lampert, M. O.; Askar, M.; Graafsma, H.

2017-01-01

Here we present new result on the testing of a Germanium sensor for X-ray radiation. The system is made of 3 × 2 Medipix3RX chips, bump-bonded to a monolithic sensor, and is called ``hexa''. Its dimensions are 45 × 30 mm2 and the sensor thickness was 1.5 mm. The total number of the pixels is 393216 in the matrix 768 × 512 with pixel pitch 55 μ m. Medipix3RX read-out chip provides photon counting read-out with single photon sensitivity. The sensor is cooled to -126°C and noise levels together with flat field response are measured. For -200 V polarization bias, leakage current was 4.4 mA (3.2 μ A/mm2). Due to higher leakage around 2.5% of all pixels stay non-responsive. More than 99% of all pixels are bump bonded correctly. In this paper we present the experimental set-up, threshold equalization procedure, image acquisition and the technique for bump bond quality estimate.

A Low-Noise NbTiN Hot Electron Bolometer Mixer

NASA Technical Reports Server (NTRS)

Tong, C. Edward; Stern, Jeffrey; Megerian, Krikor; LeDuc, Henry; Sridharan, T. K.; Gibson, Hugh; Blundell, Raymond

2001-01-01

Hot electron bolometer (HEB) mixer elements, based on niobium titanium nitride (NbTiN) thin film technology, have been fabricated on crystalline quartz substrates over a 20 nm thick AlN buffer layer. The film was patterned by optical lithography, yielding bolometer elements that measure about 1 micrometer long and between 2 and 12 micrometers wide. These mixer chips were mounted in a fixed-tuned waveguide mixer block, and tested in the 600 and 800 GHz frequency range. The 3-dB output bandwidth of these mixers was determined to be about 2.5 GHz and we measured a receiver noise temperature of 270 K at 630 GHz using an intermediate frequency of 1.5 GHz. The receiver has excellent amplitude stability and the noise temperature measurements are highly repeatable. An 800 GHz receiver incorporating one of these mixer chips has recently been installed at the Sub-Millimeter Telescope in Arizona for field test and for astronomical observations.

Extreme temperature robust optical sensor designs and fault-tolerant signal processing

DOEpatents

Riza, Nabeel Agha [Oviedo, FL; Perez, Frank [Tujunga, CA

2012-01-17

Silicon Carbide (SiC) probe designs for extreme temperature and pressure sensing uses a single crystal SiC optical chip encased in a sintered SiC material probe. The SiC chip may be protected for high temperature only use or exposed for both temperature and pressure sensing. Hybrid signal processing techniques allow fault-tolerant extreme temperature sensing. Wavelength peak-to-peak (or null-to-null) collective spectrum spread measurement to detect wavelength peak/null shift measurement forms a coarse-fine temperature measurement using broadband spectrum monitoring. The SiC probe frontend acts as a stable emissivity Black-body radiator and monitoring the shift in radiation spectrum enables a pyrometer. This application combines all-SiC pyrometry with thick SiC etalon laser interferometry within a free-spectral range to form a coarse-fine temperature measurement sensor. RF notch filtering techniques improve the sensitivity of the temperature measurement where fine spectral shift or spectrum measurements are needed to deduce temperature.

Numerical analysis of light extraction enhancement of GaN-based thin-film flip-chip light-emitting diodes with high-refractive-index buckling nanostructures

NASA Astrophysics Data System (ADS)

Yue, Qing-Yang; Yang, Yang; Cheng, Zhen-Jia; Guo, Cheng-Shan

2018-06-01

In this work, the light extraction efficiency enhancement of GaN-based thin-film flip-chip (TFFC) light-emitting diodes (LEDs) with high-refractive-index (TiO2) buckling nanostructures was studied using the three-dimensional finite difference time domain method. Compared with 2-D photonic crystals, the buckling structures have the advantages of a random directionality and a broad distribution in periodicity, which can effectively extract the guided light propagating in all azimuthal directions over a wide spectrum. Numerical studies revealed that the light extraction efficiency of buckling-structured LEDs reaches 1.1 times that of triangular lattice photonic crystals. The effects of the buckling structure feature sizes and the thickness of the N-GaN layer on the light extraction efficiency for TFFC LEDs were also investigated systematically. With optimized structural parameters, a significant light extraction enhancement of about 2.6 times was achieved for TiO2 buckling-structured TFFC LEDs compared with planar LEDs.

Ultracompact bottom-up photonic crystal lasers on silicon-on-insulator.

PubMed

Lee, Wook-Jae; Kim, Hyunseok; You, Jong-Bum; Huffaker, Diana L

2017-08-25

Compact on-chip light sources lie at the heart of practical nanophotonic devices since chip-scale photonic circuits have been regarded as the next generation computing tools. In this work, we demonstrate room-temperature lasing in 7 × 7 InGaAs/InGaP core-shell nanopillar array photonic crystals with an ultracompact footprint of 2300 × 2300 nm 2 , which are monolithically grown on silicon-on-insulator substrates. A strong lateral confinement is achieved by a photonic band-edge mode, which is leading to a strong light-matter interaction in the 7 × 7 nanopillar array, and by choosing an appropriate thickness of a silicon-on-insulator layer the band-edge mode can be trapped vertically in the nanopillars. The nanopillar array band-edge lasers exhibit single-mode operation, where the mode frequency is sensitive to the diameter of the nanopillars. Our demonstration represents an important first step towards developing practical and monolithic III-V photonic components on a silicon platform.

Petroleum exploration contribution to the structural history of Golfe du Lin

DOE Office of Scientific and Technical Information (OSTI.GOV)

Curnelle, R.

1988-08-01

Petroleum exploration has strongly contributed to the knowledge of the post-Hercynian structural history of the Golfe du Lion. It shows three stages: (1) Pyrenean orogenesis which started in the Late Cretaceous and culminated during the Eocene (40-75 Ma), (2) Oligocene rifting associated with the oceanic accretion of the Provencal basin, and (3) post-Messinian deformations due to salt tectonics. Pyrenean deformation of the area seems to have been controlled by its Hercynian inheritance: the major transcurrent faults of the Cevenole belt, Nimes, and the Durance. They favored displacement of the deformation in a northeasterly direction along the fault corridors, inside whichmore » the overthrust units were put into place. These east-west-oriented structures show northward vergence. The Pyrenean axial zone in this downthrown part of the belt consist of progressively more northerly units offset by transverse faults. The Oligocene rifting is represented by a series of horsts and deeply subsiding grabens linked to preexisting major faults. The horst are deeply eroded and the Mesozoic carbonates are karstified. The extension of the Messinian evaporitic deposits known throughout the Mediterranean basin is located north of the shallower deep-water well. The gravitational deformation of the salt is expressed by a large number of listric faults which originate in the salt bodies. The sedimentary sequence ends with a thick discordant, erosional, undeformed Pliocene-Quaternary series.« less

Shear enhanced compaction-solution bands in quartz-rich calcarenites of the Cotiella Massif (Spanish Pyrennes)

NASA Astrophysics Data System (ADS)

Tavani, Stefano; Granado, Pablo; Cantanero, Irene; Balsamo, Fabrizio; Corradetti, Amerigo; Muñoz, Josep

2017-04-01

In this contribution we describe deformation bands developed due to the interplay between shearing and mechanical and chemical compaction in Paleocene quartz-rich calcarenites. The studied structures are located in the footwall of the Cotiella Thrust (Spanish Pyrennes) and form anastomosed, mm-thick tabular bands, composed of high concentration of quartz grains. The bands strike perpendicular to the local transport direction of the regional thrust sheet, thus indicating a tectonic origin, and are organized in three sets. One set is perpendicular to the shallow-dipping bedding surface, while the other two are roughly perpendicular to each other and form an angle of 45°, in opposite directions, with the bedding. No macroscopic evidence of shearing is found along these bands. Optical microscope and SEM investigations on both undeformed and deformed rocks indicate that the high concentration of quartz within the deformation bands was caused by the localized pressure-enhanced dissolution of calcite grains, which determined the enrichment of the less soluble quartz grains. Quartz grains fracturing, fragmentation and crushing was observed along in all deformation bands, whereas cataclasis and shear occurs only along oblique oblique-to-bedding sets. All these features indicate that studied deformation bands are hybrid structures most likely developed during layer-parallel shortening. In detail, bedding perpendicular and bedding oblique structures can be interpreted as pure compaction and shear-enhanced compaction bands, respectively.

Subaqueous Sediment Remobilization and Development of Syndepositional Deformational Structures on Mars: A Kinematic Approach from the Noachian Terby Crater

NASA Astrophysics Data System (ADS)

Sarkar, R.; Das, P.; Basu Sarbadhikari, A.

2017-12-01

A 2 km thick layered sequence within the Noachian Terby crater ( 174 km diameter, 28.0°S - 74.0°E), located at the Northern rim of Hellas basin, has been re-classified here into three major categories, i.e. mega-slump, debris flows, and turbidites based on sedimentation process. A wide spectrum of deformation structures, such as large scale isoclinal moderately inclined fold, pinch and swells, disharmonic folds, sediment loading structure, normal faults and thrust duplexes, suggest that amplitude of the syndepositional deformation spanned from hydroplastic to brittle domains. These structures provide ample evidences of sediment remobilization in Terby. The dominance of such mass-flow deposits in different stratigraphic horizons indicates that the basin was reactivated in frequent intervals during the filling process. However, an undeformed thinning-up sequence of beds, well exhibited at the basinal-lows, identified as ponded/confined turbidites, indicates that the basin experienced a stable bathymetric condition at the up-dip areas of the mega-slumps. An overall enrichment of phyllosilicates and scarcity of large boulders at the basin margins indicates that the provenance materials were deposited under stable and low-energy condition before being transported and re-deposited within the crater during the Terby impact. We presume that the inter-crater layered terrain of Hellas acted as a provenance of Terby's mass-transport deposits.

Quantifying bone thickness, light transmission, and contrast interrelationships in transcranial photoacoustic imaging

NASA Astrophysics Data System (ADS)

Lediju Bell, Muyinatu A.; Ostrowski, Anastasia K.; Li, Ke; Kaanzides, Peter; Boctor, Emad

2015-03-01

We previously introduced photoacoustic imaging to detect blood vessels surrounded by bone and thereby eliminate the deadly risk of carotid artery injury during endonasal, transsphenoidal surgeries. Light would be transmitted through an optical fiber attached to the surgical drill, while a transcranial probe placed on the temporal region of the skull receives photoacoustic signals. This work quantifies changes in photoacoustic image contrast as the sphenoid bone is drilled. Frontal bone from a human adult cadaver skull was cut into seven 3 cm x 3 cm chips and sanded to thicknesses ranging 1-4 mm. For 700-940 nm wavelengths, the average optical transmission through these specimens increased from 19% to 44% as bone thickness decreased, with measurements agreeing with Monte Carlo simulations within 5%. These skull specimens were individually placed in the optical pathway of a 3.5 mm diameter, cylindrical, vessel-mimicking photoacoustic target, as the laser wavelength was varied between 700-940 nm. The mean optical insertion loss and photoacoustic image contrast loss due to the bone specimens were 56-80% and 46-79%, respectively, with the majority of change observed when the bone was <=2 mm thick. The decrease in contrast is directly proportional to insertion loss over this thickness range by factors of 0.8-1.1 when multiple wavelengths are considered. Results suggest that this proportional relationship may be used to determine the amount of bone that remains to be drilled when the thickness is 2 mm or less.

Influence of zirconia framework thickness on residual stress profile in veneering ceramic: measurement by hole-drilling.

PubMed

Mainjot, Amélie K; Schajer, Gary S; Vanheusden, Alain J; Sadoun, Michaël J

2012-04-01

Framework design is reported to influence chipping in zirconia-based restorations, which is an important cause of failure of such restorations. Residual stress profile in the veneering ceramic after the manufacturing process is an important predictive factor of the mechanical behavior of the material. The objective of this study is to investigate the influence of framework thickness on the stress profile measured in zirconia-based structures. The stress profile was measured with the hole-drilling method in bilayered disc samples of 20mm diameter with a 1.5 mm thick veneering ceramic layer. Six different framework thicknesses from 0.5 mm to 3 mm were studied. Two different cooling procedures were also investigated. Compressive stresses were observed in the surface, and tensile stresses in the depth of most of the samples. The slow cooling procedure was found to promote the development of interior tensile stresses, except for the sample with a 3mm thick framework. With the tempering procedure, samples with a 1.5 mm thick framework exhibited the most favorable stress profile, while thicker and thinner frameworks exhibited respectively in surface or interior tensile stresses. The measurements performed highlight the importance of framework thickness, which determine the nature of stresses and can explain clinical failures encountered, especially with thin frameworks. The adequate ratio between veneering ceramic and zirconia is hard to define, restricting the range of indications of zirconia-based restorations until a better understanding of such a delicate veneering process is achieved. Copyright © 2011 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

Partially degradable friction-welded pure iron-stainless steel 316L bone pin.

PubMed

Nasution, A K; Murni, N S; Sing, N B; Idris, M H; Hermawan, H

2015-01-01

This article describes the development of a partially degradable metal bone pin, proposed to minimize the occurrence of bone refracture by avoiding the creation of holes in the bone after pin removal procedure. The pin was made by friction welding and composed of two parts: the degradable part that remains in the bone and the nondegradable part that will be removed as usual. Rods of stainless steel 316L (nondegradable) and pure iron (degradable) were friction welded at the optimum parameters: forging pressure = 33.2 kPa, friction time = 25 s, burn-off length = 15 mm, and heat input = 4.58 J/s. The optimum tensile strength and elongation was registered at 666 MPa and 13%, respectively. A spiral defect formation was identified as the cause for the ductile fracture of the weld joint. A 40-µm wide intermetallic zone was identified along the fusion line having a distinct composition of Cr, Ni, and Mo. The corrosion rate of the pin gradually decreased from the undeformed zone of pure iron to the undeformed zone of stainless steel 316L. All metallurgical zones of the pin showed no toxic effect toward normal human osteoblast cells, confirming the ppb level of released Cr and Ni detected in the cell media were tolerable. © 2014 Wiley Periodicals, Inc.

Autologous Cartilage Chip Transplantation Improves Repair Tissue Composition Compared With Marrow Stimulation.

PubMed

Christensen, Bjørn Borsøe; Olesen, Morten Lykke; Lind, Martin; Foldager, Casper Bindzus

2017-06-01

Repair of chondral injuries by use of cartilage chips has recently demonstrated clinical feasibility. To investigate in vivo cartilage repair outcome of autologous cartilage chips compared with marrow stimulation in full-thickness cartilage defects in a minipig model. Controlled laboratory study. Six Göttingen minipigs received two 6-mm chondral defects in the medial and lateral trochlea of each knee. The two treatment groups were (1) autologous cartilage chips embedded in fibrin glue (ACC) (n = 12) and (2) marrow stimulation (MST) (n = 12). The animals were euthanized after 6 months, and the composition of repair tissue was quantitatively determined using histomorphometry. Semiquantitative evaluation was performed by means of the International Cartilage Repair Society (ICRS) II score. Collagen type II staining was used to further evaluate the repair tissue composition. Significantly more hyaline cartilage was found in the ACC (17.1%) compared with MST (2.9%) group ( P < .01). Furthermore, the ACC group had significantly less fibrous tissue (23.8%) compared with the MST group (41.1%) ( P < .01). No significant difference in fibrocartilage content was found (54.7% for ACC vs 50.8% for MST). The ACC group had significantly higher ICRS II scores for tissue morphological characteristics, matrix staining, cell morphological characteristics, surface assessment, mid/deep assessment, and overall assessment ( P < .05). The ACC-treated defects had significantly more collagen type II staining (54.5%) compared with the MST-treated defects (28.1%) ( P < .05). ACC transplant resulted in improved quality of cartilage repair tissue compared with MST at 6 months postoperatively. Further studies are needed to investigate ACC as a possible alternative first-line treatment for focal cartilage injuries in the knee.

Internalization of subcellular-scale microfabricated chips by healthy and cancer cells

PubMed Central

Wong, H.-S. Philip

2018-01-01

Continuous monitoring of physiological parameters inside a living cell will lead to major advances in our understanding of biology and complex diseases, such as cancer. It also enables the development of new medical diagnostics and therapeutics. Progress in nanofabrication and wireless communication has opened up the potential of making a wireless chip small enough that it can be wholly inserted into a living cell. To investigate how such chips could be internalized into various types of living single cells and how this process might affect cells’ physiology, we designed and fabricated a series of multilayered micron-scale tag structures with different sizes as potential RFID (Radio Frequency IDentification) cell trackers. While the present structures are test structures that do not resonate, the tags that do resonate have similar structure from device fabrication, material properties, and device size point of view. The structures are in four different sizes, the largest with the lateral dimension of 9 μm × 21 μm. The thickness for these structures is kept constant at 1.5 μm. We demonstrate successful delivery of our fabricated chips into various types of living cells, such as melanoma skin cancer, breast cancer, colon cancer and healthy/normal fibroblast skin cells. To our surprise, we observed a remarkable internalization rate difference between each cell type; the uptake rate was faster for more aggressive cancer cells than the normal/healthy cells. Cell viability before and after tag cellular internalization and persistence of the internalized tags have also been recorded over the course of five days of incubation. These results establish the foundations of the possibility of long term, wireless, intracellular physiological signal monitoring. PMID:29601607

Holographic Patterning of High Performance on-chip 3D Lithium-ion Microbatteries

DOE PAGES

Ning, Hailong; Pikul, James H.; Wang, Runyu; ...

2015-05-11

As sensors, wireless communication devices, personal health monitoring systems, and autonomous microelectromechanical systems (MEMS) become distributed and smaller, there is an increasing demand for miniaturized integrated power sources. Although thin-film batteries are well-suited for on-chip integration, their energy and power per unit area are limited. Three-dimensional electrode designs have potential to offer much greater power and energy per unit area; however, efforts to date to realize 3D microbatteries have led to prototypes with solid electrodes (and therefore low power) or mesostructured electrodes not compatible with manufacturing or on-chip integration. Here in this paper, we demonstrate an on-chip compatible method tomore » fabricate high energy density (6.5 μWh cm -2∙μm -1) 3D mesostructured Li-ion microbatteries based on LiMnO 2 cathodes, and NiSn anodes that possess supercapacitor-like power (3,600 μW cm(-2)∙μm(-1) peak). The mesostructured electrodes are fabricated by combining 3D holographic lithography with conventional photolithography, enabling deterministic control of both the internal electrode mesostructure and the spatial distribution of the electrodes on the substrate. The resultant full cells exhibit impressive performances, for example a conventional light-emitting diode (LED) is driven with a 500-μA peak current (600-C discharge) from a 10-μm-thick microbattery with an area of 4 mm 2 for 200 cycles with only 12% capacity fade. Lastly, a combined experimental and modeling study where the structural parameters of the battery are modulated illustrates the unique design flexibility enabled by 3D holographic lithography and provides guidance for optimization for a given application.« less

Fundamental investigation on influence of external heat on chip formation during thermal assisted machining

NASA Astrophysics Data System (ADS)

Alkali, A. U.; Ginta, T. L.; Abdulrani, A. M.; Elsiti, N. M.

2018-04-01

Various heat sources have been investigated by numerous researchers to reveal machinability benefits of thermally assisted machining (TAM) process. Fewer engineering materials have been tested. In the same vein, those researches continue to demonstrate effective performance of TAM in terms of bulk material removal rate, improved surface finish, prolong tool life and reduction of cutting forces among others. Experimental investigation on the strain-hardenability and flow stress of material removed with respect to increase in temperature in TAM has not been given attention in previous studies. This study investigated the pattern of chip morphology and segmentation giving close attention to influence of external heat source responsible for strain – hardenability of the material removed during TAM and dry machining at room temperature. Full immersion down cut milling was used throughout the machining conditions. Machining was conducted on AISI 316L using uncoated tungsten carbide end mill insert at varying cutting speeds (V) of 50, 79, and 100 m/min, and feed rates (f) of 0.15, 0.25, and 0.4 mm/tooth while the depth of cut was maintained at 0.2mm throughout the machining trials. The analyses of chip formation, segmentations and stain hardenability were carried out by using LMU light microscope, field emission microscopy and micro indentation. The study observed that build up edge is formed when a stagnation zone develops in front of tool tip which give rise to poor thermal gradient for conduction heat to be transferred within the bulk material during dry machining. This promotes varying strain – hardening of the material removed with evident high chips hardness and thickness, whereas TAM circumvents such impairment by softening the shear zone through local preheat.

Holographic patterning of high-performance on-chip 3D lithium-ion microbatteries

PubMed Central

Ning, Hailong; Pikul, James H.; Zhang, Runyu; Li, Xuejiao; Xu, Sheng; Wang, Junjie; Rogers, John A.; King, William P.; Braun, Paul V.

2015-01-01

As sensors, wireless communication devices, personal health monitoring systems, and autonomous microelectromechanical systems (MEMS) become distributed and smaller, there is an increasing demand for miniaturized integrated power sources. Although thin-film batteries are well-suited for on-chip integration, their energy and power per unit area are limited. Three-dimensional electrode designs have potential to offer much greater power and energy per unit area; however, efforts to date to realize 3D microbatteries have led to prototypes with solid electrodes (and therefore low power) or mesostructured electrodes not compatible with manufacturing or on-chip integration. Here, we demonstrate an on-chip compatible method to fabricate high energy density (6.5 μWh cm−2⋅μm−1) 3D mesostructured Li-ion microbatteries based on LiMnO2 cathodes, and NiSn anodes that possess supercapacitor-like power (3,600 μW cm−2⋅μm−1 peak). The mesostructured electrodes are fabricated by combining 3D holographic lithography with conventional photolithography, enabling deterministic control of both the internal electrode mesostructure and the spatial distribution of the electrodes on the substrate. The resultant full cells exhibit impressive performances, for example a conventional light-emitting diode (LED) is driven with a 500-μA peak current (600-C discharge) from a 10-μm-thick microbattery with an area of 4 mm2 for 200 cycles with only 12% capacity fade. A combined experimental and modeling study where the structural parameters of the battery are modulated illustrates the unique design flexibility enabled by 3D holographic lithography and provides guidance for optimization for a given application. PMID:25964360

Thick Bi{sub 2}Sr{sub 2}CaCu{sub 2}O{sub 8+{delta}} Films Grown by Liquid-Phase Epitaxy for Josephson THz Applications.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Simsek, Y.; Vlasko-Vlasov, V.; Koshelev, A. E.

Theoretical and experimental studies of intrinsic Josephson junctions that naturally occur in high-Tc superconducting Bi2Sr2CaCu2O8+δ (Bi-2212) have demonstrated their potential for novel types of compact devices for the generation and sensing of electromagnetic radiation in the THz range. Here, we show that the THz-on-a-chip concept may be realized in liquid phase epitaxial-grown (LPE) thick Bi-2212 films. We have grown μm-thick Bi-2212 LPE films on MgO substrates. These films display excellent c-axis alignment and single crystal grains of about 650 × 150 μm2 in size. A branched current-voltage characteristic was clearly observed in c-axis transport, which is a clear signature ofmore » underdamped intrinsic Josephson junctions, and a prerequisite for THz-generation. We discuss LPE growth conditions allowing improvement of the structural quality and superconducting properties of Bi-2212 films for THz applications.« less

High resolution on-chip optical filter array based on double subwavelength grating reflectors

DOE PAGES

Horie, Yu; Arbabi, Amir; Han, Seunghoon; ...

2015-11-05

An optical filter array consisting of vertical narrow-band Fabry-Pèrot (FP) resonators formed by two highly reflective high contrast subwavelength grating mirrors is reported. The filters are designed to cover a wide range of operation wavelengths ( Δλ/λ=5%) just by changing the in-plane grating parameters while the device thickness is maintained constant. In conclusion, operation in the telecom band with transmission efficiencies greater than 40% and quality factors greater than 1,000 are measured experimentally for filters fabricated on the same substrate.

Explosively Joining Dissimilar Metal Tubes.

DTIC Science & Technology

1979-11-01

specimens were tested in axial tension-tension fatigue in a Satec high cycle fatigue test machine at 30 Hz. The applied max stress for each test was...BACK CHIP A3 ROTARY FILE ,S AR .STO P9 WIRE BRUSH y es IDENTIFY {STEEL STAMP) N INSPECT ICA) YES GRIND WEtD [LEID k R IJ CA/S. BASE METAL PPEPARATION...Type: Dog bone Test Equipment: Satec SF-1U-1099 Specimen Max. Static Dynamic F a i1 u r e Width Thickness i(No.) Stress Stress Stress(KS0 (KSI) (KSI

High resolution on-chip optical filter array based on double subwavelength grating reflectors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Horie, Yu; Arbabi, Amir; Han, Seunghoon

An optical filter array consisting of vertical narrow-band Fabry-Pèrot (FP) resonators formed by two highly reflective high contrast subwavelength grating mirrors is reported. The filters are designed to cover a wide range of operation wavelengths ( Δλ/λ=5%) just by changing the in-plane grating parameters while the device thickness is maintained constant. In conclusion, operation in the telecom band with transmission efficiencies greater than 40% and quality factors greater than 1,000 are measured experimentally for filters fabricated on the same substrate.

A Spontaneous 3D Bone-On-a-Chip for Bone Metastasis Study of Breast Cancer Cells.

PubMed

Hao, Sijie; Ha, Laura; Cheng, Gong; Wan, Yuan; Xia, Yiqiu; Sosnoski, Donna M; Mastro, Andrea M; Zheng, Si-Yang

2018-03-01

Bone metastasis occurs at ≈70% frequency in metastatic breast cancer. The mechanisms used by tumors to hijack the skeleton, promote bone metastases, and confer therapeutic resistance are poorly understood. This has led to the development of various bone models to investigate the interactions between cancer cells and host bone marrow cells and related physiological changes. However, it is challenging to perform bone studies due to the difficulty in periodic sampling. Herein, a bone-on-a-chip (BC) is reported for spontaneous growth of a 3D, mineralized, collagenous bone tissue. Mature osteoblastic tissue of up to 85 µm thickness containing heavily mineralized collagen fibers naturally formed in 720 h without the aid of differentiation agents. Moreover, co-culture of metastatic breast cancer cells is examined with osteoblastic tissues. The new bone-on-a-chip design not only increases experimental throughput by miniaturization, but also maximizes the chances of cancer cell interaction with bone matrix of a concentrated surface area and facilitates easy, frequent observation. As a result, unique hallmarks of breast cancer bone colonization, previously confirmed only in vivo, are observed. The spontaneous 3D BC keeps the promise as a physiologically relevant model for the in vitro study of breast cancer bone metastasis. © 2018 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Effect of Silver Flakes in Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs Chip/Silver Paste/Bare Cu)

NASA Astrophysics Data System (ADS)

Zhao, Su-Yan; Li, Xin; Mei, Yun-Hui; Lu, Guo-Quan

2016-11-01

In this study, a silver paste has been introduced for attaching chips onto bare Cu substrates (without coating) without applying pressure. Small nano-thickness Ag flakes, measuring 1 μm-5 μm length, were embedded uniformly in Ag nanoparticles for improving the density of the material. The presence of silver flakes in the silver paste affected the joining process and its microstructure. Microstructure characterization revealed that densification of the silver layer was affected by the presence of silver flakes as the flakes coarsened and formed reactive in situ nanoparticles, which facilitated the sintering between the flakes and the incorporated nanoparticles. Coarsening of silver flakes depended on the sintering temperature, time, and the atmosphere, which affected the decomposition and burning out of organics presented on the surface of the flakes. A high-density silver layer was obtained due to the presence of compact silver flakes. With an increase in the microstructure density, a higher bonding strength and a lower thermal impedance of the sintered joints were achieved. On performing pressureless sintering at 270°C for 30 min under 99.99% N2 or 4% H2/N2, the bonding strength and thermal impedance for 11 × 11 mm2 chips were excellent, measuring approximately 21.9 MPa and 0.077°C/W, respectively.

40Ar* loss in experimentally deformed muscovite and biotite with implications for 40Ar/39Ar geochronology of naturally deformed rocks

USGS Publications Warehouse

Cosca, M.; Stunitz, H.; Bourgeix, A.-L.; Lee, J.P.

2011-01-01

The effects of deformation on radiogenic argon (40Ar*) retentivity in mica are described from high pressure experiments performed on rock samples of peraluminous granite containing euhedral muscovite and biotite. Cylindrical cores, ???15mm in length and 6.25mm in diameter, were drilled from granite collected from the South Armorican Massif in northwestern France, loaded into gold capsules, and weld-sealed in the presence of excess water. The samples were deformed at a pressure of 10kb and a temperature of 600??C over a period 29 of hours within a solid medium assembly in a Griggs-type triaxial hydraulic deformation apparatus. Overall shortening in the experiments was approximately 10%. Transmitted light and secondary and backscattered electron imaging of the deformed granite samples reveals evidence of induced defects and for significant physical grain size reduction by kinking, cracking, and grain segmentation of the micas.Infrared (IR) laser (CO2) heating of individual 1.5-2.5mm diameter grains of muscovite and biotite separated from the undeformed granite yield well-defined 40Ar/39Ar plateau ages of 311??2Ma (2??). Identical experiments on single grains separated from the experimentally deformed granite yield results indicating 40Ar* loss of 0-35% in muscovite and 2-3% 40Ar* loss in biotite. Intragrain in situ ultraviolet (UV) laser ablation 40Ar/39Ar ages (??4-10%, 1??) of deformed muscovites range from 309??13 to 264??7Ma, consistent with 0-16% 40Ar* loss relative to the undeformed muscovite. The in situ UV laser ablation 40Ar/39Ar ages of deformed biotite vary from 301 to 217Ma, consistent with up to 32% 40Ar* loss. No spatial correlation is observed between in situ 40Ar/39Ar age and position within individual grains. Using available argon diffusion data for muscovite the observed 40Ar* loss in the experimentally treated muscovite can be utilized to predict average 40Ar* diffusion dimensions. Maximum 40Ar/39Ar ages obtained by UV laser ablation overlap those of the undeformed muscovite, indicating argon loss of <1% and an average effective grain radius for 40Ar* diffusion ???700??m. The UV laser ablation and IR laser incremental 40Ar/39Ar ages indicating 40Ar* loss of 16% and 35%, respectively, are consistent with an average diffusion radius ???100??m. These results support a hypothesis of grain-scale 40Ar* diffusion distances in undeformed mica and a heterogeneous mechanical reduction in the intragrain effective diffusion length scale for 40Ar* in deformed mica. Reduction in the effective diffusion length scale in naturally deformed samples occurs most probably through production of mesoscopic and submicroscopic defects such as, e.g., stacking faults. A network of interconnected defects, continuously forming and annealing during dynamic deformation likely plays an important role in controlling both 40Ar* retention and intragrain distribution in deformed mica. Intragrain 40Ar/39Ar ages, when combined with estimates of diffusion kinetics and distances, may provide a means of establishing thermochronological histories from individual micas. ?? 2011.

Stratigraphy and lithofacies of Lisburne Group carbonate rocks (Carboniferous - Permian) in the National Petroleum Reserve - Alaska

USGS Publications Warehouse

Dumoulin, Julie A.; Bird, Kenneth J.; Houseknecht, David W.

2001-01-01

Carbonate rocks of the Lisburne Group (Carboniferous-Permian) occur widely throughout northern Alaska. In the NPRA, seismic mapping and well penetrations show that the Lisburne occurs throughout the subsurface except in northernmost NPRA where it is missing by depositional onlap. Lisburne strata encountered in 11 exploratory wells in the northern part of the NPRA are essentially undeformed, consist of limestone and lesser dolostone, sandstone, siltstone, and shale, encompass a wide array of chiefly shallow-water facies, and range in age from Early Mississippian to Permian. Basins and platforms that formed during Mississippian (and possibly Devonian) time greatly affected depositional patterns of the Lisburne. Total thickness of the Lisburne in northern NPRA wells varies from almost 4000 ft in the Ikpikpuk-Umiat Basin to 300 ft on the north edge of the Fish Creek Platform. Lisburne strata of Mississippian age are found in northeastern NPRA, comprise three subunits (lower limestone, middle dolostone, and upper limestone) and are oldest (Osagean) in the Ikpikpuk-Umiat Basin. All wells that penetrated the Lisburne in northern NPRA encountered rocks of Pennsylvanian age; these intervals are mainly limestone and characterized by decameter-scale shallowing-upward sequences. Lisburne sections of prob-able Early-middle Permian age range from thin (≤60 ft) intervals of dolostone and limestone in the Fish Creek Platform area to thick (500-1000 ft) successions of interbedded limestone and siliciclastic sediment in the Ikpikpuk-Umiat Basin and northwestern NPRA. Abundant non-carbonate detritus, primarily quartz and chert with locally notable plagioclase feldspar and metamorphic lithic clasts, occurs throughout the Lisburne Group in northern NPRA. Per-mian strata and a persistent non-carbonate detrital component are also seen in the Lisburne in subsurface beneath the Chukchi Sea (Hanna Trough) to the northwest, but are not found in Lisburne successions elsewhere in Alaska.

On the age of sinistral shearing along the southern border of the Tauern Window (Eastern Alps).

NASA Astrophysics Data System (ADS)

Kitzig, C.; Schneider, S.; Hammerschmidt, K.

2009-04-01

The first-order structure of the western Tauern Window consists of three upright, ENE-striking antiforms of large amplitude, whose flanks are overprinted by sinistral shear zones, striking parallel to the axial planes of the antiforms. Analogue modelling suggests that these shear zones accommodate part of the shortening of the South Alpine indenter (Rosenberg et al., 2004). The age of sinistral shearing in the western Tauern Window and immediately south of it is still controversial. Mancktelow et al. (2001) suggested that sinistral shearing at the southern border of the Tauern Window terminated at 30 Ma. Based on monazite spot dates ranging between 29.0-20.3 Ma (n=10) of dextral shear zones, which cross-cut the sinistral Greiner shear zone, Barnes et al. (2004) argued that the switch from sinistral to dextral shear occurred shortly after the thermal peak of the Alpine orogeny (c.~ 30 Ma). Recent dating of mica-bearing marble suggested that the activity of the southernmost sinistral shear zone of the Tauern Window (the Ahrntal shear zone) was 19.8±0.4 Ma ago (Glodny et al. 2008). Sinistral shearing is commonly interpreted as part of the 2nd Alpine phase of deformation that affected the Tauern Window. The main foliation (S1) of the Tauern Window was acquired during a first phase, which resulted in the present day nappe stack. Only along some of the later shear zones a second Alpine foliation (S2) was formed. At present no attempt has been made, to distinguish the two and directly date the S2 mylonitic foliation. In the present work we use the Rb/Sr method to date mineral pairs formed under greenschist to lower amphibolite facies conditions from the tonalitic Zentral Gneiss. We dated four samples, two from the inferred undeformed tonalite protolith, one from the strongly foliated tonalitic gneiss and one from an outcrop-scale sinistral shear zone within the foliated tonalitic gneiss. Generally biotite and feldspar define isochrones for the four samples. The undeformed tonalites yield an age of 26.4±0.1 Ma and of 11.1±0.1 Ma, the strongly foliated tonalitic gneiss yields an age of 19.8±0.1 Ma, which is close to the age of the outcrop-scale shear zone of 18.0±0.1 Ma. It is difficult to interpret the 11 Ma age of one undeformed sample, because it is significantly younger than the ages obtained from zircon fission tracks from neighbouring areas. The older age of 26 Ma for the undeformed tonalite sample is interpreted as cooling age below the closure temperature of biotite, based on the following arguments: 1) This age is consistent with the inferred regional thermochronological distribution of cooling (Luth and Willingshofer, 2008); 2) The rock fabric is undeformed; 3) The age is older than the two deformed samples collected within a distance of a few hundreds of meters. The mineral assemblage of the deformed samples (green biotite and albite crystallisation) differs from the one of the undeformed rocks (red-brown biotite and K-feldspar clasts). Therefore, the albite-biotite isochrons of the deformed samples are inferred to date the deformation event. This age of deformation is consistent with the age determination of Glodny et al. (2008) from deformed marbles of the Schieferhülle, and with previous dating of sinistral shearing along the northern border of the western Tauern Window (Schneider et al., 2007), which yielded an average (n=5) age of 21.9±1.6 Ma. Therefore, sinistral deformation appears to have affected contemporaneously both the northern and the southern margins of the Zentral Gneiss in the western Tauern Window. References: Barnes, J. D., Selverstone, J. & Sharp, Z.D., 2004. Interactions between serpentinite devolatilization, metasomatism and strike-slip strain localization during deep-crustal shearing in the Eastern Alps. Journal of Metamorphic Geology, 22, 283-300. Glodny, J., Ring, U. Kühn. A., 2008. Coeval high-pressure metamorphism, thrusting, strike slip, and extensional shearing in the Tauern Window, Eastern Alps, Tectonics, 27, TC4004, DOI:10.1029/2007TC002193. Luth, S.W., & Willingshofer, E. 2008. Mapping of the Post-Collisional Cooling History of the Eastern Alps, Birkhäuser Verlag, Basel DOI:10.1007/s00015-008-1294-9 Mancktelow, N.S., Stöckli, D., Grollimund, B., Müller, W., Fügenschuh, B., Viola, G., Seward, D. & Villa, I., 2001. The DAV and Periadriatic fault systems in the eastern Alps south of the Tauern Window. International Journal of Earth Sciences, 90, 593-622. Rosenberg, C.L., Brun, J.-P., Cagnard, F., and Gapais, D., 2007. Oblique indentation in the Eastern Alps: Insights from laboratory experiments, Tectonics, 26, TC2003, doi:10.1029/2006TC001960. Schneider, S., Hammerschmidt, K., and Rosenberg, C.L., 2007. In-situ Rb-Sr dating of the SEMP mylonites, western Tauern Window, Eastern Alps Geophysical Research Abstracts, Vol. 9, 09136. SRef-ID: 1607-7962/gra/EGU2007-A-09136

Silver flip chip interconnect technology and solid state bonding

NASA Astrophysics Data System (ADS)

Sha, Chu-Hsuan

In this dissertation, fluxless transient liquid phase (TLP) bonding and solid state bonding between thermal expansion mismatch materials have been developed using Ag-In binary systems, pure Au, Ag, and Cu-Ag composite. In contrast to the conventional soldering process, fluxless bonding technique eliminates any corrosion and contamination problems caused by flux. Without flux, it is possible to fabricate high quality joints in large bonding areas where the flux is difficult to clean entirely. High quality joints are crucial to bonding thermal expansion mismatch materials since shear stress develops in the bonded pair. Stress concentration at voids in joints could increases breakage probability. In addition, intermetallic compound (IMC) formation between solder and underbump metallurgy (UBM) is essential for interconnect joint formation in conventional soldering process. However, the interface between IMC and solder is shown to be the weak interface that tends to break first during thermal cycling and drop tests. In our solid state bonding technique, there is no IMC involved in the bonding between Au to Au, Ag and Cu, and Ag and Au. All the reliability issues related to IMC or IMC growth is not our concern. To sum up, ductile bonding media, such as Ag or Au, and proper metallic layered structure are utilized in this research to produce high quality joints. The research starts with developing a low temperature fluxless bonding process using electroplated Ag/In/Ag multilayer structures between Si chip and 304 stainless steel (304SS) substrate. Because the outer thin Ag layer effectively protects inner In layer from oxidation, In layer dissolves Ag layer and joints to Ag layer on the to-be-bonded Si chip when temperature reaches the reflow temperature of 166ºC. Joints consist of mainly Ag-rich Ag-In solid solution and Ag2In. Using this fluxless bonding technique, two 304SS substrates can be bonded together as well. From the high magnification SEM images taken at cross-section, there is no void or gap observed. The new bonding technique presented should be valuable in packaging high power electronic devices for high temperature operations. It should also be useful to bond two 304SS parts together at low bonding temperature of 190ºC. Solid state bonding technique is then introduced to bond semiconductor chips, such as Si, to common substrates, such as Cu or alumina, using pure Ag and Au at a temperature matching the typical reflow temperature used in packaging industries, 260°C. In bonding, we realize the possibilities of solid state bonding of Au to Au, Au to Ag, and Ag to Cu. The idea comes from that Cu, Ag, and Au are located in the same column on periodic table, meaning that they have similar electronic configuration. They therefore have a better chance to share electrons. Also, the crystal lattice of Cu, Ag, and Au is the same, face-centered cubic. In the project, the detailed bonding mechanism is beyond the scope and here we determine the bonding by the experimental result. Ag is chosen as the joint material because of its superior physical properties. It has the highest electrical and thermal conductivities among all metals. It has low yield strength and is relatively ductile. Au is considered as well because its excellent ductility and fatigue resistance. Thus, the Ag or Au joints can deform to accommodate the shear strain caused by CTE mismatch between Si and Cu. Ag and Au have melting temperatures higher than 950°C, so the pure Ag or Au joints are expected to sustain in high operating temperature. The resulting joints do not contain any intermetallic compound. Thus, all reliability issues associated with intermetallic growth in commonly used solder joints do not exist anymore. We finally move to the applications of solid state Ag bonding in flip chip interconnects design. At present, nearly all large-scale integrated circuit (IC) chips are packaged with flip-chip technology. This means that the chip is flipped over and the active (front) side is connected to the package using a large number of tiny solder joints, which provide mechanical support, electrical connection, and heat conduction. For chip-to-package level interconnects, a challenge is the severe mismatch in coefficient of thermal expansion (CTE) between chips and package substrates. The interconnect material thus needs to be compliant to deal with the CTE mismatch. At present, nearly all flip-chip interconnects in electronic industries are made of lead-free Sn-based solders. Soft solders are chosen due to high ductility, low yield strength, relatively low melting temperature, and reasonably good electrical and thermal conductivities. In the never ending scaling down trend, more and more transistors are placed on the same Si chip size. This results in larger pin-out numbers and smaller solder joints. According to International Technology Roadmap for Semiconductors (ITRS), by 2018, the pitch in flip-chip interconnects will become smaller than 70mum for high performance applications. Two problems occur. The first is increase in shear strain. The aspect ratio of flip-chip joints is constrained to 0.7 because it goes through molten phase in the reflow process. Therefore, smaller joints become shorter as well, resulting in larger shear strain arising from CTE mismatch between Si chips and package substrates. The second is increase in stress in the joints. Since intermetallic (IMC) thickness in the joint does not scale down with joint size, ratio of IMC thickness to joint height increases. This further enlarges the shear stress because the IMC does not deform as the soft solder does to accommodate CTE mismatch. In this research, the smallest dimension we achieve for Ag flip chip interconnect joint is 15mum in diameter. The ten advantages of Ag flip chip interconnect technology can be identified as (a) High electrical conductivity, 7.7 times of that of Pb-free solders, (b) High thermal conductivity, 5.2 times of that of Pb-free solders, (c) Completely fluxless, (d) No IMCs; all reliability issues associated with IMC and IMC growth do not exist, (e) Ag is very ductile and can manage CTE mismatch between chips and packages, (f) Ag joints can sustain at very high operation temperature because Ag has high melting temperature of 961°C, (g) No molten phase involved; the bump can better keep its shape and geometry, (h) No molten phase involved; bridging of adjacent bumps is less likely to occur, i. Aspect ratio of bumps can be made greater than 1, (j) The size of the bumps is only limited by the lithographic process. Cu-Ag composite flip chip interconnect joints is developed based on three reasons. The first is lower material cost. The second is to strengthen the columns because the yield strength of Cu is 6 times of that of Ag. The third is to avoid possible Ag migration between Ag electrodes under voltage at temperatures above 250°C. This Cu-Ag composite design presents a solution in the path to the scale down roadmap.

