Low-cost far infrared bolometer camera for automotive use

NASA Astrophysics Data System (ADS)

Vieider, Christian; Wissmar, Stanley; Ericsson, Per; Halldin, Urban; Niklaus, Frank; Stemme, Göran; Källhammer, Jan-Erik; Pettersson, Håkan; Eriksson, Dick; Jakobsen, Henrik; Kvisterøy, Terje; Franks, John; VanNylen, Jan; Vercammen, Hans; VanHulsel, Annick

2007-04-01

A new low-cost long-wavelength infrared bolometer camera system is under development. It is designed for use with an automatic vision algorithm system as a sensor to detect vulnerable road users in traffic. Looking 15 m in front of the vehicle it can in case of an unavoidable impact activate a brake assist system or other deployable protection system. To achieve our cost target below €100 for the sensor system we evaluate the required performance and can reduce the sensitivity to 150 mK and pixel resolution to 80 x 30. We address all the main cost drivers as sensor size and production yield along with vacuum packaging, optical components and large volume manufacturing technologies. The detector array is based on a new type of high performance thermistor material. Very thin Si/SiGe single crystal multi-layers are grown epitaxially. Due to the resulting valence barriers a high temperature coefficient of resistance is achieved (3.3%/K). Simultaneously, the high quality crystalline material provides very low 1/f-noise characteristics and uniform material properties. The thermistor material is transferred from the original substrate wafer to the read-out circuit using adhesive wafer bonding and subsequent thinning. Bolometer arrays can then be fabricated using industry standard MEMS process and materials. The inherently good detector performance allows us to reduce the vacuum requirement and we can implement wafer level vacuum packaging technology used in established automotive sensor fabrication. The optical design is reduced to a single lens camera. We develop a low cost molding process using a novel chalcogenide glass (GASIR®3) and integrate anti-reflective and anti-erosion properties using diamond like carbon coating.

Design and fabrication of a foldable 3D silicon based package for solid state lighting applications

NASA Astrophysics Data System (ADS)

Sokolovskij, R.; Liu, P.; van Zeijl, H. W.; Mimoun, B.; Zhang, G. Q.

2015-05-01

Miniaturization of solid state lighting (SSL) luminaires as well as reduction of packaging and assembly costs are of prime interest for the SSL lighting industry. A novel silicon based LED package for lighting applications is presented in this paper. The proposed design consists of 5 rigid Si tiles connected by flexible polyimide hinges with embedded interconnects (ICs). Electrical, optical and thermal characteristics were taken into consideration during design. The fabrication process involved polyimide (PI) application and patterning, aluminium interconnect integration in the flexible hinge, LED reflector cavity formation and metalization followed by through wafer DRIE etching for chip formation and release. A method to connect chip front to backside without TSVs was also integrated into the process. Post-fabrication wafer level assembly included LED mounting and wirebond, phosphor-based colour conversion and silicone encapsulation. The package formation was finalized by vacuum assisted wrapping around an assembly structure to form a 3D geometry, which is beneficial for omnidirectional lighting. Bending tests were performed on the flexible ICs and optical performance at different temperatures was evaluated. It is suggested that 3D packages can be expanded to platforms for miniaturized luminaire applications by combining monolithic silicon integration and system-in-package (SiP) technologies.

Advanced uncooled sensor product development

NASA Astrophysics Data System (ADS)

Kennedy, A.; Masini, P.; Lamb, M.; Hamers, J.; Kocian, T.; Gordon, E.; Parrish, W.; Williams, R.; LeBeau, T.

2015-06-01

The partnership between RVS, Seek Thermal and Freescale Semiconductor continues on the path to bring the latest technology and innovation to both military and commercial customers. The partnership has matured the 17μm pixel for volume production on the Thermal Weapon Sight (TWS) program in efforts to bring advanced production capability to produce a low cost, high performance product. The partnership has developed the 12μm pixel and has demonstrated performance across a family of detector sizes ranging from formats as small as 206 x 156 to full high definition formats. Detector pixel sensitivities have been achieved using the RVS double level advanced pixel structure. Transition of the packaging of microbolometers from a traditional die level package to a wafer level package (WLP) in a high volume commercial environment is complete. Innovations in wafer fabrication techniques have been incorporated into this product line to assist in the high yield required for volume production. The WLP seal yield is currently > 95%. Simulated package vacuum lives >> 20 years have been demonstrated through accelerated life testing where the package has been shown to have no degradation after 2,500 hours at 150°C. Additionally the rugged assembly has shown no degradation after mechanical shock and vibration and thermal shock testing. The transition to production effort was successfully completed in 2014 and the WLP design has been integrated into multiple new production products including the TWS and the innovative Seek Thermal commercial product that interfaces directly to an iPhone or android device.

A fully wafer-level packaged RF MEMS switch with low actuation voltage using a piezoelectric actuator

NASA Astrophysics Data System (ADS)

Park, Jae-Hyoung; Lee, Hee-Chul; Park, Yong-Hee; Kim, Yong-Dae; Ji, Chang-Hyeon; Bu, Jonguk; Nam, Hyo-Jin

2006-11-01

In this paper, a fully wafer-level packaged RF MEMS switch has been demonstrated, which has low operation voltage, using a piezoelectric actuator. The piezoelectric actuator was designed to operate at low actuation voltage for application to advanced mobile handsets. The dc contact type RF switch was packaged using the wafer-level bonding process. The CPW transmission lines and piezoelectric actuators have been fabricated on separate wafers and assembled together by the wafer-level eutectic bonding process. A gold and tin composite was used for eutectic bonding at a low temperature of 300 °C. Via holes interconnecting the electrical contact pads through the wafer were filled completely with electroplated copper. The fully wafer-level packaged RF MEMS switch showed an insertion loss of 0.63 dB and an isolation of 26.4 dB at 5 GHz. The actuation voltage of the switch was 5 V. The resonant frequency of the piezoelectric actuator was 38.4 kHz and the spring constant of the actuator was calculated to be 9.6 N m-1. The size of the packaged SPST (single-pole single-through) switch was 1.2 mm × 1.2 mm including the packaging sealing rim. The effect of the proposed package structure on the RF performance was characterized with a device having CPW through lines and vertical feed lines excluding the RF switches. The measured packaging loss was 0.2 dB and the return loss was 33.6 dB at 5 GHz.

High-Q Wafer Level Package Based on Modified Tri-Layer Anodic Bonding and High Performance Getter and Its Evaluation for Micro Resonant Pressure Sensor.

PubMed

Wang, Liying; Du, Xiaohui; Wang, Lingyun; Xu, Zhanhao; Zhang, Chenying; Gu, Dandan

2017-03-16

In order to achieve and maintain a high quality factor (high-Q) for the micro resonant pressure sensor, this paper presents a new wafer level package by adopting cross-layer anodic bonding technique of the glass/silicon/silica (GSS) stackable structure and integrated Ti getter. A double-layer structure similar to a silicon-on-insulator (SOI) wafer is formed after the resonant layer and the pressure-sensitive layer are bonded by silicon direct bonding (SDB). In order to form good bonding quality between the pressure-sensitive layer and the glass cap layer, the cross-layer anodic bonding technique is proposed for vacuum package by sputtering Aluminum (Al) on the combination wafer of the pressure-sensitive layer and the resonant layer to achieve electrical interconnection. The model and the bonding effect of this technique are discussed. In addition, in order to enhance the performance of titanium (Ti) getter, the prepared and activation parameters of Ti getter under different sputtering conditions are optimized and discussed. Based on the optimized results, the Ti getter (thickness of 300 nm to 500 nm) is also deposited on the inside of the glass groove by magnetron sputtering to maintain stable quality factor (Q). The Q test of the built testing system shows that the number of resonators with a Q value of more than 10,000 accounts for more than 73% of the total. With an interval of 1.5 years, the Q value of the samples remains almost constant. It proves the proposed cross-layer anodic bonding and getter technique can realize high-Q resonant structure for long-term stable operation.

MEMS packaging with etching and thinning of lid wafer to form lids and expose device wafer bond pads

DOE Office of Scientific and Technical Information (OSTI.GOV)

Chanchani, Rajen; Nordquist, Christopher; Olsson, Roy H

In wafer-level packaging of microelectromechanical (MEMS) devices a lid wafer is bonded to a MEMS wafer in a predermined aligned relationship. Portions of the lid wafer are removed to separate the lid wafer into lid portions that respectively correspond in alignment with MEMS devices on the MEMS wafer, and to expose areas of the MEMS wafer that respectively contain sets of bond pads respectively coupled to the MEMS devices.

Localized heating and bonding technique for MEMS packaging

NASA Astrophysics Data System (ADS)

Cheng, Yu-Ting

Localized heating and bonding techniques have been developed for hermetic and vacuum packaging of MEMS devices, including silicon-to-glass fusion, silicon-gold eutectic, and silicon-to-glass bonding using PSG, indium, aluminum, and aluminum/silicon alloy as the intermediate layer. Line shaped phosphorus-doped polysilicon or gold films are used as resistive microheaters to provide enough thermal energy for bonding. The bonding processes are conducted in the common environment of room temperature and atmospheric pressure and can achieve bonding strength comparable to the fracture toughness of bulk silicon in less than 10 minutes. About 5 watts of input power is needed for localized bonding which can seal a 500 x 500 mum2 area. The total input power is determined by the thermal properties of bonding materials, including the heat capacity and latent heat. Two important bonding results are obtained: (1) The surface step created by the electrical interconnect line can be planarized by reflowing the metal solder. (2) Small applied pressure, less than 1MPa, for intimate contact reduces mechanical damage to the device substrate. This new class of bonding technology has potential applications for MEMS fabrication and packaging that require low temperature processing at the wafer level, excellent bonding strength and hermetic sealing characteristics. A hermetic package based on localized aluminum/silicon-to-glass bonding has been successfully fabricated. Less than 0.2 MPa contact pressure with 46mA input current for two parallel 3.5mum wide polysilicon on-chip microheaters can create as high as 700°C bonding temperature and achieve a strong and reliable bond in 7.5 minutes. Accelerated testing in an autoclave shows some packages survive more than 450 hours under 3 atm, 100%RH and 128°C. Premature failure has been attributed to some unbonded regions on the failed samples. The bonding yield and reliability have been improved by increasing bonding time and applied pressure. Finally, vacuum encapsulation of folded-beam comb-drive mu-resonators used as pressure monitors has been demonstrated using localized aluminum/silicon-to-glass bonding. With 3.4 watt heating power, ˜0.2MPa applied contact pressure, and 90 minutes wait time before bonding, vacuum encapsulation can be achieved with the same vacuum level as the packaging environment which is about 25 mtorr. Metal coating used as diffusion barrier and a longer wait time before bonding are used to improve the vacuum level of the package. Long-term measurement of the Q of un-annealed vacuum-packaged mu-resonators, illustrates stable operation after 19 weeks.

Method for sequentially processing a multi-level interconnect circuit in a vacuum chamber

NASA Technical Reports Server (NTRS)

Routh, D. E.; Sharma, G. C. (Inventor)

1984-01-01

An apparatus is disclosed which includes a vacuum system having a vacuum chamber in which wafers are processed on rotating turntables. The vacuum chamber is provided with an RF sputtering system and a dc magnetron sputtering system. A gas inlet introduces various gases to the vacuum chamber and creates various gas plasma during the sputtering steps. The rotating turntables insure that the respective wafers are present under the sputtering guns for an average amount of time such that consistency in sputtering and deposition is achieved. By continuous and sequential processing of the wafers in a common vacuum chamber without removal, the adverse affects of exposure to atmospheric conditions are eliminated providing higher quality circuit contacts and functional device.

Method for sequentially processing a multi-level interconnect circuit in a vacuum chamber

NASA Technical Reports Server (NTRS)

Routh, D. E.; Sharma, G. C. (Inventor)

1982-01-01

The processing of wafer devices to form multilevel interconnects for microelectronic circuits is described. The method is directed to performing the sequential steps of etching the via, removing the photo resist pattern, back sputtering the entire wafer surface and depositing the next layer of interconnect material under common vacuum conditions without exposure to atmospheric conditions. Apparatus for performing the method includes a vacuum system having a vacuum chamber in which wafers are processed on rotating turntables. The vacuum chamber is provided with an RF sputtering system and a DC magnetron sputtering system. A gas inlet is provided in the chamber for the introduction of various gases to the vacuum chamber and the creation of various gas plasma during the sputtering steps.

A front-end wafer-level microsystem packaging technique with micro-cap array

NASA Astrophysics Data System (ADS)

Chiang, Yuh-Min

2002-09-01

The back-end packaging process is the remaining challenge for the micromachining industry to commercialize microsystem technology (MST) devices at low cost. This dissertation presents a novel wafer level protection technique as a final step of the front-end fabrication process for MSTs. It facilitates improved manufacturing throughput and automation in package assembly, wafer level testing of devices, and enhanced device performance. The method involves the use of a wafer-sized micro-cap array, which consists of an assortment of small caps micro-molded onto a material with adjustable shapes and sizes to serve as protective structures against the hostile environments during packaging. The micro-cap array is first constructed by a micromachining process with micro-molding technique, then sealed to the device wafer at wafer level. Epoxy-based wafer-level micro cap array has been successfully fabricated and showed good compatibility with conventional back-end packaging processes. An adhesive transfer technique was demonstrated to seal the micro cap array with a MEMS device wafer. No damage or gross leak was observed while wafer dicing or later during a gross leak test. Applications of the micro cap array are demonstrated on MEMS, microactuators fabricated using CRONOS MUMPS process. Depending on the application needs, the micro-molded cap can be designed and modified to facilitate additional component functions, such as optical, electrical, mechanical, and chemical functions, which are not easily achieved in the device by traditional means. Successful fabrication of a micro cap array comprised with microlenses can provide active functions as well as passive protection. An optical tweezer array could be one possibility for applications of a micro cap with microlenses. The micro cap itself could serve as micro well for DNA or bacteria amplification as well.

A low feed-through 3D vacuum packaging technique with silicon vias for RF MEMS resonators

NASA Astrophysics Data System (ADS)

Zhao, Jicong; Yuan, Quan; Kan, Xiao; Yang, Jinling; Yang, Fuhua

2017-01-01

This paper presents a wafer-level three-dimensional (3D) vacuum packaging technique for radio frequency microelectromechanical systems (RF MEMS) resonators. A Sn-rich Au-Sn solder bonding is employed to provide a vacuum encapsulation as well as electrical conductions. Vertical silicon vias are micro-fabricated by glass reflow process. The optimized grounding, via pitch, and all-round shielding effectively reduce feed-through capacitance. Thus the signal-to-background ratios (SBRs) of the transmission signals increase from 17 dB to 20 dB, and the quality factor (Q) values of the packaged resonators go from around 8000 up to more than 9500. The measured average leak rate and shear strength are (2.55  ±  0.9)  ×  10-8 atm-cc s-1 and 42.53  ±  4.19 MPa, respectively. Furthermore, thermal cycling test between  -40 °C and 100 °C and high temperature storage test at 150 °C show that the resonant-frequency drifts are less than  ±7 ppm. In addition, the SBRs and the Q values have no obvious change after the tests. The experimental results demonstrated that the proposed encapsulation technique is well suited for the applications of RF MEMS devices.

MEMS for vibration energy harvesting

NASA Astrophysics Data System (ADS)

Li, Lin; Zhang, Yangjian; San, Haisheng; Guo, Yinbiao; Chen, Xuyuan

2008-03-01

In this paper, a capacitive vibration-to-electrical energy harvester was designed. An integrated process flow for fabricating the designed capacitive harvester is presented. For overcoming the disadvantage of depending on external power source in capacitive energy harvester, two parallel electrodes with different work functions are used as the two electrodes of the capacitor to generate a build-in voltage for initially charging the capacitor. The device is a sandwich structure of silicon layer in two glass layers with area of about 1 cm2. The silicon structure is fabricated by using silicon-on-insulator (SOI) wafer. The glass wafers are anodic bonded on to both sides of the SOI wafer to create a vacuum sealed package.

Wafer-level packaging with compression-controlled seal ring bonding

DOEpatents

Farino, Anthony J

2013-11-05

A device may be provided in a sealed package by aligning a seal ring provided on a first surface of a first semiconductor wafer in opposing relationship with a seal ring that is provided on a second surface of a second semiconductor wafer and surrounds a portion of the second wafer that contains the device. Forcible movement of the first and second wafer surfaces toward one another compresses the first and second seal rings against one another. A physical barrier against the movement, other than the first and second seal rings, is provided between the first and second wafer surfaces.

Evolution of gettering technologies for vacuum tubes to getters for MEMS

NASA Astrophysics Data System (ADS)

Amiotti, M.

2008-05-01

Getter materials are technically proven and industrially accepted practical ways to maintain vacuum inside hermetically sealed tubes or devices to assure high reliability and long lifetime of the operating devices. The most industrially proven vacuum tube is the cathode rays tubes (CRTs), where large surfaces are available for the deposition of an evaporated barium film by a radio frequency inductive heating of a stainless steel container filled with a BaAl4 powder mixed to Ni powder. The evolution of the CRTs manufacturing technologies required also new types of barium getters able to withstand some thermal process in air without any deterioration of the evaporation characteristics. In other vacuum tubes such as traveling waves tubes, the space available for the evaporation of a barium film and the sorption capacity required to assure the vacuum for the lifetime of the devices did not allow the use of the barium film, prompting the development of sintered non evaporable getter pills that can be activated during the manufacturing process or by flowing current through an embedded resistance. The same sintered non evaporable getter pills could find usage also in evacuated parts to thermally isolate the infrared sensors for different final applications. In high energy physics particle accelerators, the getter technology moved from localized vacuum getter pumps or getter strips to a getter coating over the surface of vacuum chambers in order to guarantee a more uniform pumping speed. With the advent of solid state electronics, new challenges faced the getter technology to assure long life to vacuum or inert gas filled hermetical packages containing microelectronic devices, especially in the telecommunication and military applications. A well known problem of GaAs devices with Pd or Pt metalization is the H2 poisoning of the metal gate: to prevent this degradation a two layer getter film has been develop to absorb a large quantity of H2 per unit of getter surface. The development of Micro Electro Mechanical Systems (MEMS) with moving parts in a vacuum environment required the development of a new generation of getter film, few microns thick, that can be selectively patterned onto a silicon or glass wafer (usually 4'' or 8''). This wafer with patterned getter film can be used directly as the cap wafer of a wafer to wafer bonded MEMS structure, assuring long life and reliability to the moving MEMS structure especially in automotive applications where thermal cycles are required for qualification.

VLED for Si wafer-level packaging

NASA Astrophysics Data System (ADS)

Chu, Chen-Fu; Chen, Chiming; Yen, Jui-Kang; Chen, Yung-Wei; Tsou, Chingfu; Chang, Chunming; Doan, Trung; Tran, Chuong Anh

2012-03-01

In this paper, we introduced the advantages of Vertical Light emitting diode (VLED) on copper alloy with Si-wafer level packaging technologies. The silicon-based packaging substrate starts with a <100> dou-ble-side polished p-type silicon wafer, then anisotropic wet etching technology is done to construct the re-flector depression and micro through-holes on the silicon substrate. The operating voltage, at a typical cur-rent of 350 milli-ampere (mA), is 3.2V. The operation voltage is less than 3.7V under higher current driving conditions of 1A. The VLED chip on Si package has excellent heat dissipation and can be operated at high currents up to 1A without efficiency degradation. The typical spatial radiation pattern emits a uniform light lambertian distribution from -65° to 65° which can be easily fit for secondary optics. The correlated color temperature (CCT) has only 5% variation for daylight and less than 2% variation for warm white, when the junction temperature is increased from 25°C to 110°C, suggesting a stable CCT during operation for general lighting application. Coupled with aspheric lens and micro lens array in a wafer level process, it has almost the same light distribution intensity for special secondary optics lighting applications. In addition, the ul-tra-violet (UV) VLED, featuring a silicon substrate and hard glass cover, manufactured by wafer level pack-aging emits high power UV wavelengths appropriate for curing, currency, document verification, tanning, medical, and sterilization applications.

New optoelectronic methodology for nondestructive evaluation of MEMS at the wafer level

NASA Astrophysics Data System (ADS)

Furlong, Cosme; Ferguson, Curtis F.; Melson, Michael J.

2004-02-01

One of the approaches to fabrication of MEMS involves surface micromachining to define dies on single crystal silicon wafers, dicing of the wafers to separate the dies, and electronic packaging of the individual dies. Dicing and packaging of MEMS accounts for a large fraction of the fabrication costs, therefore, nondestructive evaluation at the wafer level, before dicing, can have significant implications on improving production yield and costs. In this paper, advances in development of optoelectronic holography (OEH) techniques for nondestructive, noninvasive, full-field of view evaluation of MEMS at the wafer level are described. With OEH techniques, quantitative measurements of shape and deformation of MEMS, as related to their performance and integrity, are obtained with sub-micrometer spatial resolution and nanometer measuring accuracy. To inspect an entire wafer with OEH methodologies, measurements of overlapping regions of interest (ROI) on a wafer are recorded and adjacent ROIs are stitched together through efficient 3D correlation analysis algorithms. Capabilities of the OEH techniques are illustrated with representative applications, including determination of optimal inspection conditions to minimize inspection time while achieving sufficient levels of accuracy and resolution.

Study of cavity effect in micro-Pirani gauge chamber with improved sensitivity for high vacuum regime

NASA Astrophysics Data System (ADS)

Zhang, Guohe; Lai, Junhua; Kong, Yanmei; Jiao, Binbin; Yun, Shichang; Ye, Yuxin

2018-05-01

Ultra-low pressure application of Pirani gauge needs significant improvement of sensitivity and expansion of measureable low pressure limit. However, the performance of Pirani gauge in high vacuum regime remains critical concerns since gaseous thermal conduction with high percentage is essential requirement. In this work, the heat transfer mechanism of micro-Pirani gauge packaged in a non-hermetic chamber was investigated and analyzed compared with the one before wafer-level packaging. The cavity effect, extremely important for the efficient detection of low pressure, was numerically and experimentally analyzed considering the influence of the pressure, the temperature and the effective heat transfer area in micro-Pirani gauge chamber. The thermal conduction model is validated by experiment data of MEMS Pirani gauges with and without capping. It is found that nature gaseous convection in chamber, determined by the Rayleigh number, should be taken into consideration. The experiment and model calculated results show that thermal resistance increases in the molecule regime, and further increases after capping due to the suppression of gaseous convection. The gaseous thermal conduction accounts for an increasing percentage of thermal conduction at low pressure while little changes at high pressure after capping because of the existence of cavity effect improving the sensitivity of cavity-effect-influenced Pirani gauge for high vacuum regime.

MEMS packaging: state of the art and future trends

NASA Astrophysics Data System (ADS)

Bossche, Andre; Cotofana, Carmen V. B.; Mollinger, Jeff R.

1998-07-01

Now that the technology for Integrated sensor and MEMS devices has become sufficiently mature to allow mass production, it is expected that the prices of bare chips will drop dramatically. This means that the package prices will become a limiting factor in market penetration, unless low cost packaging solutions become available. This paper will discuss the developments in packaging technology. Both single-chip and multi-chip packaging solutions will be addressed. It first starts with a discussion on the different requirements that have to be met; both from a device point of view (open access paths to the environment, vacuum cavities, etc.) and from the application point of view (e.g. environmental hostility). Subsequently current technologies are judged on their applicability for MEMS and sensor packaging and a forecast is given for future trends. It is expected that the large majority of sensing devices will be applied in relative friendly environments for which plastic packages would suffice. Therefore, on the short term an important role is foreseen for recently developed plastic packaging techniques such as precision molding and precision dispensing. Just like in standard electronic packaging, complete wafer level packaging methods for sensing devices still have a long way to go before they can compete with the highly optimized and automated plastic packaging processes.

Latest improvements in microbolometer thin film packaging: paving the way for low-cost consumer applications

NASA Astrophysics Data System (ADS)

Yon, J. J.; Dumont, G.; Goudon, V.; Becker, S.; Arnaud, A.; Cortial, S.; Tisse, C. L.

2014-06-01

Silicon-based vacuum packaging is a key enabling technology for achieving affordable uncooled Infrared Focal Plane Arrays (IRFPA) required by a promising mass market that shows momentum for some extensive consumer applications, such as automotive driving assistance, smart presence localization and building management. Among the various approaches studied worldwide, CEA, LETI in partnership with ULIS is committed to the development of a unique technology referred to as PLP (Pixel Level Packaging). In this PLP technology, each bolometer pixel is sealed under vacuum using a transparent thin film deposition on wafer. PLP operates as an array of hermetic micro caps above the focal plane, each enclosing a single microbolometer. In continuation of our on-going studies on PLP for regular QVGA IRFPAs, this paper emphasizes on the innate scalability of the technology which was successfully demonstrated through the development of an 80 × 80 pixel IRFPA. The relevance of the technology with regard to the two formats is discussed, considering both performance and cost issues. We show that the suboptimal fill factor inherent to the PLP arrangement is not so critical when considering smaller arrays preferably fitted for consumer applications. The discussion is supported with the electro-optical performance measurements of the PLP-based 80×80 demonstrator.

High throughput vacuum chemical epitaxy

NASA Astrophysics Data System (ADS)

Fraas, L. M.; Malocsay, E.; Sundaram, V.; Baird, R. W.; Mao, B. Y.; Lee, G. Y.

1990-10-01

We have developed a vacuum chemical epitaxy (VCE) reactor which avoids the use of arsine and allows multiple wafers to be coated at one time. Our vacuum chemical epitaxy reactor closely resembles a molecular beam epitaxy system in that wafers are loaded into a stainless steel vacuum chamber through a load chamber. Also as in MBE, arsenic vapors are supplied as reactant by heating solid arsenic sources thereby avoiding the use of arsine. However, in our VCE reactor, a large number of wafers are coated at one time in a vacuum system by the substitution of Group III alkyl sources for the elemental metal sources traditionally used in MBE. Higher wafer throughput results because in VCE, the metal-alkyl sources for Ga, Al, and dopants can be mixed at room temperature and distributed uniformly though a large area injector to multiple substrates as a homogeneous array of mixed element molecular beams. The VCE reactor that we have built and that we shall describe here uniformly deposits films on 7 inch diameter substrate platters. Each platter contains seven two inch or three 3 inch diameter wafers. The load chamber contains up to nine platters. The vacuum chamber is equipped with two VCE growth zones and two arsenic ovens, one per growth zone. Finally, each oven has a 1 kg arsenic capacity. As of this writing, mirror smooth GaAs films have been grown at up to 4 μm/h growth rate on multiple wafers with good thickness uniformity. The background doping is p-type with a typical hole concentration and mobility of 1 × 10 16/cm 3 and 350 cm 2/V·s. This background doping level is low enough for the fabrication of MESFETs, solar cells, and photocathodes as well as other types of devices. We have fabricated MESFET devices using VCE-grown epi wafers with peak extrinsic transconductance as high as 210 mS/mm for a threshold voltage of - 3 V and a 0.6 μm gate length. We have also recently grown AlGaAs epi layers with up to 80% aluminum using TEAl as the aluminum alkyl source. The AlGaAs layer thickness and aluminum content uniformity appear excellent.

Functional Testing and Characterisation of ISFETs on Wafer Level by Means of a Micro-droplet Cell#

PubMed Central

Poghossian, Arshak; Schumacher, Kerstin; Kloock, Joachim P.; Rosenkranz, Christian; Schultze, Joachim W.; Müller-Veggian, Mattea; Schöning, Michael J.

2006-01-01

A wafer-level functionality testing and characterisation system for ISFETs (ion-sensitive field-effect transistor) is realised by means of integration of a specifically designed capillary electrochemical micro-droplet cell into a commercial wafer prober-station. The developed system allows the identification and selection of “good” ISFETs at the earliest stage and to avoid expensive bonding, encapsulation and packaging processes for non-functioning ISFETs and thus, to decrease costs, which are wasted for bad dies. The developed system is also feasible for wafer-level characterisation of ISFETs in terms of sensitivity, hysteresis and response time. Additionally, the system might be also utilised for wafer-level testing of further electrochemical sensors.

Compact particle accelerator

DOE Office of Scientific and Technical Information (OSTI.GOV)

Elizondo-Decanini, Juan M.

2017-08-29

A compact particle accelerator having an input portion configured to receive power to produce particles for acceleration, where the input portion includes a switch, is provided. In a general embodiment, a vacuum tube receives particles produced from the input portion at a first end, and a plurality of wafer stacks are positioned serially along the vacuum tube. Each of the plurality of wafer stacks include a dielectric and metal-oxide pair, wherein each of the plurality of wafer stacks further accelerate the particles in the vacuum tube. A beam shaper coupled to a second end of the vacuum tube shapes themore » particles accelerated by the plurality of wafer stacks into a beam and an output portion outputs the beam.« less

Protection of microelectronic devices during packaging

DOEpatents

Peterson, Kenneth A.; Conley, William R.

2002-01-01

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Temporary coatings for protection of microelectronic devices during packaging

DOEpatents

Peterson, Kenneth A.; Conley, William R.

2005-01-18

The present invention relates to a method of protecting a microelectronic device during device packaging, including the steps of applying a water-insoluble, temporary protective coating to a sensitive area on the device; performing at least one packaging step; and then substantially removing the protective coating, preferably by dry plasma etching. The sensitive area can include a released MEMS element. The microelectronic device can be disposed on a wafer. The protective coating can be a vacuum vapor-deposited parylene polymer, silicon nitride, metal (e.g. aluminum or tungsten), a vapor deposited organic material, cynoacrylate, a carbon film, a self-assembled monolayered material, perfluoropolyether, hexamethyldisilazane, or perfluorodecanoic carboxylic acid, silicon dioxide, silicate glass, or combinations thereof. The present invention also relates to a method of packaging a microelectronic device, including: providing a microelectronic device having a sensitive area; applying a water-insoluble, protective coating to the sensitive area; providing a package; attaching the device to the package; electrically interconnecting the device to the package; and substantially removing the protective coating from the sensitive area.

Particle monitoring and control in vacuum processing equipment

NASA Astrophysics Data System (ADS)

Borden, Peter G., Dr.; Gregg, John

1989-10-01

Particle contamination during vacuum processes has emerged as the largest single source of yield loss in VLSI manufacturing. While a number of tools have been available to help understand the sources and nature of this contamination, only recently has it been possible to monitor free particle levels within vacuum equipment in real-time. As a result, a better picture is available of how particle contamination can affect a variety of processes. This paper reviews some of the work that has been done to monitor particles in vacuum loadlocks and in processes such as etching, sputtering and ion implantation. The aim has been to make free particles in vacuum equipment a measurable process parameter. Achieving this allows particles to be controlled using statistical process control. It will be shown that free particle levels in load locks correlate to wafer surface counts, device yield and process conditions, but that these levels are considerable higher during production than when dummy wafers are run to qualify a system. It will also be shown how real-time free particle monitoring can be used to monitor and control cleaning cycles, how major episodic events can be detected, and how data can be gathered in a format suitable for statistical process control.

Warpage Characteristics and Process Development of Through Silicon Via-Less Interconnection Technology.

PubMed

Shen, Wen-Wei; Lin, Yu-Min; Wu, Sheng-Tsai; Lee, Chia-Hsin; Huang, Shin-Yi; Chang, Hsiang-Hung; Chang, Tao-Chih; Chen, Kuan-Neng

2018-08-01

In this study, through silicon via (TSV)-less interconnection using the fan-out wafer-level-packaging (FO-WLP) technology and a novel redistribution layer (RDL)-first wafer level packaging are investigated. Since warpage of molded wafer is a critical issue and needs to be optimized for process integration, the evaluation of the warpage issue on a 12-inch wafer using finite element analysis (FEA) at various parameters is presented. Related parameters include geometric dimension (such as chip size, chip number, chip thickness, and mold thickness), materials' selection and structure optimization. The effect of glass carriers with various coefficients of thermal expansion (CTE) is also discussed. Chips are bonded onto a 12-inch reconstituted wafer, which includes 2 RDL layers, 3 passivation layers, and micro bumps, followed by using epoxy molding compound process. Furthermore, an optical surface inspector is adopted to measure the surface profile and the results are compared with the results from simulation. In order to examine the quality of the TSV-less interconnection structure, electrical measurement is conducted and the respective results are presented.

Method for synthesis of high quality graphene

DOEpatents

Lanzara, Alessandra [Piedmont, CA; Schmid, Andreas K [Berkeley, CA; Yu, Xiaozhu [Berkeley, CA; Hwang, Choonkyu [Albany, CA; Kohl, Annemarie [Beneditkbeuern, DE; Jozwiak, Chris M [Oakland, CA

2012-03-27

A method is described herein for the providing of high quality graphene layers on silicon carbide wafers in a thermal process. With two wafers facing each other in close proximity, in a first vacuum heating stage, while maintained at a vacuum of around 10.sup.-6 Torr, the wafer temperature is raised to about 1500.degree. C., whereby silicon evaporates from the wafer leaving a carbon rich surface, the evaporated silicon trapped in the gap between the wafers, such that the higher vapor pressure of silicon above each of the wafers suppresses further silicon evaporation. As the temperature of the wafers is raised to about 1530.degree. C. or more, the carbon atoms self assemble themselves into graphene.

Application of Au-Sn eutectic bonding in hermetic radio-frequency microelectromechanical system wafer level packaging

NASA Astrophysics Data System (ADS)

Wang, Qian; Choa, Sung-Hoon; Kim, Woonbae; Hwang, Junsik; Ham, Sukjin; Moon, Changyoul

2006-03-01

Development of packaging is one of the critical issues toward realizing commercialization of radio-frequency-microelectromechanical system (RF-MEMS) devices. The RF-MEMS package should be designed to have small size, hermetic protection, good RF performance, and high reliability. In addition, packaging should be conducted at sufficiently low temperature. In this paper, a low-temperature hermetic wafer level packaging scheme for the RF-MEMS devices is presented. For hermetic sealing, Au-Sn eutectic bonding technology at temperatures below 300°C is used. Au-Sn multilayer metallization with a square loop of 70 µm in width is performed. The electrical feed-through is achieved by the vertical through-hole via filling with electroplated Cu. The size of the MEMS package is 1 mm × 1 mm × 700 µm. The shear strength and hermeticity of the package satisfies the requirements of MIL-STD-883F. Any organic gases or contamination are not observed inside the package. The total insertion loss for the packaging is 0.075 dB at 2 GHz. Furthermore, the robustness of the package is demonstrated by observing no performance degradation and physical damage of the package after several reliability tests.

MEMS for Practical Applications

NASA Astrophysics Data System (ADS)

Esashi, Masayoshi

Silicon MEMS as electrostatically levitated rotational gyroscopes and 2D optical scanners, and wafer level packaged devices as integrated capacitive pressure sensors and MEMS switches are described. MEMS which use non-silicon materials as LTCC with electrical feedthrough, SiC and LiNbO3 for probe cards for wafer-level burn-in test, molds for glass press molding and SAW wireless passive sensors respectively are also described.

Degradation and Its Control of Ultraviolet Avalanche Photodiodes Using PEDOT:PSS/ZnSSe Organic-Inorganic Hybrid Structure

NASA Astrophysics Data System (ADS)

Abe, Tomoki; Uchida, Shigeto; Tanaka, Keita; Fujisawa, Takanobu; Kasada, Hirofumi; Ando, Koshi; Akaiwa, Kazuaki; Ichino, Kunio

2018-05-01

We investigated device degradation in PEDOT:PSS/ZnSSe organic-inorganic hybrid ultraviolet avalanche photodiodes (UV-APDs). ZnSSe/n-GaAs wafers were grown by molecular beam epitaxy, and PEDOT:PSS window layers were formed by inkjet technique. We observed rapid degradation with APD-mode stress (˜ 30 V) in the N2 (4 N) atmosphere, while we observed no marked change in forward bias current stress and photocurrent stress. In the case of a vacuum condition, we observed no detectable degradation in the dark avalanche current with APD-mode stress. Therefore, the degradation in the PEDOT:PSS/ZnSSe interface under the APD-mode stress was caused by the residual water vapor or oxygen in the N2 atmosphere and could be controlled by vacuum packaging.

Cadmium telluride photovoltaic radiation detector

DOEpatents

Agouridis, D.C.; Fox, R.J.

A dosimetry-type radiation detector is provided which employs a polycrystalline, chlorine-compensated cadmium telluride wafer fabricated to operate as a photovoltaic current generator used as the basic detecting element. A photovoltaic junction is formed in the wafer by painting one face of the cadmium telluride wafer with an n-type semi-conductive material. The opposite face of the wafer is painted with an electrically conductive material to serve as a current collector. The detector is mounted in a hermetically sealed vacuum containment. The detector is operated in a photovoltaic mode (zero bias) while DC coupled to a symmetrical differential current amplifier having a very low input impedance. The amplifier converts the current signal generated by radiation impinging upon the barrier surface face of the wafer to a voltage which is supplied to a voltmeter calibrated to read quantitatively the level of radiation incident upon the detecting wafer.

Cadmium telluride photovoltaic radiation detector

DOEpatents

Agouridis, Dimitrios C.; Fox, Richard J.

1981-01-01

A dosimetry-type radiation detector is provided which employs a polycrystalline, chlorine-compensated cadmium telluride wafer fabricated to operate as a photovoltaic current generator used as the basic detecting element. A photovoltaic junction is formed in the wafer by painting one face of the cadmium telluride wafer with an n-type semiconductive material. The opposite face of the wafer is painted with an electrically conductive material to serve as a current collector. The detector is mounted in a hermetically sealed vacuum containment. The detector is operated in a photovoltaic mode (zero bias) while DC coupled to a symmetrical differential current amplifier having a very low input impedance. The amplifier converts the current signal generated by radiation impinging upon the barrier surface face of the wafer to a voltage which is supplied to a voltmeter calibrated to read quantitatively the level of radiation incident upon the detecting wafer.

Quantitative phase measurement for wafer-level optics

NASA Astrophysics Data System (ADS)

Qu, Weijuan; Wen, Yongfu; Wang, Zhaomin; Yang, Fang; Huang, Lei; Zuo, Chao

2015-07-01

Wafer-level-optics now is widely used in smart phone camera, mobile video conferencing or in medical equipment that require tiny cameras. Extracting quantitative phase information has received increased interest in order to quantify the quality of manufactured wafer-level-optics, detect defective devices before packaging, and provide feedback for manufacturing process control, all at the wafer-level for high-throughput microfabrication. We demonstrate two phase imaging methods, digital holographic microscopy (DHM) and Transport-of-Intensity Equation (TIE) to measure the phase of the wafer-level lenses. DHM is a laser-based interferometric method based on interference of two wavefronts. It can perform a phase measurement in a single shot. While a minimum of two measurements of the spatial intensity of the optical wave in closely spaced planes perpendicular to the direction of propagation are needed to do the direct phase retrieval by solving a second-order differential equation, i.e., with a non-iterative deterministic algorithm from intensity measurements using the Transport-of-Intensity Equation (TIE). But TIE is a non-interferometric method, thus can be applied to partial-coherence light. We demonstrated the capability and disability for the two phase measurement methods for wafer-level optics inspection.

Nonlinear conductivity in silicon nitride

NASA Astrophysics Data System (ADS)

Tuncer, Enis

2017-08-01

To better comprehend electrical silicon-package interaction in high voltage applications requires full characterization of the electrical properties of dielectric materials employed in wafer and package level design. Not only the packaging but wafer level dielectrics, i.e. passivation layers, would experience high electric fields generated by the voltage applied pads. In addition the interface between the passivation layer and a mold compound might develop space charge because of the mismatch in electrical properties of the materials. In this contribution electrical properties of a thin silicon nitride (Si3N4) dielectric is reported as a function of temperature and electric field. The measured values later analyzed using different temperature dependent exponential expressions and found that the Mott variable range hopping conduction model was successful to express the data. A full temperature/electric field dependency of conductivity is generated. It was found that the conduction in Si3N4 could be expressed like a field ionization or Fowler-Nordheim mechanism.

Wafer-level micro-optics: trends in manufacturing, testing, packaging, and applications

NASA Astrophysics Data System (ADS)

Voelkel, Reinhard; Gong, Li; Rieck, Juergen; Zheng, Alan

2012-11-01

Micro-optics is an indispensable key enabling technology (KET) for many products and applications today. Probably the most prestigious examples are the diffractive light shaping elements used in high-end DUV lithography steppers. Highly efficient refractive and diffractive micro-optical elements are used for precise beam and pupil shaping. Micro-optics had a major impact on the reduction of aberrations and diffraction effects in projection lithography, allowing a resolution enhancement from 250 nm to 45 nm within the last decade. Micro-optics also plays a decisive role in medical devices (endoscopes, ophthalmology), in all laser-based devices and fiber communication networks (supercomputer, ROADM), bringing high-speed internet to our homes (FTTH). Even our modern smart phones contain a variety of micro-optical elements. For example, LED flashlight shaping elements, the secondary camera, and ambient light and proximity sensors. Wherever light is involved, micro-optics offers the chance to further miniaturize a device, to improve its performance, or to reduce manufacturing and packaging costs. Wafer-scale micro-optics fabrication is based on technology established by semiconductor industry. Thousands of components are fabricated in parallel on a wafer. We report on the state of the art in wafer-based manufacturing, testing, packaging and present examples and applications for micro-optical components and systems.

Advanced Photonic Sensors Enabled by Semiconductor Bonding

DTIC Science & Technology

2010-05-31

a dry scroll backing pump to maintain the high differential pressure between the UV gun and the sample/analysis chamber. We also replaced the...semiconductor materials in an ultra-high vacuum (UHV) environment where the properties of the interface can be controlled with atomic-level precision. Such...year research program, we designed and constructed a unique system capable of fusion bonding two wafers in an ultra-high vacuum environment. This system

An 80x80 microbolometer type thermal imaging sensor using the LWIR-band CMOS infrared (CIR) technology

NASA Astrophysics Data System (ADS)

Tankut, Firat; Cologlu, Mustafa H.; Askar, Hidir; Ozturk, Hande; Dumanli, Hilal K.; Oruc, Feyza; Tilkioglu, Bilge; Ugur, Beril; Akar, Orhan Sevket; Tepegoz, Murat; Akin, Tayfun

2017-02-01

This paper introduces an 80x80 microbolometer array with a 35 μm pixel pitch operating in the 8-12 μm wavelength range, where the detector is fabricated with the LWIR-band CMOS infrared technology, shortly named as CIR, which is a novel microbolometer implementation technique developed to reduce the detector cost in order to enable the use of microbolometer type sensors in high volume markets, such as the consumer market and IoT. Unlike the widely used conventional surface micromachined microbolometer approaches, MikroSens' CIR detector technology does not require the use of special high TCR materials like VOx or a-Si, instead, it allows to implement microbolometers with standard CMOS layers, where the suspended bulk micromachined structure is obtained by only few consecutive selective MEMS etching steps while protecting the wirebond pads with a simple lithograpy step. This approach not only reduces the fabrication cost but also increases the production yield. In addition, needing simple subtractive post-CMOS fabrication steps allows the CIR technology to be carried out in any CMOS and MEMS foundry in a truly fabless fashion, where industrially mature and Au-free wafer level vacuum packaging technologies can also be carried out, leading to cost advantage, simplicity, scalability, and flexibility. The CIR approach is used to implement an 80x80 FPA with 35 μm pixel pitch, namely MS0835A, using a 0.18 μm CMOS process. The fabricated sensor is measured to provide NETD (Noise Equivalent Temperature Difference) value of 163 mK at 17 fps (frames per second) and 71 mK at 4 fps with F/1.0 optics in a dewar environment. The measurement results of the wafer level vacuum packaged sensors with one side AR coating shows an NETD values of 112 mK at 4 fps with F/1.1 optics, i.e., demonstrates a good performance for high volume low-cost applications like advanced presence detection and human counting applications. The CIR approach of MikroSens is scalable and can be used to reduce the pixel pitch even further while increasing the array size if necessary for various other low-cost, high volume applications.

Wafer-Level Membrane-Transfer Process for Fabricating MEMS

NASA Technical Reports Server (NTRS)

Yang, Eui-Hyeok; Wiberg, Dean

2003-01-01

A process for transferring an entire wafer-level micromachined silicon structure for mating with and bonding to another such structure has been devised. This process is intended especially for use in wafer-level integration of microelectromechanical systems (MEMS) that have been fabricated on dissimilar substrates. Unlike in some older membrane-transfer processes, there is no use of wax or epoxy during transfer. In this process, the substrate of a wafer-level structure to be transferred serves as a carrier, and is etched away once the transfer has been completed. Another important feature of this process is that two electrodes constitutes an electrostatic actuator array. An SOI wafer and a silicon wafer (see Figure 1) are used as the carrier and electrode wafers, respectively. After oxidation, both wafers are patterned and etched to define a corrugation profile and electrode array, respectively. The polysilicon layer is deposited on the SOI wafer. The carrier wafer is bonded to the electrode wafer by using evaporated indium bumps. The piston pressure of 4 kPa is applied at 156 C in a vacuum chamber to provide hermetic sealing. The substrate of the SOI wafer is etched in a 25 weight percent TMAH bath at 80 C. The exposed buried oxide is then removed by using 49 percent HF droplets after an oxygen plasma ashing. The SOI top silicon layer is etched away by using an SF6 plasma to define the corrugation profile, followed by the HF droplet etching of the remaining oxide. The SF6 plasma with a shadow mask selectively etches the polysilicon membrane, if the transferred membrane structure needs to be patterned. Electrostatic actuators with various electrode gaps have been fabricated by this transfer technique. The gap between the transferred membrane and electrode substrate is very uniform ( 0.1 m across a wafer diameter of 100 mm, provided by optimizing the bonding control). Figure 2 depicts the finished product.

Micro/nano electro mechanical systems for practical applications

NASA Astrophysics Data System (ADS)

Esashi, Masayoshi

2009-09-01

Silicon MEMS as electrostatically levitated rotational gyroscope, 2D optical scanner and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as diamond, PZT, conductive polymer, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mould for glass press moulding and SAW wireless passive sensor respectively are also described.

LTCC interconnects in microsystems

NASA Astrophysics Data System (ADS)

Rusu, Cristina; Persson, Katrin; Ottosson, Britta; Billger, Dag

2006-06-01

Different microelectromechanical system (MEMS) packaging strategies towards high packaging density of MEMS devices and lower expenditure exist both in the market and in research. For example, electrical interconnections and low stress wafer level packaging are essential for improving device performance. Hybrid integration of low temperature co-fired ceramics (LTCC) with Si can be a way for an easier packaging system with integrated electrical interconnection, and as well towards lower costs. Our research on LTCC-Si integration is reported in this paper.

Output blue light evaluation for phosphor based smart white LED wafer level packages.

PubMed

Kolahdouz, Zahra; Rostamian, Ali; Kolahdouz, Mohammadreza; Ma, Teng; van Zeijl, Henk; Zhang, Kouchi

2016-02-22

This study presents a blue light detector for evaluating the output light of phosphor based white LED package. It is composed of a silicon stripe-shaped photodiode designed and implemented in a 2 μm BiCMOS process which can be used for wafer level integration of different passive and active devices all in just 5 lithography steps. The final device shows a high selectivity to blue light. The maximum responsivity at 480 nm is matched with the target blue LED illumination. The designed structure have better responsivity compared to simple photodiode structure due to reducing the effect of dead layer formation close to the surface because of implantation. It has also a two-fold increase in the responsivity and quantum efficiency compared to previously similar published sensors.

Maskless wafer-level microfabrication of optical penetrating neural arrays out of soda-lime glass: Utah Optrode Array.

PubMed

Boutte, Ronald W; Blair, Steve

2016-12-01

Borrowing from the wafer-level fabrication techniques of the Utah Electrode Array, an optical array capable of delivering light for neural optogenetic studies is presented in this paper: the Utah Optrode Array. Utah Optrode Arrays are micromachined out of sheet soda-lime-silica glass using standard backend processes of the semiconductor and microelectronics packaging industries such as precision diamond grinding and wet etching. 9 × 9 arrays with 1100μ m × 100μ m optrodes and a 500μ m back-plane are repeatably reproduced on 2i n wafers 169 arrays at a time. This paper describes the steps and some of the common errors of optrode fabrication.

Dry etch method for texturing silicon and device

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gershon, Talia S.; Haight, Richard A.; Kim, Jeehwan

2017-07-25

A method for texturing silicon includes loading a silicon wafer into a vacuum chamber, heating the silicon wafer and thermal cracking a gas to generate cracked sulfur species. The silicon wafer is exposed to the cracked sulfur species for a time duration in accordance with a texture characteristic needed for a surface of the silicon wafer.

Heterogeneously integrated microsystem-on-a-chip

DOEpatents

Chanchani, Rajen [Albuquerque, NM

2008-02-26

A microsystem-on-a-chip comprises a bottom wafer of normal thickness and a series of thinned wafers can be stacked on the bottom wafer, glued and electrically interconnected. The interconnection layer comprises a compliant dielectric material, an interconnect structure, and can include embedded passives. The stacked wafer technology provides a heterogeneously integrated, ultra-miniaturized, higher performing, robust and cost-effective microsystem package. The highly integrated microsystem package, comprising electronics, sensors, optics, and MEMS, can be miniaturized both in volume and footprint to the size of a bottle-cap or less.

Effect of chemical sanitizer combined with modified atmosphere packaging on inhibiting Escherichia coli O157:H7 in commercial spinach.

PubMed

Lee, Sun-Young; Baek, Seung-Youb

2008-06-01

Escherichia coli O157:H7 contaminated spinach has recently caused several outbreaks of human illness in the USA and Canada. However, to date, there has been no study demonstrating an effective way to eliminate E. coli O157:H7 in spinach. Therefore, this study was conducted to investigate the effect of chemical sanitizers alone or in combination with packaging methods such as vacuum and modified atmosphere packaging (MAP) on inactivating E. coli O157:H7 in spinach during storage time. Spinach inoculated with E. coli O157:H7 was packaged in four different methods (air, vacuum, N(2) gas, and CO(2) gas packaging) following treatment with water, 100 ppm chlorine dioxide, or 100 ppm sodium hypochlorite for 5 min at room temperature and stored at 7+/-2 degrees C. Treatment with water did not significantly reduce levels of E. coli O157:H7 in spinach. However, treatment with chlorine dioxide and sodium hypochlorite significantly decreased levels of E. coli O157:H7 by 2.6 and 1.1 log(10)CFU/g, respectively. Levels of E. coli O157:H7 in samples packaged in air following treatments grew during storage time, whereas levels were maintained in samples packaged in other packaging methods (vacuum, N(2) gas, and CO(2) gas packaging). Therefore there were significant differences (about 3-4 log) of E. coli O157:H7 populations between samples packed in air and other packaging methods following treatment with chemical sanitizers after 7 days storage. These results suggest that the combination of treatment with chlorine dioxide and packaging methods such as vacuum and MAP may be useful for improving the microbial safety of spinach against E. coli O157:H7 during storage.

Wafer level reliability for high-performance VLSI design

NASA Technical Reports Server (NTRS)

Root, Bryan J.; Seefeldt, James D.

1987-01-01

As very large scale integration architecture requires higher package density, reliability of these devices has approached a critical level. Previous processing techniques allowed a large window for varying reliability. However, as scaling and higher current densities push reliability to its limit, tighter control and instant feedback becomes critical. Several test structures developed to monitor reliability at the wafer level are described. For example, a test structure was developed to monitor metal integrity in seconds as opposed to weeks or months for conventional testing. Another structure monitors mobile ion contamination at critical steps in the process. Thus the reliability jeopardy can be assessed during fabrication preventing defective devices from ever being placed in the field. Most importantly, the reliability can be assessed on each wafer as opposed to an occasional sample.

Environmentally benign processing of YAG transparent wafers

NASA Astrophysics Data System (ADS)

Yang, Yan; Wu, Yiquan

2015-12-01

Transparent yttrium aluminum garnet (YAG) wafers were successfully produced via aqueous tape casting and vacuum sintering techniques using a new environmentally friendly binder, a copolymer of isobutylene and maleic anhydride with the commercial name ISOBAM (noted as ISOBAM). Aqueous YAG slurries were mixed by ball-milling, which was followed by de-gassing and tape casting of wafers. The final YAG green tapes were homogenous and flexible, and could be bent freely without cracking. After the drying and sintering processes, transparent YAG wafers were achieved. The microstructures of both the green tape and vacuum-sintered YAG ceramic were observed by scanning electronic microscopy (SEM). Phase compositions were examined by X-ray diffraction (XRD). Optical transmittance was measured in UV-VIS regions with the result that the transmittance is 82.6% at a wavelength of 800 nm.

MEMS scanner with 2D tilt, piston, and focus motion

NASA Astrophysics Data System (ADS)

Lani, S.; Bayat, D.; Petremand, Y.; Regamey, Y.-J.; Onillon, E.; Pierer, J.; Grossmann, S.

2017-02-01

A MEMS scanner with a high level of motion freedom has been developed. It includes a 2D mechanical tilting capability of +/- 15°, a piston motion of 50μm and a focus/defocus control system of a 2mm diameter mirror. The tilt and piston motion is achieved with an electromagnetic actuation (moving magnet) and the focus control with a deformation of the reflective surface with pneumatic actuation. This required the fabrication of at least one channel on the compliant membrane and a closed cavity below the mirror surface and connected to an external pressure regulator (vacuum to several bars). The fabrication relies on 3 SOI wafers, 2 for forming the compliant membranes and the integrated channel, and 1 to form the cavity mirror. All wafers were then assembled by fusion bonding. Pneumatic actuation for focus control can be achieved from front or back side; function of packaging concept. A reflective coating can be added at the mirror surface depending of the application. The tilt and piston actuation is achieved by electromagnetic actuation for which a magnet is fixed on the moving part of the MEMS device. Finally the MEMS device is mounted on a ceramic PCB, containing the actuation micro-coils. Concept, fabrication, and testing of the devices will be presented. A case study for application in an endoscope with an integrated high power laser and a MEMS steering mechanism will be presented.

Qualification and Reliability for MEMS and IC Packages

NASA Technical Reports Server (NTRS)

Ghaffarian, Reza

2004-01-01

Advanced IC electronic packages are moving toward miniaturization from two key different approaches, front and back-end processes, each with their own challenges. Successful use of more of the back-end process front-end, e.g. microelectromechanical systems (MEMS) Wafer Level Package (WLP), enable reducing size and cost. Use of direct flip chip die is the most efficient approach if and when the issues of know good die and board/assembly are resolved. Wafer level package solve the issue of known good die by enabling package test, but it has its own limitation, e.g., the I/O limitation, additional cost, and reliability. From the back-end approach, system-in-a-package (SIAP/SIP) development is a response to an increasing demand for package and die integration of different functions into one unit to reduce size and cost and improve functionality. MEMS add another challenging dimension to electronic packaging since they include moving mechanical elements. Conventional qualification and reliability need to be modified and expanded in most cases in order to detect new unknown failures. This paper will review four standards that already released or being developed that specifically address the issues on qualification and reliability of assembled packages. Exposures to thermal cycles, monotonic bend test, mechanical shock and drop are covered in these specifications. Finally, mechanical and thermal cycle qualification data generated for MEMS accelerometer will be presented. The MEMS was an element of an inertial measurement unit (IMU) qualified for NASA Mars Exploration Rovers (MERs), Spirit and Opportunity that successfully is currently roaring the Martian surface

Three Dimensional Integration and On-Wafer Packaging for Heterogeneous Wafer-Scale Circuit Architectures

DTIC Science & Technology

2006-11-01

Chip Level CMOS Chip High resistivity Si Metal Interconnect 25μm 24GHz fully integrated receiver CMOS transimpedance Amplifier (13GHz BW, 52dBΩ...power of a high-resistivity SiGe power amplifier chip with the wide operating frequency range and compactness of a CMOS mixed signal chip operating...With good RF channel selectivity, system specifications such as the linearity of the low noise amplifier (LNA), the phase noise of the voltage

Wafer-level radiometric performance testing of uncooled microbolometer arrays

NASA Astrophysics Data System (ADS)

Dufour, Denis G.; Topart, Patrice; Tremblay, Bruno; Julien, Christian; Martin, Louis; Vachon, Carl

2014-03-01

A turn-key semi-automated test system was constructed to perform on-wafer testing of microbolometer arrays. The system allows for testing of several performance characteristics of ROIC-fabricated microbolometer arrays including NETD, SiTF, ROIC functionality, noise and matrix operability, both before and after microbolometer fabrication. The system accepts wafers up to 8 inches in diameter and performs automated wafer die mapping using a microscope camera. Once wafer mapping is completed, a custom-designed quick insertion 8-12 μm AR-coated Germanium viewport is placed and the chamber is pumped down to below 10-5 Torr, allowing for the evaluation of package-level focal plane array (FPA) performance. The probe card is electrically connected to an INO IRXCAM camera core, a versatile system that can be adapted to many types of ROICs using custom-built interface printed circuit boards (PCBs). We currently have the capability for testing 384x288, 35 μm pixel size and 160x120, 52 μm pixel size FPAs. For accurate NETD measurements, the system is designed to provide an F/1 view of two rail-mounted blackbodies seen through the Germanium window by the die under test. A master control computer automates the alignment of the probe card to the dies, the positioning of the blackbodies, FPA image frame acquisition using IRXCAM, as well as data analysis and storage. Radiometric measurement precision has been validated by packaging dies measured by the automated probing system and re-measuring the SiTF and Noise using INO's pre-existing benchtop system.

Preparation of wafer-level glass cavities by a low-cost chemical foaming process (CFP).

PubMed

Shang, Jintang; Chen, Boyin; Lin, Wei; Wong, Ching-Ping; Zhang, Di; Xu, Chao; Liu, Junwen; Huang, Qing-An

2011-04-21

A novel foaming process-chemical foaming process (CFP)-using foaming agents to fabricate wafer-level micro glass cavities including channels and bubbles was investigated. The process consists of the following steps sequentially: (1) shallow cavities were fabricated by a wet etching on a silicon wafer; (2) powders of a proper foaming agent were placed in a silicon cavity, named 'mother cavity', on the etched silicon surface; (3) the silicon cavities were sealed with a glass wafer by anodic bonding; (4) the bonded wafers were heated to above the softening point of the glass, and baked for several minutes, when the gas released by the decomposition of the foaming agent in the 'mother cavity' went into the other sealed interconnected silicon cavities to foam the softened glass into cylindrical channels named 'daughter channels', or spherical bubbles named 'son bubbles'. Results showed that wafer-level micro glass cavities with smooth wall surfaces were achieved successfully without contamination by the CFP. A model for the CFP was proposed to predict the final shape of the glass cavity. Experimental results corresponded with model predictions. The CFP provides a low-cost avenue to preparation of micro glass cavities of high quality for applications such as micro-reactors, micro total analysis systems (μTAS), analytical and bio-analytical applications, and MEMS packaging.

Color stability of ground beef packaged in a low carbon monoxide atmosphere or vacuum.

PubMed

Jeong, Jong Youn; Claus, James R

2011-01-01

Ground beef was either packaged in an atmosphere of 0.4% CO, 30% CO₂, and 69.6% N₂ (CO-MAP) or vacuum. After storage (48 h, 2-3°C), packages of CO-MAP and vacuum were opened and overwrapped with polyvinyl chloride. Other CO-MAP and vacuum packages were left intact. Packages were initially displayed for 7 days (2-3°C). Intact packages were further displayed up to 35 days before being opened and displayed (1 or 3 days). Intact CO-MAP packaged ground beef was always more red than intact vacuum-packaged ground beef. Color was relatively stable for both types of intact packages over 35 days of display. Upon opening CO-MAP packaged ground beef, the red color decreased slower than in ground beef from vacuum packages. Published by Elsevier Ltd.

Superconducting Vacuum-Gap Crossovers for High Performance Microwave Applications

NASA Technical Reports Server (NTRS)

Denis, Kevin L.; Brown, Ari D.; Chang, Meng-Ping; Hu, Ron; U-Yen, Kongpop; Wollack, Edward J.

2016-01-01

The design and fabrication of low-loss wide-bandwidth superconducting vacuum-gap crossovers for high performance millimeter wave applications are described. In order to reduce ohmic and parasitic losses at millimeter wavelengths a vacuum gap is preferred relative to dielectric spacer. Here, vacuum-gap crossovers were realized by using a sacrificial polymer layer followed by niobium sputter deposition optimized for coating coverage over an underlying niobium signal layer. Both coplanar waveguide and microstrip crossover topologies have been explored in detail. The resulting fabrication process is compatible with a bulk micro-machining process for realizing waveguide coupled detectors, which includes sacrificial wax bonding, and wafer backside deep reactive ion etching for creation of leg isolated silicon membrane structures. Release of the vacuum gap structures along with the wax bonded wafer after DRIE is implemented in the same process step used to complete the detector fabrication. ?

Method for passivating crystal silicon surfaces

DOEpatents

Wang, Qi [Littleton, CO; Wang, Tihu [Littleton, CO; Page, Matthew R [Littleton, CO; Yan, Yanfa [Littleton, CO

2009-12-08

In a method of making a c-Si-based cell or a .mu.c-Si-based cell, the improvement of increasing the minority charge carrier's lifetime, comprising: a) placing a c-Si or polysilicon wafer into CVD reaction chamber under a low vacuum condition and subjecting the substrate of the wafer to heating; and b) passing mixing gases comprising NH.sub.3/H.sub.2 through the reaction chamber at a low vacuum pressure for a sufficient time and at a sufficient flow rate to enable growth of an a-Si:H layer sufficient to increase the lifetime of the c-Si or polysilicon cell beyond that of the growth of an a-Si:H layer without treatment of the wafer with NH.sub.3/H.sub.2.

Coaxial twin-shaft magnetic fluid seals applied in vacuum wafer-handling robot

NASA Astrophysics Data System (ADS)

Cong, Ming; Wen, Haiying; Du, Yu; Dai, Penglei

2012-07-01

Compared with traditional mechanical seals, magnetic fluid seals have unique characters of high airtightness, minimal friction torque requirements, pollution-free and long life-span, widely used in vacuum robots. With the rapid development of Integrate Circuit (IC), there is a stringent requirement for sealing wafer-handling robots when working in a vacuum environment. The parameters of magnetic fluid seals structure is very important in the vacuum robot design. This paper gives a magnetic fluid seal device for the robot. Firstly, the seal differential pressure formulas of magnetic fluid seal are deduced according to the theory of ferrohydrodynamics, which indicate that the magnetic field gradient in the sealing gap determines the seal capacity of magnetic fluid seal. Secondly, the magnetic analysis model of twin-shaft magnetic fluid seals structure is established. By analyzing the magnetic field distribution of dual magnetic fluid seal, the optimal value ranges of important parameters, including parameters of the permanent magnetic ring, the magnetic pole tooth, the outer shaft, the outer shaft sleeve and the axial relative position of two permanent magnetic rings, which affect the seal differential pressure, are obtained. A wafer-handling robot equipped with coaxial twin-shaft magnetic fluid rotary seals and bellows seal is devised and an optimized twin-shaft magnetic fluid seals experimental platform is built. Test result shows that when the speed of the two rotational shafts ranges from 0-500 r/min, the maximum burst pressure is about 0.24 MPa. Magnetic fluid rotary seals can provide satisfactory performance in the application of wafer-handling robot. The proposed coaxial twin-shaft magnetic fluid rotary seal provides the instruction to design high-speed vacuum robot.

SEMICONDUCTOR TECHNOLOGY: Wafer level hermetic packaging based on Cu-Sn isothermal solidification technology

NASA Astrophysics Data System (ADS)

Yuhan, Cao; Le, Luo

2009-08-01

A novel wafer level bonding method based on Cu-Sn isothermal solidification technology is established. A multi-layer sealing ring and the bonding processing are designed, and the amount of solder and the bonding parameters are optimized based on both theoretical and experimental results. Verification shows that oxidation of the solder layer, voids and the scalloped-edge appearance of the Cu6Sn5 phase are successfully avoided. An average shear strength of 19.5 MPa and an excellent leak rate of around 1.9 × 10-9 atm cc/s are possible, meeting the demands of MIL-STD-883E.

Genesis Ultrapure Water Megasonic Wafer Spin Cleaner

NASA Technical Reports Server (NTRS)

Allton, Judith H.; Stansbery, Eileen K.; Calaway, Michael J.; Rodriquez, Melissa C.

2013-01-01

A device removes, with high precision, the majority of surface particle contamination greater than 1-micron-diameter in size from ultrapure semiconductor wafer materials containing implanted solar wind samples returned by NASA's Genesis mission. This cleaning device uses a 1.5-liter/minute flowing stream of heated ultrapure water (UPW) with 1- MHz oscillating megasonic pulse energy focused at 3 to 5 mm away from the wafer surface spinning at 1,000 to 10,000 RPM, depending on sample size. The surface particle contamination is removed by three processes: flowing UPW, megasonic cavitations, and centripetal force from the spinning wafer. The device can also dry the wafer fragment after UPW/megasonic cleaning by continuing to spin the wafer in the cleaning chamber, which is purged with flowing ultrapure nitrogen gas at 65 psi (.448 kPa). The cleaner also uses three types of vacuum chucks that can accommodate all Genesis-flown array fragments in any dimensional shape between 3 and 100 mm in diameter. A sample vacuum chuck, and the manufactured UPW/megasonic nozzle holder, replace the human deficiencies by maintaining a consistent distance between the nozzle and wafer surface as well as allowing for longer cleaning time. The 3- to 5-mm critical distance is important for the ability to remove particles by megasonic cavitations. The increased UPW sonication time and exposure to heated UPW improve the removal of 1- to 5-micron-sized particles.

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems.

PubMed

Okabe, Kenji; Jeewan, Horagodage Prabhath; Yamagiwa, Shota; Kawano, Takeshi; Ishida, Makoto; Akita, Ippei

2015-12-16

In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction.

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

PubMed Central

Okabe, Kenji; Jeewan, Horagodage Prabhath; Yamagiwa, Shota; Kawano, Takeshi; Ishida, Makoto; Akita, Ippei

2015-01-01

In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of external matching components, resulting in the realization of a small-size system. In addition, the technique employed to assemble a silicon large-scale integration (LSI) chip on the very thin parylene film (5 μm) enables the integration of the rectifier circuits and the flexible antenna (rectenna). In the demonstration of wireless power transmission (WPT), the fabricated flexible rectenna achieved a maximum efficiency of 0.497% with a distance of 3 cm between antennas. In addition, WPT with radio waves allows a misalignment of 185% against antenna size, implying that the misalignment has a less effect on the WPT characteristics compared with electromagnetic induction. PMID:26694407

Type of packaging affects the colour stability of vitamin E enriched beef.

PubMed

Nassu, Renata T; Uttaro, Bethany; Aalhus, Jennifer L; Zawadski, Sophie; Juárez, Manuel; Dugan, Michael E R

2012-12-01

Colour stability is a very important parameter for meat retail display, as appearance of the product is the deciding factor for consumers at time of purchase. This study investigated the possibility of extending appearance shelf-life through the combined use of packaging method (overwrapping - OVER, modified atmosphere - MAP, vacuum skin packaging - VSP and a combination of modified atmosphere and vacuum skin packaging - MAPVSP) and antioxidants (vitamin E enriched beef). Retail attributes (appearance, lean colour, % surface discolouration), as well as colour space analysis of images for red, green and blue parameters were measured over 18days. MAPVSP provided the most desirable retail appearance during the first 4days of retail display, while VSP-HB had the best colour stability. Overall, packaging type was more influential than α-tocopherol levels on meat colour stability, although α-tocopherol levels (>4μgg(-1) meat) had a protective effect when using high oxygen packaging methods. Crown Copyright © 2012. Published by Elsevier Ltd. All rights reserved.

Single-mode glass waveguide technology for optical interchip communication on board level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning

2012-01-01

The large bandwidth demand in long-distance telecom networks lead to single-mode fiber interconnects as result of low dispersion, low loss and dense wavelength multiplexing possibilities. In contrast, multi-mode interconnects are suitable for much shorter lengths up to 300 meters and are promising for optical links between racks and on board level. Active optical cables based on multi-mode fiber links are at the market and research in multi-mode waveguide integration on board level is still going on. Compared to multi-mode, a single-mode waveguide has much more integration potential because of core diameters of around 20% of a multi-mode waveguide by a much larger bandwidth. But light coupling in single-mode waveguides is much more challenging because of lower coupling tolerances. Together with the silicon photonics technology, a single-mode waveguide technology on board-level will be the straight forward development goal for chip-to-chip optical interconnects integration. Such a hybrid packaging platform providing 3D optical single-mode links bridges the gap between novel photonic integrated circuits and the glass fiber based long-distance telecom networks. Following we introduce our 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip interconnects. This novel packaging approach merges micro-system packaging and glass integrated optics. It consists of a thin glass substrate with planar integrated singlemode waveguide circuits, optical mirrors and lenses providing an integration platform for photonic IC assembly and optical fiber interconnect. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties. That makes it perfect for microsystem packaging. The paper presents recent results in single-mode waveguide technology on wafer level and waveguide characterization. Furthermore the integration in a hybrid packaging process and design issues are discussed.

A highly miniaturized vacuum package for a trapped ion atomic clock

DOE PAGES

Schwindt, Peter D. D.; Jau, Yuan-Yu; Partner, Heather; ...

2016-05-12

We report on the development of a highly miniaturized vacuum package for use in an atomic clock utilizing trapped ytterbium-171 ions. The vacuum package is approximately 1 cm 3 in size and contains a linear quadrupole RF Paul ion trap, miniature neutral Yb sources, and a non-evaporable getter pump. We describe the fabrication process for making the Yb sources and assembling the vacuum package. To prepare the vacuum package for ion trapping, it was evacuated, baked at a high temperature, and then back filled with a helium buffer gas. Once appropriate vacuum conditions were achieved in the package, the packagemore » was sealed with a copper pinch-off and was then pumped only by the non-evaporable getter. We demonstrated ion trapping in this vacuum package and the operation of an atomic clock, stabilizing a local oscillator to the 12.6 GHz hyperfine transition of 171Yb +. The fractional frequency stability of the clock was measured to be 2 × 10 -11 / τ 1/2.« less

Fabricating capacitive micromachined ultrasonic transducers with a novel silicon-nitride-based wafer bonding process.

PubMed

Logan, Andrew; Yeow, John T W

2009-05-01

We report the fabrication and experimental testing of 1-D 23-element capacitive micromachined ultrasonic transducer (CMUT) arrays that have been fabricated using a novel wafer-bonding process whereby the membrane and the insulation layer are both silicon nitride. The membrane and cell cavities are deposited and patterned on separate wafers and fusion-bonded in a vacuum environment to create CMUT cells. A user-grown silicon-nitride membrane layer avoids the need for expensive silicon-on-insulator (SOI) wafers, reduces parasitic capacitance, and reduces dielectric charging. It allows more freedom in selecting the membrane thickness while also providing the benefits of wafer-bonding fabrication such as excellent fill factor, ease of vacuum sealing, and a simplified fabrication process when compared with the more standard sacrificial release process. The devices fabricated have a cell diameter of 22 microm, a membrane thickness of 400 nm, a gap depth of 150 nm, and an insulation thickness of 250 nm. The resonant frequency of the CMUT in air is 17 MHz and has an attenuation compensated center frequency of approximately 9 MHz in immersion with a -6 dB fractional bandwidth of 123%. This paper presents the fabrication process and some characterization results.

A highly miniaturized vacuum package for a trapped ion atomic clock

DOE Office of Scientific and Technical Information (OSTI.GOV)

Schwindt, Peter D. D., E-mail: pschwin@sandia.gov; Jau, Yuan-Yu; Partner, Heather

2016-05-15

We report on the development of a highly miniaturized vacuum package for use in an atomic clock utilizing trapped ytterbium-171 ions. The vacuum package is approximately 1 cm{sup 3} in size and contains a linear quadrupole RF Paul ion trap, miniature neutral Yb sources, and a non-evaporable getter pump. We describe the fabrication process for making the Yb sources and assembling the vacuum package. To prepare the vacuum package for ion trapping, it was evacuated, baked at a high temperature, and then back filled with a helium buffer gas. Once appropriate vacuum conditions were achieved in the package, it wasmore » sealed with a copper pinch-off and was subsequently pumped only by the non-evaporable getter. We demonstrated ion trapping in this vacuum package and the operation of an atomic clock, stabilizing a local oscillator to the 12.6 GHz hyperfine transition of {sup 171}Y b{sup +}. The fractional frequency stability of the clock was measured to be 2 × 10{sup −11}/τ{sup 1/2}.« less

Effects of lactate and modified atmospheric packaging on premature browning in cooked ground beef patties.

PubMed

Mancini, R A; Ramanathan, R; Suman, S P; Konda, M K R; Joseph, P; Dady, G A; Naveena, B M; López-López, I

2010-06-01

Our objectives were to determine the effects of lactate and modified atmosphere packaging on raw surface color, lipid oxidation, and internal cooked color of ground beef patties. Eight chubs (85% lean) were divided in half and each half was either assigned to the control (no lactate) or mixed with 2.5% lactate (w/w). Following treatment, patties were prepared and packaged in either vacuum, PVC (atmospheric oxygen level), high-oxygen (80% O(2)+20% CO(2)), or 0.4% CO (30% CO(2)+69.6% N(2)) and stored for 0, 2, or 4days at 2 degrees C. After storage, raw surface color and lipid oxidation were measured and patties were cooked to either 66 degrees C or 71 degrees C. Lactate improved (p<0.05) color stability of PVC, high-oxygen, and vacuum packaged raw patties, but had no effect (p>0.05) on the a * values and visual color scores of patties in 0.4% CO. Lactate decreased (p<0.05) lipid oxidation in all packaging atmospheres. Nevertheless, high-oxygen and PVC-packaged patties had more (p<0.05) lipid oxidation than patties in CO and vacuum. Lactate had no effect (p>0.05) on premature browning, whereas patties packaged in high-oxygen demonstrated premature browning. Conversely, cooked patties in 0.4% CO and vacuum were more red (p<0.05) than both high-oxygen and PVC-packaged patties. Although lactate improved raw color stability, it did not minimize premature browning in cooked ground beef patties. Copyright 2010 Elsevier Ltd. All rights reserved.

