Semiconductor measurement technology: Microelectronic ultrasonic bonding

NASA Technical Reports Server (NTRS)

Harman, G. G. (Editor)

1974-01-01

Information for making high quality ultrasonic wire bonds is presented as well as data to provide a basic understanding of the ultrasonic systems used. The work emphasizes problems and methods of solving them. The required measurement equipment is first introduced. This is followed by procedures and techniques used in setting up a bonding machine, and then various machine- or operator-induced reliability problems are discussed. The characterization of the ultrasonic system and its problems are followed by in-process bonding studies and work on the ultrasonic bonding (welding) mechanism. The report concludes with a discussion of various effects of bond geometry and wire metallurgical characteristics. Where appropriate, the latest, most accurate value of a particular measurement has been substituted for an earlier reported one.

Next Generation Wiring

NASA Technical Reports Server (NTRS)

Medelius, Petro; Jolley, Scott; Fitzpatrick, Lilliana; Vinje, Rubiela; Williams, Martha; Clayton, LaNetra; Roberson, Luke; Smith, Trent; Santiago-Maldonado, Edgardo

2007-01-01

Wiring is a major operational component on aerospace hardware that accounts for substantial weight and volumetric space. Over time wire insulation can age and fail, often leading to catastrophic events such as system failure or fire. The next generation of wiring must be reliable and sustainable over long periods of time. These features will be achieved by the development of a wire insulation capable of autonomous self-healing that mitigates failure before it reaches a catastrophic level. In order to develop a self-healing insulation material, three steps must occur. First, methods of bonding similar materials must be developed that are capable of being initiated autonomously. This process will lead to the development of a manual repair system for polyimide wire insulation. Second, ways to initiate these bonding methods that lead to materials that are similar to the primary insulation must be developed. Finally, steps one and two must be integrated to produce a material that has no residues from the process that degrades the insulating properties of the final repaired insulation. The self-healing technology, teamed with the ability to identify and locate damage, will greatly improve reliability and safety of electrical wiring of critical systems. This paper will address these topics, discuss the results of preliminary testing, and remaining development issues related to self-healing wire insulation.

Reliability improvement of 1 mil aluminum wire bonds for semiconductors, technical performance summary

NASA Technical Reports Server (NTRS)

1971-01-01

The reliability of semiconductor devices as influenced by the reliability of wire bonds used in the assembly of the devices is investigated. The specific type of failure dealt with involves fracture of wire bonds as a result of repeated flexure of the wire at the heel of the bond when the devices are operated in an on-off mode. The mechanism of failure is one of induced fracture of the wire. To improve the reliability of a chosen transistor, one-mil diameter wires of aluminum with various alloy additions were studied using an accelerated fatigue testing machine. In addition, the electroprobe was used to study the metallurgy of the wires as to microstructure and kinetics of the growth of insoluble phases. Thermocompression and ultrasonic bonding techniques were also investigated.

Reliability improvement of wire bonds subjected to fatigue stresses.

NASA Technical Reports Server (NTRS)

Ravi, K. V.; Philofsky, E. M.

1972-01-01

The failure of wire bonds due to repeated flexure when semiconductor devices are operated in an on-off mode has been investigated. An accelerated fatigue testing apparatus was constructed and the major fatigue variables, aluminum alloy composition, and bonding mechanism, were tested. The data showed Al-1% Mg wires to exhibit superior fatigue characteristics compared to Al-1% Cu or Al-1% Si and ultrasonic bonding to be better than thermocompression bonding for fatigue resistance. Based on these results highly reliable devices were fabricated using Al-1% Mg wire with ultrasonic bonding which withstood 120,000 power cycles with no failures.

Comparison of three different orthodontic wires for bonded lingual retainer fabrication

PubMed Central

Uysal, Tancan; Gul, Nisa; Alan, Melike Busra; Ramoglu, Sabri Ilhan

2012-01-01

Objective We evaluated the detachment force, amount of deformation, fracture mode, and pull-out force of 3 different wires used for bonded lingual retainer fabrication. Methods We tested 0.0215-inch five-stranded wire (PentaOne, Masel; group I), 0.016 × 0.022-inch dead-soft eight-braided wire (Bond-A-Braid, Reliance; group II), and 0.0195-inch dead-soft coaxial wire (Respond, Ormco; group III). To test detachment force, deformation, and fracture mode, we embedded 94 lower incisor teeth in acrylic blocks in pairs. Retainer wires were bonded to the teeth and vertically directed force was applied to the wire. To test pull-out force, wires were embedded in composite that was placed in a hole at the center of an acrylic block. Tensile force was applied along the long axis of the wire. Results Detachment force and mode of fracture were not different between groups. Deformation was significantly higher in groups II and III than in group I (p < 0.001). Mean pull-out force was significantly higher for group I compared to groups II and III (p < 0.001). Conclusions Detachment force and fracture mode were similar for all wires, but greater deformations were seen in dead-soft wires. Wire pull-out force was significantly higher for five-stranded coaxial wire than for the other wires tested. Five-stranded coaxial wires are suggested for use in bonded lingual retainers. PMID:23112930

Permanent wire splicing by an explosive joining process

NASA Technical Reports Server (NTRS)

Bement, Laurence J. (Inventor); Kushnick, Anne C. (Inventor)

1991-01-01

The invention is an apparatus and method for wire splicing using an explosive joining process. The apparatus consists of a prebent, U-shaped strap of metal that slides over prepositioned wires. A standoff means separates the wires from the strap before joining. An adhesive means holds two ribbon explosives in position centered over the U-shaped strap. A detonating means connects to the ribbon explosives. The process involves spreading strands of each wire to be joined into a flat plane. The process then requires alternating each strand in alignment to form a mesh-like arrangement with an overlapped area. The strap slides over the strands of the wires, and the standoff means is positioned between the two surfaces. The detonating means then initiates the ribbon explosives that drive the strap to accomplish a high velocity, angular collision between the mating surfaces. This collision creates surface melts and collision bonding results in electron sharing linkups.

Reliability Criteria for Thick Bonding Wire.

PubMed

Dagdelen, Turker; Abdel-Rahman, Eihab; Yavuz, Mustafa

2018-04-17

Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire.

Reliability Criteria for Thick Bonding Wire

PubMed Central

Yavuz, Mustafa

2018-01-01

Bonding wire is one of the main interconnection techniques. Thick bonding wire is widely used in power modules and other high power applications. This study examined the case for extending the use of traditional thin wire reliability criteria, namely wire flexure and aspect ratio, to thick wires. Eleven aluminum (Al) and aluminum coated copper (CucorAl) wire samples with diameter 300 μm were tested experimentally. The wire response was measured using a novel non-contact method. High fidelity FEM models of the wire were developed and validated. We found that wire flexure is not correlated to its stress state or fatigue life. On the other hand, aspect ratio is a consistent criterion of thick wire fatigue life. Increasing the wire aspect ratio lowers its critical stress and increases its fatigue life. Moreover, we found that CucorAl wire has superior performance and longer fatigue life than Al wire. PMID:29673194

Comparative Reliability Studies and Analysis of Au, Pd-Coated Cu and Pd-Doped Cu Wire in Microelectronics Packaging

PubMed Central

Chong Leong, Gan; Uda, Hashim

2013-01-01

This paper compares and discusses the wearout reliability and analysis of Gold (Au), Palladium (Pd) coated Cu and Pd-doped Cu wires used in fineline Ball Grid Array (BGA) package. Intermetallic compound (IMC) thickness measurement has been carried out to estimate the coefficient of diffusion (Do) under various aging conditions of different bonding wires. Wire pull and ball bond shear strengths have been analyzed and we found smaller variation in Pd-doped Cu wire compared to Au and Pd-doped Cu wire. Au bonds were identified to have faster IMC formation, compared to slower IMC growth of Cu. The obtained weibull slope, β of three bonding wires are greater than 1.0 and belong to wearout reliability data point. Pd-doped Cu wire exhibits larger time-to-failure and cycles-to-failure in both wearout reliability tests in Highly Accelerated Temperature and Humidity (HAST) and Temperature Cycling (TC) tests. This proves Pd-doped Cu wire has a greater potential and higher reliability margin compared to Au and Pd-coated Cu wires. PMID:24244344

Methods of measurement for semiconductor materials, process control, and devices

NASA Technical Reports Server (NTRS)

Bullis, W. M. (Editor)

1972-01-01

Activities directed toward the development of methods of measurement for semiconductor materials, process control, and devices are described. Accomplishments include the determination of the reasons for differences in measurements of transistor delay time, identification of an energy level model for gold-doped silicon, and the finding of evidence that it does not appear to be necessary for an ultrasonic bonding tool to grip the wire and move it across the substrate metallization to make the bond. Work is continuing on measurement of resistivity of semiconductor crystals; study of gold-doped silicon; development of the infrared response technique; evaluation of wire bonds and die attachment; measurement of thermal properties of semiconductor devices, delay time, and related carrier transport properties in junction devices, and noise properties of microwave diodes; and characterization of silicon nuclear radiation detectors.

Interconnect mechanisms in microelectronic packaging

NASA Astrophysics Data System (ADS)

Roma, Maria Penafrancia C.

Global economic, environmental and market developments caused major impact in the microelectronics industry. Astronomical rise of gold metal prices over the last decade shifted the use of copper and silver alloys as bonding wires. Environmental legislation on the restriction of the use of Pb launched worldwide search for lead-free solders and platings. Finally, electrical and digital uses demanded smaller, faster and cheaper devices. Ultra-fine pitch bonding, decreasing bond wire sizes and hard to bond substrates have put the once-robust stitch bond in the center of reliability issues due to stitch bond lift or open wires .Unlike the ball bond, stitch bonding does not lead to intermetallic compound formation but adhesion is dependent on mechanical deformation, interdiffusion, solid solution formation, void formation and mechanical interlocking depending on the wire material, bond configuration, substrate type , thickness and surface condition. Using Au standoff stitch bonds on NiPdAu plated substrates eliminated stitch bond lift even when the Au and Pd layers are reduced. Using the Matano-Boltzmann analysis on a STEM (Scanning Transmission Analysis) concentration profile the interdiffusion coefficient is measured to be 10-16 cm 2/s. Wire pull strength data showed that the wire pull strength is 0.062N and increases upon stress testing. Meanwhile, coating the Cu wire with Pd, not only increases oxidation resistance but also improved adhesion due to the formation of a unique interfacial adhesion layers. Adhesion strength as measured by pull showed the Cu wire bonded to Ag plated Cu substrate (0.132N) to be stronger than the Au wire bonded on the same substrate (0.124N). Ag stitch bonded to Au is predicted to be strong but surface modification made the adhesion stronger. However, on the Ag ball bonded to Al showed multiple IMC formation with unique morphology exposed by ion milling and backscattered scanning electron microscopy. Adding alloying elements in the Ag wire alloy showed differences in adhesion strength and IMC formation. Bond strength by wire pull testing showed the 95Ag alloy with higher values while shear bond testing showed the 88Ag higher bond strength. Use of Cu pillars in flip chips and eutectic bonding in wafer level chip scale packages are direct consequences of diminishing interconnect dimension as a result of the drive for miniaturization. The combination of Cu-Sn interdiffusion, Kirkendall mechanism and heterogeneous vacancy precipitation are the main causes of IMC and void formation in Cu pillar - Sn solder - Cu lead frame sandwich structure. However, adding a Ni barrier agent showed less porous IMC layer as well as void formation as a result of the modified Cu and Sn movement well as the void formation. Direct die to die bonding using Al-Ge eutectic bonds is necessary when 3D integration is needed to reduce the footprint of a package. Hermeticity and adhesion strength are a function of the Al/Ge thickness ratio, bonding pressure, temperature and time. Scanning Electron Microscope (SEM) and Focused Ion Beam (FIB) allowed imaging of interfacial microstructures, porosity, grain morphology while Scanning Transmission Electron microscope (STEM) provided diffusion profile and confirmed interdiffusion. Ion polishing technique provided information on porosity and when imaged using backscattered mode, grain structure confirmed mechanical deformation of the bonds. Measurements of the interfacial bond strength are made by wire pull tests and ball shear tests based on existing industry standard tests. However, for the Al-Ge eutectic bonds, no standard strength is available so a test is developed using the stud pull test method using the Dage 4000 Plus to yield consistent results. Adhesion strengths of 30-40 MPa are found for eutectic bonded packages however, as low as 20MPa was measured in low temperature bonded areas.

Laser Indirect Shock Welding of Fine Wire to Metal Sheet.

PubMed

Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

2017-09-12

The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent.

77 FR 5728 - Airworthiness Directives; Airbus Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2012-02-06

... between bonding lead and the harness, due to over length of the bonding lead. As the affected wire is not... chafing of the wires, and corrective actions, if necessary. We are proposing this AD to detect and correct contact or chafing of wires and bonding leads which, if not detected could be a source of sparks in the...

Influence of aluminum oxide film on thermocompression bonding of gold wire to evaporated aluminum film

NASA Technical Reports Server (NTRS)

Iwata, S.; Ishizaka, A.; Yamamoto, H.

1984-01-01

The influence of Al surface condition on the thermocompression bonding of Au wires to Al electrodes for integrated electric circuits was studied. Au wires were connected to Al electrodes by nail-head bonding after various Al surface treatments. Bonding was evaluated by measuring the wire pull strength and fraction of the number of failures at Au-Al bonds to the total number of failures. Dependence of the fraction on applied load was derived theoretically with a parameter named critical load to take into consideration the differences in Al surface condition. The relation also held explicately for various surface treatments. Characterization of the Al surface was carried out by electron microscopy for chemical analysis.

Explosive Spot Joining of Metals

NASA Technical Reports Server (NTRS)

Bement, Laurence J. (Inventor); Perry, Ronnie B. (Inventor)

1997-01-01

The invention is an apparatus and method for wire splicing using an explosive joining process. The apparatus consists of a prebend, U-shaped strap of metal that slides over prepositioned wires. A standoff means separates the wires from the strap before joining. An adhesive means holds two ribbon explosives in position centered over the U-shaped strap. A detonating means connects to the ribbon explosives. The process involves spreading strands of each wire to be joined into a flat plane. The process then requires alternating each strand in alignment to form a mesh-like arrangement with an overlapped area. The strap slides over the strands of the wires. and the standoff means is positioned between the two surfaces. The detonating means then initiates the ribbon explosives that drive the strap to accomplish a high velocity. angular collision between the mating surfaces. This collision creates surface melts and collision bonding resulting in electron-sharing linkups.

Integrated Inductors for RF Transmitters in CMOS/MEMS Smart Microsensor Systems

PubMed Central

Kim, Jong-Wan; Takao, Hidekuni; Sawada, Kazuaki; Ishida, Makoto

2007-01-01

This paper presents the integration of an inductor by complementary metal-oxide-semiconductor (CMOS) compatible processes for integrated smart microsensor systems that have been developed to monitor the motion and vital signs of humans in various environments. Integration of radio frequency transmitter (RF) technology with complementary metal-oxide-semiconductor/micro electro mechanical systems (CMOS/MEMS) microsensors is required to realize the wireless smart microsensors system. The essential RF components such as a voltage controlled RF-CMOS oscillator (VCO), spiral inductors for an LC resonator and an integrated antenna have been fabricated and evaluated experimentally. The fabricated RF transmitter and integrated antenna were packaged with subminiature series A (SMA) connectors, respectively. For the impedance (50 Ω) matching, a bonding wire type inductor was developed. In this paper, the design and fabrication of the bonding wire inductor for impedance matching is described. Integrated techniques for the RF transmitter by CMOS compatible processes have been successfully developed. After matching by inserting the bonding wire inductor between the on-chip integrated antenna and the VCO output, the measured emission power at distance of 5 m from RF transmitter was -37 dBm (0.2 μW).

High reliability bond program using small diameter aluminum wire

NASA Technical Reports Server (NTRS)

Macha, M.; Thiel, R. A.

1975-01-01

The program was undertaken to characterize the performance of small diameter aluminum wire ultrasonically bonded to conductors commonly encountered in hybrid assemblies, and to recommend guidelines for improving this performance. Wire, 25.4, 38.1 and 50.8 um (1, 1.5 and 2 mil), was used with bonding metallization consisting of thick film gold, thin film gold and aluminum as well as conventional aluminum pads on semiconductor chips. The chief tool for evaluating the performance was the double bond pull test in conjunction with a 72 hour - 150 C heat soak and -65 C to +150 C thermal cycling. In practice the thermal cycling was found to have relatively little effect compared to the heat soak. Pull strength will decrease after heat soak as a result of annealing of the aluminum wire; when bonded to thick film gold, the pull strength decreased by about 50% (weakening of the bond interface was the major cause of the reduction). Bonds to thin film gold lost about 30 - 40% of their initial pull strenth; weakening of the wire itself at the bond heel was the predominant cause. Bonds to aluminum substrate metallization lost only about 22%. Bonds between thick and thin film gold substrate metallization and semiconductor chips substantiated the previous conclusions but also showed that in about 20 to 25% of the cases, bond interface failure occurred at the semiconductor chip.

Tensile test and interface retention forces between wires and composites in lingual fixed retainers.

PubMed

Paolone, Maria Giacinta; Kaitsas, Roberto; Obach, Patricia; Kaitsas, Vasilios; Benedicenti, Stefano; Sorrenti, Eugenio; Barberi, Fabrizio

2015-06-01

In daily orthodontic clinical practice retention is very important, and lingual retainers are part of this challenge. The failure of lingual retainers may be due to many factors. The aim of this study was to assess the retention forces and mechanical behavior of different types of wires matched with different kinds of composites in lingual retainers. A tensile test was performed on cylindrical composite test specimens bonded to orthodontic wires. The specimens were constructed using four different wires: a straight wire (Remanium .016×.022″ Dentaurum), two round twisted wires (Penta One .0215″ Masel, Gold Penta Twisted .0215″ Gold N'braces) and a rectangular braided wire (D-Rect .016×.022″ Ormco); and three composites: two micro-hybrids (Micro-Hybrid Enamel Plus HFO Micerium, and Micro-Hybrid SDR U Dentsply) and a micro-nano-filled composite (Micro-Nano-Filled Transbond LR 3M). The test was performed at a speed of 10mm/min on an Inström device. The wire was fixed with a clamp. The results showed that the bonding between wires and composites in lingual fixed retainers seemed to be lowest for rectangular smooth wires and increased in round twisted and rectangular twisted wires where the bonding was so strong that the maximum tension/bond strength was greater than the ultimate tensile strength of the wire. The highest values were in rectangular twisted wires. Concerning the composites, hybrid composites had the lowest interface bonding values and broke very quickly, while the nano- and micro-composites tolerated stronger forces and displayed higher bonding values. The best results were observed with the golden twisted wire and reached 21.46 MPa with the Transbond composite. With the rectangular braided wire the retention forces were so high that the Enamel Plus composite fractured when the load exceeded 154.6 N/MPa. When the same wire was combined with the Transbond LR either the wire or the composite broke when the force exceeded 240 N. The results of this study show that, when selecting a lingual retainer in daily clinical practice, not only must the patient's compliance and dependability be considered but also the mechanical properties and composition of different combinations of composites and wires. Copyright © 2015 CEO. Published by Elsevier Masson SAS. All rights reserved.

Biofilm formation on stainless steel and gold wires for bonded retainers in vitro and in vivo and their susceptibility to oral antimicrobials.

PubMed

Jongsma, Marije A; Pelser, Floris D H; van der Mei, Henny C; Atema-Smit, Jelly; van de Belt-Gritter, Betsy; Busscher, Henk J; Ren, Yijin

2013-05-01

Bonded retainers are used in orthodontics to maintain treatment result. Retention wires are prone to biofilm formation and cause gingival recession, bleeding on probing and increased pocket depths near bonded retainers. In this study, we compare in vitro and in vivo biofilm formation on different wires used for bonded retainers and the susceptibility of in vitro biofilms to oral antimicrobials. Orthodontic wires were exposed to saliva, and in vitro biofilm formation was evaluated using plate counting and live/dead staining, together with effects of exposure to toothpaste slurry alone or followed by antimicrobial mouthrinse application. Wires were also placed intra-orally for 72 h in human volunteers and undisturbed biofilm formation was compared by plate counting and live/dead staining, as well as by denaturing gradient gel electrophoresis for compositional differences in biofilms. Single-strand wires attracted only slightly less biofilm in vitro than multi-strand wires. Biofilms on stainless steel single-strand wires however, were much more susceptible to antimicrobials from toothpaste slurries and mouthrinses than on single-strand gold wires and biofilms on multi-strand wires. Also, in vivo significantly less biofilm was found on single-strand than on multi-strand wires. Microbial composition of biofilms was more dependent on the volunteer involved than on wire type. Biofilms on single-strand stainless steel wires attract less biofilm in vitro and are more susceptible to antimicrobials than on multi-strand wires. Also in vivo, single-strand wires attract less biofilm than multi-strand ones. Use of single-strand wires is preferred over multi-strand wires, not because they attract less biofilm, but because biofilms on single-strand wires are not protected against antimicrobials as in crevices and niches as on multi-strand wires.

Fast and reliable method to estimate losses of single-mode waveguides with an arbitrary 2D trajectory.

PubMed

Negredo, F; Blaicher, M; Nesic, A; Kraft, P; Ott, J; Dörfler, W; Koos, C; Rockstuhl, C

2018-06-01

Photonic wire bonds, i.e., freeform waveguides written by 3D direct laser writing, emerge as a technology to connect different optical chips in fully integrated photonic devices. With the long-term vision of scaling up this technology to a large-scale fabrication process, the in situ optimization of the trajectory of photonic wire bonds is at stake. A prerequisite for the real-time optimization is the availability of a fast loss estimator for single-mode waveguides of arbitrary trajectory. Losses occur because of the bending of the waveguides and at transitions among sections of the waveguide with different curvatures. Here, we present an approach that resides on the fundamental mode approximation, i.e., the assumption that the photonic wire bonds predominantly carry their energy in a single mode. It allows us to predict in a quick and reliable way the pertinent losses from pre-computed modal properties of the waveguide, enabling fast design of optimum paths.

Reliability of copper wire bonds on a novel over-pad metallization

NASA Astrophysics Data System (ADS)

Kawashiro, Fumiyoshi; Itoh, Satoshi; Maeda, Takehiko; Hirose, Tetsuya; Yajima, Akira; Etoh, Takaki; Nishikawa, Hiroshi

2015-05-01

Wire bonding technology is used in most semiconductor products. Recently, high gold prices have forced semiconductor manufacturers to replace Au wires with Cu wires. Because Cu wire bonds are vulnerable to high temperature and humidity, they remain unpopular in automotive and industrial applications with narrow-bond-pad pitches and small deformed ball diameters. To avoid forming the corrosive Cu-rich intermetallic compound Cu9Al4, the use of a Ni/Pd(/Au) over-pad metallization (OPM) structure produced by electroless plating on the Al metallization has been proposed. However, certain technical issues must be overcome, such as variations in the purity and thickness of the plating. To tackle these issues, a novel OPM structure produced by physical vapor deposition is proposed and evaluated in this study.

Finite Element Bond Modeling for Indented Wires in Pretensioned Concrete Crossties

DOT National Transportation Integrated Search

2016-04-12

Indented wires have been increasingly employed by : concrete crosstie manufacturers to improve the bond between : prestressing steel reinforcements and concrete, as bond can : affect several critical performance measures, including transfer : length,...

Laser Indirect Shock Welding of Fine Wire to Metal Sheet

PubMed Central

Wang, Xiao; Huang, Tao; Luo, Yapeng; Liu, Huixia

2017-01-01

The purpose of this paper is to present an advanced method for welding fine wire to metal sheet, namely laser indirect shock welding (LISW). This process uses silica gel as driver sheet to accelerate the metal sheet toward the wire to obtain metallurgical bonding. A series of experiments were implemented to validate the welding ability of Al sheet/Cu wire and Al sheet/Ag wire. It was found that the use of a driver sheet can maintain high surface quality of the metal sheet. With the increase of laser pulse energy, the bonding area of the sheet/wire increased and the welding interfaces were nearly flat. Energy dispersive spectroscopy (EDS) results show that the intermetallic phases were absent and a short element diffusion layer which would limit the formation of the intermetallic phases emerging at the welding interface. A tensile shear test was used to measure the mechanical strength of the welding joints. The influence of laser pulse energy on the tensile failure modes was investigated, and two failure modes, including interfacial failure and failure through the wire, were observed. The nanoindentation test results indicate that as the distance to the welding interface decreased, the microhardness increased due to the plastic deformation becoming more violent. PMID:28895900

Reliability Assessment and Activation Energy Study of Au and Pd-Coated Cu Wires Post High Temperature Aging in Nanoscale Semiconductor Packaging.

PubMed

Gan, C L; Hashim, U

2013-06-01

Wearout reliability and high temperature storage life (HTSL) activation energy of Au and Pd-coated Cu (PdCu) ball bonds are useful technical information for Cu wire deployment in nanoscale semiconductor device packaging. This paper discusses the influence of wire type on the wearout reliability performance of Au and PdCu wire used in fine pitch BGA package after HTSL stress at various aging temperatures. Failure analysis has been conducted to identify the failure mechanism after HTSL wearout conditions for Au and PdCu ball bonds. Apparent activation energies (Eaa) of both wire types are investigated after HTSL test at 150 °C, 175 °C and 200 °C aging temperatures. Arrhenius plot has been plotted for each ball bond types and the calculated Eaa of PdCu ball bond is 0.85 eV and 1.10 eV for Au ball bond in 110 nm semiconductor device. Obviously Au ball bond is identified with faster IMC formation rate with IMC Kirkendall voiding while PdCu wire exhibits equivalent wearout and or better wearout reliability margin compare to conventional Au wirebond. Lognormal plots have been established and its mean to failure (t 50 ) have been discussed in this paper.

Effect of confining pressure due to external jacket of steel plate or shape memory alloy wire on bond behavior between concrete and steel reinforcing bars.

PubMed

Choi, Eunsoo; Kim, Dongkyun; Park, Kyoungsoo

2014-12-01

For external jackets of reinforced concrete columns, shape memory alloy (SMA) wires are easy to install, and they provide active and passive confining pressure; steel plates, on the other hand, only provide passive confining pressure, and their installation on concrete is not convenient because of the requirement of a special device. To investigate how SMA wires distinctly impact bond behavior compared with steel plates, this study conducted push-out bond tests of steel reinforcing bars embedded in concrete confined by SMA wires or steel plates. For this purpose, concrete cylinders were prepared with dimensions of 100 mm x 200 mm, and D-22 reinforcing bars were embedded at the center of the concrete cylinders. External jackets of 1.0 mm and 1.5 mm thickness steel plates were used to wrap the concrete cylinders. Additionally, NiTiNb SMA wire with a diameter of 1.0 mm was wound around the concrete cylinders. Slip of the reinforcing bars due to pushing force was measured by using a displacement transducer, while the circumferential deformation of specimens was obtained by using an extensometer. The circumferential deformation was used to calculate the circumferential strains of the specimens. This study assessed the radial confining pressure due to the external jackets on the reinforcing bars at bond strength from bond stress-slip curves and bond stress-circumferential strain curves. Then, the effects of the radial confining pressure on the bond behavior of concrete are investigated, and an equation is suggested to estimate bond strength using the radial confining pressure. Finally, this study focused on how active confining pressure due to recovery stress of the SMA wires influences bond behavior.

Molecular mechanism of H+ conduction in the single-file water chain of the gramicidin channel.

PubMed

Pomès, Régis; Roux, Benoît

2002-05-01

The conduction of protons in the hydrogen-bonded chain of water molecules (or "proton wire") embedded in the lumen of gramicidin A is studied with molecular dynamics free energy simulations. The process may be described as a "hop-and-turn" or Grotthuss mechanism involving the chemical exchange (hop) of hydrogen nuclei between hydrogen-bonded water molecules arranged in single file in the lumen of the pore, and the subsequent reorganization (turn) of the hydrogen-bonded network. Accordingly, the conduction cycle is modeled by two complementary steps corresponding respectively to the translocation 1) of an ionic defect (H+) and 2) of a bonding defect along the hydrogen-bonded chain of water molecules in the pore interior. The molecular mechanism and the potential of mean force are analyzed for each of these two translocation steps. It is found that the mobility of protons in gramicidin A is essentially determined by the fine structure and the dynamic fluctuations of the hydrogen-bonded network. The translocation of H+ is mediated by spontaneous (thermal) fluctuations in the relative positions of oxygen atoms in the wire. In this diffusive mechanism, a shallow free-energy well slightly favors the presence of the excess proton near the middle of the channel. In the absence of H+, the water chain adopts either one of two polarized configurations, each of which corresponds to an oriented donor-acceptor hydrogen-bond pattern along the channel axis. Interconversion between these two conformations is an activated process that occurs through the sequential and directional reorientation of water molecules of the wire. The effect of hydrogen-bonding interactions between channel and water on proton translocation is analyzed from a comparison to the results obtained previously in a study of model nonpolar channels, in which such interactions were missing. Hydrogen-bond donation from water to the backbone carbonyl oxygen atoms lining the pore interior has a dual effect: it provides a coordination of water molecules well suited both to proton hydration and to high proton mobility, and it facilitates the slower reorientation or turn step of the Grotthuss mechanism by stabilizing intermediate configurations of the hydrogen-bonded network in which water molecules are in the process of flipping between their two preferred, polarized states. This mechanism offers a detailed molecular model for the rapid transport of protons in channels, in energy-transducing membrane proteins, and in enzymes.

Methods of measurement for semiconductor materials, process control, and devices

NASA Technical Reports Server (NTRS)

Bullis, W. M. (Editor)

1972-01-01

Activities directed toward the development of methods of measurement for semiconductor materials, process control, and devices are described. Topics investigated include: measurements of transistor delay time; application of the infrared response technique to the study of radiation-damaged, lithium-drifted silicon detectors; and identification of a condition that minimizes wire flexure and reduces the failure rate of wire bonds in transistors and integrated circuits under slow thermal cycling conditions. Supplementary data concerning staff, standards committee activities, technical services, and publications are included as appendixes.

Bundled monocapillary optics

DOEpatents

Hirsch, Gregory

2002-01-01

A plurality of glass or metal wires are precisely etched to form the desired shape of the individual channels of the final polycapillary optic. This shape is created by carefully controlling the withdrawal speed of a group of wires from an etchant bath. The etched wires undergo a subsequent operation to create an extremely smooth surface. This surface is coated with a layer of material which is selected to maximize the reflectivity of the radiation being used. This reflective surface may be a single layer of material, or a multilayer coating for optimizing the reflectivity in a narrower wavelength interval. The collection of individual wires is assembled into a close-packed multi-wire bundle, and the wires are bonded together in a manner which preserves the close-pack configuration, irrespective of the local wire diameter. The initial wires are then removed by either a chemical etching procedure or mechanical force. In the case of chemical etching, the bundle is generally segmented by cutting a series of etching slots. Prior to removing the wire, the capillary array is typically bonded to a support substrate. The result of the process is a bundle of precisely oriented radiation-reflecting hollow channels. The capillary optic is used for efficiently collecting and redirecting the radiation from a source of radiation which could be the anode of an x-ray tube, a plasma source, the fluorescent radiation from an electron microprobe, a synchrotron radiation source, a reactor or spallation source of neutrons, or some other source.

Porous coatings from wire mesh for bone implants

DOEpatents

Sump, Kenneth R.

1986-01-01

A method of coating areas of bone implant elements and the resulting implant having a porous coating are described. Preselected surface areas are covered by a preform made from continuous woven lengths of wire. The preform is compressed and heated to assure that diffusion bonding occurs between the wire surfaces and between the surface boundaries of the implant element and the wire surfaces in contact with it. Porosity is achieved by control of the resulting voids between the bonded wire portions.

Method for making an elastomeric member with end pieces

DOEpatents

Hoppie, L.O.; McNinch, J.H. Jr.; Nowell, G.C.

1984-10-23

A molding process is described for molding an elongated elastomeric member with wire mesh sleeves bonded to the ends. A molding preform of elastomeric material is positioned within a seamless mold cylinder, and the open ends of the wire mesh sleeves are mounted to end plug assemblies slidably received into the mold cylinder and positioned against the ends of the preform. A specialized profile is formed into surfaces of the respective end plug assemblies and by heating of the mold, the ends of the elastomeric preform are molded to the profile, as well as bonded to the reinforcing wire mesh sleeves. Vacuum is applied to the interior of the mold to draw outgassing vapors through relief spaces there through. The completed elastomeric member is removed from the mold cylinder by stretching, the consequent reduction in diameter enabling ready separation from the mold cylinder and removal thereof. 9 figs.

Improvement of modulation bandwidth in electroabsorption-modulated laser by utilizing the resonance property in bonding wire.

PubMed

Kwon, Oh Kee; Han, Young Tak; Baek, Yong Soon; Chung, Yun C

2012-05-21

We present and demonstrate a simple and cost-effective technique for improving the modulation bandwidth of electroabsorption-modulated laser (EML). This technique utilizes the RF resonance caused by the EML chip (i.e., junction capacitance) and bonding wire (i.e, wire inductance). We analyze the effects of the lengths of the bonding wires on the frequency responses of EML by using an equivalent circuit model. To verify this analysis, we package a lumped EML chip on the sub-mount and measure its frequency responses. The results show that, by using the proposed technique, we can increase the modulation bandwidth of EML from ~16 GHz to ~28 GHz.

PROCESSING OF HIGH-PERFORMANCE Nb{sub 3}Sn WIRES THROUGH A NEW DIFFUSION REACTION USING Sn BASED ALLOYS

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tachikawa, K.; Sasaki, H.; Yamaguchi, M.

Tightly consolidated Sn-Ta and Sn-B based alloys have been prepared by the reaction among constituent metal powders at 750-775 deg. C. Sn-Ta and Sn-B based alloys exhibit quite similar microstructures. A small amount of Ti addition seems to improve the bonding between Ta or B particles and Sn matrix. Nb{sub 3}Sn wires have been fabricated by the Jelly Roll (JR) and Multi-rod (MR) process using Sn based alloy sheet and rod, respectively. Thick Nb{sub 3}Sn layers with nearly stoichiometric A15 composition are synthesized through a new diffusion mechanism between Nb and Sn based alloy. B{sub c2}(4.2 K)'s of 26.9 Tmore » (mid) and 26.5 T (mid) have been obtained in the JR and MR processed wires, respectively, using Sn-Ta based alloy. These wires exhibit enough non-Cu J{sub c} to be used above 20 T and 4.2 K. T{sub c} of JR wires using Sn-B based sheet is 18.14 K (offset) which is slightly higher than that of wires using Sn-Ta based sheet.« less

Tunable smart digital structure (SDS) to modularly assemble soft actuators with layered adhesive bonding

NASA Astrophysics Data System (ADS)

Jin, Hu; Dong, Erbao; Xu, Min; Xia, Qirong; Liu, Shuai; Li, Weihua; Yang, Jie

2018-01-01

Many shape memory alloy (SMA)-based soft actuators have specific composite structures and manufacture processes, and are therefore unique. However, these exclusive characteristics limit their capabilities and applications, so in this article a soft and smart digital structure (SDS) is proposed that acts like a modular unit to assemble soft actuators by a layered adhesive bonding process. The SDS is a fully soft structure that encapsulates a digital skeleton consisting of four groups of parallel and independently actuated SMA wires capable of outputting a four-channel tunable force. The layered adhesive bonding process modularly bonds several SDSs with an elastic backbone to fabricate a layered soft actuator where the elastic backbone is used to recover the SDSs in a cooling process using the SMA wires. Two kinds of SDS-based soft actuators were modularly assembled, an actuator, SDS-I, with a two-dimensional reciprocal motion, and an actuator, SDS-II, capable of bi-directional reciprocal motion. The thermodynamics and phase transformation modeling of the SDS-based actuator were analyzed. Several extensional soft actuators were also assembled by bonding the SDS with an anomalous elastic backbone or modularly assembling the SDS-Is and SDS-IIs. These modularly assembled soft actuators delivered more output channels and a complicated motion, e.g., an actinomorphic soft actuator with four SDS-Is jumps in a series of hierarchical heights and directional movement by tuning the input channels of the SDSs. This result showed that the SDS can modularly assemble multifarious soft actuators with diverse capabilities, steerability and tunable outputs.

Design, fabrication and actuation of a MEMS-based image stabilizer for photographic cell phone applications

NASA Astrophysics Data System (ADS)

Chiou, Jin-Chern; Hung, Chen-Chun; Lin, Chun-Ying

2010-07-01

This work presents a MEMS-based image stabilizer applied for anti-shaking function in photographic cell phones. The proposed stabilizer is designed as a two-axis decoupling XY stage 1.4 × 1.4 × 0.1 mm3 in size, and adequately strong to suspend an image sensor for anti-shaking photographic function. This stabilizer is fabricated by complex fabrication processes, including inductively coupled plasma (ICP) processes and flip-chip bonding technique. Based on the special designs of a hollow handle layer and a corresponding wire-bonding assisted holder, electrical signals of the suspended image sensor can be successfully sent out with 32 signal springs without incurring damage during wire-bonding packaging. The longest calculated traveling distance of the stabilizer is 25 µm which is sufficient to resolve the anti-shaking problem in a three-megapixel image sensor. Accordingly, the applied voltage for the 25 µm moving distance is 38 V. Moreover, the resonant frequency of the actuating device with the image sensor is 1.123 kHz.

Silane and Germane Molecular Electronics.

PubMed

Su, Timothy A; Li, Haixing; Klausen, Rebekka S; Kim, Nathaniel T; Neupane, Madhav; Leighton, James L; Steigerwald, Michael L; Venkataraman, Latha; Nuckolls, Colin

2017-04-18

This Account provides an overview of our recent efforts to uncover the fundamental charge transport properties of Si-Si and Ge-Ge single bonds and introduce useful functions into group 14 molecular wires. We utilize the tools of chemical synthesis and a scanning tunneling microscopy-based break-junction technique to study the mechanism of charge transport in these molecular systems. We evaluated the fundamental ability of silicon, germanium, and carbon molecular wires to transport charge by comparing conductances within families of well-defined structures, the members of which differ only in the number of Si (or Ge or C) atoms in the wire. For each family, this procedure yielded a length-dependent conductance decay parameter, β. Comparison of the different β values demonstrates that Si-Si and Ge-Ge σ bonds are more conductive than the analogous C-C σ bonds. These molecular trends mirror what is seen in the bulk. The conductance decay of Si and Ge-based wires is similar in magnitude to those from π-based molecular wires such as paraphenylenes However, the chemistry of the linkers that attach the molecular wires to the electrodes has a large influence on the resulting β value. For example, Si- and Ge-based wires of many different lengths connected with a methyl-thiomethyl linker give β values of 0.36-0.39 Å -1 , whereas Si- and Ge-based wires connected with aryl-thiomethyl groups give drastically different β values for short and long wires. This observation inspired us to study molecular wires that are composed of both π- and σ-orbitals. The sequence and composition of group 14 atoms in the σ chain modulates the electronic coupling between the π end-groups and dictates the molecular conductance. The conductance behavior originates from the coupling between the subunits, which can be understood by considering periodic trends such as bond length, polarizability, and bond polarity. We found that the same periodic trends determine the electric field-induced breakdown properties of individual Si-Si, Ge-Ge, Si-O, Si-C, and C-C bonds. Building from these studies, we have prepared a system that has two different, alternative conductance pathways. In this wire, we can intentionally break a labile, strained silicon-silicon bond and thereby shunt the current through the secondary conduction pathway. This type of in situ bond-rupture provides a new tool to study single molecule reactions that are induced by electric fields. Moreover, these studies provide guidance for designing dielectric materials as well as molecular devices that require stability under high voltage bias. The fundamental studies on the structure/function relationships of the molecular wires have guided the design of new functional systems based on the Si- and Ge-based wires. For example, we exploited the principle of strain-induced Lewis acidity from reaction chemistry to design a single molecule switch that can be controllably switched between two conductive states by varying the distance between the tip and substrate electrodes. We found that the strain intrinsic to the disilaacenaphthene scaffold also creates two state conductance switching. Finally, we demonstrate the first example of a stereoelectronic conductance switch, and we demonstrate that the switching relies crucially on the electronic delocalization in Si-Si and Ge-Ge wire backbones. These studies illustrate the untapped potential in using Si- and Ge-based wires to design and control charge transport at the nanoscale and to allow quantum mechanics to be used as a tool to design ultraminiaturized switches.

An evaluation of the electric arc spray and (HPPS) processes for the manufacturing of high power plasma spraying MCrAIY coatings

NASA Astrophysics Data System (ADS)

Sacriste, D.; Goubot, N.; Dhers, J.; Ducos, M.; Vardelle, A.

2001-06-01

The high power plasma torch (PlazJet) can be used to spray refractory ceramics with high spray rates and deposition efficiency. It can provide dense and hard coating with high bond strengths. When manufacturing thermal barrier coatings, the PlazJet gun is well adapted to spraying the ceramic top coat but not the MCrAIY materials that are used as bond coat. Arc spraying can compete with plasma spraying for metallic coatings since cored wires can be used to spray alloys and composites. In addition, the high production rate of arc spraying enables a significant decrease in coating cost. This paper discusses the performances of the PlazJet gun, and a twin-wire are spray system, and compares the properties and cost of MCrAIY coatings made with these two processes. For arc spraying, the use of air or nitrogen as atomizing gas is also investigated.

Evaluation of mechanical properties in metal wire mesh supported selective catalytic reduction (SCR) catalyst structures

NASA Astrophysics Data System (ADS)

Rajath, S.; Siddaraju, C.; Nandakishora, Y.; Roy, Sukumar

2018-04-01

The objective of this research is to evaluate certain specific mechanical properties of certain stainless steel wire mesh supported Selective catalytic reduction catalysts structures wherein the physical properties of the metal wire mesh and also its surface treatments played vital role thereby influencing the mechanical properties. As the adhesion between the stainless steel wire mesh and the catalyst material determines the bond strength and the erosion resistance of catalyst structures, surface modifications of the metal- wire mesh structure in order to facilitate the interface bonding is therefore very important to realize enhanced level of mechanical properties. One way to enhance such adhesion properties, the stainless steel wire mesh is treated with the various acids, i.e., chromic acid, phosphoric acid including certain mineral acids and combination of all those in various molar ratios that could generate surface active groups on metal surface that promotes good interface structure between the metal- wire mesh and metal oxide-based catalyst material and then the stainless steel wire mesh is dipped in the glass powder slurry containing some amount of organic binder. As a result of which the said catalyst material adheres to the metal-wire mesh surface more effectively that improves the erosion profile of supported catalysts structure including bond strength.

Contact and Length Dependent Effects in Single-Molecule Electronics

NASA Astrophysics Data System (ADS)

Hines, Thomas

Understanding charge transport in single molecules covalently bonded to electrodes is a fundamental goal in the field of molecular electronics. In the past decade, it has become possible to measure charge transport on the single-molecule level using the STM break junction method. Measurements on the single-molecule level shed light on charge transport phenomena which would otherwise be obfuscated by ensemble measurements of groups of molecules. This thesis will discuss three projects carried out using STM break junction. In the first project, the transition between two different charge transport mechanisms is reported in a set of molecular wires. The shortest wires show highly length dependent and temperature invariant conductance behavior, whereas the longer wires show weakly length dependent and temperature dependent behavior. This trend is consistent with a model whereby conduction occurs by coherent tunneling in the shortest wires and by incoherent hopping in the longer wires. Measurements are supported with calculations and the evolution of the molecular junction during the pulling process is investigated. The second project reports controlling the formation of single-molecule junctions by means of electrochemically reducing two axial-diazonium terminal groups on a molecule, thereby producing direct Au-C covalent bonds in-situ between the molecule and gold electrodes. Step length analysis shows that the molecular junction is significantly more stable, and can be pulled over a longer distance than a comparable junction created with amine anchoring bonds. The stability of the junction is explained by the calculated lower binding energy associated with the direct Au-C bond compared with the Au-N bond. Finally, the third project investigates the role that molecular conformation plays in the conductance of oligothiophene single-molecule junctions. Ethyl substituted oligothiophenes were measured and found to exhibit temperature dependent conductance and transition voltage for molecules with between two and six repeat units. While the molecule with only one repeat unit shows temperature invariant behavior. Density functional theory calculations show that at higher temperatures the oligomers with multiple repeat units assume a more planar conformation, which increases the conjugation length and decreases the effective energy barrier of the junction.

Method for making an elastomeric member with end pieces

DOEpatents

Hoppie, Lyle O.; McNinch, Jr., Joseph H.; Nowell, Gregory C.

1984-01-01

A molding process for molding an elongated elastomeric member (60) with wire mesh sleeves (16) bonded to the ends (14). A molding preform (10) of elastomeric material is positioned within a seamless mold cylinder (26), and the open ends of the wire mesh sleeves (16) are mounted to end plug assemblies (30) slidably received into the mold cylinder (26) and positioned against the ends (14) of the preform (10). A specialized profile is formed into surfaces (44) of the respective end plug assemblies (30) and by heating of the mold (26), the ends (14) of the elastomeric preform (10) are molded to the profile, as well as bonded to the reinforcing wire mesh sleeves (16). Vacuum is applied to the interior of the mold to draw outgassing vapors through relief spaces therethrough. The completed elastomeric member (60) is removed from the mold cylinder (26) by stretching, the consequent reduction in diameter enabling ready separation from the mold cylinder (26) and removal thereof.

Microstructures and mechanical properties of bonding layers between low carbon steel and alloy 625 processed by gas tungsten arc welding

NASA Astrophysics Data System (ADS)

Lou, Shuai; Lee, Seul Bi; Nam, Dae-Geun; Choi, Yoon Suk

2017-11-01

A filler metal wire, Alloy 625, was cladded on a plate of a low carbon streel, SS400, by gas tungsten arc welding, and the morphology of the weld bead and resulting dilution ratio were investigated under different welding parameter values (the input current, weld speed and wire feed speed). The wire feed speed was found to be most influential in controlling the dilution ratio of the weld bead, and seemed to limit the influence of other welding parameters. Two extreme welding conditions (with the minimum and maximum dilution ratios) were identified, and the corresponding microstructures, hardness and tensile properties near the bond line were compared between the two cases. The weld bead with the minimum dilution ratio showed superior hardness and tensile properties, while the formation lath martensite (due to relatively fast cooling) affected mechanical properties in the heat affected zone of the base metal with the maximum dilution ratio.

Proton transfer events in GFP.

PubMed

Di Donato, Mariangela; van Wilderen, Luuk J G W; Van Stokkum, Ivo H M; Stuart, Thomas Cohen; Kennis, John T M; Hellingwerf, Klaas J; van Grondelle, Rienk; Groot, Marie Louise

2011-09-28

Proton transfer is one of the most important elementary processes in biology. Green fluorescent protein (GFP) serves as an important model system to elucidate the mechanistic details of this reaction, because in GFP proton transfer can be induced by light absorption. Illumination initiates proton transfer through a 'proton-wire', formed by the chromophore (the proton donor), water molecule W22, Ser205 and Glu222 (the acceptor), on a picosecond time scale. To obtain a more refined view of this process, we have used a combined approach of time resolved mid-infrared spectroscopy and visible pump-dump-probe spectroscopy to resolve with atomic resolution how and how fast protons move through this wire. Our results indicate that absorption of light by GFP induces in 3 ps (10 ps in D(2)O) a shift of the equilibrium positions of all protons in the H-bonded network, leading to a partial protonation of Glu222 and to a so-called low barrier hydrogen bond (LBHB) for the chromophore's proton, giving rise to dual emission at 475 and 508 nm. This state is followed by a repositioning of the protons on the wire in 10 ps (80 ps in D(2)O), ultimately forming the fully deprotonated chromophore and protonated Glu222.

Finite element bond models for seven-wire prestressing strands in concrete crossties.

DOT National Transportation Integrated Search

2015-03-23

Seven-wire strands are commonly used in pretensioned : concrete ties, but its bonding mechanism with concrete needs : further examination to provide a better understanding of some : concrete tie failure modes. As a key component in the finite : eleme...

The fabrication of a double-layer atom chip with through silicon vias for an ultra-high-vacuum cell

NASA Astrophysics Data System (ADS)

Chuang, Ho-Chiao; Lin, Yun-Siang; Lin, Yu-Hsin; Huang, Chi-Sheng

2014-04-01

This study presents a double-layer atom chip that provides users with increased diversity in the design of the wire patterns and flexibility in the design of the magnetic field. It is more convenient for use in atomic physics experiments. A negative photoresist, SU-8, was used as the insulating layer between the upper and bottom copper wires. The electrical measurement results show that the upper and bottom wires with a width of 100 µm can sustain a 6 A current without burnout. Another focus of this study is the double-layer atom chips integrated with the through silicon via (TSV) technique, and anodically bonded to a Pyrex glass cell, which makes it a desired vacuum chamber for atomic physics experiments. Thus, the bonded glass cell not only significantly reduces the overall size of the ultra-high-vacuum (UHV) chamber but also conducts the high current from the backside to the front side of the atom chip via the TSV under UHV (9.5 × 10-10 Torr). The TSVs with a diameter of 70 µm were etched through by the inductively coupled plasma ion etching and filled by the bottom-up copper electroplating method. During the anodic bonding process, the electroplated copper wires and TSVs on atom chips also need to pass the examination of the required bonding temperature of 250 °C, under an applied voltage of 1000 V. Finally, the UHV test of the double-layer atom chips with TSVs at room temperature can be reached at 9.5 × 10-10 Torr, thus satisfying the requirements of atomic physics experiments under an UHV environment.

Bond between smooth prestressing wires and concrete : finite element model and transfer length analysis for pretensioned concrete crossties.

DOT National Transportation Integrated Search

2014-04-03

Pretensioned concrete ties are increasingly employed in railroad high speed : and heavy haul applications. The bond between prestressing wires or strands and : concrete plays an important role in determining the transfer length of pretensioned : conc...

Pulling monatomic gold wires with single molecules: an Ab initio simulation.

PubMed

Krüger, Daniel; Fuchs, Harald; Rousseau, Roger; Marx, Dominik; Parrinello, Michele

2002-10-28

Car-Parrinello molecular dynamics simulations demonstrate that pulling a single thiolate molecule anchored on a stepped gold surface does not preferentially break the sulfur-gold chemical bond. Instead, it is found that this process leads to the formation of a monoatomic gold nanowire, followed by breaking a gold-gold bond with a rupture force of about 1.2 nN. The simulations also indicate that previous single-molecule thiolate-gold and gold-gold rupture experiments both probe the same phenomenon, namely, the breaking of a gold-gold bond within a gold nanowire.

KSC-05PD-0730

NASA Technical Reports Server (NTRS)

2005-01-01

KENNEDY SPACE CENTER, FLA. In the Orbiter Processing Facility at NASAs Kennedy Space Center, United Space Alliance tile technician Jimmy Carter works on instrument wire spot bonding on Atlantis vertical tail/rudder speed brake. Atlantis is being processed for launch on the second Return to Flight mission, STS-121, which is scheduled to fly in July.

KSC-05PD-0731

NASA Technical Reports Server (NTRS)

2005-01-01

KENNEDY SPACE CENTER, FLA. In the Orbiter Processing Facility at NASAs Kennedy Space Center, United Space Alliance tile technician Jimmy Carter works on instrument wire spot bonding on Atlantis vertical tail/rudder speed brake. Atlantis is being processed for launch on the second Return to Flight mission, STS-121, which is scheduled to fly in July.

Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si

NASA Astrophysics Data System (ADS)

Duan, P.; Raz, O.; Smalbrugge, B. E.; Duis, J.; Dorren, H. J. S.

2012-01-01

We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking the opto-electrical dies directly on the CMOS driver. The suggested implementation is aiming to provide a wafer scale process which will make the use of wire bonding redundant and will allow for impedance matched metallic wiring between the electronic driving circuit and its opto-electronic counter part. We suggest the use of a thick photoresist ramp between CMOS driver and opto-electrical dies surface as the bridge for supporting co-plannar waveguides (CPW) electrically plated with lithographic accuracy. In this way all three dimensions of the interconnecting metal layer, width, length and thickness can be completely controlled. In this 1st demonstration all processing is done on commercially available devices and products, and is compatible with CMOS processing technology. To test the applicability of CPW instead of wire bonds for interconnecting the CMOS circuit and opto-electronic chips, we have made test samples and tested their performance at speeds up to 10 Gbps. In this demonstration, a silicon substrate was used on which we evaporated gold co-planar waveguides (CPW) to mimic a wire on the driver. An optical link consisting of a VCSEL chip and a photodiode chip has been assembled and fully characterized using optical coupling into and out of a multimode fiber (MMF). A 10 Gb/s 27-1 NRZ PRBS signal transmitted from one chip to another chip was detected error free. A 4 dB receiver sensitivity penalty is measured for the integrated device compared to a commercial link.

Methods of measurement for semiconductor materials, process control, and devices

NASA Technical Reports Server (NTRS)

Bullis, W. M. (Editor)

1972-01-01

Significant accomplishments include development of a procedure to correct for the substantial differences of transistor delay time as measured with different instruments or with the same instrument at different frequencies; association of infrared response spectra of poor quality germanium gamma ray detectors with spectra of detectors fabricated from portions of a good crystal that had been degraded in known ways; and confirmation of the excellent quality and cosmetic appearance of ultrasonic bonds made with aluminum ribbon wire. Work is continuing on measurement of resistivity of semiconductor crystals; study of gold-doped silicon, development of the infrared response technique; evaluation of wire bonds and die attachment; and measurement of thermal properties of semiconductor devices, delay time and related carrier transport properties in junction devices, and noise properties of microwave diodes.

Design of a Smart Ultrasonic Transducer for Interconnecting Machine Applications

PubMed Central

Yan, Tian-Hong; Wang, Wei; Chen, Xue-Dong; Li, Qing; Xu, Chang

2009-01-01

A high-frequency ultrasonic transducer for copper or gold wire bonding has been designed, analyzed, prototyped and tested. Modeling techniques were used in the design phase and a practical design procedure was established and used. The transducer was decomposed into its elementary components. For each component, an initial design was obtained with simulations using a finite elements model (FEM). Simulated ultrasonic modules were built and characterized experimentally through the Laser Doppler Vibrometer (LDV) and electrical resonance spectra. Compared with experimental data, the FEM could be iteratively adjusted and updated. Having achieved a remarkably highly-predictive FEM of the whole transducer, the design parameters could be tuned for the desired applications, then the transducer is fixed on the wire bonder with a complete holder clamping was calculated by the FEM. The approach to mount ultrasonic transducers on wire bonding machines also is of major importance for wire bonding in modern electronic packaging. The presented method can lead to obtaining a nearly complete decoupling clamper design of the transducer to the wire bonder. PMID:22408564

Flexible Bond Wire Capacitive Strain Sensor for Vehicle Tyres.

PubMed

Cao, Siyang; Pyatt, Simon; Anthony, Carl J; Kubba, Ammar I; Kubba, Ali E; Olatunbosun, Oluremi

2016-06-21

The safety of the driving experience and manoeuvrability of a vehicle can be improved by detecting the strain in tyres. To measure strain accurately in rubber, the strain sensor needs to be flexible so that it does not deform the medium that it is measuring. In this work, a novel flexible bond wire capacitive strain sensor for measuring the strain in tyres is developed, fabricated and calibrated. An array of 25 micron diameter wire bonds in an approximately 8 mm × 8 mm area is built to create an interdigitated structure, which consists of 50 wire loops resulting in 49 capacitor pairs in parallel. Laser machining was used to pattern copper on a flexible printed circuit board PCB to make the bond pads for the wire attachment. The wire array was finally packaged and embedded in polydimethylsiloxane (PDMS), which acts as the structural material that is strained. The capacitance of the device is in a linear like relationship with respect to the strain, which can measure the strain up to at least ±60,000 micro-strain (±6%) with a resolution of ~132 micro-strain (0.013%). In-tyre testing under static loading has shown the ability of the sensor to measure large tyre strains. The technology used for sensor fabrication lends itself to mass production and so the design is considered to be consistent with low cost commercialisable strain sensing technology.

Flexible Bond Wire Capacitive Strain Sensor for Vehicle Tyres

PubMed Central

Cao, Siyang; Pyatt, Simon; Anthony, Carl J.; Kubba, Ammar I.; Kubba, Ali E.; Olatunbosun, Oluremi

2016-01-01

The safety of the driving experience and manoeuvrability of a vehicle can be improved by detecting the strain in tyres. To measure strain accurately in rubber, the strain sensor needs to be flexible so that it does not deform the medium that it is measuring. In this work, a novel flexible bond wire capacitive strain sensor for measuring the strain in tyres is developed, fabricated and calibrated. An array of 25 micron diameter wire bonds in an approximately 8 mm × 8 mm area is built to create an interdigitated structure, which consists of 50 wire loops resulting in 49 capacitor pairs in parallel. Laser machining was used to pattern copper on a flexible printed circuit board PCB to make the bond pads for the wire attachment. The wire array was finally packaged and embedded in polydimethylsiloxane (PDMS), which acts as the structural material that is strained. The capacitance of the device is in a linear like relationship with respect to the strain, which can measure the strain up to at least ±60,000 micro-strain (±6%) with a resolution of ~132 micro-strain (0.013%). In-tyre testing under static loading has shown the ability of the sensor to measure large tyre strains. The technology used for sensor fabrication lends itself to mass production and so the design is considered to be consistent with low cost commercialisable strain sensing technology. PMID:27338402

Comparative evaluation of microleakage of lingual retainer wires bonded with three different lingual retainer composites: an in vitro study.

PubMed

Nimbalkar-Patil, Smita; Vaz, Anna; Patil, Pravinkumar G

2014-11-01

To evaluate microleakage when two types of retainer wires were bonded with two light cured and a self cured lingual retainer composites. Total 120 freshly extracted human mandibular incisor teeth were collected and separated into six subgroups of 20 teeth each. Two different wires, a 0.036 inch hard round stainless steel (HRSS) wire sandblasted at the ends and 0.0175 inch multistranded wire bonded onto the lingual surfaces of the incisors with three different types of composite resins of 3M company; Concise Orthodontic (self-cure), Transbond XT (light-cure) and Transbond LR (light-cure). Specimens were further sealed with a nail varnish, stained with 0.5% basic fuchsine for 24 hours, sectioned and examined under a stereomicroscope, and scored for microleakage for the enamel-composite and wire-composite interfaces. Statistical analysis was performed by Kruskal-Wallis and Mann-Whitney U-tests. For HRSS wire, at the enamel-composite interface, the microleakage was least with Transbond LR followed by Concise Orthodontic and greatest for Transbond XT (p<0.05). At the wire composite interface too, the microleakage was in order of Transbond LR

Improvisation of mechanical and electrical properties of Cu by reinforcing MWCNT using modified electro-co-deposition process

NASA Astrophysics Data System (ADS)

Belgamwar, Sachin U.; Sharma, N. N.

2018-04-01

Multi-walled Carbon nanotubes–copper (MWCNT/Cu) composite powders with variable MWCNT content were synthesized by modified electro-co-deposition method. The electro-co-deposited MWCNT/Cu powders were consolidated by conventional compaction and sintering process. The consolidated products were then hot rolled and cold drawn to fine wires. The MWCNT/Cu composite wire samples were characterized for electrical and mechanical properties. We have been able to achieve an increase of around 8% in electrical conductivity of the form wires repeatedly. It has been observed that there was gradual improvement in the properties with reinforcement of MWCNT in the copper matrix. The betterment of electrical property has been achieved with simultaneous improvement in mechanical properties of the wire. The yield strength of MWCNT/Cu composite wire was found to be four times and the tensile strength two times greater than that of pure copper. The improved properties are attributed to the proper distribution of MWCNTs in the copper matrix and excellent interfacial bonding between MWCNT and composite copper fabricated by the modified method.

High-Temperature High-Power Packaging Techniques for HEV Traction Applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Elshabini, Aicha; Barlow, Fred D.

A key issue associated with the wider adoption of hybrid-electric vehicles (HEV) and plug in hybrid-electric vehicles (PHEV) is the implementation of the power electronic systems that are required in these products. One of the primary industry goals is the reduction in the price of these vehicles relative to the cost of traditional gasoline powered vehicles. Today these systems, such as the Prius, utilize one coolant loop for the engine at approximately 100 C coolant temperatures, and a second coolant loop for the inverter at 65 C. One way in which significant cost reduction of these systems could be achievedmore » is through the use of a single coolant loop for both the power electronics as well as the internal combustion engine (ICE). This change in coolant temperature significantly increases the junction temperatures of the devices and creates a number of challenges for both device fabrication and the assembly of these devices into inverters and converters for HEV and PHEV applications. Traditional power modules and the state-of-the-art inverters in the current HEV products, are based on chip and wire assembly and direct bond copper (DBC) on ceramic substrates. While a shift to silicon carbide (SiC) devices from silicon (Si) devices would allow the higher operating temperatures required for a single coolant loop, it also creates a number of challenges for the assembly of these devices into power inverters. While this traditional packaging technology can be extended to higher temperatures, the key issues are the substrate material and conductor stability, die bonding material, wire bonds, and bond metallurgy reliability as well as encapsulation materials that are stable at high operating temperatures. The larger temperature differential during power cycling, which would be created by higher coolant temperatures, places tremendous stress on traditional aluminum wire bonds that are used to interconnect power devices. Selection of the bond metallurgy and wire bond geometry can play a key role in mitigating this stress. An alternative solution would be to eliminate the wire bonds completely through a fundamentally different method of forming a reliable top side interconnect. Similarly, the solders used in most power modules exhibit too low of a liquidus to be viable solutions for maximum junction temperatures of 200 C. Commonly used encapsulation materials, such as silicone gels, also suffer from an inability to operate at 200 C for extended periods of time. Possible solutions to these problems exist in most cases but require changes to the traditional manufacturing process used in these modules. In addition, a number of emerging technologies such as Si nitride, flip-chip assembly methods, and the elimination of base-plates would allow reliable module development for operation of HEV and PHEV inverters at elevated junction temperatures.« less

In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens.

PubMed

Jongsma, Marije A; van der Mei, Henny C; Atema-Smit, Jelly; Busscher, Henk J; Ren, Yijin

2015-03-23

Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased pocket depth and bleeding on probing. This study compares in vivo biofilm formation on single-strand and multi-strand retention wires with different oral health-care regimens. Two-centimetre wires were placed in brackets that were bonded to the buccal side of the first molars and second premolars in the upper arches of 22 volunteers. Volunteers used a selected toothpaste with or without the additional use of a mouthrinse containing essential oils. Brushing was performed manually. Regimens were maintained for 1 week, after which the wires were removed and the oral biofilm was collected to quantify the number of organisms and their viability, determine the microbial composition and visualize the bacteria by electron microscopy. A 6-week washout period was employed between regimens. Biofilm formation was reduced on single-strand wires compared with multi-strand wires; bacteria were observed to adhere between the strands. The use of antibacterial toothpastes marginally reduced the amount of biofilm on both wire types, but significantly reduced the viability of the biofilm organisms. Additional use of the mouthrinse did not result in significant changes in biofilm amount or viability. However, major shifts in biofilm composition were induced by combining a stannous fluoride- or triclosan-containing toothpaste with the mouthrinse. These shifts can be tentatively attributed to small changes in bacterial cell surface hydrophobicity after the adsorption of the toothpaste components, which stimulate bacterial adhesion to the hydrophobic oil, as illustrated for a Streptococcus mutans strain.

In vivo biofilm formation on stainless steel bonded retainers during different oral health-care regimens

PubMed Central

Jongsma, Marije A; van der Mei, Henny C; Atema-Smit, Jelly; Busscher, Henk J; Ren, Yijin

2015-01-01

Retention wires permanently bonded to the anterior teeth are used after orthodontic treatment to prevent the teeth from relapsing to pre-treatment positions. A disadvantage of bonded retainers is biofilm accumulation on the wires, which produces a higher incidence of gingival recession, increased pocket depth and bleeding on probing. This study compares in vivo biofilm formation on single-strand and multi-strand retention wires with different oral health-care regimens. Two-centimetre wires were placed in brackets that were bonded to the buccal side of the first molars and second premolars in the upper arches of 22 volunteers. Volunteers used a selected toothpaste with or without the additional use of a mouthrinse containing essential oils. Brushing was performed manually. Regimens were maintained for 1 week, after which the wires were removed and the oral biofilm was collected to quantify the number of organisms and their viability, determine the microbial composition and visualize the bacteria by electron microscopy. A 6-week washout period was employed between regimens. Biofilm formation was reduced on single-strand wires compared with multi-strand wires; bacteria were observed to adhere between the strands. The use of antibacterial toothpastes marginally reduced the amount of biofilm on both wire types, but significantly reduced the viability of the biofilm organisms. Additional use of the mouthrinse did not result in significant changes in biofilm amount or viability. However, major shifts in biofilm composition were induced by combining a stannous fluoride- or triclosan-containing toothpaste with the mouthrinse. These shifts can be tentatively attributed to small changes in bacterial cell surface hydrophobicity after the adsorption of the toothpaste components, which stimulate bacterial adhesion to the hydrophobic oil, as illustrated for a Streptococcus mutans strain. PMID:25572920

Electrostatically focused intensified charge coupled devices

NASA Technical Reports Server (NTRS)

Walker, J. W.

1977-01-01

Work performed to develop intensified charge coupled devices (ICCDs) is presented. Four ICCDs, containing 100 x 160 arrays, were fabricated. Electron gains up to 3200 at 15 keV were achieved. Photocathode sensitivities ranged from 190 to 410 micro A/lumen. Dark currents varied from 11 nA/sq cm to 37 nA/sq cm. There was serious concern about the reliability of the bonding scheme for ICCDs due to occassional bond failure. Two solutions to this problem were developed. One involved a modification of the existing bonding technique, and the other was the development of a protected bond pad employing a barrier metal between the aluminum metallization and the gold bond wire. An accumulation process was characterized with respect to its most critical variable. This characterization led to the achievement of reproducible spectral response and the discovery and elimination of dark current increase associated with this process.