Visual detection of particulates in x-ray images of processed meat products

NASA Astrophysics Data System (ADS)

Schatzki, Thomas F.; Young, Richard; Haff, Ron P.; Eye, J.; Wright, G.

1996-08-01

A study was conducted to test the efficacy of detecting particulate contaminants in processed meat samples by visual observation of line-scanned x-ray images. Six hundred field- collected processed-product samples were scanned at 230 cm2/s using 0.5 X 0.5-mm resolution and 50 kV, 13 mA excitation. The x-ray images were image corrected, digitally stored, and inspected off-line, using interactive image enhancement. Forty percent of the samples were spiked with added contaminants to establish the visual recognition of contaminants as a function of sample thickness (1 to 10 cm), texture of the x-ray image (smooth/textured), spike composition (wood/bone/glass), size (0.1 to 0.4 cm), and shape (splinter/round). The results were analyzed using a maximum likelihood logistic regression method. In packages less than 6 cm thick, 0.2-cm-thick bone chips were easily recognized, 0.1-cm glass splinters were recognized with some difficulty, while 0.4-cm-thick wood was generally missed. Operational feasibility in a time-constrained setting was confirmed. One half percent of the samples arriving from the field contained bone slivers > 1 cm long, 1/2% contained metallic material, while 4% contained particulates exceeding 0.3 cm in size. All of the latter appeared to be bone fragments.

Heteronuclear Micro-Helmholtz Coil Facilitates µm-Range Spatial and Sub-Hz Spectral Resolution NMR of nL-Volume Samples on Customisable Microfluidic Chips

PubMed Central

Spengler, Nils; Höfflin, Jens; Moazenzadeh, Ali; Mager, Dario; MacKinnon, Neil; Badilita, Vlad; Wallrabe, Ulrike; Korvink, Jan G.

2016-01-01

We present a completely revised generation of a modular micro-NMR detector, featuring an active sample volume of ∼ 100 nL, and an improvement of 87% in probe efficiency. The detector is capable of rapidly screening different samples using exchangeable, application-specific, MEMS-fabricated, microfluidic sample containers. In contrast to our previous design, the sample holder chips can be simply sealed with adhesive tape, with excellent adhesion due to the smooth surfaces surrounding the fluidic ports, and so withstand pressures of ∼2.5 bar, while simultaneously enabling high spectral resolution up to 0.62 Hz for H2O, due to its optimised geometry. We have additionally reworked the coil design and fabrication processes, replacing liquid photoresists by dry film stock, whose final thickness does not depend on accurate volume dispensing or precise levelling during curing. We further introduced mechanical alignment structures to avoid time-intensive optical alignment of the chip stacks during assembly, while we exchanged the laser-cut, PMMA spacers by diced glass spacers, which are not susceptible to melting during cutting. Doing so led to an overall simplification of the entire fabrication chain, while simultaneously increasing the yield, due to an improved uniformity of thickness of the individual layers, and in addition, due to more accurate vertical positioning of the wirebonded coils, now delimited by a post base plateau. We demonstrate the capability of the design by acquiring a 1H spectrum of ∼ 11 nmol sucrose dissolved in D2O, where we achieved a linewidth of 1.25 Hz for the TSP reference peak. Chemical shift imaging experiments were further recorded from voxel volumes of only ∼ 1.5nL, which corresponded to amounts of just 1.5 nmol per voxel for a 1 M concentration. To extend the micro-detector to other nuclei of interest, we have implemented a trap circuit, enabling heteronuclear spectroscopy, demonstrated by two 1H/13C 2D HSQC experiments. PMID:26730968

Subwavelength-thick lenses with high numerical apertures and large efficiency based on high-contrast transmitarrays

DOE Office of Scientific and Technical Information (OSTI.GOV)

Arbabi, Amir; Horie, Yu; Ball, Alexander J.

2015-05-07

Flat optical devices thinner than a wavelength promise to replace conventional free-space components for wavefront and polarization control. Transmissive flat lenses are particularly interesting for applications in imaging and on-chip optoelectronic integration. Several designs based on plasmonic metasurfaces, high-contrast transmitarrays and gratings have been recently implemented but have not provided a performance comparable to conventional curved lenses. Here we report polarization-insensitive, micron-thick, high-contrast transmitarray micro-lenses with focal spots as small as 0.57 λ. The measured focusing efficiency is up to 82%. A rigorous method for ultrathin lens design, and the trade-off between high efficiency and small spot size (or largemore » numerical aperture) are discussed. The micro-lenses, composed of silicon nano-posts on glass, are fabricated in one lithographic step that could be performed with high-throughput photo or nanoimprint lithography, thus enabling widespread adoption.« less

Design, Fabrication and Levitation Experiments of a Micromachined Electrostatically Suspended Six-Axis Accelerometer

PubMed Central

Cui, Feng; Liu, Wu; Chen, Wenyuan; Zhang, Weiping; Wu, Xiaosheng

2011-01-01

A micromachined electrostatically suspended six-axis accelerometer, with a square plate as proof mass housed by a top stator and bottom stator, is presented. The device structure and related techniques concerning its operating principles, such as calculation of capacitances and electrostatic forces/moments, detection and levitation control of the proof mass, acceleration measurement, and structural parameters design, are described. Hybrid MEMS manufacturing techniques, including surface micromachining fabrication of thin film electrodes and interconnections, integration fabrication of thick nickel structures about 500 μm using UV-LIGA by successful removal of SU-8 photoresist mold, DRIE of silicon proof mass in thickness of 450 μm, microassembly and solder bonding, were employed to fabricate this prototype microdevice. A levitation experiment system for the fabricated microaccelerometer chip is introduced, and levitation results show that fast initial levitation within 10 ms and stable full suspension of the proof mass have been successfully demonstrated. PMID:22247662

Subwavelength wave manipulation in a thin surface-wave bandgap crystal.

PubMed

Gao, Zhen; Wang, Zhuoyuan; Zhang, Baile

2018-01-01

It has been recently reported that the unit cell of wire media metamaterials can be tailored locally to shape the flow of electromagnetic waves at deep-subwavelength scales [Nat. Phys.9, 55 (2013)NPAHAX1745-247310.1038/nphys2480]. However, such bulk structures have a thickness of at least the order of wavelength, thus hindering their applications in the on-chip compact plasmonic integrated circuits. Here, based upon a Sievenpiper "mushroom" array [IEEE Trans. Microwave Theory Tech.47, 2059 (1999)IETMAB0018-948010.1109/22.798001], which is compatible with standard printed circuit board technology, we propose and experimentally demonstrate the subwavelength manipulation of surface waves on a thin surface-wave bandgap crystal with a thickness much smaller than the wavelength (1/30th of the operating wavelength). Functional devices including a T-shaped splitter and sharp bend are constructed with good performance.

A label-free, fluorescence based assay for microarray

NASA Astrophysics Data System (ADS)

Niu, Sanjun

DNA chip technology has drawn tremendous attention since it emerged in the mid 90's as a method that expedites gene sequencing by over 100-fold. DNA chip, also called DNA microarray, is a combinatorial technology in which different single-stranded DNA (ssDNA) molecules of known sequences are immobilized at specific spots. The immobilized ssDNA strands are called probes. In application, the chip is exposed to a solution containing ssDNA of unknown sequence, called targets, which are labeled with fluorescent dyes. Due to specific molecular recognition among the base pairs in the DNA, the binding or hybridization occurs only when the probe and target sequences are complementary. The nucleotide sequence of the target is determined by imaging the fluorescence from the spots. The uncertainty of background in signal detection and statistical error in data analysis, primarily due to the error in the DNA amplification process and statistical distribution of the tags in the target DNA, have become the fundamental barriers in bringing the technology into application for clinical diagnostics. Furthermore, the dye and tagging process are expensive, making the cost of DNA chips inhibitive for clinical testing. These limitations and challenges make it difficult to implement DNA chip methods as a diagnostic tool in a pathology laboratory. The objective of this dissertation research is to provide an alternative approach that will address the above challenges. In this research, a label-free assay is designed and studied. Polystyrene (PS), a commonly used polymeric material, serves as the fluorescence agent. Probe ssDNA is covalently immobilized on polystyrene thin film that is supported by a reflecting substrate. When this chip is exposed to excitation light, fluorescence light intensity from PS is detected as the signal. Since the optical constants and conformations of ssDNA and dsDNA (double stranded DNA) are different, the measured fluorescence from PS changes for the same intensity of excitation light. The fluorescence contrast is used to quantify the amount of probe-target hybridization. A mathematical model that considers multiple reflections and scattering is developed to explain the mechanism of the fluorescence contrast which depends on the thickness of the PS film. Scattering is the dominant factor that contributes to the contrast. The potential of this assay to detect single nucleotide polymorphism is also tested.

Portable Apparatus for Electrochemical Sensing of Ethylene

NASA Technical Reports Server (NTRS)

Manoukian, Mourad; Tempelman, Linda A.; Forchione, John; Krebs, W. Michael; Schmitt, Edwin W.

2007-01-01

A small, lightweight, portable apparatus based on an electrochemical sensing principle has been developed for monitoring low concentrations of ethylene in air. Ethylene has long been known to be produced by plants and to stimulate the growth and other aspects of the development of plants (including, notably, ripening of fruits and vegetables), even at concentrations as low as tens of parts per billion (ppb). The effects are magnified in plant-growth and -storage chambers wherein ethylene can accumulate. There is increasing recognition in agriculture and related industries that it is desirable to monitor and control ethylene concentrations in order to optimize the growth, storage, and ripening of plant products. Hence, there are numerous potential uses for the present apparatus in conjunction with equipment for controlling ethylene concentrations. The ethylene sensor is of a thick-film type with a design optimized for a low detection limit. The sensor includes a noble metal sensing electrode on a chip and a hydrated solid-electrolyte membrane that is held in contact with the chip. Also located on the sensor chip are a counter electrode and a reference electrode. The sensing electrode is held at a fixed potential versus the reference electrode. Detection takes place at active-triple-point areas where the sensing electrode, electrolyte, and sample gas meet. These areas are formed by cutting openings in the electrolyte membrane. The electrode current generated from electrochemical oxidation of ethylene at the active triple points is proportional to the concentration of ethylene. An additional film of the solid-electrolyte membrane material is deposited on the sensing electrode to increase the effective triple-point areas and thereby enhance the detection signal. The sensor chip is placed in a holder that is part of a polycarbonate housing. When fully assembled, the housing holds the solid-electrolyte membrane in contact with the chip (see figure). The housing includes a water reservoir for keeping the solid-electrolyte membrane hydrated. The housing also includes flow channels for circulating a sample stream of air over the chip: ethylene is brought to the sensing surface predominately by convection in this sample stream. The sample stream is generated by a built-in sampling pump. The forced circulation of sample air contributes to the attainment of a low detection limit.

P-type surface effects for thickness variation of 2um and 4um of n-type layer in GaN LED

NASA Astrophysics Data System (ADS)

Halim, N. S. A. Abdul; Wahid, M. H. A.; Hambali, N. A. M. Ahmad; Rashid, S.; Ramli, M. M.; Shahimin, M. M.

2017-09-01

The internal quantum efficiency of III-Nitrides group, GaN light-emitting diode (LED) has been considerably limited due to the insufficient hole injection and this is caused by the lack of performance p-type doping and low hole mobility. The low hole mobility makes the hole less energetic, thus reduced the performance operation of GaN LED itself. The internal quantum efficiency of GaN-based LED with surface roughness (texture) can be changed by texture size, density, and thickness of GaN film or by the combined effects of surface shape and thickness of GaN film. Besides, due to lack of p-type GaN, attempts to look forward the potential of GaN LED relied on the thickness of n-type layer and surface shape of p-type GaN layer. This work investigates the characteristics of GaN LED with undoped n-GaN layer of different thickness and the surface shape of p-type layer. The LEDs performance is significantly altered by modifying the thickness and shape. Enhancement of n-GaN layer has led to the annihilation of electrical conductivity of the chip. Different surface geometry governs the emission rate extensively. Internal quantum efficiency is also predominantly affected by the geometry of n-GaN layer which subjected to the current spreading. It is recorded that the IQE droop can be minimized by varying the thickness of the active layer without amplifying the forward voltage. Optimum forward voltage (I-V), total emission rate relationship with the injected current and internal quantum efficiency (IQE) for 2,4 µm on four different surfaces of p-type layer are also reported in this paper.

Influence of veneer thickness on residual stress profile in veneering ceramic: measurement by hole-drilling.

PubMed

Mainjot, Amélie K; Schajer, Gary S; Vanheusden, Alain J; Sadoun, Michaël J

2012-02-01

The veneering process of frameworks induces residual stresses and can initiate cracks when combined with functional stresses. The stress distribution within the veneering ceramic as a function of depth is a key factor influencing failure by chipping. This is a well-known problem with Yttria-tetragonal-zirconia-polycrystal based fixed partial dentures. The objective of this study is to investigate the influence of veneer thickness on the stress profile in zirconia- and metal-based structures. The hole-drilling method, often used for engineering measurements, was adapted for use with veneering ceramic. The stress profile was measured in bilayered disc samples of 20 mm diameter, with a 1 mm thick zirconia or metal framework. Different veneering ceramic thicknesses were performed: 1 mm, 1.5 mm, 2 mm, 2.5 mm and 3 mm. All samples exhibited the same type of stress vs. depth profile, starting with compressive at the ceramic surface, decreasing with depth up to 0.5-1.0 mm from the surface, and then becoming compressive again near the framework, except for the 1.5 mm-veneered zirconia samples which exhibited interior tensile stresses. Stresses in the surface of metal samples were not influenced by veneer thickness. Variation of interior stresses at 1.2 mm from the surface in function of veneer thickness was inverted for metal and zirconia samples. Veneer thickness influences in an opposite way the residual stress profile in metal- and in zirconia-based structures. A three-step approach and the hypothesis of the crystalline transformation are discussed to explain the less favorable residual stress development in zirconia samples. Copyright © 2011 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

Nano is the next big thing: Revealing geochemical processes with atom probe microscopy

NASA Astrophysics Data System (ADS)

Reddy, Steven; Saxey, David; Rickard, William; Fougerouse, Denis; Peterman, Emily; van Riessen, Arie; Johnson, Tim

2017-04-01

Characterizing compositional variations in minerals at the nanometre scale has the potential to yield fundamental insights into a range of geological processes associated with nucleation and mineral growth and the subsequent modification of mineral compositions by processes such as diffusion, deformation and recrystallization. However, there are few techniques that allow the quantitative measurement of low abundance trace elements and isotopes signatures at the nanometre scale. Atom probe microscopy is one such technique that has been widely used in the study of metals and, in the last decade, semiconductors. However, the development and application of atom probe microscopy to minerals is in its infancy and only a handful of published studies exist in the literature. Here, we provide an introduction to atom probe microscopy and its potential use in geological studies using two examples from both undeformed and deformed zircon (ZrSiO4). In the first example, we use atom probe microscopy to show that discordant data from the core of an undeformed 2.1 Ga zircon, metamorphosed at granulite facies conditions 150 Myr ago, contains distinct Pb reservoirs that represent both the crystallisation and metamorphic 207Pb/206Pb ages. Crystallisation ages are preserved within ˜10 nm diameter dislocation loops that formed during annealing of radiation-damaged zircon during the prograde path of the metamorphic event. The results highlight the potential for resolving the chronology of multiple, distinct Pb reservoirs within isotopically complex zircon and provide an explanation for varying amounts of discordance within individual zircon grains. In the second example, we illustrate complex trace element distributions associated with near-instantaneous deformation of a shocked zircon during the ˜1.17 Ga Stac Fada bolide impact. Substitutional and interstitial ions show correlated segregation, indicating coupling between different mobility mechanisms associated with the rapid formation and migration of oxygen vacancies and dislocations into low energy configurations. The results of these two studies show how quantification of elemental and isotopic variations at the nanoscale may reveal fundamental new insights into geochemical processes that underpin the interpretation of geochemical data collected at the microscale. Furthermore, these new data highlight the important role of crystal defects, even in undeformed zircon, in the chemical modification of zircon, and allow the interplay amongst radiation damage, recrystallization and deformation to be assessed.

Characteristics of basal ice and subglacial water at Dome Fuji, Antarctica ice sheet

NASA Astrophysics Data System (ADS)

Motoyama, H.; Uemura, R.; Hirabayashi, M.; Miyake, T.; Kuramoto, T.; Tanaka, Y.; Dome Fuji Ice Core Project, M.

2008-12-01

(Introduction): The second deep ice coring project at Dome Fuji, Antarctica reached a depth of 3035.22 m during the austral summer season in 2006/2007. The recovered ice cores contain records of global environmental changes going back about 720,000 years. (Estimation of basal ice melt): The borehole measurement was carried out on January 2nd in 2007 when the temperature disturbance in the borehole calmed down by the rest of drilling for 2 days. Temperature measurement was performed after 0 C thermometer test was done in the ground. The temperature sensor of pt100 installed in the skate-like anti-torque was used. We did not have the enough time until the temperature of thermometer was matched with the temperature of ice sheet. Some error was included in ice temperature data. The resistance of pt100 sensor was converted to temperature in the borehole measurement machine. But we used only two electrical lines for pt100 sensor. Rate of heat flow in the ice sheet was calculated using the vertical temperature gradient of the ice sheet and rate of heat conductivity of ice. The deepest part of heat flux using temperatures at 3000m and 3030m was about 45mW/m2. We assumed that this value was the heat flux from the bedrock in the ice sheet. Heat flux to the bedrock surface in the ground was assumed 54.6mW/m2 adopted by ice sheet model (P. Huybrechts, 2006). Then the heat flux for basal ice melt was about 10mW/m2. This value was equaled to melting of 1.1mm of ice thickness per year. On the other hand, the annual layer thickness under 2500m was not changed so much and its average was 1.3mm of ice thickness. So the annual layer thickness and melting rate of basal ice was the same in ordering way. Or ice equivalent in annual layer is melting every year. The age of the deepest part of ice core is guessed at 720,000 years old and the ice older than basal ice has melted away. (The state of basal ice): When the ice core drilling depth passed 3031.44m, amount of ice chip more abundant than the cutting chips has been collected. When the drilling passed 3033.46m, the amount of ice chip was decreased. But the amount of ice chip collected increase again from 3034.59m and many large ices have taken the upper part of ice core. The temperature of ice sheet near the bedrock is the pressure melting point. So the liquid water can exist easy there. The water like groundwater infiltrated into the borehole and froze in drilling liquid from 3031.44m to 3033.46m. Under 3034.59m, the subglacial water infiltrated into the borehole and froze in drilling liquid. The existence of water channel in the ice core was found. We think that the liquid water has been flowing through the boundary of ice crystal. (Characteristics of chemical constituents): The melted ice was analyzed every 10cm per 50cm from 2400m to 3028m and continuously every 10cm from 3028m to 3034m. The analytical items were water isotopes (d18O and dD), micro particles (dust) and major ion components. The variations of water isotope and dust in ice near the bedrock have no conspicuous change. But, the concentrations of Cl- and Na+ ions had interesting behavior. The concentration of Cl- ion increased and Na+ ion was decreased deeper than 3020m. Further the concentrations of all ions were decreased suddenly deeper than 3034m. The concentration of ions will be decrease in turn according to the solubility of the ion. home/

Late Paleogene rifting along the Malay Peninsula thickened crust

NASA Astrophysics Data System (ADS)

Sautter, Benjamin; Pubellier, Manuel; Jousselin, Pierre; Dattilo, Paolo; Kerdraon, Yannick; Choong, Chee Meng; Menier, David

2017-07-01

Sedimentary basins often develop above internal zones of former orogenic belts. We hereafter consider the Malay Peninsula (Western Sunda) as a crustal high separating two regions of stretched continental crust; the Andaman/Malacca basins in the western side and the Thai/Malay basins in the east. Several stages of rifting have been documented thanks to extensive geophysical exploration. However, little is known on the correlation between offshore rifted basins and the onshore continental core. In this paper, we explore through mapping and seismic data, how these structures reactivate pre-existing Mesozoic basement heterogeneities. The continental core appears to be relatively undeformed after the Triassic Indosinian orogeny. The thick crustal mega-horst is bounded by complex shear zones (Ranong, Klong Marui and Main Range Batholith Fault Zones) initiated during the Late Cretaceous/Early Paleogene during a thick-skin transpressional deformation and later reactivated in the Late Paleogene. The extension is localized on the sides of this crustal backbone along a strip where earlier Late Cretaceous deformation is well expressed. To the west, the continental shelf is underlain by three major crustal steps which correspond to wide crustal-scale tilted blocks bounded by deep rooted counter regional normal faults (Mergui Basin). To the east, some pronounced rift systems are also present, with large tilted blocks (Western Thai, Songkhla and Chumphon basins) which may reflect large crustal boudins. In the central domain, the extension is limited to isolated narrow N-S half grabens developed on a thick continental crust, controlled by shallow rooted normal faults, which develop often at the contact between granitoids and the host-rocks. The outer limits of the areas affected by the crustal boudinage mark the boundary towards the large and deeper Andaman basin in the west and the Malay and Pattani basins in the east. At a regional scale, the rifted basins resemble N-S en-echelon structures along large NW-SE shear bands. The rifting is accommodated by large low angle normal faults (LANF) running along crustal morphostructures such as broad folds and Mesozoic batholiths. The deep Andaman, Malay and Pattani basins seem to sit on weaker crust inherited from Gondwana-derived continental blocks (Burma, Sibumasu, and Indochina). The set of narrow elongated basins in the core of the Region (Khien Sa, Krabi, and Malacca basins) suffered from a relatively lesser extension.

Ultrahydrophobic water

NASA Astrophysics Data System (ADS)

Landgraf, J.; Kanitz, C.

2017-05-01

When a water drop falls on an oscillating soapy water surface it is observed that coalescence of the drop is inhibited because the drops are bouncing on the surface like on a trampoline. In our research we made experimental and theoretical investigations to an undeformable drop on a deformable bath. We described the vertical movement, predicted the critical bouncing threshold and also made experiments to the effects of an increased Weber number and the horizontal movement of the drop caused by a vertical movement.

Geochemical signature variation of pre-, syn-, and post-shearing intrusives within the Najd Fault System of western Saudi Arabia

NASA Astrophysics Data System (ADS)

Hassan, M.; Abu-Alam, T. S.; Hauzenberger, C.; Stüwe, K.

2016-10-01

Late Precambrian intrusive rocks in the Arabian-Nubian Shield emplaced within and around the Najd Fault System of Saudi Arabia feature a great compositional diversity and a variety of degrees of deformation (i.e. pre-shearing deformed, sheared mylonitized, and post-shearing undeformed) that allows placing them into a relative time order. It is shown here that the degree of deformation is related to compositional variations where early, usually pre-shearing deformed rocks are of dioritic, tonalitic to granodioritic, and later, mainly post-shearing undeformed rocks are mostly of granitic composition. Correlation of the geochemical signature and time of emplacement is interpreted in terms of changes in the source region of the produced melts due to the change of the stress regime during the tectonic evolution of the Arabian-Nubian Shield. The magma of the pre-shearing rocks has tholeiitic and calc-alkaline affinity indicating island arc or continental arc affinity. In contrast, the syn- and post-shearing rocks are mainly potassium rich peraluminous granites which are typically associated with post-orogenic uplift and collapse. This variation in geochemical signature is interpreted to reflect the change of the tectonic regime from a compressional volcanic arc nature to extensional within-plate setting of the Arabian-Nubian Shield. Within the context of published geochronological data, this change is likely to have occurred around 605-580 Ma.

Space-time evolution of cataclasis in carbonate fault zones

NASA Astrophysics Data System (ADS)

Ferraro, Francesco; Grieco, Donato Stefano; Agosta, Fabrizio; Prosser, Giacomo

2018-05-01

The present contribution focuses on the micro-mechanisms associated to cataclasis of both calcite- and dolomite-rich fault rocks. This work combines field and laboratory data of carbonate fault cores currently exposed in central and southern Italy. By first deciphering the main fault rock textures, their spatial distribution, crosscutting relationships and multi-scale dimensional properties, the relative timing of Intragranular Extensional Fracturing (IEF), chipping, and localized shear is inferred. IEF was predominant within already fractured carbonates, forming coarse and angular rock fragments, and likely lasted for a longer period within the dolomitic fault rocks. Chipping occurred in both lithologies, and was activated by grain rolling forming minute, sub-rounded survivor grains embedded in a powder-like carbonate matrix. The largest fault zones, which crosscut either limestones or dolostones, were subjected to localized shear and, eventually, to flash temperature increase which caused thermal decomposition of calcite within narrow (cm-thick) slip zones. Results are organized in a synoptic panel including the main dimensional properties of survivor grains. Finally, a conceptual model of the time-dependent evolution of cataclastic deformation in carbonate rocks is proposed.

Macro-spin modeling and experimental study of spin-orbit torque biased magnetic sensors

NASA Astrophysics Data System (ADS)

Xu, Yanjun; Yang, Yumeng; Luo, Ziyan; Xu, Baoxi; Wu, Yihong

2017-11-01

We reported a systematic study of spin-orbit torque biased magnetic sensors based on NiFe/Pt bilayers through both macro-spin modeling and experiments. The simulation results show that it is possible to achieve a linear sensor with a dynamic range of 0.1-10 Oe, power consumption of 1 μW-1mW, and sensitivity of 0.1-0.5 Ω/Oe. These characteristics can be controlled by varying the sensor dimension and current density in the Pt layer. The latter is in the range of 1 × 105-107 A/cm2. Experimental results of fabricated sensors with selected sizes agree well with the simulation results. For a Wheatstone bridge sensor comprising of four sensing elements, a sensitivity up to 0.548 Ω/Oe, linearity error below 6%, and detectivity of about 2.8 nT/√Hz were obtained. The simple structure and ultrathin thickness greatly facilitate the integration of these sensors for on-chip applications. As a proof-of-concept experiment, we demonstrate its application in detection of current flowing in an on-chip Cu wire.

Circular Dichroism Control of Tungsten Diselenide (WSe2) Atomic Layers with Plasmonic Metamolecules.

PubMed

Lin, Hsiang-Ting; Chang, Chiao-Yun; Cheng, Pi-Ju; Li, Ming-Yang; Cheng, Chia-Chin; Chang, Shu-Wei; Li, Lance L J; Chu, Chih-Wei; Wei, Pei-Kuen; Shih, Min-Hsiung

2018-05-09

Controlling circularly polarized (CP) states of light is critical to the development of functional devices for key and emerging applications such as display technology and quantum communication, and the compact circular polarization-tunable photon source is one critical element to realize the applications in the chip-scale integrated system. The atomic layers of transition metal dichalcogenides (TMDCs) exhibit intrinsic CP emissions and are potential chiroptical materials for ultrathin CP photon sources. In this work, we demonstrated CP photon sources of TMDCs with device thicknesses approximately 50 nm. CP photoluminescence from the atomic layers of tungsten diselenide (WSe 2 ) was precisely controlled with chiral metamolecules (MMs), and the optical chirality of WSe 2 was enhanced more than 4 times by integrating with the MMs. Both the enhanced and reversed circular dichroisms had been achieved. Through integrations of the novel gain material and plasmonic structure which are both low-dimensional, a compact device capable of efficiently manipulating emissions of CP photon was realized. These ultrathin devices are suitable for important applications such as the optical information technology and chip-scale biosensing.

Science& Technology Review October 2003

DOE Office of Scientific and Technical Information (OSTI.GOV)

McMahon, D H

2003-10-01

The October 2003 issue of Science & Technology Review consists of the following articles: (1) Award-Winning Technologies from Collaborative Efforts--Commentary by Hal Graboske; (2) BASIS Counters Airborne Bioterrorism--The Biological Aerosol Sentry and Information System is the first integrated biodefense system; (3) In the Chips for the Coming Decade--A new system is the first full-field lithography tool for use at extreme ultraviolet wavelengths; (4) Smoothing the Way to Print the Next Generation of Computer Chips--With ion-beam thin-film planarization, the reticles and projection optics made for extreme ultraviolet lithography are nearly defect-free; (5) Eyes Can See Clearly Now--The MEMS-based adaptive optics phoroptermore » improves the process of measuring and correcting eyesight aberrations; (6) This Switch Takes the Heat--A thermally compensated Q-switch reduces the light leakage on high-average-power lasers; (7) Laser Process Forms Thick, Curved Metal Parts--A new process shapes parts to exact specifications, improving their resistance to fatigue and corrosion cracking; and (8) Characterizing Tiny Objects without Damaging Them--Livermore researchers are developing nondestructive techniques to probe the Lilliputian world of mesoscale objects.« less

The Soft X-ray Imager (SXI) for the ASTRO-H Mission

NASA Astrophysics Data System (ADS)

Tanaka, Takaaki; Tsunemi, Hiroshi; Hayashida, Kiyoshi; Tsuru, Takeshi G.; Dotani, Tadayasu; Nakajima, Hiroshi; Anabuki, Naohisa; Nagino, Ryo; Uchida, Hiroyuki; Nobukawa, Masayoshi; Ozaki, Masanobu; Natsukari, Chikara; Tomida, Hiroshi; Ueda, Shutaro; Kimura, Masashi; Hiraga, Junko S.; Kohmura, Takayoshi; Murakami, Hiroshi; Mori, Koji; Yamauchi, Makoto; Hatsukade, Isamu; Nishioka, Yusuke; Bamba, Aya; Doty, John P.

2015-09-01

The Soft X-ray Imager (SXI) is an X-ray CCD camera onboard the ASTRO-H X-ray observatory. The CCD chip used is a P-channel back-illuminated type, and has a 200-µm thick depletion layer, with which the SXI covers the energy range between 0.4 keV and 12 keV. Its imaging area has a size of 31 mm x 31 mm. We arrange four of the CCD chips in a 2 by 2 grid so that we can cover a large field-of-view of 38' x 38'. We cool the CCDs to -120 °C with a single-stage Stirling cooler. As was done for the CCD camera of the Suzaku satellite, XIS, artificial charges are injected to selected rows in order to recover charge transfer inefficiency due to radiation damage caused by in-orbit cosmic rays. We completed fabrication of flight models of the SXI and installed them into the satellite. We verified the performance of the SXI in a series of satellite tests. On-ground calibrations were also carried out and detailed studies are ongoing.

Thin-film decoupling capacitors for multi-chip modules

NASA Astrophysics Data System (ADS)

Dimos, D.; Lockwood, S. J.; Schwartz, R. W.; Rogers, M. S.

Thin-film decoupling capacitors based on ferroelectric lead lanthanum zirconate titanate (PLZT) films are being developed for use in advanced packages, such as multi-chip modules. These thin-film decoupling capacitors are intended to replace multi-layer ceramic capacitors for certain applications, since they can be more fully integrated into the packaging architecture. The increased integration that can be achieved should lead to decreased package volume and improved high-speed performance, due to a decrease in interconnect inductance. PLZT films are fabricated by spin coating using metal carboxylate/alkoxide solutions. These films exhibit very high dielectric constants ((var epsilon) greater than or equal to 900), low dielectric losses (tan(delta) = 0.01), excellent insulation resistances (rho greater than 10(exp 13) (Omega)-cm at 125 C), and good breakdown field strengths (E(sub B) = 900 kV/cm). For integrated circuit applications, the PLZT dielectric is less than 1 micron thick, which results in a large capacitance/area (8-9 nF/sq mm). The thin-film geometry and processing conditions also make these capacitors suitable for direct incorporation onto integrated circuits and for packages that require embedded components.

Strong Interlayer Magnon-Magnon Coupling in Magnetic Metal-Insulator Hybrid Nanostructures.

PubMed

Chen, Jilei; Liu, Chuanpu; Liu, Tao; Xiao, Yang; Xia, Ke; Bauer, Gerrit E W; Wu, Mingzhong; Yu, Haiming

2018-05-25

We observe strong interlayer magnon-magnon coupling in an on-chip nanomagnonic device at room temperature. Ferromagnetic nanowire arrays are integrated on a 20-nm-thick yttrium iron garnet (YIG) thin film strip. Large anticrossing gaps up to 1.58 GHz are observed between the ferromagnetic resonance of the nanowires and the in-plane standing spin waves of the YIG film. Control experiments and simulations reveal that both the interlayer exchange coupling and the dynamical dipolar coupling contribute to the observed anticrossings. The coupling strength is tunable by the magnetic configuration, allowing the coherent control of magnonic devices.

Strong Interlayer Magnon-Magnon Coupling in Magnetic Metal-Insulator Hybrid Nanostructures

NASA Astrophysics Data System (ADS)

Chen, Jilei; Liu, Chuanpu; Liu, Tao; Xiao, Yang; Xia, Ke; Bauer, Gerrit E. W.; Wu, Mingzhong; Yu, Haiming

2018-05-01

We observe strong interlayer magnon-magnon coupling in an on-chip nanomagnonic device at room temperature. Ferromagnetic nanowire arrays are integrated on a 20-nm-thick yttrium iron garnet (YIG) thin film strip. Large anticrossing gaps up to 1.58 GHz are observed between the ferromagnetic resonance of the nanowires and the in-plane standing spin waves of the YIG film. Control experiments and simulations reveal that both the interlayer exchange coupling and the dynamical dipolar coupling contribute to the observed anticrossings. The coupling strength is tunable by the magnetic configuration, allowing the coherent control of magnonic devices.

Automated Laser Cutting In Three Dimensions

NASA Technical Reports Server (NTRS)

Bird, Lisa T.; Yvanovich, Mark A.; Angell, Terry R.; Bishop, Patricia J.; Dai, Weimin; Dobbs, Robert D.; He, Mingli; Minardi, Antonio; Shelton, Bret A.

1995-01-01

Computer-controlled machine-tool system uses laser beam assisted by directed flow of air to cut refractory materials into complex three-dimensional shapes. Velocity, position, and angle of cut varied. In original application, materials in question were thermally insulating thick blankets and tiles used on space shuttle. System shapes tile to concave or convex contours and cuts beveled edges on blanket, without cutting through outer layer of quartz fabric part of blanket. For safety, system entirely enclosed to prevent escape of laser energy. No dust generated during cutting operation - all material vaporized; larger solid chips dislodged from workpiece easily removed later.

Rutile and topaz in Precambrian gneiss, Jefferson and Clear Creek Counties, Colorado

USGS Publications Warehouse

Sheridan, Douglas M.; Taylor, Richard B.; Marsh, Sherman P.

1968-01-01

Disseminated rutile and major amounts of topaz have been identified in Precambrian topaz-quartz gneiss northwest of Evergreen, Colo. The rutile occurs in quartz-topaz-sillimanite gneiss that forms a stratigraphic unit which is 11 to 100 feet thick and is identified along strike for more than 7,000 feet. Three composite chip samples taken across this unit contain 2.2 to 4.2 percent of rutile, by weight, in grains averaging from 0.1 to 0.3 millimeter in size. The topaz content, by weight, in the same samples ranges from 23 to 67 percent.

Influencing of various phosphor parameters on the LED performance

NASA Astrophysics Data System (ADS)

Wu, Yi Ping; Zhang, Shu Qin; Jin, Shang-zhong; Shi, Chang Shou; Li, Liang; Yu, RenYong

2012-10-01

In this paper ,the advantages and disadvantages of the methods to achieve White LED are reviewed, and phosphor-converted white LEDs are discussed in detail. In the case of blue chip exciting YAG phosphor to get white LED, use Mie scattering theory to construct physical model, then analyze how the package, concentration, thickness and particle size of phosphor work on extraction efficiency, spatial Chroma uniformity and color temperature of white LED. The conclusion of this paper advances the application of LED solid-state light source. In the end, the paper puts forward the direction and focus of phosphor research.