Effect of low-dose (1 kGy) gamma radiation and selected phosphates on the microflora of vacuum-packaged ground pork

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ehioba, R.M.

1987-01-01

The effects of low-dose (1 kGy) gamma radiation and selected phosphates on the microbiology of refrigerated, vacuum-packaged ground pork were studied. Low-dose gamma radiation reduced the numbers of naturally occurring mesophiles, psychrotrophs, and anaerobes. The effect of low-dose radiation on the populations of lactic acid bacteria was minimal. On storage of the irradiated vacuum-packaged ground pork at 5/sup 0/C, there was a partial bacterial recovery, suggesting sublethal bacterial injury due to irradiation. When 10/sup 7/ CFU/g of meat is taken to be the level beyond which the meat would be considered spoiled, uninoculated, vacuum-packaged ground pork treated with 1 kGymore » (100 krad) of gamma radiation had 3.5 more days of shelf-life in terms of psychrotrophic total counts. In relation to anaerobic bacterial numbers, meat shelf-life was extended 2.5 days, while the shelf-life of meat was extended 1 day in terms of aerobic mesophilic bacteria. Irradiation prolonged shelf-life in inoculated (10/sup 5/CFU/g) meat for 1.0-1.5 days. Addition of 0.4% sodium acid pyrophosphate (SAPP) contributed 2 additional days to inoculated, irradiated vacuum-packaged ground pork shelf-life. However, SAPP had no added effect on naturally occurring microflora. Irradiation greatly decreased the numbers of gram-negative microorganisms, resulting in predominance of the gram-positive, nonsporeforming Lactobacillus and coryneform bacteria.« less

Centimeter-scale MEMS scanning mirrors for high power laser application

NASA Astrophysics Data System (ADS)

Senger, F.; Hofmann, U.; v. Wantoch, T.; Mallas, C.; Janes, J.; Benecke, W.; Herwig, Patrick; Gawlitza, P.; Ortega-Delgado, M.; Grune, C.; Hannweber, J.; Wetzig, A.

2015-02-01

A higher achievable scan speed and the capability to integrate two scan axes in a very compact device are fundamental advantages of MEMS scanning mirrors over conventional galvanometric scanners. There is a growing demand for biaxial high speed scanning systems complementing the rapid progress of high power lasers for enabling the development of new high throughput manufacturing processes. This paper presents concept, design, fabrication and test of biaxial large aperture MEMS scanning mirrors (LAMM) with aperture sizes up to 20 mm for use in high-power laser applications. To keep static and dynamic deformation of the mirror acceptably low all MEMS mirrors exhibit full substrate thickness of 725 μm. The LAMM-scanners are being vacuum packaged on wafer-level based on a stack of 4 wafers. Scanners with aperture sizes up to 12 mm are designed as a 4-DOF-oscillator with amplitude magnification applying electrostatic actuation for driving a motor-frame. As an example a 7-mm-scanner is presented that achieves an optical scan angle of 32 degrees at 3.2 kHz. LAMM-scanners with apertures sizes of 20 mm are designed as passive high-Q-resonators to be externally excited by low-cost electromagnetic or piezoelectric drives. Multi-layer dielectric coatings with a reflectivity higher than 99.9 % have enabled to apply cw-laser power loads of more than 600 W without damaging the MEMS mirror. Finally, a new excitation concept for resonant scanners is presented providing advantageous shaping of intensity profiles of projected laser patterns without modulating the laser. This is of interest in lighting applications such as automotive laser headlights.

Investigation of the heating behavior of carbide-bonded graphene coated silicon wafer used for hot embossing

NASA Astrophysics Data System (ADS)

Yang, Gao; Li, Lihua; Lee, Wing Bun; Ng, Man Cheung; Chan, Chang Yuen

2018-03-01

A recently developed carbide-bonded graphene (CBG) coated silicon wafer was found to be an effective micro-patterned mold material for implementing rapid heating in hot embossing processes owing to its superior electrical and thermal conductivity, in addition to excellent mechanical properties. To facilitate the achievement of precision temperature control in the hot embossing, the heating behavior of a CBG coated silicon wafer sample was experimentally investigated. First, two groups of controlled experiments were conducted for quantitatively evaluating the influence of the main factors such as the vacuum pressure and gaseous environment (vacuum versus nitrogen) on its heating performance. The electrical and thermal responses of this sample under a voltage of 60 V were then intensively analyzed, and revealed that it had somewhat semi-conducting properties. Further, we compared its thermal profiles under different settings of the input voltage and current limiting threshold. Moreover, the strong temperature dependence of electrical resistance for this material was observed and determined. Ultimately, the surface temperature of CBG coated silicon wafer could be as high as 1300 ℃, but surprisingly the graphene coating did not detach from the substrate under such an elevated temperature due to its strong thermal coupling with the silicon wafer.

Non-Destructive Damping Measurement for Wafer-Level Packaged Microelectromechanical System (MEMS) Acceleration Switches

DTIC Science & Technology

2014-09-01

Micromechanics and Microengineering . 2005;15:176–184. 10. Mohite SS, Kesari H, Sonti VR, Pratap R. Analytical solutions for the stiffness and damping...coefficients of squeeze films in MEMS devices with perforated back plates. Journal of Micromechanics and Microengineering . 2005;15:2083–2092. 11. Younis MI

Evidence of Processing Non-Idealities in 4H-SiC Integrated Circuits Fabricated with Two Levels of Metal Interconnect

NASA Technical Reports Server (NTRS)

Spry, David J.; Neudeck, Philip G.; Liangyu, Chen; Evans, Laura J.; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.

2015-01-01

The fabrication and prolonged 500 C electrical testing of 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) with two levels of metal interconnect is reported in another submission to this conference proceedings. While some circuits functioned more than 1000 hours at 500 C, the majority of packaged ICs from this wafer electrically failed after less than 200 hours of operation in the same test conditions. This work examines the root physical degradation and failure mechanisms believed responsible for observed large discrepancies in 500 C operating time. Evidence is presented for four distinct issues that significantly impacted 500 C IC operational yield and lifetime for this wafer.

Evidence of Processing Non-Idealities in 4H-SiC Integrated Circuits Fabricated With Two Levels of Metal Interconnect

NASA Technical Reports Server (NTRS)

Spry, David J.; Neudeck, Philip G.; Chen, Liangyu; Evans, Laura J.; Lukco, Dorothy; Chang, Carl W.; Beheim, Glenn M.

2015-01-01

The fabrication and prolonged 500 C electrical testing of 4H-SiC junction field effect transistor (JFET) integrated circuits (ICs) with two levels of metal interconnect is reported in another submission to this conference proceedings. While some circuits functioned more than 3000 hours at 500 C, the majority of packaged ICs from this wafer electrically failed after less than 200 hours of operation in the same test conditions. This work examines the root physical degradation and failure mechanisms believed responsible for observed large discrepancies in 500 C operating time. Evidence is presented for four distinct issues that significantly impacted 500 C IC operational yield and lifetime for this wafer.

Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds

NASA Astrophysics Data System (ADS)

Stamoulis, Konstantinos; Tsau, Christine H.; Spearing, S. Mark

2005-01-01

Wafer-level, thermocompression bonding is a promising technique for MEMS packaging. The quality of the bond is critically dependent on the interaction between flatness deviations, the gold film properties and the process parameters and tooling used to achieve the bonds. The effect of flatness deviations on the resulting bond is investigated in the current work. The strain energy release rate associated with the elastic deformation required to overcome wafer bow is calculated. A contact yield criterion is used to examine the pressure and temperature conditions required to flatten surface roughness asperities in order to achieve bonding over the full apparent area. The results are compared to experimental data of bond yield and toughness obtained from four-point bend delamination testing and microscopic observations of the fractured surfaces. Conclusions from the modeling and experiments indicate that wafer bow has negligible effect on determining the variability of bond quality and that the well-bonded area is increased with increasing bonding pressure. The enhanced understanding of the underlying deformation mechanisms allows for a better controlled trade-off between the bonding pressure and temperature.

Low-temperature wafer-level gold thermocompression bonding: modeling of flatness deviations and associated process optimization for high yield and tough bonds

NASA Astrophysics Data System (ADS)

Stamoulis, Konstantinos; Tsau, Christine H.; Spearing, S. Mark

2004-12-01

Wafer-level, thermocompression bonding is a promising technique for MEMS packaging. The quality of the bond is critically dependent on the interaction between flatness deviations, the gold film properties and the process parameters and tooling used to achieve the bonds. The effect of flatness deviations on the resulting bond is investigated in the current work. The strain energy release rate associated with the elastic deformation required to overcome wafer bow is calculated. A contact yield criterion is used to examine the pressure and temperature conditions required to flatten surface roughness asperities in order to achieve bonding over the full apparent area. The results are compared to experimental data of bond yield and toughness obtained from four-point bend delamination testing and microscopic observations of the fractured surfaces. Conclusions from the modeling and experiments indicate that wafer bow has negligible effect on determining the variability of bond quality and that the well-bonded area is increased with increasing bonding pressure. The enhanced understanding of the underlying deformation mechanisms allows for a better controlled trade-off between the bonding pressure and temperature.

Effect of the ripening time under vacuum and packaging film permeability on processing and quality characteristics of low-fat fermented sausages.

PubMed

Liaros, N G; Katsanidis, E; Bloukas, J G

2009-12-01

The effect of vacuum ripening of low-fat fermented sausages packaged in films with different permeabilities on their microbiological, physicochemical and sensorial characteristics was studied. High-fat control sausages were produced with 30% initial fat and low-fat sausages with 10% initial fat. The low-fat sausages were separated into: (a) non-packaged (control) and (b) packaged under vacuum on 7th, 12th and 17th day of processing, remaining under vacuum during the ripening period for 21, 16 and 11days, respectively, in three different oxygen (100, 38 and⩽5cm(3)/m(2)/24h/1atm) and water vapour (4.5, <2.5 and 1g/m(2)24h) permeability plastic bags. Vacuum packaging reduced (p<0.05) the weight loss, the hardness and extent of lipid oxidation in the sausages, increased (p<0.05) their lightness, but had no effect (p>0.05) on the redness, compared to the control sausages. Packaging low-fat fermented sausages under vacuum for the last 11days of ripening in packaging film with high permeability increased (p<0.05) the lactic acid bacteria count. The same product packaged in film with medium permeability had a higher (p<0.05) Micrococcaceae count and the same (p>0.05) hardness and overall acceptability as the high-fat control sausages. A ripening time of 11days and the medium packaging film permeability were the most appropriate conditions for the vacuum packaging of low-fat fermented sausages.

Laser cutting sandwich structure glass-silicon-glass wafer with laser induced thermal-crack propagation

NASA Astrophysics Data System (ADS)

Cai, Yecheng; Wang, Maolu; Zhang, Hongzhi; Yang, Lijun; Fu, Xihong; Wang, Yang

2017-08-01

Silicon-glass devices are widely used in IC industry, MEMS and solar energy system because of their reliability and simplicity of the manufacturing process. With the trend toward the wafer level chip scale package (WLCSP) technology, the suitable dicing method of silicon-glass bonded structure wafer has become necessary. In this paper, a combined experimental and computational approach is undertaken to investigate the feasibility of cutting the sandwich structure glass-silicon-glass (SGS) wafer with laser induced thermal-crack propagation (LITP) method. A 1064 nm semiconductor laser cutting system with double laser beams which could simultaneously irradiate on the top and bottom of the sandwich structure wafer has been designed. A mathematical model for describing the physical process of the interaction between laser and SGS wafer, which consists of two surface heating sources and two volumetric heating sources, has been established. The temperature stress distribution are simulated by using finite element method (FEM) analysis software ABAQUS. The crack propagation process is analyzed by using the J-integral method. In the FEM model, a stationary planar crack is embedded in the wafer and the J-integral values around the crack front edge are determined using the FEM. A verification experiment under typical parameters is conducted and the crack propagation profile on the fracture surface is examined by the optical microscope and explained from the stress distribution and J-integral value.

Laser Vacuum Furnace for Zone Refining

NASA Technical Reports Server (NTRS)

Griner, D. B.; Zurburg, F. W.; Penn, W. M.

1986-01-01

Laser beam scanned to produce moving melt zone. Experimental laser vacuum furnace scans crystalline wafer with high-power CO2-laser beam to generate precise melt zone with precise control of temperature gradients around zone. Intended for zone refining of silicon or other semiconductors in low gravity, apparatus used in normal gravity.

New getter configuration at wafer level for assuring long term stability of MEMs

NASA Astrophysics Data System (ADS)

Moraja, Marco; Amiotti, Marco; Kullberg, Richard C.

2003-01-01

The evolution from ceramic packages to wafer to wafer hermetic sealing poses tremendous technical challenges to integrate a proper getter inside the MEMs to assure a long term stability and reliability of the devices. The state of the art solution to integrate a getter inside the MEMs of the last generation consists in patterning the getter material with a specific geometry onto the Si cap wafer. The practical implementation of this solution consists in a 4" or 6" Si wafers with grooves or particular incisures, where the getter material is placed in form of a thick film. The typical thickness of these thick films is in the range of few microns, depending on the gas load to be handled during the lifetime of the device. The structure of the thick getter film is highly porous in order to improve sorption performances, but at the same time there are no loose particles thanks to a proprietary manufacturing method. The getter thick film is composed of a Zr special alloy with a proper composition to optimize the sorption performances. The getter thick film can be placed selectively into grooves without affecting the lateral regions, surrounding the grooves where the hermetic sealing is performed.

Chip-package nano-structured copper and nickel interconnections with metallic and polymeric bonding interfaces

NASA Astrophysics Data System (ADS)

Aggarwal, Ankur

With the semiconductor industry racing toward a historic transition, nano chips with less than 45 nm features demand I/Os in excess of 20,000 that support computing speed in terabits per second, with multi-core processors aggregately providing highest bandwidth at lowest power. On the other hand, emerging mixed signal systems are driving the need for 3D packaging with embedded active components and ultra-short interconnections. Decreasing I/O pitch together with low cost, high electrical performance and high reliability are the key technological challenges identified by the 2005 International Technology Roadmap for Semiconductors (ITRS). Being able to provide several fold increase in the chip-to-package vertical interconnect density is essential for garnering the true benefits of nanotechnology that will utilize nano-scale devices. Electrical interconnections are multi-functional materials that must also be able to withstand complex, sustained and cyclic thermo-mechanical loads. In addition, the materials must be environmentally-friendly, corrosion resistant, thermally stable over a long time, and resistant to electro-migration. A major challenge is also to develop economic processes that can be integrated into back end of the wafer foundry, i.e. with wafer level packaging. Device-to-system board interconnections are typically accomplished today with either wire bonding or solders. Both of these are incremental and run into either electrical or mechanical barriers as they are extended to higher density of interconnections. Downscaling traditional solder bump interconnect will not satisfy the thermo-mechanical reliability requirements at very fine pitches of the order of 30 microns and less. Alternate interconnection approaches such as compliant interconnects typically require lengthy connections and are therefore limited in terms of electrical properties, although expected to meet the mechanical requirements. A novel chip-package interconnection technology is developed to address the IC packaging requirements beyond the ITRS projections and to introduce innovative design and fabrication concepts that will further advance the performance of the chip, the package, and the system board. The nano-structured interconnect technology simultaneously packages all the ICs intact in wafer form with quantum jump in the number of interconnections with the lowest electrical parasitics. The intrinsic properties of nano materials also enable several orders of magnitude higher interconnect densities with the best mechanical properties for the highest reliability and yet provide higher current and heat transfer densities. Nano-structured interconnects provides the ability to assemble the packaged parts on the system board without the use of underfill materials and to enable advanced analog/digital testing, reliability testing, and burn-in at wafer level. This thesis investigates the electrical and mechanical performance of nanostructured interconnections through modeling and test vehicle fabrication. The analytical models evaluate the performance improvements over solder and compliant interconnections. Test vehicles with nano-interconnections were fabricated using low cost electro-deposition techniques and assembled with various bonding interfaces. Interconnections were fabricated at 200 micron pitch to compare with the existing solder joints and at 50 micron pitch to demonstrate fabrication processes at fine pitches. Experimental and modeling results show that the proposed nano-interconnections could enhance the reliability and potentially meet all the system performance requirements for the emerging micro/nano-systems.

Contamination Control Assessment of the World's Largest Space Environment Simulation Chamber

NASA Technical Reports Server (NTRS)

Snyder, Aaron; Henry, Michael W.; Grisnik, Stanley P.; Sinclair, Stephen M.

2012-01-01

The Space Power Facility s thermal vacuum test chamber is the largest chamber in the world capable of providing an environment for space simulation. To improve performance and meet stringent requirements of a wide customer base, significant modifications were made to the vacuum chamber. These include major changes to the vacuum system and numerous enhancements to the chamber s unique polar crane, with a goal of providing high cleanliness levels. The significance of these changes and modifications are discussed in this paper. In addition, the composition and arrangement of the pumping system and its impact on molecular back-streaming are discussed in detail. Molecular contamination measurements obtained with a TQCM and witness wafers during two recent integrated system tests of the chamber are presented and discussed. Finally, a concluding remarks section is presented.

Redesigning the continuous vacuum sealer packaging machine to improve the processing speed

NASA Astrophysics Data System (ADS)

Belo, J. B.; Widyanto, S. A.; Jamari, J.

2017-01-01

Vacuum sealer as a product packaging tool of food products to be able to vacuum air inside the plastic which is filled with food products and it causes the pressure lower. In this condition, the optimal heating temperature is reached in a shorter time, so that damage on plastic sealer of vacuumed food products could be prevented to be more effective and efficient. The purpose of this redesigning is to design a vacuum sealer packaging machine continuously through a conveyor mechanism on the packaging quality, time of processing speed of vacuuming food product in the plastic package. This designing process is conducted through several steps of designing and constructing tools until the products are ready to operate. Data analysis is done through quality test of vacuum and sealer to the plastic thickness of 75 µm, 80 µm, and 100 µm with temperature of 170°C, 180°C, 190°C and vacuum duration of 5 seconds, 8 seconds, and 60 seconds. Results of this designing process indicate that vacuum sealer works practically and more optimally with the time of vacuum processing speed of 0 to 1 minute/s; whereas, the pressure of vacuuming suction is until 1e-5 MPa. The results of tensile strength test are at a maximum of 32,796 (N/mm2) and a minimum of 20,155 (N/mm2) and the analysis of plastic composite with EDX. This result shows that the vacuum pressure and the quality of vacuum sealer are better and more efficient.

Use of Optical Oxygen Sensors in Non-Destructively Determining the Levels of Oxygen Present in Combined Vacuum and Modified Atmosphere Packaged Pre-Cooked Convenience-Style Foods and the Use of Ethanol Emitters to Extend Product Shelf-Life.

PubMed

Hempel, Andreas W; Papkovsky, Dmitri B; Kerry, Joseph P

2013-11-18

O₂ sensors were used to non-destructively monitor O₂ levels in commercially packed pre-cooked, convenience modified atmosphere packaging (MAP) foods. A substantial level of O₂ (>15%) was present in packs resulting in a shorter than expected shelf-life, where the primary spoilage mechanism was found to be mould. Various combinations of vacuum (0-0.6 MPa) and gas flush (0.02-0.03 MPa) (30% CO₂/70% N₂) settings were assessed as treatments that result in the desired shelf-life (28 days). This was achieved using the combined treatment of vacuum 0.35 MPa and gas flush 0.02 MPa which resulted in a reduction of 6%-9% O 2 in all three samples (battered sausages (BS), bacon slices (BA), and meat and potato pies (PP)). Reduced O₂ levels reflect the microbial quality of products, which has been successfully reduced. Duplicate samples of all product packs were produced using ethanol emitters (EE) to see if shelf-life could be further extended. Results showed a further improvement in shelf-life to 35 days. Sensory analysis showed that ethanol flavour and aroma was not perceived by panellists in two of the three products assessed. This study demonstrates how smart packaging technologies, both intelligent and active, can be used to assist in the modification of conventional packaging systems in order to enhance product quality and safety and through the extension of product shelf-life.

The development of 8 inch roll-to-plate nanoimprint lithography (8-R2P-NIL) system

NASA Astrophysics Data System (ADS)

Lee, Lai Seng; Mohamed, Khairudin; Ooi, Su Guan

2017-07-01

Growth in semiconductor and integrated circuit industry was observed in the past decennium of years for industrial technology which followed Moore's law. The line width of nanostructure to be exposed was influenced by the essential technology of photolithography. Thus, it is crucial to have a low cost and high throughput manufacturing process for nanostructures. Nanoimprint Lithography technique invented by Stephen Y. Chou was considered as major nanolithography process to be used in future integrated circuit and integrated optics. The drawbacks of high imprint pressure, high imprint temperature, air bubbles formation, resist sticking to mold and low throughput of thermal nanoimprint lithography on silicon wafer have yet to be solved. Thus, the objectives of this work is to develop a high throughput, low imprint force, room temperature UV assisted 8 inch roll to plate nanoimprint lithography system capable of imprinting nanostructures on 200 mm silicon wafer using roller imprint with flexible mold. A piece of resist spin coated silicon wafer was placed onto vacuum chuck drives forward by a stepper motor. A quartz roller wrapped with a piece of transparent flexible mold was used as imprint roller. The imprinted nanostructures were cured by 10 W, 365 nm UV LED which situated inside the quartz roller. Heat generated by UV LED was dissipated by micro heat pipe. The flexible mold detaches from imprinted nanostructures in a 'line peeling' pattern and imprint pressure was measured by ultra-thin force sensors. This system has imprinting speed capability ranging from 0.19 mm/s to 5.65 mm/s, equivalent to imprinting capability of 3 to 20 pieces of 8 inch wafers per hour. Speed synchronization between imprint roller and vacuum chuck was achieved by controlling pulse rate supplied to stepper motor which drive the vacuum chuck. The speed different ranging from 2 nm/s to 98 nm/s is achievable. Vacuum chuck height was controlled by stepper motor with displacement of 5 nm/step.

Study on vacuum packaging reliability of micromachined quartz tuning fork gyroscopes

NASA Astrophysics Data System (ADS)

Fan, Maoyan; Zhang, Lifang

2017-09-01

Packaging technology of the micromachined quartz tuning fork gyroscopes by vacuum welding has been experimentally studied. The performance of quartz tuning fork is influenced by the encapsulation shell, encapsulation method and fixation of forks. Alloy solder thick film is widely used in the package to avoid the damage of the chip structure by the heat resistance and hot temperature, and this can improve the device performance and welding reliability. The results show that the bases and the lids plated with gold and nickel can significantly improve the airtightness and reliability of the vacuum package. Vacuum packaging is an effective method to reduce the vibration damping, improve the quality factor and further enhance the performance. The threshold can be improved nearly by 10 times.

Quality of Meat (Longissimus dorsi) from Male Fallow Deer (Dama dama) Packaged and Stored under Vacuum and Modified Atmosphere Conditions

PubMed Central

Piaskowska, N.; Daszkiewicz, T.; Kubiak, D.; Zapotoczny, P.

2016-01-01

This study evaluated the effect of vacuum and modified atmosphere (40% CO2+60% N2, MA) packaging on the chemical composition, physicochemical properties and sensory attributes of chill-stored meat from 10 fallow deer (Dama dama) bucks at 17 to 18 months of age. The animals were hunter-harvested in the forests of north-eastern Poland. During carcass dressing (48 to 54 h post mortem), both musculus longissimus muscles were cut out. Each muscle was divided into seven sections which were allocated to three groups: 0, A, and B. Samples 0 were immediately subjected to laboratory analyses. Samples A were vacuum-packaged, and samples B were packaged in MA. Packaged samples were stored for 7, 14, and 21 days at 2°C. The results of the present study showed that the evaluated packaging systems had no significant effect on the quality of fallow deer meat during chilled storage. However, vacuum-packaged meat samples were characterised by greater drip loss. Vacuum and MA packaging contributed to preserving the desired physicochemical properties and sensory attributes of meat during 21 days of storage. Regardless of the packaging method used, undesirable changes in the colour, water-holding capacity and juiciness of meat, accompanied by tenderness improvement, were observed during chilled storage. PMID:27165026

The influence of headspace and dissolved oxygen level on growth and haemolytic BL enterotoxin production of a psychrotolerant Bacillus weihenstephanensis isolate on potato based ready-to-eat food products.

PubMed

Samapundo, S; Everaert, H; Wandutu, J N; Rajkovic, A; Uyttendaele, M; Devlieghere, F

2011-04-01

The major objective of this study was to determine the influence of the initial headspace and dissolved O(2) level and vacuum packaging on growth and diarrhoeal enterotoxin production by Bacillus weihenstephanensis on potato based ready-to-eat food products. In general, the lower the initial headspace or dissolved O(2) level the slower the maximum growth rate (μ(max), log(10) CFU g(-1) d(-1)), the longer the lag phase duration (λ, d) and the smaller the maximum population density (N(max), log(10) CFU g(-1)) became. The slowest μ(max), the longest λ and the smallest N(max) were generally found for growth under vacuum packaging. This implies shorter shelf-lives will occur at higher initial headspace or dissolved O(2) levels as the growth of B. weihenstephanensis to the infective dose of 10(5) CFU g(-1) in such atmospheres takes a shorter time. Significant consumption of dissolved O(2) only occurred when growth shifted from the lag to the exponential phase and growth generally transitioned from the exponential to the stationary phase when the dissolved O(2) levels fell below ca. 75 ppb. Diarrhoeal enterotoxin production (determined via detection of the L2 component of haemolytic BL) was similar for growth under initial headspace O(2) levels of 1-20.9%, and was only reduced when growth took place under vacuum packaging. The reduction in L2 production when growth took place under vacuum was most probably related to the low final cell densities observed under this condition. Both growth and L2 production were inhibited over a 32-day incubation period at 7 °C by 40% CO(2) irrespective of the headspace or dissolved O(2) levels. The results illustrate the importance of residual O(2) and CO(2) on the shelf-stability and safety of modified atmosphere packaged potato based ready-to-eat food products with regards to B. weihenstephanensis. Copyright © 2010 Elsevier Ltd. All rights reserved.

Silicon direct bonding approach to high voltage power device (insulated gate bipolar transistors)

NASA Astrophysics Data System (ADS)

Cha, Giho; Kim, Youngchul; Jang, Hyungwoo; Kang, Hyunsoon; Song, Changsub

2001-10-01

Silicon direct bonding technique was successfully applied for the fabrication of high voltage IGBT (Insulated Gate Bipolar Transistor). In this work, 5 inch, p-type CZ wafer for handle wafer and n-type FZ wafer for device wafer were used and bonding the two wafers was performed at reduced pressure (1mmTorr) using a modified vacuum bonding machine. Since the breakdown voltage in high voltage device has been determined by the remained thickness of device layer, grinding and CMP steps should be carefully designed in order to acquire better uniformity of device layer. In order to obtain the higher removal rate and the final better uniformity of device layer, the harmony of the two processes must be considered. We found that the concave type of grinding profile and the optimal thickness of ground wafer was able to reduce the process time of CMP step and also to enhance the final thickness uniformity of device layer up to +/- 1%. Finally, when compared epitaxy layer with SDB wafer, the SDB wafer was found to be more favorable in terms of cost and electrical characteristics.

Comparison of modified atmosphere packaging and vacuum packaging for long period storage of dry-cured ham: effects on colour, texture and microbiological quality.

PubMed

García-Esteban, Marta; Ansorena, Diana; Astiasarán, Iciar

2004-05-01

Slices of dry-cured hams (Biceps femoris muscle) were stored during 8 weeks under vacuum and modified atmospheres (100% N(2) and a mixture of 20% CO(2) and 80% N(2)) in order to study the modifications on colour, texture and microbial counts during that period. Lightness was found to be more stable when samples were stored with 20% CO(2) and 80% N(2) without statistical differences between vacuum and 100% N(2). A slight whiteness was observed in the vacuum packed samples. Yellowness increased during time in vacuum packed samples, although no differences were found among the three conditions at the end of the study. Redness values were not affected by time or by the packaging system. With regard to texture, values found for all samples were within the normal range for this type of products, although it was observed that modified atmosphere packaging preserved samples better from hardening than vacuum packaging. No safety problems were detected in relation to the microbial quality in any case. In general, no clear differences were found among the three packaging systems for colour, texture and microbial quality in the storage conditions studied.

Development and fabrication of a solar cell junction processing system

NASA Technical Reports Server (NTRS)

1984-01-01

A processing system capable of producing solar cell junctions by ion implantation followed by pulsed electron beam annealing was developed and constructed. The machine was to be capable of processing 4-inch diameter single-crystal wafers at a rate of 10(7) wafers per year. A microcomputer-controlled pulsed electron beam annealer with a vacuum interlocked wafer transport system was designed, built and demonstrated to produce solar cell junctions on 4-inch wafers with an AMI efficiency of 12%. Experiments showed that a non-mass-analyzed (NMA) ion beam could implant 10 keV phosphorous dopant to form solar cell junctions which were equivalent to mass-analyzed implants. A NMA ion implanter, compatible with the pulsed electron beam annealer and wafer transport system was designed in detail but was not built because of program termination.

Extension of the shelf life of prawns (Penaeus japonicus) by vacuum packaging and high-pressure treatment.

PubMed

López-Caballero, M E; Pérez-Mateos, M; Borderías, J A; Montero, P

2000-10-01

The present study has investigated the application of high pressures (200 and 400 MPa) in chilled prawn tails, both conventionally stored (air) and vacuum packaged. Vacuum packaging and high-pressure treatment did extend the shelf life of the prawn samples, although it did affect muscle color very slightly, giving it a whiter appearance. The viable shelf life of 1 week for the air-stored samples was extended to 21 days in the vacuum-packed samples, 28 days in the samples treated at 200 MPa, and 35 days in the samples pressurized at 400 MPa. Vacuum packaging checked the onset of blackening, whereas high-pressure treatment aggravated the problem. From a microbiological point of view, batches conventionally stored reached about 6 log CFU/g or even higher at 14 days. Similar figures were reached in total number of bacteria in vacuum-packed samples and in pressurized at 200-MPa samples at 21 days. When samples were pressurized at 400 MPa, total numbers of bacteria were below 5.5 log CFU/g at 35 days of storage. Consequently, a combination of vacuum packaging and high-pressure treatment would appear to be beneficial in prolonging freshness and preventing spotting.

193nm high power lasers for the wide bandgap material processing

NASA Astrophysics Data System (ADS)

Fujimoto, Junichi; Kobayashi, Masakazu; Kakizaki, Koji; Oizumi, Hiroaki; Mimura, Toshio; Matsunaga, Takashi; Mizoguchi, Hakaru

2017-02-01

Recently infrared laser has faced resolution limit of finer micromachining requirement on especially semiconductor packaging like Fan-Out Wafer Level Package (FO-WLP) and Through Glass Via hole (TGV) which are hard to process with less defect. In this study, we investigated ablation rate with deep ultra violet excimer laser to explore its possibilities of micromachining on organic and glass interposers. These results were observed with a laser microscopy and Scanning Electron Microscope (SEM). As the ablation rates of both materials were quite affordable value, excimer laser is expected to be put in practical use for mass production.

An investigation of the effect of rapid slurry chilling on blown pack spoilage of vacuum-packaged beef primals.

PubMed

Reid, R; Fanning, S; Whyte, P; Kerry, J; Bolton, D

2017-02-01

The aim of this study was to investigate if rapid slurry chilling would retard or prevent blown pack spoilage (BPS) of vacuum-packaged beef primals. Beef primals were inoculated with Clostridium estertheticum subspp. estertheticum (DSMZ 8809), C. estertheticum subspp. laramenise (DSMZ 14864) and C. gasigenes (DSMZ 12272), and vacuum-packaged with and without heat shrinkage (90°C for 3 s). These packs were then subjected to immediate chilling in an ice slurry or using conventional blast chilling systems and stored at 2°C for up to 100 days. The onset and progress of BPS was monitored using the following scale; 0-no gas bubbles in drip; 1-gas bubbles in drip; 2-loss of vacuum; 3-'blown'; 4-presence of sufficient gas inside the packs to produce pack distension and 5-tightly stretched, 'overblown' packs/packs leaking. Rapid slurry chilling (as compared to conventional chilling) did not significantly affect (P > 0.05) the time to the onset or progress of BPS. It was therefore concluded that rapid chilling of vacuum-packaged beef primals, using an ice slurry system, may not be used as a control intervention to prevent or retard blown pack spoilage. This study adds to our growing understanding of blown pack spoilage of vacuum-packaged beef primals and suggests that rapid chilling of vacuum-packaged beef primals is not a control option for the beef industry. The results suggest that neither eliminating the heat shrinkage step nor rapid chilling of vacuum-packaged beef retard the time to blown pack spoilage. © 2016 The Society for Applied Microbiology.

Fabricating a Microcomputer on a Single Silicon Wafer

NASA Technical Reports Server (NTRS)

Evanchuk, V. L.

1983-01-01

Concept for "microcomputer on a slice" reduces microcomputer costs by eliminating scribing, wiring, and packaging of individual circuit chips. Low-cost microcomputer on silicon slice contains redundant components. All components-central processing unit, input/output circuitry, read-only memory, and random-access memory (CPU, I/O, ROM, and RAM) on placed on single silicon wafer.

Comprehensive investigation of HgCdTe metalorganic chemical vapor deposition

NASA Technical Reports Server (NTRS)

Raupp, Gregory B.

1993-01-01

The principal objective of this experimental and theoretical research program was to explore the possibility of depositing high quality epitaxial CdTe and HgCdTe at very low pressures through metalorganic chemical vapor deposition (MOCVD). We explored two important aspects of this potential process: (1) the interaction of molecular flow transport and deposition in an MOCVD reactor with a commercial configuration, and (2) the kinetics of metal alkyl source gas adsorption, decomposition and desorption from the growing film surface using ultra high vacuum surface science reaction techniques. To explore the transport-reaction issue, we have developed a reaction engineering analysis of a multiple wafer-in-tube ultrahigh vacuum chemical vapor deposition (UHV/CVD) reactor which allows an estimate of wafer or substrate throughput for a reactor of fixed geometry and a given deposition chemistry with specified film thickness uniformity constraints. The model employs a description of ballistic transport and reaction based on the pseudo-steady approximation to the Boltzmann equation in the limit of pure molecular flow. The model representation takes the form of an integral equation for the flux of each reactant or intermediate species to the wafer surfaces. Expressions for the reactive sticking coefficients (RSC) for each species must be incorporated in the term which represents reemission from a wafer surface. The interactions of MOCVD precursors with Si and CdTe were investigated using temperature programmed desorption (TPD) in ultra high vacuum combined with Auger electron spectroscopy (AES). These studies revealed that diethyltellurium (DETe) and dimethylcadmium (DMCd) adsorb weakly on clean Si(100) and desorb upon heating without decomposing. These precursors adsorb both weakly and strongly on CdTe(111)A, with DMCd exhibiting the stronger interaction with the surface than DETe.

Low temperature wafer-level bonding for hermetic packaging of 3D microsystems

NASA Astrophysics Data System (ADS)

Tan, C. S.; Fan, J.; Lim, D. F.; Chong, G. Y.; Li, K. H.

2011-07-01

Metallic copper-copper (Cu-Cu) thermo-compression bonding, oxide-oxide (SiO2-SiO2) fusion bonding and silicon-silicon (Si-Si) direct bonding are investigated for potential application as hermetic seal in 3D microsystem packaging. Cavities are etched to a volume of 1.4 × 10-3 cm3 in accordance with the MIL-STD-883E standard prescribed for microelectronics packaging. In the case of metal bonding, a clean Cu layer with a thickness of 300 nm and a Ti barrier layer with an underlying thickness of 50 nm are used. The wafer pair is bonded at 300 °C under the application of a bonding force of 5500 N for 1 h. On the other hand, Si-Si bonding and SiO2-SiO2 bonding are initiated at room ambient after surface activation, followed by annealing in inert ambient at 300 °C for 1 h. The bonded cavities are stored in a helium bomb chamber and the leak rate is measured with a mass spectrometer. An excellent helium leak rate below 5 × 10-9 atm cm3 s-1 is detected for all cases and this is at least ten times better than the reject limit.

Optical Forces Near Microfabricated Devices

DTIC Science & Technology

2013-08-01

one beam for two power levels , 50mW and 100mW. 50 µm corresponds to the center of the channel...available MIT MEEP package (32). The computational resolution is 32 grid points per lattice constant. Fig 2.2(a) shows the normalized transmission through...a silicon-on-insulator wafer using standard techniques (33). The lattice constant of the photonic crystal can be scaled to place a given guided

Use of Optical Oxygen Sensors in Non-Destructively Determining the Levels of Oxygen Present in Combined Vacuum and Modified Atmosphere Packaged Pre-Cooked Convenience-Style Foods and the Use of Ethanol Emitters to Extend Product Shelf-Life

PubMed Central

Hempel, Andreas W.; Papkovsky, Dmitri B.; Kerry, Joseph P.

2013-01-01

O2 sensors were used to non-destructively monitor O2 levels in commercially packed pre-cooked, convenience modified atmosphere packaging (MAP) foods. A substantial level of O2 (>15%) was present in packs resulting in a shorter than expected shelf-life, where the primary spoilage mechanism was found to be mould. Various combinations of vacuum (0–0.6 MPa) and gas flush (0.02–0.03 MPa) (30% CO2/70% N2) settings were assessed as treatments that result in the desired shelf-life (28 days). This was achieved using the combined treatment of vacuum 0.35 MPa and gas flush 0.02 MPa which resulted in a reduction of 6%–9% O2 in all three samples (battered sausages (BS), bacon slices (BA), and meat and potato pies (PP)). Reduced O2 levels reflect the microbial quality of products, which has been successfully reduced. Duplicate samples of all product packs were produced using ethanol emitters (EE) to see if shelf-life could be further extended. Results showed a further improvement in shelf-life to 35 days. Sensory analysis showed that ethanol flavour and aroma was not perceived by panellists in two of the three products assessed. This study demonstrates how smart packaging technologies, both intelligent and active, can be used to assist in the modification of conventional packaging systems in order to enhance product quality and safety and through the extension of product shelf-life. PMID:28239134

Effect of packaging and storage time on survival of Listeria monocytogenes on kippered beef steak and turkey tenders.

PubMed

Uppal, Kamaldeep K; Getty, Kelly J K; Boyle, Elizabeth A E; Harper, Nigel M; Lobaton-Sulabo, April Shayne S; Barry, Bruce

2012-01-01

The objective of our study was to determine effect of packaging method and storage time on reducing Listeria monocytogenes in shelf-stable meat snacks. Commercially available kippered beef steak strips and turkey tenders were dipped into a 5-strain L. monocytogenes cocktail, and dried at 23 °C until a water activity of 0.80 was achieved. Inoculated samples were packaged with 4 treatments: (1) vacuum, (2) nitrogen flushed with oxygen scavenger, (3) heat sealed with oxygen scavenger, and (4) heat sealed without oxygen scavenger. Samples were stored at 23 °C and evaluated for L. monocytogenes levels at 0, 24, 48, and 72 h. Initial levels (time 0) of L. monocytogenes were approximately 5.7 log CFU/cm² for steak and tenders. After 24 h of storage time, a 1 log CFU/cm² reduction of L. monocytogenes was observed for turkey tenders for all packaging treatments. After 48 h, turkey tenders showed >1 log CFU/cm² reduction of L. monocytogenes for all packaging treatments except for vacuum, where only 0.9 log CFU/cm² reduction was observed. After 72 h, reductions for all packaging treatments for turkey tenders ranged from 1.5 to 2.4 log CFU/cm². For kippered beef steak, there was no interaction between the packaging treatments and all storage times (P > 0.05) whereas, time was different (P <0.05). For kippered beef steak, there was 1 log reduction of L. monocytogenes at 24 and 48 h of storage times at 23 °C for all packaging treatments and a 2.1 log CFU/ cm² L. monocytogenes reduction at 72 h of storage time. Processors of kippered beef steak and turkey tenders could use a combination of vacuum or nitrogen-flushing or heat sealed with an oxygen scavenger packaging methods and a holding time of 24 h prior to shipping to reduce potential L. monocytogenes numbers by ≥1 log. However, processors should be encouraged to hold packaged product a minimum of 72 h to enhance the margin of safety for L. monocytogenes control. © 2011 Institute of Food Technologists®

Reliability and Characteristics of Wafer-Level Chip-Scale Packages under Current Stress

NASA Astrophysics Data System (ADS)

Chen, Po-Ying; Kung, Heng-Yu; Lai, Yi-Shao; Hsiung Tsai, Ming; Yeh, Wen-Kuan

2008-02-01

In this work, we present a novel approach and method for elucidating the characteristics of wafer-level chip-scale packages (WLCSPs) for electromigration (EM) tests. The die in WLCSP was directly attached to the substrate via a soldered interconnect. The shrinking of the area of the die that is available for power, and the solder bump also shrinks the volume and increases the density of electrons for interconnect efficiency. The bump current density now approaches to 106 A/cm2, at which point the EM becomes a significant reliability issue. As known, the EM failure depends on numerous factors, including the working temperature and the under bump metallization (UBM) thickness. A new interconnection geometry is adopted extensively with moderate success in overcoming larger mismatches between the displacements of components during current and temperature changes. Both environments and testing parameters for WLCSP are increasingly demanded. Although failure mechanisms are considered to have been eliminated or at least made manageable, new package technologies are again challenging its process, integrity and reliability. WLCSP technology was developed to eliminate the need for encapsulation to ensure compatibility with smart-mount technology (SMT). The package has good handing properties but is now facing serious reliability problems. In this work, we investigated the reliability of a WLCSP subjected to different accelerated current stressing conditions at a fixed ambient temperature of 125 °C. A very strong correlation exists between the mean time to failure (MTTF) of the WLCSP test vehicle and the mean current density that is carried by a solder joint. A series of current densities were applied to the WLCSP architecture; Black's power law was employed in a failure mode simulation. Additionally, scanning electron microscopy (SEM) was adopted to determine the differences existing between high- and low-current-density failure modes.

NLC Electrical

Science.gov Websites

Racks and Cable Plant Instrumentation Systems Tunnel Electronics Enclosures Low Level RF Beam Positron Electronics Vacuum Electronics (Summary) System Notes NLC Electrical System Work Package Task Descriptions

Vacuum Flashover Characteristics of Laminated Polystyrene Insulators

DTIC Science & Technology

1999-06-01

space charge dominated. A minimum wafer thickness and/or the number of wafers required for the application can be calculated. Equation 1 represents...toward the anode. qn is the fraction of charge deposited on that section of the stack. Equation 1 comes from the assumption that a space charge ...Rodriguez, A.E., and Honig, E.M., "Characterization of an Insulated Space Charge Limited Non-Relativistic Electron Beam Diode Operating at 300 kV/cm

Apparatus for use in examining the lattice of a semiconductor wafer by X-ray diffraction

NASA Technical Reports Server (NTRS)

Parker, D. L.; Porter, W. A. (Inventor)

1978-01-01

An improved apparatus for examining the crystal lattice of a semiconductor wafer utilizing X-ray diffraction techniques was presented. The apparatus is employed in a method which includes the step of recording the image of a wafer supported in a bent configuration conforming to a compound curve, produced through the use of a vacuum chuck provided for an X-ray camera. The entire surface thereof is illuminated simultaneously by a beam of incident X-rays which are projected from a distant point-source and satisfy conditions of the Bragg Law for all points on the surface of the water.

Lipid and protein oxidation and sensory properties of vacuum-packaged dry-cured ham subjected to high hydrostatic pressure.

PubMed

Fuentes, Verónica; Ventanas, Jesús; Morcuende, David; Estévez, Mario; Ventanas, Sonia

2010-07-01

The effect of HHP treatment (600 MPa) on the oxidative stability of lipids and proteins of vacuum-packaged Iberian dry-cured ham and the impact on the sensory characteristics of the product was investigated. In order to assess how different commercial presentations are affected by HHP treatment, three different presentations of vacuum-packaged Iberian dry-cured ham were considered, namely, (i) intact format (IF) corresponding to non-sliced vacuum-packaged dry-cured ham, (ii) conventional-sliced format (CSF) corresponding to dry-cured ham slices placed stretched out in the package and (iii) alternative-sliced format (ASF) corresponding to dry-cured ham slices piled up horizontally. The oxidation of dry-cured ham lipids and proteins was enhanced by HHP-treatment with the presentation being highly influential on these oxidative reactions. Pre-slicing dry-cured ham results in a more susceptible product to oxidative reactions during pressurisation and subsequent refrigerated storage. Possible mechanisms, by which HHP-induced oxidative reactions would affect particular sensory traits in vacuum-packaged Iberian dry-cured ham such as colour, texture and flavour attributes, are discussed. Copyright 2010 Elsevier Ltd. All rights reserved.

Effect of including whole linseed and vitamin E in the diet of young bulls slaughtered at two fat covers on the sensory quality of beef packaged in two different packaging systems.

PubMed

Albertí, Pere; Campo, María M; Beriain, María J; Ripoll, Guillermo; Sañudo, Carlos

2017-02-01

Forty-six Pirenaica young bulls, slaughtered at two levels of fatness (3 and 4 mm), were used to evaluate the effect of the inclusion of 50 g kg -1 linseed alone or with 200 IU vitamin E kg -1 in the concentrate and of the meat packaging system (vacuum or modified atmosphere packaging (MAP)) on the beef sensory quality. The inclusion of linseed or supplementation with vitamin E in the concentrate induced no significant differences in the main meat sensory scores and overall appraisal except under MAP, where small differences due to concentrate ingredients were found in juiciness and metallic flavor intensity. Extending the display time up to 4 or 8 days in high-oxygen MAP had detrimental effects on sensory attributes. Meat from animals with 4 mm fat cover depth were rated more tender and juicy, less fibrous and with a higher intensity of beef flavor and rancid odor than meat from 3 mm fat cover bulls when both samples were vacuum packaged. The inclusion of 50 g kg -1 linseed in the concentrate fed to bulls had no detrimental effect on the beef sensory quality. The vacuum-packaged meat of bulls slaughtered at 4 mm fat cover was rated higher on sensory analysis than that at 3 mm fat cover. © 2016 Society of Chemical Industry. © 2016 Society of Chemical Industry.

Use of antimicrobial biodegradable packaging to control Listeria monocytogenes during storage of cooked ham.

PubMed

Marcos, Begonya; Aymerich, Teresa; Monfort, Josep M; Garriga, Margarita

2007-11-30

The antimicrobial effect against L. monocytogenes of biodegradable films (alginate, zein and polyvinyl alcohol) containing enterocins was investigated. Survival of the pathogen was studied by means of challenge tests performed at 6 degrees C during 8 and 29 days, for air-packed and vacuum-packed sliced cooked ham, respectively. Air packaging was tested with two concentrations of enterocins (200 and 2000 AU/cm2). Control air-packed cooked ham showed an increase of L. monocytogenes from 10(4) to 10(7) CFU/g after 8 days. By contrast, packaging with antimicrobial films effectively slowed down the pathogen's growth, leading to final counts lower than in control lots. Air-packaging with alginate films containing 2000 AU/cm2 of enterocins effectively controlled L. monocytogenes for 8 days. An increase of only 1 log unit was observed in zein and polyvinyl alcohol lots at the same enterocin concentration. Vacuum packaging with films containing enterocins (2000 AU/cm2) also delayed the growth of the pathogen. No increase from inoculated levels was observed during 15 days in antimicrobial alginate films. After 29 days of storage, the lowest counts were obtained in samples packed with zein and alginate films containing enterocins, as well as with zein control films. The most effective treatment for controlling L. monocytogenes during 6 degrees C storage was vacuum-packaging of sliced cooked ham with alginate films containing 2000 AU/cm2 of enterocins. From the results obtained it can concluded that antimicrobial packaging can improve the safety of sliced cooked ham by delaying and reducing the growth of L. monocytogenes.

Cost-effective method of manufacturing a 3D MEMS optical switch

NASA Astrophysics Data System (ADS)

Carr, Emily; Zhang, Ping; Keebaugh, Doug; Chau, Kelvin

2009-02-01

growth of data and video transport networks. All-optical switching eliminates the need for optical-electrical conversion offering the ability to switch optical signals transparently: independent of data rates, formats and wavelength. It also provides network operators much needed automation capabilities to create, monitor and protect optical light paths. To further accelerate the market penetration, it is necessary to identify a path to reduce the manufacturing cost significantly as well as enhance the overall system performance, uniformity and reliability. Currently, most MEMS optical switches are assembled through die level flip-chip bonding with either epoxies or solder bumps. This is due to the alignment accuracy requirements of the switch assembly, defect matching of individual die, and cost of the individual components. In this paper, a wafer level assembly approach is reported based on silicon fusion bonding which aims to reduce the packaging time, defect count and cost through volume production. This approach is successfully demonstrated by the integration of two 6-inch wafers: a mirror array wafer and a "snap-guard" wafer, which provides a mechanical structure on top of the micromirror to prevent electrostatic snap-down. The direct silicon-to-silicon bond eliminates the CTEmismatch and stress issues caused by non-silicon bonding agents. Results from a completed integrated switch assembly will be presented, which demonstrates the reliability and uniformity of some key parameters of this MEMS optical switch.

European consumer response to packaging technologies for improved beef safety.

PubMed

Van Wezemael, Lynn; Ueland, Øydis; Verbeke, Wim

2011-09-01

Beef packaging can influence consumer perceptions of beef. Although consumer perceptions and acceptance are considered to be among the most limiting factors in the application of new technologies, there is a lack of knowledge about the acceptability to consumers of beef packaging systems aimed at improved safety. This paper explores European consumers' acceptance levels of different beef packaging technologies. An online consumer survey was conducted in five European countries (n=2520). Acceptance levels among the sample ranged between 23% for packaging releasing preservative additives up to 73% for vacuum packaging. Factor analysis revealed that familiar packaging technologies were clearly preferred over non-familiar technologies. Four consumer segments were identified: the negative (31% of the sample), cautious (30%), conservative (17%) and enthusiast (22%) consumers, which were profiled based on their attitudes and beef consumption behaviour. Differences between consumer acceptance levels should be taken into account while optimising beef packaging and communicating its benefits. Copyright © 2011 Elsevier Ltd. All rights reserved.

Numerical modeling of carrier gas flow in atomic layer deposition vacuum reactor: A comparative study of lattice Boltzmann models

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pan, Dongqing; Chien Jen, Tien; Li, Tao

2014-01-15

This paper characterizes the carrier gas flow in the atomic layer deposition (ALD) vacuum reactor by introducing Lattice Boltzmann Method (LBM) to the ALD simulation through a comparative study of two LBM models. Numerical models of gas flow are constructed and implemented in two-dimensional geometry based on lattice Bhatnagar–Gross–Krook (LBGK)-D2Q9 model and two-relaxation-time (TRT) model. Both incompressible and compressible scenarios are simulated and the two models are compared in the aspects of flow features, stability, and efficiency. Our simulation outcome reveals that, for our specific ALD vacuum reactor, TRT model generates better steady laminar flow features all over the domainmore » with better stability and reliability than LBGK-D2Q9 model especially when considering the compressible effects of the gas flow. The LBM-TRT is verified indirectly by comparing the numerical result with conventional continuum-based computational fluid dynamics solvers, and it shows very good agreement with these conventional methods. The velocity field of carrier gas flow through ALD vacuum reactor was characterized by LBM-TRT model finally. The flow in ALD is in a laminar steady state with velocity concentrated at the corners and around the wafer. The effects of flow fields on precursor distributions, surface absorptions, and surface reactions are discussed in detail. Steady and evenly distributed velocity field contribute to higher precursor concentration near the wafer and relatively lower particle velocities help to achieve better surface adsorption and deposition. The ALD reactor geometry needs to be considered carefully if a steady and laminar flow field around the wafer and better surface deposition are desired.« less

3D interconnect metrology in CMS/ITRI

NASA Astrophysics Data System (ADS)

Ku, Y. S.; Shyu, D. M.; Hsu, W. T.; Chang, P. Y.; Chen, Y. C.; Pang, H. L.

2011-05-01

Semiconductor device packaging technology is rapidly advancing, in response to the demand for thinner and smaller electronic devices. Three-dimensional chip/wafer stacking that uses through-silicon vias (TSV) is a key technical focus area, and the continuous development of this novel technology has created a need for non-contact characterization. Many of these challenges are novel to the industry due to the relatively large variety of via sizes and density, and new processes such as wafer thinning and stacked wafer bonding. This paper summarizes the developing metrology that has been used during via-middle & via-last TSV process development at EOL/ITRI. While there is a variety of metrology and inspection applications for 3D interconnect processing, the main topics covered here are via CD/depth measurement, thinned wafer inspection and wafer warpage measurement.

Reducing Salt in Raw Pork Sausages Increases Spoilage and Correlates with Reduced Bacterial Diversity

PubMed Central

Fougy, Lysiane; Desmonts, Marie-Hélène; Coeuret, Gwendoline; Fassel, Christine; Hamon, Erwann; Hézard, Bernard; Champomier-Vergès, Marie-Christine

2016-01-01

ABSTRACT Raw sausages are perishable foodstuffs; reducing their salt content raises questions about a possible increased spoilage of these products. In this study, we evaluated the influence of salt reduction (from 2.0% to 1.5% [wt/wt]), in combination with two types of packaging (modified atmosphere [50% mix of CO2-N2] and vacuum packaging), on the onset of spoilage and on the diversity of spoilage-associated bacteria. After 21 days of storage at 8°C, spoilage was easily observed, characterized by noticeable graying of the products and the production of gas and off-odors defined as rancid, sulfurous, or sour. At least one of these types of spoilage occurred in each sample, and the global spoilage intensity was more pronounced in samples stored under modified atmosphere than under vacuum packaging and in samples with the lower salt content. Metagenetic 16S rRNA pyrosequencing revealed that vacuum-packaged samples contained a higher total bacterial richness (n = 69 operational taxonomic units [OTUs]) than samples under the other packaging condition (n = 46 OTUs). The core community was composed of 6 OTUs (Lactobacillus sakei, Lactococcus piscium, Carnobacterium divergens, Carnobacterium maltaromaticum, Serratia proteamaculans, and Brochothrix thermosphacta), whereas 13 OTUs taxonomically assigned to the Enterobacteriaceae, Enterococcaceae, and Leuconostocaceae families comprised a less-abundant subpopulation. This subdominant community was significantly more abundant when 2.0% salt and vacuum packaging were used, and this correlated with a lower degree of spoilage. Our results demonstrate that salt reduction, particularly when it is combined with CO2-enriched packaging, promotes faster spoilage of raw sausages by lowering the overall bacterial diversity (both richness and evenness). IMPORTANCE Our study takes place in the context of raw meat product manufacturing and is linked to a requirement for salt reduction. Health guidelines are calling for a reduction in dietary salt intake. However, salt has been used for a very long time as a hurdle technology, and salt reduction in meat products raises the question of spoilage and waste of food. The study was conceived to assess the role of sodium chloride reduction in meat products, both at the level of spoilage development and at the level of bacterial diversity, using 16S rRNA amplicon sequencing and raw pork sausage as a meat model. PMID:27107120

Reducing Salt in Raw Pork Sausages Increases Spoilage and Correlates with Reduced Bacterial Diversity.

PubMed

Fougy, Lysiane; Desmonts, Marie-Hélène; Coeuret, Gwendoline; Fassel, Christine; Hamon, Erwann; Hézard, Bernard; Champomier-Vergès, Marie-Christine; Chaillou, Stéphane

2016-07-01

Raw sausages are perishable foodstuffs; reducing their salt content raises questions about a possible increased spoilage of these products. In this study, we evaluated the influence of salt reduction (from 2.0% to 1.5% [wt/wt]), in combination with two types of packaging (modified atmosphere [50% mix of CO2-N2] and vacuum packaging), on the onset of spoilage and on the diversity of spoilage-associated bacteria. After 21 days of storage at 8°C, spoilage was easily observed, characterized by noticeable graying of the products and the production of gas and off-odors defined as rancid, sulfurous, or sour. At least one of these types of spoilage occurred in each sample, and the global spoilage intensity was more pronounced in samples stored under modified atmosphere than under vacuum packaging and in samples with the lower salt content. Metagenetic 16S rRNA pyrosequencing revealed that vacuum-packaged samples contained a higher total bacterial richness (n = 69 operational taxonomic units [OTUs]) than samples under the other packaging condition (n = 46 OTUs). The core community was composed of 6 OTUs (Lactobacillus sakei, Lactococcus piscium, Carnobacterium divergens, Carnobacterium maltaromaticum, Serratia proteamaculans, and Brochothrix thermosphacta), whereas 13 OTUs taxonomically assigned to the Enterobacteriaceae, Enterococcaceae, and Leuconostocaceae families comprised a less-abundant subpopulation. This subdominant community was significantly more abundant when 2.0% salt and vacuum packaging were used, and this correlated with a lower degree of spoilage. Our results demonstrate that salt reduction, particularly when it is combined with CO2-enriched packaging, promotes faster spoilage of raw sausages by lowering the overall bacterial diversity (both richness and evenness). Our study takes place in the context of raw meat product manufacturing and is linked to a requirement for salt reduction. Health guidelines are calling for a reduction in dietary salt intake. However, salt has been used for a very long time as a hurdle technology, and salt reduction in meat products raises the question of spoilage and waste of food. The study was conceived to assess the role of sodium chloride reduction in meat products, both at the level of spoilage development and at the level of bacterial diversity, using 16S rRNA amplicon sequencing and raw pork sausage as a meat model. Copyright © 2016, American Society for Microbiology. All Rights Reserved.

PDMS spreading morphological patterns on substrates of different hydrophilicity in air vacuum and water.

PubMed

Zbik, Marek S; Frost, Ray L

2010-04-15

In paper has been to investigate the morphological patterns and kinetics of PDMS spreading on silicon wafer using combination of techniques like ellipsometry, atomic force microscope (AFM), scanning electron microscope (SEM) and optical microscopy. A macroscopic silicone oil drops as well as PDMS water based emulsions were studied after deposition on a flat surface of silicon wafer in air, water and vacuum. Our own measurements using an imaging ellipsometer, which also clearly shows the presence of a precursor film. The diffusion constant of this film, measured with a 60,000 cS PDMS sample spreading on a hydrophilic silicon wafer is D(f)=1.4x10(-11) m(2)/s. Regardless of their size, density and method of deposition, droplets on both types of wafer (hydrophilic and hydrophobic) flatten out over a period of many hours, up to 3 days. During this process neighbouring droplets may coalesce, but there is strong evidence that some of the PDMS from the droplets migrates into a thin, continuous film that covers the surface in between droplets. The thin film appears to be ubiquitous if there has been any deposition of PDMS. However, this statement needs further verification. One question is whether the film forms immediately after forced drying, or whether in some or all cases it only forms by spreading from isolated droplets as they slowly flatten out. 2010 Elsevier Inc. All rights reserved.

Sulfur passivation techniques for III-V wafer bonding

NASA Astrophysics Data System (ADS)

Jackson, Michael James

The use of direct wafer bonding in a multijunction III-V solar cell structure requires the formation of a low resistance bonded interface with minimal thermal treatment. A wafer bonded interface behaves as two independent surfaces in close proximity, hence a major source of resistance is Fermi level pinning common in III-V surfaces. This study demonstrates the use of sulfur passivation in III-V wafer bonding to reduce the energy barrier at the interface. Two different sulfur passivation processes are addressed. A dry sulfur passivation method that utilizes elemental sulfur vapor activated by ultraviolet light in vacuum is compared with aqueous sulfide and native oxide etch treatments. Through the addition of a sulfur desorption step in vacuum, the UV-S treatment achieves bondable surfaces free of particles contamination or surface roughening. X-ray photoelectron spectroscopy measurements of the sulfur treated GaAs surfaces find lower levels of oxide and the appearance of sulfide species. After 4 hrs of air exposure, the UV-S treated GaAs actually showed an increase in the amount of sulfide bonded to the semiconductor, resulting in less oxidation compared to the aqueous sulfide treatment. Large area bonding is achieved for sulfur treated GaAs / GaAs and InP / InP with bulk fracture strength achieved after annealing at 400 °C and 300 °C respectively, without large compressive forces. The electrical conductivity across a sulfur treated 400 °C bonded n-GaAs/n-GaAs interface significantly increased with a short anneal (1-2 minutes) at elevated temperatures (50--600 °C). Interfaces treated with the NH4OH oxide etch, on the other hand, exhibited only mild improvement in accordance with previously published studies in this area. TEM and STEM images revealed similar interfacial microstructure changes with annealing for both sulfur treated and NH4OH interfaces, whereby some areas have direct semiconductor-semiconductor contact without any interfacial layer. Fitting the observed temperature dependence of zero bias conductance using a model for tunneling through a grain boundary reveals that the addition of sulfur at the interface lowered the interfacial energy barrier by 0.2 eV. The interface resistance for these sulfur-treated structures is less than 0.03 O·cm 2 at room temperature. These results emphasize that sulfur passivation techniques reduce interface states that otherwise limit the implementation of wafer bonding for high efficiency solar cells and other devices.

Effectiveness of some recent antimicrobial packaging concepts.

PubMed

Vermeiren, L; Devlieghere, F; Debevere, J

2002-01-01

A new type of active packaging is the combination of food-packaging materials with antimicrobial substances to control microbial surface contamination of foods. For both migrating and non-migrating antimicrobial materials, intensive contact between the food product and packaging material is required and therefore potential food applications include especially vacuum or skin-packaged products, e.g. vacuum-packaged meat, fish, poultry or cheese. Several antimicrobial compounds have been combined with different types of carriers (plastic and rubber articles, paper-based materials, textile fibrils and food-packaging materials). Until now, however, few antimicrobial concepts have found applications as a food-packaging material. Antimicrobial packaging materials cannot legally be used in the EU at the moment. The potential use would require amendments of several different legal texts involving areas such as food additives, food packaging, hygiene, etc. The main objective of this paper is to provide a state of the art about the different types of antimicrobial concepts, their experimental development and commercialization, and to present a case study summarizing the results of investigations on the feasibility of a low-density polyethylene (LDPE)-film containing triclosan to inhibit microbial growth on food surfaces and consequently prolong shelf-life or improve microbial food safety. In contrast with the strong antimicrobial effect in in-vitro simulated vacuum-packaged conditions against the psychrotrophic food pathogen L. monocytogenes, the 1000 mg kg(-1) containing triclosan film did not effectively reduce spoilage bacteria and growth of L. monocytogenes on refrigerated vacuum-packaged chicken breasts stored at 7 degrees C.

Auxiliary propulsion system flight package

NASA Technical Reports Server (NTRS)

Collett, C. R.

1987-01-01

Hughes Aircraft Company developed qualified and integrated flight, a flight test Ion Auxiliary Propulsion System (IAPS), on an Air Force technology satellite. The IAPS Flight Package consists of two identical Thruster Subsystems and a Diagnostic Subsystem. Each thruster subsystem (TSS) is comprised of an 8-cm ion Thruster-Gimbal-Beam Shield Unit (TGBSU); Power Electronics Unit; Digital Controller and Interface Unit (DCIU); and Propellant Tank, Valve and Feed Unit (PTVFU) plus the requisite cables. The Diagnostic Subsystem (DSS) includes four types of sensors for measuring the effect of the ion thrusters on the spacecraft and the surrounding plasma. Flight qualifications of IAPS, prior to installation on the spacecraft, consisted of performance, vibration and thermal-vacuum testing at the unit level, and thermal-vacuum testing at the subsystem level. Mutual compatibility between IAPS and the host spacecraft was demonstrated during a series of performance and environmental tests after the IAPS Flight Package was installed on the spacecraft. After a spacecraft acoustic test, performance of the ion thrusters was reverified by removing the TGBSUs for a thorough performance test at Hughes Research Laboratories (HRL). The TGBSUs were then reinstalled on the spacecraft. The IAPS Flight Package is ready for flight testing when Shuttle flights are resumed.

Postharvest changes in the phenolic profile of watercress induced by post-packaging irradiation and modified atmosphere packaging.

PubMed

Pinela, José; Barros, Lillian; Barreira, João C M; Carvalho, Ana Maria; Oliveira, M Beatriz P P; Santos-Buelga, Celestino; Ferreira, Isabel C F R

2018-07-15

The effects of γ-ray irradiation and modified atmosphere packaging (MAP) on watercress (Nasturtium officinale R. Br.) phenolic compounds were evaluated after 7-day storage at 4 °C. Irradiation doses of 1, 2 and 5 kGy were tested, as well as vacuum-packaging and MAP enriched with 100% N 2 and Ar. A non-irradiated, air-packaged control was included in all experiments. p-Coumaric acid was the most abundant compound in fresh watercress, followed by quercetin-3-O-sophoroside and isorhamnetin-O-hydroxyferuloylhexoside-O-hexoside. Four kaempferol glycoside derivatives were identified for the first time in this species. In general, flavonoids predominated over phenolic acids. Samples stored under vacuum and irradiated at 2 kGy revealed lower phenolic levels. Ar-enriched MAP and control conditions preserved the initial phenolic content. The 5 kGy dose also maintained concentrations of flavonoids and total phenolic compounds, but increased the phenolic acids content. Additionally, flavonoids were found strongly correlated to DPPH scavenging activity and β-carotene bleaching inhibition capacity. Copyright © 2018 Elsevier Ltd. All rights reserved.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jankowski, A.F.; Hayes, J.P.; Kanna, R.L.

The formation of high energy density, storage devices is achievable using composite material systems. Alternate layering of carbon aerogel wafers and Ni foils with rnicroporous separators is a prospective composite for capacitor applications. An inherent problem exists to form a physical bond between Ni and the porous carbon wafer. The bonding process must be limited to temperatures less than 1000{degrees}C, at which point the aerogel begins to degrade. The advantage of a low temperature eutectic in the Ni-Ti alloy system solves this problem. Ti, a carbide former, is readily adherent as a sputter deposited thin film onto the carbon wafer.more » A vacuum bonding process is then used to join the Ni foil and Ti coating through eutectic phase formation. The parameters required for successfld bonding are described along with a structural characterization of the Ni foil-carbon aerogel wafer interface.« less

Wafer-scale micro-optics fabrication

NASA Astrophysics Data System (ADS)

Voelkel, Reinhard

2012-07-01

Micro-optics is an indispensable key enabling technology for many products and applications today. Probably the most prestigious examples are the diffractive light shaping elements used in high-end DUV lithography steppers. Highly-efficient refractive and diffractive micro-optical elements are used for precise beam and pupil shaping. Micro-optics had a major impact on the reduction of aberrations and diffraction effects in projection lithography, allowing a resolution enhancement from 250 nm to 45 nm within the past decade. Micro-optics also plays a decisive role in medical devices (endoscopes, ophthalmology), in all laser-based devices and fiber communication networks, bringing high-speed internet to our homes. Even our modern smart phones contain a variety of micro-optical elements. For example, LED flash light shaping elements, the secondary camera, ambient light and proximity sensors. Wherever light is involved, micro-optics offers the chance to further miniaturize a device, to improve its performance, or to reduce manufacturing and packaging costs. Wafer-scale micro-optics fabrication is based on technology established by the semiconductor industry. Thousands of components are fabricated in parallel on a wafer. This review paper recapitulates major steps and inventions in wafer-scale micro-optics technology. The state-of-the-art of fabrication, testing and packaging technology is summarized.

Design and performance test of a MEMS vibratory gyroscope with a novel AGC force rebalance control

NASA Astrophysics Data System (ADS)

Sung, Woon-Tahk; Sung, Sangkyung; Lee, Jang Gyu; Kang, Taesam

2007-10-01

In this paper, the development and performance test results of a laterally oscillating MEMS gyroscope using a novel force rebalance control strategy are presented. The micromachined structure and electrodes are fabricated using the deep reactive ion etching (DRIE) and anodic wafer bonding process. The high quality factor required for the resonance-based sensor is achieved using a vacuum-sealed device package. A systematic design approach of the force rebalance control is applied via a modified automatic gain control (AGC) method. The rebalance control design takes advantages of a novel AGC loop modification, which allows the approximation of the system's dynamics into a simple linear form. Using the proposed modification of AGC and the rebalance strategy that maintains a biased oscillation, a number of performance improvements including bandwidth extension and widened operating range were observed to be achieved. Finally, the experimental results of the gyroscope's practical application verify the feasibility and performance of the developed sensor.

Effect of modified atmosphere and vacuum packaging on TVB-N production of rainbow trout (Oncorhynchus mykiss) and carp (Cyprinus carpio) cuts

NASA Astrophysics Data System (ADS)

Babić Milijašević, J.; Milijašević, M.; Đinović-Stojanović, J.; Vranić, D.

2017-09-01

The aim of our research was to examine the influence of packaging in modified atmosphere and vacuum on the total volatile basic nitrogen (TVB-N) content in muscle of rainbow trout (Oncorhynchus mykiss) and common carp (Cyprinus carpio), as well as to determine the most suitable gas mixtures for packing of these freshwater species. Three sample groups of trout and carp cuts were investigated. The two groups were packaged in modified atmosphere with different gas ratios: 90%CO2+10%N2 (MAP 1) and 60%CO2+40%N2 (MAP 2), whereas the third group of fish cuts were vacuum packaged. During trials, the trout and carp cuts were stored in refrigerator at 3°C±0.5°C. Determination of TVB-N was performed on 1, 4, 7, 9, 12 and 14 days of storage. The obtained results indicate that the investigated mixtures of gases and vacuum had a significant influence on the values of TVB-N in trout and carp cuts. The lowest increase in TVB-N was established in trout and carp cuts packaged in MAP 1, whereas the highest increase was established in vacuum packaged cuts. Based on the obtained results, it can be concluded that the gas mixture consisting of 90% CO2 and 10% N2 was the most suitable for packaging of fresh trout and carp cuts in terms of TVB-N value.

Effect of packaging and storage temperature on the survival of Listeria monocytogenes inoculated postprocessing on sliced salami.

PubMed

Gounadaki, Antonia S; Skandamis, Panagiotis N; Drosinos, Eleftherios H; Nychas, George-John E

2007-10-01

The survival of postprocess Listeria monocytogenes contamination on sliced salami, stored under the temperatures associated with retail and domestic storage, was investigated. Sliced salami was inoculated with low and high concentrations of L. monocytogenes before being packaged under vacuum or air. Survival of L. monocytogenes was determined after storage of sausages for 45 or 90 days for low or high sample inocula, respectively, at 5, 15, and 25 degrees C. All survival curves of L. monocytogenes were characterized by an initial rapid inactivation within the first days of storage, followed by a second, slower inactivation phase or "tailing." Greater reduction of L. monocytogenes was observed at the high storage temperature (25 degrees C), followed by ambient (15 degrees C) and chill (5 degrees C) storage conditions. Moreover, vacuum packaging resulted in a slower destruction of L. monocytogenes than air packaging, and this effect increased as storage temperature decreased. Although L. monocytogenes numbers decreased to undetectable levels by the end of the storage period, the time (in days) needed for this reduction and for the total elimination of the pathogen decreased with high temperature, aerobic storage, and high inoculum. Results of this study clearly indicated that the kinetics of L. monocytogenes were highly dependent on the interaction of factors such as storage temperature, packaging conditions, and initial level of contamination (inoculum). These results may contribute to the exposure assessment of quantitative microbial risk assessment and to the establishment of storage-packaging recommendations of fermented sausages.

The effect of vacuum packaging on histamine changes of milkfish sticks at various storage temperatures.

PubMed

Kung, Hsien-Feng; Lee, Yi-Chen; Lin, Chiang-Wei; Huang, Yu-Ru; Cheng, Chao-An; Lin, Chia-Min; Tsai, Yung-Hsiang

2017-10-01

The effects of polyethylene packaging (PEP) (in air) and vacuum packaging (VP) on the histamine related quality of milkfish sticks stored at different temperatures (-20°C, 4°C, 15°C, and 25°C) were studied. The results showed that the aerobic plate count (APC), pH, total volatile basic nitrogen (TVBN), and histamine contents increased as storage time increased when the PEP and VP samples were stored at 25°C. At below 15°C, the APC, TVBN, pH, and histamine levels in PEP and VP samples were retarded, but the VP samples had considerably lower levels of APC, TVBN, and histamine than PEP samples. Once the frozen fish samples stored at -20°C for 2 months were thawed and stored at 25°C, VP retarded the increase of histamine in milkfish sticks as compared to PEP. In summary, this result suggested the milkfish sticks packed with VP and stored below 4°C could prevent deterioration of product quality and extend shelf-life. Copyright © 2017. Published by Elsevier B.V.

Transfer orbit stage mechanisms thermal vacuum test

NASA Technical Reports Server (NTRS)

Oleary, Scott T.

1990-01-01

A systems level mechanisms test was conducted on the Orbital Sciences Corp.'s Transfer Orbit Stage (TOS). The TOS is a unique partially reusable transfer vehicle which will boost a satellite into its operational orbit from the Space Shuttle's cargo bay. The mechanical cradle and tilt assemblies will return to earth with the Space Shuttle while the Solid Rocket Motor (SRM) and avionics package are expended. A mechanisms test was performed on the forward cradle and aft tilting assemblies of the TOS under thermal vacuum conditions. Actuating these assemblies under a 1 g environment and thermal vacuum conditions proved to be a complex task. Pneumatic test fixturing was used to lift the forward cradle, and tilt the SRM, and avionics package. Clinometers, linear voltage displacement transducers, and load cells were used in the thermal vacuum chamber to measure the performance and characteristics of the TOS mechanism assembly. Incorporation of the instrumentation and pneumatic system into the test setup was not routine since pneumatic actuation of flight hardware had not been previously performed in the facility. The methods used are presented along with the problems experienced during the design, setup and test phases.