Methods of measurement for semiconductor materials, process control, and devices

NASA Technical Reports Server (NTRS)

Bullis, W. M. (Editor)

1973-01-01

This progress report describes NBS activities directed toward the development of methods of measurement for semiconductor materials, process control, and devices. Significant accomplishments during this reporting period include design of a plan to provide standard silicon wafers for four-probe resistivity measurements for the industry, publication of a summary report on the photoconductive decay method for measuring carrier lifetime, publication of a comprehensive review of the field of wire bond fabrication and testing, and successful completion of organizational activity leading to the establishment of a new group on quality and hardness assurance in ASTM Committee F-1 on Electronics. Work is continuing on measurement of resistivity of semiconductor crystals; characterization of generation-recombination-trapping centers in silicon; study of gold-doped silicon; development of the infrared response technique; evaluation of wire bonds and die attachment; and measurement of thermal properties of semiconductor devices, delay time and related carrier transport properties in junction devices, and noise properties of microwave diodes.

Welding Wires To Thin Thermocouple Films

NASA Technical Reports Server (NTRS)

Holanda, Raymond; Kim, Walter S.; Danzey, Gerald A.; Pencil, Eric; Wadel, Mary

1993-01-01

Parallel-gap resistance welding yields joints surviving temperatures of about 1,000 degrees C. Much faster than thermocompression bonding. Also exceeds conductive-paste bonding and sputtering thin films through porous flame-sprayed insulation on prewelded lead wires. Introduces no foreign material into thermocouple circuit and does not require careful control of thickness of flame-sprayed material.

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2014 CFR

2014-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2012 CFR

2012-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2013 CFR

2013-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or... interconnected.) This connection must be made before any filling hole is opened, and must remain in place until after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2011 CFR

2011-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or integrally connected steel framing, and the other end to the shell of the cargo tank to provide a continuous... after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

49 CFR 177.837 - Class 3 materials.

Code of Federal Regulations, 2010 CFR

2010-10-01

... through an open filling hole, one end of a bond wire shall be connected to the stationary system piping or integrally connected steel framing, and the other end to the shell of the cargo tank to provide a continuous... after the last filling hole has been closed. Additional bond wires are not needed around All-Metal...

Extreme temperature packaging: challenges and opportunities

NASA Astrophysics Data System (ADS)

Johnson, R. Wayne

2016-05-01

Consumer electronics account for the majority of electronics manufactured today. Given the temperature limits of humans, consumer electronics are typically rated for operation from -40°C to +85°C. Military applications extend the range to -65°C to +125°C while underhood automotive electronics may see +150°C. With the proliferation of the Internet of Things (IoT), the goal of instrumenting (sensing, computation, transmission) to improve safety and performance in high temperature environments such as geothermal wells, nuclear reactors, combustion chambers, industrial processes, etc. requires sensors, electronics and packaging compatible with these environments. Advances in wide bandgap semiconductors (SiC and GaN) allow the fabrication of high temperature compatible sensors and electronics. Integration and packaging of these devices is required for implementation into actual applications. The basic elements of packaging are die attach, electrical interconnection and the package or housing. Consumer electronics typically use conductive adhesives or low melting point solders for die attach, wire bonds or low melting solder for electrical interconnection and epoxy for the package. These materials melt or decompose in high temperature environments. This paper examines materials and processes for high temperature packaging including liquid transient phase and sintered nanoparticle die attach, high melting point wires for wire bonding and metal and ceramic packages. The limitations of currently available solutions will also be discussed.

Direct mapping of electrical noise sources in molecular wire-based devices

PubMed Central

Cho, Duckhyung; Lee, Hyungwoo; Shekhar, Shashank; Yang, Myungjae; Park, Jae Yeol; Hong, Seunghun

2017-01-01

We report a noise mapping strategy for the reliable identification and analysis of noise sources in molecular wire junctions. Here, different molecular wires were patterned on a gold substrate, and the current-noise map on the pattern was measured and analyzed, enabling the quantitative study of noise sources in the patterned molecular wires. The frequency spectra of the noise from the molecular wire junctions exhibited characteristic 1/f2 behavior, which was used to identify the electrical signals from molecular wires. This method was applied to analyze the molecular junctions comprising various thiol molecules on a gold substrate, revealing that the noise in the junctions mainly came from the fluctuation of the thiol bonds. Furthermore, we quantitatively compared the frequencies of such bond fluctuations in different molecular wire junctions and identified molecular wires with lower electrical noise, which can provide critical information for designing low-noise molecular electronic devices. Our method provides valuable insights regarding noise phenomena in molecular wires and can be a powerful tool for the development of molecular electronic devices. PMID:28233821

Direct mapping of electrical noise sources in molecular wire-based devices

NASA Astrophysics Data System (ADS)

Cho, Duckhyung; Lee, Hyungwoo; Shekhar, Shashank; Yang, Myungjae; Park, Jae Yeol; Hong, Seunghun

2017-02-01

We report a noise mapping strategy for the reliable identification and analysis of noise sources in molecular wire junctions. Here, different molecular wires were patterned on a gold substrate, and the current-noise map on the pattern was measured and analyzed, enabling the quantitative study of noise sources in the patterned molecular wires. The frequency spectra of the noise from the molecular wire junctions exhibited characteristic 1/f2 behavior, which was used to identify the electrical signals from molecular wires. This method was applied to analyze the molecular junctions comprising various thiol molecules on a gold substrate, revealing that the noise in the junctions mainly came from the fluctuation of the thiol bonds. Furthermore, we quantitatively compared the frequencies of such bond fluctuations in different molecular wire junctions and identified molecular wires with lower electrical noise, which can provide critical information for designing low-noise molecular electronic devices. Our method provides valuable insights regarding noise phenomena in molecular wires and can be a powerful tool for the development of molecular electronic devices.

Durability Evaluation of a Thin Film Sensor System With Enhanced Lead Wire Attachments on SiC/SiC Ceramic Matrix Composites

NASA Technical Reports Server (NTRS)

Lei, Jih-Fen; Kiser, J. Douglas; Singh, Mrityunjay; Cuy, Mike; Blaha, Charles A.; Androjna, Drago

2000-01-01

An advanced thin film sensor system instrumented on silicon carbide (SiC) fiber reinforced SiC matrix ceramic matrix composites (SiC/SiC CMCs), was evaluated in a Mach 0.3 burner rig in order to determine its durability to monitor material/component surface temperature in harsh environments. The sensor system included thermocouples in a thin film form (5 microns thick), fine lead wires (75 microns diameter), and the bonds between these wires and the thin films. Other critical components of the overall system were the heavy, swaged lead wire cable (500 microns diameter) that contained the fine lead wires and was connected to the temperature readout, and ceramic attachments which were bonded onto the CMCs for the purpose of securing the lead wire cables, The newly developed ceramic attachment features a combination of hoops made of monolithic SiC or SiC/SiC CMC (which are joined to the test article) and high temperature ceramic cement. Two instrumented CMC panels were tested in a burner rig for a total of 40 cycles to 1150 C (2100 F). A cycle consisted of rapid heating to 1150 C (2100 F), a 5 minute hold at 1150 C (2100 F), and then cooling down to room temperature in 2 minutes. The thin film sensor systems provided repeatable temperature measurements for a maximum of 25 thermal cycles. Two of the monolithic SiC hoops debonded during the sensor fabrication process and two of the SiC/SiC CMC hoops failed during testing. The hoops filled with ceramic cement, however, showed no sign of detachment after 40 thermal cycle test. The primary failure mechanism of this sensor system was the loss of the fine lead wire-to-thin film connection, which either due to detachment of the fine lead wires from the thin film thermocouples or breakage of the fine wire.

Inorganic spark chamber frame and method of making the same

NASA Technical Reports Server (NTRS)

Heslin, T. M. (Inventor)

1982-01-01

A spark chamber frame, manufactured using only inorganic materials is described. The spark chamber frame includes a plurality of beams formed from inorganic material, such as ceramic or glass, and are connected together at ends with inorganic bonding material having substantially the same thermal expansion as the beam material. A plurality of wires formed from an inorganic composition are positioned between opposed beams so that the wires are uniformly spaced and form a grid. A plurality of hold down straps are formed of inorganic material such as ceramic or glass having substantially the same chemical and thermal properties as the beam material. Hold down straps overlie wires extending over the beams and are bonded thereto with inorganic bonding material.

Wiring design for the control of electromagnetic interference (EMI)

NASA Technical Reports Server (NTRS)

Kopasakis, George

1995-01-01

Wiring design is only one important aspect of EMI control. Other important areas for EMI are: circuit design, filtering, grounding, bonding, shielding, lighting, electrostatic discharge (ESD), transient suppression, and electromagnetic pulse (EMP). Topics covered include: wire magnetic field emissions at low frequencies; wire radiated magnetic field emissions at frequencies; wire design guidelines for EMI control; wire design guidelines for EMI control; high frequency emissions from cables; and pulse frequency spectra.

A tool for measuring the bending length in thin wires

NASA Astrophysics Data System (ADS)

Lorenzini, M.; Cagnoli, G.; Cesarini, E.; Losurdo, G.; Martelli, F.; Piergiovanni, F.; Vetrano, F.; Viceré, A.

2013-03-01

Great effort is currently being put into the development and construction of the second generation, advanced gravitational wave detectors, Advanced Virgo and Advanced LIGO. The development of new low thermal noise suspensions of mirrors, based on the experience gained in the previous experiments, is part of this task. Quasi-monolithic suspensions with fused silica wires avoid the problem of rubbing friction introduced by steel cradle arrangements by directly welding the wires to silica blocks bonded to the mirror. Moreover, the mechanical loss level introduced by silica (ϕfs ˜ 10-7 in thin fused silica wires) is by far less than the one associated with steel. The low frequency dynamical behaviour of the suspension can be computed and optimized, provided that the wire bending shape under pendulum motion is known. Due to the production process, fused silica wires are thicker near the two ends (necks), so that analytical bending computations are very complicated. We developed a tool to directly measure the low frequency bending parameters of fused silica wires, and we tested it on the wires produced for the Virgo+ monolithic suspensions. The working principle and a set of test measurements are presented and explained.

A tool for measuring the bending length in thin wires.

PubMed

Lorenzini, M; Cagnoli, G; Cesarini, E; Losurdo, G; Martelli, F; Piergiovanni, F; Vetrano, F; Viceré, A

2013-03-01

Great effort is currently being put into the development and construction of the second generation, advanced gravitational wave detectors, Advanced Virgo and Advanced LIGO. The development of new low thermal noise suspensions of mirrors, based on the experience gained in the previous experiments, is part of this task. Quasi-monolithic suspensions with fused silica wires avoid the problem of rubbing friction introduced by steel cradle arrangements by directly welding the wires to silica blocks bonded to the mirror. Moreover, the mechanical loss level introduced by silica (φfs ∼ 10(-7) in thin fused silica wires) is by far less than the one associated with steel. The low frequency dynamical behaviour of the suspension can be computed and optimized, provided that the wire bending shape under pendulum motion is known. Due to the production process, fused silica wires are thicker near the two ends (necks), so that analytical bending computations are very complicated. We developed a tool to directly measure the low frequency bending parameters of fused silica wires, and we tested it on the wires produced for the Virgo+ monolithic suspensions. The working principle and a set of test measurements are presented and explained.

Electromagnetically Clean Solar Arrays

NASA Technical Reports Server (NTRS)

Stem, Theodore G.; Kenniston, Anthony E.

2008-01-01

The term 'electromagnetically clean solar array' ('EMCSA') refers to a panel that contains a planar array of solar photovoltaic cells and that, in comparison with a functionally equivalent solar-array panel of a type heretofore used on spacecraft, (1) exhibits less electromagnetic interferences to and from other nearby electrical and electronic equipment and (2) can be manufactured at lower cost. The reduction of electromagnetic interferences is effected through a combination of (1) electrically conductive, electrically grounded shielding and (2) reduction of areas of current loops (in order to reduce magnetic moments). The reduction of cost is effected by designing the array to be fabricated as a more nearly unitary structure, using fewer components and fewer process steps. Although EMCSAs were conceived primarily for use on spacecraft they are also potentially advantageous for terrestrial applications in which there are requirements to limit electromagnetic interference. In a conventional solar panel of the type meant to be supplanted by an EMCSA panel, the wiring is normally located on the back side, separated from the cells, thereby giving rise to current loops having significant areas and, consequently, significant magnetic moments. Current-loop geometries are chosen in an effort to balance opposing magnetic moments to limit far-0field magnetic interactions, but the relatively large distances separating current loops makes full cancellation of magnetic fields problematic. The panel is assembled from bare photovoltaic cells by means of multiple sensitive process steps that contribute significantly to cost, especially if electomagnetic cleanliness is desired. The steps include applying a cover glass and electrical-interconnect-cell (CIC) sub-assemble, connecting the CIC subassemblies into strings of series-connected cells, laying down and adhesively bonding the strings onto a panel structure that has been made in a separate multi-step process, and mounting the wiring on the back of the panel. Each step increases the potential for occurrence of latent defects, loss of process control, and attrition of components. An EMCSA panel includes an integral cover made from a transparent material. The silicone cover supplants the individual cover glasses on the cells and serves as an additional unitary structural support that offers the advantage, relative to glass, of the robust, forgiving nature of the silcone material. The cover contains pockets that hold the solar cells in place during the lamination process. The cover is coated with indium tin oxide to make its surface electrically conductive, so that it serves as a contiguous, electrically grounded shield over the entire panel surface. The cells are mounted in proximity to metallic printed wiring. The painted-wiring layer comprises metal-film traces on a sheet of Kapton (or equivalent) polyimide. The traces include contact pads on one side of the sheet for interconnecting the cells. Return leads are on the opposite side of the sheet, positioned to form the return currents substantially as mirror images of, and in proximity to, the cell sheet currents, thereby minimizing magnetic moments. The printed-wiring arrangement mimics the back-wiring arrangement of conventional solar arrays, but the current-loop areas and the resulting magnetic moments are much smaller because the return-current paths are much closer to the solar-cell sheet currents. The contact pads are prepared with solder fo electrical and mechanical bonding to the cells. The pocketed cover/shield, the solar cells, the printed-wiring layer, an electrical bonding agent, a mechanical-bonding agent, a composite structural front-side face sheet, an aluminum honeycomb core, and a composite back-side face sheet are all assembled, then contact pads are soldered to the cells and the agents are cured in a single lamination process.

Cyclic and low temperature effects on microcircuits

NASA Technical Reports Server (NTRS)

Weissflug, V. A.; Sisul, E. V.

1977-01-01

Cyclic temperature and low temperature operating life tests, and pre-/post-life device evaluations were used to determine the degrading effects of thermal environments on microcircuit reliability. Low power transistor-transistor-logic gates and linear devices were included in each test group. Device metallization systems included aluminum metallization/aluminum wire, aluminum metallization/gold wire, and gold metallization/gold wire. Fewer than 2% electrical failures were observed during the cyclic and low temperature life tests and the post-life evaluations revealed approximately 2% bond pull failures. Reconstruction of aluminum die metallization was observed in all devices and the severity of the reconstruction appeared to be directly related to the magnitude of the temperature excursion. All types of bonds except the gold/gold bonds were weakened by exposure to repeated cyclic temperature stress.

High-frequency ultrasonic wire bonding systems

PubMed

Tsujino; Yoshihara; Sano; Ihara

2000-03-01

The vibration characteristics of longitudinal-complex transverse vibration systems with multiple resonance frequencies of 350-980 kHz for ultrasonic wire bonding of IC, LSI or electronic devices were studied. The complex vibration systems can be applied for direct welding of semiconductor tips (face-down bonding, flip-chip bonding) and packaging of electronic devices. A longitudinal-complex transverse vibration bonding system consists of a complex transverse vibration rod, two driving longitudinal transducers 7.0 mm in diameter and a transverse vibration welding tip. The vibration distributions along ceramic and stainless-steel welding tips were measured at up to 980 kHz. A high-frequency vibration system with a height of 20.7 mm and a weight of less than 15 g was obtained.

En-masse retraction with a preformed nickel-titanium and stainless steel archwire assembly and temporary skeletal anchorage devices without posterior bonding

PubMed Central

Jee, Jeong-Hyun; Ahn, Hyo-Won; Seo, Kyung-Won; Kook, Yoon-Ah; Chung, Kyu-Rhim; Nelson, Gerald

2014-01-01

Objective To evaluate the therapeutic effects of a preformed assembly of nickel-titanium (NiTi) and stainless steel (SS) archwires (preformed C-wire) combined with temporary skeletal anchorage devices (TSADs) as the sole source of anchorage and to compare these effects with those of a SS version of C-wire (conventional C-wire) for en-masse retraction. Methods Thirty-one adult female patients with skeletal Class I or II dentoalveolar protrusion, mild-to-moderate anterior crowding (3.0-6.0 mm), and stable Class I posterior occlusion were divided into conventional (n = 15) and preformed (n = 16) C-wire groups. All subjects underwent first premolar extractions and en-masse retraction with pre-adjusted edgewise anterior brackets, the assigned C-wire, and maxillary C-tubes or C-implants; bonded mesh-tube appliances were used in the mandibular dentition. Differences in pretreatment and post-retraction measurements of skeletal, dental, and soft-tissue cephalometric variables were statistically analyzed. Results Both groups showed full retraction of the maxillary anterior teeth by controlled tipping and space closure without altered posterior occlusion. However, the preformed C-wire group had a shorter retraction period (by 3.2 months). Furthermore, the maxillary molars in this group showed no significant mesialization, mesial tipping, or extrusion; some mesialization and mesial tipping occurred in the conventional C-wire group. Conclusions Preformed C-wires combined with maxillary TSADs enable simultaneous leveling and space closure from the beginning of the treatment without maxillary posterior bonding. This allows for faster treatment of dentoalveolar protrusion without unwanted side effects, when compared with conventional C-wire, evidencing its clinical expediency. PMID:25309863

Wire bonding quality monitoring via refining process of electrical signal from ultrasonic generator

NASA Astrophysics Data System (ADS)

Feng, Wuwei; Meng, Qingfeng; Xie, Youbo; Fan, Hong

2011-04-01

In this paper, a technique for on-line quality detection of ultrasonic wire bonding is developed. The electrical signals from the ultrasonic generator supply, namely, voltage and current, are picked up by a measuring circuit and transformed into digital signals by a data acquisition system. A new feature extraction method is presented to characterize the transient property of the electrical signals and further evaluate the bond quality. The method includes three steps. First, the captured voltage and current are filtered by digital bandpass filter banks to obtain the corresponding subband signals such as fundamental signal, second harmonic, and third harmonic. Second, each subband envelope is obtained using the Hilbert transform for further feature extraction. Third, the subband envelopes are, respectively, separated into three phases, namely, envelope rising, stable, and damping phases, to extract the tiny waveform changes. The different waveform features are extracted from each phase of these subband envelopes. The principal components analysis (PCA) method is used for the feature selection in order to remove the relevant information and reduce the dimension of original feature variables. Using the selected features as inputs, an artificial neural network (ANN) is constructed to identify the complex bond fault pattern. By analyzing experimental data with the proposed feature extraction method and neural network, the results demonstrate the advantages of the proposed feature extraction method and the constructed artificial neural network in detecting and identifying bond quality.

Sub-Kelvin resistance thermometer

NASA Technical Reports Server (NTRS)

Castles, Stephen H. (Inventor)

1992-01-01

A device capable of accurate temperature measurement down to 0.01 K of a particular object is discussed. The device is comprised of the following: a heat sink wafer; a first conducting pad bonded near one end of the heat sink wafer; a second conducting pad bonded near the other end of the heat sink wafer; and an oblong doped semiconductor crystal such as germanium. The oblong doped semiconductor crystal has a third conducting pad bonded on its bottom surface with the oblong doped semiconductor crystal bonded to the heat sink wafer by having the fourth conducting pad bonded to the first conducting pad. A wire is bonded between the second and third conducting pads. Current and voltage wires bonded to the first and second conducting pads measure the change in resistance of the oblong doped semiconductor crystal; this indicates the temperature of the object whose temperature is to be measured.

The effects of silver coating on friction coefficient and shear bond strength of steel orthodontic brackets.

PubMed

Arash, Valiollah; Anoush, Keivan; Rabiee, Sayed Mahmood; Rahmatei, Manuchehr; Tavanafar, Saeid

2015-01-01

Aims of the present study was to measure frictional resistance between silver coated brackets and different types of arch wires, and shear bond strength of these brackets to the tooth. In an experimental clinical research 28 orthodontic brackets (standard, 22 slots) were coated with silver ions using electroplate method. Six brackets (coated: 3, uncoated: 3) were evaluated with Scanning Electron Microscopy and Atomic Force Microscopy. The amount of friction in 15 coated brackets was measured with three different kinds of arch wires (0.019 × 0.025-in stainless steel [SS], 0.018-in stainless steel [SS], 0.018-in Nickel-Titanium [Ni-Ti]) and compared with 15 uncoated steel brackets. In addition, shear bond strength values were compared between 10 brackets with silver coating and 10 regular brackets. Universal testing machine was used to measure shear bond strength and the amount of friction between the wires and brackets. SPSS 18 was used for data analysis with t-test. SEM and AFM results showed deposition of a uniform layer of silver, measuring 8-10 μm in thickness on bracket surfaces. Silver coating led to higher frictional forces in all the three types of arch wires, which was statistically significant in 0.019 × 0.025-in SS and 0.018-in Ni-Ti, but it did not change the shear bond strength significantly. Silver coating with electroplating method did not affect the bond strength of the bracket to enamel; in addition, it was not an effective method for decreasing friction in sliding mechanics. © Wiley Periodicals, Inc.

Composite Bus Structure for the SMEX/WIRE Satellite

NASA Technical Reports Server (NTRS)

Rosanova, Giulio G.

1998-01-01

In an effort to reduce the weight and optimize the structural design of the Small Explorer (SMEX) Wide-Field Infrared Explorer (WIRE) spacecraft, it has become desirable to change the material and construction from mechanically fastened aluminum structure to a fully bonded fiber-reinforced composite (FRC) structure. GSFC has developed the WIRE spacecraft structural bus design concept, including the instrument and launch vehicle requirements. The WIRE Satellite is the fifth of a series of SMEX satellites to be launched once per year. GSFC has chosen Composite Optics Inc. (COI) as the prime contractor for the development and procurement of the WIRE composite structure. The detailed design of the fully bonded FRC structure is based on COI's Short Notice Accelerated Production SATellite ("SNAPSAT") approach. SNAPSAT is a state of the art design and manufacturing technology for advanced composite materials which utilizes flat-stock detail parts bonded together to produce a final structural assembly. The structural design approach adopted for the WIRE structure provides a very viable alternative to both traditional aluminum construction as well as high tech. molded type composite structures. This approach to composite structure design is much less costly than molded or honeycomb sandwich type composite construction, but may cost slightly more than conventional aluminum construction on the subsystem level. However on the overall program level the weight saving achieved is very cost effective, since the primary objective is to allocate more mass for science payloads.

Manufacturing Methods & Technology Project Execution Report. First CY 83.

DTIC Science & Technology

1983-11-01

UCCURRENCE. H 83 5180 MMT FOR METAL DEWAR AND UNBONDED LEADS THE GOLD WIRE BONDED CONNECTIOkS ARE MADE BY HAND WHICH IS A TEDIOUS AND EXPENSIVE PROCESS. THE...ATTACHMENTS CURRENT FILAMENT WOUND COMPOSIIE ROCKET MOTOR CASES REQUIRE FORGED METAL POLE PIECESt NOZZLE CLOSURE ATTACHMENT RINGS, AND OTHER ATTACHMENT RINGS... ELASTOMER INSULATOR PROCESS LARGE TACTICAL ROCKET MOTOR INSULATORS ARE COSTLY, LACK DESIGN CHANGE FLEXIBILITY AND SUFFER LONG LEAD TIMES. CURRENT

[Individual indirect bonding technique (IIBT) using set-up model].

PubMed

Kyung, H M

1989-01-01

There has been much progress in Edgewise Appliance since E.H. Angle. One of the most important procedures in edgewise appliance is correct bracket position. Not only conventional edgewise appliance but also straight wire appliance & lingual appliance cannot be used more effectively unless the bracket position is accurate. Improper bracket positioning may reveal much problems during treatment, especially in finishing state. It may require either rebonding after the removal of the malpositioned bracket or the greater number of arch wire and the more complex wire bending, causing much difficulty in performing effective treatments. This made me invent Individual Indirect Bonding Technique with the use of multi-purpose set-up model in order to determine a correct and objective bracket position according to individual patients. This technique is more accurate than former indirect bonding techniques in bracket positioning, because it decides the bracket position on a set-up model which has produced to have the occlusal relationship the clinician desired. This technique is especially effective in straight wire appliance and lingual appliance in which the correct bracket positioning is indispensible.

Customized Hermetic Feedthrough Developed to Isolate Fluids

NASA Technical Reports Server (NTRS)

Meredith, Roger D.

1999-01-01

A common problem occurs when refrigerant fluids wick inside the insulation of thermocouple wires through a compressor's casing feedthrough and then leak into the adjacent disconnect box outside the casing. Leaking fluids create an unfavorable situation inside the disconnect box and may contaminate the fluids. To address this problem, NASA Lewis Research Center s Manufacturing Engineering Division developed a customized hermetic feedthrough for a bank of Worthington compressors. In these compressors, bearing temperatures are measured by internal thermocouples embedded in bearings located inside the compressor casings. The thermocouple wires need to be routed outside the casing and read at another location. These wires are short and are terminated to a disconnect strip inside the casing. The bearings operate at about 170 F, but because the casing is filled with R12 refrigerant oil, the casing has a maximum temperature of about 100 F. The operating conditions of these compressors permit the use of an epoxy that is compatible with the R12 fluid. The desired finished product is a stainless steel tube that has been filled solid with epoxy after thermocouple wires bonded and sealed by epoxy have been inserted through its length. Shrink tubing extends from both ends of the tube. The process that was developed to isolate the thermocouple wires from the R12 fluid follows. For this application, use an 8-in.-long piece of 0.500-in. 304 stainless steel tube with six pairs of 24-gauge stranded, PTFE-insulated (polytetrafluoroethylene) type "T" thermocouple wires for each feedthrough. Use shrink tubing to strain relief the insulated wires at their exit from the stainless steel tube. Cut the wire to length and identify the location of the stainless steel tube sleeve with masking tape. Then, remove the outer insulation from a 2-in. section of wire that will be inside the tube, and carefully strip to bare wire a 1-in. section in the middle of the section with the outer insulation removed. For an effective seal, the epoxy must penetrate between the strands when stranded conductors are used. Make the seal with epoxy bond on the bare wire. The bare wire must be encapsulated with a thin layer of the epoxy that leaves only a very low profile. These encapsulated wires must cure before the assembly can be continued. Then, inspect the cured wires for complete encapsulation before going to the next step. Insert the wires in the stainless steel tube and orient them so that the epoxied stripped sections are staggered within the tube; then, apply shrink tubing to one end of the cleaned wires, positioning it inside the edge of the tube. The small gaps between the wires on the other end will be used to inject the epoxy into the tube. Let the epoxy cure inside the tube, free of any voids. Then, continue to fill the tube until the entire 8-in. length is nearly filled, allowing room for the other strain-relieving shrink tubing. Since this first design, the process has been adjusted to fit many needs and situations. Customized feedthroughs have been assembled from various wire types, wire gauges, and/or stainless steel tube passages. The fittings selected to mount these feedthroughs allow their use in other areas, such as pressure or vacuum systems.

Microstructure and Properties of Lap Joint Between Aluminum Alloy and Galvanized Steel by CMT

NASA Astrophysics Data System (ADS)

Niu, Song; Chen, Su; Dong, Honggang; Zhao, Dongsheng; Zhang, Xiaosheng; Guo, Xin; Wang, Guoqiang

2016-05-01

Lap joining of 1-mm-thick Novelist AC 170 PX aluminum alloy to 1.2-mm-thick ST06 Z galvanized steel sheets for automotive applications was conducted by cold metal transfer advanced welding process with ER4043 and ER4047 filler wires. Under the optimized welding parameters with ER4043 filler wire, the tensile shear strength of joint was 189 MPa, reaching 89% of the aluminum alloy base metal. Microstructure and elemental distribution were characterized by optical metalloscope and electron probe microanalysis. The lap joints with ER4043 filler wire had smaller wetting angle and longer bonded line length with better wettability than with ER4047 filler wire during welding with same parameters. The needle-like Al-Fe-Si intermetallic compounds (IMCs) were spalled into the weld and brought negative effect to the tensile strength of joints. With increasing welding current, the needle-like IMCs grew longer and spread further into the weld, which would deteriorate the tensile shear strength.

An Alternative Cu-Based Bond Layer for Electric Arc Coating Process

NASA Astrophysics Data System (ADS)

Fadragas, Carlos R.; Morales, E. V.; Muñoz, J. A.; Bott, I. S.; Lariot Sánchez, C. A.

2011-12-01

A Cu-Al alloy has been used as bond coat between a carbon steel substrate and a final coating deposit obtained by applying the twin wire electric arc spraying coating technique. The presence of a copper-based material in the composite system can change the overall temperature profile during deposition because copper exhibits a thermal conductivity several times higher than that of the normally recommended bond coat materials (such as nickel-aluminum alloys or nickel-chromium alloys). The microstructures of 420 and 304 stainless steels deposited by the electric arc spray process have been investigated, focusing attention on the deposit homogeneity, porosity, lamellar structure, and microhardness. The nature of the local temperature gradient during deposition can strongly influence the formation of the final coating deposit. This study presents a preliminary study, undertaken to investigate the changes in the temperature profile which occur when a Cu-Al alloy is used as bond coat, and the possible consequences of these changes on the microstructure and adhesion of the final coating deposit. The influence of the thickness of the bond layer on the top coating temperature has also been also evaluated.

Processing and characterization of phase boundaries in ceramic and metallic materials

NASA Astrophysics Data System (ADS)

Zeng, Liang

The goal of this dissertation work was to explore and describe advanced characterization of novel materials processing. These characterizations were carried out using scanning and transmission electron microscopy (SEM and TEM), and X-ray diffraction techniques. The materials studied included ceramics and metallic materials. The first part of this dissertation focuses on the processing, and the resulting interfacial microstructure of ceramics joined using spin-on interlayers. SEM, TEM, and indentation tests were used to investigate the interfacial microstructural and mechanical property evolution of polycrystalline zirconia bonded to glass ceramic MaCor(TM), and polycrystalline alumina to single crystal alumina. Interlayer assisted specimens were joined using a thin amorphous silica interlayer. This interlayer was produced by spin coating an organic based silica bond material precursor and curing at 200°C, followed by joining in a microwave cavity or conventional electric furnace. Experimental results indicate that in the joining of the zirconia and MaCor(TM) no significant interfacial microstructural and mechanical property differences developed between materials joined either with or without interlayers, due to the glassy nature of MaCor(TM). The bond interface was non-planar, as a result of the strong wetting of MaCor(TM) and silica and dissolution of the zirconia. However, without the aid of a silica interlayer, sapphire and 98% polycrystalline alumina failed to join under the experimental conditions under this study. A variety of interfacial morphologies have been observed, including amorphous regions, fine crystalline alumina, and intimate contact between the sapphire and polycrystalline alumina. In addition, the evolution of the joining process from the initial sputter-cure to the final joining state and joining mechanisms were characterized. The second part of this dissertation focused on the effects of working and heat treatment on microstructure, texture, phase boundary movement, and mechanical property evolution in Ti-6Al-4V wire. The as-received wire consisted of equilibrium a and metastable beta phases and had a moderately strong fiber texture with prism plane normals aligned with the wire axis. The wire was worked by extrusion, solution heat-treatment and water quenching, and aging. The extrusion process strengthened the as-received texture. After solutionization and quenching, microstrucual observations showed the presence of many needlelike martensitic platelets in the prior beta phase regions. Texture analysis revealed that a secondary fiber with basal plane normals aligned with the wire axis emerged at the expense of the initial texture, indicating that highly preferred phase boundary motion (variant selection) occurred during the beta → alpha transformation. The strength of the variant selection consistently increased with solutionization temperature and time. In addition, the effects of dislocation type and density on variant selections were further investigated. This implies that strategic prior deformation and heat treatment can be exploited to design the resulting texture and microstructure and consequently optimize the properties of titanium products.

Stainless hooks to bond lower lingual retainer.

PubMed

Durgekar, Sujala G; Nagaraj, K

2011-01-01

We introduced a simple and economical technique for precise placement of lower lingual retainers. Two stainless steel hooks made of 0.6mm wire are placed interdentally in the embrasure area between canine and lateral incisor bilaterally to lock the retainer wire in the correct position. Etch, rinse and dry the enamel surfaces with the retainer passively in place, then bond the retainer with light-cured adhesive. Hooks are simple to fabricate and eliminate the need for a transfer tray.

The effect of prior sandblasting of the wire on the shear bond strength of two different types of lingual retainers.

PubMed

Kilinç, Delal Dara; Sayar, Gülşilay

2018-04-07

The aim of this study was to evaluate the effect of total surface sandblasting on the shear bond strength of two different retainer wires. The null hypothesis was that there is no difference in the bond strength of the two types of lingual retainer wires when they are sandblasted. One hundred and sixty human premolar teeth were equally divided into four groups (n=40). A pair of teeth was embedded in self-curing acrylic resin and polished. Retainer wires were applied on the etched and rinsed surfaces of the teeth. Four retainers were used: group 1: braided retainer (0.010×0.028″, Ortho Technology); group 2: sandblasted braided retainer (0.010×0.028″, Ortho Technology); group 3: coaxial retainer (0.0215″ Coaxial, 3M) and group 4: sandblasted coaxial retainer (0.0215″ Coaxial, 3M). The specimens were tested using a universal test machine in shear mode with a crosshead speed of one mm/min. One-way analysis of variance (Anova) was used to determine the significant differences among the groups. There was no significant difference (P=0.117) among the groups according to this test. The null hypothesis was accepted. There was no statistically significant difference among the shear bond strength values of the four groups. Copyright © 2018 CEO. Published by Elsevier Masson SAS. All rights reserved.

High-speed receiver based on waveguide germanium photodetector wire-bonded to 90nm SOI CMOS amplifier.

PubMed

Pan, Huapu; Assefa, Solomon; Green, William M J; Kuchta, Daniel M; Schow, Clint L; Rylyakov, Alexander V; Lee, Benjamin G; Baks, Christian W; Shank, Steven M; Vlasov, Yurii A

2012-07-30

The performance of a receiver based on a CMOS amplifier circuit designed with 90nm ground rules wire-bonded to a waveguide germanium photodetector is characterized at data rates up to 40Gbps. Both chips were fabricated through the IBM Silicon CMOS Integrated Nanophotonics process on specialty photonics-enabled SOI wafers. At the data rate of 28Gbps which is relevant to the new generation of optical interconnects, a sensitivity of -7.3dBm average optical power is demonstrated with 3.4pJ/bit power-efficiency and 0.6UI horizontal eye opening at a bit-error-rate of 10(-12). The receiver operates error-free (bit-error-rate < 10(-12)) up to 40Gbps with optimized power supply settings demonstrating an energy efficiency of 1.4pJ/bit and 4pJ/bit at data rates of 32Gbps and 40Gbps, respectively, with an average optical power of -0.8dBm.

HTS thin films: Passive microwave components and systems integration issues

DOE Office of Scientific and Technical Information (OSTI.GOV)

Miranda, F.A.; Chorey, C.M.; Bhasin, K.B.

1994-12-31

The excellent microwave properties of the High-Temperature-Superconductors (HTS) have been amply demonstrated in the laboratory by techniques such as resonant cavity, power transmission and microstrip resonator measurements. The low loss and high Q passive structures made possible with HTS, present attractive options for applications in commercial, military and space-based systems. However, to readily insert HTS into these systems improvement is needed in such areas as repeatability in the deposition and processing of the HTS films, metal-contact formation, wire bonding, and overall film endurance to fabrication and assembly procedures. In this paper we present data compiled in our lab which illustratemore » many of the problems associated with these issues. Much of this data were obtained in the production of a space qualified hybrid receiver-downconverter module for the Naval Research Laboratory`s High Temperature Superconductivity Space Experiment II (HTSSE-II). Examples of variations observed in starting films and finished circuits will be presented. It is shown that under identical processing the properties of the HTS films can degrade to varying extents. Finally, we present data on ohmic contacts and factors affecting their adhesion to HTS films, strength of wire bonds made to such contacts, and aging effects.« less

HTS thin films: Passive microwave components and systems integration issues

NASA Technical Reports Server (NTRS)

Miranda, F. A.; Chorey, C. M.; Bhasin, K. B.

1995-01-01

The excellent microwave properties of the High-Temperature-Superconductors (HTS) have been amply demonstrated in the laboratory by techniques such as resonant cavity, power transmission and microstrip resonator measurements. The low loss and high Q passive structures made possible with HTS, present attractive options for applications in commercial, military and spacebased systems. However, to readily insert HTS into these systems improvement is needed in such areas as repeatability in the deposition and processing of the HTS films, metal-contact formation, wire bonding, and overall film endurance to fabrication and assembly procedures. In this paper we present data compiled in our lab which illustrate many of the problems associated with these issues. Much of this data were obtained in the production of a space qualified hybrid receiver-downconverter module for the Naval Research Laboratory's High Temperature Superconductivity Space Experiment 2 (HTSSE-2). Examples of variations observed in starting films and finished circuits will be presented. It is shown that under identical processing the properties of the HTS films can degrade to varying extents. Finally, we present data on ohmic contacts and factors affecting their adhesion to HTS films, strength of wire bonds made to such contacts, and aging effects.

Attaching Copper Wires to Magnetic-Reed-Switch Leads

NASA Technical Reports Server (NTRS)

Kamila, Rudolf

1987-01-01

Bonding method reliably joins copper wires to short iron-alloy leads from glass-encased dry magnetic-reed switch without disturbing integrity of glass-to-metal seal. Joint resistant to high temperatures and has low electrical resistance.

Universal behavior of surface-dangling bonds in hydrogen-terminated Si, Ge, and Si/Ge nanowires.

NASA Astrophysics Data System (ADS)

Nunes, Ricardo; Kagimura, Ricardo; Chacham, Hélio

2007-03-01

We report an ab initio study of the electronic properties of surface dangling bond (SDB) states in hydrogen-terminated Si, Ge, and Si/Ge nanowires with diameters between 1 and 2 nm. We find that the charge transition levels ɛ(+/-) of SDB states are deep in the bandgap for Si wires, and shallow (near the valence band edge) for Ge wires. In both Si and Ge wires, the SDB states are localized. We also find that the SDB ɛ(+/-) levels behave as a ``universal" energy reference level among Si, Ge, and Si/Ge wires within a precision of 0.1 eV. By computing the average bewteen the electron affinity and ionization energy in the atomi limit of several atoms from the III, IV and V columns, we conjecture that the universality is a periodic-table atomic property.

Measured opening characteristics of an electromagnetically opened diaphragm for the Langley expansion tunnel

NASA Technical Reports Server (NTRS)

Moore, J. A.

1976-01-01

Results from an experimental study of the opening characteristics of an electromagnetically opened, 15.24 cm diameter diaphragm are presented. This diaphragm consists of a polyester film bonded to a preformed wire and is opened by passing a current pulse (capacitor discharge) through the wire. The diaphragm separates the acceleration section of the expansion tunnel from the nozzle so that the nozzle may be at a lower pressure than the acceleration section prior to a test. Opening times and cleanness of the opened area were examined for dependence on diaphragm thickness, on wire diameter, on technique of bonding the wire to the diaphragm, and on voltage and energy level of the energy source. Time histories of the pitot pressure measured at the expansion-tunnel nozzle entrance location are presented for (1) no diaphragm, (2) a flow-opened diaphragm, and (3) an electromagnetically opened diaphragm.

Design, processing and testing of LSI arrays: Hybrid microelectronics task

NASA Technical Reports Server (NTRS)

Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.

1979-01-01

Mathematical cost factors were generated for both hybrid microcircuit and printed wiring board packaging methods. A mathematical cost model was created for analysis of microcircuit fabrication costs. The costing factors were refined and reduced to formulae for computerization. Efficient methods were investigated for low cost packaging of LSI devices as a function of density and reliability. Technical problem areas such as wafer bumping, inner/outer leading bonding, testing on tape, and tape processing, were investigated.

ZnO nanorod arrays and direct wire bonding on GaN surfaces for rapid fabrication of antireflective, high-temperature ultraviolet sensors

NASA Astrophysics Data System (ADS)

So, Hongyun; Senesky, Debbie G.

2016-11-01

Rapid, cost-effective, and simple fabrication/packaging of microscale gallium nitride (GaN) ultraviolet (UV) sensors are demonstrated using zinc oxide nanorod arrays (ZnO NRAs) as an antireflective layer and direct bonding of aluminum wires to the GaN surface. The presence of the ZnO NRAs on the GaN surface significantly reduced the reflectance to less than 1% in the UV and 4% in the visible light region. As a result, the devices fabricated with ZnO NRAs and mechanically stable aluminum bonding wires (pull strength of 3-5 gf) showed higher sensitivity (136.3% at room temperature and 148.2% increase at 250 °C) when compared with devices with bare (uncoated) GaN surfaces. In addition, the devices demonstrated reliable operation at high temperatures up to 300 °C, supporting the feasibility of simple and cost-effective UV sensors operating with higher sensitivity in high-temperature conditions, such as in combustion, downhole, and space exploration applications.

Flowable composites for bonding orthodontic retainers.

PubMed

Tabrizi, Sama; Salemis, Elio; Usumez, Serdar

2010-01-01

To test the null hypothesis that there are no statistically significant differences between flowables and an orthodontic adhesive tested in terms of shear bond strength (SBS) and pullout resistance. To test the SBS of Light Bond, FlowTain, Filtek Supreme, and Tetric Flow were applied to the enamel surfaces of 15 teeth. Using matrices for application, each composite material was cured for 40 seconds and subjected to SBS testing. To test pullout resistance, 15 samples were prepared for each composite in which a wire was embedded; then the composite was cured for 40 seconds. Later, the ends of the wire were drawn up and tensile stress was applied until the resin failed. Findings were analyzed using an ANOVA and a Tukey HSD test. The SBS values for Light Bond, FlowTain, Filtek Supreme, and Tetric Flow were 19.0 +/- 10.9, 14.7 +/- 9.3, 22.4 +/- 16.3, and 16.8 +/- 11.8 MPa, respectively, and mean pullout values were 42.2 +/- 13.0, 24.0 +/- 6.9, 26.3 +/- 9.4, and 33.8 +/- 18.0 N, respectively. No statistically significant differences were found among the groups in terms of SBS (P > .05). On the other hand, Light Bond yielded significantly higher pullout values compared with the flowables Filtek Supreme and Flow-Tain (P < .01). However, there were no significant differences among the pullout values of flowables, nor between Light Bond and Tetric Flow (P > .05). The hypothesis is rejected. Light Bond yielded significantly higher pullout values compared with the flowables Filtek Supreme and FlowTain. However, flowable composites provided satisfactory SBS and wire pullout values, comparable to a standard orthodontic resin, and therefore can be used as an alternative for direct bonding of lingual retainers.

Structural Properties of Single-Strand Orthodontic Wires from a Proposed Alternative Standard Flexure Test.

DTIC Science & Technology

1984-01-01

structural system the orthodontic appliance consists intraorally of bands or bonded pads and the attached brackets , the arch wires, the ligatures, and any...RD-Ali5B 994 STRUCTURAL PROPERTIES OF SINGLE-STRAND ORTHODONTIC i/i WIRES FROM A PROPOSED__(U) AIR FORCE INST OF TECH WRIGHT-PATTERSON RFB OH M L... Orthodontic Wires From A Proposed Alternative - Standard Flexure Test 6. PERPOMING o1. REPORT NUMBER AUTNOR(e) I. CONTRACT O& GRANT NUMUER(a) Marion L

High resolution structural characterisation of laser-induced defect clusters inside diamond

NASA Astrophysics Data System (ADS)

Salter, Patrick S.; Booth, Martin J.; Courvoisier, Arnaud; Moran, David A. J.; MacLaren, Donald A.

2017-08-01

Laser writing with ultrashort pulses provides a potential route for the manufacture of three-dimensional wires, waveguides, and defects within diamond. We present a transmission electron microscopy study of the intrinsic structure of the laser modifications and reveal a complex distribution of defects. Electron energy loss spectroscopy indicates that the majority of the irradiated region remains as sp3 bonded diamond. Electrically conductive paths are attributed to the formation of multiple nano-scale, sp2-bonded graphitic wires and a network of strain-relieving micro-cracks.

Raman spectroscopy as a tool to investigate the structure and electronic properties of carbon-atom wires

PubMed Central

Milani, Alberto; Tommasini, Matteo; Russo, Valeria; Li Bassi, Andrea; Lucotti, Andrea; Cataldo, Franco

2015-01-01

Summary Graphene, nanotubes and other carbon nanostructures have shown potential as candidates for advanced technological applications due to the different coordination of carbon atoms and to the possibility of π-conjugation. In this context, atomic-scale wires comprised of sp-hybridized carbon atoms represent ideal 1D systems to potentially downscale devices to the atomic level. Carbon-atom wires (CAWs) can be arranged in two possible structures: a sequence of double bonds (cumulenes), resulting in a 1D metal, or an alternating sequence of single–triple bonds (polyynes), expected to show semiconducting properties. The electronic and optical properties of CAWs can be finely tuned by controlling the wire length (i.e., the number of carbon atoms) and the type of termination (e.g., atom, molecular group or nanostructure). Although linear, sp-hybridized carbon systems are still considered elusive and unstable materials, a number of nanostructures consisting of sp-carbon wires have been produced and characterized to date. In this short review, we present the main CAW synthesis techniques and stabilization strategies and we discuss the current status of the understanding of their structural, electronic and vibrational properties with particular attention to how these properties are related to one another. We focus on the use of vibrational spectroscopy to provide information on the structural and electronic properties of the system (e.g., determination of wire length). Moreover, by employing Raman spectroscopy and surface enhanced Raman scattering in combination with the support of first principles calculations, we show that a detailed understanding of the charge transfer between CAWs and metal nanoparticles may open the possibility to tune the electronic structure from alternating to equalized bonds. PMID:25821689

Magnetism in Mn-nanowires and -clusters as δ-doped layers in group IV semiconductors (Si, Ge)

NASA Astrophysics Data System (ADS)

Simov, K. R.; Glans, P.-A.; Jenkins, C. A.; Liberati, M.; Reinke, P.

2018-01-01

Mn doping of group-IV semiconductors (Si/Ge) is achieved by embedding nanostructured Mn-layers in group-IV matrix. The Mn-nanostructures are monoatomic Mn-wires or Mn-clusters and capped with an amorphous Si or Ge layer. The precise fabrication of δ-doped Mn-layers is combined with element-specific detection of the magnetic signature with x-ray magnetic circular dichroism. The largest moment (2.5 μB/Mn) is measured for Mn-wires with ionic bonding character and a-Ge overlayer cap; a-Si capping reduces the moment due to variations of bonding in agreement with theoretical predictions. The moments in δ-doped layers dominated by clusters is quenched with an antiferromagnetic component from Mn-Mn bonding.

Superconducting Multilayer High-Density Flexible Printed Circuit Board for Very High Thermal Resistance Interconnections

NASA Astrophysics Data System (ADS)

de la Broïse, Xavier; Le Coguie, Alain; Sauvageot, Jean-Luc; Pigot, Claude; Coppolani, Xavier; Moreau, Vincent; d'Hollosy, Samuel; Knarosovski, Timur; Engel, Andreas

2018-05-01

We have successively developed two superconducting flexible PCBs for cryogenic applications. The first one is monolayer, includes 552 tracks (10 µm wide, 20 µm spacing), and receives 24 wire-bonded integrated circuits. The second one is multilayer, with one track layer between two shielding layers interconnected by microvias, includes 37 tracks, and can be interconnected at both ends by wire bonding or by connectors. The first cold measurements have been performed and show good performances. The novelty of these products is, for the first one, the association of superconducting materials with very narrow pitch and bonded integrated circuits and, for the second one, the introduction of a superconducting multilayer structure interconnected by vias which is, to our knowledge, a world-first.

Length-dependent structural stability of linear monatomic Cu wires

NASA Astrophysics Data System (ADS)

Singh, Gurvinder; Kumar, Krishan; Singh, Baljinder; Moudgil, R. K.

2018-05-01

We present first-principle calculations based on density functional theory for the finite-length monatomic Cu atom linear wires. The structure and its stability with increasing wire length in terms of number of atoms (N) is determined. Interestingly, the bond length is found to exhibit an oscillatory structure (the so-called magic length phenomenon), with a qualitative change in oscillatory behavior as one moves from even N wire to odd N wire. The even N wires follow simple even-odd oscillations whereas odd N wires show a phase change at the half length of the wires. The stability of the wire structure, determined in terms of the wire formation energy, also contains even-odd oscillation as a function of wire length. However, the oscillations in formation energy reverse its phase after the wire length is increased beyond N=12. Our findings are seen to be qualitatively consistent with recent simulations for a similar class finite-length metal atom wires.

Lingual straight wire method.

PubMed

Takemoto, Kyoto; Scuzzo, Giuseppe; Lombardo, L U C A; Takemoto, Y U I

2009-12-01

The mushroom arch-wire is mainly used in lingual orthodontic treatment but the complicated wire bending it requires affects both the treatment results and the time spent at the chair. The author proposes a new lingual straight wire method (LSW) in order to facilitate arch coordination and simplify the mechanics. The attention paid to the set-up model and bracket positioning and bonding plus the use of the new LSW method will also improve patient comfort. Copyright 2009 Collège Européen d'Orthodontie. Published by Elsevier Masson SAS.. All rights reserved.

Microstructural evolution and micromechanical properties of gamma-irradiated Au ball bonds

DOE Office of Scientific and Technical Information (OSTI.GOV)

Yusoff, Wan Yusmawati Wan, E-mail: yusmawati@upnm.edu.my; Ismail, Roslina, E-mail: roslina.ismail@ukm.my; Jalar, Azman, E-mail: azmn@ukm.my

2014-07-01

The effect of gamma radiation on the mechanical and structural properties of gold ball bonds was investigated. Gold wires from thermosonic wire bonding were exposed to gamma rays from a Cobalt-60 source at a low dose (5 Gy). The load–depth curve of nanoindentation for the irradiated gold wire bond has an apparent staircase shape during loading compared to the as-received sample. The hardness of the specimens calculated from the nanoindentation shows an increase in value from 0.91 to 1.09 GPa for specimens after exposure. The reduced elastic modulus for irradiated specimens significantly increased as well, with values from 75.18 tomore » 98.55 GPa. The change in intrinsic properties due to gamma radiation was investigated using dual-focused ion beam and high-resolution transmission electron microscope analysis. The dual-focused ion beam and high-resolution transmission electron microscope images confirmed the changes in grain structure and the presence of dislocations. The scanning electron microscope micrographs of focused ion beam cross sections showed that the grain structure of the gold became elongated and smaller after exposure to gamma rays. Meanwhile, high-resolution transmission electron microscopy provided evidence that gamma radiation induced dislocation of the atomic arrangement. - Highlights: • Nanoindentation technique provides a detailed characterisation of Au ball bond. • P–h curve of irradiated Au ball bond shows an apparent pop-in event. • Hardness and reduced modulus increased after exposure. • Elongated and smaller grain structure in irradiated specimens • Prevalent presence of dislocations in the atomic arrangement.« less

Iridium Interfacial Stack - IrIS

NASA Technical Reports Server (NTRS)

Spry, David

2012-01-01

Iridium Interfacial Stack (IrIS) is the sputter deposition of high-purity tantalum silicide (TaSi2-400 nm)/platinum (Pt-200 nm)/iridium (Ir-200 nm)/platinum (Pt-200 nm) in an ultra-high vacuum system followed by a 600 C anneal in nitrogen for 30 minutes. IrIS simultaneously acts as both a bond metal and a diffusion barrier. This bondable metallization that also acts as a diffusion barrier can prevent oxygen from air and gold from the wire-bond from infiltrating silicon carbide (SiC) monolithically integrated circuits (ICs) operating above 500 C in air for over 1,000 hours. This TaSi2/Pt/Ir/Pt metallization is easily bonded for electrical connection to off-chip circuitry and does not require extra anneals or masking steps. There are two ways that IrIS can be used in SiC ICs for applications above 500 C: it can be put directly on a SiC ohmic contact metal, such as Ti, or be used as a bond metal residing on top of an interconnect metal. For simplicity, only the use as a bond metal is discussed. The layer thickness ratio of TaSi2 to the first Pt layer deposited thereon should be 2:1. This will allow Si from the TaSi2 to react with the Pt to form Pt2Si during the 600 C anneal carried out after all layers have been deposited. The Ir layer does not readily form a silicide at 600 C, and thereby prevents the Si from migrating into the top-most Pt layer during future anneals and high-temperature IC operation. The second (i.e., top-most) deposited Pt layer needs to be about 200 nm to enable easy wire bonding. The thickness of 200 nm for Ir was chosen for initial experiments; further optimization of the Ir layer thickness may be possible via further experimentation. Ir itself is not easily wire-bonded because of its hardness and much higher melting point than Pt. Below the iridium layer, the TaSi2 and Pt react and form desired Pt2Si during the post-deposition anneal while above the iridium layer remains pure Pt as desired to facilitate easy and strong wire-bonding to the SiC chip circuitry.

Advanced Process Possibilities in Friction Crush Welding of Aluminum, Steel, and Copper by Using an Additional Wire

NASA Astrophysics Data System (ADS)

Besler, Florian A.; Grant, Richard J.; Schindele, Paul; Stegmüller, Michael J. R.

2017-12-01

Joining sheet metal can be problematic using traditional friction welding techniques. Friction crush welding (FCW) offers a high speed process which requires a simple edge preparation and can be applied to out-of-plane geometries. In this work, an implementation of FCW was employed using an additional wire to weld sheets of EN AW5754 H22, DC01, and Cu-DHP. The joint is formed by bringing together two sheet metal parts, introducing a wire into the weld zone and employing a rotating disk which is subject to an external force. The requirements of the welding preparation and the fundamental process variables are shown. Thermal measurements were taken which give evidence about the maximum temperature in the welding center and the temperature in the periphery of the sheet metals being joined. The high welding speed along with a relatively low heat input results in a minimal distortion of the sheet metal and marginal metallurgical changes in the parent material. In the steel specimens, this FCW implementation produces a fine grain microstructure, enhancing mechanical properties in the region of the weld. Aluminum and copper produced mean bond strengths of 77 and 69 pct to that of the parent material, respectively, whilst the steel demonstrated a strength of 98 pct. Using a wire offers the opportunity to use a higher-alloyed additional material and to precisely adjust the additional material volume appropriate for a given material alignment and thickness.

Hydrated Excess Protons Can Create Their Own Water Wires.

PubMed

Peng, Yuxing; Swanson, Jessica M J; Kang, Seung-gu; Zhou, Ruhong; Voth, Gregory A

2015-07-23

Grotthuss shuttling of an excess proton charge defect through hydrogen bonded water networks has long been the focus of theoretical and experimental studies. In this work we show that there is a related process in which water molecules move ("shuttle") through a hydrated excess proton charge defect in order to wet the path ahead for subsequent proton charge migration. This process is illustrated through reactive molecular dynamics simulations of proton transport through a hydrophobic nanotube, which penetrates through a hydrophobic region. Surprisingly, before the proton enters the nanotube, it starts "shooting" water molecules into the otherwise dry space via Grotthuss shuttling, effectively creating its own water wire where none existed before. As the proton enters the nanotube (by 2-3 Å), it completes the solvation process, transitioning the nanotube to the fully wet state. By contrast, other monatomic cations (e.g., K(+)) have just the opposite effect, by blocking the wetting process and making the nanotube even drier. As the dry nanotube gradually becomes wet when the proton charge defect enters it, the free energy barrier of proton permeation through the tube via Grotthuss shuttling drops significantly. This finding suggests that an important wetting mechanism may influence proton translocation in biological systems, i.e., one in which protons "create" their own water structures (water "wires") in hydrophobic spaces (e.g., protein pores) before migrating through them. An existing water wire, e.g., one seen in an X-ray crystal structure or MD simulations without an explicit excess proton, is therefore not a requirement for protons to transport through hydrophobic spaces.

Joining Tubes With Adhesive

NASA Technical Reports Server (NTRS)

Bateman, W. A.

1984-01-01

Cylindrical tubes joined together, end to end, by method employing adhesive, tapered ends, and spacing wires. Tapered joint between tubular structural elements provides pressure between bonding surfaces during adhesive curing. Spacing wires prevent adhesive from being scraped away when one element inserted in other. Method developed for assembling structural elements made of composite materials.

46 CFR 35.35-5 - Electrical bonding-TB/ALL.

Code of Federal Regulations, 2013 CFR

2013-10-01

... 46 Shipping 1 2013-10-01 2013-10-01 false Electrical bonding-TB/ALL. 35.35-5 Section 35.35-5 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY TANK VESSELS OPERATIONS Cargo Handling § 35.35-5 Electrical bonding—TB/ALL. The use of a vessel/shore bonding cable or wire is permissible only if...

46 CFR 35.35-5 - Electrical bonding-TB/ALL.

Code of Federal Regulations, 2014 CFR

2014-10-01

... 46 Shipping 1 2014-10-01 2014-10-01 false Electrical bonding-TB/ALL. 35.35-5 Section 35.35-5 Shipping COAST GUARD, DEPARTMENT OF HOMELAND SECURITY TANK VESSELS OPERATIONS Cargo Handling § 35.35-5 Electrical bonding—TB/ALL. The use of a vessel/shore bonding cable or wire is permissible only if...

One kilometer (1 km) electric solar wind sail tether produced automatically.

PubMed

Seppänen, Henri; Rauhala, Timo; Kiprich, Sergiy; Ukkonen, Jukka; Simonsson, Martin; Kurppa, Risto; Janhunen, Pekka; Hæggström, Edward

2013-09-01

We produced a 1 km continuous piece of multifilament electric solar wind sail tether of μm-diameter aluminum wires using a custom made automatic tether factory. The tether comprising 90,704 bonds between 25 and 50 μm diameter wires is reeled onto a metal reel. The total mass of 1 km tether is 10 g. We reached a production rate of 70 m/24 h and a quality level of 1‰ loose bonds and 2‰ rebonded ones. We thus demonstrated that production of long electric solar wind sail tethers is possible and practical.

Thermoelectric performance of various benzo-difuran wires

DOE Office of Scientific and Technical Information (OSTI.GOV)

Péterfalvi, Csaba G.; Grace, Iain; Manrique, Dávid Zs.

2014-05-07

Using a first principles approach to electron transport, we calculate the electrical and thermoelectrical transport properties of a series of molecular wires containing benzo-difuran subunits. We demonstrate that the side groups introduce Fano resonances, the energy of which is changing with the electronegativity of selected atoms in it. We also study the relative effect of single, double, or triple bonds along the molecular backbone and find that single bonds yield the highest thermopower, approximately 22 μV/K at room temperature, which is comparable with the highest measured values for single-molecule thermopower reported to date.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rodenbeck, Christopher T; Girardi, Michael

Internal nodes of a constituent integrated circuit (IC) package of a multichip module (MCM) are protected from excessive charge during plasma cleaning of the MCM. The protected nodes are coupled to an internal common node of the IC package by respectively associated discharge paths. The common node is connected to a bond pad of the IC package. During MCM assembly, and before plasma cleaning, this bond pad receives a wire bond to a ground bond pad on the MCM substrate.

Recrystallization texture in nickel heavily deformed by accumulative roll bonding

NASA Astrophysics Data System (ADS)

Mishin, O. V.; Zhang, Y. B.; Godfrey, A.

2017-07-01

The recrystallization behavior of Ni processed by accumulative roll bonding to a total accumulated von Mises strain of 4.8 has been examined, and analyzed with respect to heterogeneity in the deformation microstructure. The regions near the bonding interface are found to be more refined and contain particle deformation zones around fragments of the steel wire brush used to prepare the surface for bonding. Sample-scale gradients are also observed, manifested as differences between the subsurface, intermediate and central layers, where the distributions of texture components are different. These heterogeneities affect the progress of recrystallization. While the subsurface and near-interface regions typically contain lower frequencies of cube-oriented grains than anywhere else in the sample, a strong cube texture forms in the sample during recrystallization, attributed to both a high nucleation rate and fast growth rate of cube-oriented grains. The observations highlight the sensitivity of recrystallization to heterogeneity in the deformation microstructure and demonstrate the importance of characterizing this heterogeneity over several length scales.

Maxillary molar derotation and distalization by using a nickel-titanium wire fabricated on a setup model

PubMed Central

Jung, Jong Moon; Wi, Young Joo; Koo, Hyun Mo; Kim, Min Ji

2017-01-01

The purpose of this article is to introduce a simple appliance that uses a setup model and a nickel-titanium (Ni-Ti) wire for correcting the mesial rotation and drift of the permanent maxillary first molar. The technique involves bonding a Ni-Ti wire to the proper position of the target tooth on a setup model, followed by the fabrication of the transfer cap for indirect bonding and its transfer to the patient's teeth. This appliance causes less discomfort and provides better oral hygiene for the patients than do conventional appliances such as the bracket, pendulum, and distal jet. The treatment time is also shorter with the new appliance than with full-fixed appliances. Moreover, the applicability of the new appliance can be expanded to many cases by using screws or splinting with adjacent teeth to improve anchorage. PMID:28670568

Maxillary molar derotation and distalization by using a nickel-titanium wire fabricated on a setup model.

PubMed

Jung, Jong Moon; Wi, Young Joo; Koo, Hyun Mo; Kim, Min Ji; Chun, Youn Sic

2017-07-01

The purpose of this article is to introduce a simple appliance that uses a setup model and a nickel-titanium (Ni-Ti) wire for correcting the mesial rotation and drift of the permanent maxillary first molar. The technique involves bonding a Ni-Ti wire to the proper position of the target tooth on a setup model, followed by the fabrication of the transfer cap for indirect bonding and its transfer to the patient's teeth. This appliance causes less discomfort and provides better oral hygiene for the patients than do conventional appliances such as the bracket, pendulum, and distal jet. The treatment time is also shorter with the new appliance than with full-fixed appliances. Moreover, the applicability of the new appliance can be expanded to many cases by using screws or splinting with adjacent teeth to improve anchorage.

The role of oxide structure on copper wire to the rubber adhesion

NASA Astrophysics Data System (ADS)

Su, Yea-Yang; Shemenski, Robert M.

2000-07-01

Most metals have an oxide layer on the surface. However, the structure of the oxide varies with the matrix composition, and depends upon the environmental conditions. A bronze coating, nominal composition of 98.5% Cu and balance of Sn, is applied to steel wire for reinforcing pneumatic tire beads and to provide adhesion to rubber. This work studied the influence of copper oxides on the bronze coating on adhesion during vulcanization. To emphasize the oxide structures, electrolytic tough pitch (ETP) copper wire was used instead of the traditional bronze-coated tire bead wire. Experimental results confirmed the hypothesis that cuprous oxide (Cu 2O) could significantly improve bonding between copper wire and rubber, and demonstrated that the interaction between rubber and oxide layer on wire is an electrochemical reaction.

KSC-05pd2530

NASA Image and Video Library

2005-11-30

KENNEDY SPACE CENTER, FLA. - In Orbiter Processing Facility Bay 2, the nose cap of space shuttle Endeavour is prepared for installation of thermal protection system blankets. Endeavour recently came out of a nearly two-year Orbiter Major Modification period which began in December 2003. Engineers and technicians spent 900,000 hours performing 124 modifications to the vehicle. These included all recommended return-to-flight safety modifications, bonding more than 1,000 thermal protection system tiles and inspecting more than 150 miles of wiring throughout the orbiter. Shuttle major modification periods are scheduled at regular intervals to enhance safety and performance, infuse new technology, and allow for thorough inspections of the airframe and wiring of the vehicles. This was the second of these modification periods performed entirely at Kennedy Space Center. Endeavour's previous modification was completed in March 1997.

Investigation of Electrostatic Charge in Hose Lines

DTIC Science & Technology

2006-10-01

of the system. A INSULATORINSULATOR Ir1 Q Q dH vH A INSULATORINSULATOR Ir2 Q dm dl 2 vm LmLH S1 S2 S3EXTERNAL WIRE BRAID ON HOSE vl 2vm dm Lm dl...sizes of fuel hoses , including hoses with and without integrally bonded grounding wire braid ; (4) Different lengths of hose test sections; (5...Different earth grounding contact conditions along the hose test section, such as: (i) Complete insulation from the ground; (ii) Wire braid conductor along

KommonBase - A precise direct bonding system for labial fixed appliances.

PubMed

Miyashita, Wataru; Komori, Akira; Takemoto, Kyoto

2017-09-01

"KommonBase" is a system designed to customize the bracket base by means of an extended resin base covering the tooth. This system enables precise bracket placement and accurate fit on teeth. Moreover, KommonBase can be easily fabricated in a laboratory and bonded on each tooth using simple clinical procedures. Straight-wire treatment without wire bending was achieved in the clinical cases presented in this article using the KommonBase system for a labial fixed appliance. The application of KommonBase to the vestibular side enables efficient orthodontic treatment using simple mechanics. Copyright © 2017 CEO. Published by Elsevier Masson SAS. All rights reserved.

Three-dimensional quantification of pretorqued nickel-titanium wires in edgewise and prescription brackets.

PubMed

Mittal, Nitika; Xia, Zeyang; Chen, Jie; Stewart, Kelton T; Liu, Sean Shih-Yao

2013-05-01

To quantify the three-dimensional moments and forces produced by pretorqued nickel-titanium (NiTi) rectangular archwires fully engaged in 0.018- and 0.022-inch slots of central incisor and molar edgewise and prescription brackets. Ten identical acrylic dental models with retroclined maxillary incisors were fabricated for bonding with various bracket-wire combinations. Edgewise, Roth, and MBT brackets with 0.018- and 0.022-inch slots were bonded in a simulated 2 × 4 clinical scenario. The left central incisor and molar were sectioned and attached to load cells. Correspondingly sized straight and pretorqued NiTi archwires were ligated to the brackets using 0.010-inch ligatures. Each load cell simultaneously measured three force (Fx, Fy, Fz) and three moment (Mx, My, Mz) components. The faciolingual, mesiodistal, and inciso-occluso/apical axes of the teeth corresponded to the x, y, and z axes of the load cells, respectively. Each wire was removed and retested seven times. Three-way analysis of variance (ANOVA) examined the effects of wire type, wire size, and bracket type on the measured orthodontic load systems. Interactions among the three effects were examined and pair-wise comparisons between significant combinations were performed. The force and moment components on each tooth were quantified according to their local coordinate axes. The three-way ANOVA interaction terms were significant for all force and moment measurements (P < .05), except for Fy (P > .05). The pretorqued wire generates a significantly larger incisor facial crown torquing moment in the MBT prescription compared to Roth, edgewise, and the straight NiTi wire.