Gelcasting compositions having improved drying characteristics and machinability

DOEpatents

Janney, Mark A.; Walls, Claudia A. H.

2001-01-01

A gelcasting composition has improved drying behavior, machinability and shelf life in the dried and unfired state. The composition includes an inorganic powder, solvent, monomer system soluble in the solvent, an initiator system for polymerizing the monomer system, and a plasticizer soluble in the solvent. Dispersants and other processing aides to control slurry properties can be added. The plasticizer imparts an ability to dry thick section parts, to store samples in the dried state without cracking under conditions of varying relative humidity, and to machine dry gelcast parts without cracking or chipping. A method of making gelcast parts is also disclosed.

Integrated on-chip inductors with electroplated magnetic yokes (invited)

NASA Astrophysics Data System (ADS)

Wang, Naigang; O'Sullivan, Eugene J.; Herget, Philipp; Rajendran, Bipin; Krupp, Leslie E.; Romankiw, Lubomyr T.; Webb, Bucknell C.; Fontana, Robert; Duch, Elizabeth A.; Joseph, Eric A.; Brown, Stephen L.; Hu, Xiaolin; Decad, Gary M.; Sturcken, Noah; Shepard, Kenneth L.; Gallagher, William J.

2012-04-01

Thin-film ferromagnetic inductors show great potential as the energy storage element for integrated circuits containing on-chip power management. In order to achieve the high energy storage required for power management, on-chip inductors require relatively thick magnetic yoke materials (several microns or more), which can be readily deposited by electroplating through a photoresist mask as demonstrated in this paper, the yoke material of choice being Ni45Fe55, whose properties of relatively high moment and electrical resistivity make it an attractive model yoke material for inductors. Inductors were designed with a variety of yoke geometries, and included both single-turn and multi-turn coil designs, which were fabricated on 200 mm silicon wafers in a CMOS back-end-of-line (BEOL) facility. Each inductor consisted of electroplated copper coils enclosed by the electroplated Ni45Fe55 yokes; aspects of the fabrication of the inductors are discussed. Magnetic properties of the electroplated yoke materials are described, including high frequency permeability measurements. The inductance of 2-turn coil inductors, for example, was enhanced up to about 6 times over the air core equivalent, with an inductance density of 130 nH/mm2 being achieved. The resistance of these non-laminated inductors was relatively large at high frequency due to magnetic and eddy current losses but is expected to improve as the yoke material/structure is further optimized, making electroplated yoke-containing inductors attractive for dc-dc power converters.

Multichannel detection of ionic currents through two nanopores fabricated on integrated Si3N4 membranes.

PubMed

Yanagi, Itaru; Akahori, Rena; Aoki, Mayu; Harada, Kunio; Takeda, Ken-Ichi

2016-08-16

Integration of solid-state nanopores and multichannel detection of signals from each nanopore are effective measures for realizing high-throughput nanopore sensors. In the present study, we demonstrated fabrication of Si3N4 membrane arrays and the simultaneous measurement of ionic currents through two nanopores formed in two adjacent membranes. Membranes with thicknesses as low as 6.4 nm and small nanopores with diameters of less than 2 nm could be fabricated using the poly-Si sacrificial-layer process and multilevel pulse-voltage injection. Using the fabricated nanopore membranes, we successfully achieved simultaneous detection of clear ionic-current blockades when single-stranded short homopolymers (poly(dA)60) passed through two nanopores. In addition, we investigated the signal crosstalk and leakage current among separated chambers. When two nanopores were isolated on the front surface of the membrane, there was no signal crosstalk or leakage current between the chambers. However, when two nanopores were isolated on the backside of the Si substrate, signal crosstalk and leakage current were observed owing to high-capacitance coupling between the chambers and electrolysis of water on the surface of the Si substrate. The signal crosstalk and leakage current could be suppressed by oxidizing the exposed Si surface in the membrane chip. Finally, the observed ionic-current blockade when poly(dA)60 passed through the nanopore in the oxidized chip was approximately half of that observed in the non-oxidized chip.

Direct measurement of a patient's entrance skin dose during pediatric cardiac catheterization

PubMed Central

Sun, Lue; Mizuno, Yusuke; Iwamoto, Mari; Goto, Takahisa; Koguchi, Yasuhiro; Miyamoto, Yuka; Tsuboi, Koji; Chida, Koichi; Moritake, Takashi

2014-01-01

Children with complex congenital heart diseases often require repeated cardiac catheterization; however, children are more radiosensitive than adults. Therefore, radiation-induced carcinogenesis is an important consideration for children who undergo those procedures. We measured entrance skin doses (ESDs) using radio-photoluminescence dosimeter (RPLD) chips during cardiac catheterization for 15 pediatric patients (median age, 1.92 years; males, n = 9; females, n = 6) with cardiac diseases. Four RPLD chips were placed on the patient's posterior and right side of the chest. Correlations between maximum ESD and dose–area products (DAP), total number of frames, total fluoroscopic time, number of cine runs, cumulative dose at the interventional reference point (IRP), body weight, chest thickness, and height were analyzed. The maximum ESD was 80 ± 59 (mean ± standard deviation) mGy. Maximum ESD closely correlated with both DAP (r = 0.78) and cumulative dose at the IRP (r = 0.82). Maximum ESD for coiling and ballooning tended to be higher than that for ablation, balloon atrial septostomy, and diagnostic procedures. In conclusion, we directly measured ESD using RPLD chips and found that maximum ESD could be estimated in real-time using angiographic parameters, such as DAP and cumulative dose at the IRP. Children requiring repeated catheterizations would be exposed to high radiation levels throughout their lives, although treatment influences radiation dose. Therefore, the radiation dose associated with individual cardiac catheterizations should be analyzed, and the effects of radiation throughout the lives of such patients should be followed. PMID:24968708

Investigation of the Effect of Tool Edge Geometry upon Cutting Variables, Tool Wear and Burr Formation Using Finite Element Simulation — A Progress Report

NASA Astrophysics Data System (ADS)

Sartkulvanich, Partchapol; Al-Zkeri, Ibrahim; Yen, Yung-Chang; Altan, Taylan

2004-06-01

This paper summarizes some of the progress made on FEM simulations of metal cutting processes conducted at the Engineering Research Center (ERC/NSM). Presented research focuses on the performance of various cutting edge geometries (hone and chamfer edges) for different tool materials and specifically on: 1) the effect of round and chamfer edge geometries on the cutting variables in machining carbon steels and 2) the effect of the edge hone size upon the flank wear and burr formation behavior in face milling of A356-T6 aluminum alloy. In the second task, an innovative design of edge preparation with varying hone size around the tool nose is also explored using FEM. In order to model three-dimensional conventional turning and face milling with two-dimensional orthogonal cutting simulations, 2D simulation cross-sections consisting of the cutting speed direction and chip flow direction are selected at different locations along the tool nose radius. Then the geometries of the hone and chamfer edges and their associated tool angles as well as uncut chip thickness are determined on these planes and employed in cutting simulations. The chip flow direction on the tool rake face are obtained by examining the wear grooves on the experimental inserts or estimated by using Oxley's approximation theory of oblique cutting. Simulation results are compared with the available experimental results (e.g. cutting forces) both qualitatively and quantitatively.

From red cells to soft porous lubrication.

NASA Astrophysics Data System (ADS)

Wu, Qianhong; Zhu, Zenghao; Nathan, Rungun

2017-11-01

In this paper, we report a novel experimental study to examine the lubrication theory for highly compressible porous media (Feng & Weinbaum, JFM, 422, 282, 2000), which was applied to the frictionless motion of red cells over the endothelial surface layer (ESL). The experimental setup consists of a running conveyer belt covered with a porous sheet, and an upper planar board, i.e. planing surface. The pore pressure generation was captured when the planing surface glides over the porous sheet. If the lateral leakage was eliminated, we found that the overall pore pressure's contribution to the total lift, fair 80%, and the friction coefficient η = 0.0981, when U =5 m/s, L =0.381 m, λ = h2/h0 = 1 and k =h2/h1 = 3, where U is the velocity of the conveyor belt; L is the planing surface length; h0, h1 and h2 are the undeformed, leading and trailing edge porous layer thickness, respectively. fair increases with the increase in U, λ and L, while decreases with the increase in k. η decreases with the increase in fair. If lateral pressure leakage exists, the pore pressure generation is reduced by nearly 90%. All the results agreed well with the theoretical predictions. The study here lays the foundation for applying soft porous media for new type of bearing with significantly reduced friction. This research was supported by the National Science Foundation (NSF CBET) under Award No. 1511096.

Age and evolution of thin-skinned deformation in Zacatecas, Mexico: Sevier orogeny evidence in the Mexican Fold-Thrust Belt

NASA Astrophysics Data System (ADS)

Ramírez-Peña, César Francisco; Chávez-Cabello, Gabriel

2017-07-01

Integrating U-Pb ages from zircons of syn- and postectonic intrusives emplaced in folded pre- and synorogenic marine sedimentary rocks, it is proposed that thin-skinned deformation in the Concepción del Oro salient of the Mexican Fold Thrust Belt in northern Zacatecas, Mexico, was active between 92 and 71.6 Ma. The intrusives Pico de Teyra and El Peñuelo (U-Pb zircon ages: 76.9 and 72.5 Ma) show internal tectonic foliations and horizontal shear zones that cut off aplitic veins, which apparently developed syntectonically to thin-skinned deformation. Other intrusives like Saltillito (71.6 Ma) and Concepción del Oro are clearly postectonic because they are undeformed internally, cut regional structures and are younger than syntectonic plutons. Biostratigraphic ages reported for synorogenic sediments (Concepción del Oro and Parras formations) indicate that regional thin-skinned deformation was active between Early Turonian and Late Campanian, which is in agreement with syn and postectonic intrusive emplacement ages in the area. Nevertheless, the thin-skinned structures are disrupted by a younger NNW-SSE high angle reverse and normal faults that uplifts the San Julián Block in the west and truncate the Concepción del Oro salient, suggesting a post-Paleocene thick-skinned stage of deformation. In this work, we propose that style and age of thin-skinned deformation is similar to the Sevier orogeny in the Rocky Mountains.

40Ar ∗ loss in experimentally deformed muscovite and biotite with implications for 40Ar/ 39Ar geochronology of naturally deformed rocks

NASA Astrophysics Data System (ADS)

Cosca, Michael; Stunitz, Holger; Bourgeix, Anne-Lise; Lee, John P.

2011-12-01

The effects of deformation on radiogenic argon ( 40Ar ∗) retentivity in mica are described from high pressure experiments performed on rock samples of peraluminous granite containing euhedral muscovite and biotite. Cylindrical cores, ˜15 mm in length and 6.25 mm in diameter, were drilled from granite collected from the South Armorican Massif in northwestern France, loaded into gold capsules, and weld-sealed in the presence of excess water. The samples were deformed at a pressure of 10 kb and a temperature of 600 °C over a period 29 of hours within a solid medium assembly in a Griggs-type triaxial hydraulic deformation apparatus. Overall shortening in the experiments was approximately 10%. Transmitted light and secondary and backscattered electron imaging of the deformed granite samples reveals evidence of induced defects and for significant physical grain size reduction by kinking, cracking, and grain segmentation of the micas. Infrared (IR) laser (CO 2) heating of individual 1.5-2.5 mm diameter grains of muscovite and biotite separated from the undeformed granite yield well-defined 40Ar/ 39Ar plateau ages of 311 ± 2 Ma (2σ). Identical experiments on single grains separated from the experimentally deformed granite yield results indicating 40Ar ∗ loss of 0-35% in muscovite and 2-3% 40Ar ∗ loss in biotite. Intragrain in situ ultraviolet (UV) laser ablation 40Ar/ 39Ar ages (±4-10%, 1σ) of deformed muscovites range from 309 ± 13 to 264 ± 7 Ma, consistent with 0-16% 40Ar ∗ loss relative to the undeformed muscovite. The in situ UV laser ablation 40Ar/ 39Ar ages of deformed biotite vary from 301 to 217 Ma, consistent with up to 32% 40Ar ∗ loss. No spatial correlation is observed between in situ40Ar/ 39Ar age and position within individual grains. Using available argon diffusion data for muscovite the observed 40Ar ∗ loss in the experimentally treated muscovite can be utilized to predict average 40Ar ∗ diffusion dimensions. Maximum 40Ar/ 39Ar ages obtained by UV laser ablation overlap those of the undeformed muscovite, indicating argon loss of <1% and an average effective grain radius for 40Ar ∗ diffusion ⩾700 μm. The UV laser ablation and IR laser incremental 40Ar/ 39Ar ages indicating 40Ar ∗ loss of 16% and 35%, respectively, are consistent with an average diffusion radius ≪100 μm. These results support a hypothesis of grain-scale 40Ar ∗ diffusion distances in undeformed mica and a heterogeneous mechanical reduction in the intragrain effective diffusion length scale for 40Ar ∗ in deformed mica. Reduction in the effective diffusion length scale in naturally deformed samples occurs most probably through production of mesoscopic and submicroscopic defects such as, e.g., stacking faults. A network of interconnected defects, continuously forming and annealing during dynamic deformation likely plays an important role in controlling both 40Ar ∗ retention and intragrain distribution in deformed mica. Intragrain 40Ar/ 39Ar ages, when combined with estimates of diffusion kinetics and distances, may provide a means of establishing thermochronological histories from individual micas.

Optimal design of leak-proof SRAM cell using MCDM method

NASA Astrophysics Data System (ADS)

Wang, Qi; Kang, Sung-Mo

2003-04-01

As deep-submicron CMOS technology advances, on-chip cache has become a bottleneck on microprocessor's performance. Meanwhile, it also occupies a big percentage of processor area and consumes large power. Speed, power and area of SRAM are mutually contradicting, and not easy to be met simultaneously. Many existent leakage suppression techniques have been proposed, but they limit the circuit's performance. We apply a Multi-Criteria Decision Making strategy to perform a minimum delay-power-area optimization on SRAM circuit under some certain constraints. Based on an integrated device and circuit-level approach, we search for a process that yields a targeted composite performance. In consideration of the huge amount of simulation workload involved in the optimal design-seeking process, most of this process is automated to facilitate our goal-pursuant. With varying emphasis put on delay, power or area, different optimal SRAM designs are derived and a gate-oxide thickness scaling limit is projected. The result seems to indicate that a better composite performance could be achieved under a thinner oxide thickness. Under the derived optimal oxide thickness, the static leakage power consumption contributes less than 1% in the total power dissipation.

Real-time measurement of flow rate in microfluidic devices using a cantilever-based optofluidic sensor.

PubMed

Cheri, Mohammad Sadegh; Latifi, Hamid; Sadeghi, Jalal; Moghaddam, Mohammadreza Salehi; Shahraki, Hamidreza; Hajghassem, Hasan

2014-01-21

Real-time and accurate measurement of flow rate is an important reqirement in lab on a chip (LOC) and micro total analysis system (μTAS) applications. In this paper, we present an experimental and numerical investigation of a cantilever-based optofluidic flow sensor for this purpose. Two sensors with thin and thick cantilevers were fabricated by engraving a 2D pattern of cantilever/base on two polymethylmethacrylate (PMMA) slabs using a CO2 laser system and then casting a 2D pattern with polydimethylsiloxane (PDMS). The basic working principle of the sensor is the fringe shift of the Fabry-Pérot (FP) spectrum due to a changing flow rate. A Finite Element Method (FEM) is used to solve the three dimensional (3D) Navier-Stokes and structural deformation equations to simulate the pressure distribution, velocity and cantilever deflection results of the flow in the channel. The experimental results show that the thin and thick cantilevers have a minimum detectable flow change of 1.3 and 4 (μL min(-1)) respectively. In addition, a comparison of the numerical and experimental deflection of the cantilever has been done to obtain the effective Young's modulus of the thin and thick PDMS cantilevers.

Graphene-based bimorphs for micron-sized, autonomous origami machines.

PubMed

Miskin, Marc Z; Dorsey, Kyle J; Bircan, Baris; Han, Yimo; Muller, David A; McEuen, Paul L; Cohen, Itai

2018-01-16

Origami-inspired fabrication presents an attractive platform for miniaturizing machines: thinner layers of folding material lead to smaller devices, provided that key functional aspects, such as conductivity, stiffness, and flexibility, are persevered. Here, we show origami fabrication at its ultimate limit by using 2D atomic membranes as a folding material. As a prototype, we bond graphene sheets to nanometer-thick layers of glass to make ultrathin bimorph actuators that bend to micrometer radii of curvature in response to small strain differentials. These strains are two orders of magnitude lower than the fracture threshold for the device, thus maintaining conductivity across the structure. By patterning 2-[Formula: see text]m-thick rigid panels on top of bimorphs, we localize bending to the unpatterned regions to produce folds. Although the graphene bimorphs are only nanometers thick, they can lift these panels, the weight equivalent of a 500-nm-thick silicon chip. Using panels and bimorphs, we can scale down existing origami patterns to produce a wide range of machines. These machines change shape in fractions of a second when crossing a tunable pH threshold, showing that they sense their environments, respond, and perform useful functions on time and length scales comparable with microscale biological organisms. With the incorporation of electronic, photonic, and chemical payloads, these basic elements will become a powerful platform for robotics at the micrometer scale.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Smilga, A. V.

We discuss non-Hermitian field theories where the spectrum of the Hamiltonian involves only real energies. We make three observations. (i) The theories obtained from supersymmetric theories by nonanticommutative deformations belong in many cases to this class. (ii) When the deformation parameter is small, the deformed theory enjoys the same supersymmetry algebra as the undeformed one. Half of the supersymmetries are manifest and the existence of another half can be deduced from the structure of the spectrum. (iii) Generically, the conventionally defined S-matrix is not unitary for such theories.

Determination of Fatigue Damage in Corrosion-Fatigued Al-2024-T4 and Cycled Ti-6Al-4V Alloys.

DTIC Science & Technology

1982-05-01

overall induced microplasticity at very low applied cyclic stresses, the frequency dependence as well as the observed cathodic polariza- tion effects...The absence of an overall induced microplasticity at very low applied cyclic stresses, the frequency dependence as well as the observed cathodic... microplasticity , expressed in terms of the * values, was principally 31 ._ __ __ _ __ _- ..... U - - .. :0 (a) Undeformed to. 5 L . 1 llh1 i. _ _ * :[ I.I5E- (b

Self-Diffusion of Drops in a Dilute Sheared Emulsion

NASA Technical Reports Server (NTRS)

Loewenberg, Michael; Hinch, E. J.

1996-01-01

Self-diffusion coefficients that describe cross-flow migration of non-Brownian drops in a dilute sheared emulsion were obtained by trajectory calculations. A boundary integral formulation was used to describe pairwise interactions between deformable drops; interactions between undeformed drops were described with mobility functions for spherical drops. The results indicate that drops have large anisotropic self-diffusivities which depend strongly on the drop viscosity and modestly on the shear-rate. Pairwise interactions between drops in shear-flow do not appreciably promote drop breakup.

Interpretation of the Last Chance thrust, Death Valley region, California, as an Early Permian décollement in a previously undeformed shale basin

USGS Publications Warehouse

Stevens, Calvin H.; Stone, Paul

2005-01-01

We interpret the Last Chance thrust as similar in many ways to Appalachian-type décollements in which the zone of thrusting is localized along a shale interval. The Last Chance thrust, however, has been dismembered during later geologic events so that its original geometry has been obscured. Our model may have unrecognized analogs in other structurally complex shale basins in which the initial deformation was along a major shale unit.

Characterization of the Nonlinear Viscoelastic and Adhesive Properties of Polyurea and Characterization of Polyurea-Clad Metallic Structures

DTIC Science & Technology

2009-10-14

10mm away from the defect in the undeformed state in both cases) respectively from the defect. The time variation of von Mises effective stress at...specimen experiences a multiaxial compressive stress state , consisting of a pressure and superposed shear. The Arcan test is used in the direct...conductivity (OHFC) copper the stress -strain curve is also shown in Fig. 1. Fitting the power-law hardening model of Eq. 1, we obtain n ~ 0.3; it is apparent

Development of n-in-p pixel modules for the ATLAS upgrade at HL-LHC

NASA Astrophysics Data System (ADS)

Macchiolo, A.; Nisius, R.; Savic, N.; Terzo, S.

2016-09-01

Thin planar pixel modules are promising candidates to instrument the inner layers of the new ATLAS pixel detector for HL-LHC, thanks to the reduced contribution to the material budget and their high charge collection efficiency after irradiation. 100-200 μm thick sensors, interconnected to FE-I4 read-out chips, have been characterized with radioactive sources and beam tests at the CERN-SPS and DESY. The results of these measurements are reported for devices before and after irradiation up to a fluence of 14 ×1015 neq /cm2 . The charge collection and tracking efficiency of the different sensor thicknesses are compared. The outlook for future planar pixel sensor production is discussed, with a focus on sensor design with the pixel pitches (50×50 and 25×100 μm2) foreseen for the RD53 Collaboration read-out chip in 65 nm CMOS technology. An optimization of the biasing structures in the pixel cells is required to avoid the hit efficiency loss presently observed in the punch-through region after irradiation. For this purpose the performance of different layouts have been compared in FE-I4 compatible sensors at various fluence levels by using beam test data. Highly segmented sensors will represent a challenge for the tracking in the forward region of the pixel system at HL-LHC. In order to reproduce the performance of 50×50 μm2 pixels at high pseudo-rapidity values, FE-I4 compatible planar pixel sensors have been studied before and after irradiation in beam tests at high incidence angle (80°) with respect to the short pixel direction. Results on cluster shapes, charge collection and hit efficiency will be shown.

Swept Mechanism of Micro-Milling Tool Geometry Effect on Machined Oxygen Free High Conductivity Copper (OFHC) Surface Roughness

PubMed Central

Shi, Zhenyu; Liu, Zhanqiang; Li, Yuchao; Qiao, Yang

2017-01-01

Cutting tool geometry should be very much considered in micro-cutting because it has a significant effect on the topography and accuracy of the machined surface, particularly considering the uncut chip thickness is comparable to the cutting edge radius. The objective of this paper was to clarify the influence of the mechanism of the cutting tool geometry on the surface topography in the micro-milling process. Four different cutting tools including two two-fluted end milling tools with different helix angles of 15° and 30° cutting tools, as well as two three-fluted end milling tools with different helix angles of 15° and 30° were investigated by combining theoretical modeling analysis with experimental research. The tool geometry was mathematically modeled through coordinate translation and transformation to make all three cutting edges at the cutting tool tip into the same coordinate system. Swept mechanisms, minimum uncut chip thickness, and cutting tool run-out were considered on modeling surface roughness parameters (the height of surface roughness Rz and average surface roughness Ra) based on the established mathematical model. A set of cutting experiments was carried out using four different shaped cutting tools. It was found that the sweeping volume of the cutting tool increases with the decrease of both the cutting tool helix angle and the flute number. Great coarse machined surface roughness and more non-uniform surface topography are generated when the sweeping volume increases. The outcome of this research should bring about new methodologies for micro-end milling tool design and manufacturing. The machined surface roughness can be improved by appropriately selecting the tool geometrical parameters. PMID:28772479

3D on-chip microscopy of optically cleared tissue

NASA Astrophysics Data System (ADS)

Zhang, Yibo; Shin, Yoonjung; Sung, Kevin; Yang, Sam; Chen, Harrison; Wang, Hongda; Teng, Da; Rivenson, Yair; Kulkarni, Rajan P.; Ozcan, Aydogan

2018-02-01

Traditional pathology relies on tissue biopsy, micro-sectioning, immunohistochemistry and microscopic imaging, which are relatively expensive and labor-intensive, and therefore are less accessible in resource-limited areas. Low-cost tissue clearing techniques, such as the simplified CLARITY method (SCM), are promising to potentially reduce the cost of disease diagnosis by providing 3D imaging and phenotyping of thicker tissue samples with simpler preparation steps. However, the mainstream imaging approach for cleared tissue, fluorescence microscopy, suffers from high-cost, photobleaching and signal fading. As an alternative approach to fluorescence, here we demonstrate 3D imaging of SCMcleared tissue using on-chip holography, which is based on pixel-super-resolution and multi-height phase recovery algorithms to digitally compute the sample's amplitude and phase images at various z-slices/depths through the sample. The tissue clearing procedures and the lens-free imaging system were jointly optimized to find the best illumination wavelength, tissue thickness, staining solution pH, and the number of hologram heights to maximize the imaged tissue volume, minimize the amount of acquired data, while maintaining a high contrast-to-noise ratio for the imaged cells. After this optimization, we achieved 3D imaging of a 200-μm thick cleared mouse brain tissue over a field-of-view of <20mm2 , and the resulting 3D z-stack agrees well with the images acquired with a scanning lens-based microscope (20× 0.75NA). Moreover, the lens-free microscope achieves an order-of-magnitude better data efficiency compared to its lens-based counterparts for volumetric imaging of samples. The presented low-cost and high-throughput lens-free tissue imaging technique enabled by CLARITY can be used in various biomedical applications in low-resource-settings.

Flight Qualified Micro Sun Sensor

NASA Technical Reports Server (NTRS)

Liebe, Carl Christian; Mobasser, Sohrab; Wrigley, Chris; Schroeder, Jeffrey; Bae, Youngsam; Naegle, James; Katanyoutanant, Sunant; Jerebets, Sergei; Schatzel, Donald; Lee, Choonsup

2007-01-01

A prototype small, lightweight micro Sun sensor (MSS) has been flight qualified as part of the attitude-determination system of a spacecraft or for Mars surface operations. The MSS has previously been reported at a very early stage of development in NASA Tech Briefs, Vol. 28, No. 1 (January 2004). An MSS is essentially a miniature multiple-pinhole electronic camera combined with digital processing electronics that functions analogously to a sundial. A micromachined mask containing a number of microscopic pinholes is mounted in front of an active-pixel sensor (APS). Electronic circuits for controlling the operation of the APS, readout from the pixel photodetectors, and analog-to-digital conversion are all integrated onto the same chip along with the APS. The digital processing includes computation of the centroids of the pinhole Sun images on the APS. The spacecraft computer has the task of converting the Sun centroids into Sun angles utilizing a calibration polynomial. The micromachined mask comprises a 500-micron-thick silicon wafer, onto which is deposited a 57-nm-thick chromium adhesion- promotion layer followed by a 200-nm-thick gold light-absorption layer. The pinholes, 50 microns in diameter, are formed in the gold layer by photolithography. The chromium layer is thin enough to be penetrable by an amount of Sunlight adequate to form measurable pinhole images. A spacer frame between the mask and the APS maintains a gap of .1 mm between the pinhole plane and the photodetector plane of the APS. To minimize data volume, mass, and power consumption, the digital processing of the APS readouts takes place in a single field-programmable gate array (FPGA). The particular FPGA is a radiation- tolerant unit that contains .32,000 gates. No external memory is used so the FPGA calculates the centroids in real time as pixels are read off the APS with minimal internal memory. To enable the MSS to fit into a small package, the APS, the FPGA, and other components are mounted on a single two-sided board following chip-on-board design practices

Volcanic Centers of the Northern McCullough Range, Southern Nevada USA: a View of Pre- Extensional Volcanism in the Colorado River Extensional Corridor

NASA Astrophysics Data System (ADS)

Honn, D. K.; Johnsen, R.; Smith, E. I.

2007-05-01

The northern McCullough Range, just south of Las Vegas, Nevada, is being developed by the US Bureau of Land Management as the Sloan Canyon National Conservation Area to preserve its natural history. Compared to adjacent ranges, the northern McCullough Range was relatively undeformed by Miocene extension in the Colorado River Extensional Corridor. Therefore, the well preserved volcanic centers within the McCullough Range provide an excellent opportunity to study pre-extensional volcanism. There are at least seven volcanic centers in the northern McCullough Range; this study focuses on the Cactus Hill, McCullough Wash, and Eldorado Valley Volcanoes in the central McCullough Range, and the Henderson Caldera in the northern McCullough Range. The Cactus Hill volcano is a 200 m thick section of flows and agglomerates that form a broad basalt-andesite cone, nearly 2 km in diameter. This cone is cut by two (2-3 m wide) basalt dikes and at least 8 dacite domes. Each of the domes is associated with a broad debris apron. The McCullough Wash volcano is composed of at least 6 dacite domes and carapace breccias that reflect periods of dome growth and collapse. The Eldorado Valley Volcano, another series of dacite domes and flows, is the source of a 250 m thick breccia unit (Eldorado Valley breccia). The breccia is a block and ash deposit (with beds up to 1.5 m thick) containing spectacular blocks (1 cm - 3 m in diameter) and bombs (10 cm - 6 m in diameter) that are interbedded with flows from the McCullough Wash and Cactus Hill volcanoes. Interbedding of dacite breccia of the Eldorado Valley Volcano with dacitic, andesitic and basaltic dome debris from the Cactus Hill volcano reflect coeval mafic and felsic volcanism. The Henderson caldera at the northern tip of the McCullough Range is formed by a arc of domes that erupted a series of biotite dacite flows. The caldera is also filled by domes and flows of hornblende andesite, ash-flow tuff and mesobreccia deposits. The tuff of the Henderson caldera (~20 m thick) grades from a pumice poor base to a pumice rich top and contains lithic fragments of andesite that reflect the explosive truncation of the central McCullough Range stratovolcano (2500 to 3000 m thick section of andesite flows). Mesobreccia occurs along the southern margin of the caldera and contains andesite clasts (< 25 cm) within a matrix of the tuff of the Henderson caldera. The ongoing study the volcanic centers of the McCullough Range provide geologic data for the development of the Sloan Canyon National Conservation Area as well as providing insight into the evolution of the Colorado River extensional corridor.

Hot embossed polyethylene through-hole chips for bead-based microfluidic devices

PubMed Central

Chou, Jie; Du, Nan; Ou, Tina; Floriano, Pierre N.; Christodoulides, Nicolaos; McDevitt, John T.

2013-01-01

Over the past decade, there has been a growth of interest in the translation of microfluidic systems into real-world clinical practice, especially for use in point-of-care or near patient settings. While initial fabrication advances in microfluidics involved mainly the etching of silicon and glass, the economics of scaling of these materials is not amendable for point-of-care usage where single-test applications forces cost considerations to be kept low and throughput high. As such, a materials base more consistent with point-of-care needs is required. In this manuscript, the fabrication of a hot embossed, through-hole low-density polyethylene ensembles derived from an anisotropically etched silicon wafer is discussed. This semi-opaque polymer that can be easily sterilized and recycled provides low background noise for fluorescence measurements and yields more affordable cost than other thermoplastics commonly used for microfluidic applications such as cyclic olefin copolymer (COC). To fabrication through-hole microchips from this alternative material for microfluidics, a fabrication technique that uses a high-temperature, high-pressure resistant mold is described. This aluminum-based epoxy mold, serving as the positive master mold for embossing, is casted over etched arrays of pyramidal pits in a silicon wafer. Methods of surface treatment of the wafer prior to casting and PDMS casting of the epoxy are discussed to preserve the silicon wafer for future use. Changes in the thickness of polyethylene are observed for varying embossing temperatures. The methodology described herein can quickly fabricate 20 disposable, single use chips in less than 30 minutes with the ability to scale up 4x by using multiple molds simultaneously. When coupled as a platform supporting porous bead sensors, as in the recently developed Programmable Bio-Nano-Chip, this bead chip system can achieve limits of detection, for the cardiac biomarker C-reactive protein, of 0.3 ng/mL, thereby demonstrating the approach is compatible with high performance, real-world clinical measurements in the context of point-of-care testing. PMID:23183187

A beta-ray spectrometer based on a two-or three silicon detector coincidence telescope

NASA Astrophysics Data System (ADS)

Horowitz, Y. S.; Weizman, Y.; Hirning, C. R.

1996-02-01

This report describes the operation of a beta-ray energy spectrometer based on a silicon detector telescope using two or three elements. The front detector is a planar, totally-depleted, silicon surface barrier detector that is 97 μm thick, the back detector is a room-temperature, lithium compensated, silicon detector that is 5000 μm thick, and the intermediate detector is similar to the front detector but 72 μm thick and intended to be used only in intense photon fields. The three detectors are mounted in a light-tight aluminum housing. The capability of the spectrometer to reject photons is based upon the fact that the incident photon will have a small probability of simultaneously losing detectable energy in two detectors, and an even smaller probability of losing detectable energy in all three detectors. Electrons will, however, almost always record measurable events in either the front two or all three detectors. A coincidence requirement between the detectors thus rejects photon induced events. With a 97 μm thick detector the lower energy coincidence threshold is approximately 110 keV. With an ultra-thin 40 μm thick front detector, and operated at 15°C, the spectrometer is capable of detecting even 60-70 keV electrons with a coincidence efficiency of 60%. The spectrometer has been used to measure beta radiation fields in CANDU reactor working environments, and the spectral information is intended to support dose algorithms for the LiF TLD chips used in the Ontario Hydro dosimetry program.

On hydrophilicity improvement of the porous anodic alumina film by hybrid nano/micro structuring

NASA Astrophysics Data System (ADS)

Wang, Weichao; Zhao, Wei; Wang, Kaige; Wang, Lei; Wang, Xuewen; Wang, Shuang; Zhang, Chen; Bai, Jintao

2017-09-01

In both, laboratory and industry, tremendous attention is paid to discover an effective technique to produce uniform, controllable and (super) hydrophilic surfaces over large areas that are useful in a wide range of applications. In this investigation, by combing porous anodic alumina (PAA) film with nano-structures and microarray of aluminum, the hydrophilicity of hybrid nano-micro structure has been significantly improved. It is found some factors can affect the hydrophilicity of film, such as the size and aspect ratio of microarray, the thickness of nano-PAA film etc. Comparing with pure nano-PAA films and microarray, the hybrid nano-micro structure can provide uniform surface with significantly better hydrophilicity. The improvement can be up to 84%. Also, this technique exhibits good stability and repeatability for industrial production. By optimizing the thickness of nano-PAA film and aspect ratio of micro-structures, super-hydrophilicity can be reached. This study has obvious prospect in the fields of chemical industry, biomedical engineering and lab-on-a-chip applications.

High bandwidth piezoresistive force probes with integrated thermal actuation

PubMed Central

Doll, Joseph C.; Pruitt, Beth L.

2012-01-01

We present high-speed force probes with on-chip actuation and sensing for the measurement of pN-scale forces at the microsecond time scale. We achieve a high resonant frequency in water (1–100 kHz) with requisite low spring constants (0.3–40 pN/nm) and low integrated force noise (1–100 pN) by targeting probe dimensions on the order of 300 nm thick, 1–2 μm wide and 30–200 μm long. Forces are measured using silicon piezoresistors while the probes are actuated thermally with an aluminum unimorph and silicon heater. The piezoresistive sensors are designed using open source numerical optimization code that incorporates constraints on operating temperature. Parylene passivation enables operation in ionic media and we demonstrate simultaneous actuation and sensing. The improved design and fabrication techniques that we describe enable a 10–20 fold improvement in force resolution or measurement bandwidth over prior piezoresistive cantilevers of comparable thickness. PMID:23175616

Modified Y-TZP Core Design Improves All-ceramic Crown Reliability

PubMed Central

Silva, N.R.F.A.; Bonfante, E.A.; Rafferty, B.T.; Zavanelli, R.A.; Rekow, E.D.; Thompson, V.P.; Coelho, P.G.

2011-01-01

This study tested the hypothesis that all-ceramic core-veneer system crown reliability is improved by modification of the core design. We modeled a tooth preparation by reducing the height of proximal walls by 1.5 mm and the occlusal surface by 2.0 mm. The CAD-based tooth preparation was replicated and positioned in a dental articulator for core and veneer fabrication. Standard (0.5 mm uniform thickness) and modified (2.5 mm height lingual and proximal cervical areas) core designs were produced, followed by the application of veneer porcelain for a total thickness of 1.5 mm. The crowns were cemented to 30-day-aged composite dies and were either single-load-to-failure or step-stress-accelerated fatigue-tested. Use of level probability plots showed significantly higher reliability for the modified core design group. The fatigue fracture modes were veneer chipping not exposing the core for the standard group, and exposing the veneer core interface for the modified group. PMID:21057036

Micromachined Thin-Film Sensors for SOI-CMOS Co-Integration

NASA Astrophysics Data System (ADS)

Laconte, Jean; Flandre, D.; Raskin, Jean-Pierre

Co-integration of sensors with their associated electronics on a single silicon chip may provide many significant benefits regarding performance, reliability, miniaturization and process simplicity without significantly increasing the total cost. Micromachined Thin-Film Sensors for SOI-CMOS Co-integration covers the challenges and interests and demonstrates the successful co-integration of gas flow sensors on dielectric membrane, with their associated electronics, in CMOS-SOI technology. We firstly investigate the extraction of residual stress in thin layers and in their stacking and the release, in post-processing, of a 1 μm-thick robust and flat dielectric multilayered membrane using Tetramethyl Ammonium Hydroxide (TMAH) silicon micromachining solution.

In vivo thermoluminescence dosimetry for total body irradiation.

PubMed

Palkosková, P; Hlavata, H; Dvorák, P; Novotný, J; Novotný, J

2002-01-01

An improvement in the clinical results obtained using total body irradiation (TBI) with photon beams requires precise TBI treatment planning, reproducible irradiation, precise in vivo dosimetry, accurate documentation and careful evaluation. In vivo dosimetry using LiF Harshaw TLD-100 chips was used during the TBI treatments performed in our department. The results of in vivo thermoluminescence dosimetry (TLD) show that using TLD measurements and interactive adjustment of some treatment parameters based on these measurements, like monitor unit calculations, lung shielding thickness and patient positioning, it is possible to achieve high precision in absorbed dose delivery (less than 0.5%) as well as in homogeneity of irradiation (less than 6%).

Electrowetting of soap bubbles

NASA Astrophysics Data System (ADS)

Arscott, Steve

2013-07-01

A proof-of-concept demonstration of the electrowetting-on-dielectric of a sessile soap bubble is reported here. The bubbles are generated using a commercial soap bubble mixture—the surfaces are composed of highly doped, commercial silicon wafers covered with nanometer thick films of Teflon®. Voltages less than 40 V are sufficient to observe the modification of the bubble shape and the apparent bubble contact angle. Such observations open the way to inter alia the possibility of bubble-transport, as opposed to droplet-transport, in fluidic microsystems (e.g., laboratory-on-a-chip)—the potential gains in terms of volume, speed, and surface/volume ratio are non-negligible.

A collimated detection system for assessing leakage dose from medical linear accelerators at the patient plane.

PubMed

Lonski, P; Taylor, M L; Franich, R D; Kron, T

2014-03-01

Leakage radiation from linear accelerators can make a significant contribution to healthy tissue dose in patients undergoing radiotherapy. In this work thermoluminescent dosimeters (LiF:Mg,Cu,P TLD chips) were used in a focused lead cone loaded with TLD chips for the purpose of evaluating leakage dose at the patient plane. By placing the TLDs at one end of a stereotactic cone, a focused measurement device is created; this was tested both in and out of the primary beam of a Varian 21-iX linac using 6 MV photons. Acrylic build up material of 1.2 cm thickness was used inside the cone and measurements made with either one or three TLD chips at a given distance from the target. Comparing the readings of three dosimeters in one plane inside the cone offered information regarding the orientation of the cone relative to a radiation source. Measurements in the patient plane with the linac gantry at various angles demonstrated that leakage dose was approximately 0.01% of the primary beam out of field when the cone was pointed directly towards the target and 0.0025% elsewhere (due to scatter within the gantry). No specific 'hot spots' (e.g., insufficient shielding or gaps at abutments) were observed. Focused cone measurements facilitate leakage dose measurements from the linac head directly at the patient plane and allow one to infer the fraction of leakage due to 'direct' photons (along the ray-path from the bremsstrahlung target) and that due to scattered photons.