Microwave Induced Direct Bonding of Single Crystal Silicon Wafers

NASA Technical Reports Server (NTRS)

Budraa, N. K.; Jackson, H. W.; Barmatz, M.

1999-01-01

We have heated polished doped single-crystal silicon wafers in a single mode microwave cavity to temperatures where surface to surface bonding occurred. The absorption of microwaves and heating of the wafers is attributed to the inclusion of n-type or p-type impurities into these substrates. A cylindrical cavity TM (sub 010) standing wave mode was used to irradiate samples of various geometry's at positions of high magnetic field. This process was conducted in vacuum to exclude plasma effects. This initial study suggests that the inclusion of impurities in single crystal silicon significantly improved its microwave absorption (loss factor) to a point where heating silicon wafers directly can be accomplished in minimal time. Bonding of these substrates, however, occurs only at points of intimate surface to surface contact. The inclusion of a thin metallic layer on the surfaces enhances the bonding process.

Low surface energy polymeric release coating for improved contact print lithography

NASA Astrophysics Data System (ADS)

Mancini, David P.; Resnick, Douglas J.; Gehoski, Kathleen A.; Popovich, Laura L.; Chang, Daniel

2002-03-01

Contact printing has been used for decades in many various lithography applications in the microelectronic industry. While vacuum contact printing processes offer sub-micron resolution and high throughput, they often suffer from some important drawbacks. One of the most common problems is degradation in both resolution and defect density which occurs when the same mask si used for multiple exposures without frequent mask cleans. This is largely due to the relatively high surface energy of both quartz and chrome and the tendency of most photoresists to adhere to these surfaces. As a result, when a mask and wafer are pressed into intimate contact, resist will tend to stick to the mask creating a defect on the wafer, effectively propagating defects to subsequent wafers. In this study, DuPont Teflon AF 1601S is used as a photomask coating and evaluated for its ability to act as a release agent and reduce defects while maintaining resolution for multiple exposures. Teflon AF is an amorphous, transparent, low surface energy, polymeric material that can be spin coated into a thin conformal film. Tests have shown that when using an uncoated mask in vacuum contact, resolution of 0.75 micrometers dense lines is severely degraded after less than 10 consecutive exposures. However, when the mask is coated, 0.75 micrometers dense lines were successfully resolved using vacuum contact for over 200 exposures without cleaning. In addition, it has been demonstrated that Teflon AF coatings impart to a mask a self-cleaning capability, since particles tend to stick to the photoresist rather than the mask. A coated mask, which was purposefully contaminated with particulates, resolved 0.75 micrometers dense lines on all but the first wafer of a series of 25 consecutive exposures. The patented mask releases layer process has successfully been demonstrated with a positive novolak resist. Additional data which describes the system chemistry, dilution and coating process, and film morphology are also presented.

Innovative on-chip packaging applied to uncooled IRFPA

NASA Astrophysics Data System (ADS)

Dumont, Geoffroy; Arnaud, Agnès; Imperinetti, Pierre; Mottin, Eric; Simoens, François; Vialle, Claire; Rabaud, Wilfried; Grand, Gilles; Baclet, Nathalie

2008-03-01

The Laboratoire Infrarouge (LIR) of the Laboratoire d'Electronique et de Technologie de l'Information (LETI) has been involved in the development of microbolometers for over fifteen years. Two generations of technology have been transferred to ULIS and LETI is still working to improve performances of low cost detectors. Simultaneously, packaging still represents a significant part of detectors price. Reducing production costs would contribute to keep on extending applications of uncooled IRFPA to high volume markets like automotive. Therefore LETI develops an onchip packaging technology dedicated to microbolometers. The efficiency of a micropackaging technology for microbolometers relies on two major technical specifications. First, it must include an optical window with a high transmittance for the IR band, so as to maximize the detector absorption. Secondly, in order to preserve the thermal insulation of the detector, the micropackaging must be hermetically closed to maintain a vacuum level lower than 10 -3mbar. This paper presents an original microcap structure that enables the use of IR window materials as sealing layers to maintain the expected vacuum level. The modelling and integration of an IR window suitable for this structure is also presented. This zero level packaging technology is performed in a standard collective way, in continuation of bolometers' technology. The CEA-LETI, MINATEC presents status of these developments concerning this innovating technology including optical simulations results and SEM views of technical realizations.

MT3825BA: a 384×288-25µm ROIC for uncooled microbolometer FPAs

NASA Astrophysics Data System (ADS)

Eminoglu, Selim; Gulden, M. Ali; Bayhan, Nusret; Incedere, O. Samet; Soyer, S. Tuncer; Ustundag, Cem M. B.; Isikhan, Murat; Kocak, Serhat; Turan, Ozge; Yalcin, Cem; Akin, Tayfun

2014-06-01

This paper reports the development of a new microbolometer Readout Integrated Circuit (ROIC) called MT3825BA. It has a format of 384 × 288 and a pixel pitch of 25μm. MT3825BA is Mikro-Tasarim's second microbolometer ROIC product, which is developed specifically for resistive surface micro-machined microbolometer detector arrays using high-TCR pixel materials, such as VOx and a-Si. MT3825BA has a system-on-chip architecture, where all the timing, biasing, and pixel non-uniformity correction (NUC) operations in the ROIC are applied using on-chip circuitry simplifying the use and system integration of this ROIC. The ROIC is designed to support pixel resistance values ranging from 30 KΩ to 100 KΩ. MT3825BA is operated using conventional row based readout method, where pixels in the array are read out in a row-by-row basis, where the applied bias for each pixel in a given row is updated at the beginning of each line period according to the applied line based NUC data. The NUC data is applied continuously in a row-by-row basis using the serial programming interface, which is also used to program user configurable features of the ROIC, such as readout gain, integration time, and number of analog video outputs. MT3825BA has a total of 4 analog video outputs and 2 analog reference outputs, placed at the top and bottom of the ROIC, which can be programmed to operate in the 1, 2, and 4-output modes, supporting frames rates well above 60 fps at a 3 MHz pixel output rate. The pixels in the array are read out with respect to reference pixels implemented above and below actual array pixels. The bias voltage of the pixels can be programmed over a 1.0 V range to compensate for the changes in the detector resistance values due to the variations coming from the manufacturing process or changes in the operating temperature. The ROIC has an on-chip integrated temperature sensor with a sensitivity of better than 5 mV / K, and the output of the temperature sensor can be read out the output as part of the analog video stream. MT3825BA can be used to build a microbolometer FPAs with an NETD value below 100 mK using a microbolometer detector array fabrication technology with a detector resistance value up to 100 KΩ, a high TCR value (< 2 % / K), and a sufficiently low pixel thermal conductance (Gth ≤ 20 nW / K). MT3825BA measures 13.0 mm × 13.5 mm and is fabricated on 200 mm CMOS wafers. The microbolometer ROIC wafers are engineered to have flat surface finish to simplify the wafer level detector fabrication and wafer level vacuum packaging (WLVP). The ROIC runs on 3.3 V analog and 1.8 V digital supplies, and dissipates less than 85 mW in the 2-output mode at 30 fps. Mikro-Tasarim provides tested ROIC wafers and offers compact test electronics and software for its ROIC customers to shorten their FPA and camera development cycles.

Silicon Alignment Pins: An Easy Way to Realize a Wafer-to-Wafer Alignment

NASA Technical Reports Server (NTRS)

Jung-Kubiak, Cecile; Reck, Theodore J.; Lin, Robert H.; Peralta, Alejandro; Gill, John J.; Lee, Choonsup; Siles, Jose; Toda, Risaku; Chattopadhyay, Goutam; Cooper, Ken B.;

Hollow Microtube Resonators via Silicon Self-Assembly toward Subattogram Mass Sensing Applications.

PubMed

Kim, Joohyun; Song, Jungki; Kim, Kwangseok; Kim, Seokbeom; Song, Jihwan; Kim, Namsu; Khan, M Faheem; Zhang, Linan; Sader, John E; Park, Keunhan; Kim, Dongchoul; Thundat, Thomas; Lee, Jungchul

2016-03-09

Fluidic resonators with integrated microchannels (hollow resonators) are attractive for mass, density, and volume measurements of single micro/nanoparticles and cells, yet their widespread use is limited by the complexity of their fabrication. Here we report a simple and cost-effective approach for fabricating hollow microtube resonators. A prestructured silicon wafer is annealed at high temperature under a controlled atmosphere to form self-assembled buried cavities. The interiors of these cavities are oxidized to produce thin oxide tubes, following which the surrounding silicon material is selectively etched away to suspend the oxide tubes. This simple three-step process easily produces hollow microtube resonators. We report another innovation in the capping glass wafer where we integrate fluidic access channels and getter materials along with residual gas suction channels. Combined together, only five photolithographic steps and one bonding step are required to fabricate vacuum-packaged hollow microtube resonators that exhibit quality factors as high as ∼ 13,000. We take one step further to explore additionally attractive features including the ability to tune the device responsivity, changing the resonator material, and scaling down the resonator size. The resonator wall thickness of ∼ 120 nm and the channel hydraulic diameter of ∼ 60 nm are demonstrated solely by conventional microfabrication approaches. The unique characteristics of this new fabrication process facilitate the widespread use of hollow microtube resonators, their translation between diverse research fields, and the production of commercially viable devices.

Effect of Various Packaging Methods on Small-Scale Hanwoo (Korean Native Cattle) during Refrigerated Storage

PubMed Central

Yu, Hwan Hee; Song, Myung Wook; Kim, Tae-Kyung; Choi, Yun-Sang; Cho, Gyu Yong; Lee, Na-Kyoung; Paik, Hyun-Dong

2018-01-01

Abstract The objective of this study was to investigate comparison of physicochemical, microbiological, and sensory characteristics of Hanwoo eye of round by various packaging methods [wrapped packaging (WP), modified atmosphere packaging (MAP), vacuum packaging (VP) with three different vacuum films, and vacuum skin packaging (VSP)] at a small scale. Packaged Hanwoo beef samples were stored in refrigerated conditions (4±1°C) for 28 days. Packaged beef was sampled on days 0, 7, 14, 21, and 28. Physicochemical [pH, surface color, thiobarbituric acid reactive substances (TBARS), and volatile basic nitrogen (VBN) values], microbiological, and sensory analysis of packaged beef samples were performed. VP and VSP samples showed low TBARS and VBN values, and pH and surface color did not change substantially during the 28-day period. For VSP, total viable bacteria, psychrotrophic bacteria, lactic acid bacteria, and coliform counts were lower than those for other packaging systems. Salmonella spp. and Escherichia coli O157:H7 were not detected in any packaged beef samples. A sensory analysis showed that the scores for appearance, flavor, color, and overall acceptability did not change significantly until day 7. In total, VSP was effective with respect to significantly higher a* values, physicochemical stability, and microbial safety in Hanwoo packaging (p<0.05). PMID:29805283

The effects of atmospheric pressure cold plasma treatment on microbiological, physical-chemical and sensory characteristics of vacuum packaged beef loin.

PubMed

Bauer, A; Ni, Y; Bauer, S; Paulsen, P; Modic, M; Walsh, J L; Smulders, F J M

2017-06-01

Effects on vacuum packaged and non-packaged beef longissimus samples exposed to atmospheric cold plasma (ACP) generated at different powers were studied over a 10day period of vacuum-, and a subsequent 3day period of aerobic storage. Exposure of non-covered beef samples under high power ACP conditions resulted in increased a*, b*, Chroma and Hue values, but ACP treatment of packaged loins did not impact colour (L*, a*, b*, Chroma, Hue), lipid peroxidation, sarcoplasmic protein denaturation, nitrate/nitrite uptake, or myoglobin isoform distribution. Colour values measured after 3days of aerobic storage following unpackaging (i.e. 20days post-mortem) were similar and all compliant with consumer acceptability standards. Exposure to ACP of the polyamide-polyethylene packaging film inoculated with Staphylococcus aureus, Listeria monocytogenes and two Escherichia coli strains resulted in >2 log reduction without affecting the integrity of the packaging matrix. Results indicate that ACP can reduce microbial numbers on surfaces of beef packages without affecting characteristics of the packaged beef. Copyright © 2017 Elsevier Ltd. All rights reserved.

Study of temperature distributions in wafer exposure process

NASA Astrophysics Data System (ADS)

Lin, Zone-Ching; Wu, Wen-Jang

During the exposure process of photolithography, wafer absorbs the exposure energy, which results in rising temperature and the phenomenon of thermal expansion. This phenomenon was often neglected due to its limited effect in the previous generation of process. However, in the new generation of process, it may very likely become a factor to be considered. In this paper, the finite element model for analyzing the transient behavior of the distribution of wafer temperature during exposure was established under the assumption that the wafer was clamped by a vacuum chuck without warpage. The model is capable of simulating the distribution of the wafer temperature under different exposure conditions. The flowchart of analysis begins with the simulation of transient behavior in a single exposure region to the variation of exposure energy, interval of exposure locations and interval of exposure time under continuous exposure to investigate the distribution of wafer temperature. The simulation results indicate that widening the interval of exposure locations has a greater impact in improving the distribution of wafer temperature than extending the interval of exposure time between neighboring image fields. Besides, as long as the distance between the field center locations of two neighboring exposure regions exceeds the straight distance equals to three image fields wide, the interacting thermal effect during wafer exposure can be ignored. The analysis flow proposed in this paper can serve as a supporting reference tool for engineers in planning exposure paths.

Assessment of Performance of the Industrial Process of Bulk Vacuum Packaging of Raw Meat with Nondestructive Optical Oxygen Sensing Systems.

PubMed

Kelly, Caroline A; Cruz-Romero, Malco; Kerry, Joseph P; Papkovsky, Dmitri P

2018-05-02

The commercially-available optical oxygen-sensing system Optech-O₂ Platinum was applied to nondestructively assess the in situ performance of bulk, vacuum-packaged raw beef in three ~300 kg containers. Twenty sensors were attached to the inner surface of the standard bin-contained laminate bag (10 on the front and back sides), such that after filling with meat and sealing under vacuum, the sensors were accessible for optical interrogation with the external reader device. After filling and sealing each bag, the sensors were measured repetitively and nondestructively over a 15-day storage period at 1 °C, thus tracking residual oxygen distribution in the bag and changes during storage. The sensors revealed a number of unidentified meat quality and processing issues, and helped to improve the packaging process by pouring flakes of dry ice into the bag. Sensor utility in mapping the distribution of residual O₂ in sealed bulk containers and optimising and improving the packaging process, including handling and storage of bulk vacuum-packaged meat bins, was evident.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2005-01-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Standard semiconductor packaging for high-reliability low-cost MEMS applications

NASA Astrophysics Data System (ADS)

Harney, Kieran P.

2004-12-01

Microelectronic packaging technology has evolved over the years in response to the needs of IC technology. The fundamental purpose of the package is to provide protection for the silicon chip and to provide electrical connection to the circuit board. Major change has been witnessed in packaging and today wafer level packaging technology has further revolutionized the industry. MEMS (Micro Electro Mechanical Systems) technology has created new challenges for packaging that do not exist in standard ICs. However, the fundamental objective of MEMS packaging is the same as traditional ICs, the low cost and reliable presentation of the MEMS chip to the next level interconnect. Inertial MEMS is one of the best examples of the successful commercialization of MEMS technology. The adoption of MEMS accelerometers for automotive airbag applications has created a high volume market that demands the highest reliability at low cost. The suppliers to these markets have responded by exploiting standard semiconductor packaging infrastructures. However, there are special packaging needs for MEMS that cannot be ignored. New applications for inertial MEMS devices are emerging in the consumer space that adds the imperative of small size to the need for reliability and low cost. These trends are not unique to MEMS accelerometers. For any MEMS technology to be successful the packaging must provide the basic reliability and interconnection functions, adding the least possible cost to the product. This paper will discuss the evolution of MEMS packaging in the accelerometer industry and identify the main issues that needed to be addressed to enable the successful commercialization of the technology in the automotive and consumer markets.

Safety analysis report for packaging (onsite) multicanister overpack cask

DOE Office of Scientific and Technical Information (OSTI.GOV)

Edwards, W.S.

1997-07-14

This safety analysis report for packaging (SARP) documents the safety of shipments of irradiated fuel elements in the MUlticanister Overpack (MCO) and MCO Cask for a highway route controlled quantity, Type B fissile package. This SARP evaluates the package during transfers of (1) water-filled MCOs from the K Basins to the Cold Vacuum Drying Facility (CVDF) and (2) sealed and cold vacuum dried MCOs from the CVDF in the 100 K Area to the Canister Storage Building in the 200 East Area.

Extreme-UV lithography vacuum chamber zone seal

DOEpatents

Haney, Steven J.; Herron, Donald Joe; Klebanoff, Leonard E.; Replogle, William C.

2001-01-01

Control of particle contamination on the reticle and carbon contamination of optical surfaces in photolithography systems can be achieved by the establishment of multiple pressure zones in the photolithography systems. The different zones will enclose the reticle, projection optics, wafer, and other components of system. The system includes a vacuum apparatus that includes: a housing defining a vacuum chamber; one or more metrology trays situated within the vacuum chamber each of which is supported by at least one support member, wherein the tray separates the vacuum chamber into a various compartments that are maintained at different pressures; and conductance seal devices for adjoining the perimeter of each tray to an inner surface of the housing wherein the tray is decoupled from vibrations emanating from the inner surface of the housing.

Extreme-UV lithography vacuum chamber zone seal

DOEpatents

Haney, Steven J.; Herron, Donald Joe; Klebanoff, Leonard E.; Replogle, William C.

2003-04-08

Control of particle contamination on the reticle and carbon contamination of optical surfaces in photolithography systems can be achieved by the establishment of multiple pressure zones in the photolithography systems. The different zones will enclose the reticle, projection optics, wafer, and other components of system. The system includes a vacuum apparatus that includes: a housing defining a vacuum chamber; one or more metrology trays situated within the vacuum chamber each of which is supported by at least one support member, wherein the tray separates the vacuum chamber into a various compartments that are maintained at different pressures; and conductance seal devices for adjoining the perimeter of each tray to an inner surface of the housing wherein the tray is decoupled from vibrations emanating from the inner surface of the housing.

Extreme-UV lithography vacuum chamber zone seal

DOEpatents

Haney, Steven J.; Herron, Donald Joe; Klebanoff, Leonard E.; Replogle, William C.

2003-04-15

Control of particle contamination on the reticle and carbon contamination of optical surfaces in photolithography systems can be achieved by the establishment of multiple pressure zones in the photolithography systems. The different zones will enclose the reticle, projection optics, wafer, and other components of system. The system includes a vacuum apparatus that includes: a housing defining a vacuum chamber; one or more metrology trays situated within the vacuum chamber each of which is supported by at least one support member, wherein the tray separates the vacuum chamber into a various compartments that are maintained at different pressures; and conductance seal devices for adjoining the perimeter of each tray to an inner surface of the housing wherein the tray is decoupled from vibrations emanating from the inner surface of the housing.

An assessment of the hardness of miniature vacuum tubes to high-voltage transients

DOE Office of Scientific and Technical Information (OSTI.GOV)

Orvis, W.J.

1990-03-01

Miniature vacuum tubes are vacuum switching and control devices fabricated on a silicon wafer, using the same technology as is used to make integrated circuits. They operate in much the same manner as conventional vacuum tubes, but with two important differences: they are micron sized devices, and they employ field emission instead of thermionic emission as the electron source. As these devices have a vacuum as their active region, they will be extremely hard to nuclear radiation and relatively insensitive to temperature effects, they are also expected to be extremely fast devices. We have estimated here that their hardness tomore » high-voltage transients will be at least as good as existing semiconductor devices and possibly better. 5 figs.« less

Alternative Packaging for Back-Illuminated Imagers

NASA Technical Reports Server (NTRS)

Pain, Bedabrata

2009-01-01

An alternative scheme has been conceived for packaging of silicon-based back-illuminated, back-side-thinned complementary metal oxide/semiconductor (CMOS) and charge-coupled-device image-detector integrated circuits, including an associated fabrication process. This scheme and process are complementary to those described in "Making a Back-Illuminated Imager With Back-Side Connections" (NPO-42839), NASA Tech Briefs, Vol. 32, No. 7 (July 2008), page 38. To avoid misunderstanding, it should be noted that in the terminology of imaging integrated circuits, "front side" or "back side" does not necessarily refer to the side that, during operation, faces toward or away from a source of light or other object to be imaged. Instead, "front side" signifies that side of a semiconductor substrate upon which the pixel pattern and the associated semiconductor devices and metal conductor lines are initially formed during fabrication, and "back side" signifies the opposite side. If the imager is of the type called "back-illuminated," then the back side is the one that faces an object to be imaged. Initially, a back-illuminated, back-side-thinned image-detector is fabricated with its back side bonded to a silicon handle wafer. At a subsequent stage of fabrication, the front side is bonded to a glass wafer (for mechanical support) and the silicon handle wafer is etched away to expose the back side. The frontside integrated circuitry includes metal input/output contact pads, which are rendered inaccessible by the bonding of the front side to the glass wafer. Hence, one of the main problems is to make the input/output contact pads accessible from the back side, which is ultimately to be the side accessible to the external world. The present combination of an alternative packaging scheme and associated fabrication process constitute a solution of the problem.

11.72-sq cm Active-Area Wafer Interconnected PiN Diode Pulsed at 64 kA Dissipates 382 J and Exhibits an Action of 1.7 MA(sup 2)-s

DTIC Science & Technology

2012-01-30

calculated action exceeded 1.7 MA2 -s. Preliminary efforts on high voltage diode interconnection have produced quarter wafer interconnected PiN...was packaged in a “hockey-puck” configuration and pulsed to 64 kA, dissipating 382 J with a calculated action exceeding 1.7 MA2 -s. II. FULL...epitaxial layers are utilized. 11.72-cm2 Active-area Wafer Interconnected PiN Diode pulsed at 64 kA dissipates 382 J and exhibits an action of 1.7 MA2 -s

[Evaluation of the quality of poultry meat and its processing for vacuum packaging].

PubMed

Swiderski, F; Russel, S; Waszkiewicz-Robak, B; Cholewińska, E

1997-01-01

The aim of study was to evaluate the quality of poultry meat, roasted and smoked chicken and poultry pie packing under low and high vacuum. All investigated products were stored at +4 degrees C and evaluated by microbiological analysis. It was showed that packing under low and high vacuum inhibited development of aerobic microorganisms, proteolytic bacteria, yeasts and moulds. Vacuum-packaged storage of poultry meat and its products stimulated activity of anaerobic, nonsporeforming bacteria. The fast spoilage of fresh poultry meat was observed both under vacuum and conventional storage. The microbiology quality of poultry products depended on technology of production and microbiological quality of raw material.

Emission factors of air toxics from semiconductor manufacturing in Korea.

PubMed

Eom, Yun-Sung; Hong, Ji-Hyung; Lee, Suk-Jo; Lee, Eun-Jung; Cha, Jun-Seok; Lee, Dae-Gyun; Bang, Sun-Ae

2006-11-01

The development of local, accurate emission factors is very important for the estimation of reliable national emissions and air quality management. For that, this study is performed for pollutants released to the atmosphere with source-specific emission tests from the semiconductor manufacturing industry. The semiconductor manufacturing industry is one of the major sources of air toxics or hazardous air pollutants (HAPs); thus, understanding the emission characteristics of the emission source is a very important factor in the development of a control strategy. However, in Korea, there is a general lack of information available on air emissions from the semiconductor industry. The major emission sources of air toxics examined from the semiconductor manufacturing industry were wet chemical stations, coating applications, gaseous operations, photolithography, and miscellaneous devices in the wafer fabrication and semiconductor packaging processes. In this study, analyses of emission characteristics, and the estimations of emission data and factors for air toxics, such as acids, bases, heavy metals, and volatile organic compounds from the semiconductor manufacturing process have been performed. The concentration of hydrogen chloride from the packaging process was the highest among all of the processes. In addition, the emission factor of total volatile organic compounds (TVOCs) for the packaging process was higher than that of the wafer fabrication process. Emission factors estimated in this study were compared with those of Taiwan for evaluation, and they were found to be of similar level in the case of TVOCs and fluorine compounds.

Thin glass based packaging and photonic single-mode waveguide integration by ion-exchange technology on board and module level

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Lang, Günter; Schröder, Henning

2011-01-01

The proposed novel packaging approach merges micro-system packaging and glass integrated optics. It provides 3D optical single-mode intra system links to bridge the gap between novel photonic integrated circuits and the glass fibers for inter system interconnects. We introduce our hybrid 3D photonic packaging approach based on thin glass substrates with planar integrated optical single-mode waveguides for fiber-to-chip and chip-to-chip links. Optical mirrors and lenses provide optical mode matching for photonic IC assemblies and optical fiber interconnects. Thin glass is commercially available in panel and wafer formats and characterizes excellent optical and high-frequency properties as reviewed in the paper. That makes it perfect for micro-system packaging. The adopted planar waveguide process based on ion-exchange technology is capable for high-volume manufacturing. This ion-exchange process and the optical propagation are described in detail for thin glass substrates. An extensive characterization of all basic circuit elements like straight and curved waveguides, couplers and crosses proves the low attenuation of the optical circuit elements.

Ion projection lithography: November 2000 status and sub-70-nm prospects

NASA Astrophysics Data System (ADS)

Kaesmaier, Rainer; Wolter, Andreas; Loeschner, Hans; Schunck, Stefan

2000-10-01

Among all next generation lithography (NGL) options Ion Projection Lithography (IPL) offers the smallest (particle) wavelength of 5x10- 5nm (l00keV Helium ions). Thus, 4x reduction ion-optics has diffraction limits <3nm even when using a numerical aperture as low as NAequals10-5. As part of the European MEDEA IPL project headed by Infineon Technologies wide field ion-optics have been designed by IMS- Vienna with predicted resolution of 50nm within a 12.5mm exposure field. The ion-optics part of the PDT tool (PDT-IOS) has been realized and assembled. In parallel to the PDT-IOS effort, at Leica Jena a test bench for a vertical vacuum 300mm-wafer stage has been realized. Operation of magnetic bearing supported stage movement has already been demonstrated. As ASML vacuum compatible optical wafer alignment system, with 3nm(3(sigma) ) precision demonstrated in air, has been integrated to this wafer test bench system recently. Parallel to the IPL tool development, Infineon Technologies Mask House and the Institute for Microelectronics Stuttgart are intensively working on the development of IPL stencil masks with success in producing 150mm and 200mm stencil masks as reported elsewhere. This paper is focused on information about the status of the PDT-IOS tool.

Combined effect of cooking (grilling and roasting) and chilling storage (with and without air) on lipid and cholesterol oxidation in chicken breast.

PubMed

Conchillo, Ana; Ansorena, Diana; Astiasarán, Iciar

2003-05-01

The oxidation of the lipid fraction and cholesterol in raw and cooked chicken breast samples stored for 0 and 6 days at 4 degrees C under aerobic conditions and in vacuum packaging was studied. The multivariate statistical analysis showed significant effects of both culinary process and storage conditions on the lipid and cholesterol oxidation process, with a significant interaction between the two variables. Aerobic storage increased thiobarbituric acid reactive substances (TBA) from 0.04 to 0.06 ppm for raw samples, from 0.21 to 1.20 ppm for grilled samples, and from 0.24 to 1.62 ppm for roasted samples. During vacuum storage, only roasted samples showed significant increases in TBA. Levels of total cholesterol oxidation products (COP) remained low (2.88 to 4.35 microg/g of lipid) for all raw samples. Cooking increased COP levels to 12.85 and 11.54 microg/ g of lipid for grilled and roasted samples, respectively. Total COP and all individual COP except for cholestanetriol were significantly correlated with TBA and the peroxide index. However, the most extensive effect was attributable to the aerobic storage of cooked samples, which led to COP levels of 92.35 and 88.60 microg/g of lipid in grilled and roasted samples, respectively. Vacuum packaging did not increase COP levels for cooked samples.

Sensors and Micromachined Devices for the Automotive and New Markets: The Delphi Delco Electronics MEMS Story.

NASA Astrophysics Data System (ADS)

Logsdon, James

2002-03-01

This presentation will provide a brief history of the development of MEMS products and technology, beginning with the manifold absolute pressure sensor in the late seventies through the current variety of Delphi Delco Electronics sensors available today. The technology development of micromachining from uncompensated P plus etch stops to deep reactive ion etching and the technology development of wafer level packaging from electrostatic bonding to glass frit sealing and silicon to silicon direct bonding will be reviewed.

Scaling of Fiber Laser Systems Based on Novel Components and High Power Capable Packaging and Joining Technologies

DTIC Science & Technology

2010-09-01

l ri Laser Splicing / Welding r li i / l i Contact Bonding t t i Wafer Level Bonding Mineralic, Fusion . Anodic, Eutectic, Glass-frit, liquid...28-29 September 2010 SET-171 Mid-IR Fiber Laser Workshop partly sponsored by Tapering and splicing device as well as process control developed...Components Laser based splicing and tapering Multimode fiber (ø720µm) with spliced end cap (ø1500µm) © Fraunhofer IOF 28-29 September 2010 SET-171 Mid-IR

High voltage photo-switch package module having encapsulation with profiled metallized concavities

DOEpatents

Sullivan, James S; Sanders, David M; Hawkins, Steven A; Sampayan, Stephen A

2015-05-05

A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces metalized with first metallic layers formed thereon, and encapsulated with a dielectric encapsulation material such as for example epoxy. The first metallic layers are exposed through the encapsulation via encapsulation concavities which have a known contour profile, such as a Rogowski edge profile. Second metallic layers are then formed to line the concavities and come in contact with the first metal layer, to form profiled and metalized encapsulation concavities which mitigate enhancement points at the edges of electrodes matingly seated in the concavities. One or more optical waveguides may also be bonded to the substrate for coupling light into the photo-conductive wafer, with the encapsulation also encapsulating the waveguides.

Quality changes of cuttlefish stored under various atmosphere modifications and vacuum packaging.

PubMed

Bouletis, Achilleas D; Arvanitoyannis, Ioannis S; Hadjichristodoulou, Christos; Neofitou, Christos; Parlapani, Foteini F; Gkagtzis, Dimitrios C

2016-06-01

Seafood preservation and its shelf life prolongation are two of the main issues in the seafood industry. As a result, and in view of market globalization, research has been triggered in this direction by applying several techniques such as modified atmosphere packaging (MAP), vacuum packaging (VP) and active packaging (AP). However, seafood such as octopus, cuttlefish and others have not been thoroughly investigated up to now. The aim of this research was to determine the optimal conditions of modified atmosphere under which cuttlefish storage time and consequently shelf life time could be prolonged without endangering consumer safety. It was found that cuttlefish shelf life reached 2, 2, 4, 8 and 8 days for control, VP, MAP 1, MAP 2 and MAP 3 (20% CO2 -80% N2 , 50% CO2 -50% N2 and 70% CO2 -30% N2 for MAP 1, 2 and 3, respectively) samples, respectively, judging by their sensorial attributes. Elevated CO2 levels had a strong microbiostatic effect, whereas storage under vacuum did not offer significant advantages. All physicochemical attributes of MAP-treated samples were better preserved compared to control. Application of high CO2 atmospheres such as MAP 2 and MAP 3 proved to be an effective strategy toward preserving the characteristics and prolonging the shelf life of fresh cuttlefish and thereby improving its potential in the market. © 2015 Society of Chemical Industry. © 2015 Society of Chemical Industry.

Chemical and biochemical study of industrially produced San Simón da Costa smoked semi-hard cow's milk cheeses: Effects of storage under vacuum and different modified atmospheres.

PubMed

Garabal, J I; Rodríguez-Alonso, P; Franco, D; Centeno, J A

2010-05-01

Two batches of smoked, semi-hard (ripened for 45 d) San Simón da Costa cow's milk cheeses with Protected Designation of Origin were used to investigate the chemical, biochemical, and sensorial parameters that may be affected by modified-atmosphere packaging. Cheeses were packaged for 45 d as follows: vacuum packaging, packaging in 100% N(2), packaging in a gas mixture of 20% CO(2)/80% N(2), and packaging in a gas mixture of 50% CO(2)/50% N(2). The San Simón da Costa cheeses were characterized by high contents of lactic, oxalic, and citric organic acids. The main free amino acids found were isoleucine, phenylalanine, serine, valine, lysine, and glutamic acid, and the most abundant volatile compounds included ethanol, diacetyl, 2-butanol, isopropyl alcohol, furfural, acetaldehyde, 2-butanone, acetone, and 2-methylfuran. Modified atmospheres appeared to alter the ripening processes by affecting lipolysis, as indicated by the lower concentrations of butyric and propionic acids compared with control cheeses. In addition, modified-atmosphere packaging altered the proteolysis processes, yielding higher amounts of branched-chain alcohols. The results revealed that storage under modified atmosphere contributes to the accumulation of several compounds probably derived from smoke, including aldehydes such as 2-furancarboxaldehyde (furfural), alcohols such as 2-methoxyphenol (guaiacol), ketones such as 2-cyclopenten-1-one, and esters such as methyl furancarboxylate, which were negatively correlated with flavor. Vacuum packaging was the most useful technique in terms of preserving the sensory quality of San Simón da Costa Protected Designation of Origin cheeses. Considering the current demands for packaged portions of food at the distribution and retail levels and the potential health risks associated with some smoke-derived compounds usually present in some smoked foods, the results obtained in this study may be of special interest to the cheese industry. Copyright 2010 American Dairy Science Association. Published by Elsevier Inc. All rights reserved.

Flip chip bumping technology—Status and update

NASA Astrophysics Data System (ADS)

Juergen Wolf, M.; Engelmann, Gunter; Dietrich, Lothar; Reichl, Herbert

2006-09-01

Flip chip technology is a key driver for new complex system architectures and high-density packaging, e.g. sensor or pixel devices. Bumped wafers/dice as key elements become very important in terms of general availability at low cost, high yield and quality level. Today, different materials, e.g. Au, Ni, AuSn, SnAg, SnAgCu, SnCu, etc., are used for flip chip interconnects and different bumping approaches are available. Electroplating is the technology of choice for high-yield wafer bumping for small bump sizes and pitches. Lead-free solder bumps require an increase in knowledge in the field of under bump metallization (UBM) and the interaction of bump and substrate metallization, the formation and growth of intermetallic compounds (IMCs) during liquid- and solid-phase reactions. Results of a new bi-layer UBM of Ni-Cu which is especially designed for small-sized lead-free solder bumps will be discussed.

Wafer-fused semiconductor radiation detector

DOEpatents

Lee, Edwin Y.; James, Ralph B.

2002-01-01

Wafer-fused semiconductor radiation detector useful for gamma-ray and x-ray spectrometers and imaging systems. The detector is fabricated using wafer fusion to insert an electrically conductive grid, typically comprising a metal, between two solid semiconductor pieces, one having a cathode (negative electrode) and the other having an anode (positive electrode). The wafer fused semiconductor radiation detector functions like the commonly used Frisch grid radiation detector, in which an electrically conductive grid is inserted in high vacuum between the cathode and the anode. The wafer-fused semiconductor radiation detector can be fabricated using the same or two different semiconductor materials of different sizes and of the same or different thicknesses; and it may utilize a wide range of metals, or other electrically conducting materials, to form the grid, to optimize the detector performance, without being constrained by structural dissimilarity of the individual parts. The wafer-fused detector is basically formed, for example, by etching spaced grooves across one end of one of two pieces of semiconductor materials, partially filling the grooves with a selected electrical conductor which forms a grid electrode, and then fusing the grooved end of the one semiconductor piece to an end of the other semiconductor piece with a cathode and an anode being formed on opposite ends of the semiconductor pieces.

Single-Crystal Sapphire Optical Fiber Sensor Instrumentation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Pickrell, Gary; Scott, Brian; Wang, Anbo

2013-12-31

This report summarizes technical progress on the program “Single-Crystal Sapphire Optical Fiber Sensor Instrumentation,” funded by the National Energy Technology Laboratory of the U.S. Department of Energy, and performed by the Center for Photonics Technology of the Bradley Department of Electrical and Computer Engineering at Virginia Tech. This project was completed in three phases, each with a separate focus. Phase I of the program, from October 1999 to April 2002, was devoted to development of sensing schema for use in high temperature, harsh environments. Different sensing designs were proposed and tested in the laboratory. Phase II of the program, frommore » April 2002 to April 2009, focused on bringing the sensor technologies, which had already been successfully demonstrated in the laboratory, to a level where the sensors could be deployed in harsh industrial environments and eventually become commercially viable through a series of field tests. Also, a new sensing scheme was developed and tested with numerous advantages over all previous ones in Phase II. Phase III of the program, September 2009 to December 2013, focused on development of the new sensing scheme for field testing in conjunction with materials engineering of the improved sensor packaging lifetimes. In Phase I, three different sensing principles were studied: sapphire air-gap extrinsic Fabry-Perot sensors; intensity-based polarimetric sensors; and broadband polarimetric sensors. Black body radiation tests and corrosion tests were also performed in this phase. The outcome of the first phase of this program was the selection of broadband polarimetric differential interferometry (BPDI) for further prototype instrumentation development. This approach is based on the measurement of the optical path difference (OPD) between two orthogonally polarized light beams in a single-crystal sapphire disk. At the beginning of Phase II, in June 2004, the BPDI sensor was tested at the Wabash River coal gasifier facility in Terre Haute, Indiana. Due to business conditions at industrial partner and several logistical problems, this field test was not successful. An alternative high-temperature sensing system using sapphire wafer-based extrinsic Fabry-Perot interferometry was then developed as a significant improvement over the BPDI solution. From June 2006 to June 2008, three consecutive field tests were performed with the new sapphire wafer sensors at the TECO coal gasifier in Tampa, Florida. One of the sensors survived in the industrial coal gasifier for 7 months, over which time the existing thermocouples were replaced twice. The outcome of these TECO field tests suggests that the sapphire wafer sensor has very good potential to be commercialized. However packaging and sensor protection issues need additional development. During Phase III, several major improvements in the design and fabrication process of the sensor have been achieved through experiments and theoretical analysis. Studies on the property of the key components in the sensor head, including the sapphire fiber and sapphire wafer, were also conducted, for a better understanding of the sensor behavior. A final design based on all knowledge and experience has been developed, free of any issues encountered during the entire research. Sensors with this design performed well as expected in lab long-term tests, and were deployed in the sensing probe of the final coal-gasifier field test. Sensor packaging and protection was improved through materials engineering through testing of packaging designs in two blank probe packaging tests at Eastman Chemical in Kingsport, TN. Performance analysis of the blank probe packaging resulted in improve package designs culminating in a 3rd generation probe packaging utilized for the full field test of the sapphire optical sensor and materials designed sensor packaging.« less

Colour, lipid and protein stability of Rhea americana meat during air- and vacuum-packaged storage: influence of muscle on oxidative processes.

PubMed

Filgueras, R S; Gatellier, P; Aubry, L; Thomas, A; Bauchart, D; Durand, D; Zambiazi, R C; Santé-Lhoutellier, V

2010-11-01

Physicochemical characteristics and oxidative stability during storage were determined in Gastrocnemius pars interna (GN) and Iliofiburalis (IF) muscles of Rhea americana. Glycolytic potential (GP) and pH decline of muscles were measured within the first 24 h post mortem. Colour, lipid and protein stability were determined during storage of meat, i.e. 5 days under air-packaging at 4°C, or 28 days under vacuum-packaging at 4°C. In parallel, anti-oxidant status of muscles was estimated by measuring α-tocopherol content and anti-oxidant enzyme activities (superoxide dismutase and catalase), while pro-oxidant status was evaluated by determining haeminic iron and long chain fatty acids (especially polyunsaturated fatty acids). The ultimate pH was similar in both muscles, but the GP value was significantly higher in IF than in GN muscle. Haeminic iron and alpha-tocopherol content differed between muscles, with 30% more haeminic iron (p<0.05) and 134% more alpha-tocopherol (p<0.001) in IF than GN muscle. The IF muscle presented higher lipid content and lower PUFA/SFA ratio (polyunsaturated fatty acids/saturated fatty acids) than GN muscle. With storage under air-packaging, lipid and protein oxidation of rhea muscles increased up to 275% and 30%, respectively. This increase was more rapidly and marked in IF muscle. The IF also showed high level of metmyoglobin accumulation after 3 days of storage (47%) and was rejected by 1 consumer out of 2 in sensorial analysis. Under vacuum-packaging, both muscles showed a high stability of colour and no oxidation of lipids and proteins. Copyright © 2010 The American Meat Science Association. Published by Elsevier Ltd. All rights reserved.

Effect of vacuum and modified atmosphere packaging on microbiological properties of cold-smoked trout

NASA Astrophysics Data System (ADS)

Đorđević, J.; Pavlićević, N.; Bošković, M.; Janjić, J.; Glišić, M.; Starčević, M.; Baltić, M. Ž.

2017-09-01

Because of the importance of different packaging methods for the extension of fish shelf life, as a highly perishable food, the aim of the present study was to examine the effect of vacuum and modified atmosphere packaging on the total Enterobacteriaceae and lactic acid bacteria counts of cold-smoked Salmon trout (Oncorhynchus mykiss) stored at 3°C during six weeks. Trout fillets were vacuumed packaged (VP) or packaged in one of two different modified atmospheres, with gas ratio of 50%CO2/50%N2 (MAP1) and 90%CO2/10%N2 (MAP2) and analysed on days 0, 7, 14, 21, 28, 35 and 42. Both the total Enterobacteriaceae and total lactic acid bacteria counts increased in the trout fillets in all packaging types during storage. A significantly lower total Enterobacteriaceae count was determined in the MAP fish compared to the VP fish, with the weakest growth rate and lowest numbers attained in MAP2 fillets. The lactic acid bacteria count was higher in trout packaged in MAP compared to VP, with the highest number in the MAP with 90% CO2 (MAP2).

Packaged integrated opto-fluidic solution for harmful fluid analysis

NASA Astrophysics Data System (ADS)

Allenet, T.; Bucci, D.; Geoffray, F.; Canto, F.; Couston, L.; Jardinier, E.; Broquin, J.-E.

2016-02-01

Advances in nuclear fuel reprocessing have led to a surging need for novel chemical analysis tools. In this paper, we present a packaged lab-on-chip approach with co-integration of optical and micro-fluidic functions on a glass substrate as a solution. A chip was built and packaged to obtain light/fluid interaction in order for the entire device to make spectral measurements using the photo spectroscopy absorption principle. The interaction between the analyte solution and light takes place at the boundary between a waveguide and a fluid micro-channel thanks to the evanescent part of the waveguide's guided mode that propagates into the fluid. The waveguide was obtained via ion exchange on a glass wafer. The input and the output of the waveguides were pigtailed with standard single mode optical fibers. The micro-scale fluid channel was elaborated with a lithography procedure and hydrofluoric acid wet etching resulting in a 150+/-8 μm deep channel. The channel was designed with fluidic accesses, in order for the chip to be compatible with commercial fluidic interfaces/chip mounts. This allows for analyte fluid in external capillaries to be pumped into the device through micro-pipes, hence resulting in a fully packaged chip. In order to produce this co-integrated structure, two substrates were bonded. A study of direct glass wafer-to-wafer molecular bonding was carried-out to improve detector sturdiness and durability and put forward a bonding protocol with a bonding surface energy of γ>2.0 J.m-2. Detector viability was shown by obtaining optical mode measurements and detecting traces of 1.2 M neodymium (Nd) solute in 12+/-1 μL of 0.01 M and pH 2 nitric acid (HNO3) solvent by obtaining an absorption peak specific to neodymium at 795 nm.

Quality attributes of farmed eel (Anguilla anguilla) stored under air, vacuum and modified atmosphere packaging at 0 degrees C.

PubMed

Arkoudelos, John; Stamatis, Nikolaos; Samaras, Fotis

2007-01-01

The shelf life of fresh eel in various packaging conditions of atmospheric air, vacuum and modified atmosphere packaging (MAP) (40% CO(2), 30% N(2) and 30% O(2)) at 0 degrees C was investigated. All raw eel samples received acceptable sensory scores during the first 11+/-1 days of storage in atmospheric air, 11+/-1 days of storage in vacuum and finally 18+/-1 days of storage in MAP conditions. Using the microbial quality indicators the shelf life of eel packed in air, vacuum and MAP was estimated to be more than 18, 28 and 34 days, respectively. The main spoilage microorganisms under MAP conditions were lactic acid producing bacteria followed by Shewanella spp., pseudomonads, Enterobacteriaceae and yeasts. Chemical data revealed that pH, ammonia, glucose and lactate examinations might not be useful for monitoring eel quality differences.

First On-Wafer Power Characterization of MMIC Amplifiers at Sub-Millimeter Wave Frequencies

NASA Technical Reports Server (NTRS)

Fung, A. K.; Gaier, T.; Samoska, L.; Deal, W. R.; Radisic, V.; Mei, X. B.; Yoshida, W.; Liu, P. S.; Uyeda, J.; Barsky, M.;

The effect of vacuum packaging, EDTA, oregano and thyme oils on the microbiological quality of chicken's breast.

PubMed

Pavelková, Adriana; Kačániová, Miroslava; Horská, Elena; Rovná, Katarína; Hleba, Lukáš; Petrová, Jana

2014-10-01

The effect of ethylenediaminetetraacetate (EDTA), oregano (Origanum vulgare) and thyme (Thymus vulgaris) oils, on the chicken breast fillets was examined in this study. The chicken breast fillets were stored under vacuum packaging (VP), at 4 ± 0.5 °C for a period of 18 days. There were used the following treatments of chicken breast fillets: Air-packaged (AC, control samples), vacuum-packaged (VPC, control samples), VP with EDTA solution 1.50% w/w (VPEC, control samples), VP with oregano oil 0.20% v/w (VP + O) and VP with thyme oil 0.20% v/w, (VP + T). The quality assessment for vacuum packaging of the product in accordance with the terms above and EDTA treatment, oregano and thyme oil was established by microbiological analyzes. The microbiological properties as the total viable counts on Plate Count Agar, after incubation for 2 days at 37 °C and coliform bacteria on Violet Red Bile Glucose agar incubated at 37 °C for 24 h, lactobacilli on Rogosa and Sharpe agar after incubation 48-78 h at 37 °C in an aerobic atmosphere supplemented with carbon dioxide (5% CO2) and Pseudomonas aeruginosa on Pseudomonas Isolation agar (PIA, Oxoid, UK) after incubation at 48 h at 35 °C were monitored. The using of oregano, thyme oil and EDTA with combination of vacuum packaging has significant effects to reduction of all followed groups of microorganisms compared with control group without vacuum packaging and untreated control group. The natural preservatives can be used as alternatives to chemical additives which could extend the meat and meat products shelf life. The knowledge about them can have an important economic feedback by reducing losses attributed to spoilage and by allowing the products to reach distant and new markets. This study shows how using of natural antimicrobials can extend the shelf-life of the meat product. Copyright © 2013 Elsevier Ltd. All rights reserved.

Warpage Measurement of Thin Wafers by Reflectometry

NASA Astrophysics Data System (ADS)

Ng, Chi Seng; Asundi, Anand Krishna

To cope with advances in the electronic and portable devices, electronic packaging industries have employed thinner and larger wafers to produce thinner packages/ electronic devices. As the thickness of the wafer decrease (below 250um), there is an increased tendency for it to warp. Large stresses are induced during manufacturing processes, particularly during backside metal deposition. The wafers bend due to these stresses. Warpage results from the residual stress will affect subsequent manufacturing processes. For example, warpage due to this residual stresses lead to crack dies during singulation process which will severely reorient the residual stress distributions, thus, weakening the mechanical and electrical properties of the singulated die. It is impossible to completely prevent the residual stress induced on thin wafers during the manufacturing processes. Monitoring of curvature/flatness is thus necessary to ensure reliability of device and its uses. A simple whole-field curvature measurement system using a novel computer aided phase shift reflection grating method has been developed and this project aims to take it to the next step for residual stress and full field surface shape measurement. The system was developed from our earlier works on Computer Aided Moiré Methods and Novel Techniques in Reflection Moiré, Experimental Mechanics (1994) in which novel structured light approach was shown for surface slope and curvature measurement. This method uses similar technology but coupled with a novel phase shift system to accurately measure slope and curvature. In this study, slope of the surface were obtain using the versatility of computer aided reflection grating method to manipulate and generate gratings in two orthogonal directions. The curvature and stress can be evaluated by performing a single order differentiation on slope data.

Die singulation method and package formed thereby

DOEpatents

Anderson, Robert C [Tucson, AZ; Shul, Randy J [Albuquerque, NM; Clews, Peggy J [Tijeras, NM; Baker, Michael S [Albuquerque, NM; De Boer, Maarten P [Albuquerque, NM

2012-08-07

A method is disclosed for singulating die from a substrate having a sacrificial layer and one or more device layers, with a retainer being formed in the device layer(s) and anchored to the substrate. Deep Reactive Ion Etching (DRIE) etching of a trench through the substrate from the bottom side defines a shape for each die. A handle wafer is then attached to the bottom side of the substrate, and the sacrificial layer is etched to singulate the die and to form a frame from the retainer and the substrate. The frame and handle wafer, which retain the singulated die in place, can be attached together with a clamp or a clip and to form a package for the singulated die. One or more stops can be formed from the device layer(s) to limit a sliding motion of the singulated die.

An evaluation of the effectiveness of FreshCase technology to extend the storage life of whole-muscle pork and ground pork sausage.

PubMed

Yang, X; Woerner, D R; McCullough, K R; Hasty, J D; Geornaras, I; Smith, G C; Sofos, J N; Belk, K E

2016-11-01

The objective of this study was to identify the maximum time of refrigerated storage before aerobic psychrotrophic bacteria grew to a level indicative of spoilage (7 log cfu/g) or other indicators of spoilage were observed for whole-muscle pork and ground pork sausage packaged using FreshCase technology. Pork chops and pork sausage were packaged using conventional vacuum packaging without nitrite in film (Control) or using FreshCase technology and were compared with respect to microbial counts, pH, instrumental color measurements, lipid oxidation level, and sensory properties. The storage life was 45 d for pork chops stored in FreshCase packages at 1°C and 19 d for ground pork sausage stored under the same condition. Results indicated that both pork chops and sausage stored in FreshCase packages retained redder color ( < 0.05) than those stored in Control packages. No differences ( > 0.05) existed between Control and FreshCase packaged samples for any off-odor detection for either pork chops or sausage. Moreover, levels of oxidative rancidity in all packages had low thiobarbituric acid reactive substances values. The results indicated that FreshCase technology can be used to extend storage life of pork products without having adverse effects on pork quality.

Three Axes MEMS Combined Sensor for Electronic Stability Control System

NASA Astrophysics Data System (ADS)

Jeong, Heewon; Goto, Yasushi; Aono, Takanori; Nakamura, Toshiaki; Hayashi, Masahide

A microelectromechanical systems (MEMS) combined sensor measuring two-axis accelerations and an angular rate (rotation) has been developed for an electronic stability control system of automobiles. With the recent trend to mount the combined sensors in the engine compartment, the operation temperature range increased drastically, with the request of immunity to environmental disturbances such as vibration. In this paper, we report the combined sensor which has a gyroscopic part and two acceleration parts in single die. A deformation-robust MEMS structure has been adopted to achieve stable operation under wide temperature range (-40 to 125°C) in the engine compartment. A package as small as 10 × 19 × 4 mm is achieved by adopting TSV (through silicon via) and WLP (wafer-level package) technologies with enough performance as automotive grade.

Switchable adhesion for wafer-handling based on dielectric elastomer stack transducers

NASA Astrophysics Data System (ADS)

Grotepaß, T.; Butz, J.; Förster-Zügel, F.; Schlaak, H. F.

2016-04-01

Vacuum grippers are often used for the handling of wafers and small devices. In order to evacuate the gripper, a gas flow is created that can harm the micro structures on the wafer. A promising alternative to vacuum grippers could be adhesive grippers with switchable adhesion. There have been some publications of gecko-inspired adhesive devices. Most of these former works consist of a structured surface which adheres to the object manipulated and an actuator for switching the adhesion. Until now different actuator principles have been investigated, like smart memory alloys and pneumatics. In this work for the first time dielectric elastomer stack transducers (DEST) are combined with a structured surface. DESTs are a promising new transducer technology with many applications in different industry sectors like medical devices, human-machine-interaction and soft robotics. Stacked dielectric elastomer transducers show thickness contraction originating from the electromechanical pressure of two compliant electrodes compressing an elastomeric dielectric when a voltage is applied. Since DESTs and the adhesive surfaces previously described are made of elastomers, it is self-evident to combine both systems in one device. The DESTs are fabricated by a spin coating process. If the flat surface of the spinning carrier is substituted for example by a perforated one, the structured elastomer surface and the DEST can be fabricated in one process. By electrical actuation the DEST contracts and laterally expands which causes the gecko-like cilia to adhere on the object to manipulate. This work describes the assembly and the experimental results of such a device using switchable adhesion. It is intended to be used for the handling of glass wafers.

Influence of PA6 nanocomposite films on the stability of vacuum-aged beef loins during storage in modified atmospheres.

PubMed

Picouet, P A; Fernandez, A; Realini, C E; Lloret, E

2014-01-01

A masterbatch of polyamide 6 (PA6) containing dispersed nanoclays, was used to fabricate a novel multilayer film for vacuum packed meat. Performance of the nanocomposite was compared to a control PA6 multilayer and a high barrier commercial film. Addition of nanoclays improved oxygen barrier properties, UV-blocking capability and stiffness. Beef loins were vacuum-aged using the three films for 0 7, 14 and 21 days at 2°C. After each ageing time, beef steaks were packaged in commercial trays and high oxygen atmosphere and stored at 4°C for 9 days. Beef quality parameters and gas content were studied during display time in MAP (1, 3, 6 and 9 d). Beef quality parameters were not influenced by the packaging materials used during ageing and the performance of nanocomposites was comparable to high barrier films. Ageing had a positive impact on the stabilization of redness up to day 6 in MAP. Thereafter, oxymyoglobin content and oxidation levels were negatively influenced by ageing. © 2013.

Shelf life of cooked goat blood sausage prepared with the addition of heart and kidney.

PubMed

Silva, F A P; Amaral, D S; Guerra, I C D; Arcanjo, N M O; Bezerra, T K A; Ferreira, V C S; Araújo, I B S; Dalmás, P S; Madruga, M S

2014-08-01

This study focused on the effect of two packaging formats (vacuum packaging and over-wrap packaging) on the shelf life of cooked sausage prepared with blood, heart, kidney and goat meat fragments under storage at 4±1°C for a period of 90 days. The storage time and type of packaging significantly affected the chemical (pH, moisture, protein and TBARS number), physical (shear force) and microbial (mould and yeast) parameters of cooked sausage. Vacuum packaging maintained the microbiological and chemical qualities of cooked goat blood sausage for a longer period of time (63 days) compared to over-wrap packaging (41 days) and could be a viable alternative to refrigerated storage of the product for quality maintenance. Copyright © 2014 Elsevier Ltd. All rights reserved.

Influence of vacuum chamber impurities on the lifetime of organic light-emitting diodes

PubMed Central

Fujimoto, Hiroshi; Suekane, Takashi; Imanishi, Katsuya; Yukiwaki, Satoshi; Wei, Hong; Nagayoshi, Kaori; Yahiro, Masayuki; Adachi, Chihaya

2016-01-01

We evaluated the influence of impurities in the vacuum chamber used for the fabrication of organic light-emitting diodes on the lifetime of the fabricated devices and found a correlation between lifetime and the device fabrication time. The contact angle of the ITO substrates stored the chamber under vacuum were used to evaluate chamber cleanliness. Liquid chromatography-mass spectrometry was performed on Si wafers stored in the vacuum chamber before device fabrication to examine the impurities in the chamber. Surprisingly, despite the chamber and evaporation sources being at room temperature, a variety of materials were detected, including previously deposited materials and plasticizers from the vacuum chamber components. We show that the impurities, and not differences in water content, in the chamber were the source of lifetime variations even when the duration of exposure to impurities only varied before and after deposition of the emitter layer. These results suggest that the impurities floating in the vacuum chamber significantly impact lifetime values and reproducibility. PMID:27958304

Influence of vacuum chamber impurities on the lifetime of organic light-emitting diodes

NASA Astrophysics Data System (ADS)

Fujimoto, Hiroshi; Suekane, Takashi; Imanishi, Katsuya; Yukiwaki, Satoshi; Wei, Hong; Nagayoshi, Kaori; Yahiro, Masayuki; Adachi, Chihaya

2016-12-01

We evaluated the influence of impurities in the vacuum chamber used for the fabrication of organic light-emitting diodes on the lifetime of the fabricated devices and found a correlation between lifetime and the device fabrication time. The contact angle of the ITO substrates stored the chamber under vacuum were used to evaluate chamber cleanliness. Liquid chromatography-mass spectrometry was performed on Si wafers stored in the vacuum chamber before device fabrication to examine the impurities in the chamber. Surprisingly, despite the chamber and evaporation sources being at room temperature, a variety of materials were detected, including previously deposited materials and plasticizers from the vacuum chamber components. We show that the impurities, and not differences in water content, in the chamber were the source of lifetime variations even when the duration of exposure to impurities only varied before and after deposition of the emitter layer. These results suggest that the impurities floating in the vacuum chamber significantly impact lifetime values and reproducibility.

Direct wafer bonding of highly conductive GaSb/GaInAs and GaSb/GaInP heterojunctions prepared by argon-beam surface activation

DOE Office of Scientific and Technical Information (OSTI.GOV)

Predan, Felix, E-mail: felix.predan@ise.fraunhofer.de; Reinwand, Dirk; Cariou, Romain

The authors present a low-temperature wafer bonding process for the formation of electrically conductive n-GaSb/n-Ga{sub 0.79}In{sub 0.21}As and n-GaSb/n-Ga{sub 0.32}In{sub 0.68}P heterojunctions. The surfaces are deoxidized by sputter-etching with an argon-beam and bonded in ultrahigh vacuum. The sputtering behavior was investigated for each material, revealing a distinct selective sputtering characteristic for Ga{sub 0.32}In{sub 0.68}P. According to these findings, the settings for the bonding process were chosen. The mechanical and electrical properties of the wafer bonds were studied. Fully bonded 2 in. wafer pairs were found for both material combinations exhibiting high bond energies, which are comparable to the binding energiesmore » in the semiconductors. Furthermore, bond resistances below 5 mΩ cm{sup 2} could be reached, which are in the range of the lowest resistances that have been reported for wafer bonded heterojunctions. This speaks, together with the high bond energies, for a high amount of covalent bonds at the interfaces. These promising bond characteristics make the integration of antimonides with arsenides or phosphides by wafer bonding attractive for various optoelectronic applications such as multijunction solar cells.« less

[Assessment of the probability of encountering staphylococcal enterotoxins in lactic acid cheese packaged in laminates].

PubMed

Steinka, Izabela

2004-01-01

Immunoassay methods were used to identify the presence of staphylococcal enterotoxins in lactic acid cheese vacuum and non-vacuum packed. There was assessed the probability of encountering staphylococcal enterotoxin in cheese dependent on different systems of packaging, count of staphylococcal cells, intensiveness of coagulase synthesis and tightness of packaging. The presence of enterotoxin was identified in 5% of researched samples of products stored for 14 days. The influence of packaging system and tightness on presence of enterotoxin was observed. The probability of presence of staphylococcal and enterotoxin in relation to researched factors was presented by the mathematical models.

Effect of modified atmosphere and vacuum packaging on some quality characteristics and the shelf-life of "morcilla", a typical cooked blood sausage.

PubMed

Cachaldora, Aida; García, Gloria; Lorenzo, José M; García-Fontán, M Camino

2013-02-01

The effect of modified atmosphere and vacuum packaging on the shelf-life of "morcilla", a traditional cooked blood sausage, was investigated. A total of 99 "morcillas" were packaged under vacuum and in modified atmosphere using three different gas mixtures: 15:35:50/O(2):N(2):CO(2) (atmosphere 1), 60:40/N(2):CO(2) (atmosphere 2) and 40:60/N(2):CO(2) (atmosphere 3), and stored during 2, 4, 6 and 8 weeks at 4 °C. Shelf life evaluation was based on pH, water activity (a(w)), colour (CIE L*, a*, b*, C* and h*), TBARS formation and microbial counts. The results indicated that, in general, storage time affected (P<0.05) all parameters whereas no significant differences were observed (P>0.05) among packaging conditions. Based on the microbial counts, the shelf-life of "morcilla" would be greater than 8 weeks for all packaging conditions. Samples packaged with high CO(2) concentrations (40:60/N(2):CO(2)) showed the lowest values of TBARS at the end of storage. Copyright © 2012 Elsevier Ltd. All rights reserved.

Effect of a nano-silver coating on the quality of fresh turkey meat during storage after modified atmosphere or vacuum packaging.

PubMed

Deus, D; Kehrenberg, C; Schaudien, D; Klein, G; Krischek, C

2017-02-01

Nano-silver is used in consumer products due to its antibacterial properties. The aim of this study was to evaluate the effect of a nano-silver-coated film on the quality of turkey meat during vacuum-sealed and modified atmosphere packaging up to 12 days of storage. In the first part of the experiment, turkey breasts were packaged using either vacuum packaging or modified atmosphere packages (MAPs) and contained films with or without a nano-silver coating (control film). Parameters such as pH, electrical conductivity, color (lightness L*, redness a*), myoglobin redox forms, thiobarbituric acid-reactive substances (TBARS), biogenic amines (BAs), total viable bacterial counts, Pseudomonas species counts, and Enterobacteriaceae species counts were evaluated on storage days 4, 8, and 12. In the second part of the study, the antimicrobial effect of a nano-silver-coated film on turkey breast was evaluated after inoculation with Escherichia coli (E. coli). Turkey meat packaged with the nano-silver film exhibited lower a* values on days 1 (3.15 ± 0.62), 4 (3.90 ± 0.68), and 8 (4.27 ± 0.76) compared to the packaged meat with the control film (3.41 ± 0.73, 4.35 ± 0.94, 4.85 ± 0.89, respectively), indicating special optical properties of nanoparticles. Concerning the BAs, silver packaged meat showed higher values of tyramine on day 12 (1274 ± 392 ng/g meat) and cadaverine on day 4 (1224 ± 435 ng/g meat) compared to the normal packaged products (647 ± 576 and 508 ± 314 ng/g meat, respectively). MAP meat revealed higher L* and TBARS values and lower microbial counts than the vacuum packaged products on all days. The MAP meat also showed lower a* results on days 4 and 8 and higher metmyoglobin (metMb) values on days 8 and 12 compared to th E: vacuum products. In the inoculation study, the microbial counts of the turkey meat were comparable between the two film types. The study showed that the nano-silver coating did not exhibit any advantageous effects on the quality and microbiological parameters of the turkey meat. © 2016 Poultry Science Association Inc.

The Function of Emulsions on the Biogenic Amine Formation and their Indices of Sea Bass Fillets (Dicentrarchus Labrax) Stored in Vacuum Packaging.

PubMed

Ozogul, Yesim; Durmus, Mustafa; Kuley Boga, Esmeray; Uçar, Yılmaz; Ozogul, Fatih

2018-02-01

The impacts of emulsions based on commercial oils on the biogenic amine formation and their indices of vacuumed packed sea bass fillets were investigated. The results showed that among biogenic amines, cadaverine, putrescine, spermidine, spermine, serotonin, dopamine, and agmatine were predominant amines in sea bass fillets stored under vacuum packaging. Significant differences (P < 0.05) in biogenic amines concentrations of vacuumed packed sea bass treated with emulsions were observed. All groups contained histamine lower than 5.0 mg/100 g, regarded as the allowable limit by the U.S. Food and Drug Administration. Polyamine levels were not affected by application of emulsion. Quality index (QI) showed an increase and after 14 d of storage it decreased in all groups. The control generally seemed to higher QI value than those of treatment groups except at 14 and 18 days while soybean and corn gave lower QI among treatment groups. Only biogenic amine index correlated with sensory acceptability of vacuumed packed sea bass, indicating that this index can be used for determination of the degree of spoilage of vacuumed packed sea bass. Emulsions extended the shelf-life (approximately 2 to 4 d) of vacuumed packed sea bass fillets by inhibiting microbial growth compared to the control. Emulsions have become popular since they are regarded as ideal carrier for the delivery of lipophilic substances due to the ease of preparation, small particle size, their enhanced bioavailability, and long term kinetic stability. They have been proven to be self-preserving antimicrobials due to bound water in their structure and thus no available water to microorganisms. Antimicrobial emulsions have potential applications in many fields because they are inexpensive, stable, and nontoxic agents. © 2018 Institute of Food Technologists®.

Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning

NASA Astrophysics Data System (ADS)

Wang, Chenxi; Xu, Jikai; Zeng, Xiaorun; Tian, Yanhong; Wang, Chunqing; Suga, Tadatomo

2018-02-01

We demonstrate a facile bonding process for combining silicon and quartz glass wafers by a two-step wet chemical surface cleaning. After a post-annealing at 200 °C, strong bonding interfaces with no defects or microcracks were obtained. On the basis of the detailed surface and bonding interface characterizations, the bonding mechanism was explored and discussed. The amino groups terminated on the cleaned surfaces might contribute to the bonding strength enhancement during the annealing. This cost-effective bonding process has great potentials for silicon- and glass-based heterogeneous integrations without requiring a vacuum system.

Wafer-scale solution-derived molecular gate dielectrics for low-voltage graphene electronics

NASA Astrophysics Data System (ADS)

Sangwan, Vinod K.; Jariwala, Deep; Everaerts, Ken; McMorrow, Julian J.; He, Jianting; Grayson, Matthew; Lauhon, Lincoln J.; Marks, Tobin J.; Hersam, Mark C.

2014-02-01

Graphene field-effect transistors are integrated with solution-processed multilayer hybrid organic-inorganic self-assembled nanodielectrics (SANDs). The resulting devices exhibit low-operating voltage (2 V), negligible hysteresis, current saturation with intrinsic gain >1.0 in vacuum (pressure < 2 × 10-5 Torr), and overall improved performance compared to control devices on conventional SiO2 gate dielectrics. Statistical analysis of the field-effect mobility and residual carrier concentration demonstrate high spatial uniformity of the dielectric interfacial properties and graphene transistor characteristics over full 3 in. wafers. This work thus establishes SANDs as an effective platform for large-area, high-performance graphene electronics.

Micro-machined resonator oscillator

DOEpatents

Koehler, Dale R.; Sniegowski, Jeffry J.; Bivens, Hugh M.; Wessendorf, Kurt O.

1994-01-01

A micro-miniature resonator-oscillator is disclosed. Due to the miniaturization of the resonator-oscillator, oscillation frequencies of one MHz and higher are utilized. A thickness-mode quartz resonator housed in a micro-machined silicon package and operated as a "telemetered sensor beacon" that is, a digital, self-powered, remote, parameter measuring-transmitter in the FM-band. The resonator design uses trapped energy principles and temperature dependence methodology through crystal orientation control, with operation in the 20-100 MHz range. High volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Unique design features include squeeze-film damping for robust vibration and shock performance, capacitive coupling through micro-machined diaphragms allowing resonator excitation at the package exterior, circuit integration and extremely small (0.1 in. square) dimensioning. A family of micro-miniature sensor beacons is also disclosed with widespread applications as bio-medical sensors, vehicle status monitors and high-volume animal identification and health sensors. The sensor family allows measurement of temperatures, chemicals, acceleration and pressure. A microphone and clock realization is also available.

Quality of hurdle treated pork sausages during refrigerated (4 ± 1°C) storage.

PubMed

Thomas, R; Anjaneyulu, A S R; Kondaiah, N

2010-06-01

Pork sausages developed using hurdle technology was evaluated during refrigerated storage (4 ± 1°C). Hurdles incorporated were low pH, low water activity, vacuum packaging and post package reheating. Dipping in potassium sorbate solution prior to vacuum packaging was also tried. Hurdle treatment significantly (p <0.05) reduced the rate of deterioration of quality characteristics of pork sausages during storage, as indicated by TBARS and tyrosine values. Incorporation of hurdles decreased the growth of different spoilage and pathogenic microorganisms. Combination of pH, water activity, vacuum packaging and reheating inhibited the growth of yeast and molds up to 12 days, while additional dipping of sausages in 1% potassium sorbate solution prior to packaging inhibited their growth even on 30(th) day of storage. Incorporation of hurdles resulted in initial reduction in all the sensory attributes, but they helped to maintain these attributes for significantly longer period compared to control. Hurdle treated sausages exhibited no spoilage signs even on day 30, while the control sausages were found acceptable only up to 18 days.

Surface attachment of active antimicrobial coatings onto conventional plastic-based laminates and performance assessment of these materials on the storage life of vacuum packaged beef sub-primals.

PubMed

Clarke, David; Tyuftin, Andrey A; Cruz-Romero, Malco C; Bolton, Declan; Fanning, Seamus; Pankaj, Shashi K; Bueno-Ferrer, Carmen; Cullen, Patrick J; Kerry, Joe P

2017-04-01

Two antimicrobial coatings, namely Sodium octanoate and Auranta FV (a commercial antimicrobial composed of bioflavonoids, citric, malic, lactic, and caprylic acids) were used. These two antimicrobials were surface coated onto the inner polyethylene layer of cold plasma treated polyamide films using beef gelatin as a carrier and coating polymer. This packaging material was then used to vacuum pack beef sub-primal cuts and stored at 4 °C. A control was prepared using the non-coated commercial laminate and the same vacuum packaged sub-primal beef cuts. During storage, microbial and quality assessments were carried out. Sodium octanoate treated packages significantly (p < 0.05) reduced microbial counts for all bacteria tested with an increase of 7 and 14 days, respectively compared to control samples. No significant effect on pH was observed with any treatment. The results suggested that these food grade antimicrobials have the potential to be used in antimicrobial active packaging applications for beef products. Copyright © 2016 Elsevier Ltd. All rights reserved.

Preliminary evaluation of Glass Resin materials for solar cell cover use

NASA Technical Reports Server (NTRS)

Marsik, S. J.; Swartz, C. K.; Baraona, C. R.

1978-01-01

The glass resins were deposited by several techniques on 200 micron thick cells and on 50 microns thick wafers. The covered cells were exposed to ultraviolet light in vacuum to an intensity of 10 UV energy-equivalent solar constants at air mass zero for 728 hr. The exposure was followed by a single long thermal cycle from ambient temperature to -150 C. Visual inspection of the samples indicated that all samples had darkened to varying degrees. The loss in short-circuit current was found to range from 8 to 24%, depending on the resin formulation. In another test over 40 glass resin-coated silicon wafers withstood 15 thermal cycles from 100 to-196 C in one or more of the thicknesses tested. Several of the resin-coated wafers were tested at 65 C and 90% relative humidity for 170 hr. No change in physical appearance was detected.

Oxidation of silicon with a 5 eV O(-) beam

NASA Technical Reports Server (NTRS)

Hecht, M. H.; Orient, O. J.; Chutjian, A.; Vasquez, R. P.

1989-01-01

A silicon wafer has been oxidized at room temperature in vacuum using a pure, ground-state beam of O(-) ions. The beam was of sufficiently low energy that no displacement damage or implantation was energetically possible. The resulting SiO2 films were analyzed with X-ray photoelectron spectroscopy. A logarithmic dependence of oxide thickness on dose was observed, with an extrapolated oxidation efficiency of unity for the clean silicon surface. A distinct initial oxidation phase was observed, with an anomalously high level of silicon suboxides. In addition, the valence-band offset between the silicon and the oxide was unusually small, suggesting a large interfacial dipole.

Conformal Thin Film Packaging for SiC Sensor Circuits in Harsh Environments

NASA Technical Reports Server (NTRS)

Scardelletti, Maximilian C.; Karnick, David A.; Ponchak, George E.; Zorman, Christian A.

2011-01-01

In this investigation sputtered silicon carbide annealed at 300 C for one hour is used as a conformal thin film package. A RF magnetron sputterer was used to deposit 500 nm silicon carbide films on gold metal structures on alumina wafers. To determine the reliability and resistance to immersion in harsh environments, samples were submerged in gold etchant for 24 hours, in BOE for 24 hours, and in an O2 plasma etch for one hour. The adhesion strength of the thin film was measured by a pull test before and after the chemical immersion, which indicated that the film has an adhesion strength better than 10(exp 8) N/m2; this is similar to the adhesion of the gold layer to the alumina wafer. MIM capacitors are used to determine the dielectric constant, which is dependent on the SiC anneal temperature. Finally, to demonstrate that the SiC, conformal, thin film may be used to package RF circuits and sensors, an LC resonator circuit was fabricated and tested with and without the conformal SiC thin film packaging. The results indicate that the SiC coating adds no appreciable degradation to the circuits RF performance. Index Terms Sputter, silicon carbide, MIM capacitors, LC resonators, gold etchants, BOE, O2 plasma

Combined effects of gamma irradiation and a modified atmospheric packaging on the physicochemical characteristics of sausage

NASA Astrophysics Data System (ADS)

Ahn, Hyun-Joo; Kim, Jae-Hyun; Jo, Cheorun; Lee, Ju-Woon; Yook, Hong-Sun; Kim, Hee-Yun; Byun, Myung-Woo

2004-09-01

This study is to investigate the combined effects of irradiation and a modified atmospheric packaging (MAP) on the color, nitrosoheme pigments (NO-Mb), residual nitrite and N-nitrosodimethylamine (NDMA) in sausage during storage. Sausage with air, vacuum, CO 2, N 2, or CO 2/N 2 packaging was irradiated at 5 kGy. Irradiation reduced the red color of sausage, and a vacuum or MAP was effective in minimizing the loss of redness. The reduction of NO-Mb was observed by irradiation, while the MAP was more effective in maintaining the NO-Mb than the aerobic ones. Residual nitrite was reduced by irradiation, and the contents were lower under vacuum or MAP than aerobic ones. NDMA was significantly reduced by irradiation.