Sagittal and vertical load-deflection and permanent deformation of transpalatal arches connected with palatal implants: an in-vitro study.

PubMed

Crismani, Adriano G; Celar, Ales G; Burstone, Charles J; Bernhart, Thomas G; Bantleon, Hans-Peter; Mittlboeck, Martina

2007-06-01

The purposes of this laboratory investigation were to (1) measure the sagittal and vertical deflection of loaded transpalatal arches (TPAs) connected to a palatal implant, (2) measure the extent of permanent deformation of the connecting TPA in the sagittal and vertical directions, (3) test various wire dimensions in terms of deflection behavior, and (4) evaluate soldering vs laser welding vs adhesive bonding of TPAs in terms of load deflection behavior. Stainless steel wires of 6 dimensions were tested: 0.8 x 0.8, 0.9, 1, 1.1, 1.2, and 1.2 x 1.2 mm. For each dimension, 10 specimens were soldered to the palatal implant abutment, 10 were laser welded, and 10 were adhesively bonded to the implant abutment (total, 180 specimens). The measuring device applied increments of force of 50 cN, from 0 to 500 cN. Then the specimens were unloaded. The values were statistically described and analyzed with ANOVA and Wilcoxon rank sum tests. Absolute orthodontic anchorage without deformation of TPAs was not observed with the wire dimensions tested. To prevent loss of anchorage greater than 370 mum (sagittal deflection of 1.2 x 1.2 mm adhesively bonded TPA at 500 cN force level), wires thicker than 1.2 x 1.2 mm or cast anchorage elements must be considered for clinical practice. However, larger cross sections might cause more patient discomfort, and laboratory procedures increase costs.

75 FR 82337 - Airworthiness Directives; The Boeing Company Model 777-200, -300, and -300ER Series Airplanes

Federal Register 2010, 2011, 2012, 2013, 2014

2010-12-30

... hardware; and making certain wiring changes. This proposed AD was prompted by results from fuel system... a new P302 panel on the right side of the airplane, and changing the wiring; and performing certain bonding resistance measurements and reworking the airplane installation to verify that [[Page 82339...

Synthesis of one-dimensional metal-containing insulated molecular wire with versatile properties directed toward molecular electronics materials.

PubMed

Masai, Hiroshi; Terao, Jun; Seki, Shu; Nakashima, Shigeto; Kiguchi, Manabu; Okoshi, Kento; Fujihara, Tetsuaki; Tsuji, Yasushi

2014-02-05

We report, herein, the design, synthesis, and properties of new materials directed toward molecular electronics. A transition metal-containing insulated molecular wire was synthesized through the coordination polymerization of a Ru(II) porphyrin with an insulated bridging ligand of well-defined structure. The wire displayed not only high linearity and rigidity, but also high intramolecular charge mobility. Owing to the unique properties of the coordination bond, the interconversion between the monomer and polymer states was realized under a carbon monoxide atmosphere or UV irradiation. The results demonstrated a high potential of the metal-containing insulated molecular wire for applications in molecular electronics.

Tungsten wire/FeCrAlY matrix turbine blade fabrication study

NASA Technical Reports Server (NTRS)

Melnyk, P.; Fleck, J. N.

1979-01-01

The objective was to establish a viable FRS monotape technology base to fabricate a complex, advanced turbine blade. All elements of monotape fabrication were addressed. A new process for incorporation of the matrix, including bi-alloy matrices, was developed. Bonding, cleaning, cutting, sizing, and forming parameters were established. These monotapes were then used to fabricate a 48 ply solid JT9D-7F 1st stage turbine blade. Core technology was then developed and first a 12 ply and then a 7 ply shell hollow airfoil was fabricated. As the fabrication technology advanced, additional airfoils incorporated further elements of sophistication, by introducing in sequence bonded root blocks, cross-plying, bi-metallic matrix, tip cap, trailing edge slots, and impingement inserts.

A study of tape adhesive strength on endotracheal tubes.

PubMed

Fenje, N; Steward, D J

1988-03-01

A method of assessing the adhesive bond of tapes used to secure endotracheal (ET) tubes is described. Five kinds of tape and six different ET tubes including two silicone rubber, wire-reinforced tubes were tested. There are significant differences in the adhesive strength of different tapes, and in the adhesive bond formed by different ET tube materials. On the Portex clear ET tube, silk tape adhered best (p less than 0.001), followed by waterproof, cloth, dermiclear, and micropore tapes. Adhesive bonding by silk tape was significantly greater (p less than 0.001) for the three clear ET tubes (Portex clear, NCC clear, and Portex ivory) than for the Portex blue and the silicone rubber, wire-reinforced ET tubes. All tapes showed very poor or negligible adhesion to the Sheridan and Portex reinforced ET tubes. Adhesion to these tubes was greatly improved by wrapping them tightly with an "op site" dressing prior to applying tape.

TAB interconnects for space concentrator solar cell arrays

NASA Technical Reports Server (NTRS)

Avery, J.; Bauman, J. S.; Gallagher, P.; Yerkes, J. W.

1993-01-01

The Boeing Company has evaluated the use of Tape Automated Bonding (TAB) and Surface Mount Technology (SMT) for a highly reliable, low cost interconnect for concentrator solar cell arrays. TAB and SMT are currently used in the electronics industry for chip interconnects and printed circuit board assembly. TAB tape consists of sixty-four 3-mil/1-oz tin-plated copper leads on 8-mil centers. The leads are thermocompression gang bonded to GaAs concentrator solar cell with silver contacts. This bond, known as an Inner Lead Bond (ILB), allows for pretesting and sorting capability via nondestruct wire bond pull and flash testing. Destructive wire pull tests resulted in preferred mid-span failures. Improvements in fill factor were attributed to decreased contact resistance on TAB bonded cells. Preliminary thermal cycling and aging tests were shown excellent bond strength and metallurgical results. Auger scans of bond sites reveals an Ag-Cu-Tin composition. Improper bonds are identified through flash testing as a performance degradation. On going testing of cells are underway at Lewis Research Center. SMT techniques are utilized to excise and form TAB leads post ILB. The formed leads' shape isolates thermal mismatches between the cells and the flex circuit they are mounted on. TABed cells are picked and placed with a gantry x-y-z positioning system with pattern recognition. Adhesives are selected to avoid thermal expansion mismatch and promote thermal transfer to the flex circuit. TAB outer lead bonds are parallel gap welded (PGW) to the flex circuit to finish the concentrator solar cell subassembly.

Fabrication of tungsten wire reinforced nickel-base alloy composites

NASA Technical Reports Server (NTRS)

Brentnall, W. D.; Toth, I. J.

1974-01-01

Fabrication methods for tungsten fiber reinforced nickel-base superalloy composites were investigated. Three matrix alloys in pre-alloyed powder or rolled sheet form were evaluated in terms of fabricability into composite monotape and multi-ply forms. The utility of monotapes for fabricating more complex shapes was demonstrated. Preliminary 1093C (2000F) stress rupture tests indicated that efficient utilization of fiber strength was achieved in composites fabricated by diffusion bonding processes. The fabrication of thermal fatigue specimens is also described.

Procedures for precap visual inspection

NASA Technical Reports Server (NTRS)

1984-01-01

Screening procedures for the final precap visual inspection of microcircuits used in electronic system components are described as an aid in training personnel unfamiliar with microcircuits. Processing techniques used in industry for the manufacture of monolithic and hybrid components are presented and imperfections that may be encountered during this inspection are discussed. Problem areas such as scratches, voids, adhesions, and wire bonding are illustrated by photomicrographs. This guide can serve as an effective tool in training personnel to perform precap visual inspections efficiently and reliably.

KSC-05pd2533

NASA Image and Video Library

2005-11-30

KENNEDY SPACE CENTER, FLA. - In Orbiter Processing Facility Bay 2, United Space Alliance technician Michael Vanwart installs thermal protection system blankets in the nose cap of space shuttle Endeavour. Endeavour recently came out of a nearly two-year Orbiter Major Modification period which began in December 2003. Engineers and technicians spent 900,000 hours performing 124 modifications to the vehicle. These included all recommended return-to-flight safety modifications, bonding more than 1,000 thermal protection system tiles and inspecting more than 150 miles of wiring throughout the orbiter. Shuttle major modification periods are scheduled at regular intervals to enhance safety and performance, infuse new technology, and allow for thorough inspections of the airframe and wiring of the vehicles. This was the second of these modification periods performed entirely at Kennedy Space Center. Endeavour's previous modification was completed in March 1997.

KSC-05pd2531

NASA Image and Video Library

2005-11-30

KENNEDY SPACE CENTER, FLA. - In Orbiter Processing Facility bay 2, United Space Alliance technician Michael Vanwart prepares to install thermal protection system blankets in the nose cap of space shuttle Endeavour. Endeavour recently came out of a nearly two-year Orbiter Major Modification period which began in December 2003. Engineers and technicians spent 900,000 hours performing 124 modifications to the vehicle. These included all recommended return-to-flight safety modifications, bonding more than 1,000 thermal protection system tiles and inspecting more than 150 miles of wiring throughout the orbiter. Shuttle major modification periods are scheduled at regular intervals to enhance safety and performance, infuse new technology, and allow for thorough inspections of the airframe and wiring of the vehicles. This was the second of these modification periods performed entirely at Kennedy Space Center. Endeavour's previous modification was completed in March 1997.

KSC-05pd2532

NASA Image and Video Library

2005-11-30

KENNEDY SPACE CENTER, FLA. - In Orbiter Processing Facility Bay 2, United Space Alliance technician Michael Vanwart installs thermal protection system blankets in the nose cap of space shuttle Endeavour. Endeavour recently came out of a nearly two-year Orbiter Major Modification period which began in December 2003. Engineers and technicians spent 900,000 hours performing 124 modifications to the vehicle. These included all recommended return-to-flight safety modifications, bonding more than 1,000 thermal protection system tiles and inspecting more than 150 miles of wiring throughout the orbiter. Shuttle major modification periods are scheduled at regular intervals to enhance safety and performance, infuse new technology, and allow for thorough inspections of the airframe and wiring of the vehicles. This was the second of these modification periods performed entirely at Kennedy Space Center. Endeavour's previous modification was completed in March 1997.

Amplifier Module for 260-GHz Band Using Quartz Waveguide Transitions

NASA Technical Reports Server (NTRS)

Padmanabhan, Sharmila; Fung, King Man; Kangaslahti, Pekka P.; Peralta, Alejandro; Soria, Mary M.; Pukala, David M.; Sin, Seth; Samoska, Lorene A.; Sarkozy, Stephen; Lai, Richard

2012-01-01

Packaging of MMIC LNA (monolithic microwave integrated circuit low-noise amplifier) chips at frequencies over 200 GHz has always been problematic due to the high loss in the transition between the MMIC chip and the waveguide medium in which the chip will typically be used. In addition, above 200 GHz, wire-bond inductance between the LNA and the waveguide can severely limit the RF matching and bandwidth of the final waveguide amplifier module. This work resulted in the development of a low-loss quartz waveguide transition that includes a capacitive transmission line between the MMIC and the waveguide probe element. This capacitive transmission line tunes out the wirebond inductance (where the wire-bond is required to bond between the MMIC and the probe element). This inductance can severely limit the RF matching and bandwidth of the final waveguide amplifier module. The amplifier module consists of a quartz E-plane waveguide probe transition, a short capacitive tuning element, a short wire-bond to the MMIC, and the MMIC LNA. The output structure is similar, with a short wire-bond at the output of the MMIC, a quartz E-plane waveguide probe transition, and the output waveguide. The quartz probe element is made of 3-mil quartz, which is the thinnest commercially available material. The waveguide band used is WR4, from 170 to 260 GHz. This new transition and block design is an improvement over prior art because it provides for better RF matching, and will likely yield lower loss and better noise figure. The development of high-performance, low-noise amplifiers in the 180-to- 700-GHz range has applications for future earth science and planetary instruments with low power and volume, and astrophysics array instruments for molecular spectroscopy. This frequency band, while suitable for homeland security and commercial applications (such as millimeter-wave imaging, hidden weapons detection, crowd scanning, airport security, and communications), also has applications to future NASA missions. The Global Atmospheric Composition Mission (GACM) in the NRC Decadel Survey will need low-noise amplifiers with extremely low noise temperatures, either at room temperature or for cryogenic applications, for atmospheric remote sensing.

Infrared spectral marker bands characterizing a transient water wire inside a hydrophobic membrane protein.

PubMed

Wolf, Steffen; Freier, Erik; Cui, Qiang; Gerwert, Klaus

2014-12-14

Proton conduction along protein-bound "water wires" is an essential feature in membrane proteins. Here, we analyze in detail a transient water wire, which conducts protons via a hydrophobic barrier within a membrane protein to create a proton gradient. It is formed only for a millisecond out of three water molecules distributed at inactive positions in a polar environment in the ground state. The movement into a hydrophobic environment causes characteristic shifts of the water bands reflecting their different chemical properties. These band shifts are identified by time-resolved Fourier Transform Infrared difference spectroscopy and analyzed by biomolecular Quantum Mechanical/Molecular Mechanical simulations. A non-hydrogen bonded ("dangling") O-H stretching vibration band and a broad continuum absorbance caused by a combined vibration along the water wire are identified as characteristic marker bands of such water wires in a hydrophobic environment. The results provide a basic understanding of water wires in hydrophobic environments.

The Image Understanding Architecture Project

DTIC Science & Technology

1988-04-01

The error resulted in the frame being reduced in size and incorrectly bonded . The problem has been corrected and3 the design has been re-submitted...Promotional literature, Beaverton, OR, 1985. Nii, 1986] Nil, H.P., The Blackboard Model of Problem Solving and the Evolution of Blackboard...microns. This resulted in a reduction in pad sizes to two thirds of the minimum required for safe bonding . All chips had many wire bonds on the die

The rectenna design on contact lens for wireless powering of the active intraocular pressure monitoring system.

PubMed

Cheng, H W; Jeng, B M; Chen, C Y; Huang, H Y; Chiou, J C; Luo, C H

2013-01-01

This paper proposed a wireless power harvesting system with micro-electro-mechanical-systems (MEMS) fabrication for noninvasive intraocular pressure (IOP) measurement on soft contact lens substructure. The power harvesting IC consists of a loop antenna, an impedance matching network and a rectifier. The proposed IC has been designed and fabricated by CMOS 0.18 um process that operates at the ISM band of 5.8 GHz. The antenna and the power harvesting IC would be bonded together by using flip chip bonding technologies without extra wire interference. The circuit utilized an impedance transformation circuit to boost the input RF signal that improves the circuit performance. The proposed design achieves an RF-to-DC conversion efficiency of 35% at 5.8 GHz.

Improved Sensing Coils for SQUIDs

NASA Technical Reports Server (NTRS)

Penanen, Konstantin; Hahn, Inseob; Eom, Byeong Ho

2007-01-01

An improvement in the design and fabrication of sensing coils of superconducting quantum interference device (SQUID) magnetometers has been proposed to increase sensitivity. It has been estimated that, in some cases, it would be possible to increase sensitivity by about half or to reduce measurement time correspondingly. The pertinent aspects of the problems of design and fabrication can be summarized as follows: In general, to increase the sensitivity of a SQUID magnetometer, it is necessary to maximize the magnetic flux enclosed by the sensing coil while minimizing the self-inductance of this coil. It is often beneficial to fabricate the coil from a thicker wire to reduce its self-inductance. Moreover, to optimize the design of the coil with respect to sensitivity, it may be necessary to shape the wire to other than a commonly available circular or square cross-section. On the other hand, it is not practical to use thicker superconducting wire for the entire superconducting circuit, especially if the design of a specific device requires a persistent-current loop enclosing a remotely placed SQUID sensor. It may be possible to bond a thicker sensing-coil wire to thinner superconducting wires leading to a SQUID sensor, but it could be difficult to ensure reliable superconducting connections, especially if the bonded wires are made of different materials. The main idea is to mold the sensing coil in place, to more nearly optimum cross sectional shape, instead of making the coil by winding standard pre-fabricated wire. For this purpose, a thin superconducting wire loop that is an essential part of the SQUID magnetometer would be encapsulated in a form that would serve as a mold. A low-melting-temperature superconducting metal (e.g., indium, tin, or a lead/tin alloy) would be melted into the form, which would be sized and shaped to impart the required cross section to the coil thus formed.

Contamination control in hybrid microelectronic modules. Part 3: Specifications for coating material and process controls

NASA Technical Reports Server (NTRS)

Himmel, R. P.

1975-01-01

Resin systems for coating hybrids prior to hermetic sealing are described. The resin systems are a flexible silicone junction resin system and a flexible cycloaliphatic epoxy resin system. The coatings are intended for application to the hybrid after all the chips have been assembled and wire bonded, but prior to hermetic sealing of the package. The purpose of the coating is to control particulate contamination by immobilizing particles and by passivating the hybrid. Recommended process controls for the purpose of minimizing contamination in hybrid microcircuit packages are given. Emphasis is placed on those critical hybrid processing steps in which contamination is most likely to occur.

Contamination control in hybrid microelectronic modules. Part 2: Selection and evaluation of coating materials

NASA Technical Reports Server (NTRS)

Himmel, R. P.

1975-01-01

The selection, test, and evaluation of organic coating materials for contamination control in hybrid circuits is reported. The coatings were evaluated to determine their suitability for use as a conformal coating over the hybrid microcircuit (including chips and wire bonds) inside a hermetically sealed package. Evaluations included ease of coating application and repair and effect on thin film and thick film resistors, beam leads, wire bonds, transistor chips, and capacitor chips. The coatings were also tested for such properties as insulation resistance, voltage breakdown strength, and capability of immobilizing loose particles inside the packages. The selected coatings were found to be electrically, mechanically, and chemically compatible with all components and materials normally used in hybrid microcircuits.

Thin film solar cells with Si nanocrystallites embedded in amorphous intrinsic layers by hot-wire chemical vapor deposition.

PubMed

Park, Seungil; Parida, Bhaskar; Kim, Keunjoo

2013-05-01

We investigated the thin film growths of hydrogenated silicon by hot-wire chemical vapor deposition with different flow rates of SiH4 and H2 mixture ambient and fabricated thin film solar cells by implementing the intrinsic layers to SiC/Si heterojunction p-i-n structures. The film samples showed the different infrared absorption spectra of 2,000 and 2,100 cm(-1), which are corresponding to the chemical bonds of SiH and SiH2, respectively. The a-Si:H sample with the relatively high silane concentration provides the absorption peak of SiH bond, but the microc-Si:H sample with the relatively low silane concentration provides the absorption peak of SiH2 bond as well as SiH bond. Furthermore, the microc-Si:H sample showed the Raman spectral shift of 520 cm(-1) for crystalline phase Si bonds as well as the 480 cm(-1) for the amorphous phase Si bonds. These bonding structures are very consistent with the further analysis of the long-wavelength photoconduction tail and the formation of nanocrystalline Si structures. The microc-Si:H thin film solar cell has the photovoltaic behavior of open circuit voltage similar to crystalline silicon thin film solar cell, indicating that microc-Si:H thin film with the mixed phase of amorphous and nanocrystalline structures show the carrier transportation through the channel of nanocrystallites.

Memotain: A CAD/CAM nickel-titanium lingual retainer.

PubMed

Kravitz, Neal D; Grauer, Dan; Schumacher, Pascal; Jo, Yong-Min

2017-04-01

Approximately 1/2 of maxillary and 1/5 of mandibular multi-stranded lingual retainers fail during retention in some form, either bond failure or wire breakage. Memotain is a new CAD/CAM fabricated lingual retainer wire made of custom-cut nickel-titanium, as an alternative to multi-stranded lingual retainers. It offers numerous perceived advantages to the traditional multi-stranded stainless steel wire, including precision fit, avoidance of interferences, corrosion resistance and even the potential for minor tooth movement as an active lingual retainer. Copyright © 2017 American Association of Orthodontists. Published by Elsevier Inc. All rights reserved.

Characterization of Nitinol Laser-Weld Joints by Nondestructive Testing

NASA Astrophysics Data System (ADS)

Wohlschlögel, Markus; Gläßel, Gunter; Sanchez, Daniela; Schüßler, Andreas; Dillenz, Alexander; Saal, David; Mayr, Peter

2015-12-01

Joining technology is an integral part of today's Nitinol medical device manufacturing. Besides crimping and riveting, laser welding is often applied to join components made from Nitinol to Nitinol, as well as Nitinol components to dissimilar materials. Other Nitinol joining techniques include adhesive bonding, soldering, and brazing. Typically, the performance of joints is assessed by destructive mechanical testing, on a process validation base. In this study, a nondestructive testing method—photothermal radiometry—is applied to characterize small Nitinol laser-weld joints used to connect two wire ends via a sleeve. Two different wire diameters are investigated. Effective joint connection cross sections are visualized using metallography techniques. Results of the nondestructive testing are correlated to data from destructive torsion testing, where the maximum torque at fracture is evaluated for the same joints and criteria for the differentiation of good and poor laser-welding quality by nondestructive testing are established.

Electronics Reliability Fracture Mechanics, Volume 2. Fracture Mechanics

DTIC Science & Technology

1992-05-01

alloy or strength level. Aluminum alloy 2024 - T351 was selected as being representative of the aluminum wire, and the fatigue ...to bracket the bond wire fatigue tests. 3-41 Also shown for comparison are two curves, which are the crack growth rates for 2024 aluminum alloy (Ref...is very similar to that for 2024 aluminum alloy . 3.2.6 Discussion of Loop Vibration Fatigue Testing Results This experimental and

Hydrated Excess Protons Can Create Their Own Water Wires

PubMed Central

2014-01-01

Grotthuss shuttling of an excess proton charge defect through hydrogen bonded water networks has long been the focus of theoretical and experimental studies. In this work we show that there is a related process in which water molecules move (“shuttle”) through a hydrated excess proton charge defect in order to wet the path ahead for subsequent proton charge migration. This process is illustrated through reactive molecular dynamics simulations of proton transport through a hydrophobic nanotube, which penetrates through a hydrophobic region. Surprisingly, before the proton enters the nanotube, it starts “shooting” water molecules into the otherwise dry space via Grotthuss shuttling, effectively creating its own water wire where none existed before. As the proton enters the nanotube (by 2–3 Å), it completes the solvation process, transitioning the nanotube to the fully wet state. By contrast, other monatomic cations (e.g., K+) have just the opposite effect, by blocking the wetting process and making the nanotube even drier. As the dry nanotube gradually becomes wet when the proton charge defect enters it, the free energy barrier of proton permeation through the tube via Grotthuss shuttling drops significantly. This finding suggests that an important wetting mechanism may influence proton translocation in biological systems, i.e., one in which protons “create” their own water structures (water “wires”) in hydrophobic spaces (e.g., protein pores) before migrating through them. An existing water wire, e.g., one seen in an X-ray crystal structure or MD simulations without an explicit excess proton, is therefore not a requirement for protons to transport through hydrophobic spaces. PMID:25369445

Design, processing and testing of LSI arrays, hybrid microelectronics task

NASA Technical Reports Server (NTRS)

Himmel, R. P.; Stuhlbarg, S. M.; Ravetti, R. G.; Zulueta, P. J.; Rothrock, C. W.

1979-01-01

Mathematical cost models previously developed for hybrid microelectronic subsystems were refined and expanded. Rework terms related to substrate fabrication, nonrecurring developmental and manufacturing operations, and prototype production are included. Sample computer programs were written to demonstrate hybrid microelectric applications of these cost models. Computer programs were generated to calculate and analyze values for the total microelectronics costs. Large scale integrated (LST) chips utilizing tape chip carrier technology were studied. The feasibility of interconnecting arrays of LSU chips utilizing tape chip carrier and semiautomatic wire bonding technology was demonstrated.

Large scale generation of micro-droplet array by vapor condensation on mesh screen piece

PubMed Central

Xie, Jian; Xu, Jinliang; He, Xiaotian; Liu, Qi

2017-01-01

We developed a novel micro-droplet array system, which is based on the distinct three dimensional mesh screen structure and sintering and oxidation induced thermal-fluid performance. Mesh screen was sintered on a copper substrate by bonding the two components. Non-uniform residue stress is generated along weft wires, with larger stress on weft wire top location than elsewhere. Oxidation of the sintered package forms micro pits with few nanograsses on weft wire top location, due to the stress corrosion mechanism. Nanograsses grow elsewhere to show hydrophobic behavior. Thus, surface-energy-gradient weft wires are formed. Cooling the structure in a wet air environment nucleates water droplets on weft wire top location, which is more “hydrophilic” than elsewhere. Droplet size is well controlled by substrate temperature, air humidity and cooling time. Because warp wires do not contact copper substrate and there is a larger conductive thermal resistance between warp wire and weft wire, warp wires contribute less to condensation but function as supporting structure. The surface energy analysis of drops along weft wires explains why droplet array can be generated on the mesh screen piece. Because the commercial material is used, the droplet system is cost effective and can be used for large scale utilization. PMID:28054635

Large scale generation of micro-droplet array by vapor condensation on mesh screen piece.

PubMed

Xie, Jian; Xu, Jinliang; He, Xiaotian; Liu, Qi

2017-01-05

We developed a novel micro-droplet array system, which is based on the distinct three dimensional mesh screen structure and sintering and oxidation induced thermal-fluid performance. Mesh screen was sintered on a copper substrate by bonding the two components. Non-uniform residue stress is generated along weft wires, with larger stress on weft wire top location than elsewhere. Oxidation of the sintered package forms micro pits with few nanograsses on weft wire top location, due to the stress corrosion mechanism. Nanograsses grow elsewhere to show hydrophobic behavior. Thus, surface-energy-gradient weft wires are formed. Cooling the structure in a wet air environment nucleates water droplets on weft wire top location, which is more "hydrophilic" than elsewhere. Droplet size is well controlled by substrate temperature, air humidity and cooling time. Because warp wires do not contact copper substrate and there is a larger conductive thermal resistance between warp wire and weft wire, warp wires contribute less to condensation but function as supporting structure. The surface energy analysis of drops along weft wires explains why droplet array can be generated on the mesh screen piece. Because the commercial material is used, the droplet system is cost effective and can be used for large scale utilization.

Large scale generation of micro-droplet array by vapor condensation on mesh screen piece

NASA Astrophysics Data System (ADS)

Xie, Jian; Xu, Jinliang; He, Xiaotian; Liu, Qi

2017-01-01

We developed a novel micro-droplet array system, which is based on the distinct three dimensional mesh screen structure and sintering and oxidation induced thermal-fluid performance. Mesh screen was sintered on a copper substrate by bonding the two components. Non-uniform residue stress is generated along weft wires, with larger stress on weft wire top location than elsewhere. Oxidation of the sintered package forms micro pits with few nanograsses on weft wire top location, due to the stress corrosion mechanism. Nanograsses grow elsewhere to show hydrophobic behavior. Thus, surface-energy-gradient weft wires are formed. Cooling the structure in a wet air environment nucleates water droplets on weft wire top location, which is more “hydrophilic” than elsewhere. Droplet size is well controlled by substrate temperature, air humidity and cooling time. Because warp wires do not contact copper substrate and there is a larger conductive thermal resistance between warp wire and weft wire, warp wires contribute less to condensation but function as supporting structure. The surface energy analysis of drops along weft wires explains why droplet array can be generated on the mesh screen piece. Because the commercial material is used, the droplet system is cost effective and can be used for large scale utilization.

An Integrated Thermal Compensation System for MEMS Inertial Sensors

PubMed Central

Chiu, Sheng-Ren; Teng, Li-Tao; Chao, Jen-Wei; Sue, Chung-Yang; Lin, Chih-Hsiou; Chen, Hong-Ren; Su, Yan-Kuin

2014-01-01

An active thermal compensation system for a low temperature-bias-drift (TBD) MEMS-based gyroscope is proposed in this study. First, a micro-gyroscope is fabricated by a high-aspect-ratio silicon-on-glass (SOG) process and vacuum packaged by glass frit bonding. Moreover, a drive/readout ASIC, implemented by the 0.25 μm 1P5M standard CMOS process, is designed and integrated with the gyroscope by directly wire bonding. Then, since the temperature effect is one of the critical issues in the high performance gyroscope applications, the temperature-dependent characteristics of the micro-gyroscope are discussed. Furthermore, to compensate the TBD of the micro-gyroscope, a thermal compensation system is proposed and integrated in the aforementioned ASIC to actively tune the parameters in the digital trimming mechanism, which is designed in the readout ASIC. Finally, some experimental results demonstrate that the TBD of the micro-gyroscope can be compensated effectively by the proposed compensation system. PMID:24599191

Metal oxide, Group V-VI chalcogenides and GaN/AlGaN photodetectors

NASA Astrophysics Data System (ADS)

Hasan, Md. Rezaul

In this work, a simple, low-cost and catalyst free one-step solution processing of onedimensional Sb2S3 nanostructures on polyimide substrates was done. This structure demonstrated its potential application as a photoconductor in the UV and visible regime. Using-field emission scanning electron microscopy (SEM), grazing incidence X-Ray diffraction, Raman spectra and transmission electron microscopy measurements, it was shown that the Sb 2S3 films have high crystallinity, uniform morphology and nearstoichiometric composition. Further, using tauc plot, it was found that the films have a direct bandgap of 1.67 eV. MSM photodetectors, fabricated using these films showed a clear photo response in both UV as well as visible wavelength. These devices showed UV on/off ratio as high as 160 under the light intensity of 30 mW/cm2 and a small rise time and fall time of 44 ms 28 ms respectively. The effect of geometry of metal pad and bonding wire orientation of a multi-channel FET on the coupling of THz radiation was studied. The spatial variation images were taken by raster scan with the resolution of 0.07 mm steps in both x and y directions. An effective gate bias, where the effect of noise is minimum and photoresponse is maximum, was used for imaging. By applying VGS =-2.8V and VDS =380mV, the images were taken for all different combinations of activated bonding wires and metal pads. It was observed that, effect of bonding wire orientation is negligible for the large source pad as the radiation is coupled basically between drain and gate pad. Effect of drain bonding wire on coupling depends on the maximum width or diameter of metal pad and the incoming wavelength. In this work, Position of activated Drain pad and orientation of respective bonding wire defined the image tilting angle. Voltage drop across the shorting metal between drain pads, also played a role in increasing the asymmetry by selectively exciting a certain portion of FET Channels more than the other portion. Position of gate pad defined the center point of the image without tilting the image as the geometry of the gate pads were parallel to each other. And there was no effect of gate pad bonding wire orientation because of the larger width of gate pads. For the GaN/AlGaNHEMT, the effect of Al mole fraction in AlGaN layer and the effect of gate oxide on the DC and low frequency noise characterization was studied. MOSHEMT with SiO2 improved the Id(on)/I d(off) ratio up to more than 8 orders, while it is only 10 times in conventional HEMT. It was shown that the gate leakage and isolation leakage suppression efficiency improved dramatically with the oxide. Subthreshold swing (SS) of MOS-HEMTs with different Al mole fraction (from 20% to 35%) vary slightly from 72 mV/decade to 79 mV/decade, but the conventional GaN/AlGaN HEMT showed SS of 2.4V/decade. Low frequency noise study revealed the difference in transport mechanism between HEMT and MOS-HEMTs. By using Carrier Number Fluctuation (CNF) model on the measured data, it was found that the noise is predominantly coming from the surface states. While generation-recombination is very prominent in conventional HEMT, it is very weak and insignificant in both MOS-HEMTs at much higher frequencies. This study reveals that very high number of surface states assisting the tunneling in schottky/AlGaN barrier is responsible for unusually high leakage and higher noise level in conventional HEMT. Leakage level is improved from mA/mm range for HEMT to pA/mm range for MOS-HEMTs. Leakage suppression improvement and minimization of noise level can be mainly attributed to high quality SiO2. Hooge's constant was in the order of 5-6x10-3 in MOS-HEMTs, which is 5x10 -2 for conventional HEMT indicating much lower noise level in the MOS-HEMTs. (Abstract shortened by ProQuest.).

Use of optical technique for inspection of warpage of IC packages

NASA Astrophysics Data System (ADS)

Toh, Siew-Lok; Chau, Fook S.; Ong, Sim Heng

2001-06-01

The packaging of IC packages has changed over the years, form dual-in-line, wire-bond, and pin-through-hole in printed wiring board technologies in the 1970s to ball grid array, chip scale and surface mount technologies in the 1990s. Reliability has been a big problem for manufacturers for some moisture-sensitive packages. One of the potential problems in plastic IC packages is moisture-induced popcorn effect which can arise during the reflow process. Shearography is a non-destructive inspection technique that may be used to detect the delamination and warpage of IC packages. It is non-contacting and permits a full-field observation of surface displacement derivatives. Another advantage of this technique is that it is able to give the real-time formation of the fringes which indicate flaws in the IC package under real-time simulation condition of Surface Mount Technology (SMT) IR reflow profile. It is extremely fast and convenient to study the true behavior of the packaging deformation during the SMT process. It can be concluded that shearography has the potential for the real- time detection, in situ and non-destructive inspection of IC packages during the surface mount process.

Concepts and Development of Bio-Inspired Distributed Embedded Wired/Wireless Sensor Array Architectures for Acoustic Wave Sensing in Integrated Aerospace Vehicles

NASA Technical Reports Server (NTRS)

Ghoshal, Anindya; Prosser, William H.; Kirikera, Goutham; Schulz, Mark J.; Hughes, Derke J.; Orisamolu, Wally

2003-01-01

This paper discusses the modeling of acoustic emissions in plate structures and their sensing by embedded or surface bonded piezoelectric sensor arrays. Three different modeling efforts for acoustic emission (AE) wave generation and propagation are discussed briefly along with their advantages and disadvantages. Continuous sensors placed at right angles on a plate are being discussed as a new approach to measure and locate the source of acoustic waves. Evolutionary novel signal processing algorithms and bio-inspired distributed sensor array systems are used on large structures and integrated aerospace vehicles for AE source localization and preliminary results are presented. These systems allow for a great reduction in the amount of data that needs to be processed and also reduce the chances of false alarms from ambient noises. It is envisioned that these biomimetic sensor arrays and signal processing techniques will be useful for both wireless and wired sensor arrays for real time health monitoring of large integrated aerospace vehicles and earth fixed civil structures. The sensor array architectures can also be used with other types of sensors and for other applications.

Functionally Graded Shape Memory Alloy Composites Optimized for Passive Vibration Control

DTIC Science & Technology

2006-11-20

Nitinol , it is anticipated that the wire can only experience an incomplete hysteresis. 2.1. SMA wires in sleeves continuously bonded to the plate...Gilheany, J. 1995. Control of the natural frequencies of nitinol -reinforced composite beams, Journal of Sound and Vibrations, Vol. 185, 171-185. 3 Ro...J., and Baz, A., 1995. Nitinol -reinforced plates: Part III, Dynamic characteristics, Composites Engineering, Vol. 5, 91-106. 4 Epps, J and Chandra

A review of various nozzle range of wire arc spray on FeCrBMnSi metal coating

NASA Astrophysics Data System (ADS)

Purwaningsih, Hariyati; Rochiem, Rochman; Suchaimi, Muhammad; Jatimurti, Wikan; Wibisono, Alvian Toto; Kurniawan, Budi Agung

2018-04-01

Low Temperature Hot Corrosion (LTHC) is type of hot corrosion which occurred on 700-800°C and usually on turbine blades. So, as a result the material of turbine blades is crack and degredation of rotation efficiency. Hot corrosion protection with the use of barrier that separate substrate and environment is one of using metal surface coating, wire arc spray method. This study has a purpose to analyze the effect of nozzle distance and gas pressure on FeCrBMnSi coating process using wire arc spray method on thermal resistance. The parameter of nozzle distance and gas pressure are used, resulted the best parameter on distance 400 mm and gas pressure 3 bar which has the bond strength of 12,58 MPa with porosity percentage of 5,93% and roughness values of 16,36 µm. While the examination of thermal cycle which by heating and cooling continuously, on the coating surface is formed oxide compound (Fe3O4) which cause formed crack propagation and delamination. Beside that hardness of coating surface is increase which caused by precipitate boride (Fe9B)0,2

Inspection of additive manufactured parts using laser ultrasonics

NASA Astrophysics Data System (ADS)

Lévesque, D.; Bescond, C.; Lord, M.; Cao, X.; Wanjara, P.; Monchalin, J.-P.

2016-02-01

Additive manufacturing is a novel technology of high importance for global sustainability of resources. As additive manufacturing involves typically layer-by-layer fusion of the feedstock (wire or powder), an important characteristic of the fabricated metallic structural parts, such as those used in aero-engines, is the performance, which is highly related to the presence of defects, such as cracks, lack of fusion or bonding between layers, and porosity. For this purpose, laser ultrasonics is very attractive due to its non-contact nature and is especially suited for the analysis of parts of complex geometries. In addition, the technique is well adapted to online implementation and real-time measurement during the manufacturing process. The inspection can be performed from either the top deposited layer or the underside of the substrate and the defects can be visualized using laser ultrasonics combined with the synthetic aperture focusing technique (SAFT). In this work, a variety of results obtained off-line on INCONEL® 718 and Ti-6Al-4V coupons that were manufactured using laser powder, laser wire, or electron beam wire deposition are reported and most defects detected were further confirmed by X-ray micro-computed tomography.

Removal of distal protein–water hydrogen bonds in a plant epoxide hydrolase increases catalytic turnover but decreases thermostability

PubMed Central

Thomaeus, Ann; Naworyta, Agata; Mowbray, Sherry L.; Widersten, Mikael

2008-01-01

A putative proton wire in potato soluble epoxide hydrolase 1, StEH1, was identified and investigated by means of site-directed mutagenesis, steady-state kinetic measurements, temperature inactivation studies, and X-ray crystallography. The chain of hydrogen bonds includes five water molecules coordinated through backbone carbonyl oxygens of Pro186, Leu266, His269, and the His153 imidazole. The hydroxyl of Tyr149 is also an integrated component of the chain, which leads to the hydroxyl of Tyr154. Available data suggest that Tyr154 functions as a final proton donor to the anionic alkylenzyme intermediate formed during catalysis. To investigate the role of the putative proton wire, mutants Y149F, H153F, and Y149F/H153F were constructed and purified. The structure of the Y149F mutant was solved by molecular replacement and refined to 2.0 Å resolution. Comparison with the structure of wild-type StEH1 revealed only subtle structural differences. The hydroxyl group lost as a result of the mutation was replaced by a water molecule, thus maintaining a functioning hydrogen bond network in the proton wire. All mutants showed decreased catalytic efficiencies with the R,R-enantiomer of trans-stilbene oxide, whereas with the S,S-enantiomer, k cat/K M was similar or slightly increased compared with the wild-type reactions. k cat for the Y149F mutant with either TSO enantiomer was increased; thus the lowered enzyme efficiencies were due to increases in K M. Thermal inactivation studies revealed that the mutated enzymes were more sensitive to elevated temperatures than the wild-type enzyme. Hence, structural alterations affecting the hydrogen bond chain caused increases in k cat but lowered thermostability. PMID:18515642

Removal of distal protein-water hydrogen bonds in a plant epoxide hydrolase increases catalytic turnover but decreases thermostability.

PubMed

Thomaeus, Ann; Naworyta, Agata; Mowbray, Sherry L; Widersten, Mikael

2008-07-01

A putative proton wire in potato soluble epoxide hydrolase 1, StEH1, was identified and investigated by means of site-directed mutagenesis, steady-state kinetic measurements, temperature inactivation studies, and X-ray crystallography. The chain of hydrogen bonds includes five water molecules coordinated through backbone carbonyl oxygens of Pro(186), Leu(266), His(269), and the His(153) imidazole. The hydroxyl of Tyr(149) is also an integrated component of the chain, which leads to the hydroxyl of Tyr(154). Available data suggest that Tyr(154) functions as a final proton donor to the anionic alkylenzyme intermediate formed during catalysis. To investigate the role of the putative proton wire, mutants Y149F, H153F, and Y149F/H153F were constructed and purified. The structure of the Y149F mutant was solved by molecular replacement and refined to 2.0 A resolution. Comparison with the structure of wild-type StEH1 revealed only subtle structural differences. The hydroxyl group lost as a result of the mutation was replaced by a water molecule, thus maintaining a functioning hydrogen bond network in the proton wire. All mutants showed decreased catalytic efficiencies with the R,R-enantiomer of trans-stilbene oxide, whereas with the S,S-enantiomer, k (cat)/K (M) was similar or slightly increased compared with the wild-type reactions. k (cat) for the Y149F mutant with either TSO enantiomer was increased; thus the lowered enzyme efficiencies were due to increases in K (M). Thermal inactivation studies revealed that the mutated enzymes were more sensitive to elevated temperatures than the wild-type enzyme. Hence, structural alterations affecting the hydrogen bond chain caused increases in k (cat) but lowered thermostability.

Effect of grit-blasting on substrate roughness and coating adhesion

NASA Astrophysics Data System (ADS)

Varacalle, Dominic J.; Guillen, Donna Post; Deason, Douglas M.; Rhodaberger, William; Sampson, Elliott

2006-09-01

Statistically designed experiments were performed to compare the surface roughness produced by grit blasting A36/1020 steel using different abrasives. Grit blast media, blast pressure, and working distance were varied using a Box-type statistical design of experiment (SDE) approach. The surface textures produced by four metal grits (HG16, HG18, HG25, and HG40) and three conventional grits (copper slag, coal slag, and chilled iron) were compared. Substrate roughness was measured using surface profilometry and correlated with operating parameters. The HG16 grit produced the highest surface roughness of all the grits tested. Aluminum and zinc-aluminum coatings were deposited on the grit-blasted substrates using the twin-wire electric are (TWEA) process. Bond strength of the coatings was measured with a portable adhesion tester in accordance with ASTM standard D 4541. The coatings on substrates roughened with steel grit exhibit superior bond strength to those prepared with conventional grit. For aluminum coatings sprayed onto surfaces prepared with the HG16 grit, the bond strength was most influenced by current, spray distance, and spray gun pressure (in that order). The highest bond strength for the zinc-aluminum coatings was attained on surfaces prepared using the metal grits.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Guo, Rui; Gao, Liming, E-mail: liming.gao@sjtu.edu.cn; Li, Ming, E-mail: mingli90@sjtu.edu.cn

As the continuous shrinkage of the interconnect line width in microelectronics devices, there is a growing concern about the electromigration (EM) failure of bonding wire. In addition, an innovative Ag–8Au–3Pd alloy wire has shown promise as an economical substitute for gold wire interconnects due to the cost pressure of gold in the last decade. In present study of the Ag–8Au–3Pd alloy wire, the surface diffusion occupied the dominant position during EM failure, and the activation energy was found to be 0.61 eV. In order to reveal the failure mechanism, the cross-sections of the Ag–8Au–3Pd alloy wire during EM were preparedmore » by focused ion beam (FIB) micro-machining for electron backscatter diffraction (EBSD) analysis. The microstructure evolution of the Ag–8Au–3Pd alloy wire was characterized by the grain size and grain boundary. As a result, the EM failure originates in the atom transportation, which causes grain size increasing and atom diffusion on the wire surface. - Highlights: • The activation energy of Ag–8Au–3Pd alloy wire was obtained as 0.61 eV. • During EM, the silver atoms diffused from negative to the positive terminal on the wire surface. • The microstructure (grain size and grain boundary) was characterized by FIB-EBSD. • During EM, the atom transportation was found to cause grain size growth and atom diffusion on the wire surface.« less

Microfabricated Electrical Connector for Atomic Force Microscopy Probes with Integrated Sensor/Actuator

NASA Astrophysics Data System (ADS)

Akiyama, Terunobu; Staufer, Urs; Rooij, Nico F. de

2002-06-01

A microfabricated, electrical connector is proposed for facilitating the mounting of atomic force microscopy (AFM) probes, which have an integrated sensor and/or actuator. Only a base chip, which acts as a socket, is permanently fixed onto a printed circuit board and electronically connected by standard wire bonding. The AFM chip, the “plug”, is flipped onto the base chip and pressed from the backside by a spring. Electrical contact with the eventual stress sensors, capacitive or piezoelectric sensor/actuators, is provided by contact bumps. These bumps of about 8 μm height are placed onto the base chip. They touch the pads on the AFM chip that were originally foreseen to be for wire bonding and thus provide the electrical contact. This connector schema was successfully used to register AFM images with piezoresistive cantilevers.

Feasibility study of silicon nitride protection of plastic encapsulated semiconductors

NASA Technical Reports Server (NTRS)

Peters, J. W.; Hall, T. C.; Erickson, J. J.; Gebhart, F. L.

1979-01-01

The application of low temperature silicon nitride protective layers on wire bonded integrated circuits mounted on lead frame assemblies is reported. An evaluation of the mechanical and electrical compatibility of both plasma nitride and photochemical silicon nitride (photonitride) passivations (parallel evaluations) of integrated circuits which were then encapsulated in plastic is described. Photonitride passivation is compatible with all wire bonded lead frame assemblies, with or without initial chip passivation. Plasma nitride passivation of lead frame assemblies is possible only if the chip is passivated before lead frame assembly. The survival rate after the environmental test sequence of devices with a coating of plasma nitride on the chip and a coating of either plasma nitride or photonitride over the assembled device is significantly greater than that of devices assembled with no nitride protective coating over either chip or lead frame.

Engineering and experimental analyses of the tensile loads applied during strength testing of direct bonded orthodontic brackets.

PubMed

Katona, T R; Chen, J

1994-08-01

The stress levels within the cement layer (hence, the apparent strength) of a direct bonded orthodontic bracket depends, to a large extent, on the alignment of the tensile loads that are applied to the specimen. The purpose of this analysis was to determine how the construction of a ligature wire harness affects the alignment of the applied loads. Tensile tests conducted on a modified bracket/cement system showed large variations in the force-elongation curve profiles. An engineering model was developed to explain these deviations. The results indicate that it is virtually impossible to evenly apply tensile loads to the bracket. It was also proposed that long harnesses constructed with thin ligature wire, prestressing the harness, and lubrication may reduce some of the effects of unavoidable load-bracket misalignment.

Hydrogen Bond Networks and Hydrophobic Effects in the Amyloid β30-35 Chain in Water: A Molecular Dynamics Study.

PubMed

Jong, KwangHyok; Grisanti, Luca; Hassanali, Ali

2017-07-24

We have studied the conformational landscape of the C-terminal fragment of the amyloid protein Aβ 30-35 in water using well-tempered metadynamics simulations and found that it resembles an intrinsically disordered protein. The conformational fluctuations of the protein are facilitated by a collective reorganization of both protein and water hydrogen bond networks, combined with electrostatic interactions between termini as well as hydrophobic interactions of the side chains. The stabilization of hydrophobic interactions in one of the conformers involves a collective collapse of the side chains along with a squeeze-out of water sandwiched between them. The charged N- and C-termini play a critical role in stabilizing different types of protein conformations, including those involving contact-ion salt bridges as well as solvent-mediated interactions of the termini and the amide backbone. We have examined this by probing the distribution of directed water wires forming the hydrogen bond network enveloping the polypeptide. Water wires and their fluctuations form an integral part of structural signature of the protein conformation.

Hot wire anemometer measurements in the unheated air flow tests of the SRB nozzle-to-case joint

NASA Technical Reports Server (NTRS)

Ramachandran, N.

1988-01-01

Hot-Wire Anemometer measurements made in the Solid Rocket Booster (SRB) nozzle-to-case joint are discussed. The study was undertaken to glean additional information on the circumferential flow induced in the SRB nozzle joint and the effect of this flow on the insulation bonding flaws. The tests were conducted on a full-scale, 2-D representation of a 65-in long segment of the SRB nozzle joint, with unheated air as the working fluid. Both the flight Mach number and Reynolds number were matched simultaneously and different pressure gradients imposed along the joint face were investigated. Hot-wire anemometers were used to obtain velocity data for different joint gaps and debond configurations. The procedure adopted for hot-wire calibration and use is outlined and the results from the tests summarized.

Attachment of Free Filament Thermocouples for Temperature Measurements on Ceramic Matrix Composites

NASA Technical Reports Server (NTRS)

Lei, Jih-Fen; Cuy, Michael D.; Wnuk, Stephen P.

1998-01-01

At the NASA Lewis Research Center, a new installation technique utilizing convoluted wire thermocouples (TC's) was developed and proven to produce very good adhesion on CMC's, even in a burner rig environment. Because of their unique convoluted design, such TC's of various types and sizes adhere to flat or curved CMC specimens with no sign of delamination, open circuits, or interactions-even after testing in a Mach 0.3 burner rig to 1200 C (2200 F) for several thermal cycles and at several hours at high temperatures. Large differences in thermal expansion between metal thermocouples and low-expansion materials, such as CMC's, normally generate large stresses in the wires. These stresses cause straight wires to detach, but convoluted wires that are bonded with strips of coating allow bending in the unbonded portion to relieve these expansion stresses.

Effects of intraoral aging on surface properties of coated nickel-titanium archwires.

PubMed

Rongo, Roberto; Ametrano, Gianluca; Gloria, Antonio; Spagnuolo, Gianrico; Galeotti, Angela; Paduano, Sergio; Valletta, Rosa; D'Antò, Vincenzo

2014-07-01

To evaluate the effects of intraoral aging on surface properties of esthetic and conventional nickel-titanium (NiTi) archwires. Five NiTi wires were considered for this study (Sentalloy, Sentalloy High Aesthetic, Superelastic Titanium Memory Wire, Esthetic Superelastic Titanium Memory Wire, and EverWhite). For each type of wire, four samples were analyzed as received and after 1 month of clinical use by an atomic force microscope (AFM) and a scanning electronic microscope (SEM). To evaluate sliding resistance, two stainless steel plates with three metallic or three monocrystalline brackets, bonded in passive configuration, were manufactured; four as-received and retrieved samples for every wire were pulled five times at 5 mm/min for 1 minute by means of an Instron 5566, recording the greatest friction value (N). Data were analyzed by one-way analysis of variance and by Student's t-test. After clinical use, surface roughness increased considerably. The SEM images showed homogeneity for the as-received control wires; however, after clinical use esthetic wires exhibited a heterogeneous surface with craters and bumps. The lowest levels of friction were observed with the as-received Superelastic Titanium Memory Wire on metallic brackets. When tested on ceramic brackets, all the wires exhibited an increase in friction (t-test; P < .05). Furthermore, all the wires, except Sentalloy, showed a statistically significant increase in friction between the as-received and retrieved groups (t-test; P < .05). Clinical use of the orthodontic wires increases their surface roughness and the level of friction.

A cryogenic thermal source for detector array characterization

NASA Astrophysics Data System (ADS)

Chuss, David T.; Rostem, Karwan; Wollack, Edward J.; Berman, Leah; Colazo, Felipe; DeGeorge, Martin; Helson, Kyle; Sagliocca, Marco

2017-10-01

We describe the design, fabrication, and validation of a cryogenically compatible quasioptical thermal source for characterization of detector arrays. The source is constructed using a graphite-loaded epoxy mixture that is molded into a tiled pyramidal structure. The mold is fabricated using a hardened steel template produced via a wire electron discharge machining process. The absorptive mixture is bonded to a copper backplate enabling thermalization of the entire structure and measurement of the source temperature. Measurements indicate that the reflectance of the source is <0.001 across a spectral band extending from 75 to 330 GHz.

High loading uranium fuel plate

DOEpatents

Wiencek, Thomas C.; Domagala, Robert F.; Thresh, Henry R.

1990-01-01

Two embodiments of a high uranium fuel plate are disclosed which contain a meat comprising structured uranium compound confined between a pair of diffusion bonded ductile metal cladding plates uniformly covering the meat, the meat having a uniform high fuel loading comprising a content of uranium compound greater than about 45 Vol. % at a porosity not greater than about 10 Vol. %. In a first embodiment, the meat is a plurality of parallel wires of uranium compound. In a second embodiment, the meat is a dispersion compact containing uranium compound. The fuel plates are fabricated by a hot isostatic pressing process.

A Cryogenic Thermal Source for Detector Array Characterization

NASA Technical Reports Server (NTRS)

Chuss, David T.; Rostem, Karwan; Wollack, Edward J.; Berman, Leah; Colazo, Felipe; DeGeorge, Martin; Helson, Kyle; Sagliocca, Marco

2017-01-01

We describe the design, fabrication, and validation of a cryogenically compatible quasioptical thermal source for characterization of detector arrays. The source is constructed using a graphite-loaded epoxy mixture that is molded into a tiled pyramidal structure. The mold is fabricated using a hardened steel template produced via a wire electron discharge machining process. The absorptive mixture is bonded to a copper backplate enabling thermalization of the entire structure and measurement of the source temperature. Measurements indicate that the reflectance of the source is less than 0.001 across a spectral band extending from 75 to 330 gigahertz.

Universal solar-cell terminal

NASA Technical Reports Server (NTRS)

Bashin, S.; Kelley, F. G.

1977-01-01

Terminal, which replaces stakes or lugs in conventional design with loop receptacles for wires from cell and harness, uses dissimilar bonding properties (metal-to-glass and/or ceramics) of iron-nickel-cobalt alloy in conjunction with standard termination.

Multi-functional laser fabrication of diamond (Conference Presentation)

NASA Astrophysics Data System (ADS)

Salter, Patrick S.; Booth, Martin J.

2017-03-01

Ultrafast laser fabrication enables micro-structuring of diamond in 3D with a range of functionality. An ultrashort pulsed beam focused beneath the diamond surface induces structural modifications which are highly localised in three dimensions. At high pulse energy, the laser breaks down the diamond lattice at focus to form a graphitic phase. We demonstrate high resolution analysis of the structural changes revealing the graphitic phase to be formed of small clusters ( 100 nm in size) of amorphous sp2 bonded carbon accompanied by localised cracking of the diamond. When the laser focus is traced through the diamond, continuous graphitic wires are created which are electrically conductive. We have used such wires to fabricate large-area 3D radiation sensors which have been employed for the detection of high energy protons. Such graphitic wires have an associated stress field and a related localised modulation of the refractive index. We have recently written combinations of graphitic tracks in diamond to engineer stress fields to give a desired refractive index distribution and form an optical waveguide. Type III waveguides are demonstrated that allow guiding of both polarization states. We also show that by reducing the laser pulse energy, it is possible to avoid complete breakdown of the diamond lattice and simply introduce an ensemble of vacancies within the focal volume. This can be used to create single coherent NV centres in diamond isolated in 3D. All these processes are improved by processing at high numerical aperture (NA), for which adaptive optics aberration correction is essential.

Disassembly Properties of Cementitious Finish Joints Using an Induction Heating Method

PubMed Central

Ahn, Jaecheol; Noguchi, Takafumi; Kitagaki, Ryoma

2015-01-01

Efficient maintenance and upgrading of a building during its lifecycle are difficult because a cementitious finish uses materials and parts with low disassembly properties. Additionally, the reuse and recycling processes during building demolition also present numerous problems from the perspective of environmental technology. In this study, an induction heating (IH) method was used to disassemble cementitious finish joints, which are widely used to join building members and materials. The IH rapidly and selectively heated and weakened these joints. The temperature elevation characteristics of the cementitious joint materials were measured as a function of several resistor types, including wire meshes and punching metals, which are usually used for cementitious finishing. The disassembly properties were evaluated through various tests using conductive resistors in cementitious joints such as mortar. When steel fiber, punching metal, and wire mesh were used as conductive resistors, the cementitious modifiers could be weakened within 30 s. Cementitious joints with conductive resistors also showed complete disassembly with little residual bond strength.

Tapered monocapillary-optics for point source applications

DOEpatents

Hirsch, Gregory

2000-01-01

A glass or metal wire is precisely etched to form the paraboloidal or ellipsoidal shape of the final desired capillary optic. This shape is created by carefully controlling the withdrawal speed of the wire from an etchant bath. In the case of a complete ellipsoidal capillary, the etching operation is performed twice in opposite directions on adjacent wire segments. The etched wire undergoes a subsequent operation to create an extremely smooth surface. This surface is coated with a layer of material which is selected to maximize the reflectivity of the radiation. This reflective surface may be a single layer for wideband reflectivity, or a multilayer coating for optimizing the reflectivity in a narrower wavelength interval. The coated wire is built up with a reinforcing layer, typically by a plating operation. The initial wire is removed by either an etching procedure or mechanical force. Prior to removing the wire, the capillary is typically bonded to a support substrate. One option for attaching the wire to the substrate produces a monolithic structure by essentially burying it under a layer of plating which covers both the wire and the substrate. The capillary optic is used for efficiently collecting and redirecting the divergent radiation from a source which could be the anode of an x-ray tube, a plasma source, the fluorescent radiation from an electron microprobe, or some other source of radiation.

Methods of Measurement for Semiconductor Materials, Process Control, and Devices

NASA Technical Reports Server (NTRS)

Bullis, W. M. (Editor)

1973-01-01

The development of methods of measurement for semiconductor materials, process control, and devices is reported. Significant accomplishments include: (1) Completion of an initial identification of the more important problems in process control for integrated circuit fabrication and assembly; (2) preparations for making silicon bulk resistivity wafer standards available to the industry; and (3) establishment of the relationship between carrier mobility and impurity density in silicon. Work is continuing on measurement of resistivity of semiconductor crystals; characterization of generation-recombination-trapping centers, including gold, in silicon; evaluation of wire bonds and die attachment; study of scanning electron microscopy for wafer inspection and test; measurement of thermal properties of semiconductor devices; determination of S-parameters and delay time in junction devices; and characterization of noise and conversion loss of microwave detector diodes.

'There were more wires than him': the potential for wireless patient monitoring in neonatal intensive care.

PubMed

Bonner, Oliver; Beardsall, Kathryn; Crilly, Nathan; Lasenby, Joan

2017-02-01

The neonatal intensive care unit (NICU) can be one of the most stressful hospital environments. Alongside providing intensive clinical care, it is important that parents have the opportunity for regular physical contact with their babies because the neonatal period is critical for parent-child bonding. At present, monitoring technology in the NICU requires multiple wired sensors to track each baby's vital signs. This study describes the experiences that parents and nurses have with the current monitoring methods, and reports on their responses to the concept of a wireless monitoring system. Semistructured interviews were conducted with six parents, each of whom had babies on the unit, and seven nurses who cared for those babies. The interviews initially focused on the participants' experiences of the current wired system and then on their responses to the concept of a wireless system. The transcripts were analysed using a general inductive approach to identify relevant themes. Participants reported on physical and psychological barriers to parental care, the ways in which the current system obstructed the efficient delivery of clinical care and the perceived benefits and risks of a wireless system. The parents and nurses identified that the wires impeded baby-parent bonding; physically and psychologically. While a wireless system was viewed as potentially enabling greater interaction, staff and parents highlighted potential concerns, including the size, weight and battery life of any new device. The many wires required to safely monitor babies within the NICU creates a negative environment for parents at a critical developmental period, in terms of physical and psychological interactions. Nurses also experience challenges with the existing system, which could negatively impact the clinical care delivery. Developing a wireless system could overcome these barriers, but there remain challenges in designing a device suitable for this unique environment.

Investigation of improving MEMS-type VOA reliability

NASA Astrophysics Data System (ADS)

Hong, Seok K.; Lee, Yeong G.; Park, Moo Y.

2003-12-01

MEMS technologies have been applied to a lot of areas, such as optical communications, Gyroscopes and Bio-medical components and so on. In terms of the applications in the optical communication field, MEMS technologies are essential, especially, in multi dimensional optical switches and Variable Optical Attenuators(VOAs). This paper describes the process for the development of MEMS type VOAs with good optical performance and improved reliability. Generally, MEMS VOAs have been fabricated by silicon micro-machining process, precise fibre alignment and sophisticated packaging process. Because, it is composed of many structures with various materials, it is difficult to make devices reliable. We have developed MEMS type VOSs with many failure mode considerations (FMEA: Failure Mode Effect Analysis) in the initial design step, predicted critical failure factors and revised the design, and confirmed the reliability by preliminary test. These predicted failure factors were moisture, bonding strength of the wire, which wired between the MEMS chip and TO-CAN and instability of supplied signals. Statistical quality control tools (ANOVA, T-test and so on) were used to control these potential failure factors and produce optimum manufacturing conditions. To sum up, we have successfully developed reliable MEMS type VOAs with good optical performances by controlling potential failure factors and using statistical quality control tools. As a result, developed VOAs passed international reliability standards (Telcodia GR-1221-CORE).

Investigation of improving MEMS-type VOA reliability

NASA Astrophysics Data System (ADS)

Hong, Seok K.; Lee, Yeong G.; Park, Moo Y.

2004-01-01

MEMS technologies have been applied to a lot of areas, such as optical communications, Gyroscopes and Bio-medical components and so on. In terms of the applications in the optical communication field, MEMS technologies are essential, especially, in multi dimensional optical switches and Variable Optical Attenuators(VOAs). This paper describes the process for the development of MEMS type VOAs with good optical performance and improved reliability. Generally, MEMS VOAs have been fabricated by silicon micro-machining process, precise fibre alignment and sophisticated packaging process. Because, it is composed of many structures with various materials, it is difficult to make devices reliable. We have developed MEMS type VOSs with many failure mode considerations (FMEA: Failure Mode Effect Analysis) in the initial design step, predicted critical failure factors and revised the design, and confirmed the reliability by preliminary test. These predicted failure factors were moisture, bonding strength of the wire, which wired between the MEMS chip and TO-CAN and instability of supplied signals. Statistical quality control tools (ANOVA, T-test and so on) were used to control these potential failure factors and produce optimum manufacturing conditions. To sum up, we have successfully developed reliable MEMS type VOAs with good optical performances by controlling potential failure factors and using statistical quality control tools. As a result, developed VOAs passed international reliability standards (Telcodia GR-1221-CORE).

Military Handbook. Grounding, Bonding, and Shielding for Electronic Equipments and Facilities. Volume 1. Basic Theory

DTIC Science & Technology

1987-12-29

when the air or gas stream contains particulate matter. b. Pulverized materials passing through chutes or pneumatic conveyors . c. Nonconductive power...Hanover NH, 1971, AD 722 221. 146.Oakley, R.J., "Surface Transfer Impedance and Cable Shielding Design ," Wire Journal, Vol 4, No. 3, March 1971, pp...including considerations of grounding, bonding, and shielding in all phases of design , construction, operation, and maintenance of electronic equipment

Design and Fabrication of an Implantable Cortical Semiconductor Integrated Circuit Electrode Array

DTIC Science & Technology

1990-12-01

25 Array Pads....................25 Polyimide ....................26 III. METHODOLOGY.........................27 Brain Chip Electronics...38 Ionic Permeation. .................. 38 Polyimide . ................... 38 Implantation. .................... 39 Wire Bonding...53 Pad Sensitivity ................. 53 Ionic Permeat:.on. .................. 54 Polyimide . ................... 54 Implantation

Composite metal foil and ceramic fabric materials

DOEpatents

Webb, B.J.; Antoniak, Z.I.; Prater, J.T.; DeSteese, J.G.

1992-03-24

The invention comprises new materials useful in a wide variety of terrestrial and space applications. In one aspect, the invention comprises a flexible cloth-like material comprising a layer of flexible woven ceramic fabric bonded with a layer of metallic foil. In another aspect, the invention includes a flexible fluid impermeable barrier comprising a flexible woven ceramic fabric layer having metal wire woven therein. A metallic foil layer is incontinuously welded to the woven metal wire. In yet another aspect, the invention includes a material comprising a layer of flexible woven ceramic fabric bonded with a layer of an organic polymer. In still another aspect, the invention includes a rigid fabric structure comprising a flexible woven ceramic fabric and a resinous support material which has been hardened as the direct result of exposure to ultraviolet light. Inventive methods for producing such material are also disclosed. 11 figs.

The UT 19-channel DC SQUID based neuromagnetometer.

PubMed

ter Brake, H J; Flokstra, J; Jaszczuk, W; Stammis, R; van Ancum, G K; Martinez, A; Rogalla, H

1991-01-01

A 19-channel DC SQUID based neuromagnetometer is under construction at the University of Twente (UT). Except for the cryostat all elements of the system are developed at the UT. It comprises 19 wire-wound first-order gradiometers in a hexagonal configuration. The gradiometers are connected to planar DC SQUIDs fabricated with a Nb/Al, AlO kappa/Nb technology. For this connection we developed a method to bond a Nb wire to a Nb thin-film. The SQUIDs are placed in compartmentalised Nb modules. Further, external feedback is incorporated in order to eliminate cross talk between the gradiometers. The electronics basically consist of a phase-locked loop operating with a modulation frequency of 100 kHz. Between SQUID and preamplifier a small transformer is used to limit the noise contribution of the preamplifier. In the paper the overall system is described, and special attention is paid to the SQUID module (bonding, compartments, external-feedback setup, output transformer).

Dopant activation mechanism of Bi wire-δ-doping into Si crystal, investigated with wavelength dispersive fluorescence x-ray absorption fine structure and density functional theory.