Permeabilization assay for antimicrobial peptides based on pore-spanning lipid membranes on nanoporous alumina.

PubMed

Neubacher, Henrik; Mey, Ingo; Carnarius, Christian; Lazzara, Thomas D; Steinem, Claudia

2014-04-29

Screening tools to study antimicrobial peptides (AMPs) with the aim to optimize therapeutic delivery vectors require automated and parallelized sampling based on chip technology. Here, we present the development of a chip-based assay that allows for the investigation of the action of AMPs on planar lipid membranes in a time-resolved manner by fluorescence readout. Anodic aluminum oxide (AAO) composed of cylindrical pores with a diameter of 70 nm and a thickness of up to 10 μm was used as a support to generate pore-spanning lipid bilayers from giant unilamellar vesicle spreading, which resulted in large continuous membrane patches sealing the pores. Because AAO is optically transparent, fluid single lipid bilayers and the underlying pore cavities can be readily observed by three-dimensional confocal laser scanning microscopy (CLSM). To assay the membrane permeabilizing activity of the AMPs, the translocation of the water-soluble dyes into the AAO cavities and the fluorescence of the sulforhodamine 101 1,2-dihexadecanoyl-sn-glycero-3-phosphoethanol-l-amine triethylammonium salt (Texas Red DHPE)-labeled lipid membrane were observed by CLSM in a time-resolved manner as a function of the AMP concentration. The effect of two different AMPs, magainin-2 and melittin, was investigated, showing that the concentrations required for membrane permeabilization and the kinetics of the dye entrance differ significantly. Our results are discussed in light of the proposed permeabilization models of the two AMPs. The presented data demonstrate the potential of this setup for the development of an on-chip screening platform for AMPs.

Vacuum packaging of InGaAs focal plane array with four-stage thermoelectric cooler

NASA Astrophysics Data System (ADS)

Mo, De-feng; Liu, Da-fu; Yang, Li-yi; Xu, Qin-fei; Li, Xue

2013-09-01

The InGaAs focal plane array (FPA) detectors, covering the near-infrared 1~2.4 μm wavelength range, have been developed for application in space-based spectroscopy of the Earth atmosphere. This paper shows an all-metal vacuum package design for area array InGaAs detector of 1024×64 pixels, and its architecture will be given. Four-stage thermoelectric cooler (TEC) is used to cool down the FPA chip. To acquire high heat dissipation for TEC's Joule-heat, tungsten copper (CuW80) and kovar (4J29) is used as motherboard and cavity material respectively which joined by brazing. The heat loss including conduction, convection and radiation is analyzed. Finite element model is established to analyze the temperature uniformity of the chip substrate which is made of aluminum nitride (AlN). The performance of The TEC with and without heat load in vacuum condition is tested. The results show that the heat load has little influence to current-voltage relationship of TEC. The temperature difference (ΔT) increases as the input current increases. A linear relationship exists between heat load and ΔT of the TEC. Theoretical analysis and calculation show that the heat loss of radiation and conduction is about 187 mW and 82 mW respectively. Considering the Joule-heat of readout circuit and the heat loss of radiation and conduction, the FPA for a 220 K operation at room temperature can be achieved. As the thickness of AlN chip substrate is thicker than 1 millimeter, the temperature difference can be less than 0.3 K.

Section 1: Interfacial reactions and grain growth in ferroelectric SrBi{sub 2}Ta{sub 2}O (SBT) thin films on Si substrates

DOE Office of Scientific and Technical Information (OSTI.GOV)

Dickerson, B.D.; Zhang, X.; Desu, S.B.

1997-04-01

Much of the cost of traditional infrared cameras based on narrow-bandgap photoelectric semiconductors comes from the cryogenic cooling systems required to achieve high detectivity. Detectivity is inversely proportional to noise. Generation-recombination noise in photoelectric detectors increases roughly exponentially with temperature, but thermal noise in photoelectric detectors increases only linearly with temperature. Therefore `thermal detectors perform far better at room temperature than 8-14 {mu}m photon detectors.` Although potentially more affordable, uncooled pyroelectric cameras are less sensitive than cryogenic photoelectric cameras. One way to improve the sensitivity to cost ratio is to deposit ferroelectric pixels with good electrical properties directly on mass-produced,more » image-processing chips. `Good` properties include a strong temperature dependence of the remanent polarization, P{sub r}, or the relative dielectric constant, {epsilon}{sub r}, for sensitive operation in pyroelectric or dielectric mode, respectively, below or above the Curie temperature, which is 320 C for SBT. When incident infrared radiation is chopped, small oscillations in pixel temperature produce pyroelectric or dielectric alternating currents. The sensitivity of ferroelectric thermal detectors depends strongly on pixel microstructure, since P{sub r} and {epsilon}{sub r} increase with grain size during annealing. To manufacture SBT pixels on Si chips, acceptable SBT grain growth must be achieved at the lowest possible oxygen annealing temperature, to avoid damaging the Si chip below. Therefore current technical progress describes how grain size, reaction layer thickness, and electrical properties develop during the annealing of SBT pixels deposited on Si.« less

Fault imprint in clay units: magnetic fabric, structural and mineralogical signature

NASA Astrophysics Data System (ADS)

Moreno, Eva; Homberg, Catherine; Schnyder, Johann; Person, Alain; du Peloux1, Arthur; Dick, Pierre

2014-05-01

Fault-induced deformations in clay units can be difficult to decipher because strain markers are not always visible at outcrop scale or using geophysical methods. Previous studies have indicated that the anisotropy of magnetic susceptibility (ASM) provides a powerful and rapid technique to investigate tectonic deformation in clay units even when they appear quite homogenous and undeformed at the outcrop scale (Lee et al. 1990, Mattei et al. 1997). We report here a study based on ASM, structural analysis and magnetic and clay mineralogy from two boreholes (TF1 and ASM1)drilled horizontally in the Experimental Station of Tournemire of the Institute for Radiological Protection and Nuclear Safety (IRSN) in Aveyron (France). The boreholes intersect a N-S trending strike-slip fault from west to east. The ASM study indicates the evolution of the magnetic fabric from the undeformed host rock to the fault core. Also, all the fractures cutting the studied interval of the core have been measured as well as the slip vectors which are generally well preserved. In the two boreholes, the undeformed sediments outside the fault zone are characterized by an oblate fabric, a sub-vertical minimum susceptibility axis (k3) perpendicular to the bedding plane and without magnetic lineation. Within the fault zone, a tilt in the bedding plane has been observed in two boreholes TF1 and ASM1. In addition, in the TF1 core, the fault area presents a tectonic fabric characterized by a triaxial AMS ellipsoid. Moreover, the magnetic lineation increases and k3 switches from a vertical to a sub-horizontal plane. This kind of fabric has not been observed in borehole ASM1. The structural analysis of the individual fractures making the fault zone indicates a complex tectonic history with different imprint in the two fault segments cut by the two boreholes. The large majority of fractures correspond to dextral strike-slip faults but normal and reverse movements were observed and are more or less frequent depending on the borehole. Notably, many fractures are low angle faults (dip<45°) and may bear both strike-slip or normal striae. The mineralogical study based on X-ray diffraction analysis, have pointed out some variations in clay minerals associations nearby the deformed zones that may be the result of fluid circulation along the fault system which is in agreement with the presence of goethite determined by low magnetic temperature measurements. This multi-proxi study, combining ASM, petrostructural and mineralogical approaches has highlighted the heterogeneity of the fault, but also its past role as a drain to fluid circulation.

An integrated eddy current detection and imaging system on a silicon chip

NASA Technical Reports Server (NTRS)

Henderson, H. Thurman; Kartalia, K. P.; Dury, Joseph D.

1991-01-01

Eddy current probes have been used for many years for numerous sensing applications including crack detection in metals. However, these applications have traditionally used the eddy current effect in the form of a physically wound single or different probe pairs which of necessity must be made quite large compared to microelectronics dimensions. Also, the traditional wound probe can only take a point reading, although that point might include tens of individual cracks or crack arrays; thus, conventional eddy current probes are beset by two major problems: (1) no detailed information can be obtained about the crack or crack array; and (2) for applications such as quality assurance, a vast amount of time must be taken to scan a complete surface. Laboratory efforts have been made to fabricate linear arrays of single turn probes in a thick film format on a ceramic substrate as well as in a flexible cable format; however, such efforts inherently suffer from relatively large size requirements as well as sensitivity issues. Preliminary efforts to fully extend eddy current probing from a point or single dimensional level to a two dimensional micro-eddy current format on a silicon chip, which might overcome all of the above problems, are presented.

Dose estimation of eye lens for interventional procedures in diagnosis

NASA Astrophysics Data System (ADS)

Liu, Yu-Rong; Huang, Chia-Yu; Hsu, Ching-Han; Hsu, Fang-Yuh

2017-11-01

The International Commission on Radiological Protection (ICRP) recommended that the equivalent dose limit for the lens of the eye be decreased from 150 mSv/y (ICRP, 2007) to 20 mSv/y averaged over five years (ICRP, 2011). How to accurately measure the eye-lens dose has, therefore, been an issue of interest recently. Interventional radiologists are at a higher risk of radiation-induced eye injury, such as cataracts, than all other occupational radiation workers. The main objective of this study is to investigate the relationship between the doses to the eye lenses of interventional radiologists measured by different commercial eye-lens dosimeters. This study measured a reference eye-lens dose, which involved placing thermoluminescent dosimeter (TLD) chips at the surface of the eye of the Rando Phantom, and the TLD chips were covered by a 3-mm-thick tissue-equivalent bolus. Commercial eye-lens dosimeters, such as a headband dosimeter and standard personnel dose badges, were placed at the positions recommended by the manufacturers. The results show that the personnel dose badge is not an appropriate dosimeter for evaluating eye-lens dose. Dose deviations for different dosimeters are discussed and presented in this study.

Optimized acoustic biochip integrated with microfluidics for biomarkers detection in molecular diagnostics.

PubMed

Papadakis, G; Friedt, J M; Eck, M; Rabus, D; Jobst, G; Gizeli, E

2017-09-01

The development of integrated platforms incorporating an acoustic device as the detection element requires addressing simultaneously several challenges of technological and scientific nature. The present work was focused on the design of a microfluidic module, which, combined with a dual or array type Love wave acoustic chip could be applied to biomedical applications and molecular diagnostics. Based on a systematic study we optimized the mechanics of the flow cell attachment and the sealing material so that fluidic interfacing/encapsulation would impose minimal losses to the acoustic wave. We have also investigated combinations of operating frequencies with waveguide materials and thicknesses for maximum sensitivity during the detection of protein and DNA biomarkers. Within our investigations neutravidin was used as a model protein biomarker and unpurified PCR amplified Salmonella DNA as the model genetic target. Our results clearly indicate the need for experimental verification of the optimum engineering and analytical parameters, in order to develop commercially viable systems for integrated analysis. The good reproducibility of the signal together with the ability of the array biochip to detect multiple samples hold promise for the future use of the integrated system in a Lab-on-a-Chip platform for application to molecular diagnostics.

Human Brain Organoids on a Chip Reveal the Physics of Folding.

PubMed

Karzbrun, Eyal; Kshirsagar, Aditya; Cohen, Sidney R; Hanna, Jacob H; Reiner, Orly

2018-05-01

Human brain wrinkling has been implicated in neurodevelopmental disorders and yet its origins remain unknown. Polymer gel models suggest that wrinkling emerges spontaneously due to compression forces arising during differential swelling, but these ideas have not been tested in a living system. Here, we report the appearance of surface wrinkles during the in vitro development and self-organization of human brain organoids in a micro-fabricated compartment that supports in situ imaging over a timescale of weeks. We observe the emergence of convolutions at a critical cell density and maximal nuclear strain, which are indicative of a mechanical instability. We identify two opposing forces contributing to differential growth: cytoskeletal contraction at the organoid core and cell-cycle-dependent nuclear expansion at the organoid perimeter. The wrinkling wavelength exhibits linear scaling with tissue thickness, consistent with balanced bending and stretching energies. Lissencephalic (smooth brain) organoids display reduced convolutions, modified scaling and a reduced elastic modulus. Although the mechanism here does not include the neuronal migration seen in in vivo , it models the physics of the folding brain remarkably well. Our on-chip approach offers a means for studying the emergent properties of organoid development, with implications for the embryonic human brain.

Human brain organoids on a chip reveal the physics of folding

NASA Astrophysics Data System (ADS)

Karzbrun, Eyal; Kshirsagar, Aditya; Cohen, Sidney R.; Hanna, Jacob H.; Reiner, Orly

2018-05-01

Human brain wrinkling has been implicated in neurodevelopmental disorders and yet its origins remain unknown. Polymer gel models suggest that wrinkling emerges spontaneously due to compression forces arising during differential swelling, but these ideas have not been tested in a living system. Here, we report the appearance of surface wrinkles during the in vitro development and self-organization of human brain organoids in a microfabricated compartment that supports in situ imaging over a timescale of weeks. We observe the emergence of convolutions at a critical cell density and maximal nuclear strain, which are indicative of a mechanical instability. We identify two opposing forces contributing to differential growth: cytoskeletal contraction at the organoid core and cell-cycle-dependent nuclear expansion at the organoid perimeter. The wrinkling wavelength exhibits linear scaling with tissue thickness, consistent with balanced bending and stretching energies. Lissencephalic (smooth brain) organoids display reduced convolutions, modified scaling and a reduced elastic modulus. Although the mechanism here does not include the neuronal migration seen in vivo, it models the physics of the folding brain remarkably well. Our on-chip approach offers a means for studying the emergent properties of organoid development, with implications for the embryonic human brain.

SU-E-I-24: Design and Fabrication of a Multi-Functional Neck and Thyroid Phantom for Medical Dosimetry and Calibration

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mehdizadeh, S; Sina, S; Karimipourfard, M

Purpose: The purpose of this study is the design and fabrication of a multipurpose anthropomorphic neck and thyroid phantom for use in medical applications (i.e. quality control of images in nuclear medicine, and dosimetry). Methods: The designed neck phantom is composed of seven elliptic cylindrical slices with semi-major axis of 14 and semi-minor axis of 12.5 cm, each having the thickness of 2cm. Thyroid gland, bony part of the neck, and the wind pipe were also built inside the neck phantom. Results: The phantom contains some removable plugs,inside and at its surface to accommodate the TLD chips with different shapesmore » and dimensions, (i.e. rod, cylindrical and cubical TLD chips)for the purpose of medical dosimetry (i.e. in radiology, radiotherapy, and nuclear medicine). For the purpose of quality control of images in nuclear medicine, the removable thyroid gland was built to accommodate the radioactive iodine. The female and male thyroid glands were built in two sizes separately. Conclusion: The designed phantom is a multi-functional phantom which is applicable for dosimetry in diagnostic radiology, radiotherapy, and quality control of images in nuclear medicine.« less

[Fatigue damage analysis of porcelain in all-ceramic crowns].

PubMed

Liu, Yi-hong; Feng, Hai-lan; Liu, Guang-hua; Shen, Zhi-jian

2010-02-18

To investigate the fatigue damage mechanism of porcelain, and its relation with the microscopic defects in clinically failed all-ceramic crowns. Collecting the bilayered all-ceramic crowns failed in vivo. The fractured surfaces and occlusial surfaces of failed crowns were examined by an optical microscope followed by detailed fractography investigations using a field emission scanning electron microscope. When chemical impurities were of concern, energy-dispersive X-ray spectroscopy analysis was performed to examine chemical composition. A standard practice for fractography failure analysis of advanced ceramics is applied to disclose the fracture mode, and damage character. Three types of fracture features are defined as breakdown of the entire crown, and porcelain chipping-off/delamination. Alumina crowns were usually characterized by breakdown of the entire crown, while zirconia crowns by porcelain chipping-off and delamination. The fatigue damage of porcelain was classified into surface wear, cone crack, and porcelain delamination. The observed microscopic defects in this study included air bubbles and impurity particles. The multi-point occlusial contacts were recommended in all-ceramic restorations clinically. The thickness of porcelain is important for the anti-fatigue ability of porcelain. Cautions have to be taken to avoid contaminations during the veneering processes.

A Wirelessly Powered Smart Contact Lens with Reconfigurable Wide Range and Tunable Sensitivity Sensor Readout Circuitry

PubMed Central

Chiou, Jin-Chern; Hsu, Shun-Hsi; Huang, Yu-Chieh; Yeh, Guan-Ting; Liou, Wei-Ting; Kuei, Cheng-Kai

2017-01-01

This study presented a wireless smart contact lens system that was composed of a reconfigurable capacitive sensor interface circuitry and wirelessly powered radio-frequency identification (RFID) addressable system for sensor control and data communication. In order to improve compliance and reduce user discomfort, a capacitive sensor was embedded on a soft contact lens of 200 μm thickness using commercially available bio-compatible lens material and a standard manufacturing process. The results indicated that the reconfigurable sensor interface achieved sensitivity and baseline tuning up to 120 pF while consuming only 110 μW power. The range and sensitivity tuning of the readout circuitry ensured a reliable operation with respect to sensor fabrication variations and independent calibration of the sensor baseline for individuals. The on-chip voltage scaling allowed the further extension of the detection range and prevented the implementation of large on-chip elements. The on-lens system enabled the detection of capacitive variation caused by pressure changes in the range of 2.25 to 30 mmHg and hydration level variation from a distance of 1 cm using incident power from an RFID reader at 26.5 dBm. PMID:28067859

Drying performance of fermented cassava (fercaf) using a convective multiple flash dryer

NASA Astrophysics Data System (ADS)

Handojo, Lienda A.; Zefanya, Samuel; Christanto, Yohanes

2017-05-01

Fermented cassava (fercaf) is a tropical versatile carbohydrate source flour which is produced by modifying the characteristics of cassava. Drying process is one of the processes that could influence the quality of fercaf. In general, for food application, convective and vacuum drying were used, however recently another advanced method using combination of both convective and vacuum, i.e. convective multiple flash drying (CMFD), was proposed. This method is conducted by repeating cycles of convective and vacuum drying in intermittent manner. Cassava chips with thickness of 0.1-0.2 cm were fermented for 24 hours at room condition. Then, the drying process was conducted by using 3 techniques, i.e. convective, vacuum, and combined method (CMFD), with operation temperatures between 50 and 70°C for 10 hours or until fermented cassava reached a moisture content of less than 20%. The study shows that CMFD was the fastest drying method with only 5-6 hours period compared to 8-10 hours using vacuum and more than 10 hours using convective method. CMFD also produces harder fercaf chips than those of vacuum and convective methods. Moreover, this research also proves that the operating pressure and temperature influence the moisture content.

Multi-wavelength transceiver integration on SOI for high-performance computing system applications

NASA Astrophysics Data System (ADS)

Aalto, Timo; Harjanne, Mikko; Ylinen, Sami; Kapulainen, Markku; Vehmas, Tapani; Cherchi, Matteo; Neumeyr, Christian; Ortsiefer, Markus; Malacarne, Antonio

2015-03-01

We present a vision for transceiver integration on a 3 μm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 μm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 μm thick SOI waveguides locally tapered down to 3 μm to provide low-loss coupling between an optical single-mode fiber array and the 3 μm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 μm.

Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors.

PubMed

Malinowski, Pawel E; Georgitzikis, Epimitheas; Maes, Jorick; Vamvaka, Ioanna; Frazzica, Fortunato; Van Olmen, Jan; De Moor, Piet; Heremans, Paul; Hens, Zeger; Cheyns, David

2017-12-10

Imaging in the infrared wavelength range has been fundamental in scientific, military and surveillance applications. Currently, it is a crucial enabler of new industries such as autonomous mobility (for obstacle detection), augmented reality (for eye tracking) and biometrics. Ubiquitous deployment of infrared cameras (on a scale similar to visible cameras) is however prevented by high manufacturing cost and low resolution related to the need of using image sensors based on flip-chip hybridization. One way to enable monolithic integration is by replacing expensive, small-scale III-V-based detector chips with narrow bandgap thin-films compatible with 8- and 12-inch full-wafer processing. This work describes a CMOS-compatible pixel stack based on lead sulfide quantum dots (PbS QD) with tunable absorption peak. Photodiode with a 150-nm thick absorber in an inverted architecture shows dark current of 10 -6 A/cm² at -2 V reverse bias and EQE above 20% at 1440 nm wavelength. Optical modeling for top illumination architecture can improve the contact transparency to 70%. Additional cooling (193 K) can improve the sensitivity to 60 dB. This stack can be integrated on a CMOS ROIC, enabling order-of-magnitude cost reduction for infrared sensors.

Large area thinned planar sensors for future high-luminosity-LHC upgrades

NASA Astrophysics Data System (ADS)

Wittig, T.; Lawerenz, A.; Röder, R.

2016-12-01

Planar hybrid silicon sensors are a well proven technology for past and current particle tracking detectors in HEP experiments. However, the future high-luminosity upgrades of the inner trackers at the LHC experiments pose big challenges to the detectors. A first challenge is an expected radiation damage level of up to 2ṡ 1016 neq/cm2. For planar sensors, one way to counteract the charge loss and thus increase the radiation hardness is to decrease the thickness of their active area. A second challenge is the large detector area which has to be built as cost-efficient as possible. The CiS research institute has accomplished a proof-of-principle run with n-in-p ATLAS-Pixel sensors in which a cavity is etched to the sensor's back side to reduce its thickness. One advantage of this technology is the fact that thick frames remain at the sensor edges and guarantee mechanical stability on wafer level while the sensor is left on the resulting thin membrane. For this cavity etching technique, no handling wafers are required which represents a benefit in terms of process effort and cost savings. The membranes with areas of up to ~ 4 × 4 cm2 and thicknesses of 100 and 150 μm feature a sufficiently good homogeneity across the whole wafer area. The processed pixel sensors show good electrical behaviour with an excellent yield for a suchlike prototype run. First sensors with electroless Ni- and Pt-UBM are already successfully assembled with read-out chips.

Thin film type 248-nm bottom antireflective coatings

NASA Astrophysics Data System (ADS)

Enomoto, Tomoyuki; Nakayama, Keisuke; Mizusawa, Kenichi; Nakajima, Yasuyuki; Yoon, Sangwoong; Kim, Yong-Hoon; Kim, Young-Ho; Chung, Hoesik; Chon, Sang Mun

2003-06-01

A frequent problem encountered by photoresists during the manufacturing of semiconductor device is that activating radiation is reflected back into the photoresist by the substrate. So, it is necessary that the light reflection is reduced from the substrate. One approach to reduce the light reflection is the use of bottom anti-reflective coating (BARC) applied to the substrate beneath the photoresist layer. The BARC technology has been utilized for a few years to minimize the reflectivity. As the chip size is reduced to sub 0.13-micron, the photoresist thickness has to decrease with the aspect ratio being less than 3.0. Therefore, new Organic BARC is strongly required which has the minimum reflectivity with thinner BARC thickness and higher etch selectivity towards resist. SAMSUNG Electronics has developed the advanced Organic BARC with Nissan Chemical Industries, Ltd. and Brewer Science, Inc. for achieving the above purpose. As a result, the suitable high performance SNAC2002 series KrF Organic BARCs were developed. Using CF4 gas as etchant, the plasma etch rate of SNAC2002 series is about 1.4 times higher than that of conventional KrF resists and 1.25 times higher than the existing product. The SNAC2002 series can minimize the substrate reflectivity at below 40nm BARC thickness, shows excellent litho performance and coating properties.

Optimization of 248nm bottom anti-reflective coatings with thin film and high etch rate on real device

NASA Astrophysics Data System (ADS)

Kim, MyoungSoo; Kim, HakJoon; Shim, KewChan; Jeon, JeHa; Gil, MyungGoon; Song, YongWook; Enomoto, Tomoyuki; Sakaguchi, Takahiro; Nakajima, Yasuyuki

2005-05-01

A frequent problem encountered by photoresists during the manufacturing of semiconductor device is that activating radiation is reflected back into the photoresist by the substrate. So, it is necessary that the light reflection is reduced from the substrate. One approach to reduce the light reflection is the use of bottom anti-reflective coating (BARC) applied to the substrate beneath the photoresist layer. The BARC technology has been utilized for a few years to minimize the reflectivity. As the chip size is reduced to sub 100nm, the photoresist thickness has to decrease with the aspect ratio being less than 3.0. Therefore, new Organic BARC is strongly required which has the minimum reflectivity with thinner BARC thickness and higher etch selectivity toward resists. Hynix Semiconductor Inc., Nissan Chemical Industries, Ltd., and Brewer Science, Inc. have developed the advanced Organic BARC for achieving the above purpose. As a result, the suitable high performance 248nm Organic BARCs, NCA series, were achieved. Using CF4 gas as etchant, the plasma etch rate of NCA series is about 1.4 times higher than that of conventional 248nm resists. NCA series can be minimizing the substrate reflectivity at below 45nm BARC thickness. NCA series show the excellent litho performance and coating property on real device.

Ultimate scaling of TiN/ZrO2/TiN capacitors: Leakage currents and limitations due to electrode roughness

NASA Astrophysics Data System (ADS)

Jegert, Gunther; Kersch, Alfred; Weinreich, Wenke; Lugli, Paolo

2011-01-01

In this paper, we investigate the influence of electrode roughness on the leakage current in TiN/high-κ ZrO2/TiN (TZT) thin-film capacitors which are used in dynamic random access memory cells. Based on a microscopic transport model, which is expanded to incorporate electrode roughness, we assess the ultimate scaling potential of TZT capacitors in terms of equivalent oxide thickness, film smoothness, thickness fluctuations, defect density and distribution, and conduction band offset (CBO). The model is based on three-dimensional, fully self-consistent, kinetic Monte Carlo transport simulations. Tunneling transport in the bandgap of the dielectric is treated, which includes defect-assisted transport mechanisms. Electrode roughness is described in the framework of fractal geometry. While the short-range roughness of the electrodes is found not to influence significantly the leakage current, thickness fluctuations of the dielectric have a major impact. For thinner dielectric films they cause a transformation of the dominant transport mechanism from Poole-Frenkel conduction to trap-assisted tunneling. Consequently, the sensitivity of the leakage current on electrode roughness drastically increases on downscaling. Based on the simulations, optimization of the CBO is suggested as the most viable strategy to extend the scalability of TZT capacitors over the next chip generations.

Seismic stratigraphy and late Quaternary shelf history, south-central Monterey Bay, California

USGS Publications Warehouse

Chin, J.L.; Clifton, H.E.; Mullins, H.T.

1988-01-01

The south-central Monterey Bay shelf is a high-energy, wave-dominated, tectonically active coastal region on the central California continental margin. A prominent feature of this shelf is a sediment lobe off the mouth of the Salinas River that has surface expression. High-resolution seismic-reflection profiles reveal that an angular unconformity (Quaternary?) underlies the entire shelf and separates undeformed strata above it from deformed strata below it. The Salinas River lobe is a convex bulge on the shelf covering an area of approximately 72 km2 in water depths from 10 to 90 m. It reaches a maximum thickness of 35 m about 2.5 km seaward of the river mouth and thins in all directions away from this point. Adjacent shelf areas are characterized by only a thin (2 to 5 m thick) and uniform veneer of sediment. Acoustic stratigraphy of the lobe is complex and is characterized by at least three unconformity-bounded depositional sequences. Acoustically, these sequences are relatively well bedded. Acoustic foresets occur within the intermediate sequence and dip seaward at 0.7?? to 2.0??. Comparison with sedimentary sequences in uplifted onshore Pleistocene marine-terrace deposits of the Monterey Bay area, which were presumably formed in a similar setting under similar processes, suggests that a general interpretation can be formulated for seismic stratigraphic patterns. Depositional sequences are interpreted to represent shallowing-upwards progradational sequences of marine to nonmarine coastal deposits formed during interglacial highstands and/or during early stages of falling sea level. Acoustic foresets within the intermediate sequence are evidence of seaward progradation. Acoustic unconformities that separate depositional sequences are interpreted as having formed largely by shoreface planation and may be the only record of the intervening transgressions. The internal stratigraphy of the Salinas River lobe thus suggests that at least several late Quaternary regressions and transgressions may be recorded under the present shelf. This record may represent the last major eustatic cycle of sea level, an interval not observed in uplifted onshore Pleistocene marine terraces. ?? 1988.

Homogeneous Yang-Baxter deformations as generalized diffeomorphisms

NASA Astrophysics Data System (ADS)

Sakamoto, Jun-ichi; Sakatani, Yuho; Yoshida, Kentaroh

2017-10-01

Yang-Baxter (YB) deformations of string sigma model provide deformed target spaces. We propose that homogeneous YB deformations always lead to a certain class of β-twisted backgrounds and represent the bosonic part of the supergravity fields in terms of the classical r-matrix associated with the YB deformation. We then show that various β-twisted backgrounds can be realized by considering generalized diffeomorphisms in the undeformed background. Our result extends the notable relation between the YB deformations and (non-commuting) TsT transformations. We also discuss more general deformations beyond the YB deformations.

Effect of thermal noise on vesicles and capsules in shear flow.

PubMed

Abreu, David; Seifert, Udo

2012-07-01

We add thermal noise consistently to reduced models of undeformable vesicles and capsules in shear flow and derive analytically the corresponding stochastic equations of motion. We calculate the steady-state probability distribution function and construct the corresponding phase diagrams for the different dynamical regimes. For fluid vesicles, we predict that at small shear rates thermal fluctuations induce a tumbling motion for any viscosity contrast. For elastic capsules, due to thermal mixing, an intermittent regime appears in regions where deterministic models predict only pure tank treading or tumbling.

Effect of the mass center shift for force-free flexible spacecraft

NASA Technical Reports Server (NTRS)

Meirovitch, L.; Juang, J.-N.

1975-01-01

For a spinning flexible spacecraft the mass center generally shifts relative to the nominal undeformed position. It is thought that this shift of center complicates spacecraft stability analysis. It is proved, on the basis of results achieved by Meirovitch and Calico (1972), that for the general class of force-free single-spin flexible spacecraft it is possible to ignore this shift of center without affecting the stability criteria in any significant way. A new theorem on inequalities for quadratic forms is proved to demonstrate the validity of the stability analysis.

Cosmogenic Radionuclides in Recently Fallen Chondrites Mihonoseki and Tahara

NASA Astrophysics Data System (ADS)

Shima, M.; Honda, M.; Yabuki, S.; Takahashi, K.

1993-07-01

Introduction: The chondrite Mihonoseki, L6, 6.38 kg, fell on December 10, 1992 [1]. The other chondrite, Tahara, fell on March 26, 1991, on the deck of car- carrier ship, M.S. Century-Highway No.1 of Kawasaki Kisen Kaisha Ltd., anchored at T-3 berth of Toyota Pier, at Toyohashi harbor, in Tahara-Center, Toyota Motor Corp., Tahara-machi, Atsumi-gun, Aichi-ken, Japan. Although the total mass is estimated to be more than 5 kg, only several fragments were recovered by crews. In fact, this was recognized by the event of Mihonoseki. Tahara was classified as H5 [2]. Gamma-Ray Counting: With whole mass of Mihonoseki, nondestructive gamma-ray countings started on December 15, 1992, using a pure Ge detector (ORTEC), 45 mm x 39 mm, horizontal type. Data collections were performed every day in the beginning and later about every week through February 3, 1993. A sample chamber was shielded with 15-cm-thick lead, 6-cm-thick iron, and 0.5-cm-thick plastic plates. For Tahara, another set (Canberra), 44 mm x 42 mm, coaxial type, was used. The 420-g fragment was mounted in the sample chamber shielded with 15-cm-thick lead, 2-cm-thick iron, 2-cm-thick copper, and 2-cm-thick plastic plates. The counting started in January 1993. The counting efficiencies for gamma rays as a function of energy, ranging between 122 keV (57Co) and 1809 keV (26Al), have been determined using three different standards. A mixed standard solution of nine-species gamma-ray emitters, QCY-44, reference time 12:00 GMT on February 1, 1993, was supplied from Amersham, England. The solution was dropped onto (1) chips of Al-foil, (2) chips of filter paper, or (3) olivine sand. Those standards were mixed thoroughly with mock materials, fine and coarse olivine sand and iron powder, and reagent KCl, standard for 40K, then filled into mock shells of Mihonoseki and Tahara, which were made of hard plastic and aluminum foil with epoxy resin, respectively. For Tahara, mocks with all three types of standards were examined for comparison, while for Mihonoseki only (3) was used. The difficulty was to prepare a suitable mock sample having the same density as chondrites 3.5. Especially for a large sample like Mihonoseki, even when we use about equal fractions of olivine sand and metallic iron, the weight of the mock was about 80%, and when we intend to obtain heavier than 90%, we have to use a larger portion of metallic iron, which causes some reductions in the efficiencies of 20-30%, depending on energies. Results: The contents of 14 gamma emitters were studied as shown in the Table (which appears in the hard copy). Errors quoted are only from counting statistics. The most striking may be to learn that Mihonoseki contains a very low level of 60Co; the content is lower than 1 dpm/kg, which could not be determined accurately by a current-direct gamma counting. This reflects the smaller preatmospheric size of the body, and consistent with other observations such as 22Ne/21Ne = 1.180 [1] and lower activity levels of general products such as 46 dpm 26Al/kg, which is about three-fourths of a common level among L chondrites. Besides, relatively high 56Co in respect to 58Co is also noticed in Mihonoseki. References: [1] Shima M. et al.(1993) LPSC XXIV 1297-1298. [2] Shima M. et al.(1993) Meteoritical Bull., in press.

Microstructural and petrophysical characterization of a "structurally oversimplified" fault zone in poorly lithified sands: evidence for a coseismic rupture?

NASA Astrophysics Data System (ADS)

Balsamo, Fabrizio; Storti, Fabrizio

2010-05-01

We studied an extensional fault zone developed in poorly lithified, quartz-rich high porosity sandy sediments of the seismically active Crotone basin (southern Italy). The fault zone cuts across interlayered fine- to coarse-grained sands and consists of a cm-thick, discrete fault core embedded in virtually undeformed wall sediments. Consequently, it can be described as "structurally oversimplified" due to the lack of footwall and hanging wall damage zones. We acquired microstructural, grain size, grain shape, porosity, mineralogical and permeability data to investigate the influence of initial sedimentological characteristics of sands on the final faulted granular products and related hydrologic properties. Faulting evolves by a general grain size and porosity reduction with a combination of intragranular fracturing, spalling, and flaking of grain edges, irrespective of grain mineralogy. The dominance of cataclasis, also confirmed by fractal dimensions >2.6, is generally not expected at a deformation depth <1 km. Coarse-grained sand shows a much higher comminution intensity, grain shape variations and permeability drop than fine-grained sands. This is because coarser aggregates have (i) fewer grain-to-grain contacts for a given area, which results in higher stress concentration at contact points, and (ii) a higher probability of pre-existing intragranular microstructural defects that result in a lower grain strength. The peculiar structural architecture, the dominance of cataclasis over non-destructive particulate flow, and the compositional variations of clay minerals in the fault core, strongly suggest that the studied fault zone developed by a coseismic rupture.

On fault evidence for a large earthquake in the late fifteenth century, Eastern Kunlun fault, China

NASA Astrophysics Data System (ADS)

Junlong, Zhang

2017-11-01

The EW-trending Kunlun Fault System (KFS) is one of the major left-lateral strike-slip faults on the Tibetan Plateau. It forms the northern boundary of the Bayan Har block. Heretofore, no evidence has been provided for the most recent event (MRE) of the 70-km-long eastern section of the KFS. The studied area is located in the north of the Zoige Basin (northwest Sichuan province) and was recognized by field mapping. Several trenches were excavated and revealed evidence of repeated events in late Holocene. The fault zone is characterized by a distinct 30-60-cm-thick clay fault gouge layer juxtaposing the hanging wall bedrock over unconsolidated late Holocene footwall colluvium and alluvium. The fault zone, hanging wall, and footwall were conformably overlain by undeformed post-MRE deposits. Samples of charred organic material were obtained from the top of the faulted sediments and the base of the unfaulted sediments. Modeling of the age of samples, earthquake yielded a calibrated 2σ radiocarbon age of A.D. 1489 ± 82. Combined with the historical earthquake record, the MRE is dated at A.D. 1488. Based on the over 50 km-long surface rupture, the magnitude of this event is nearly M w 7.0. Our data suggests that a 200-km-long seismic gap could be further divided into the Luocha and Maqu sections. For the last 1000 years, the Maqu section has been inactive, and hence, it is likely that the end of its seismic cycle is approaching, and that there is a potentially significant seismic hazard in eastern Tibet.

Carboniferous and older carbonate rocks: Lithofacies, extent, and reservoir quality: Chapter CC in The oil and gas resource potential of the Arctic National Wildlife Refuge 1002 area, Alaska

USGS Publications Warehouse

Dumoulin, Julie A.

1999-01-01

Carboniferous and older carbonate rocks are potential hydrocarbon reservoir facies for four plays in the 1002 area of the Arctic National Wildlife Refuge. These rocks include several units in the pre-Carboniferous basement and the Carboniferous Lisburne Group. Data from exploratory wells west of the 1002 area, outcrops south of the 1002 area, seismic lines, and well logs are synthesized herein to infer carbonate lithofacies, extent, and reservoir character beneath the northeastern Arctic coastal plain.A chiefly shallow-water basement carbonate succession of Late Proterozoic through Early Devonian age (Katakturuk Dolomite, Nanook Limestone, and Mount Copleston Limestone) is interpreted to be present beneath much of the south-central 1002 area; it reaches 3,700 m thick in outcrop and is the primary reservoir for the Deformed Franklinian Play. A more heterogeneous lithologic assemblage of uncertain age forms basement in the northwestern part of the 1002 area; well data define three subunits that contain carbonate intervals 5- 50 m thick. These strata are prospective reservoirs for the Undeformed Franklinian Play and could also be reservoirs for the Niguanak- Aurora Play. Regional lithologic correlations suggest a Cambrian-Late Proterozoic(?) age for subunits one and two, and a slightly younger, later Cambrian-Silurian age for subunit three. Seismic and well data indicate that subunit one overlies subunit two and is overlain by subunit three. The Mississippian and Pennsylvanian Lisburne Group, a predominantly carbonate platform succession as much as 1 km thick, is projected beneath the southernmost part of the 1002 area and is a potential reservoir for the Ellesmerian Thrust-belt and Niguanak-Aurora Plays.Carbonate rocks in the 1002 area probably retain little primary porosity but may have locally well developed secondary porosity. Measured reservoir parameters in basement carbonate strata are low (porosity generally ≤ 5%; permeability ≤ 0.2 md) but drill-stem tests found locally reasonable flow rates (4,220-4,800 bpd) and, in the Flaxman Island area, recovered gas and condensate from these rocks. The Lisburne Group has produced up to 50,000 bbl of oil/ day from the Lisburne field at Prudhoe Bay. Reservoir parameters of the Lisburne in northeastern Alaska range from low (porosities ≤ 5% in most limestones) to good (porosities average 6.5-10% in some dolostones). Reservoir quality in Carboniferous and older carbonate strata in the 1002 area should be greatest where these rocks are highly fractured and (or) truncated by the Lower Cretaceous Unconformity.

The Las Matras tonalitic trondhjemitic pluton, central Argentina: Grenvillian-age constraints, geochemical characteristics, and regional implications

NASA Astrophysics Data System (ADS)

Sato, A. M.; Tickyj, H.; Llambías, E. J.; Sato, K.