Effect of different packaging methods and storage temperature on microbiological and physicochemical quality characteristics of meatball.

PubMed

Yilmaz, I; Demirci, M

2010-06-01

The objective of this research was to determine physicochemical changes and microbiological quality of the different packaged meatball samples. Meatball samples in polystyrene tray were closed with polyethylene film (PS packs), vacuumed and modified atmosphere packaged, (MAP) (65% N(2), 35% CO(2)), and held under refrigerated display (4 °C) for 8, 16 and 16 days for PS packs, vacuum and MAP, respectively. Microbial load, free fatty acids and thiobarbituric acid values of the samples tended to increase with storage time. Bacteria counts of the raw meatball samples increased 2 log cycles at the end of storage compared with initial values. Meatball samples can be stored without any microbiological problem for 7 days at 4 °C. Results from this study suggested that shelf-life assigned to modified-MAP and vacuum-packed meatballs may be appropriate. Meatball samples underwent physical deformation when they were packed before vacuum process. With these negative factors considered, MAP is superior to other two packs methods.

High voltage photo switch package module

DOEpatents

Sullivan, James S; Sanders, David M; Hawkins, Steven A; Sampayan, Stephen E

2014-02-18

A photo-conductive switch package module having a photo-conductive substrate or wafer with opposing electrode-interface surfaces, and at least one light-input surface. First metallic layers are formed on the electrode-interface surfaces, and one or more optical waveguides having input and output ends are bonded to the substrate so that the output end of each waveguide is bonded to a corresponding one of the light-input surfaces of the photo-conductive substrate. This forms a waveguide-substrate interface for coupling light into the photo-conductive wafer. A dielectric material such as epoxy is then used to encapsulate the photo-conductive substrate and optical waveguide so that only the metallic layers and the input end of the optical waveguide are exposed. Second metallic layers are then formed on the first metallic layers so that the waveguide-substrate interface is positioned under the second metallic layers.

Space ultra-vacuum facility and method of operation

NASA Technical Reports Server (NTRS)

Naumann, Robert J. (Inventor)

1988-01-01

A wake shield space processing facility (10) for maintaining ultra-high levels of vacuum is described. The wake shield (12) is a truncated hemispherical section having a convex side (14) and a concave side (24). Material samples (68) to be processed are located on the convex side of the shield, which faces in the wake direction in operation in orbit. Necessary processing fixtures (20) and (22) are also located on the convex side. Support equipment including power supplies (40, 42), CMG package (46) and electronic control package (44) are located on the convex side (24) of the shield facing the ram direction. Prior to operation in orbit the wake shield is oriented in reverse with the convex side facing the ram direction to provide cleaning by exposure to ambient atomic oxygen. The shield is then baked-out by being pointed directed at the sun to obtain heating for a suitable period.

Relevance of nanocomposite packaging on the stability of vacuum-packed dry cured ham.

PubMed

Lloret, Elsa; Fernandez, Avelina; Trbojevich, Raul; Arnau, Jacint; Picouet, Pierre A

2016-08-01

In this study effects of a novel high barrier multilayer polyamide film containing dispersed nanoclays (PAN) on the stability of vacuum packed dry-cured ham were investigated during 90days refrigerated storage in comparison with non-modified multilayer polyamide (PA) and a commercial high barrier film. Characteristic bands of the mineral in FT-IR spectra confirmed the presence of nanoclays in PAN, enhancing oxygen transmission barrier properties and UV protection. Packaging in PAN films did not originate significant changes on colour or lipid oxidation during prolonged storage of vacuum-packed dry-cured ham. Larger oxygen transmission rates in PA films caused changes in CIE b* during refrigerated storage. Ham quality was not affected by light exposition during 90days and only curing had a significant benefit on colour and TBARS, being cured samples more stable during storage in all the packages used. Packaging of dry-cured ham in PAN was equivalent to commercial high barrier films. Copyright © 2016 Elsevier Ltd. All rights reserved.

Eutectic-based wafer-level-packaging technique for piezoresistive MEMS accelerometers and bond characterization using molecular dynamics simulations

NASA Astrophysics Data System (ADS)

Aono, T.; Kazama, A.; Okada, R.; Iwasaki, T.; Isono, Y.

2018-03-01

We developed a eutectic-based wafer-level-packaging (WLP) technique for piezoresistive micro-electromechanical systems (MEMS) accelerometers on the basis of molecular dynamics analyses and shear tests of WLP accelerometers. The bonding conditions were experimentally and analytically determined to realize a high shear strength without solder material atoms diffusing to adhesion layers. Molecular dynamics (MD) simulations and energy dispersive x-ray (EDX) spectrometry done after the shear tests clarified the eutectic reaction of the solder materials used in this research. Energy relaxation calculations in MD showed that the diffusion of solder material atoms into the adhesive layer was promoted at a higher temperature. Tensile creep MD simulations also suggested that the local potential energy in a solder material model determined the fracture points of the model. These numerical results were supported by the shear tests and EDX analyses for WLP accelerometers. Consequently, a bonding load of 9.8 kN and temperature of 300 °C were found to be rational conditions because the shear strength was sufficient to endure the polishing process after the WLP process and there was little diffusion of solder material atoms to the adhesion layer. Also, eutectic-bonding-based WLP was effective for controlling the attenuation of the accelerometers by determining the thickness of electroplated solder materials that played the role of a cavity between the accelerometers and lids. If the gap distance between the two was less than 6.2 µm, the signal gains for x- and z-axis acceleration were less than 20 dB even at the resonance frequency due to air-damping.

Vacuum decay container/closure integrity testing technology. Part 2. Comparison to dye ingress tests.

PubMed

Wolf, Heinz; Stauffer, Tony; Chen, Shu-Chen Y; Lee, Yoojin; Forster, Ronald; Ludzinski, Miron; Kamat, Madhav; Mulhall, Brian; Guazzo, Dana Morton

2009-01-01

Part 1 of this series demonstrated that a container closure integrity test performed according to ASTM F2338-09 Standard Test Method for Nondestructive Detection of Leaks in Packages by Vacuum Decay Method using a VeriPac 325/LV vacuum decay leak tester by Packaging Technologies & Inspection, LLC (PTI) is capable of detecting leaks > or = 5.0 microm (nominal diameter) in rigid, nonporous package systems, such as prefilled glass syringes. The current study compared USP, Ph.Eur. and ISO dye ingress integrity test methods to PTI's vacuum decay technology for the detection of these same 5-, 10-, and 15-microm laser-drilled hole defects in 1-mL glass prefilled syringes. The study was performed at three test sites using several inspectors and a variety of inspection conditions. No standard dye ingress method was found to reliably identify all holed syringes. Modifications to these standard dye tests' challenge conditions increased the potential for dye ingress, and adjustments to the visual inspection environment improved dye ingress detection. However, the risk of false positive test results with dye ingress tests remained. In contrast, the nondestructive vacuum decay leak test method reliably identified syringes with holes > or = 5.0 microm.

Terahertz Array Receivers with Integrated Antennas

NASA Technical Reports Server (NTRS)

Chattopadhyay, Goutam; Llombart, Nuria; Lee, Choonsup; Jung, Cecile; Lin, Robert; Cooper, Ken B.; Reck, Theodore; Siles, Jose; Schlecht, Erich; Peralta, Alessandro;

Modified Atmosphere Packaging and Its Feasibility for Military Feeding Systems

DTIC Science & Technology

1994-12-01

must be taken in all food processing . There are special precautions for NAP foods because a MAP food will not be sterilized and contamination or...Food Engineering. October: 62-63. 3 Rice, J., 1989. Modified Atmosphere Packaging. Food Processing . March: 60-76. 4 Coulon, M., and P. Louis, 1989...Prepared Foods. May:131. 9 Rice, J., 1989. Gas-Emitting Wafers: A Cost Effective NAP Approach. Food Processing . September:42. 10 Rice, J., 1991

Drosophila as an unconventional substrate for microfabrication

NASA Astrophysics Data System (ADS)

Shum, Angela J.; Parviz, Babak A.

2007-02-01

We present the application of Drosophila fruit flies as an unconventional substrate for microfabrication. Drosophila by itself represents a complex system capable of many functions not attainable with current microfabrication technology. By using Drosophila as a substrate, we are able to capitalize on these natural functions while incorporating additional functionality into a superior hybrid system. In the following, development of microfabrication processes for Drosophila substrates is discussed. In particular, results of a study on Drosophila tolerance to vacuum pressure during multiple stages of development are given. A remarkable finding that adult Drosophila may withstand up to 3 hours of exposure to vacuum with measurable survival is noted. This finding opens a number of new opportunities for performing fabrication processes, similar to the ones performed on a silicon wafer, on a fruit fly as a live substrate. As a model microfabrication process, it is shown how a collection of Drosophila can be made to self-assemble into an array of microfabricated recesses on a silicon wafer and how a shadow mask can be used to thermally evaporate 100 nm of indium on flies. The procedure resulted in the production of a number of live flies with a pre-designed metal micropattern on their wings. This demonstration of vacuum microfabrication on a live organism provides the first step towards the development of a hybrid biological/solid-state manufacturing process for complex microsystems.

Nitrite spray treatment to promote red color stability of vacuum packaged beef.

PubMed

Song, Xiao; Cornforth, Daren; Whittier, Dick; Luo, Xin

2015-01-01

Sodium nitrite solutions were sprayed on select grade boneless rib (M. longissimus thoracis) and bottom round (mainly M. biceps femoris) steaks individually, to form bright red nitric oxide myoglobin (NO-Mb) in vacuum packages. Our objective was to determine the optimum level of nitrite in spray for stable raw steak redness, low or no residual nitrite, and low surface pinking (ham-like cured color) after cooking. Results showed that steaks sprayed with 100-350 ppm nitrite solutions had 3.0-3.6g weight gain and a calculated level of 1.3-5.3mg nitrite added/kg steak, but very low (<1 ppm) residual nitrite. Nitrite sprays of 250-350 ppm were optimum for raw steak color during 21 days of storage at 1°C (a*>10; chroma C*>16). Raw steak redness was less stable in round than rib. Visual scores for pinkness after cooking were low, indicating that cooked color at even the highest nitrite treatment (350 ppm) was acceptable. Copyright © 2014 Elsevier Ltd. All rights reserved.

Moisture Adsorption Isotherm and Storability of Hazelnut Inshells and Kernels Produced in Oregon, USA.

PubMed

Jung, Jooyeoun; Wang, Wenjie; McGorrin, Robert J; Zhao, Yanyun

2018-02-01

Moisture adsorption isotherms and storability of dried hazelnut inshells and kernels produced in Oregon were evaluated and compared among cultivars, including Barcelona, Yamhill, and Jefferson. Experimental moisture adsorption data fitted to Guggenheim-Anderson-de Boer (GAB) model, showing less hygroscopic properties in Yamhill than other cultivars of inshells and kernels due to lower content of carbohydrate and protein, but higher content of fat. The safe levels of moisture content (MC, dry basis) of dried inshells and kernels for reaching kernel water activity (a w ) ≤0.65 were estimated using the GAB model as 11.3% and 5.0% for Barcelona, 9.4% and 4.2% for Yamhill, and 10.7% and 4.9% for Jefferson, respectively. Storage conditions (2 °C at 85% to 95% relative humidity [RH], 10 °C at 65% to 75% RH, and 27 °C at 35% to 45% RH), times (0, 4, 8, or 12 mo), and packaging methods (atmosphere vs. vacuum) affected MC, a w , bioactive compounds, lipid oxidation, and enzyme activity of dried hazelnut inshells or kernels. For inshells packaged at woven polypropylene bag, MC and a w of inshells and kernels (inside shells) increased at 2 and 10 °C, but decreased at 27 °C during storage. For kernels, lipid oxidation and polyphenol oxidase activity also increased with extended storage time (P < 0.05), and MC and a w of vacuum packaged samples were more stable during storage than those atmospherically packaged ones. Principal component analysis showed correlation of kernel qualities with storage condition, time, and packaging method. This study demonstrated that the ideal storage condition or packaging method varied among cultivars due to their different moisture adsorption and physicochemical and enzymatic stability during storage. Moisture adsorption isotherm of hazelnut inshells and kernels is useful for predicting the storability of nuts. This study found that water adsorption and storability varied among the different cultivars of nuts, in which Yamhill was less hygroscopic than Barcelona and Jefferson, thus more stable during storage. For ensuring food safety and quality of nuts during storage, each cultivar of kernels should be dried to a certain level of MC. Lipid oxidation and enzyme activity of kernel could be increased with extended storage time. Vacuum packaging was recommended to kernels for reducing moisture adsorption during storage. © 2018 Institute of Food Technologists®.

Soft x-ray spectroscopy of high pressure liquid.

PubMed

Qiao, Ruimin; Xia, Yujian; Feng, Xuefei; Macdougall, James; Pepper, John; Armitage, Kevin; Borsos, Jason; Knauss, Kevin G; Lee, Namhey; Allézy, Arnaud; Gilbert, Benjamin; MacDowell, Alastair A; Liu, Yi-Sheng; Glans, Per-Anders; Sun, Xuhui; Chao, Weilun; Guo, Jinghua

2018-01-01

We describe a new experimental technique that allows for soft x-ray spectroscopy studies (∼100-1000 eV) of high pressure liquid (∼100 bars). We achieve this through a liquid cell with a 100 nm-thick Si 3 N 4 membrane window, which is sandwiched by two identical O-rings for vacuum sealing. The thin Si 3 N 4 membrane allows soft x-rays to penetrate, while separating the high-pressure liquid under investigation from the vacuum required for soft x-ray transmission and detection. The burst pressure of the Si 3 N 4 membrane increases with decreasing size and more specifically is inversely proportional to the side length of the square window. It also increases proportionally with the membrane thickness. Pressures > 60 bars could be achieved for 100 nm-thick square Si 3 N 4 windows that are smaller than 65 μm. However, above a certain pressure, the failure of the Si wafer becomes the limiting factor. The failure pressure of the Si wafer is sensitive to the wafer thickness. Moreover, the deformation of the Si 3 N 4 membrane is quantified using vertical scanning interferometry. As an example of the performance of the high-pressure liquid cell optimized for total-fluorescence detected soft x-ray absorption spectroscopy (sXAS), the sXAS spectra at the Ca L edge (∼350 eV) of a CaCl 2 aqueous solution are collected under different pressures up to 41 bars.

Soft x-ray spectroscopy of high pressure liquid

DOE PAGES

Qiao, Ruimin; Xia, Yujian; Feng, Xuefei; ...

2018-01-01

Here, we describe a new experimental technique that allows for soft x-ray spectroscopy studies (~100-1000 eV) of high pressure liquid (~100 bars). We achieve this through a liquid cell with a 100 nm-thick Si 3N 4 membrane window, which is sandwiched by two identical O-rings for vacuum sealing. The thin Si 3N 4 membrane allows soft x-rays to penetrate, while separating the high-pressure liquid under investigation from the vacuum required for soft x-ray transmission and detection. The burst pressure of the Si 3N 4 membrane increases with decreasing size and more specifically is inversely proportional to the side length ofmore » the square window. It also increases proportionally with the membrane thickness. Pressures > 60 bars could be achieved for 100 nm-thick square Si 3N 4 windows that are smaller than 65 μm. However, above a certain pressure, the failure of the Si wafer becomes the limiting factor. The failure pressure of the Si wafer is sensitive to the wafer thickness. Moreover, the deformation of the Si 3N 4 membrane is quantified using vertical scanning interferometry. As an example of the performance of the high-pressure liquid cell optimized for total-fluorescence detected soft x-ray absorption spectroscopy (sXAS), the sXAS spectra at the Ca L edge (~350 eV) of a CaCl 2 aqueous solution are collected under different pressures up to 41 bars.« less

Soft x-ray spectroscopy of high pressure liquid

DOE Office of Scientific and Technical Information (OSTI.GOV)

Qiao, Ruimin; Xia, Yujian; Feng, Xuefei

Here, we describe a new experimental technique that allows for soft x-ray spectroscopy studies (~100-1000 eV) of high pressure liquid (~100 bars). We achieve this through a liquid cell with a 100 nm-thick Si 3N 4 membrane window, which is sandwiched by two identical O-rings for vacuum sealing. The thin Si 3N 4 membrane allows soft x-rays to penetrate, while separating the high-pressure liquid under investigation from the vacuum required for soft x-ray transmission and detection. The burst pressure of the Si 3N 4 membrane increases with decreasing size and more specifically is inversely proportional to the side length ofmore » the square window. It also increases proportionally with the membrane thickness. Pressures > 60 bars could be achieved for 100 nm-thick square Si 3N 4 windows that are smaller than 65 μm. However, above a certain pressure, the failure of the Si wafer becomes the limiting factor. The failure pressure of the Si wafer is sensitive to the wafer thickness. Moreover, the deformation of the Si 3N 4 membrane is quantified using vertical scanning interferometry. As an example of the performance of the high-pressure liquid cell optimized for total-fluorescence detected soft x-ray absorption spectroscopy (sXAS), the sXAS spectra at the Ca L edge (~350 eV) of a CaCl 2 aqueous solution are collected under different pressures up to 41 bars.« less

Embossed Teflon AF Laminate Membrane Microfluidic Diaphragm Valves

NASA Technical Reports Server (NTRS)

Willis, Peter; Hunt, Brian; White,Victor; Grunthaner, Frank

2008-01-01

A microfluidic system has been designed to survive spaceflight and to function autonomously on the Martian surface. It manipulates microscopic quantities of liquid water and performs chemical analyses on these samples to assay for the presence of molecules associated with past or present living processes. This technology lies at the core of the Urey Instrument, which is scheduled for inclusion on the Pasteur Payload of the ESA ExoMars rover mission in 2013. Fabrication processes have been developed to make the microfabricated Teflon-AF microfluidic diaphragm pumps capable of surviving extreme temperature excursions before and after exposure to liquid water. Two glass wafers are etched with features and a continuous Teflon membrane is sandwiched between them (see figure). Single valves are constructed using this geometry. The microfabricated devices are then post processed by heating the assembled device while applying pneumatic pressure to force the Teflon diaphragm against the valve seat while it is softened. After cooling the device, the embossed membrane retains this new shape. This solves previous problems with bubble introduction into the fluid flow where deformations of the membrane at the valve seat occurred during device bonding at elevated temperatures (100-150 C). The use of laminated membranes containing commercial Teflon AF 2400 sheet sandwiched between spun Teflon AF 1600 layers performed best, and were less gas permeable than Teflon AF 1600 membranes on their own. Spinning Teflon AF 1600 solution (6 percent in FLOURINERT(Registered TradeMark) FC40 solvent, 3M Company) at 500 rpm for 1.5 seconds, followed by 1,000 rpm for 3 seconds onto Borofloat glass wafers, results in a 10-micron-thick film of extremely smooth Teflon AF. This spinning process is repeated several times on flat, blank, glass wafers in order to gradually build a thick, smooth membrane. After running this process at least five times, the wafer and Teflon coating are heated under vacuum at 220 C for one hour in order to drive off any residual solvent present in the composite film. After this, a second blank, glass wafer is brought down from above and the stack is held under vacuum at 3 atm mechanical pressure for ten 10 hours.

Mechanical Design and Development of TES Bolometer Detector Arrays for the Advanced ACTPol Experiment

NASA Technical Reports Server (NTRS)

Ward, Jonathan T.; Austermann, Jason; Beall, James A.; Choi, Steve K.; Crowley, Kevin T.; Devlin, Mark J.; Duff, Shannon M.; Gallardo, Patricio M.; Henderson, Shawn W.; Ho, Shuay-Pwu Patty;

Mechanical designs and development of TES bolometer detector arrays for the Advanced ACTPol experiment

NASA Astrophysics Data System (ADS)

Ward, Jonathan T.; Austermann, Jason; Beall, James A.; Choi, Steve K.; Crowley, Kevin T.; Devlin, Mark J.; Duff, Shannon M.; Gallardo, Patricio A.; Henderson, Shawn W.; Ho, Shuay-Pwu Patty; Hilton, Gene; Hubmayr, Johannes; Khavari, Niloufar; Klein, Jeffrey; Koopman, Brian J.; Li, Dale; McMahon, Jeffrey; Mumby, Grace; Nati, Federico; Niemack, Michael D.; Page, Lyman A.; Salatino, Maria; Schillaci, Alessandro; Schmitt, Benjamin L.; Simon, Sara M.; Staggs, Suzanne T.; Thornton, Robert; Ullom, Joel N.; Vavagiakis, Eve M.; Wollack, Edward J.

2016-07-01

The next generation Advanced ACTPol (AdvACT) experiment is currently underway and will consist of four Transition Edge Sensor (TES) bolometer arrays, with three operating together, totaling 5800 detectors on the sky. Building on experience gained with the ACTPol detector arrays, AdvACT will utilize various new technologies, including 150 mm detector wafers equipped with multichroic pixels, allowing for a more densely packed focal plane. Each set of detectors includes a feedhorn array of stacked silicon wafers which form a spline profile leading to each pixel. This is then followed by a waveguide interface plate, detector wafer, back short cavity plate, and backshort cap. Each array is housed in a custom designed structure manufactured from high purity copper and then gold plated. In addition to the detector array assembly, the array package also encloses cryogenic readout electronics. We present the full mechanical design of the AdvACT high frequency (HF) detector array package along with a detailed look at the detector array stack assemblies. This experiment will also make use of extensive hardware and software previously developed for ACT, which will be modified to incorporate the new AdvACT instruments. Therefore, we discuss the integration of all AdvACT arrays with pre-existing ACTPol infrastructure.

Color, lipid oxidation, sensory quality, and aroma compounds of beef steaks displayed under different levels of oxygen in a modified atmosphere package.

PubMed

Resconi, Virginia Celia; Escudero, Ana; Beltrán, José Antonio; Olleta, José Luis; Sañudo, Carlos; Campo, María del Mar

2012-01-01

High oxygen modified atmosphere packaging (MAP) is currently used by the industry to maintain an attractive color in fresh meat. However, it can also promote lipid oxidation and sensory changes. The aim of this study was to compare the quality of beef steaks displayed under different levels of oxygen. For that purpose, meat was stored with 50%, 60%, and 80% of oxygen for 4 and 8 d at retail conditions. A control treatment with steaks vacuum packaged, without exposure to retail display, was included, and color, lipid oxidation, organoleptic characteristics, and aroma compounds were analyzed. Steaks displayed under high oxygen MAP with 50% of oxygen showed the lowest color stability, according to hue values. Higher oxygen levels did not necessarily correspond with higher rancidity levels in the raw meat. Thiobarbituric Acid Reacting Substances (TBARS) values were higher than 2.2 mg malonaldehyde (MDA)/kg muscle in all the samples displayed for 8 d at retail conditions. These samples exhibited the highest intensities of rancid and the least intense beef odors and flavors. The ketones: 2,3-butanedione, 2-octanone, 2,3-pentanedione, 2-heptanone, 4-methyl-2-pentanone, and the aldehydes: pentanal, 2-methyl-butanal, and 2-furfurylthiol, 1-octen-3-ol and 2-methylpropyl-acetate, were proposed as candidates for the aroma differences between the cooked beef steaks stored under vacuum and high oxygen packs. High oxygen modified atmosphere packaging (MAP) is used to increase shelf-life and color at the retail level. However, oxygen deteriorates faster some quality attributes, being a contributor to lipid oxidation that could be perceived at consumption. This study attempts to find the best gas composition in a MAP in order to maintain the color, minimizing the oxidation. Aromatically relevant chemicals have been analyzed by gas olfactometry-gas chromatography as a key to measure beef oxidation after display. © 2011 Institute of Food Technologists®

How to Build a Vacuum Spring-transport Package for Spinning Rotor Gauges

PubMed Central

Fedchak, James A.; Scherschligt, Julia; Sefa, Makfir

2016-01-01

The spinning rotor gauge (SRG) is a high-vacuum gauge often used as a secondary or transfer standard for vacuum pressures in the range of 1.0 x 10-4 Pa to 1.0 Pa. In this application, the SRGs are frequently transported to laboratories for calibration. Events can occur during transportation that change the rotor surface conditions, thus changing the calibration factor. To assure calibration stability, a spring-transport mechanism is often used to immobilize the rotor and keep it under vacuum during transport. It is also important to transport the spring-transport mechanism using packaging designed to minimize the risk of damage during shipping. In this manuscript, a detailed description is given on how to build a robust spring-transport mechanism and shipping container. Together these form a spring-transport package. The spring-transport package design was tested using drop-tests and the performance was found to be excellent. The present spring-transport mechanism design keeps the rotor immobilized when experiencing shocks of several hundred g (g = 9.8 m/sec2 and is the acceleration due to gravity), while the shipping container assures that the mechanism will not experience shocks greater than about 100 g during common shipping mishaps (as defined by industry standards). PMID:27078575

Effect of age of cook-in-bag delicatessen meats formulated with lactate-diacetate on the behavior of Listeria monocytogenes contamination introduced when opening the packages during storage.

PubMed

Geornaras, Ifigenia; Toczko, Darren; Sofos, John N

2013-07-01

This study evaluated the potential effect of age of cook-in-bag ham and turkey breast delicatessen meats formulated with lactate-diacetate on survival and/or growth of Listeria monocytogenes introduced after opening of packages and slicing of product. Commercially prepared cured ham and turkey breast products formulated with potassium lactate and sodium diacetate were stored at 1.7°C unsliced, in their original cook-in-bags, and without postlethality exposure. On days 5, 90, 120, and 180 of storage, product slices (10.2 by 7.6 cm) were surface inoculated (1 to 2 log CFU/cm²) with a 10-strain mixture of L. monocytogenes, vacuum packaged (seven slices per bag), and stored at 4°C for up to 13 weeks. Inoculated levels of L. monocytogenes on both products were 1.4 to 1.5 log CFU/cm². Irrespective of product age at slicing and inoculation, after 13 weeks of vacuum-packaged storage (4°C), pathogen counts on product slices were 1.5 to 2.3 (ham) and 2.3 to 2.5 (turkey) log CFU/cm². Overall, the results of the study showed that the age of the cook-in-bag products prior to slicing and inoculation with the pathogen did not (P ≥ 0.05) affect the behavior of L. monocytogenes during vacuum-packaged storage (4°C, up to 13 weeks) of ham and turkey slices. Mean counts of lactic acid bacteria and yeasts and molds, when detected, did not exceed approximately 1 and 2 log CFU/cm², respectively, among all stored samples. Findings of the study will be useful to the meat industry and risk assessors in their efforts to control L. monocytogenes in ready-to-eat meat products.

Vacuum decay container closure integrity leak test method development and validation for a lyophilized product-package system.

PubMed

Patel, Jayshree; Mulhall, Brian; Wolf, Heinz; Klohr, Steven; Guazzo, Dana Morton

2011-01-01

A leak test performed according to ASTM F2338-09 Standard Test Method for Nondestructive Detection of Leaks in Packages by Vacuum Decay Method was developed and validated for container-closure integrity verification of a lyophilized product in a parenteral vial package system. This nondestructive leak test method is intended for use in manufacturing as an in-process package integrity check, and for testing product stored on stability in lieu of sterility tests. Method development and optimization challenge studies incorporated artificially defective packages representing a range of glass vial wall and sealing surface defects, as well as various elastomeric stopper defects. Method validation required 3 days of random-order replicate testing of a test sample population of negative-control, no-defect packages and positive-control, with-defect packages. Positive-control packages were prepared using vials each with a single hole laser-drilled through the glass vial wall. Hole creation and hole size certification was performed by Lenox Laser. Validation study results successfully demonstrated the vacuum decay leak test method's ability to accurately and reliably detect those packages with laser-drilled holes greater than or equal to approximately 5 μm in nominal diameter. All development and validation studies were performed at Whitehouse Analytical Laboratories in Whitehouse, NJ, under the direction of consultant Dana Guazzo of RxPax, LLC, using a VeriPac 455 Micro Leak Test System by Packaging Technologies & Inspection (Tuckahoe, NY). Bristol Myers Squibb (New Brunswick, NJ) fully subsidized all work. A leak test performed according to ASTM F2338-09 Standard Test Method for Nondestructive Detection of Leaks in Packages by Vacuum Decay Method was developed and validated to detect defects in stoppered vial packages containing lyophilized product for injection. This nondestructive leak test method is intended for use in manufacturing as an in-process package integrity check, and for testing product stored on stability in lieu of sterility tests. Test method validation study results proved the method capable of detecting holes laser-drilled through the glass vial wall greater than or equal to 5 μm in nominal diameter. Total test time is less than 1 min per package. All method development and validation studies were performed at Whitehouse Analytical Laboratories in Whitehouse, NJ, under the direction of consultant Dana Guazzo of RxPax, LLC, using a VeriPac 455 Micro Leak Test System by Packaging Technologies & Inspection (Tuckahoe, NY). Bristol Myers Squibb (New Brunswick, NJ) fully subsidized all work.

Design, processing and testing of LSI arrays: Hybrid microelectronics task

NASA Technical Reports Server (NTRS)

Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.

1979-01-01

Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.

Instructions for Plastic Encapsulated Microcircuit(PEM) Selection, Screening and Qualification.

NASA Technical Reports Server (NTRS)

King, Terry; Teverovsky, Alexander; Leidecker, Henning

2002-01-01

The use of Plastic Encapsulated Microcircuits (PEMs) is permitted on NASA Goddard Space Flight Center (GSFC) spaceflight applications, provided each use is thoroughly evaluated for thermal, mechanical, and radiation implications of the specific application and found to meet mission requirements. PEMs shall be selected for their functional advantage and availability, not for cost saving; the steps necessary to ensure reliability usually negate any initial apparent cost advantage. A PEM shall not be substituted for a form, fit and functional equivalent, high reliability, hermetic device in spaceflight applications. Due to the rapid change in wafer-level designs typical of commercial parts and the unknown traceability between packaging lots and wafer lots, lot specific testing is required for PEMs, unless specifically excepted by the Mission Assurance Requirements (MAR) for the project. Lot specific qualification, screening, radiation hardness assurance analysis and/or testing, shall be consistent with the required reliability level as defined in the MAR. Developers proposing to use PEMs shall address the following items in their Performance Assurance Implementation Plan: source selection (manufacturers and distributors), storage conditions for all stages of use, packing, shipping and handling, electrostatic discharge (ESD), screening and qualification testing, derating, radiation hardness assurance, test house selection and control, data collection and retention.

Radiation sensitivity of foodborne pathogens in meat byproducts with different packaging

NASA Astrophysics Data System (ADS)

Yong, Hae In; Kim, Hyun-Joo; Nam, Ki Chang; Kwon, Joong Ho; Jo, Cheorun

2015-10-01

The aim of this study was to determine radiation sensitivity of Escherichia coli O157:H7 and Listeria monocytogenes in edible meat byproducts. Seven beef byproducts (heart, liver, lung, lumen, omasum, large intestine, and small intestine) and four pork byproducts (heart, large intestine, liver, and small intestine) were used. Electron beam irradiation significantly reduced the numbers of pathogenic microorganisms in meat byproducts and no viable cells were detected in both aerobically- and vacuum-packaged samples irradiated at 4 kGy. Meat byproducts packed under vacuum had higher D10 value than the ones packed aerobically. No significant difference was observed between the D10 values of E. coli O157:H7 and L. monocytogenes inoculated in either aerobically or vacuum packaged samples. These results suggest that low-dose electron beam irradiation can significantly decrease microbial numbers and reduce the risk of meat byproduct contamination by the foodborne pathogens.

Protoflight photovoltaic power module system-level tests in the space power facility

NASA Technical Reports Server (NTRS)

Rivera, Juan C.; Kirch, Luke A.

1989-01-01

Work Package Four, which includes the NASA-Lewis and Rocketdyne, has selected an approach for the Space Station Freedom Photovoltaic (PV) Power Module flight certification that combines system level qualification and acceptance testing in the thermal vacuum environment: The protoflight vehicle approach. This approach maximizes ground test verification to assure system level performance and to minimize risk of on-orbit failures. The preliminary plans for system level thermal vacuum environmental testing of the protoflight PV Power Module in the NASA-Lewis Space Power Facility (SPF), are addressed. Details of the facility modifications to refurbish SPF, after 13 years of downtime, are briefly discussed. The results of an evaluation of the effectiveness of system level environmental testing in screening out incipient part and workmanship defects and unique failure modes are discussed. Preliminary test objectives, test hardware configurations, test support equipment, and operations are presented.

Formation of biogenic amines and growth of spoilage-related microorganisms in pork stored under different packaging conditions applying PCA.

PubMed

Li, Miaoyun; Tian, Lu; Zhao, Gaiming; Zhang, Qiuhui; Gao, Xiaoping; Huang, Xianqing; Sun, Lingxia

2014-02-01

The objective of this study was to investigate the evolution of biogenic amines and spoilage-related microorganisms of chilled pork stored at 5 °C under various atmospheric conditions. The experimental packaging systems were pallet packaging, vacuum packaging (VP) and modified atmosphere packaging methods (MAP, 40%O2+40%CO2+20%N2), respectively. The results showed that about 74.26% of the variability could be explained by two first principal components analyzed by PCA in the pallet packaging, while in the vacuum and modified atmosphere packagings were about 85.21% and 79.14%, respectively. PC1 differentiated the indicators from packaging conditions. All the five microbial indicators and partial biogenic amines, gathering together, had high values at the positive side of PC1. Putrescine and cadaverine could reflect the spoilage evolution of fresh pork except for those in the pallet. Therefore, putrescine and cadaverine could be used as the spoilage indicators of chilled pork, of which the contents might reflect the spoilage degree. © 2013.

Getting small: new 10μm pixel pitch cooled infrared products

NASA Astrophysics Data System (ADS)

Reibel, Y.; Pere-Laperne, N.; Augey, T.; Rubaldo, L.; Decaens, G.; Bourqui, M.-L.; Manissadjian, A.; Billon-Lanfrey, D.; Bisotto, S.; Gravrand, O.; Destefanis, G.; Druart, G.; Guerineau, N.

2014-06-01

Recent advances in miniaturization of IR imaging technology have led to a burgeoning market for mini thermalimaging sensors. Seen in this context our development on smaller pixel pitch has opened the door to very compact products. When this competitive advantage is mixed with smaller coolers, thanks to HOT technology, we achieve valuable reductions in size, weight and power of the overall package. In the same time, we are moving towards a global offer based on digital interfaces that provides our customers lower power consumption and simplification on the IR system design process while freeing up more space. Additionally, we are also investigating new wafer level camera solution taking advantage of the progress in micro-optics. This paper discusses recent developments on hot and small pixel pitch technologies as well as efforts made on compact packaging solution developed by SOFRADIR in collaboration with CEA-LETI and ONERA.

Full-wafer fabrication by nanostencil lithography of micro/nanomechanical mass sensors monolithically integrated with CMOS.

PubMed

Arcamone, J; van den Boogaart, M A F; Serra-Graells, F; Fraxedas, J; Brugger, J; Pérez-Murano, F

2008-07-30

Wafer-scale nanostencil lithography (nSL) is used to define several types of silicon mechanical resonators, whose dimensions range from 20 µm down to 200 nm, monolithically integrated with CMOS circuits. We demonstrate the simultaneous patterning by nSL of ∼2000 nanodevices per wafer by post-processing standard CMOS substrates using one single metal evaporation, pattern transfer to silicon and subsequent etch of the sacrificial layer. Resonance frequencies in the MHz range were measured in air and vacuum. As proof-of-concept towards an application as high performance sensors, CMOS integrated nano/micromechanical resonators are successfully implemented as ultra-sensitive areal mass sensors. These devices demonstrate the ability to monitor the deposition of gold layers whose average thickness is smaller than a monolayer. Their areal mass sensitivity is in the range of 10(-11) g cm(-2) Hz(-1), and their thickness resolution corresponds to approximately a thousandth of a monolayer.

Modified-atmosphere storage under subatmospheric pressure and beef quality: II. Color, drip, cooking loss, sarcomere length, and tenderness.

PubMed

Smulders, F J M; Hiesberger, J; Hofbauer, P; Dögl, B; Dransfield, E

2006-09-01

Beef has a requirement for refrigerated storage up to 14 d to achieve adequate aging and a tender product. To achieve this aging with little spoilage and no surface drying, vacuum packaging is attractive, because it is inherently simple and offers a clear indication to the packer when the process has failed or there is risk of spoilage. However, there is increasing pressure on the meat industry to limit the use of packaging materials in view of their cost and the cost involved in their recovery and recycling. The purpose of this report was to evaluate an alternative storage system in containers using modified atmospheres at reduced pressure (approximately 25 kPa). The quality of the meat for both container- and vacuum-packed treatments was measured during chilled storage for up to 3 wk. Storage time had the most significant effect on quality characteristics, irrespective of the packaging method. Storage in containers under a 70%N2:30%CO2 gas mixture gave characteristics similar to beef stored under vacuum. Storage in containers under 100% CO2 produced less drip loss than under 70%N2:30%CO2, but generally container storage produced 3 times as much drip loss as vacuum packaging. Shear force of the LM was unaffected by the type of packaging, and at d 2 after slaughter (i.e., before the storage trial was begun), sarcomere lengths of muscles intended for container storage were similar to those destined for vacuum storage. During the packaging treatment, the comparison between the storage systems was always done within 1 animal using one carcass-half for container storage and the other half for vacuum packaging; all bulls were shackled from the left hindleg during bleeding. The majority of the muscles from the left sides had lower shear force values than those from the right sides at the earlier storage times (2 and 9 d after slaughter) but had similar values after longer storage (16 and 23 d after slaughter). This is the first report that shackling beef carcasses from the left side can result in more tender meat in the LM from that side. The increased tenderness in the LM from the shackled side probably resulted from an early decrease in pH and an increase in calpain activity after mechanical strain of the muscles on the shackled side. This effect of shackling should be taken into account when designing systematic comparisons of tenderness in beef.

Micro-machined resonator oscillator

DOEpatents

Koehler, D.R.; Sniegowski, J.J.; Bivens, H.M.; Wessendorf, K.O.

1994-08-16

A micro-miniature resonator-oscillator is disclosed. Due to the miniaturization of the resonator-oscillator, oscillation frequencies of one MHz and higher are utilized. A thickness-mode quartz resonator housed in a micro-machined silicon package and operated as a telemetered sensor beacon'' that is, a digital, self-powered, remote, parameter measuring-transmitter in the FM-band. The resonator design uses trapped energy principles and temperature dependence methodology through crystal orientation control, with operation in the 20--100 MHz range. High volume batch-processing manufacturing is utilized, with package and resonator assembly at the wafer level. Unique design features include squeeze-film damping for robust vibration and shock performance, capacitive coupling through micro-machined diaphragms allowing resonator excitation at the package exterior, circuit integration and extremely small (0.1 in. square) dimensioning. A family of micro-miniature sensor beacons is also disclosed with widespread applications as bio-medical sensors, vehicle status monitors and high-volume animal identification and health sensors. The sensor family allows measurement of temperatures, chemicals, acceleration and pressure. A microphone and clock realization is also available. 21 figs.

Magnetically Suspended Linear Pulse Motor for Semiconductor Wafer Transfer in Vacuum Chamber

NASA Technical Reports Server (NTRS)

Moriyama, Shin-Ichi; Hiraki, Naoji; Watanabe, Katsuhide; Kanemitsu, Yoichi

1996-01-01

This paper describes a magnetically suspended linear pulse motor for a semiconductor wafer transfer robot in a vacuum chamber. The motor can drive a wafer transfer arm horizontally without mechanical contact. In the construction of the magnetic suspension system, four pairs of linear magnetic bearings for the lift control are used for the guidance control as well. This approach allows us to make the whole motor compact in size and light in weight. The tested motor consists of a double-sided stator and a transfer arm with a width of 50 mm and a total length of 700 mm. The arm, like a ladder in shape, is designed as the floating element with a tooth width of 4 mm (a tooth pitch of 8 mm). The mover mass is limited to about 1.6 kg by adopting such an arm structure, and the ratio of thrust to mover mass reaches to 3.2 N/kg under a broad air gap (1 mm) between the stator teeth and the mover teeth. The performance testing was carried out with a transfer distance less than 450 mm and a transfer speed less than 560 mm/s. The attitude of the arm was well controlled by the linear magnetic bearings with a combined use, and consequently the repeatability on the positioning of the arm reached to about 2 micron. In addition, the positioning accuracy was improved up to about 30 micron through a compensation of the 128-step wave current which was used for the micro-step drive with a step increment of 62.5 micron.

Wafer level reliability testing: An idea whose time has come

NASA Technical Reports Server (NTRS)

Trapp, O. D.

1987-01-01

Wafer level reliability testing has been nurtured in the DARPA supported workshops, held each autumn since 1982. The seeds planted in 1982 have produced an active crop of very large scale integration manufacturers applying wafer level reliability test methods. Computer Aided Reliability (CAR) is a new seed being nurtured. Users are now being awakened by the huge economic value of the wafer reliability testing technology.

Apparatus and Method for Cold Welding Thin Wafers to Hard Substrates

NASA Technical Reports Server (NTRS)

Oeftering, Richard C. (Inventor); Smith, Floyd A. (Inventor)

1996-01-01

An apparatus for coating and bonding parts in a vacuum includes a floating mount assembly holding one part and applying a bonding load to the parts. A pivoting mount assembly holds one part and is pivoted between a coating position and a bonding position. At least one coating source is provided for depositing a thin film of a metal onto a surface of each of the parts to improve the cold weld between the two parts. A restraining lever controls the application of the bonding load to the parts. The coating and bonding process occurs in a vacuum chamber with a single set-up.

Beneficial defects: exploiting the intrinsic polishing-induced wafer roughness for the catalyst-free growth of Ge in-plane nanowires.

PubMed

Persichetti, Luca; Sgarlata, Anna; Mori, Stefano; Notarianni, Marco; Cherubini, Valeria; Fanfoni, Massimo; Motta, Nunzio; Balzarotti, Adalberto

2014-01-01

We outline a metal-free fabrication route of in-plane Ge nanowires on Ge(001) substrates. By positively exploiting the polishing-induced defects of standard-quality commercial Ge(001) wafers, micrometer-length wires are grown by physical vapor deposition in ultra-high-vacuum environment. The shape of the wires can be tailored by the epitaxial strain induced by subsequent Si deposition, determining a progressive transformation of the wires in SiGe faceted quantum dots. This shape transition is described by finite element simulations of continuous elasticity and gives hints on the equilibrium shape of nanocrystals in the presence of tensile epitaxial strain. 81.07.Gf; 68.35.bg; 68.35.bj; 62.23.Eg.

Modification of in-pack conditions to extend the storage life of vacuum packaged lamb.

PubMed

Gill, C O; Penney, N

1985-01-01

High pH (>5·9) lamb loins from a research abattoir were subjected to differing packaging treatments to determine whether package modification could reliably extend the storage life of chilled lamb cuts beyond that attained by cuts vacuum-packaged in film of low gas permeability, as in current commercial practice. Treatments applied were carbon dioxide flushing or addition of a citrate buffer (pH 4·8), a 5% lactic acid solution or a Lactobacillus inoculum (plastic packs only) and packaging in a plastic film of moderately low oxygen permeability (140 cc/m(2)/24 h at 25°C and 90% relative humidity) or in a foil laminate of immeasurably low oxygen permeability. After 12 weeks' storage at -0.5°C, the cuts packaged in the plastic film were spoiled by off-odours produced by enterobacteria, except for inoculated cuts, which, instead, had developed unacceptable dairy flavours. In contrast, cuts packaged in foil laminate developed floras of lactobacilli that had not caused spoilage after 12 weeks, and meat colour was much improved by the exclusion of oxygen. Loin cuts from a commercial packaging operation were packaged in a shrinkable plastic film of low oxygen permeability (30 to 40 cc/m(2)/24 h at 25°C and 90% relative humidity), in foil laminate, or in foil laminate after the addition of 5% lactic acid solution. For the first 6 weeks, cuts were stored in a commercial chiller nominally operating at 0°C; subsequently, they were held in a laboratory chiller at -0.5°C. Some cuts packaged in the shrinkable plastic were spoiled after 9 weeks' storage and all were spoiled at 12 weeks, because of off-flavours produced by enterobacteria. All cuts packaged in the foil laminate were very acceptable at 9 weeks but most were spoiled by off-flavours at 12 weeks. Most cuts treated with lactic acid and packaged in foil laminate were unspoiled after 12 weeks. The packaging requirements indicated to be necessary for reliable extension of the storage life of vacuum packaged lamb are discussed. Copyright © 1985. Published by Elsevier Ltd.

Composite germanium monochromators - Results for the TriCS single-crystal diffractometer at SINQ

NASA Astrophysics Data System (ADS)

Schefer, J.; Fischer, S.; Böhm, M.; Keller, L.; Horisberger, M.; Medarde, M.; Fischer, P.

Composite germanium monochromators are foremost in application in neutron diffraction due to their good scattering properties, low absorption values and the diamond structure which avoids second-order contamination when using hhk reflections (all odd). Our slices for the monochromator are built from 24 wafers, each 0.4 mm thick. The alignment of the wafers within the final composite wafer package has been improved by adding tin for the soldering process with a sputtering method instead of foils. Nine slices, each 12.5 mm high, are mounted on separate miniature goniometer heads to the focusing monochromator. The focusing angle is controlled by only one motor/digitizer by using a sophisticated mechanism. Turning the monochromator by 9° around overlineω allow access of the 311 (primary) and 511 (secondary) reflection. We also show the importance of permanent quality control with neutrons. The monochromator will be used on the single-crystal diffractometer TriCS at SINQ.

HEMT Amplifiers and Equipment for their On-Wafer Testing

NASA Technical Reports Server (NTRS)

Fung, King man; Gaier, Todd; Samoska, Lorene; Deal, William; Radisic, Vesna; Mei, Xiaobing; Lai, Richard

2008-01-01

Power amplifiers comprising InP-based high-electron-mobility transistors (HEMTs) in coplanar-waveguide (CPW) circuits designed for operation at frequencies of hundreds of gigahertz, and a test set for onwafer measurement of their power levels have been developed. These amplifiers utilize an advanced 35-nm HEMT monolithic microwave integrated-circuit (MMIC) technology and have potential utility as local-oscillator drivers and power sources in future submillimeter-wavelength heterodyne receivers and imaging systems. The test set can reduce development time by enabling rapid output power characterization, not only of these and similar amplifiers, but also of other coplanar-waveguide power circuits, without the necessity of packaging the circuits.

Manufacturable Tri-Stack AlSb/InAs HEMT Low-Noise Amplifiers Using Wafer-Level-Packaging Technology for Light-Weight and Ultralow-Power Applications

DTIC Science & Technology

2009-05-01

shown in Fig. 1 was grown by molecular - beam epitaxy (MBE) on 3-inch semi-insulating GaAs substrates. AlGaSb was used as a buffer. AlSb was used as... beam epitaxy for low-power applications,” J. Vac. Sci. Technol. B. 24, pp. 2581-2585, 2006. [12] Y. C. Chou, L. J. Lee, J. M. Yang, M. D. Lange, P...passivation AlGaSb buffer Figure 1: Cross section of an AlSb/InAs HEMT device on a 3-inch GaAs substrate. The interface region between the

Ultraminiature Broadband Light Source and Method of Manufacturing Same

NASA Technical Reports Server (NTRS)

Tuma, Margaret L. (Inventor); Collura, Joseph S. (Inventor); Helvajian, Henry (Inventor); Pocha, Michael D. (Inventor); Meyer, Glenn A. (Inventor); McConaghy, Charles F. (Inventor); Olsen, Barry L. (Inventor); Hansen, William W. (Inventor)

2010-01-01

An ultraminiature light source using a double-spiral shaped tungsten filament includes end contact portions which are separated to allow for radial and length-wise unwinding of the spiral. The double-spiral filament is spaced relatively far apart at the end portions thereof so that contact between portions of the filament upon expansion is avoided. The light ource is made by fabricating a double-spiral ultraminiature tungsten filament from tungsten foil and housing the filament in a ceramic package having a reflective bottom and a well wherein the filament is suspended. A vacuum furnace brazing process attaches the filament to contacts of the ceramic package. Finally, a cover with a transparent window is attached onto the top of the ceramic package by solder reflow in a second vacuum furnace process to form a complete hermetically sealed package.

Ultraminiature broadband light source with spiral shaped filament

NASA Technical Reports Server (NTRS)

McConaghy, Charles F. (Inventor); Olsen, Barry L. (Inventor); Tuma, Margaret L. (Inventor); Collura, Joseph S. (Inventor); Pocha, Michael D. (Inventor); Helvajian, Henry (Inventor); Meyer, Glenn A. (Inventor); Hansen, William W (Inventor)

2012-01-01

An ultraminiature light source using a double-spiral shaped tungsten filament includes end contact portions which are separated to allow for radial and length-wise unwinding of the spiral. The double-spiral filament is spaced relatively far apart at the end portions thereof so that contact between portions of the filament upon expansion is avoided. The light source is made by fabricating a double-spiral ultraminiature tungsten filament from tungsten foil and housing the filament in a ceramic package having a reflective bottom and a well wherein the filament is suspended. A vacuum furnace brazing process attaches the filament to contacts of the ceramic package. Finally, a cover with a transparent window is attached onto the top of the ceramic package by solder reflow in a second vacuum furnace process to form a complete hermetically sealed package.

Integrated Arrays on Silicon at Terahertz Frequencies

NASA Technical Reports Server (NTRS)

Chattopadhayay, Goutam; Lee, Choonsup; Jung, Cecil; Lin, Robert; Peralta, Alessandro; Mehdi, Imran; Llombert, Nuria; Thomas, Bertrand

2011-01-01

In this paper we explore various receiver font-end and antenna architecture for use in integrated arrays at terahertz frequencies. Development of wafer-level integrated terahertz receiver front-end by using advanced semiconductor fabrication technologies and use of novel integrated antennas with silicon micromachining are reported. We report novel stacking of micromachined silicon wafers which allows for the 3-dimensional integration of various terahertz receiver components in extremely small packages which easily leads to the development of 2- dimensioanl multi-pixel receiver front-ends in the terahertz frequency range. We also report an integrated micro-lens antenna that goes with the silicon micro-machined front-end. The micro-lens antenna is fed by a waveguide that excites a silicon lens antenna through a leaky-wave or electromagnetic band gap (EBG) resonant cavity. We utilized advanced semiconductor nanofabrication techniques to design, fabricate, and demonstrate a super-compact, low-mass submillimeter-wave heterodyne frontend. When the micro-lens antenna is integrated with the receiver front-end we will be able to assemble integrated heterodyne array receivers for various applications such as multi-pixel high resolution spectrometer and imaging radar at terahertz frequencies.

Future Development of Dense Ferroelectric Memories for Space Applications

NASA Technical Reports Server (NTRS)

Philpy, Stephen C.; Derbenwick, Gary F.

2001-01-01

The availability of high density, radiation tolerant, nonvolatile memories is critical for space applications. Ferroelectric memories, when fabricated with radiation hardened complementary metal oxide semiconductors (CMOS), can be manufactured and packaged to provide high density replacements for Flash memory, which is not radiation tolerant. Previous work showed ferroelectric memory cells to be resistant to single event upsets and proton irradiation, and ferroelectric storage capacitors to be resistant to neutron exposure. In addition to radiation hardness, the fast programming times, virtually unlimited endurance, and low voltage, low power operation make ferroelectric memories ideal for space missions. Previously, a commercial double level metal 64-kilobit ferroelectric memory was presented. Although the capabilities of radiation hardened wafer fabrication facilities lag behind those of the most modern commercial wafer fabrication facilities, several paths to achieving radiation tolerant, dense ferroelectric memories are emerging. Both short and long term solutions are presented in this paper. Although worldwide major semiconductor companies are introducing commercial ferroelectric memories, funding limitations must be overcome to proceed with the development of high density, radiation tolerant ferroelectric memories.

Carbon monoxide concentration and exposure time effects on the depth of CO penetration and surface color of raw and cooked beef longissimus lumborum steaks.

PubMed

Sakowska, A; Guzek, D; Głąbska, D; Wierzbicka, A

2016-11-01

This study investigated the influence of carbon monoxide (CO) exposure time (0, 7, 14, and 21days) and concentration in gas mixture on depth of penetration and the surface color of raw and cooked striploin steaks. Seven packaging treatments were evaluated: vacuum, vacuum after 48h of exposure to 0.1%, 0.3% or 0.5% CO (mixed with 30% CO2 and 69.5-69.9% N2), and modified atmosphere packaging (MAP) containing the same gas mixtures. CO penetration depth increased as exposure times and CO concentration in gas mixtures increased (p<0.05). However, the carboxymyoglobin that formed did not always turn brown during thermal treatment. In cooked samples treated with 0.3% and 0.5% CO-MAP, a red carboxymyoglobin border was visible at the cross section, whereas other CO packaging treatments had its partial or total browning. To create a red color in raw and avoid a red boarder in cooked beef, up to 0.5% CO in vacuum packages and only 0.1% for MAP can be recommended. Copyright © 2016 Elsevier Ltd. All rights reserved.

Back-illuminated CCD imager adapted for contrast transfer function measurements thereon

NASA Technical Reports Server (NTRS)

Levine, Peter A. (Inventor)

1987-01-01

Stripe patterns of varying spatial frequency, formed in the top-metalization of a back-illuminated solid-state imager, facilitate on-line measurement of contrast transfer function during wafer-probe testing. The imager may be packaged to allow front-illumination during in-the-field testing after its manufacture.

Process Development for the Fabrication of Spheroidal Microdevice Packages Utilizing MEMS Technologies

DTIC Science & Technology

2014-03-27

in a thin conductive layer, the wafer surface can be made into the cathode while using a stainless steel plate as an anode. Bath temperature, voltage...beakers with polytetrafluoroethylene (PTFE) tools while under a fume hood, as HF is known to attack glass and polystyrene [62]. Additionally

Effect of cinnamon essential oil on bacterial diversity and shelf-life in vacuum-packaged common carp (Cyprinus carpio) during refrigerated storage.

PubMed

Zhang, Yuemei; Li, Dongping; Lv, Jian; Li, Qingzheng; Kong, Chunli; Luo, Yongkang

2017-05-16

The present study investigated the effect of cinnamon essential oil on the quality of vacuum-packaged common carp (Cyprinus carpio) fillets stored at 4±1°C in terms of sensory scores, physicochemical characteristics (total volatile basic nitrogen (TVB-N), biogenic amines, and color), and presence of spoilage microbiota. A total of 290,753 bacterial sequences and 162 different genera belonging to 14 phyla were observed by a high-throughput sequencing technique targeting the V3-V4 region of 16S rDNA, which showed a more comprehensive estimate of microbial diversity in carp samples compared with microbial enumeration. Before storage, Macrococcus and Aeromonas were the prevalent populations in the control samples, but cinnamon essential oil decreased the relative abundance of Macrococcus in the treated samples. Variability in the predominant microbiota in different samples during chilled storage was observed. Aeromonas followed by Lactococcus were the major contaminants in the spoiled control samples. Microbial enumeration also observed relatively higher counts of Aeromonas than other spoilage microorganisms. Compared with the control samples, cinnamon essential oil inhibited the growth of Aeromonas and Lactococcus were the predominant components in the treated samples on day 10; plate counts also revealed a relatively high level of lactic acid bacteria during refrigerated storage. However, there were no significant differences (P>0.05) in the composition of dominant microbiota between these two treatments at the end of the shelf-life. Furthermore, cinnamon essential oil treatment was more effective in inhibiting the increase of TVB-N and the accumulation of biogenic amines (especially for putrescine and cadaverine levels). Based primarily on sensory analysis, the use of cinnamon essential oil extended the shelf-life of vacuum-packaged common carp fillets by about 2days. Copyright © 2016 Elsevier B.V. All rights reserved.

Effects of self-carbon dioxide-generation material for active packaging on pH, water-holding capacity, meat color, lipid oxidation and microbial growth in beef during cold storage.

PubMed

Lee, Seung-Jae; Lee, Seung Yun; Kim, Gap-Don; Kim, Geun-Bae; Jin, Sang Keun; Hur, Sun Jin

2017-08-01

Active packaging refers to the mixing of additive agents into packaging materials with the purpose of maintaining or extending food product quality and shelf life. The aim of this study was to develop an easy and cheap active packaging for beef. Beef loin samples were divided into three packaging groups (C, ziplock bag packaging; T1, vacuum packaging; T2, active packaging) and stored at 4 °C for 21 days. The water-holding capacity was significantly (P < 0.05) higher in C and T2 than in T1 for up to 7 days of storage. The TBARS value was significantly (P < 0.05) lower in T1 and T2 after 7 days of storage. The counts of some microorganism were significantly (P < 0.05) lower in T1 and T2 after 7 days of storage; the total bacterial count and Escherichia coli count were lowest in T2 at the end of storage. These results indicate that active packaging using self-CO 2 -generation materials can extend the shelf life similarly to that observed with vacuum packaging, and that the active packaging method can improve the quality characteristics of beef during cold storage. © 2017 Society of Chemical Industry. © 2017 Society of Chemical Industry.

9 CFR 590.548 - Drying, blending, packaging, and heat treatment rooms and facilities.

Code of Federal Regulations, 2011 CFR

2011-01-01

... 9 Animals and Animal Products 2 2011-01-01 2011-01-01 false Drying, blending, packaging, and heat..., blending, packaging, and heat treatment rooms and facilities. (a) General. Processing rooms shall be... vacuum cleaned daily. (c) The heat treatment room shall be of an approved construction and be maintained...

9 CFR 590.548 - Drying, blending, packaging, and heat treatment rooms and facilities.

Code of Federal Regulations, 2013 CFR

2013-01-01

... 9 Animals and Animal Products 2 2013-01-01 2013-01-01 false Drying, blending, packaging, and heat..., blending, packaging, and heat treatment rooms and facilities. (a) General. Processing rooms shall be... vacuum cleaned daily. (c) The heat treatment room shall be of an approved construction and be maintained...

9 CFR 590.548 - Drying, blending, packaging, and heat treatment rooms and facilities.

Code of Federal Regulations, 2012 CFR

2012-01-01

... 9 Animals and Animal Products 2 2012-01-01 2012-01-01 false Drying, blending, packaging, and heat..., blending, packaging, and heat treatment rooms and facilities. (a) General. Processing rooms shall be... vacuum cleaned daily. (c) The heat treatment room shall be of an approved construction and be maintained...

9 CFR 590.548 - Drying, blending, packaging, and heat treatment rooms and facilities.

Code of Federal Regulations, 2014 CFR

2014-01-01

... 9 Animals and Animal Products 2 2014-01-01 2014-01-01 false Drying, blending, packaging, and heat..., blending, packaging, and heat treatment rooms and facilities. (a) General. Processing rooms shall be... vacuum cleaned daily. (c) The heat treatment room shall be of an approved construction and be maintained...

(abstract) Electronic Packaging for Microspacecraft Applications

NASA Technical Reports Server (NTRS)

Wasler, David

1993-01-01

The intent of this presentation is to give a brief look into the future of electronic packaging for microspacecraft applications. Advancements in electronic packaging technology areas have developed to the point where a system engineer's visions, concepts, and requirements for a microspacecraft can now be a reality. These new developments are ideal candidates for microspacecraft applications. These technologies are capable of bringing about major changes in how we design future spacecraft while taking advantage of the benefits due to size, weight, power, performance, reliability , and cost. This presentation will also cover some advantages and limitations of surface mount technology (SMT), multichip modules (MCM), and wafer scale integration (WSI), and what is needed to implement these technologies into microspacecraft.

Amorphous-diamond electron emitter

DOEpatents

Falabella, Steven

2001-01-01

An electron emitter comprising a textured silicon wafer overcoated with a thin (200 .ANG.) layer of nitrogen-doped, amorphous-diamond (a:D-N), which lowers the field below 20 volts/micrometer have been demonstrated using this emitter compared to uncoated or diamond coated emitters wherein the emission is at fields of nearly 60 volts/micrometer. The silicon/nitrogen-doped, amorphous-diamond (Si/a:D-N) emitter may be produced by overcoating a textured silicon wafer with amorphous-diamond (a:D) in a nitrogen atmosphere using a filtered cathodic-arc system. The enhanced performance of the Si/a:D-N emitter lowers the voltages required to the point where field-emission displays are practical. Thus, this emitter can be used, for example, in flat-panel emission displays (FEDs), and cold-cathode vacuum electronics.

Electron beam throughput from raster to imaging

NASA Astrophysics Data System (ADS)

Zywno, Marek

2016-12-01

Two architectures of electron beam tools are presented: single beam MEBES Exara designed and built by Etec Systems for mask writing, and the Reflected E-Beam Lithography tool (REBL), designed and built by KLA-Tencor under a DARPA Agreement No. HR0011-07-9-0007. Both tools have implemented technologies not used before to achieve their goals. The MEBES X, renamed Exara for marketing purposes, used an air bearing stage running in vacuum to achieve smooth continuous scanning. The REBL used 2 dimensional imaging to distribute charge to a 4k pixel swath to achieve writing times on the order of 1 wafer per hour, scalable to throughput approaching optical projection tools. Three stage architectures were designed for continuous scanning of wafers: linear maglev, rotary maglev, and dual linear maglev.

Investigating reliability attributes of silicon photovoltaic cells - An overview

NASA Technical Reports Server (NTRS)

Royal, E. L.

1982-01-01

Reliability attributes are being developed on a wide variety of advanced single-crystal silicon solar cells. Two separate investigations: cell-contact integrity (metal-to-silicon adherence), and cracked cells identified with fracture-strength-reducing flaws are discussed. In the cell-contact-integrity investigation, analysis of contact pull-strength data shows that cell types made with different metallization technologies, i.e., vacuum, plated, screen-printed and soldered, have appreciably different reliability attributes. In the second investigation, fracture strength was measured using Czochralski wafers and cells taken at various stages of processing and differences were noted. Fracture strength, which is believed to be governed by flaws introduced during wafer sawing, was observed to improve (increase) after chemical polishing and other process steps that tend to remove surface and edge flaws.

Beneficial defects: exploiting the intrinsic polishing-induced wafer roughness for the catalyst-free growth of Ge in-plane nanowires

PubMed Central

2014-01-01

We outline a metal-free fabrication route of in-plane Ge nanowires on Ge(001) substrates. By positively exploiting the polishing-induced defects of standard-quality commercial Ge(001) wafers, micrometer-length wires are grown by physical vapor deposition in ultra-high-vacuum environment. The shape of the wires can be tailored by the epitaxial strain induced by subsequent Si deposition, determining a progressive transformation of the wires in SiGe faceted quantum dots. This shape transition is described by finite element simulations of continuous elasticity and gives hints on the equilibrium shape of nanocrystals in the presence of tensile epitaxial strain. PACS 81.07.Gf; 68.35.bg; 68.35.bj; 62.23.Eg PMID:25114649

Effect of carrageenan level and packaging during ripening on processing and quality characteristics of low-fat fermented sausages produced with olive oil.

PubMed

Koutsopoulos, D A; Koutsimanis, G E; Bloukas, J G

2008-05-01

Eight low-fat fermented sausages were produced with partial replacement of pork backfat with olive oil. The total fat content of the sausages was 10% of which 8% was animal fat and 2% was olive oil. The sausages were produced with two types of carrageenan (ι- and κ-) in four levels (0%, 1%, 2% and 3%). ι-Carrageenan had a better effect (p<0.05) than κ-carrageenan on such characteristics as pH, weight loss and lipid oxidation of the sausages, as well as, on sensory attributes. Low-fat fermented sausages with κ-carrageenan had the same (p>0.05) firmness as high-fat commercial sausages (control). The carrageenan level of 3% negatively affected the firmness of the sausages. In a 2nd experiment, a high-fat control (30% total fat) and three low-fat fermented sausages (10% total fat) with olive oil were produced with three levels of ι-carrageenan (0%, 1% and 2%). Low-fat sausages were vacuum packed for the last two weeks of ripening. ι-Carrageenan added at levels up to 2% had a positive effect (p<0.05) on the physicochemical and microbiological characteristics of the low-fat fermented sausages. The application of vacuum packaging over last two weeks of ripening improved the physicochemical and microbiological characteristics of the sausages and resulted in sensory attributes equal to or better than the high-fat controls.

Modeling physical vapor deposition of energetic materials

DOE PAGES

Shirvan, Koroush; Forrest, Eric C.

2018-03-28

Morphology and microstructure of organic explosive films formed using physical vapor deposition (PVD) processes strongly depends on local surface temperature during deposition. Currently, there is no accurate means of quantifying the local surface temperature during PVD processes in the deposition chambers. This study focuses on using a multiphysics computational fluid dynamics tool, STARCCM+, to simulate pentaerythritol tetranitrate (PETN) deposition. The PETN vapor and solid phase were simulated using the volume of fluid method and its deposition in the vacuum chamber on spinning silicon wafers was modeled. The model also included the spinning copper cooling block where the wafers are placedmore » along with the chiller operating with forced convection refrigerant. Implicit time-dependent simulations in two- and three-dimensional were performed to derive insights in the governing physics for PETN thin film formation. PETN is deposited at the rate of 14 nm/s at 142.9 °C on a wafer with an initial temperature of 22 °C. The deposition of PETN on the wafers was calculated at an assumed heat transfer coefficient (HTC) of 400 W/m 2 K. This HTC proved to be the most sensitive parameter in determining the local surface temperature during deposition. Previous experimental work found noticeable microstructural changes with 0.5 mm fused silica wafers in place of silicon during the PETN deposition. This work showed that fused silica slows initial wafer cool down and results in ~10 °C difference for the surface temperature at 500 μm PETN film thickness. It was also found that the deposition surface temperature is insensitive to the cooling power of the copper block due to the copper block's very large heat capacity and thermal conductivity relative to the heat input from the PVD process. Future work should incorporate the addition of local stress during PETN deposition. Lastly, based on simulation results, it is also recommended to investigate the impact of wafer surface energy on the PETN microstructure and morphology formation.« less

Modeling physical vapor deposition of energetic materials

DOE Office of Scientific and Technical Information (OSTI.GOV)

Shirvan, Koroush; Forrest, Eric C.

Morphology and microstructure of organic explosive films formed using physical vapor deposition (PVD) processes strongly depends on local surface temperature during deposition. Currently, there is no accurate means of quantifying the local surface temperature during PVD processes in the deposition chambers. This study focuses on using a multiphysics computational fluid dynamics tool, STARCCM+, to simulate pentaerythritol tetranitrate (PETN) deposition. The PETN vapor and solid phase were simulated using the volume of fluid method and its deposition in the vacuum chamber on spinning silicon wafers was modeled. The model also included the spinning copper cooling block where the wafers are placedmore » along with the chiller operating with forced convection refrigerant. Implicit time-dependent simulations in two- and three-dimensional were performed to derive insights in the governing physics for PETN thin film formation. PETN is deposited at the rate of 14 nm/s at 142.9 °C on a wafer with an initial temperature of 22 °C. The deposition of PETN on the wafers was calculated at an assumed heat transfer coefficient (HTC) of 400 W/m 2 K. This HTC proved to be the most sensitive parameter in determining the local surface temperature during deposition. Previous experimental work found noticeable microstructural changes with 0.5 mm fused silica wafers in place of silicon during the PETN deposition. This work showed that fused silica slows initial wafer cool down and results in ~10 °C difference for the surface temperature at 500 μm PETN film thickness. It was also found that the deposition surface temperature is insensitive to the cooling power of the copper block due to the copper block's very large heat capacity and thermal conductivity relative to the heat input from the PVD process. Future work should incorporate the addition of local stress during PETN deposition. Lastly, based on simulation results, it is also recommended to investigate the impact of wafer surface energy on the PETN microstructure and morphology formation.« less

The Zwicky Transient Facility Camera

NASA Astrophysics Data System (ADS)

Dekany, Richard; Smith, Roger M.; Belicki, Justin; Delacroix, Alexandre; Duggan, Gina; Feeney, Michael; Hale, David; Kaye, Stephen; Milburn, Jennifer; Murphy, Patrick; Porter, Michael; Reiley, Daniel J.; Riddle, Reed L.; Rodriguez, Hector; Bellm, Eric C.

2016-08-01

The Zwicky Transient Facility Camera (ZTFC) is a key element of the ZTF Observing System, the integrated system of optoelectromechanical instrumentation tasked to acquire the wide-field, high-cadence time-domain astronomical data at the heart of the Zwicky Transient Facility. The ZTFC consists of a compact cryostat with large vacuum window protecting a mosaic of 16 large, wafer-scale science CCDs and 4 smaller guide/focus CCDs, a sophisticated vacuum interface board which carries data as electrical signals out of the cryostat, an electromechanical window frame for securing externally inserted optical filter selections, and associated cryo-thermal/vacuum system support elements. The ZTFC provides an instantaneous 47 deg2 field of view, limited by primary mirror vignetting in its Schmidt telescope prime focus configuration. We report here on the design and performance of the ZTF CCD camera cryostat and report results from extensive Joule-Thompson cryocooler tests that may be of broad interest to the instrumentation community.

Realization of MEMS-IC Vertical Integration Utilizing Smart Bumpless Bonding

NASA Astrophysics Data System (ADS)

Shiozaki, Masayoshi; Moriguchi, Makoto; Sasaki, Sho; Oba, Masatoshi

This paper reports fundamental technologies, properties, and new experimental results of SBB (Smart Bumpless Bonding) to realize MEMS-IC vertical integration. Although conventional bonding technologies have had difficulties integrating MEMS and its processing circuit because of their rough bonding surfaces, fragile structures, and thermal restriction, SBB technology realized the vertical integration without thermal treatment, any adhesive materials including bumps, and chemical mechanical polishing. The SBB technology bonds sealing parts for vacuum sealing and electrodes for electrical connection simultaneously as published in previous experimental study. The plasma CVD SiO2 is utilized to realize vacuum sealing as sealing material. And Au projection studs are formed on each electrode and connected electrically between two wafers by compressive plastic deformation and surface activation. In this paper, new experimental results including vacuum sealing properties, electrical improvement, IC bonding results on the described fundamental concept and properties are reported.

A digital miniature x-ray tube with a high-density triode carbon nanotube field emitter

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jeong, Jin-Woo; Kang, Jun-Tae; Choi, Sungyoul

2013-01-14

We have fabricated a digital miniature x-ray tube (6 mm in diameter and 32 mm in length) with a high-density triode carbon nanotube (CNT) field emitter for special x-ray applications. The triode CNT emitter was densely formed within a diameter of below 4 mm with the focusing-functional gate. The brazing process enables us to obtain and maintain a desired vacuum level for the reliable electron emission from the CNT emitters after the vacuum packaging. The miniature x-ray tube exhibited a stable and reliable operation over 250 h in a pulse mode at an anode voltage of above 25 kV.

Luminescence of BaBrI and SrBrI single crystals doped with Eu2+

NASA Astrophysics Data System (ADS)

Shalaev, A. A.; Shendrik, R.; Myasnikova, A. S.; Bogdanov, A.; Rusakov, A.; Vasilkovskyi, A.

2018-05-01

The crystal growth procedure and luminescence properties of pure and Eu2+-doped BaBrI and SrBrI crystals are reported. Emission and excitation spectra were recorded under ultraviolet and vacuum ultraviolet excitations. The energy of the first Eu2+ 4f-5d transition and SrBrI band gap are obtained. The electronic structure calculations were performed within GW approximation as implemented in the Vienna Ab Initio Simulation Package. The energy between lowest Eu2+ 5d state and the bottom of conduction band are found based on luminescence quenching parameters. The vacuum referred binding energy diagram of lanthanide levels was constructed using the chemical shift model.

Impact of front-of-pack nutrition information and label design on children's choice of two snack foods: Comparison of warnings and the traffic-light system.

PubMed

Arrúa, Alejandra; Curutchet, María Rosa; Rey, Natalia; Barreto, Patricia; Golovchenko, Nadya; Sellanes, Andrea; Velazco, Guillermo; Winokur, Medy; Giménez, Ana; Ares, Gastón

2017-09-01

Research on the relative influence of package features on children's perception of food products is still necessary to aid policy design and development. The aim of the present work was to evaluate the relative influence of two front-of-pack (FOP) nutrition labelling schemes, the traffic light system and Chilean warning system, and label design on children's choice of two popular snack foods in Uruguay, wafer cookies and orange juice. A total of 442 children in grades 4 to 6 from 12 primary schools in Montevideo (Uruguay) participated in the study. They were asked to complete a choice-conjoint task with wafer cookies and orange juice labels, varying in label design and the inclusion of FOP nutrition information. Half of the children completed the task with labels featuring the traffic-light system (n = 217) and the other half with labels featuring the Chilean warning system (n = 225). Children's choices of wafer cookies and juice labels was significantly influenced by both label design and FOP nutritional labels. The relative impact of FOP nutritional labelling on children's choices was higher for the warning system compared to the traffic-light system. Results from the present work stress the need to regulate the design of packages and the inclusion of nutrient claims, and provide preliminary evidence of the potential of warnings to discourage children's choice of unhealthful products. Copyright © 2017 Elsevier Ltd. All rights reserved.

Characterization of a potentially novel 'blown pack' spoilage bacterium isolated from bovine hide.

PubMed

Moschonas, G; Bolton, D J

2013-03-01

To characterize a psychrotrophic bacterium, designated TC1, previously isolated from a cattle hide in Ireland, and to investigate the ability of this strain to cause 'blown pack' spoilage (BPS) of vacuum-packaged beef primals. TC1 was characterized using a combination of phenotypic, chemotaxonomic and genotypic analyses and was assessed for its ability to spoil vacuum-packaged beef at refrigerated temperatures. TC1 was Gram-positive and formed elliptical subterminal endospores. The strain was able to grow between 0 and 33 °C, with optimal growth between 23 and 24 °C. TC1 could be differentiated from its phylogenetically closest neighbour (Clostridium lituseburense DSM 797(T)) by 16S rRNA gene sequencing, pulsed-field gel electrophoresis and cellular fatty acid composition. TC1 spoiled (BPS) beef within 42 days when inoculated in cold-stored (1 °C) vacuum-packed beef. The phenotypic, chemotaxonomic and genotypic characterization indicated that TC1 may represent a potentially novel, cold-tolerant, gas-producing bacterium of considerable economic significance to the beef industry. This study reports and characterizes an emerging BPS bacterium, which should be considered in future activities designed to minimize the psychrophilic and psychrotrophic spoilage of vacuum-packaged beef. © 2012 The Society for Applied Microbiology.