PubMed

Murata, Koichi; Kirkham, Christopher; Shimomura, Masaru; Nitta, Kiyofumi; Uruga, Tomoya; Terada, Yasuko; Nittoh, Koh-Ichi; Bowler, David R; Miki, Kazushi

2017-04-20

We successfully characterized the local structures of Bi atoms in a wire-δ-doped layer (1/8 ML) in a Si crystal, using wavelength dispersive fluorescence x-ray absorption fine structure at the beamline BL37XU, in SPring-8, with the help of density functional theory calculations. It was found that the burial of Bi nanolines on the Si(0 0 1) surface, via growth of Si capping layer at 400 °C by molecular beam epitaxy, reduced the Bi-Si bond length from [Formula: see text] to [Formula: see text] Å. We infer that following epitaxial growth the Bi-Bi dimers of the nanoline are broken, and the Bi atoms are located at substitutional sites within the Si crystal, leading to the shorter Bi-Si bond lengths.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Wolf, Steffen; Gerwert, Klaus, E-mail: gerwert@bph.rub.de; Department of Biophysics, Chinese Academy of Sciences, Max-Planck-Gesellschaft Partner Institute for Computational Biology, 320 Yue Yang Road, 200031 Shanghai

Proton conduction along protein-bound “water wires” is an essential feature in membrane proteins. Here, we analyze in detail a transient water wire, which conducts protons via a hydrophobic barrier within a membrane protein to create a proton gradient. It is formed only for a millisecond out of three water molecules distributed at inactive positions in a polar environment in the ground state. The movement into a hydrophobic environment causes characteristic shifts of the water bands reflecting their different chemical properties. These band shifts are identified by time-resolved Fourier Transform Infrared difference spectroscopy and analyzed by biomolecular Quantum Mechanical/Molecular Mechanical simulations.more » A non-hydrogen bonded (“dangling”) O–H stretching vibration band and a broad continuum absorbance caused by a combined vibration along the water wire are identified as characteristic marker bands of such water wires in a hydrophobic environment. The results provide a basic understanding of water wires in hydrophobic environments.« less

Motor for High Temperature Applications

NASA Technical Reports Server (NTRS)

Roopnarine (Inventor)

2013-01-01

A high temperature motor has a stator with poles formed by wire windings, and a rotor with magnetic poles on a rotor shaft positioned coaxially within the stator. The stator and rotor are built up from stacks of magnetic-alloy laminations. The stator windings are made of high temperature magnet wire insulated with a vitreous enamel film, and the wire windings are bonded together with ceramic binder. A thin-walled cylinder is positioned coaxially between the rotor and the stator to prevent debris from the stator windings from reaching the rotor. The stator windings are wound on wire spools made of ceramic, thereby avoiding need for mica insulation and epoxy/adhesive. The stator and rotor are encased in a stator housing with rear and front end caps, and rear and front bearings for the rotor shaft are mounted on external sides of the end caps to keep debris from the motor migrating into the bearings' races.

Processing and characterization of device solder interconnection and module attachment for power electronics modules

NASA Astrophysics Data System (ADS)

Haque, Shatil

This research is focused on the processing of an innovative three-dimensional packaging architecture for power electronics building blocks with soldered device interconnections and subsequent characterization of the module's critical interfaces. A low-cost approach termed metal posts interconnected parallel plate structure (MPIPPS) was developed for packaging high-performance modules of power electronics building blocks (PEBB). The new concept implemented direct bonding of copper posts, not wire bonding of fine aluminum wires, to interconnect power devices as well as joining the different circuit planes together. We have demonstrated the feasibility of this packaging approach by constructing PEBB modules (consisting of Insulated Gate Bipolar Transistors (IGBTs), diodes, and a few gate driver elements and passive components). In the 1st phase of module fabrication with IGBTs with Si3N 4 passivation, we had successfully fabricated packaged devices and modules using the MPIPPS technique. These modules were tested electrically and thermally, and they operated at pulse-switch and high power stages up to 6kW. However, in the 2nd phase of module fabrication with polyimide passivated devices, we experienced significant yield problems due to metallization difficulties of these devices. The under-bump metallurgy scheme for the development of a solderable interface involved sputtering of Ti-Ni-Cu and Cr-Cu, and an electroless deposition of Zn-Ni-Au metallization. The metallization process produced excellent yield in the case of Si3N4 passivated devices. However, under the same metallization schemes, devices with a polyimide passivation exhibited inconsistent electrical contact resistance. We found that organic contaminants such as hydrocarbons remain in the form of thin monolayers on the surface, even in the case of as-received devices from the manufacturer. Moreover, in the case of polyimide passivated devices, plasma cleaning introduced a few carbon constituents on the surface, which was not observed in the case of Si3N4 passivated devices. X-Ray Photoelectron Spectroscopy (XPS) Spectra showed evidence of possible carbon contaminants, such as carbide (˜282.9eV) and graphite (˜284.3eV) on the surface at binding energies below the binding energy of the hydrocarbon peak (C 1s at 285eV). Whereas above the hydrocarbon peak energy level, carbon-nitrogen compounds, single bond carbon compounds (˜285.9eV) and double bond carbon compounds (˜288.5eV) were evident. The majority of the carbon composition on the pad surface was associated with hydrocarbons, which were hydrophobic in nature, thus making the device contact pad less wettable. (Abstract shortened by UMI.)

High-Density Superconducting Cables for Advanced ACTPol

NASA Astrophysics Data System (ADS)

Pappas, C. G.; Austermann, J.; Beall, J. A.; Duff, S. M.; Gallardo, P. A.; Grace, E.; Henderson, S. W.; Ho, S. P.; Koopman, B. J.; Li, D.; McMahon, J.; Nati, F.; Niemack, M. D.; Niraula, P.; Salatino, M.; Schillaci, A.; Schmitt, B. L.; Simon, S. M.; Staggs, S. T.; Stevens, J. R.; Vavagiakis, E. M.; Ward, J. T.; Wollack, E. J.

2016-07-01

Advanced ACTPol (AdvACT) is an upcoming Atacama Cosmology Telescope (ACT) receiver upgrade, scheduled to deploy in 2016, that will allow measurement of the cosmic microwave background polarization and temperature to the highest precision yet with ACT. The AdvACT increase in sensitivity is partly provided by an increase in the number of transition-edge sensors (TESes) per array by up to a factor of two over the current ACTPol receiver detector arrays. The high-density AdvACT TES arrays require 70 \\upmu m pitch superconducting flexible cables (flex) to connect the detector wafer to the first-stage readout electronics. Here, we present the flex fabrication process and test results. For the flex wiring layer, we use a 400-nm-thick sputtered aluminum film. In the center of the cable, the wiring is supported by a polyimide substrate, which smoothly transitions to a bare (uncoated with polyimide) silicon substrate at the ends of the cable for a robust wedge wire-bonding interface. Tests on the first batch of flex made for the first AdvACT array show that the flex will meet the requirements for AdvACT, with a superconducting critical current above 1 mA at 500 mK, resilience to mechanical and cryogenic stress, and a room temperature yield of 97 %.

High-Density Superconducting Cables for Advanced ACTPol

NASA Technical Reports Server (NTRS)

Pappas, C. G.; Austermann, J.; Beall, J. A.; Duff, S. M.; Gallardo, P. A.; Grace, E.; Henderson, S. W.; Ho, S. P.; Koopman, B. J.; Li, D.;

A one-pot gold seed-assisted synthesis of gold/platinum wire nanoassemblies and their enhanced electrocatalytic activity for the oxidation of oxalic acid

NASA Astrophysics Data System (ADS)

Bai, Juan; Fang, Chun-Long; Liu, Zong-Huai; Chen, Yu

2016-01-01

Three-dimensional (3D) noble metal nanoassemblies composed of one-dimensional (1D) nanowires have been attracting much interest due to the unique physical and chemical properties of 1D nanowires as well as the particular interconnected open-pore structure of 3D nanoassemblies. In this work, well-defined Au/Pt wire nanoassemblies were synthesized by using a facile NaBH4 reduction method in the presence of a branched form of polyethyleneimine (PEI). A study of the growth mechanism indicated the morphology of the final product to be highly related to the molecular structure of the polymeric amine. Also, the preferred Pt-on-Pt deposition contributed to the formation of the 1D Pt nanowires. The Au/Pt wire nanoassemblies were functionalized with PEI at the same time that these nanoassemblies were synthesized due to the strong N-Pt bond. The chemically functionalized Au/Pt wire nanoassemblies exhibited better electrocatalytic activity for the electro-oxidation of oxalic acid than did commercial Pt black.Three-dimensional (3D) noble metal nanoassemblies composed of one-dimensional (1D) nanowires have been attracting much interest due to the unique physical and chemical properties of 1D nanowires as well as the particular interconnected open-pore structure of 3D nanoassemblies. In this work, well-defined Au/Pt wire nanoassemblies were synthesized by using a facile NaBH4 reduction method in the presence of a branched form of polyethyleneimine (PEI). A study of the growth mechanism indicated the morphology of the final product to be highly related to the molecular structure of the polymeric amine. Also, the preferred Pt-on-Pt deposition contributed to the formation of the 1D Pt nanowires. The Au/Pt wire nanoassemblies were functionalized with PEI at the same time that these nanoassemblies were synthesized due to the strong N-Pt bond. The chemically functionalized Au/Pt wire nanoassemblies exhibited better electrocatalytic activity for the electro-oxidation of oxalic acid than did commercial Pt black. Electronic supplementary information (ESI) available: Experimental details and additional physical characterization. See DOI: 10.1039/c5nr08150e

Who's on base? Revealing the catalytic mechanism of inverting family 6 glycoside hydrolases

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mayes, Heather B.; Knott, Brandon C.; Crowley, Michael F.

In several important classes of inverting carbohydrate-active enzymes, the identity of the catalytic base remains elusive, including in family 6 Glycoside Hydrolase (GH6) enzymes, which are key components of cellulase cocktails for cellulose depolymerization. Despite many structural and kinetic studies with both wild-type and mutant enzymes, especially on the Trichoderma reesei (Hypocrea jecorina) GH6 cellulase ( TrCel6A), the catalytic base in the single displacement inverting mechanism has not been definitively identified in the GH6 family. Here, we employ transition path sampling to gain insight into the catalytic mechanism, which provides unbiased atomic-level understanding of key order parameters involved in cleavingmore » the strong glycosidic bond. Our hybrid quantum mechanics and molecular mechanics (QM/MM) simulations reveal a network of hydrogen bonding that aligns two active site water molecules that play key roles in hydrolysis: one water molecule drives the reaction by nucleophilic attack on the substrate and a second shuttles a proton to the putative base (D175) via a short water wire. We also investigated the case where the putative base is mutated to an alanine, an enzyme that is experimentally still partially active. The simulations predict that proton hopping along a water wire via a Grotthuss mechanism provides a mechanism of catalytic rescue. Further simulations reveal that substrate processive motion is 'driven' by strong electrostatic interactions with the protein at the product sites and that the -1 sugar adopts a 2S O ring configuration as it reaches its binding site. Lastly, this work thus elucidates previously elusive steps in the processive catalytic mechanism of this important class of enzymes.« less

Who's on base? Revealing the catalytic mechanism of inverting family 6 glycoside hydrolases

DOE PAGES

Mayes, Heather B.; Knott, Brandon C.; Crowley, Michael F.; ...

2016-06-01

In several important classes of inverting carbohydrate-active enzymes, the identity of the catalytic base remains elusive, including in family 6 Glycoside Hydrolase (GH6) enzymes, which are key components of cellulase cocktails for cellulose depolymerization. Despite many structural and kinetic studies with both wild-type and mutant enzymes, especially on the Trichoderma reesei (Hypocrea jecorina) GH6 cellulase ( TrCel6A), the catalytic base in the single displacement inverting mechanism has not been definitively identified in the GH6 family. Here, we employ transition path sampling to gain insight into the catalytic mechanism, which provides unbiased atomic-level understanding of key order parameters involved in cleavingmore » the strong glycosidic bond. Our hybrid quantum mechanics and molecular mechanics (QM/MM) simulations reveal a network of hydrogen bonding that aligns two active site water molecules that play key roles in hydrolysis: one water molecule drives the reaction by nucleophilic attack on the substrate and a second shuttles a proton to the putative base (D175) via a short water wire. We also investigated the case where the putative base is mutated to an alanine, an enzyme that is experimentally still partially active. The simulations predict that proton hopping along a water wire via a Grotthuss mechanism provides a mechanism of catalytic rescue. Further simulations reveal that substrate processive motion is 'driven' by strong electrostatic interactions with the protein at the product sites and that the -1 sugar adopts a 2S O ring configuration as it reaches its binding site. Lastly, this work thus elucidates previously elusive steps in the processive catalytic mechanism of this important class of enzymes.« less

Ion-water wires in imidazolium-based ionic liquid/water solutions induce unique trends in density.

PubMed

Ghoshdastidar, Debostuti; Senapati, Sanjib

2016-03-28

Ionic liquid/water binary mixtures are rapidly gaining popularity as solvents for dissolution of cellulose, nucleobases, and other poorly water-soluble biomolecules. Hence, several studies have focused on measuring the thermophysical properties of these versatile mixtures. Among these, 1-ethyl-3-methylimidazolium ([emim]) cation-based ILs containing different anions exhibit unique density behaviours upon addition of water. While [emim][acetate]/water binary mixtures display an unusual rise in density with the addition of low-to-moderate amounts of water, those containing the [trifluoroacetate] ([Tfa]) anion display a sluggish decrease in density. The density of [emim][tetrafluoroborate] ([emim][BF4])/water mixtures, on the other hand, declines rapidly in close accordance with the experimental reports. Here, we unravel the structural basis underlying this unique density behavior of [emim]-based IL/water mixtures using all-atom molecular dynamics (MD) simulations. The results revealed that the distinct nature of anion-water hydrogen bonded networks in the three systems was a key in modulating the observed unique density behaviour. Vast expanses of uninterrupted anion-water-anion H-bonded stretches, denoted here as anion-water wires, induced significant structuring in [emim][Ac]/water mixtures that resulted in the density rise. Conversely, the presence of intermittent large water clusters disintegrated the anion-water wires in [emim][Tfa]/water and [emim][BF4]/water mixtures to cause a monotonic density decrease. The differential nanostructuring affected the dynamics of the solutions proportionately, with the H-bond making and breaking dynamics found to be greatly retarded in [emim][Ac]/water mixtures, while it exhibited a faster relaxation in the other two binary solutions.

Modified Process Reduces Porosity when Soldering in Reduced Gravity Environments

NASA Technical Reports Server (NTRS)

Watson, Kevin; Struk, Peter; Pettegrew, Richard; Downs, Robert; Haylett, Daniel

2012-01-01

A modified process yields lower levels of internal porosity for solder joints produced in reduced-gravity environments. The process incorporates both alternative materials and a modified procedure. The process provides the necessary cleaning action to enable effective bonding of the applied solder alloy with the materials to be joined. The modified process incorporates a commercially available liquid flux that is applied to the solder joint before heating with the soldering iron. It is subsequently heated with the soldering iron to activate the cleaning action of the flux and to evaporate most of the flux, followed by application of solder alloy in the form of commercially available solid solder wire (containing no flux). Continued heating ensures adequate flow of the solder alloy around and onto the materials to be joined. The final step is withdrawal of the soldering iron to allow alloy solidification and cooling of the solder joint.

Tungsten-reinforced tantalum

NASA Technical Reports Server (NTRS)

Bacigalupi, R. J.; Breitwieser, R.

1972-01-01

Method is described for producing tungsten-reinforced tantalum, a material possessing the high temperature strength of tungsten and room temperature ductility and weldability of tantalum. This material is produced by bonding together and overlaying structure of tungsten wires with chemical vapor deposited tantalum.

Control and Measurement of an Xmon with the Quantum Socket

NASA Astrophysics Data System (ADS)

McConkey, T. G.; Bejanin, J. H.; Earnest, C. T.; McRae, C. R. H.; Rinehart, J. R.; Weides, M.; Mariantoni, M.

The implementation of superconducting quantum processors is rapidly reaching scalability limitations. Extensible electronics and wiring solutions for superconducting quantum bits (qubits) are among the most imminent issues to be tackled. The necessity to substitute planar electrical interconnects (e.g., wire bonds) with three-dimensional wires is emerging as a fundamental pillar towards scalability. In a previous work, we have shown that three-dimensional wires housed in a suitable package, named the quantum socket, can be utilized to measure high-quality superconducting resonators. In this work, we set out to test the quantum socket with actual superconducting qubits to verify its suitability as a wiring solution in the development of an extensible quantum computing architecture. To this end, we have designed and fabricated a series of Xmon qubits. The qubits range in frequency from about 6 to 7 GHz with anharmonicity of 200 MHz and can be tuned by means of Z pulses. Controlling tunable Xmons will allow us to verify whether the three-dimensional wires contact resistance is low enough for qubit operation. Qubit T1 and T2 times and single qubit gate fidelities are compared against current standards in the field.

Metallurgical characterization of a new nickel-titanium wire for rotary endodontic instruments.

PubMed

Alapati, Satish B; Brantley, William A; Iijima, Masahiro; Clark, William A T; Kovarik, Libor; Buie, Caesar; Liu, Jie; Ben Johnson, William

2009-11-01

A novel thermomechanical processing procedure has been developed that yields a superelastic (SE) nickel-titanium (NiTi) wire (M-Wire) that laboratory testing shows has improved mechanical properties compared with conventional SE austenitic NiTi wires used for manufacture of rotary instruments. The objective of this study was to determine the origin of the improved mechanical properties. Specimens from 2 batches of M-Wire prepared under different processing conditions and from 1 batch of standard-processed SE wire for rotary instruments were examined by scanning transmission electron microscopy, temperature-modulated differential scanning calorimetry, micro-x-ray diffraction, and scanning electron microscopy with x-ray energy-dispersive spectrometric analyses. The processing for M-Wire yields a microstructure containing martensite, that the proportions of NiTi phases depend on processing conditions, and that the microstructure exhibits pronounced evidence of alloy strengthening. The presence of Ti(2)Ni precipitates in both microstructures indicates that M-Wire and the conventional SE wire for rotary instruments are titanium-rich.

Dynamic breaking of a single gold bond

NASA Astrophysics Data System (ADS)

Pobelov, Ilya V.; Lauritzen, Kasper Primdal; Yoshida, Koji; Jensen, Anders; Mészáros, Gábor; Jacobsen, Karsten W.; Strange, Mikkel; Wandlowski, Thomas; Solomon, Gemma C.

2017-07-01

While one might assume that the force to break a chemical bond gives a measure of the bond strength, this intuition is misleading. If the force is loaded slowly, thermal fluctuations may break the bond before it is maximally stretched, and the breaking force will be less than the bond can sustain. Conversely, if the force is loaded rapidly it is more likely that the maximum breaking force is measured. Paradoxically, no clear differences in breaking force were observed in experiments on gold nanowires, despite being conducted under very different conditions. Here we explore the breaking behaviour of a single Au-Au bond and show that the breaking force is dependent on the loading rate. We probe the temperature and structural dependencies of breaking and suggest that the paradox can be explained by fast breaking of atomic wires and slow breaking of point contacts giving very similar breaking forces.

Nylon screws make inexpensive coil forms

NASA Technical Reports Server (NTRS)

Aucoin, G.; Rosenthal, C.

1978-01-01

Standard nylon screws act as coil form copper wire laid down in spiral thread. Completed coil may be bonded to printed-circuit board. However, it is impossible to tune coil by adjusting spacing between windings, technique sometimes used with air-core coils.

The Quantum Socket: Wiring for Superconducting Qubits - Part 2

NASA Astrophysics Data System (ADS)

Bejanin, J. H.; McConkey, T. G.; Rinehart, J. R.; Bateman, J. D.; Earnest, C. T.; McRae, C. H.; Rohanizadegan, Y.; Shiri, D.; Mariantoni, M.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.

Quantum computing research has reached a level of maturity where quantum error correction (QEC) codes can be executed on linear arrays of superconducting quantum bits (qubits). A truly scalable quantum computing architecture, however, based on practical QEC algorithms, requires nearest neighbor interaction between qubits on a two-dimensional array. Such an arrangement is not possible with techniques that rely on wire bonding. To address this issue, we have developed the quantum socket, a device based on three-dimensional wires that enables the control of superconducting qubits on a two-dimensional grid. In this talk, we present experimental results characterizing this type of wiring. We will show that the quantum socket performs exceptionally well for the transmission and reflection of microwave signals up to 10 GHz, while minimizing crosstalk between adjacent wires. Under realistic conditions, we measured an S21 of -5 dB at 6 GHz and an average crosstalk of -60 dB. We also describe time domain reflectometry results and arbitrary pulse transmission tests, showing that the quantum socket can be used to control superconducting qubits.

Fabrication and characterization of one-dimensional multilayer gratings for nanoscale microscope calibration

NASA Astrophysics Data System (ADS)

Wang, Xingrui; Zhao, Yang; Liu, Jie; Chen, Jie; Li, Tongbao; Cheng, Xinbin

2016-09-01

One-dimensional multilayer gratings were prepared by four steps. A periodic Si/SiO2 multilayer was firstly deposited on Si substrate using a magnetron sputtering coating process. Then, the multilayer was been bonded and split into small pieces by diamond wire cutting. The side-wall of the cut sample was subsequently grinded and polished until the surface roughness was less than 1nm. Finally, the SiO2 layers were selective etched using hydrofluoric acid to form the grating structure. In the above steps, special attentions were given to optimize the etching processes to achieve a uniform and smooth grating pattern. Transmission electron microscope (TEM) was used to characterize the multilayer gratings. The pitch size of the grating was evaluated by an offline image analysis algorithm and optimized processes are discussed.

Modeling and simulation of the fluid flow in wire electrochemical machining with rotating tool (wire ECM)

NASA Astrophysics Data System (ADS)

Klocke, F.; Herrig, T.; Zeis, M.; Klink, A.

2017-10-01

Combining the working principle of electrochemical machining (ECM) with a universal rotating tool, like a wire, could manage lots of challenges of the classical ECM sinking process. Such a wire-ECM process could be able to machine flexible and efficient 2.5-dimensional geometries like fir tree slots in turbine discs. Nowadays, established manufacturing technologies for slotting turbine discs are broaching and wire electrical discharge machining (wire EDM). Nevertheless, high requirements on surface integrity of turbine parts need cost intensive process development and - in case of wire-EDM - trim cuts to reduce the heat affected rim zone. Due to the process specific advantages, ECM is an attractive alternative manufacturing technology and is getting more and more relevant for sinking applications within the last few years. But ECM is also opposed with high costs for process development and complex electrolyte flow devices. In the past, few studies dealt with the development of a wire ECM process to meet these challenges. However, previous concepts of wire ECM were only suitable for micro machining applications. Due to insufficient flushing concepts the application of the process for machining macro geometries failed. Therefore, this paper presents the modeling and simulation of a new flushing approach for process assessment. The suitability of a rotating structured wire electrode in combination with an axial flushing for electrodes with high aspect ratios is investigated and discussed.

Fabrication and development of several heat pipe honeycomb sandwich panel concepts. [airframe integrated scramjet engine

NASA Technical Reports Server (NTRS)

Tanzer, H. J.

1982-01-01

The feasibility of fabricating and processing liquid metal heat pipes in a low mass honeycomb sandwich panel configuration for application on the NASA Langley airframe-integrated Scramjet engine was investigated. A variety of honeycomb panel facesheet and core-ribbon wick concepts was evaluated within constraints dictated by existing manufacturing technology and equipment. The chosen design consists of an all-stainless steel structure, sintered screen facesheets, and two types of core-ribbon; a diffusion bonded wire mesh and a foil-screen composite. Cleaning, fluid charging, processing, and process port sealing techniques were established. The liquid metals potassium, sodium and cesium were used as working fluids. Eleven honeycomb panels 15.24 cm X 15.24 cm X 2.94 cm were delivered to NASA Langley for extensive performance testing and evaluation; nine panels were processed as heat pipes, and two panels were left unprocessed.

Forming Refractory Insulation On Copper Wire

NASA Technical Reports Server (NTRS)

Setlock, J.; Roberts, G.

1995-01-01

Alternative insulating process forms flexible coat of uncured refractory insulating material on copper wire. Coated wire formed into coil or other complex shape. Wire-coating apparatus forms "green" coat on copper wire. After wire coiled, heating converts "green" coat to refractory electrical insulator. When cured to final brittle form, insulating material withstands temperatures above melting temperature of wire. Process used to make coils for motors, solenoids, and other electrical devices to be operated at high temperatures.

Process for attaching molecular wires and devices to carbon nanotubes and compositions thereof

NASA Technical Reports Server (NTRS)

Yang, Jiping (Inventor); Tour, James M. (Inventor); Bahr, Jeffrey L. (Inventor)

2008-01-01

The present invention is directed towards processes for covalently attaching molecular wires and molecular electronic devices to carbon nanotubes and compositions thereof. Such processes utilize diazonium chemistry to bring about this marriage of wire-like nanotubes with molecular wires and molecular electronic devices.

Wiring up pre-characterized single-photon emitters by laser lithography

NASA Astrophysics Data System (ADS)

Shi, Q.; Sontheimer, B.; Nikolay, N.; Schell, A. W.; Fischer, J.; Naber, A.; Benson, O.; Wegener, M.

2016-08-01

Future quantum optical chips will likely be hybrid in nature and include many single-photon emitters, waveguides, filters, as well as single-photon detectors. Here, we introduce a scalable optical localization-selection-lithography procedure for wiring up a large number of single-photon emitters via polymeric photonic wire bonds in three dimensions. First, we localize and characterize nitrogen vacancies in nanodiamonds inside a solid photoresist exhibiting low background fluorescence. Next, without intermediate steps and using the same optical instrument, we perform aligned three-dimensional laser lithography. As a proof of concept, we design, fabricate, and characterize three-dimensional functional waveguide elements on an optical chip. Each element consists of one single-photon emitter centered in a crossed-arc waveguide configuration, allowing for integrated optical excitation and efficient background suppression at the same time.

Geiger-Mode Avalanche Photodiode Arrays Integrated to All-Digital CMOS Circuits

DTIC Science & Technology

2016-01-20

Figure 7 4×4 GMAPD array wire bonded to CMOS timing circuits Figure 8 Low‐fill‐factor APD design used in lidar sensors The APD doping...epitaxial growth and the pixels are isolated by mesa etch. 128×32 lidar image sensors were built by bump bonding the APD arrays to a CMOS timing...passive image sensor with this large a format based on hybridization of a GMAPD array to a CMOS readout. Fig. 14 shows one of the first images taken

Electroless epitaxial etching for semiconductor applications

DOEpatents

McCarthy, Anthony M.

2002-01-01

A method for fabricating thin-film single-crystal silicon on insulator substrates using electroless etching for achieving efficient etch stopping on epitaxial silicon substrates. Microelectric circuits and devices are prepared on epitaxial silicon wafers in a standard fabrication facility. The wafers are bonded to a holding substrate. The silicon bulk is removed using electroless etching leaving the circuit contained within the epitaxial layer remaining on the holding substrate. A photolithographic operation is then performed to define streets and wire bond pad areas for electrical access to the circuit.

"Grinding" cavities in polyurethane foam

NASA Technical Reports Server (NTRS)

Brower, J. R.; Davey, R. E.; Dixon, W. F.; Robb, P. H.; Zebus, P. P.

1980-01-01

Grinding tool installed on conventional milling machine cuts precise cavities in foam blocks. Method is well suited for prototype or midsize production runs and can be adapted to computer control for mass production. Method saves time and materials compared to bonding or hot wire techniques.

Progress on TSV technology for Medipix3RX chip

NASA Astrophysics Data System (ADS)

Sarajlić, M.; Pennicard, D.; Smoljanin, S.; Fritzsch, T.; Zoschke, K.; Graafsma, H.

2017-12-01

The progress of Through Silicon Via (TSV) technology for Medipix3RX chip done at DESY is presented here. The goal of this development is to replace the wire bonds in X-ray detectors with TSVs, in order to reduce the dead area between detectors. We obtained the first working chips assembled together with Si based sensors for X-ray detection. The 3D integration technology, including TSV, Re-distribution layer deposition, bump bonding to the Si sensor and bump bonding to the carrier PCB, was done by Fraunhofer Institute IZM in Berlin. After assembly, the module was successfully tested by recording background radiation and making X-ray images of small objects. The active area of the Medipix3RX chip is 14.1 mm×14.1 mm or 256×256 pixels. During TSV processing, the Medipix3RX chip was thinned from 775 μm original thickness, to 130 μm. The diameter of the vias is 40 μm, and the pitch between the vias is 120 μm. A liner filling approach was used to contact the TSV with the RDL on the backside of the Medipix3RX readout chip.

Stepwise vs concerted excited state tautomerization of 2-hydroxypyridine: Ammonia dimer wire mediated hydrogen/proton transfer

DOE Office of Scientific and Technical Information (OSTI.GOV)

Esboui, Mounir, E-mail: mounir.esboui@fst.rnu.tn; Technical and Vocational Training Corporation, Hail College of Technology, P.O. Box 1960, Hail 81441

The stepwise and concerted excited state intermolecular proton transfer (PT) and hydrogen transfer (HT) reactions in 2-hydroxypyridine-(NH{sub 3}){sub 2} complex in the gas phase under Cs symmetry constraint and without any symmetry constraints were performed using quantum chemical calculations. It shows that upon excitation, the hydrogen bonded in 2HP-(NH{sub 3}){sub 2} cluster facilitates the releasing of both hydrogen and proton transfer reactions along ammonia wire leading to the formation of the 2-pyridone tautomer. For the stepwise mechanism, it has been found that the proton and the hydrogen may transfer consecutively. These processes are distinguished from each other through charge translocationmore » analysis and the coupling between the motion of the proton and the electron density distribution along ammonia wire. For the complex under Cs symmetry, the excited state HT occurs on the A″({sup 1}πσ{sup ∗}) and A′({sup 1}nσ{sup ∗}) states over two accessible energy barriers along reaction coordinates, and excited state PT proceeds mainly through the A′({sup 1}ππ{sup ∗}) and A″({sup 1}nπ{sup ∗}) potential energy surfaces. For the unconstrained complex, potential energy profiles show two {sup 1}ππ{sup ∗}-{sup 1}πσ{sup ∗} conical intersections along enol → keto reaction path indicating that proton and H atom are localized, respectively, on the first and second ammonia of the wire. Moreover, the concerted excited state PT is competitive to take place with the stepwise process, because it proceeds over low barriers of 0.14 eV and 0.11 eV with respect to the Franck-Condon excitation of enol tautomer, respectively, under Cs symmetry and without any symmetry constraints. These barriers can be probably overcome through tunneling effect.« less

Effect of Pd Surface Roughness on the Bonding Process and High Temperature Reliability of Au Ball Bonds

NASA Astrophysics Data System (ADS)

Huang, Y.; Kim, H. J.; McCracken, M.; Viswanathan, G.; Pon, F.; Mayer, M.; Zhou, Y. N.

2011-06-01

A 0.3- μm-thick electrolytic Pd layer was plated on 1 μm of electroless Ni on 1 mm-thick polished and roughened Cu substrates with roughness values ( R a) of 0.08 μm and 0.5 μm, respectively. The rough substrates were produced with sand-blasting. Au wire bonding on the Ni/Pd surface was optimized, and the electrical reliability was investigated under a high temperature storage test (HTST) during 800 h at 250°C by measuring the ball bond contact resistance, R c. The average value of R c of optimized ball bonds on the rough substrate was 1.96 mΩ which was about 40.0% higher than that on the smooth substrate. The initial bondability increased for the rougher surface, so that only half of the original ultrasonic level was required, but the reliability was not affected by surface roughness. For both substrate types, HTST caused bond healing, reducing the average R c by about 21% and 27%, respectively. Au diffusion into the Pd layer was observed in scanning transmission electron microscopy/ energy dispersive spectroscopy (STEM-EDS) line-scan analysis after HTST. It is considered that diffusion of Au or interdiffusion between Au and Pd can provide chemically strong bonding during HTST. This is supported by the R c decrease measured as the aging time increased. Cu migration was indicated in the STEM-EDS analysis, but its effect on reliability can be ignored. Au and Pd tend to form a complete solid solution at the interface and can provide reliable interconnection for high temperature (250°C) applications.

The Quantum Socket: Wiring for Superconducting Qubits - Part 1

NASA Astrophysics Data System (ADS)

McConkey, T. G.; Bejanin, J. H.; Rinehart, J. R.; Bateman, J. D.; Earnest, C. T.; McRae, C. H.; Rohanizadegan, Y.; Shiri, D.; Mariantoni, M.; Penava, B.; Breul, P.; Royak, S.; Zapatka, M.; Fowler, A. G.

Quantum systems with ten superconducting quantum bits (qubits) have been realized, making it possible to show basic quantum error correction (QEC) algorithms. However, a truly scalable architecture has not been developed yet. QEC requires a two-dimensional array of qubits, restricting any interconnection to external classical systems to the third axis. In this talk, we introduce an interconnect solution for solid-state qubits: The quantum socket. The quantum socket employs three-dimensional wires and makes it possible to connect classical electronics with quantum circuits more densely and accurately than methods based on wire bonding. The three-dimensional wires are based on spring-loaded pins engineered to insure compatibility with quantum computing applications. Extensive design work and machining was required, with focus on material quality to prevent magnetic impurities. Microwave simulations were undertaken to optimize the design, focusing on the interface between the micro-connector and an on-chip coplanar waveguide pad. Simulations revealed good performance from DC to 10 GHz and were later confirmed against experimental measurements.

Investigation of current transfer in built-up superconductors

DOE Office of Scientific and Technical Information (OSTI.GOV)

Miller, J.R.; Dresner, L.; Lue, J.W.

1977-01-01

Superconductors carrying 10 kA or more have been widely suggested for use in fusion research and reactor magnets. Built-up or cable conductors have been proposed in which superconductor is concentrated in part of the conductor or part of the strands while the stabilizer occupies the rest. This scheme leads to substantial saving in manufacturing cost and to reduction of ac losses. Simplified analysis indicates that the current transfer from superconducting wire to normal wire takes place over a characteristic length depending on the resistivity of the contact barrier, the resistivity of the stabilizer, and the geometry of the conductor. Furthermore,more » the cold-end recovery suffers a reduction. Two types of conductors were constructed for the experimental test. Triplex conductors consisting of either three superconducting wires or two superconducting plus one copper wire were used to simulate cables. Laminated superconductor and copper strips with different soldering bonds were used for build-ups. Normal zone propagation and recovery experiments have been performed and results are compared with the theory.« less

A process chain for integrating piezoelectric transducers into aluminum die castings to generate smart lightweight structures

NASA Astrophysics Data System (ADS)

Stein, Stefan; Wedler, Jonathan; Rhein, Sebastian; Schmidt, Michael; Körner, Carolin; Michaelis, Alexander; Gebhardt, Sylvia

The application of piezoelectric transducers to structural body parts of machines or vehicles enables the combination of passive mechanical components with sensor and actuator functions in one single structure. According to Herold et al. [1] and Staeves [2] this approach indicates significant potential regarding smart lightweight construction. To obtain the highest yield, the piezoelectric transducers need to be integrated into the flux of forces (load path) of load bearing structures. Application in a downstream process reduces yield and process efficiency during manufacturing and operation, due to the necessity of a subsequent process step of sensor/actuator application. The die casting process offers the possibility for integration of piezoelectric transducers into metal structures. Aluminum castings are particularly favorable due to their high quality and feasibility for high unit production at low cost (Brunhuber [3], Nogowizin [4]). Such molded aluminum parts with integrated piezoelectric transducers enable functions like active vibration damping, structural health monitoring or energy harvesting resulting in significant possibilities of weight reduction, which is an increasingly important driving force of automotive and aerospace industry (Klein [5], Siebenpfeiffer [6]) due to increasingly stringent environmental protection laws. In the scope of those developments, this paper focuses on the entire process chain enabling the generation of lightweight metal structures with sensor and actuator function, starting from the manufacturing of piezoelectric modules over electrical and mechanical bonding to the integration of such modules into aluminum (Al) matrices by die casting. To achieve this challenging goal, piezoceramic sensors/actuator modules, so-called LTCC/PZT modules (LPM) were developed, since ceramic based piezoelectric modules are more likely to withstand the thermal stress of about 700 °C introduced by the casting process (Flössel et al., [7]). The modules are made of low temperature cofired ceramic (LTCC) tapes with an embedded lead zirconate titanate (PZT) plate and are manufactured in multilayer technique. For joining conducting copper (Cu) wires with the electrode structure of the LPM, a novel laser drop on demand wire bonding method (LDB) is applied, which is based on the melting of a spherical CuSn12 braze preform with a liquidus temperature Tliquid of 989.9 °C (Deutsches Kupfer-Institut Düsseldorf, [8]) providing sufficient thermal stability for a subsequent casting process.

Test systems of the STS-XYTER2 ASIC: from wafer-level to in-system verification

NASA Astrophysics Data System (ADS)

Kasinski, Krzysztof; Zubrzycka, Weronika

2016-09-01

The STS/MUCH-XYTER2 ASIC is a full-size prototype chip for the Silicon Tracking System (STS) and Muon Chamber (MUCH) detectors in the new fixed-target experiment Compressed Baryonic Matter (CBM) at FAIR-center, Darmstadt, Germany. The STS assembly includes more than 14000 ASICs. The complicated, time-consuming, multi-step assembly process of the detector building blocks and tight quality assurance requirements impose several intermediate testing to be performed for verifying crucial assembly steps (e.g. custom microcable tab-bonding before wire-bonding to the PCB) and - if necessary - identifying channels or modules for rework. The chip supports the multi-level testing with different probing / contact methods (wafer probe-card, pogo-probes, in-system tests). A huge number of ASICs to be tested restricts the number and kind of tests possible to be performed within a reasonable time. The proposed architectures of test stand equipment and a brief summary of methodologies are presented in this paper.

Composite ceramic superconducting wires for electric motor applications

NASA Astrophysics Data System (ADS)

Halloran, John W.

1988-12-01

This is the Second Quarterly report on a project to develop HTSC wire for an HTSC motor. The raw material for fiber production is an improved YBa2Cu3O(7-x) powder. Continuous spools of green YBa2Cu3O(7-x) fiber are being produced. The major effort in fiber spinning is aimed at improving fiber quality and reducing fiber. Binder burnout and sintering has been intensively investigated. Fiber sintering fibers is done by the rapid zone sintering method. A continuous furnace received near the end of this Quarter will be used for continuous sintering. Continuous silver coated green fiber are produced. We have made progress toward continuous cladding using the mechanical cladding concept. The melt spinning process was successfully applied to YBa2Cu3O(7-x) powders at 50 vol percent solids loadings. The cladding work centered on mechanical cladding of silver treated filaments by solder bonding to copper strips. Aluminum deposits on YBa2Cu3O(7-x) filament surfaces were produced by MOCVD at ATM, but the superconductivity was degraded. Electrical characterization work focused on methods of making low resistance contacts on YBa2Cu3O(7-x) filaments. Emerson Motor Division has begun work on DC heteropolar and homopolar motor designs. The mechanical stresses on conventional copper wires during winding have been characterized to determine the mechanical parameters of motor building.

Effect of High Temperature Storage in Vacuum, Air, and Humid Conditions on Degradation of Gold/Aluminum Wire Bonds in PEMs

NASA Technical Reports Server (NTRS)

Teverovsky, Alexander

2006-01-01

Microcircuits encapsulated in three plastic package styles were stored in different environments at temperatures varying from 130 C to 225 C for up to 4,000 hours in some cases. To assess the effect of oxygen, the parts were aged at high temperatures in air and in vacuum chambers. The effect of humidity was evaluated during long-term highly accelerated temperature and humidity stress testing (HAST) at temperatures of 130 C and 150 C. High temperature storage testing of decapsulated microcircuits in air, vacuum, and HAST chambers was carried out to evaluate the role of molding compounds in the environmentally-induced degradation and failure of wire bonds (WB). This paper reports on accelerating factors of environment and molding compound on WB failures. It has been shown that all environments, including oxygen, moisture, and the presence of molding compounds reduce time-to-failures compared to unencapsulated devices in vacuum conditions. The mechanism of the environmental effect on KB degradation is discussed.

Structural Characterization of N-Alkylated Twisted Amides: Consequences for Amide Bond Resonance and N-C Cleavage.

PubMed

Hu, Feng; Lalancette, Roger; Szostak, Michal

2016-04-11

Herein, we describe the first structural characterization of N-alkylated twisted amides prepared directly by N-alkylation of the corresponding non-planar lactams. This study provides the first experimental evidence that N-alkylation results in a dramatic increase of non-planarity around the amide N-C(O) bond. Moreover, we report a rare example of a molecular wire supported by the same amide C=O-Ag bonds. Reactivity studies demonstrate rapid nucleophilic addition to the N-C(O) moiety of N-alkylated amides, indicating the lack of n(N) to π*(C=O) conjugation. Most crucially, we demonstrate that N-alkylation activates the otherwise unreactive amide bond towards σ N-C cleavage by switchable coordination. © 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Impact of different rectangular wires on torsional expression of different sizes of buccal tube.

PubMed

Ajami, Shabnam; Boroujeni, Afshar-Rasti

2018-01-01

Torsions in rectangular wires are the essential part of corrections in the finishing stage of treatment. Moreover the greatest amounts of torques are applied in the molar areas. a clinically effective moment is between 5 and 20 Nmm. In this study we have decided to evaluate the impact of different tube sizes and different dimensions of wires with different modulus of elasticities on the amount torsional bond strength of molar tubes. 60 human impacted molar teeth were collected. A buccal tube was bonded on the buccal surface of all the samples by using light cured adhesive resin. After that, the teeth were mounted in a hard acrylic block. According to the size of buccal tube and the rectangular wires to be tested 4 groups will be designed. Torsional force was applied by instron machine. The torque angle at 5Nmm and at 20Nmm point will be calculated: which means, how many degrees of torque is required to reach the maximum 20Nmm moment from the minimum 5Nmm.One-way ANOVA was used to compare torque angle in all of the groups. The least amount of clinically significant angle was 2.2 ᵒ in the 0.017×0.025 SS and the largest amount of it was 23.7 ᵒ in the 0.017×0.025 TMA in 0.018×0.025 slot molar tube. But, this angle was 19.9 ᵒand 13.6 ᵒ in 0.019×0.025 SS and 0.019×0.025 TMA archwire in 0.022×0.028 molar tube. The 0.017×0.025 SS archwire in 0.018×0.025 molar tube had the lowest clinically significant angle. The largest amount was seen in group 0.017×0.025 TMA in 0.018×0.025 slot molar tube. Key words: Torsional efficacy, rectangular wires, buccal tubes, torque angle.

Impact of different rectangular wires on torsional expression of different sizes of buccal tube

PubMed Central

Boroujeni, Afshar-Rasti

2018-01-01

Background Torsions in rectangular wires are the essential part of corrections in the finishing stage of treatment. Moreover the greatest amounts of torques are applied in the molar areas. a clinically effective moment is between 5 and 20 Nmm. In this study we have decided to evaluate the impact of different tube sizes and different dimensions of wires with different modulus of elasticities on the amount torsional bond strength of molar tubes. Material and Methods 60 human impacted molar teeth were collected. A buccal tube was bonded on the buccal surface of all the samples by using light cured adhesive resin. After that, the teeth were mounted in a hard acrylic block. According to the size of buccal tube and the rectangular wires to be tested 4 groups will be designed. Torsional force was applied by instron machine. The torque angle at 5Nmm and at 20Nmm point will be calculated: which means, how many degrees of torque is required to reach the maximum 20Nmm moment from the minimum 5Nmm.One-way ANOVA was used to compare torque angle in all of the groups. Results The least amount of clinically significant angle was 2.2 ᵒ in the 0.017×0.025 SS and the largest amount of it was 23.7 ᵒ in the 0.017×0.025 TMA in 0.018×0.025 slot molar tube. But, this angle was 19.9 ᵒand 13.6 ᵒ in 0.019×0.025 SS and 0.019×0.025 TMA archwire in 0.022×0.028 molar tube. Conclusions The 0.017×0.025 SS archwire in 0.018×0.025 molar tube had the lowest clinically significant angle. The largest amount was seen in group 0.017×0.025 TMA in 0.018×0.025 slot molar tube. Key words: Torsional efficacy, rectangular wires, buccal tubes, torque angle. PMID:29670712

Weld Wire Investigation Summary

DOE Office of Scientific and Technical Information (OSTI.GOV)

Cunningham, M.A.

1999-03-22

After GTA welding reservoir A production/process prove-in assemblies, X-ray examination detected a lack of sidewall fusion. After examining several possible causes, it was determined that the weld wire filler metal was responsible, particularly the wire cleaning process. The final conclusion was that the filler wire must be abrasively cleaned in a particular manner to perform as required. The abrasive process was incorporated into the wire material specification, ensuring consistency for all reservoir GTA welding at AlliedSignal Federal Manufacturing and Technologies (FM and T).

H+-type and OH--type biological protonic semiconductors and complementary devices

NASA Astrophysics Data System (ADS)

Deng, Yingxin; Josberger, Erik; Jin, Jungho; Rousdari, Anita Fadavi; Helms, Brett A.; Zhong, Chao; Anantram, M. P.; Rolandi, Marco

2013-10-01

Proton conduction is essential in biological systems. Oxidative phosphorylation in mitochondria, proton pumping in bacteriorhodopsin, and uncoupling membrane potentials by the antibiotic Gramicidin are examples. In these systems, H+ hop along chains of hydrogen bonds between water molecules and hydrophilic residues - proton wires. These wires also support the transport of OH- as proton holes. Discriminating between H+ and OH- transport has been elusive. Here, H+ and OH- transport is achieved in polysaccharide- based proton wires and devices. A H+- OH- junction with rectifying behaviour and H+-type and OH--type complementary field effect transistors are demonstrated. We describe these devices with a model that relates H+ and OH- to electron and hole transport in semiconductors. In turn, the model developed for these devices may provide additional insights into proton conduction in biological systems.

H+-type and OH−-type biological protonic semiconductors and complementary devices

PubMed Central

Deng, Yingxin; Josberger, Erik; Jin, Jungho; Rousdari, Anita Fadavi; Helms, Brett A.; Zhong, Chao; Anantram, M. P.; Rolandi, Marco

2013-01-01

Proton conduction is essential in biological systems. Oxidative phosphorylation in mitochondria, proton pumping in bacteriorhodopsin, and uncoupling membrane potentials by the antibiotic Gramicidin are examples. In these systems, H+ hop along chains of hydrogen bonds between water molecules and hydrophilic residues – proton wires. These wires also support the transport of OH− as proton holes. Discriminating between H+ and OH− transport has been elusive. Here, H+ and OH− transport is achieved in polysaccharide- based proton wires and devices. A H+- OH− junction with rectifying behaviour and H+-type and OH−-type complementary field effect transistors are demonstrated. We describe these devices with a model that relates H+ and OH− to electron and hole transport in semiconductors. In turn, the model developed for these devices may provide additional insights into proton conduction in biological systems. PMID:24089083

Use of beam deflection to control an electron beam wire deposition process

NASA Technical Reports Server (NTRS)

Taminger, Karen M. (Inventor); Hofmeister, William H. (Inventor); Hafley, Robert A. (Inventor)

2013-01-01

A method for controlling an electron beam process wherein a wire is melted and deposited on a substrate as a molten pool comprises generating the electron beam with a complex raster pattern, and directing the beam onto an outer surface of the wire to thereby control a location of the wire with respect to the molten pool. Directing the beam selectively heats the outer surface of the wire and maintains the position of the wire with respect to the molten pool. An apparatus for controlling an electron beam process includes a beam gun adapted for generating the electron beam, and a controller adapted for providing the electron beam with a complex raster pattern and for directing the electron beam onto an outer surface of the wire to control a location of the wire with respect to the molten pool.

Transferrable monolithic multicomponent system for near-ultraviolet optoelectronics

NASA Astrophysics Data System (ADS)

Qin, Chuan; Gao, Xumin; Yuan, Jialei; Shi, Zheng; Jiang, Yuan; Liu, Yuhuai; Wang, Yongjin; Amano, Hiroshi

2018-05-01

A monolithic near-ultraviolet multicomponent system is implemented on a 0.8-mm-diameter suspended membrane by integrating a transmitter, waveguide, and receiver into a single chip. Two identical InGaN/Al0.10Ga0.90N multiple-quantum well (MQW) diodes are fabricated using the same process flow, which separately function as a transmitter and receiver. There is a spectral overlap between the emission and detection spectra of the MQW diodes. Therefore, the receiver can respond to changes in the emission of the transmitter. The multicomponent system is mechanically transferred from silicon, and the wire-bonded transmitter on glass experimentally demonstrates spatial light transmission at 200 Mbps using non-return-to-zero on–off keying modulation.

Study of a reinforced concrete beam strengthened using a combination of SMA wire and CFRP plate

NASA Astrophysics Data System (ADS)

Liu, Zhi-qiang; Li, Hui

2006-03-01

Traditional methods used for strengthening of reinforced concrete (RC) structures, such as bonding of steel plates, suffer from inherent disadvantages. In recent years, strengthening of RC structures using carbon fiber reinforced polymer (CFRP) plates has attracted considerable attentions around the world. Most existing research on CFRP plate bonding for flexural strengthening of RC beams has been carried out for the strength enhancement. However, little research is focused on effect of residual deformations on the strengthening. The residual deformations have an important effect on the strengthening by CFRP plates. There exists a very significant challenge how the residual deformations are reduced. Shape memory alloy (SMA) has showed outstanding functional properties as an actuator. It is a possibility that SMA can be used to reduce the residual deformation and make cracks of concrete close by imposing the recovery forces on the concrete in the tensile zone. It is only an emergency damage repair since the SMA wires need to be heated continuously. So, an innovative method of a RC beam strengthened by CFRP plates in combination with SMA wires was first investigated experimentally in this paper. In addition, the nonlinear finite element software of ABAQUS was employed to further simulate the behavior of RC beams strengthened through the new strengthening method. It can be found that this is an excellent and effective strengthening method.

Advanced processing of CdTe pixel radiation detectors

NASA Astrophysics Data System (ADS)

Gädda, A.; Winkler, A.; Ott, J.; Härkönen, J.; Karadzhinova-Ferrer, A.; Koponen, P.; Luukka, P.; Tikkanen, J.; Vähänen, S.

2017-12-01

We report a fabrication process of pixel detectors made of bulk cadmium telluride (CdTe) crystals. Prior to processing, the quality and defect density in CdTe material was characterized by infrared (IR) spectroscopy. The semiconductor detector and Flip-Chip (FC) interconnection processing was carried out in the clean room premises of Micronova Nanofabrication Centre in Espoo, Finland. The chip scale processes consist of the aluminum oxide (Al2O3) low temperature thermal Atomic Layer Deposition (ALD), titanium tungsten (TiW) metal sputtering depositions and an electroless Nickel growth. CdTe crystals with the size of 10×10×0.5 mm3 were patterned with several photo-lithography techniques. In this study, gold (Au) was chosen as the material for the wettable Under Bump Metalization (UBM) pads. Indium (In) based solder bumps were grown on PSI46dig read out chips (ROC) having 4160 pixels within an area of 1 cm2. CdTe sensor and ROC were hybridized using a low temperature flip-chip (FC) interconnection technique. The In-Au cold weld bonding connections were successfully connecting both elements. After the processing the detector packages were wire bonded into associated read out electronics. The pixel detectors were tested at the premises of Finnish Radiation Safety Authority (STUK). During the measurement campaign, the modules were tested by exposure to a 137Cs source of 1.5 TBq for 8 minutes. We detected at the room temperature a photopeak at 662 keV with about 2 % energy resolution.

Using wire shaping techniques and holographic optics to optimize deposition characteristics in wire-based laser cladding.

PubMed

Goffin, N J; Higginson, R L; Tyrer, J R

2016-12-01

In laser cladding, the potential benefits of wire feeding are considerable. Typical problems with the use of powder, such as gas entrapment, sub-100% material density and low deposition rate are all avoided with the use of wire. However, the use of a powder-based source material is the industry standard, with wire-based deposition generally regarded as an academic curiosity. This is because, although wire-based methods have been shown to be capable of superior quality results, the wire-based process is more difficult to control. In this work, the potential for wire shaping techniques, combined with existing holographic optical element knowledge, is investigated in order to further improve the processing characteristics. Experiments with pre-placed wire showed the ability of shaped wire to provide uniformity of wire melting compared with standard round wire, giving reduced power density requirements and superior control of clad track dilution. When feeding with flat wire, the resulting clad tracks showed a greater level of quality consistency and became less sensitive to alterations in processing conditions. In addition, a 22% increase in deposition rate was achieved. Stacking of multiple layers demonstrated the ability to create fully dense, three-dimensional structures, with directional metallurgical grain growth and uniform chemical structure.

Using wire shaping techniques and holographic optics to optimize deposition characteristics in wire-based laser cladding

PubMed Central

Higginson, R. L.; Tyrer, J. R.

2016-01-01

In laser cladding, the potential benefits of wire feeding are considerable. Typical problems with the use of powder, such as gas entrapment, sub-100% material density and low deposition rate are all avoided with the use of wire. However, the use of a powder-based source material is the industry standard, with wire-based deposition generally regarded as an academic curiosity. This is because, although wire-based methods have been shown to be capable of superior quality results, the wire-based process is more difficult to control. In this work, the potential for wire shaping techniques, combined with existing holographic optical element knowledge, is investigated in order to further improve the processing characteristics. Experiments with pre-placed wire showed the ability of shaped wire to provide uniformity of wire melting compared with standard round wire, giving reduced power density requirements and superior control of clad track dilution. When feeding with flat wire, the resulting clad tracks showed a greater level of quality consistency and became less sensitive to alterations in processing conditions. In addition, a 22% increase in deposition rate was achieved. Stacking of multiple layers demonstrated the ability to create fully dense, three-dimensional structures, with directional metallurgical grain growth and uniform chemical structure. PMID:28119550

Welding wire selection critical to jet engine repair work

NASA Astrophysics Data System (ADS)

1992-11-01

A review is provided of issues related to the selection of welding wire for aircraft gas-turbine engines emphasizing the importance of cleanliness in the welding wire product. A three-step metallurgical control process is described for the production of welding wire that is clean and suitable for turbine repair. The process is based on: (1) vacuum induction melting; (2) contamination-free processing of the wire; and (3) environmentally controlled packaging. Weld work on aerospace casting is shown to be useful and suitable for many alloy and superalloy materials with various filler materials.

Respectful Youth Cultures

ERIC Educational Resources Information Center

Laursen, Erik K.

2014-01-01

Children are social beings who rely on interactions with others to survive and thrive. Since the human brain is wired to connect, cultures in schools and youth organizations must be designed so youth can bond to supportive peers and adults. Children learn through observation, modeling, and responding to people in their environments. Bronfenbrenner…

Wire Composition: Its Effect on Metal Disintegration and Particle Formation in Twin-Wire Arc-Spraying Process

NASA Astrophysics Data System (ADS)

Tillmann, W.; Abdulgader, M.

2013-03-01

The wire tips in twin-wire arc-spraying (TWAS) are heated in three different zones. A high-speed camera was used to observe the melting behavior, metal breakup, and particle formation under different operating conditions. In zone (I), the wire tips are melted (liquidus metal) and directly atomized in the form of smaller droplets. Their size is a function of the specific properties of the molten metal and the exerting aerodynamic forces. Zone (II) is directly beneath zone (I) and the origin of the extruded metal sheets at the wire tips. The extruded metal sheets in the case of cored wires are shorter than those observed while using solid wires. In this study, the effects of adjustable parameters and powder filling on melting behavior, particle formation, and process instability were revealed, and a comparison between solid and cored wires was made. The findings can improve the accuracy of the TWAS process modeling.

Influence of metal bonding layer on strain transfer performance of FBG

NASA Astrophysics Data System (ADS)

Liu, Hao; Chen, Weimin; Zhang, Peng; Liu, Li; Shu, Yuejie; Wu, Jun

2013-01-01

Metal bonding layer seriously affects the strain transfer performance of Fiber Bragg Grating (FBG). Based on the mode of FBG strain transfer, the influence of the length, the thickness, Poisson's ratio, elasticity modulus of metal bonding layer on the strain transfer coefficient of FBG is analyzed by numerical simulation. FBG is packaged to steel wire using metal bonding technology of FBG. The tensile tests of different bonding lengths and elasticity modulus are carried out. The result shows the strain transfer coefficient of FBGs are 0.9848,0.962 and their average strain sensitivities are 1.076 pm/μɛ,1.099 pm/μɛ when the metal bonding layer is zinc, whose lengths are 15mm, 20mm, respectively. The strain transfer coefficient of FBG packaged by metal bonding layer raises 8.9 percent compared to epoxy glue package. The preliminary experimental results show that the strain transfer coefficient increases with the length of metal bonding layer, decreases with the thickness of metal bonding layer and the influence of Poisson's ratio can be ignored. The experiment result is general agreement with the analysis and provides guidance for metal package of FBG.

Indium Hybridization of Large Format TES Bolometer Arrays to Readout Multiplexers for Far-Infrared Astronomy

NASA Technical Reports Server (NTRS)

Miller, Timothy M.; Costen, Nick; Allen, Christine

2007-01-01

The advance of new detector technologies combined with enhanced fabrication methods has resulted in an increase in development of large format arrays. The next generation of scientific instruments will utilize detectors containing hundreds to thousands of elements providing a more efficient means to conduct large area sky surveys. Some notable detectors include a 32x32 x-ray microcalorimeter for Constellation-X, an infrared bolometer called SAFIRE to fly on the airborne observatory SOFIA, and the sub-millimeter bolometer SCUBA-2 to be deployed at the JCMT which will use more than 10,000 elements for two colors, each color using four 32x40 arrays. Of these detectors, SCUBA-2 is farthest along in development and uses indium hybridization to multiplexers for readout of the large number of elements, a technology that will be required to enable the next generation of large format arrays. Our current efforts in working toward large format arrays have produced GISMO, the Goddard IRAM Superconducting 2-Millimeter observer. GISMO is a far infrared instrument to be field tested later this year at the IRAM 30 meter telescope in Spain. GISMO utilizes transition edge sensor (TES) technology in an 8x16 filled array format that allows for typical fan-out wiring and wire-bonding to four 1x32 NIST multiplexers. GISMO'S electrical wiring is routed along the tops of 30 micron walls which also serve as the mechanical framework for the array. This architecture works well for the 128 element array, but is approaching the limit for routing the necessary wires along the surface while maintaining a high fill factor. Larger format arrays will benefit greatly from making electrical connections through the wafer to the backside, where they can be hybridized to a read-out substrate tailored to handling the wiring scheme. The next generation array we are developing is a 32x40 element array on a pitch of 1135 microns that conforms to the NIST multiplexer, already developed for the SCUBA-2 instrument This architecture will utilize electrical connections that route from the TES to the support frame and through the wafer. The detector chip will then be hybridized to the NIST multiplexer via indium bump bonding. In our development scheme we are using substrates that allow for diagnostic testing of electrical continuity across the entire array and we are testing our process to minimize or eliminate any contact resistance at metal interfaces. Our goal is hybridizing a fully functional 32x40 array of TES bolometers to a NIST multiplexer. The following work presents our current progress toward enabling this technology.

Development and Properties of Advanced Internal Magnesium Infiltration (AIMI) Processed MgB2 Wires

DOE Office of Scientific and Technical Information (OSTI.GOV)

Collings, Prof Edward William; Sumption, Prof Michael D; Li, Guangze

The development, processing, properties, and formation mechanisms of Advanced Internal Magnesium Infiltration (AIMI) MgB2 wires are discussed against a background of the related and original processes, Internal-Magnesium-Diffusion (IMD) and Magnesium-Reactive-Liquid-Infiltration (Mg-RLI). First reviewed are the formation, properties and applications of Mg-RLI bulks as basis for discussions of Mg-RLI-processed and IMD-processed wires. The transition from Mg-RLI- and IMD- to AIMI wires is explained, and the relative performances of powder-in-tube (PIT), IMD and AIMI wires are summarized in the form of an iso-Je diagram of Jc,nb versus Anb/ATOT in which ATOT, Anb, Jc,nb, and Je are, respectively, the wire s cross-sectional area,more » the area inside the chemical barrier, the critical current (Ic) normalized to Anb, and Ic normalized to ATOT. After the details of AIMI wire fabrication selection of starting powders, dopants, and reaction heat treatments are introduced the report goes on to describe in detail the development of high performance AIMI wires: layer Jcs, fill factors, Jes, and the effects of wire size, multifilamentarization, doping with C, and co-doping with C and Dy2O3. The two-stage mechanism of layer formation in AIMI wires is discussed: first the reactive infiltration of liquid Mg into a porous B pack, a process that terminates with the formation of a dense MgB2 layer; second the slow diffusion of Mg into any remaining B through that MgB2 layer. The report concludes with a brief general discussion of anisotropy, current percolation, and the Jc field dependence of MgB2 wires.« less

In Situ Electrochemical Deposition of Microscopic Wires

NASA Technical Reports Server (NTRS)

Yun, Minhee; Myung, Nosang; Vasquez, Richard

2005-01-01

A method of fabrication of wires having micron and submicron dimensions is built around electrochemical deposition of the wires in their final positions between electrodes in integrated circuits or other devices in which the wires are to be used. Heretofore, nanowires have been fabricated by a variety of techniques characterized by low degrees of controllability and low throughput rates, and it has been necessary to align and electrically connect the wires in their final positions by use of sophisticated equipment in expensive and tedious post-growth assembly processes. The present method is more economical, offers higher yields, enables control of wire widths, and eliminates the need for post-growth assembly. The wires fabricated by this method could be used as simple electrical conductors or as transducers in sensors. Depending upon electrodeposition conditions and the compositions of the electroplating solutions in specific applications, the wires could be made of metals, alloys, metal oxides, semiconductors, or electrically conductive polymers. In this method, one uses fabrication processes that are standard in the semiconductor industry. These include cleaning, dry etching, low-pressure chemical vapor deposition, lithography, dielectric deposition, electron-beam lithography, and metallization processes as well as the electrochemical deposition process used to form the wires. In a typical case of fabrication of a circuit that includes electrodes between which microscopic wires are to be formed on a silicon substrate, the fabrication processes follow a standard sequence until just before the fabrication of the microscopic wires. Then, by use of a thermal SiO-deposition technique, the electrodes and the substrate surface areas in the gaps between them are covered with SiO. Next, the SiO is electron-beam patterned, then reactive-ion etched to form channels having specified widths (typically about 1 m or less) that define the widths of the wires to be formed. Drops of an electroplating solution are placed on the substrate in the regions containing the channels thus formed, then the wires are electrodeposited from the solution onto the exposed portions of the electrodes and into the channels. The electrodeposition is a room-temperature, atmospheric-pressure process. The figure shows an example of palladium wires that were electrodeposited into 1-mm-wide channels between gold electrodes.

Three-dimensional finite element analysis of the shear bond test.

PubMed

DeHoff, P H; Anusavice, K J; Wang, Z

1995-03-01

The purpose of this study was to use finite element analyses to model the planar shear bond test and to evaluate the effects of modulus values, bonding agent thickness, and loading conditions on the stress distribution in the dentin adjacent to the bonding agent-dentin interface. All calculations were performed with the ANSYS finite element program. The planar shear bond test was modeled as a cylinder of resin-based composite bonded to a cylindrical dentin substrate. The effects of material, geometry and loading variables were determined primarily by use of a three-dimensional structural element. Several runs were also made using an axisymmetric element with harmonic loading and a plane strain element to determine whether two-dimensional analyses yield valid results. Stress calculations using three-dimensional finite element analyses confirmed the presence of large stress concentration effects for all stress components at the bonding agent-dentin interface near the application of the load. The maximum vertical shear stress generally occurs approximately 0.3 mm below the loading site and then decreases sharply in all directions. The stresses reach relatively uniform conditions within about 0.5 mm of the loading site and then increase again as the lower region of the interface is approached. Calculations using various loading conditions indicated that a wire-loop method of loading leads to smaller stress concentration effects, but a shear bond strength determined by dividing a failure load by the cross-sectional area grossly underestimates the true interfacial bond strength. Most dental researchers are using tensile and shear bond tests to predict the effects of process and material variables on the clinical performance of bonding systems but no evidence has yet shown that bond strength is relevant to clinical performance. A critical factor in assessing the usefulness of bond tests is a thorough understanding of the stress states that cause failure in the bond test and then to assess whether these stress states also exist in the clinical situation. Finite element analyses can help to answer this question but much additional work is needed to identify the failure modes in service and to relate these failures to particular loading conditions. The present study represents only a first step in understanding the stress states in the planar shear bond test.

A cost-effective 25-Gb/s EML TOSA using all-in-one FPCB wiring and metal optical bench.

PubMed

Han, Young-Tak; Kwon, Oh-Kee; Lee, Dong-Hun; Lee, Chul-Wook; Leem, Young-Ahn; Shin, Jang-Uk; Park, Sang-Ho; Baek, Yongsoon

2013-11-04

We present a cost-effective 25-Gb/s electro-absorption modulator integrated laser (EML) transmitter optical sub-assembly (TOSA) using all-in-one flexible printed circuit board (FPCB) wiring and a metal optical bench (MOB). For a low cost and high bandwidth TOSA, internal and external wirings and feed-through of the TOSA to transmit radio-frequency (RF) signal are configured all-in-one using the FPCB. The FPCB is extended from an exterior of the TOSA package up to an EML chip inside the package through the slit formed on a rear sidewall of the package and die-bonded on the MOB. The EML TOSA shows a modulated output power of more than 3.5 dBm and a clear eye pattern with a dynamic extinction ratio of ~8.4 dB at a data rate of 25.78 Gb/s.

Two-probe STM experiments at the atomic level.

PubMed

Kolmer, Marek; Olszowski, Piotr; Zuzak, Rafal; Godlewski, Szymon; Joachim, Christian; Szymonski, Marek

2017-11-08

Direct characterization of planar atomic or molecular scale devices and circuits on a supporting surface by multi-probe measurements requires unprecedented stability of single atom contacts and manipulation of scanning probes over large, nanometer scale area with atomic precision. In this work, we describe the full methodology behind atomically defined two-probe scanning tunneling microscopy (STM) experiments performed on a model system: dangling bond dimer wire supported on a hydrogenated germanium (0 0 1) surface. We show that 70 nm long atomic wire can be simultaneously approached by two independent STM scanners with exact probe to probe distance reaching down to 30 nm. This allows direct wire characterization by two-probe I-V characteristics at distances below 50 nm. Our technical results presented in this work open a new area for multi-probe research, which can be now performed with precision so far accessible only by single-probe scanning probe microscopy (SPM) experiments.

Improvement of orthodontic friction by coating archwire with carbon nitride film

NASA Astrophysics Data System (ADS)

Wei, Songbo; Shao, Tianmin; Ding, Peng

2011-10-01

In order to reduce frictional resistance between archwire and bracket during orthodontic tooth movement, carbon nitride (CNx) thin films were deposited on the surface of archwires with ion beam assisted deposition (IBAD). The energy-dispersive X-ray spectrometer (EDS) analysis showed that the CNx film was successfully deposited on the surface of the orthodontic wires. X-ray photoelectron spectroscopy (XPS) analysis suggested that the deposited CNx film was sp 2 carbon dominated structures, and diversiform bonds (N sbnd C, N tbnd C, et al.) coexisted in the film. The friction tests indicated that the CNx film significantly reduced the wire-bracket friction both in ambient air and in artificial saliva. The sp 2C rich structure of the CNx film as well as its protection function for the archwire was responsible for the low friction of the wire-bracket sliding system.