2000-12-01

The N-S trending belt with Grenvillian-age rocks developed in central western Argentina represents the basement of an allochthonous terrane derived from Laurentia during the Early Paleozoic. The Las Matras pluton (36°46‧S, 67°07‧W) is located at the southern extension of this belt in the Las Matras Block. It consists of a low-Al tonalitic to trondhjemitic facies characteristic of an arc magmatism. Isotopic studies yielded Grenvillian Rb-Sr (1212±47 Ma) and Sm-Nd (1188±47 Ma) ages which, due to the undeformed and non-metamorphosed character of the pluton, are interpreted to represent a crystallization age of around 1200 Ma. Although this age is slightly older than available dates from other exposures of the same belt, and the undeformed feature is also distinctive for Las Matras, the depleted Sr and Nd isotopic signatures of the pluton agree with those from other magmatic rocks involved in that belt. The differences found between Las Matras and the northern exposures indicate that this belt with Grenvillian-age rocks comprises regions of non-homogeneous evolution. Although the correlation of the Lower Paleozoic platform carbonates from the sedimentary cover of the Grenvillian-age basement rocks suggests the surroundings of the Southern Grenville Province (Texas and northern Mexico) as the probable detachment site for the Argentine belt, comparison of magmatic and tectonic processes involved in these basement rocks does not indicate similar evolutions. This fact can suggest an independent evolution of the Argentine belt prior to amalgamation to the Laurentian Grenville orogen.

Narrow-band tunable terahertz emission from ferrimagnetic Mn{sub 3-x}Ga thin films

DOE Office of Scientific and Technical Information (OSTI.GOV)

Awari, N.; University of Groningen, 9747 AG Groningen; Kovalev, S., E-mail: s.kovalev@hzdr.de, E-mail: c.fowley@hzdr.de, E-mail: rodek@tcd.ie

2016-07-18

Narrow-band terahertz emission from coherently excited spin precession in metallic ferrimagnetic Mn{sub 3-x}Ga Heusler alloy nanofilms has been observed. The efficiency of the emission, per nanometer film thickness, is comparable or higher than that of classical laser-driven terahertz sources based on optical rectification. The center frequency of the emission from the films can be tuned precisely via the film composition in the range of 0.20–0.35 THz, making this type of metallic film a candidate for efficient on-chip terahertz emitters. Terahertz emission spectroscopy is furthermore shown to be a sensitive probe of magnetic properties of ultra-thin films.

Thermal transpiration in zeolites: A mechanism for motionless gas pumps

NASA Astrophysics Data System (ADS)

Gupta, Naveen K.; Gianchandani, Yogesh B.

2008-11-01

We explore the use of a naturally occurring zeolite, clinoptilolite, for a chip-scale, thermal transpiration-based gas pump. The nanopores in clinoptilolite enable the required free-molecular flow, even at atmospheric pressure. The pump utilizes a foil heater located between zeolite disks in a plastic package. A 2.3mm thick zeolite disk generates a typical gas flow rate of 6.6×10-3 cc/min-cm2 with an input power of <300mW/cm2. The performance is constrained by imperfections in clinoptilolite, which provide estimated leakage apertures of 10.2-13.5μm/cm2 of flow cross section. The transient response of the pump is studied to quantify nonidealities.

A nanoforest structure for practical surface-enhanced Raman scattering substrates

NASA Astrophysics Data System (ADS)

Seol, Myeong-Lok; Choi, Sung-Jin; Baek, David J.; Park, Tae Jung; Ahn, Jae-Hyuk; Lee, Sang Yup; Choi, Yang-Kyu

2012-03-01

A nanoforest structure for surface-enhanced Raman scattering (SERS) active substrates is fabricated and analyzed. The detailed morphology of the resulting structure can be easily controlled by modifying the process parameters such as initial gold layer thickness and etching time. The applicability of the nanoforest substrate as a label-free SERS immunosensor is demonstrated using influenza A virus subtype H1N1. Selective binding of the H1N1 surface antigen and the anti-H1 antibody is directly detected by the SERS signal differences. Simple fabrication and high throughput with strong in-plane hot-spots imply that the nanoforest structure can be a practical sensing component of a chip-based SERS sensing system.

Development of a RadFET Linear Array for Intracavitary in vivo Dosimetry During External Beam Radiotherapy and Brachytherapy

NASA Astrophysics Data System (ADS)

Price, R. A.; Benson, C.; Joyce, M. J.; Rodgers, K.

2004-08-01

We present the details of a new linear array dosimeter consisting of a chain of semiconductors mounted on an ultra-thin (50 /spl mu/m thick) flexible substrate and housed in an intracavitary catheter. The semiconductors, manufactured by NMRC Cork, have not been packaging and incorporate a passivation layer that allows them to be mounted on the substrate using flip-chip-bonding. This paper reports, for the first time, the construction of a multiple (ten) detector array suited to in vivo dosimetry in the rectum, esophagus and vagina during external beam radiotherapy, as well as being adaptable to in vivo dosimetry during brachytherapy and diagnostic radiology.

Study of the Vibration Effect on the Cutting Forces and Roughness of Slub Milling

NASA Astrophysics Data System (ADS)

Germa, S.; Estrems Amestoy, M.; Sánchez Reinoso, H. T.; Franco Chumillas, P.

2009-11-01

For the planning process of slab milling operations, the vibration of the tool is the main factor to be considered. Under vibration conditions, the effect of the small displacements of the cutting tool and the cutting forces on the chip thickness must be minimized in order to avoid undesirable consequences, such as the fast flank wear, superficial defects and roughness increase. In this work, a mathematical model is developed to take into account the combined effect of the cutting tool and workpiece oscillation, as well as the axial errors of different milling tool tips. As a result, the model estimates the variation of the cutting forces and the ideal surface roughness.

Optofluidic technology for monitoring rotifer Brachionus calyciflorus responses to regular light pulses

NASA Astrophysics Data System (ADS)

Cartlidge, Rhys; Campana, Olivia; Nugegoda, Dayanthi; Wlodkowic, Donald

2016-12-01

Behavioural alterations can occur as a result of a toxicant exposure at concentrations significantly lower than lethal effects that are commonly measured in acute toxicity testing. The use of alternating light and dark photoperiods to test phototactic responses of aquatic invertebrates in the presence of environmental contaminants provides an attractive analytical avenue. Quantification of phototactic responses represents a sublethal endpoint that can be employed as an early warning signal. Despite the benefits associated with the assessment of these endpoints, there is currently a lack of automated and miniaturized bioanalytical technologies to implement the development of toxicity testing with small aquatic species. In this study we present a proof-of-concept microfluidic Lab-on-a-Chip (LOC) platform for the assessment of rotifer swimming behavior in the presence of the toxicant copper sulfate. The device was designed to assess impact of toxicants at sub-lethal concentrations on freshwater crustacean Brachionus calyciflorus, testing behavioral endpoints such as animal swimming distance, speed and acceleration. The LOC device presented in this work enabled straightforward caging of microscopic crustaceans as well as non-invasive analysis of rapidly swimming animals in a focal plane of a video-microscopy system. The chip-based technology was fabricated using a new photolithography method that enabled formation of thick photoresist layers with minimal distortion. Photoresist molds were then employed for replica molding of LOC devices with poly(dimethylsiloxane) (PDMS) elastomer. The complete bioanalytical system consisted of: (i) microfluidic PDMS chip-based device; (ii) peristaltic microperfusion pumping manifold; (iii) miniaturized CMOS camera for video data acquisition; and (iv) video analysis software algorithms for quantification of changes in swimming behaviour of B. calyciflorus in response to reference toxicants.

Optofluidic bioimaging platform for quantitative phase imaging of lab on a chip devices using digital holographic microscopy.

PubMed

Pandiyan, Vimal Prabhu; John, Renu

2016-01-20

We propose a versatile 3D phase-imaging microscope platform for real-time imaging of optomicrofluidic devices based on the principle of digital holographic microscopy (DHM). Lab-on-chip microfluidic devices fabricated on transparent polydimethylsiloxane (PDMS) and glass substrates have attained wide popularity in biological sensing applications. However, monitoring, visualization, and characterization of microfluidic devices, microfluidic flows, and the biochemical kinetics happening in these devices is difficult due to the lack of proper techniques for real-time imaging and analysis. The traditional bright-field microscopic techniques fail in imaging applications, as the microfluidic channels and the fluids carrying biological samples are transparent and not visible in bright light. Phase-based microscopy techniques that can image the phase of the microfluidic channel and changes in refractive indices due to the fluids and biological samples present in the channel are ideal for imaging the fluid flow dynamics in a microfluidic channel at high resolutions. This paper demonstrates three-dimensional imaging of a microfluidic device with nanometric depth precisions and high SNR. We demonstrate imaging of microelectrodes of nanometric thickness patterned on glass substrate and the microfluidic channel. Three-dimensional imaging of a transparent PDMS optomicrofluidic channel, fluid flow, and live yeast cell flow in this channel has been demonstrated using DHM. We also quantify the average velocity of fluid flow through the channel. In comparison to any conventional bright-field microscope, the 3D depth information in the images illustrated in this work carry much information about the biological system under observation. The results demonstrated in this paper prove the high potential of DHM in imaging optofluidic devices; detection of pathogens, cells, and bioanalytes on lab-on-chip devices; and in studying microfluidic dynamics in real time based on phase changes.

Thick resist for MEMS processing

NASA Astrophysics Data System (ADS)

Brown, Joe; Hamel, Clifford

2001-11-01

The need for technical innovation is always present in today's economy. Microfabrication methods have evolved in support of the demand for smaller and faster integrated circuits with price performance improvements always in the scope of the manufacturing design engineer. The dispersion of processing technology spans well beyond IC fabrication today with batch fabrication and wafer scale processing lending advantages to MEMES applications from biotechnology to consumer electronics from oil exploration to aerospace. Today the demand for innovative processing techniques that enable technology is apparent where only a few years ago appeared too costly or not reliable. In high volume applications where yield and cost improvements are measured in fractions of a percent it is imperative to have process technologies that produce consistent results. Only a few years ago thick resist coatings were limited to thickness less than 20 microns. Factors such as uniformity, edge bead and multiple coatings made high volume production impossible. New developments in photoresist formulation combined with advanced coating equipment techniques that closely controls process parameters have enable thick photoresist coatings of 70 microns with acceptable uniformity and edge bead in one pass. Packaging of microelectronic and micromechanical devices is often a significant cost factor and a reliability issue for high volume low cost production. Technologies such as flip- chip assembly provide a solution for cost and reliability improvements over wire bond techniques. The processing for such technology demands dimensional control and presents a significant cost savings if it were compatible with mainstream technologies. Thick photoresist layers, with good sidewall control would allow wafer-bumping technologies to penetrate the barriers to yield and production where costs for technology are the overriding issue. Single pass processing is paramount to the manufacturability of packaging technology. Uniformity and edge bead control defined the success of process implementation. Today advanced packaging solutions are created with thick photoresist coatings. The techniques and results will be presented.

Eruption Depths, Magma Storage and Magma Degassing at Sumisu Caldera, Izu-Bonin Arc: Evidence from Glasses and Melt Inclusions

NASA Astrophysics Data System (ADS)

Johnson, E. R.

2015-12-01

Island arc volcanoes can become submarine during cataclysmal caldera collapse. The passage of a volcanic vent from atmospheric to under water environment involves complex modifications of the eruption style and subsequent transport of the pyroclasts. Here, we use FTIR measurements of the volatile contents of glass and melt inclusions in the juvenile pumice clasts in the Sumisu basin and its surroundings (Izu-Bonin arc) to investigate changes in eruption depths, magma storage and degassing over time. This study is based on legacy cores from ODP 126, where numerous unconsolidated (<65 ka), extremely thick (few m to >250 m), massive to normally graded pumice lapilli-tuffs were recovered over four cores (788C, 790A, 790B and 791A). Glass and clast geochemistry indicate the submarine Sumisu caldera as the source of several of these pumice lapilli-tuffs. Glass chips and melt inclusions from these samples were analyzed using FTIR for H2O and CO2 contents. Glass chips record variable H2O contents; most chips contain 0.6-1.6 wt% H2O, corresponding to eruption depths of 320-2100 mbsl. Variations in glass H2O and pressure estimates suggest that edifice collapse occurred prior-to or during eruption of the oldest of these samples, and that the edifice may have subsequently grown over time. Sanidine-hosted melt inclusions from two units record variably degassed but H2O-rich melts (1.1-5.6 wt% H2O). The lowest H2O contents overlap with glass chips, consistent with degassing and crystallization of melts until eruption, and the highest H2O contents suggest that large amounts of degassing accompanied likely explosive eruptions. Most inclusions, from both units, contain 2-4 wt% H2O, which further indicates that the magmas crystallized at pressures of ~50-100 MPa, or depths ~400-2800 m below the seafloor. Further glass and melt inclusion analyses, including major element compositions, will elucidate changes in magma storage, degassing and evolution over time.

Subwavelength engineered fiber-to-chip silicon-on-sapphire interconnects for mid-infrared applications (Conference Presentation)

NASA Astrophysics Data System (ADS)

Alonso-Ramos, Carlos; Han, Zhaohong; Le Roux, Xavier; Lin, Hongtao; Singh, Vivek; Lin, Pao Tai; Tan, Dawn; Cassan, Eric; Marris-Morini, Delphine; Vivien, Laurent; Wada, Kazumi; Hu, Juejun; Agarwal, Anuradha; Kimerling, Lionel C.

2016-05-01

The mid-Infrared wavelength range (2-20 µm), so-called fingerprint region, contains the very sharp vibrational and rotational resonances of many chemical and biological substances. Thereby, on-chip absorption-spectrometry-based sensors operating in the mid-Infrared (mid-IR) have the potential to perform high-precision, label-free, real-time detection of multiple target molecules within a single sensor, which makes them an ideal technology for the implementation of lab-on-a-chip devices. Benefiting from the great development realized in the telecom field, silicon photonics is poised to deliver ultra-compact efficient and cost-effective devices fabricated at mass scale. In addition, Si is transparent up to 8 µm wavelength, making it an ideal material for the implementation of high-performance mid-IR photonic circuits. The silicon-on-insulator (SOI) technology, typically used in telecom applications, relies on silicon dioxide as bottom insulator. Unfortunately, silicon dioxide absorbs light beyond 3.6 µm, limiting the usability range of the SOI platform for the mid-IR. Silicon-on-sapphire (SOS) has been proposed as an alternative solution that extends the operability region up to 6 µm (sapphire absorption), while providing a high-index contrast. In this context, surface grating couplers have been proved as an efficient means of injecting and extracting light from mid-IR SOS circuits that obviate the need of cleaving sapphire. However, grating couplers typically have a reduced bandwidth, compared with facet coupling solutions such as inverse or sub-wavelength tapers. This feature limits their feasibility for absorption spectroscopy applications that may require monitoring wide wavelength ranges. Interestingly, sub-wavelength engineering can be used to substantially improve grating coupler bandwidth, as demonstrated in devices operating at telecom wavelengths. Here, we report on the development of fiber-to-chip interconnects to ZrF4 optical fibers and integrated SOS circuits with 500 nm thick Si, operating around 3.8 µm wavelength. Results on facet coupling and sub-wavelength engineered grating coupler solutions in the mid-IR regime will be compared.

Hot embossed polyethylene through-hole chips for bead-based microfluidic devices.

PubMed

Chou, Jie; Du, Nan; Ou, Tina; Floriano, Pierre N; Christodoulides, Nicolaos; McDevitt, John T

2013-04-15

Over the past decade, there has been a growth of interest in the translation of microfluidic systems into real-world clinical practice, especially for use in point-of-care or near patient settings. While initial fabrication advances in microfluidics involved mainly the etching of silicon and glass, the economics of scaling of these materials is not amendable for point-of-care usage where single-test applications force cost considerations to be kept low and throughput high. As such, materials base more consistent with point-of-care needs is required. In this manuscript, the fabrication of a hot embossed, through-hole low-density polyethylene ensembles derived from an anisotropically etched silicon wafer is discussed. This semi-opaque polymer that can be easily sterilized and recycled provides low background noise for fluorescence measurements and yields more affordable cost than other thermoplastics commonly used for microfluidic applications such as cyclic olefin copolymer (COC). To fabrication through-hole microchips from this alternative material for microfluidics, a fabrication technique that uses a high-temperature, high-pressure resistant mold is described. This aluminum-based epoxy mold, serving as the positive master mold for embossing, is casted over etched arrays of pyramidal pits in a silicon wafer. Methods of surface treatment of the wafer prior to casting and PDMS casting of the epoxy are discussed to preserve the silicon wafer for future use. Changes in the thickness of polyethylene are observed for varying embossing temperatures. The methodology described herein can quickly fabricate 20 disposable, single use chips in less than 30 min with the ability to scale up 4 times by using multiple molds simultaneously. When coupled as a platform supporting porous bead sensors, as in the recently developed Programmable Bio-Nano-Chip, this bead chip system can achieve limits of detection, for the cardiac biomarker C-reactive protein, of 0.3 ng/mL, thereby demonstrating that the approach is compatible with high performance, real-world clinical measurements in the context of point-of-care testing. Copyright © 2012 Elsevier B.V. All rights reserved.

Iridium Interfacial Stack - IrIS

NASA Technical Reports Server (NTRS)

Spry, David

2012-01-01

Iridium Interfacial Stack (IrIS) is the sputter deposition of high-purity tantalum silicide (TaSi2-400 nm)/platinum (Pt-200 nm)/iridium (Ir-200 nm)/platinum (Pt-200 nm) in an ultra-high vacuum system followed by a 600 C anneal in nitrogen for 30 minutes. IrIS simultaneously acts as both a bond metal and a diffusion barrier. This bondable metallization that also acts as a diffusion barrier can prevent oxygen from air and gold from the wire-bond from infiltrating silicon carbide (SiC) monolithically integrated circuits (ICs) operating above 500 C in air for over 1,000 hours. This TaSi2/Pt/Ir/Pt metallization is easily bonded for electrical connection to off-chip circuitry and does not require extra anneals or masking steps. There are two ways that IrIS can be used in SiC ICs for applications above 500 C: it can be put directly on a SiC ohmic contact metal, such as Ti, or be used as a bond metal residing on top of an interconnect metal. For simplicity, only the use as a bond metal is discussed. The layer thickness ratio of TaSi2 to the first Pt layer deposited thereon should be 2:1. This will allow Si from the TaSi2 to react with the Pt to form Pt2Si during the 600 C anneal carried out after all layers have been deposited. The Ir layer does not readily form a silicide at 600 C, and thereby prevents the Si from migrating into the top-most Pt layer during future anneals and high-temperature IC operation. The second (i.e., top-most) deposited Pt layer needs to be about 200 nm to enable easy wire bonding. The thickness of 200 nm for Ir was chosen for initial experiments; further optimization of the Ir layer thickness may be possible via further experimentation. Ir itself is not easily wire-bonded because of its hardness and much higher melting point than Pt. Below the iridium layer, the TaSi2 and Pt react and form desired Pt2Si during the post-deposition anneal while above the iridium layer remains pure Pt as desired to facilitate easy and strong wire-bonding to the SiC chip circuitry.

Doping-tunable thermal emission from plasmon polaritons in semiconductor epsilon-near-zero thin films

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jun, Young Chul; Luk, Ting S.; Robert Ellis, A.

2014-09-29

Here, we utilize the unique dispersion properties of leaky plasmon polaritons in epsilon-near-zero (ENZ) thin films to demonstrate thermal radiation control. Owing to its highly flat dispersion above the light line, a thermally excited leaky wave at the ENZ frequency out-couples into free space without any scattering structures, resulting in a narrowband, wide-angle, p-polarized thermal emission spectrum. We demonstrate this idea by measuring angle- and polarization-resolved thermal emission spectra from a single layer of unpatterned, doped semiconductors with deep-subwavelength film thickness (d/λ0 ~ 6 ×10 -3, where d is the film thickness and λ0 is the free space wavelength). Wemore » show that this semiconductor ENZ film effectively works as a leaky wave thermal radiation antenna, which generates far-field radiation from a thermally excited mode. The use of semiconductors makes the radiation frequency highly tunable by controlling doping densities and also facilitates device integration with other components. Therefore, this leaky plasmon polariton emission from semiconductor ENZ films provides an avenue for on-chip control of thermal radiation.« less

Surface Micromachined Silicon Carbide Accelerometers for Gas Turbine Applications

NASA Technical Reports Server (NTRS)

DeAnna, Russell G.

1998-01-01

A finite-element analysis of possible silicon carbide (SIC) folded-beam, lateral-resonating accelerometers is presented. Results include stiffness coefficients, acceleration sensitivities, resonant frequency versus temperature, and proof-mass displacements due to centripetal acceleration of a blade-mounted sensor. The surface micromachined devices, which are similar to the Analog Devices Inc., (Norwood, MA) air-bag crash detector, are etched from 2-pm thick, 3C-SiC films grown at 1600 K using atmospheric pressure chemical vapor deposition (APCVD). The substrate is a 500 gm-thick, (100) silicon wafer. Polysilicon or silicon dioxide is used as a sacrificial layer. The finite element analysis includes temperature-dependent properties, shape change due to volume expansion, and thermal stress caused by differential thermal expansion of the materials. The finite-element results are compared to experimental results for a SiC device of similar, but not identical, geometry. Along with changes in mechanical design, blade-mounted sensors would require on-chip circuitry to cancel displacements due to centripetal acceleration and improve sensitivity and bandwidth. These findings may result in better accelerometer designs for this application.

Synergic combination of the sol–gel method with dip coating for plasmonic devices

PubMed Central

Patrini, Maddalena; Floris, Francesco; Fornasari, Lucia; Pellacani, Paola; Marchesini, Gerardo; Valsesia, Andrea; Artizzu, Flavia; Marongiu, Daniela; Saba, Michele; Marabelli, Franco; Mura, Andrea; Bongiovanni, Giovanni

2015-01-01

Summary Biosensing technologies based on plasmonic nanostructures have recently attracted significant attention due to their small dimensions, low-cost and high sensitivity but are often limited in terms of affinity, selectivity and stability. Consequently, several methods have been employed to functionalize plasmonic surfaces used for detection in order to increase their stability. Herein, a plasmonic surface was modified through a controlled, silica platform, which enables the improvement of the plasmonic-based sensor functionality. The key processing parameters that allow for the fine-tuning of the silica layer thickness on the plasmonic structure were studied. Control of the silica coating thickness was achieved through a combined approach involving sol–gel and dip-coating techniques. The silica films were characterized using spectroscopic ellipsometry, contact angle measurements, atomic force microscopy and dispersive spectroscopy. The effect of the use of silica layers on the optical properties of the plasmonic structures was evaluated. The obtained results show that the silica coating enables surface protection of the plasmonic structures, preserving their stability for an extended time and inducing a suitable reduction of the regeneration time of the chip. PMID:25821692

Phosphor chessboard packaging for white LEDs in high efficiency and high color performance

NASA Astrophysics Data System (ADS)

Nguyen, Quang-Khoi; Chang, Yu-Yu; Lu, Chun-Yan; Yang, Tsung-Hsun; Chung, Te-Yuan; Sun, Ching-Cherng

2016-09-01

We performed the simulation of white LEDs packaging with different chessboard structures of white light converting phosphor layer covered on GaN die chip. Three different types of chessboard structures are called type 1, type 2 and type 3, respectively. The result of investigation according to the phosphor thickness show the increasing of thickness of phosphor layer are, the decreasing of output blue light power are. Meanwhile, the changes of yellow light are neglect. Type 3 shows highest packaging efficiency of 74.3 % compares with packaging efficiency of type 2 and type 1 (72.5 % and 71.3 %, respectively). Type 3 also shows the most effect of forward light. Attention that the type 3 chessboard structure gets packaging efficiency of 74.3 % at color temperature of daylight as well as high saving of phosphor amount. The color temperatures of three types of chessboard structure are higher than 5000 K, so they are suitable for lighting purpose. The angular correlate color temperature deviation (ACCTD) of type 1, type 2 and type 3 are 6500K, 11500K and 17000K, respectively.

Multilevel photonic modules for millimeter-wave phased-array antennas

NASA Astrophysics Data System (ADS)

Paolella, Arthur C.; Bauerle, Athena; Joshi, Abhay M.; Wright, James G.; Coryell, Louis A.

2000-09-01

Millimeter wave phased array systems have antenna element sizes and spacings similar to MMIC chip dimensions by virtue of the operating wavelength. Designing modules in traditional planar packaing techniques are therefore difficult to implement. An advantageous way to maintain a small module footprint compatible with Ka-Band and high frequency systems is to take advantage of two leading edge technologies, opto- electronic integrated circuits (OEICs) and multilevel packaging technology. Under a Phase II SBIR these technologies are combined to form photonic modules for optically controlled millimeter wave phased array antennas. The proposed module, consisting of an OEIC integrated with a planar antenna array will operate on the 40GHz region. The OEIC consists of an InP based dual-depletion PIN photodetector and distributed amplifier. The multi-level module will be fabricated using an enhanced circuit processing thick film process. Since the modules are batch fabricated using an enhanced circuit processing thick film process. Since the modules are batch fabricated, using standard commercial processes, it has the potential to be low cost while maintaining high performance, impacting both military and commercial communications systems.

The study of multilayer anti-reflection coating in InSb focal plane detector

NASA Astrophysics Data System (ADS)

Zheng, Kelin; Wei, Peng; Wang, Liwen; Su, Xianjun; Wang, Haizhen

2016-10-01

In manufacturing of InSb focal plane detector, InSb chip have to be polished from backside to reduce its thickness and then be plated a layer of coating to decrease its reflection (enhance its transmittance) for infrared ray. Moreover, the anti-reflection coating has to be multilayer for more anti-reflection bandwidth. In this article, it is introduced that the optimal design of triple layer λ/4 anti-reflection coating——the anodic oxide, SiNx and MgF2. The best thickness range of each layer and its theoretical reflective index are calculated from simulation software, until the refractive index of each layer has been measured by ellipsometer. And then the transmissivity and reflectivity of the triple layer coating are measured for testing and verifying its performance on the transmittance and reflection. In the end, the anti-reflective effect of the triple layer coating and monolayer SiNx coating are respectively measured and compared by infrared focal plane array measurement system. And it is showed that this triple layer coating achieved more anti-reflection bandwidth and better anti reflective effect.

RFID and Memory Devices Fabricated Integrally on Substrates

NASA Technical Reports Server (NTRS)

Schramm, Harry F.

2004-01-01

Electronic identification devices containing radio-frequency identification (RFID) circuits and antennas would be fabricated integrally with the objects to be identified, according to a proposal. That is to say, the objects to be identified would serve as substrates for the deposition and patterning of the materials of the devices used to identify them, and each identification device would be bonded to the identified object at the molecular level. Vacuum arc vapor deposition (VAVD) is the NASA derived process for depositing layers of material on the substrate. This proposal stands in contrast to the current practice of fabricating RFID and/or memory devices as wafer-based, self-contained integrated-circuit chips that are subsequently embedded in or attached to plastic cards to make smart account-information cards and identification badges. If one relies on such a chip to store data on the history of an object to be tracked and the chip falls off or out of the object, then one loses both the historical data and the means to track the object and verify its identity electronically. Also, in contrast is the manufacturing philosophy in use today to make many memory devices. Today s methods involve many subtractive processes such as etching. This proposal only uses additive methods, building RFID and memory devices from the substrate up in thin layers. VAVD is capable of spraying silicon, copper, and other materials commonly used in electronic devices. The VAVD process sprays most metals and some ceramics. The material being sprayed has a very strong bond with the substrate, whether that substrate is metal, ceramic, or even wood, rock, glass, PVC, or paper. An object to be tagged with an identification device according to the proposal must be compatible with a vacuum deposition process. Temperature is seldom an issue as the substrate rarely reaches 150 F (66 C) during the deposition process. A portion of the surface of the object would be designated as a substrate for the deposition of the device. By use of a vacuum arc vapor deposition apparatus, a thin electrically insulating film would first be deposited on the substrate. Subsequent layers of materials would then be deposited and patterned by use of known integrated-circuit fabrication techniques. The total thickness of the deposited layers could be much less than the 100- m thickness of the thinnest state-of-the-art self-contained microchips. Such a thin deposit could be readily concealed by simply painting over it. Both large vacuum chambers for production runs and portable hand-held devices for in situ applications are available.

Relative inactivity during the last 140,000 years of a portion of the La Paz fault, southern Baja California Sur, Mexico

USGS Publications Warehouse

Szabo, B. J.; Hausback, B.P.; Smith, Joe T.

1990-01-01

Uranium-series dating of corals overlying the undeformed Punta Coyote gravels indicates that the underlying La Paz fault zone has been relatively inactive in this part of the Baja California peninsula during the last 140,000 years, and possibly for a significantly longer period. However, Holocene seismic activities along extensions of the fault zone north of Cabo San Lucas suggest potential seismic hazards for the city of La Paz (population 200,000), which lies about 6 km from the fault. ?? 1990 Springer-Verlag New York Inc.

An air-pressure-free elastomeric valve for integrated nucleic acid analysis by capillary electrophoresis

NASA Astrophysics Data System (ADS)

Jung, Wooseok; Barrett, Matthew; Brooks, Carla; Rivera, Andrew; Birdsell, Dawn N.; Wagner, David M.; Zenhausern, Frederic

2015-12-01

We present a new elastomeric valve for integrated nucleic acid analysis by capillary electrophoresis. The valve functions include metering to capture a designated volume of biological sample into a polymerase chain reaction (PCR) chamber, sealing to preserve the sample during PCR cycling, and transfer of the PCR-products and on-chip formamide post-processing for the analysis of DNA fragments by capillary gel electrophoresis. This new valve differs from prior art polydimethylsiloxane (PDMS) valves in that the valve is not actuated externally by air-pressure or vacuum so that it simplifies a DNA analysis system by eliminating the need for an air-pressure or vacuum source, and off-cartridge solenoid valves, control circuit boards and software. Instead, the new valve is actuated by a thermal cycling peltier assembly integrated within the hardware instrument that tightly comes in contact with a microfluidic cartridge for thermal activation during PCR, so that it spontaneously closes the valve without an additional actuator system. The valve has bumps in the designated locations so that it has a self-alignment that does not require precise alignment of a valve actuator. Moreover, the thickness of the new valve is around 600 μm with an additional bump height of 400 μm so that it is easy to handle and very feasible to fabricate by injection molding compared to other PDMS valves whose thicknesses are around 30-100 μm. The new valve provided over 95% of metering performance in filling the fixed volume of the PCR chamber, preserved over 97% of the sample volume during PCR, and showed very comparable capillary electrophoresis peak heights to the benchtop assay tube controls with very consistent transfer volume of the PCR-product and on-chip formamide. The new valve can perform a core function for integrated nucleic acid analysis by capillary electrophoresis.

Ultra-low fouling and high antibody loading zwitterionic hydrogel coatings for sensing and detection in complex media.

PubMed

Chou, Ying-Nien; Sun, Fang; Hung, Hsiang-Chieh; Jain, Priyesh; Sinclair, Andrew; Zhang, Peng; Bai, Tao; Chang, Yung; Wen, Ten-Chin; Yu, Qiuming; Jiang, Shaoyi

2016-08-01

For surface-based diagnostic devices to achieve reliable biomarker detection in complex media such as blood, preventing nonspecific protein adsorption and incorporating high loading of biorecognition elements are paramount. In this work, a novel method to produce nonfouling zwitterionic hydrogel coatings was developed to achieve these goals. Poly(carboxybetaine acrylamide) (pCBAA) hydrogel thin films (CBHTFs) prepared with a carboxybetaine diacrylamide crosslinker (CBAAX) were coated on gold and silicon dioxide surfaces via a simple spin coating process. The thickness of CBHTFs could be precisely controlled between 15 and 150nm by varying the crosslinker concentration, and the films demonstrated excellent long-term stability. Protein adsorption from undiluted human blood serum onto the CBHTFs was measured with surface plasmon resonance (SPR). Hydrogel thin films greater than 20nm exhibited ultra-low fouling (<5ng/cm(2)). In addition, the CBHTFs were capable of high antibody functionalization for specific biomarker detection without compromising their nonfouling performance. This strategy provides a facile method to modify SPR biosensor chips with an advanced nonfouling material, and can be potentially expanded to a variety of implantable medical devices and diagnostic biosensors. In this work, we developed an approach to realize ultra-low fouling and high ligand loading with a highly-crosslinked, purely zwitterionic, carboxybetaine thin film hydrogel (CBHTF) coating platform. The CBHTF on a hydrophilic surface demonstrated long-term stability. By varying the crosslinker content in the spin-coated hydrogel solution, the thickness of CBHTFs could be precisely controlled. Optimized CBHTFs exhibited ultra-low nonspecific protein adsorption below 5ng/cm(2) measured by a surface plasmon resonance (SPR) sensor, and their 3D architecture allowed antibody loading to reach 693ng/cm(2). This strategy provides a facile method to modify SPR biosensor chips with an advanced nonfouling material, and can be potentially expanded to a variety of implantable medical devices and diagnostic biosensors. Copyright © 2016 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Importance of Thickness in Human Cardiomyocyte Network for Effective Electrophysiological Stimulation Using On-Chip Extracellular Microelectrodes

NASA Astrophysics Data System (ADS)

Hamada, Tomoyo; Nomura, Fumimasa; Kaneko, Tomoyuki; Yasuda, Kenji

2012-06-01

We have developed a three-dimensionally controlled in vitro human cardiomyocyte network assay for the measurements of drug-induced conductivity changes and the appearance of fatal arrhythmia such as ventricular tachycardia/fibrillation for more precise in vitro predictive cardiotoxicity. To construct an artificial conductance propagation model of a human cardiomyocyte network, first, we examined the cell concentration dependence of the cell network heights and found the existence of a height limit of cell networks, which was double-layer height, whereas the cardiomyocytes were effectively and homogeneously cultivated within the microchamber maintaining their spatial distribution constant and their electrophysiological conductance and propagation were successfully recorded using a microelectrode array set on the bottom of the microchamber. The pacing ability of a cardiomyocyte's electrophysiological response has been evaluated using microelectrode extracellular stimulation, and the stimulation for pacing also successfully regulated the beating frequencies of two-layered cardiomyocyte networks, whereas monolayered cardiomyocyte networks were hardly stimulated by the external electrodes using the two-layered cardiomyocyte stimulation condition. The stability of the lined-up shape of human cardiomyocytes within the rectangularly arranged agarose microchambers was limited for a two-layered cardiomyocyte network because their stronger force generation shrunk those cells after peeling off the substrate. The results indicate the importance of fabrication technology of thickness control of cellular networks for effective extracellular stimulation and the potential concerning thick cardiomyocyte networks for long-term cultivation.

Formation of an indium tin oxide nanodot/Ag nanowire electrode as a current spreader for near ultraviolet AlGaN-based light-emitting diodes

NASA Astrophysics Data System (ADS)

Park, Jae-Seong; Kim, Jae-Ho; Kim, Jun-Yong; Kim, Dae-Hyun; Na, Jin-Young; Kim, Sun-Kyung; Kang, Daesung; Seong, Tae-Yeon

2017-01-01

Indium tin oxide (ITO) nanodots (NDs) were combined with Ag nanowires (Ag NWs) as a p-type electrode in near ultraviolet AlGaN-based light-emitting diodes (LEDs) to increase light output power. The Ag NWs were 30 ± 5 nm in diameter and 25 ± 5 μm in length. The transmittance of 10 nm-thick ITO-only was 98% at 385 nm, while the values for ITO ND/Ag NW were 83%-88%. ITO ND/Ag NW films showed lower sheet resistances (32-51 Ω sq-1) than the ITO-only film (950 Ω sq-1). LEDs (chip size: 300 × 800 μm2) fabricated using the ITO NDs/Ag NW electrodes exhibited higher forward-bias voltages (3.52-3.75 V at 20 mA) than the LEDs with the 10 nm-thick ITO-only electrode (3.5 V). The LEDs with ITO ND/Ag NW electrodes yielded a 24%-62% higher light output power (at 20 mA) than those with the 10 nm-thick ITO-only electrode. Furthermore, finite-difference time-domain (FDTD) simulations were performed to investigate the extraction efficiency. Based on the emission images and FDTD simulations, the enhanced light output with the ITO ND/Ag NW electrodes is attributed to improved current spreading and better extraction efficiency.

Preparation of multi-layer film consisting of hydrogen-free DLC and nitrogen-containing DLC for conductive hard coating

NASA Astrophysics Data System (ADS)

Iijima, Yushi; Harigai, Toru; Isono, Ryo; Degai, Satoshi; Tanimoto, Tsuyoshi; Suda, Yoshiyuki; Takikawa, Hirofumi; Yasui, Haruyuki; Kaneko, Satoru; Kunitsugu, Shinsuke; Kamiya, Masao; Taki, Makoto

2018-01-01

Conductive hard-coating films have potential application as protective films for contact pins used in the electrical inspection process for integrated circuit chips. In this study, multi-layer diamond-like carbon (DLC) films were prepared as conductive hard-coating films. The multi-layer DLC films consisting of DLC and nitrogen-containing DLC (N-DLC) film were prepared using a T-shape filtered arc deposition method. Periodic DLC/N-DLC four-layer and eight-layer films had the same film thickness by changing the thickness of each layer. In the ball-on-disk test, the N-DLC mono-layer film showed the highest wear resistance; however, in the spherical polishing method, the eight-layer film showed the highest polishing resistance. The wear and polishing resistance and the aggressiveness against an opponent material of the multi-layer DLC films improved by reducing the thickness of a layer. In multi-layer films, the soft N-DLC layer between hard DLC layers is believed to function as a cushion. Thus, the tribological properties of the DLC films were improved by a multi-layered structure. The electrical resistivity of multi-layer DLC films was approximately half that of the DLC mono-layer film. Therefore, the periodic DLC/N-DLC eight-layer film is a good conductive hard-coating film.

Die attach dimension and material on thermal conductivity study for high power COB LED

NASA Astrophysics Data System (ADS)

Sarukunaselan, K.; Ong, N. R.; Sauli, Z.; Mahmed, N.; Kirtsaeng, S.; Sakuntasathien, S.; Suppiah, S.; Alcain, J. B.; Retnasamy, V.

2017-09-01

High power LED began to gain popularity in the semiconductor market due to its efficiency and luminance. Nonetheless, along with the increased in efficiency, there was an increased in the junction temperature too. The alleviating junction temperature is undesirable since the performances and lifetime will be degraded over time. Therefore, it is crucial to solve this thermal problem by maximizing the heat dissipation to the ambience. Improvising the die attach (DA) layer would be the best option because this layer is sandwiched between the chip (heat source) and the substrate (channel to the ambient). In this paper, the impact of thickness and thermal conductivity onto the junction temperature and Von Mises stress is analyzed. Results obtained showed that the junction temperature is directly proportional to the thickness but the stress was inversely proportional to the thickness of the DA. The thermal conductivity of the materials did affect the junction temperature as there was not much changes once the thermal conductivity reached 20W/mK. However, no significant changes were observed on the Von Mises stress caused by the thermal conductivity. Material with the second highest thermal conductivity had the lowest stress, whereas the highest conductivity material had the highest stress value at 20 µm. Overall, silver sinter provided the best thermal dissipation compared to the other materials.