A Novel Method to Decontaminate Surgical Instruments for Operational and Austere Environments.

PubMed

Knox, Randy W; Demons, Samandra T; Cunningham, Cord W

2015-12-01

The purpose of this investigation was to test a field-expedient, cost-effective method to decontaminate, sterilize, and package surgical instruments in an operational (combat) or austere environment using chlorhexidine sponges, ultraviolet C (UVC) light, and commercially available vacuum sealing. This was a bench study of 4 experimental groups and 1 control group of 120 surgical instruments. Experimental groups were inoculated with a 10(6) concentration of common wound bacteria. The control group was vacuum sealed without inoculum. Groups 1, 2, and 3 were first scrubbed with a chlorhexidine sponge, rinsed, and dried. Group 1 was then packaged; group 2 was irradiated with UVC light, then packaged; group 3 was packaged, then irradiated with UVC light through the bag; and group 4 was packaged without chlorhexidine scrubbing or UVC irradiation. The UVC was not tested by itself, as it does not grossly clean. The instruments were stored overnight and tested for remaining colony forming units (CFU). Data analysis was conducted using analysis of variance and group comparisons using the Tukey method. Group 4 CFU was statistically greater (P < .001) than the control group and groups 1 through 3. There was no statistically significant difference between the control group and groups 1 through 3. Vacuum sealing of chlorhexidine-scrubbed contaminated instruments with and without handheld UVC irradiation appears to be an acceptable method of field decontamination. Chlorhexidine scrubbing alone achieved a 99.9% reduction in CFU, whereas adding UVC before packaging achieved sterilization or 100% reduction in CFU, and UVC through the bag achieved disinfection. Published by Elsevier Inc.

Vacuum decay container/closure integrity testing technology. Part 1. ASTM F2338-09 precision and bias studies.

PubMed

Wolf, Heinz; Stauffer, Tony; Chen, Shu-Chen Y; Lee, Yoojin; Forster, Ronald; Ludzinski, Miron; Kamat, Madhav; Godorov, Phillip; Guazzo, Dana Morton

2009-01-01

ASTM F2338-09 Standard Test Method for Nondestructive Detection of Leaks in Packages by Vacuum Decay Method is applicable for leak-testing rigid and semi-rigid non-lidded trays; trays or cups sealed with porous barrier lidding materials; rigid, nonporous packages; and flexible, nonporous packages. Part 1 of this series describes the precision and bias studies performed in 2008 to expand this method's scope to include rigid, nonporous packages completely or partially filled with liquid. Round robin tests using three VeriPac 325/LV vacuum decay leak testers (Packaging Technologies & Inspection, LLC, Tuckahoe, NY) were performed at three test sites. Test packages were 1-mL glass syringes. Positive controls had laser-drilled holes in the barrel ranging from about 5 to 15 microm in nominal diameter. Two different leak tests methods were performed at each site: a "gas leak test" performed at 250 mbar (absolute) and a "liquid leak test" performed at about 1 mbar (absolute). The gas leak test was used to test empty, air-filled syringes. All defects with holes > or = 5.0 microm and all no-defect controls were correctly identified. The only false negative result was attributed to a single syringe with a < 5.0-microm hole. Tests performed using a calibrated air leak supported a 0.10-cm3 x min(-1) (ccm) sensitivity limit (99/99 lower tolerance limit). The liquid leak test was used to test both empty, air-filled syringes and water-filled syringes. Test results were 100% accurate for all empty and water-filled syringes, both without holes and with holes (5, 10, and 15 microm). Tests performed using calibrated air flow leaks of 0, 0.05, and 0.10 ccm were also 100% accurate; data supported a 0.10-ccm sensitivity limit (99/99 lower tolerance limit). Quantitative differential pressure results strongly correlated to hole size using either liquid or gas vacuum decay leak tests. The higher vacuum liquid leak test gave noticeably higher pressure readings when water was present in the defect. Both the ASTM F2338-09 test method and the precision and bias study report are available by contacting ASTM International in West Conshohocken, PA, USA (www.astm.org).

EUVL mask dual pods to be used for mask shipping and handling in exposure tools

NASA Astrophysics Data System (ADS)

Gomei, Yoshio; Ota, Kazuya; Lystad, John; Halbmair, Dave; He, Long

2007-03-01

The concept of Extreme Ultra-Violet Lithography (EUVL) mask dual pods is proposed for use in both mask shipping and handling in exposure tools. The inner pod was specially designed to protect masks from particle contamination during shipping from mask houses to wafer factories. It can be installed in a load-lock chamber of exposure tools and evacuated while holding the mask inside. The inner pod upper cover is removed just before the mask is installed to a mask stage. Prototypes were manufactured and tested for shipping and for vacuum cycling. We counted particle adders through these actions with a detectable level of 54 nm and up. The adder count was close to zero, or we can say that the obtained result is within the noise level of our present evaluation environment. This indicates that the present concept is highly feasible for EUVL mask shipping and handling in exposure tools.

A three-mask process for fabricating vacuum-sealed capacitive micromachined ultrasonic transducers using anodic bonding.

PubMed

Yamaner, F Yalçın; Zhang, Xiao; Oralkan, Ömer

2015-05-01

This paper introduces a simplified fabrication method for vacuum-sealed capacitive micromachined ultrasonic transducer (CMUT) arrays using anodic bonding. Anodic bonding provides the established advantages of wafer-bondingbased CMUT fabrication processes, including process simplicity, control over plate thickness and properties, high fill factor, and ability to implement large vibrating cells. In addition to these, compared with fusion bonding, anodic bonding can be performed at lower processing temperatures, i.e., 350°C as opposed to 1100°C; surface roughness requirement for anodic bonding is more than 10 times more relaxed, i.e., 5-nm rootmean- square (RMS) roughness as opposed to 0.5 nm for fusion bonding; anodic bonding can be performed on smaller contact area and hence improves the fill factor for CMUTs. Although anodic bonding has been previously used for CMUT fabrication, a CMUT with a vacuum cavity could not have been achieved, mainly because gas is trapped inside the cavities during anodic bonding. In the approach we present in this paper, the vacuum cavity is achieved by opening a channel in the plate structure to evacuate the trapped gas and subsequently sealing this channel by conformal silicon nitride deposition in the vacuum environment. The plate structure of the fabricated CMUT consists of the single-crystal silicon device layer of a silicon-on-insulator wafer and a thin silicon nitride insulation layer. The presented fabrication approach employs only three photolithographic steps and combines the advantages of anodic bonding with the advantages of a patterned metal bottom electrode on an insulating substrate, specifically low parasitic series resistance and low parasitic shunt capacitance. In this paper, the developed fabrication scheme is described in detail, including process recipes. The fabricated transducers are characterized using electrical input impedance measurements in air and hydrophone measurements in immersion. A representative design is used to demonstrate immersion operation in conventional, collapse-snapback, and collapse modes. In collapsemode operation, an output pressure of 1.67 MPa pp is shown at 7 MHz on the surface of the transducer for 60-Vpp, 3-cycle sinusoidal excitation at 30-V dc bias.

Merging photonics with nanoelectronics (Conference Presentation)

NASA Astrophysics Data System (ADS)

Liehr, Michael

2016-02-01

The recently established American Institute for Manufacturing Photonics (AIM Photonics) is a manufacturing consortium headquartered in New York, with funding from the US Department of Defense (DoD), New York State, and industrial partners to advance the state of the art in the design, manufacture, testing, assembly, and packaging of integrated photonic devices. Dr. Michael Liehr, CEO of AIM Photonics, will describe the technical goals, operational framework, near-term milestones, and opportunities for the broader photonics community. The Institute intends to organize a currently fragmented domestic capability in integrated photonics. AIM Photonics will develop and demonstrate innovative manufacturing technologies for a number of key application sectors for integrated photonics devices. The Institute will furthermore specifically focus on establishing and building out an infrastructure in key areas required to accelerate the further adoption of integrated photonics. Specifically, we will enhance the available hardware development capability to include Si-based Multi-Project Wafer runs, InP-based Photonic Integrated Circuits, first and second level packaging, test and assembly.

The effect of carbon monoxide pretreatment exposure time on the colour stability and quality attributes of vacuum packaged beef steaks.

PubMed

Van Rooyen, Lauren Anne; Allen, Paul; Crawley, Sarah M; O'Connor, David I

2017-07-01

The effect of 5% CO pretreatments prior to vacuum packaging of beef striploin steaks (Longissimus thoracis et lumborum, LTL) on quality attributes, primarily colour stability was investigated. The aim was to determine the optimum pretreatment that would induce the desirable red colour, while allowing discoloration to occur by the end of a 28-day display period (2°C), so as to not mask spoilage. A range of pretreatment exposure times (1, 3, 5, 7, 9, 15 and 24h) were applied to steaks using a gas mixture of 5% CO, 60% CO 2 and 35% N 2 . The 5h CO pretreatment exposure time achieved the desirable colour and discoloration reached unacceptable levels (a*=12, C*=16) by the use-by date (28days), thus ensuring consumers' of a reliable visual indication of freshness and addressing concerns about safety. The 5% CO pretreatment had no negative effect on microbiological safety, lipid oxidation, cooking loss and WBSF measurements at the end of storage (P>0.05). Copyright © 2017 Elsevier Ltd. All rights reserved.

Diffusion of oxygen in cork.

PubMed

Lequin, Sonia; Chassagne, David; Karbowiak, Thomas; Simon, Jean-Marc; Paulin, Christian; Bellat, Jean-Pierre

2012-04-04

This work reports measurements of effective oxygen diffusion coefficient in raw cork. Kinetics of oxygen transfer through cork is studied at 298 K thanks to a homemade manometric device composed of two gas compartments separated by a cork wafer sample. The first compartment contains oxygen, whereas the second one is kept under dynamic vacuum. The pressure decrease in the first compartment is recorded as a function of time. The effective diffusion coefficient D(eff) is obtained by applying Fick's law to transient state using a numerical method based on finite differences. An analytical model derived from Fick's law applied to steady state is also proposed. Results given by these two methods are in close agreement with each other. The harmonic average of the effective diffusion coefficients obtained from the distribution of 15 cork wafers of 3 mm thickness is 1.1 × 10(-9) m(2) s(-1) with a large distribution over four decades. The statistical analysis of the Gaussian distribution obtained on a 3 mm cork wafer is extrapolated to a 48 mm cork wafer, which length corresponds to a full cork stopper. In this case, the probability density distribution gives a mean value of D(eff) equal to 1.6 × 10(-9) m(2) s(-1). This result shows that it is possible to obtain the effective diffusion coefficient of oxygen through cork from short time (few days) measurements performed on a thin cork wafer, whereas months are required to obtain the diffusion coefficient for a full cork stopper. Permeability and oxygen transfer rate are also calculated for comparison with data from other studies.

Effects of vacuum and modified atmosphere on textural parameters and structural proteins of cultured meagre (Argyrosomus regius) fillets.

PubMed

Sáez, María I; Martínez, Tomás F; Cárdenas, Salvador; Suárez, María D

2015-09-01

The influence of two preservation strategies (vacuum package and modified atmosphere package) on the post-mortem changes of textural parameters, pH, water holding capacity, sarcoplasmic and myofibrillar proteins, and collagen content of meagre (Argyrosomus regius) fillets was studied. Fillets were stored in a cold room in aerobic (control, C), vacuum (V) and modified atmosphere (MA) package. Samples were withdrawn at six sampling points throughout 15-day storage, and post-mortem changes were assessed. The textural parameters were significantly enhanced in V and MA compared to C. Both V and MA treatments reduced the intensity of a group of myofibrillar protein fractions (140-195 kDa) and increased insoluble collagen compared to C. Consequently, the post-mortem flesh softening in C was attributed to increased proteolysis in both intracellular and extracellular structural proteins. The preservation of the textural and biochemical characteristics of meagre fillets subjected to V and MA treatments makes these two treatments highly recommendable for the commercialization of meagre fillets. © The Author(s) 2014.

Effect of low-temperature preservation on the quality of vacuum-packaged dry-cured ham: Refrigerated boneless ham and frozen ham cuts.

PubMed

Cilla, Irene; Martínez, Luis; Beltrán, José Antonio; Roncalés, Pedro

2006-05-01

The effect of storage on dry-cured ham quality was studied. Sixteen vacuum-packaged boneless dry-cured hams and sixteen vacuum-packaged dry-cured ham cuts were stored in darkness under refrigeration (4±2°C; 8 months) or freezing (-18±1°C; 24 months), respectively. Instrumental colour and texture, physico-chemical and biochemical parameters, sensory profile and consumer acceptability and purchase satisfaction were measured throughout storage. The overall quality of refrigerated boneless dry-cured hams and frozen dry-cured ham cuts showed only limited changes throughout long-term storage. Significant changes involved loss of odour and flavour, increased adhesiveness and modification of hardness, the Semimembranosus muscle became tender while Biceps femoris became harder, leading to a higher textural homogeneity. In agreement with those changes, the overall acceptability assessed by a trained panel decreased throughout storage, though this was significant regarding only frozen hams. However, consumer evaluation of acceptability, as well as satisfaction with hypothetical purchasing, did not vary significantly throughout storage.

Imaging ATUM ultrathin section libraries with WaferMapper: a multi-scale approach to EM reconstruction of neural circuits

PubMed Central

Hayworth, Kenneth J.; Morgan, Josh L.; Schalek, Richard; Berger, Daniel R.; Hildebrand, David G. C.; Lichtman, Jeff W.

2014-01-01

The automated tape-collecting ultramicrotome (ATUM) makes it possible to collect large numbers of ultrathin sections quickly—the equivalent of a petabyte of high resolution images each day. However, even high throughput image acquisition strategies generate images far more slowly (at present ~1 terabyte per day). We therefore developed WaferMapper, a software package that takes a multi-resolution approach to mapping and imaging select regions within a library of ultrathin sections. This automated method selects and directs imaging of corresponding regions within each section of an ultrathin section library (UTSL) that may contain many thousands of sections. Using WaferMapper, it is possible to map thousands of tissue sections at low resolution and target multiple points of interest for high resolution imaging based on anatomical landmarks. The program can also be used to expand previously imaged regions, acquire data under different imaging conditions, or re-image after additional tissue treatments. PMID:25018701

Wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible biomedical platform.

PubMed

Maeng, Jimin; Meng, Chuizhou; Irazoqui, Pedro P

2015-02-01

We present wafer-scale integrated micro-supercapacitors on an ultrathin and highly flexible parylene platform, as progress toward sustainably powering biomedical microsystems suitable for implantable and wearable applications. All-solid-state, low-profile (<30 μm), and high-density (up to ~500 μF/mm(2)) micro-supercapacitors are formed on an ultrathin (~20 μm) freestanding parylene film by a wafer-scale parylene packaging process in combination with a polyaniline (PANI) nanowire growth technique assisted by surface plasma treatment. These micro-supercapacitors are highly flexible and shown to be resilient toward flexural stress. Further, direct integration of micro-supercapacitors into a radio frequency (RF) rectifying circuit is achieved on a single parylene platform, yielding a complete RF energy harvesting microsystem. The system discharging rate is shown to improve by ~17 times in the presence of the integrated micro-supercapacitors. This result suggests that the integrated micro-supercapacitor technology described herein is a promising strategy for sustainably powering biomedical microsystems dedicated to implantable and wearable applications.

Mechanical Designs and Developement of Advanced ACT: A Transfomative Upgrade to the ACTPol Receiver on the Atacama Cosmology Telescope.

NASA Astrophysics Data System (ADS)

Ward, Jonathan; Advanced ACT Collaboration, NASA Space Technology Research Fellowship

2017-06-01

The Atacama Cosmology Telescope is a six-meter diameter telescope located at 17,000 feet (5,200 meters) on Cerro Toco in the Andes Mountains of northern Chile. The next generation Advanced ACT (AdvACT) experiment is currently underway and will consist of three multichroic TES bolometer arrays operating together, totaling 5800 detectors on the sky. Each array will be sensitive to two frequency bands: a high frequency (HF) array at 150 and 230 GHz, two middle frequency (MF) arrays at 90 and 150 GHz, and a low frequency (LF) array at 28 and 41 GHz. The AdACT detector arrays will feature a revamped design when compared to ACTPol, including a transition to 150mm wafers equipped with multichroic pixels, allowing for a more densely packed focal plane. Each set of detectors consists of a feedhorn array of stacked silicon wafers which form a corrugated profile leading to each pixel. This is then followed by a four-piece detector stack assembly of silicon wafers which includes a waveguide interface plate, detector wafer, backshort cavity plate, and backshort cap. Each array is housed in a custom designed structure manufactured out of gold-plated, high purity copper. In addition to the detector array assembly, the array package also encloses the majority of our readout electronics. We present the full mechanical design of the AdvACT HF and MF detector array packages along with a detailed look at the detector array assemblies. We also highlight the use of continuously rotating warm half-wave plates (HWPs) at the front of the AdvACT receiver. We review the design of the rotation system and also early pipeline data analysis results. This experiment will also make use of extensive hardware and software previously developed for ACT, which will be modified to incorporate the new AdvACT instruments. Therefore, we discuss the integration of all AdvACT instruments with pre-existing ACTPol infrastructure.

Innovative on-chip packaging applied to uncooled IRFPA

NASA Astrophysics Data System (ADS)

Dumont, Geoffroy; Arnaud, Agnès; Impérinetti, Pierre; Vialle, Claire; Rabaud, Wilfried; Goudon, Valérie; Yon, Jean-Jacques

2008-04-01

The Laboratoire Infrarouge (LIR) of the Laboratoire d'Electronique et de Technologie de l'Information (LETI) has been involved in the development of microbolometers for over fifteen years. Two generations of technology have been transferred to ULIS and LETI is still working to improve performances of low cost detectors. Simultaneously, packaging still represents a significant part of detectors price. Reducing production costs would contribute to keep on extending applications of uncooled IRFPA to high volume markets like automotive. Therefore LETI is developing an on-chip packaging technology dedicated to microbolometers. This paper presents an original microcap structure that enables the use of IR window materials as sealing layers to maintain the expected vacuum level. The modelling and integration of an IR window suitable for this structure is also presented. This monolithic packaging technology is performed in a standard collective way, in continuation of bolometers' technology. The CEA-LETI, MINATEC presents status of these developments concerning this innovating technology including optical simulations results and SEM views of technical realizations.

Investigation of hyper-NA scanner emulation for photomask CDU performance

NASA Astrophysics Data System (ADS)

Poortinga, Eric; Scheruebl, Thomas; Conley, Will; Sundermann, Frank

2007-02-01

As the semiconductor industry moves toward immersion lithography using numerical apertures above 1.0 the quality of the photomask becomes even more crucial. Photomask specifications are driven by the critical dimension (CD) metrology within the wafer fab. Knowledge of the CD values at resist level provides a reliable mechanism for the prediction of device performance. Ultimately, tolerances of device electrical properties drive the wafer linewidth specifications of the lithography group. Staying within this budget is influenced mainly by the scanner settings, resist process, and photomask quality. Tightening of photomask specifications is one mechanism for meeting the wafer CD targets. The challenge lies in determining how photomask level metrology results influence wafer level imaging performance. Can it be inferred that photomask level CD performance is the direct contributor to wafer level CD performance? With respect to phase shift masks, criteria such as phase and transmission control are generally tightened with each technology node. Are there other photomask relevant influences that effect wafer CD performance? A comprehensive study is presented supporting the use of scanner emulation based photomask CD metrology to predict wafer level within chip CD uniformity (CDU). Using scanner emulation with the photomask can provide more accurate wafer level prediction because it inherently includes all contributors to image formation related to the 3D topography such as the physical CD, phase, transmission, sidewall angle, surface roughness, and other material properties. Emulated images from different photomask types were captured to provide CD values across chip. Emulated scanner image measurements were completed using an AIMS TM45-193i with its hyper-NA, through-pellicle data acquisition capability including the Global CDU Map TM software option for AIMS TM tools. The through-pellicle data acquisition capability is an essential prerequisite for capturing final CDU data (after final clean and pellicle mounting) before the photomask ships or for re-qualification at the wafer fab. Data was also collected on these photomasks using a conventional CD-SEM metrology system with the pellicles removed. A comparison was then made to wafer prints demonstrating the benefit of using scanner emulation based photomask CD metrology.

Changes in the microbiota of lamb packaged in a vacuum and in modified atmospheres during chilled storage analysed by high-throughput sequencing.

PubMed

Wang, Taojun; Zhao, Liang; Sun, Yanan; Ren, Fazheng; Chen, Shanbin; Zhang, Hao; Guo, Huiyuan

2016-11-01

Changes in the microbiota of lamb were investigated under vacuum packaging (VP) and under 20% CO2/80% N2 (LC), 60% CO2/40% N2 (MC), and 100% CO2 (HC) modified atmosphere packaging (MAP) during chilled storage. Viable counts were monitored, and the total microbial communities were assessed by high-throughput sequencing. The starting community had the highest microbial diversity, after which Lactococcus and Carnobacterium spp. outcompeted during the 28-day storage. The relative abundances of Brochothrix spp. in the LC atmosphere were much higher than those of the other groups on days 7 and 28. The bacterial inhibiting effect of the MAP environments on microbial growth was positively correlated with the CO2 concentration. The HC atmosphere inhibited microbial growth and delayed changes in the microbial community composition, extending the lamb's shelf life by approximately 7days compared with the VP atmosphere. Lamb packaged in the VP atmosphere had a more desirable colour but a higher weight loss than lamb packaged in the MAP atmospheres. Copyright © 2016 Elsevier Ltd. All rights reserved.

7 CFR 58.241 - Packaging, repackaging and storage.

Code of Federal Regulations, 2012 CFR

2012-01-01

... contamination. The room should be vacuumed as often as necessary and kept clean and orderly. ... clean, sound commercially accepted container or packaging material which will satisfactorily protect the... them practically free of residual product before being transferred from the filling room to the...

7 CFR 58.241 - Packaging, repackaging and storage.

Code of Federal Regulations, 2014 CFR

2014-01-01

... contamination. The room should be vacuumed as often as necessary and kept clean and orderly. ... clean, sound commercially accepted container or packaging material which will satisfactorily protect the... them practically free of residual product before being transferred from the filling room to the...

Thermotolerance of meat spoilage lactic acid bacteria and their inactivation in vacuum-packaged vienna sausages.

PubMed

Franz, C M; von Holy, A

1996-02-01

Heat resistance of three meat spoilage lactic acid bacteria was determined in vitro. D-values at 57, 60 and 63 degrees C were 52.9, 39.3 and 32.5 s for Lactobacillus sake, 34.9, 31.3 and 20.2 s for Leuconostoc mesenteroides and 22.5, 15.6 and 14.4 s for Lactobacillus curvatus, respectively. The three lactic acid bacteria were heat sensitive, as one log reductions in numbers were achieved at 57 degrees C in less than 60 s. Z-values could not be accurately determined as D-values did not change by a factor of 10 over the temperature range studied. In-package pasteurization processes were calculated using the highest in vitro D-value and applied to vacuum-packaged vienna sausages. Microbiological shelf life (time for lactic acid bacteria count to reach 5 x 10(6) CFU/g) increased from 7 days for non-pasteurized samples to 67, 99 and 119 days for samples of the three pasteurization treatments at 8 degrees C storage. Enterobacteriaceae were detected at levels of log 4.0 CFU/g in non-pasteurized samples, but were reduced to < log 1.0 CFU/g in pasteurized samples. The incidence of listeriae in non-pasteurized samples was low as only one Listeria innocua strain was isolated. No Listeria spp. were isolated from pasteurized samples. Numbers of Clostridium isolates increased from one in non-pasteurized samples to 25 in pasteurized samples. Increasing incidences of clostridia, and the presence of C. perfringens in pasteurized samples indicated that in-package pasteurization could compromise product safety.

Modified atmosphere packaging and vacuum packaging for long period chilled storage of dry-cured Iberian ham.

PubMed

Parra, V; Viguera, J; Sánchez, J; Peinado, J; Espárrago, F; Gutierrez, J I; Andrés, A I

2010-04-01

Dry-cured Iberian ham slices were stored under vacuum and under four different modified atmospheres (60/40=60%N(2)+40%CO(2); 70/30=70%N(2)+30%CO(2); 80/20=80%N(2)+20%CO(2); argon=70%argon+30%CO(2)) at 4+/-1 degrees C during 120 days. Gas composition, moisture content, pH, colour, pigment content, and lipid stability were measured, as well as sensory and microbial analysis were carried out throughout storage. A loss of intensity of red colour (a(*)-values) was observed during storage in ham slices (P<0.05). Consistently, MbFe(II)NO content also decreased throughout storage (P>0.05). Slices of ham packed in 40%CO(2) (60/40) and 30%CO(2) (70/30) showed lower a(*)-values than the rest of the batches after 60 days (P<0.05), though differences were not evident after 120 days (P>0.05). TBARs values showed an upward trend during the storage of packaged slices (P<0.05). Vacuum-packed slices showed the lowest TBARs values and those packed with 40%CO(2), the highest. Sensory attributes did not vary significantly (P>0.05) throughout storage under refrigeration and packed either in vacuum or in modified atmospheres. No safety problems were detected in relation to the microbial quality in any case. 2009 Elsevier Ltd. All rights reserved.

Bio-protective potential of lactic acid bacteria: Effect of Lactobacillus sakei and Lactobacillus curvatus on changes of the microbial community in vacuum-packaged chilled beef.

PubMed

Zhang, Yimin; Zhu, Lixian; Dong, Pengcheng; Liang, Rongrong; Mao, Yanwei; Qiu, Shubing; Luo, Xin

2018-04-01

This study was to determine the bacterial diversity and monitor the community dynamic changes during storage of vacuum-packaged sliced raw beef as affected by Lactobacillus sakei and Lactobacillus curvatus . L. sakei and L. curvatus were separately incubated in vacuumed-packaged raw beef as bio-protective cultures to inhibit the naturally contaminating microbial load. Dynamic changes of the microbial diversity of inoculated or non-inoculated (control) samples were monitored at 4°C for 0 to 38 days, using polymerase chain reaction-denaturing gradient gel electrophoresis (PCR-DGGE). The DGGE profiles of DNA directly extracted from non-inoculated control samples highlighted the order of appearance of spoilage bacteria during storage, showing that Enterbacteriaceae and Pseudomonas fragi emerged early, then Brochothrix thermosphacta shared the dominant position, and finally, Pseudomonas putida showed up became predominant. Compared with control, the inoculation of either L. sakei or L. curvatus significantly lowered the complexity of microbial diversity and inhibited the growth of spoilage bacteria (p<0.05). Interestingly, we also found that the dominant position of L. curvatus was replaced by indigenous L. sakei after 13 d for L. curvatus -inoculated samples. Plate counts on selective agars further showed that inoculation with L. sakei or L. curvatus obviously reduced the viable counts of Enterbacteraceae , Pseudomonas spp. and B. thermosphacta during later storage (p< 0.05), with L. sakei exerting greater inhibitory effect. Inoculation with both bio-protective cultures also significantly decreased the total volatile basic nitrogen values of stored samples (p<0.05). Taken together, the results proved the benefits of inoculation with lactic acid bacteria especially L. sakei as a potential way to inhibit growth of spoilage-related bacteria and improve the shelf life of vacuum-packaged raw beef.

Lithographic chip identification: meeting the failure analysis challenge

NASA Astrophysics Data System (ADS)

Perkins, Lynn; Riddell, Kevin G.; Flack, Warren W.

1992-06-01

This paper describes a novel method using stepper photolithography to uniquely identify individual chips for permanent traceability. A commercially available 1X stepper is used to mark chips with an identifier or `serial number' which can be encoded with relevant information for the integrated circuit manufacturer. The permanent identification of individual chips can improve current methods of quality control, failure analysis, and inventory control. The need for this technology is escalating as manufacturers seek to provide six sigma quality control for their products and trace fabrication problems to their source. This need is especially acute for parts that fail after packaging and are returned to the manufacturer for analysis. Using this novel approach, failure analysis data can be tied back to a particular batch, wafer, or even a position within a wafer. Process control can be enhanced by identifying the root cause of chip failures. Chip identification also addresses manufacturers concerns with increasing incidences of chip theft. Since chips currently carry no identification other than the manufacturer's name and part number, recovery efforts are hampered by the inability to determine the sales history of a specific packaged chip. A definitive identifier or serial number for each chip would address this concern. The results of chip identification (patent pending) are easily viewed through a low power microscope. Batch number, wafer number, exposure step, and chip location within the exposure step can be recorded, as can dates and other items of interest. An explanation of the chip identification procedure and processing requirements are described. Experimental testing and results are presented, and potential applications are discussed.

Behavior of Listeria monocytogenes at 7 degrees C in commercial turkey breast, with or without antimicrobials, after simulated contamination for manufacturing, retail and consumer settings.

PubMed

Lianou, Alexandra; Geornaras, Ifigenia; Kendall, Patricia A; Scanga, John A; Sofos, John N

2007-08-01

Uncured turkey breast, commercially available with or without a mixture of potassium lactate and sodium diacetate, was sliced, inoculated with a 10-strain composite of Listeria monocytogenes, vacuum-packaged, and stored at 4 degrees C, to simulate contamination after a lethal processing step at the plant. At 5, 15, 25 and 50 days of storage, packages were opened, slices were tested, and bags with remaining slices were reclosed with rubber bands; this simulated home use of plant-sliced and -packaged product. At the same above time intervals, portions of original product (stored at 4 degrees C in original processing bags) were sliced and inoculated as above, and packaged in delicatessen bags, simulating contamination during slicing/handling at retail or home. Both sets of bags were stored aerobically at 7 degrees C for 12 days to simulate home storage. L. monocytogenes populations were lower (P<0.05) during storage in turkey breast containing a combination of lactate and diacetate compared to product without antimicrobials under both contamination scenarios. Due to prolific growth of the pathogen under the plant-contamination scenario in product without lactate-diacetate during vacuum-packaged storage (4 degrees C), populations at 3 days of aerobic storage (7 degrees C) of such product ranged from 4.6 to 7.4 log cfu/cm(2). Under the retail/home-contamination scenario, mean growth rates (log cfu/cm(2)/day) of the organism during aerobic storage ranged from 0.14 to 0.16, and from 0.25 to 0.51, in product with and without lactate-diacetate, respectively; growth rates in turkey breast without antimicrobials decreased (P<0.05) with age of the product. Overall, product without antimicrobials inoculated to simulate plant-contamination and product with lactate-diacetate inoculated to simulate retail/home-contamination were associated with the highest and lowest pathogen levels during aerobic storage at 7 degrees C, respectively. However, 5- and 15-day-old turkey breast without lactate-diacetate stored aerobically for 12 days resulted in similar pathogen levels (7.3-7.7 log cfu/cm(2)), irrespective of contamination scenario.

Lactic acid bacteria of meat and meat products.

PubMed

Egan, A F

1983-09-01

When the growth of aerobic spoilage bacteria is inhibited, lactic acid bacteria may become the dominant component of the microbial flora of meats. This occurs with cured meats and with meats packaged in films of low gas permeability. The presence of a flora of psychrotrophic lactic acid bacteria on vacuum-packaged fresh chilled meats usually ensures that shelf-life is maximal. When these organisms spoil meats it is generally by causing souring, however other specific types of spoilage do occur. Some strains cause slime formation and greening of cured meats, and others may produce hydrogen sulphide during growth on vacuum-packaged beef. The safety and stability of fermented sausages depends upon fermentation caused by lactic acid bacteria. Overall the presence on meats of lactic acid bacteria is more desirable than that of the types of bacteria they have replaced.

New class of microminiature Joule — Thomson refrigerator and vacuum package

NASA Astrophysics Data System (ADS)

Paugh, Robert L.

1990-12-01

Progress is reported on the development of a two-stage, fast cooldown Joule — Thomson refrigerator using nitrogen gas and a nitrogen — hydrocarbon gas mixture as the refrigerants. The refrigerator incorporates a microminiature Venturi pump to reduce the pressure of the exhaust of the main boiler to bring the operating temperature of the cold stage to < 70 K in as little as 10 s. The vacuum package for the refrigerator contains no organic materials and is designed to provide a ten year shelf life. Special glass strengthening techniques are being used to achieve cooler survival of acceleration tests of up to 100 000g.

The effectiveness of triclosan-incorporated plastic against bacteria on beef surfaces.

PubMed

Cutter, C N

1999-05-01

Triclosan is a nonionic, broad-spectrum, antimicrobial agent that has been incorporated into a variety of personal hygiene products, including hand soaps, deodorants, shower gels, mouthwashes, and toothpastes. In this study, plastic containing 1,500 ppm of triclosan was evaluated in plate overlay assays and meat experiments as a means of reducing populations of bacteria. Plate overlay assays indicated that the triclosan-incorporated plastic (TIP) inhibited the following organisms: Brochothrix thermosphacta ATCC 11509, Salmonella Typhimurium ATCC 14028, Staphylococcus aureus ATCC 12598, Bacillus subtilis ATCC 6051, Shigella flexneri ATCC 12022, Escherichia coli ATCC 25922, and several strains of E. coli O157:H7. In meat experiment 1, irradiated, lean beef surfaces inoculated with B. thermosphacta, Salmonella Typhimurium, E. coli O157:H7, or B. subtilis were covered with TIP, vacuum packaged, and stored for 24 h at 4 degrees C. Of the organisms tested, only populations of B. thermosphacta were slightly reduced. In meat experiment 2, prerigor beef surfaces were inoculated with E. coli O157: H7, Salmonella Typhimurium, or B. thermosphacta incubated at 4 degrees C for 24 h, wrapped in TIP or control plastic, vacuum packaged, and stored at 4 degrees C for up to 14 days. There was a slight reduction in the population of the organisms after initial application with TIP. However, bacterial populations following long-term, refrigerated (4 degrees C), vacuum-packaged storage up to 14 days were not statistically (P< or =0.05) or numerically different than controls. In meat experiment 3, even TIP-wrapped, vacuum-packaged beef samples that were temperature abused at 12 degrees C did not exhibit significant (P< or =0.05) or sustainable reductions after 14 days of 4 degrees C storage. Another study indicated that populations of E. coli O157:H7 or B. thermosphacta added directly to TIP were not affected after 2 h of refrigerated storage or that the antimicrobial activity could be extracted from the plastic. Additional experiments suggest that presence of fatty acids or adipose may diminish the antimicrobial activity of TIP on meat surfaces. This study demonstrates that while antimicrobial activity is detected against bacterial cultures in antimicrobial plate assays, plastic containing 1,500 ppm of triclosan does not effectively reduce bacterial populations on refrigerated, vacuum-packaged meat surfaces.

Preliminary evaluation of glass resin materials for solar cell cover use. [on spacecraft

NASA Technical Reports Server (NTRS)

Marsik, S. J.; Swartz, C. K.; Baraona, C. R.

1978-01-01

Silicon solar cells and silicon wafers coated with a heat-curable resin consisting of alternating Si-O atoms were subjected to three tests to evaluate the potential utility of this coating in space environments. These included UV irradiation in vacuum at an intensity of 10 air mass zero UV energy-equivalent solar constants for 728 hours followed by a long thermal cycle; 15 thermal shock cycles between 100 C and minus 196 C; and high temperature and humidity (65 C at 90% relative humidity). The UV tests resulted in a 8 to 24% loss in short-circuit current and darkening of the covers. Modification of the resin to provide a better match between the coefficients of expansion of the resin and silicon improved resistance to thermal shock, but also increased the darkening effect under UV irradiation. Silicon wafers coated with the resin were not adversely affected by the temperature/humidity test.

Modular packaging concept for MEMS and MOEMS

NASA Astrophysics Data System (ADS)

Stenchly, Vanessa; Reinert, Wolfgang; Quenzer, Hans-Joachim

2017-11-01

Wherever technical systems detect objects in their environment or interact with people, optical devices may play an important role. Light can be relatively easily produced and spatially and temporally modulated. Laser can project sharp images over long distances or cut materials in short distances. Depending on the wavelength an invisible scanning in near infrared for gesture recognition is possible as well as a projection of brilliant colour images. For several years, the Fraunhofer ISIT develops Opto-Packaging processes based on the viscous reshaping of glass wafers: First, hermetically sealed laser micro-mirror scanners WLP with inclined windows deflect in the central light reflex of the window out of the image area. Second, housing with lateral light exit permits hermetic sealing of edge-emitting lasers for highest reliability and durability. Such systems are currently experiencing an extremely high interest of the industry in all segments, from consumer to automotive through to materials processing. Our modular Opto-Packaging platform enables fast product developments. Housing for opto mechanical MEMS devices are equipped with inclined windows to minimize distortion, stray light and reflection losses. The hot viscous glass forming technology is also applied to functionalized substrate wafers which possess areas with high heat dissipation in addition to thermally insulating areas. Electrical contacts may be realized with metal filled vias or TGV (Through Glass Vias). The modular system reduces the development times for new, miniaturized optical systems so that manufacturers can focus on the essentials in their development, namely their product functionalities.

Strain of laser annealed silicon surfaces

NASA Astrophysics Data System (ADS)

Nemanich, R. J.; Haneman, D.

1982-05-01

High resolution Raman scattering measurements have been carried out on pulse and continuous-wave laser annealed silicon samples with various surface preparations. These included polished and ion-bombarded wafers, and saw-cut crystals. The pulse annealing treatments were carried out in ultrahigh vacuum and in air. The residual strain was inferred from the frequency shift of the first-order Raman active mode of Si, and was detectable in the range 10-2-10-3 in all except the polished samples.

Method and apparatus for in-cell vacuuming of radiologically contaminated materials

DOEpatents

Spadaro, Peter R.; Smith, Jay E.; Speer, Elmer L.; Cecconi, Arnold L.

1987-01-01

A vacuum air flow operated cyclone separator arrangement for collecting, handling and packaging loose contaminated material in accordance with acceptable radiological and criticality control requirements. The vacuum air flow system includes a specially designed fail-safe prefilter installed upstream of the vacuum air flow power supply. The fail-safe prefilter provides in-cell vacuum system flow visualization and automatically reduces or shuts off the vacuum air flow in the event of an upstream prefilter failure. The system is effective for collecting and handling highly contaminated radiological waste in the form of dust, dirt, fuel element fines, metal chips and similar loose material in accordance with radiological and criticality control requirements for disposal by means of shipment and burial.

Wafer hot spot identification through advanced photomask characterization techniques: part 2

NASA Astrophysics Data System (ADS)

Choi, Yohan; Green, Michael; Cho, Young; Ham, Young; Lin, Howard; Lan, Andy; Yang, Richer; Lung, Mike

2017-03-01

Historically, 1D metrics such as Mean to Target (MTT) and CD Uniformity (CDU) have been adequate for mask end users to evaluate and predict the mask impact on the wafer process. However, the wafer lithographer's process margin is shrinking at advanced nodes to a point that classical mask CD metrics are no longer adequate to gauge the mask contribution to wafer process error. For example, wafer CDU error at advanced nodes is impacted by mask factors such as 3-dimensional (3D) effects and mask pattern fidelity on sub-resolution assist features (SRAFs) used in Optical Proximity Correction (OPC) models of ever-increasing complexity. To overcome the limitation of 1D metrics, there are numerous on-going industry efforts to better define wafer-predictive metrics through both standard mask metrology and aerial CD methods. Even with these improvements, the industry continues to struggle to define useful correlative metrics that link the mask to final device performance. In part 1 of this work, we utilized advanced mask pattern characterization techniques to extract potential hot spots on the mask and link them, theoretically, to issues with final wafer performance. In this paper, part 2, we complete the work by verifying these techniques at wafer level. The test vehicle (TV) that was used for hot spot detection on the mask in part 1 will be used to expose wafers. The results will be used to verify the mask-level predictions. Finally, wafer performance with predicted and verified mask/wafer condition will be shown as the result of advanced mask characterization. The goal is to maximize mask end user yield through mask-wafer technology harmonization. This harmonization will provide the necessary feedback to determine optimum design, mask specifications, and mask-making conditions for optimal wafer process margin.

Reduction of the potential energy barrier and resistance at wafer-bonded n-GaAs/n-GaAs interfaces by sulfur passivation

NASA Astrophysics Data System (ADS)

Jackson, Michael J.; Jackson, Biyun L.; Goorsky, Mark S.

2011-11-01

Sulfur passivation and subsequent wafer-bonding treatments are demonstrated for III-V semiconductor applications using GaAs-GaAs direct wafer-bonded structures. Two different sulfur passivation processes are addressed. A dry sulfur passivation method that utilizes elemental sulfur vapor activated by ultraviolet light in vacuum is compared with aqueous sulfide and native-oxide-etch treatments. The electrical conductivity across a sulfur-treated 400 - °C-bonded n-GaAs/n-GaAs interface significantly increased with a short anneal (1-2 min) at elevated temperatures (500-600 °C). Interfaces treated with the NH4OH oxide etch, on the other hand, exhibited only mild improvement in accordance with previously published studies in this area. TEM and STEM images revealed similar interfacial microstructure changes with annealing for both sulfur-treated and NH4OH interfaces, whereby some areas have direct semiconductor-semiconductor contact without any interfacial layer. Fitting the observed temperature dependence of zero-bias conductance using a model for tunneling through a grain boundary reveals that the addition of sulfur at the interface lowered the interfacial energy barrier by 0.2 eV. The interface resistance for these sulfur-treated structures is 0.03 Ω.cm at room temperature. These results emphasize that sulfur-passivation techniques reduce interface states that otherwise limit the implementation of wafer bonding for high-efficiency solar cells and other devices.

Sodium chloride-induced filamentation and alternative gene expression of fts, murZ, and gnd in Listeria monocytogenes 08-5923 on vacuum-packaged ham.

PubMed

Liu, Xiaoji; Miller, Petr; Basu, Urmila; McMullen, Lynn M

2014-11-01

The aim of this study was to examine the filament formation and differential gene expression of Listeria monocytogenes 08-5923 grown on refrigerated vacuum-packaged ham products with various NaCl concentrations. Filament formation of L. monocytogenes was observed on ham products with 1.35% and 2.35% NaCl, which was monitored using flow cytometry by measuring forward light scatter. Quantitative real-time PCR was used to study the differential expression of genes in filamented cells of L. monocytogenes grown on hams following 2 or 3 months of storage at 4 °C. The genes involved in cell division (ftsX/lmo2506), cell wall synthesis (murZ/lmo2552), and NADPH production (gnd/lmo1376) were significantly downregulated in filamented cells of L. monocytogenes grown on ham with 2.35% NaCl stored at 4 °C. To our knowledge, this study reports the first evidence of filament formation of Listeria grown on meat products, which could impact the food safety risk and tolerance levels of L. monocytogenes set by regulatory agencies. © 2014 Federation of European Microbiological Societies. Published by John Wiley & Sons Ltd. All rights reserved.

Cu Pillar Low Temperature Bonding and Interconnection Technology of for 3D RF Microsystem

NASA Astrophysics Data System (ADS)

Shi, G. X.; Qian, K. Q.; Huang, M.; Yu, Y. W.; Zhu, J.

2018-03-01

In this paper 3D interconnects technologies used Cu pillars are discussed with respect to RF microsystem. While 2.5D Si interposer and 3D packaging seem to rely to cu pillars for the coming years, RF microsystem used the heterogeneous chip such as GaAs integration with Si interposers should be at low temperature. The pillars were constituted by Cu (2 micron) -Ni (2 micron) -Cu (3 micron) -Sn (1 micron) multilayer metal and total height is 8 micron on the front-side of the wafer by using electroplating. The wafer backside Cu pillar is obtained by temporary bonding, thinning and silicon surface etching. The RF interposers are stacked by Cu-Sn eutectic bonding at 260 °C. Analyzed the reliability of different pillar bonding structure.

Heterogeneous integration based on low-temperature bonding for advanced optoelectronic devices

NASA Astrophysics Data System (ADS)

Higurashi, Eiji

2018-04-01

Heterogeneous integration is an attractive approach to manufacturing future optoelectronic devices. Recent progress in low-temperature bonding techniques such as plasma activation bonding (PAB) and surface-activated bonding (SAB) enables a new approach to integrating dissimilar materials for a wide range of photonics applications. In this paper, low-temperature direct bonding and intermediate layer bonding techniques are focused, and their state-of-the-art applications in optoelectronic devices are reviewed. First, we describe the room-temperature direct bonding of Ge/Ge and Ge/Si wafers for photodetectors and of GaAs/SiC wafers for high-power semiconductor lasers. Then, we describe low-temperature intermediate layer bonding using Au and lead-free Sn-3.0Ag-0.5Cu solders for optical sensors and MEMS packaging.

Packaging Concerns and Techniques for Large Devices: Challenges for Complex Electronics

NASA Technical Reports Server (NTRS)

LaBel, Kenneth A.; Sampson, Michael J.

2010-01-01

NASA is going to have to accept the use of non-hermetic packages for complex devices. There are a large number of packaging options available. Space application subjects the packages to stresses that they were probably not designed for (vacuum for instance). NASA has to find a way of having assurance in the integrity of the packages. There are manufacturers interested in qualifying non-hermetic packages to MIL-PRF-38535 Class V. Government space users are agreed that Class V should be for hermetic packages only. NASA is working on a new Class for non-hermetic packages for M38535 Appendix B, "Class Y". Testing for package integrity will be required but can be package specific as described by a Package Integrity Test Plan. The plan is developed by the manufacturer and approved by DSCC and government space.

Microbial growth, communities and sensory characteristics of vacuum and modified atmosphere packaged lamb shoulders.

PubMed

Kiermeier, Andreas; Tamplin, Mark; May, Damian; Holds, Geoff; Williams, Michelle; Dann, Alison

2013-12-01

Packaging fresh lamb in a vacuum (VAC) versus a 100% CO2 modified atmosphere (MAP) may influence product shelf-life and the bacterial communities. While VAC is a common packing method and 100% CO2 MAP is used in some countries, there is little information about how these different techniques affect the growth of spoilage bacteria and sensory attributes of lamb. The aim of this study was to assess changes in microbiological and organoleptic properties, and determine differences in microbial communities by terminal restriction fragment length polymorphism (TRFLP) and 454 pyrosequencing, in bone-in (BI) and bone-out (BO) MAP- and VAC-packed lamb shoulders stored at -0.3 °C over 12 wk. VAC and MAP lamb shoulders were acceptable in sensory test scores over 12 wk of storage at -0.3 °C, despite total viable count (TVC) and lactic acid bacteria (LAB) levels increasing to 8 log10 CFU/cm(2) for VAC lamb and 4-6 log10 CFU/cm(2) for MAP lamb. Similar to the sensory results, there were no significant differences in microbial communities between BI and BO product. However, types of bacteria were different between VAC and MAP packaging. Specifically, while VAC shoulder became dominated by Carnobacterium spp. in the middle of the storage period, the MAP shoulder microbial population remained similar from the start until later storage times. Copyright © 2013 Elsevier Ltd. All rights reserved.

Nightshade Prototype Experiments (Silverleaf)

DOE Office of Scientific and Technical Information (OSTI.GOV)

Danielson, Jeremy; Bauer, Amy L.

2016-12-23

The Red Sage campaign is a series of subcritical dynamic plutonium experiments designed to measure ejecta. Nightshade, the first experiments in Red Sage scheduled for fiscal year 2019, will measure the amount of ejecta emission into vacuum from a double-­shocked plutonium surface. To address the major technical risks in Nightshade, a Level 2 milestone was developed for fiscal year 2016. Silverleaf, a series of four experiments, was executed at the Los Alamos National Laboratory in July and August 2016 to demonstrate a prototype of the Nightshade package and to satisfy this Level 2 milestone. This report is documentation that Redmore » Sage Level 2 milestone requirements were successfully met.« less

High-sensitivity Leak-testing Method with High-Resolution Integration Technique

NASA Astrophysics Data System (ADS)

Fujiyoshi, Motohiro; Nonomura, Yutaka; Senda, Hidemi

A high-resolution leak-testing method named HR (High-Resolution) Integration Technique has been developed for MEMS (Micro Electro Mechanical Systems) sensors such as a vibrating angular-rate sensor housed in a vacuum package. Procedures of the method to obtain high leak-rate resolution were as follows. A package filled with helium gas was kept in a small accumulation chamber to accumulate helium gas leaking from the package. After the accumulation, the accumulated helium gas was introduced into a mass spectrometer in a short period of time, and the flux of the helium gas was measured by the mass spectrometer as a transient phenomenon. The leak-rate of the package was calculated from the detected transient waveform of the mass spectrometer and the accumulation time of the helium gas in the accumulation chamber. Because the density of the helium gas in the vacuum chamber increased and the accumulated helium gas was measured in a very short period of time with the mass spectrometer, the peak strength of the transient waveform became high and the signal to noise ratio was much improved. The detectable leak-rate resolution of the technique reached 1×10-15 (Pa·m3/s). This resolution is 103 times superior to that of the conventional helium vacuum integration method. The accuracy of the measuring system was verified with a standard helium gas leak source. The results were well matched between theoretical calculation based on the leak-rate of the source and the experimental results within only 2% error.

Silicon Wafer Advanced Packaging (SWAP). Multichip Module (MCM) Foundry Study. Version 2

DTIC Science & Technology

1991-04-08

Next Layer Dielectric Spacing - Additional Metal Thickness Impact on Dielectric Uniformity/Adhiesion. The first step in .!Ie EPerimental design would be... design CAM - computer aided manufacturing CAE - computer aided engineering CALCE - computer aided life cycle engineering center CARMA - computer aided...expansion 5 j- CVD - chemical vapor deposition J . ..- j DA - design automation J , DEC - Digital Equipment Corporation --- DFT - design for testability

A Z-Axis Quartz Cross-Fork Micromachined Gyroscope Based on Shear Stress Detection

PubMed Central

Xie, Liqiang; Wu, Xuezhong; Li, Shengyi; Wang, Haoxu; Su, Jianbin; Dong, Peitao

2010-01-01

Here we propose a novel quartz micromachined gyroscope. The sensor has a simple cross-fork structure in the x-y plane of quartz crystal. Shear stress rather than normal stress is utilized to sense Coriolis’ force generated by the input angular rate signal. Compared to traditional quartz gyroscopes, which have two separate sense electrodes on each sidewall, there is only one electrode on each sidewall of the sense beam. As a result, the fabrication of the electrodes is simplified and the structure can be easily miniaturized. In order to increase sensitivity, a pair of proof masses is attached to the ends of the drive beam, and the sense beam has a tapered design. The structure is etched from a z-cut quartz wafer and the electrodes are realized by direct evaporation using the aperture mask method. The drive mode frequency of the prototype is 13.38 kHz, and the quality factor is approximately 1,000 in air. Therefore, the gyroscope can work properly without a vacuum package. The measurement ability of the shear stress detection design scheme is validated by the Coriolis’ force test. The performance of the sensor is characterized on a precision rate table using a specially designed readout circuit. The experimentally obtained scale factor is 1.45 mV/°/s and the nonlinearity is 3.6% in range of ±200 °/s. PMID:22294887

7 CFR 319.73-3 - Conditions for transit movement of certain products through Puerto Rico or Hawaii.

Code of Federal Regulations, 2012 CFR

2012-01-01

... Agriculture (Continued) ANIMAL AND PLANT HEALTH INSPECTION SERVICE, DEPARTMENT OF AGRICULTURE FOREIGN... not limited to, sealed cartons, airtight containers, or vacuum packaging. Samples of unroasted coffee received by mail but not packaged in this manner are subject to inspection and safeguard by an inspector...

7 CFR 319.73-3 - Conditions for transit movement of certain products through Puerto Rico or Hawaii.

Code of Federal Regulations, 2011 CFR

2011-01-01

... Agriculture (Continued) ANIMAL AND PLANT HEALTH INSPECTION SERVICE, DEPARTMENT OF AGRICULTURE FOREIGN... not limited to, sealed cartons, airtight containers, or vacuum packaging. Samples of unroasted coffee received by mail but not packaged in this manner are subject to inspection and safeguard by an inspector...

7 CFR 319.73-3 - Conditions for transit movement of certain products through Puerto Rico or Hawaii.

Code of Federal Regulations, 2014 CFR

2014-01-01

... Agriculture (Continued) ANIMAL AND PLANT HEALTH INSPECTION SERVICE, DEPARTMENT OF AGRICULTURE FOREIGN... not limited to, sealed cartons, airtight containers, or vacuum packaging. Samples of unroasted coffee received by mail but not packaged in this manner are subject to inspection and safeguard by an inspector...

7 CFR 319.73-3 - Conditions for transit movement of certain products through Puerto Rico or Hawaii.

Code of Federal Regulations, 2010 CFR

2010-01-01

... Agriculture (Continued) ANIMAL AND PLANT HEALTH INSPECTION SERVICE, DEPARTMENT OF AGRICULTURE FOREIGN... not limited to, sealed cartons, airtight containers, or vacuum packaging. Samples of unroasted coffee received by mail but not packaged in this manner are subject to inspection and safeguard by an inspector...

7 CFR 319.73-3 - Conditions for transit movement of certain products through Puerto Rico or Hawaii.

Code of Federal Regulations, 2013 CFR

2013-01-01

... Agriculture (Continued) ANIMAL AND PLANT HEALTH INSPECTION SERVICE, DEPARTMENT OF AGRICULTURE FOREIGN... not limited to, sealed cartons, airtight containers, or vacuum packaging. Samples of unroasted coffee received by mail but not packaged in this manner are subject to inspection and safeguard by an inspector...

Lipid oxidation and color changes of goose meat stored under vacuum and modified atmosphere conditions.

PubMed

Orkusz, A; Haraf, G; Okruszek, A; Werenska-Sudnik, M

2017-03-01

The objective of the work was to investigate the color and lipid oxidation changes of goose breast meat packaged in vacuum and modified atmosphere (MA) conditions consisting of 80% O2, 20% CO2, and stored in refrigerated conditions at 4°C. Color stability was monitored by determining total heme pigments concentration; relative concentration of myoglobin, oxymyoglobin, and metmyoglobin; parameters of color L*, a*, b*, and sensory evaluation of the surface color. Lipid stability was measured by determining thiobarbituric acid reactive substances (TBARS). The samples were examined in 24 h after slaughter (unpacked muscles) and on d 4, 7, 9, 11 of storage (muscles packed in vacuum and in MA). Through the time of storage, samples packed in MA had higher TBARS values in comparison to the meat packed in vacuum. For samples packed in two types of atmospheres, the total pigments concentration decreased gradually within 11 d of storage. It was observed that relative metmyoglobin concentration increased whereas relative oxymyoglobin concentration decreased in total heme pigments in the MA stored muscle. The relative concentration of all three myoglobin forms sample packed in vacuum remained unchanged. The color parameters (L*, a*, b*) did not change for 11 d of storage for the vacuum packed meat. The value of the color parameter a* decreased and the value of the color parameters L* and b* increased in the samples packaged in MA. The data prove that if you store goose meat in MA (consisting of 80% O2, 20% CO2) or vacuum, the unchanged surface color is preserved for 9 and 11 day, respectively.Vacuum appears to be a better method as regards the maintaining of lipid stability in goose meat. © 2016 Poultry Science Association Inc.

Dissolved carbon dioxide and oxygen concentrations in purge of vacuum-packaged pork chops and the relationship to shelf life and models for estimating microbial populations.

PubMed

Adams, K R; Niebuhr, S E; Dickson, J S

2015-12-01

The objectives of this study were to determine the dissolved CO2 and O2 concentrations in the purge of vacuum-packaged pork chops over a 60 day storage period, and to elucidate the relationship of dissolved CO2 and O2 to the microbial populations and shelf life. As the populations of spoilage bacteria increased, the dissolved CO2 increased and the dissolved O2 decreased in the purge. Lactic acid bacteria dominated the spoilage microflora, followed by Enterobacteriaceae and Brochothrix thermosphacta. The surface pH decreased to 5.4 due to carbonic acid and lactic acid production before rising to 5.7 due to ammonia production. A mathematical model was developed which estimated microbial populations based on dissolved CO2 concentrations. Scanning electron microscope images were also taken of the packaging film to observe the biofilm development. The SEM images revealed a two-layer biofilm on the packaging film that was the result of the tri-phase growth environment. Copyright © 2015 Elsevier Ltd. All rights reserved.

Effect of packaging type during postmortem aging and degree of doneness on pork chop sensory traits of loins selected to vary in color and marbling.

PubMed

Klehm, B J; King, D A; Dilger, A C; Shackelford, S D; Boler, D D

2018-05-04

The objective was to determine the interactions between packaging type and degree of doneness on sensory traits of pork loins classified based on the newly proposed USDA quality grades. A total of 144 loins were selected from 2 groups of pigs (lean growth or meat quality production focus) to represent as much variation in visual color and marbling as possible. Selection was achieved with a VQG grading camera. The ventral surface of the loins was evaluated for loin quality traits at 1 d postmortem. At 2 d postmortem loins were sliced into 28-mm-thick chops. Chop within each loin was randomly assigned to either individual vacuum packages or to individual Styrofoam trays and overwrapped in polyvinyl chloride (PVC) oxygen permeable film. Overwrapped PVC packages were then placed in bulk packages and flushed with a gas mixture that contained approximately 0.4% carbon monoxide, 30% carbon dioxide, and 80% nitrogen. Vacuum-packaged chops were aged until 14 d postmortem. Chops packaged in PVC overwrap were aged until 9 d postmortem in the bulk packages, then placed on simulated retail display until 14 d postmortem. Chops from each packaging type were cooked to an internal temperature of either 63 °C or 71 °C for the evaluation of slice shear force (SSF) or for evaluation of tenderness, juiciness, and flavor by a trained panel. Data were analyzed as split-split plot design with production focus of the pigs, proposed USDA quality grade, packaging type, and degree of doneness as fixed effects. While there were main effect differences between production focuses, there were no interactions with production focus. There were also no 3-way (P ≥ 0.19) interactions and only one 2-way interaction among quality grade, packaging type, or degree of doneness. There were no differences in sensory tenderness (P = 0.30), juiciness (P = 0.49), flavor (P = 0.89), SSF (P = 0.13), or cook loss (P = 0.06) among USDA quality grades. There were no differences in sensory tenderness (P = 0.06), juiciness (P = 0.32), flavor (P = 0.74), SSF (P = 0.99), or cook loss (P = 0.12) between chops aged in vacuum packages or PVC packages. Chops cooked to 63 °C were 4.6% more tender (P < 0.0001), 10.1% juicier (P < 0.0001), and 2.9% less flavorful (P = 0.01) than chops cooked to 71 °C. These data suggest that cooking chops to 63 °C rather than 71 °C was a more effective way to improve tenderness and juiciness than selecting chops of a certain quality grade or altering packaging postmortem.

New polymeric materials for designing photoresistors and photodetective assemblies based on CdHgTe

NASA Astrophysics Data System (ADS)

Khitrova, L. M.; Troshkin, Y. S.; Belyaev, V. P.; Popovyan, G. E.; Kiseleva, L. V.

1999-06-01

In order to improve quality of photodetectors and photodetective assemblies two new cryo- and chemically resistant adhesives were developed: epoxy-silico-organic adhesive `(Phi) X-5P' and acrylic `OPHOH-2' adhesive for gluing of CdHgTe wafers to a substrate `XCK-H' vacuum-tight modified adhesive is used for attaching of inlet windows and glass holder elements. `OPUOH-65' vibration damping thixotropic composition was developed for mounting of multi- layer printed circuits.

Microbiological safety of retail vacuum-packed and modified-atmosphere-packed cooked meats at end of shelf life.

PubMed

Sagoo, S K; Little, C L; Allen, G; Williamson, K; Grant, K A

2007-04-01

A study of retail modified-atmosphere-packed and vacuum-packed cooked ready-to-eat meats was undertaken from September through mid-November 2003 to determine the microbiological quality at the end of shelf life and to establish any risk factors in the production, storage, and display of this product. Examination of 2,981 samples using Microbiological Guidelines criteria revealed that 66% were of satisfactory or acceptable microbiology quality, 33% were of unsatisfactory quality mainly due to high aerobic colony counts and Enterobacteriaceae concentrations, and 1% were of unacceptable quality due to the presence of Listeria monocytogenes at 100 CFU/g or higher (27 samples; range of 10(2) to 106 CFU/g) and Campylobacter jejuni (1 sample), indicating a risk to health. All samples at the end of the shelf life had satisfactory (<20 CFU/g) and/or acceptable (<102 CFU/g) levels of Staphylococcus aureus and Clostridium perfringens, four samples (<1%) had unsatisfactory levels of Escherichia coli (range of 102 to 106 CFU/g) and 5.5% of the samples contained L. monocytogenes at <20 CFU/g (4.8%) or between 20 and 100 CFU/g (0.7%). More samples of chicken (45%; 224 of 495 samples), beef (43%; 160 of 371 samples), and turkey (41%; 219 of 523 samples) were of unsatisfactory or unacceptable quality compared with ham (23%; 317 of 1,351 samples) or pork (32%; 67 of 206 samples). Twelve different L. monocytogenes typing characters (serotype-amplified fragment length polymorphism type-phage type) were evaluated for isolates recovered from samples of unacceptable quality, and the 1/2-IX-NT type was recovered from almost half (48%) of these samples. Salmonella was not detected in any samples examined. Risk factors identified for cooked meats that were microbiologically contaminated more frequently included vacuum packaging, packaging on retail premises, slicing, temperature not monitored in display units, and no hazard analysis system in place. Results from this study also suggest that the shelf life assigned to some modified-atmosphere-packed and vacuum-packed meats may not be appropriate.

MEMS/MOEMS foundry services at INO

NASA Astrophysics Data System (ADS)

García-Blanco, Sonia; Ilias, Samir; Williamson, Fraser; Généreux, Francis; Le Noc, Loïc; Poirier, Michel; Proulx, Christian; Tremblay, Bruno; Provençal, Francis; Desroches, Yan; Caron, Jean-Sol; Larouche, Carl; Beaupré, Patrick; Fortin, Benoit; Topart, Patrice; Picard, Francis; Alain, Christine; Pope, Timothy; Jerominek, Hubert

2010-06-01

In the MEMS manufacturing world, the "fabless" model is getting increasing importance in recent years as a way for MEMS manufactures and startups to minimize equipment costs and initial capital investment. In order for this model to be successful, the fabless company needs to work closely with a MEMS foundry service provider. Due to the lack of standardization in MEMS processes, as opposed to CMOS microfabrication, the experience in MEMS development processes and the flexibility of the MEMS foundry are of vital importance. A multidisciplinary team together with a complete microfabrication toolset allows INO to offer unique MEMS foundry services to fabless companies looking for low to mid-volume production. Companies that benefit from their own microfabrication facilities can also be interested in INO's assistance in conducting their research and development work during periods where production runs keep their whole staff busy. Services include design, prototyping, fabrication, packaging, and testing of various MEMS and MOEMS devices on wafers fully compatible with CMOS integration. Wafer diameters ranging typically from 1 inch to 6 inches can be accepted while 8-inch wafers can be processed in some instances. Standard microfabrication techniques such as metal, dielectric, and semiconductor film deposition and etching as well as photolithographic pattern transfer are available. A stepper permits reduction of the critical dimension to around 0.4 μm. Metals deposited by vacuum deposition methods include Au, Ag, Al, Al alloys, Ti, Cr, Cu, Mo, MoCr, Ni, Pt, and V with thickness varying from 5 nm to 2 μm. Electroplating of several materials including Ni, Au and In is also available. In addition, INO has developed and built a gold black deposition facility to answer customer's needs for broadband microbolometric detectors. The gold black deposited presents specular reflectance of less than 10% in the wavelength range from 0.2 μm to 100 μm with thickness ranging from 20 to 35 μm and a density of 0.3% the bulk density of gold. Two Balzers thin-film deposition instruments (BAP-800 and BAK-760) permit INO to offer optical thin film manufacturing. Recent work in this field includes the design and development of a custom filter for the James Webb Space Telescope (JWST) as collaboration with the Canadian company ComDEV. An overview of the different microfabrication foundry services offered by INO will be presented together with the most recent achievements in the field of MEMS/MOEMS.

Integrated otpical monitoring of MEMS for closed-loop control

NASA Astrophysics Data System (ADS)

Dawson, Jeremy M.; Wang, Limin; McCormick, W. B.; Rittenhouse, S. A.; Famouri, Parviz F.; Hornak, Lawrence A.

2003-01-01

Robust control and failure assessment of MEMS employed in physically demanding, mission critical applications will allow for higher degrees of quality assurance in MEMS operation. Device fault detection and closed-loop control require detailed knowledge of the operational states of MEMS over the lifetime of the device, obtained by a means decoupled from the system. Preliminary through-wafer optical monitoring research efforts have shown that through-wafer optical probing is suitable for characterizing and monitoring the behavior of MEMS, and can be implemented in an integrated optical monitoring package for continuous in-situ device monitoring. This presentation will discuss research undertaken to establish integrated optical device metrology for closed-loop control of a MUMPS fabricated lateral harmonic oscillator. Successful linear closed-loop control results using a through-wafer optical microprobe position feedback signal will be presented. A theoretical optical output field intensity study of grating structures, fabricated on the shuttle of the resonator, was performed to improve the position resolution of the optical microprobe position signal. Through-wafer microprobe signals providing a positional resolution of 2 μm using grating structures will be shown, along with initial binary Fresnel diffractive optical microelement design layout, process development, and testing results. Progress in the design, fabrication, and test of integrated optical elements for multiple microprobe signal delivery and recovery will be discussed, as well as simulation of device system model parameter changes for failure assessment.

Reducing the substrate dependent scanner leveling effect in low-k1 contact printing

NASA Astrophysics Data System (ADS)

Chang, C. S.; Tseng, C. F.; Huang, C. H.; Yang, Elvis; Yang, T. H.; Chen, K. C.

2015-03-01

As the scaling down of design rule for high-density memory device, the small depth of focus (DoF) budget may be deteriorated by focus leveling errors, which arises in unpredicted reflectivity from multilayer structures on the topographic wafer. The leveling sensors of ASML scanner use near infrared (NIR) range wavelength which can penetrate through most of films using in semiconductor fabrication such as photo-resist, bottom anti reflective coating (BARC) and dielectric materials. Consequently, the reflected light from underlying substructures would disturb leveling sensors from accurate leveling. The different pattern densities and layout characteristics between array and periphery of a memory chip are expected to result in different leveling signals. Furthermore, the process dependent variations between wafer central and edge areas are also considered to yield different leveling performances during wafer exposure. In this study, lower blind contact immunity was observed for peripheral contacts comparing to the array contacts especially around wafer edge region. In order to overcome this problem, a series of investigations have been carried out. The wafer edge leveling optimization through circuit dependent focus edge clearance (CDFEC) option doesn't get improvement. Air gauge improved process leveling (AGILE) function of ASML immersion scanner doesn't show improved result either. The ILD uniformity improvement and step height treatments around wafer edge such as edge exclusion of film deposition and bevel etching are also ineffective to mitigate the blind contact problem of peripheral patterns. Altering the etch hard-mask stack is finally found to be an effective approach to alleviate the issue. For instance, through either containing high temperature deposition advanced patterning film (APF) in the hard-mask or inserting higher opaque film such as amorphous Si in between the hard-mask stack.

Screening of lactic acid bacteria from vacuum packaged beef for antimicrobial activity

PubMed Central

Oliveira, Roseane B. P.; de L. Oliveira, Afonso; Glória, M. Beatriz A.

2008-01-01

The objective of this study was to isolate lactic acid bacteria (LAB) from vacuum packaged beef and to investigate their antagonist activity. LAB mean counts of 5.19 log cfu/cm2 were obtained from five samples of vacuum packaged beef. Two hundred isolates were selected and screened for the inhibitory effect on five ATCC reference Lactobacillus strains. Thirty six isolates showed activity in the agar spot test against at least two of the indicator strains. However, only six cell free supernatants (CFS) from these isolates exhibited activity against the indicator strains using the well-diffusion test and conditions that eliminated the effects of organic acids and hydrogen peroxide. L. acidophilus was the most sensitive indicator tested, whereas L. plantarum and L. fermentum were the most resistant ones. Identification by MIDI system indicated that these LAB isolates were Lactococcus lactis subsp. cremoris, Pediococcus acidilactici, Lactobacillus delbrueckii subsp. bulgaricus and Lactobacillus casei GC subgroup A. The antagonistic factors produced by most of these LAB against L. acidophilus were resistant to heat treatment (100°C for 10 min) and stable over a wide pH range (4.0 to 9.0). These data suggest that these isolates could be used as promising hurdles aiming increased safety and extended shelf life of meat products. PMID:24031232

Thermal Hysteresis of MEMS Packaged Capacitive Pressure Sensor (CPS) Based 3C-SiC

NASA Astrophysics Data System (ADS)

Marsi, N.; Majlis, B. Y.; Mohd-Yasin, F.; Hamzah, A. A.; Mohd Rus, A. Z.

2016-11-01

Presented herein are the effects of thermal hysteresis analyses of the MEMS packaged capacitive pressure sensor (CPS). The MEMS CPS was employed on Si-on-3C-SiC wafer that was performed using the hot wall low-pressure chemical vapour deposition (LPCVD) reactors at the Queensland Micro and Nanotechnology Center (QMNC), Griffith University and fabricated using the bulk-micromachining process. The MEMS CPS was operated at an extreme temperature up to 500°C and high external pressure at 5.0 MPa. The thermal hysteresis phenomenon that causes the deflection, strain and stress on the 3C-SiC diaphragm spontaneously influence the MEMS CPS performances. The differences of temperature, hysteresis, and repeatability test were presented to demonstrate the functionality of the MEMS packaged CPS. As expected, the output hysteresis has a low hysteresis (less than 0.05%) which has the hardness greater than the traditional silicon. By utilizing this low hysteresis, it was revealed that the MEMS packaged CPS has high repeatability and stability of the sensor.

Electrical properties of Si-Si interfaces obtained by room temperature covalent wafer bonding

NASA Astrophysics Data System (ADS)

Jung, A.; Zhang, Y.; Arroyo Rojas Dasilva, Y.; Isa, F.; von Känel, H.

2018-02-01

We study covalent bonds between p-doped Si wafers (resistivity ˜10 Ω cm) fabricated on a recently developed 200 mm high-vacuum system. Oxide- and void free interfaces were obtained by argon (Ar) or neon (Ne) sputtering prior to wafer bonding at room temperature. The influence of the sputter induced amorphous Si layer at the bonding interface on the electrical behavior is accessed with temperature-dependent current-voltage measurements. In as-bonded structures, charge transport is impeded by a potential barrier of 0.7 V at the interface with thermionic emission being the dominant charge transport mechanism. Current-voltage characteristics are found to be asymmetric which can tentatively be attributed to electric dipole formation at the interface as a result of the time delay between the surface preparation of the two bonding partners. Electron beam induced current measurements confirm the corresponding asymmetric double Schottky barrier like band-alignment. Moreover, we demonstrate that defect annihilation at a low temperature of 400 °C increases the electrical conductivity by up to three orders of magnitude despite the lack of recrystallization of the amorphous layer. This effect is found to be more pronounced for Ne sputtered surfaces which is attributed to the lighter atomic mass compared to Ar, inducing weaker lattice distortions during the sputtering.

Bio-protective potential of lactic acid bacteria: Effect of Lactobacillus sakei and Lactobacillus curvatus on changes of the microbial community in vacuum-packaged chilled beef

PubMed Central

Zhang, Yimin; Zhu, Lixian; Dong, Pengcheng; Liang, Rongrong; Mao, Yanwei; Qiu, Shubing

2018-01-01

Objective This study was to determine the bacterial diversity and monitor the community dynamic changes during storage of vacuum-packaged sliced raw beef as affected by Lactobacillus sakei and Lactobacillus curvatus. Methods L. sakei and L. curvatus were separately incubated in vacuumed-packaged raw beef as bio-protective cultures to inhibit the naturally contaminating microbial load. Dynamic changes of the microbial diversity of inoculated or non-inoculated (control) samples were monitored at 4°C for 0 to 38 days, using polymerase chain reaction-denaturing gradient gel electrophoresis (PCR-DGGE). Results The DGGE profiles of DNA directly extracted from non-inoculated control samples highlighted the order of appearance of spoilage bacteria during storage, showing that Enterbacteriaceae and Pseudomonas fragi emerged early, then Brochothrix thermosphacta shared the dominant position, and finally, Pseudomonas putida showed up became predominant. Compared with control, the inoculation of either L. sakei or L. curvatus significantly lowered the complexity of microbial diversity and inhibited the growth of spoilage bacteria (p<0.05). Interestingly, we also found that the dominant position of L. curvatus was replaced by indigenous L. sakei after 13 d for L. curvatus-inoculated samples. Plate counts on selective agars further showed that inoculation with L. sakei or L. curvatus obviously reduced the viable counts of Enterbacteraceae, Pseudomonas spp. and B. thermosphacta during later storage (p< 0.05), with L. sakei exerting greater inhibitory effect. Inoculation with both bio-protective cultures also significantly decreased the total volatile basic nitrogen values of stored samples (p<0.05). Conclusion Taken together, the results proved the benefits of inoculation with lactic acid bacteria especially L. sakei as a potential way to inhibit growth of spoilage-related bacteria and improve the shelf life of vacuum-packaged raw beef. PMID:29059725

Dissolution of Oxygen Precipitate Nuclei in n-Type CZ-Si Wafers to Improve Their Material Quality: Experimental Results

DOE Office of Scientific and Technical Information (OSTI.GOV)

Sopori, Bhushan; Basnyat, Prakash; Devayajanam, Srinivas

2017-01-01

We present experimental results which show that oxygen-related precipitate nuclei (OPN) present in p-doped, n-type, Czochralski wafers can be dissolved using a flash-annealing process, yielding very high quality wafers for high-efficiency solar cells. Flash annealing consists of heating a wafer in an optical furnace to temperature between 1150 and 1250 degrees C for a short time. This process produces a large increase in the minority carrier lifetime (MCLT) and homogenizes each wafer. We have tested wafers from different axial locations of two ingots. All wafers reach nearly the same high value of MCLT. The OPN dissolution is confirmed by oxygenmore » analysis using Fourier transform infrared spectra and injection-level dependence of MCLT.« less

[Impact of storage conditions and time on herb of Lonicera macranthoides].