IEEE 1988 International Symposium on Electromagnetic Compatibility, Seattle, WA, Aug. 2-4, 1988, Record

NASA Astrophysics Data System (ADS)

Various papers on electromagnetic compatibility are presented. Some of the optics considered include: field-to-wire coupling 1 to 18 GHz, SHF/EHF field-to-wire coupling model, numerical method for the analysis of coupling to thin wire structures, spread-spectrum system with an adaptive array for combating interference, technique to select the optimum modulation indices for suppression of undesired signals for simultaneous range and data operations, development of a MHz RF leak detector technique for aircraft harness surveillance, and performance of standard aperture shielding techniques at microwave frequncies. Also discussed are: spectrum efficiency of spread-spectrum systems, control of power supply ripple produced sidebands in microwave transistor amplifiers, an intership SATCOM versus radar electromagnetic interference prediction model, considerations in the design of a broadband E-field sensing system, unique bonding methods for spacecraft, and review of EMC practice for launch vehicle systems.

Adsorption and Reaction of Acetaldehyde on Shape-Controlled CeO2 Nanocrystals: Elucidation of Structure-function Relationships

DOE Office of Scientific and Technical Information (OSTI.GOV)

Mann, Amanda K; Wu, Zili; Calaza, Florencia

2014-01-01

CeO2 cubes with {100} facets, octahedra with {111} facets, and wires with highly defective structures were utilized to probe the structure-dependent reactivity of acetaldehyde. Using temperature-programmed desorption (TPD), temperature-programmed surface reactions (TPSR), and in situ infrared spectroscopy it was found that acetaldehyde desorbs unreacted or undergoes reduction, coupling, or C-C bond scission reactions depending on the surface structure of CeO2. Room temperature FTIR indicates that acetaldehyde binds primarily as 1-acetaldehyde on the octahedra, in a variety of conformations on the cubes, including coupling products and acetate and enolate species, and primarily as coupling products on the wires. The percent consumptionmore » of acetaldehyde follows the order of wires > cubes > octahedra. All the nanoshapes produce the coupling product crotonaldehyde; however, the selectivity to produce ethanol follows the order wires cubes >> octahedra. The selectivity and other differences can be attributed to the variation in the basicity of the surfaces, defects densities, coordination numbers of surface atoms, and the reducibility of the nanoshapes.« less

Advantages of a distant cellulase catalytic base.

PubMed

Burgin, Tucker; Ståhlberg, Jerry; Mayes, Heather B

2018-03-30

The inverting glycoside hydrolase Trichoderma reesei ( Hypocrea jecorina ) Cel6A is a promising candidate for protein engineering for more economical production of biofuels. Until recently, its catalytic mechanism had been uncertain: The best candidate residue to serve as a catalytic base, Asp-175, is farther from the glycosidic cleavage site than in other glycoside hydrolase enzymes. Recent unbiased transition path sampling simulations revealed the hydrolytic mechanism for this more distant base, employing a water wire; however, it is not clear why the enzyme employs a more distant catalytic base, a highly conserved feature among homologs across different kingdoms. In this work, we describe molecular dynamics simulations designed to uncover how a base with a longer side chain, as in a D175E mutant, affects procession and active site alignment in the Michaelis complex. We show that the hydrogen bond network is tuned to the shorter aspartate side chain, and that a longer glutamate side chain inhibits procession as well as being less likely to adopt a catalytically productive conformation. Furthermore, we draw comparisons between the active site in Trichoderma reesei Cel6A and another inverting, processive cellulase to deduce the contribution of the water wire to the overall enzyme function, revealing that the more distant catalytic base enhances product release. Our results can inform efforts in the study and design of enzymes by demonstrating how counterintuitive sacrifices in chemical reactivity can have worthwhile benefits for other steps in the catalytic cycle. © 2018 by The American Society for Biochemistry and Molecular Biology, Inc.

Prediction of multi performance characteristics of wire EDM process using grey ANFIS

NASA Astrophysics Data System (ADS)

Kumanan, Somasundaram; Nair, Anish

2017-09-01

Super alloys are used to fabricate components in ultra-supercritical power plants. These hard to machine materials are processed using non-traditional machining methods like Wire cut electrical discharge machining and needs attention. This paper details about multi performance optimization of wire EDM process using Grey ANFIS. Experiments are designed to establish the performance characteristics of wire EDM such as surface roughness, material removal rate, wire wear rate and geometric tolerances. The control parameters are pulse on time, pulse off time, current, voltage, flushing pressure, wire tension, table feed and wire speed. Grey relational analysis is employed to optimise the multi objectives. Analysis of variance of the grey grades is used to identify the critical parameters. A regression model is developed and used to generate datasets for the training of proposed adaptive neuro fuzzy inference system. The developed prediction model is tested for its prediction ability.

Manufacturing and testing VLPC hybrids

NASA Astrophysics Data System (ADS)

Adkins, L. R.; Ingram, C. M.; Anderson, E. J.

1998-11-01

To insure that the manufacture of VLPC devices is a reliable, cost-effective technology, hybrid assembly procedures and testing methods suitable for large scale production have been developed. This technology has been developed under a contract from Fermilab as part of the D-Zero upgrade program. Each assembled hybrid consists of a VLPC chip mounted on an AlN substrate. The VLPC chip is provided with bonding pads (one connected to each pixel) which are wire bonded to gold traces on the substrate. The VLPC/AlN hybrids are mated in a vacuum sealer using solder preforms and a specially designed carbon boat. After mating, the VLPC pads are bonded to the substrate with an automatic wire bonder. Using this equipment we have achieved a thickness tolerance of ±0.0007 inches and a production rate of 100 parts per hour. After assembly the VLPCs are tested for optical response at an operating temperature of 7K. The parts are tested in a custom designed continuous-flow dewar with a capacity 15 hybrids, and one Lake Shore DT470-SD-11 calibrated temperature sensor mounted to an AlN substrate. Our facility includes five of these dewars with an ultimate test capacity of 75 parts per day. During the course of the Dzero program we have assembled more than 4,000 VLPC hybrids and have tested more than 2,500 with a high yield.

AIN-Based Packaging for SiC High-Temperature Electronics

NASA Technical Reports Server (NTRS)

Savrun, Ender

2004-01-01

Packaging made primarily of aluminum nitride has been developed to enclose silicon carbide-based integrated circuits (ICs), including circuits containing SiC-based power diodes, that are capable of operation under conditions more severe than can be withstood by silicon-based integrated circuits. A major objective of this development was to enable packaged SiC electronic circuits to operate continuously at temperatures up to 500 C. AlN-packaged SiC electronic circuits have commercial potential for incorporation into high-power electronic equipment and into sensors that must withstand high temperatures and/or high pressures in diverse applications that include exploration in outer space, well logging, and monitoring of nuclear power systems. This packaging embodies concepts drawn from flip-chip packaging of silicon-based integrated circuits. One or more SiC-based circuit chips are mounted on an aluminum nitride package substrate or sandwiched between two such substrates. Intimate electrical connections between metal conductors on the chip(s) and the metal conductors on external circuits are made by direct bonding to interconnections on the package substrate(s) and/or by use of holes through the package substrate(s). This approach eliminates the need for wire bonds, which have been the most vulnerable links in conventional electronic circuitry in hostile environments. Moreover, the elimination of wire bonds makes it possible to pack chips more densely than was previously possible.

The use of plastic optical fibres and shape memory alloys for damage assessment and damping control in composite materials

NASA Astrophysics Data System (ADS)

Kuang, K. S. C.; Cantwell, W. J.

2003-08-01

This paper reports the use of a plastic fibre sensor for detecting impact damage in carbon fibre epoxy cantilever beams by monitoring their damping response under free vibration loading conditions. The composite beams were impacted at impact energies up to 8 J. The residual strengths and stiffnesses of the damaged laminates were measured in order to relate reductions in their mechanical properties to changes in their damping characteristics. Here, optical fibre sensors were surface bonded to carbon fibre composite beams which were subjected to free vibration tests to monitor their dynamic response. In the second part of this study, Ni-Ti shape memory alloy (SMA) wires were employed to control and modify the damping response of a composite beam. The SMA wires were initially trained to obtain the desired shape when activated. Here, the trained SMA wires were heated locally using a nickel/chromium wire that was wrapped around the trained region of the SMA. By using this method to activate the SMA wire (as opposed to direct electrical heating), it is possible to obtain localized actuation without heating the entire length of the wire. This procedure minimizes any damage to the host material that may result from local heat transfer between the SMA wire and the composite structure. In addition, the reduction in power requirements to achieve SMA activation permits the use of small-size power packs which can in turn lead to a potential weight reduction in weight-critical applications. The findings of this study demonstrate that a trained SMA offers a superior damping capability to that exhibited by an 'as-supplied' flat-annealed wire.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Takai, Yoshizo; Kawasaki, Tadahiro; Kimura, Yoshihide

A single-atom-sized gold wire was successfully observed in real time by a newly developed defocus-image modulation processing electron microscope. Because of phase retrieval processing with spherical aberration correction, the single-atom strand wire was observed with high contrast and without contrast blurring. By carefully looking at the atomic distance, the contrast, and the dynamic behavior of the wire, we recognized that there are two stages of the wire. In the first stage the wire maintained the atomic distance in the bulk crystal, but in the second stage the wire showed the atomic distance of the nearest-neighbor atoms with weaker contrast. Themore » gold wire was rather stable for a few seconds under strong electron beam illumination.« less

Process water reduction in a wire milling operation. 1989 summer intern report

DOE Office of Scientific and Technical Information (OSTI.GOV)

Alberg, J.

1989-12-31

Johnson Filtration Systems is a company located in New Brighton, Minnesota which employs 256 people. The focus of the project was to reduce the water usage of the wire milling operation. Water in the milling process is used to clean the wire and cool the mill components. Total annual water usage for this operation is six million gallons. The milling process changes the cross sectional shape of the wire by using flattening hammers and rollers. A synthetic coolant is used to enhance this process and remove heat. The coolant is removed from the wire as it is pulled through amore » squeegee, washed it with water and dried with an air knife.« less

Microstructure and Mechanical Properties of Plasma Arc Brazed AISI 304L Stainless Steel and Galvanized Steel Plates

NASA Astrophysics Data System (ADS)

Jin, Yajuan; Li, Ruifeng; Yu, Zhishui; Wang, Yu

2016-04-01

Plasma arc brazing is used to join the AISI 304L stainless steel and galvanized steel plate butt joints with the CuSi3Mn1 filler wire. The effect of parameters on weld surface appearance, interfacial microstructure, and composition distribution in the joint was studied. The microhardness and mechanical tests were conducted to determine the mechanical properties of the welded specimens. The results indicated that good appearance, bead shape, and sufficient metallurgical bonding could be obtained when the brazing process was performed with a wire feeding speed of 0.8 m/min, plasma gas flow rate of 3.0 l/min, welding current of 100 A, and welding speed of 27 cm/min. During plasma arc brazing process, the top corner of the stainless steel and galvanized steel plate were heated and melted, and the melted quantity of stainless steel was much more than that of the galvanized steel due to the thermal conductivity coefficient difference between the dissimilar materials. The microhardness test results shows that the microhardness value gradually increased from the side of the galvanized steel to the stainless steel in the joint, and it is good for improving the mechanical properties of joint. The tensile strength was a little higher than that of the brazing filler, and the fracture position of weld joint was at the base metal of galvanized steel plate.

Sol-gel approach for fabrication of coated anodized titanium wire for solid-phase microextraction: highly efficient adsorbents for enrichment of trace polar analytes.

PubMed

Jia, Jing; Xu, Lili; Wang, Shuai; Wang, Licheng; Liu, Xia

2014-05-01

Nanotubular titania film was prepared in situ on titanium wire and was used as the fiber substrate for solid-phase microextraction (SPME) because of its high surface-to-volume ratio, easy preparation, and mechanical stability. Three different functional coatings, β-cyclodextrin (β-CD), β-cyclodextrin-co-poly(ethylenepropylene glycol) (β-CD/PEG), and polyethylene glycol (PEG)-based sorbents were chemically bonded to the nanostructured wire surface via sol-gel technology to further enhance the absorbing capability and extraction selectivity. Coupled to gas chromatography-flame ionic detection (GC-FID), the prepared SPME fibers were investigated using diverse compounds. The results indicated that the fibers showed good mechanical strength, excellent thermal stability, and wonderful capacity and selectivity to polar compounds, including polar aromatic compounds, alcohols, and ketones. Combining the superior hydrophilic property of a bonded functional molecule and the highly porous structure of a fiber coating, the prepared PEG-coated SPME fiber showed much higher adsorption affinity to ephedrine and methylephedrine than β-CD and β-CD/PEG fibers. The as-established PEG-coated SPME-GC analytical method provided excellent sensitivity (LODs, 0.004 and 0.001 ng mL(-1) for ephedrine and methylephedrine, respectively) and better linear range (0.01-2 000 μg L(-1)). In addition, it has surprising repeatability and reproducibility. Finally, the present approach was used to analyze ephedrine and methylephedrine from real urine samples, and reliable results were obtained.

The increase in conductance of a gold single atom chain during elastic elongation

NASA Astrophysics Data System (ADS)

Tavazza, F.; Barzilai, S.; Smith, D. T.; Levine, L. E.

2013-02-01

The conductance of monoatomic gold wires has been studied using ab initio calculations and the transmission was found to vary with the elastic strain. Counter-intuitively, the conductance was found to increase for the initial stages of the elongation, where the structure has a zigzag shape and the bond angles increase from ≈140° toward ≈160°. After a certain elongation limit, where the angles are relatively high, the bond length elongation associated with a Peierls distortion reverses this trend and the conductance decreases. These simulations are in good agreement with previously unexplained experimental results.

Adaptation of ion beam technology to microfabrication of solid state devices and transducers

NASA Technical Reports Server (NTRS)

Topich, J. A.

1977-01-01

It was found that ion beam texturing of silicon surfaces can be used to increase the effective surface area of MOS capacitors. There is, however, a problem with low dielectric breakdown. Preliminary work was begun on the fabrication of ion implanted resistors on textured surfaces and the potential improvement of wire bond strength by bonding to a textured surface. In the area of ion beam sputtering, the techniques for sputtering PVC were developed. A PVC target containing valinomycin was used to sputter an ion selective membrane on a field effect transistor to form a potassium ion sensor.

High Current Density, Long Life Cathodes for High Power RF Sources

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ives, Robert Lawrence; Collins, George; Falce, Lou

2014-01-22

This program was tasked with improving the quality and expanding applications for Controlled Porosity Reservoir (CPR) cathodes. Calabazas Creek Research, Inc. (CCR) initially developed CPR cathodes on a DOE-funded SBIR program to improve cathodes for magnetron injection guns. Subsequent funding was received from the Defense Advanced Research Projects Agency. The program developed design requirements for implementation of the technology into high current density cathodes for high frequency applications. During Phase I of this program, CCR was awarded the prestigious 2011 R&D100 award for this technology. Subsequently, the technology was presented at numerous technical conferences. A patent was issued for themore » technology in 2009. These cathodes are now marketed by Semicon Associates, Inc. in Lexington, KY. They are the world’s largest producer of cathodes for vacuum electron devices. During this program, CCR teamed with Semicon Associates, Inc. and Ron Witherspoon, Inc. to improve the fabrication processes and expand applications for the cathodes. Specific fabrications issues included the quality of the wire winding that provides the basic structure and the sintering to bond the wires into a robust, cohesive structure. The program also developed improved techniques for integrating the resulting material into cathodes for electron guns.« less

Energetic additive manufacturing process with feed wire

DOEpatents

Harwell, Lane D.; Griffith, Michelle L.; Greene, Donald L.; Pressly, Gary A.

2000-11-07

A process for additive manufacture by energetic wire deposition is described. A source wire is fed into a energy beam generated melt-pool on a growth surface as the melt-pool moves over the growth surface. This process enables the rapid prototyping and manufacture of fully dense, near-net shape components, as well as cladding and welding processes. Alloys, graded materials, and other inhomogeneous materials can be grown using this process.

Pressure activated interconnection of micro transfer printed components

NASA Astrophysics Data System (ADS)

Prevatte, Carl; Guven, Ibrahim; Ghosal, Kanchan; Gomez, David; Moore, Tanya; Bonafede, Salvatore; Raymond, Brook; Trindade, António Jose; Fecioru, Alin; Kneeburg, David; Meitl, Matthew A.; Bower, Christopher A.

2016-05-01

Micro transfer printing and other forms of micro assembly deterministically produce heterogeneously integrated systems of miniaturized components on non-native substrates. Most micro assembled systems include electrical interconnections to the miniaturized components, typically accomplished by metal wires formed on the non-native substrate after the assembly operation. An alternative scheme establishing interconnections during the assembly operation is a cost-effective manufacturing method for producing heterogeneous microsystems, and facilitates the repair of integrated microsystems, such as displays, by ex post facto addition of components to correct defects after system-level tests. This letter describes pressure-concentrating conductor structures formed on silicon (1 0 0) wafers to establish connections to preexisting conductive traces on glass and plastic substrates during micro transfer printing with an elastomer stamp. The pressure concentrators penetrate a polymer layer to form the connection, and reflow of the polymer layer bonds the components securely to the target substrate. The experimental yield of series-connected test systems with >1000 electrical connections demonstrates the suitability of the process for manufacturing, and robustness of the test systems against exposure to thermal shock, damp heat, and mechanical flexure shows reliability of the resulting bonds.

A biomechanical analysis of sublaminar and subtransverse process fixation using metal wires and polyethylene cables.

PubMed

Fujita, Masaru; Diab, Mohammad; Xu, Zheng; Puttlitz, Christian M

2006-09-01

An in vitro biomechanical calf thoracic spine study. To evaluate the biomechanical stability of sublaminar and subtransverse process fixation using stainless steel wires and ultra-high molecular weight polyethylene (UHMWPE) cables. It is commonly held that transverse process fixation provides less stability than sublaminar fixation. To our knowledge, this is the first biomechanical study to compare the stability afforded by sublaminar fixation and subtransverse process fixation using metal wire and UHMWPE cable before and after cyclic loading. There were 6 fresh-frozen calf thoracic spines (T4-T9) used to determine the sublaminar fixation stiffness and subtransverse process fixation stiffness in each group. Double strands of 18-gauge stainless steel wire, 3 and 5 mm-width UHMWPE cable (Nesplon; Alfresa, Inc., Osaka, Japan) were applied to each spine. Cyclic pure flexion-extension moment loading (2 Nm, 0.5 Hz, 5000 cycles) was applied after the initial stability was analyzed by measuring the range of motion. Statistical analyses were used to delineate differences between the various experimental groups. Subtransverse process wiring was more stable than sublaminar wiring after cyclic loading in flexion-extension (P < 0.05). There were no significant differences between each group in lateral bending and axial rotation after cyclic loading. Sublaminar stainless steel wiring was more stable than sublaminar 3 and 5-mm cable before and after cyclic loading in axial rotation (P < 0.01). Acute subtransverse process fixation using 3-mm cable was less stable after cyclic loading in axial rotation (P < 0.05). All other groups did not produce statistically significant differences. Subtransverse process fixation provides at least as much stability as sublaminar fixation. A 5-mm UHMWPE cable and stainless steel wire result in equivalent sublaminar and subtransverse process stability.

Laser Hot Wire Process: A Novel Process for Near-Net Shape Fabrication for High-Throughput Applications

NASA Astrophysics Data System (ADS)

Kottman, Michael; Zhang, Shenjia; McGuffin-Cawley, James; Denney, Paul; Narayanan, Badri K.

2015-03-01

The laser hot wire process has gained considerable interest for additive manufacturing applications, leveraging its high deposition rate, low dilution, thermal stability, and general metallurgical control including the ability to introduce and preserve desired meta-stable phases. Recent advancements in closed-loop process control and laser technology have increased productivity, process stability, and control of deposit metallurgy. The laser hot wire process has shown success in several applications: repairing and rejuvenating casting dies, depositing a variety of alloys including abrasion wear-resistant overlays with solid and tubular wires, and producing low-dilution (<5%) nickel alloy overlays for corrosion applications. The feasibility of fabricating titanium buildups is being assessed for aerospace applications.

A study on the compatibility between one-bottle dentin adhesives and composite resins using micro-shear bond strength.

PubMed

Song, Minju; Shin, Yooseok; Park, Jeong-Won; Roh, Byoung-Duck

2015-02-01

This study was performed to determine whether the combined use of one-bottle self-etch adhesives and composite resins from same manufacturers have better bond strengths than combinations of adhesive and resins from different manufacturers. 25 experimental micro-shear bond test groups were made from combinations of five dentin adhesives and five composite resins with extracted human molars stored in saline for 24 hr. Testing was performed using the wire-loop method and a universal testing machine. Bond strength data was statistically analyzed using two way analysis of variance (ANOVA) and Tukey's post hoc test. Two way ANOVA revealed significant differences for the factors of dentin adhesives and composite resins, and significant interaction effect (p < 0.001). All combinations with Xeno V (Dentsply De Trey) and Clearfil S(3) Bond (Kuraray Dental) adhesives showed no significant differences in micro-shear bond strength, but other adhesives showed significant differences depending on the composite resin (p < 0.05). Contrary to the other adhesives, Xeno V and BondForce (Tokuyama Dental) had higher bond strengths with the same manufacturer's composite resin than other manufacturer's composite resin. Not all combinations of adhesive and composite resin by same manufacturers failed to show significantly higher bond strengths than mixed manufacturer combinations.

Superconductor Composite

DOEpatents

Dorris, Stephen E.; Burlone, Dominick A.; Morgan; Carol W.

1999-02-02

A superconducting conductor fabricated from a plurality of wires, e.g., fine silver wires, coated with a superconducting powder. A process of applying superconducting powders to such wires, to the resulting coated wires and superconductors produced therefrom.

Theoretical Insights Into the Excited State Double Proton Transfer Mechanism of Deep Red Pigment Alkannin.

PubMed

Zhao, Jinfeng; Dong, Hao; Zheng, Yujun

2018-02-08

As the most important component of deep red pigments, alkannin is investigated theoretically in detail based on time-dependent density functional theory (TDDFT) method. Exploring the dual intramolecular hydrogen bonds (O1-H2···O3 and O4-H5···O6) of alkannin, we confirm the O1-H2···O3 may play a more important role in the first excited state than the O4-H5···O6 one. Infrared (IR) vibrational analyses and subsequent charge redistribution also support this viewpoint. Via constructing the S 1 -state potential energy surface (PES) and searching transition state (TS) structures, we illuminate the excited state double proton transfer (ESDPT) mechanism of alkannin is the stepwise process that can be first launched by the O1-H2···O3 hydrogen bond wire in gas state, acetonitrile (CH 3 CN) and cyclohexane (CYH) solvents. We present a novel mechanism that polar aprotic solvents can contribute to the first-step proton transfer (PT) process in the S 1 state, and nonpolar solvents play important roles in lowering the potential energy barrier of the second-step PT reaction.

Validation of Organics for Advanced Stirling Convertor (ASC)

NASA Astrophysics Data System (ADS)

Shin, E. Eugene; Scheiman, Dan; Cybulski, Michelle; Quade, Derek; Inghram, Linda; Burke, Chris

2008-01-01

Organic materials are an essential part of the Advanced Stirling Convertor (ASC) construction as adhesives, potting, wire insulation, lubrication coatings, bobbins, bumpers, insulators, thread lockers. Since a long lifetime of such convertors to be used in the Advanced Stirling Radioisotope Generator (ASRG), sometimes up to 17 years, is required in various space applications such as Mars rovers, deep space missions, and lunar surface power, performance, durability and reliability of those organics should be critically evaluated in every possible material-process-fabrication-service environment relations. The objective of this study was to evaluate, validate, and recommend organics for use in ASCs. Systematic and extensive evaluation methodologies were developed and conducted for various organic materials. The overall efforts dealing with organics materials for the last several years are summarized in the key areas, e.g., process-fabrication optimization, adhesive bonding integrity, outgassing, thermal stability, and durability

Optimization of Indium Bump Morphology for Improved Flip Chip Devices

NASA Technical Reports Server (NTRS)

Jones, Todd J.; Nikzad, Shouleh; Cunningham, Thomas J.; Blazejewski, Edward; Dickie, Matthew R.; Hoenk, Michael E.; Greer, Harold F.

2011-01-01

Flip-chip hybridization, also known as bump bonding, is a packaging technique for microelectronic devices that directly connects an active element or detector to a substrate readout face-to-face, eliminating the need for wire bonding. In order to make conductive links between the two parts, a solder material is used between the bond pads on each side. Solder bumps, composed of indium metal, are typically deposited by thermal evaporation onto the active regions of the device and substrate. While indium bump technology has been a part of the electronic interconnect process field for many years and has been extensively employed in the infrared imager industry, obtaining a reliable, high-yield process for high-density patterns of bumps can be quite difficult. Under the right conditions, a moderate hydrogen plasma exposure can raise the temperature of the indium bump to the point where it can flow. This flow can result in a desirable shape where indium will efficiently wet the metal contact pad to provide good electrical contact to the underlying readout or imager circuit. However, it is extremely important to carefully control this process as the intensity of the hydrogen plasma treatment dramatically affects the indium bump morphology. To ensure the fine-tuning of this reflow process, it is necessary to have realtime feedback on the status of the bumps. With an appropriately placed viewport in a plasma chamber, one can image a small field (a square of approximately 5 millimeters on each side) of the bumps (10-20 microns in size) during the hydrogen plasma reflow process. By monitoring the shape of the bumps in real time using a video camera mounted to a telescoping 12 magnifying zoom lens and associated optical elements, an engineer can precisely determine when the reflow of the bumps has occurred, and can shut off the plasma before evaporation or de-wetting takes place.

Enamel Insulated Copper Wire in Electric Motors: Sliding Behavior and Possible Damage Mechanisms During Die Bending

NASA Astrophysics Data System (ADS)

Demiri, Albion

This study investigates the sliding friction and the forming behaviour of enamel insulated copper wire during the die-forming process. It also aims to determine potential damage mechanisms to the wire during bending process for electric motor coils. In this investigation a wire-bending machine was designed and built in order to simulate the wire forming process in a laboratory scale. Bending angle of the wire and the bending radii were used to control the strain on the wire surface. The effect of speed on COF was investigated for different speeds of of 1, 5, 10, 15, and 20mm/s. A positive correlation was observed between the COF and the testing speed. Additionally, the effect of strain on COF was studied for 2% and 23% to determine its influence on the COF. A general trend was observed of decreased COF with increased strain in wires. Finally, the ability of the enamel coating to resist external damage and wire strain was investigated by tensile testing of pre-scratched magnet wire. The results showed that wire enamel can withstand significant surface damage prior to breach and failure. The insulating polymer coating failed under the scratch tests at 20N load using a Rockwell indenter and at 5N load using a 90° conical steel indenter. Additional tests, such as tensile testing, scratch testing and reciprocating friction testing, were used to characterize the mechanical and tribological properties of the enamel insulated copper wire.

Effects of Parasitic Reactance on Lattice Circuit Slotline Switch

NASA Technical Reports Server (NTRS)

Ponchak, George E.

2016-01-01

A slotline lattice switch has recently been proposed and demonstrated. In that paper, ideal diode characteristics were assumed. In this paper, the effects of parasitic reactances, due to the diode and the wire bonds that connect it to the circuit, are investigated. The switch is compared to a traditional slotline switch with a single diode across the slot.

Fabrication of Microstripline Wiring for Large Format Transition Edge Sensor Arrays

NASA Technical Reports Server (NTRS)

Chervenak, James A.; Adams, J. M.; Bailey, C. N.; Bandler, S.; Brekosky, R. P.; Eckart, M. E.; Erwin, A. E.; Finkbeiner, F. M.; Kelley, R. L.; Kilbourne, C. A.;

Alleviation of mandibular anterior crowding with copper-nickel-titanium vs nickel-titanium wires: a double-blind randomized control trial.

PubMed

Pandis, Nikolaos; Polychronopoulou, Argy; Eliades, Theodore

2009-08-01

The purpose of this study was to investigate the efficiency of copper-nickel-titanium (CuNiTi) vs nickel-titanium (NiTi) archwires in resolving crowding of the anterior mandibular dentition. Sixty patients were included in this single-center, single-operator, double-blind randomized trial. All patients were bonded with the In Ovation-R self-ligating bracket (GAC, Central Islip, NY) with a 0.022-in slot, and the amount of crowding of the mandibular anterior dentition was assessed by using the irregularity index. The patients were randomly allocated into 2 groups of 30 patients, each receiving a 0.016-in CuNiTi 35 degrees C (Ormco, Glendora, Calif) or a 0.016-in NiTi (ModernArch, Wyomissing, Pa) wire. The type of wire selected for each patient was not disclosed to the provider or the patient. The date that each patient received a wire was recorded, and all patients were followed monthly for a maximum of 6 months. Demographic and clinical characteristics between the 2 wire groups were compared with the t test or the chi-square test and the Fisher exact test. Time to resolve crowding was explored with statistical methods for survival analysis, and alignment rate ratios for wire type and crowding level were calculated with Cox proportional hazards multivariate modeling. The type of wire (CuNiTi vs NiTi) had no significant effect on crowding alleviation (129.4 vs 121.4 days; hazard ratio, 1.3; P >0.05). Severe crowding (>5 on the irregularity index) showed a significantly higher probability of crowding alleviation duration relative to dental arches with a score of <5 (138.5 vs 113.1 days; hazard ratio, 2.2; P=0.02). The difference of the loading pattern of wires in laboratory and clinical conditions might effectively eliminate the laboratory-derived advantage of CuNiTi wires.

Engineered pinning landscapes for enhanced 2G coil wire

DOE PAGES

Rupich, Martin W.; Sathyamurthy, Srivatsan; Fleshler, Steven; ...

2016-04-01

We demonstrate a twofold increase in the in-field critical current of AMSC's standard 2G coil wire by irradiation with 18-MeV Au ions. The optimum pinning enhancement is achieved with a dose of 6 × 10 11 Au ions/cm 2. Although the 77 K, self-field critical current is reduced by about 35%, the in-field critical current (H//c) shows a significant enhancement between 4 and 50 K in fields > 1 T. The process was used for the roll-to-roll irradiation of AMSC's standard 46-mm-wide production coated conductor strips, which were further processed into standard copper laminated coil wire. The long-length wires showmore » the same enhancement as attained with short static irradiated samples. The roll-to-roll irradiation process can be incorporated in the standard 2G wire manufacturing, with no modifications to the current process. In conclusion, the enhanced performance of the wire will benefit rotating machine and magnet applications.« less

A production parylene coating process for hybrid microcircuits

NASA Technical Reports Server (NTRS)

Kale, V. S.; Riley, T. J.

1977-01-01

The real impetus for developing a production parylene coating process for internal hybrid passivation came as a result of the possibility of loose conductive particles in hybrid microelectronic circuits, causing intermittent and sometimes permanent failures. Because of the excellent mechanical properties of parylene, it is capable of securing the loose particles in place and prevent such failures. The process of coating described consists of (1) vaporizing the initial charge, which is in the form of a dimer; (2) conversion of the dimer into a reactive monomer; and (3) deposition and subsequent polymerization of the monomer in the deposition chamber which forms a uniform parylene film over all the cold surfaces in contact. Experimental results are discussed in terms of wire bond reliability, resistor drift, high-temperature storage characteristics of parylene, and coating acceptance standards. It is concluded that internal cavities of microelectronic circuits can be successfully coated with parylene provided appropriate tooling is used to protect external leads from the parylene monomer.

Carbon nanotube wires with continuous current rating exceeding 20 Amperes

NASA Astrophysics Data System (ADS)

Cress, Cory D.; Ganter, Matthew J.; Schauerman, Christopher M.; Soule, Karen; Rossi, Jamie E.; Lawlor, Colleen C.; Puchades, Ivan; Ubnoske, Stephen M.; Bucossi, Andrew R.; Landi, Brian J.

2017-07-01

A process to fabricate carbon nanotube (CNT) wires with diameters greater than 1 cm and continuous current carrying capability exceeding 20 A is demonstrated. Wires larger than 5 mm are formed using a multi-step radial densification process that begins with a densified CNT wire core followed by successive wrapping of additional CNT material to increase the wire size. This process allows for a wide range of wire diameters to be fabricated, with and without potassium tetrabromoaurate (KAuBr4) chemical doping, and the resulting electrical and thermal properties to be characterized. Electrical measurements are performed with on/off current steps to obtain the maximum current before reaching a peak CNT wire temperature of 100 °C and before failure, yielding values of instantaneous currents in excess of 45 A for KAuBr4 doped CNT wires with a diameter of 6 mm achieved prior to failure. The peak temperature of the wires at failure (˜530 °C) is correlated with the primary decomposition peak observed in thermal gravimetric analysis of a wire sample confirming that oxidation is the primary failure mode of CNT wires operated in air. The in operando stability of doped CNT wires is confirmed by monitoring the resistance and temperature, which remain largely unaltered over 40 days and 1 day for wires with 1.5 mm and 11.2 mm diameters, respectively. The 100 °C continuous current rating, or ampacity, is measured for a range of doped CNT wire diameters and corresponding linear mass densities ρL. To describe the results, a new form of the fuse-law, where the critical current is defined as I ∝ρL3 /4, is developed and shows good agreement with the experimental data. Ultimately, CNT wires are shown to be stable electrical conductors, with failure current densities in excess of 50 A in the case of a convectively cooled 11.2 mm doped CNT wire, and amenable for use in applications that have long-term, high-current demands.

Synergistic responses of superficial chemistry and micro topography of titanium created by wire-type electric discharge machining.

PubMed

Kataoka, Yu; Tamaki, Yukimichi; Miyazaki, Takashi

2011-01-01

Wire-type electric discharge machining has been applied to the manufacture of endosseous titanium implants as this computer associated technique allows extremely accurate complex sample shaping with an optimal micro textured surface during the processing. Since the titanium oxide layer is sensitively altered by each processing, the authors hypothesized that this technique also up-regulates biological responses through the synergistic effects of the superficial chemistry and micro topography. To evaluate the respective in vitro cellular responses on the superficial chemistry and micro topography of titanium surface processed by wire-type electric discharge, we used titanium-coated epoxy resin replica of the surface. An oxide layer on the titanium surface processed by wire-type electric discharge activated the initial responses of osteoblastic cells through an integrin-mediated mechanism. Since the mRNA expression of ALP on those replicas was up-regulated compared to smooth titanium samples, the micro topography of a titanium surface processed by wire-type electric discharge promotes the osteogenic potential of cells. The synergistic response of the superficial chemistry and micro topography of titanium processed by wire-type electric discharge was demonstrated in this study.

Design of advanced ultrasonic transducers for welding devices.

PubMed

Parrini, L

2001-11-01

A new high frequency ultrasonic transducer has been conceived, designed, prototyped, and tested. In the design phase, an advanced approach was used and established. The method is based on an initial design estimate obtained with finite element method (FEM) simulations. The simulated ultrasonic transducers and resonators are then built and characterized experimentally through laser interferometry and electrical resonance spectra. The comparison of simulation results with experimental data allows the parameters of FEM models to be adjusted and optimized. The achieved FEM simulations exhibit a remarkably high predictive potential and allow full control of the vibration behavior of the transducer. The new transducer is mounted on a wire bonder with a flange whose special geometry was calculated by means of FEM simulations. This flange allows the transducer to be attached on the wire bonder, not only in longitudinal nodes, but also in radial nodes of the ultrasonic field excited in the horn. This leads to a total decoupling of the transducer to the wire bonder, which has not been achieved so far. The new approach to mount ultrasonic transducers on a welding device is of major importance, not only for wire bonding, but also for all high power ultrasound applications and has been patented.

High-Temperature, Thin-Film Strain Gages Improved

NASA Technical Reports Server (NTRS)

2005-01-01

Conventional resistance strain gage technology uses "bonded" strain gages. These foil or wire gages are bonded onto the surface of the test article with glue, ceramic cements, or flame-sprayed ceramics. These bonding agents can, in some instances, limit both the degree of strain transmission from the test structure to the gage and the maximum working temperature of the gage. Also, the bulky, bonded gage normally disrupts aerodynamic gas flow on the surface of the test structure because of its intrusive character. To respond to the urgent needs in aeronautic and aerospace research where stress and temperature gradients are high, aerodynamic effects need to be minimized, and higher operational temperatures are required, the NASA Lewis Research Center developed a thin film strain gage. This gage, a vacuum-deposited thin film formed directly on the surface of a test structure, operates at much higher temperatures than commercially available gages do and with minimal disruption of the aerodynamic flow. The gage uses an alloy, palladium-13 wt % chromium (hereafter, PdCr), which was developed by United Technologies Research Center under a NASA contract. PdCr is structurally stable and oxidation resistant up to at least 1100 C (2000 F); its temperature-induced resistance change is linear, repeatable, and not sensitive to the rates of heating and cooling. An early strain gage, which was made of 25-micrometer-diameter PdCr wire and demonstrated to be useable to 800 C, won an R&D 100 award in 1991. By further improving the purity of the material and by developing gage fabrication techniques that use sputter-deposition, photolithography patterning, and chemical etching, we have made an 8- to 10-m PdCr thin-film strain gage that can measure dynamic and static strain to at least 1100 C. For static strain measurements, a 5-m-thick Pt element serves as a temperature compensator to further minimize the temperature effect of the gage. These thin-film gages provide the advantage of minimally intrusive surface strain measurements and give highly repeatable readings with low drift at temperatures from ambient to 1100 C. This is a 300 C advance in operating temperature over the PdCr wire gage and a 500 C advance over commercially available gages made of other materials.

Composite ceramic superconducting wires for electric motor applications

NASA Astrophysics Data System (ADS)

Holloran, John W.

1989-07-01

Progress is described on developing Y-123 wire for an HTSC motor. The wire development involves synthesis of Y-123 powder, spinning polymer containing green fiber, heat treating the fiber to produce metallized superconducting filaments, and characterizing the electrical properties. A melt spinning process was developed for producing 125-micron diameter green fiber containing 50 vol percent Y-123. This fiber can be braided for producing transposed multifilamentary wire. A process was developed to coat green fiber with silver alloys which can be continuous sintering. A second process for multifilamentary ribbon wire is also being developed. The Y-123 filaments have 77 deg self-field Jc values up to 2600 A/sq cm, but Jc is reduced to 10 A/cm squared at 800 G. Preliminary data is presented on mechanical properties. A dc homopolar motor with an iron magnetic circuit is being designed to operate with early HTSC wire.

Electromagnetic Nondestructive Evaluation of Wire Insulation and Models of Insulation Material Properties

NASA Technical Reports Server (NTRS)

Bowler, Nicola; Kessler, Michael R.; Li, Li; Hondred, Peter R.; Chen, Tianming

2012-01-01

Polymers have been widely used as wiring electrical insulation materials in space/air-craft. The dielectric properties of insulation polymers can change over time, however, due to various aging processes such as exposure to heat, humidity and mechanical stress. Therefore, the study of polymers used in electrical insulation of wiring is important to the aerospace industry due to potential loss of life and aircraft in the event of an electrical fire caused by breakdown of wiring insulation. Part of this research is focused on studying the mechanisms of various environmental aging process of the polymers used in electrical wiring insulation and the ways in which their dielectric properties change as the material is subject to the aging processes. The other part of the project is to determine the feasibility of a new capacitive nondestructive testing method to indicate degradation in the wiring insulation, by measuring its permittivity.

Improvements of fabrication processes and enhancement of critical current densities in (Ba,K)Fe2As2 HIP wires and tapes

NASA Astrophysics Data System (ADS)

Pyon, Sunseng; Suwa, Takahiro; Tamegai, Tsuyoshi; Takano, Katsutoshi; Kajitani, Hideki; Koizumi, Norikiyo; Awaji, Satoshi; Zhou, Nan; Shi, Zhixiang

2018-05-01

We fabricated (Ba,K)Fe2As2 superconducting wires and tapes using the powder-in-tube method and hot isostatic pressing (HIP). HIP wires and tapes showed a high value of transport critical current density (J c) exceeding 100 kAcm‑2 at T = 4.2 K and the self-field. Transport J c in the HIP wire reached 38 kAcm‑2 in a high magnetic field of 100 kOe. This value is almost twice larger than the previous highest value of J c among round wires using iron-based superconductors. Enhancement of J c in the wires and tapes was caused by improvement of the drawing process, which caused degradation of the core, formation of microcracks, weak links between grains, and random orientation of grains. Details of the effect of the improved fabrication processes on the J c are discussed.

Length-Dependent Nanotransport and Charge Hopping Bottlenecks in Long Thiophene-Containing π-Conjugated Molecular Wires.

PubMed

Smith, Christopher E; Odoh, Samuel O; Ghosh, Soumen; Gagliardi, Laura; Cramer, Christopher J; Frisbie, C Daniel

2015-12-23

Self-assembled conjugated molecular wires containing thiophene up to 6 nm in length were grown layer-by-layer using click chemistry. Reflection-absorption infrared spectroscopy, ellipsometry and X-ray photoelectron spectroscopy were used to follow the stepwise growth. The electronic structure of the conjugated wires was studied with cyclic voltammetry and UV-vis spectroscopy as well as computationally with density functional theory (DFT). The current-voltage curves (±1 V) of the conjugated molecular wires were measured with conducting probe atomic force microscopy (CP-AFM) in which the molecular wire film bound to a gold substrate was contacted with a conductive AFM probe. By systematically measuring the low bias junction resistance as a function of length for molecules 1-4 nm long, we extracted the structure dependent tunneling attenuation factor (β) of 3.4 nm(-1) and a contact resistance of 220 kΩ. The crossover from tunneling to hopping transport was observed at a molecular length of 4-5 nm with an activation energy of 0.35 eV extracted from Arrhenius plots of resistance versus temperature. DFT calculations revealed localizations of spin densities (polarons) on molecular wire radical cations. The calculations were employed to gauge transition state energies for hopping of polarons along wire segments. Individual estimated transition state energies were 0.2-0.4 eV, in good agreement with the experimental activation energy. The transition states correspond to flattening of dihedral angles about specific imine bonds. These results open up possibilities to further explore the influence of molecular architecture on hopping transport in molecular junctions, and highlight the utility of DFT to understand charge localization and associated hopping-based transport.

Progress toward a tungsten alloy wire/high temperature alloy composite turbine blade

NASA Technical Reports Server (NTRS)

Ritzert, F. J.; Dreshfield, R. L.

1992-01-01

A tungsten alloy wire reinforced high temperature alloy composite is being developed for potential application as a hollow turbine blade for advanced rocket engine turbopumps. The W-24Re-HfC alloy wire used for these composite blades provides an excellent balance of strength and wire ductility. Preliminary fabrication, specimen design, and characterization studies were conducted by using commercially available W218 tungsten wire in place of the W-24Re-Hfc wire. Subsequently, two-ply, 50 vol pct composite panels using the W-24Re-HfC wire were fabricated. Tensile tests and metallographic studies were performed to determine the material viability. Tensile strengths of a Waspaloy matrix composite at 870 C were 90 pct of the value expected from rule-of-mixtures calculations. During processing of this Waspaloy matrix composite, a brittle phase was formed at the wire/matrix interface. Circumferential wire cracks were found in this phase. Wire coating and process evaluation efforts were performed in an attempt to solve the reaction problem. Although problems were encountered in this study, wire reinforced high temperature alloy composites continue to show promise for turbopump turbine blade material improvement.

Influence of Wire Electrical Discharge Machining (WEDM) process parameters on surface roughness

NASA Astrophysics Data System (ADS)

Yeakub Ali, Mohammad; Banu, Asfana; Abu Bakar, Mazilah

2018-01-01

In obtaining the best quality of engineering components, the quality of machined parts surface plays an important role. It improves the fatigue strength, wear resistance, and corrosion of workpiece. This paper investigates the effects of wire electrical discharge machining (WEDM) process parameters on surface roughness of stainless steel using distilled water as dielectric fluid and brass wire as tool electrode. The parameters selected are voltage open, wire speed, wire tension, voltage gap, and off time. Empirical model was developed for the estimation of surface roughness. The analysis revealed that off time has a major influence on surface roughness. The optimum machining parameters for minimum surface roughness were found to be at a 10 V open voltage, 2.84 μs off time, 12 m/min wire speed, 6.3 N wire tension, and 54.91 V voltage gap.

Dynamical analysis of surface-insulated planar wire array Z-pinches

NASA Astrophysics Data System (ADS)

Li, Yang; Sheng, Liang; Hei, Dongwei; Li, Xingwen; Zhang, Jinhai; Li, Mo; Qiu, Aici

2018-05-01

The ablation and implosion dynamics of planar wire array Z-pinches with and without surface insulation are compared and discussed in this paper. This paper first presents a phenomenological model named the ablation and cascade snowplow implosion (ACSI) model, which accounts for the ablation and implosion phases of a planar wire array Z-pinch in a single simulation. The comparison between experimental data and simulation results shows that the ACSI model could give a fairly good description about the dynamical characteristics of planar wire array Z-pinches. Surface insulation introduces notable differences in the ablation phase of planar wire array Z-pinches. The ablation phase is divided into two stages: insulation layer ablation and tungsten wire ablation. The two-stage ablation process of insulated wires is simulated in the ACSI model by updating the formulas describing the ablation process.

Surface Dangling-Bond States and Band Lineups in Hydrogen-Terminated Si, Ge, and Ge/Si Nanowires

NASA Astrophysics Data System (ADS)

Kagimura, R.; Nunes, R. W.; Chacham, H.

2007-01-01

We report an ab initio study of the electronic properties of surface dangling-bond (SDB) states in hydrogen-terminated Si and Ge nanowires with diameters between 1 and 2 nm, Ge/Si nanowire heterostructures, and Si and Ge (111) surfaces. We find that the charge transition levels ɛ(+/-) of SDB states behave as a common energy reference among Si and Ge wires and Si/Ge heterostructures, at 4.3±0.1eV below the vacuum level. Calculations of ɛ(+/-) for isolated atoms indicate that this nearly constant value is a periodic-table atomic property.

Fabrication of Pd-Cr wire

NASA Technical Reports Server (NTRS)

Diamond, Sidney; Leach, Dennen M.

1989-01-01

Fabrication of Pd-13 percent Cr alloy wires is described. Melting, casting, swaging and annealing processes are discussed. Drawing to reach two diameters (0.003 inch and 0.00176 inch) of wire is described. Representative micrographs of the Pd-Cr alloy at selected stages during wire fabrication are included. The resistance of the wire was somewhat lower, by about 15 to 20 percent, than comparable wire of other alloys used for strain gages.

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rupich, Martin W.; Sathyamurthy, Srivatsan; Fleshler, Steven

We demonstrate a twofold increase in the in-field critical current of AMSC's standard 2G coil wire by irradiation with 18-MeV Au ions. The optimum pinning enhancement is achieved with a dose of 6 × 10 11 Au ions/cm 2. Although the 77 K, self-field critical current is reduced by about 35%, the in-field critical current (H//c) shows a significant enhancement between 4 and 50 K in fields > 1 T. The process was used for the roll-to-roll irradiation of AMSC's standard 46-mm-wide production coated conductor strips, which were further processed into standard copper laminated coil wire. The long-length wires showmore » the same enhancement as attained with short static irradiated samples. The roll-to-roll irradiation process can be incorporated in the standard 2G wire manufacturing, with no modifications to the current process. In conclusion, the enhanced performance of the wire will benefit rotating machine and magnet applications.« less

DOE Office of Scientific and Technical Information (OSTI.GOV)

Rupich, Martin W.; Sathyamurthy, Srivatsan; Fleshler, Steven

We demonstrate a twofold increase in the in-field critical current of AMSC's standard 2G coil wire by irradiation with 18-MeV Au ions. The optimum pinning enhancement is achieved with a dose of 6 x 10(11) Au ions/cm(2). Although the 77 K, self-field critical current is reduced by about 35%, the in-field critical current (H//c) shows a significant enhancement between 4 and 50 K in fields > 1 T. The process was used for the roll-to-roll irradiation of AMSC's standard 46-mm-wide production coated conductor strips, which were further processed into standard copper laminated coil wire. The long-length wires show the samemore » enhancement as attained with short static irradiated samples. The roll-to-roll irradiation process can be incorporated in the standard 2G wire manufacturing, with no modifications to the current process. The enhanced performance of the wire will benefit rotating machine and magnet applications.« less

Evaluation of shear bond strength of porcelain bonded to laser welded titanium surface and determination of mode of bond failure.

PubMed

Patil, Narendra P; Dandekar, Minal; Nadiger, Ramesh K; Guttal, Satyabodh S

2010-09-01

The aim of this study was to evaluate the shear bond strength of porcelain to laser welded titanium surface and to determine the mode of bond failure through scanning electron microscopy (SEM) and energy dispersive spectrophotometry (EDS). Forty five cast rectangular titanium specimens with the dimension of 10 mm x 8 mm x 1 mm were tested. Thirty specimens had a perforation of 2 mm diameter in the centre. These were randomly divided into Group A and B. The perforations in the Group B specimens were repaired by laser welding using Cp Grade II titanium wire. The remaining 15 specimens were taken as control group. All the test specimens were layered with low fusing porcelain and tested for shear bond strength. The debonded specimens were subjected to SEM and EDS. Data were analysed with 1-way analysis of variance and Student's t-test for comparison among the different groups. One-way analysis of variance (ANOVA) showed no statistically significant difference in shear bond strength values at a 5% level of confidence. The mean shear bond strength values for control group, Group A and B was 8.4 +/- 0.5 Mpa, 8.1 +/- 0.4 Mpa and 8.3 +/- 0.3 Mpa respectively. SEM/EDS analysis of the specimens showed mixed and cohesive type of bond failure. Within the limitations of the study laser welding did not have any effect on the shear bond strength of porcelain bonded to titanium.

Numerical Simulations of As-Extruded Mg Matrix Composites Interpenetrated by Metal Reinforcement

NASA Astrophysics Data System (ADS)

Y Wang, H.; Wang, S. R.; Yang, X. F.; Li, P.

2017-12-01

The interpenetrating magnesium composites reinforced by three-dimensional braided stainless steel wire reinforcement were fabricated and investigated. The extrusion processes of the composites in different conditions were carried out and simulated by finite element method using the DEFORM-3D software. The results show that the matrix and reinforcement of the composites form a good interfacial bonding and the grains were refined by extrusion and the influence of reinforcement, which are in accordance with the enhanced strength and degraded plasticity. The combined quality between the matrix and reinforcement can be strengthened in extrusion chamber where occurred large strain and suffered intense stress, and the effective stress of the material increases continuously with the increase in extrusion ratio and the decrease in extrusion speed until it reaches a stable value.

Selective Functionalization of Arbitrary Nanowires

DTIC Science & Technology

2006-11-02

3-mercaptopropyl)- trimethoxysilane (MPTMS). The wires were grown electrochemically in anodic aluminum oxide ( AAO ) templates. Selective deposition...In the past, templates composed of polycarbonate track-etched membranes or anodic aluminum oxide materials have been used for the construction of...modifier MPTMS was used to function- alize the AAO template because it can form covalent bonds with silanes and metal oxide surfaces21 and because of

From Bonding Wires to Banding Women. Proceedings of the International Consultation on Micro-Chips Technology (Manila, Philippines, October 1986).

ERIC Educational Resources Information Center

Center for Women's Resources, Quezon City (Philippines).

In October 1986, 40 women from 12 countries gathered in the Philippines for a 10-day meeting of organizers, educators, and workers affected by and confronting the international electronics industry in microchip plants and in automated offices. Participants were from Malaysia, Indonesia, Thailand, the Philippines, Hong Kong, Japan, the Netherlands,…

Analysis of proton wires in the enzyme active site suggests a mechanism of c-di-GMP hydrolysis by the EAL domain phosphodiesterases.

PubMed

Grigorenko, Bella L; Knyazeva, Marina A; Nemukhin, Alexander V

2016-11-01

We report for the first time a hydrolysis mechanism of the cyclic dimeric guanosine monophosphate (c-di-GMP) by the EAL domain phosphodiesterases as revealed by molecular simulations. A model system for the enzyme-substrate complex was prepared on the base of the crystal structure of the EAL domain from the BlrP1 protein complexed with c-di-GMP. The nucleophilic hydroxide generated from the bridging water molecule appeared in a favorable position for attack on the phosphorus atom of c-di-GMP. The most difficult task was to find a pathway for a proton transfer to the O3' atom of c-di-GMP to promote the O3'P bond cleavage. We show that the hydrogen bond network extended over the chain of water molecules in the enzyme active site and the Glu359 and Asp303 side chains provides the relevant proton wires. The suggested mechanism is consistent with the structural, mutagenesis, and kinetic experimental studies on the EAL domain phosphodiesterases. Proteins 2016; 84:1670-1680. © 2016 Wiley Periodicals, Inc. © 2016 Wiley Periodicals, Inc.

Formation of Bi2Sr2CaCu2O x /Ag multifilamentary metallic precursor powder-in-tube wires

NASA Astrophysics Data System (ADS)

Zhang, Yun; Koch, Carl C.; Schwartz, Justin

2016-12-01

Previously, a metallic precursor (MP) approach to synthesizing Bi2Sr2CaCu2O x (Bi2212), with a homogeneous mixture of Bi, Sr, Ca, Cu and Ag was produced by mechanical alloying. Here, Bi2212/Ag round multifilamentary wire is manufactured using a metallic precursor powder-in-tube (MPIT) process. The MP powders were packed into a pure Ag tube in an Ar atmosphere and then sealed. After deformation, multifilamentary round wires and rolled tapes were heat treated in flowing oxygen through three stages: oxidation, conversion and partial-melt processing (PMP). Processing-microstructure-property relationships on 20-50 mm long multifilamentary round wires and rolled tapes were studied extensively. It is shown that conventional wire deformation processes, optimized for oxide-powder-in-tube wires, are not effective for deforming MPIT wires, and that as with prior studies of MPIT Bi2Sr2Ca2Cu3O y conductors, hot extrusion is required for obtaining a multifilamentary structure with fine filaments. As a result, the Bi2212 MPIT wires reported here have low engineering critical current density. Nonetheless, by focusing on sections of wires that remain intact after deformation, it is also shown that the first heat treatment stage, the oxidation stage, plays a crucial role in chemical homogeneity, phase transformation, and microstructural evolution and three reaction pathways for MP oxidation are presented. Furthermore, it is found the Bi2212 grain alignment within an MPIT filament is significantly different from that found in OPIT filaments after PMP, indicating the formation of highly dense filaments containing Bi2212 fine grains and Ag particles before PMP aids the formation of large, c-axis textured Bi2212 filaments during PMP. These results show that, with improved wire deformation, high critical current density may be obtained via a MPIT process.

Technology for pressure-instrumented thin airfoil models, phase 1

NASA Technical Reports Server (NTRS)

Wigley, D. A.

1985-01-01

A network of channels was chemically milled into one surface of a pair of matched plates having bond planes which were neither planar or profiled to match the contour of the trailing edge of a supercritical airfoil for testing in cryogenic wind tunnels. Vacuum brazing bonded the plates together to create a network of pressure passages without blockages or cross leaks. The greatest success was achieved with the smaller samples and planar bonding surfaces. In larger samples, problems were encountered due to warpage created by the relief of residual stresses. Successful bonds were formed by brazing A286, Nitronic 40 and 300 series stainless steels at 1065 C using AMS 4777B brazing alloy, but excessive grain growth occurred in samples of 200 grade 18 nickel maraging steels. Good bonds were obtained with maraging steel using a 47 percent Nickel-47 percent Palladium-6 percent Silicon alloy and brazing at 927 C. Electro-Discharge-Machining was an effective method of cutting profiled bond planes and airfoil contours. Orifices of good definition were obtained when the EDM wire cut passed through predrilled holes. Possible configurations for joints between small segments and the larger main wing were also studied.

Monte Carlo design of optimal wire mesh collimator for breast tumor imaging process

NASA Astrophysics Data System (ADS)

Saad, W. H. M.; Roslan, R. E.; Mahdi, M. A.; Choong, W.-S.; Saion, E.; Saripan, M. I.

2011-08-01

This paper presents the modeling of breast tumor imaging process using wire mesh collimator gamma camera. Previous studies showed that the wire mesh collimator has a potential to improve the sensitivity of the tumor detection. In this paper, we extend our research significantly, to find an optimal configuration of the wire mesh collimator specifically for semi-compressed breast tumor detection, by looking into four major factors: weight, sensitivity, spatial resolution and tumor contrast. The numbers of layers in the wire mesh collimator is varied to optimize the collimator design. The statistical variations of the results are studied by simulating multiple realizations for each experiment using different starting random numbers. All the simulation environments are modeled using Monte Carlo N-Particle Code (MCNP). The quality of the detection is measured directly by comparing the sensitivity, spatial resolution and tumor contrast of the images produced by the wire mesh collimator and benchmarked that with a standard multihole collimator. The proposed optimal configuration of the wire mesh collimator is optimized by selecting the number of layers in wire mesh collimator, where the tumor contrast shows a relatively comparable value to the multihole collimator, when it is tested with uniformly semi-compressed breast phantom. The wire mesh collimator showed higher number of sensitivity because of its loose arrangement while the spatial resolution of wire mesh collimator does not shows much different compared to the multihole collimator. With a relatively good tumor contrast and spatial resolution, and increased in sensitivity, a new proposed wire mesh collimator gives a significant improvement in the wire mesh collimator design for breast cancer imaging process. The proposed collimator configuration is reduced to 44.09% from the total multihole collimator weight.

Anisotropic electrical conduction and reduction in dangling-bond density for polycrystalline Si films prepared by catalytic chemical vapor deposition

NASA Astrophysics Data System (ADS)

Niikura, Chisato; Masuda, Atsushi; Matsumura, Hideki

1999-07-01

Polycrystalline Si (poly-Si) films with high crystalline fraction and low dangling-bond density were prepared by catalytic chemical vapor deposition (Cat-CVD), often called hot-wire CVD. Directional anisotropy in electrical conduction, probably due to structural anisotropy, was observed for Cat-CVD poly-Si films. A novel method to separately characterize both crystalline and amorphous phases in poly-Si films using anisotropic electrical conduction was proposed. On the basis of results obtained by the proposed method and electron spin resonance measurements, reduction in dangling-bond density for Cat-CVD poly-Si films was achieved using the condition to make the quality of the included amorphous phase high. The properties of Cat-CVD poly-Si films are found to be promising in solar-cell applications.

The effect of ligation on the load deflection characteristics of nickel titanium orthodontic wire.

PubMed

Kasuya, Shugo; Nagasaka, Satoshi; Hanyuda, Ai; Ishimura, Sadao; Hirashita, Ayao

2007-12-01

This study examined the effect of ligation on the load-deflection characteristics of nickel-titanium (NiTi) orthodontic wire. A modified three-point bending system was used for bending the NiTi round wire, which was inserted and ligated in the slots of three brackets, one of which was bonded to each of the three bender rods. Three different ligation methods, stainless steel ligature (SSL), slot lid (SL), and elastomeric ligature (EL), were employed, as well as a control with neither bracket nor ligation (NBL). The tests were repeated five times under each condition. Comparisons were made of load-deflection curve, load at maximum deflection of 2,000 microm, and load at a deflection of 1,500 microm during unloading. Analysis of Variance (ANOVA) and Dunnett's test were conducted to determine method difference (alpha = 0.05). The interaction between deflection and ligation was tested, using repeated-measures ANOVA (alpha = 0.05). The load values of the ligation groups were two to three times greater than the NBL group at a deflection of 1,500 microm during unloading: 4.37 N for EL, 3.90 N for SSL, 3.02 N for SL, and 1.49 N for NBL (P < 0.01). For the EL, a plateau region disappeared in the unloading curve. SL showed the smallest load. The ligation of the bracket wire may make NiTi wire exhibit a significantly heavier load than that traditionally expected. NiTi wire exhibited the majority of its true superelasticity with SL, whereas EL may act as a restraint on its superelasticity.

Butt Welding Joint of Aluminum Alloy by Space GHTA Welding Process in Vacuum

NASA Astrophysics Data System (ADS)

Suita, Yoshikazu; Shinike, Shuhei; Ekuni, Tomohide; Terajima, Noboru; Tsukuda, Yoshiyuki; Imagawa, Kichiro

Aluminum alloys have been used widely in constructing various space structures including the International Space Station (ISS) and launch vehicles. For space applications, welding experiments on aluminum alloy were performed using the GHTA (Gas Hollow Tungsten Arc) welding process using a filler wire feeder in a vacuum. We investigated the melting phenomenon of the base metal and filler wire, bead formation, and the effects of wire feed speed on melting characteristics. The melting mechanism in the base metal during the bead on a plate with wire feed was similar to that for the melt run without wire feed. We clarified the effects of wire feed speed on bead sizes and configurations. Furthermore, the butt welded joint welded using the optimum wire feed speed, and the joint tensile strengths were evaluated. The tensile strength of the square butt joint welded by the pulsed DC GHTA welding with wire feed in a vacuum is nearly equal to that of the same joint welded by conventional GTA (Gas Tungsten Arc) welding in air.

An Investigation into the Comparative Costs of Additive Manufacture vs. Machine from Solid for Aero Engine Parts

DTIC Science & Technology

2006-05-01

welding power sources are not totally efficient at converting power drawn from the wall into heat energy used for the welding process . TIG sources are...Powder bed + Laser • Wire + Laser • Wire + Electron Beam • Wire + TIG Each system has its own unique attributes in terms of process variables...relative economics of producing a near net shape by Additive Manufacturing (AM) processes compared with traditional machine from solid processes (MFS

Superconducting MgB2 wires with vanadium diffusion barrier

NASA Astrophysics Data System (ADS)

Hušek, I.; Kováč, P.; Melišek, T.; Kulich, M.; Rosová, A.; Kopera, L.; Szundiová, B.

2017-10-01

Single-core MgB2 wires with a vanadium barrier and Cu stabilization have been made by the in situ powder-in-tube (PIT) and internal magnesium diffusion (IMD) into boron processes. Heat treatment of PIT wires was done at the temperature range of 650 °C-850 °C/30 min. Critical currents of differently treated MgB2/V/Cu wires have been measured and related with the structure of MgB2. It was found that critical current density of MgB2/V wire annealed above 700 °C decreases rapidly. The obtained results clearly show that vanadium is a well formable metal and can be applied as an effective diffusion barrier for MgB2 wires heat-treated at temperatures ≤700 °C. This temperature limit is well applicable for MgB2 wires with high current densities made by PIT and also by the IMD process.

Present status of PIT round wires of 122-type iron-based superconductors

NASA Astrophysics Data System (ADS)

Tamegai, T.; Suwa, T.; Pyon, S.; Kajitani, H.; Takano, K.; Koizumi, N.; Awaji, S.; Watanabe, K.

2017-12-01

Outstanding characteristics with high T c and H c2 and small anisotropy in iron-based superconductors (IBSs) have triggered the development of superconducting wires and tapes using these novel superconductors. In this short article, developments and present status of round wires of 122-type IBSs are reviewed. By introducing hot-isostatic pressing (HIP) technique, J c in round wires of 122-type IBSs has been improved significantly. Further improvements have been realized by refining the fabrication process of the core material and introducing partial texturing of the wire core. The largest transport J c for round wires at 4.2 K at self-field and 100 kOe are 2.0x105 A/cm2 and 3.8x104 A/cm2, respectively. We also compare the J c characteristics of wires and tapes processed by HIP.

The Effects of Operational Parameters on a Mono-wire Cutting System: Efficiency in Marble Processing

NASA Astrophysics Data System (ADS)

Yilmazkaya, Emre; Ozcelik, Yilmaz

2016-02-01

Mono-wire block cutting machines that cut with a diamond wire can be used for squaring natural stone blocks and the slab-cutting process. The efficient use of these machines reduces operating costs by ensuring less diamond wire wear and longer wire life at high speeds. The high investment costs of these machines will lead to their efficient use and reduce production costs by increasing plant efficiency. Therefore, there is a need to investigate the cutting performance parameters of mono-wire cutting machines in terms of rock properties and operating parameters. This study aims to investigate the effects of the wire rotational speed (peripheral speed) and wire descending speed (cutting speed), which are the operating parameters of a mono-wire cutting machine, on unit wear and unit energy, which are the performance parameters in mono-wire cutting. By using the obtained results, cuttability charts for each natural stone were created on the basis of unit wear and unit energy values, cutting optimizations were performed, and the relationships between some physical and mechanical properties of rocks and the optimum cutting parameters obtained as a result of the optimization were investigated.

Development of a Fabrication Path for Au-Organothiol-Carbon Nanotube Molecular Junctions

NASA Astrophysics Data System (ADS)

Moscatello, Jason

2011-04-01

Silicon electronics is at the scaling limit and new approaches are necessary. Nanomaterials have significant promise in addressing this problem and each has its own potentially useful properties; yet making the material is only the first step in harnessing those properties. Transitioning from developing materials to integrating them into devices is no small endeavor - placement, wiring, etc. are nontrivial on the nanoscale. This talk details work done at Michigan Tech developing a fabrication process for Molecular Electronic Junctions (MEJs). The goal is to study the lifetime of MEJs containing strong bonds because short lifetime is the largest limiting factor in many MEJs. It is important that the physics studied remains accurate even if the size is scaled down and the MEJs are arranged into arrays - two things that are necessary for MEJs to be used commercially. In addition the process is widely usable, since it only utilizes inexpensive and/or common processes (e.g. dielectrophoresis and photolithography). An overview of the fabrication process will be detailed, along with carbon nanotube (top electrode) placement by dielectrophoresis, and initial results.

Scale-up of 2G wire manufacturing at American Superconductor Corporation

NASA Astrophysics Data System (ADS)

Fleshler, S.; Buczek, D.; Carter, B.; Cedrone, P.; DeMoranville, K.; Gannon, J.; Inch, J.; Li, X.; Lynch, J.; Otto, A.; Podtburg, E.; Roy, D.; Rupich, M.; Sathyamurthy, S.; Schreiber, J.; Thieme, C.; Thompson, E.; Tucker, D.; Nagashima, K.; Ogata, M.