Thin film and high-etch-rate type 248-nm bottom antireflective coatings

NASA Astrophysics Data System (ADS)

Enomoto, Tomoyuki; Takei, Satoshi; Kishioka, Takahiro; Hatanaka, Tadashi; Sakamoto, Rikimaru; Nakajima, Yasuyuki

2004-05-01

A frequent problem encountered by photoresists during the manufacturing of semiconductor device is that activating radiation is reflected back into the photoresist by the substrate. So, it is necessary that the light reflection is reduced from the substrate. One approach to reduce the light reflection is the use of bottom anti-reflective coating (BARC) applied to the substrate beneath the photoresist layer. The BARC technology has been utilized for a few years to minimize the reflectivity. As the chip size is reduced to sub 0.13 micron, the photoresist thickness has to decrease with the aspect ratio being less than 3.0. Therefore, new Organic BARC is strongly required which has the minimum reflectivity with thinner BARC thickness and higher etch selectivity toward resists. Nissan Chemical Industries, Ltd. and Brewer Science, Inc. have developed the advanced Organic BARC for achieving the above purpose. As a result, the suitable high performance NCA3000 series 248nm Organic BARCs were developed. Using CF4 gas as etchant, the plasma etch rate of NCA3000 series is about 1.4-1.6 times higher than that of conventional 248nm resists and 1.1-1.2 times higher than that of the existing product. The NCA3000 series can minimize the substrate reflectivity at below 45nm BARC thickness, shows excellent litho performance and coating properties.

Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance

NASA Astrophysics Data System (ADS)

Lee, Tae-Kyu; Chen, Zhiqiang; Guirguis, Cherif; Akinade, Kola

2017-10-01

The stability of solder interconnects in a mechanical shock environment is crucial for large body size flip-chip ball grid array (FCBGA) electronic packages. Additionally, the junction temperature increases with higher electric power condition, which brings the component into an elevated temperature environment, thus introducing another consideration factor for mechanical stability of interconnection joints. Since most of the shock performance data available were produced at room temperature, the effect of elevated temperature is of interest to ensure the reliability of the device in a mechanical shock environment. To achieve a stable␣interconnect in a dynamic shock environment, the interconnections must tolerate mechanical strain, which is induced by the shock wave input and reaches the particular component interconnect joint. In this study, large body size (52.5 × 52.5 mm2) FCBGA components assembled on 2.4-mm-thick boards were tested with various isothermal pre-conditions and testing conditions. With a heating element embedded in the test board, a test temperature range from room temperature to 100°C was established. The effects of elevated temperature on mechanical shock performance were investigated. Failure and degradation mechanisms are identified and discussed based on the microstructure evolution and grain structure transformations.

Polyplanar optical display electronics

NASA Astrophysics Data System (ADS)

DeSanto, Leonard; Biscardi, Cyrus

1997-07-01

The polyplanar optical display (POD) is a unique display screen which can be used with any projection source. The prototype ten inch display is two inches thick and has a matte black face which allows for high contrast images. The prototype being developed is a form, fit and functional replacement display for the B-52 aircraft which uses a monochrome ten-inch display. In order to achieve a long lifetime, the new display uses a 100 milliwatt green solid- state laser at 532 nm as its light source. To produce real- time video, the laser light is being modulated by a digital light processing (DLP) chip manufactured by Texas Instruments. In order to use the solid-state laser as the light source and also fit within the constraints of the B-52 display, the digital micromirror device (DMD) circuit board is removed from the Texas Instruments DLP light engine assembly. Due to the compact architecture of the projection system within the display chassis, the DMD chip is operated remotely from the Texas Instruments circuit board. We discuss the operation of the DMD divorced from the light engine and the interfacing of the DMD board with various video formats including the format specific to the B-52 aircraft. A brief discussion of the electronics required to drive the laser is also presented.

X-ray surface dose measurements using TLD extrapolation.

PubMed

Kron, T; Elliot, A; Wong, T; Showell, G; Clubb, B; Metcalfe, P

1993-01-01

Surface dose measurements in therapeutic x-ray beams are of importance in determining the dose to the skin of patients undergoing radiotherapy. Measurements were performed in the 6-MV beam of a medical linear accelerator with LiF thermoluminescence dosimeters (TLD) using a solid water phantom. TLD chips (surface area 3.17 x 3.17 cm2) of three different thicknesses (0.230, 0.099, and 0.038 g/cm2) were used to extrapolate dose readings to an infinitesimally thin layer of LiF. This surface dose was measured for field sizes ranging from 1 x 1 cm2 to 40 x 40 cm2. The surface dose relative to maximum dose was found to be 10.0% for a field size of 5 x 5 cm2, 16.3% for 10 x 10 cm2, and 26.9% for 20 x 20 cm2. Using a 6-mm Perspex block tray in the beam increased the surface dose in these fields to 10.7%, 17.7%, and 34.2% respectively. Due to the small size of the TLD chips, TLD extrapolation is applicable also for intracavity and exit dose determinations. The technique used for in vivo dosimetry could provide clinicians information about the build up of dose up to 1-mm depth in addition to an extrapolated surface dose measurement.

Nanoparticle-coated micro-optofluidic ring resonator as a detector for microscale gas chromatographic vapor analysis.

PubMed

Scholten, K; Collin, W R; Fan, X; Zellers, E T

2015-05-28

A vapor sensor comprising a nanoparticle-coated microfabricated optofluidic ring resonator (μOFRR) is introduced. A multilayer film of polyether functionalized, thiolate-monolayer-protected gold nanoparticles (MPN) was solvent cast on the inner wall of the hollow cylindrical SiOxμOFRR resonator structure, and whispering gallery mode (WGM) resonances were generated with a 1550 nm tunable laser via an optical fiber taper. Reversible shifts in the WGM resonant wavelength upon vapor exposure were detected with a photodetector. The μOFRR chip was connected to a pair of upstream etched-Si chips containing PDMS-coated separation μcolumns and calibration curves were generated from the peak-area responses to five volatile organic compounds (VOCs). Calibration curves were linear, and the sensitivities reflected the influence of analyte volatility and analyte-MPN functional group affinity. Sorption-induced changes in film thickness apparently dominate over changes in the refractive index of the film as the determinant of responses for all VOCs. Peaks from the MPN-coated μOFRR were just 20-50% wider than those from a flame ionization detector for similar μcolumn separation conditions, reflecting the rapid response of the sensor for VOCs. The five VOCs were baseline separated in <1.67 min, with detection limits as low as 38 ng.

High sensitivity flat SiO2 fibres for medical dosimetry

NASA Astrophysics Data System (ADS)

Abdul Sani, Siti. F.; Alalawi, Amani I.; Azhar, Hairul A. R.; Amouzad Mahdiraji, Ghafour; Tamchek, Nizam; Nisbet, A.; Maah, M. J.; Bradley, D. A.

2014-11-01

We describe investigation of a novel undoped flat fibre fabricated for medical radiation dosimetry. Using high energy X-ray beams generated at a potential of 6 MV, comparison has been made of the TL yield of silica flat fibres, TLD-100 chips and Ge-doped silica fibres. The flat fibres provide competitive TL yield to that of TLD-100 chips, being some 100 times that of the Ge-doped fibres. Pt-coated flat fibres have then been used to increase photoelectron production and hence local dose deposition, obtaining significant increase in dose sensitivity over that of undoped flat fibres. Using 250 kVp X-ray beams, the TL yield reveals a progressive linear increase in dose for Pt thicknesses from 20 nm up to 80 nm. The dose enhancement factor (DEF) of (0.0150±0.0003) nm-1 Pt is comparable to that obtained using gold, agreeing at the 1% level with the value expected on the basis of photoelectron generation. Finally, X-ray photoelectron spectroscopy (XPS) has been employed to characterize the surface oxidation state of the fibre medium. The charge state of Si2p was found to lie on 103.86 eV of binding energy and the atomic percentage obtained from the XPS analysis is 22.41%.

Nanoparticle-coated micro-optofluidic ring resonator as a detector for microscale gas chromatographic vapor analysis

NASA Astrophysics Data System (ADS)

Scholten, K.; Collin, W. R.; Fan, X.; Zellers, E. T.

2015-05-01

A vapor sensor comprising a nanoparticle-coated microfabricated optofluidic ring resonator (μOFRR) is introduced. A multilayer film of polyether functionalized, thiolate-monolayer-protected gold nanoparticles (MPN) was solvent cast on the inner wall of the hollow cylindrical SiOx μOFRR resonator structure, and whispering gallery mode (WGM) resonances were generated with a 1550 nm tunable laser via an optical fiber taper. Reversible shifts in the WGM resonant wavelength upon vapor exposure were detected with a photodetector. The μOFRR chip was connected to a pair of upstream etched-Si chips containing PDMS-coated separation μcolumns and calibration curves were generated from the peak-area responses to five volatile organic compounds (VOCs). Calibration curves were linear, and the sensitivities reflected the influence of analyte volatility and analyte-MPN functional group affinity. Sorption-induced changes in film thickness apparently dominate over changes in the refractive index of the film as the determinant of responses for all VOCs. Peaks from the MPN-coated μOFRR were just 20-50% wider than those from a flame ionization detector for similar μcolumn separation conditions, reflecting the rapid response of the sensor for VOCs. The five VOCs were baseline separated in <1.67 min, with detection limits as low as 38 ng.

Survivability of soldered leadless chip carriers after temperature cycling

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zawicki, L.R.; Lenhardt, B.W.; Smith, F.R.

Temperature cycling evaluations were conducted on leadless chip carriers (LCCs) soldered to thick film networks (TKNs). Various temperature ranges, rates of change, cycle times, number of cycles, and sizes of LCCs were used. The TKNs were attached to metal backing plates with 63Sn/37Pb solder preforms using an infrared vacuum soldering process. The LCCs were attached to Pt/Au TKNs with 63Sn/37Pb solder paste using a belt reflow process. Visual examination and cross-sectional analysis were used to evaluate the survivability. Results were also correlated with finite elemental analysis. Considering the initial results, possible solutions included changing the solder from 63Sn/37Pb to 50Pb/50In,more » deleting the metal backplate, changing the rate of change in the temperature cycle, and/or adding leads to the large LCCs. Because of a system requirement, the rate of change in the temperature cycle could not be changed. Since there was no long term reliability information on the Pt/Au TKN with 50Pb/50In solder, this option was also dropped. Additional evaluations showed little difference in the survivability of large LCC solder joints with or without the metal backing plate. The final results indicated that LCCs beyond a certain physical size required compliant leads to survive the temperature cycle requirements.« less

Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors †

PubMed Central

Georgitzikis, Epimitheas; Vamvaka, Ioanna; Frazzica, Fortunato; Van Olmen, Jan; De Moor, Piet; Heremans, Paul; Hens, Zeger; Cheyns, David

2017-01-01

Imaging in the infrared wavelength range has been fundamental in scientific, military and surveillance applications. Currently, it is a crucial enabler of new industries such as autonomous mobility (for obstacle detection), augmented reality (for eye tracking) and biometrics. Ubiquitous deployment of infrared cameras (on a scale similar to visible cameras) is however prevented by high manufacturing cost and low resolution related to the need of using image sensors based on flip-chip hybridization. One way to enable monolithic integration is by replacing expensive, small-scale III–V-based detector chips with narrow bandgap thin-films compatible with 8- and 12-inch full-wafer processing. This work describes a CMOS-compatible pixel stack based on lead sulfide quantum dots (PbS QD) with tunable absorption peak. Photodiode with a 150-nm thick absorber in an inverted architecture shows dark current of 10−6 A/cm2 at −2 V reverse bias and EQE above 20% at 1440 nm wavelength. Optical modeling for top illumination architecture can improve the contact transparency to 70%. Additional cooling (193 K) can improve the sensitivity to 60 dB. This stack can be integrated on a CMOS ROIC, enabling order-of-magnitude cost reduction for infrared sensors. PMID:29232871

Implementing inverted master-slave 3D semiconductor stack

DOE Office of Scientific and Technical Information (OSTI.GOV)

Coteus, Paul W.; Hall, Shawn A.; Takken, Todd E.

2016-03-08

A method and apparatus are provided for implementing an enhanced three dimensional (3D) semiconductor stack. A chip carrier has an aperture of a first length and first width. A first chip has at least one of a second length greater than the first length or a second width greater than the first width; a second chip attached to the first chip, the second chip having at least one of a third length less than the first length or a third width less than the first width; the first chip attached to the chip carrier by connections in an overlap regionmore » defined by at least one of the first and second lengths or the first and second widths; the second chip extending into the aperture; and a heat spreader attached to the chip carrier and in thermal contact with the first chip for dissipating heat from both the first chip and second chip.« less

Compression Debarking of Stored Wood Chips

Treesearch

James A. Mattson

1974-01-01

Two 750 ft. piles of unbarked chips were stored for 1 year to evaluate the effect of chip storage on the effectiveness of bark-chip separations-segregation methods under study. in processing stored chips suffered more wood loss than fresh chips.

Attachment method for stacked integrated circuit (IC) chips

DOEpatents

Bernhardt, Anthony F.; Malba, Vincent

1999-01-01

An attachment method for stacked integrated circuit (IC) chips. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM.

Attachment method for stacked integrated circuit (IC) chips

DOEpatents

Bernhardt, A.F.; Malba, V.

1999-08-03

An attachment method for stacked integrated circuit (IC) chips is disclosed. The method involves connecting stacked chips, such as DRAM memory chips, to each other and/or to a circuit board. Pads on the individual chips are rerouted to form pads on the side of the chip, after which the chips are stacked on top of each other whereby desired interconnections to other chips or a circuit board can be accomplished via the side-located pads. The pads on the side of a chip are connected to metal lines on a flexible plastic tape (flex) by anisotropically conductive adhesive (ACA). Metal lines on the flex are likewise connected to other pads on chips and/or to pads on a circuit board. In the case of a stack of DRAM chips, pads to corresponding address lines on the various chips may be connected to the same metal line on the flex to form an address bus. This method has the advantage of reducing the number of connections required to be made to the circuit board due to bussing; the flex can accommodate dimensional variation in the alignment of chips in the stack; bonding of the ACA is accomplished at low temperature and is otherwise simpler and less expensive than solder bonding; chips can be bonded to the ACA all at once if the sides of the chips are substantially coplanar, as in the case for stacks of identical chips, such as DRAM. 12 figs.

Comparison of contamination of femoral heads and pre-processed bone chips during hip revision arthroplasty.

PubMed

Mathijssen, N M C; Sturm, P D; Pilot, P; Bloem, R M; Buma, P; Petit, P L; Schreurs, B W

2013-12-01

With bone impaction grafting, cancellous bone chips made from allograft femoral heads are impacted in a bone defect, which introduces an additional source of infection. The potential benefit of the use of pre-processed bone chips was investigated by comparing the bacterial contamination of bone chips prepared intraoperatively with the bacterial contamination of pre-processed bone chips at different stages in the surgical procedure. To investigate baseline contamination of the bone grafts, specimens were collected during 88 procedures before actual use or preparation of the bone chips: in 44 procedures intraoperatively prepared chips were used (Group A) and in the other 44 procedures pre-processed bone chips were used (Group B). In 64 of these procedures (32 using locally prepared bone chips and 32 using pre-processed bone chips) specimens were also collected later in the procedure to investigate contamination after use and preparation of the bone chips. In total, 8 procedures had one or more positive specimen(s) (12.5 %). Contamination rates were not significantly different between bone chips prepared at the operating theatre and pre-processed bone chips. In conclusion, there was no difference in bacterial contamination between bone chips prepared from whole femoral heads in the operating room and pre-processed bone chips, and therefore, both types of bone allografts are comparable with respect to risk of infection.

Development of Overpressures at Nankai Accretionary Prism, Ocean Drilling Program Sites 1173 and 1174

NASA Astrophysics Data System (ADS)

Gamage, K.; Screaton, E.

2003-12-01

In this study, we used a one-dimensional model of sedimentation, initial prism loading, and fluid flow to examine the development of overpressures at the toe of the Nankai accretionary complex. A permeability-porosity relationship was established for hemipelagic sediments from laboratory measured permeabilities as an input to the model. Vertical permeabilities were measured for 10 core samples from the Ocean Drilling Program (ODP) Leg 190, Sites 1173 and 1174, from the upper and lower Shikoku Basin facies. Both sites were drilled along the Muroto Transect through the dècollement zone or its equivalent. Site 1173 is located 11 km seaward of the deformation front and it represents the undeformed incoming sediments, where as Site 1174 represents sediments within the proto-thrust zone. Although turbidite-rich sediments dominate the Nankai accretionary prism, the dècollement and underthrust sediments are primarily composed of hemipelagic muds. Using the permeability-porosity relationship, our modeling results indicate excess pore pressures that are greater than 30% of lithostatic pressure at the toe of the prism at a convergence rate of 4cm/yr. These values are slightly lower than previously inferred excess pore pressures estimated from porosity data. Additional runs were conducted to simulate a 10-m thick low permeability barrier at the dècollement where vertical fluid flow is restricted. The low permeability barrier required a permeability less than 1 x 10-19 m2 to generate excess pore pressures greater than 50% of lithostatic pressure. Modeling was further extended to test the significance of variable prism loading rates due to uncertainties in the convergence rate and affects of lateral stress above the dècollement.

Evidence for post-1620 Ma Proterozoic regional deformation, Lucy Gray Range, southern Nevada

DOE Office of Scientific and Technical Information (OSTI.GOV)

Duebendorfer, E.M.; Christensen, C.H.; Shafiqullah, M.

1993-04-01

Major mylonite zones in the northern Lucy Gray Range, Nevada, deform and are spatially associated with the 1,425 Ma Beer Bottle Pass pluton, Mylonitic granite yielded a K-Ar biotite date of 1,400 [+-] 30 Ma and is overlain nonconformably by the Cambrian Tapeats Sandstone, thus constraining deformation to the Proterozoic. The mylonites may therefore represent an unrecognized period of Proterozoic deformation in the Southwest. Field and microstructural studies were undertaken to evaluate between 3 possible models for the apparent spatial association of granite and mylonites: (1) deformation directly related to pluton emplacement (ballooning); (2) synkinematic pluton emplacement; or (3) post-emplacementmore » deformation. Mylonite zones up to 50 meters thick strike north to northeast, dip moderately to steeply northwest, and contain a remarkably consistent west-plunging mineral lineation. Mylonites are present locally at the granite-wall rock contact; however, less than 30% of the exposed contact is mylonitic. The authors reject a pluton-emplacement origin for the mylonites because (1) mylonite zones within wall rocks locally strike at high angles to an undeformed pluton-wall rock contact, (2) the consistent (pluton-side-down) shear sense is more compatible with a uniform-sense simple shear zone than a ballooning pluton, (3) plane strain fabrics dominate over flattening fabrics, and (4) mylonites adjacent to pluton contacts lack annealing textures predicted by the ballooning model. If so, the conventional interpretation of 1,400 Ga granitoids as anorogenic may need to be re-evaluated. The authors cannot, however, rule out the possibility that the mylonites completely postdate intrusion of the Beer Bottle Pass pluton. Future work is planned to delimit the regional extent of this previously unrecognized Proterozoic deformational event.« less

Soft-sediment deformation produced by tides in a meizoseismic area, Turnagain Arm, Alaska

USGS Publications Warehouse

Greb, S.F.; Archer, A.W.

2007-01-01

Turnagain Arm is a semidiurnal hypertidal estuary in southeastern Alaska with a recorded tidal range of 9 m. Contorted bedding and flow rolls preserved in tidal sediments within the estuary have previously been interpreted as resulting from the Mw 9.2 Great Alaskan earthquake of 1964. Horizons of flow rolls between undeformed beds in sediments and rock strata have been used to infer ancient earthquakes in other areas. Although many types of soft-sediment deformation structures can be formed by earthquakes, observations of sedimentation on tidal flats in the inner parts of Turnagain Arm in the summers of 2003 and 2004 show that a wide range of soft-sediment deformation structures, similar to those inferred to have been formed by earthquakes, can form in macrotidal estuaries in the absence of seismic shock. During sedimentation rate measurements in 2004, soft-sediment deformation structures were recorded that formed during one day's tide, either in response to overpressurization of tidal flats during rapid tidal drawdown or by shear stress exerted on the bed by the passage of a 1.8 m tidal bore. Structures consisted of How rolls, dish structures, flames, and small dewatering pipes in a bed 17 cm thick. In the future, if the flow rolls in Turnagain Arm were found in isolated outcrops across an area 11 km in length, in an estuary known to have been influenced by large-magnitude earthquakes, would they be interpreted as seismites? These examples show that caution is needed when using horizons of flow rolls to infer paleoseismicity in estuarine deposits because many of the mechanisms (tidal flux, tidal bores, slumping, flooding) that can cause deformation in rapidly deposited, unconsolidated silts and sands, are orders of magnitude more common than great earthquakes. ?? 2007 The Geological Society of America.

Study on vacuum packaging reliability of micromachined quartz tuning fork gyroscopes

NASA Astrophysics Data System (ADS)

Fan, Maoyan; Zhang, Lifang

2017-09-01

Packaging technology of the micromachined quartz tuning fork gyroscopes by vacuum welding has been experimentally studied. The performance of quartz tuning fork is influenced by the encapsulation shell, encapsulation method and fixation of forks. Alloy solder thick film is widely used in the package to avoid the damage of the chip structure by the heat resistance and hot temperature, and this can improve the device performance and welding reliability. The results show that the bases and the lids plated with gold and nickel can significantly improve the airtightness and reliability of the vacuum package. Vacuum packaging is an effective method to reduce the vibration damping, improve the quality factor and further enhance the performance. The threshold can be improved nearly by 10 times.

Ultra-thin ohmic contacts for p-type nitride light emitting devices

DOEpatents

Raffetto, Mark; Bharathan, Jayesh; Haberern, Kevin; Bergmann, Michael; Emerson, David; Ibbetson, James; Li, Ting

2014-06-24

A flip-chip semiconductor based Light Emitting Device (LED) can include an n-type semiconductor substrate and an n-type GaN epi-layer on the substrate. A p-type GaN epi-layer can be on the n-type GaN epi-layer and a metal ohmic contact p-electrode can be on the p-type GaN epi-layer, where the metal ohmic contact p-electrode can have an average thickness less than about 25 .ANG.. A reflector can be on the metal ohmic contact p-electrode and a metal stack can be on the reflector. An n-electrode can be on the substrate opposite the n-type GaN epi-layer and a bonding pad can be on the n-electrode.

Stress modeling of microdiaphragm pressure sensors

NASA Technical Reports Server (NTRS)

Tack, P. C.; Busta, H. H.

1986-01-01

A finite element program analysis was used to model the stress distribution of two monocrystalline silicon diaphragm pressure sensors. One configuration consists of an anisotropically backside etched diaphragm into a 250 micron thick, (100) oriented, silicon wafer. The diaphragm and total chip dimensions are given. The device is rigidly clamped on the back to a support substrate. Another configuration consists of a monocrystalline, (100), microdiaphragm which is formed on top of the wafer and whose area is reduced by a factor of 25 over the first configuration. The diaphragm is rigidly clamped to the silicon wafer. The stresses were calculated at a gauge pressure of 300 mm Hg and used to estimate the piezoresistive responses of resistor elements which were placed parallel and perpendicular near the diaphragm edges.

Study of a Flexible Low Profile Tunable Dipole Antenna Using Barium Strontium Titanate Varactors

NASA Technical Reports Server (NTRS)

Cure, David; Weller, Thomas; Miranda, Felix A.

2014-01-01

In this paper a flexible low profile dipole antenna using a frequency selective surface (FSS) with interdigital barium strontium titanate (BST) varactor-tuned unit cells is presented. The varactor chips were placed only along one dimension of the FSS to avoid the use of vias and simplify the DC bias network. The antenna uses overlapping metallic plates that resemble fish scales as a ground plane to improve the flexibility of the multi-material stack structure. The measured data of the antenna demonstrate tunability from 2.42 GHz to 2.66 GHz and 1.3 dB gain drop when using overlapping metallic plates instead of continuous ground plane. The total antenna thickness is approximately lambda/24.

Dialysis membrane for separation on microchips

DOEpatents

Singh, Anup K [San Francisco, CA; Kirby, Brian J [San Francisco, CA; Shepodd, Timothy J [Livermore, CA

2010-07-13

Laser-induced phase-separation polymerization of a porous acrylate polymer is used for in-situ fabrication of dialysis membranes inside glass microchannels. A shaped 355 nm laser beam is used to produce a porous polymer membrane with a thickness of about 15 .mu.m, which bonds to the glass microchannel and forms a semi-permeable membrane. Differential permeation through a membrane formed with pentaerythritol triacrylate was observed and quantified by comparing the response of the membrane to fluorescein and fluorescently tagging 200 nm latex microspheres. Differential permeation was observed and quantified by comparing the response to rhodamine 560 and lactalbumin protein in a membrane formed with SPE-methylene bisacrylamide. The porous membranes illustrate the capability for the present technique to integrate sample cleanup into chip-based analysis systems.

A comprehensive experimental characterization of the iPIX gamma imager

NASA Astrophysics Data System (ADS)

Amgarou, K.; Paradiso, V.; Patoz, A.; Bonnet, F.; Handley, J.; Couturier, P.; Becker, F.; Menaa, N.

2016-08-01

The results of more than 280 different experiments aimed at exploring the main features and performances of a newly developed gamma imager, called iPIX, are summarized in this paper. iPIX is designed to quickly localize radioactive sources while estimating the ambient dose equivalent rate at the measurement point. It integrates a 1 mm thick CdTe detector directly bump-bonded to a Timepix chip, a tungsten coded-aperture mask, and a mini RGB camera. It also represents a major technological breakthrough in terms of lightness, compactness, usability, response sensitivity, and angular resolution. As an example of its key strengths, an 241Am source with a dose rate of only few nSv/h can be localized in less than one minute.

Two-Dimensional Photonic Crystals for Sensitive Microscale Chemical and Biochemical Sensing

PubMed Central

Miller, Benjamin L.

2015-01-01

Photonic crystals – optical devices able to respond to changes in the refractive index of a small volume of space – are an emerging class of label-free chemical-and bio-sensors. This review focuses on one class of photonic crystal, in which light is confined to a patterned planar material layer of sub-wavelength thickness. These devices are small (on the order of tens to 100s of microns square), suitable for incorporation into lab-on-a-chip systems, and in theory can provide exceptional sensitivity. We introduce the defining characteristics and basic operation of two-dimensional photonic crystal sensors, describe variations of their basic design geometry, and summarize reported detection results from chemical and biological sensing experiments. PMID:25563402

Syn-extensional emplacement of the 1. 42 Ga Sandia Granite, N. M

DOE Office of Scientific and Technical Information (OSTI.GOV)

Karlstrom, K.E.; Kirby, E.; Andronicos, C.

1993-02-01

The 1.42 Ga Sandia pluton is one of a suite of Middle Proterozoic granitoid intrusions exposed in northern New Mexico. It crops out over 420 km[sup 2] in the Sandia Mountains, just east of Albuquerque. Recent structural work indicates that the pluton was emplaced syntectonically with respect to a transtensional ductile shear zone on its southeastern side. The shear zone is 1-2 km wide, dips 60[degree] NW under the pluton, and is thus inferred to be a deformed base or lower side of the pluton. From NW to SE, a transect across the zone consists of (1) essentially undeformed, locallymore » flow-foliated Sandia pluton (megacrystic monzogranite); (2) mylonitic, augen orthogneiss that is clearly sheared Sandia pluton; its matrix is depleted in quartz and K-feldspar and enriched in biotite relative to the undeformed pluton; (3) Cibola granite - a 1 km wide zone of fine to coarse grained, equigranular, leucocratic granite; (4) the Tijeras Fault - a Phanerozoic brittle fault; (5) the Tijeras Greenstone - unsheared amphibolite and interlayered pelitic schist and quartzite. Field and microstructural relationships indicate that pluton crystallization was synchronous with shear zone movements. Shear zone movement is interpreted to have punctuated segregation of evolved melts during fractional crystallization of the magma. Geochemical data show linear trends in major and trace elements, with compositional gaps between the main pluton and leucocratic phases. Strain studies suggest that the biotite-rich mylonitic augen orthogneiss records significant volume loss in the matrix. Melts presumably were drawn down pressure gradients into the active shear zone after the main unit was 50--70% crystallized. Further work is required to constrain whether extension was related to regional deformation or only to pluton emplacement.« less

Impact and implications of the Afro-Eurasian collision south of Cyprus from reflection seismic data

NASA Astrophysics Data System (ADS)

Klimke, Jennifer; Ehrhardt, Axel

2014-06-01

The Cyprus Arc in the Eastern Mediterranean represents the active collision front between the African and Eurasian (Anatolian) Plates. Along the Cyprus Arc, the Eratosthenes Seamount is believed to have been blocking the northward motion of the African Plate since the Late Pliocene-Early Pleistocene. Based on a dense grid of 2D reflection seismic profiles covering the Eratosthenes Seamount and western Levant Basin offshore Cyprus, new observations regarding the Cyprus Arc collision front at the triple transition zone Eratosthenes Seamount-Levant Basin-Hecataeus Rise are presented. The data show that the Levant Basin is filled with ~ 10 km of sediments of Early Mesozoic (probably Jurassic) to Plio-Quaternary age with only a localized deformation affecting the Miocene-Oligocene rock units. The sediments onlap directly against the steep eastern flank of the Eratosthenes Seamount to the west and the southern flank of the Hecataeus Rise to the north. The sediments show no deformation that could be associated with collision and are undeformed even very close to the two prominent structures. Pinching out of the Base Miocene reflector in the Levant Basin due to onlapping of the Middle Miocene reflector indicates uplift of the Eratosthenes Seamount and the Hecataeus Rise. In contrast to the Messinian Evaporites north of the Eratosthenes Seamount, the salt in the Levant Basin, even close to the Hecataeus Rise, is tectonically undeformed. It is proposed that the Eratosthenes Seamount, the western Levant Basin and the Hecataeus Rise act as one tectonic unit. This implies that the collision front is located north of this unit and that the Hecataeus Rise shields the sediments south of it from deformation associated with collision of the African and Anatolian Plates.

Quantum spectral curve for the η-deformed AdS5 × S5 superstring

NASA Astrophysics Data System (ADS)

Klabbers, Rob; van Tongeren, Stijn J.

2017-12-01

The spectral problem for the AdS5 ×S5 superstring and its dual planar maximally supersymmetric Yang-Mills theory can be efficiently solved through a set of functional equations known as the quantum spectral curve. We discuss how the same concepts apply to the η-deformed AdS5 ×S5 superstring, an integrable deformation of the AdS5 ×S5 superstring with quantum group symmetry. This model can be viewed as a trigonometric version of the AdS5 ×S5 superstring, like the relation between the XXZ and XXX spin chains, or the sausage and the S2 sigma models for instance. We derive the quantum spectral curve for the η-deformed string by reformulating the corresponding ground-state thermodynamic Bethe ansatz equations as an analytic Y system, and map this to an analytic T system which upon suitable gauge fixing leads to a Pμ system - the quantum spectral curve. We then discuss constraints on the asymptotics of this system to single out particular excited states. At the spectral level the η-deformed string and its quantum spectral curve interpolate between the AdS5 ×S5 superstring and a superstring on "mirror" AdS5 ×S5, reflecting a more general relationship between the spectral and thermodynamic data of the η-deformed string. In particular, the spectral problem of the mirror AdS5 ×S5 string, and the thermodynamics of the undeformed AdS5 ×S5 string, are described by a second rational limit of our trigonometric quantum spectral curve, distinct from the regular undeformed limit.

3D Topography of the Young Adult Anal Sphincter Complex Reconstructed from Undeformed Serial Anatomical Sections

PubMed Central

Wu, Yi; Dabhoiwala, Noshir F.; Hagoort, Jaco; Shan, Jin-Lu; Tan, Li-Wen; Fang, Bin-Ji; Zhang, Shao-Xiang; Lamers, Wouter H.

2015-01-01

Background Pelvic-floor anatomy is usually studied by artifact-prone dissection or imaging, which requires prior anatomical knowledge. We used the serial-section approach to settle contentious issues and an interactive 3D-pdf to make the results widely accessible. Method 3D reconstructions of undeformed thin serial anatomical sections of 4 females and 2 males (21–35y) of the Chinese Visible Human database. Findings Based on tendinous septa and muscle-fiber orientation as segmentation guides, the anal-sphincter complex (ASC) comprised the subcutaneous external anal sphincter (EAS) and the U-shaped puborectal muscle, a part of the levator ani muscle (LAM). The anococcygeal ligament fixed the EAS to the coccygeal bone. The puborectal-muscle loops, which define the levator hiatus, passed around the anorectal junction and inserted anteriorly on the perineal body and pubic bone. The LAM had a common anterior attachment to the pubic bone, but separated posteriorly into puborectal and “pubovisceral” muscles. This pubovisceral muscle was bilayered: its internal layer attached to the conjoint longitudinal muscle of the rectum and the rectococcygeal fascia, while its outer, patchy layer reinforced the inner layer. ASC contraction makes the ano-rectal bend more acute and lifts the pelvic floor. Extensions of the rectal longitudinal smooth muscle to the coccygeal bone (rectococcygeal muscle), perineal body (rectoperineal muscle), and endopelvic fascia (conjoint longitudinal and pubovisceral muscles) formed a “diaphragm” at the inferior boundary of the mesorectum that suspended the anorectal junction. Its contraction should straighten the anorectal bend. Conclusion The serial-section approach settled contentious topographic issues of the pelvic floor. We propose that the ASC is involved in continence and the rectal diaphragm in defecation. PMID:26305117

Microelectromechanical Systems (MEMS) Broadband Light Source Developed

NASA Technical Reports Server (NTRS)

Tuma, Margaret L.

2003-01-01

A miniature, low-power broadband light source has been developed for aerospace applications, including calibrating spectrometers and powering miniature optical sensors. The initial motivation for this research was based on flight tests of a Fabry-Perot fiberoptic temperature sensor system used to detect aircraft engine exhaust gas temperature. Although the feasibility of the sensor system was proven, the commercial light source optically powering the device was identified as a critical component requiring improvement. Problems with the light source included a long stabilization time (approximately 1 hr), a large amount of heat generation, and a large input electrical power (6.5 W). Thus, we developed a new light source to enable the use of broadband optical sensors in aerospace applications. Semiconductor chip-based light sources, such as lasers and light-emitting diodes, have a relatively narrow range of emission wavelengths in comparison to incandescent sources. Incandescent light sources emit broadband radiation from visible to infrared wavelengths; the intensity at each wavelength is determined by the filament temperature and the materials chosen for the filament and the lamp window. However, present commercial incandescent light sources are large in size and inefficient, requiring several watts of electrical power to obtain the desired optical power, and they emit a large percentage of the input power as heat that must be dissipated. The miniature light source, developed jointly by the NASA Glenn Research Center, the Jet Propulsion Laboratory, and the Lighting Innovations Institute, requires one-fifth the electrical input power of some commercial light sources, while providing similar output light power that is easily coupled to an optical fiber. Furthermore, it is small, rugged, and lightweight. Microfabrication technology was used to reduce the size, weight, power consumption, and potential cost-parameters critical to future aerospace applications. This chip-based light source has the potential for monolithic fabrication with on-chip drive electronics. Other uses for these light sources are in systems for vehicle navigation, remote sensing applications such as monitoring bridges for stress, calibration sources for spectrometers, light sources for space sensors, display lighting, addressable arrays, and industrial plant monitoring. Two methods for filament fabrication are being developed: wet-chemical etching and laser ablation. Both yield a 25-mm-thick tungsten spiral filament. The proof-of-concept filament shown was fabricated with the wet etch method. Then it was tested by heating it in a vacuum chamber using about 1.25 W of electrical power; it generated bright, blackbody radiation at approximately 2650 K. The filament was packaged in Glenn's clean-room facilities. This design uses three chips vacuum-sealed with glass tape. The bottom chip consists of a reflective film deposited on silicon, the middle chip contains a tungsten filament bonded to silicon, and the top layer is a transparent window. Lifetime testing on the package will begin shortly. The emitted optical power is expected to be approximately 1.0 W with the spectral peak at 1.1 mm.

Repairable chip bonding/interconnect process

DOEpatents

Bernhardt, Anthony F.; Contolini, Robert J.; Malba, Vincent; Riddle, Robert A.

1997-01-01

A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder.

Novel tool wear monitoring method in milling difficult-to-machine materials using cutting chip formation

NASA Astrophysics Data System (ADS)

Zhang, P. P.; Guo, Y.; Wang, B.

2017-05-01

The main problems in milling difficult-to-machine materials are the high cutting temperature and rapid tool wear. However it is impossible to investigate tool wear in machining. Tool wear and cutting chip formation are two of the most important representations for machining efficiency and quality. The purpose of this paper is to develop the model of tool wear with cutting chip formation (width of chip and radian of chip) on difficult-to-machine materials. Thereby tool wear is monitored by cutting chip formation. A milling experiment on the machining centre with three sets cutting parameters was performed to obtain chip formation and tool wear. The experimental results show that tool wear increases gradually along with cutting process. In contrast, width of chip and radian of chip decrease. The model is developed by fitting the experimental data and formula transformations. The most of monitored errors of tool wear by the chip formation are less than 10%. The smallest error is 0.2%. Overall errors by the radian of chip are less than the ones by the width of chip. It is new way to monitor and detect tool wear by cutting chip formation in milling difficult-to-machine materials.

Expression and significance of CHIP in canine mammary gland tumors

PubMed Central

WANG, Huanan; YANG, Xu; JIN, Yipeng; PEI, Shimin; ZHANG, Di; MA, Wen; HUANG, Jian; QIU, Hengbin; ZHANG, Xinke; JIANG, Qiuyue; SUN, Weidong; ZHANG, Hong; LIN, Degui

2015-01-01

CHIP (Carboxy terminus of Hsc70 Interacting Protein) is an E3 ubiquitin ligase that can induce ubiquitination and degradation of several oncogenic proteins. The expression of CHIP is frequently lower in human breast cancer than in normal breast tissue. However, the expression and role of CHIP in the canine mammary gland tumor (CMGT) remain unclear. We investigated the potential correlation between CHIP expression and mammary gland tumor prognosis in female dogs. CHIP expression was measured in 54 dogs by immunohistochemistry and real-time RT-PCR. CHIP protein expression was significantly correlated with the histopathological diagnosis, outcome of disease and tumor classification. The transcriptional level of CHIP was significantly higher in normal tissues (P=0.001) and benign tumors (P=0.009) than it in malignant tumors. CHIP protein expression was significantly correlated with the transcriptional level of CHIP (P=0.0102). The log-rank test survival curves indicated that patients with low expression of CHIP had shorter overall periods of survival than those with higher CHIP protein expression (P=0.050). Our data suggest that CHIP may play an important role in the formation and development of CMGTs and serve as a valuable prognostic marker and potential target for genetic therapy. PMID:26156079

On-chip concentration of bacteria using a 3D dielectrophoretic chip and subsequent laser-based DNA extraction in the same chip

NASA Astrophysics Data System (ADS)

Cho, Yoon-Kyoung; Kim, Tae-hyeong; Lee, Jeong-Gun

2010-06-01

We report the on-chip concentration of bacteria using a dielectrophoretic (DEP) chip with 3D electrodes and subsequent laser-based DNA extraction in the same chip. The DEP chip has a set of interdigitated Au post electrodes with 50 µm height to generate a network of non-uniform electric fields for the efficient trapping by DEP. The metal post array was fabricated by photolithography and subsequent Ni and Au electroplating. Three model bacteria samples (Escherichia coli, Staphylococcus epidermidis, Streptococcus mutans) were tested and over 80-fold concentrations were achieved within 2 min. Subsequently, on-chip DNA extraction from the concentrated bacteria in the 3D DEP chip was performed by laser irradiation using the laser-irradiated magnetic bead system (LIMBS) in the same chip. The extracted DNA was analyzed with silicon chip-based real-time polymerase chain reaction (PCR). The total process of on-chip bacteria concentration and the subsequent DNA extraction can be completed within 10 min including the manual operation time.