PubMed

Ma, Peng; Li, Long-Yun; Zhang, Ying

2014-03-01

To study the effect of different storage conditions and storage time on herb quality of Lonicera macranthoides, different packaging materials including vacuum plastic bags, plastic bags, woven bags, sealed with endometrial bags, paper bags, sack bags were selected for the study under different storage conditions including room temperature, 5 degrees C refrigerator, low temperature of - 20 degrees C refrigerator and desiccator. Twenty-four batches of samples were used for the study, and active ingredients were determined. The experimental results showed that the ingredients in each storage group changed with the storage time, storage conditions (storage environment, packaging). Under the same storage time, the storage environment (temperature, humidity) had effect on the stability of herb quality. Low temperature had less effect on herb quality. The effect of packaging on herb quality was as following: plastic vacuum packaging > woven with endometrial sealed packaging > plastic bag > woven bag > sack bags > paper bags. Under the same storage conditions, with the increase of storage time, caffeic acid content increased slowly, and other five ingredients content decreased gradually. Storage time affected significantly on the intrinsic quality (chemical composition) and appearance of herb. It is suggested that low temperature (5 degrees C), dark and sealed storage are suitable for storage of L. macranthoides herb, the storage time should be not more than 24 months.

Precision depth measurement of through silicon vias (TSVs) on 3D semiconductor packaging process.

PubMed

Jin, Jonghan; Kim, Jae Wan; Kang, Chu-Shik; Kim, Jong-Ahn; Lee, Sunghun

2012-02-27

We have proposed and demonstrated a novel method to measure depths of through silicon vias (TSVs) at high speed. TSVs are fine and deep holes fabricated in silicon wafers for 3D semiconductors; they are used for electrical connections between vertically stacked wafers. Because the high-aspect ratio hole of the TSV makes it difficult for light to reach the bottom surface, conventional optical methods using visible lights cannot determine the depth value. By adopting an optical comb of a femtosecond pulse laser in the infra-red range as a light source, the depths of TSVs having aspect ratio of about 7 were measured. This measurement was done at high speed based on spectral resolved interferometry. The proposed method is expected to be an alternative method for depth inspection of TSVs.

Development, fabrication and testing of a magnetically connected plastic vacuum probe surface sampler

NASA Technical Reports Server (NTRS)

Phillips, G. B.; Pace, V. A., Jr.

1972-01-01

The sampler utilizes permanent magnets and soft metal pole pieces to connect the cone/filter assembly to the sampling head and vacuum supply. The cone/filter assembly is packaged in a plastic container and presterilized so that the need for any human contact during the sampling procedure is completely eliminated. Microbiological tests have demonstrated that the sampling efficiency is not affected by the magnetic coupling apparatus and that the probe appears to function as efficiently as the conventional plastic and Sandia vacuum probes.

Apparatus and method for skin packaging articles

NASA Technical Reports Server (NTRS)

Madsen, B.; Pozsony, E. R.; Collin, E. E. (Inventor)

1973-01-01

A system for skin packaging articles including a loading zone for positioning articles to be packaged upon a substrate, a thermoplastic film heating and vacuum operated skin packaging zone for covering the articles with film laminated to the substrate and a slitting zone for separating and trimming the individual skin packaged articles. The articles are passed to the successive zones. The loading zone may be adapted for conveyorized instead of hand loading. In some cases, where only transverse cutting of the film web is necessary, it may be desirable to eliminate the slitting zone and remove the skin packaged article or articles directly from the packaging zone. A conveniently located operating panel contains controls for effecting automatic, semiautomatic or manual operation of the entire system of any portions in any manner desired.

Analysis and modeling of wafer-level process variability in 28 nm FD-SOI using split C-V measurements

NASA Astrophysics Data System (ADS)

Pradeep, Krishna; Poiroux, Thierry; Scheer, Patrick; Juge, André; Gouget, Gilles; Ghibaudo, Gérard

2018-07-01

This work details the analysis of wafer level global process variability in 28 nm FD-SOI using split C-V measurements. The proposed approach initially evaluates the native on wafer process variability using efficient extraction methods on split C-V measurements. The on-wafer threshold voltage (VT) variability is first studied and modeled using a simple analytical model. Then, a statistical model based on the Leti-UTSOI compact model is proposed to describe the total C-V variability in different bias conditions. This statistical model is finally used to study the contribution of each process parameter to the total C-V variability.

Utilization of fluorescence spectroscopy as a novel approach to evaluate the oxidative stability in beef retail displayed.

PubMed

Pouzo, L B; Zaritzky, N E; Pavan, E; Rossetti, L; Descalzo, A M

2016-09-01

Beef samples from grazing steers finished with different seed-supplemented diets were vacuum packaged for 3, 14 and 56days (VC) and subsequently exposed to aerobic conditions (AE) for 0 and 5days. Different fluorescent compounds of interest in the oxidation process were detected in meat, namely tryptophan residues, Schiff bases and porphyrins. Tryptophan intensity fluorescence increased with 14days of VC; while Schiff bases intensity increased (P<0.05) in beef samples stored under VC-56 and in all samples after AE-5days. Porphyrins increased (P<0.05) gradually with the extension of vacuum storage time, but were degraded in beef with long vacuum storage and 5days of AE. Higher levels of porphyrins in beef under VC were correlated (P<0.05) with lower redness and higher TBARS after AE-5. This study revealed the potential of fluorescence signals to detect oxidative changes in beef under different storage conditions using a fast and nondestructive method such as fluorescence spectroscopy. Copyright © 2016 Elsevier Ltd. All rights reserved.

Microbial profiles of commercial, vacuum-packaged, fresh pork of normal or short storage life.

PubMed

Holley, Richard A; Peirson, Michael D; Lam, Jocelyn; Tan, Kit Bee

2004-12-01

The microbial ecology of fresh vacuum-packed pork cuts during storage at -1.5 degrees C for up to 45 days was examined to characterize rates of microbial growth and pH changes in commercially prepared products of normal storage quality. Pork loins in commercial distribution with odour defects were also studied to determine a possible cause of the defects and avoid future problems. In addition, microbial profiles of pork cuts from two plants were compared, after storage for 25 days at -1.5 degrees C, to identify possible reasons for differences in the storage life of product from the plants. The effects of a change in sanitation procedures on the microbial populations of products stored for 25 days were also studied. With normal product, microbial growth in different packages progressed at different rates, reflecting differences in initial levels of bacterial contamination. All samples in the study reached 8 weeks without apparent organoleptic change and samples carried 5.8+/-1.2 log bacteria cm(-2) (mean+/-S.D.). The flora of loins with the odour defect were predominately lactic acid bacteria (LAB) and carnobacteria, but they contained large fractions of Enterobacteriaceae <35 days after packaging. Aeromonas spp. and Shewanella spp. were likely responsible for the sulfide-putrid smell of these spoiled products, but species of Enterobacteriaceae and lactic acid bacteria could have contributed to spoilage. Comparison of microbial groups present in 16 other cuts, half from each of two commercial plants, which were stored for 25 days at -1.5 degrees C, showed that larger fractions of Enterobacteriaceae were present in samples from the plant having difficulty achieving the desired storage life. Additional bacterial samples from 12 cuts supplied by the latter plant obtained after adoption of an acid sanitizer step in the plant cleaning regimen, and also stored for 25 days at -1.5 degrees C, yielded few Enterobacteriaceae, Aeromonas or Shewanella. Use of an acid sanitizer in plant cleaning may be a means of controlling alkali-tolerant bacteria such as Aeromonas or Shewanella which can contaminate pork cuts and spoil vacuum-packaged product. The fraction of Enterobacteriaceae in bacteria populations on fresh pork stored for 25 days at -1.5 degrees C may be a useful indicator of the effectiveness of plant sanitation.

Effect of high-dose irradiation on quality characteristics of ready-to-eat broiler breast fillets stored at room temperature.

PubMed

Baptista, R F; Teixeira, C E; Lemos, M; Monteiro, M L G; Vital, H C; Mársico, E T; Júnior, C A Conte; Mano, S B

2014-10-01

The effect of high-dose irradiation on the physical, chemical, and bacteriological parameters of ready-to-eat vacuum-packed broiler breast meat after 430 d of storage at room temperature was investigated. Ready-to-eat broiler breast fillets were immersed in brine with garlic powder and then drained, grilled, and vacuum-packed (primary packaging). The high-dose irradiation used was approximately 48 kGy. The treatments were designated as A (irradiated samples stored at room temperature), B (irradiated samples stored at -25°C), and C (nonirradiated samples stored at -25°C). All samples were packaged in polyethylene bags containing aluminum to exclude light (secondary packaging). Proximate composition, pH, 2-thiobarbituric acid reactive substance (TBARS), and heterotrophic aerobic mesophilic bacteria were analyzed during 430 d of storage. Results were analyzed using 1-way ANOVA and the Tukey test. Linear regression was used to analyze the correlation between the results for each parameter and storage time of the different treatments. The gamma radiation caused slight changes (P < 0.05) in the moisture and fat content, regardless of storage temperature. After storage d 110, TBARS values remained stable (P > 0.05) in all the treatments. The preservation methods used were effective in maintaining the mesophilic counts below the detection level during the entire storage period. We concluded that, among the treatments studied, high-dose irradiation with storage at room temperature showed potential for the preservation of ready-to-eat products made from poultry meat, to provide foods safe for consumption. ©2014 Poultry Science Association Inc.

Patterned wafer geometry grouping for improved overlay control

NASA Astrophysics Data System (ADS)

Lee, Honggoo; Han, Sangjun; Woo, Jaeson; Park, Junbeom; Song, Changrock; Anis, Fatima; Vukkadala, Pradeep; Jeon, Sanghuck; Choi, DongSub; Huang, Kevin; Heo, Hoyoung; Smith, Mark D.; Robinson, John C.

2017-03-01

Process-induced overlay errors from outside the litho cell have become a significant contributor to the overlay error budget including non-uniform wafer stress. Previous studies have shown the correlation between process-induced stress and overlay and the opportunity for improvement in process control, including the use of patterned wafer geometry (PWG) metrology to reduce stress-induced overlay signatures. Key challenges of volume semiconductor manufacturing are how to improve not only the magnitude of these signatures, but also the wafer to wafer variability. This work involves a novel technique of using PWG metrology to provide improved litho-control by wafer-level grouping based on incoming process induced overlay, relevant for both 3D NAND and DRAM. Examples shown in this study are from 19 nm DRAM manufacturing.

Influence of modified atmospheric storage, lactic acid, and NaCl on survival of sublethally heat-injured Listeria monocytogenes.

PubMed

Williams, R C; Golden, D A

2001-03-20

The effect of package atmosphere on survival of uninjured and sublethally heat-injured Listeria monocytogenes, inoculated onto tryptose phosphate agar containing 0.85% lactic acid and 2% NaCl (TPALAS) was investigated. Inoculated TPALAS plates were packaged in air, 100% N2 (N2), 30% CO2-70% N2 (CO2-N2), and vacuum and stored at 4 and 20 degrees C for up to 31 days. Recovery of L. monocytogenes from TPALAS was influenced by the injury status (i.e., injured and uninjured) of the inoculum, storage atmosphere (air, N2, CO2-N2, and vacuum), storage temperature (4 and 20 degrees C), and recovery media [tryptose phosphate agar (TPA) and modified Oxford agar (MOX)] (P <0.05). Overall, storage at 4 degrees C supported greater survival than storage at 20 degrees C (P< 0.05). Uninjured L. monocytogenes stored at 4 degrees C was recovered on TPA better than sublethally heat-injured L. monocytogenes stored at 40 degrees C (P < 0.05). Recovery of sublethally heat-injured L. monocytogenes stored at 4 degrees C followed the order N2 > CO2-N2 > air > vacuum (P < 0.05), whereas recovery of uninjured L. monocyrogenes stored at 4 degrees C followed the order N2 > CO2-N2 > vacuum > air (P < 0.05). Air and vacuum atmospheres supported greater survival of uninjured and heat-injured L. monocytogenes than N2 and CO2-N2 atmospheres at 20 degrees C (P < 0.05). Recovery of sublethally heat-injured L. monocytogenes stored at 20 degrees C followed the order vacuum > air> CO2-N2 = N2 (P <0.05), whereas recovery of uninjured L. monocytogenes stored at 20 degrees C followed the order vacuum > air> CO2-N2 > N2 (P<0.05). Uninjured L. monocytogenes stored under N2 at 4 degrees C was recovered best, whereas sublethally heat-injured L. monocytogenes stored under N2 at 20 degrees C was recovered poorest (P < 0.05). Factors such as package atmosphere and storage temperature, involved in the production, storage, and distribution of fermented foods must be thoroughly evaluated when determining strategies for control and detection of L. monocytogenes in such products.

Advancements in meat packaging.

PubMed

McMillin, Kenneth W

2017-10-01

Packaging of meat provides the same or similar benefits for raw chilled and processed meats as other types of food packaging. Although air-permeable packaging is most prevalent for raw chilled red meat, vacuum and modified atmosphere packaging offer longer shelf life. The major advancements in meat packaging have been in the widely used plastic polymers while biobased materials and their integration into composite packaging are receiving much attention for functionality and sustainability. At this time, active and intelligent packaging are not widely used for antioxidant, antimicrobial, and other functions to stabilize and enhance meat properties although many options are being developed and investigated. The advances being made in nanotechnology will be incorporated into food packaging and presumably into meat packaging when appropriate and useful. Intelligent packaging using sensors for transmission of desired information and prompting of subsequent changes in packaging materials, environments or the products to maintain safety and quality are still in developmental stages. Copyright © 2017 Elsevier Ltd. All rights reserved.

Wavelength tunable MEMS VCSELs for OCT imaging

NASA Astrophysics Data System (ADS)

Sahoo, Hitesh Kumar; Ansbæk, Thor; Ottaviano, Luisa; Semenova, Elizaveta; Hansen, Ole; Yvind, Kresten

2018-02-01

MEMS VCSELs are one of the most promising swept source (SS) lasers for optical coherence tomography (OCT) and one of the best candidates for future integration with endoscopes, surgical probes and achieving an integrated OCT system. However, the current MEMS-based SS are processed on the III-V wafers, which are small, expensive and challenging to work with. Furthermore, the actuating part, i.e., the MEMS, is on the top of the structure which causes a strong dependence on packaging to decrease its sensitivity to the operating environment. This work addresses these design drawbacks and proposes a novel design framework. The proposed device uses a high contrast grating mirror on a Si MEMS stage as the bottom mirror, all of which is defined in an SOI wafer. The SOI wafer is then bonded to an InP III-V wafer with the desired active layers, thereby sealing the MEMS. Finally, the top mirror, a dielectric DBR (7 pairs of TiO2 - SiO2), is deposited on top. The new device is based on a silicon substrate with MEMS defined on a silicon membrane in an enclosed cavity. Thus the device is much more robust than the existing MEMS VCSELs. This design also enables either a two-way actuation on the MEMS or a smaller optical cavity (pull-away design), i.e., wider FSR (Free Spectral Range) to increase the wavelength sweep. Fabrication of the proposed device is outlined and the results of device characterization are reported.

Growth of 1.5 micron gallium indium nitrogen arsenic antimonide vertical cavity surface emitting lasers by molecular beam epitaxy

NASA Astrophysics Data System (ADS)

Wistey, Mark Allan

Fiber optics has revolutionized long distance communication and long haul networks, allowing unimaginable data speeds and noise-free telephone calls around the world for mere pennies per hour at the trunk level. But the high speeds of optical fiber generally do not extend to individual workstations or to the home, in large part because it has been difficult and expensive to produce lasers which emitted light at wavelengths which could take advantage of optical fiber. One of the most promising solutions to this problem is the development of a new class of semiconductors known as dilute nitrides. Dilute nitrides such as GaInNAs can be grown directly on gallium arsenide, which allows well-established processing techniques. More important, gallium arsenide allows the growth of vertical-cavity surface-emitting lasers (VCSELs), which can be grown in dense, 2D arrays on each wafer, providing tremendous economies of scale for manufacturing, testing, and packaging. Unfortunately, GaInNAs lasers have suffered from what has been dubbed the "nitrogen penalty," with high thresholds and low efficiency as the fraction of nitrogen in the semiconductor was increased. This thesis describes the steps taken to identify and essentially eliminate the nitrogen penalty. Protecting the wafer surface from plasma ignition, using an arsenic cap, greatly improved material quality. Using a Langmuir probe, we further found that the nitrogen plasma source produced a large number of ions which damaged the wafer during growth. The ions were dramatically reduced using deflection plates. Low voltage deflection plates were found to be preferable to high voltages, and simulations showed low voltages to be adequate for ion removal. The long wavelengths from dilute nitrides can be partly explained by wafer damage during growth. As a result of these studies, we demonstrated the first CW, room temperature lasers at wavelengths beyond 1.5mum on gallium arsenide, and the first GaInNAs(Sb) VCSELs beyond 1.31mum: 1.46mum. These techniques offer the promise of inexpensive, high speed fiber networking.

The challenges encountered in the integration of an early test wafer surface scanning inspection system into a 450mm manufacturing line

NASA Astrophysics Data System (ADS)

Lee, Jeffrey; McGarvey, Steve

2013-04-01

The introduction of early test wafer (ETW) 450mm Surface Scanning Inspection Systems (SSIS) into Si manufacturing has brought with it numerous technical, commercial, and logistical challenges on the path to rapid recipe development and subsequent qualification of other 450mm wafer processing equipment. This paper will explore the feasibility of eliminating the Polystyrene Latex Sphere deposition process step and the subsequent creation of SSIS recipes based upon the theoretical optical properties of both the SSIS and the process film stack(s). The process of Polystyrene Latex Sphere deposition for SSIS recipe generation and development is generally accepted on the previous technology nodes for 150/200/300mm wafers. PSL is deposited with a commercially available deposition system onto a non-patterned bare Si or non-patterned filmed Si wafer. After deposition of multiple PSL spots, located in different positions on a wafer, the wafer is inspected on a SSIS and a response curve is generated. The response curve is based on the the light scattering intensity of the NIST certified PSL that was deposited on the wafer. As the initial 450mm Si wafer manufacturing began, there were no inspection systems with sub-90nm sensitivities available for defect and haze level verification. The introduction of a 450mm sub-30nm inspection system into the manufacturing line generated instant challenges. Whereas the 450mm wafers were relatively defect free at 90nm, at 40nm the wafers contained several hundred thousand defects. When PSL was deposited onto wafers with these kinds of defect levels, PSL with signals less than the sub-90nm defects were difficult to extract. As the defectivity level of the wafers from the Si suppliers rapidly improves the challenges of SSIS recipe creation with high defectivity decreases while at the same time the cost of PSL deposition increases. The current cost per wafer is fifteen thousand dollars for a 450mm PSL deposition service. When viewed from the standpoint of the generations of hundreds of SSIS recipes for the global member companies of ISMI, it is simply not economically viable to create all recipes based on PSL based light scattering response curves. This paper will explore the challenges/end results encountered with the PSL based SSIS recipe generation and compare those against the challenges/end results of SSIS recipes generated based strictly upon theoretical Bidirectional reflectance distribution function (BRDF) light scattering modeling. The BRDF modeling will allow for the creation of SSIS recipes without PSL deposition, which is greatly appealing for a multitude of both technical and commercial considerations. This paper will also explore the technical challenges of SSIS recipe generation based strictly upon BRDF modeling.

Reliability Analysis/Assessment of Advanced Technologies

DTIC Science & Technology

1990-05-01

34, Reliability Physics 1980 , IEEE, p. 165. 25. RADC-TR-83-244. 26. Towner, Janet M., et. al., "Aluminum Electromigration Under Pulsed D.C. Conditions...Duvvury, Redwine, Kitagawa, Haas, Chuang, Beydler, Hyslop , "Impact of Hot Carriers On DRAM circuits", 1987 IEEE/IRPS. 58. Cahoon, Thornewell, Tsai...et. a]., "Substrate for Large Silicon Chip and Full Wafer Packaging", Semiconductor International, pp. 149-156, April 1980 . 5. T.E. Lewis and D.L

Nanogranular soft magnetic material and on-package integrated inductors

NASA Astrophysics Data System (ADS)

Li, Liangliang

2007-12-01

Integrated inductors used in electronic circuits are mainly spiral-shaped aluminum devices fabricated on Si chip. They have several disadvantages---large silicon area consumption, high DC resistance and high cost. An attractive approach to address these issues is directly integrating inductors into package substrates, which provide plenty of usage area, low resistance and low cost. The goals of this dissertation are designing and fabricating magnetic and air-core inductors with characteristic low resistance and high quality factor on package substrates. The research work includes three parts which are summarized below. First, the CoFeHfO nanogranular magnetic material developed on Si wafers and package substrates by pulsed DC reactive sputtering were investigated. On Si wafers, the optimized CoFeHfO film has soft magnetic properties. On printed circuit board (PCB) substrates, these magnetic properties degrade due to the rough surface. Surface planarization such as chemical-mechanical polishing can be applied on PCB substrates to reduce the surface roughness and hence improve these properties. Second, on-package inductors with small resistances and high quality factors were designed, fabricated, measured and analyzed. Air-core and magnetic inductors (20 design variations) were built on 8-inch PCB substrates. The DC resistances of these inductors are less than 12 mO, one of the lowest values ever reported. The maximum quality factors can be as large as ˜80 at around 1 GHz for the air-core inductors and ˜25 at 200 MHz for the magnetic inductors. Third, inductor simulation was carried out to study the effects of magnetic materials on the properties of inductors using the Ansoft HFSS software package. The measurement data for the permeability spectra of the CoFeHfO film and the tensor nature of the permeability were taken into account in the simulation. The simulation results matched the experimental data for the inductances, resistances and quality factors. This established an accurate method for modeling high-frequency magnetic devices. Using this method, an inductor with a closed magnetic core was studied by varying the geometry of the core and copper coil. It has been found that the inductance of this inductor depends strongly on whether the permeability of the magnetic core is isotropic or anisotropic.

Combined effect of vacuum-packaging and oregano essential oil on the shelf-life of Mediterranean octopus (Octopus vulgaris) from the Aegean Sea stored at 4 degrees C.

PubMed

Atrea, I; Papavergou, A; Amvrosiadis, I; Savvaidis, I N

2009-04-01

The present study evaluated the use of vacuum packaging (alone) or with addition of oregano essential oil (EO), as an antimicrobial treatment for shelf-life extension of fresh Mediterranean octopus stored under refrigeration for a period of 23 days. Four different treatments were tested: A, control sample; under aerobic storage in the absence of oregano essential oil; VP, under vacuum packaging in the absence of oregano essential oil; and VO1, VO2, treated samples with oregano essential oil 0.2 and 0.4% (v/w), respectively, under VP. Of all the microorganisms enumerated, Pseudomonas spp., H2S-producing bacteria and lactic acid bacteria (LAB) were the groups that prevailed in octopus samples, irrespective of antimicrobial treatment. With regard to the chemical freshness indices determined, thiobarbituric acid (TBA) values were low in all octopus samples, as could have been expected from the low fat content of the product. Both trimethylamine nitrogen (TMA-N) and total volatile basic nitrogen (TVB-N) values of oregano treated under VP octopus samples were significantly lower compared to control samples during the entire refrigerated storage period. Based primarily on sensory evaluation (odor), the use of VP, VO1 and VO2 extended the shelf-life of fresh Mediterranean octopus by ca. 3, 11 and 20 days, respectively.

Influence of heat processing on the volatile organic compounds and microbial diversity of salted and vacuum-packaged silver carp (Hypophthalmichthys molitrix) fillets during storage.

PubMed

Li, Dongping; Zhang, Jingbin; Song, Sijia; Feng, Ligeng; Luo, Yongkang

2018-06-01

Ready-to-eat products have become popular with most of the busy people in modern cities. Heat processing combined with vacuum-packaging is one of the most common methods to make ready-to-eat products with an extended shelf-life. In this study, the influence of heat processing [80 °C (LT) and 98 °C (HT) in water bath] on the quality of salted and vacuum-packaged silver carp (Hypophthalmichthys molitrix) fillets, stored at 20 ± 1 °C, was investigated by sensory analysis, biochemical analysis, and microbial diversity. SPME-GC/MS indicated the presence of 27 volatile organic compounds (VOCs) in fillets, and major VOCs were aldehydes and alcohols. Acids tended to increase during storage and caused a fetid odor at the end of storage. Culture-dependent method indicated that Bacillus dominated the spoiled LT and HT samples. In addition, Bacillus was identified as the main spoiler of deteriorated heated fillets by high-throughput sequencing. Sphingomonas and Brevibacillus dominated the indigenous bacteria of fresh raw fillets. After heat processing, LT samples exhibited higher organoleptic quality than HT samples on day 0. HT samples showed extended shelf-life at 20 °C storage compared to LT samples. Copyright © 2017. Published by Elsevier Ltd.

Effects of dietary magnesium and duration of refrigerated storage on the quality of vacuum-packaged, boneless pork loins.

PubMed

Apple, J K; Davis, J R; Rakes, L K; Maxwell, C V; Stivarius, M R; Pohlman, F W

2001-01-01

Quality data were initially collected on 78 pork loins from crossbred pigs fed diets containing 0, 1.25 or 2.5% magnesium mica (MM). Loins were then vacuum-packaged, and randomly assigned to either 4 or 8 weeks of storage at 2°C. Dietary MM had no (P > 0.05) effect on moisture loss/retention or subjective and objective color measurements. Purge volume increased (P<0.05) and drip loss decreased (P<0.05) as storage time increased. Moreover, longissimus thoracis et lumborum (LM) chops became lighter (P<0.05), redder (P<0.05), and more yellow (P<0.05) during 8 weeks of storage. Although TBARS values increased linearly (P<0.001) during extended storage, LM chops from pigs fed 2.5% MM tended to have lower (P<0.07) TBARS values after 4 weeks of storage than chops from pigs fed 0 and 1.25% MM. After 8 weeks of storage, however, there was a tendency for TBARS values of chops from pigs fed 1.25% MM to be lower (P<0.07) than chops from pigs fed 2.5% MM. Even though feeding swine diets containing MM did not affect color and water-holding capacity of pork loins during storage, the data indicated inclusion of MM in swine diets may retard onset of oxidative rancidity in vacuum-packaged pork loins.

Effect of cleaning procedures on the electrical properties of carbon nanotube transistors—A statistical study

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tittmann-Otto, J., E-mail: jana.tittmann-otto@zfm.tu-chemnitz.de; Hermann, S.; Hartmann, M.

The interface between a carbon nanotube (CNT) and its environment can dramatically affect the electrical properties of CNT-based field-effect transistors (FETs). For such devices, the channel environment plays a significant role inducing doping or charge traps giving rise to hysteresis in the transistor characteristics. Thereby the fabrication process strongly determines the extent of those effects and the final device performance. In CNT-based devices obtained from dispersions, a proper individualization of the nanotubes is mandatory. This is generally realized by an ultrasonic treatment combined with surfactant molecules, which enwrap nanotubes forming micelle aggregates. To minimize impact on device performance, it ismore » of vital importance to consider post-deposition treatments for removal of surfactant molecules and other impurities. In this context, we investigated the effect of several wet chemical cleaning and thermal post treatments on the electrical characteristics as well as physical properties of more than 600 devices fabricated only by wafer-level compatible technologies. We observed that nitric acid and water treatments improved the maximum-current of devices. Additionally, we found that the ethanol treatment successfully lowered hysteresis in the transfer characteristics. The effect of the chemical cleaning procedures was found to be more significant on CNT-metal contacts than for the FET channels. Moreover, we investigated the effect of an additional thermal cleaning step under vacuum after the chemical cleaning, which had an exceptional impact on the hysteresis behavior including hysteresis reversal. The presence of surfactant molecules on CNT was evidenced by X-ray photoelectron and Raman spectroscopies. By identifying the role of surfactant molecules and assessing the enhancement of device performance as a direct consequence of several cleaning procedures, these results are important for the development of CNT-based electronics at the wafer-level.« less

Effect of cleaning procedures on the electrical properties of carbon nanotube transistors—A statistical study

NASA Astrophysics Data System (ADS)

Tittmann-Otto, J.; Hermann, S.; Kalbacova, J.; Hartmann, M.; Toader, M.; Rodriguez, R. D.; Schulz, S. E.; Zahn, D. R. T.; Gessner, T.

2016-03-01

The interface between a carbon nanotube (CNT) and its environment can dramatically affect the electrical properties of CNT-based field-effect transistors (FETs). For such devices, the channel environment plays a significant role inducing doping or charge traps giving rise to hysteresis in the transistor characteristics. Thereby the fabrication process strongly determines the extent of those effects and the final device performance. In CNT-based devices obtained from dispersions, a proper individualization of the nanotubes is mandatory. This is generally realized by an ultrasonic treatment combined with surfactant molecules, which enwrap nanotubes forming micelle aggregates. To minimize impact on device performance, it is of vital importance to consider post-deposition treatments for removal of surfactant molecules and other impurities. In this context, we investigated the effect of several wet chemical cleaning and thermal post treatments on the electrical characteristics as well as physical properties of more than 600 devices fabricated only by wafer-level compatible technologies. We observed that nitric acid and water treatments improved the maximum-current of devices. Additionally, we found that the ethanol treatment successfully lowered hysteresis in the transfer characteristics. The effect of the chemical cleaning procedures was found to be more significant on CNT-metal contacts than for the FET channels. Moreover, we investigated the effect of an additional thermal cleaning step under vacuum after the chemical cleaning, which had an exceptional impact on the hysteresis behavior including hysteresis reversal. The presence of surfactant molecules on CNT was evidenced by X-ray photoelectron and Raman spectroscopies. By identifying the role of surfactant molecules and assessing the enhancement of device performance as a direct consequence of several cleaning procedures, these results are important for the development of CNT-based electronics at the wafer-level.

Planned development of a 3D computer based on free-space optical interconnects

NASA Astrophysics Data System (ADS)

Neff, John A.; Guarino, David R.

1994-05-01

Free-space optical interconnection has the potential to provide upwards of a million data channels between planes of electronic circuits. This may result in the planar board and backplane structures of today giving away to 3-D stacks of wafers or multi-chip modules interconnected via channels running perpendicular to the processor planes, thereby eliminating much of the packaging overhead. Three-dimensional packaging is very appealing for tightly coupled fine-grained parallel computing where the need for massive numbers of interconnections is severely taxing the capabilities of the planar structures. This paper describes a coordinated effort by four research organizations to demonstrate an operational fine-grained parallel computer that achieves global connectivity through the use of free space optical interconnects.

Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures

NASA Astrophysics Data System (ADS)

Kang, Kibum; Lee, Kan-Heng; Han, Yimo; Gao, Hui; Xie, Saien; Muller, David A.; Park, Jiwoong

2017-10-01

High-performance semiconductor films with vertical compositions that are designed to atomic-scale precision provide the foundation for modern integrated circuitry and novel materials discovery. One approach to realizing such films is sequential layer-by-layer assembly, whereby atomically thin two-dimensional building blocks are vertically stacked, and held together by van der Waals interactions. With this approach, graphene and transition-metal dichalcogenides--which represent one- and three-atom-thick two-dimensional building blocks, respectively--have been used to realize previously inaccessible heterostructures with interesting physical properties. However, no large-scale assembly method exists at present that maintains the intrinsic properties of these two-dimensional building blocks while producing pristine interlayer interfaces, thus limiting the layer-by-layer assembly method to small-scale proof-of-concept demonstrations. Here we report the generation of wafer-scale semiconductor films with a very high level of spatial uniformity and pristine interfaces. The vertical composition and properties of these films are designed at the atomic scale using layer-by-layer assembly of two-dimensional building blocks under vacuum. We fabricate several large-scale, high-quality heterostructure films and devices, including superlattice films with vertical compositions designed layer-by-layer, batch-fabricated tunnel device arrays with resistances that can be tuned over four orders of magnitude, band-engineered heterostructure tunnel diodes, and millimetre-scale ultrathin membranes and windows. The stacked films are detachable, suspendable and compatible with water or plastic surfaces, which will enable their integration with advanced optical and mechanical systems.

Layer-by-layer assembly of two-dimensional materials into wafer-scale heterostructures.

PubMed

Kang, Kibum; Lee, Kan-Heng; Han, Yimo; Gao, Hui; Xie, Saien; Muller, David A; Park, Jiwoong

2017-10-12

High-performance semiconductor films with vertical compositions that are designed to atomic-scale precision provide the foundation for modern integrated circuitry and novel materials discovery. One approach to realizing such films is sequential layer-by-layer assembly, whereby atomically thin two-dimensional building blocks are vertically stacked, and held together by van der Waals interactions. With this approach, graphene and transition-metal dichalcogenides-which represent one- and three-atom-thick two-dimensional building blocks, respectively-have been used to realize previously inaccessible heterostructures with interesting physical properties. However, no large-scale assembly method exists at present that maintains the intrinsic properties of these two-dimensional building blocks while producing pristine interlayer interfaces, thus limiting the layer-by-layer assembly method to small-scale proof-of-concept demonstrations. Here we report the generation of wafer-scale semiconductor films with a very high level of spatial uniformity and pristine interfaces. The vertical composition and properties of these films are designed at the atomic scale using layer-by-layer assembly of two-dimensional building blocks under vacuum. We fabricate several large-scale, high-quality heterostructure films and devices, including superlattice films with vertical compositions designed layer-by-layer, batch-fabricated tunnel device arrays with resistances that can be tuned over four orders of magnitude, band-engineered heterostructure tunnel diodes, and millimetre-scale ultrathin membranes and windows. The stacked films are detachable, suspendable and compatible with water or plastic surfaces, which will enable their integration with advanced optical and mechanical systems.

Ammonia gas permeability of meat packaging materials.

PubMed

Karim, Faris; Hijaz, Faraj; Kastner, Curtis L; Smith, J Scott

2011-03-01

Meat products are packaged in polymer films designed to protect the product from exterior contaminants such as light, humidity, and harmful chemicals. Unfortunately, there is almost no data on ammonia permeability of packaging films. We investigated ammonia permeability of common meat packaging films: low-density polyethylene (LDPE; 2.2 mil), multilayer polyolefin (MLP; 3 mil), and vacuum (V-PA/PE; 3 mil, 0.6 mil polyamide/2.4 mil polyethylene). The films were fabricated into 10 × 5 cm pouches and filled with 50 mL deionized water. Pouches were placed in a plexiglass enclosure in a freezer and exposed to 50, 100, 250, or 500 ppm ammonia gas for 6, 12, 24, and 48 h at -17 ± 3 °C and 21 ± 3 °C. At freezing temperatures, no ammonia residues were detected and no differences in pH were found in the water. At room temperature, ammonia levels and pH of the water increased significantly (P < 0.05) with increasing exposure times and ammonia concentrations. Average ammonia levels in the water were 7.77 ppm for MLP, 5.94 ppm for LDPE, and 0.89 ppm for V-PA/PE at 500 ppm exposure for 48 h at 21 ± 3 °C. Average pH values were 8.64 for MLP, 8.38 for LDPE, and 7.23 for V-PA/PE (unexposed ranged from 5.49 to 6.44) at 500 ppm exposure for 48 h. The results showed that temperature influenced ammonia permeability. Meat packaging materials have low ammonia permeability and protect meat products exposed to ammonia leaks during frozen storage.

Using an extractive Fourier transform infrared spectrometer for improving cleanroom air quality in a semiconductor manufacturing plant.

PubMed

Li, Shou-Nan; Chang, Chin-Ta; Shih, Hui-Ya; Tang, Andy; Li, Alen; Chen, Yin-Yung

2003-01-01

A mobile extractive Fourier transform infrared (FTIR) spectrometer was successfully used to locate, identify, and quantify the "odor" sources inside the cleanroom of a semiconductor manufacturing plant. It was found that ozone (O(3)) gas with a peak concentration of 120 ppm was unexpectedly releasing from a headspace of a drain for transporting used ozonized water and that silicon tetrafluoride (SiF(4)) with a peak concentration of 3 ppm was off-gassed from silicon wafers after dry-etching processing. When the sources of the odors was pinpointed by the FTIR, engineering control measures were applied. For O(3) control, a water-sealed pipeline was added to prevent the O(3) gas (emitting from the ozonized water) from entering the mixing unit. A ventilation system also was applied to the mixing unit in case of O(3) release. For SiF(4) mitigation, before the wafer-out chamber was opened, N(2) gas with a flow rate of 150 L/min was used for 100 sec to purge the wafer-out chamber, and a vacuum system was simultaneously activated to pump away the purging N(2). The effectiveness of the control measures was assured by using the FTIR. In addition, the FTIR was used to monitor the potential hazardous gas emissions during preventative maintenance of the semiconductor manufacturing equipment.

Recent Advances of VCSEL Photonics

NASA Astrophysics Data System (ADS)

Koyama, Fumio

2006-12-01

A vertical-cavity surface emitting laser (VCSEL) was invented 30 years ago. A lot of unique features can be expected, such as low-power consumption, wafer-level testing, small packaging capability, and so on. The market of VCSELs has been growing up rapidly in recent years, and they are now key devices in local area networks using multimode optical fibers. Also, long wavelength VCSELs are currently attracting much interest for use in single-mode fiber metropolitan area and wide area network applications. In addition, a VCSEL-based disruptive technology enables various consumer applications such as a laser mouse and laser printers. In this paper, the recent advance of VCSEL photonics will be reviewed, which include the wavelength extension of single-mode VCSELs and their wavelength integration/control. Also, this paper explores the potential and challenges for new functions of VCSELs toward optical signal processing.

Shelf-life extension of vacuum-packaged meat from pheasant (Phasianus colchicus) by lactic acid treatment.

PubMed

Pfeifer, Agathe; Smulders, Frans J M; Paulsen, Peter

2014-07-01

We investigated the influence of lactic acid treatment of pheasant meat before vacuum-packaged storage of 3, 7, and 10 d at +6°C on microbiota and pH. Breast muscle samples were collected from carcasses of slaughtered as well as from hunted (shot) wild pheasants. Immersion of meat samples in 3% (wt/wt) lactic acid for 60 s effectuated a significant drop in pH of approximately 0.5 to 0.7 units, which remained during the entire storage period. In parallel, total aerobic counts of such treated and stored samples were on an average 1.5 to 1.7 log units lower than in non-acid-treated samples. Similar results were found for Enterobacteriaceae. A significant decrease in pH was measured at d 7 and 10 in the acid-treated samples in comparison with the untreated ones. In summary, the immersion of pheasant breast meat cuts in dilute lactic acid significantly reduced microbiota during vacuum-packed storage, even at slight temperature abuse conditions. © 2014 Poultry Science Association Inc.

Effect of packaging during storage time on retail display shelf life of longissimus muscle from two different beef production systems.

PubMed

Luzardo, S; Woerner, D R; Geornaras, I; Engle, T E; Delmore, R J; Hess, A M; Belk, K E

2016-06-01

Two studies were conducted to evaluate the influence of packaging and production system (PS) on retail display life color (L*, a*, and b*), fatty acid profile (% of total fatty acids), lipid oxidation (thiobarbituric acid reactive substances; mg malondialdehyde/kg of muscle), vitamin E content (µg/g of muscle), and odor (trained panelists) during storage of LM. Four (or 3) different packaging treatments were applied to LM from steers fattened on grazing systems (Uruguayan) or on high-concentrate diets (U.S.). From fabrication to application of treatments, Uruguayan LM were vacuum packaged for air shipment and U.S. LM were also vacuum packaged and kept in a cooler until Uruguayan samples arrived. Treatments were applied 7 d after slaughter. In Exp. 1, treatments were vacuum packaging (VP), low-oxygen (O) modified atmosphere packaging (MAP) with nitrogen (N2) and carbon dioxide (MAP/CO), low-O MAP with N2 plus CO and carbon monoxide (MAP/CO), and VP plus an application of peroxyacetic acid (VP/PAA). In Exp. 2 block 1, treatments were VP, MAP/CO, and VP with ethyl-arginate HCl incorporated into the film as an antimicrobial agent (VP/AM). In Exp. 2 block 2, treatments were VP, MAP/CO, MAP/CO, and VP/AM. After 35 d storage, steaks were evaluated during simulated retail display for up to 6 d. In Exp. 1, Uruguayan steaks under MAP/CO had greater ( < 0.05) a* values than VP/PAA and MAP/CO on d 6 of display. For U.S. beef, the MAP/CO had the reddest lean color ( < 0.05) compared with the other 3 packaging treatments on d 6 of display in Exp. 1. Packaging × PS × time interaction was significant ( < 0.05) in Exp. 1. In Exp. 2, MAP/CO in Uruguayan steaks also had the greatest a* values on d 6 of display, but no differences ( > 0.05) were detected among both VP and MAP/CO in U.S. steaks at this time. No significant ( > 0.05) packaging × PS × time interaction was observed in Exp. 2. Only PS (both experiments) and time (Exp. 1) affected ( < 0.05) L* values. In both experiments, U.S. steaks had greater ( < 0.05) L* values than Uruguayan steaks. Vitamin E content in Uruguayan steaks was greater ( < 0.05) than in U.S. steaks. Packaging × PS, PS × time, and packaging × PS × time interactions were not significant ( > 0.05) for any of the fatty acids. Beef from Uruguayan had lower ( < 0.05) SFA and MUFA and greater ( < 0.05) PUFA and n-6 and n-3 fatty acid percentages than U.S. beef. Complexity of fresh meat postmortem chemistry warrants a more comprehensive approach to maximize shelf life.

WaferOptics® mass volume production and reliability

NASA Astrophysics Data System (ADS)

Wolterink, E.; Demeyer, K.

2010-05-01

The Anteryon WaferOptics® Technology platform contains imaging optics designs, materials, metrologies and combined with wafer level based Semicon & MEMS production methods. WaferOptics® first required complete new system engineering. This system closes the loop between application requirement specifications, Anteryon product specification, Monte Carlo Analysis, process windows, process controls and supply reject criteria. Regarding the Anteryon product Integrated Lens Stack (ILS), new design rules, test methods and control systems were assessed, implemented, validated and customer released for mass production. This includes novel reflowable materials, mastering process, replication, bonding, dicing, assembly, metrology, reliability programs and quality assurance systems. Many of Design of Experiments were performed to assess correlations between optical performance parameters and machine settings of all process steps. Lens metrologies such as FFL, BFL, and MTF were adapted for wafer level production and wafer mapping was introduced for yield management. Test methods for screening and validating suitable optical materials were designed. Critical failure modes such as delamination and popcorning were assessed and modeled with FEM. Anteryon successfully managed to integrate the different technologies starting from single prototypes to high yield mass volume production These parallel efforts resulted in a steep yield increase from 30% to over 90% in a 8 months period.

Extremely Low Frequency-Magnetic Field (ELF-MF) Exposure Characteristics among Semiconductor Workers

PubMed Central

Choi, Sangjun; Cha, Wonseok; Kim, Won; Yoon, Chungsik; Park, Ju-Hyun; Ha, Kwonchul; Park, Donguk

2018-01-01

We assessed the exposure of semiconductor workers to extremely low frequency-magnetic fields (ELF-MF) and identified job characteristics affecting ELF-MF exposure. These were demonstrated by assessing the exposure of 117 workers involved in wafer fabrication (fab) and chip packaging wearing personal dosimeters for a full shift. A portable device was used to monitor ELF-MF in high temporal resolution. All measurements were categorized by operation, job and working activity during working time. ELF-MF exposure of workers were classified based on the quartiles of ELF-MF distribution. The average levels of ELF-MF exposure were 0.56 µT for fab workers, 0.59 µT for chip packaging workers and 0.89 µT for electrical engineers, respectively. Exposure to ELF-MF differed among types of factory, operation, job and activity. Workers engaged in the diffusion and chip testing activities showed the highest ELF-MF exposure. The ELF-MF exposures of process operators were found to be higher than those of maintenance engineers, although peak exposure and/or patterns varied. The groups with the highest quartile ELF-MF exposure level are operators in diffusion, ion implantation, module and testing operations, and maintenance engineers in diffusion, module and testing operations. In conclusion, ELF-MF exposure among workers can be substantially affected by the type of operation and job, and the activity or location. PMID:29614730

Effect of Hops Beta Acids on the Survival of Unstressed- or Acid-Stress-Adapted-Listeria Monocytogenes and on the Quality and Sensory Attributes of Commercially Cured Ham Slices.

PubMed

Wang, Li; McKeith, Amanda Gipe; Shen, Cangliang; Carter, Kelsey; Huff, Alyssa; McKeith, Russell; Zhang, Xinxia; Chen, Zhengxing

2016-02-01

This study evaluated the antilisterial activity of hops beta acids (HBA) and their impact on the quality and sensory attributes of ham. Commercially cured ham slices were inoculated with unstressed- and acid-stress-adapted (ASA)-L. monocytogenes (2.2 to 2.5 log CFU/cm(2) ), followed by no dipping (control), dipping in deionized (DI) water, or dipping in a 0.11% HBA solution. This was followed by vacuum or aerobic packaging and storage (7.2 °C, 35 or 20 d). Samples were taken periodically during storage to check for pH changes and analyze the microbial populations. Color measurements were obtained by dipping noninoculated ham slices in a 0.11% HBA solution, followed by vacuum packaging and storage (4.0 °C, 42 d). Sensory evaluations were performed on ham slices treated with 0.05% to 0.23% HBA solutions, followed by vacuum packaging and storage (4.0 °C, 30 d). HBA caused immediate reductions of 1.2 to 1.5 log CFU/cm(2) (P < 0.05) in unstressed- and ASA-L. monocytogenes populations on ham slices. During storage, the unstressed-L. monocytogenes populations on HBA-treated samples were 0.5 to 2.0 log CFU/cm(2) lower (P < 0.05) than control samples and those dipped in DI water. The lag-phase of the unstressed-L. monocytogenes population was extended from 3.396 to 7.125 d (control) to 7.194 to 10.920 d in the HBA-treated samples. However, the ASA-L. monocytogenes population showed resistance to HBA because they had a higher growth rate than control samples and had similar growth variables to DI water-treated samples during storage. Dipping in HBA solution did not adversely affect the color or sensory attributes of the ham slices stored in vacuum packages. These results are useful for helping ready-to-eat meat processors develop operational procedures for applying HBA on ham slices. © 2016 Institute of Food Technologists®

Inhibitory effects of cinnamon and clove essential oils on mold growth on baked foods.

PubMed

Ju, Jian; Xu, Xiaomiao; Xie, Yunfei; Guo, Yahui; Cheng, Yuliang; Qian, He; Yao, Weirong

2018-02-01

This study evaluated the minimum inhibition concentration (MIC) and minimum lethal concentration (MLC) of cinnamon and clove essential oils against mold growth on green bean cake and finger citron crisp cake, and also examined the effects of these two essential oils and their application methods on the shelf life of the baked products in normal and vacuum packages by accelerated storage test. The results showed that the MIC of cinnamon and clove essential oils against molds were 0.21-0.83 and 0.21-1.67μL/mL, respectively and the MLC were 0.42-0.83 and 0.83-1.67μL/mL, respectively. In normal package cinnamon and clove essential oils could prolong the shelf life of green bean cake 9-10 and 3-4days, respectively and could prolong the shelf life of finger citron crisp cake 5-6 and 2-3days, respectively. And in vacuum package they were 15-16, 8-9, 10-12 and 7-9days, respectively in turn. Copyright © 2017. Published by Elsevier Ltd.

Evaluation of the effectiveness of non-irradiated and chlorine-free packaging for fresh beef preservation.

PubMed

Rodrigues, José B M; Sarantópoulos, Claire I G L; Bromberg, Renata; Andrade, Juliana C; Brunelli, Kleber; Miyagusku, Luciana; Marquezini, Miriam G; Yamada, Eunice A

2017-03-01

This study evaluates the potential of using non-irradiated barrier-shrink bags containing ethylene-vinyl alcohol copolymer (EVOH), polyamide (PA) and ethylene ionomer in their structures to preserve vacuum-packaged fresh beef as an alternative to traditional gamma-ray cross-linked bags containing polyvinylidene chloride (PVDC). Boneless beef rib eye roll cuts were vacuum-packed in an industrial processing plant using EVOH 44% mol, EVOH 32% mol and a control PVDC barrier shrink bags. The cuts were evaluated during storage at 0.5°C. The EVOH films presented similar performance compared to control PVDC barrier shrink bags related to bacteria growth and purge loss. Packages with EVOH 32% mol film presented better performance than control bag with respect to the meat sensorial attributes, including fewer bubbles and better adhesion. EVOH 44% mol bags presented the highest rate of colour loss. The EVOH 32% mol non-irradiated and chlorine-free film is as effective for the preservation of fresh beef as traditional PVDC-irradiated shrink bags. Copyright © 2016 Elsevier Ltd. All rights reserved.

System-level integration of active silicon photonic biosensors

NASA Astrophysics Data System (ADS)

Laplatine, L.; Al'Mrayat, O.; Luan, E.; Fang, C.; Rezaiezadeh, S.; Ratner, D. M.; Cheung, K.; Dattner, Y.; Chrostowski, L.

2017-02-01

Biosensors based on silicon photonic integrated circuits have attracted a growing interest in recent years. The use of sub-micron silicon waveguides to propagate near-infrared light allows for the drastic reduction of the optical system size, while increasing its complexity and sensitivity. Using silicon as the propagating medium also leverages the fabrication capabilities of CMOS foundries, which offer low-cost mass production. Researchers have deeply investigated photonic sensor devices, such as ring resonators, interferometers and photonic crystals, but the practical integration of silicon photonic biochips as part of a complete system has received less attention. Herein, we present a practical system-level architecture which can be employed to integrate the aforementioned photonic biosensors. We describe a system based on 1 mm2 dies that integrate germanium photodetectors and a single light coupling device. The die are embedded into a 16x16 mm2 epoxy package to enable microfluidic and electrical integration. First, we demonstrate a simple process to mimic Fan-Out Wafer-level-Packaging, which enables low-cost mass production. We then characterize the photodetectors in the photovoltaic mode, which exhibit high sensitivity at low optical power. Finally, we present a new grating coupler concept to relax the lateral alignment tolerance down to +/- 50 μm at 1-dB (80%) power penalty, which should permit non-experts to use the biochips in a"plug-and-play" style. The system-level integration demonstrated in this study paves the way towards the mass production of low-cost and highly sensitive biosensors, and can facilitate their wide adoption for biomedical and agro-environmental applications.

Hybrid propulsion technology program. Volume 1: Conceptional design package

NASA Technical Reports Server (NTRS)

Jensen, Gordon E.; Holzman, Allen L.; Leisch, Steven O.; Keilbach, Joseph; Parsley, Randy; Humphrey, John

1989-01-01

A concept design study was performed to configure two sizes of hybrid boosters; one which duplicates the advanced shuttle rocket motor vacuum thrust time curve and a smaller, quarter thrust level booster. Two sizes of hybrid boosters were configured for either pump-fed or pressure-fed oxygen feed systems. Performance analyses show improved payload capability relative to a solid propellant booster. Size optimization and fuel safety considerations resulted in a 4.57 m (180 inch) diameter large booster with an inert hydrocarbon fuel. The preferred diameter for the quarter thrust level booster is 2.53 m (96 inches). As part of the design study critical technology issues were identified and a technology acquisition and demonstration plan was formulated.

Hybrid propulsion technology program. Volume 2: Technology definition package

NASA Technical Reports Server (NTRS)

Jensen, Gordon E.; Holzman, Allen L.; Leisch, Steven O.; Keilbach, Joseph; Parsley, Randy; Humphrey, John

1989-01-01

A concept design study was performed to configure two sizes of hybrid boosters; one which duplicates the advanced shuttle rocket motor vacuum thrust time curve and a smaller, quarter thrust level booster. Two sizes of hybrid boosters were configured for either pump-fed or pressure-fed oxygen feed systems. Performance analyses show improved payload capability relative to a solid propellant booster. Size optimization and fuel safety considerations resulted in a 4.57 m (180 inch) diameter large booster with an inert hydrocarbon fuel. The preferred diameter for the quarter thrust level booster is 2.53 m (96 inches). The demonstration plan would culminate with test firings of a 3.05 m (120 inch) diameter hybrid booster.

Closed Brayton Cycle Power Conversion Unit for Fission Surface Power Phase I Final Report

NASA Technical Reports Server (NTRS)

Fuller, Robert L.

2010-01-01

A Closed Brayton cycle power conversion system has been developed to support the NASA fission surface power program. The goal is to provide electricity from a small nuclear reactor heat source for surface power production for lunar and Mars environments. The selected media for a heat source is NaK 78 with water as a cooling source. The closed Brayton cycle power was selected to be 12 kWe output from the generator terminals. A heat source NaK temperature of 850 K plus or minus 25 K was selected. The cold source water was selected at 375 K plus or minus 25 K. A vacuum radiation environment of 200 K is specified for environmental operation. The major components of the system are the power converter, the power controller, and the top level data acquisition and control unit. The power converter with associated sensors resides in the vacuum radiation environment. The power controller and data acquisition system reside in an ambient laboratory environment. Signals and power are supplied across the pressure boundary electrically with hermetic connectors installed on the vacuum vessel. System level analyses were performed on working fluids, cycle design parameters, heater and cooling temperatures, and heat exchanger options that best meet the needs of the power converter specification. The goal is to provide a cost effective system that has high thermal-to-electric efficiency in a compact, lightweight package.

Design, Operation, and Modeling of a Vertical APCVD Reactor for Silicon Carbide Film Growth

NASA Technical Reports Server (NTRS)

DeAnna, Russell G.; Fleischman, Aaron J.; Zorman, Christian A.; Mehregany, Mehran

1998-01-01

An atmospheric pressure chemical vapor deposition (APCVD) reactor utilizing a unique vertical geometry which enables 3C-SiC films to be grown on two, 4-inch diameter Si wafers has been constructed. Contrary to expectations, 3C-SiC films grown in this reactor are thickest at the downstream end of the substrates. To better understand the reason for the thickness distribution on the wafers, an axisymmetric finite-element model of the gas flow in the reactor was constructed. The model uses the ANSYS53 Flowtran package and includes compressible and temperature-dependent fluid properties in laminar or turbulent flow. It does not include reaction chemistry or unsteady flow. The ANSYS53 results predict that the cool, inlet fluid falls through the inlet pipe and the warm, diffuser region like a jet. This jet impinges on top of the susceptor and gets diverted to the reactor side walls, where it flows to the bottom of the reactor, turns, and slowly rises along the face of the susceptor. This may explain why the SiC films are thickest at the downstream side of the wafers, as gas containing fresh reactants first passes over this region. Modeling results are presented for both one atmosphere and one half atmosphere reactor pressure.

Robust wafer identification recognition based on asterisk-shape filter and high-low score comparison method.

PubMed

Hsu, Wei-Chih; Yu, Tsan-Ying; Chen, Kuan-Liang

2009-12-10

Wafer identifications (wafer ID) can be used to identify wafers from each other so that wafer processing can be traced easily. Wafer ID recognition is one of the problems of optical character recognition. The process to recognize wafer IDs is similar to that used in recognizing car license-plate characters. However, due to some unique characteristics, such as the irregular space between two characters and the unsuccessive strokes of wafer ID, it will not get a good result to recognize wafer ID by directly utilizing the approaches used in car license-plate character recognition. Wafer ID scratches are engraved by a laser scribe almost along the following four fixed directions: horizontal, vertical, plus 45 degrees , and minus 45 degrees orientations. The closer to the center line of a wafer ID scratch, the higher the gray level will be. These and other characteristics increase the difficulty to recognize the wafer ID. In this paper a wafer ID recognition scheme based on an asterisk-shape filter and a high-low score comparison method is proposed to cope with the serious influence of uneven luminance and make recognition more efficiently. Our proposed approach consists of some processing stages. Especially in the final recognition stage, a template-matching method combined with stroke analysis is used as a recognizing scheme. This is because wafer IDs are composed of Semiconductor Equipment and Materials International (SEMI) standard Arabic numbers and English alphabets, and thus the template ID images are easy to obtain. Furthermore, compared with the approach that requires prior training, such as a support vector machine, which often needs a large amount of training image samples, no prior training is required for our approach. The testing results show that our proposed scheme can efficiently and correctly segment out and recognize the wafer ID with high performance.

In-situ investigation of thermal instabilities and solid state dewetting in polycrystalline platinum thin films via confocal laser microscopy

DOE Office of Scientific and Technical Information (OSTI.GOV)

Jahangir, S.; Cheng, Xuan; Huang, H. H.

2014-10-28

Solid state dewetting and the subsequent morphological changes for platinum thin films grown on zinc oxide (ZnO) buffered (001) silicon substrates (Pt/ZnO/SiO{sub 2}/(001)Si system) is investigated under vacuum conditions via a custom-designed confocal laser microscope coupled with a laser heating system. Live imaging of thin film dewetting under a range of heating and quenching vacuum ambients reveals events including hillock formation, hole formation, and hole growth that lead to formation of a network of Pt ligaments, break up of Pt ligaments to individual islands and subsequent Pt islands shape reformation, in chronological fashion. These findings are corroborated by ex-situ materialsmore » characterization and quantitative electron microscopy analysis. A secondary hole formation via blistering before film rupture is revealed to be the critical stage, after which a rapid dewetting catastrophe occurs. This process is instantaneous and cannot be captured by ex-situ methods. Finally, an intermetallic phase forms at 900 °C and alters the morphology of Pt islands, suggesting a practical limit to the thermal environments that may be used for these platinized silicon wafers in vacuum conditions.« less

Improvements in the shelf life of commercial corn dry masa flour (CMF) by reducing lipid oxidation.

PubMed

Márquez-Castillo, A; Vidal-Quintanar, R L

2011-03-01

To improve the shelf life of commercial nixtamalized corn dry masa flour (CMF), the modified atmosphere packaging (MAP) was used. Pouches (20 × 20 cm) of ethyl vinyl alcohol (EVOH) with 180 g of CMF were stored at 55 °C, and a(w) of 0.45; under Light and Dark conditions, antioxidants (0.02% TBHQ), Vacuum, and N(2) and CO(2), and used as treatments. Thereafter, changes in their linoleic acid (LA) concentration by GC, peroxide (PV), and anisidine values (p-A), which were monitored for 180 d. EVOH showed a significantly lower consumption of LA by autoxidation (11.7% ± 0.2% in 117 d) than polyethylene film (70.5% ± 0.3% in 113 d) under the same storage temperature. The elimination of oxygen by vacuum in each pouch allowed a low consumption (16.4% ± 0.1%) of LA. PV (14.5 ± 0.09 mEq/kg of fat), and p-A (63 ± 0.16 mmol/kg) were low, and generated over 121 d of storage. CMF stored under MAP had 100% protection against oxidation of LA. A combination of Vacuum and EVOH packaging extended the shelf life of CMF to 108 d with only 10% of LA loss. For retail stores, the EVOH packaging will reduce lipid oxidation of CMF and safety related to off odors and flavors from the oxidation of tortillas will increase dramatically.

Successful Cleaning and Study of Contamination of Si(001) in Ultrahigh Vacuum

DOE Office of Scientific and Technical Information (OSTI.GOV)

Gheorghe, N. G.; Lungu, G. A.; Husanu, M. A.

2011-10-03

This paper presents the very first surface physics experiment performed in ultrahigh vacuum (UHV) in Romania, using a new molecular beam epitaxy (MBE) installation. Cleaning of a Si(001) wafer was achieved by using a very simple technique: sequences of annealing at 900-1000 deg. C in ultrahigh vacuum: low 10{sup -8} mbar, with a base pressure of 1.5x10{sup -10} mbar. The preparation procedure is quite reproducible and allows repeated cleaning of the Si(001) after contamination in ultrahigh vacuum. The Si(001) single crystal surface is characterized by low energy electron diffraction (LEED), reflection high energy electron diffraction (RHEED), and Auger electron spectroscopymore » (AES). The latter technique is utilized in order to investigate the sample contamination by the residual gas in the UHV chamber, as determined by a residual gas analyzer (RGA). Unambiguous assignment of oxidized and unoxidized silicon is provided; also, an important feature is that the LVV Auger peak at 90-92 eV cannot be solely attributed to clean Si (i.e. Si surrounded only by Si), but also to silicon atoms bounded with carbon. Even with a sum of partial pressures of oxygen and carbon containing molecules in the range of 5x10{sup -10} mbar, the sample is contaminated very quickly, having a (1/e) lifetime of about 76 minutes.« less

An SU-8 liquid cell for surface acoustic wave biosensors

NASA Astrophysics Data System (ADS)

Francis, Laurent A.; Friedt, Jean-Michel; Bartic, Carmen; Campitelli, Andrew

2004-08-01

One significant challenge facing biosensor development is packaging. For surface acoustic wave based biosensors, packaging influences the general sensing performance. The acoustic wave is generated and received thanks to interdigital transducers and the separation between the transducers defines the sensing area. Liquids used in biosensing experiments lead to an attenuation of the acoustic signal while in contact with the transducers. We have developed a liquid cell based on photodefinable epoxy SU-8 that prevents the presence of liquid on the transducers, has a small disturbance effect on the propagation of the acoustic wave, does not interfere with the biochemical sensing event, and leads to an integrated sensor system with reproducible properties. The liquid cell is achieved in two steps. In a first step, the SU-8 is precisely patterned around the transducers to define 120 μm thick walls. In a second step and after the dicing of the sensors, a glass capping is placed manually and glued on top of the SU-8 walls. This design approach is an improvement compared to the more classical solution consisting of a pre-molded cell that must be pressed against the device in order to avoid leaks, with negative consequences on the reproducibility of the experimental results. We demonstrate the effectiveness of our approach by protein adsorption monitoring. The packaging materials do not interfere with the biomolecules and have a high chemical resistance. For future developments, wafer level bonding of the quartz capping onto the SU-8 walls is envisioned.

Preservation of fresh meat with active and modified atmosphere packaging conditions.

PubMed

Skandamis, Panagiotis N; Nychas, George-John E

2002-11-15

The sensory, microbiological and physicochemical attributes of fresh meat stored at 5 and 15 degrees C were affected by the combined effect of volatile compounds of oregano essential oil and modified atmosphere packaging conditions (40% CO2/30% N2/30% O2, 100% CO2, 80% CO2/20% air, vacuum pack and air). It was found that the extension of shelf life of meat samples depended on the packaging conditions and augmented in the order: air < vacuum pack < 40% CO2/30% N2/30% O2 < 80% CO2/ 20% air < 100% CO2. Longer shelf life was observed in samples supplemented with the volatile compounds of oregano essential oil and stored under the same packaging conditions mentioned above. The extension of shelf life may be due to the synergistic effect of volatile compounds of oregano essential oil and the modified atmosphere packaging used on the microbiological and physicochemical characteristics of meat. Indeed, both these hurdles can prolong and delay microbial growth or suppress the final counts of the spoilage microorganisms in comparison with the 'control' samples. The effect of essential oil volatile compounds was even more pronounced on the physicochemical changes of meat samples caused by microbial association. Oregano essential oil delayed glucose and lactate consumption, both indicators of meat spoilage aerobically as well as under 40% CO2/30% N2/30% O2, and 100% CO2. Finally, changes in other metabolites such as formic acid were also observed.

Effect of Addition of Natural Antioxidants on the Shelf-Life of “Chorizo”, a Spanish Dry-Cured Sausage

PubMed Central

Pateiro, Mirian; Bermúdez, Roberto; Lorenzo, José Manuel; Franco, Daniel

2015-01-01

The dose effect of the addition of natural antioxidants (tea, chestnut, grape seed and beer extracts) on physicochemical, microbiological changes and on oxidative stability of dry-cured “chorizo”, as well as their effect during the storage under vacuum conditions was evaluated. Color parameters were significantly (p < 0.05) affected by the addition of antioxidants so that samples that contained antioxidants were more effective in maintaining color. The improving effects were dose-dependent with highest values with the dose of 50 mg/kg during ripening and depend on the extract during vacuum packaging. Addition of antioxidants decreased (p < 0.05) the oxidation, showing thiobarbituric acid reactive substances (TBARS) values below 0.4 mg MDA/kg. Natural antioxidants matched or even improved the results obtained for butylated hydroxytoluene (BHT). Regarding texture profile analysis (TPA) analysis, hardness values significantly (p < 0.001) decreased with the addition of antioxidants, obtaining the lower results with the dose of 200 mg/kg both during ripening and vacuum packaging. Antioxidants reduced the counts of total viable counts (TVC), lactic acid bacteria (LAB), mold and yeast. Free fatty acid content during ripening and under vacuum conditions showed a gradual and significant (p < 0.05) release as a result of lipolysis. At the end of ripening, the addition of GRA1000 protected chorizos from oxidative degradation. PMID:26785337

Compliant layer chucking surface

DOEpatents

Blaedel, Kenneth L [Dublin, CA; Spence, Paul A [Pleasanton, CA; Thompson, Samuel L [Pleasanton, CA

2004-12-28

A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a "pin" chuck, thereby reducing the probability of entrapping a particle.

Encapsulation for smart textile electronics - humidity and temperature sensor.

PubMed

Larsson, Andreas; Tran, Thanh-Nam; Aasmundtveit, Knut E; Seeberg, Trine M

2015-01-01

A combined humidity and temperature sensor was packaged by vacuum casting onto three different types of textiles; cotton, nylon and a waterproof fabric. This was done in order to integrate the sensor in a jacket in a soft and reliable way without changing the sensor performance. A membrane was custom made and integrated into the device to protect the sensor from the environment. The packaged sensors performance was characterized in a climate chamber were the relative humidity and temperature ranged from 25 % to 95 % and -10 °C to 75 °C respectively. The packaged sensors showed insignificant to limited performance degradation.

Fabrication of a Silicon Backshort Assembly for Waveguide-Coupled Superconducting Detectors

NASA Technical Reports Server (NTRS)

Crowe, Erik J.; Bennett, Charles L.; Chuss, David T.; Denis, Kevin L.; Eimer, Joseph; Lourie, Nathan; Marriage, Tobias; Moseley, Samuel H.; Rostem, Karwan; Stevenson, Thomas R.;

Fabrication of Silicon Backshorts with Improved Out-of-Band Rejection for Waveguide-Coupled Superconducting Detectors

NASA Technical Reports Server (NTRS)

Crowe, Erik J.; Bennett, Charles L.; Chuss, David T.; Denis, Kevin L.; Eimer, Joseph; Lourie, Nathan; Marriage, Tobias; Moseley, Samuel H.; Rostem, Karwan; Stevenson, Thomas R.;

A Lorentz force actuated magnetic field sensor with capacitive read-out

NASA Astrophysics Data System (ADS)

Stifter, M.; Steiner, H.; Kainz, A.; Keplinger, F.; Hortschitz, W.; Sauter, T.

2013-05-01

We present a novel design of a resonant magnetic field sensor with capacitive read-out permitting wafer level production. The device consists of a single-crystal silicon cantilever manufactured from the device layer of an SOI wafer. Cantilevers represent a very simple structure with respect to manufacturing and function. On the top of the structure, a gold lead carries AC currents that generate alternating Lorentz forces in an external magnetic field. The free end oscillation of the actuated cantilever depends on the eigenfrequencies of the structure. Particularly, the specific design of a U-shaped structure provides a larger force-to-stiffness-ratio than standard cantilevers. The electrodes for detecting cantilever deflections are separately fabricated on a Pyrex glass-wafer. They form the counterpart to the lead on the freely vibrating planar structure. Both wafers are mounted on top of each other. A custom SU-8 bonding process on wafer level creates a gap which defines the equilibrium distance between sensing electrodes and the vibrating structure. Additionally to the capacitive read-out, the cantilever oscillation was simultaneously measured with laser Doppler vibrometry through proper windows in the SOI handle wafer. Advantages and disadvantages of the asynchronous capacitive measurement configuration are discussed quantitatively and presented by a comprehensive experimental characterization of the device under test.

A Basic Research for the Development and Evaluation of Novel MEMS Digital Accelerometers

DTIC Science & Technology

2013-02-01

that timing differences as measured by the circuit are linearly dependent on the measured capacitance changes. As such, the circuit’s readout is...error in the electronic measurement to refine the technique. An additional capability of the circuit is the ability to observe the impact of cold...low resistivity on (ɘ.01 Ω-cm) silicon on insulator wafers (SOI). The beams are fabricated in a 0.3 cm by 0.3 cm die which is then packaged and wire

Injectable Ceramic Microcast Silicon Carbonitride (SiCN) Microelectromechanical System (MEMS) for Extreme Temperature Environments with Extension: Micro Packages for Nano-Devices

DTIC Science & Technology

2004-01-01

pyrolyzed to produce the ceramic (SiCN) parts, or they may be retained in the polymeric state and used as high-temperature polymer /glass MEMS devices. Two...structure and the SU8 /wafer is weak due to the Teflon coating. (j) A free standing polymer structure results. The structure is then crosslinked and... polymer . Further efforts are necessary to identify the least damaging rinsing chemicals, that is, chemicals which would not contaminate polymerized

Multi-Step Deep Reactive Ion Etching Fabrication Process for Silicon-Based Terahertz Components

NASA Technical Reports Server (NTRS)

Reck, Theodore (Inventor); Perez, Jose Vicente Siles (Inventor); Lee, Choonsup (Inventor); Cooper, Ken B. (Inventor); Jung-Kubiak, Cecile (Inventor); Mehdi, Imran (Inventor); Chattopadhyay, Goutam (Inventor); Lin, Robert H. (Inventor); Peralta, Alejandro (Inventor)

2016-01-01

A multi-step silicon etching process has been developed to fabricate silicon-based terahertz (THz) waveguide components. This technique provides precise dimensional control across multiple etch depths with batch processing capabilities. Nonlinear and passive components such as mixers and multipliers waveguides, hybrids, OMTs and twists have been fabricated and integrated into a small silicon package. This fabrication technique enables a wafer-stacking architecture to provide ultra-compact multi-pixel receiver front-ends in the THz range.

Aerogel-Based Multilayer Insulation with Micrometeoroid Protection

NASA Technical Reports Server (NTRS)

Begag, Redouane; White, Shannon

2013-01-01

Ultra-low-density, highly hydrophobic, fiber-reinforced aerogel material integrated with MLI (aluminized Mylar reflectors and B4A Dacron separators) offers a highly effective insulation package by providing unsurpassed thermal performance and significant robustness, delivering substantial MMOD protection via the addition of a novel, durable, external aerogel layer. The hydrophobic nature of the aerogel is an important property for maintaining thermal performance if the material is exposed to the environment (i.e. rain, snow, etc.) during ground installations. The hybrid aerogel/MLI/MMOD solution affords an attractive alternative because it will perform thermally in the same range as MLI at all vacuum levels (including high vacuum), and offers significant protection from micrometeoroid damage. During this effort, the required low-density and resilient aerogel materials have been developed that are needed to optimize the thermal performance for space (high vacuum) cryotank applications. The proposed insulation/MMOD package is composed of two sections: a stack of interleaved aerogel layers and MLI intended for cryotank thermal insulation, and a 1.5- to 1-in. (.2.5- to 3.8- cm) thick aerogel layer (on top of the insulation portion) for MMOD protection. Learning that low-density aerogel cannot withstand the hypervelocity impact test conditions, the innovators decided during the course of the program to fabricate a high-density and strong material based on a cross-linked aerogel (X-aerogel; developed elsewhere by the innovators) for MMOD protection. This system has shown a very high compressive strength that is capable of withstanding high-impact tests if a proper configuration of the MMOD aerogel layer is used. It was learned that by stacking two X-aerogel layers [1.5-in. (.3.8-cm) thick] separated by an air gap, the system would be able to hold the threat at a speed of 5 km/s and gpass h the test. The first aerogel panel stopped the projectile from damaging the second aerogel panel. The impacted X-aerogel (the back specimen from the successful test) was further tested in comparison to another similar sample (not impacted) at Kennedy Space Center for thermal conductivity evaluation at cryogenic conditions. The specimens were tested under high vacuum and cryogenic temperatures, using Cryostat 500. The results show that the specimen did not lose a significant amount of thermal performance due to the impact test, especially at high vacuum.

Reduction of image-based ADI-to-AEI overlay inconsistency with improved algorithm

NASA Astrophysics Data System (ADS)

Chen, Yen-Liang; Lin, Shu-Hong; Chen, Kai-Hsiung; Ke, Chih-Ming; Gau, Tsai-Sheng

2013-04-01

In image-based overlay (IBO) measurement, the measurement quality of various measurement spectra can be judged by quality indicators and also the ADI-to-AEI similarity to determine the optimum light spectrum. However we found some IBO measured results showing erroneous indication of wafer expansion from the difference between the ADI and the AEI maps, even after their measurement spectra were optimized. To reduce this inconsistency, an improved image calculation algorithm is proposed in this paper. Different gray levels composed of inner- and outer-box contours are extracted to calculate their ADI overlay errors. The symmetry of intensity distribution at the thresholds dictated by a range of gray levels is used to determine the particular gray level that can minimize the ADI-to-AEI overlay inconsistency. After this improvement, the ADI is more similar to AEI with less expansion difference. The same wafer was also checked by the diffraction-based overlay (DBO) tool to verify that there is no physical wafer expansion. When there is actual wafer expansion induced by large internal stress, both the IBO and the DBO measurements indicate similar expansion results. The scanning white-light interference microscope was used to check the variation of wafer warpage during the ADI and AEI stages. It predicts a similar trend with the overlay difference map, confirming the internal stress.