2009-10-01

American Superconductor Corporation (AMSC) has developed the base technology and a manufacturing line for initial volume production of low-cost second generation high temperature superconductor (2G HTS) wire for commercial and military applications. The manufacturing line is based on reel-to-reel processing of wide HTS strips using rolling assisted bi-axially textured substrate (RABiTS™) for the template and Metal Organic Deposition (MOD) for the HTS layer. AMSC’s wide strip process is a low cost manufacturing technology since multiple wires are produced in a single manufacturing pass by slitting the wide strip to narrower width in the last stage of the manufacturing process. Industry standard 4.4 mm wide wires are produced by laminating metallic foils, such as copper, stainless steel or any other material, to the HTS insert wire, and are chosen to tailor the electrical, thermal and mechanical properties of the wire for specific applications. The laminated, 4.4 mm wide wires are known as “344 superconductors.” In this paper, we summarize the status of AMSC’s manufacturing capability, the performance of the wire presently being produced, as well as the cost and technical advantages of AMSC’s manufacturing approach. In addition, future direction for research and development to improve electrical performance is presented.

Micromolded thick PZT sol gel composite structures for ultrasound transducer devices operating at high frequencies

NASA Astrophysics Data System (ADS)

Pang, Guofeng

The objective of this work has been to design and develop a micromolding technique useful for batch fabrication to microfabricate 3D ceramic structures for device purposes using a sol gel composite processing technique and deep photolithography (UV LIGA). These structures may be the elements of ultrasound transducers, the structures associated with electronic packaging, or microstructures for microfluidic applications. To demonstrate the technique, the project has focused on the design and fabrication of annular and linear arrays for high frequency (>20 MHz) ultrasound imaging applications, particularly where an electronically steered imaging modality is employed. Other typical micromolded structures have been demonstrated to show the potential for micromolding. The transferability of the technique for industrial purposes is proposed. Using a sol gel composite process, the critical components in this technique are mold making, mold filling, material-processing, demolding, top electrode and essential material characterization. Two types of molds have been created using UV LIGA and/or electroplating. A purely organic mold made of Su-8 epoxy based photo-resist has shown tremendous performance for micromolding. The transducer packaging process has also been designed and evaluated at the laboratory level. A Su-8 micro bridge and bond pad has been used for wire bonding purposes. A 5-element annular array transducer has been fabricated by this technique and fully packaged. The micromolded piezoceramic structures have been characterized. The pulse echo performance of each element and the focusing performance of 5 elements of a packaged transducer array have been evaluated using a coaxial cable and a cable delay system.

Prevention and treatment of demineralisation during fixed appliance therapy: a review of current methods and future applications.

PubMed

Chambers, C; Stewart, S; Su, B; Sandy, J; Ireland, A

2013-11-01

Orthodontic treatment, like all aspects of dentistry, exposes the clinician to the risk of malpractice and litigation. Demineralisation of tooth enamel is still one of the main complications of orthodontic treatment and it is essential patients are made aware of this risk during the consent process. There are a variety of fluoride delivery systems (mouthrinse, varnish, bonding system, and elastics), which can be used to prevent white spot lesion (WSL) formation. Glass-ionomer bonding cements (GIC) have also been shown to reduce WSL formation and have the benefit of not relying on patient compliance. However, these materials have not found widespread acceptance, possibly due to handling characteristics. A number of new technologies, principally fillers and coatings, have recently become available with potential antimicrobial and antibiofilm properties. Coatings can be applied to brackets and wires, which prevent bacterial adhesion. However, the longevity of these coatings is questionable. There are a number of methods available aimed at reducing the incidence of WSL, but they all have limitations. Capitalising on technological advances will enable the production of tailor made orthodontic brackets and adhesive systems, which provide long-term protection against WSL without relying on patient compliance.

Molecular Self-Assembly Driven by London Dispersion Forces

DOE Office of Scientific and Technical Information (OSTI.GOV)

Li, Guo; Cooper, Valentino R; Cho, Jun-Hyung

2011-01-01

The nature and strength of intermolecular interactions are crucial to a variety of kinetic and dynamic processes at surfaces. Whereas strong chemisorption bonds are known to facilitate molecular binding, the importance of the weaker yet ubiquitous van der Waals (vdW) interactions remains elusive in most cases. Here we use first-principles calculations combined with kinetic Monte Carlo simulations to unambiguously demonstrate the vital role that vdW interactions play in molecular self-assembly, using styrene nanowire growth on silicon as a prototypical example. We find that, only when the London dispersion forces are included, accounting for the attractive parts of vdW interactions, canmore » the effective intermolecular interaction be reversed from being repulsive to attractive. Such attractive interactions, in turn, ensure the preferred growth of long wires under physically realistic conditions as observed experimentally. We further propose a cooperative scheme, invoking the application of an electric field and the selective creation of Si dangling bonds, to drastically improve the ordered arrangement of the molecular structures. The present study represents a significant step forward in the fundamental understanding and precise control of molecular self-assembly guided by London dispersion forces.« less

Biocompatibility of Hydrogen-Diluted Amorphous Silicon Carbide Thin Films for Artificial Heart Valve Coating

NASA Astrophysics Data System (ADS)

Rizal, Umesh; Swain, Bhabani S.; Rameshbabu, N.; Swain, Bibhu P.

2018-01-01

Amorphous silicon carbide (a-SiC:H) thin films were synthesized using trichloromethylsilane by a hot wire chemical vapor deposition process. The deposited films were characterized by Fourier transform infrared spectroscopy (FTIR), Raman spectroscopy, x-ray diffraction and x-ray photoelectron spectroscopy to confirm its chemical bonding, structural network and composition of the a-SiC:H films. The optical microscopy images reveal that hydrogen dilution increased the surface roughness and pore density of a-SiC:H thin film. The Raman spectroscopy and FTIR spectra reveal chemical network consisting of Si-Si, C-C and Si-C bonds, respectively. The XRD spectroscopy and Raman spectroscopy indicate a-SiC:H still has short-range order. In addition, in vitro cytotoxicity test ensures the behavior of cell-semiconductor hybrid to monitor the proper coordination. The live-dead assays and MTT assay reveal an increase in green nucleus cell, and cell viability is greater than 88%, respectively, showing non-toxic nature of prepared a-SiC:H film. Moreover, the result indicated by direct contact assay, and cell prefers to adhere and proliferate on a-SiC:H thin films having a positive effect as artificial heart valve coating material.

A comparison study of exploding a Cu wire in air, water, and solid powders

NASA Astrophysics Data System (ADS)

Han, Ruoyu; Wu, Jiawei; Ding, Weidong; Zhou, Haibin; Qiu, Aici; Wang, Yanan

2017-11-01

In this paper, an experimental study on exploding a copper wire in air, water, incombustible powders, and energetic materials is performed. We examined the effects of the surrounding media on the explosion process and its related phenomena. Experiments were first carried out with copper wire explosions driven by microsecond timescale pulsed currents in air, water, and the half-half case. Then, the copper wires were exploded in air, water, SiO2 powders, quartz sand, NaCl powders, and energetic-material cylinders, respectively. Our experimental results indicated that the explosion process was significantly influenced by the surrounding media, resulting in noticeable differences in energy deposition, optical emission, and shock waves. In particular, incombustible powders could throttle the current flow completely when a fine wire was adopted. We also found that an air or incombustible-powder layer could drastically attenuate the shock wave generated by a wire explosion. As for energetic-material loads, obvious discrepancies were found in voltage/current waveforms from vaporization when compared with a wire explosion in air/water, which meant the metal vapor/liquid drops play a significant role in the ignition process.

Investigation of the degradation mechanism of catalytic wires during oxidation of ammonia process

NASA Astrophysics Data System (ADS)

Pura, Jarosław; Wieciński, Piotr; Kwaśniak, Piotr; Zwolińska, Marta; Garbacz, Halina; Zdunek, Joanna; Laskowski, Zbigniew; Gierej, Maciej

2016-12-01

The most common catalysts for the ammonia oxidation process are 80 μm diameter platinum-rhodium wires knitted or woven into the form of a gauze. In an aggressive environment and under extreme conditions (temperature 800-900 °C, intensive gas flow, high pressure) precious elements are drained from the surface of the wires. Part of this separated material quickly decomposes on the surface in the form of characteristic "cauliflower-shape protrusions". The rest of the platinum is captured by palladium-nickel catalytic-capture gauzes located beneath. In our investigation we focused on the effects of the degradation of gauzes from one industrial catalytic system. The aim of the study was to compare the degree and the mechanism of degradation of gauzes from a different part of the reactor. The study covered PtRh7 catalytic and PdNi5 catalytic-capture gauzes. X-ray computer microtomography investigation revealed that despite strong differences in morphology, each Pt-Rh wire has a similar specific surface area. This indicates that the oxidation process and morphological changes of the wires occur in a self-regulating balance, resulting in the value of the specific surface area of the catalyst. Microtomography analysis of Pd-Ni wires revealed strong redevelopment of the wires' surface, which is related to the platinum capture phenomenon. Scanning electron microscope observations also revealed the nanostructure in the cauliflower-shape protrusions and large grains in the wires' preserved cores. The high temperature in the reactor and the long-term nature of the process do not favor the occurrence of the nanostructure in this type of material. Further and detailed analysis of this phenomena will provide a better understanding of the precious metals etching and deposition processes during oxidation.

Submillimeter-Wave Amplifier Module with Integrated Waveguide Transitions

NASA Technical Reports Server (NTRS)

Samoska, Lorene; Chattopadhyay, Goutam; Pukala, David; Gaier, Todd; Soria, Mary; ManFung, King; Deal, William; Mei, Gerry; Radisic, Vesna; Lai, Richard

2009-01-01

To increase the usefulness of monolithic millimeter-wave integrated circuit (MMIC) components at submillimeter-wave frequencies, a chip has been designed that incorporates two integrated, radial E-plane probes with an MMIC amplifier in between, thus creating a fully integrated waveguide module. The integrated amplifier chip has been fabricated in 35-nm gate length InP high-electron-mobility-transistor (HEMT) technology. The radial probes were mated to grounded coplanar waveguide input and output lines in the internal amplifier. The total length of the internal HEMT amplifier is 550 m, while the total integrated chip length is 1,085 m. The chip thickness is 50 m with the chip width being 320 m. The internal MMIC amplifier is biased through wire-bond connections to the gates and drains of the chip. The chip has 3 stages, employing 35-nm gate length transistors in each stage. Wire bonds from the DC drain and gate pads are connected to off-chip shunt 51-pF capacitors, and additional off-chip capacitors and resistors are added to the gate and drain bias lines for low-frequency stability of the amplifier. Additionally, bond wires to the grounded coplanar waveguide pads at the RF input and output of the internal amplifier are added to ensure good ground connections to the waveguide package. The S-parameters of the module, not corrected for input or output waveguide loss, are measured at the waveguide flange edges. The amplifier module has over 10 dB of gain from 290 to 330 GHz, with a peak gain of over 14 dB at 307 GHz. The WR2.2 waveguide cutoff is again observed at 268 GHz. The module is biased at a drain current of 27 mA, a drain voltage of 1.24 V, and a gate voltage of +0.21 V. Return loss of the module is very good between 5 to 25 dB. This result illustrates the usefulness of the integrated radial probe transition, and the wide (over 10-percent) bandwidth that one can expect for amplifier modules with integrated radial probes in the submillimeter-regime (>300 GHz).

Analytical methods to characterize heterogeneous raw material for thermal spray process: cored wire Inconel 625

NASA Astrophysics Data System (ADS)

Lindner, T.; Bonebeau, S.; Drehmann, R.; Grund, T.; Pawlowski, L.; Lampke, T.

2016-03-01

In wire arc spraying, the raw material needs to exhibit sufficient formability and ductility in order to be processed. By using an electrically conductive, metallic sheath, it is also possible to handle non-conductive and/or brittle materials such as ceramics. In comparison to massive wire, a cored wire has a heterogeneous material distribution. Due to this fact and the complex thermodynamic processes during wire arc spraying, it is very difficult to predict the resulting chemical composition in the coating with sufficient accuracy. An Inconel 625 cored wire was used to investigate this issue. In a comparative study, the analytical results of the raw material were compared to arc sprayed coatings and droplets, which were remelted in an arc furnace under argon atmosphere. Energy-dispersive X-ray spectroscopy (EDX) and X-ray fluorescence (XRF) analysis were used to determine the chemical composition. The phase determination was performed by X-ray diffraction (XRD). The results were related to the manufacturer specifications and evaluated in respect to differences in the chemical composition. The comparison between the feedstock powder, the remelted droplets and the thermally sprayed coatings allows to evaluate the influence of the processing methods on the resulting chemical and phase composition.

Observation of fast expansion velocity with insulating tungsten wires on ∼80 kA facility

DOE Office of Scientific and Technical Information (OSTI.GOV)

Li, M.; Li, Y.; State Key Laboratory of Intense Pulsed Radiation Simulation and Effect, Northwest Institute of Nuclear Technology, Xi'an 710024

2016-07-15

This paper presents experimental results on the effects of insulating coatings on tungsten planar wire array Z-pinches on an 80 kA, 100 ns current facility. Expansion velocity is obviously increased from ∼0.25 km/s to ∼3.5 km/s by using the insulating coatings. It can be inferred that the wire cores are in gaseous state with this fast expansion velocity. An optical framing camera and laser probing images show that the standard wire arrays have typical ablation process which is similar to their behaviors on mega-ampere facilities. The ablation process and precursor plasma are suppressed for dielectric tungsten wires. The wire array implosion might be improvedmore » if these phenomena can be reproduced on Mega-ampere facilities.« less

Wiring Damage Analyses for STS OV-103

NASA Technical Reports Server (NTRS)

Thomas, Walter, III

2006-01-01

This study investigated the Shuttle Program s belief that Space Transportation System (STS) wiring damage occurrences are random, that is, a constant occurrence rate. Using Problem Reporting and Corrective Action (PRACA)-derived data for STS Space Shuttle OV-103, wiring damage was observed to increase over the vehicle s life. Causal factors could include wiring physical deterioration, maintenance and inspection induced damage, and inspection process changes resulting in more damage events being reported. Induced damage effects cannot be resolved with existent data. Growth analysis (using Crow-AMSAA, or CA) resolved maintenance/inspection effects (e.g., heightened awareness) on all wire damages and indicated an overall increase since Challenger Return-to-Flight (RTF). An increasing failure or occurrence rate per flight cycle was seen for each wire damage mode; these (individual) rates were not affected by inspection process effects, within statistical error.

Fatigue failure of regenerator screens in a high frequency Stirling engine

NASA Technical Reports Server (NTRS)

Hull, David R.; Alger, Donald L.; Moore, Thomas J.; Scheuermann, Coulson M.

1988-01-01

Failure of Stirling Space Power Demonstrator Engine (SPDE) regenerator screens was investigated. After several hours of operation the SPDE was shut down for inspection and on removing the regenator screens, debris of unknown origin was discovered along with considerable cracking of the screens in localized areas. Metallurgical analysis of the debris determined it to be cracked-off-deformed pieces of the 41 micron thickness Type 304 stainless steel wire screen. Scanning electron microscopy of the cracked screens revealed failures occurring at wire crossovers and fatigue striations on the fracture surface of the wires. Thus, the screen failure can be characterized as a fatigue failure of the wires. The crossovers were determined to contain 30 percent reduction in wire thickness and a highly worked microstructure occurring from the manufacturing process of the wire screens. Later it was found that reduction in wire thickness occurred because the screen fabricator had subjected it to a light cold-roll process after weaving. Installation of this screen left a clearance in the regenerator allowing the screens to move. The combined effects of the reduction in wire thickness, stress concentration (caused by screen movement), and highly worked microstructure at the wire crossovers led to the fatigue failure of the screens.

Operation and force analysis of the guide wire in a minimally invasive vascular interventional surgery robot system

NASA Astrophysics Data System (ADS)

Yang, Xue; Wang, Hongbo; Sun, Li; Yu, Hongnian

2015-03-01

To develop a robot system for minimally invasive surgery is significant, however the existing minimally invasive surgery robots are not applicable in practical operations, due to their limited functioning and weaker perception. A novel wire feeder is proposed for minimally invasive vascular interventional surgery. It is used for assisting surgeons in delivering a guide wire, balloon and stenting into a specific lesion location. By contrasting those existing wire feeders, the motion methods for delivering and rotating the guide wire in blood vessel are described, and their mechanical realization is presented. A new resistant force detecting method is given in details. The change of the resistance force can help the operator feel the block or embolism existing in front of the guide wire. The driving torque for rotating the guide wire is developed at different positions. Using the CT reconstruction image and extracted vessel paths, the path equation of the blood vessel is obtained. Combining the shapes of the guide wire outside the blood vessel, the whole bending equation of the guide wire is obtained. That is a risk criterion in the delivering process. This process can make operations safer and man-machine interaction more reliable. A novel surgery robot for feeding guide wire is designed, and a risk criterion for the system is given.

Laser Wire Stripper

NASA Technical Reports Server (NTRS)

1983-01-01

NASA-developed space shuttle technology is used in a laser wire stripper designed by Raytheon Company. Laser beams cut through insulation on a wire without damaging conductive metal, because laser radiation that melts plastic insulation is reflected by the metal. The laser process is fast, clean, precise and repeatable. It eliminates quality control problems and the expense of rejected wiring.

Dual-Wavelength Interferometry and Light Emission Study for Experimental Support of Dual-Wire Ablation Experiments

NASA Astrophysics Data System (ADS)

Hamilton, Andrew; Caplinger, James; Sotnikov, Vladimir; Sarkisov, Gennady; Leland, John

2017-10-01

In the Plasma Physics and Sensors Laboratory, located at Wright Patterson Air Force Base, we utilize a pulsed power source to create plasma through a wire ablation process of metallic wires. With a parallel arrangement of wires the azimuthal magnetic fields generated around each wire, along with the Ohmic current dissipation and heating occurring upon wire evaporation, launch strong radial outflows of magnetized plasmas towards the centralized stagnation region. It is in this region that we investigate two phases of the wire ablation process. Observations in the first phase are collsionless and mostly comprised of light ions ejected from the initial corona. The second phase is observed when the wire core is ablated and heavy ions dominate collisions in the stagnation region. In this presentation we will show how dual-wavelength interferometric techniques can provide information about electron and atomic densities from experiments. Additionally, we expect white-light emission to provide a qualitative confirmation of the instabilities observed from our experiments. The material is based upon work supported by the Air Force Office of Scientific Research under Award Number 16RYCOR289.

Model-Based Testability Assessment and Directed Troubleshooting of Shuttle Wiring Systems

NASA Technical Reports Server (NTRS)

Deb, Somnath; Domagala, Chuck; Shrestha, Roshan; Malepati, Venkatesh; Cavanaugh, Kevin; Patterson-Hine, Ann; Sanderfer, Dwight; Cockrell, Jim; Norvig, Peter (Technical Monitor)

2000-01-01

We have recently completed a pilot study on the Space shuttle wiring system commissioned by the Wiring Integrity Research (WIRe) team at NASA Ames Research Center, As the space shuttle ages, it is experiencing wiring degradation problems including arcing, chaffing insulation breakdown and broken conductors. A systematic and comprehensive test process is required to thoroughly test and quality assure (QA) the wiring systems. The NASA WIRe team recognized the value of a formal model based analysis for risk-assessment and fault coverage analysis. However. wiring systems are complex and involve over 50,000 wire segments. Therefore, NASA commissioned this pilot study with Qualtech Systems. Inc. (QSI) to explore means of automatically extracting high fidelity multi-signal models from wiring information database for use with QSI's Testability Engineering and Maintenance System (TEAMS) tool.

Process for Nondestructive Evaluation of the Quality of a Crimped Wire Connector

NASA Technical Reports Server (NTRS)

Yost, William T. (Inventor); Cramer, Karl E. (Inventor); Perey, Daniel F. (Inventor); Williams, Keith A. (Inventor)

2014-01-01

A process and apparatus for collecting data for nondestructive evaluation of the quality of a crimped wire connector are provided. The process involves providing a crimping tool having an anvil and opposing jaw for crimping a terminal onto a stranded wire, moving the jaw relative to the anvil to close the distance between the jaw and the anvil and thereby compress the terminal against the wire, while transmitting ultrasonic waves that are propagated through the terminal-wire combination and received at a receiving ultrasonic transducer as the jaw is moved relative to the anvil, and detecting and recording the position of the jaw relative to the anvil as a function of time and detecting and recording the amplitude of the ultrasonic wave that is received at the receiving ultrasonic transducer as a function of time as the jaw is moved relative to the anvil.

Corrosion resistance of premodeled wires made of stainless steel used for heart electrotherapy leaders

NASA Astrophysics Data System (ADS)

Przondziono, J.; Walke, W.; Młynarski, R.; Szatka, W.

2012-05-01

The purpose of the study is to evaluate resistance to electrochemical corrosion of wire made of X10CrNi18-8 stainless steel designed for use in cardiology treatment. The influence of strain formed in the premodeling process and methods of wire surface preparation to corrosive resistance in artificial plasma solution were analysed. Wire corrosion tests were carried out in the solution of artificial plasma. Resistance to electrochemical corrosion was evaluated on the ground of recorded curves of anodic polarization by means of potentiodynamic method. Potentiodynamic tests carried out enabled to determine how the resistance to pitting corrosion of wire changes, depending on strain formed in the premodeling process as well as on the method of wire surface preparation. For evaluation of phenomena occurring on the surface of tested steel, electrochemical impedance spectroscopy (EIS) was applied. Deterioration of corrosive properties of wire along with the increase in the formed strain hardening was observed.

Curvature effect on the mechanical behaviour of a martensitic shape-memory-alloy wire for applications in civil engineering

NASA Astrophysics Data System (ADS)

Tran, Hanh; Balandraud, Xavier; Destrebecq, Jean-François

2015-02-01

The mechanical response of a bent shape memory alloy (SMA) wire is a key point for the understanding of the process of the creation of confining effects in a wrapped concrete cylinder for example. The objective of the present study is to model the phenomena involved in the bending of a martensitic SMA wire. The mechanism of martensite reorientation is considered in the model, which also takes into account the asymmetry between tension and compression. For validation purposes, experiments were performed on Ni-Ti wires: measurement of residual curvatures after bending release and tensile tests on pre-bent wires. In particular, the analysis shows a variation in axial stiffness as a function of the preliminary curvature. This result shows the necessity of modelling the distributions of the state variables within the wire cross-section for the simulation of confinement processes using SMA wires. It also opens prospects to potential application to the bending of SMA fibres in smart textiles.

Superconductor-insulator transition in long MoGe nanowires.

PubMed

Kim, Hyunjeong; Jamali, Shirin; Rogachev, A

2012-07-13

The properties of one-dimensional superconducting wires depend on physical processes with different characteristic lengths. To identify the process dominant in the critical regime we have studied the transport properties of very narrow (9-20 nm) MoGe wires fabricated by advanced electron-beam lithography in a wide range of lengths, 1-25  μm. We observed that the wires undergo a superconductor-insulator transition (SIT) that is controlled by cross sectional area of a wire and possibly also by the width-to-thickness ratio. The mean-field critical temperature decreases exponentially with the inverse of the wire cross section. We observed that a qualitatively similar superconductor-insulator transition can be induced by an external magnetic field. Our results are not consistent with any currently known theory of the SIT. Some long superconducting MoGe nanowires can be identified as localized superconductors; namely, in these wires the one-electron localization length is much smaller than the length of a wire.

Electrical wire insulation and electromagnetic coil

DOEpatents

Bich, George J.; Gupta, Tapan K.

1984-01-01

An electromagnetic coil for high temperature and high radiation application in which glass is used to insulate the electrical wire. A process for applying the insulation to the wire is disclosed which results in improved insulation properties.

Method of electroforming a rocket chamber

NASA Technical Reports Server (NTRS)

Fortini, A. (Inventor)

1974-01-01

A transpiration cooled rocket chamber is made by forming a porous metal wall on a suitably shaped mandrel. The porous wall may be made of sintered powdered metal, metal fibers sintered on the mandrel or wires woven onto the mandrel and then sintered to bond the interfaces of the wires. Intersecting annular and longitudinal ribs are then electroformed on the porous wall. An interchamber wall having orifices therein is then electroformed over the annular and longitudinal ribs. Parallel longitudinal ribs are then formed on the outside surface of the interchamber wall after which an annular jacket is electroformed over the parallel ribs to form distribution passages therewith. A feed manifold communicating with the distribution passages may be fabricated and welded to the rocket chamber or the feed manifold may be electroformed in place.

Shear Bond Strength of Intraoral Laser Welding and its Effect on Intrapulpal Temperature Rise in Primary Teeth: An in Vitro Study.

PubMed

Aglarci, Cahide; Yildiz, Esma; Isman, Eren; Kazak, Mine

2016-03-01

This study compared the shear bond strength (SBS) of conventional welding (CW) and intraoral laser welding (LW) on fixed space maintainers (SMs), and investigated the intrapulpal temperature change (ITC) during LW. Lasers have been used for intraoral welding. The SBS test used 26 molar bands divided into two groups, CW and LW. Stainless steel wires were welded to the middle of the buccal and lingual aspects of all the bands, using an Nd:YAG laser for the LW group and silver solder and flux soldering media for the CW group. The samples, fixed to acrylic resin blocks, were subjected to shear testing. In the ITC test, 25 exfoliated primary second molar teeth were used to adapt molar bands. J-type thermocouple wire was positioned in the pulp chamber. ITCs were determined during Nd:YAG laser welding of stainless steel wires to the bands. Mann-Whitney U test was used to determine differences in SBS between the groups. ITCs were analyzed by paired t test. The SBS between groups showed significant differences (LW: 489.47 ± 135.70; CW: 49.71 ± 17.76; p < 0.001). The mean ITC during LW was 3.64 ± 0.79 (min: 2.4; max: 5.10). None of the samples' ITCs exceeded the critical threshold value (5.5 °C). LW obtained a higher-strength joint than CW. ITCs during LW do not present a thermal risk to primary teeth. The intraoral use of LW for SMs in primary teeth is recommended in terms of strength and ITCs.

The controlled relay of multiple protons required at the active site of nitrogenase.

PubMed

Dance, Ian

2012-07-07

The enzyme nitrogenase, when reducing natural and unnatural substrates, requires large numbers of protons per chemical catalytic cycle. The active face of the catalytic site (the FeMo-cofactor, FeMo-co) is situated in a protein domain which is largely hydrophobic and anhydrous, and incapable of serial provision of multiple protons. Through detailed analysis of the high quality protein crystal structures available the characteristics of a chain of water molecules leading from the protein surface to a key sulfur atom (S3B) of FeMo-co are described. The first half of the water chain from the surface inwards is branched, slightly variable, and able to accommodate exogenous small molecules: this is dubbed the proton bay. The second half, from the proton bay to S3B, is comprised of a single chain of eight hydrogen bonded water molecules. This section is strictly conserved, and is intimately involved in hydrogen bonds with homocitrate, an essential component that chelates Mo. This is the proton wire, and a detailed Grotthuss mechanism for serial translocation of protons through this proton wire to S3B is proposed. This controlled serial proton relay from the protein surface to S3B is an essential component of the intramolecular hydrogenation paradigm for the complete chemical mechanisms of nitrogenase. Each proton reaching S3B, instigated by electron transfer to FeMo-co, becomes a hydrogen atom that migrates to other components of the active face of FeMo-co and to bound substrates and intermediates, allowing subsequent multiple proton transfers along the proton wire. Experiments to test the proposed mechanism of proton supply are suggested. The water chain in nitrogenase is comparable with the purported proton pumping pathway of cytochrome c oxidase.

Resistence seam welding thin copper foils

DOE Office of Scientific and Technical Information (OSTI.GOV)

Hollar, D.L. Jr.

1991-02-01

Use of flat flexible circuits in the electronics industry is expanding. The term flexible circuits'' is defined here as copper foil which has been bonded to an insulating film such as Kapton film. The foil is photo processed to produce individual circuit paths similar to printed circuit boards. Another insulating film is laminated over the conductors to complete the flexible circuit. Flexible circuits, like multiwire cables, are susceptible to electromagnetic radiation (EMR) interference. On multiwire cables the interference problem is mitigated by adding a woven wire braid shielding over the conductors. Shielding on flexible circuits is accomplished by enclosing themore » circuits in a copper foil envelope. However, the copper foil must be electrically sealed around the flexcircuit to be effective. Ultimately, a resistance seam welding process and appropriate equipment were developed which would provide the required electrical seal between two layers of 2-oz (0.0028-inch thick) copper foil on a 1.1-inch wide, 30-inch long, 0.040-inch thick flexible circuit. 4 refs., 19 figs.« less

Comparison of X-ray Radiation Process in Single and Nested Wire Array Implosions

NASA Astrophysics Data System (ADS)

Li, Z. H.; Xu, Z. P.; Yang, J. L.; Xu, R. K.; Guo, C.; Grabovsky, E. V.; Oleynic, G. M.; Smirnov, V. P.

2006-01-01

In order to understanding the difference between tungsten single-wire-array and tungsten nested-wire-array Z-pinches, we have measured the x-ray power, the temporal-spatial distributions of x-ray radiation from each of the two loads. The measurements were performed with 0.1mm spatial and 1 ns temporal resolutions at 2.5- and 3.5-MA currents. The experimental conditions, including wire material, number of wires, wire-array length, electrode design, and implosion time, remained unchanged from shot to shot. Analysis of the radiation power profiles suggests that the nested-wire-array radiate slightly less x-ray energy in relatively shorter time interval than the single wire-array, leading to a much greater x-ray power in nested-wire-array implosion. The temporal-spatial distributions of x-ray power show that in both cases, plasmas formed by wire-array ablation radiate not simultaneously along load axis. For nested-wire-array Z-pinch, plasmas near the anode begin to radiate in 2ns later than that near the cathode. As a contrast, the temporal divergence of radiation among different plasma zones of single-wire-array Z-pinch along Z-axis is more than 6ns. Measurements of the x-ray emissions from small segments of pinch (2mm length along axis) indicate that local radiation power profiles almost do not vary for the two loads. Photographs taken by X-ray framing camera give a same description about the radiation process of pinch. One may expect that, as a result of this study, if the single-wire-array can be redesigned so ingeniously that the x-rays are emitted at the same time all over the pinch zone, the radiation power of single wire array Z-pinch may be much greater than what have been achieved.

Chemical and constitutional influences in the self-assembly of functional supramolecular hydrogen-bonded nanoscopic fibres.

PubMed

Puigmartí-Luis, Josep; Minoia, Andrea; Pérez Del Pino, Angel; Ujaque, Gregori; Rovira, Concepció; Lledós, Agustí; Lazzaroni, Roberto; Amabilino, David B

2006-12-13

A new series of secondary amides bearing long alkyl chains with pi-electron-donor cores has been synthesized and characterised, and their self-assembly upon casting at surfaces has been studied. The different supramolecular assemblies of the materials have been visualized by using atomic force microscopy (AFM) and transmission electron microscopy (TEM). It is possible to obtain well-defined fibres of these aromatic core molecules as a result of the hydrogen bonds between the amide groups. Indeed, by altering the alkyl-chain lengths, constitutions, concentrations and solvent, it is possible to form different rodlike aggregates on graphite. Aggregate sizes with a lower limit of 6-8 nm width have been reached for different amide derivatives, while others show larger aggregates with rodlike morphologies which are several micrometers in length. For one compound that forms nanofibres, doping was performed by using a chemical oxidant, and the resulting layer on graphite was shown to exhibit metallic-like spectroscopy curves when probed with current-sensing AFM. This technique also revealed current maps of the surface of the molecular material. Fibre formation not only takes place on the graphite surface: nanometre scale rods have been imaged by using TEM on a grid after evaporation of solutions of the compounds in chloroform. Molecular modelling proves the importance of the hydrogen bonds in the generation of the fibres, and indicates that the constitution of the molecules is vital for the formation of the desired columnar stacks, results that are consistent with the images obtained by microscopic techniques. The results show the power of noncovalent bonds in self-assembly processes that can lead to electrically conducting nanoscale supramolecular wires.

"Processing and Mechanical Properties of NiTi-Nb Porous Structures with Microchannels"

NASA Astrophysics Data System (ADS)

Bewerse, Catherine Nicole

Nickel-Titanium alloys are able to recover high amounts of strain (~5-8%) through a reversible phase transformation. This shape recovery, and its accompanying toughness and high yield strength, make the material attractive for biomedical, actuation, and energy absorption applications. Porous structures made out of NiTi are particularly interesting, as the mechanical properties can be tailored close to that of bone. While various methods exist to create NiTi porous structures, many are limited by pore interconnectivity, pore geometry and spatial arrangement, or undesirable formation of intermetallics. In this dissertation, we present three different processing methods to fabricate NiTi(Nb) porous structures with 3D fully interconnected microchannels. These structures have controllable volume fraction, orientation, and spatial distribution of the microchannels. In addition, we characterize the NiTi-Nb eutectic material used to bond the porous structures and investigate the strain field and stress concentrations around a model pore though Digital Image Correlation (DIC) and FEM. We first present a method using hot isostatic pressing (HIPing) with a steel wire scaffold to create a structure with a 60% volume fraction of a regular 3D network of orthogonally interconnected microchannels. This structure exhibited an effective stiffness similar to cortical bone, but exhibited brittle fracture at a relatively low strength, implying poor NiTi powder bonding. This prompted the use of liquid phase sintering instead of HIPing in our second method, where a quasi-binary NiTi-Nb eutectic was used to bond the NiTi powders. The resulting structure contained 34% channel porosity with 16% matrix porosity due to void consolidation and a clearly defined 3D network of interconnected microchannels with circular cross sections. In an effort to simplify the processing of these NiTi-Nb structures and enable scalability, the final method presented employs slip casting with and without magnesium spaceholders combined with liquid phase sintering. This pressure-less processing method makes costly HIPing equipment unnecessary, with a single multi-step heat treatment in which binders and spaceholder are removed and the NiTi powder matrix is bonded. These structures have excellent shape memory properties, high toughness, and low stiffnesses between trabecular and cortical bone. The high-aspect ratio microchannels create anisotropic mechanical properties, which are also explored.

Carbon nanotube wires and cables: Near-term applications and future perspectives

NASA Astrophysics Data System (ADS)

Jarosz, Paul; Schauerman, Christopher; Alvarenga, Jack; Moses, Brian; Mastrangelo, Thomas; Raffaelle, Ryne; Ridgley, Richard; Landi, Brian

2011-11-01

Wires and cables are essential to modern society, and opportunities exist to develop new materials with reduced resistance, mass, and/or susceptibility to fatigue. This article describes how carbon nanotubes (CNTs) offer opportunities for integration into wires and cables for both power and data transmission due to their unique physical and electronic properties. Macroscopic CNT wires and ribbons are presently shown as viable replacements for metallic conductors in lab-scale demonstrations of coaxial, USB, and Ethernet cables. In certain applications, such as the outer conductor of a coaxial cable, CNT materials may be positioned to displace metals to achieve substantial benefits (e.g. reduction in cable mass per unit length (mass/length) up to 50% in some cases). Bulk CNT materials possess several unique properties which may offer advantages over metallic conductors, such as flexure tolerance and environmental stability. Specifically, CNT wires were observed to withstand greater than 200,000 bending cycles without increasing resistivity. Additionally, CNT wires exhibit no increase in resistivity after 80 days in a corrosive environment (1 M HCl), and little change in resistivity with temperature (<1% from 170-330 K). This performance is superior to conventional metal wires and truly novel for a wiring material. However, for CNTs to serve as a full replacement for metals, the electrical conductivity of CNT materials must be improved. Recently, the conductivity of a CNT wire prepared through simultaneous densification and doping has exceeded 1.3 × 106 S/m. This level of conductivity brings CNTs closer to copper (5.8 × 107 S/m) and competitive with some metals (e.g. gold) on a mass-normalized basis. Developments in manipulation of CNT materials (e.g. type enrichment, doping, alignment, and densification) have shown progress towards this goal. In parallel with efforts to improve bulk conductivity, integration of CNT materials into cabling architectures will require development in electrical contacting. Several methods for contacting bulk CNT materials to metals are demonstrated, including mechanical crimping and ultrasonic bonding, along with a method for reducing contact resistance by tailoring the CNT-metal interface via electroless plating. Collectively, these results summarize recent progress in CNT wiring technologies and illustrate that nanoscale conductors may become a disruptive technology in cabling designs.

Carbon nanotube wires and cables: near-term applications and future perspectives.

PubMed

Jarosz, Paul; Schauerman, Christopher; Alvarenga, Jack; Moses, Brian; Mastrangelo, Thomas; Raffaelle, Ryne; Ridgley, Richard; Landi, Brian

2011-11-01

Wires and cables are essential to modern society, and opportunities exist to develop new materials with reduced resistance, mass, and/or susceptibility to fatigue. This article describes how carbon nanotubes (CNTs) offer opportunities for integration into wires and cables for both power and data transmission due to their unique physical and electronic properties. Macroscopic CNT wires and ribbons are presently shown as viable replacements for metallic conductors in lab-scale demonstrations of coaxial, USB, and Ethernet cables. In certain applications, such as the outer conductor of a coaxial cable, CNT materials may be positioned to displace metals to achieve substantial benefits (e.g. reduction in cable mass per unit length (mass/length) up to 50% in some cases). Bulk CNT materials possess several unique properties which may offer advantages over metallic conductors, such as flexure tolerance and environmental stability. Specifically, CNT wires were observed to withstand greater than 200,000 bending cycles without increasing resistivity. Additionally, CNT wires exhibit no increase in resistivity after 80 days in a corrosive environment (1 M HCl), and little change in resistivity with temperature (<1% from 170-330 K). This performance is superior to conventional metal wires and truly novel for a wiring material. However, for CNTs to serve as a full replacement for metals, the electrical conductivity of CNT materials must be improved. Recently, the conductivity of a CNT wire prepared through simultaneous densification and doping has exceeded 1.3 × 10(6) S/m. This level of conductivity brings CNTs closer to copper (5.8 × 10(7) S/m) and competitive with some metals (e.g. gold) on a mass-normalized basis. Developments in manipulation of CNT materials (e.g. type enrichment, doping, alignment, and densification) have shown progress towards this goal. In parallel with efforts to improve bulk conductivity, integration of CNT materials into cabling architectures will require development in electrical contacting. Several methods for contacting bulk CNT materials to metals are demonstrated, including mechanical crimping and ultrasonic bonding, along with a method for reducing contact resistance by tailoring the CNT-metal interface via electroless plating. Collectively, these results summarize recent progress in CNT wiring technologies and illustrate that nanoscale conductors may become a disruptive technology in cabling designs.

Application Of Numerical Modelling To Ribbed Wire Rod Dimensions Precision Increase

NASA Astrophysics Data System (ADS)

Szota, Piotr; Mróz, Sebastian; Stefanik, Andrzej

2007-05-01

The paper presents the results of theoretical and experimental investigations of the process of rolling square ribbed wire rod designed for concrete reinforcement. Numerical modelling of the process of rolling in the finishing and pre-finishing grooves was carried out using the Forge2005® software. In the investigation, particular consideration was given to the analysis of the effect of pre-finished band shape on the formation of ribs on the finished wire rod in the finishing groove. The results of theoretical studies were verified in experimental tests, which were carried out in a wire rolling mill.

Manufacturing Process Development to Produce Depleted Uranium Wire for EBAM Feedstock

DOE Office of Scientific and Technical Information (OSTI.GOV)

Alexander, David John; Clarke, Kester Diederik; Coughlin, Daniel Robert

2015-06-30

Wire produced from depleted uranium (DU) is needed as feedstock for the Electron-Beam Additive Manufacturing (EBAM) process. The goal is to produce long lengths of DU wire with round or rectangular cross section, nominally 1.5 mm (0.060 inches). It was found that rolling methods, rather than swaging or drawing, are preferable for production of intermediate quantities of DU wire. Trials with grooveless rolling have shown that it is suitable for initial reductions of large stock. Initial trials with grooved rolling have been successful, for certain materials. Modified square grooves (square round-bottom vee grooves) with 12.5 % reduction of area permore » pass have been selected for the reduction process.« less

Needleless electrospinning with twisted wire spinneret

NASA Astrophysics Data System (ADS)

Holopainen, Jani; Penttinen, Toni; Santala, Eero; Ritala, Mikko

2015-01-01

A needleless electrospinning setup named ‘Needleless Twisted Wire Electrospinning’ was developed. The polymer solution is electrospun from the surface of a twisted wire set to a high voltage and collected on a cylindrical collector around the wire. Multiple Taylor cones are simultaneously self-formed on the downward flowing solution. The system is robust and simple with no moving parts aside from the syringe pump used to transport the solution to the top of the wire. The structure and process parameters of the setup and the results on the preparation of polyvinyl pyrrolidone (PVP), hydroxyapatite (HA) and bioglass fibers with the setup are presented. PVP fiber sheets with areas of 40 × 120 cm2 and masses up to 1.15 g were prepared. High production rates of 5.23 g h-1 and 1.40 g h-1 were achieved for PVP and HA respectively. The major limiting factor of the setup is drying of the polymer solution on the wire during the electrospinning process which will eventually force to interrupt the process for cleaning of the wire. Possible solutions to this problem and other ways to develop the setup are discussed. The presented system provides a simple way to increase the production rate and area of fiber sheet as compared with the conventional needle electrospinning.

The 80 kV electrostatic wire septum for AmPS

NASA Astrophysics Data System (ADS)

Vanderlinden, A.; Bijleveld, J. H. M.; Rookhuizen, H. Boer; Bruinsma, P. J. T.; Heine, E.; Lassing, P.; Prins, E.

The characteristics of the wire septum for the Amsterdam Pulse Stretcher (AmPS) are summarized. In the extraction process of the AmPS the extracted beam is intercepted from the circulating beam by the 1 m long electrostatic wire septum. For a bending angle of 4.4 mrad, the maximum anode voltage is 80 kV. The system developed consists of a wire spacing of 0.65 mm between tungsten wires of 50 micrometers diameter. Stainless steel spring wires, bent in a half cylindrical carrier, stretch the septum wires two by two. Prototype tests were successful up to an anode voltage of 120 kV.

Displacement of teeth without and with bonded fixed orthodontic retainers: 3D analysis using triangular target frames and optoelectronic motion tracking device.

PubMed

Chakroun, Firas; Colombo, Vera; Lie Sam Foek, Dave; Gallo, Luigi Maria; Feilzer, Albert; Özcan, Mutlu

2018-06-06

The objective of this study was to evaluate the anterior tooth movement without and with bonded fixed orthodontic retainers under incremental loading conditions. Six extracted mandibular anterior human teeth were embedded in acrylic resin in True Form I Arch type and 3D reconstruction of Digital Volume Tomography (DVT) images (0.4 mm 3 voxels) were obtained. The anatomy of each tooth was segmented and digitally reconstructed using 3D visualization software for medical images (AMIRA, FEI SVG). The digital models of the teeth were repositioned to form an arch with constant curvature using a CAD software (Rhinoceros) and a base holder was designed fitting the shape of the roots. The clearance between the roots and their slot in the holder was kept constant at 0.3 mm to replicate the periodontal ligament thickness. The holder and the teeth were then manufactured by 3D printing (Objet Eden 260VS, Stratasys) using a resin material for dental applications (E = 2-3 GPa). The 3D-printed teeth models were then positioned in the holder and the root compartments were filled with silicone. The procedure was repeated to obtain three identical arch models. Each model was tested for tooth mobility by applying force increasing from 5 to 30 N with 5 N increments applied perpendicular on the lingual tooth surface on the incisal one third (crosshead speed: 0.1 mm/s). The teeth on each model were first tested without retainer (control) and subsequently with the bonded retainers (braided bonded retainer wire; Multi-strand 1 × 3 high performance wire, 0.022″ × 0.016″). Tooth displacement was measured in terms of complicance (F/Δ movement) (N/mm) using custom-built optoelectronic motion tracking device (OPTIS) (accuracy: 5 µm; sampling rate: 200 Hz). The position of the object was detected through three LEDs positioned in a fixed triangular shape on a metal support (Triangular Target Frame). The measurements were repeated for three times for each tooth. Data were analyzed using mixed model with nesting (alpha = 0.05). The use of retainer showed a significant effect on tooth mobility (0.008 ± 0.004) compared to non-bonded teeth (control) (0.014 ± 0.009) (p < 0.0001). The amount of displacement on the tooth basis was also significantly different (p = 0.0381) being the most for tooth no. 42 (without: 0.024 ± 0.01; with: 0.012 ± 0.002) (p = 0.0018). No significant difference was observed between repeated measurements (p = 0.097) and the incremental magnitude of loading (5-30 N: 0.07 ± 0.01-0.09 ± 0.02) (p > 0.05). Mandibular anterior teeth showed less tooth mobility when bonded with stainless steel wire as opposed to non-bonded teeth but the tooth mobility varied depending on the tooth type. Intermittent increase in loading from 5 to 30 N did not increase tooth displacement. Copyright © 2018 Elsevier Ltd. All rights reserved.

A broadband 8-18GHz 4-input 4-output Butler matrix

NASA Astrophysics Data System (ADS)

Milner, Leigh; Parker, Michael

2007-01-01

Butler matrices can be used in antenna beam-forming networks to provide a linear phase distribution across the elements of an array. The development of an 8 to 18GHz micro-strip implementation of a 4-input 4-ouput Butler matrix is described. The designed Butler matrix uses March hybrids, Schiffman phase shifters and wire-bond crossovers integrated on a single 60mm x 70mm alumina substrate.

Reactive Silicate Coatings for Protecting and Bonding Reinforcing Steel in Cement-Based Composites

DTIC Science & Technology

2008-12-01

wire. Selected sections of cracked enamel were maintained in the wet condition and examine periodical for evidence of gel formation and crack ... enamel containing portland cement will protect the underlying reinforcing steel in an aggressive environment. d) If the enamel coating is cracked ...oxidized. The increase in volume cracks the concrete around the reinforcement and weakens the steel members. When the steel is separated from the

Assessing the feasibility of yttria-stabilized zirconia in novel designs as mandibular anterior fixed lingual retention following orthodontic treatment

NASA Astrophysics Data System (ADS)

Stout, Matthew

The purpose of this study is to explore the feasibility of yttria-stabilized zirconia (Y-TZP) in fixed lingual retention as an alternative to stainless steel. Exploratory Y-TZP specimens were milled to establish design parameters. Next, specimens were milled according to ASTM standard C1161-13 and subjected to four-point flexural test to determine materials properties. Finite Element (FE) Analysis was employed to evaluate nine novel cross-sectional designs and compared to stainless steel wire. Each design was analyzed under the loading conditions to determine von Mises and bond stress. The most promising design was fabricated to assess accuracy and precision of current CAD/CAM milling technology. The superior design had a 1.0 x 0.5 mm semi-elliptical cross section and was shown to be fabricated reliably. Overall, the milling indicated a maximum percent standard deviation of 9.3 and maximum percent error of 13.5 with a cost of $30 per specimen. Y-TZP can be reliably milled to dimensions comparable to currently available metallic retainer wires. Further research is necessary to determine the success of bonding protocol and clinical longevity of Y-TZP fixed retainers. Advanced technology is necessary to connect the intraoral scan to an aesthetic and patient-specific Y-TZP fixed retainer.

Method of manufacturing superconductor wire

DOEpatents

Motowidlo, Leszek

2014-09-16

A method for forming Nb.sub.3Sn superconducting wire is provided. The method employs a powder-in-tube process using a high-tin intermetallic compound, such as MnSn.sub.2, for producing the Nb.sub.3Sn. The use of a high-tin intermetallic compound enables the process to perform hot extrusion without melting the high-tin intermetallic compound. Alternatively, the method may entail drawing the wire without hot extrusion.

Process for producing fine and ultrafine filament superconductor wire

DOEpatents

Kanithi, H.C.

1992-02-18

A process for producing a superconductor wire made up of a large number of round monofilament rods is provided for, comprising assembling a multiplicity of round monofilaments inside each of a multiplicity of thin wall hexagonal tubes and then assembling a number of said thin wall hexagonal tubes within an extrusion can and subsequently consolidating, extruding and drawing the entire assembly down to the desired wire size. 8 figs.

Process for producing fine and ultrafine filament superconductor wire

DOEpatents

Kanithi, Hem C.

1992-01-01

A process for producing a superconductor wire made up of a large number of round monofilament rods is provided for, comprising assembling a multiplicity of round monofilaments inside each of a multiplicity of thin wall hexagonal tubes and then assembling a number of said thin wall hexagonal tubes within an extrusion can and subsequently consolidating, extruding and drawing the entire assembly down to the desired wire size.

Could titanium oxide coating from a sol-gel process make stone baskets more resistant to laser radiation at 2.1 μm?

PubMed

Cordes, Jens; Nguyen, Felix; Heidenau, Frank; Jocham, Dieter

2012-10-19

Stone baskets could be easily destroyed by Holmium:YAG-laser at an endourologic treatment, with respect to this, we try to improve the resistance by coating them with a titanium oxide layer. The layer was established by a sol-gel-process. Six new baskets (Equadus, Opi Med, Ettlingen, Germany) were used: 1.8 Ch. with 4 wires (diameter 0.127 mm). Three baskets were coated with a layer of titanium oxide established by a sol-gel process at the BioCerEntwicklungs GmbH in Bayreuth (~100 nanometres thickness). The lithotripter was a Holmium:YAG laser (Auriga XL, Starmedtec, Starnberg, Germany). 10 uncoated and 10 coated wires were tested with 610 mJ (the minimal clinical setting) and 2 uncoated and 2 coated wires were tested with 110 mJ. The wires were locked in a special holding instrument under water and the laser incident angle was 90°. The endpoint was gross visible damage to the wire and loss of electric conduction. Only two coated wires resisted two pulses (one in the 610 mJ and one in the 110 mJ setting). All other wires were destroyed after one pulse. This was the first attempt at making stone baskets more resistant to a Holmium:YAG laser beam. Titanium oxide deposited by a sol-gel-process on a titanium-nickel alloy did not result in better resistance to laser injuries.

Fatigue failure of regenerator screens in a high frequency Stirling engine

NASA Technical Reports Server (NTRS)

Hull, David R.; Alger, Donald L.; Moore, Thomas J.; Scheuermann, Coulson M.

1987-01-01

Failure of Stirling Space Power Demonstrator Engine (SPDE) regenerator screens was investigated. After several hours of operation the SPDE was shut down for inspection and on removing the regenerator screens, debris of unknown origin was discovered along with considerable cracking of the screens in localized areas. Metallurgical analysis of the debris determined it to be cracked-off-deformed pieces of the 41 micron thickness Type 304 stainless steel wire screen. Scanning electron microscopy of the cracked screens revealed failures occurring at wire crossovers and fatigue striations on the fracture surface of the wires. Thus, the screen failure can be characterized as a fatigue failure of the wires. The crossovers were determined to contain a 30 percent reduction in wire thickness and a highly worked microstructure occurring from the manufacturing process of the wire screens. Later it was found that reduction in wire thickness occurred because the screen fabricator had subjected it to a light cold-roll process after weaving. Installation of this screen left a clearance in the regenerator allowing the screens to move. The combined effects of the reduction in wire thickness, stress concentration (caused by screen movement), and highly worked microstructure at the wire crossovers led to the fatigue failure of the screens.

Electron beam additive manufacturing with wire - Analysis of the process

NASA Astrophysics Data System (ADS)

Weglowski, Marek St.; Błacha, Sylwester; Pilarczyk, Jan; Dutkiewicz, Jan; Rogal, Łukasz

2018-05-01

The electron beam additive manufacturing process with wire is a part of global trend to find fast and efficient methods for producing complex shapes elements from costly metal alloys such as stainless steels, nickel alloys, titanium alloys etc. whose production by other conventional technologies is unprofitable or technically impossible. Demand for additive manufacturing is linked to the development of new technologies in the automotive, aerospace and machinery industries. The aim of the presented work was to carried out research on electron beam additive manufacturing with a wire as a deposited (filler) material. The scope of the work was to investigate the influence of selected technological parameters such as: wire feed rate, beam current, travelling speed, acceleration voltage on stability of the deposition process and geometric dimensions of the padding welds. The research revealed that, at low beam currents, the deposition process is unstable. The padding weld reinforcement is non-uniform. Irregularity of the width, height and straightness of the padding welds can be observed. At too high acceleration voltage and beam current, burn-through of plate and excess penetration weld can be revealed. The achieved results and gained knowledge allowed to produce, based on EBAM with wire process, whole structure from stainless steel.

Enhanced control of electrochemical response in metallic materials in neural stimulation electrode applications

DOE Office of Scientific and Technical Information (OSTI.GOV)

Watkins, K.G.; Steen, W.M.; Manna, I.

New means have been investigated for the production of electrode devices (stimulation electrodes) which could be implanted in the human body in order to control pain, activate paralysed limbs or provide electrode arrays for cochlear implants for the deaf or for the relief of tinitus. To achieve this ion implantation and laser materials processing techniques were employed. Ir was ion implanted in Ti-6Al-4V alloy and the surface subsequently enriched in the noble metal by dissolution in sulphuric acid. For laser materials processing techniques, investigation has been carried out on the laser cladding and laser alloying of Ir in Ti wire.more » A particular aim has been the determination of conditions required for the formation of a two phase Ir, Ir-rich, and Ti-rich microstructure which would enable subsequent removal of the non-noble phase to leave a highly porous noble metal with large real surface area and hence improved charge carrying capacity compared with conventional non porous electrodes. Evaluation of the materials produced has been carried out using repetitive cyclic voltammetry, amongst other techniques. For laser alloyed Ir on Ti wire, it has been found that differences in the melting point and density of the materials makes control of the cladding or alloying process difficult. Investigation of laser process parameters for the control of alloying and cladding in this system was carried out and a set of conditions for the successful production of two phase Ir-rich and Ti-rich components in a coating layer with strong metallurgical bonding to the Ti alloy substrate was derived. The laser processed material displays excellent potential for further development in providing stimulation electrodes with the current carrying capacity of Ir but in a form which is malleable and hence capable of formation into smaller electrodes with improved spatial resolution compared with presently employed electrodes.« less

Copper diffusion and mechanical toughness at Cu-silica interfaces glued with polyelectrolyte nanolayers

NASA Astrophysics Data System (ADS)

Gandhi, D. D.; Singh, A. P.; Lane, M.; Eizenberg, M.; Ramanath, G.

2007-04-01

We demonstrate the use of polyallylamine hydrochloride (PAH)-polystyrene sulfonate (PSS) nanolayers to block Cu transport into silica. Cu/PSS-PAH/SiO2 structures show fourfold enhancement in device failure times during bias thermal annealing at 200 °C at an applied electric field of 2 MV/cm, when compared with structures with pristine Cu-SiO2 interfaces. Although the bonding at both Cu-PSS and PAH-SiO2 interfaces are strong, the interfacial toughness measured by the four-point bend tests is ˜2 Jm-2. Spectroscopic analysis of fracture surfaces reveals that weak electrostatic bonding at the PSS-PAH interface is responsible for the low toughness. Similar behavior is observed for Cu-SiO2 interfaces modified with other polyelectrolyte bilayers that inhibit Cu diffusion. Thus, while strong bonding at Cu-barrier and barrier-dielectric interfaces may be sufficient for blocking copper transport across polyelectrolyte bilayers, strong interlayer molecular bonding is a necessary condition for interface toughening. These findings are of importance for harnessing MNLs for use in future device wiring applications.

Confining jackets for concrete cylinders using NiTiNb and NiTi shape memory alloy wires

NASA Astrophysics Data System (ADS)

Choi, Eunsoo; Nam, Tae-Hyun; Yoon, Soon-Jong; Cho, Sun-Kyu; Park, Joonam

2010-05-01

This study used prestrained NiTiNb and NiTi shape memory alloy (SMA) wires to confine concrete cylinders. The recovery stress of the wires was measured with respect to the maximal prestrain of the wires. SMA wires were preelongated during the manufacturing process and then wrapped around concrete cylinders of 150 mm×300 mm (phi×L). Unconfined concrete cylinders were tested for compressive strength and the results were compared to those of cylinders confined by SMA wires. NiTiNb SMA wires increased the compressive strength and ductility of the cylinders due to the confining effect. NiTiNb wires were found to be more effective in increasing the peak strength of the cylinders and dissipating energy than NiTi wires. This study showed the potential of the proposed method to retrofit reinforced concrete columns using SMA wires to protect them from earthquakes.

Understanding the densification process of Bi2Sr2CaCu2Ox round wires with overpressure processing and its effect on critical current density

PubMed Central

Matras, M. R.; Jiang, J.; Larbalestier, D. C.; Hellstrom, E. E.

2016-01-01

Overpressure (OP) processing increases the critical current density (JC) of Bi2Sr2CaCu2Ox (2212) round wires by shrinking the surrounding Ag matrix around the 2212 filaments, driving them close to full density and greatly increasing the 2212 grain connectivity. Indeed densification is vital for attaining the highest JC. Here, we investigate the time and temperature dependence of the wire densification. We find that the wire diameter decreases by 3.8 ± 0.3 % after full heat treatment at 50 atm and 100 atm OP. At 50 atm OP pressure, the filaments start densifying above 700 °C and reach a 3.30 ± 0.07 % smaller diameter after 2 h at 820 °C, which is below the melting point of 2212 powder. The densification is homogeneous and does not change the filament shape before melting. The growth of non-superconducting phases is observed at 820 °C, suggesting that time should be minimized at high temperature prior to melting the 2212 powder. Study of an open-ended 2.2 m long wire sample shows that full densification and the high OP JC (JC varies by about 3.1 times over the 2.2 m long wire) is reached about 1 m from the open ends, thus showing that coil-length wires can be protected from leaky seals by adding at least 1 m of sacrificial wire at each end. PMID:28479675

Using of fiber-array diagnostic to measure the propagation of fast axial ionization wave during breakdown of electrically exploding tungsten wire in vacuum.

PubMed

Shi, Huantong; Zou, Xiaobing; Wang, Xinxin

2017-12-01

The physical process of electrical explosion of wires in vacuum is featured with the surface discharge along the wire, which generates the corona plasma layer and terminates the Joule heating of the wire core. In this paper, a fiber-array probe was designed to directly measure the radiation of surface arc with spatial and temporal resolution. The radiation of the exploding wire was casted to the section of an optical-fiber-array by a lens and transmitted to PIN diodes and finally collected with an oscilloscope. This probe enables direct diagnostics of the evolution of surface discharge with high temporal resolution and certain spatial resolution. The radiation of a tungsten wire driven by a positive current pulse was measured, and results showed that surface discharge initiates near the cathode and propagates toward the anode with a speed of 7.7 ± 1.6 mm/ns; further estimations showed that this process is responsible for the "conical" structure of the exploding wire.

InGaAs/InP quantum wires grown on silicon with adjustable emission wavelength at telecom bands

NASA Astrophysics Data System (ADS)

Han, Yu; Li, Qiang; Ng, Kar Wei; Zhu, Si; Lau, Kei May

2018-06-01

We report the growth of vertically stacked InGaAs/InP quantum wires on (001) Si substrates with adjustable room-temperature emission at telecom bands. Based on a self-limiting growth mode in selective area metal–organic chemical vapor deposition, crescent-shaped InGaAs quantum wires with variable dimensions are embedded within InP nano-ridges. With extensive transmission electron microscopy studies, the growth transition and morphology change from quantum wires to ridge quantum wells (QWs) have been revealed. As a result, we are able to decouple the quantum wires from ridge QWs and manipulate their dimensions by scaling the growth time. With minimized lateral dimension and their unique positioning, the InGaAs/InP quantum wires are more immune to dislocations and more efficient in radiative processes, as evidenced by their excellent optical quality at telecom-bands. These promising results thus highlight the potential of combining low-dimensional quantum wire structures with the aspect ratio trapping process for integrating III–V nano-light emitters on mainstream (001) Si substrates.

Using of fiber-array diagnostic to measure the propagation of fast axial ionization wave during breakdown of electrically exploding tungsten wire in vacuum

NASA Astrophysics Data System (ADS)

Shi, Huantong; Zou, Xiaobing; Wang, Xinxin

2017-12-01

The physical process of electrical explosion of wires in vacuum is featured with the surface discharge along the wire, which generates the corona plasma layer and terminates the Joule heating of the wire core. In this paper, a fiber-array probe was designed to directly measure the radiation of surface arc with spatial and temporal resolution. The radiation of the exploding wire was casted to the section of an optical-fiber-array by a lens and transmitted to PIN diodes and finally collected with an oscilloscope. This probe enables direct diagnostics of the evolution of surface discharge with high temporal resolution and certain spatial resolution. The radiation of a tungsten wire driven by a positive current pulse was measured, and results showed that surface discharge initiates near the cathode and propagates toward the anode with a speed of 7.7 ± 1.6 mm/ns; further estimations showed that this process is responsible for the "conical" structure of the exploding wire.

Development of practical high temperature superconducting wire for electric power application

NASA Technical Reports Server (NTRS)

Hawsey, Robert A.; Sokolowski, Robert S.; Haldar, Pradeep; Motowidlo, Leszek R.

1995-01-01

The technology of high temperature superconductivity has gone from beyond mere scientific curiousity into the manufacturing environment. Single lengths of multifilamentary wire are now produced that are over 200 meters long and that carry over 13 amperes at 77 K. Short-sample critical current densities approach 5 x 104 A/sq cm at 77 K. Conductor requirements such as high critical current density in a magnetic field, strain-tolerant sheathing materials, and other engineering properties are addressed. A new process for fabricating round BSCCO-2212 wire has produced wires with critical current densities as high as 165,000 A/sq cm at 4.2 K and 53,000 A/sq cm at 40 K. This process eliminates the costly, multiple pressing and rolling steps that are commonly used to develop texture in the wires. New multifilamentary wires with strengthened sheathing materials have shown improved yield strengths up to a factor of five better than those made with pure silver. Many electric power devices require the wire to be formed into coils for production of strong magnetic fields. Requirements for coils and magnets for electric power applications are described.

InGaAs/InP quantum wires grown on silicon with adjustable emission wavelength at telecom bands.

PubMed

Han, Yu; Li, Qiang; Ng, Kar Wei; Zhu, Si; Lau, Kei May

2018-06-01

We report the growth of vertically stacked InGaAs/InP quantum wires on (001) Si substrates with adjustable room-temperature emission at telecom bands. Based on a self-limiting growth mode in selective area metal-organic chemical vapor deposition, crescent-shaped InGaAs quantum wires with variable dimensions are embedded within InP nano-ridges. With extensive transmission electron microscopy studies, the growth transition and morphology change from quantum wires to ridge quantum wells (QWs) have been revealed. As a result, we are able to decouple the quantum wires from ridge QWs and manipulate their dimensions by scaling the growth time. With minimized lateral dimension and their unique positioning, the InGaAs/InP quantum wires are more immune to dislocations and more efficient in radiative processes, as evidenced by their excellent optical quality at telecom-bands. These promising results thus highlight the potential of combining low-dimensional quantum wire structures with the aspect ratio trapping process for integrating III-V nano-light emitters on mainstream (001) Si substrates.

Solution of magnetohydrodynamic flow and heat transfer of radiative viscoelastic fluid with temperature dependent viscosity in wire coating analysis

PubMed Central

Khan, Muhammad Altaf; Siddiqui, Nasir; Ullah, Murad; Shah, Qayyum

2018-01-01

Wire coating process is a continuous extrusion process for primary insulation of conducting wires with molten polymers for mechanical strength and protection in aggressive environments. In the present study, radiative melt polymer satisfying third grade fluid model is used for wire coating process. The effect of magnetic parameter, thermal radiation parameter and temperature dependent viscosity on wire coating analysis has been investigated. Reynolds model and Vogel’s models have been incorporated for variable viscosity. The governing equations characterizing the flow and heat transfer phenomena are solved analytically by utilizing homotopy analysis method (HAM). The computed results are also verified by ND-Solve method (Numerical technique) and Adomian Decomposition Method (ADM). The effect of pertinent parameters is shown graphically. In addition, the instability of the flow in the flows of the wall of the extrusion die is well marked in the case of the Vogel model as pointed by Nhan-Phan-Thien. PMID:29596448

Cryogenic deformation of high temperature superconductive composite structures

DOEpatents

Roberts, Peter R.; Michels, William; Bingert, John F.

2001-01-01

An improvement in a process of preparing a composite high temperature oxide superconductive wire is provided and involves conducting at least one cross-sectional reduction step in the processing preparation of the wire at sub-ambient temperatures.

Electronics reliability fracture mechanics. Volume 2: Fracture mechanics

NASA Astrophysics Data System (ADS)

Kallis, J.; Duncan, L.; Buechler, D.; Backes, P.; Sandkulla, D.

1992-05-01

This is the second of two volumes. The other volume (WL-TR-92-3015) is 'Causes of Failures of Shop Replaceable Units and Hybrid Microcircuits.' The objective of the Electronics Reliability Fracture Mechanics (ERFM) program was to develop and demonstrate a life prediction technique for electronic assemblies, when subjected to environmental stresses of vibration and thermal cycling, based upon the mechanical properties of the materials and packaging configurations which make up an electronic system. The application of fracture mechanics to microscale phenomena in electronic assemblies was a pioneering research effort. The small scale made the experiments very difficult; for example, the 1-mil-diameter bond wires in microelectronic devices are 1/3 the diameter of a human hair. A number of issues had to be resolved to determine whether a fracture mechanics modelling approach is correct for the selected failures; specifically, the following two issues had to be resolved: What fraction of the lifetime is spent in crack initiation? Are macro fracture mechanics techniques, used in large structures such as bridges, applicable to the tiny structures in electronic equipment? The following structural failure mechanisms were selected for modelling: bondwire fracture from mechanical cycling; bondwire fracture from thermal (power) cycling; plated through hole (PTH) fracture from thermal cycling. The bondwire fracture test specimens were A1-1 percent Si wires, representative of wires used in the parts in the modules selected for detailed investigation in this program (see Vol. 1 of this report); 1-mil-diameter wires were tested in this program. The PTH test specimens were sections of 14-layer printed wiring boards of the type used.