3D printed high density, reversible, chip-to-chip microfluidic interconnects.

PubMed

Gong, Hua; Woolley, Adam T; Nordin, Gregory P

2018-02-13

Our latest developments in miniaturizing 3D printed microfluidics [Gong et al., Lab Chip, 2016, 16, 2450; Gong et al., Lab Chip, 2017, 17, 2899] offer the opportunity to fabricate highly integrated chips that measure only a few mm on a side. For such small chips, an interconnection method is needed to provide the necessary world-to-chip reagent and pneumatic connections. In this paper, we introduce simple integrated microgaskets (SIMs) and controlled-compression integrated microgaskets (CCIMs) to connect a small device chip to a larger interface chip that implements world-to-chip connections. SIMs or CCIMs are directly 3D printed as part of the device chip, and therefore no additional materials or components are required to make the connection to the larger 3D printed interface chip. We demonstrate 121 chip-to-chip interconnections in an 11 × 11 array for both SIMs and CCIMs with an areal density of 53 interconnections per mm 2 and show that they withstand fluid pressures of 50 psi. We further demonstrate their reusability by testing the devices 100 times without seal failure. Scaling experiments show that 20 × 20 interconnection arrays are feasible and that the CCIM areal density can be increased to 88 interconnections per mm 2 . We then show the utility of spatially distributed discrete CCIMs by using an interconnection chip with 28 chip-to-world interconnects to test 45 3D printed valves in a 9 × 5 array. Each valve is only 300 μm in diameter (the smallest yet reported for 3D printed valves). Every row of 5 valves is tested to at least 10 000 actuations, with one row tested to 1 000 000 actuations. In all cases, there is no sign of valve failure, and the CCIM interconnections prove an effective means of using a single interface chip to test a series of valve array chips.

Repairable chip bonding/interconnect process

DOEpatents

Bernhardt, A.F.; Contolini, R.J.; Malba, V.; Riddle, R.A.

1997-08-05

A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules is disclosed. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets. For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder. 10 figs.

The "DREAM" IODP project to drill the Mediterranean Salt Giant on the Balearic Promontory

NASA Astrophysics Data System (ADS)

Lofi, Johanna; Camerlenghi, Angelo; Aloisi, Giovanni; Maillard, Agnès; Garcia-Castellanos, Daniel; Huebscher, Christian; Kuroda, Junichiro

2017-04-01

Salt giants preserving kilometer-thick evaporite layers are the sedimentary expression of extreme environmental events of global relevance. Despite their global occurrence and general importance on Earth, there is currently no complete stratigraphic record through an un-deformed salt giant of marine origin. Similarly, there is a significant lack of knowledge about the factors controlling salt giants deposition, their early evolution, the impact they exert on the isostatic response of continental margins and on sub-salt formations, and the unprecedented deep biosphere they may harbor. The Mediterranean Messinian salt giant, which formed 5.5 Myrs ago, is one of the youngest salt giant on Earth and is currently lying below the Plio-Quaternary cover in a relatively un-deformed state close to its original depositional configuration. This salt giant is thus accessible by drilling and forms an ideal case study that could be used as a reference for older salt giants. However, since its discovery in 1970 during the DSDP Leg XIII, and despite 40 years or multi-disciplinary researches, this salt giant is still not fully understood and remains one of the longest-living controversies in Earth Science. In this context, the IODP DREAM project aims at exploring the Mediterranean salt giant by drilling with the JOIDES Resolution a transect of 4 sites on the southern margin of the Balearic promontory (Western Mediterranean). We identified this area as likely the only place in the Mediterranean where we could implement a shallow-to-deep transect of non-riser drilling sites. Due to the geological history and pre-structuration of the Promontory, MSC deposits are found preserved in a series of sedimentary basins lying at different water depths between the present-day coastline and the deep central salt basins. DREAM thus offers a unique opportunity to sample several hundred of meters of material forming the Mediterranean salt giant in varied water depths. This unique sedimentary record should allow testing 1) the contradictory emplacement models that explain its genesis and 2) the presence of halophilic micro-organisms it may host/feed. DREAM is a part of a bigger Multi-phase IODP Drilling Project entitled "Uncovering a Salt Giant" (857-MDP, coord. A. Camerlenghi) born out of a series of workshops and international initiatives carried out since 2014. The DREAM pre-proposal P857B has been accepted by the IODP Science Evaluation Panel in January 2016. The full-proposal will be submitted after the acquisition of complementary Site Survey Data in 2017. The DREAM project is performed in close link with various international initiatives including the COST Action CA15103 and ANR Project MEDSALT (Camerlenghi et al., this congress) and the IMMAGE ICDP-IODP amphibious proposal (Flecker et al., this congress). DREAM co-proponents: J. Anton, M.A. Bassetti, D. Birgel, R. Bourillot, A. Caruso, H. Daigle, G. DeLange, F. Dela Pierre, R. Flecker, V. Gaullier, D. Hodell, F. Jimenez-Espejo, W. Krijgsman, L. Lourens, S. Lugli, V. Manzi, T. McGenity, J. McKenzie, P. Meijer, H. Moreno, A. Moscariello, P. Munch, N. Ohkouchi, J. Peckmann, P. Pezard, J. Poort, M. Roveri, F. Sierro, K. Takai, T. Treude.

Fabrication of a Cryogenic Terahertz Emitter for Bolometer Focal Plane Calibrations

NASA Technical Reports Server (NTRS)

Chervenak, James; Brown, Ari; Wollack, Edward

2012-01-01

A fabrication process is reported for prototype emitters of THz radiation, which operate cryogenically, and should provide a fast, stable blackbody source suitable for characterization of THz devices. The fabrication has been demonstrated and, at the time of this reporting, testing was underway. The emitter is similar to a monolithic silicon bolometer in design, using both a low-noise thermometer and a heater element on a thermally isolated stage. An impedance-matched, high-emissivity coat ing is also integrated to tune the blackbody properties. This emitter is designed to emit a precise amount of power as a blackbody spectrum centered on terahertz frequencies. The emission is a function of the blackbody temperature. An integrated resistive heater and thermometer system can control the temperature of the blackbody with greater precision than previous incarnations of calibration sources that relied on blackbody emission. The emitter is fabricated using a silicon- on-insulator substrate wafer. The buried oxide is chosen to be less than 1 micron thick, and the silicon device thickness is 1-2 microns. Layers of phosphorus compensated with boron are implanted into and diffused throughout the full thickness of the silicon device layer to create the thermometer and heater components. Degenerately doped wiring is implanted to connect the devices to wire-bondable contact pads at the edge of the emitter chip. Then the device is micromachined to remove the thick-handle silicon behind the thermometer and heater components, and to thermally isolate it on a silicon membrane. An impedance- matched emissive coating (ion assisted evaporated Bi) is applied to the back of the membrane to enable high-efficiency emission of the blackbody spectrum.

Capillary-Driven Microfluidic Chips for Miniaturized Immunoassays: Efficient Fabrication and Sealing of Chips Using a "Chip-Olate" Process.

PubMed

Temiz, Yuksel; Delamarche, Emmanuel

2017-01-01

The fabrication of silicon-based microfluidic chips is invaluable in supporting the development of many microfluidic concepts for research in the life sciences and in vitro diagnostic applications such as the realization of miniaturized immunoassays using capillary-driven chips. While being extremely abundant, the literature covering microfluidic chip fabrication and assay development might not have addressed properly the challenge of fabricating microfluidic chips on a wafer level or the need for dicing wafers to release chips that need then to be further processed, cleaned, rinsed, and dried one by one. Here, we describe the "chip-olate" process wherein microfluidic structures are formed on a silicon wafer, followed by partial dicing, cleaning, and drying steps. Then, integration of reagents (if any) can be done, followed by lamination of a sealing cover. Breaking by hand the partially diced wafer yields individual chips ready for use.

Surface dose measurements with commonly used detectors: a consistent thickness correction method.

PubMed

Reynolds, Tatsiana A; Higgins, Patrick

2015-09-08

The purpose of this study was to review application of a consistent correction method for the solid state detectors, such as thermoluminescent dosimeters (chips (cTLD) and powder (pTLD)), optically stimulated detectors (both closed (OSL) and open (eOSL)), and radiochromic (EBT2) and radiographic (EDR2) films. In addition, to compare measured surface dose using an extrapolation ionization chamber (PTW 30-360) with other parallel plate chambers RMI-449 (Attix), Capintec PS-033, PTW 30-329 (Markus) and Memorial. Measurements of surface dose for 6MV photons with parallel plate chambers were used to establish a baseline. cTLD, OSLs, EDR2, and EBT2 measurements were corrected using a method which involved irradiation of three dosimeter stacks, followed by linear extrapolation of individual dosimeter measurements to zero thickness. We determined the magnitude of correction for each detector and compared our results against an alternative correction method based on effective thickness. All uncorrected surface dose measurements exhibited overresponse, compared with the extrapolation chamber data, except for the Attix chamber. The closest match was obtained with the Attix chamber (-0.1%), followed by pTLD (0.5%), Capintec (4.5%), Memorial (7.3%), Markus (10%), cTLD (11.8%), eOSL (12.8%), EBT2 (14%), EDR2 (14.8%), and OSL (26%). Application of published ionization chamber corrections brought all the parallel plate results to within 1% of the extrapolation chamber. The extrapolation method corrected all solid-state detector results to within 2% of baseline, except the OSLs. Extrapolation of dose using a simple three-detector stack has been demonstrated to provide thickness corrections for cTLD, eOSLs, EBT2, and EDR2 which can then be used for surface dose measurements. Standard OSLs are not recommended for surface dose measurement. The effective thickness method suffers from the subjectivity inherent in the inclusion of measured percentage depth-dose curves and is not recommended for these types of measurements.

The bending stress distribution in bilayered and graded zirconia-based dental ceramics

PubMed Central

Fabris, Douglas; Souza, Júlio C.M.; Silva, Filipe S.; Fredel, Márcio; Mesquita-Guimarães, Joana; Zhang, Yu; Henriques, Bruno

2016-01-01

The purpose of this study was to evaluate the biaxial flexural stresses in classic bilayered and in graded zirconia-feldspathic porcelain composites. A finite element method and an analytical model were used to simulate the piston-on-ring test and to predict the biaxial stress distributions across the thickness of the bilayer and graded zirconia-feldspathic porcelain discs. An axisymmetric model and a flexure formula of Hsueh et al. were used in the FEM and analytical analysis, respectively. Four porcelain thicknesses were tested in the bilayered discs. In graded discs, continuous and stepwise transitions from the bottom zirconia layer to the top porcelain layer were studied. The resulting stresses across the thickness, measured along the central axis of the disc, for the bilayered and graded discs were compared. In bilayered discs, the maximum tensile stress decreased while the stress mismatch (at the interface) increased with the porcelain layer thickness. The optimized balance between both variables is achieved for a porcelain thickness ratio in the range of 0.30–0.35. In graded discs, the highest tensile stresses were registered for porcelain rich interlayers (p=0.25) whereas the zirconia rich ones (p=8) yield the lowest tensile stresses. In addition, the maximum stresses in a graded structure can be tailored by altering compositional gradients. A decrease in maximum stresses with increasing values of p (a scaling exponent in the power law function) was observed. Our findings showed a good agreement between the analytical and simulated models, particularly in the tensile region of the disc. Graded zirconia-feldspathic porcelain composites exhibited a more favourable stress distribution relative to conventional bilayered systems. This fact can significantly impact the clinical performance of zirconia-feldspathic porcelain prostheses, namely reducing the fracture incidence of zirconia and the chipping and delamination of porcelain. PMID:28104926

Development of a MEMS acoustic emission sensor system

NASA Astrophysics Data System (ADS)

Greve, David W.; Oppenheim, Irving J.; Wu, Wei; Wright, Amelia P.

2007-04-01

An improved multi-channel MEMS chip for acoustic emission sensing has been designed and fabricated in 2006 to create a device that is smaller in size, superior in sensitivity, and more practical to manufacture than earlier designs. The device, fabricated in the MUMPS process, contains four resonant-type capacitive transducers in the frequency range between 100 kHz and 500 kHz on a chip with an area smaller than 2.5 sq. mm. The completed device, with its circuit board, electronics, housing, and connectors, possesses a square footprint measuring 25 mm x 25 mm. The small footprint is an important attribute for an acoustic emission sensor, because multiple sensors must typically be arrayed around a crack location. Superior sensitivity was achieved by a combination of four factors: the reduction of squeeze film damping, a resonant frequency approximating a rigid body mode rather than a bending mode, a ceramic package providing direct acoustic coupling to the structural medium, and high-gain amplifiers implemented on a small circuit board. Manufacture of the system is more practical because of higher yield (lower unit costs) in the MUMPS fabrication task and because of a printed circuit board matching the pin array of the MEMS chip ceramic package for easy assembly and compactness. The transducers on the MEMS chip incorporate two major mechanical improvements, one involving squeeze film damping and one involving the separation of resonance modes. For equal proportions of hole area to plate area, a triangular layout of etch holes reduces squeeze film damping as compared to the conventional square layout. The effect is modeled analytically, and is verified experimentally by characterization experiments on the new transducers. Structurally, the transducers are plates with spring supports; a rigid plate would be the most sensitive transducer, and bending decreases the sensitivity. In this chip, the structure was designed for an order-of-magnitude separation between the first and the second mode frequency, strongly approximating the desirable rigid plate limit. The effect is modeled analytically and is verified experimentally by measurement of the resonance frequencies in the new transducers. Another improvement arises from the use of a pin grid array ceramic package, in which the MEMS chip is acoustically coupled to the structure with only two interfaces, through a ceramic medium that is negligible in thickness when compared to wavelengths of interest. Like other acoustic emission sensors, those on the 2006 MEMS chip are sensitive only to displacements normal to the surface on which the device is mounted. To overcome that long-standing limitation, a new MEMS sensor sensitive to in-plane motion has been designed, featuring a different spring-mass mechanism and creating the signal by the change in capacitance between stationary and moving fingers. Predicted damping is much lower for the case of the in-plane sensor, and squeeze-film damping is used selectively to isolate the desired in-plane mechanical response from any unwanted out-of-plane response. The new spring-mass mechanism satisfies the design rules for the PolyMUMPS fabrication (foundry) process. A 3-D MEMS sensor system is presently being fabricated, collocating two in-plane sensors and one out-of-plane sensor at the mm scale, which is very short compared to the acoustic wavelength of interest for stress waves created by acoustic emission events.

A multi-year survey of stem-end chip defect in chipping potatoes (Solanum tuberosum L.)

USDA-ARS?s Scientific Manuscript database

One of the most serious tuber quality concerns of US chip potato growers is stem-end chip defect, which is defined as a localized post-fry discoloration in and adjacent to the vasculature on the stem end portion of potato chips. The incidence and severity of stem-end chip defect vary with growing lo...

CHIP promotes thyroid cancer proliferation via activation of the MAPK and AKT pathways

DOE Office of Scientific and Technical Information (OSTI.GOV)

Zhang, Li; Liu, Lianyong; Department of Endocrinology, Shanghai Punan Hospital, Shanghai 200125

The carboxyl terminus of Hsp70-interacting protein (CHIP) is a U box-type ubiquitin ligase that plays crucial roles in various biological processes, including tumor progression. To date, the functional mechanism of CHIP in thyroid cancer remains unknown. Here, we obtained evidence of upregulation of CHIP in thyroid cancer tissues and cell lines. CHIP overexpression markedly enhanced thyroid cancer cell viability and colony formation in vitro and accelerated tumor growth in vivo. Conversely, CHIP knockdown impaired cell proliferation and tumor growth. Notably, CHIP promoted cell growth through activation of MAPK and AKT pathways, subsequently decreasing p27 and increasing cyclin D1 and p-FOXO3a expression. Ourmore » findings collectively indicate that CHIP functions as an oncogene in thyroid cancer, and is therefore a potential therapeutic target for this disease. - Highlights: • CHIP is significantly upregulated in thyroid cancer cells. • Overexpression of CHIP facilitates proliferation and tumorigenesis of thyroid cancer cells. • Silencing of CHIP inhibits the proliferation and tumorigenesis of thyroid cancer cells. • CHIP promotes thyroid cancer cell proliferation via activating the MAPK and AKT pathways.« less

Minimum constitutive relation error based static identification of beams using force method

NASA Astrophysics Data System (ADS)

Guo, Jia; Takewaki, Izuru

2017-05-01

A new static identification approach based on the minimum constitutive relation error (CRE) principle for beam structures is introduced. The exact stiffness and the exact bending moment are shown to make the CRE minimal for given displacements to beam damages. A two-step substitution algorithm—a force-method step for the bending moment and a constitutive-relation step for the stiffness—is developed and its convergence is rigorously derived. Identifiability is further discussed and the stiffness in the undeformed region is found to be unidentifiable. An extra set of static measurements is complemented to remedy the drawback. Convergence and robustness are finally verified through numerical examples.

Tectonic wedging in the forearc basin - Accretionary prism transition, Lesser Antilles forearc

NASA Technical Reports Server (NTRS)

Torrini, Rudolph, Jr.; Speed, Robert C.

1989-01-01

This paper describes regional structure of the inner forearc of the southern Lesser Antilles, which contains an extensive 50-70 km wide inner forearc deformation belt (IFDB) developed above crystalline basement of the undeformed forearc basin (FAB), close to and perhaps above its probable subduction trace with Atlantic lithosphere. The IFDB is analyzed, with emphasis placed on five transects across the belt, using mainly migrated seismic sections and balanced model cross sections. The IFDB features and its evolution are discussed, with special attention given to the major structures divided by early and late stages of development, paleobathymetric history, event timing, displacement and strain, and alternative tectonic explanations.

Nonlinear Equations of Equilibrium for Elastic Helicopter or Wind Turbine Blades Undergoing Moderate Deformation

NASA Technical Reports Server (NTRS)

Rosen, A.; Friedmann, P. P.

1978-01-01

A set of nonlinear equations of equilibrium for an elastic wind turbine or helicopter blades are presented. These equations are derived for the case of small strains and moderate rotations (slopes). The derivation includes several assumptions which are carefully stated. For the convenience of potential users the equations are developed with respect to two different systems of coordinates, the undeformed and the deformed coordinates of the blade. Furthermore, the loads acting on the blade are given in a general form so as to make them suitable for a variety of applications. The equations obtained in the study are compared with those obtained in previous studies.

Model quantification of the CO2 storage in the Los Páramos site (Duero basin, NE Spain)

NASA Astrophysics Data System (ADS)

Nardi, Albert; Grandia, Fidel; Abarca, Elena; Motis, Kilian; Molinero, Jorge

2013-04-01

The Duero basin in NW Spain is one the most promising basin for CO2 storage in the Iberian Peninsula due to the existence of favourable deep aquifers close to large CO2 emission point sources. A number of projects are presently active either for scientific research (e.g., the Hontomín site, OXI-CFB300 EPRR project) or commercial purposes (e.g., Sahagún and Los Páramos projects). The project called Los Páramos intends to assess the injection of CO2 in a group of dome-shaped structures with an estimated total capacity of 200 Mt (ranked 2nd in the Iberian Peninsula, IGME 2010). These domes were studied in the past for hydrocarbon exploration and a large body of information is available from seismic profiles (over 170 km) and 3 deep wells. The Los Páramos site is emplaced in the San Pedro Folded Band (SPFB) that consists mainly of thick-skinned thrusts of Mesozoic rocks (Triassic and Upper Cretaceous) sealed by a thick (1200-1500 m), undeformed cover of Tertiary claystones. Dome-like structures are related to thrusts leading to favourable reservoirs. The target horizon for CO2 storage is the Utrillas Fm sandstone with high porosity (13-20%) and thickness (225-250 m). In three of the domes, the Utrillas Fm is below -800m, allowing thus the storage of CO2(sc). This sandstone hosts an aquifer containing saline water, up to 50 g·L-1, according to the data from drill wells. The presence of saline groundwater is explained by water interaction with Triassic evaporite layers just underlying the Utrillas Fm sandstones. The CO2 storage at Los Paramos site is planned via injection of supercritical CO2 (CO2(sc)) in the Utrillas Fm. In general, the next four trapping mechanisms are expected, which are of increasing importance through time (1) structural, (2) residual saturation, (3) dissolution, and (4) mineral. The prediction of the mass of CO2 stored through time in any storage systems is an essential parameter in the pre-injection assessment of a geological storage. For safety reasons, it is relevant to know the mass of CO2 trapped under the different trapping mechanisms. In this work, storage quantification in the Dome B of Los Páramos site has been performed by using multiphase transport simulations with COMSOL Multiphysics. Model results predict well the amount of CO2 trapped as residual phase and the onset of the formation of CO2-rich brine fingers and their extent and evolution.

Size matters: The effects of displacement magnitude on the fluid flow properties of faults in poorly lithified sediments

NASA Astrophysics Data System (ADS)

Loveless, S. E.; Bense, V.; Turner, J.

2011-12-01

Many aquifers worldwide occur in poorly lithified sediments, often in regions that experience active tectonic deformation. Faulting of these sediments introduces heterogeneities that may affect aquifer porosity and permeability, and consequently subsurface fluid flow and groundwater storage. The specific hydrogeological effects of faults depend upon the fault architecture and deformation mechanisms. These are controlled by factors such as rheology, stratigraphy and burial depth. Here, we analyse fault permeability in poorly lithified sediments as a function of fault displacement. We have carried out detailed outcrop studies of minor normal faults at five study sites within the rapidly extending Corinth rift, Central Greece. Gravel conglomerates of giant Gilbert delta facies form productive but localised shallow aquifers within the region. Exposures reveal dense (average 20 faults per 100 m) networks of minor (0.1 to 50 m displacement) normal faults within the uplifted sequences, proximal to many of the crustal-scale normal faults. Analysis of 42 faults shows that fault zones are primarily composed of smeared beds that can either retain their definition or mix with surrounding sediment. Lenses or blocks of sediment are common in fault zones that cut beds with contrasting rheology, and a few faults have a clay core and/or damage zone. Fault thickness increases at a rate of about 0.4 m per 10 m increase in displacement. Comparison of sediment micro-structures from the field, hand samples and thin sections show grain-scale sediment mixing, fracturing of clasts, and in some cases cementation, within fault zones. In faults with displacements >12 m we also find a number of roughly parallel, highly indurated shear planes, up to 20 mm in thickness, composed of highly fragmented clasts and a fine grained matrix. Image analysis of thin sections from hand samples collected in the field was used to quantify the porosity of fault zones and adjacent undeformed sediment. These data show a reduction in average porosity from 21% (± 4) in undisturbed sediments to 14% (± 8) within fault zones. We find that fault zone porosity decreases by approximately 5% per 1 m displacement (up to 2 m displacement), as sediments undergo greater micro-scale deformation. Porosity within the shear planes of larger displacement faults (> 12 m) is significantly less than 5%. In summary, with an increase in fault displacement there is an increase in fault thickness and decrease in fault zone porosity, in addition to the occurrence of extremely low porosity shear planes. Consequently, the impact of faults in poorly lithified sediment on fluid flow is, to a large degree, dependent upon the magnitude of fault displacement.

Crustal structure of central Syria: The intracontinental Palmyride mountain belt

NASA Astrophysics Data System (ADS)

Al-Saad, Damen; Sawaf, Tarif; Gebran, Ali; Barazangi, Muawia; Best, John A.; Chaimov, Thomas A.

1992-07-01

Along a 450-km transect across central Syria seismic reflection data, borehole information, potential field data and surface geologic mapping have been combined to examine the crustal structure of the northern Arabian platform beneath Syria. The transect is surrounded by the major plate boundaries of the Middle East, including the Dead Sea transform fault system along the Levantine margin to the west, the Bitlis suture and East Anatolian fault to the north, and the Zagros collisional belt to the northeast and east. Three main tectonic provinces of the northern Arabian platform in Syria are crossed by this transect from south to north: the Rutbah uplift, the Palmyra fold-thrust belt, and the Aleppo plateau. The Rutbah uplift in southern Syria is a broad, domal basement-cored structure with a thick Phanerozoic (mostly Paleozoic) cover of 6-7 km. Isopachs based on well and seismic reflection data indicate that this region was an early Paleozoic depocenter. The Palmyra fold-thrust belt, the northeastern arm of the Syrian Arc, is a northeast-southwest-trending intracontinental mountain belt that acts as a mobile tectonic zone between the relatively stable Rutbah uplift to the south and the less stable Aleppo plateau to the north. Short-wavelength en-echelon folds characterized by relatively steep, faulted southeast flanks dominate in the southwest, most strongly deformed segment of the belt, while a complex system of deeply rooted faults and broad folds characterize the northeastern region, described in this study. The Aleppo plateau lies immediately north of the Palmyride belt, with a combined Paleozoic and Mesozoic sedimentary section that averages 4-5 km in thickness. Although this region appears relatively undeformed on seismic reflection data when compared to Palmyride deformation, a system of near-vertical, probable strike-slip faults crosscut the region in a dominantly northeasterly direction. Gravity and magnetic modeling constrains the deep crustal structure along the transect. The crustal thickness is estimated to be approximately 38 km. Interpretation of the gravity data indicates two different crustal blocks beneath the Rutbah uplift and the Aleppo plateau, and the presence of a crustal-penetrating, high-density body beneath the northeast Palmyrides. The two distinct crustal blocks suggest that they were accreted possibly along a suture zone and/or a major strike-slip fault zone located approximately in the present-day position of the Palmyrides. The age of the accretion is estimated to be Proterozoic or Early Cambrian, based on the observation of a pervasive reflection (interpreted as the Middle Cambrian Burj limestone) in the Rutbah uplift and in the Aleppo plateau and by analogy with the well-mapped Proterozoic sutures of the Arabian shield to the south.

Packaging Technology Designed, Fabricated, and Assembled for High-Temperature SiC Microsystems

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2003-01-01

A series of ceramic substrates and thick-film metalization-based prototype microsystem packages designed for silicon carbide (SiC) high-temperature microsystems have been developed for operation in 500 C harsh environments. These prototype packages were designed, fabricated, and assembled at the NASA Glenn Research Center. Both the electrical interconnection system and the die-attach scheme for this packaging system have been tested extensively at high temperatures. Printed circuit boards used to interconnect these chip-level packages and passive components also are being fabricated and tested. NASA space and aeronautical missions need harsh-environment, especially high-temperature, operable microsystems for probing the inner solar planets and for in situ monitoring and control of next-generation aeronautical engines. Various SiC high-temperature-operable microelectromechanical system (MEMS) sensors, actuators, and electronics have been demonstrated at temperatures as high as 600 C, but most of these devices were demonstrated only in the laboratory environment partially because systematic packaging technology for supporting these devices at temperatures of 500 C and beyond was not available. Thus, the development of a systematic high-temperature packaging technology is essential for both in situ testing and the commercialization of high-temperature SiC MEMS. Researchers at Glenn developed new prototype packages for high-temperature microsystems using ceramic substrates (aluminum nitride and 96- and 90-wt% aluminum oxides) and gold (Au) thick-film metalization. Packaging components, which include a thick-film metalization-based wirebond interconnection system and a low-electrical-resistance SiC die-attachment scheme, have been tested at temperatures up to 500 C. The interconnection system composed of Au thick-film printed wire and 1-mil Au wire bond was tested in 500 C oxidizing air with and without 50-mA direct current for over 5000 hr. The Au thick-film metalization-based wirebond electrical interconnection system was also tested in an extremely dynamic thermal environment to assess thermal reliability. The I-V curve1 of a SiC high-temperature diode was measured in oxidizing air at 500 C for 1000 hr to electrically test the Au thick-film material-based die-attach assembly.

YAG glass-ceramic phosphor for white LED (II): luminescence characteristics

NASA Astrophysics Data System (ADS)

Tanabe, Setsuhisa; Fujita, Shunsuke; Yoshihara, Satoru; Sakamoto, Akihiko; Yamamoto, Shigeru

2005-09-01

Optical properties of the Ce:YAG glass-ceramic (GC) phosphor for the white LED were investigated. Concentration dependence of fluorescence intensity of Ce3+:5d→4f transition in the GC showed a maximum at 0.5mol%Ce2O3. Quantum efficiency (QE) of Ce3+ fluorescence in the GC materials, the color coordinate and luminous flux of electroluminescence of LED composite were evaluated with an integrating sphere. QE increased with increasing ceramming temperature of the as-made glass. The color coordinates (x,y) of the composite were increased with increasing thickness of the GC mounted on a blue LED chip. The effect of Gd2O3 substitution on the optical properties of the GC materials was also investigated. The excitation and emission wavelength shifted to longer side up to Gd/(Y+Gd)=0.40 in molar composition. As a result, the color coordinate locus of the LED with various thickness of the GdYAG-GC shifted to closer to the Planckian locus for the blackbody radiation. These results were explained by partial substitution of Gd3+ ions in the precipitated YAG micro-crystals, leading to the increase of lattice constant of unit cell, which was confirmed by X-ray diffraction.

Low Voltage Electrowetting-on-Dielectric Platform using Multi-Layer Insulators

PubMed Central

Lin, Yan-You; Evans, Randall D.; Welch, Erin; Hsu, Bang-Ning; Madison, Andrew C.; Fair, Richard B.

2010-01-01

A low voltage, two-level-metal, and multi-layer insulator electrowetting-on-dielectric (EWD) platform is presented. Dispensing 300pl droplets from 140nl closed on-chip reservoirs was accomplished with as little as 11.4V solely through EWD forces, and the actuation threshold voltage was 7.2V with a 1Hz voltage switching rate between electrodes. EWD devices were fabricated with a multilayer insulator consisting of 135nm sputtered tantalum pentoxide (Ta2O5) and 180nm parylene C coated with 70nm of CYTOP. Furthermore, the minimum actuation threshold voltage followed a previously published scaling model for the threshold voltage, VT, which is proportional to (t/εr)1/2, where t and εr are the insulator thickness and dielectric constant respectively. Device threshold voltages are compared for several insulator thicknesses (200nm, 500nm, and 1µm), different dielectric materials (parylene C and tantalum pentoxide), and homogeneous versus heterogeneous compositions. Additionally, we used a two-level-metal fabrication process, which enables the fabrication of smaller and denser electrodes with high interconnect routing flexibility. We also have achieved low dispensing and actuation voltages for scaled devices with 30pl droplets. PMID:20953362

Simulation of angular and energy distributions of the PTB beta secondary standard.

PubMed

Faw, R E; Simons, G G; Gianakon, T A; Bayouth, J E

1990-09-01

Calculations and measurements have been performed to assess radiation doses delivered by the PTB Secondary Standard that employs 147Pm, 204Tl, and 90Sr:90Y sources in prescribed geometries, and features "beam-flattening" filters to assure uniformity of delivered doses within a 5-cm radius of the axis from source to detector plane. Three-dimensional, coupled, electron-photon Monte Carlo calculations, accounting for transmission through the source encapsulation and backscattering from the source mounting, led to energy spectra and angular distributions of electrons penetrating the source encapsulation that were used in the representation of pseudo sources of electrons for subsequent transport through the atmosphere, filters, and detectors. Calculations were supplemented by measurements made using bare LiF TLD chips on a thick polymethyl methacrylate phantom. Measurements using the 204Tl and 90Sr:90Y sources revealed that, even in the absence of the beam-flattening filters, delivered dose rates were very uniform radially. Dosimeter response functions (TLD:skin dose ratios) were calculated and confirmed experimentally for all three beta-particle sources and for bare LiF TLDs ranging in mass thickness from 10 to 235 mg cm-2.

Doping-tunable thermal emission from plasmon polaritons in semiconductor epsilon-near-zero thin films

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jun, Young Chul, E-mail: youngchul.jun@inha.ac.kr; Luk, Ting S., E-mail: tsluk@sandia.gov; Brener, Igal

2014-09-29

We utilize the unique dispersion properties of leaky plasmon polaritons in epsilon-near-zero (ENZ) thin films to demonstrate thermal radiation control. Owing to its highly flat dispersion above the light line, a thermally excited leaky wave at the ENZ frequency out-couples into free space without any scattering structures, resulting in a narrowband, wide-angle, p-polarized thermal emission spectrum. We demonstrate this idea by measuring angle- and polarization-resolved thermal emission spectra from a single layer of unpatterned, doped semiconductors with deep-subwavelength film thickness (d/λ{sub 0} ∼ 6×10{sup −3}, where d is the film thickness and  λ{sub 0} is the free space wavelength). We show thatmore » this semiconductor ENZ film effectively works as a leaky wave thermal radiation antenna, which generates far-field radiation from a thermally excited mode. The use of semiconductors makes the radiation frequency highly tunable by controlling doping densities and also facilitates device integration with other components. Therefore, this leaky plasmon polariton emission from semiconductor ENZ films provides an avenue for on-chip control of thermal radiation.« less

Measurement of resistance switching dynamics in copper sulfide memristor structures

NASA Astrophysics Data System (ADS)

McCreery, Kaitlin; Olson, Matthew; Teitsworth, Stephen

Resistance switching materials are the subject of current research in large part for their potential to enable novel computing devices and architectures such as resistance random access memories and neuromorphic chips. A common feature of memristive structures is the hysteretic switching between high and low resistance states which is induced by the application of a sufficiently large electric field. Here, we describe a relatively simple wet chemistry process to fabricate Cu2 S / Cu memristive structures with Cu2 S film thickness ranging up to 150 micron. In this case, resistance switching is believed to be mediated by electromigration of Cu ions from the Cu substrate into the Cu2 S film. Hysteretic current-voltage curves are measured and reveal switching voltages of about 0.8 Volts with a relatively large variance and independent of film thickness. In order to gain insight into the dynamics and variability of the switching process, we have measured the time-dependent current response to voltage pulses of varying height and duration with a time resolution of 1 ns. The transient response consists of a deterministic RC component as well as stochastically varying abrupt current steps that occur within a few microseconds of the pulse application.

Thin film thermocouples for thermoelectric characterization of nanostructured materials

NASA Astrophysics Data System (ADS)

Grayson, Matthew; Zhou, Chuanle; Varrenti, Andrew; Chyung, Seung Hye; Long, Jieyi; Memik, Seda

2011-03-01

The increased use of nanostructured materials as thermoelectrics requires reliable and accurate characterization of the anisotropic thermal coefficients of small structures, such as superlattices and quantum wire networks. Thin evaporated metal films can be used to create thermocouples with a very small thermal mass and low thermal conductivity, in order to measure thermal gradients on nanostructures and thereby measure the thermal conductivity and the Seebeck coefficient of the nanostructure. In this work we confirm the known result that thin metal films have lower Seebeck coefficients than bulk metals, and we also calibrate the Seebeck coefficient of a thin-film Ni/Cr thermocouple with 50 nm thickness, showing it to have about 1/4 the bulk value. We demonstrate reproducibility of this thin-filmSeebeck coefficient on multiple substrates, and we show that this coefficient does, in fact, change as a function of film thickness. We will discuss prototype measurement designs and preliminary work as to how these thin films can be used to study both Seebeck coefficients and thermal conductivities of superlattices in various geometries. The same technology can in principle be used on integrated circuits for thermal mapping, under the name ``Integrated On-Chip Thermocouple Array'' (IOTA).

Iron layer-dependent surface-enhanced raman scattering of hierarchical nanocap arrays

NASA Astrophysics Data System (ADS)

Chen, Lei; Sun, Huanhuan; Zhao, Yue; Gao, Renxian; Wang, Yaxin; Liu, Yang; Zhang, Yongjun; Hua, Zhong; Yang, Jinghai

2017-11-01

In this report, we fabricated the multi-layer Ag/Fe/Ag sandwich cap-shaped films on monolayer non-closed packed (ncp) polystyrene colloidal particle (PSCP) templates through a layer-by-layer (LBL) depositing method. This research focused on the surface-enhanced Raman scattering (SERS) effect of the thickness of the deposited Fe film which was controlled by the sputtering time. The SERS intensities were increased firstly, and then decreased as the thickness of Fe layer grows gradually, which is attributed to the charge transition from the Fermi level of the Ag NPs to Fe layer. The use of multi-layer Ag/Fe/Ag sandwich cap-shaped films enables us to evaluate the contribution of surface plasmon resonance and charge distribution between Ag and Fe to SERS enhancement. Our work introduced a novel system (Ag/Fe/Ag) for high performance SERS and extended the SERS application of Fe. Furthermore, we have designed the Ag/Fe/Ag SERS-active substrate as the immunoassay chip for quantitative determination of AFP-L3 which is the biomarker of hepatocellular carcinoma (HCC). The proposed research demonstrates that the SERS substrates with Ag/Fe/Ag sandwich cap-shaped arrays have a high sensitivity for bioassay.

How Much Ocean Is Left Between Libya and Crete

NASA Astrophysics Data System (ADS)

Makris, J.; Yegorova, T.

The intense deformation of the Hellenides is due to crustal shortening and the collision between the European and African Plates. This processes creates the Mediterranean accretionary wedge known as Mediterranean Ridge, which is composed of thick sedi- mentary sequences exceeding 10 km in thickness. The stage of this collision has been under dispute for many years. We performed wide aperture seismic soundings between Crete and Libya along 5 seismic lines. The results were used to constrain gravity mod- elling and develop density models in 2D and 3D between Libya and the Cretan Sea. We identified the limits of the European continental crust extending south of Crete for more than 100 km and building the backstop of the sediment accumulation . The African continental crust extends to the north for about 80 to 100 km, so that the remaining space floored by the oceanic Thethian basement is at its narrowest point not more than 100 to 120 km wide. By modelling in 3D the gravity field of the sedi- ments, crust and uppermost mantle we identified significant variations of the density distribution of the upper mantle. The young intensely deforming area of the Aegean domain is floored by low density upper mantle due to the mobilization of magma and the activation of the thermal regime. The subducted cold oceanic slab sinks below the Cretan crust in NE orientation and is decupled from the continental crust between central Crete and the southeastern edge of the Peloponnese. The deformation of the sediments controlled by the compressional processes have their maximum accumu- lation at the limits of the backstop. Here the transition of the deep trough to the flat and nearly undeformed sedimentary sequence is very abrupt and the transition oc- curs along vertical displacements of 6 to 8 km near vertical throw. Near the southern transition of the oceanic crust to the African continental domain obducted ophiolites extend over large areas explaining gravity highs and also observed intense magnetic anomalies. The computed gravity field fits the observed one in all its low frequency spectrum. We avoided modelling the high frequency part of the field since the seismic 1 information was not dense enough to justify the effort. 2

Field-based perspective on fault rock evolution and microstructures in low-angle fault zones (W-Cyclades, Greece)

NASA Astrophysics Data System (ADS)

Grasemann, Bernhard

2010-05-01

The mechanics of sub-horizontal faults, typically active at the brittle/ductile transition zone, are still controversial because they do not conform to current fault-mechanical theory. In the Western Cyclades (Greece) conjugate high-angle brittle faults mechanically interact with sub-horizontal faults and therefore models based on fault and/or stress rotation can be rejected. A range of different deformation mechanisms and/or rock properties must have resulted in an reduction of the fault strength in both the ductily and cataclastically deformed fault rocks. Typically the low-angle faults have following characteristics: The footwall below the subhorizontal faults consists of coarse-grained impure marbles and greenschists, which record an increase in shear strain localizing in several meters to tens of meters thick ultra fine-grained marble mylonites. These ultamylonites are delimited along a knife-sharp slickenside plane juxtaposing tens of decimeter thick zones of polyphase ultracataclasites. The marbles accommodated high shear strain by ductile deformation mechanisms such as dislocation creep and/or grain size sensitive flow by recrystallization, which might have result in fault zone weakening. Typically the marbles are impure and record spatial arrangement of mica and quartz grains, which might have lead to structural softening by decoupling of the calcite matrix from the clasts. During brittle deformation the massif marble ultramylonites act as a strong plate and ultracataclastic deformation is localizing exactly along the border of this plate. Although some of the cataclastic deformation mechanisms lead to chaotic fabrics with evidence for frictional sliding and comminution, others favor the formation of foliated cataclasites and fault gouges with various intensities of phyllosilicate fabrics. Frequently, a repeated switch between grain fracturing processes and processes, which created a sc or scc'-type foliation can be observed. On Serifos the low-angle fault cuts the roof of a pluton, recording progressive deformation of the undeformed granodiorite at lower structural levels, to mylonitic granodiorite within the shear zone. Although there were almost no whole-rock compositional, mass or volume changes in the strongly deformed footwall, the weakly foliated granodiorite in the hanging wall has been heavily fractured and totally bleached by fluid infiltration. Concluding, a wide range of different deformation mechanisms, both in the ductile and the brittle field, acted during formation of the low-angle faults in the Western Cyclades.