16 CFR 501.3 - Replacement bags for vacuum cleaners.

Code of Federal Regulations, 2010 CFR

2010-01-01

... statement appears on the principal display panel of the package accurately identifying the make and model of...) The name and place of business of the manufacturer, packer, or distributor of the replacement bags, in...

Effect of packaging materials on the chemical composition and microbiological quality of edible mushroom (Pleurotus ostreatus) grown on cassava peels.

PubMed

Ajayi, Oluwakemi; Obadina, Adewale; Idowu, Micheal; Adegunwa, Mojisola; Kajihausa, Olatundun; Sanni, Lateef; Asagbra, Yemisi; Ashiru, Bolanle; Tomlins, Keith

2015-07-01

Edible fungi such as mushrooms are highly perishable and deteriorate few days after harvest due to its high moisture content and inability to maintain their physiological status. In this study, the effect of packaging materials on the nutritional composition of mushroom cultivated from cassava peels was investigated. Mushroom samples were dried at 50°C in a cabinet dryer for 8 h. The dried mushroom samples packaged in four different packaging materials; high density polyethylene (HDPE), polypropylene (PP), laminated aluminum foil (LAF), high density polyethylene under vacuum (HDPEV) were stored at freezing (0°C) temperatures for 12 weeks. Samples were collected at 2-week intervals and analyzed for proximate composition (carbohydrate, protein, fat, fiber, ash, moisture), mineral content (calcium, potassium), vitamin C content, and microbiological qualities (total aerobic count, Pseudomonal count, Coliform count, Staphylococcal count, Salmonella count) using the standard laboratory procedures. Carbohydrate, protein, fat content of dried mushrooms packaged in HDPE at freezing temperature ranged from 45.2% to 53.5%, 18.0% to 20.3%, and 3.2% to 4.3%, while mushrooms in polypropylene ranged from 45.2% to 53.5%, 18.5% to 20.3%, 2.6% to 4.3%. Carbohydrate, protein, fat of mushroom in LAF ranged from 47.8% to 53.5%, 17.3% to 20.3%, and 3.3% to 4.3%, respectively, while carbohydrate, protein, fat of mushroom in HDPEV ranged from 51.1% to 53.5%, 19.5% to 20.3%, and 3.5% to 4.3%. Microbiological analysis showed that total aerobic count, Pseudomonal count, and Staphyloccocal count of dried mushroom ranged from 2.3 to 3.8 log cfu/g, 0.6 to 1.1 log cfu/g, and 0.4 to 0.5 log cfu/g, respectively. In conclusion, dried mushroom in HDPE packaged under vacuum at freezing temperature retained the nutritional constituents than those packaged with other packaging materials.

Effect of packaging materials on the chemical composition and microbiological quality of edible mushroom (Pleurotus ostreatus) grown on cassava peels

PubMed Central

Ajayi, Oluwakemi; Obadina, Adewale; Idowu, Micheal; Adegunwa, Mojisola; Kajihausa, Olatundun; Sanni, Lateef; Asagbra, Yemisi; Ashiru, Bolanle; Tomlins, Keith

2015-01-01

Edible fungi such as mushrooms are highly perishable and deteriorate few days after harvest due to its high moisture content and inability to maintain their physiological status. In this study, the effect of packaging materials on the nutritional composition of mushroom cultivated from cassava peels was investigated. Mushroom samples were dried at 50°C in a cabinet dryer for 8 h. The dried mushroom samples packaged in four different packaging materials; high density polyethylene (HDPE), polypropylene (PP), laminated aluminum foil (LAF), high density polyethylene under vacuum (HDPEV) were stored at freezing (0°C) temperatures for 12 weeks. Samples were collected at 2-week intervals and analyzed for proximate composition (carbohydrate, protein, fat, fiber, ash, moisture), mineral content (calcium, potassium), vitamin C content, and microbiological qualities (total aerobic count, Pseudomonal count, Coliform count, Staphylococcal count, Salmonella count) using the standard laboratory procedures. Carbohydrate, protein, fat content of dried mushrooms packaged in HDPE at freezing temperature ranged from 45.2% to 53.5%, 18.0% to 20.3%, and 3.2% to 4.3%, while mushrooms in polypropylene ranged from 45.2% to 53.5%, 18.5% to 20.3%, 2.6% to 4.3%. Carbohydrate, protein, fat of mushroom in LAF ranged from 47.8% to 53.5%, 17.3% to 20.3%, and 3.3% to 4.3%, respectively, while carbohydrate, protein, fat of mushroom in HDPEV ranged from 51.1% to 53.5%, 19.5% to 20.3%, and 3.5% to 4.3%. Microbiological analysis showed that total aerobic count, Pseudomonal count, and Staphyloccocal count of dried mushroom ranged from 2.3 to 3.8 log cfu/g, 0.6 to 1.1 log cfu/g, and 0.4 to 0.5 log cfu/g, respectively. In conclusion, dried mushroom in HDPE packaged under vacuum at freezing temperature retained the nutritional constituents than those packaged with other packaging materials. PMID:26288720

Three-dimensional micro/nano-scale structure fabricated by combination of non-volatile polymerizable RTIL and FIB irradiation

PubMed Central

Kuwabata, Susumu; Minamimoto, Hiro; Inoue, Kosuke; Imanishi, Akihito; Hosoya, Ken; Uyama, Hiroshi; Torimoto, Tsukasa; Tsuda, Tetsuya; Seki, Shu

2014-01-01

Room-temperature ionic liquid (RTIL) has been widely investigated as a nonvolatile solvent as well as a unique liquid material because of its interesting features, e.g., negligible vapor pressure and high thermal stability. Here we report that a non-volatile polymerizable RTIL is a useful starting material for the fabrication of micro/nano-scale polymer structures with a focused-ion-beam (FIB) system operated under high-vacuum condition. Gallium-ion beam irradiation to the polymerizable 1-allyl-3-ethylimidazolium bis((trifluoromethane)sulfonyl)amide RTIL layer spread on a Si wafer induced a polymerization reaction without difficulty. What is interesting to note is that we have succeeded in provoking the polymerization reaction anywhere on the Si wafer substrate by using FIB irradiation with a raster scanning mode. By this finding, two- and three-dimensional micro/nano-scale polymer structure fabrications were possible at the resolution of 500,000 dpi. Even intricate three-dimensional micro/nano-figures with overhang and hollow moieties could be constructed at the resolution of approximately 100 nm. PMID:24430465

New Finsler package

NASA Astrophysics Data System (ADS)

Youssef, Nabil L.; Elgendi, S. G.

2014-03-01

The book “Handbook of Finsler geometry” has been included with a CD containing an elegant Maple package, FINSLER, for calculations in Finsler geometry. Using this package, an example concerning a Finsler generalization of Einstein’s vacuum field equations was treated. In this example, the calculation of the components of the hv-curvature of Cartan connection leads to wrong expressions. On the other hand, the FINSLER package works only in dimension four. We introduce a new Finsler package in which we fix the two problems and solve them. Moreover, we extend this package to compute not only the geometric objects associated with Cartan connection but also those associated with Berwald, Chern and Hashiguchi connections in any dimension. These improvements have been illustrated by a concrete example. Furthermore, the problem of simplifying tensor expressions is treated. This paper is intended to make calculations in Finsler geometry more easier and simpler.

Vertical and lateral heterogeneous integration

NASA Astrophysics Data System (ADS)

Geske, Jon; Okuno, Yae L.; Bowers, John E.; Jayaraman, Vijay

2001-09-01

A technique for achieving large-scale monolithic integration of lattice-mismatched materials in the vertical direction and the lateral integration of dissimilar lattice-matched structures has been developed. The technique uses a single nonplanar direct-wafer-bond step to transform vertically integrated epitaxial structures into lateral epitaxial variation across the surface of a wafer. Nonplanar wafer bonding is demonstrated by integrating four different unstrained multi-quantum-well active regions lattice matched to InP on a GaAs wafer surface. Microscopy is used to verify the quality of the bonded interface, and photoluminescence is used to verify that the bonding process does not degrade the optical quality of the laterally integrated wells. The authors propose this technique as a means to achieve greater levels of wafer-scale integration in optical, electrical, and micromechanical devices.

Reliable bonding using indium-based solders

NASA Astrophysics Data System (ADS)

Cheong, Jongpil; Goyal, Abhijat; Tadigadapa, Srinivas; Rahn, Christopher

2004-01-01

Low temperature bonding techniques with high bond strengths and reliability are required for the fabrication and packaging of MEMS devices. Indium and indium-tin based bonding processes are explored for the fabrication of a flextensional MEMS actuator, which requires the integration of lead zirconate titanate (PZT) substrate with a silicon micromachined structure at low temperatures. The developed technique can be used either for wafer or chip level bonding. The lithographic steps used for the patterning and delineation of the seed layer limit the resolution of this technique. Using this technique, reliable bonds were achieved at a temperature of 200°C. The bonds yielded an average tensile strength of 5.41 MPa and 7.38 MPa for samples using indium and indium-tin alloy solders as the intermediate bonding layers respectively. The bonds (with line width of 100 microns) showed hermetic sealing capability of better than 10-11 mbar-l/s when tested using a commercial helium leak tester.

Reliable bonding using indium-based solders

NASA Astrophysics Data System (ADS)

Cheong, Jongpil; Goyal, Abhijat; Tadigadapa, Srinivas; Rahn, Christopher

2003-12-01

Low temperature bonding techniques with high bond strengths and reliability are required for the fabrication and packaging of MEMS devices. Indium and indium-tin based bonding processes are explored for the fabrication of a flextensional MEMS actuator, which requires the integration of lead zirconate titanate (PZT) substrate with a silicon micromachined structure at low temperatures. The developed technique can be used either for wafer or chip level bonding. The lithographic steps used for the patterning and delineation of the seed layer limit the resolution of this technique. Using this technique, reliable bonds were achieved at a temperature of 200°C. The bonds yielded an average tensile strength of 5.41 MPa and 7.38 MPa for samples using indium and indium-tin alloy solders as the intermediate bonding layers respectively. The bonds (with line width of 100 microns) showed hermetic sealing capability of better than 10-11 mbar-l/s when tested using a commercial helium leak tester.

Fabrication and electrical characterization of partially metallized vias fabricated by inkjet

NASA Astrophysics Data System (ADS)

Khorramdel, B.; Mäntysalo, M.

2016-04-01

Through silicon vias (TSVs), acting as vertical interconnections, play an important role in micro-electro-mechanical systems (MEMS) 3D wafer level packaging. Today, taking advantage of nanoparticle inks, inkjet technologies as local filling methods could be used to plate the inside the vias with a conductive material, rather than using a current method, such as chemical vapor deposition or electrolytic growth. This could decrease the processing time, cost and waste material produced. In this work, we have fabricated and demonstrated electrical characterization of TSVs with a top diameter of 85 μm, and partially metallized on their inside walls using silver nanoparticle ink and drop-on-demand inkjet printing. Electrical measurement showed that the resistance of a single via with a void free coverage from top to bottom could be less than 4 Ω, which is still acceptable for MEMS applications.

Critical dimension control using ultrashort laser for improving wafer critical dimension uniformity

NASA Astrophysics Data System (ADS)

Avizemer, Dan; Sharoni, Ofir; Oshemkov, Sergey; Cohen, Avi; Dayan, Asaf; Khurana, Ranjan; Kewley, Dave

2015-07-01

Requirements for control of critical dimension (CD) become more demanding as the integrated circuit (IC) feature size specifications become tighter and tighter. Critical dimension control, also known as CDC, is a well-known laser-based process in the IC industry that has proven to be robust, repeatable, and efficient in adjusting wafer CD uniformity (CDU) [Proc. SPIE 6152, 615225 (2006)]. The process involves locally and selectively attenuating the deep ultraviolet light which goes through the photomask to the wafer. The input data for the CDC process in the wafer fab is typically taken from wafer CDU data, which is measured by metrology tools such as wafer-critical dimension-scanning electron microscopy (CD-SEM), wafer optical scatterometry, or wafer level CD (WLCD). The CD correction process uses the CDU data in order to create an attenuation correction contour, which is later applied by the in-situ ultrashort laser system of the CDC to locally change the transmission of the photomask. The ultrashort pulsed laser system creates small, partially scattered, Shade-In-Elements (also known as pixels) by focusing the laser beam inside the quartz bulk of the photomask. This results in the formation of a localized, intravolume, quartz modified area, which has a different refractive index than the quartz bulk itself. The CDC process flow for improving wafer CDU in a wafer fab with detailed explanations of the shading elements formation inside the quartz by the ultrashort pulsed laser is reviewed.

Microbial deterioration of vacuum-packaged chilled beef cuts and techniques for microbiota detection and characterization: a review.

PubMed

Hernández-Macedo, Maria Lucila; Barancelli, Giovana Verginia; Contreras-Castillo, Carmen Josefina

2011-01-01

Gas production from microbial deterioration in vacuum-packs of chilled meat leads to pack distension, which is commonly referred as blown pack. This phenomenon is attributed to some psychrophilic and psychrotrophic Clostridium species, as well as Enterobacteria. The ability of these microorganisms to grow at refrigeration temperatures makes the control by the meat industry a challenge. This type of deterioration has been reported in many countries including some plants in the Midwestern and Southeastern regions of Brazil. In addition to causing economic losses, spoilage negatively impacts the commercial product brand, thereby impairing the meat industry. In the case of strict anaerobes species they are difficult to grow and isolate using culture methods in conventional microbiology laboratories. Furthermore, conventional culture methods are sometimes not capable of distinguishing species or genera. DNA-based molecular methods are alternative strategies for detecting viable and non-cultivable microorganisms and strict anaerobic microorganisms that are difficult to cultivate. Here, we review the microorganisms and mechanisms involved in the deterioration of vacuum-packaged chilled meat and address the use of molecular methods for detecting specific strict anaerobic microorganisms and microbial communities in meat samples.

Heat transfer implications in the first MEMS fabricated thermal transiration-driven vacuum pump for gases

NASA Technical Reports Server (NTRS)

Vargo, S. E.; Green, A. A.; Muntz, E. P.

2000-01-01

The success of NASA's future space missions and the development of portable, commercial instrument packages will depend greatly on miniaturized components enabled by the use of microelectromechanical systems (MEMS).

Ion beam evaluation of silicon carbide membrane structures intended for particle detectors

NASA Astrophysics Data System (ADS)

Pallon, J.; Syväjärvi, M.; Wang, Q.; Yakimova, R.; Iakimov, T.; Elfman, M.; Kristiansson, P.; Nilsson, E. J. C.; Ros, L.

2016-03-01

Thin ion transmission detectors can be used as a part of a telescope detector for mass and energy identification but also as a pre-cell detector in a microbeam system for studies of biological effects from single ion hits on individual living cells. We investigated a structure of graphene on silicon carbide (SiC) with the purpose to explore a thin transmission detector with a very low noise level and having mechanical strength to act as a vacuum window. In order to reach very deep cavities in the SiC wafers for the preparation of the membrane in the detector, we have studied the Inductive Coupled Plasma technique to etch deep circular cavities in 325 μm prototype samples. By a special high temperature process the outermost layers of the etched SiC wafers were converted into a highly conductive graphitic layer. The produced cavities were characterized by electron microscopy, optical microscopy and proton energy loss measurements. The average membrane thickness was found to be less than 40 μm, however, with a slightly curved profile. Small spots representing much thinner membrane were also observed and might have an origin in crystal defects or impurities. Proton energy loss measurement (also called Scanning Transmission Ion Microscopy, STIM) is a well suited technique for this thickness range. This work presents the first steps of fabricating a membrane structure of SiC and graphene which may be an attractive approach as a detector due to the combined properties of SiC and graphene in a monolithic materials structure.

Impact of high pressure treatment and intramuscular fat content on colour changes and protein and lipid oxidation in sliced and vacuum-packaged Iberian dry-cured ham.

PubMed

Fuentes, Verónica; Utrera, Mariana; Estévez, Mario; Ventanas, Jesús; Ventanas, Sonia

2014-08-01

The effect of high hydrostatic pressure (HHP) (600MPa) and intramuscular fat content (IMF) on colour parameters and oxidative stability of lipids and proteins in sliced vacuum-packaged Iberian dry-cured ham during refrigerated storage (120 days at 2°C) was investigated. Several studies have investigated the influence of HHP on lipid oxidation of meat products. However, its effects on protein carbonylation, as also the influence of IMF content on this carbonylation are poorly understood. HHP treatment had a significant effect on lean lightness after 0 and 120 days of storage while IMF content increased lightness and yellowness over time. Regarding oxidative stability, the effect of HHP treatment depended on IMF content samples with a high IMF having greater lipid instability while samples with a low IMF underwent more protein carbonylation. Copyright © 2014 Elsevier Ltd. All rights reserved.

Vacuum mechatronics

NASA Technical Reports Server (NTRS)

Hackwood, Susan; Belinski, Steven E.; Beni, Gerardo

1989-01-01

The discipline of vacuum mechatronics is defined as the design and development of vacuum-compatible computer-controlled mechanisms for manipulating, sensing and testing in a vacuum environment. The importance of vacuum mechatronics is growing with an increased application of vacuum in space studies and in manufacturing for material processing, medicine, microelectronics, emission studies, lyophylisation, freeze drying and packaging. The quickly developing field of vacuum mechatronics will also be the driving force for the realization of an advanced era of totally enclosed clean manufacturing cells. High technology manufacturing has increasingly demanding requirements for precision manipulation, in situ process monitoring and contamination-free environments. To remove the contamination problems associated with human workers, the tendency in many manufacturing processes is to move towards total automation. This will become a requirement in the near future for e.g., microelectronics manufacturing. Automation in ultra-clean manufacturing environments is evolving into the concept of self-contained and fully enclosed manufacturing. A Self Contained Automated Robotic Factory (SCARF) is being developed as a flexible research facility for totally enclosed manufacturing. The construction and successful operation of a SCARF will provide a novel, flexible, self-contained, clean, vacuum manufacturing environment. SCARF also requires very high reliability and intelligent control. The trends in vacuum mechatronics and some of the key research issues are reviewed.

Effect of packaging atmospheres on storage quality characteristics of heavily marbled beef longissimus steaks.

PubMed

Yang, Xiaoyin; Zhang, Yimin; Zhu, Lixian; Han, Mingshan; Gao, Shujuan; Luo, Xin

2016-07-01

The objective of this study was to investigate the effects of modified atmosphere packaging (MAP) systems on shelf-life and quality of beef steaks with high marbling. Four packaging types were used including 80% O2 MAP (80% O2+20% CO2), 50% O2 MAP (50% O2+30% CO2+20% N2), carbon monoxide MAP (0.4% CO+30% CO2+69.6% N2) and vacuum packaging (VP). Steaks were displayed under simulated retail conditions at 4°C for 12days. Purge loss, pH, color stability, oxidative stability and microbial counts were monitored. Aerobically packaged steaks exhibited a bright-red color at the first 4days. However, discoloration and oxidation became major factors limiting their shelf-life to 8days. Compared with aerobic packaging, anaerobic packaging extended shelf-life of heavily marbled beef steaks, due to better color stability, together with lower oxidation and microbial populations. Among all packaging methods, CO-MAP had the best preservation for steaks, with more red color than other packaging types. Copyright © 2016 Elsevier Ltd. All rights reserved.

Post-Growth Annealing of Bridgman-grown CdZnTe and CdMnTe Crystals for Room-temperature Nuclear Radiation Detectors

DOE PAGES

Egarievwe, Stephen U.; Yang, Ge; Egarievwe, Alexander; ...

2015-02-11

Bridgman-grown cadmium zinc telluride (CdZnTe or CZT) and cadmium manganese telluride (CdMnTe or CMT) crystals often have Te inclusions that limit their performances as X-ray- and gamma-ray-detectors. We present here the results of post-growth thermal annealing aimed at reducing and eliminating Te inclusions in them. In a 2D analysis, we observed that the sizes of the Te inclusions declined to 92% during a 60-h annealing of CZT at 510 °C under Cd vapor. Further, tellurium inclusions were eliminated completely in CMT samples annealed at 570 °C in Cd vapor for 26 h, whilst their electrical resistivity fell by an ordermore » of 10 2. During the temperature-gradient annealing of CMT at 730 °C and an 18 °C/cm temperature gradient for 18 h in a vacuum of 10 -5 mbar, we observed the diffusion of Te from the sample, causing a reduction in size of the Te inclusions. For CZT samples annealed at 700 °C in a 10 °C/cm temperature gradient, we observed the migration of Te inclusions from a low-temperature region to a high one at 0.022 μm/s. During the temperature-gradient annealing of CZT in a vacuum of 10 -5 mbar at 570 °C and 30 °C/cm for 18 h, some Te inclusions moved toward the high-temperature side of the wafer, while other inclusions of the same size, i.e., 10 µm in diameter, remained in the same position. These results show that the migration, diffusion, and reaction of Te with Cd in the matrix of CZT- and CMT-wafers are complex phenomena that depend on certain conditions.« less

DOE Office of Scientific and Technical Information (OSTI.GOV)

Egarievwe, Stephen U.; Yang, Ge; Egarievwe, Alexander

Bridgman-grown cadmium zinc telluride (CdZnTe or CZT) and cadmium manganese telluride (CdMnTe or CMT) crystals often have Te inclusions that limit their performances as X-ray- and gamma-ray-detectors. We present here the results of post-growth thermal annealing aimed at reducing and eliminating Te inclusions in them. In a 2D analysis, we observed that the sizes of the Te inclusions declined to 92% during a 60-h annealing of CZT at 510 °C under Cd vapor. Further, tellurium inclusions were eliminated completely in CMT samples annealed at 570 °C in Cd vapor for 26 h, whilst their electrical resistivity fell by an ordermore » of 10 2. During the temperature-gradient annealing of CMT at 730 °C and an 18 °C/cm temperature gradient for 18 h in a vacuum of 10 -5 mbar, we observed the diffusion of Te from the sample, causing a reduction in size of the Te inclusions. For CZT samples annealed at 700 °C in a 10 °C/cm temperature gradient, we observed the migration of Te inclusions from a low-temperature region to a high one at 0.022 μm/s. During the temperature-gradient annealing of CZT in a vacuum of 10 -5 mbar at 570 °C and 30 °C/cm for 18 h, some Te inclusions moved toward the high-temperature side of the wafer, while other inclusions of the same size, i.e., 10 µm in diameter, remained in the same position. These results show that the migration, diffusion, and reaction of Te with Cd in the matrix of CZT- and CMT-wafers are complex phenomena that depend on certain conditions.« less

Flexible Electrostatic Technologies for Capture and Handling, Phase 1

NASA Technical Reports Server (NTRS)

Bryan, Thomas

2015-01-01

Fundamental to many of NASA's in-space transportation missions is the capture and handling of various objects and vehicles in various orbits for servicing, debris disposal, sample retrieval, and assembly without the benefit of sufficient grapple fixtures and docking ports. To perform similar material handling tasks on Earth, pincher grippers, suction grippers, or magnetic chucks are used, but are unable to reliably grip aluminum and composite spacecraft, insulation, radiators, solar arrays, or extra-terrestrial objects in the vacuum of outer space without dedicated handles in the right places. The electronic Flexible Electrostatic Technologies for space Capture and Handling (FETCH) will enable reliable and compliant gripping (soft dock) of practically any object in various orbits or surfaces without dedicated mechanical features, very low impact capture, and built-in proximity sensing without any conventional actuators. Originally developed to handle semiconductor and glass wafers during vacuum chamber processing without contamination, the normal rigid wafer handling chucks are replaced with thin metal foil segments laminated in flexible insulation driven by commercial off-the-shelf solid state, high-voltage power supplies. Preliminary testing in NASA Marshall Space Flight Center's (MSFC's) Flat Floor Robotics Lab demonstrated compliant alignment and gripping with a full-sized, 150-lb microsat mockup and translation before a clean release with a flip of a switch. The flexible electrostatic gripper pads can be adapted to various space applications with different sizes, shapes, and foil electrode layouts even with openings through the gripper pads for addition of guidance sensors or injection of permanent adhesives. With gripping forces estimated between 0.5 and 2.5 lb/in2 or 70-300 lb/ft2 of surface contact, the FETCH can turn on and off rapidly and repeatedly to enable sample handling, soft docking, in-space assembly, precision relocation, and surface translation for accurate anchoring.

Engineering a nanostructured "super surface" with superhydrophobic and superkilling properties.

PubMed

Hasan, Jafar; Raj, Shammy; Yadav, Lavendra; Chatterjee, Kaushik

2015-05-12

We present a nanostructured "super surface" fabricated using a simple recipe based on deep reactive ion etching of a silicon wafer. The topography of the surface is inspired by the surface topographical features of dragonfly wings. The super surface is comprised of nanopillars 4 μm in height and 220 nm in diameter with random inter-pillar spacing. The surface exhibited superhydrophobicity with a static water contact angle of 154.0° and contact angle hysteresis of 8.3°. Bacterial studies revealed the bactericidal property of the surface against both gram negative ( Escherichia coli ) and gram positive ( Staphylococcus aureus ) strains through mechanical rupture of the cells by the sharp nanopillars. The cell viability on these nanostructured surfaces was nearly six-fold lower than on the unmodified silicon wafer. The nanostructured surface also killed mammalian cells (mouse osteoblasts) through mechanical rupture of the cell membrane. Thus, such nanostructured super surfaces could find applications for designing self-cleaning and anti-bacterial surfaces in diverse applications such as microfluidics, surgical instruments, pipelines and food packaging.

Optical inspection of hidden MEMS structures

NASA Astrophysics Data System (ADS)

Krauter, Johann; Gronle, Marc; Osten, Wolfgang

2017-06-01

Micro-electro-mechanical system's (MEMS) applications have greatly expanded over the recent years, and the MEMS industry has grown almost exponentially. One of the strongest drivers are the automotive and consumer markets. A 100% test is necessary especially in the production of automotive MEMS sensors since they are subject to safety relevant functions. This inspection should be carried out before dicing and packaging since more than 90% of the production costs are incurred during these steps. An electrical test is currently being carried out with each MEMS component. In the case of a malfunction, the defect can not be located on the wafer because the MEMS are no longer optically accessible due to the encapsulation. This paper presents a low coherence interferometer for the topography measurement of MEMS structures located within the wafer stack. Here, a high axial and lateral resolution is necessary to identify defects such as stuck or bent MEMS fingers. First, the boundary conditions for an optical inspection system will be discussed. The setup is then shown with some exemplary measurements.

Long-Term Stability of NIST Chip-Scale Atomic Clock Physics Packages

DTIC Science & Technology

2007-01-01

vacuum packaging), as has been demonstrated by Lutwak et al. [3]. Nevertheless, we tried to investigate the causes for the frequency shifts of...stability,” Optics Express, 13, 1249-1253. [3] R. Lutwak , J. Deng, W. Riley, M. Varghese, J. Leblanc, G. Tepolt, M. Mescher, D. K. Serkland, K. M. Geib...the 1st Annual Multiconference on Electronics and Photonics, 7-11 November 2006, Guanajuato, Mexico, in press. [6] R. Lutwak , P. Vlitas, M

Vacuum foil insulation system

DOEpatents

Hanson, John P.; Sabolcik, Rudolph E.; Svedberg, Robert C.

1976-11-16

In a multifoil thermal insulation package having a plurality of concentric cylindrical cups, means are provided for reducing heat loss from the penetration region which extends through the cups. At least one cup includes an integral skirt extending from one end of the cup to intersection with the penetration means. Assembly of the insulation package with the skirted cup is facilitated by splitting the cup to allow it to be opened up and fitted around the other cups during assembly.

Evaluation of the role of Carnobacterium piscicola in spoilage of vacuum- and modified-atmosphere-packed cold-smoked salmon stored at 5 degrees C.

PubMed

Paludan-Müller, C; Dalgaard, P; Huss, H H; Gram, L

1998-02-17

The microflora on spoiled cold-smoked salmon often consists of a mixture of lactic acid bacteria (LAB) and Gram-negative bacteria. To elucidate the role of the different groups, a storage trial was carried out in which nisin and CO2 were used for the selective inhibition of the two bacterial groups. The shelf-life of vacuum-packed cold-smoked salmon, recorded by sensory evaluation, was four weeks at 5 degrees C and the microflora was composed of LAB (10(6)-10(7) cfu/g) with an associate Gram-negative flora in varying levels (10(5)-10(7) cfu/g). The addition of nisin and/or a CO2-atmosphere increased the shelf-life to five or six weeks and limited the level of LAB to about 10(4)-10(6), 10(3)-10(6) and 10(2)-10(4) cfu/g, respectively. CO2-atmosphere +/- nisin inhibited the growth of Gram-negative bacteria, whereas nisin had no effect on these in vacuum packages. The Gram-negative flora on vacuum-packed salmon was dominated by a Vibrio sp., resembling V. marinus, Enterobacteriaceae (Enterobacter agglomerans, Serratia liquefaciens and Rahnella aquatilis) and occasionally Aeromonas hydrophila. Irrespective of the addition of nisin and/or CO2-atmosphere, the LAB microflora was dominated by Carnobacterium piscicola, which was found to account for 87% of the 255 LAB isolates characterized. Whole-cell-protein patterns analysed by SDS-PAGE confirmed the Carnobacterium species identification. The spoilage potential of C. piscicola isolates was further studied by inoculation of approx. 10(6) cfu/g in cold-smoked salmon stored at 5 degrees C. The salmon did not spoil within 4 weeks of storage in vacuum- or CO2-atmosphere, and it is concluded that despite high levels (> 10(7) cfu/g) of C. piscicola, sensory rejection was caused by autolytic changes. This was supported by the development of soft texture and sour, rancid and bitter off-flavours at the point of spoilage, irrespective of the length of shelf-life and low or high total counts of LAB and Gram-negative bacteria.

Space Suit Portable Life Support System (PLSS) 2.0 Unmanned Vacuum Environment Testing

NASA Technical Reports Server (NTRS)

Watts, Carly; Vogel, Matthew

2016-01-01

For the first time in more than 30 years, an advanced space suit Portable Life Support System (PLSS) design was operated inside a vacuum chamber representative of the flight operating environment. The test article, PLSS 2.0, was the second system-level integrated prototype of the advanced PLSS design, following the PLSS 1.0 Breadboard that was developed and tested throughout 2011. Whereas PLSS 1.0 included five technology development components with the balance the system simulated using commercial-off-the-shelf items, PLSS 2.0 featured first generation or later prototypes for all components less instrumentation, tubing and fittings. Developed throughout 2012, PLSS 2.0 was the first attempt to package the system into a flight-like representative volume. PLSS 2.0 testing included an extensive functional evaluation known as Pre-Installation Acceptance (PIA) testing, Human-in-the-Loop testing in which the PLSS 2.0 prototype was integrated via umbilicals to a manned prototype space suit for 19 two-hour simulated EVAs, and unmanned vacuum environment testing. Unmanned vacuum environment testing took place from 1/9/15-7/9/15 with PLSS 2.0 located inside a vacuum chamber. Test sequences included performance mapping of several components, carbon dioxide removal evaluations at simulated intravehicular activity (IVA) conditions, a regulator pressure schedule assessment, and culminated with 25 simulated extravehicular activities (EVAs). During the unmanned vacuum environment test series, PLSS 2.0 accumulated 378 hours of integrated testing including 291 hours of operation in a vacuum environment and 199 hours of simulated EVA time. The PLSS prototype performed nominally throughout the test series, with two notable exceptions including a pump failure and a Spacesuit Water Membrane Evaporator (SWME) leak, for which post-test failure investigations were performed. In addition to generating an extensive database of PLSS 2.0 performance data, achievements included requirements and operational concepts verification, as well as demonstration of vehicular interfaces, consumables sizing and recharge, and water quality control.

Low-temperature direct heterogeneous bonding of polyether ether ketone and platinum.

PubMed

Fu, Weixin; Shigetou, Akitsu; Shoji, Shuichi; Mizuno, Jun

2017-10-01

Direct heterogeneous bonding between polyether ether ketone (PEEK) and Pt was realized at the temperatures lower than 150°C. In order to create sufficient bondability to diverse materials, the surface was modified by vacuum ultraviolet (VUV) irradiation, which formed hydrate bridges. For comparison, direct bonding between surfaces atomically cleaned via Ar fast atom bombardment (FAB) was conducted in a vacuum. The VUV irradiation was found to be effective for creating an ultrathin hydrate bridge layer from the residual water molecules in the chamber. Tight bonds were formed through dehydration of the hydrate bridges by heating at 150°C, which also contributed to enhancing interdiffusion across the interface. The VUV-modified surfaces showed bondability as good as that of the FAB-treated surfaces, and the VUV-modified samples had shear strengths at the same level as those of FAB-treated surfaces. This technology will be of practical use in the packaging of lightweight, flexible biomedical devices. Copyright © 2017 Elsevier B.V. All rights reserved.

Influence of freezing and thawing on the hydration characteristics, quality, and consumer acceptance of whole muscle beef injected with solutions of salt and phosphate.

PubMed

Pietrasik, Z; Janz, J A M

2009-03-01

Effects of salt/phosphate injection level (112% or 125% pump), salt level (0.5% or 1.5% salt), and freezing/thawing on hydration characteristics, quality, and consumer acceptance of beef semitendinosus were investigated. All enhancement treatments decreased shear force by 25-35%, but negatively affected colour. Increased salt concentration yielded lower purge and cooking losses, and higher water holding capacity. The higher injection level reduced water binding properties, however, the loss in functionality with higher water addition was overcome with increased salt content. Freezing and subsequent thawing was generally detrimental to colour and water binding properties and tended to increase shear force. Freezing and subsequent thawing did not affect fluid release in steaks held for 1 day before analysis, but resulted in decreased water retention in samples held for 7 days. Holding vacuum packaged steaks for 7 days generally increased package purge and negatively affected colour parameters, although water binding characteristics were improved. Consumer panel results demonstrated a negative effect on juiciness and tenderness where meat subject to low salt/high injection was frozen then thawed - the low salt level was insufficient to maintain any positive effect of injection treatment. In general, salt/phosphate injection improved product acceptability and increased willingness to purchase.

Development of shelf stable pork sausages using hurdle technology and their quality at ambient temperature (37±1°C) storage.

PubMed

Thomas, R; Anjaneyulu, A S R; Kondaiah, N

2008-05-01

Shelf stable pork sausages were developed using hurdle technology and their quality was evaluated during ambient temperature (37±1°C) storage. Hurdles incorporated were low pH, low water activity, vacuum packaging and post package reheating. Dipping in potassium sorbate solution prior to vacuum packaging was also studied. Reheating increased the pH of the sausages by 0.17units as against 0.11units in controls. Incorporation of hurdles significantly decreased emulsion stability, cooking yield, moisture and fat percent, yellowness and hardness, while increasing the protein percent and redness. Hurdle treatment reduced quality deterioration during storage as indicated by pH, TBARS and tyrosine values. About 1 log reduction in total plate count was observed with the different hurdles as were reductions in the coliform, anaerobic, lactobacilli and Staphylococcus aureus counts. pH, a(w) and reheating hurdles inhibited yeast and mold growth up to day 3, while additional dipping in 1% potassium sorbate solution inhibited their growth throughout the 9 days storage. Despite low initial sensory appeal, the hurdle treated sausages had an overall acceptability in the range 'very good' to 'good' up to day 6.

Compact atom interferometer using single laser

NASA Astrophysics Data System (ADS)

Chiow, Sheng-Wey; Yu, Nan

2017-04-01

Atom interferometer (AI) based sensors exhibit precision and accuracy unattainable with classical sensors, thanks to the inherent stability of atomic properties. The complexity of required laser system and the size of vacuum chamber driven by optical access requirement limit the applicability of such technology in size, weight, and power (SWaP) challenging environments, such as in space. For instance, a typical physics package of AI includes six viewports for laser cooling and trapping, two for AI beams, and two more for detection and a vacuum pump. Similarly, a typical laser system for an AI includes two lasers for cooling and repumping, and two for Raman transitions as AI beam splitters. In this presentation, we report our efforts in developing a miniaturized atomic accelerometer for planetary exploration. We will describe a physics package configuration having minimum optical access (thus small volume), and a laser and optics system utilizing a single laser for the sensor operation. Preliminary results on acceleration sensitivity will be discussed. We will also illustrate a path for further packaging and integration based on the demonstrated concepts. This research was carried out at the Jet Propulsion Laboratory, California Institute of Technology, under a contract with the National Aeronautics and Space Administration.

Control of Escherichia coli and Listeria monocytogenes in suckling-lamb meat evaluated using microbial challenge tests.

PubMed

Osés, S M; Diez, A M; Gómez, E M; Wilches-Pérez, D; Luning, P A; Jaime, I; Rovira, J

2015-12-01

Escherichia coli and Listeria monocytogenes microbial challenge tests were performed on fresh suckling-lamb meat. Hind leg slices were chilly stored under two modified atmosphere packaging (MAP) environments (A: 15%O2/60%CO2/25%N2, B: 15%O2/30%CO2/55%N2) and vacuum packaging (V). Only E. coli was reduced between 0.72-1.25 log cfu/g from day 1 to day 4 by the combined use of MAP/V, chilling storage and the growth of native lactic acid bacteria. However, L. monocytogenes was not inhibited by the application of V or MAP. Even do, in inoculated samples, this pathogen increased between 1.2-2.7 log cfu/g throughout the study. Consequently, a second experiment that combined the effects of MAP/V and a protective culture (Leuconostoc pseudomesenteroides PCK 18) against L. monocytogenes was designed. Two different levels of protective cultures were assayed (4 and 6 log cfu/g). Lc. pseudomesenteroides PCK 18 was able to control the growth of L. monocytogenes when the differences between them are higher than 2 log cfu/g. Moreover, when high level of protective culture was used a significant reduction of L. monocytogenes counts were noticed in samples packaged in 60% of CO2 along the storage period, although sensory properties were also affected. Copyright © 2015 Elsevier Ltd. All rights reserved.

Virtual optical interfaces for the transportation industry

NASA Astrophysics Data System (ADS)

Hejmadi, Vic; Kress, Bernard

2010-04-01

We present a novel implementation of virtual optical interfaces for the transportation industry (automotive and avionics). This new implementation includes two functionalities in a single device; projection of a virtual interface and sensing of the position of the fingers on top of the virtual interface. Both functionalities are produced by diffraction of laser light. The device we are developing include both functionalities in a compact package which has no optical elements to align since all of them are pre-aligned on a single glass wafer through optical lithography. The package contains a CMOS sensor which diffractive objective lens is optimized for the projected interface color as well as for the IR finger position sensor based on structured illumination. Two versions are proposed: a version which senses the 2d position of the hand and a version which senses the hand position in 3d.

Low-cost uncooled VOx infrared camera development

NASA Astrophysics Data System (ADS)

Li, Chuan; Han, C. J.; Skidmore, George D.; Cook, Grady; Kubala, Kenny; Bates, Robert; Temple, Dorota; Lannon, John; Hilton, Allan; Glukh, Konstantin; Hardy, Busbee

2013-06-01

The DRS Tamarisk® 320 camera, introduced in 2011, is a low cost commercial camera based on the 17 µm pixel pitch 320×240 VOx microbolometer technology. A higher resolution 17 µm pixel pitch 640×480 Tamarisk®640 has also been developed and is now in production serving the commercial markets. Recently, under the DARPA sponsored Low Cost Thermal Imager-Manufacturing (LCTI-M) program and internal project, DRS is leading a team of industrial experts from FiveFocal, RTI International and MEMSCAP to develop a small form factor uncooled infrared camera for the military and commercial markets. The objective of the DARPA LCTI-M program is to develop a low SWaP camera (<3.5 cm3 in volume and <500 mW in power consumption) that costs less than US $500 based on a 10,000 units per month production rate. To meet this challenge, DRS is developing several innovative technologies including a small pixel pitch 640×512 VOx uncooled detector, an advanced digital ROIC and low power miniature camera electronics. In addition, DRS and its partners are developing innovative manufacturing processes to reduce production cycle time and costs including wafer scale optic and vacuum packaging manufacturing and a 3-dimensional integrated camera assembly. This paper provides an overview of the DRS Tamarisk® project and LCTI-M related uncooled technology development activities. Highlights of recent progress and challenges will also be discussed. It should be noted that BAE Systems and Raytheon Vision Systems are also participants of the DARPA LCTI-M program.

Slicing of silicon into sheet material. Silicon sheet growth development for the large area silicon sheet task of the low cost silicon solar array project. Third quarterly report, September 20, 1976--December 19, 1976

DOE Office of Scientific and Technical Information (OSTI.GOV)

Holden, S.C.

1976-12-27

The stability of tensioned blades used in multiblade sawing does not seem to be the limitation in cutting with thin blades. So far, 0.010 cm thick blades have been totally unsuccessful. Recently, 0.015 cm blades have proven successful in wafering, offering an 0.005 cm reduction in the silicon used per slice. The failure of thin blades is characterized as a possible result of blade misalignment or from the inherent uncontrollability of the loose abrasive multiblade process. Corrective procedures will be employed in the assembly of packages to eliminate one type of blade misalignment. Two ingots were sliced with the samemore » batch of standard silicon carbide abrasive slurry to determine the useful lifetime of this expendable material. After 250 slices, the cutting efficiency had not degraded. Further tests will be continued to establish the maximum lifetime of both silicon carbide and boron carbide abrasive. Electron microscopy will be employed to evaluate the wear of abrasive particles in the failure of abrasive slurry. The surface damage of silicon wafers has been characterized as predominantly subsurface fracture. Damage with No. 600 SiC is between 10 and 15 microns into the wafer surface. This agrees well with previous investigations of damage from silicon carbide abrasive papers.« less

An all-silicon single-wafer micro-g accelerometer with a combined surface and bulk micromachining process

NASA Technical Reports Server (NTRS)

Yazdi, N.; Najafi, K.

2000-01-01

This paper reports an all-silicon fully symmetrical z-axis micro-g accelerometer that is fabricated on a single-silicon wafer using a combined surface and bulk fabrication process. The microaccelerometer has high device sensitivity, low noise, and low/controllable damping that are the key factors for attaining micro g and sub-micro g resolution in capacitive accelerometers. The microfabrication process produces a large proof mass by using the whole wafer thickness and a large sense capacitance by utilizing a thin sacrificial layer. The sense/feedback electrodes are formed by a deposited 2-3 microns polysilicon film with embedded 25-35 microns-thick vertical stiffeners. These electrodes, while thin, are made very stiff by the thick embedded stiffeners so that force rebalancing of the proof mass becomes possible. The polysilicon electrodes are patterned to create damping holes. The microaccelerometers are batch-fabricated, packaged, and tested successfully. A device with a 2-mm x 1-mm proof mass and a full bridge support has a measured sensitivity of 2 pF/g. The measured sensitivity of a 4-mm x 1-mm accelerometer with a cantilever support is 19.4 pF/g. The calculated noise floor of these devices at atmosphere are 0.23 micro g/sqrt(Hz) and 0.16 micro g/sqrt(Hz), respectively.

Chemical effect on diffusion in intermetallic compounds

NASA Astrophysics Data System (ADS)

Chen, Yi-Ting

With the trend of big data and the Internet of things, we live in a world full of personal electronic devices and small electronic devices. In order to make the devices more powerful, advanced electronic packaging such as wafer level packaging or 3D IC packaging play an important role. Furthermore, ?-bumps, which connect silicon dies together with dimension less than 10 ?m, are crucial parts in advanced packaging. Owing to the dimension of ?-bumps, they transform into intermetallic compound from tin based solder after the liquid state bonding process. Moreover, many new reliability issues will occur in electronic packaging when the bonding materials change; in this case, we no longer have tin based solder joint, instead, we have intermetallic compound ?-bumps. Most of the potential reliability issues in intermetallic compounds are caused by the chemical reactions driven by atomic diffusion in the material; thus, to know the diffusivities of atoms inside a material is significant and can help us to further analyze the reliability issues. However, we are lacking these kinds of data in intermetallic compound because there are some problems if used traditional Darken's analysis. Therefore, we considered Wagner diffusivity in our system to solve the problems and applied the concept of chemical effect on diffusion by taking the advantage that large amount of energy will release when compounds formed. Moreover, by inventing the holes markers made by Focus ion beam (FIB), we can conduct the diffusion experiment and obtain the tracer diffusivities of atoms inside the intermetallic compound. We applied the technique on Ni3Sn4 and Cu3Sn, which are two of the most common materials in electronic packaging, and the tracer diffusivities are measured under several different temperatures; moreover, microstructure of the intermetallic compounds are investigated to ensure the diffusion environment. Additionally, the detail diffusion mechanism was also discussed in aspect of diffusion activation enthalpy and diffusion pre-factor by using lattice structure simulation. Last but not the least, X-ray photoelectron spectroscopy and First principal calculation simulation were used to observe the electron binding energies in the intermetallic compound and illustrate the partial covalent bonding behavior in the intermetallic compounds.

Effects of high pressure application (400 and 900 MPa) and refrigerated storage time on the oxidative stability of sliced skin vacuum packed dry-cured ham.

PubMed

Clariana, Maria; Guerrero, Luis; Sárraga, Carmen; Garcia-Regueiro, José A

2012-02-01

The effect of high pressure processing at 400 MPa and 900 MPa on the oxidative stability of sliced and vacuum packaged commercial dry-cured ham was determined by analyzing the antioxidant enzyme activities, TBARS levels (thiobarbituric acid reactive substances), vitamin E content and physicochemical characteristics during refrigerated storage for 50 days in different light conditions. In dry-cured ham pressurized at 400 MPa color changes and sensory analyses were also assessed. The high pressure process at 900 MPa produced a decrease in superoxide dismutase (SOD) and glutathione peroxidase (GSHPx) activities and increased vitamin E content. In contrast, pressurization at 400 MPa, increased SOD activity, and showed no effect on vitamin E content and GSHPx activity. In general the physicochemical parameters determined (fat, moisture and collagen) were unaffected by pressurization. Treatment at 400 MPa increased the instrumental color measurement of lightness (L* values, CIELAB). This level of pressure also modified the hardness, chewiness, saltiness and color intensity. These changes of the sensory attributes in dry-cured ham were significant, but small. Copyright © 2011 Elsevier Ltd. All rights reserved.

Effect of sous vide processing on physicochemical, ultrastructural, microbial and sensory changes in vacuum packaged chicken sausages.

PubMed

Naveena, B M; Khansole, Panjab S; Shashi Kumar, M; Krishnaiah, N; Kulkarni, Vinayak V; Deepak, S J

2017-01-01

The processing of sous vide chicken sausages was optimized under vacuum packaging condition and cooking at 100 ℃ for 30 min (SV30), 60 min (SV60) and 120 min (SV120) and compared with aerobically cooked control at 100 ℃ for 30 min. Sous vide processing of chicken sausages (SV30) produced higher (p < 0.05) cooking yield, Hunterlab a* values and sensory attributes without affecting proximate composition and shear force values relative to control. The sodium dodecyl sulphate-polyacrylamide gel electrophoresis and scanning electron microscopy results revealed no significant changes in protein quality and emulsion ultra-structure due to SV30 processing relative to control sausages. Sous vide processing of chicken sausages enriched with rosemary diterpene phenols retained the freshness and quality up to 120 days during storage at 4 ± 1 ℃ relative to control sausages that were spoiled on 20th day. Lipid oxidation and microbial growth remained below the spoilage levels for all the SV-processed sausages throughout the storage and addition of rosemary diterpene mixture at 0.02% v/w reduced the microbial growth and improved (p < 0.05) the sensory attributes. Our results demonstrate that sous vide processing minimizes lipid oxidation and microbial growth of chicken sausages with improved product quality and shelf-life at 4 ± 1 ℃. © The Author(s) 2016.

Further Testing of an Amine-based Pressure-Swing System for Carbon Dioxide and Humidity Control

NASA Technical Reports Server (NTRS)

Lin, Amy; Smith, Frederick; Sweterlitsch, Jeffrey; Nalette, Tim A.; Papale, William

2008-01-01

In a crewed spacecraft environment, atmospheric carbon dioxide (CO2) and moisture control are crucial. Hamilton Sundstrand has developed a stable and efficient amine-based CO2 and water vapor sorbent, SA9T, that is well suited for use in a spacecraft environment. The sorbent is efficiently packaged in pressure-swing regenerable beds that are thermally linked to improve removal efficiency and minimize vehicle thermal loads. Flows are all controlled with a single spool valve. This technology has been baselined for the new Orion spacecraft. However, more data was needed on the operational characteristics of the package in a simulated spacecraft environment. A unit was therefore tested with simulated metabolic loads in a closed chamber at Johnson Space Center during the last third of 2006. Those test results were reported in a 2007 ICES paper. A second test article was incorporated for a third phase of testing, and that test article was modified to allow pressurized gas purge regeneration on the launch pad in addition to the standard vacuum regeneration in space. Metabolic rates and chamber volumes were also adjusted to reflect current programmatic standards. The third phase of tests was performed during the spring and summer of 2007. Tests were run with a range of operating conditions, varying: cycle time, vacuum pressure (or purge gas flow rate), air flow rate, and crew activity levels. Results of this testing are presented and potential flight operational strategies discussed.

Engineering report on the OAO-2 Wisconsin experiment package

NASA Technical Reports Server (NTRS)

Bendell, C. B.

1972-01-01

The continued useful operation of the OAO-2 Wisconsin Experiment Package (WEP) for almost three years after its December 1968 launch is evidence of a superior engineering accomplishment. Reliability features of the experiment concept and design which have contributed to its long life are presented. Data anomalies and partial failures are summarized along with conclusions regarding their causes. The thermal, vacuum and radiation effects of the space environment are shown to be minimal and quite localized within the WEP.

Thin-film formation of Si clathrates on Si wafers

NASA Astrophysics Data System (ADS)

Ohashi, Fumitaka; Iwai, Yoshiki; Noguchi, Akihiro; Sugiyama, Tomoya; Hattori, Masashi; Ogura, Takuya; Himeno, Roto; Kume, Tetsuji; Ban, Takayuki; Nonomura, Shuichi

2014-04-01

In this study, we prepared Si clathrate films (Na8Si46 and NaxSi136) using a single-crystalline Si substrate. Highly oriented film growth of Zintl-phase sodium silicide, which is a precursor of Si clathrate, was achieved by exposing Na vapour to Si substrates under an Ar atmosphere. Subsequent heat treatment of the NaSi film at 400 °C (3 h) under vacuum (<10-2 Pa) resulted in a film of Si clathrates having a thickness of several micrometres. Furthermore, this technique enabled the selective growth of Na8Si46 and NaxSi136 using the appropriate crystalline orientation of Si substrates.

Solid-state dewetting of thin Au films studied with real-time, in situ spectroscopic ellipsometry

NASA Astrophysics Data System (ADS)

Magnozzi, M.; Bisio, F.; Canepa, M.

2017-11-01

We report the design and testing of a small, high vacuum chamber that allows real-time, in situ spectroscopic ellipsometry (SE) measurements; the chamber was designed to be easily inserted within the arms of a commercial ellipsometer. As a test application, we investigated the temperature-induced solid-state dewetting of thin (20 to 8 nm) Au layers on Si wafers. In situ SE measurements acquired in real time during the heating of the samples reveal features that can be related to the birth of a localized surface plasmon resonance (LSPR), and demonstrate the presence of a temperature threshold for the solid-state dewetting.

One-step Ge/Si epitaxial growth.

PubMed

Wu, Hung-Chi; Lin, Bi-Hsuan; Chen, Huang-Chin; Chen, Po-Chin; Sheu, Hwo-Shuenn; Lin, I-Nan; Chiu, Hsin-Tien; Lee, Chi-Young

2011-07-01

Fabricating a low-cost virtual germanium (Ge) template by epitaxial growth of Ge films on silicon wafer with a Ge(x)Si(1-x) (0 < x < 1) graded buffer layer was demonstrated through a facile chemical vapor deposition method in one step by decomposing a hazardousless GeO(2) powder under hydrogen atmosphere without ultra-high vacuum condition and then depositing in a low-temperature region. X-ray diffraction analysis shows that the Ge film with an epitaxial relationship is along the in-plane direction of Si. The successful growth of epitaxial Ge films on Si substrate demonstrates the feasibility of integrating various functional devices on the Ge/Si substrates.

Thick resist for MEMS processing

NASA Astrophysics Data System (ADS)

Brown, Joe; Hamel, Clifford

2001-11-01

The need for technical innovation is always present in today's economy. Microfabrication methods have evolved in support of the demand for smaller and faster integrated circuits with price performance improvements always in the scope of the manufacturing design engineer. The dispersion of processing technology spans well beyond IC fabrication today with batch fabrication and wafer scale processing lending advantages to MEMES applications from biotechnology to consumer electronics from oil exploration to aerospace. Today the demand for innovative processing techniques that enable technology is apparent where only a few years ago appeared too costly or not reliable. In high volume applications where yield and cost improvements are measured in fractions of a percent it is imperative to have process technologies that produce consistent results. Only a few years ago thick resist coatings were limited to thickness less than 20 microns. Factors such as uniformity, edge bead and multiple coatings made high volume production impossible. New developments in photoresist formulation combined with advanced coating equipment techniques that closely controls process parameters have enable thick photoresist coatings of 70 microns with acceptable uniformity and edge bead in one pass. Packaging of microelectronic and micromechanical devices is often a significant cost factor and a reliability issue for high volume low cost production. Technologies such as flip- chip assembly provide a solution for cost and reliability improvements over wire bond techniques. The processing for such technology demands dimensional control and presents a significant cost savings if it were compatible with mainstream technologies. Thick photoresist layers, with good sidewall control would allow wafer-bumping technologies to penetrate the barriers to yield and production where costs for technology are the overriding issue. Single pass processing is paramount to the manufacturability of packaging technology. Uniformity and edge bead control defined the success of process implementation. Today advanced packaging solutions are created with thick photoresist coatings. The techniques and results will be presented.

High-resolution and Fast-response Fiber-optic Temperature Sensor Using Silicon Fabry-Perot Cavity

DTIC Science & Technology

2015-03-23

silver diaphragm,” Opt. Lett. 37(9), 1505–1507 (2012). 18. I. M. White and X. D. Fan , “On the performance quantification of resonant refractive index...to the response time, the package of a FBG with a copper tube encapsulation can greatly reduce the response time of the sensor from several seconds...head shown in Fig. 1(b) are described in Fig. 2. The fabrication started with bonding a 200-µm-thick double-side-polished silicon wafer on top of

The effect of plasma density and emitter geometry on space charge limits for field emitter array electron charge emission into a space plasma

NASA Astrophysics Data System (ADS)

Morris, Dave; Gilchrist, Brian; Gallimore, Alec

2001-02-01

Field Emitter Array Cathodes (FEACs) are a new technology being developed for several potential spacecraft electron emission and charge control applications. Instead of a single hot (i.e., high powered) emitter, or a gas dependant plasma contactor, FEAC systems consist of many (hundreds or thousands) of small (micron level) cathode/gate pairs printed on a semiconductor wafer that effect cold field emission at relatively low voltages. Each individual cathode emits only micro-amp level currents, but a functional array is capable of amp/cm2 current densities. It is hoped that thus FEAC offers the possibility of a relatively low-power, simple to integrate, and inexpensive technique for the high level of current emissions that are required for an electrodynamic tether (EDT) propulsion mission. Space charge limits are a significant concern for the EDT application. Vacuum chamber tests and PIC simulations are being performed at the University of Michigan Plasmadynamics and Electric Propulsion Laboratory and Space Physics Research Laboratory to determine the effect of plasma density and emitter geometry on space charge limitations. The results of this work and conclusions to date of how to best mitigate space charge limits will be presented. .

A piezoelectric micro generator worked at low frequency and high acceleration based on PZT and phosphor bronze bonding.

PubMed

Tang, Gang; Yang, Bin; Hou, Cheng; Li, Guimiao; Liu, Jingquan; Chen, Xiang; Yang, Chunsheng

2016-12-08

Recently, piezoelectric energy harvesters (PEHs) have been paid a lot of attention by many researchers to convert mechanical energy into electrical and low level vibration. Currently, most of PEHs worked under high frequency and low level vibration. In this paper, we propose a micro cantilever generator based on the bonding of bulk PZT wafer and phosphor bronze, which is fabricated by MEMS technology, such as mechanical chemical thinning and etching. The experimental results show that the open-circuit output voltage, output power and power density of this fabricated prototype are 35 V, 321 μW and 8664 μW cm -3 at the resonant frequency of 100.8 Hz, respectively, when it matches an optimal loading resistance of 140 kΩ under the excitation of 3.0 g acceleration. The fabricated micro generator can obtain the open-circuit stable output voltage of 61.2 V when the vibration acceleration arrives at 7.0 g. Meanwhile, when this device is pasted on the vibrating vacuum pump, the output voltage is about 11 V. It demonstrates that this novel proposed device can scavenge high vibration level energy at low frequency for powering the inertial sensors in internet of things application.

A piezoelectric micro generator worked at low frequency and high acceleration based on PZT and phosphor bronze bonding

PubMed Central

Tang, Gang; Yang, Bin; Hou, Cheng; Li, Guimiao; Liu, Jingquan; Chen, Xiang; Yang, Chunsheng

2016-01-01

Recently, piezoelectric energy harvesters (PEHs) have been paid a lot of attention by many researchers to convert mechanical energy into electrical and low level vibration. Currently, most of PEHs worked under high frequency and low level vibration. In this paper, we propose a micro cantilever generator based on the bonding of bulk PZT wafer and phosphor bronze, which is fabricated by MEMS technology, such as mechanical chemical thinning and etching. The experimental results show that the open-circuit output voltage, output power and power density of this fabricated prototype are 35 V, 321 μW and 8664 μW cm−3 at the resonant frequency of 100.8 Hz, respectively, when it matches an optimal loading resistance of 140 kΩ under the excitation of 3.0 g acceleration. The fabricated micro generator can obtain the open-circuit stable output voltage of 61.2 V when the vibration acceleration arrives at 7.0 g. Meanwhile, when this device is pasted on the vibrating vacuum pump, the output voltage is about 11 V. It demonstrates that this novel proposed device can scavenge high vibration level energy at low frequency for powering the inertial sensors in internet of things application. PMID:27929139

Instrumental meat quality of veal calves reared under three management systems and color evolution of meat stored in three packaging systems.

PubMed

Ripoll, G; Albertí, P; Casasús, I; Blanco, M

2013-02-01

This study evaluated the meat quality of grazing suckling calves (GR), suckling plus supplemented calves (SUP) and weaned calves finished on concentrates (FIN) and the color evolution of meat packaged in film (FILM), modified atmosphere packaging (MAP) and vacuum packaging (VAC). Intramuscular fat was quite low for all treatments and GR meat had greater percentages of PUFA and lower SFA, MUFA and n6/n3 than SUP and FIN. FIN and SUP meat had more L* and was more tender when aged than GR. GR meat was tough and dark. The packaging system was more influential on meat color than the feeding management. VAC had the lowest values of metmyoglobin when aged. MAP had the greatest L* and hue angle and the lowest redness after 13 d of aging, thus MAP was the packaging with the shortest shelf life. Copyright © 2012 Elsevier Ltd. All rights reserved.

Controlling Blown Pack Spoilage Using Anti-Microbial Packaging

PubMed Central

Reid, Rachael; Tyuftin, Andrey A.; Kerry, Joe P.; Whyte, Paul; Bolton, Declan

2017-01-01

Active (anti-microbial) packaging was prepared using three different formulations; Auranta FV; Inbac-MDA and sodium octanoate at two concentrations (2.5 and 3.5 times their minimum inhibitory concentration (MIC, the lowest concentration that will inhibit the visible growth of the organisms) against Clostridium estertheticum, DSMZ 8809). Inoculated beef samples were packaged using the active packaging and monitored for 100 days storage at 2 °C for blown pack spoilage. The time to the onset of blown pack spoilage was significantly (p < 0.01) increased using Auranta FV and sodium octanoate (caprylic acid sodium salt) at both concentrations. Moreover, sodium octanoate packs had significantly (p < 0.01) delayed blown pack spoilage as compared to Auranta FV. It was therefore concluded that Auranta FV or sodium octanoate, incorporated into the packaging materials used for vacuum packaged beef, would inhibit blown pack spoilage and in the case of the latter, well beyond the 42 days storage period currently required for beef primals. PMID:28805679

Controlling Blown Pack Spoilage Using Anti-Microbial Packaging.

PubMed

Reid, Rachael; Bolton, Declan; Tiuftin, Andrey A; Kerry, Joe P; Fanning, Séamus; Whyte, Paul

2017-08-12

Active (anti-microbial) packaging was prepared using three different formulations; Auranta FV; Inbac-MDA and sodium octanoate at two concentrations (2.5 and 3.5 times their minimum inhibitory concentration (MIC, the lowest concentration that will inhibit the visible growth of the organisms) against Clostridium estertheticum , DSMZ 8809). Inoculated beef samples were packaged using the active packaging and monitored for 100 days storage at 2 °C for blown pack spoilage. The time to the onset of blown pack spoilage was significantly ( p < 0.01) increased using Auranta FV and sodium octanoate (caprylic acid sodium salt) at both concentrations. Moreover, sodium octanoate packs had significantly ( p < 0.01) delayed blown pack spoilage as compared to Auranta FV. It was therefore concluded that Auranta FV or sodium octanoate, incorporated into the packaging materials used for vacuum packaged beef, would inhibit blown pack spoilage and in the case of the latter, well beyond the 42 days storage period currently required for beef primals.

A 45° saw-dicing process applied to a glass substrate for wafer-level optical splitter fabrication for optical coherence tomography

NASA Astrophysics Data System (ADS)

Maciel, M. J.; Costa, C. G.; Silva, M. F.; Gonçalves, S. B.; Peixoto, A. C.; Ribeiro, A. Fernando; Wolffenbuttel, R. F.; Correia, J. H.

2016-08-01

This paper reports on the development of a technology for the wafer-level fabrication of an optical Michelson interferometer, which is an essential component in a micro opto-electromechanical system (MOEMS) for a miniaturized optical coherence tomography (OCT) system. The MOEMS consists on a titanium dioxide/silicon dioxide dielectric beam splitter and chromium/gold micro-mirrors. These optical components are deposited on 45° tilted surfaces to allow the horizontal/vertical separation of the incident beam in the final micro-integrated system. The fabrication process consists of 45° saw dicing of a glass substrate and the subsequent deposition of dielectric multilayers and metal layers. The 45° saw dicing is fully characterized in this paper, which also includes an analysis of the roughness. The optimum process results in surfaces with a roughness of 19.76 nm (rms). The actual saw dicing process for a high-quality final surface results as a compromise between the dicing blade’s grit size (#1200) and the cutting speed (0.3 mm s-1). The proposed wafer-level fabrication allows rapid and low-cost processing, high compactness and the possibility of wafer-level alignment/assembly with other optical micro components for OCT integrated imaging.

Testing of an Amine-Based Pressure-Swing System for Carbon Dioxide and Humidity Control

NASA Technical Reports Server (NTRS)

Lin, Amy; Smith, Frederick; Sweterlitsch, Jeffrey; Graf, John; Nalette, Tim; Papale, William; Campbell, Melissa; Lu, Sao-Dung

2007-01-01

In a crewed spacecraft environment, atmospheric carbon dioxide (CO2) and moisture control is crucial. Hamilton Sundstrand has developed a stable and efficient amine-based CO2 and water vapor sorbent, SA9T, that is well-suited for use in a spacecraft environment. The sorbent is efficiently packaged in pressure-swing regenerable beds that are thermally linked to improve removal efficiency and minimize vehicle thermal loads. Flows are all controlled with a single spool valve. This technology has been baselined for the new Orion spacecraft. However, more data was needed on the operational characteristics of the package in a simulated spacecraft environment. A unit was therefore tested with simulated metabolic loads in a closed chamber at Johnson Space Center during the last third of 2006. Tests were run at a variety of cabin temperatures and with a range of operating conditions varying cycle time, vacuum pressure, air flow rate, and crew activity levels. Results of this testing are presented and potential flight operational strategies discussed.

Kerfless epitaxial silicon wafers with 7 ms carrier lifetimes and a wide lift-off process window

NASA Astrophysics Data System (ADS)

Gemmel, Catherin; Hensen, Jan; David, Lasse; Kajari-Schröder, Sarah; Brendel, Rolf

2018-04-01

Silicon wafers contribute significantly to the photovoltaic module cost. Kerfless silicon wafers that grow epitaxially on porous silicon (PSI) and are subsequently detached from the growth substrate are a promising lower cost drop-in replacement for standard Czochralski (Cz) wafers. However, a wide technological processing window appears to be a challenge for this process. This holds in particularly for the etching current density of the separation layer that leads to lift-off failures if it is too large or too low. Here we present kerfless PSI wafers of high electronic quality that we fabricate on weakly reorganized porous Si with etch current densities varying in a wide process window from 110 to 150 mA/cm2. We are able to detach all 17 out of 17 epitaxial wafers. All wafers exhibit charge carrier lifetimes in the range of 1.9 to 4.3 ms at an injection level of 1015 cm-3 without additional high-temperature treatment. We find even higher lifetimes in the range of 4.6 to 7.0 ms after applying phosphorous gettering. These results indicate that a weak reorganization of the porous layer can be beneficial for a large lift-off process window while still allowing for high carrier lifetimes.

Evaluation of a cyanoacrylate dressing to manage peristomal skin alterations under ostomy skin barrier wafers.

PubMed

Milne, Catherine T; Saucier, Darlene; Trevellini, Chenel; Smith, Juliet

2011-01-01

Peristomal skin alterations under ostomy barrier wafers are a commonly reported problem. While a number of interventions to manage this issue have been reported, the use of a topically applied cyanoacrylate has received little attention. This case series describes the use of a topical cyanoacrylate for the management of peristomal skin alterations in persons living with an ostomy. Using a convenience sample, the topical cyanoacrylate dressing was applied to 11 patients with peristomal skin disruption under ostomy wafers in acute care and outpatient settings. The causes of barrier function interruption were also addressed to enhance outcomes. Patients were assessed for wound discomfort using a Likert Scale, time to healing, and number of appliance changes. Patient satisfaction was also examined. Average reported discomfort levels were 9.5 out of 10 at the initial peristomal irritation assessment visit decreased to 3.5 at the first wafer change and were absent by the second wafer change. Wafers had increasing wear time between changes in both settings with acute care patients responding faster. Epidermal resurfacing occurred within 10.2 days in outpatients and within 7 days in acute care patients. Because of the skin sealant action of this dressing, immediate adherence of the wafer was reported at all pouch changes.

The application of carbon monoxide in meat packaging needs to be re-evaluated within the EU: An overview.

PubMed

Van Rooyen, Lauren Anne; Allen, Paul; O'Connor, David I

2017-10-01

Carbon monoxide (CO) has many value-added benefits in meat packaging due to its colour stabilising effects and enhancement of meat quality attributes. The regulation of CO within meat packaging varies worldwide and remains a topical and controversial issue. CO is prohibited in the EU for use in meat packaging mainly due to fears it may mask spoilage therefore misleading consumers. The issue of consumer acceptance of CO was not considered. This article reviews the most pertinent literature to assess if the problems associated with the prohibition have been addressed. Applying CO pretreatments prior to vacuum packaging enhances colour while allowing discolouration to occur by the use-by-date, thereby addressing concerns about safety. Recent work showing European consumer acceptance of CO in meat packaging demonstrates its future potential within the EU. The information provided may support framing future policies intended to assure consumer protection, safety, choice and interest. Re-evaluation of permitting CO as a packaging gas within the EU may be warranted. Copyright © 2017 Elsevier Ltd. All rights reserved.

Effect of Rosmarinus officinalis L. essential oil combined with different packaging conditions to extend the shelf life of refrigerated beef meat.

PubMed

Sirocchi, Veronica; Devlieghere, Frank; Peelman, Nanou; Sagratini, Gianni; Maggi, Filippo; Vittori, Sauro; Ragaert, Peter

2017-04-15

Rosemary essential oil (REO) contains bioactives having antioxidant and antimicrobial properties. This work investigated the effect of REO combined with modified atmosphere packaging conditions (MAP), in our case, aerobic, vacuum or high O 2 , to extend the shelf life of beef. Beef slices were wrapped in special three-layer sheets of packaging material, some with a coating of REO (active packaging, AP), and some without REO (non active packaging, NAP), and stored at 4°C for 20days. The use of REO proved efficacious in every storage condition, as seen in the lower counts of psychrotrophics, Brochothrix thermosphacta, Pseudomonas spp., and Enterobacteriaceae in AP meat compared to NAP meat. Sensory and colourimetric analyses showed that the best packaging conditions were high-O 2 atmosphere in combination with REO. Based on microbiological data, shelf life of beef was 5-6days for AP samples packaged under aerobic conditions and 14-15days for AP samples in high-O 2 conditions. Copyright © 2016 Elsevier Ltd. All rights reserved.

Effectiveness of antimicrobial food packaging materials.

PubMed

Cooksey, K

2005-10-01

Antimicrobial additives have been used successfully for many years as direct food additives. The literature provides evidence that some of these additives may be effective as indirect food additives incorporated into food packaging materials. Antimicrobial food packaging is directed toward the reduction of surface contamination of processed, prepared foods such as sliced meats and Frankfurter sausages (hot dogs). The use of such packaging materials is not meant to be a substitute for good sanitation practices, but it should enhance the safety of food as an additional hurdle for the growth of pathogenic and/or spoilage microorganisms. Studies have focused on establishing methods for coating low-density polyethylene film or barrier films with methyl cellulose as a carrier for nisin. These films have significantly reduced the presence of Listeria monocytogenes in solutions and in vacuum packaged hot dogs. Other research has focused on the use of chitosan to inhibit L. monocytogenes and chlorine dioxide sachets for the reduction of Salmonella on modified atmosphere-packaged fresh chicken breasts. Overall, antimicrobial packaging shows promise as an effective method for the inhibition of certain bacteria in foods, but barriers to their commercial implementation continue to exist.

Effects of diet, packaging, and irradiation on protein oxidation, lipid oxidation, and color of raw broiler thigh meat during refrigerated storage.

PubMed

Xiao, S; Zhang, W G; Lee, E J; Ma, C W; Ahn, D U

2011-06-01

This study was designed to evaluate the effects of dietary treatment, packaging, and irradiation singly or in combination on the oxidative stability of broiler chicken thigh meat. A total of 120 four-week-old chickens were divided into 12 pens (10 birds/pen), and 4 pens of broilers were randomly assigned to a control oxidized diet (5% oxidized oil) or an antioxidant-added diet [500 IU of vitamin E + 200 mg/kg of butylated hydroxyanisole (BHA)] and fed for 2 wk. After slaughter, thigh meats were separated, ground, packaged in either oxygen-permeable or oxygen-impermeable vacuum bags, and irradiated at 0 or 3 kGy. Lipid oxidation (TBA-reactive substances), protein oxidation (carbonyl), and color of the meat were measured at 1, 4, and 7 d of refrigerated storage. The lipid and protein oxidation of thigh meats from birds fed the diet supplemented with antioxidants (vitamin E + BHA) was significantly lower than the lipid and protein oxidation of birds fed the control diet, whereas the lipid and protein oxidation of broilers fed the oxidized oil diet was higher than that of birds fed the control diet. Vacuum packaging slowed, but irradiation accelerated, the lipid and protein oxidation of thigh meat during storage. Dietary antioxidants (vitamin E + BHA) and irradiation treatments showed a stronger effect on lipid oxidation than on protein oxidation. A significant correlation between lipid and protein oxidation in meat was found during storage. Dietary supplementation of vitamin E + BHA and the irradiation treatment increased the lightness and redness of thigh meat, respectively. It is suggested that appropriate use of dietary antioxidants in combination with packaging could be effective in minimizing oxidative changes in irradiated raw chicken thigh meat.

Signal processing techniques for damage detection with piezoelectric wafer active sensors and embedded ultrasonic structural radar

NASA Astrophysics Data System (ADS)

Yu, Lingyu; Bao, Jingjing; Giurgiutiu, Victor

2004-07-01

Embedded ultrasonic structural radar (EUSR) algorithm is developed for using piezoelectric wafer active sensor (PWAS) array to detect defects within a large area of a thin-plate specimen. Signal processing techniques are used to extract the time of flight of the wave packages, and thereby to determine the location of the defects with the EUSR algorithm. In our research, the transient tone-burst wave propagation signals are generated and collected by the embedded PWAS. Then, with signal processing, the frequency contents of the signals and the time of flight of individual frequencies are determined. This paper starts with an introduction of embedded ultrasonic structural radar algorithm. Then we will describe the signal processing methods used to extract the time of flight of the wave packages. The signal processing methods being used include the wavelet denoising, the cross correlation, and Hilbert transform. Though hardware device can provide averaging function to eliminate the noise coming from the signal collection process, wavelet denoising is included to ensure better signal quality for the application in real severe environment. For better recognition of time of flight, cross correlation method is used. Hilbert transform is applied to the signals after cross correlation in order to extract the envelope of the signals. Signal processing and EUSR are both implemented by developing a graphical user-friendly interface program in LabView. We conclude with a description of our vision for applying EUSR signal analysis to structural health monitoring and embedded nondestructive evaluation. To this end, we envisage an automatic damage detection application utilizing embedded PWAS, EUSR, and advanced signal processing.