Competing charge density wave and antiferromagnetism of metallic atom wires in GaN(10 1 ¯ ) and ZnO(10 1 ¯ )

NASA Astrophysics Data System (ADS)

Kang, Yoon-Gu; Kim, Sun-Woo; Cho, Jun-Hyung

2017-12-01

Low-dimensional electron systems often show a delicate interplay between electron-phonon and electron-electron interactions, giving rise to interesting quantum phases such as the charge density wave (CDW) and magnetism. Using the density-functional theory (DFT) calculations with the semilocal and hybrid exchange-correlation functionals as well as the exact-exchange plus correlation in the random-phase approximation (EX + cRPA), we systematically investigate the ground state of the metallic atom wires containing dangling-bond (DB) electrons, fabricated by partially hydrogenating the GaN(10 1 ¯0 ) and ZnO(10 1 ¯0 ) surfaces. We find that the CDW or antiferromagnetic (AFM) order has an electronic energy gain due to a band-gap opening, thereby being more stabilized compared to the metallic state. Our semilocal DFT calculation predicts that both DB wires in GaN(10 1 ¯0 ) and ZnO(10 1 ¯0 ) have the same CDW ground state, whereas the hybrid DFT and EX + cRPA calculations predict the AFM ground state for the former DB wire and the CDW ground state for the latter one. It is revealed that more localized Ga DB electrons in GaN(10 1 ¯0 ) prefer the AFM order, while less localized Zn DB electrons in ZnO(10 1 ¯0 ) the CDW formation. Our findings demonstrate that the drastically different ground states are competing in the DB wires created on the two representative compound semiconductor surfaces.

Blast Coating of Superelastic NiTi Wire with PTFE to Enhance Wear Properties

NASA Astrophysics Data System (ADS)

Dunne, Conor F.; Roche, Kevin; Twomey, Barry; Hodgson, Darel; Stanton, Kenneth T.

2015-03-01

This work investigates the deposition of polytetrafluoroethylene (PTFE) onto a superelastic NiTi wire using an ambient temperature-coating technique known as CoBlast. The process utilises a stream of abrasive (Al2O3) and a coating medium (PTFE) sprayed simultaneously at the surface of the substrate. Superelastic NiTi wire is used in guidewire applications, and PTFE coatings are commonly applied to reduce damage to vessel walls during insertion and removal, and to aid in accurate positioning by minimising the force required to advance, retract or rotate the wire. The CoBlast coated wires were compared to wire treated with PTFE only. The coated samples were examined using variety of techniques: X-ray diffraction (XRD), microscopy, surface roughness, wear testing and flexural tests. The CoBlast coated samples had an adherent coating with a significant resistance to wear compared to the samples coated with PTFE only. The XRD revealed that the process gave rise to a stress-induced martensite phase in the NiTi which may enhance mechanical properties. The study indicates that the CoBlast process can be used to deposit thin adherent coatings of PTFE onto the surface of superelastic NiTi.

Evaluation of Young’s modulus of MgB2 filaments in composite wires for the superconducting links for the high-luminosity LHC upgrade

NASA Astrophysics Data System (ADS)

Sugano, Michinaka; Ballarino, Amalia; Bartova, Barbora; Bjoerstad, Roger; Gerardin, Alexandre; Scheuerlein, Christian

2016-02-01

MgB2 wire is a promising superconductor for the superconducting links for the high-luminosity upgrade of the large Hadron collider at CERN. The mechanical properties of MgB2 must be fully quantified for the cable design, and in this study, we evaluate the Young’s modulus of MgB2 filaments in wires with a practical level of critical current. The Young’s moduli of MgB2 filaments by two different processes, in situ and ex situ, were compared. Two different evaluation methods were applied to an in situ MgB2 wire, a single-fiber tensile test and a tensile test after removing Monel. In addition, the Young’s modulus of the few-micron-thick Nb-Ni reaction layer in an ex situ processed wire was evaluated using a nanoindentation testing technique to improve the accuracy of analysis based on the rule of mixtures. The Young’s moduli of the in situ and ex situ MgB2 wires were in the range of 76-97 GPa and no distinct difference depending on the fabrication process was found.

Strengthening of Aluminum Wires Treated with A206/Alumina Nanocomposites.

PubMed

Florián-Algarín, David; Marrero, Raúl; Li, Xiaochun; Choi, Hongseok; Suárez, Oscar Marcelo

2018-03-10

This study sought to characterize aluminum nanocomposite wires that were fabricated through a cold-rolling process, having potential applications in TIG (tungsten inert gas) welding of aluminum. A206 (Al-4.5Cu-0.25Mg) master nanocomposites with 5 wt % γAl₂O₃ nanoparticles were first manufactured through a hybrid process combining semi-solid mixing and ultrasonic processing. A206/1 wt % γAl₂O₃ nanocomposites were fabricated by diluting the prepared master nanocomposites with a monolithic A206 alloy, which was then added to a pure aluminum melt. The fabricated Al-γAl₂O₃ nanocomposite billet was cold-rolled to produce an Al nanocomposite wire with a 1 mm diameter and a transverse area reduction of 96%. Containing different levels of nanocomposites, the fabricated samples were mechanically and electrically characterized. The results demonstrate a significantly higher strength of the aluminum wires with the nanocomposite addition. Further, the addition of alumina nanoparticles affected the wires' electrical conductivity compared with that of pure aluminum and aluminum-copper alloys. The overall properties of the new material demonstrate that these wires could be an appealing alternative for fillers intended for aluminum welding.

Highly Conductive One-Dimensional Manganese Oxide Wires by Coating with Graphene Oxides

NASA Astrophysics Data System (ADS)

Tojo, Tomohiro; Shinohara, Masaki; Fujisawa, Kazunori; Muramatsu, Hiroyuki; Hayashi, Takuya; Ahm Kim, Yoong; Endo, Morinobu

2012-10-01

Through coating with graphene oxides, we have developed a chemical route to the bulk production of long, thin manganese oxide (MnO2) nanowires that have high electrical conductivity. The average diameter of these hybrid nanowires is about 25 nm, and their average length is about 800 nm. The high electrical conductivity of these nanowires (ca. 189.51+/-4.51 µS) is ascribed to the homogeneous coating with conductive graphene oxides as well as the presence of non-bonding manganese atoms. The growth mechanism of the nanowires is theoretically supported by the initiation of morphological conversion from graphene oxide to wrapped structures through the formation of covalent bonds between manganese and oxygen atoms at the graphene oxide edge.

PbS-PbSe IR detector arrays

NASA Technical Reports Server (NTRS)

Barrett, John R. (Inventor)

1986-01-01

A silicon wafer is provided which does not employ individually bonded leads between the IR sensitive elements and the input stages of multiplexers. The wafer is first coated with lead selenide in a first detector array area and is thereafter coated with lead sulfide within a second detector array area. The described steps result in the direct chemical deposition of lead selenide and lead sulfide upon the silicon wafer to eliminate individual wire bonding, bumping, flip chipping, planar interconnecting methods of connecting detector array elements to silicon chip circuitry, e.g., multiplexers, to enable easy fabrication of very long arrays. The electrode structure employed, produces an increase in the electrical field gradient between the electrodes for a given volume of detector material, relative to conventional electrode configurations.

Multiple Differential-Amplifier MMICs Embedded in Waveguides

NASA Technical Reports Server (NTRS)

Kangaslahti, Pekka; Schlecht, Erich

2010-01-01

Compact amplifier assemblies of a type now being developed for operation at frequencies of hundreds of gigahertz comprise multiple amplifier units in parallel arrangements to increase power and/or cascade arrangements to increase gains. Each amplifier unit is a monolithic microwave integrated circuit (MMIC) implementation of a pair of amplifiers in differential (in contradistinction to single-ended) configuration. Heretofore, in cascading amplifiers to increase gain, it has been common practice to interconnect the amplifiers by use of wires and/or thin films on substrates. This practice has not yielded satisfactory results at frequencies greater than 200 Hz, in each case, for either or both of two reasons: Wire bonds introduce large discontinuities. Because the interconnections are typically tens of wavelengths long, any impedance mismatches give rise to ripples in the gain-vs.-frequency response, which degrade the performance of the cascade.

Temperature Changes of Pulp Chamber during In Vitro Laser Welding of Orthodontic Attachments

PubMed Central

İşman, Eren; Okşayan, Rıdvan; Sökücü, Oral; Üşümez, Serdar

2014-01-01

The use of lasers has been suggested for orthodontists to fabricate or repair orthodontic appliances by welding metals directly in the mouth. This work aimed to evaluate the temperature changes in the pulp chamber during welding of an orthodontic wire to an orthodontic molar band using Nd : YAG laser in vitro. A freshly extracted human third molar with eliminated pulpal tissues was used. J-type thermocouple wire was positioned in the pulp chamber. A conductor gel was used in the transferring of outside temperature changes to the thermocouple wire. An orthodontic band was applied to the molar tooth and bonded using light cured orthodontic cement. Twenty five mm length of 0.6 mm diameter orthodontic stainless steel wires was welded to the orthodontic band using Nd : YAG laser operated at 9.4 watt. Temperature variation was determined as the change from baseline temperature to the highest temperature was recorded during welding. The recorded temperature changes were between 1.8 and 6.8°C (mean: 3.3 ± 1.1°C). The reported critical 5.5°C level was exceeded in only one sample. The results of this study suggest that intraoral use of lasers holds great potential for the future of orthodontics and does not present a thermal risk. Further studies with larger samples and structural analysis are required. PMID:24550714

Improvement of the Mechanical Properties of 1022 Carbon Steel Coil by Using the Taguchi Method to Optimize Spheroidized Annealing Conditions.

PubMed

Yang, Chih-Cheng; Liu, Chang-Lun

2016-08-12

Cold forging is often applied in the fastener industry. Wires in coil form are used as semi-finished products for the production of billets. This process usually requires preliminarily drawing wire coil in order to reduce the diameter of products. The wire usually has to be annealed to improve its cold formability. The quality of spheroidizing annealed wire affects the forming quality of screws. In the fastener industry, most companies use a subcritical process for spheroidized annealing. Various parameters affect the spheroidized annealing quality of steel wire, such as the spheroidized annealing temperature, prolonged heating time, furnace cooling time and flow rate of nitrogen (protective atmosphere). The effects of the spheroidized annealing parameters affect the quality characteristics of steel wire, such as the tensile strength and hardness. A series of experimental tests on AISI 1022 low carbon steel wire are carried out and the Taguchi method is used to obtain optimum spheroidized annealing conditions to improve the mechanical properties of steel wires for cold forming. The results show that the spheroidized annealing temperature and prolonged heating time have the greatest effect on the mechanical properties of steel wires. A comparison between the results obtained using the optimum spheroidizing conditions and the measures using the original settings shows the new spheroidizing parameter settings effectively improve the performance measures over their value at the original settings. The results presented in this paper could be used as a reference for wire manufacturers.

Physical and mechanical properties of a thermomechanically treated NiTi wire used in the manufacture of rotary endodontic instruments.

PubMed

Pereira, E S J; Peixoto, I F C; Viana, A C D; Oliveira, I I; Gonzalez, B M; Buono, V T L; Bahia, M G A

2012-05-01

To compare physical and mechanical properties of one conventional and one thermomechanically treated nickel-titanium (NiTi) wire used to manufacture rotary endodontic instruments. Two NiTi wires 1.0 mm in diameter were characterized; one of them, C-wire (CW), was processed in the conventional manner, and the other, termed M-Wire (MW), received an additional heat treatment according to the manufacturer. Chemical composition was determined by energy-dispersive X-ray spectroscopy, phase constitution by XRD and the transformation temperatures by DSC. Tensile loading/unloading tests and Vickers microhardness measurements were performed to assess the mechanical behaviour. Data were analysed using analysis of variance (α = 0.05). The two wires showed approximately the same chemical composition, close to the 1 : 1 atomic ratio, and the β-phase was the predominant phase present. B19' martensite and the R-phase were found in MW, in agreement with the higher transformation temperatures found in this wire compared with CW, whose transformation temperatures were below room temperature. Average Vickers microhardness values were similar for MW and CW (P = 0.91). The stress at the transformation plateau in the tensile load-unload curves was lower and more uniform in the M-Wire, which also showed the smallest stress hysteresis and apparent elastic modulus. The M-Wire had physical and mechanical properties that can render endodontic instruments more flexible and fatigue resistant than those made with conventionally processed NiTi wires. © 2011 International Endodontic Journal.

Proceedings of the ECOM Hybrid Microcircuit Symposium, 1976

DTIC Science & Technology

1976-06-01

remove both stationary and moving clutter. The hex fast line receiver micrýocircuit is a thin film chip-and-wire microcircuit (shown in Figure 7) which...of the following: (a) multiple usage, (b) high volume production, or (c) moderate volume and multiple usage. These criteria are not hard and fast ...compounding when the circuit complexity increases. O particular concern are open or intermittent bonds, susceptibility to moisture and impurities in the

A novel five-wire micro anemometer with 3D directionality for low speed air flow detection and acoustic particle velocity detecting capability

NASA Astrophysics Data System (ADS)

Li, Zhe; Chang, Wenhan; Gao, Chengchen; Hao, Yilong

2018-04-01

In this paper, a novel five-wire micro-fabricated anemometer with 3D directionality based on calorimetric principle is proposed, which is capable of measuring low speed airflow. This structure is realized by vertically bonding two different dies, which can be fabricated on the same wafer resulting in a simple fabrication process. Experiments on speed lower than 200 mm s-1 are conducted, showing good repeatability and directionality. The speed of airflow is controlled by the volumetric flow rate. The measured velocity sensitivity is 9.4 mV · s m-1, with relative direction sensitivity of 37.1 dB. The deviation between the expected and the measured directivity is analyzed by both theories and simulations. A correction procedure is proposed and turns out to be useful to eliminate this deviation. To further explore the potential of our device, we expose it to acoustic plane waves in a standing wave tube, showing consistent planar directivity of figure of eight. The measured velocity sensitivity at 1 kHz and 120 dBC is 4.4 mV · s m-1, with relative direction sensitivity of 27.0 dB. By using the correction method proposed above, the maximum angle error is about  ±2°, showing its good directionality accuracy.

Toward a distributed free-floating wireless implantable neural recording system.

PubMed

Pyungwoo Yeon; Xingyuan Tong; Byunghun Lee; Mirbozorgi, Abdollah; Ash, Bruce; Eckhardt, Helmut; Ghovanloo, Maysam

2016-08-01

To understand the complex correlations between neural networks across different regions in the brain and their functions at high spatiotemporal resolution, a tool is needed for obtaining long-term single unit activity (SUA) across the entire brain area. The concept and preliminary design of a distributed free-floating wireless implantable neural recording (FF-WINeR) system are presented, which can enabling SUA acquisition by dispersedly implanting tens to hundreds of untethered 1 mm3 neural recording probes, floating with the brain and operating wirelessly across the cortical surface. For powering FF-WINeR probes, a 3-coil link with an intermediate high-Q resonator provides a minimum S21 of -22.22 dB (in the body medium) and -21.23 dB (in air) at 2.8 cm coil separation, which translates to 0.76%/759 μW and 0.6%/604 μW of power transfer efficiency (PTE) / power delivered to a 9 kΩ load (PDL), in body and air, respectively. A mock-up FF-WINeR is implemented to explore microassembly method of the 1×1 mm2 micromachined silicon die with a bonding wire-wound coil and a tungsten micro-wire electrode. Circuit design methods to fit the active circuitry in only 0.96 mm2 of die area in a 130 nm standard CMOS process, and satisfy the strict power and performance requirements (in simulations) are discussed.

Quench degradation limit of multifilamentary AgBi 2Sr 2CaCu 2O x round wires

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ye, Liyang; Li, Pei; Shen, Tengming

Understanding safe operating limits of composite superconducting wires is important for the design of superconducting magnets. Here we report measurements of quench-induced critical current density Jc degradation in commercial Ag/Bi 2Sr 2CaCu 2O x (Bi-2212) round wires using heater-induced quenches at 4.2 K in self magnetic field that reveal a general degradation behavior. J c degradation strongly depends on the local hot spot temperature T max, and is nearly independent of operating current, the temperature gradient along the conductor dT max/dx, and the temperature rising rate dT max/dt. Both J c and n value (where n is an index ofmore » the sharpness of the superconductor-to-normal transition) exhibit small but irreversible degradation when T max exceeds 400-450 K, and large degradation occurs when Tmax exceeds 550 K. This behavior was consistently found for a series of Bi-2212 wires with widely variable wire architectures and porosity levels in the Bi-2212 filaments, including a wire processed using a standard partial melt processing and in which Bi-2212 filaments are porous, an overpressure processed wire in which Bi-2212 filaments are nearly porosity-free and that has a J c(4.2 K, self field) exceeding 8000 A/mm 2, and a wire that has nearly no filament to filament bridges after reaction. Microstructural observations of degraded wires reveal cracks in the Bi-2212 filaments perpendicular to the wire axis, indicating that the quench-induced I c degradation is primarily driven by strain. These results further suggest that the quench degradation temperature limit depends on the strain state of Bi-2212 filaments and this dependence shall be carefully considered when engineering a high-field Bi-2212 magnet.« less

Quench degradation limit of multifilamentary AgBi 2Sr 2CaCu 2O x round wires

DOE PAGES

Ye, Liyang; Li, Pei; Shen, Tengming; ...

2016-02-02

Understanding safe operating limits of composite superconducting wires is important for the design of superconducting magnets. Here we report measurements of quench-induced critical current density Jc degradation in commercial Ag/Bi 2Sr 2CaCu 2O x (Bi-2212) round wires using heater-induced quenches at 4.2 K in self magnetic field that reveal a general degradation behavior. J c degradation strongly depends on the local hot spot temperature T max, and is nearly independent of operating current, the temperature gradient along the conductor dT max/dx, and the temperature rising rate dT max/dt. Both J c and n value (where n is an index ofmore » the sharpness of the superconductor-to-normal transition) exhibit small but irreversible degradation when T max exceeds 400-450 K, and large degradation occurs when Tmax exceeds 550 K. This behavior was consistently found for a series of Bi-2212 wires with widely variable wire architectures and porosity levels in the Bi-2212 filaments, including a wire processed using a standard partial melt processing and in which Bi-2212 filaments are porous, an overpressure processed wire in which Bi-2212 filaments are nearly porosity-free and that has a J c(4.2 K, self field) exceeding 8000 A/mm 2, and a wire that has nearly no filament to filament bridges after reaction. Microstructural observations of degraded wires reveal cracks in the Bi-2212 filaments perpendicular to the wire axis, indicating that the quench-induced I c degradation is primarily driven by strain. These results further suggest that the quench degradation temperature limit depends on the strain state of Bi-2212 filaments and this dependence shall be carefully considered when engineering a high-field Bi-2212 magnet.« less

Ductile-Phase-Toughened Tungsten for Plasma-Facing Materials

NASA Astrophysics Data System (ADS)

Cunningham, Kevin Hawkins

A variety of processing approaches were employed to fabricate ductile-phase-toughened (DPT) tungsten (W) composites. Mechanical testing and analytical modeling were used to guide composite development. This work provides a basis for further development of W composites to be used in structural divertor components of future fusion reactors. W wire was tested in tension, showing significant ductility and strength. Coatings of copper (Cu) or tungsten carbide (WC) were applied to the W wire via electrodeposition and carburization, respectively. Composites were fabricated using spark plasma sintering (SPS) to consolidate W powders together with each type of coated W wire. DPT behavior, e.g. crack arrest and crack bridging, was not observed in three-point bend testing of the sintered composites. A laminate was fabricated by hot pressing W and Cu foils together with W wires, and subsequently tested in tension. This laminate was bonded via hot pressing to thick W plate as a reinforcing layer, and the composite was tested in three-point bending. Crack arrest was observed along with some fiber pullout, but significant transverse cracking in the W plate confounded further fracture toughness analysis. The fracture toughness of thin W plate was measured in three-point bending. W plates were brazed with Cu foils to form a laminate. Crack arrest and crack bridging were observed in three-point bend tests of the laminate, and fracture resistance curves were successfully calculated for this DPT composite. An analytical model of crack bridging was developed using the basis described by Chao in previous work by the group. The model uses the specimen geometry, matrix properties, and the stress-displacement function of a ductile reinforcement ("bridging law") to calculate the fracture resistance curve (R-curve) and load-displacement curve (P-D curve) for any test specimen geometry. The code was also implemented to estimate the bridging law of an arbitrary composite using R-curve data. Finally, a parametric study was performed to quantitatively determine the necessary mechanical properties of useful toughening reinforcements for a DPT W composite. The analytical model has a broad applicability for any DPT material.

Understanding the densification process of Bi2Sr2CaCu2O x round wires with overpressure processing and its effect on critical current density

NASA Astrophysics Data System (ADS)

Matras, M. R.; Jiang, J.; Larbalestier, D. C.; Hellstrom, E. E.

2016-10-01

Overpressure (OP) processing increases the critical current density ({{\\boldsymbol{J}}}{{C}}) of Bi2Sr2CaCu2O x (2212) round wires by shrinking the surrounding Ag matrix around the 2212 filaments, driving them close to full density and greatly increasing the 2212 grain connectivity. Indeed densification is vital for attaining the highest {{\\boldsymbol{J}}}{{C}}. Here, we investigate the time and temperature dependence of the wire densification. We find that the wire diameter decreases by 3.8 ± 0.3% after full heat treatment at 50 atm and 100 atm OP. At 50 atm OP pressure, the filaments start densifying above 700 °C and reach a 3.30 ± 0.07% smaller diameter after 2 h at 820 °C, which is below the melting point of 2212 powder. The densification is homogeneous and does not change the filament shape before melting. The growth of non-superconducting phases is observed at 820 °C, suggesting that time should be minimized at high temperature prior to melting the 2212 powder. Study of an open-ended 2.2 m long wire sample shows that full densification and the high OP {{\\boldsymbol{J}}}{{C}} ({{\\boldsymbol{J}}}{{C}} varies by about 3.1 times over the 2.2 m long wire) is reached about 1 m from the open ends, thus showing that coil-length wires can be protected from leaky seals by adding at least 1 m of sacrificial wire at each end.

Selection of Wire Electrical Discharge Machining Process Parameters on Stainless Steel AISI Grade-304 using Design of Experiments Approach

NASA Astrophysics Data System (ADS)

Lingadurai, K.; Nagasivamuni, B.; Muthu Kamatchi, M.; Palavesam, J.

2012-06-01

Wire electrical discharge machining (WEDM) is a specialized thermal machining process capable of accurately machining parts of hard materials with complex shapes. Parts having sharp edges that pose difficulties to be machined by the main stream machining processes can be easily machined by WEDM process. Design of Experiments approach (DOE) has been reported in this work for stainless steel AISI grade-304 which is used in cryogenic vessels, evaporators, hospital surgical equipment, marine equipment, fasteners, nuclear vessels, feed water tubing, valves, refrigeration equipment, etc., is machined by WEDM with brass wire electrode. The DOE method is used to formulate the experimental layout, to analyze the effect of each parameter on the machining characteristics, and to predict the optimal choice for each WEDM parameter such as voltage, pulse ON, pulse OFF and wire feed. It is found that these parameters have a significant influence on machining characteristic such as metal removal rate (MRR), kerf width and surface roughness (SR). The analysis of the DOE reveals that, in general the pulse ON time significantly affects the kerf width and the wire feed rate affects SR, while, the input voltage mainly affects the MRR.

Real-time monitoring of the laser hot-wire welding process

NASA Astrophysics Data System (ADS)

Liu, Wei; Liu, Shuang; Ma, Junjie; Kovacevic, Radovan

2014-04-01

The laser hot-wire welding process was investigated in this work. The dynamics of the molten pool during welding was visualized by using a high-speed charge-coupled device (CCD) camera assisted by a green laser as an illumination source. It was found that the molten pool is formed by the irradiation of the laser beam on the filler wire. The effect of the hot-wire voltage on the stability of the welding process was monitored by using a spectrometer that captured the emission spectrum of the laser-induced plasma plume. The spectroscopic study showed that when the hot-wire voltage is above 9 V a great deal of spatters occur, resulting in the instability of the plasma plume and the welding process. The effect of spatters on the plasma plume was shown by the identified spectral lines of the element Mn I. The correlation between the Fe I electron temperature and the weld-bead shape was studied. It was noted that the electron temperature of the plasma plume can be used to real-time monitor the variation of the weld-bead features and the formation of the weld defects.

Kinetic analysis of MgB2 layer formation in advanced internal magnesium infiltration (AIMI) processed MgB2 wires

PubMed Central

Li, G. Z.; Sumption, M. D.; Collings, E. W.

2015-01-01

Significantly enhanced critical current density (Jc) for MgB2 superconducting wires can be obtained following the advanced internal Mg infiltration (AIMI) route. But unless suitable precautions are taken, the AIMI-processed MgB2 wires will exhibit incomplete MgB2 layer formation, i.e. reduced superconductor core size and hence suppressed current-carrying capability. Microstructural characterization of AIMI MgB2 wires before and after the heat treatment reveals that the reaction mechanism changes from a “Mg infiltration-reaction” at the beginning of the heat treatment to a “Mg diffusion-reaction” once a dense MgB2 layer is formed. A drastic drop in the Mg transport rate from infiltration to diffusion causes the termination of the MgB2 core growth. To quantify this process, a two-stage kinetic model is built to describe the MgB2 layer formation and growth. The derived kinetic model and the associated experimental observations indicate that fully reacted AIMI-processed MgB2 wires can be achieved following the optimization of B particle size, B powder packing density, MgB2 reaction activation energy and its response to the additions of dopants. PMID:26973431

Thin wire pointing method

NASA Technical Reports Server (NTRS)

Green, G.; Mattauch, R. J. (Inventor)

1983-01-01

A method is described for forming sharp tips on thin wires, in particular phosphor bronze wires of diameters such as one-thousandth inch used to contact micron size Schottky barrier diodes, which enables close control of tip shape and which avoids the use of highly toxic solutions. The method includes dipping an end of a phosphor bronze wire into a dilute solution of sulfamic acid and applying a current through the wire to electrochemically etch it. The humidity in the room is controlled to a level of less than 50%, and the voltage applied between the wire and another electrode in the solutions is a half wave rectified voltage. The current through the wire is monitored, and the process is stopped when the current falls to a predetermined low level.

Failure analysis of the fractured wires in sternal perichronal loops.

PubMed

Chao, Jesús; Voces, Roberto; Peña, Carmen

2011-10-01

We report failure analysis of sternal wires in two cases in which a perichronal fixation technique was used to close the sternotomy. Various characteristics of the retrieved wires were compared to those of unused wires of the same grade and same manufacturer and with surgical wire specifications. In both cases, wire fracture was un-branched and transgranular and proceeded by a high cycle fatigue process, apparently in the absence of corrosion. However, stress anlysis indicates that the effective stress produced during strong coughing is lower than the yield strength. Our findings suggest that in order to reduce the risk for sternal dehiscence, the diameter of the wire used should be increased. Copyright © 2011 Elsevier Ltd. All rights reserved.

Novel perovskite coating of strontium zirconate in Inconel substrate

NASA Astrophysics Data System (ADS)

Venkatesh, G.; Blessto, B.; Rao, C. Santhosh Kumar; Subramanian, R.; Berchmans, L. John

2018-02-01

Thermal Barrier Coatings (TBC) provides a low thermal conductivity barrier to heat transfer from the hot gas in the engine to the surface of the coated alloy component. SrZrO3 powder are prepared by Sol Gel synthesis method. The synthesized powder sample is characterized by X Ray Diffraction Technique (XRD), Scanning Electron Microscope (SEM) and Transmission Electron Microscope (TEM) and the results are interpreted. The Polycrystalline nature of SrZrO3 is confirmed and lattice spacing are determined in XRD. SEM shows sub-micron sized particles and a fringed pattern is observed in TEM. The IN718 specimen is Wire Cut and Sand Blasted. A SrZrO3 double layer is coated over the Inconel specimen through a Bond Coat made of NiCoCrAlY by Plasma spraying Process and also characterized. SEM analysis of the Coating shows diffusion of Fe, Sr into the substrate.

Monolithic short wave infrared (SWIR) detector array

NASA Technical Reports Server (NTRS)

1983-01-01

A monolithic self-scanned linear detector array was developed for remote sensing in the 1.1- 2.4-micron spectral region. A high-density IRCCD test chip was fabricated to verify new design approaches required for the detector array. The driving factors in the Schottky barrier IRCCD (Pdsub2Si) process development are the attainment of detector yield, uniformity, adequate quantum efficiency, and lowest possible dark current consistent with radiometric accuracy. A dual-band module was designed that consists of two linear detector arrays. The sensor architecture places the floating diffusion output structure in the middle of the chip, away from the butt edges. A focal plane package was conceptualized and includes a polycrystalline silicon substrate carrying a two-layer, thick-film interconnecting conductor pattern and five epoxy-mounted modules. A polycrystalline silicon cover encloses the modules and bond wires, and serves as a radiation and EMI shield, thermal conductor, and contamination seal.

Ultra-compact 32 × 32 strictly-non-blocking Si-wire optical switch with fan-out LGA interposer.

PubMed

Tanizawa, Ken; Suzuki, Keijiro; Toyama, Munehiro; Ohtsuka, Minoru; Yokoyama, Nobuyuki; Matsumaro, Kazuyuki; Seki, Miyoshi; Koshino, Keiji; Sugaya, Toshio; Suda, Satoshi; Cong, Guangwei; Kimura, Toshio; Ikeda, Kazuhiro; Namiki, Shu; Kawashima, Hitoshi

2015-06-29

We demonstrate a 32 × 32 path-independent-insertion-loss optical path switch that integrates 1024 thermooptic Mach-Zehnder switches and 961 intersections on a small, 11 × 25 mm2 die. The switch is fabricated on a 300-mm-diameter silicon-on-insulator wafer by a complementary metal-oxide semiconductor-compatible process with advanced ArF immersion lithography. For reliable electrical packaging, the switch chip is flip-chip bonded to a ceramic interposer that arranges the electrodes in a 0.5-mm pitch land grid array. The on-chip loss is measured to be 15.8 ± 1.0 dB, and successful switching is demonstrated for digital-coherent 43-Gb/s QPSK signals. The total crosstalk of the switch is estimated to be less than -20 dB at the center wavelength of 1545 nm. The bandwidth narrowing caused by dimensional errors that arise during fabrication is discussed.

Torsional bridge setup for the characterization of integrated circuits and microsensors under mechanical shear stress.

PubMed

Herrmann, M; Gieschke, P; Ruther, P; Paul, O

2011-12-01

We present a torsional bridge setup for the electro-mechanical characterization of devices integrated in the surface of silicon beams under mechanical in-plane shear stress. It is based on the application of a torsional moment to the longitudinal axis of the silicon beams, which results in a homogeneous in-plane shear stress in the beam surface. The safely applicable shear stresses span the range of ±50 MPa. Thanks to a specially designed clamping mechanism, the unintended normal stress typically stays below 2.5% of the applied shear stress. An analytical model is presented to compute the induced shear stress. Numerical computations verify the analytical results and show that the homogeneity of the shear stress is very high on the beam surface in the region of interest. Measurements with piezoresistive microsensors fabricated using a complementary metal-oxide-semiconductor process show an excellent agreement with both the computational results and comparative measurements performed on a four-point bending bridge. The electrical connection to the silicon beam is performed with standard bond wires. This ensures that minimal forces are applied to the beam by the electrical interconnection to the external instrumentation and that devices with arbitrary bond pad layout can be inserted into the setup.

Parametric Optimization of Wire Electrical Discharge Machining of Powder Metallurgical Cold Worked Tool Steel using Taguchi Method

NASA Astrophysics Data System (ADS)

Sudhakara, Dara; Prasanthi, Guvvala

2017-04-01

Wire Cut EDM is an unconventional machining process used to build components of complex shape. The current work mainly deals with optimization of surface roughness while machining P/M CW TOOL STEEL by Wire cut EDM using Taguchi method. The process parameters of the Wire Cut EDM is ON, OFF, IP, SV, WT, and WP. L27 OA is used for to design of the experiments for conducting experimentation. In order to find out the effecting parameters on the surface roughness, ANOVA analysis is engaged. The optimum levels for getting minimum surface roughness is ON = 108 µs, OFF = 63 µs, IP = 11 A, SV = 68 V and WT = 8 g.

Method for controlling gas metal arc welding

DOEpatents

Smartt, Herschel B.; Einerson, Carolyn J.; Watkins, Arthur D.

1989-01-01

The heat input and mass input in a Gas Metal Arc welding process are controlled by a method that comprises calculating appropriate values for weld speed, filler wire feed rate and an expected value for the welding current by algorithmic function means, applying such values for weld speed and filler wire feed rate to the welding process, measuring the welding current, comparing the measured current to the calculated current, using said comparison to calculate corrections for the weld speed and filler wire feed rate, and applying corrections.

Critical current density in wire drawn and hydrostatically extruded Nb-Ti superconductors

NASA Technical Reports Server (NTRS)

Alterovitz, S. A.; Woollam, J. A.; Collings, E. W.

1979-01-01

Critical current studies have been made on copper-clad Nb-Ti composite wire prepared under area reductions of 100:1 and 10,000:1 by hydrostatic extrusion (HE), wire drawing and HE plus drawing. Comparative evaluation of the thermomechanical processing equivalent of HE was performed.

22 CFR 122.2 - Submission of registration statement.

Code of Federal Regulations, 2013 CFR

2013-04-01

... payment via Automated Clearing House or Federal Reserve Wire Network payable to the Department of State of... Federal Reserve Wire Network (FedWire) are electronic networks used to process financial transactions in...., Comptroller, Treasurer, General Counsel) or any member of the board of directors: (i) Has ever been indicted...

22 CFR 122.2 - Submission of registration statement.

Code of Federal Regulations, 2012 CFR

2012-04-01

... payment via Automated Clearing House or Federal Reserve Wire Network payable to the Department of State of... Federal Reserve Wire Network (FedWire) are electronic networks used to process financial transactions in...., Comptroller, Treasurer, General Counsel) or any member of the board of directors: (i) Has ever been indicted...

The effect of strain hardening on resistance to electrochemical corrosion of wires for orthopaedics

NASA Astrophysics Data System (ADS)

Przondziono, J.; Walke, W.; Hadasik, E.; Szymszal, J.

2012-05-01

The purpose of this research is to evaluate electrochemical corrosion resistance of wire with modified surface, made of stainless steel of Cr-Ni-Mo type, widely used in implants for orthopaedics, depending on hardening created in the process of drawing. Tests have been carried out in the environment imitating human osseous tissue. Pitting corrosion was determined on the ground of registered anodic polarisation curves by means of potentiodynamic method with application of electrochemical testing system VoltaLab® PGP 201. Wire corrosion tests were carried out in Tyrode solution on samples that were electrochemically polished as well as electrochemically polished and finally chemically passivated. Initial material for tests was wire rod made of X2CrNiMo17-12-2 steel with diameter of 5.5 mm in supersaturated condition. Wire rod was drawn up to diameter of 1.35 mm. This work shows the course of flow curve of wire made of this grade of steel and mathematical form of yield stress function. The study also presents exemplary curves showing the dependence of polarisation resistance in strain function in the drawing process of electrochemically passivated and electrochemically polished and then chemically passivated wire.

Update on High-Temperature Coils for Electromagnets

NASA Technical Reports Server (NTRS)

Kascak, Albert F.; Montague, Gerald T.; Palazzolo, Alan; Preuss, Jason; Carter, Bart; Tucker, Randall; Hunt, Andrew

2005-01-01

A report revisits the subject matter of "High-Temperature Coils for Electromagnets" (LEW-17164), NASA Tech Briefs, Vol. 26, No. 8, (August 2002) page 38. To recapitulate: Wires have been developed for use in electromagnets that operate at high temperatures. The starting material for a wire of this type can be either a nickel-clad, ceramic-insulated copper wire or a bare silver wire. The wire is covered by electrical-insulation material that is intended to withstand operating temperatures in the range from 800 to 1,300 F (.430 to .700 C): The starting wire is either primarily wrapped with S-glass as an insulating material or else covered with another insulating material wrapped in S-glass prior to the winding process. A ceramic binding agent is applied as a slurry during the winding process to provide further insulating capability. The turns are pre-bent during winding to prevent damage to the insulation. The coil is then heated to convert the binder into ceramic. The instant report mostly reiterates the prior information and presents some additional information on the application of the ceramic binding agent and the incorporation of high-temperature wire into the windings.

Laser-bulge based ultrasonic bonding method for fabricating multilayer thermoplastic microfluidic devices

NASA Astrophysics Data System (ADS)

Liang, Chao; Liu, Chong; Liu, Ziyang; Meng, Fanjian; Li, Jingmin

2017-11-01

Ultrasonic bonding is a commonly-used method for fabrication of thermoplastic microfluidic devices. However, due to the existence of the energy director (a convex structure to concentrate the ultrasonic energy), it is difficult to control its molten polymer flow, which may result in a small gap between the bonding interface or microchannel clogging. In this paper, we present an approach to address these issues. Firstly, the microchannels were patterned onto the PMMA sheets using hot embossing with the wire electrical discharge machined molds. Then, a small bulge, which was formed at the edge of the laser-ablated groove (LG), was generated around the microchannel using a CO2 laser ablation system. By using the bulge to concentrate the ultrasonic energy, there was no need for fabricating the complicated and customized energy director. When the bulge was melted, it was able to flow into the LG which overcame the ‘gap’ and ‘clogging’ problems. Here, two types of two-layer microfluidic devices and a five-layer micromixer were fabricated to validate its performance. Our results showed that these thermoplastic microdevices can be successfully bonded by using this method. The liquid leakage was not observed in both the capillary-driven flowing test and the pressure-driven mixing experiments. It is a potential method for bonding the thermoplastic microfluidic devices.

Micro-miniature gas chromatograph column disposed in silicon wafers

DOEpatents

Yu, Conrad M.

2000-01-01

A micro-miniature gas chromatograph column is fabricated by forming matching halves of a circular cross-section spiral microcapillary in two silicon wafers and then bonding the two wafers together using visual or physical alignment methods. Heating wires are deposited on the outside surfaces of each wafer in a spiral or serpentine pattern large enough in area to cover the whole microcapillary area inside the joined wafers. The visual alignment method includes etching through an alignment window in one wafer and a precision-matching alignment target in the other wafer. The two wafers are then bonded together using the window and target. The physical alignment methods include etching through vertical alignment holes in both wafers and then using pins or posts through corresponding vertical alignment holes to force precision alignment during bonding. The pins or posts may be withdrawn after curing of the bond. Once the wafers are bonded together, a solid phase of very pure silicone is injected in a solution of very pure chloroform into one end of the microcapillary. The chloroform lowers the viscosity of the silicone enough that a high pressure hypodermic needle with a thumbscrew plunger can force the solution into the whole length of the spiral microcapillary. The chloroform is then evaporated out slowly to leave the silicone behind in a deposit.

Elastomeric member and method of manufacture therefor

DOEpatents

Hoppie, L.O.

1985-12-10

An energy storage device is disclosed consisting of a stretched elongated elastomeric member disposed within a tubular housing, which elastomeric member is adapted to be torsionally stressed to store energy. The elastomeric member is configured in the relaxed state with a uniform diameter body section, and transition end sections, attached to rigid end piece assemblies of a lesser diameter. The profile and deflection characteristic of the transition sections are such that upon stretching of the elastomeric member, a substantially uniform diameter assembly results, to minimize the required volume of the surrounding housing. Each of the transition sections are received within and bonded to a woven wire mesh sleeve having helical windings at a particular helix angle to control the deflection of the transition section. Each sleeve also contracts with the contraction of the associated transition section to maintain the bond therebetween. During manufacture, the sleeves are forced against a forming surface and bonded to the associated transition section to provide the correct profile and helix angle. 12 figs.

Elastomeric member

DOEpatents

Hoppie, L.O.

1985-07-30

An energy storage device is disclosed consisting of a stretched elongated elastomeric member disposed within a tubular housing, which elastomeric member is adapted to be torsionally stressed to store energy. The elastomeric member is configured in the relaxed state with a uniform diameter body section, and transition end sections, attached to rigid end piece assemblies of a lesser diameter. The profile and deflection characteristic of the transition sections are such that upon stretching of the elastomeric member, a substantially uniform diameter assembly results, to minimize the required volume of the surrounding housing. Each of the transition sections are received within and bonded to a woven wire mesh sleeve having helical windings at a particular helix angle to control the deflection of the transition section. Each sleeve also contracts with the contraction of the associated transition section to maintain the bond there between. During manufacture, the sleeves are forced against a forming surface and bonded to the associated transition section to provide the correct profile and helix angle. 12 figs.

Fabrication of Buried Nanochannels From Nanowire Patterns

NASA Technical Reports Server (NTRS)

Choi, Daniel; Yang, Eui-Hyeok

2007-01-01

A method of fabricating channels having widths of tens of nanometers in silicon substrates and burying the channels under overlying layers of dielectric materials has been demonstrated. With further refinement, the method might be useful for fabricating nanochannels for manipulation and analysis of large biomolecules at single-molecule resolution. Unlike in prior methods, burying the channels does not involve bonding of flat wafers to the silicon substrates to cover exposed channels in the substrates. Instead, the formation and burying of the channels are accomplished in a more sophisticated process that is less vulnerable to defects in the substrates and less likely to result in clogging of, or leakage from, the channels. In this method, the first step is to establish the channel pattern by forming an array of sacrificial metal nanowires on an SiO2-on-Si substrate. In particular, the wire pattern is made by use of focused-ion-beam (FIB) lithography and a subsequent metallization/lift-off process. The pattern of metal nanowires is then transferred onto the SiO2 layer by reactive-ion etching, which yields sacrificial SiO2 nanowires covered by metal. After removal of the metal covering the SiO2 nanowires, what remains are SiO2 nanowires on an Si substrate. Plasma-enhanced chemical vapor deposition (PECVD) is used to form a layer of a dielectric material over the Si substrate and over the SiO2 wires on the surface of the substrate. FIB milling is then performed to form trenches at both ends of each SiO2 wire. The trenches serve as openings for the entry of chemicals that etch SiO2 much faster than they etch Si. Provided that the nanowires are not so long that the diffusion of the etching chemicals is blocked, the sacrificial SiO2 nanowires become etched out from between the dielectric material and the Si substrate, leaving buried channels. At the time of reporting the information for this article, channels 3 m long, 20 nm deep, and 80 nm wide (see figure) had been fabricated by this method.

Edge Modes and Teleportation in a Topologically Insulating Quantum Wire

DOE Office of Scientific and Technical Information (OSTI.GOV)

Ghrear, Majd; Mackovic, Brie; Semenoff, Gordon W.

We find a simple model of an insulating state of a quantum wire which has a single isolated edge mode. We argue that, when brought to proximity, the edge modes on independent wires naturally form Bell entangled states which could be used for elementary quantum processes such as teleportation. We give an example of an algorithm which teleports the spin state of an electron from one quantum wire to another.

The effects of insulating coatings and current prepulse on tungsten planar wire array Z-pinches

DOE Office of Scientific and Technical Information (OSTI.GOV)

Li, M., E-mail: limo@nint.ac.cn; Li, Y.; State Key Laboratory of Intense Pulsed Radiation Simulation and Effect, Northwest Institute of Nuclear Technology, Xi'an 710024

2015-12-15

This paper presents experimental results on the effects of insulating coatings and current prepulse on tungsten planar wire array Z-pinches on ∼100 ns main current facility. Optical framing images indicated that without a current prepulse the wire ablation process was asymmetrical and the implosion was zippered. The x-ray peak power was ∼320 GW. By using insulating coatings on the wire surface the asymmetry remained, and the processes of ablation and implosion were delayed by ∼30 ns. The x-ray burst was narrow and decreased to ∼200 GW. When current prepulses were used on both standard and insulated wire arrays, implosion symmetry was improved and themore » x-ray burst was improved (to ∼520 GW peak power). In addition, there was a strong emitting precursor column for insulated loads with the current prepulse.« less

Platform technologies for hybrid optoelectronic integration and packaging

NASA Astrophysics Data System (ADS)

Datta, Madhumita

In order to bring fiber-optics closer to individual home and business services, the optical network components have to be inexpensive and reliable. Integration and packaging of optoelectronic devices holds the key to high-volume low-cost component manufacturing. The goal of this dissertation is to propose, study, and demonstrate various ways to integrate optoelectronic devices on a packaging platform to implement cost-effective, functional optical modules. Two types of hybrid integration techniques have been proposed: flip-chip solder bump bonding for high-density two-dimensional array packaging of surface-emitting devices, and solder preform bonding for fiber-coupled edge-emitting semiconductor devices. For flip-chip solder bump bonding, we developed a simple, inexpensive remetallization process called "electroless plating", which converts the aluminum bond pads of foundry-made complementary metal oxide semiconductor (CMOS) chips into solder-bondable and wire-bondable gold surfaces. We have applied for a patent on this remetallization technique. For fiber-pigtailed edge-emitting laser modules, we have studied the coupling characteristics of different types of lensed single-mode fibers including semispherically lensed fiber, cylindrically lensed fiber and conically lensed fiber. We have experimentally demonstrated 66% coupling efficiency with semispherically lensed fiber and 50% efficiency with conically lensed fibers. We have proposed and designed a packaging platform on which lensed fibers can be actively aligned to a laser and solder-attached reliably to the platform so that the alignment is retained. We have designed thin-film nichrome heaters on fused quartz platforms as local heat source to facilitate on-board solder alignment and attachment of fiber. The thermal performance of the heaters was simulated using finite element analysis tool ANSYS prior to fabrication. Using the heater's reworkability advantage, we have estimated the shift of the fiber due to solder shrinkage and introduced a pre-correction in the alignment process to restore optimum coupling efficiency close to 50% with conically lensed fibers. We have applied for a patent on this unique active alignment method through the University of Maryland's Technology Commercialization Office. Although we have mostly concentrated on active alignment platforms, we have proposed the idea of combining the passive alignment advantages of silicon optical benches to the on-board heater-assisted active alignment technique. This passive-active alignment process has the potential of cost-effective array packaging of edge-emitting devices.

Development of a self-stressing NiTiNb shape memory alloy (SMA)/fiber reinforced polymer (FRP) patch

NASA Astrophysics Data System (ADS)

El-Tahan, M.; Dawood, M.; Song, G.

2015-06-01

The objective of this research is to develop a self-stressing patch using a combination of shape memory alloys (SMAs) and fiber reinforced polymer (FRP) composites. Prestressed carbon FRP patches are emerging as a promising alternative to traditional methods to repair cracked steel structures and civil infrastructure. However, prestressing these patches typically requires heavy and complex fixtures, which is impractical in many applications. This paper presents a new approach in which the prestressing force is applied by restraining the shape memory effect of NiTiNb SMA wires. The wires are subsequently embedded in an FRP overlay patch. This method overcomes the practical challenges associated with conventional prestressing. This paper presents the conceptual development of the self-stressing patch with the support of experimental observations. The bond between the SMA wires and the FRP is evaluated using pull-out tests. The paper concludes with an experimental study that evaluates the patch response during activation subsequent monotonic tensile loading. The results demonstrate that the self-stressing patch with NiTiNb SMA is capable of generating a significant prestressing force with minimal tool and labor requirements.

Experimental and numerical investigations of wire bending by linear winding of rectangular tooth coils

NASA Astrophysics Data System (ADS)

Komodromos, A.; Tekkaya, A. E.; Hofmann, J.; Fleischer, J.

2018-05-01

Since electric motors are gaining in importance in many fields of application, e.g. hybrid electric vehicles, optimization of the linear coil winding process greatly contributes to an increase in productivity and flexibility. For the investigation of the forming behavior of the winding wire the material behavior is characterized in different experimental setups. Numerical examinatons of the linear winding process are carried out in a case study for a rectangular bobbin in order to analyze the influence of forming parameters on the resulting properties of the wound coil. Besides the numerical investigation of the linear winding method by using the finite element method (FEM), a multi-body dynamics (MBD) simulation is carried out. The multi-body dynamics simulation is necessary to represent the movement of the bodies as well as the connection of the components during winding. The finite element method is used to represent the material behavior of the copper wire and the plastic strain distribution within the wire. It becomes clear that the MBD simulation is not sufficient for analyzing the process and the wire behavior in its entirety. Important parameters that define the final coil properties cannot be analyzed in the manner of a precise manifestation, e.g. the clearance between coil bobbin and wire as well as the wire deformation behavior in form of a diameter reduction which negatively affects the ohmic resistance. Finally, the numerical investigations are validated experimentally by linear winding tests.

Increasing component functionality via multi-process additive manufacturing

NASA Astrophysics Data System (ADS)

Coronel, Jose L.; Fehr, Katherine H.; Kelly, Dominic D.; Espalin, David; Wicker, Ryan B.

2017-05-01

Additively manufactured components, although extensively customizable, are often limited in functionality. Multi-process additive manufacturing (AM) grants the ability to increase the functionality of components via subtractive manufacturing, wire embedding, foil embedding and pick and place. These processes are scalable to include several platforms ranging from desktop to large area printers. The Multi3D System is highlighted, possessing the capability to perform the above mentioned processes, all while transferring a fabricated component with a robotic arm. Work was conducted to fabricate a patent inspired, printed missile seeker. The seeker demonstrated the advantage of multi-process AM via introduction of the pick and place process. Wire embedding was also explored, with the successful interconnect of two layers of embedded wires in different planes. A final demonstration of a printed contour bracket, served to show the reduction of surface roughness on a printed part is 87.5% when subtractive manufacturing is implemented in tandem with AM. Functionality of the components on all the cases was improved. Results included optical components embedded within the printed housing, wires embedded with interconnection, and reduced surface roughness. These results highlight the improved functionality of components through multi-process AM, specifically through work conducted with the Multi3D System.

Novel Chemical Process for Producing Chrome Coated Metal

PubMed Central

Pelar, Christopher; Greenaway, Karima; Zea, Hugo; Wu, Chun-Hsien

2018-01-01

This work demonstrates that a version of the Reduction Expansion Synthesis (RES) process, Cr-RES, can create a micron scale Cr coating on an iron wire. The process involves three steps. I. A paste consisting of a physical mix of urea, chrome nitrate or chrome oxide, and water is prepared. II. An iron wire is coated by dipping. III. The coated, and dried, wire is heated to ~800 °C for 10 min in a tube furnace under a slow flow of nitrogen gas. The processed wires were then polished and characterized, primarily with scanning electron microscopy (SEM). SEM indicates the chrome layer is uneven, but only on the scale of a fraction of a micron. The evidence of porosity is ambiguous. Elemental mapping using SEM electron microprobe that confirmed the process led to the formation of a chrome metal layer, with no evidence of alloy formation. Additionally, it was found that thickness of the final Cr layer correlated with the thickness of the precursor layer that was applied prior to the heating step. Potentially, this technique could replace electrolytic processing, a process that generates carcinogenic hexavalent chrome, but further study and development is needed. PMID:29303977

Novel Chemical Process for Producing Chrome Coated Metal.

PubMed

Pelar, Christopher; Greenaway, Karima; Zea, Hugo; Wu, Chun-Hsien; Luhrs, Claudia C; Phillips, Jonathan

2018-01-05

This work demonstrates that a version of the Reduction Expansion Synthesis (RES) process, Cr-RES, can create a micron scale Cr coating on an iron wire. The process involves three steps. I. A paste consisting of a physical mix of urea, chrome nitrate or chrome oxide, and water is prepared. II. An iron wire is coated by dipping. III. The coated, and dried, wire is heated to ~800 °C for 10 min in a tube furnace under a slow flow of nitrogen gas. The processed wires were then polished and characterized, primarily with scanning electron microscopy (SEM). SEM indicates the chrome layer is uneven, but only on the scale of a fraction of a micron. The evidence of porosity is ambiguous. Elemental mapping using SEM electron microprobe that confirmed the process led to the formation of a chrome metal layer, with no evidence of alloy formation. Additionally, it was found that thickness of the final Cr layer correlated with the thickness of the precursor layer that was applied prior to the heating step. Potentially, this technique could replace electrolytic processing, a process that generates carcinogenic hexavalent chrome, but further study and development is needed.

Role of Water in Proton-Hydroxide Conductance Across Model and Biological Membranes.

DTIC Science & Technology

1987-11-10

Arlington, VA 22217-5000 61153N RR04108 441K712 11. TITLE (Include Security Classification) Role of water in proton-hydroxide conductance across model and...used the gramicidin channel to test properties of transmembrane strands of hydrogen bonded water which would model such defects. Results are described...Gramicidin as a model "proton wire." 2. Effects of homologous series of alcohols on proton flux in liposomes, and the relationship to their anesthetic

Surface Modification and Nanojunction Fabrication with Molecular Metal Wires

DTIC Science & Technology

2012-12-21

single - crystal X-ray diffraction studies of 2 and 3. Both the single - crystal structural data of 2 and 3 and the spectroscopic/voltammetric data...structure, magnetic properties, and single -molecule conductance of two new trinuclear metal string complexes, [Ni3(dzp)4(NCS)2] (2) and [ Co3 (dzp)4(NCS...modifying the crystallization conditions. The [s- Co3 (dpa)4(Cl)2] contains a symmetrical tricobalt framework with identical Co–Co bond lengths (2.34 Å

FET Noise Studies.

DTIC Science & Technology

1981-03-01

34: ’- o .- _ . ’. . ,,t. 9 t SO 1404 0 -2.5 N 3 3 TEMERAT UR E ATN ETF BA SENSOR NIISELANALORE SITWAL SFig re 2 . Bl ck d agram set- p fo noi...be rebonded. This presented problems in repeating data. To minimize the contact problem, we replaced our wire bonds with gold ribbons to relieve...Note that the noise exhibits an almost perfect 1/f behavior. (Actually these curves were taken before the gold ribbons were introduced, but the

A 100 electrode intracortical array: structural variability.

PubMed

Campbell, P K; Jones, K E; Normann, R A

1990-01-01

A technique has been developed for fabricating three dimensional "hair brush" electrode arrays from monocrystalline silicon blocks. Arrays consist of a square pattern of 100 penetrating electrodes, with 400 microns interelectrode spacing. Each electrode is 1.5mm in length and tapers from about 100 microns at its base to a sharp point at the tip. The tips of each electrode are coated with platinum and the entire structure, with the exception of the tips, is insulated with polyimide. Electrical connection to selected electrodes is made by wire bonding polyimide insulated 25 microns diameter gold lead wires to bonding pads on the rear surface of the array. As the geometrical characteristics of the electrodes in such an aray will influence their electrical properties (such as impedance, capacitance, spreading resistance in an electrolyte, etc.) it is desirable that such an array have minimal variability in geometry from electrode to electrode. A study was performed to determine the geometrical variability resulting from our micromachining techniques. Measurements of the diameter of each of the 100 electrodes were made at various planes above the silicon substrate of the array. For the array that was measured, the standard deviation of the diameters was approximately 9% of the mean diameter near the tip, 8% near the middle, and 6% near the base. We describe fabrication techniques which should further reduce these variabilities.

Measurement of Sound Speed in Thread

NASA Astrophysics Data System (ADS)

Saito, Shigemi; Shibata, Yasuhiro; Ichiki, Akira; Miyazaki, Akiho

2006-05-01

By employing thin wires, human hairs and threads, the measurement of sound speed in a thread whose diameter is smaller than 0.2 mm has been attempted. Preparing two cylindrical ceramic transducers with a 300 kHz resonance frequency, a perforated glass bead to be knotted by a sample thread is bonded to the center of the end surface of each transducer. After connecting these transducers with a sample thread, a receiving transducer is attached at a ceiling so as to hang another transmitting transducer with the thread. A glass bead is bonded to another end surface of the transmitting transducer so that tension, varied with a hanged plumb, can be applied to the sample thread. The time delay of the received signal relative to the transmitting pulse is measured while gradually shortening the thread. Sound speed is determined by the proportionality of time delay with thread length. Although the measured values for metallic wires are somewhat different from the values derived from the density and Young’s modulus cited in references, they are reproducible. The sound speed for human hairs of over twenty samples, which varies between 2000 and 2500 m/s, seems to depend on hair quality. Sound speed in a cotton thread is found to approach a constant value under large tension. An advanced measurement system available for uncut threads is also presented, where semi cylindrical transducers pinch the thread.

Disulphide linkage: To get cleaved or not? Bulk and nano copper based SERS of cystine

NASA Astrophysics Data System (ADS)

P. J., Arathi; Seemesh, Bhaskar; Rajendra Kumar Reddy, G.; Suresh Kumar, P.; Ramanathan, V.

2018-05-01

Different nano-structures of noble metals have been the conventional substrates for carrying out Surface Enhanced Raman Spectroscopy (SERS). In this paper we examine electrodeposited copper (Cu) nano-structures on pencil graphite as novel substrate to carry out SERS measurements by considering L-cystine (Cys-Cys) (dimer of the amino acid cysteine) as the probe. The formation of monolayer of the probe molecule on the substrates was confirmed using cyclic voltammetric measurements. Mode of adsorption of Cys-Cys was observed to be different on bulk Cu (taken in the wire form) and nano-structured Cu on pencil graphite. Whereas in the former the disulphide bond of Cys-Cys remained intact, it got cleaved when Cys-Cys was adsorbed on electrodeposited copper indicating the activated nature of the nano-structure compared to bulk copper. Csbnd S stretching mode of vibration underwent blue shift in Cys-Cys adsorbed on Cu on pencil graphite vis-à-vis Cys-Cys adsorbed on Cu wire. Further evidence on the cleavage of the Csbnd S bond on an activated substrate was obtained by considering a bimetallic substrate comprising of silver on copper which was electrodeposited on pencil graphite. Our studies have demonstrated that nano-copper surface is an excellent substrate for SERS giving 200 μM as lower detection limit for Cys-Cys.

Bending effects and temperature dependence of magnetic properties in a Fe-rich amorphous wire

NASA Astrophysics Data System (ADS)

Bordin, G.; Buttino, G.; Poppi, M.

2001-08-01

Amorphous wires with composition Fe 77.5Si 7.5B 15 exhibit a very peculiar magnetization process characterized by a single and quite large Barkhausen jump. This gives rise to a squared hysteresis loop at a critical magnetic field. The bistable behaviour, widely studied in wires with typical length of 10 cm and diameter of 125 μm, appears above a length of about 7 cm in straight wires and disappears for curvature radius within the range 2-12 cm in bent wires. In this work it is shown that bistability occurs in bent wires, whatever their curvature is, provided the wires are long enough. To this purpose spiral-shaped samples with several turns are considered. However, when the wire length is not a integer number of turns the magnetization reverses through many large Barkhausen jumps. In this condition, varying the measuring temperature can activate the energy barriers for the jumps.

Autonomous diagnostics and prognostics of signal and data distribution systems

NASA Astrophysics Data System (ADS)

Blemel, Kenneth G.

2001-07-01

Wiring is the nervous system of any complex system and is attached to or services nearly every subsystem. Damage to optical wiring systems can cause serious interruptions in communication, command and control systems. Electrical wiring faults and failures due to opens, shorts, and arcing probably result in adverse effects to the systems serviced by the wiring. Abnormalities in a system usually can be detected by monitoring some wiring parameter such as vibration, data activity or power consumption. This paper introduces the mapping of wiring to critical functions during system engineering to automatically define the Failure Modes Effects and Criticality Analysis. This mapping can be used to define the sensory processes needed to perform diagnostics during system engineering. This paper also explains the use of Operational Modes and Criticality Effects Analysis in the development of Sentient Wiring Systems as a means for diagnostic, prognostics and health management of wiring in aerospace and transportation systems.

Wire Crimp Connectors Verification using Ultrasonic Inspection

NASA Technical Reports Server (NTRS)

Cramer, K. Elliott; Perey, Daniel F.; Yost, William T.

2007-01-01

The development of a new ultrasonic measurement technique to quantitatively assess wire crimp connections is discussed. The amplitude change of a compressional ultrasonic wave propagating through the junction of a crimp connector and wire is shown to correlate with the results of a destructive pull test, which previously has been used to assess crimp wire junction quality. Various crimp junction pathologies (missing wire strands, incorrect wire gauge, incomplete wire insertion in connector) are ultrasonically tested, and their results are correlated with pull tests. Results show that the ultrasonic measurement technique consistently (as evidenced with pull-testing data) predicts good crimps when ultrasonic transmission is above a certain threshold amplitude level. A physics-based model, solved by finite element analysis, describes the compressional ultrasonic wave propagation through the junction during the crimping process. This model is in agreement within 6% of the ultrasonic measurements. A prototype instrument for applying the technique while wire crimps are installed is also presented.

Pain and discomfort experienced after placement of a conventional or a superelastic NiTi aligning archwire. A randomized clinical trial.

PubMed

Fernandes, L M; Ogaard, B; Skoglund, L

1998-01-01

Two nickel-titanium arch-wire types commonly used for initial tooth alignment were compared with regard to the pain/discomfort patients experience during the initial phase of tooth movement. The two arch wires used were a superelastic nickel-titanium alloy, 0.014 inch Sentalloy, Light (GAC International Inc. Central Islip, NY, USA) and a 0.014 inch Nitinol (Unitek, Monrovia, CA, USA), a conventional nickel-titanium aligning archwire. One hundred and twenty-eight consecutive patients attending an orthodontic university clinic and 2 private practices for routine placement of a fixed appliance were randomly assigned one of these 2 initial arch wires. Assessments of pain/discomfort were made daily by means of a 100 mm visual analog scale (VAS) over the first 7-day period after bonding. On the first day, recordings were made every hour for the first 11 hours. The results showed that the level of discomfort increased continuously every hour after the insertion of either a Sentalloy or a Nitinol as first arch wires, with a peak in the first night, remaining high on the second day and decreasing thereafter to baseline level after 7 days. During the first 10 hours it was apparent that the pain/discomfort experienced after placement of a Sentalloy was less than that found with the Nitinol archwire, although a significant difference could be found at 4 hours only. No significant gender-specific differences were found in either archwire group. A significant difference between the upper and lower dental arches was observed during the first 11 hours after placement of either a Sentalloy or a Nitinol arch wire, with the lower arch having the higher pain experience.

Effect of orthodontic brackets and different wires on radiofrequency heating and magnetic field interactions during 3-T MRI

PubMed Central

Görgülü, S; Ayyıldız, S; Gökçe, S; Ozen, T

2014-01-01

Objectives: To evaluate the heating and magnetic field interactions of fixed orthodontic appliances with different wires and ligaments in a 3-T MRI environment and to estimate the safety of these orthodontic materials. Methods: 40 non-carious extracted human maxillary teeth were embedded in polyvinyl chloride boxes, and orthodontic brackets were bonded. Nickel–titanium and stainless steel arch wires, and elastic and stainless steel ligaments were used to obtain four experimental groups in total. Specimens were evaluated at 3 T for radiofrequency heating and magnetic field interactions. Radiofrequency heating was evaluated by placing specimens in a cylindrical plastic container filled with isotonic solution and measuring changes in temperature after T1 weighted axial sequencing and after completion of all sequences. Translational attraction and torque values of specimens were also evaluated. One-way ANOVA test was used to compare continuous variables of temperature change. Significance was set at p < 0.05. Results: None of the groups exhibited excessive heating (highest temperature change: <3.04 °C), with the maximum increase in temperature observed at the end of the T1 weighted axial sequence. Magnetic field interactions changed depending on the material used. Although the brackets presented minor interactions that would not cause movement in situ, nickel–titanium and stainless steel wires presented great interactions that may pose a risk for the patient. Conclusions: The temperature changes of the specimens were considered to be within acceptable ranges. With regard to magnetic field interactions, brackets can be considered “MR safe”; however, it would be safe to replace the wires before MRI. PMID:24257741

Method of fabricating a PbS-PbSe IR detector array

NASA Technical Reports Server (NTRS)

Barrett, John R. (Inventor)

1987-01-01

A silicon wafer is provided which does not employ individually bonded leads between the IR sensitive elements and the input stages of multiplexers. The wafer is first coated with lead selenide in a first detector array area and is thereafter coated with lead sulfide within a second detector array area. The described steps result in the direct chemical deposition of lead selenide and lead sulfide upon the silicon wafer to eliminate individual wire bonding, bumping, flip chiping, planar interconnecting methods of connecting detector array elements to silicon chip circuitry, e.g., multiplexers, to enable easy fabrication of very long arrays. The electrode structure employed, produces an increase in the electrical field gradient between the electrodes for a given volume of detector material, relative to conventional electrode configurations.

A study of the stress wave factor technique for evaluation of composite materials

NASA Technical Reports Server (NTRS)

Duke, J. C., Jr.; Henneke, E. G., II; Kiernan, M. T.; Grosskopf, P. P.

1989-01-01

The acousto-ultrasonic approach for nondestructive evaluation provides a measurement procedure for quantifying the integrated effect of globally distributed damage characteristic of fiber reinforced composite materials. The evaluation procedure provides a stress wave factor that correlates closely with several material performance parameters. The procedure was investigated for a variety of materials including advanced composites, hybrid structure bonds, adhesive bonds, wood products, and wire rope. The research program focused primarily on development of fundamental understanding and applications advancements of acousto-ultrasonics for materials characterization. This involves characterization of materials for which detection, location, and identification of imperfections cannot at present be analyzed satisfactorily with mechanical performance prediction models. In addition to presenting definitive studies on application potentials, the understanding of the acousto-ultrasonic method as applied to advanced composites is reviewed.

Polymer Chemistry

NASA Technical Reports Server (NTRS)

Williams, Martha; Roberson, Luke; Caraccio, Anne

2010-01-01

This viewgraph presentation describes new technologies in polymer and material chemistry that benefits NASA programs and missions. The topics include: 1) What are Polymers?; 2) History of Polymer Chemistry; 3) Composites/Materials Development at KSC; 4) Why Wiring; 5) Next Generation Wiring Materials; 6) Wire System Materials and Integration; 7) Self-Healing Wire Repair; 8) Smart Wiring Summary; 9) Fire and Polymers; 10) Aerogel Technology; 11) Aerogel Composites; 12) Aerogels for Oil Remediation; 13) KSC's Solution; 14) Chemochromic Hydrogen Sensors; 15) STS-130 and 131 Operations; 16) HyperPigment; 17) Antimicrobial Materials; 18) Conductive Inks Formulations for Multiple Applications; and 19) Testing and Processing Equipment.

Vertically aligned nanowires from boron-doped diamond.