Low-power chip-level optical interconnects based on bulk-silicon single-chip photonic transceivers

NASA Astrophysics Data System (ADS)

Kim, Gyungock; Park, Hyundai; Joo, Jiho; Jang, Ki-Seok; Kwack, Myung-Joon; Kim, Sanghoon; Kim, In Gyoo; Kim, Sun Ae; Oh, Jin Hyuk; Park, Jaegyu; Kim, Sanggi

2016-03-01

We present new scheme for chip-level photonic I/Os, based on monolithically integrated vertical photonic devices on bulk silicon, which increases the integration level of PICs to a complete photonic transceiver (TRx) including chip-level light source. A prototype of the single-chip photonic TRx based on a bulk silicon substrate demonstrated 20 Gb/s low power chip-level optical interconnects between fabricated chips, proving that this scheme can offer compact low-cost chip-level I/O solutions and have a significant impact on practical electronic-photonic integration in high performance computers (HPC), cpu-memory interface, 3D-IC, and LAN/SAN/data-center and network applications.

Epitaxially grown BaM hexaferrite films having uniaxial axis in the film plane for self-biased devices

PubMed Central

Zhang, Xiaozhi; Meng, Siqin; Song, Dongsheng; Zhang, Yao; Yue, Zhenxing; Harris, Vincent G.

2017-01-01

Barium hexaferrite (BaM) films with in-plane c-axis orientation are promising and technically important materials for self-biased magnetic microwave devices. In this work, highly oriented BaM films with different thickness and an in-plane easy axis (c-axis) of magnetization were grown on a-plane single-crystal sapphire substrates by direct current magnetron sputtering. A procedure involving seed layers, layer-by-layer annealing was adopted to reduce the substrate-induced strains and allow for the growth of thick (~3.44 μm) films. The epitaxial growth of the BaM film on sapphire was revealed by high-resolution transmission electron microscopy with dislocations being observed at the film-substrate interface. The orientation was also verified by X-ray diffraction and more notably, polarized Raman scattering. The magnetic properties and ferromagnetic resonant frequencies were experimentally characterized by a vibrating sample magnetometry and a frequency-swept ferromagnetic resonant flip-chip technique, respectively. The micron-thick BaM films exhibited a large remanence ratio of 0.92 along in-plane easy axis and a small one of 0.09 for the in-plane hard axis loop measurement. The FMR frequency was 50.3 GHz at zero field and reached 57.9 GHz under a magnetic field of 3 kOe, indicating that the epitaxial BaM films with strong self-biased behaviors have good electromagnetic properties in millimeter-wave range. PMID:28276492

A radiation detector design mitigating problems related to sawed edges

NASA Astrophysics Data System (ADS)

Aurola, A.; Marochkin, V.; Tuuva, T.

2014-12-01

In pixelated silicon radiation detectors that are utilized for the detection of UV, visible, and in particular Near Infra-Red (NIR) light it is desirable to utilize a relatively thick fully depleted Back-Side Illuminated (BSI) detector design providing 100% Fill Factor (FF), low Cross-Talk (CT), and high Quantum Efficiency (QE). The optimal thickness of such detectors is typically less than 300μm and above 40μm and thus it is more or less mandatory to thin the detector wafer from the backside after the front side of the detector has been processed and before a conductive layer is formed on the backside. A TAIKO thinning process is optimal for such a thickness range since neither a support substrate on the front side nor lithographic steps on the backside are required. The conductive backside layer should, however, be homogenous throughout the wafer and it should be biased from the front side of the detector. In order to provide good QE for blue and UV light the conductive backside layer should be of opposite doping type than the substrate. The problem with a homogeneous backside layer being of opposite doping type than the substrate is that a lot of leakage current is typically generated at the sawed chip edges, which may increase the dark noise and the power consumption. These problems are substantially mitigated with a proposed detector edge arrangement which 2D simulation results are presented in this paper.

Epitaxially grown BaM hexaferrite films having uniaxial axis in the film plane for self-biased devices.

PubMed

Zhang, Xiaozhi; Meng, Siqin; Song, Dongsheng; Zhang, Yao; Yue, Zhenxing; Harris, Vincent G

2017-03-09

Barium hexaferrite (BaM) films with in-plane c-axis orientation are promising and technically important materials for self-biased magnetic microwave devices. In this work, highly oriented BaM films with different thickness and an in-plane easy axis (c-axis) of magnetization were grown on a-plane single-crystal sapphire substrates by direct current magnetron sputtering. A procedure involving seed layers, layer-by-layer annealing was adopted to reduce the substrate-induced strains and allow for the growth of thick (~3.44 μm) films. The epitaxial growth of the BaM film on sapphire was revealed by high-resolution transmission electron microscopy with dislocations being observed at the film-substrate interface. The orientation was also verified by X-ray diffraction and more notably, polarized Raman scattering. The magnetic properties and ferromagnetic resonant frequencies were experimentally characterized by a vibrating sample magnetometry and a frequency-swept ferromagnetic resonant flip-chip technique, respectively. The micron-thick BaM films exhibited a large remanence ratio of 0.92 along in-plane easy axis and a small one of 0.09 for the in-plane hard axis loop measurement. The FMR frequency was 50.3 GHz at zero field and reached 57.9 GHz under a magnetic field of 3 kOe, indicating that the epitaxial BaM films with strong self-biased behaviors have good electromagnetic properties in millimeter-wave range.

Effects of calcium supplements on the quality and acrylamide content of puffed shrimp chips.

PubMed

Chen, Tai-Yuan; Luo, Hsuan-Min; Hsu, Pang-Hung; Sung, Wen-Chieh

2016-01-01

The quality and acrylamide content of deep-fried and microwave-puffed shrimp chips fortified with 0.1%, 0.5%, or 1.0% calcium salts (calcium lactate, calcium carbonate, calcium citrate, or calcium acetate) were investigated. Microwave-puffed shrimp chips contained higher amounts of acrylamide (130.43 ppb) than did deep-fried shrimp chips. The greatest mitigation of acrylamide formation in overfried chips was obtained with 0.1% calcium lactate. All browning indexes of fortified shrimp chips, whether deep-fried or microwave-puffed, were reduced. L* values of microwave-puffed shrimp chips were higher than those of deep-fried shrimp chips, whereas a* and b* values and browning indexes were lower. Color differences (ΔE) between deep-fried puffed shrimp chips fortified with calcium salts and a control sample were higher than 5, and the sensory scores of shrimp chips were significantly decreased by the addition of calcium lactate. Copyright © 2015. Published by Elsevier B.V.

1H, 15N and 13C resonance assignments for free and IEEVD peptide-bound forms of the tetratricopeptide repeat domain from the human E3 ubiquitin ligase CHIP.

PubMed

Zhang, Huaqun; McGlone, Cameron; Mannion, Matthew M; Page, Richard C

2017-04-01

The ubiquitin ligase CHIP catalyzes covalent attachment of ubiquitin to unfolded proteins chaperoned by the heat shock proteins Hsp70/Hsc70 and Hsp90. CHIP interacts with Hsp70/Hsc70 and Hsp90 by binding of a C-terminal IEEVD motif found in Hsp70/Hsc70 and Hsp90 to the tetratricopeptide repeat (TPR) domain of CHIP. Although recruitment of heat shock proteins to CHIP via interaction with the CHIP-TPR domain is well established, alterations in structure and dynamics of CHIP upon binding are not well understood. In particular, the absence of a structure for CHIP-TPR in the free form presents a significant limitation upon studies seeking to rationally design inhibitors that may disrupt interactions between CHIP and heat shock proteins. Here we report the 1 H, 13 C, and 15 N backbone and side chain chemical shift assignments for CHIP-TPR in the free form, and backbone chemical shift assignments for CHIP-TPR in the IEEVD-bound form. The NMR resonance assignments will enable further studies examining the roles of dynamics and structure in regulating interactions between CHIP and the heat shock proteins Hsp70/Hsc70 and Hsp90.

In situ measurement of the junction temperature of light emitting diodes using a flexible micro temperature sensor.

PubMed

Lee, Chi-Yuan; Su, Ay; Liu, Yin-Chieh; Fan, Wei-Yuan; Hsieh, Wei-Jung

2009-01-01

This investigation aimed to fabricate a flexible micro resistive temperature sensor to measure the junction temperature of a light emitting diode (LED). The junction temperature is typically measured using a thermal resistance measurement approach. This approach is limited in that no standard regulates the timing of data capture. This work presents a micro temperature sensor that can measure temperature stably and continuously, and has the advantages of being lightweight and able to monitor junction temperatures in real time. Micro-electro-mechanical-systems (MEMS) technologies are employed to minimize the size of a temperature sensor that is constructed on a stainless steel foil substrate (SS-304 with 30 μm thickness). A flexible micro resistive temperature sensor can be fixed between the LED chip and the frame. The junction temperature of the LED can be measured from the linear relationship between the temperature and the resistance. The sensitivity of the micro temperature sensor is 0.059 ± 0.004 Ω/°C. The temperature of the commercial CREE(®) EZ1000 chip is 119.97 °C when it is thermally stable, as measured using the micro temperature sensor; however, it was 126.9 °C, when measured by thermal resistance measurement. The micro temperature sensor can be used to replace thermal resistance measurement and performs reliably.

Manufacturing and testing VLPC hybrids

NASA Astrophysics Data System (ADS)

Adkins, L. R.; Ingram, C. M.; Anderson, E. J.

1998-11-01

To insure that the manufacture of VLPC devices is a reliable, cost-effective technology, hybrid assembly procedures and testing methods suitable for large scale production have been developed. This technology has been developed under a contract from Fermilab as part of the D-Zero upgrade program. Each assembled hybrid consists of a VLPC chip mounted on an AlN substrate. The VLPC chip is provided with bonding pads (one connected to each pixel) which are wire bonded to gold traces on the substrate. The VLPC/AlN hybrids are mated in a vacuum sealer using solder preforms and a specially designed carbon boat. After mating, the VLPC pads are bonded to the substrate with an automatic wire bonder. Using this equipment we have achieved a thickness tolerance of ±0.0007 inches and a production rate of 100 parts per hour. After assembly the VLPCs are tested for optical response at an operating temperature of 7K. The parts are tested in a custom designed continuous-flow dewar with a capacity 15 hybrids, and one Lake Shore DT470-SD-11 calibrated temperature sensor mounted to an AlN substrate. Our facility includes five of these dewars with an ultimate test capacity of 75 parts per day. During the course of the Dzero program we have assembled more than 4,000 VLPC hybrids and have tested more than 2,500 with a high yield.

Optimization of the polyplanar optical display electronics for a monochrome B-52 display

NASA Astrophysics Data System (ADS)

DeSanto, Leonard

1998-09-01

The Polyplanar Optical Display (POD) is a unique display screen which can be used with any projection source. The prototype ten-inch display is two inches thick and has a matte black face which allows for high contrast images. The prototype being developed is a form, fit and functional replacement display for the B-52 aircraft which uses a monochrome ten-inch display. In order to achieve a long lifetime, the new display uses a new 200 mW green solid-state laser (10,000 hr. life) at 532 nm as its light source. To produce real-time video, the laser light is being modulated by a Digital Light Processing (DLPTM) chip manufactured by Texas Instruments (TI). In order to use the solid-state laser as the light source and also fit within the constraints of the B-52 display, the Digital Micromirror Device (DMDTM) chip is operated remotely from the Texas Instruments circuit board. In order to achieve increased brightness a monochrome digitizing interface was investigated. The operation of the DMDTM divorced from the light engine and the interfacing of the DMDTM board with the RS-170 video format specific to the B-52 aircraft will be discussed, including the increased brightness of the monochrome digitizing interface. A brief description of the electronics required to drive the new 200 mW laser is also presented.

Alumina Based 500 C Electronic Packaging Systems and Future Development

NASA Technical Reports Server (NTRS)

Chen, Liang-Yu

2012-01-01

NASA space and aeronautical missions for probing the inner solar planets as well as for in situ monitoring and control of next-generation aeronautical engines require high-temperature environment operable sensors and electronics. A 96% aluminum oxide and Au thick-film metallization based packaging system including chip-level packages, printed circuit board, and edge-connector is in development for high temperature SiC electronics. An electronic packaging system based on this material system was successfully tested and demonstrated with SiC electronics at 500 C for over 10,000 hours in laboratory conditions previously. In addition to the tests in laboratory environments, this packaging system has more recently been tested with a SiC junction field effect transistor (JFET) on low earth orbit through the NASA Materials on the International Space Station Experiment 7 (MISSE7). A SiC JFET with a packaging system composed of a 96% alumina chip-level package and an alumina printed circuit board mounted on a data acquisition circuit board was launched as a part of the MISSE7 suite to International Space Station via a Shuttle mission and tested on the orbit for eighteen months. A summary of results of tests in both laboratory and space environments will be presented. The future development of alumina based high temperature packaging using co-fired material systems for improved performance at high temperature and more feasible mass production will also be discussed.

Suspended mid-infrared fiber-to-chip grating couplers for SiGe waveguides

NASA Astrophysics Data System (ADS)

Favreau, Julien; Durantin, Cédric; Fédéli, Jean-Marc; Boutami, Salim; Duan, Guang-Hua

2016-03-01

Silicon photonics has taken great importance owing to the applications in optical communications, ranging from short reach to long haul. Originally dedicated to telecom wavelengths, silicon photonics is heading toward circuits handling with a broader spectrum, especially in the short and mid-infrared (MIR) range. This trend is due to potential applications in chemical sensing, spectroscopy and defense in the 2-10 μm range. We previously reported the development of a MIR photonic platform based on buried SiGe/Si waveguide with propagation losses between 1 and 2 dB/cm. However the low index contrast of the platform makes the design of efficient grating couplers very challenging. In order to achieve a high fiber-to-chip efficiency, we propose a novel grating coupler structure, in which the grating is locally suspended in air. The grating has been designed with a FDTD software. To achieve high efficiency, suspended structure thicknesses have been jointly optimized with the grating parameters, namely the fill factor, the period and the grating etch depth. Using the Efficient Global Optimization (EGO) method we obtained a configuration where the fiber-to-waveguide efficiency is above 57 %. Moreover the optical transition between the suspended and the buried SiGe waveguide has been carefully designed by using an Eigenmode Expansion software. Transition efficiency as high as 86 % is achieved.

Rapid bonding of Pyrex glass microchips.

PubMed

Akiyama, Yoshitake; Morishima, Keisuke; Kogi, Atsuna; Kikutani, Yoshikuni; Tokeshi, Manabu; Kitamori, Takehiko

2007-03-01

A newly developed vacuum hot press system has been specially designed for the thermal bonding of glass substrates in the fabrication process of Pyrex glass microchemical chips. This system includes a vacuum chamber equipped with a high-pressure piston cylinder and carbon plate heaters. A temperature of up to 900 degrees C and a force of as much as 9800 N could be applied to the substrates in a vacuum atmosphere. The Pyrex substrates bonded with this system under different temperatures, pressures, and heating times were evaluated by tensile strength tests, by measurements of thickness, and by observations of the cross-sectional shapes of the microchannels. The optimal bonding conditions of the Pyrex glass substrates were 570 degrees C for 10 min under 4.7 N/mm(2) of applied pressure. Whereas more than 16 h is required for thermal bonding with a conventional furnace, the new system could complete the whole bonding processes within just 79 min, including heating and cooling periods. Such improvements should considerably enhance the production rate of Pyrex glass microchemical chips. Whereas flat and dust-free surfaces are required for conventional thermal bonding, especially without long and repeated heating periods, our hot press system could press a fine dust into glass substrates so that even the areas around the dust were bonded. Using this capability, we were able to successfully integrate Pt/Ti thin film electrodes into a Pyrex glass microchip.

Novel conformal organic antireflective coatings for advanced I-line lithography

NASA Astrophysics Data System (ADS)

Deshpande, Shreeram V.; Nowak, Kelly A.; Fowler, Shelly; Williams, Paul; Arjona, Mikko

2001-08-01

Flash memory chips are playing a critical role in semiconductor devices due to increased popularity of hand held electronic communication devices such as cell phones and PDAs (personal Digital Assistants). Flash memory offers two primary advantages in semiconductor devices. First, it offers flexibility of in-circuit programming capability to reduce the loss from programming errors and to significantly reduce commercialization time to market for new devices. Second, flash memory has a double density memory capability through stacked gate structures which increases the memory capability and thus saves significantly on chip real estate. However, due to stacked gate structures the requirements for manufacturing of flash memory devices are significantly different from traditional memory devices. Stacked gate structures also offer unique challenges to lithographic patterning materials such as Bottom Anti-Reflective Coating (BARC) compositions used to achieve CD control and to minimize standing wave effect in photolithography. To be applicable in flash memory manufacturing a BARC should form a conformal coating on high topography of stacked gate features as well as provide the normal anti-reflection properties for CD control. In this paper we report on a new highly conformal advanced i-line BARC for use in design and manufacture of flash memory devices. Conformal BARCs being significantly thinner in trenches than the planarizing BARCs offer the advantage of reducing BARC overetch and thus minimizing resist thickness loss.

Quantum efficiency measurements of eROSITA pnCCDs

NASA Astrophysics Data System (ADS)

Ebermayer, Stefanie; Andritschke, Robert; Elbs, Johannes; Meidinger, Norbert; Strüder, Lothar; Hartmann, Robert; Gottwald, Alexander; Krumrey, Michael; Scholze, Frank

2010-07-01

For the eROSITA X-ray telescope, which is planned to be launched in 2012, detectors were developed and fabricated at the MPI Semiconductor Laboratory. The fully depleted, back-illuminated pnCCDs have an ultrathin pn-junction to improve the low-energy X-ray response function and quantum efficiency. The device thickness of 450 μm is fully sensitive to X-ray photons yielding high quantum efficiency of more than 90% at photon energies of 10 keV. An on-chip filter is deposited on top of the entrance window to suppress visible and UV light which would interfere with the X-ray observations. The pnCCD type developed for the eROSITA telescope was characterized in terms of quantum efficiency and spectral response function. The described measurements were performed in 2009 at the synchrotron radiation sources BESSY II and MLS as cooperation between the MPI Semiconductor Laboratory and the Physikalisch-Technische Bundesanstalt (PTB). Quantum efficiency measurements over a wide range of photon energies from 3 eV to 11 keV as well as spectral response measurements are presented. For X-ray energies from 3 keV to 10 keV the quantum efficiency of the CCD including on-chip filter is shown to be above 90% with an attenuation of visible light of more than five orders of magnitude. A detector response model is described and compared to the measurements.

Imaging performance of a Timepix detector based on semi-insulating GaAs

NASA Astrophysics Data System (ADS)

Zaťko, B.; Zápražný, Z.; Jakůbek, J.; Šagátová, A.; Boháček, P.; Sekáčová, M.; Korytár, D.; Nečas, V.; Žemlička, J.; Mora, Y.; Pichotka, M.

2018-01-01

This work focused on a Timepix chip [1] coupled with a bulk semi-insulating GaAs sensor. The sensor consisted of a matrix of 256 × 256 pixels with a pitch of 55 μm bump-bonded to a Timepix ASIC. The sensor was processed on a 350 μm-thick SI GaAs wafer. We carried out detector adjustment to optimize its performance. This included threshold equalization with setting up parameters of the Timepix chip, such as Ikrum, Pream, Vfbk, and so on. The energy calibration of the GaAs Timepix detector was realized using a 241Am radioisotope in two Timepix detector modes: time-over-threshold and threshold scan. An energy resolution of 4.4 keV in FWHM (Full Width at Half Maximum) was observed for 59.5 keV γ-photons using threshold scan mode. The X-ray imaging quality of the GaAs Timepix detector was tested using various samples irradiated by an X-ray source with a focal spot size smaller than 8 μm and accelerating voltage up to 80 kV. A 700 μm × 700 μm gold testing object (X-500-200-16Au with Siemens star) fabricated with high precision was used for the spatial resolution testing at different values of X-ray image magnification (up to 45). The measured spatial resolution of our X-ray imaging system was about 4 μm.

Neuron array with plastic synapses and programmable dendrites.

PubMed

Ramakrishnan, Shubha; Wunderlich, Richard; Hasler, Jennifer; George, Suma

2013-10-01

We describe a novel neuromorphic chip architecture that models neurons for efficient computation. Traditional architectures of neuron array chips consist of large scale systems that are interfaced with AER for implementing intra- or inter-chip connectivity. We present a chip that uses AER for inter-chip communication but uses fast, reconfigurable FPGA-style routing with local memory for intra-chip connectivity. We model neurons with biologically realistic channel models, synapses and dendrites. This chip is suitable for small-scale network simulations and can also be used for sequence detection, utilizing directional selectivity properties of dendrites, ultimately for use in word recognition.

ChIP and ChIP-Related Techniques: Expanding the Fields of Application and Improving ChIP Performance.

PubMed

Visa, Neus; Jordán-Pla, Antonio

2018-01-01

Protein-DNA interactions in vivo can be detected and quantified by chromatin immunoprecipitation (ChIP). ChIP has been instrumental for the advancement of epigenetics and has set the groundwork for the development of a number of ChIP-related techniques that have provided valuable information about the organization and function of genomes. Here, we provide an introduction to ChIP and discuss the applications of ChIP in different research areas. We also review some of the strategies that have been devised to improve ChIP performance.

Process for 3D chip stacking

DOEpatents

Malba, V.

1998-11-10

A manufacturable process for fabricating electrical interconnects which extend from a top surface of an integrated circuit chip to a sidewall of the chip using laser pantography to pattern three dimensional interconnects. The electrical interconnects may be of an L-connect or L-shaped type. The process implements three dimensional (3D) stacking by moving the conventional bond or interface pads on a chip to the sidewall of the chip. Implementation of the process includes: (1) holding individual chips for batch processing, (2) depositing a dielectric passivation layer on the top and sidewalls of the chips, (3) opening vias in the dielectric, (4) forming the interconnects by laser pantography, and (5) removing the chips from the holding means. The process enables low cost manufacturing of chips with bond pads on the sidewalls, which enables stacking for increased performance, reduced space, and higher functional per unit volume. 3 figs.

Process for 3D chip stacking

DOEpatents

Malba, Vincent

1998-01-01

A manufacturable process for fabricating electrical interconnects which extend from a top surface of an integrated circuit chip to a sidewall of the chip using laser pantography to pattern three dimensional interconnects. The electrical interconnects may be of an L-connect or L-shaped type. The process implements three dimensional (3D) stacking by moving the conventional bond or interface pads on a chip to the sidewall of the chip. Implementation of the process includes: 1) holding individual chips for batch processing, 2) depositing a dielectric passivation layer on the top and sidewalls of the chips, 3) opening vias in the dielectric, 4) forming the interconnects by laser pantography, and 5) removing the chips from the holding means. The process enables low cost manufacturing of chips with bond pads on the sidewalls, which enables stacking for increased performance, reduced space, and higher functional per unit volume.

The Ubiquitin Ligase CHIP Prevents SirT6 Degradation through Noncanonical Ubiquitination

PubMed Central

Ronnebaum, Sarah M.; Wu, Yaxu; McDonough, Holly

2013-01-01

The ubiquitin ligase CHIP (carboxyl terminus of Hsp70-interacting protein) regulates protein quality control, and CHIP deletion accelerates aging and reduces the life span in mice. Here, we reveal a mechanism for CHIP's influence on longevity by demonstrating that CHIP stabilizes the sirtuin family member SirT6, a lysine deacetylase/ADP ribosylase involved in DNA repair, metabolism, and longevity. In CHIP-deficient cells, SirT6 protein half-life is substantially reduced due to increased proteasome-mediated degradation, but CHIP overexpression in these cells increases SirT6 protein expression without affecting SirT6 transcription. CHIP noncanonically ubiquitinates SirT6 at K170, which stabilizes SirT6 and prevents SirT6 canonical ubiquitination by other ubiquitin ligases. In CHIP-depleted cells, SirT6 K170 mutation increases SirT6 half-life and prevents proteasome-mediated degradation. The global decrease in SirT6 expression in the absence of CHIP is associated with decreased SirT6 promoter occupancy, which increases histone acetylation and promotes downstream gene transcription in CHIP-depleted cells. Cells lacking CHIP are hypersensitive to DNA-damaging agents, but DNA repair and cell viability are rescued by enforced expression of SirT6. The discovery of this CHIP-SirT6 interaction represents a novel protein-stabilizing mechanism and defines an intersection between protein quality control and epigenetic regulation to influence pathways that regulate the biology of aging. PMID:24043303

[Preparation of poly(methyl acrylate) microfluidic chips surface-modified by hyperbranched polyamide ester and their application in the separation of biomolecules].

PubMed

Liu, Bing; Lin, Donge; Xu, Lin; Lei, Yanhui; Bo, Qianglong; Shou, Chongqi

2012-05-01

The surface of poly (methyl acrylate) (PMMA) microfluidic chips were modified using hyperbranched polyamide ester via chemical bonding. The contact angles of the modified chips were measured. The surface morphology was observed by scanning electron microscope (SEM) and stereo microscope. The results showed that the surface of the modified chips was coated by a dense, uniform, continuous, hydrophilic layer of hyperbranched polyamide ester. The hydrophilic of the chip surface was markedly improved. The contact angle of the chips modified decreased from 89.9 degrees to 29.5 degrees. The electro osmotic flow (EOF) in the modified microchannel was lower than that in the unmodified microchannel. Adenosine and L-lysine were detected and separated via the modified PMMA microfluidic chips. Compared with unmodified chips, the modified chips successfully separated the two biomolecules. The detection peaks were clear and sharp. The separation efficiencies of adenosine and L-lysine were 8.44 x 10(4) plates/m and 9.82 x 10(4) plates/m respectively, and the resolutions (Rs) was 5.31. The column efficiencies and resolutions of the modified chips were much higher than those of the unmodified chips. It was also observed that the modified chips possessed good reproducibility of migration time. This research may provide a new and effective method to improve the hydrophilicity of the PMMA surface and the application of PMMA microfluidic chips in the determination of trace biomolecules.

A stretchable and flexible system for skin-mounted measurement of motion tracking and physiological signals.

PubMed

Pinghung Wei; Raj, Milan; Yung-Yu Hsu; Morey, Briana; DePetrillo, Paolo; McGrane, Bryan; Xianyan Wang; Lin, Monica; Keen, Bryan; Papakyrikos, Cole; Lowe, Jared; Ghaffari, Roozbeh

2014-01-01

In this paper, we present a stretchable wearable system capable of i) measuring multiple physiological parameters and ii) transmitting data via radio frequency to a smart phone. The electrical architecture consists of ultra thin sensors (<; 20 μm thick) and a conformal network of associated active and passive electronics in a mesh-like geometry that can mechanically couple with the curvilinear surfaces of the human body. Spring-like metal interconnects between individual chips on board the device allow the system to accommodate strains approaching ~30% A representative example of a smart patch that measures movement and electromyography (EMG) signals highlights the utility of this new class of medical skin-mounted system in monitoring a broad range of neuromuscular and cardiovascular diseases.

Usewear studies of flint tools with microPIXE and microRBS

NASA Astrophysics Data System (ADS)

Christensen, Marianne; Grime, Geoff; Menu, Michel; Walter, Philippe

1993-05-01

The use of ancient stone tools leaves a polish (usewear) on the cutting edge which can be studied to determine the material the tool had worked during its use. The film is formed by high pressure intrusion of the worked material into the microcavities of the chipped flint surface and so the film can also be analysed directly to determine the nature of the worked material. This paper describes the analysis of experimental flint tools which had worked bone and ivory using microbeam PIXE and RBS. It is found that PIXE used simultaneously with RBS allows the thickness and composition of the film to be determined and ivory distinguished from bone while RBS mapping allows the three-dimensional structure of the film to be determined.

Drop-casted self-assembling graphene oxide membranes for scanning electron microscopy on wet and dense gaseous samples.

PubMed

Krueger, Mark; Berg, Shannon; Stone, D'Arcy; Strelcov, Evgheni; Dikin, Dmitriy A; Kim, Jaemyung; Cote, Laura J; Huang, Jiaxing; Kolmakov, Andrei

2011-12-27

Graphene oxide sheets dispersed in water and many other solvents can spontaneously assemble into a surface film covering an evaporating droplet due to their amphiphilicity. Thus, graphene oxide membranes with controllable thickness suspended over an orifice have been directly fabricated using a simple drop-cast approach. Mechanical properties and electron transparency tests of these membranes show their use as electron transparent, but molecularly impenetrable, windows for environmental electron microscopy in liquids and dense gaseous media. The foreseeable, broader application of this drop-cast window methodology is the creation of access spots for electron probes to study isolated microsamples in their natural, undisrupted state within the interior of prefabricated devices (such as microfluidic chips or sealed containers of biological, chemically reactive, toxic, or forensic materials).

Propagational characteristics in a warm hybrid plasmonic waveguide

NASA Astrophysics Data System (ADS)

Mahmodi Moghadam, M.; Shahmansouri, M.; Farokhi, B.

2017-12-01

We theoretically analyze the properties of guided modes in a warm planar conductor-gap-dielectric (CGD) system. The latter consists of a high index dielectric, separated from a warm metallic plasma with a low index nano-sized dielectric layer (gap) by using the hydrodynamic model coupled to Maxwell's equations. The effects of thermal pressure on the confinement and the propagation losses of Hybrid Plasmon Polariton (HPP) modes are studied. We found that the thermal effect leads to a reduction in the effective refractive index as well as in the propagation losses of the HPP mode. Furthermore, the cutoff thickness in the warm CGD waveguide is found to be smaller than that in a cold CGD waveguide. The results may be useful in understanding the essential physics of active/passive Plasmonic devices and chip-scale systems.

Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control

NASA Astrophysics Data System (ADS)

Mehta, Sohan Singh; Yeung, Marco; Mirza, Fahad; Raman, Thiagarajan; Longenbach, Travis; Morgan, Justin; Duggan, Mark; Soedibyo, Rio A.; Reidy, Sean; Rabie, Mohamed; Cho, Jae Kyu; Premachandran, C. S.; Faruqui, Danish

2018-03-01

In this paper, we demonstrate photosensitive polyimide (PSPI) profile optimization to effectively reduce stress concentrations and enable PSPI as protection package-induced stress. Through detailed package simulation, we demonstrate 45% reduction in stress as the sidewall angle (SWA) of PSPI is increased from 45 to 80 degrees in Cu pillar package types. Through modulation of coating and develop multi-step baking temperature and time, as well as dose energy and post litho surface treatments, we demonstrate a method for reliably obtaining PSPI sidewall angle >75 degree. Additionally, we experimentally validate the simulation findings that PSPI sidewall angle impacts chip package interaction (CPI). Finally, we conclude this paper with PSPI material and tool qualification requirements for future technology node based on current challenges.

Quasiparticle spin resonance and coherence in superconducting aluminium

NASA Astrophysics Data System (ADS)

Quay, C. H. L.; Weideneder, M.; Chiffaudel, Y.; Strunk, C.; Aprili, M.

2015-10-01

Conventional superconductors were long thought to be spin inert; however, there is now increasing interest in both (the manipulation of) the internal spin structure of the ground-state condensate, as well as recently observed long-lived, spin-polarized excitations (quasiparticles). We demonstrate spin resonance in the quasiparticle population of a mesoscopic superconductor (aluminium) using novel on-chip microwave detection techniques. The spin decoherence time obtained (~100 ps), and its dependence on the sample thickness are consistent with Elliott-Yafet spin-orbit scattering as the main decoherence mechanism. The striking divergence between the spin coherence time and the previously measured spin imbalance relaxation time (~10 ns) suggests that the latter is limited instead by inelastic processes. This work stakes out new ground for the nascent field of spin-based electronics with superconductors or superconducting spintronics.

A General Reliability Model for Ni-BaTiO3-Based Multilayer Ceramic Capacitors

NASA Technical Reports Server (NTRS)

Liu, Donhang

2014-01-01

The evaluation of multilayer ceramic capacitors (MLCCs) with Ni electrode and BaTiO3 dielectric material for potential space project applications requires an in-depth understanding of their reliability. A general reliability model for Ni-BaTiO3 MLCC is developed and discussed. The model consists of three parts: a statistical distribution; an acceleration function that describes how a capacitor's reliability life responds to the external stresses, and an empirical function that defines contribution of the structural and constructional characteristics of a multilayer capacitor device, such as the number of dielectric layers N, dielectric thickness d, average grain size, and capacitor chip size A. Application examples are also discussed based on the proposed reliability model for Ni-BaTiO3 MLCCs.

A General Reliability Model for Ni-BaTiO3-Based Multilayer Ceramic Capacitors

NASA Technical Reports Server (NTRS)

Liu, Donhang

2014-01-01

The evaluation for potential space project applications of multilayer ceramic capacitors (MLCCs) with Ni electrode and BaTiO3 dielectric material requires an in-depth understanding of the MLCCs reliability. A general reliability model for Ni-BaTiO3 MLCCs is developed and discussed in this paper. The model consists of three parts: a statistical distribution; an acceleration function that describes how a capacitors reliability life responds to external stresses; and an empirical function that defines the contribution of the structural and constructional characteristics of a multilayer capacitor device, such as the number of dielectric layers N, dielectric thickness d, average grain size r, and capacitor chip size A. Application examples are also discussed based on the proposed reliability model for Ni-BaTiO3 MLCCs.

Experimental identification of nitrogen-vacancy complexes in nitrogen implanted silicon

NASA Astrophysics Data System (ADS)

Adam, Lahir Shaik; Law, Mark E.; Szpala, Stanislaw; Simpson, P. J.; Lawther, Derek; Dokumaci, Omer; Hegde, Suri

2001-07-01

Nitrogen implantation is commonly used in multigate oxide thickness processing for mixed signal complementary metal-oxide-semiconductor and System on a Chip technologies. Current experiments and diffusion models indicate that upon annealing, implanted nitrogen diffuses towards the surface. The mechanism proposed for nitrogen diffusion is the formation of nitrogen-vacancy complexes in silicon, as indicated by ab initio studies by J. S. Nelson, P. A. Schultz, and A. F. Wright [Appl. Phys. Lett. 73, 247 (1998)]. However, to date, there does not exist any experimental evidence of nitrogen-vacancy formation in silicon. This letter provides experimental evidence through positron annihilation spectroscopy that nitrogen-vacancy complexes indeed form in nitrogen implanted silicon, and compares the experimental results to the ab initio studies, providing qualitative support for the same.

Fabric-based active electrode design and fabrication for health monitoring clothing.

PubMed

Merritt, Carey R; Nagle, H Troy; Grant, Edward

2009-03-01

In this paper, two versions of fabric-based active electrodes are presented to provide a wearable solution for ECG monitoring clothing. The first version of active electrode involved direct attachment of surface-mountable components to a textile screen-printed circuit using polymer thick film techniques. The second version involved attaching a much smaller, thinner, and less obtrusive interposer containing the active electrode circuitry to a simplified textile circuit. These designs explored techniques for electronic textile interconnection, chip attachment to textiles, and packaging of circuits on textiles for durability. The results from ECG tests indicate that the performance of each active electrode is comparable to commercial Ag/AgCl electrodes. The interposer-based active electrodes survived a five-cycle washing test while maintaining good signal integrity.

High kappa Dielectrics on InGaAs and GaN: Growth, Interfacial Structural Studies, and Surface Fermi Level Unpinning

DTIC Science & Technology

2010-12-24

nano-thick Al2O3, HfO2, and Ga2O3 (Gd2O3)/ InGaAs (and GaN) using high-resolution x-ray reflectivity using in-situ/ex-situ high-resolution synchrotron...aligned inversion-channel In0.75Ga0.25As MOSFETs using MBE- grown Al2O3/ Ga2O3 (Gd2O3) Chips integrating high κ’s/InGaAs and /Ge onto Si substrates have...using molecular beam epitaxy (MBE)-Al2O3/ Ga2O3 (Gd2O3) [GGO] and atomic layer deposited (ALD)-Al2O3, with gate lengths (LG) of 1 μm and 0.4 μm

Method for dialysis on microchips using thin porous polymer membrane

DOEpatents

Singh, Anup K [San Francisco, CA; Kirby, Brian J [San Francisco, CA; Shepodd, Timothy J [Livermore, CA

2009-05-19

Laser-induced phase-separation polymerization of a porous acrylate polymer is used for in-situ fabrication of dialysis membranes inside glass microchannels. A shaped 355 nm laser beam is used to produce a porous polymer membrane with a thickness of about 15 .mu.m, which bonds to the glass microchannel and forms a semi-permeable membrane. Differential permeation through a membrane formed with pentaerythritol triacrylate was observed and quantified by comparing the response of the membrane to fluorescein and fluorescently tagging 200 nm latex microspheres. Differential permeation was observed and quantified by comparing the response to rhodamine 560 and lactalbumin protein in a membrane formed with SPE-methylene bisacrylamide. The porous membranes illustrate the capability for the present technique to integrate sample cleanup into chip-based analysis systems.

Dialysis on microchips using thin porous polymer membranes

DOEpatents

Singh, Anup K.; Kirby, Brian J.; Shepodd, Timothy J.

2007-09-04

Laser-induced phase-separation polymerization of a porous acrylate polymer is used for in-situ fabrication of dialysis membranes inside glass microchannels. A shaped 355 nm laser beam is used to produce a porous polymer membrane with a thickness of about 15 .mu.m, which bonds to the glass microchannel and form a semi-permeable membrane. Differential permeation through a membrane formed with pentaerythritol triacrylate was observed and quantified by comparing the response of the membrane to fluorescein and fluorescently tagging 200 nm latex microspheres. Differential permeation was observed and quantified by comparing the response to rhodamine 560 and lactalbumin protein in a membrane formed with SPE-methylene bisacrylamide. The porous membranes illustrate the capability for the present technique to integrate sample cleanup into chip-based analysis systems.

Laser-induced vibration of a thin soap film.

PubMed

Emile, Olivier; Emile, Janine

2014-09-21

We report on the vibration of a thin soap film based on the optical radiation pressure force. The modulated low power laser induces a counter gravity flow in a vertical free-standing draining film. The thickness of the soap film is then higher in the upper region than in the lower region of the film. Moreover, the lifetime of the film is dramatically increased by a factor of 2. Since the laser beam only acts mechanically on the film interfaces, such a film can be employed in an optofluidic diaphragm pump, the interfaces behaving like a vibrating membrane and the liquid in-between being the fluid to be pumped. Such a pump could then be used in delicate micro-equipment, in chips where temperature variations are detrimental and even in biological systems.