Progress on complementary patterning using plasmon-excited electron beamlets (Conference Presentation)

NASA Astrophysics Data System (ADS)

Du, Zhidong; Chen, Chen; Pan, Liang

2017-04-01

Maskless lithography using parallel electron beamlets is a promising solution for next generation scalable maskless nanolithography. Researchers have focused on this goal but have been unable to find a robust technology to generate and control high-quality electron beamlets with satisfactory brightness and uniformity. In this work, we will aim to address this challenge by developing a revolutionary surface-plasmon-enhanced-photoemission (SPEP) technology to generate massively-parallel electron beamlets for maskless nanolithography. The new technology is built upon our recent breakthroughs in plasmonic lenses, which will be used to excite and focus surface plasmons to generate massively-parallel electron beamlets through photoemission. Specifically, the proposed SPEP device consists of an array of plasmonic lens and electrostatic micro-lens pairs, each pair independently producing an electron beamlet. During lithography, a spatial optical modulator will dynamically project light onto individual plasmonic lenses to control the switching and brightness of electron beamlets. The photons incident onto each plasmonic lens are concentrated into a diffraction-unlimited spot as localized surface plasmons to excite the local electrons to near their vacuum levels. Meanwhile, the electrostatic micro-lens extracts the excited electrons to form a focused beamlet, which can be rastered across a wafer to perform lithography. Studies showed that surface plasmons can enhance the photoemission by orders of magnitudes. This SPEP technology can scale up the maskless lithography process to write at wafers per hour. In this talk, we will report the mechanism of the strong electron-photon couplings and the locally enhanced photoexcitation, design of a SPEP device, overview of our proof-of-concept study, and demonstrated parallel lithography of 20-50 nm features.

The effect of temperature during retail display on the colour stability of CO pretreated vacuum packaged beef steaks.

PubMed

Van Rooyen, Lauren Anne; Allen, Paul; Gallagher, Eimear I; O'Connor, David I

2018-05-24

The effect of CO pretreatments applied to beef striploin steaks (Longissimus thoracis et lumborum, LTL) prior to vacuum packaging and display temperature on colour stability, shelf life and tenderness was determined. Steaks were exposed to 5% CO, 60% CO 2 and 35% N 2 for 3 (CO3), 5 (CO5) or 7 (CO7) h, followed by 28 days display at 2 °C (good industry practice) or 6 °C (mild abuse). CO5 was the optimum exposure time as it induced the desirable colour while not retaining the bright colour, irrespective of display temperature. K/S ratios confirmed that CO pretreatment did not mask spoilage and could be more sensitive than colour parameters at monitoring discoloration as colour was not retained. Exposure to CO did not have any negative effect on meat quality attributes, while mild temperature abuse (6 °C) increased purge loss and decreased pH. Copyright © 2018 Elsevier Ltd. All rights reserved.

Monitoring of Microbial Metabolites and Bacterial Diversity in Beef Stored under Different Packaging Conditions ▿ †

PubMed Central

Ercolini, Danilo; Ferrocino, Ilario; Nasi, Antonella; Ndagijimana, Maurice; Vernocchi, Pamela; La Storia, Antonietta; Laghi, Luca; Mauriello, Gianluigi; Guerzoni, M. Elisabetta; Villani, Francesco

2011-01-01

Beef chops were stored at 4°C under different conditions: in air (A), modified-atmosphere packaging (MAP), vacuum packaging (V), or bacteriocin-activated antimicrobial packaging (AV). After 0 to 45 days of storage, analyses were performed to determine loads of spoilage microorganisms, microbial metabolites (by solid-phase microextraction [SPME]-gas chromatography [GC]-mass spectrometry [MS] and proton nuclear magnetic resonance [1H NMR]), and microbial diversity (by PCR–denaturing gradient gel electrophoresis [DGGE] and pyrosequencing). The microbiological shelf life of meat increased with increasing selectivity of storage conditions. Culture-independent analysis by pyrosequencing of DNA extracted directly from meat showed that Brochothrix thermosphacta dominated during the early stages of storage in A and MAP, while Pseudomonas spp. took over during further storage in A. Many different bacteria, several of which are usually associated with soil rather than meat, were identified in V and AV; however, lactic acid bacteria (LAB) dominated during the late phases of storage, and Carnobacterium divergens was the most frequent microorganism in AV. Among the volatile metabolites, butanoic acid was associated with the growth of LAB under V and AV storage conditions, while acetoin was related to the other spoilage microbial groups and storage conditions. 1H NMR analysis showed that storage in air was associated with decreases in lactate, glycogen, IMP, and ADP levels and with selective increases in levels of 3-methylindole, betaine, creatine, and other amino acids. The meat microbiota is significantly affected by storage conditions, and its changes during storage determine complex shifts in the metabolites produced, with a potential impact on meat quality. PMID:21803905

Industrial application of an antilisterial strain of Lactobacillus sakei as a protective culture and its effect on the sensory acceptability of cooked, sliced, vacuum-packaged meats.

PubMed

Bredholt, S; Nesbakken, T; Holck, A

2001-06-15

The application of a protective lactic acid bacterium (LAB) during the commercial production of cooked meat products is described. The LAB, a strain of Lactobacillus sakei, was previously isolated from cooked ham and inhibited growth of Listeria monocytogenes and Escherichia coli O157:H7 in this product. L. sakei was applied to the cooked products at a concentration of 10(5)-10(6) cfu/g immediately before slicing and vacuum-packaging using a hand-operated spraying bottle. The LAB strain inhibited growth of 10(3) cfu/g of a cocktail of three rifampicin resistant mutant L. monocytogenes strains both at 8 degrees C and 4 degrees C. Consumer acceptance tests of cooked ham and of servelat sausage, a Norwegian non-fermented cooked meat sausage, showed that control and inoculated products were equally acceptable. The products were still acceptable after storage for 28 days at 4 degrees C and, after opening the packages, for a further 5 days at 4 degrees C. The findings presented here confirm that the L. sakei strain is suitable for use as a protective culture and may technically easily be implemented in the commercial production of cooked meat products.

Sugar maple sap volume increases as vacuum level is increased

Treesearch

Russell S. Walters; H. Clay Smith

1975-01-01

Maple sap yields collected by using plastic tubing with a vacuum pump increased as the vacuum level was increased. Sap volumes collected at the 10- and 15-inch mercury vacuum levels were statistically significantly higher than volumes collected at the 5-inch level. Although the 15-inch vacuum yielded more sap than the 10-inch vacuum, the difference was not...

Thermal Interface Materials Selection and Application Guidelines: In Perspective of Xilinx Virtex-5QV Thermal Management

NASA Technical Reports Server (NTRS)

Suh, Jong-ook; Dillon, R. Peter; Tseng, Stephen

2015-01-01

The heat from high-power microdevices for space, such as Xilinx Virtex 4 and 5 (V4 and V5), has to be removed mainly through conduction in the space vacuum environment. The class-Y type packages are designed to remove the heat from the top of the package, and the most effective method to remove heat from the class-Y type packages is to attach a heat transfer device on the lid of the package and to transfer the heat to frame or chassis. When a heat transfer device is attached to the package lid, the surfaces roughness of the package lid and the heat transfer device reduces the effective contact area between the two. The reduced contact area results in increased thermal contact resistance, and a thermal interface material is required to reduce the thermal contact resistance by filling in the gap between the surfaces of the package lid and the heat transfer device. The current report describes JPL's FY14 NEPP task study on property requirements of TIM and impact of TIM properties on the packaging reliability. The current task also developed appratuses to investigate the performances of TIMs in the actual mission environment.

Bulk lifetime characterization of corona charged silicon wafers with high resistivity by means of microwave detected photoconductivity

NASA Astrophysics Data System (ADS)

Engst, C. R.; Rommel, M.; Bscheid, C.; Eisele, I.; Kutter, C.

2017-12-01

Minority carrier lifetime (lifetime) measurements are performed on corona-charged silicon wafers by means of Microwave Detected Photoconductivity (MDP). The corona charge is deposited on the front and back sides of oxidized wafers in order to adjust accumulation conditions. Once accumulation is established, interface recombination is suppressed and bulk lifetimes are obtained. Neither contacts nor non-CMOS compatible preparation techniques are required in order to achieve accumulation conditions, which makes the method ideally suited for inline characterization. The novel approach, termed ChargedMDP (CMDP), is used to investigate neutron transmutation doped (NTD) float zone silicon with resistivities ranging from 6.0 to 8.2 kΩ cm. The bulk properties of 150 mm NTD wafers are analyzed in detail by performing measurements of the carrier lifetime and the steady-state photoconductivity at various injection levels. The results are compared with MDP measurements of uncharged wafers as well as to the established charged microwave detected Photoconductance Decay (charge-PCD) method. Besides analyzing whole wafers, CMDP measurements are performed on oxide test-structures on a patterned wafer. Finally, the oxide properties are characterized by means of charge-PCD as well as capacitance-voltage measurements. With CMDP, average bulk lifetimes up to 33.1 ms are measured, whereby significant variations are observed among wafers, which are produced out of the same ingot but oxidized in different furnaces. The observed lifetime variations are assumed to be caused by contaminations, which are introduced during the oxidation process. The results obtained by CMDP were neither accessible by means of conventional MDP measurements of uncharged wafers nor with the established charge-PCD method.

Survival of epiphytic bacteria from seed stored on the Long Duration Exposure Facility (LDEF)

NASA Technical Reports Server (NTRS)

Schuerger, Andrew C.; Norman, Bret L.; Angelo, Joseph A., Jr.

1991-01-01

This study was designed to determine the survival of microorganisms exposed to the relatively harsh conditions found in low Earth orbit (LEO). Seed of corn, sunflower, canteloupe, zucchini, bean, pea, and pumpkin cultivars were packaged in two 18 x 2.5 cm aluminum tubes; wall thickness for each tube was 1.33 mm. One seed tube was attacked to payload M0006, tray C-2; a second tube was stored at room temperature in a lab on Earth. Five lithium fluoride thermoluminescent dosimetry wafers (TLD-100 wafers) were placed in each aluminum tube. The total mean dosages for flight and ground-control TLD wafers were 210.0 and 0.9 rads, respectively. Seeds were washed for 2 hrs in a phosphate buffered saline solution. Bacteria were isolated by plating samples of the seed-washings onto dilute tryptic soy agar. Pure isolates of morphologically distinct bacteria were obtained by standard microbiological procedures. Bacteria were grouped according to colony-type and preliminary identification was completed using a fatty-acid analysis system. Bacillus spp. were the primary microoganisms that survived on seed during the experiment. Bacterial diversity and relative abundance were similar for the ground flight seed. Bacillus subtilus, B. pumilus, B. licheniformis, B. polymyxa, B. megaterium, and B. pabuli were isolated most frequently. Members of the genera Kurthia, Listeria, Micrococcus, and Arthrobacter were also isolated from flight and ground control seed. Results support the hypothesis that terrestrial microorganisms can survive long periods of time in the relatively harsh LEO environment.

Optoelectronic interconnects for 3D wafer stacks

NASA Astrophysics Data System (ADS)

Ludwig, David E.; Carson, John C.; Lome, Louis S.

1996-01-01

Wafer and chip stacking are envisioned as a means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper provides definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies are discussed.

Optoelectronic interconnects for 3D wafer stacks

NASA Astrophysics Data System (ADS)

Ludwig, David; Carson, John C.; Lome, Louis S.

1996-01-01

Wafer and chip stacking are envisioned as means of providing increased processing power within the small confines of a three-dimensional structure. Optoelectronic devices can play an important role in these dense 3-D processing electronic packages in two ways. In pure electronic processing, optoelectronics can provide a method for increasing the number of input/output communication channels within the layers of the 3-D chip stack. Non-free space communication links allow the density of highly parallel input/output ports to increase dramatically over typical edge bus connections. In hybrid processors, where electronics and optics play a role in defining the computational algorithm, free space communication links are typically utilized for, among other reasons, the increased network link complexity which can be achieved. Free space optical interconnections provide bandwidths and interconnection complexity unobtainable in pure electrical interconnections. Stacked 3-D architectures can provide the electronics real estate and structure to deal with the increased bandwidth and global information provided by free space optical communications. This paper will provide definitions and examples of 3-D stacked architectures in optoelectronics processors. The benefits and issues of these technologies will be discussed.

Silver free III-nitride flip chip light-emitting-diode with wall plug efficiency over 70% utilizing a GaN tunnel junction

NASA Astrophysics Data System (ADS)

Yonkee, B. P.; Young, E. C.; DenBaars, S. P.; Nakamura, S.; Speck, J. S.

2016-11-01

A molecular beam epitaxy regrowth technique was demonstrated on standard industrial patterned sapphire substrate light-emitting diode (LED) epitaxial wafers emitting at 455 nm to form a GaN tunnel junction. By using an HF pretreatment on the wafers before regrowth, a voltage of 3.08 V at 20 A/cm2 was achieved on small area devices. A high extraction package was developed for comparison with flip chip devices which utilize an LED floating in silicone over a BaSO4 coated header and produced a peak external quantum efficiency (EQE) of 78%. A high reflectivity mirror was designed using a seven-layer dielectric coating backed by aluminum which has a calculated angular averaged reflectivity over 98% between 400 and 500 nm. This was utilized to fabricate a flip chip LED which had a peak EQE and wall plug efficiency of 76% and 73%, respectively. This flip chip could increase light extraction over a traditional flip chip LED due to the increased reflectivity of the dielectric based mirror.

Off-line wafer level reliability control: unique measurement method to monitor the lifetime indicator of gate oxide validated within bipolar/CMOS/DMOS technology

NASA Astrophysics Data System (ADS)

Gagnard, Xavier; Bonnaud, Olivier

2000-08-01

We have recently published a paper on a new rapid method for the determination of the lifetime of the gate oxide involved in a Bipolar/CMOS/DMOS technology (BCD). Because this previous method was based on a current measurement with gate voltage as a parameter needing several stress voltages, it was applied only by lot sampling. Thus, we tried to find an indicator in order to monitor the gate oxide lifetime during the wafer level parametric test and involving only one measurement of the device on each wafer test cell. Using the Weibull law and Crook model, combined with our recent model, we have developed a new test method needing only one electrical measurement of MOS capacitor to monitor the quality of the gate oxide. Based also on a current measurement, the parameter is the lifetime indicator of the gate oxide. From the analysis of several wafers, we gave evidence of the possibility to detect a low performance wafer, which corresponds to the infantile failure on the Weibull plot. In order to insert this new method in the BCD parametric program, a parametric flowchart was established. This type of measurement is an important challenges, because the actual measurements, breakdown charge, Qbd, and breakdown electric field, Ebd, at parametric level and Ebd and interface states density, Dit during the process cannot guarantee the gate oxide lifetime all along fabrication process. This indicator measurement is the only one, which predicts the lifetime decrease.

Scalable Manufacturing of Solderable and Stretchable Physiologic Sensing Systems.

PubMed

Kim, Yun-Soung; Lu, Jesse; Shih, Benjamin; Gharibans, Armen; Zou, Zhanan; Matsuno, Kristen; Aguilera, Roman; Han, Yoonjae; Meek, Ann; Xiao, Jianliang; Tolley, Michael T; Coleman, Todd P

2017-10-01

Methods for microfabrication of solderable and stretchable sensing systems (S4s) and a scaled production of adhesive-integrated active S4s for health monitoring are presented. S4s' excellent solderability is achieved by the sputter-deposited nickel-vanadium and gold pad metal layers and copper interconnection. The donor substrate, which is modified with "PI islands" to become selectively adhesive for the S4s, allows the heterogeneous devices to be integrated with large-area adhesives for packaging. The feasibility for S4-based health monitoring is demonstrated by developing an S4 integrated with a strain gauge and an onboard optical indication circuit. Owing to S4s' compatibility with the standard printed circuit board assembly processes, a variety of commercially available surface mount chip components, such as the wafer level chip scale packages, chip resistors, and light-emitting diodes, can be reflow-soldered onto S4s without modifications, demonstrating the versatile and modular nature of S4s. Tegaderm-integrated S4 respiration sensors are tested for robustness for cyclic deformation, maximum stretchability, durability, and biocompatibility for multiday wear time. The results of the tests and demonstration of the respiration sensing indicate that the adhesive-integrated S4s can provide end users a way for unobtrusive health monitoring. © 2017 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Nanosatellite program at Sandia National Laboratories

DOE Office of Scientific and Technical Information (OSTI.GOV)

Reynolds, D.A.; Kern, J.P.; Schoeneman, J.L.

1999-11-11

The concept of building extremely small satellites which, either independently or as a collective, can perform missions which are comparable to their much larger cousins, has fascinated scientists and engineers for several years now. In addition to the now commonplace microelectronic integrated circuits, the more recent advent of technologies such as photonic integrated circuits (PIC's) and micro-electromechanical systems (MEMS) have placed such a goal within their grasp. Key to the acceptance of this technology will be the ability to manufacture these very small satellites in quantity without sacrificing their performance or versatility. In support of its nuclear treaty verification, proliferationmore » monitoring and other remote sensing missions, Sandia National laboratories has had a 35-year history of providing highly capable systems, densely packaged for unintrusive piggyback missions on government satellites. As monitoring requirements have become more challenging and remote sensing technologies become more sophisticated, packaging greater capability into these systems has become a requirement. Likewise, dwindling budgets are pushing satellite programs toward smaller and smaller platforms, reinforcing the need for smaller, cheaper satellite systems. In the next step of its miniaturization plan, Sandia has begun development of technologies for a highly integrated miniature satellite. The focus of this development is to achieve nanosat or smaller dimensions while maintaining significant capability utilizing semiconductor wafer-level integration and, at the same time promoting affordability through modular generic construction.« less

Performance of a novel wafer scale CMOS active pixel sensor for bio-medical imaging.

PubMed

Esposito, M; Anaxagoras, T; Konstantinidis, A C; Zheng, Y; Speller, R D; Evans, P M; Allinson, N M; Wells, K

2014-07-07

Recently CMOS active pixels sensors (APSs) have become a valuable alternative to amorphous silicon and selenium flat panel imagers (FPIs) in bio-medical imaging applications. CMOS APSs can now be scaled up to the standard 20 cm diameter wafer size by means of a reticle stitching block process. However, despite wafer scale CMOS APS being monolithic, sources of non-uniformity of response and regional variations can persist representing a significant challenge for wafer scale sensor response. Non-uniformity of stitched sensors can arise from a number of factors related to the manufacturing process, including variation of amplification, variation between readout components, wafer defects and process variations across the wafer due to manufacturing processes. This paper reports on an investigation into the spatial non-uniformity and regional variations of a wafer scale stitched CMOS APS. For the first time a per-pixel analysis of the electro-optical performance of a wafer CMOS APS is presented, to address inhomogeneity issues arising from the stitching techniques used to manufacture wafer scale sensors. A complete model of the signal generation in the pixel array has been provided and proved capable of accounting for noise and gain variations across the pixel array. This novel analysis leads to readout noise and conversion gain being evaluated at pixel level, stitching block level and in regions of interest, resulting in a coefficient of variation ⩽1.9%. The uniformity of the image quality performance has been further investigated in a typical x-ray application, i.e. mammography, showing a uniformity in terms of CNR among the highest when compared with mammography detectors commonly used in clinical practice. Finally, in order to compare the detection capability of this novel APS with the technology currently used (i.e. FPIs), theoretical evaluation of the detection quantum efficiency (DQE) at zero-frequency has been performed, resulting in a higher DQE for this detector compared to FPIs. Optical characterization, x-ray contrast measurements and theoretical DQE evaluation suggest that a trade off can be found between the need of a large imaging area and the requirement of a uniform imaging performance, making the DynAMITe large area CMOS APS suitable for a range of bio-medical applications.

31-mode piezoelectric micromachined ultrasonic transducer with PZT thick film by granule spraying in vacuum process

NASA Astrophysics Data System (ADS)

Jung, Joontaek; Annapureddy, Venkateswarlu; Hwang, Geon-Tae; Song, Youngsup; Lee, Wonjun; Kang, Woojin; Ryu, Jungho; Choi, Hongsoo

2017-05-01

A piezoelectric micromachined ultrasonic transducer (pMUT) is an ideal device for portable medical diagnosis systems, intravascular ultrasound systems, and ultrasonic cameras because of its favorable characteristics including small size, acoustic impedance matching with the body, low power consumption, and simple integration with the systems. Despite these advantages, practical applications are limited because of insufficient acoustic pressure of the pMUT caused by the thin active piezoelectric layer. Here, we report the fabrication of a thick piezoelectric Pb(Zr,Ti)O3 (PZT) film-based pMUT device having high deflection at low driving voltage using the granule spraying in vacuum (GSV) process. Pre-patterned high-density thick (exceeding 8 μm) PZT films were grown on 6-inch-diameter Si/SiO2/Ti/Pt silicon-on-insulator wafers at room temperature at a high deposition rate of ˜5 μm min-1. The fabrication process using the proposed GSV process was simple and fast, and the deflection of the pMUT exhibited a high value of 0.8 μm.

Investigation of proton spin relaxation in water with dispersed silicon nanoparticles for potential magnetic resonance imaging applications

NASA Astrophysics Data System (ADS)

Kargina, Yu. V.; Gongalsky, M. B.; Perepukhov, A. M.; Gippius, A. A.; Minnekhanov, A. A.; Zvereva, E. A.; Maximychev, A. V.; Timoshenko, V. Yu.

2018-03-01

Porous and nonporous silicon (Si) nanoparticles (NPs) prepared by ball-milling of electrochemically etched porous Si layers and crystalline Si wafers were studied as potential agents for enhancement of the proton spin relaxation in aqueous media. While nonporous Si NPs did not significantly influence the spin relaxation, the porous ones resulted in strong shortening of the transverse relaxation times. In order to investigate an effect of the electron spin density in porous Si NPs on the proton spin relaxation, we use thermal annealing of the NPs in vacuum or in air. The transverse relaxation rate of about 0.5 l/(g s) was achieved for microporous Si NPs, which were thermally annealing in vacuum to obtain the electron spin density of the order of 1017 g-1. The transverse relaxation rate was found to be almost proportional to the concentration of porous Si NPs in the range from 0.1 to 20 g/l. The obtained results are discussed in view of possible biomedical applications of Si NPs as contrast agents for magnetic resonance imaging.

Bypass Diode Temperature Tests of a Solar Array Coupon Under Space Thermal Environment Conditions

NASA Technical Reports Server (NTRS)

Wright, Kenneth H., Jr.; Schneider, Todd A.; Vaughn, Jason A.; Hoang, Bao; Wong, Frankie; Wu, Gordon

2016-01-01

Tests were performed on a 56-cell Advanced Triple Junction solar array coupon whose purpose was to determine margin available for bypass diodes integrated with new, large multi-junction solar cells that are manufactured from a 4-inch wafer. The tests were performed under high vacuum with coupon back side thermal conditions of both cold and ambient. The bypass diodes were subjected to a sequence of increasing discrete current steps from 0 Amp to 2.0 Amp in steps of 0.25 Amp. At each current step, a temperature measurement was obtained via remote viewing by an infrared camera. This paper discusses the experimental methodology, experiment results, and the thermal model.

By-Pass Diode Temperature Tests of a Solar Array Coupon Under Space Thermal Environment Conditions

NASA Technical Reports Server (NTRS)

Wright, Kenneth H., Jr.; Schneider, Todd A.; Vaughn, Jason A.; Hoang, Bao; Wong, Frankie

2016-01-01

Tests were performed on a 56-cell Advanced Triple Junction solar array coupon whose purpose was to determine margin available for bypass diodes integrated with new, large multi-junction solar cells that are manufactured from a 4-inch wafer. The tests were performed under high vacuum with cold and ambient coupon back-side. The bypass diodes were subjected to a sequence of increasing discrete current steps from 0 Amp to 2.0 Amp in steps of 0.25 Amp. At each current step, a temperature measurement was obtained via remote viewing by an infrared camera. This paper discusses the experimental methodology, including the calibration of the thermal imaging system, and the results.

Radiation Hardened Silicon-on-Insulator Structures with N+ Ion Modified Buried SiO2 Layer

NASA Astrophysics Data System (ADS)

Tyschenko, I. E.; Popov, V. P.

2009-12-01

Radiation-resistant silicon-on-insulator structures were produced by N+ ion implantation into thermally grown SiO2 film and subsequent hydrogen transfer of the Si layer to the nitrogen-implanted substrate under conditions of vacuum wafer bonding. Accumulation of the carriers in the buried SiO2 was investigated as a function of fluence of nitrogen ions in the range (1-6)×1015 cm2 and as a function of total radiation dose ranging from 104 to 107 rad (Si). It was found that the charge generated near the nitrided bonding interface was reduced by a factor of four compared to the thermal SiO2/Si interface.

Method for rapid, controllable growth and thickness, of epitaxial silicon films

DOEpatents

Wang, Qi [Littleton, CO; Stradins, Paul [Golden, CO; Teplin, Charles [Boulder, CO; Branz, Howard M [Boulder, CO

2009-10-13

A method of producing epitaxial silicon films on a c-Si wafer substrate using hot wire chemical vapor deposition by controlling the rate of silicon deposition in a temperature range that spans the transition from a monohydride to a hydrogen free silicon surface in a vacuum, to obtain phase-pure epitaxial silicon film of increased thickness is disclosed. The method includes placing a c-Si substrate in a HWCVD reactor chamber. The method also includes supplying a gas containing silicon at a sufficient rate into the reaction chamber to interact with the substrate to deposit a layer containing silicon thereon at a predefined growth rate to obtain phase-pure epitaxial silicon film of increased thickness.

Effect of electron irradiation and packaging atmosphere on the survival of aeromonas hydrophila in minced poultry meat

NASA Astrophysics Data System (ADS)

Stecchini, M. L.; Sarais, I.; Del Torre, M.; Fuochi, P. G.

1995-02-01

Resistance to electron irradiation of Aeromonas hydrophila inoculated in minced poultry meat packed in presence of air or under vacuum was examined. Surviving bacteria were counted on starch ampicillin agar containing 100 μg/ml of ampicillin. Radiation resistance, expressed as D 10 values, was calculated from the survival curves and found to be 0.12 and 0.12 kGy in poultry meat packed in air or under vacuum respectively. Storage at 2°C of meat samples irradiated at 0.5 kGy further reduced the number of A. hydrophila.

Effect of Oregano Essential Oil (Origanum vulgare subsp. hirtum) on the Storage Stability and Quality Parameters of Ground Chicken Breast Meat.

PubMed

Al-Hijazeen, Marwan; Lee, Eun Joo; Mendonca, Aubrey; Ahn, Dong Uk

2016-06-07

A study was conducted to investigate the effect of oregano essential oil on the oxidative stability and color of raw and cooked chicken breast meats. Five treatments, including (1) control (none added); (2) 100 ppm oregano essential oil; (3) 300 ppm oregano essential oil; (4) 400 ppm oregano essential oil; and (5) 5 ppm butylated hydroxyanisole (BHA), were prepared with ground boneless, skinless chicken breast meat and used for both raw and cooked meat studies. For raw meat study, samples were individually packaged in oxygen-permeable bags and stored in a cold room (4 °C) for 7 days. For cooked meat study, the raw meat samples were vacuum-packaged in oxygen-impermeable vacuum bags and then cooked in-bag to an internal temperature of 75 °C. After cooling to room temperature, the cooked meats were repackaged in new oxygen-permeable bags and then stored at 4 °C for 7 days. Both raw and cooked meats were analyzed for lipid and protein oxidation, volatiles, and color at 0, 3, and 7 days of storage. Oregano essential oil significantly reduced (p < 0.05) lipid and protein oxidation, and improved color stability of raw and cooked meat. However, oregano oil at 400 ppm showed the strongest effect for all these parameters. Hexanal was the major aldehyde, which was decreased significantly (p < 0.05) by oregano oil treatment, in cooked meat. Overall, oregano essential oil at 100-400 ppm levels could be a good preservative that can replace the synthetic antioxidant in chicken meat.

Effect of Oregano Essential Oil (Origanum vulgare subsp. hirtum) on the Storage Stability and Quality Parameters of Ground Chicken Breast Meat

PubMed Central

Al-Hijazeen, Marwan; Lee, Eun Joo; Mendonca, Aubrey; Ahn, Dong Uk

2016-01-01

A study was conducted to investigate the effect of oregano essential oil on the oxidative stability and color of raw and cooked chicken breast meats. Five treatments, including (1) control (none added); (2) 100 ppm oregano essential oil; (3) 300 ppm oregano essential oil; (4) 400 ppm oregano essential oil; and (5) 5 ppm butylated hydroxyanisole (BHA), were prepared with ground boneless, skinless chicken breast meat and used for both raw and cooked meat studies. For raw meat study, samples were individually packaged in oxygen-permeable bags and stored in a cold room (4 °C) for 7 days. For cooked meat study, the raw meat samples were vacuum-packaged in oxygen-impermeable vacuum bags and then cooked in-bag to an internal temperature of 75 °C. After cooling to room temperature, the cooked meats were repackaged in new oxygen-permeable bags and then stored at 4 °C for 7 days. Both raw and cooked meats were analyzed for lipid and protein oxidation, volatiles, and color at 0, 3, and 7 days of storage. Oregano essential oil significantly reduced (p < 0.05) lipid and protein oxidation, and improved color stability of raw and cooked meat. However, oregano oil at 400 ppm showed the strongest effect for all these parameters. Hexanal was the major aldehyde, which was decreased significantly (p < 0.05) by oregano oil treatment, in cooked meat. Overall, oregano essential oil at 100–400 ppm levels could be a good preservative that can replace the synthetic antioxidant in chicken meat. PMID:27338486

Effect of Environmental Factors on Intra-Specific Inhibitory Activity of Carnobacterium maltaromaticum

PubMed Central

Bowman, John P.; Ratkowsky, David A.; Tamplin, Mark

2017-01-01

Carnobacterium maltaromaticum is frequently associated with foods having extended shelf-life due to its inhibitory activity to other bacteria. The quantification of such inhibition interactions affected by various environmental factors is limited. This study investigated the effect of environmental factors relevant to vacuum-packaged beef on inhibition between two model isolates of C. maltaromaticum, D0h and D8c, specifically D8c sensitivity to D0h inhibition and D0h inhibitor production. The effects of temperature (−1, 7, 15, 25 °C), atmosphere (aerobic and anaerobic), pH (5.5, 6, 6.5), lactic acid (0, 25, 50 mM) and glucose (0, 0.56, 5.55 mM) on D8c sensitivity (diameter of an inhibition zone) were measured. The effects of pH, glucose, lactic acid and atmosphere on D0h inhibitor production were measured at 25 °C. Sensitivity of D8c was the highest at 15 °C, under aerobic atmosphere, at higher concentrations of undissociated lactic acid and glucose, and at pH 5.5 (p < 0.001). pH significantly affected D0h inhibitor production (p < 0.001), which was the highest at pH 6.5. The effect of lactic acid depended upon pH level; at relatively low pH (5.5), lactic acid decreased the production rate (arbitrary inhibition unit (AU)/mL/h). This study provides a quantitative description of intra-species interactions, studied in in vitro environments that are relevant to vacuum-packaged beef. PMID:28906433

Characterization of Atomic-Layer-Deposited (ALD) Al2O3-Passivated Sub-50-μm-thick Kerf-less Si Wafers by Controlled Spalling

NASA Astrophysics Data System (ADS)

Lee, Yong Hwan; Cha, Hamchorom; Choi, Sunho; Chang, Hyo Sik; Jang, Boyun; Oh, Jihun

2018-05-01

A systematic characterization of sub-50-μm-thick, kerf-less monocrystalline Si wafers fabricated by a controlled fracture method is presented. The spalling process introduces various defects on the Si surface, which result in high surface roughness levels, residual stress, and low effective minority carrier lifetimes. In addition, metals used to induce fracturing in Si diffuse in the Si at room temperature and degrade the effective minority carrier lifetime. Selective removal of these defected Si regions improves the residual stress and effective lifetimes of spalled Si wafers.

Control over dark current densities and cutoff wavelengths of GaAs/AlGaAs QWIP grown by multi-wafer MBE reactor

NASA Astrophysics Data System (ADS)

Roodenko, K.; Choi, K. K.; Clark, K. P.; Fraser, E. D.; Vargason, K. W.; Kuo, J.-M.; Kao, Y.-C.; Pinsukanjana, P. R.

2016-09-01

Performance of quantum well infrared photodetector (QWIP) device parameters such as detector cutoff wavelength and the dark current density depend strongly on the quality and the control of the epitaxy material growth. In this work, we report on a methodology to precisely control these critical material parameters for long wavelength infrared (LWIR) GaAs/AlGaAs QWIP epi wafers grown by multi-wafer production Molecular beam epitaxy (MBE). Critical growth parameters such as quantum well (QW) thickness, AlGaAs composition and QW doping level are discussed.

Enhancement of mercuric iodide detector performance through increases in wafer uniformity by purification and crystal growth in microgravity

NASA Astrophysics Data System (ADS)

Steiner, Bruce; van den Berg, Lodewijk; Laor, Uri

1999-10-01

Wafers from mercuric iodide crystals grown in microgravity on two occasions have previously been found to be characterized by a higher hole mobility-lifetime product, which enables energy dispersive radiation detectors with superior resolution. In the present work, we have identified the specific structural modifications that are responsible for this enhanced performance. As a result of this study, the performance of terrestrial wafers also has been improved but not yet to the level of wafers grown in microgravity. High resolution synchrotron x-ray diffraction images of a series of wafers, including those grown both in microgravity and on the ground, reveal two principal types of structural changes that are interrelated. One of these, arrays of inclusions, affects performance far more strongly than the other, variation in lattice orientation. Inclusions can be formed either from residual impurities or in response to deviations from ideal stoichiometry. The formation of both types is facilitated by gravity-driven convection during growth. As the level of inclusions is reduced, through growth from material of higher purity, through the achievement of balanced stoichiometry, or by suppression of convection mixing during crystal growth, the hole mobility-lifetime product is enhanced in spite of an accompanying decreased uniformity in lattice orientation. Sixfold enhancement in the performance of x- and γ-ray detectors has been accomplished to date. Further augmentation in performance appears likely.

Addressable test matrix for measuring analog transfer characteristics of test elements used for integrated process control and device evaluation

NASA Technical Reports Server (NTRS)

Buehler, Martin G. (Inventor)

1988-01-01

A set of addressable test structures, each of which uses addressing schemes to access individual elements of the structure in a matrix, is used to test the quality of a wafer before integrated circuits produced thereon are diced, packaged and subjected to final testing. The electrical characteristic of each element is checked and compared to the electrical characteristic of all other like elements in the matrix. The effectiveness of the addressable test matrix is in readily analyzing the electrical characteristics of the test elements and in providing diagnostic information.

SiC Seeded Crystal Growth

NASA Astrophysics Data System (ADS)

Glass, R. C.; Henshall, D.; Tsvetkov, V. F.; Carter, C. H., Jr.

1997-07-01

The availability of relatively large (30 mm) SiC wafers has been a primary reason for the renewed high level of interest in SiC semiconductor technology. Projections that 75 mm SiC wafers will be available in 2 to 3 years have further peaked this interest. Now both 4H and 6H polytypes are available, however, the micropipe defects that occur to a varying extent in all wafers produced to date are seen by many as preventing the commercialization of many types of SiC devices, especially high current power devices. Most views on micropipe formation are based around Frank's theory of a micropipe being the hollow core of a screw dislocation with a huge Burgers vector (several times the unit cell) and with the diameter of the core having a direct relationship with the magnitude of the Burgers vector. Our results show that there are several mechanisms or combinations of these mechanisms which cause micropipes in SiC boules grown by the seeded sublimation method. Additional considerations such as polytype variations, dislocations and both impurity and diameter control add to the complexity of producing high quality wafers. Recent results at Cree Research, Inc., including wafers with micropipe densities of less than 1 cm - 2 (with 1 cm2 areas void of micropipes), indicate that micropipes will be reduced to a level that makes high current devices viable and that they may be totally eliminated in the next few years. Additionally, efforts towards larger diameter high quality substrates have led to production of 50 mm diameter 4H and 6H wafers for fabrication of LEDs and the demonstration of 75 mm wafers. Low resistivity and semi-insulating electrical properties have also been attained through improved process and impurity control. Although challenges remain, the industry continues to make significant progress towards large volume SiC-based semiconductor fabrication.

Effect of High Temperature Storage in Vacuum, Air, and Humid Conditions on Degradation of Gold/Aluminum Wire Bonds in PEMs

NASA Technical Reports Server (NTRS)

Teverovsky, Alexander

2006-01-01

Microcircuits encapsulated in three plastic package styles were stored in different environments at temperatures varying from 130 C to 225 C for up to 4,000 hours in some cases. To assess the effect of oxygen, the parts were aged at high temperatures in air and in vacuum chambers. The effect of humidity was evaluated during long-term highly accelerated temperature and humidity stress testing (HAST) at temperatures of 130 C and 150 C. High temperature storage testing of decapsulated microcircuits in air, vacuum, and HAST chambers was carried out to evaluate the role of molding compounds in the environmentally-induced degradation and failure of wire bonds (WB). This paper reports on accelerating factors of environment and molding compound on WB failures. It has been shown that all environments, including oxygen, moisture, and the presence of molding compounds reduce time-to-failures compared to unencapsulated devices in vacuum conditions. The mechanism of the environmental effect on KB degradation is discussed.

Fabrication of Fresnel micro lens array in borosilicate glass by F2-laser ablation for glass interposer application

NASA Astrophysics Data System (ADS)

Brusberg, Lars; Neitz, Marcel; Schröder, Henning; Fricke-Begemann, Thomas; Ihlemann, Jürgen

2014-03-01

The future need for more bandwidth forces the development of optical transmission solutions for rack-to-rack, boardto- board and chip-to-chip interconnects. The goals are significant reduction of power consumption, highest density and potential for bandwidth scalability to overcome the limitations of the systems today with mostly copper based interconnects. For system integration the enabling of thin glass as a substrate material for electro-optical components with integrated micro-optics for efficient light coupling to integrated optical waveguides or fibers is becoming important. Our glass based packaging approach merges micro-system packaging and glass integrated optics. This kind of packaging consists of a thin glass substrate with integrated micro lenses providing a platform for photonic component assembly and optical fiber or waveguide interconnection. Thin glass is commercially available in panel and wafer size and characterizes excellent optical and high frequency properties. That makes it perfect for microsystem packaging. A suitable micro lens approach has to be comparable with different commercial glasses and withstand post-processing like soldering. A benefit of using laser ablated Fresnel lenses is the planar integration capability in the substrate for highest integration density. In the paper we introduce our glass based packaging concept and the Fresnel lens design for different scenarios like chip-to-fiber, chip-to-optical-printed-circuit-board coupling. Based on the design the Fresnel lenses were fabricated by using a 157 nm fluorine laser ablation system.

A novel patterning control strategy based on real-time fingerprint recognition and adaptive wafer level scanner optimization

NASA Astrophysics Data System (ADS)

Cekli, Hakki Ergun; Nije, Jelle; Ypma, Alexander; Bastani, Vahid; Sonntag, Dag; Niesing, Henk; Zhang, Linmiao; Ullah, Zakir; Subramony, Venky; Somasundaram, Ravin; Susanto, William; Matsunobu, Masazumi; Johnson, Jeff; Tabery, Cyrus; Lin, Chenxi; Zou, Yi

2018-03-01

In addition to lithography process and equipment induced variations, processes like etching, annealing, film deposition and planarization exhibit variations, each having their own intrinsic characteristics and leaving an effect, a `fingerprint', on the wafers. With ever tighter requirements for CD and overlay, controlling these process induced variations is both increasingly important and increasingly challenging in advanced integrated circuit (IC) manufacturing. For example, the on-product overlay (OPO) requirement for future nodes is approaching <3nm, requiring the allowable budget for process induced variance to become extremely small. Process variance control is seen as an bottleneck to further shrink which drives the need for more sophisticated process control strategies. In this context we developed a novel `computational process control strategy' which provides the capability of proactive control of each individual wafer with aim to maximize the yield, without introducing a significant impact on metrology requirements, cycle time or productivity. The complexity of the wafer process is approached by characterizing the full wafer stack building a fingerprint library containing key patterning performance parameters like Overlay, Focus, etc. Historical wafer metrology is decomposed into dominant fingerprints using Principal Component Analysis. By associating observed fingerprints with their origin e.g. process steps, tools and variables, we can give an inline assessment of the strength and origin of the fingerprints on every wafer. Once the fingerprint library is established, a wafer specific fingerprint correction recipes can be determined based on its processing history. Data science techniques are used in real-time to ensure that the library is adaptive. To realize this concept, ASML TWINSCAN scanners play a vital role with their on-board full wafer detection and exposure correction capabilities. High density metrology data is created by the scanner for each wafer and on every layer during the lithography steps. This metrology data will be used to obtain the process fingerprints. Also, the per exposure and per wafer correction potential of the scanners will be utilized for improved patterning control. Additionally, the fingerprint library will provide early detection of excursions for inline root cause analysis and process optimization guidance.

Meat Processing Plant Microbiome and Contamination Patterns of Cold-Tolerant Bacteria Causing Food Safety and Spoilage Risks in the Manufacture of Vacuum-Packaged Cooked Sausages

PubMed Central

Rahkila, Riitta; Ali, Javeria; Rousu, Juho; Björkroth, K. Johanna

2015-01-01

Refrigerated food processing facilities are specific man-made niches likely to harbor cold-tolerant bacteria. To characterize this type of microbiota and study the link between processing plant and product microbiomes, we followed and compared microbiota associated with the raw materials and processing stages of a vacuum-packaged, cooked sausage product affected by a prolonged quality fluctuation with occasional spoilage manifestations during shelf life. A total of 195 samples were subjected to culturing and amplicon sequence analyses. Abundant mesophilic psychrotrophs were detected within the microbiomes throughout the different compartments of the production plant environment. However, each of the main genera of food safety and quality interest, e.g., Leuconostoc, Brochothrix, and Yersinia, had their own characteristic patterns of contamination. Bacteria from the genus Leuconostoc, commonly causing spoilage of cold-stored, modified-atmosphere-packaged foods, were detected in high abundance (up to >98%) in the sausages studied. The same operational taxonomic units (OTUs) were, however, detected in lower abundances in raw meat and emulsion (average relative abundance of 2% ± 5%), as well as on the processing plant surfaces (<4%). A completely different abundance profile was found for OTUs phylogenetically close to the species Yersinia pseudotuberculosis. These OTUs were detected in high abundance (up to 28%) on the processing plant surfaces but to a lesser extent (<1%) in raw meat, sausage emulsion, and sausages. The fact that Yersinia-like OTUs were found on the surfaces of a high-hygiene packaging compartment raises food safety concerns related to their resilient existence on surfaces. PMID:26231646

Graphitized silicon carbide microbeams: wafer-level, self-aligned graphene on silicon wafers

NASA Astrophysics Data System (ADS)

Cunning, Benjamin V.; Ahmed, Mohsin; Mishra, Neeraj; Ranjbar Kermany, Atieh; Wood, Barry; Iacopi, Francesca

2014-08-01

Currently proven methods that are used to obtain devices with high-quality graphene on silicon wafers involve the transfer of graphene flakes from a growth substrate, resulting in fundamental limitations for large-scale device fabrication. Moreover, the complex three-dimensional structures of interest for microelectromechanical and nanoelectromechanical systems are hardly compatible with such transfer processes. Here, we introduce a methodology for obtaining thousands of microbeams, made of graphitized silicon carbide on silicon, through a site-selective and wafer-scale approach. A Ni-Cu alloy catalyst mediates a self-aligned graphitization on prepatterned SiC microstructures at a temperature that is compatible with silicon technologies. The graphene nanocoating leads to a dramatically enhanced electrical conductivity, which elevates this approach to an ideal method for the replacement of conductive metal films in silicon carbide-based MEMS and NEMS devices.

Modifications of Fabrication of Vibratory Microgyroscopes

NASA Technical Reports Server (NTRS)

Bae, Sam Y.; Yee, Karl Y.; Wiberg, Dean

2005-01-01

A micromachining process for the fabrication of vibratory microgyroscopes from silicon wafers, and aspects of the microgyroscope design that are inextricably linked with the fabrication process, have been modified in an effort to increase production yields from perspectives of both quantity and quality. Prior to the modifications, the effective production yield of working microgyroscopes was limited to one or less per wafer. The modifications are part of a continuing effort to improve the design and increase production yields to more than 30 working microgyroscopes per wafer. A discussion of pertinent aspects of the unmodified design and the unmodified fabrication process is prerequisite to a meaningful description of the modifications. The design of the microgyroscope package was not conducive to high yield and rapid testing of many microgyroscopes. One of the major impediments to high yield and testing was found to lie in vibration- isolation beams around the four edges of each microgyroscope, which beams were found to be unnecessary for achieving high resonance quality factors (Q values) characterizing the vibrations of petallike cantilevers. The fabrication process included an 8- m-deep plasma etch. The purpose of the etch was to create 8- m vertical gaps, below which were to be placed large gold evaporated electrodes and sensing pads to drive and sense resonant vibrations of the "petals." The process also included a step in which bridges between dies were cut to separate the dies. The etched areas must be kept clean and smooth (free of debris and spikes), because any object close to 8 m high in those areas would stop the vibrations. However, it was found that after the etch, there remained some spikes with heights that were, variously, almost as high or as high as the etch depth. It also was found that the cutting of bridges created silicon debris, some of which lodged in the 8- m gaps and some of which landed on top of the petals. The masses added to the petals by the debris altered resonance frequencies and/or Q values to unacceptable degrees. Hence, the spikes and the debris have been conjectured to cause most of the observed malfunctions of newly fabricated microgyroscopes. Another pertinent aspect of the unmodified design and process was the fabrication of electrodes and the 8- m capacitance gap on a 500- m-thick wafer, and the fabrication of a 3-mm-thick baseplate from another wafer. It was necessary to bond these wafers to each other in an assembly step that was later found to be superfluous in that it could be eliminated by a suitable modification of the design.

Wafer-level colinearity monitoring for TFH applications

NASA Astrophysics Data System (ADS)

Moore, Patrick; Newman, Gary; Abreau, Kelly J.

2000-06-01

Advances in thin film head (TFH) designs continue to outpace those in the IC industry. The transition to giant magneto resistive (GMR) designs is underway along with the push toward areal densities in the 20 Gbit/inch2 regime and beyond. This comes at a time when the popularity of the low-cost personal computer (PC) is extremely high, and PC prices are continuing to fall. Consequently, TFH manufacturers are forced to deal with pricing pressure in addition to technological demands. New methods of monitoring and improving yield are required along with advanced head designs. TFH manufacturing is a two-step process. The first is a wafer-level process consisting of manufacturing devices on substrates using processes similar to those in the IC industry. The second half is a slider-level process where wafers are diced into 'rowbars' containing many heads. Each rowbar is then lapped to obtain the desired performance from each head. Variation in the placement of specific layers of each device on the bar, known as a colinearity error, causes a change in device performance and directly impacts yield. The photolithography tool and process contribute to colinearity errors. These components include stepper lens distortion errors, stepper stage errors, reticle fabrication errors, and CD uniformity errors. Currently, colinearity is only very roughly estimated during wafer-level TFH production. An absolute metrology tool, such as a Nikon XY, could be used to quantify colinearity with improved accuracy, but this technique is impractical since TFH manufacturers typically do not have this type of equipment at the production site. More importantly, this measurement technique does not provide the rapid feedback needed in a high-volume production facility. Consequently, the wafer-fab must rely on resistivity-based measurements from slider-fab to quantify colinearity errors. The feedback of this data may require several weeks, making it useless as a process diagnostic. This study examines a method of quickly estimating colinearity at the wafer-level with a test reticle and metrology equipment routinely found in TFH facilities. Colinearity results are correlated to slider-fab measurements on production devices. Stepper contributions to colinearity are estimated, and compared across multiple steppers and stepper generations. Multiple techniques of integrating this diagnostic into production are investigated and discussed.

Surface science analysis of GaAs photocathodes following sustained electron beam delivery

DOE Office of Scientific and Technical Information (OSTI.GOV)

Carlos Hernandez-Garcia, Fay Hannon, Marcy Stutzman, V. Shutthanandan, Z. Zhu, M. Nandasri, S. V. Kuchibhatla, S. Thevuthasan, W. P. Hess

2012-06-01

Degradation of the photocathode materials employed in photoinjectors represents a challenge for sustained operation of nuclear physics accelerators and high power Free Electron Lasers (FEL). Photocathode quantum efficiency (QE) degradation is due to residual gasses in the electron source vacuum system being ionized and accelerated back to the photocathode. These investigations are a first attempt to characterize the nature of the photocathode degradation, and employ multiple surface and bulk analysis techniques to investigate damage mechanisms including sputtering of the Cs-oxidant surface monolayer, other surface chemistry effects, and ion implantation. Surface and bulk analysis studies were conducted on two GaAs photocathodes,more » which were removed from the JLab FEL DC photoemission gun after delivering electron beam, and two control samples. The analysis techniques include Helium Ion Microscopy (HIM), Rutherford Backscattering Spectrometry (RBS), Atomic Force Microscopy (AFM) and Secondary Ion Mass Spectrometry (SIMS). In addition, two high-polarization strained superlattice GaAs photocathode samples, one removed from the Continuous Electron Beam Accelerator Facility (CEBAF) photoinjector and one unused, were also analyzed using Transmission Electron Microscopy (TEM) and SIMS. It was found that heat cleaning the FEL GaAs wafer introduces surface roughness, which seems to be reduced by prolonged use. The bulk GaAs samples retained a fairly well organized crystalline structure after delivering beam but shows evidence of Cs depletion on the surface. Within the precision of the SIMS and RBS measurements the data showed no indication of hydrogen implantation or lattice damage from ion back bombardment in the bulk GaAs wafers. In contrast, SIMS and TEM measurements of the strained superlattice photocathode show clear crystal damage in the wafer from ion back bombardment.« less

Vertical integration of array-type miniature interferometers at wafer level by using multistack anodic bonding

NASA Astrophysics Data System (ADS)

Wang, Wei-Shan; Wiemer, Maik; Froemel, Joerg; Enderlein, Tom; Gessner, Thomas; Lullin, Justine; Bargiel, Sylwester; Passilly, Nicolas; Albero, Jorge; Gorecki, Christophe

2016-04-01

In this work, vertical integration of miniaturized array-type Mirau interferometers at wafer level by using multi-stack anodic bonding is presented. Mirau interferometer is suitable for MEMS metrology and for medical imaging according to its vertical-, lateral- resolutions and working distances. Miniaturized Mirau interferometer can be a promising candidate as a key component of an optical coherence tomography (OCT) system. The miniaturized array-type interferometer consists of a microlens doublet, a Si-based MEMS Z scanner, a spacer for focus-adjustment and a beam splitter. Therefore, bonding technologies which are suitable for heterogeneous substrates are of high interest and necessary for the integration of MEMS/MOEMS devices. Multi-stack anodic bonding, which meets the optical and mechanical requirements of the MOEMS device, is adopted to integrate the array-type interferometers. First, the spacer and the beam splitter are bonded, followed by bonding of the MEMS Z scanner. In the meanwhile, two microlenses, which are composed of Si and glass wafers, are anodically bonded to form a microlens doublet. Then, the microlens doublet is aligned and bonded with the scanner/spacer/beam splitter stack. The bonded array-type interferometer is a 7- wafer stack and the thickness is approximately 5mm. To separate such a thick wafer stack with various substrates, 2-step laser cutting is used to dice the bonded stack into Mirau chips. To simplify fabrication process of each component, electrical connections are created at the last step by mounting a Mirau chip onto a flip chip PCB instead of through wafer vias. Stability of Au/Ti films on the MEMS Z scanner after anodic bonding, laser cutting and flip chip bonding are discussed as well.

System and Method for Fabricating Super Conducting Circuitry on Both Sides of an Ultra-Thin Layer

NASA Technical Reports Server (NTRS)

Brown, Ari D. (Inventor); Mikula, Vilem (Inventor)

2017-01-01

A method of fabricating circuitry in a wafer includes depositing a superconducting metal on a silicon on insulator wafer having a handle wafer, coating the wafer with a sacrificial layer and bonding the wafer to a thermally oxide silicon wafer with a first epoxy. The method includes flipping the wafer, thinning the flipped wafer by removing a handle wafer, etching a buried oxide layer, depositing a superconducting layer, bonding the wafer to a thermally oxidized silicon wafer having a handle wafer using an epoxy, flipping the wafer again, thinning the flipped wafer, etching a buried oxide layer from the wafer and etching the sacrificial layer from the wafer. The result is a wafer having superconductive circuitry on both sides of an ultra-thin silicon layer.

Post-growth annealing of Bridgman-grown CdZnTe and CdMnTe crystals for room-temperature nuclear radiation detectors

NASA Astrophysics Data System (ADS)

Egarievwe, Stephen U.; Yang, Ge; Egarievwe, Alexander A.; Okwechime, Ifechukwude O.; Gray, Justin; Hales, Zaveon M.; Hossain, Anwar; Camarda, Giuseppe S.; Bolotnikov, Aleksey E.; James, Ralph B.

2015-06-01

Bridgman-grown cadmium zinc telluride (CdZnTe or CZT) and cadmium manganese telluride (CdMnTe or CMT) crystals often have Te inclusions that limit their performances as X-ray- and gamma-ray-detectors. We present here the results of post-growth thermal annealing aimed at reducing and eliminating Te inclusions in them. In a 2D analysis, we observed that the sizes of the Te inclusions declined to 92% during a 60-h annealing of CZT at 510 °C under Cd vapor. Further, tellurium inclusions were eliminated completely in CMT samples annealed at 570 °C in Cd vapor for 26 h, whilst their electrical resistivity fell by an order of 102. During the temperature-gradient annealing of CMT at 730 °C and an 18 °C/cm temperature gradient for 18 h in a vacuum of 10-5 mbar, we observed the diffusion of Te from the sample, so causing a reduction in size of the Te inclusions. For CZT samples annealed at 700 °C in a 10 °C/cm temperature gradient, we observed the migration of Te inclusions from a low-temperature region to a high one at 0.022 μm/s. During the temperature-gradient annealing of CZT in a vacuum of 10-5 mbar at 570 °C and 30 °C/cm for 18 h, some Te inclusions moved toward the high-temperature side of the wafer, while other inclusions of the same size, i.e., 10 μm in diameter, remained in the same position. These results show that the migration, diffusion, and reaction of Te with Cd in the matrix of CZT- and CMT-wafers are complex phenomena that depend on the conditions in local regions, such as composition and structure, as well as on the annealing conditions.

An ultra-compact processor module based on the R3000

NASA Astrophysics Data System (ADS)

Mullenhoff, D. J.; Kaschmitter, J. L.; Lyke, J. C.; Forman, G. A.

1992-08-01

Viable high density packaging is of critical importance for future military systems, particularly space borne systems which require minimum weight and size and high mechanical integrity. A leading, emerging technology for high density packaging is multi-chip modules (MCM). During the 1980's, a number of different MCM technologies have emerged. In support of Strategic Defense Initiative Organization (SDIO) programs, Lawrence Livermore National Laboratory (LLNL) has developed, utilized, and evaluated several different MCM technologies. Prior LLNL efforts include modules developed in 1986, using hybrid wafer scale packaging, which are still operational in an Air Force satellite mission. More recent efforts have included very high density cache memory modules, developed using laser pantography. As part of the demonstration effort, LLNL and Phillips Laboratory began collaborating in 1990 in the Phase 3 Multi-Chip Module (MCM) technology demonstration project. The goal of this program was to demonstrate the feasibility of General Electric's (GE) High Density Interconnect (HDI) MCM technology. The design chosen for this demonstration was the processor core for a MIPS R3000 based reduced instruction set computer (RISC), which has been described previously. It consists of the R3000 microprocessor, R3010 floating point coprocessor and 128 Kbytes of cache memory.

Light Enhanced Hydrofluoric Acid Passivation: A Sensitive Technique for Detecting Bulk Silicon Defects

PubMed Central

Grant, Nicholas E.

2016-01-01

A procedure to measure the bulk lifetime (>100 µsec) of silicon wafers by temporarily attaining a very high level of surface passivation when immersing the wafers in hydrofluoric acid (HF) is presented. By this procedure three critical steps are required to attain the bulk lifetime. Firstly, prior to immersing silicon wafers into HF, they are chemically cleaned and subsequently etched in 25% tetramethylammonium hydroxide. Secondly, the chemically treated wafers are then placed into a large plastic container filled with a mixture of HF and hydrochloric acid, and then centered over an inductive coil for photoconductance (PC) measurements. Thirdly, to inhibit surface recombination and measure the bulk lifetime, the wafers are illuminated at 0.2 suns for 1 min using a halogen lamp, the illumination is switched off, and a PC measurement is immediately taken. By this procedure, the characteristics of bulk silicon defects can be accurately determined. Furthermore, it is anticipated that a sensitive RT surface passivation technique will be imperative for examining bulk silicon defects when their concentration is low (<1012 cm-3). PMID:26779939

Effect of pretreatment with carbon monoxide and ozone on the quality of vacuum packaged beef meats.

PubMed

Lyu, Fei; Shen, Kejing; Ding, Yuting; Ma, Xin

2016-07-01

Beef meats without pretreatment (CK) or pretreated with different volume ratios of carbon monoxide and ozone of 100%CO (T1), 2%O3+98%CO (T2), 5%O3+95%CO (T3) and 10%O3+90%CO (T4) using modified atmosphere packages for 1.5h, after that they were vacuum-packaged and stored in 0°C refrigerator for 46days. The surface color a* values and sensory scores of T1, T2, T3 and T4 were significant higher than CK (p<0.05) during storage. In the mid and later storage, the drip loss, total viable counts (TVC), metmyoglobin (met-Mb), thiobarbituric acid reactive substances (TBARS), total volatile basic nitrogen (TVB-N) and pH of T1, T2, T3 and T4 were significantly lower than CK (p<0.05), and these values of T2, T3 and T4 were significantly lower than T1 in the later storage. In conclusion, O3 in the combination didn't affect the color-developing effect of CO, and could help CO maintain the meat quality. Therefore, the pretreatment of CO combined with O3 at certain concentrations can be a promising technique to maintain the quality of beef meats. Copyright © 2016 Elsevier Ltd. All rights reserved.

The effect of sage, sodium erythorbate and a mixture of sage and sodium erythorbate on the quality of turkey meatballs stored under vacuum and modified atmosphere conditions.

PubMed

Karpińska-Tymoszczyk, M

2010-12-01

1. The combined effect of sage (S), sodium erythorbate (SE), a mixture of sage and sodium erythorbate (MIX) and vacuum packaging (VP) and modified atmosphere packaging (MAP) on the quality of cooked turkey meatballs stored at 4°C was investigated. The physicochemical properties (colour, MDA, AV, pH, water activity), microbiological quality characteristics (counts of mesophilic and psychrotrophic bacteria, fungi, coliforms and Clostridium sp.) and flavour attributes of meatballs were determined. 2. The values of the colour parameters L*, a* and b* were affected by the additives and packaging method. The colour of meatballs was better protected by sodium erythorbate than by sage or a mixture of sage and sodium erythorbate. The additives effectively stabilised lipids against oxidation and slowed down hydrolytic changes in turkey meatballs. Sage and a mixture of sage and sodium erythorbate showed stronger antioxidant properties than sodium erythorbate added alone. Products with additives were characterised by better sensory quality than control samples. Sage and MIX prevented the growth of mesophilic and psychrotrophic bacteria. All additives inhibited the growth of coliforms. 3. MAP was more effective than VP in maintaining the microbial and sensory quality stability of cooked turkey meatballs. However, VP appears to be a better method as regards the maintaining of lipid stability in turkey meatballs.

Fabricating with crystalline Si to improve superconducting detector performance

NASA Astrophysics Data System (ADS)

Beyer, A. D.; Hollister, M. I.; Sayers, J.; Frez, C. F.; Day, P. K.; Golwala, S. R.

2017-05-01

We built and measured radio-frequency (RF) loss tangent, tan δ, evaluation structures using float-zone quality silicon-on-insulator (SOI) wafers with 5 μm thick device layers. Superconducting Nb components were fabricated on both sides of the SOI Si device layer. Our main goals were to develop a robust fabrication for using crystalline Si (c-Si) dielectric layers with superconducting Nb components in a wafer bonding process and to confirm that tan δ with c-Si dielectric layers was reduced at RF frequencies compared to devices fabricated with amorphous dielectrics, such as SiO2 and SixNy, where tan δ ∼ 10-3. Our primary test structure used a Nb coplanar waveguide (CPW) readout structure capacitively coupled to LC resonators, where the capacitors were defined as parallel-plate capacitors on both sides of a c-Si device layer using a wafer bonding process with benzocyclobutene (BCB) wafer bonding adhesive. Our control experiment, to determine the intrinsic tan δ in the SOI device layer without wafer bonding, also used Nb CPW readout coupled to LC resonators; however, the parallel-plate capacitors were fabricated on both sides of the Si device layer using a deep reactive ion etch (DRIE) to access the c-Si underside through the buried oxide and handle Si layers in the SOI wafers. We found that our wafer bonded devices demonstrated F· δ = (8 ± 2) × 10-5, where F is the filling fraction of two-level states (TLS). For the control experiment, F· δ = (2.0 ± 0.6) × 10-5, and we discuss what may be degrading the performance in the wafer bonded devices as compared to the control devices.

Radiometer on a Chip

NASA Technical Reports Server (NTRS)

Chattopadhyay, Goutam; Gill, John J.; Mehdi, Imran; Lee, Choonsup; Schlecht, Erich T.; Skalare, Anders; Ward, John S.; Siegel, Peter H.; Thomas, Bertrand C.

2009-01-01

The radiometer on a chip (ROC) integrates whole wafers together to p rovide a robust, extremely powerful way of making submillimeter rece ivers that provide vertically integrated functionality. By integratin g at the wafer level, customizing the interconnects, and planarizing the transmission media, it is possible to create a lightweight asse mbly performing the function of several pieces in a more conventiona l radiometer.

Capillary-Driven Microfluidic Chips for Miniaturized Immunoassays: Efficient Fabrication and Sealing of Chips Using a "Chip-Olate" Process.

PubMed

Temiz, Yuksel; Delamarche, Emmanuel

2017-01-01

The fabrication of silicon-based microfluidic chips is invaluable in supporting the development of many microfluidic concepts for research in the life sciences and in vitro diagnostic applications such as the realization of miniaturized immunoassays using capillary-driven chips. While being extremely abundant, the literature covering microfluidic chip fabrication and assay development might not have addressed properly the challenge of fabricating microfluidic chips on a wafer level or the need for dicing wafers to release chips that need then to be further processed, cleaned, rinsed, and dried one by one. Here, we describe the "chip-olate" process wherein microfluidic structures are formed on a silicon wafer, followed by partial dicing, cleaning, and drying steps. Then, integration of reagents (if any) can be done, followed by lamination of a sealing cover. Breaking by hand the partially diced wafer yields individual chips ready for use.

Resonance ultrasonic vibrations in Cz-Si wafers as a possible diagnostic technique in ion implantation

NASA Astrophysics Data System (ADS)

Zhao, Z. Y.; Ostapenko, S.; Anundson, R.; Tvinnereim, M.; Belyaev, A.; Anthony, M.

2001-07-01

The semiconductor industry does not have effective metrology for well implants. The ability to measure such deep level implants will become increasingly important as we progress along the technology road map. This work explores the possibility of using the acoustic whistle effect on ion implanted silicon wafers. The technique detects the elastic stress and defects in silicon wafers by measuring the sub-harmonic f/2 resonant vibrations on a wafer induced via backside contact to create standing waves, which are measured by a non-contact ultrasonic probe. Preliminary data demonstrates that it is sensitive to implant damage, and there is a direct correlation between this sub-harmonic acoustic mode and some of the implant and anneal conditions. This work presents the results of a feasibility study to assess and quantify the correspondent whistle effect to implant damage, residual damage after annealing and intrinsic defects.

Fluid Dynamics of Small, Rugged Vacuum Pumps of Viscous-Drag Type

NASA Technical Reports Server (NTRS)

Russell, John M.

2002-01-01

The need to identify spikes in the concentration of hazardous gases during countdowns to space shuttle launches has led Kennedy Space Center to acquire considerable expertise in the design, construction, and operation of special-purpose gas analyzers of mass-spectrometer type. If such devices could be miniaturized so as to fit in a small airborne package or backpack them their potential applications would include integrated vehicle health monitoring in later-generation space shuttles and in hazardous material detection in airports, to name two examples. The bulkiest components of such devices are vacuum pumps, particularly those that function in the low vacuum range. Now some pumps that operate in the high vacuum range (e.g. molecular-drag and turbomolecular pumps) are already small and rugged. The present work aims to determine whether, on physical grounds, one may or may not adopt the molecular-drag principle to the low-vacuum range (in which case viscous-drag principle is the appropriate term). The deliverable of the present effort is the derivation and justification of some key formulas and calculation methods for the preliminary design of a single-spool, spiral-channel viscous-drag pump.

Application of overlay modeling and control with Zernike polynomials in an HVM environment

NASA Astrophysics Data System (ADS)

Ju, JaeWuk; Kim, MinGyu; Lee, JuHan; Nabeth, Jeremy; Jeon, Sanghuck; Heo, Hoyoung; Robinson, John C.; Pierson, Bill

2016-03-01

Shrinking technology nodes and smaller process margins require improved photolithography overlay control. Generally, overlay measurement results are modeled with Cartesian polynomial functions for both intra-field and inter-field models and the model coefficients are sent to an advanced process control (APC) system operating in an XY Cartesian basis. Dampened overlay corrections, typically via exponentially or linearly weighted moving average in time, are then retrieved from the APC system to apply on the scanner in XY Cartesian form for subsequent lot exposure. The goal of the above method is to process lots with corrections that target the least possible overlay misregistration in steady state as well as in change point situations. In this study, we model overlay errors on product using Zernike polynomials with same fitting capability as the process of reference (POR) to represent the wafer-level terms, and use the standard Cartesian polynomials to represent the field-level terms. APC calculations for wafer-level correction are performed in Zernike basis while field-level calculations use standard XY Cartesian basis. Finally, weighted wafer-level correction terms are converted to XY Cartesian space in order to be applied on the scanner, along with field-level corrections, for future wafer exposures. Since Zernike polynomials have the property of being orthogonal in the unit disk we are able to reduce the amount of collinearity between terms and improve overlay stability. Our real time Zernike modeling and feedback evaluation was performed on a 20-lot dataset in a high volume manufacturing (HVM) environment. The measured on-product results were compared to POR and showed a 7% reduction in overlay variation including a 22% terms variation. This led to an on-product raw overlay Mean + 3Sigma X&Y improvement of 5% and resulted in 0.1% yield improvement.

Effect of the Ti/Si ratio of spin coating solutions on surface passivation of crystalline silicon by TiO x -SiO x composite films

NASA Astrophysics Data System (ADS)

Yoshiba, Shuhei; Tanitsu, Katsuya; Suda, Yoshiyuki; Kamisako, Koichi

2017-06-01

Passivation films or antireflection coatings are generally prepared using costly vacuum or high-temperature processes. Thus, we report the preparation of TiO x -SiO x composite films by novel spin coatable solutions for the synthesis of low-cost passivation coating materials. The desired films were formed by varying the mixing ratios of TiO x and SiO x , and the resulting films exhibited excellent surface passivation properties. For the p-type wafer, an optimal effective surface recombination velocity (S eff) of 93 cm/s was achieved at \\text{TiO}x:\\text{SiO}x = 6:4, while a surface recombination current density (J 0s) of 195 fA/cm2 was obtained. In contrast, for the n-type wafer, an S eff of 27 cm/s and a J 0s of 38 fA/cm2 were achieved at \\text{TiO}x:\\text{SiO}x = 8:2. This excellent surface passivation effect could be attributed to the low interface state density and high positive fixed charge density. Furthermore, the thickness of the interfacial SiO x layer was determined to be important for obtaining the desired surface passivation effect.

Measurement of muscle exudate protein composition as an indicator of beef tenderness

USDA-ARS?s Scientific Manuscript database

The objective was to determine the relationship between the protein composition of muscle exudate and beef tenderness. Strip loins (n = 24) were divided into 3 sections, vacuum packaged, and aged at 4°C. After 0, 7, and 14 days, shear force was measured and muscle exudate was analyzed for protein ...

Cooperative growth phenomena in silicon/germanium low-temperature epitaxy

NASA Astrophysics Data System (ADS)

Meyerson, Bernard S.; Uram, Kevin J.; LeGoues, Francoise K.

1988-12-01

A series of Si:Ge alloys and structures has been prepared by ultrahigh-vacuum chemical vapor deposition. Alloys of composition 0≤Ge/Si≤0.20 are readily deposited at T=550 °C. Commensurate, defect-free strained layers are deposited up to a critical thickness, whereupon the accumulated stress in the films is accommodated by the formation of dislocation networks in the substrate wafers. A cooperative growth phenomenon is observed where the addition of 10% germane to the gaseous deposition source accelerates silane's heterogeneous reaction rate by a factor of 25. A model is proposed where Ge acts as a desorption center for mobile hydrogen adatoms on the Si[100] surface, accelerating heterogeneous silane pyrolysis by the enhanced availability of chemisorption sites.

Cameras for semiconductor process control

NASA Technical Reports Server (NTRS)

Porter, W. A.; Parker, D. L.

1977-01-01

The application of X-ray topography to semiconductor process control is described, considering the novel features of the high speed camera and the difficulties associated with this technique. The most significant results on the effects of material defects on device performance are presented, including results obtained using wafers processed entirely within this institute. Defects were identified using the X-ray camera and correlations made with probe data. Also included are temperature dependent effects of material defects. Recent applications and improvements of X-ray topographs of silicon-on-sapphire and gallium arsenide are presented with a description of a real time TV system prototype and of the most recent vacuum chuck design. Discussion is included of our promotion of the use of the camera by various semiconductor manufacturers.

Fabrication and characterisation of nanocrystalline graphite MEMS resonators using a geometric design to control buckling

NASA Astrophysics Data System (ADS)

Fishlock, S. J.; O'Shea, S. J.; McBride, J. W.; Chong, H. M. H.; Pu, S. H.

2017-09-01

The simulation, fabrication and characterisation of nanographite MEMS resonators is reported in this paper. The deposition of nanographite is achieved using plasma-enhanced chemical vapour deposition directly onto numerous substrates such as commercial silicon wafers. As a result, many of the reliability issues of devices based on transferred graphene are avoided. The fabrication of the resonators is presented along with a simple undercutting method to overcome buckling, by changing the effective stress of the structure from ~436 MPa compressive, to ~13 MPa tensile. The characterisation of the resonators using electrostatic actuation and laser Doppler vibrometry is reported, demonstrating resonator frequencies from 5-640 kHz and quality factor above 1819 in vacuum obtained.

Meat Processing Plant Microbiome and Contamination Patterns of Cold-Tolerant Bacteria Causing Food Safety and Spoilage Risks in the Manufacture of Vacuum-Packaged Cooked Sausages.

PubMed

Hultman, Jenni; Rahkila, Riitta; Ali, Javeria; Rousu, Juho; Björkroth, K Johanna

2015-10-01

Refrigerated food processing facilities are specific man-made niches likely to harbor cold-tolerant bacteria. To characterize this type of microbiota and study the link between processing plant and product microbiomes, we followed and compared microbiota associated with the raw materials and processing stages of a vacuum-packaged, cooked sausage product affected by a prolonged quality fluctuation with occasional spoilage manifestations during shelf life. A total of 195 samples were subjected to culturing and amplicon sequence analyses. Abundant mesophilic psychrotrophs were detected within the microbiomes throughout the different compartments of the production plant environment. However, each of the main genera of food safety and quality interest, e.g., Leuconostoc, Brochothrix, and Yersinia, had their own characteristic patterns of contamination. Bacteria from the genus Leuconostoc, commonly causing spoilage of cold-stored, modified-atmosphere-packaged foods, were detected in high abundance (up to >98%) in the sausages studied. The same operational taxonomic units (OTUs) were, however, detected in lower abundances in raw meat and emulsion (average relative abundance of 2%±5%), as well as on the processing plant surfaces (<4%). A completely different abundance profile was found for OTUs phylogenetically close to the species Yersinia pseudotuberculosis. These OTUs were detected in high abundance (up to 28%) on the processing plant surfaces but to a lesser extent (<1%) in raw meat, sausage emulsion, and sausages. The fact that Yersinia-like OTUs were found on the surfaces of a high-hygiene packaging compartment raises food safety concerns related to their resilient existence on surfaces. Copyright © 2015, American Society for Microbiology. All Rights Reserved.

The effects of packaging method (vacuum pouch vs. plastic tray) on spoilage in a cook-chill pork-based dish kept under refrigeration.

PubMed

Díaz, Pedro; Garrido, María Dolores; Bañón, Sancho

2010-03-01

The effects of two packaging methods on the spoilage of a cook-chill pork-based dish kept under refrigeration were studied. Raw pork cuts and pre-cooked tomato sauce were packed under vacuum "sous vide" in polyamide-polypropylene pouches (SV) or into translucent polypropylene trays under modified atmosphere (80% N(2)+20% CO(2)) and sealed with a top film (PT). Samples were cooked inside the pack at an oven temperature/time of 70 degrees C/7h, chilled at 3 degrees C and stored at 2 degrees C for up to 90days. Microbial (psychrotrophs, lactic-acid bacteria, Enterobacteriaceae, moulds and yeasts), physical-chemical (pH, water activity and total acidity) and sensory (colour, odour, flavour, texture and acceptance) parameters were determined. Heat penetration was faster in SV (2 degrees C/min) than in PT (1 degrees C/min) (core temperature). Both packaging methods were equally effective in protecting against microbial spoilage for 90 day at 2 degrees C. Minor counts were only detected for lactic-acid bacteria and anaerobic psychrotrophs in SV. No Enterobacteriaceae growth was found. Slight differences between SV and PT in pH and total acidity were observed. SV and PT had similar effects on the sensory preservation of the dishes. A gradual loss of acceptance of the cooked pork and tomato sauce was observed. Rancid flavour in PT and warmed-over-flavour in SV were noted in the final stages of storage. According to acceptance scores, the shelf-life of both SV and PT was 56 days at 2 degrees C. Both packaging methods can be used to manufacture sous vide meat-based dishes subsequently stored under refrigeration for catering use. Copyright 2009 Elsevier Ltd. All rights reserved.