PubMed

Yang, Nianjun; Uetsuka, Hiroshi; Osawa, Eiji; Nebel, Christoph E

2008-11-01

Vertically aligned diamond nanowires with controlled geometrical properties like length and distance between wires were fabricated by use of nanodiamond particles as a hard mask and by use of reactive ion etching. The surface structure, electronic properties, and electrochemical functionalization of diamond nanowires were characterized by atomic force microscopy (AFM) and scanning tunneling microscopy (STM) as well as electrochemical techniques. AFM and STM experiments show that diamond nanowire etched for 10 s have wire-typed structures with 3-10 nm in length and with typically 11 nm spacing in between. The electrode active area of diamond nanowires is enhanced by a factor of 2. The functionalization of nanowire tips with nitrophenyl molecules is characterized by STM on clean and on nitrophenyl molecule-modified diamond nanowires. Tip-modified diamond nanowires are promising with respect to biosensor applications where controlled biomolecule bonding is required to improve chemical stability and sensing significantly.

Development and characterization of PdCr temperature-compensated wire resistance strain gage

NASA Technical Reports Server (NTRS)

Lei, Jih-Fen

1989-01-01

A temperature-compensated resistance static strain gage with potential to be used to 600 C was recently developed. Gages were fabricated from specially developed palladium-13 w/o chromium (Pd-13Cr) wire and platinum (Pt) compensator. When bonded to high temperature Hastelloy X, the apparent strain from room temperature to 600 C was within 400 microstrain for gages with no preheat treatment and within 3500 microstrain for gages with 16 hours prestabilization at 640 C. The apparent strain versus temperature relationship of stabilized PdCr gages were repeatable with the reproducibility within 100 microstrain during three thermal cycles to 600 C and an 11 hours soak at 600 C. The gage fabrication, construction and installation is described. Also, the coating system used for this compensated resistance strain gage is explained. The electrical properties of the strain sensing element and main characteristics of the compensated gage including apparent strain, drift and reproducibility are discussed.

The topology of fullerenes

PubMed Central

Schwerdtfeger, Peter; Wirz, Lukas N; Avery, James

2015-01-01

Fullerenes are carbon molecules that form polyhedral cages. Their bond structures are exactly the planar cubic graphs that have only pentagon and hexagon faces. Strikingly, a number of chemical properties of a fullerene can be derived from its graph structure. A rich mathematics of cubic planar graphs and fullerene graphs has grown since they were studied by Goldberg, Coxeter, and others in the early 20th century, and many mathematical properties of fullerenes have found simple and beautiful solutions. Yet many interesting chemical and mathematical problems in the field remain open. In this paper, we present a general overview of recent topological and graph theoretical developments in fullerene research over the past two decades, describing both solved and open problems. WIREs Comput Mol Sci 2015, 5:96–145. doi: 10.1002/wcms.1207 Conflict of interest: The authors have declared no conflicts of interest for this article. For further resources related to this article, please visit the WIREs website. PMID:25678935

Annealing effects on capacitance-voltage characteristics of a-Si/SiN(x) multilayer prepared using hot-wire chemical vapour deposition.

PubMed

Panchal, A K; Rai, D K; Solanki, C S

2011-04-01

Post-deposition annealing of a-Si/SiN(x) multilayer films at different temperature shows varying shift in high frequency (1 MHz) capacitance-voltage (HFCV) characteristics. Various a-Si/SiN(x) multilayer films were deposited using hot wire chemical vapor deposition (HWCVD) and annealed in the temperature range of 800 to 900 degrees C to precipitate Si quantum dots (Si-QD) in a-Si layers. HFCV measurements of the as-deposited and annealed films in metal-insulator-semiconductor (MIS) structures show hysterisis in C-V curves. The hysteresis in the as-deposited films and annealed films is attributed to charge trapping in Si-dangling bonds in a-Si layer and in Si-QD respectively. The charge trapping density in Si-QD increases with temperature while the interface defects density (D(it)) remains constant.

Bisecting Microfluidic Channels with Metallic Nanowires Fabricated by Nanoskiving.

PubMed

Kalkman, Gerard A; Zhang, Yanxi; Monachino, Enrico; Mathwig, Klaus; Kamminga, Machteld E; Pourhossein, Parisa; Oomen, Pieter E; Stratmann, Sarah A; Zhao, Zhiyuan; van Oijen, Antoine M; Verpoorte, Elisabeth; Chiechi, Ryan C

2016-02-23

This paper describes the fabrication of millimeter-long gold nanowires that bisect the center of microfluidic channels. We fabricated the nanowires by nanoskiving and then suspended them over a trench in a glass structure. The channel was sealed by bonding it to a complementary poly(dimethylsiloxane) structure. The resulting structures place the nanowires in the region of highest flow, as opposed to the walls, where it approaches zero, and expose their entire surface area to fluid. We demonstrate active functionality, by constructing a hot-wire anemometer to measure flow through determining the change in resistance of the nanowire as a function of heat dissipation at low voltage (<5 V). Further, passive functionality is demonstrated by visualizing individual, fluorescently labeled DNA molecules attached to the wires. We measure rates of flow and show that, compared to surface-bound DNA strands, elongation saturates at lower rates of flow and background fluorescence from nonspecific binding is reduced.

Extrusion of metal oxide superconducting wire, tube or ribbon

DOEpatents

Dusek, Joseph T.

1993-10-05

A process for extruding a superconducting metal oxide composition YBa.sub.2 Cu.sub.3 O.sub.7-x provides a wire (tube or ribbon) having a cohesive mass and a degree of flexibility together with enhanced electrical properties. Wire diameters in the range of 6-85 mils have been produced with smaller wires on the order of 10 mils in diameter exhibiting enhanced flexibility for forming braided, or multistrand, configurations for greater current carrying capacity. The composition for extrusion contains a polymeric binder to provide a cohesive mass to bind the particles together during the extrusion process with the binder subsequently removed at lower temperatures during sintering. The composition for extrusion further includes a deflocculent, an organic plasticizer and a solvent which also are subsequently removed during sintering. Electrically conductive tubing with an inner diameter of 52 mil and an outer diameter of 87-355 mil has also been produced. Flat ribbons have been produced in the range of 10-125 mil thick by 100-500 mil wide. The superconducting wire, tube or ribbon may include an outer ceramic insulating sheath co-extruded with the wire, tubing or ribbon.

Extrusion of metal oxide superconducting wire, tube or ribbon

DOEpatents

Dusek, Joseph T.

1993-01-01

A process for extruding a superconducting metal oxide composition YBa.sub.2 Cu.sub.3 O.sub.7-x provides a wire (tube or ribbon) having a cohesive mass and a degree of flexibility together with enhanced electrical properties. Wire diameters in the range of 6-85 mils have been produced with smaller wires on the order of 10 mils in diameter exhibiting enhanced flexibility for forming braided, or multistrand, configurations for greater current carrying capacity. The composition for extrusion contains a polymeric binder to provide a cohesive mass to bind the particles together during the extrusion process with the binder subsequently removed at lower temperatures during sintering. The composition for extrusion further includes a deflocculent, an organic plasticizer and a solvent which also are subsequently removed during sintering. Electrically conductive tubing with an inner diameter of 52 mil and an outer diameter of 87-355 mil has also been produced. Flat ribbons have been produced in the range of 10-125 mil thick by 100-500 mil wide. The superconducting wire, tube or ribbon may include an outer ceramic insulating sheath co-extruded with the wire, tubing or ribbon.

A review of wiring system safety in space power systems

NASA Technical Reports Server (NTRS)

Stavnes, Mark W.; Hammoud, Ahmad N.

1993-01-01

Wiring system failures have resulted from arc propagation in the wiring harnesses of current aerospace vehicles. These failures occur when the insulation becomes conductive upon the initiation of an arc. In some cases, the conductive path of the carbon arc track displays a high enough resistance such that the current is limited, and therefore may be difficult to detect using conventional circuit protection. Often, such wiring failures are not simply the result of insulation failure, but are due to a combination of wiring system factors. Inadequate circuit protection, unforgiving system designs, and careless maintenance procedures can contribute to a wiring system failure. This paper approaches the problem with respect to the overall wiring system, in order to determine what steps can be taken to improve the reliability, maintainability, and safety of space power systems. Power system technologies, system designs, and maintenance procedures which have led to past wiring system failures will be discussed. New technologies, design processes, and management techniques which may lead to improved wiring system safety will be introduced.

Novel Bonding Technology for Hermetically Sealed Silicon Micropackage

NASA Astrophysics Data System (ADS)

Lee, Duck-Jung; Ju, Byeong-Kwon; Choi, Woo-Beom; Jeong, Jee-Won; Lee, Yun-Hi; Jang, Jin; Lee, Kwang-Bae; Oh, Myung-Hwan

1999-01-01

We performed glass-to-silicon bonding and fabricated a hermetically sealed silicon wafer using silicon direct bonding followed by anodic bonding (SDAB). The hydrophilized glass and silicon wafers in solution were dried and initially bonded in atmosphere as in the silicon direct bonding (SDB) process, but annealing at high temperature was not performed. Anodic bonding was subsequently carried out for the initially bonded specimens. Then the wafer pairs bonded by the SDAB method were different from those bonded by the anodic bonding process only. The effects of the bonding process on the bonded area and tensile strength were investigated as functions of bonding temperature and voltage. Using scanning electron microscopy (SEM), the cross-sectional view of the bonded interface region was observed. In order to investigate the migration of the sodium ions in the bonding process, the concentration of the bonded glass was compared with that of standard glass. The specimen bonded using the SDAB process had higher efficiency than that using the anodic bonding process only.

Modified low-temperture direct bonding method for vacuum microelectronics application

NASA Astrophysics Data System (ADS)

Ju, Byeong-Kwon; Lee, Duck-Jung; Choi, Woo-Beom; Lee, Yun-Hi; Jang, Jin; Lee, Kwang-Bae; Oh, Myung-Hwan

1997-06-01

This paper presents the process and experimental results for the improved silicon-to-glass bonding using silicon direct bonding (SDB) followed by anodic bonding. The initial bonding between glass and silicon was caused by the hydrophilic surfaces of silicon-glass ensemble using SDB method. Then the initially bonded specimen had to be strongly bonded by anodic bonding process. The effects of the bonding process parameters on the interface energy were investigated as functions of the bonding temperature and voltage. We found that the specimen which was bonded using SDB process followed by anodic bonding process had higher interface energy than one using anodic bonding process only. The main factor contributing to the higher interface energy in the glass-to-silicon assemble bonded by SDB followed by anodic bonding was investigated by secondary ion mass spectroscopy analysis.

Geometry characteristics modeling and process optimization in coaxial laser inside wire cladding

NASA Astrophysics Data System (ADS)

Shi, Jianjun; Zhu, Ping; Fu, Geyan; Shi, Shihong

2018-05-01

Coaxial laser inside wire cladding method is very promising as it has a very high efficiency and a consistent interaction between the laser and wire. In this paper, the energy and mass conservation law, and the regression algorithm are used together for establishing the mathematical models to study the relationship between the layer geometry characteristics (width, height and cross section area) and process parameters (laser power, scanning velocity and wire feeding speed). At the selected parameter ranges, the predicted values from the models are compared with the experimental measured results, and there is minor error existing, but they reflect the same regularity. From the models, it is seen the width of the cladding layer is proportional to both the laser power and wire feeding speed, while it firstly increases and then decreases with the increasing of the scanning velocity. The height of the cladding layer is proportional to the scanning velocity and feeding speed and inversely proportional to the laser power. The cross section area increases with the increasing of feeding speed and decreasing of scanning velocity. By using the mathematical models, the geometry characteristics of the cladding layer can be predicted by the known process parameters. Conversely, the process parameters can be calculated by the targeted geometry characteristics. The models are also suitable for multi-layer forming process. By using the optimized process parameters calculated from the models, a 45 mm-high thin-wall part is formed with smooth side surfaces.

Method for controlling gas metal arc welding

DOEpatents

Smartt, H.B.; Einerson, C.J.; Watkins, A.D.

1987-08-10

The heat input and mass input in a Gas Metal Arc welding process are controlled by a method that comprises calculating appropriate values for weld speed, filler wire feed rate and an expected value for the welding current by algorithmic function means, applying such values for weld speed and filler wire feed rate to the welding process, measuring the welding current, comparing the measured current to the calculated current, using said comparison to calculate corrections for the weld speed and filler wire feed rate, and applying corrections. 3 figs., 1 tab.

A miniature Joule-Thomson cooler for optical detectors in space.

PubMed

Derking, J H; Holland, H J; Tirolien, T; ter Brake, H J M

2012-04-01

The utilization of single-stage micromachined Joule-Thomson (JT) coolers for cooling small optical detectors is investigated. A design of a micromachined JT cold stage-detector system is made that focuses on the interface between a JT cold stage and detector, and on the wiring of the detector. Among various techniques, adhesive bonding is selected as most suitable technique for integrating the detector with the JT cold stage. Also, the optimum wiring of the detector is discussed. In this respect, it is important to minimize the heat conduction through the wiring. Therefore, each wire should be optimized in terms of acceptable impedance and thermal heat load. It is shown that, given a certain impedance, the conductive heat load of electrically bad conducting materials is about twice as high as that of electrically good conducting materials. A micromachined JT cold stage is designed and integrated with a dummy detector. The JT cold stage is operated at 100 K with nitrogen as the working fluid and at 140 K with methane. Net cooling powers of 143 mW and 117 mW are measured, respectively. Taking into account a radiative heat load of 40 mW, these measured values make the JT cold stage suitable for cooling a photon detector with a power dissipation up to 50 mW, allowing for another 27 to 53 mW heat load arising from the electrical leads. © 2012 American Institute of Physics

Development of termination and utilization concepts for flat conductor cables. Volume 3: Cost study comparison, flat versus round conductor cable

NASA Technical Reports Server (NTRS)

1972-01-01

A cost study comparing flat conductor cable (FCC) with small-gage wire (SGW) and conventional round conductor cable (RCC) is presented. This study was based on a vehicle wiring system consisting of 110,000 ft of conventional RCC equally divided between AWG sizes 20,22, and 24 using MIL-W-81044-type wire and MIL-C-26500 circular connectors. Basic cost data were developed on a similar-sized commercial jet airplane wiring system on a previous company R&D program in which advanced wiring techniques were carried through equivalent installations on an airplane mockup; and on data developed on typical average bundles during this program. Various cost elements included were engineering labor, operations (manufacturing) labor, material costs, and cost impact on payload. Engineering labor includes design, wiring system integration, wiring diagrams and cable assembly drawings, wire installations, and other related supporting functions such as the electronic data processing for the wiring. Operations labor includes mockup, tooling and production planning, fabrication, assembly, installation, and quality control cost impact on payload is the conversion of wiring system weight variations through use of different wiring concepts to program payload benefits in terms of dollars.

New concepts and materials for the manufacturing of MR-compatible guide wires.

PubMed

Brecher, Christian; Emonts, Michael; Brack, Alexander; Wasiak, Christian; Schütte, Adrian; Krämer, Nils; Bruhn, Robin

2014-04-01

This paper shows the development of a new magnetic resonance imaging (MRI)-compatible guide wire made from fiber-reinforced plastics. The basic material of the developed guide wire is manufactured using a specially developed micro-pullwinding technology, which allows the adjustment of tensile, bending, and torsional stiffness independent from each other. Additionally, the micro-pullwinding technology provides the possibility to vary the stiffness along the length of the guide wire in a continuous process. With the possibilities of this technology, the mechanical properties of the guide wire were precisely adjusted for the intended usage in MRI-guided interventions. The performance of the guide wire regarding the mechanical properties was investigated. It could be shown, that the mechanical properties could be changed independently from each other by varying the process parameters. Especially, the torsional stiffness could be significantly improved with only a minor influence on bending and tensile properties. The precise influence of the variation of the winding angle on the mechanical and geometrical properties has to be further investigated. The usability of the guide wire as well as its visibility in MRI was investigated by radiologists. With the micro-pullwinding technology, a continuous manufacturing technique for highly stressable, MRI-safe profiles is available and can be the trigger for a new class of medical devices.

Wire-shaped perovskite solar cell based on TiO2 nanotubes

NASA Astrophysics Data System (ADS)

Wang, Xiaoyan; Kulkarni, Sneha A.; Li, Zhen; Xu, Wenjing; Batabyal, Sudip K.; Zhang, Sam; Cao, Anyuan; Wong, Lydia Helena

2016-05-01

In this work, a wire-shaped perovskite solar cell based on TiO2 nanotube (TNT) arrays is demonstrated for the first time by integrating a perovskite absorber on TNT-coated Ti wire. Anodization was adopted for the conformal growth of TNTs on Ti wire, together with the simultaneous formation of a compact TiO2 layer. A sequential step dipping process is employed to produce a uniform and compact perovskite layer on top of TNTs with conformal coverage as the efficient light absorber. Transparent carbon nanotube film is wrapped around Ti wire as the hole collector and counter electrode. The integrated perovskite solar cell wire by facile fabrication approaches shows a promising future in portable and wearable textile electronics.

Welding wire pressure sensor assembly

NASA Technical Reports Server (NTRS)

Morris, Timothy B. (Inventor); Milly, Peter F., Sr. (Inventor); White, J. Kevin (Inventor)

1994-01-01

The present invention relates to a device which is used to monitor the position of a filler wire relative to a base material being welded as the filler wire is added to a welding pool. The device is applicable to automated welding systems wherein nonconsumable electrode arc welding processes are utilized in conjunction with a filler wire which is added to a weld pool created by the electrode arc. The invention senses pressure deviations from a predetermined pressure between the filler wire and the base material, and provides electrical signals responsive to the deviations for actuating control mechanisms in an automatic welding apparatus so as to minimize the pressure deviation and to prevent disengagement of the contact between the filler wire and the base material.

Method and apparatus for diamond wire cutting of metal structures

DOEpatents

Parsells, Robert; Gettelfinger, Geoff; Perry, Erik; Rule, Keith

2005-04-19

A method and apparatus for diamond wire cutting of metal structures, such as nuclear reactor vessels, is provided. A diamond wire saw having a plurality of diamond beads with beveled or chamfered edges is provided for sawing into the walls of the metal structure. The diamond wire is guided by a plurality of support structures allowing for a multitude of different cuts. The diamond wire is cleaned and cooled by CO.sub.2 during the cutting process to prevent breakage of the wire and provide efficient cutting. Concrete can be provided within the metal structure to enhance cutting efficiency and reduce airborne contaminants. The invention can be remotely controlled to reduce exposure of workers to radioactivity and other hazards.

Wire ablation dynamics model and its application to imploding wire arrays of different geometries.

PubMed

Esaulov, A A; Kantsyrev, V L; Safronova, A S; Velikovich, A L; Shrestha, I K; Williamson, K M; Osborne, G C

2012-10-01

The paper presents an extended description of the amplified wire ablation dynamics model (WADM), which accounts in a single simulation for the processes of wire ablation and implosion of a wire array load of arbitrary geometry and wire material composition. To investigate the role of wire ablation effects, the implosions of cylindrical and planar wire array loads at the university based generators Cobra (Cornell University) and Zebra (University of Nevada, Reno) have been analyzed. The analysis of the experimental data shows that the wire mass ablation rate can be described as a function of the current through the wire and some coefficient defined by the wire material properties. The aluminum wires were found to ablate with the highest rate, while the copper ablation is the slowest one. The lower wire ablation rate results in a higher inward velocity of the ablated plasma, a higher rate of the energy coupling with the ablated plasma, and a more significant delay of implosion for a heavy load due to the ablation effects, which manifest the most in a cylindrical array configuration and almost vanish in a single-planar array configuration. The WADM is an efficient tool suited for wire array load design and optimization in wide parameter ranges, including the loads with specific properties needed for the inertial confinement fusion research and laboratory astrophysics experiments. The data output from the WADM simulation can be used to simplify the radiation magnetohydrodynamics modeling of the wire array plasma.

The confining effectiveness of NiTiNb and NiTi SMA wire jackets for concrete

NASA Astrophysics Data System (ADS)

Choi, Eunsoo; Chung, Young-Soo; Choi, Jun-Hyeok; Kim, Hong-Taek; Lee, Hacksoo

2010-03-01

The purpose of this study is to assess the confining effectiveness of shape memory alloy (SMA) wire jackets for concrete. The performance of SMA wire jackets was compared to that of steel jackets. A prestrained martensitic SMA wire was wrapped around a concrete cylinder and then heated by a heating jacket. In the process, a confining stress around the cylinder was developed in the SMA wire due to the shape memory effect; this jacketing method can increase the strength and ductility of the cylinder under an axial compressive load. In this study, NiTi and NiTiNb SMA wires of 1.0 mm in diameter were used for the confinement. Recovery tests were conducted on the wires to assess their recovery and residual stress. The confinement by SMA wire jackets increased the strength slightly and greatly increased the ductility compared to the strength and ductility of plain concrete cylinders. The NiTiNb SMA wire jacket showed better performance than that of the NiTi SMA wire jacket. The confining effectiveness of the SMA wire jackets of this study was estimated to be similar to that of the steel jackets. This study showed the potential of the SMA wire jacketing method to retrofit reinforced concrete columns and protect them from seismic risks.

Fabrication of multifilamentary Nb/sub 3/(Al,Ge) wires through a modified jelly roll process

DOE Office of Scientific and Technical Information (OSTI.GOV)

Tachikawa, K.; Kamisada, Y.; Suzuki, E.

Recently, development of Nb/sub 3/Al multifilamentary wires has gained much interests since high-field performance superior to that of Nb/sub 3/Sn can be expected in these wires. In this study, Nb/Al-Ge alloy composites were fabricated into multifilamentary wires through a modified jelly roll (MJR) process. A Nb mesh sheet produced at the Teledyne Wah Chang Co. was used as Nb component. An Al-Ge alloy prepared by a conventional casting process was forged and rolled into a sheet of 0.2 mm in thickness. The Nb/Al-Ge composite was prepared by wrapping the Nb mesh sheet together with the Al-Ge alloy sheet around amore » Nb core into a jelly roll form. The MJR composite was encased in a Cu-Ni alloy tube of which outer diameter was 43 mm. The resulting composite was hydrostatically pressed and extruded into a rod of 18 mm in diameter. A Nb barrier was then inserted between the MJR and the Cu-Ni jacket. The composite rod was swaged and drawn into a wire without any intermediate annealing. The wire was able to be drawn down to a very small diameter of 0.1 mm. The cross-sectional configuration of the MJR composite was not much disturbed by the fabrication. Superconducting transition temperature Tc of the wire, after different heat treatment including a rapid quenching from high temperatures by a continuous electron beam irradiation, was studied, and an onset Tc of 19.3K has been achieved.« less

Strengthening of Aluminum Wires Treated with A206/Alumina Nanocomposites

PubMed Central

Marrero, Raúl; Li, Xiaochun; Choi, Hongseok

2018-01-01

This study sought to characterize aluminum nanocomposite wires that were fabricated through a cold-rolling process, having potential applications in TIG (tungsten inert gas) welding of aluminum. A206 (Al-4.5Cu-0.25Mg) master nanocomposites with 5 wt % γAl2O3 nanoparticles were first manufactured through a hybrid process combining semi-solid mixing and ultrasonic processing. A206/1 wt % γAl2O3 nanocomposites were fabricated by diluting the prepared master nanocomposites with a monolithic A206 alloy, which was then added to a pure aluminum melt. The fabricated Al–γAl2O3 nanocomposite billet was cold-rolled to produce an Al nanocomposite wire with a 1 mm diameter and a transverse area reduction of 96%. Containing different levels of nanocomposites, the fabricated samples were mechanically and electrically characterized. The results demonstrate a significantly higher strength of the aluminum wires with the nanocomposite addition. Further, the addition of alumina nanoparticles affected the wires’ electrical conductivity compared with that of pure aluminum and aluminum–copper alloys. The overall properties of the new material demonstrate that these wires could be an appealing alternative for fillers intended for aluminum welding. PMID:29534441

High conductivity carbon nanotube wires from radial densification and ionic doping

NASA Astrophysics Data System (ADS)

Alvarenga, Jack; Jarosz, Paul R.; Schauerman, Chris M.; Moses, Brian T.; Landi, Brian J.; Cress, Cory D.; Raffaelle, Ryne P.

2010-11-01

Application of drawing dies to radially densify sheets of carbon nanotubes (CNTs) into bulk wires has shown the ability to control electrical conductivity and wire density. Simultaneous use of KAuBr4 doping solution, during wire drawing, has led to an electrical conductivity in the CNT wire of 1.3×106 S/m. Temperature-dependent electrical measurements show that conduction is dominated by fluctuation-assisted tunneling, and introduction of KAuBr4 significantly reduces the tunneling barrier between individual nanotubes. Ultimately, the concomitant doping and densification process leads to closer packed CNTs and a reduced charge transfer barrier, resulting in enhanced bulk electrical conductivity.

Cost-Reduced M587 Electronic Time Fuze: Root Cause Analysis of July 1979 Early Bursts

DTIC Science & Technology

1981-04-01

capacitor during gunfire, coupled with an intermit - tent wire bond (which opens during setback and then closes again) can defeat the initialization circuit...is calibrated, (c) the set time is checked out in fast time to verify that the setting has actually been achieved, and (d) the setter visually com...insensitive to supply voltage. One of the reasons for choosing the twin-T design was because it was possible to preclude fail- fast failure modes. The

Module comprising IC memory stack dedicated to and structurally combined with an IC microprocessor chip

NASA Technical Reports Server (NTRS)

Carson, John C. (Inventor); Indin, Ronald J. (Inventor); Shanken, Stuart N. (Inventor)

1994-01-01

A computer module is disclosed in which a stack of glued together IC memory chips is structurally integrated with a microprocessor chip. The memory provided by the stack is dedicated to the microprocessor chip. The microprocessor and its memory stack may be connected either by glue and/or by solder bumps. The solder bumps can perform three functions--electrical interconnection, mechanical connection, and heat transfer. The electrical connections in some versions are provided by wire bonding.

Transducer Workshop (16th) Held in San Antonio, Texas on June 18-20, 1991

DTIC Science & Technology

1991-06-01

34 he from 1936-40 he was Instructor in EE at Armour says even of the very first gage which Dat- (now Illinois) Institute of Technology in wyler bonded...wirebonds are draped over a dam separating the sensor from the conformal coat- Compared to the first generation sensor de- ing used for structural...base. (No discussion will prevent flow of the coating onto the sensor. be included on the electrical stability of circuit Draping the sensor lead wires

An Investigation of Nonuniform Dose Deposition From an Electron Beam

DTIC Science & Technology

1994-08-01

to electron - beam pulse. Ceramic package HIPEC Lid Electron beam Die Bond wires TLD TLD Silver epoxy 6 package cavity die TLD’s 21 3 4 5 Figure 2...these apertures was documented in a previous experiment relating to HIFX electron -beam dosimetry .2 The hardware required for this setup was a 60-cm...impurity serves 2Gregory K. Ovrebo, Steven M. Blomquist, and Steven R. Murrill, A HIFX Electron -Beam Dosimetry System, Army Research Laboratory, ARL-TR

Failures in Hybrid Microcircuits During Environmental Testing. History Cases

NASA Technical Reports Server (NTRS)

Teverovsky, Alexander

2008-01-01

This purpose of this viewgraph presentation is to discuss failures in hermetic hybrids observed at the GSFC PA Lab during environmental stress testing. The cases discussed are: Case I. Substrate metallization failures during Thermal cycling (TC). Case II. Flex lid-induced failure. Case Ill. Hermeticity failures during TC. Case IV. Die metallization cracking during TC. and how many test cycles and parts is necessary? Case V. Wire Bond failures after life test. Case VI. Failures caused by Au/In IMC growth.

Nondestructive evaluation/characterization of composite materials and structures using the acousto-ultrasonic techniques

NASA Technical Reports Server (NTRS)

Dos Reis, H. L. M.; Vary, A.

1988-01-01

This paper introduces the nature and the underlying rational of the acousto-ultrasonic stress wave factor technique and some of its applications to composite materials and structures. Furthermore, two examples of successful application of the acousto-ultrasonic technique are presented in detail. In the first example, the acousto-ultrasonic technique is used to evaluate the adhesive bond strength between rubber layers and steel plates, and in the seocnd example the tehcnique is used to monitor progressive damage in wire rope.

Acrylic Plastic Spherical Pressure Hull for Continental Shelf Depths

DTIC Science & Technology

1993-03-01

the con- l and secure conduit for the instrumentation leads at cave surface of the sphere (figure 26). The meridi- any external pressure to which the...constant pressure monitoring. In-line pressure CEA-06-1 25WT-120 with a gage factor of 2.11, transducers sense chamber pressures and send a bonded to the...wired to a strain gage conditioner that sensed strain as an analog FINDINGS voltage corresponding to the change in resistance occuring in each gage as it

Investigation about the Chrome Steel Wire Arc Spray Process and the Resulting Coating Properties

NASA Astrophysics Data System (ADS)

Wilden, J.; Bergmann, J. P.; Jahn, S.; Knapp, S.; van Rodijnen, F.; Fischer, G.

2007-12-01

Nowadays, wire-arc spraying of chromium steel has gained an important market share for corrosion and wear protection applications. However, detailed studies are the basis for further process optimization. In order to optimize the process parameters and to evaluate the effects of the spray parameters DoE-based experiments had been carried out with high-speed camera shoots. In this article, the effects of spray current, voltage, and atomizing gas pressure on the particle jet properties, mean particle velocity and mean particle temperature and plume width on X46Cr13 wire are presented using an online process monitoring device. Moreover, the properties of the coatings concerning the morphology, composition and phase formation were subject of the investigations using SEM, EDX, and XRD-analysis. These deep investigations allow a defined verification of the influence of process parameters on spray plume and coating properties and are the basis for further process optimization.

Fully 3D-Integrated Pixel Detectors for X-Rays

DOE PAGES

Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul; ...

2016-01-01

The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch,more » yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e - rms and a conversion gain of 69.5 μV/e - with 2.6 e - rms and 2.7 μV/e - rms pixel-to-pixel variations, respectively, were measured.« less

DOE Office of Scientific and Technical Information (OSTI.GOV)

Deptuch, Grzegorz W.; Gabriella, Carini; Enquist, Paul

The vertically integrated photon imaging chip (VIPIC1) pixel detector is a stack consisting of a 500-μm-thick silicon sensor, a two-tier 34-μm-thick integrated circuit, and a host printed circuit board (PCB). The integrated circuit tiers were bonded using the direct bonding technology with copper, and each tier features 1-μm-diameter through-silicon vias that were used for connections to the sensor on one side, and to the host PCB on the other side. The 80-μm-pixel-pitch sensor was the direct bonding technology with nickel bonded to the integrated circuit. The stack was mounted on the board using Sn–Pb balls placed on a 320-μm pitch,more » yielding an entirely wire-bond-less structure. The analog front-end features a pulse response peaking at below 250 ns, and the power consumption per pixel is 25 μW. We successful completed the 3-D integration and have reported here. Additionally, all pixels in the matrix of 64 × 64 pixels were responding on well-bonded devices. Correct operation of the sparsified readout, allowing a single 153-ns bunch timing resolution, was confirmed in the tests on a synchrotron beam of 10-keV X-rays. An equivalent noise charge of 36.2 e - rms and a conversion gain of 69.5 μV/e - with 2.6 e - rms and 2.7 μV/e - rms pixel-to-pixel variations, respectively, were measured.« less

Micro-structure and properties of Cu-0.5 wt%Ag alloy fine wires with severe cold plastic deformation treatment

NASA Astrophysics Data System (ADS)

Shu-sen, Wang; Yuan-wang, Zhang; Da-wei, Yao

2018-04-01

In this work, the Cu-0.5 wt% Ag alloy was prepared and then sold solution treated at 760 °C for 4 h and aged at 400 °C for 4 h. The severe cold plastic deformation treatment with a maximum true strain of 11.48 was applied to obtain the Cu-0.5 wt%Ag fine wires with the diameter of 0.087 mm. Then the fine wires were given eight intermediate heat treatments at 300 °C–350 °C for 10–60 min. Properties of the fine wires with different annealing heat treatments were analyzed, results showed that after the annealing process of 350 °C, 20 min was applied to Cu-0.5 wt% Ag fine wires, their conductivity, tensile strength and elongation could reach 98.6%IACS, 367 MPa and 8%, respectively. This demonstrated that the Cu-0.5 wt% Ag processes high strength and high conductivity properties and was a promising conductive material.

2D projection-based software application for mobile C-arms optimises wire placement in the proximal femur - An experimental study.

PubMed

Swartman, B; Frere, D; Wei, W; Schnetzke, M; Beisemann, N; Keil, H; Franke, J; Grützner, P A; Vetter, S Y

2017-10-01

A new software application can be used without fixed reference markers or a registration process in wire placement. The aim was to compare placement of Kirschner wires (K-wires) into the proximal femur with the software application versus the conventional method without guiding. As study hypothesis, we assumed less placement attempts, shorter procedure time and shorter fluoroscopy time using the software. The same precision inside a proximal femur bone model using the software application was premised. The software detects a K-wire within the 2D fluoroscopic image. By evaluating its direction and tip location, it superimposes a trajectory on the image, visualizing the intended direction of the K-wire. The K-wire was positioned in 20 artificial bones with the use of software by one surgeon; 20 bones served as conventional controls. A brass thumb tack was placed into the femoral head and its tip targeted with the wire. Number of placement attempts, duration of the procedure, duration of fluoroscopy time and distance to the target in a postoperative 3D scan were recorded. Compared with the conventional method, use of the application showed fewer attempts for optimal wire placement (p=0.026), shorter duration of surgery (p=0.004), shorter fluoroscopy time (p=0.024) and higher precision (p=0.018). Final wire position was achieved in the first attempt in 17 out of 20 cases with the software and in 9 out of 20 cases with the conventional method. The study hypothesis was confirmed. The new application optimised the process of K-wire placement in the proximal femur in an artificial bone model while also improving precision. Benefits lie especially in the reduction of placement attempts and reduction of fluoroscopy time under the aspect of radiation protection. The software runs on a conventional image intensifier and can therefore be easily integrated into the daily surgical routine. Copyright © 2017 Elsevier Ltd. All rights reserved.

Low temperature junction growth using hot-wire chemical vapor deposition

DOEpatents

Wang, Qi; Page, Matthew; Iwaniczko, Eugene; Wang, Tihu; Yan, Yanfa

2014-02-04

A system and a process for forming a semi-conductor device, and solar cells (10) formed thereby. The process includes preparing a substrate (12) for deposition of a junction layer (14); forming the junction layer (14) on the substrate (12) using hot wire chemical vapor deposition; and, finishing the semi-conductor device.

Dynamics of vapor emissions at wire explosion thresholda)

NASA Astrophysics Data System (ADS)

Belony, Paul A.; Kim, Yong W.

2010-10-01

X-pinch plasmas have been actively studied in the recent years. Numerical simulation of the ramp-up of metallic vapor emissions from wire specimens shows that under impulsive Ohmic heating the wire core invariably reaches a supercritical state before explosion. The heating rate depends sensitively on the local wire resistance, leading to highly variable vapor emission flux along the wire. To examine the vapor emission process, we have visualized nickel wire explosions by means of shock formation in air. In a single explosion as captured by shadowgraphy, there usually appear several shocks with spherical or cylindrical wave front originating from different parts of the wire. Growth of various shock fronts in time is well characterized by a power-law scaling in one form or another. Continuum emission spectra are obtained and calibrated to measure temperature near the explosion threshold. Shock front structures and vapor plume temperature are examined.

Pull-pull position control of dual motor wire rope transmission.

PubMed

Guo, Quan; Jiao, Zongxia; Yan, Liang; Yu, Qian; Shang, Yaoxing

2016-08-01

Wire rope transmission is very efficient because of the small total moving object mass. The wire rope could only transmit pulling force. Therefore it has to be kept in a tightened state during transmission; in high speed applications the dynamic performance depends on the rope's stiffness, which can be adjusted by the wire rope tension. To improve the system dynamic performance output, this paper proposes a novel pull-pull method based on dual motors connected by wire ropes, for precise, high speed position control applications. The method can regulate target position and wire rope tension simultaneously. Wire ropes remain in a pre-tightening state at all times, which prevents the influence of elasticity and reduces the position tracking error in the changing direction process. Simulations and experiments were conducted; the results indicate that both position precision and superior dynamic performance can be synchronously achieved. The research is relevant to space craft precision pointing instruments.

SpaceWire: IP, Components, Development Support and Test Equipment

NASA Astrophysics Data System (ADS)

Parkes, S.; McClements, C.; Mills, S.; Martin, I.

SpaceWire is a communications network for use onboard spacecraft. It is designed to connect high data-rate sensors, large solid-state memories, processing units and the downlink telemetry subsystem providing an integrated data-handling network. SpaceWire links are serial, high-speed (2 Mbits/sec to 400 Mbits/sec), bi-directional, full-duplex, pointto- point data links which connect together SpaceWire equipment. Application information is sent along a SpaceWire link in discrete packets. Control and time information can also be sent along SpaceWire links. SpaceWire is defined in the ECSS-E50-12A standard [1]. With the adoption of SpaceWire on many space missions the ready availability of intellectual property (IP) cores, components, software drivers, development support, and test equipment becomes a major issue for those developing satellites and their electronic subsystems. This paper describes the work being done at the University of Dundee and STAR-Dundee Ltd with ESA, BNSC and internal funding to make these essential items available. STAR-Dundee is a spin-out company of the University of Dundee set up specifically to support users of SpaceWire.

Prediction of Central Burst Defects in Copper Wire Drawing Process

DOE Office of Scientific and Technical Information (OSTI.GOV)

Vega, G.; NEXANS France, NMC Nexans Metallurgy Centre, Boulevard du Marais, BP39, F-62301 Lens; Haddi, A.

2011-01-17

In this study, the prediction of chevron cracks (central bursts) in copper wire drawing process is investigated using experimental and numerical approaches. The conditions of the chevron cracks creation along the wire axis depend on (i) the die angle, the friction coefficient between the die and the wire, (ii) the reduction in crosssectional area of the wire, (iii) the material properties and (iv) the drawing velocity or strain rate. Under various drawing conditions, a numerical simulation for the prediction of central burst defects is presented using an axisymmetric finite element model. This model is based on the application of themore » Cockcroft and Latham fracture criterion. This criterion was used as the damage value to estimate if and where defects will occur during the copper wire drawing. The critical damage value of the material is obtained from a uniaxial tensile test. The results show that the die angle and the reduction ratio have a significant effect on the stress distribution and the maximum damage value. The central bursts are expected to occur when the die angle and reduction ratio reach a critical value. Numerical predictions are compared with experimental observations.« less

Composite ceramic superconducting wires for electric motor applications

NASA Astrophysics Data System (ADS)

Halloran, John W.

1990-04-01

Silver clad polycrystalline Y-123 wire is being fabricated with a continuous reel-to-reel process. Scale-up activities are underway to produce enough wire for the field coils of the HTSC motor. Green HTSC fiber were produced in kilometer lengths, and sintered wires up to 166 meters long. The 77K Jc values are 1000-2800 A/sq cm in self field. To improve Jc of the Y-123 wire, development began on directional crystallization, including preliminary work at A. D. Little and Oak Ridge National Lab. Large lots of BiSCCO material were produced to fabricated fibers and sintered polycrystalline BiSSCO wire as rolled tape. Work continued in collaboration with Sandia and Los Alamos National Laboratories on rapid thermal processing of Y-123, with most emphasis on characterizing the rapid oxygenation effect. The design of the HTSC homopolar motor has been improved to increase the output from field coils by using six smaller coils, each with separately optimized current. Motor construction is in progress. Preliminary design is underway on a dc heteropolar motor with HTSC field windings and armature and a brushless trapped flux permanent magnet dc motor, in which the field is produced by trapped flux in an HTSC rotor.

Intermetallic alloy welding wires and method for fabricating the same

DOEpatents

Santella, M.L.; Sikka, V.K.

1996-06-11

Welding wires for welding together intermetallic alloys of nickel aluminides, nickel-iron aluminides, iron aluminides, or titanium aluminides, and preferably including additional alloying constituents are fabricated as two-component, clad structures in which one component contains the primary alloying constituent(s) except for aluminum and the other component contains the aluminum constituent. This two-component approach for fabricating the welding wire overcomes the difficulties associated with mechanically forming welding wires from intermetallic alloys which possess high strength and limited ductilities at elevated temperatures normally employed in conventional metal working processes. The composition of the clad welding wires is readily tailored so that the welding wire composition when melted will form an alloy defined by the weld deposit which substantially corresponds to the composition of the intermetallic alloy being joined. 4 figs.

Intermetallic alloy welding wires and method for fabricating the same

DOEpatents

Santella, Michael L.; Sikka, Vinod K.

1996-01-01

Welding wires for welding together intermetallic alloys of nickel aluminides, nickel-iron aluminides, iron aluminides, or titanium aluminides, and preferably including additional alloying constituents are fabricated as two-component, clad structures in which one component contains the primary alloying constituent(s) except for aluminum and the other component contains the aluminum constituent. This two-component approach for fabricating the welding wire overcomes the difficulties associated with mechanically forming welding wires from intermetallic alloys which possess high strength and limited ductilities at elevated temperatures normally employed in conventional metal working processes. The composition of the clad welding wires is readily tailored so that the welding wire composition when melted will form an alloy defined by the weld deposit which substantially corresponds to the composition of the intermetallic alloy being joined.

The Effect of Material Removal on the Corrosion Resistance and Biocompatibility of Nitinol Laser-Cut and Wire-Form Products

NASA Astrophysics Data System (ADS)

Decker, Jennifer Fino; Trépanier, Christine; Vien, Lot; Pelton, Alan R.

2011-07-01

Laser cutting and wire forming are two of the most commonly used processes in the manufacture of Nitinol medical devices. This study explores how varying the amount of material removed during the final surface treatment steps affects the corrosion resistance of Z-type stents that have either been laser-cut from tube or shape set from wire. All parts were subjected to a typical heat treatment process necessary to achieve an Austenite finish (Af) temperature of 25 ± 5 °C, and were subsequently post-processed with an electrochemical passivation process. The total weight loss during post-processing was recorded and the process adjusted to create groups with less than 5%, less than 10%, and less than 25% amounts of weight loss. The parts were then crimped to 6 mm and allowed to expand back to their original diameter. The corrosion test results showed that on average both groups of Z-stents experienced an increase in the corrosion breakdown potential and a decrease in the standard deviation with increasing amounts of material removal. In addition, less material removal is required from the wire-form Z-stents as compared to the laser-cut Z-stents to achieve high corrosion resistance. Finally, 7 day nickel ion release tests performed on the wire-formed Z-stents showed a dramatic decrease from 0.0132 mg of nickel leached per day for the low weight loss group to approximately 0.001 mg/day for the medium and high weight loss groups.

Advanced Bode Plot Techniques for Ultrasonic Transducers

NASA Astrophysics Data System (ADS)

DeAngelis, D. A.; Schulze, G. W.

The Bode plot, displayed as either impedance or admittance versus frequency, is the most basic test used by ultrasonic transducer designers. With simplicity and ease-of-use, Bode plots are ideal for baseline comparisons such as spacing of parasitic modes or impedance, but quite often the subtleties that manifest as poor process control are hard to interpret or are nonexistence. In-process testing of transducers is time consuming for quantifying statistical aberrations, and assessments made indirectly via the workpiece are difficult. This research investigates the use of advanced Bode plot techniques to compare ultrasonic transducers with known "good" and known "bad" process performance, with the goal of a-priori process assessment. These advanced techniques expand from the basic constant voltage versus frequency sweep to include constant current and constant velocity interrogated locally on transducer or tool; they also include up and down directional frequency sweeps to quantify hysteresis effects like jumping and dropping phenomena. The investigation focuses solely on the common PZT8 piezoelectric material used with welding transducers for semiconductor wire bonding. Several metrics are investigated such as impedance, displacement/current gain, velocity/current gain, displacement/voltage gain and velocity/voltage gain. The experimental and theoretical research methods include Bode plots, admittance loops, laser vibrometry and coupled-field finite element analysis.

Study of thermomechanical treatment on mechanical-induced phase transformation of NiTi and TiNiCu wires.

PubMed

Seyyed Aghamiri, S M; Nili Ahmadabadi, M; Shahmir, H; Naghdi, F; Raygan, Sh

2013-05-01

The nickel-titanium shape memory alloys have been used in orthodontic application due to their unique properties like superelasticity and biocompatibility. The phase transformation behavior of these alloys can be changed by alloying elements and thermomechanical processing conditions. In this study, two types of NiTi and TiNiCu wires of 0.4mm diameter were produced via thermomechanical treatments with final step of 20% cold drawing followed by annealing at different temperatures of 300 and 400 °C for varying times of 10, 30 and 60 min. The processed wires were characterized by oral cavity configuration three point bending (OCTPB) test at 37 °C to specify the mechanical transformation features. Also, differential scanning calorimetry (DSC) was used to analyze the thermal transformation temperatures of selected wires. The results showed the thermomechanical treatment at 300 °C for 30 min was the suitable process in terms of superelasticity and transformation temperatures for orthodontic application. Copyright © 2013 Elsevier Ltd. All rights reserved.

Conversion of electromagnetic energy in Z-pinch process of single planar wire arrays at 1.5 MA

DOE Office of Scientific and Technical Information (OSTI.GOV)

Liangping, Wang; Mo, Li; Juanjuan, Han

The electromagnetic energy conversion in the Z-pinch process of single planar wire arrays was studied on Qiangguang generator (1.5 MA, 100 ns). Electrical diagnostics were established to monitor the voltage of the cathode-anode gap and the load current for calculating the electromagnetic energy. Lumped-element circuit model of wire arrays was employed to analyze the electromagnetic energy conversion. Inductance as well as resistance of a wire array during the Z-pinch process was also investigated. Experimental data indicate that the electromagnetic energy is mainly converted to magnetic energy and kinetic energy and ohmic heating energy can be neglected before the final stagnation. Themore » kinetic energy can be responsible for the x-ray radiation before the peak power. After the stagnation, the electromagnetic energy coupled by the load continues increasing and the resistance of the load achieves its maximum of 0.6–1.0 Ω in about 10–20 ns.« less

Closed-Loop Process Control for Electron Beam Freeform Fabrication and Deposition Processes

NASA Technical Reports Server (NTRS)

Taminger, Karen M. (Inventor); Hofmeister, William H. (Inventor); Martin, Richard E. (Inventor); Hafley, Robert A. (Inventor)

2013-01-01

A closed-loop control method for an electron beam freeform fabrication (EBF(sup 3)) process includes detecting a feature of interest during the process using a sensor(s), continuously evaluating the feature of interest to determine, in real time, a change occurring therein, and automatically modifying control parameters to control the EBF(sup 3) process. An apparatus provides closed-loop control method of the process, and includes an electron gun for generating an electron beam, a wire feeder for feeding a wire toward a substrate, wherein the wire is melted and progressively deposited in layers onto the substrate, a sensor(s), and a host machine. The sensor(s) measure the feature of interest during the process, and the host machine continuously evaluates the feature of interest to determine, in real time, a change occurring therein. The host machine automatically modifies control parameters to the EBF(sup 3) apparatus to control the EBF(sup 3) process in a closed-loop manner.

Joining of dissimilar materials

DOEpatents

Tucker, Michael C; Lau, Grace Y; Jacobson, Craig P

2012-10-16

A method of joining dissimilar materials having different ductility, involves two principal steps: Decoration of the more ductile material's surface with particles of a less ductile material to produce a composite; and, sinter-bonding the composite produced to a joining member of a less ductile material. The joining method is suitable for joining dissimilar materials that are chemically inert towards each other (e.g., metal and ceramic), while resulting in a strong bond with a sharp interface between the two materials. The joining materials may differ greatly in form or particle size. The method is applicable to various types of materials including ceramic, metal, glass, glass-ceramic, polymer, cermet, semiconductor, etc., and the materials can be in various geometrical forms, such as powders, fibers, or bulk bodies (foil, wire, plate, etc.). Composites and devices with a decorated/sintered interface are also provided.

Electronically Transparent Au-N Bonds for Molecular Junctions.

PubMed

Zang, Yaping; Pinkard, Andrew; Liu, Zhen-Fei; Neaton, Jeffrey B; Steigerwald, Michael L; Roy, Xavier; Venkataraman, Latha

2017-10-25

We report a series of single-molecule transport measurements carried out in an ionic environment with oligophenylenediamine wires. These molecules exhibit three discrete conducting states accessed by electrochemically modifying the contacts. Transport in these junctions is defined by the oligophenylene backbone, but the conductance is increased by factors of ∼20 and ∼400 when compared to traditional dative junctions. We propose that the higher-conducting states arise from in situ electrochemical conversion of the dative Au←N bond into a new type of Au-N contact. Density functional theory-based transport calculations establish that the new contacts dramatically increase the electronic coupling of the oligophenylene backbone to the Au electrodes, consistent with experimental transport data. The resulting contact resistance is the lowest reported to date; more generally, our work demonstrates a facile method for creating electronically transparent metal-organic interfaces.

Effect of electrical spot welding on load deflection rate of orthodontic wires.

PubMed

Alavi, Shiva; Abrishami, Arezoo

2015-01-01

One of the methods used for joining metals together is welding, which can be carried out using different techniques such as electric spot welding. This study evaluated the effect of electric spot welding on the load deflection rate of stainless steel and chromium-cobalt orthodontic wires. In this experimental-laboratory study, load deflection rate of 0.016 × 0.022 inch stainless steel and chromium cobalt wires were evaluated in five groups (n =18): group one: Stainless steel wires, group two: chromium-cobalt wires, group three: stainless steel wires welded to stainless steel wires, group four: Stainless steel wires welded to chromium-cobalt wires, group five: chromium-cobalt wire welded to chromium-cobalt wires. Afterward, the forces induced by the samples in 0.5 mm, 1 mm, 1.5 mm deflection were measured using a universal testing machine. Then mean force measured for each group was compared with other groups. The data were analyzed using repeated measure analysis of variance (ANOVA), one-way ANOVA, and paired t-test by the SPSS software. The significance level was set as 0.05. The Tukey test showed that there were significant differences between the load deflection rates of welded groups compared to control ones (P < 0.001). Considering the limitation of this study, the electric spot welding process performed on stainless steel and chromium-cobalt wires increased their load deflection rates.

From molecular to macroscopic engineering: shaping hydrogen-bonded organic nanomaterials.

PubMed

Yoosaf, K; Llanes-Pallas, Anna; Marangoni, Tomas; Belbakra, Abdelhalim; Marega, Riccardo; Botek, Edith; Champagne, Benoît; Bonifazi, Davide; Armaroli, Nicola

2011-03-07

The self-assembly and self-organization behavior of chromophoric acetylenic scaffolds bearing 2,6-bis(acetylamino)pyridine (1, 2) or uracyl-type (3-9) terminal groups has been investigated by photophysical and microscopic methods. Systematic absorption and luminescence studies show that 1 and 2, thanks to a combination of solvophilic/solvophobic forces and π-π stacking interactions, undergo self-organization in apolar solvents (i.e., cyclohexane) and form spherical nanoparticles, as evidenced by wide-field optical microscopy, TEM, and AFM analysis. For the longer molecular module, 2, a more uniform size distribution is found (80-200 nm) compared to 1 (20-1000 nm). Temperature scans in the range 283-353 K show that the self-organized nanoparticles are reversibly formed and destroyed, being stable at lower temperatures. Molecular modules 1 and 2 were then thoroughly mixed with the complementary triply hydrogen-bonding units 3-9. Depending on the specific geometrical structure of 3-9, different nanostructures are evidenced by microscopic investigations. Combination of modules 1 or 2 with 3, which bears only one terminal uracyl unit, leads to the formation of vesicular structures; instead, when 1 is combined with bis-uracyl derivative 4 or 5, a structural evolution from nanoparticles to nanowires is observed. The length of the wires obtained by mixing 1 and 4 or 1 and 5 can be controlled by addition of 3, which prompts transformation of the wires into shorter rods. The replacement of linear system 5 with the related angular modules 6 and 7 enables formation of helical nanostructures, unambiguously evidenced by AFM. Finally, thermally induced self-assembly was studied in parallel with modules 8 and 9, in which the uracyl recognition sites are protected with tert-butyloxycarbonyl (BOC) groups. This strategy allows further control of the self-assembly/self-organization process by temperature, since the BOC group is completely removed on heating. Microscopy studies show that the BOC-protected ditopic modules 8 self-assemble and self-organize with 1 into ordered linear nanostructures, whereas BOC-protected tritopic system 9 gives rise to extended domains of circular nano-objects in combination with 1. Copyright © 2011 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim.

Study on nondestructive detection system based on x-ray for wire ropes conveyer belt

NASA Astrophysics Data System (ADS)

Miao, Changyun; Shi, Boya; Wan, Peng; Li, Jie

2008-03-01

A nondestructive detection system based on X-ray for wire ropes conveyer belt is designed by X-ray detection technology. In this paper X-ray detection principle is analyzed, a design scheme of the system is presented; image processing of conveyer belt is researched and image processing algorithms are given; X-ray acquisition receiving board is designed with the use of FPGA and DSP; the software of the system is programmed by C#.NET on WINXP/WIN2000 platform. The experiment indicates the system can implement remote real-time detection of wire ropes conveyer belt images, find faults and give an alarm in time. The system is direct perceived, strong real-time and high accurate. It can be used for fault detection of wire ropes conveyer belts in mines, ports, terminals and other fields.

Effects of beam configurations on wire melting and transfer behaviors in dual beam laser welding with filler wire

NASA Astrophysics Data System (ADS)

Ma, Guolong; Li, Liqun; Chen, Yanbin

2017-06-01

Butt joints of 2 mm thick stainless steel with 0.5 mm gap were fabricated by dual beam laser welding with filler wire technique. The wire melting and transfer behaviors with different beam configurations were investigated detailedly in a stable liquid bridge mode and an unstable droplet mode. A high speed video system assisted by a high pulse diode laser as an illumination source was utilized to record the process in real time. The difference of welding stability between single and dual beam laser welding with filler wire was also compartively studied. In liquid bridge transfer mode, the results indicated that the transfer process and welding stability were disturbed in the form of "broken-reformed" liquid bridge in tandem configuration, while improved by stabilizing the molten pool dynamics with a proper fluid pattern in side-by-side configuration, compared to sigle beam laser welding with filler wire. The droplet transfer period and critical radius were studied in droplet transfer mode. The transfer stability of side-by-side configuration with the minium transfer period and critical droplet size was better than the other two configurations. This was attributed to that the action direction and good stability of the resultant force which were beneficial to transfer process in this case. The side-by-side configuration showed obvious superiority on improving welding stability in both transfer modes. An acceptable weld bead was successfully generated even in undesirable droplet transfer mode under the present conditions.

Evolution of flexural rigidity according to the cross-sectional dimension of a superelastic nickel titanium orthodontic wire.

PubMed

Garrec, Pascal; Tavernier, Bruno; Jordan, Laurence

2005-08-01

The choice of the most suitable orthodontic wire for each stage of treatment requires estimation of the forces generated. In theory, the selection of wire sequences should initially utilize a lower flexural rigidity; thus clinicians use smaller round cross-sectional dimension wires to generate lighter forces during the preliminary alignment stage. This assessment is true for conventional alloys, but not necessarily for superelastic nickel titanium (NiTi). In this case, the flexural rigidity dependence on cross-sectional dimension differs from the linear elasticity prediction because of the martensitic transformation process. It decreases with increasing deflection and this phenomenon is accentuated in the unloading process. This behaviour should lead us to consider differently the biomechanical approach to orthodontic treatment. The present study compared bending in 10 archwires made from NiTi orthodontics alloy of two cross-sectional dimensions. The results were based on microstructural and mechanical investigations. With conventional alloys, the flexural rigidity was constant for each wire and increased largely with the cross-sectional dimension for the same strain. With NiTi alloys, the flexural rigidity is not constant and the influence of size was not as important as it should be. This result can be explained by the non-constant elastic modulus during the martensite transformation process. Thus, in some cases, treatment can begin with full-size (rectangular) wires that nearly fill the bracket slot with a force application deemed to be physiologically desirable for tooth movement and compatible with patient comfort.

Welder--Wire Process Operator: Apprenticeship Course Outline. Apprenticeship and Industry Training. 12-107.2

ERIC Educational Resources Information Center

Alberta Advanced Education and Technology, 2007

2007-01-01

The graduate of the Wire Process Operator apprenticeship program is a certified journeyperson who will be able to: (1) be skillful in the fusing of metals using prescribed welding applications; (2) have a working knowledge of the welding equipment involved with the various welding procedures; (3) comprehend drawings; (4) have a thorough knowledge…

Real-time monitoring of laser hot-wire cladding of Inconel 625

NASA Astrophysics Data System (ADS)

Liu, Shuang; Liu, Wei; Harooni, Masoud; Ma, Junjie; Kovacevic, Radovan

2014-10-01

Laser hot-wire cladding (LHWC), characterized by resistance heating of the wire, largely increases the productivity and saves the laser energy. However, the main issue of applying this method is the occurrence of arcing which causes spatters and affects the stability of the process. In this study, an optical spectrometer was used for real-time monitoring of the LHWC process. The corresponding plasma intensity was analyzed under various operating conditions. The electron temperature of the plasma was calculated for elements of nickel and chromium that mainly comprised the plasma plume. There was a correlation between the electron temperature and the stability of the process. The characteristics of the resulted clad were also investigated by measuring the dilution, hardness and microstructure.

Flexible Microstrip Circuits for Superconducting Electronics

NASA Technical Reports Server (NTRS)

Chervenak, James; Mateo, Jennette

2013-01-01

Flexible circuits with superconducting wiring atop polyimide thin films are being studied to connect large numbers of wires between stages in cryogenic apparatus with low heat load. The feasibility of a full microstrip process, consisting of two layers of superconducting material separated by a thin dielectric layer on 5 mil (approximately 0.13 mm) Kapton sheets, where manageable residual stress remains in the polyimide film after processing, has been demonstrated. The goal is a 2-mil (approximately 0.051-mm) process using spin-on polyimide to take advantage of the smoother polyimide surface for achieving highquality metal films. Integration of microstrip wiring with this polyimide film may require high-temperature bakes to relax the stress in the polyimide film between metallization steps.

Method for wiring allocation and switch configuration in a multiprocessor environment

DOEpatents

Aridor, Yariv [Zichron Ya'akov, IL; Domany, Tamar [Kiryat Tivon, IL; Frachtenberg, Eitan [Jerusalem, IL; Gal, Yoav [Haifa, IL; Shmueli, Edi [Haifa, IL; Stockmeyer, legal representative, Robert E.; Stockmeyer, Larry Joseph [San Jose, CA

2008-07-15

A method for wiring allocation and switch configuration in a multiprocessor computer, the method including employing depth-first tree traversal to determine a plurality of paths among a plurality of processing elements allocated to a job along a plurality of switches and wires in a plurality of D-lines, and selecting one of the paths in accordance with at least one selection criterion.

Processing and characterization of superconducting solenoids made of Bi-2212/Ag-alloy multifilament round wire for high field magnet applications

NASA Astrophysics Data System (ADS)

Chen, Peng

As the only high temperature superconductor with round wire (RW) geometry, Bi2Sr2CaCu2O8+x (Bi-2212) superconducting wire has the advantages of being multi-filamentary, macroscopically isotropic and twistable. With overpressure (OP) processing techniques recently developed by our group at the National High Magnetic Field Laboratory (NHMFL), the engineering current density (Je) of Bi-2212 RW can be dramatically increased. For example, Je of more than 600 A/mm 2 (4.2 K and 20 T) is achieved after 100 bar OP processing. With these intrinsically beneficial properties and recent processing progress, Bi-2212 RW has become very attractive for high field magnet applications, especially for nuclear magnetic resonance (NMR) magnets and accelerator magnets etc. This thesis summarizes my graduate study on Bi-2212 solenoids for high field and high homogeneity NMR magnet applications, which mainly includes performance study of Bi-2212 RW insulations, 1 bar and OP processing study of Bi-2212 solenoids, and development of superconducting joints between Bi-2212 RW conductors. Electrical insulation is one of the key components of Bi-2212 coils to provide sufficient electrical standoff within coil winding pack. A TiO 2/polymer insulation offered by nGimat LLC was systematically investigated by differential thermal analysis (DTA), thermo-gravimetric analysis (TGA), scanning electron microscopy (SEM), dielectric property measurements, and transport critical current (Ic) property measurements. About 29% of the insulation by weight is polymer. When the Bi-2212 wire is fully heat treated, this decomposes with slow heating to 400 °C in flowing O2. After the full reaction, we found that the TiO2 did not degrade the critical current properties, adhered well to the conductor, and provided a breakdown voltage of more than 100 V. A Bi-2212 RW wound solenoid coil was built using this insulation being offered by nGimat LLC. The coil resistance was constant through coil winding, polymer burn-off and full coil reaction. The coil was successfully tested at the NHMFL generating 33.8 T combined magnetic field in a 31.2 T background field. Multiple quenches occurred safely, which also illustrates that the insulation provided sufficient dielectric standoff. For Bi-2212 RW with a typical as-drawn diameter of 1.0-1.5 mm, this 15 microm thick insulation allows a very high coil packing factor of ~0.74, whereas earlier alumino-silicate braid insulation only allows packing factors of 0.38-0.48. In addition to the commercial TiO2/polymer insulation, we have also investigated sol-gel based ceramic coatings through collaboration with Harran University and another TiO2 based insulation coating at the NHMFL. Since Bi-2212 superconducting coils employ the Wind-and-React (W&R) technology, there are some potential issues in processing Bi-2212 coils, in particular for coils with a large thermal mass and dense oxide insulation coating. For this study, several Bi-2212 test solenoids with an outer diameter (OD) of about 90 mm were built and heat treated in 1 bar flowing oxygen with deadweights applied so as to simulate large coil packs. After the heat treatment (HT), coils were epoxy impregnated and cut. Winding pack was checked using SEM in terms of conductor geometry and insulation. Some samples were extracted to measure transport critical current Ic and critical temperature Tc. The results are very promising: test coils presented low creep behavior after standard partial melt HT under mechanical load, and no Ic degradation was found due to the application of mechanical load, and no inadequate oxygenation issue was seen for thick coils with ceramic coating on the wire. However, coils were partially electrically shorted after 1 bar HT under mechanical load, and we believe that increasing insulation coating thickness is necessary. In addition, several small solenoids were manufactured to study OP processing of Bi-2212 coils. The preliminary results indicate that there are some gaps between turns due to densification of wires (~4% wire diameter reduction) during 50-100 bar OP processing, and the diameter shrinking of conductors will potentially lead to coil sagging. So far, we have developed some methods to solve the issue of coil sagging, such as using flexible coil flange to allow smooth sagging of winding pack during OP processing. We have also investigated electrical joints between Bi-2212 RW conductors, which include resistive joints and superconducting joints. For resistive Bi-2212 joints, we evaluated conventional diffusion bonding method and soldering method. In general, the joints (with 42 mm joint length) resistances are below 200 nO at 4.2 K and magnetic fields up to 13.5 T, and the effect of magnetoresistance is clearly present. In addition to resistive joints, we successfully developed a superconducting joint between Bi-2212 RW conductors for persistent current mode (PCM) operations. (Abstract shortened by UMI.).

Elastomeric member and method of manufacture therefor

DOEpatents

Hoppie, Lyle O.

1985-01-01

An energy storage device (10) is disclosed consisting of a stretched elongated elastomeric member (16) disposed within a tubular housing (14), which elastomeric member (16) is adapted to be torsionally stressed to store energy. The elastomeric member (16) is configured in the relaxed state with a uniform diameter body section (74), and transition end sections (76, 78), attached to rigid end piece assemblies (22, 24) of a lesser diameter. The profile and deflection characteristic of the transition sections (76, 78) are such that upon stretching of the elastomeric member (16), a substantially uniform diameter assembly results, to minimize the required volume of the surrounding housing (14). Each of the transition sections (76, 78) are received within and bonded to a woven wire mesh sleeve (26, 28) having helical windings at a particular helix angle to control the deflection of the transition section. Each sleeve (26, 28) also contracts with the contraction of the associated transition section to maintain the bond therebetween. During manufacture, the sleeves (26, 28) are forced against a forming surface and bonded to the associated transition section (76, 78) to provide the correct profile and helix angle.

Elastomeric member

DOEpatents

Hoppie, Lyle O.

1985-01-01

An energy storage device (10) is disclosed consisting of a stretched elongated elastomeric member (16) disposed within a tubular housing (14), which elastomeric member (16) is adapted to be torsionally stressed to store energy. The elastomeric member (16) is configured in the relaxed state with a uniform diameter body section (74), and transition end sections (76, 78), attached to rigid end piece assemblies (22, 24) of a lesser diameter. The profile and deflection characteristic of the transition sections (76, 78) are such that upon stretching of the elastomeric member (16), a substantially uniform diameter assembly results, to minimize the required volume of the surrounding housing (14). Each of the transition sections (76, 78) are received within and bonded to a woven wire mesh sleeve (26, 28) having helical windings at a particular helix angle to control the deflection of the transition section. Each sleeve (26, 28) also contracts with the contraction of the associated transition section to maintain the bond therebetween. During manufacture, the sleeves (26, 28) are forced against a forming surface and bonded to the associated transition section (76, 78) to provide the correct profile and helix angle.

Hierarchical lattice models of hydrogen-bond networks in water

NASA Astrophysics Data System (ADS)

Dandekar, Rahul; Hassanali, Ali A.

2018-06-01

We develop a graph-based model of the hydrogen-bond network in water, with a view toward quantitatively modeling the molecular-level correlational structure of the network. The networks formed are studied by the constructing the model on two infinite-dimensional lattices. Our models are built bottom up, based on microscopic information coming from atomistic simulations, and we show that the predictions of the model are consistent with known results from ab initio simulations of liquid water. We show that simple entropic models can predict the correlations and clustering of local-coordination defects around tetrahedral waters observed in the atomistic simulations. We also find that orientational correlations between bonds are longer ranged than density correlations, determine the directional correlations within closed loops, and show that the patterns of water wires within these structures are also consistent with previous atomistic simulations. Our models show the existence of density and compressibility anomalies, as seen in the real liquid, and the phase diagram of these models is consistent with the singularity-free scenario previously proposed by Sastry and coworkers [Phys. Rev. E 53, 6144 (1996), 10.1103/PhysRevE.53.6144].